經濟部智慧財產局員工消費合作社印製 505889 A7 一 ___B7^_ 五、發明說明（1 ) 本發明關於晶片的系列製造方法，特別是用戶識別（ s I Μ )卡，包括下列步驟： -一創造軟體程式； - -該軟體程式將施用於一晶片上； - -晶片載具相關及用戶相關個人化資料將施用於該晶片 上。 本發明關於各類型晶片的製造，主要關於所謂用戶識 別（S I Μ )卡的製造，即行動無線電卡，其***一，行動 電話並須輸入一用戶識別密碼（Ρ I Ν )以啓動，以便該 行動電話可用於撥打及接收電話。用戶識別（S I Μ )卡 上的一晶片儲存行動電話所需的資訊，以便在開啓後登入 ίτ動無線電網路。爲該用途而須儲存於該晶片上的資料是 所g胃的個人化資料；在晶片載具相關個人化資料及用戶相 關個人化資料間形成一區隔，前者對晶片所預期之類型（ 例如手錶、卡等）的所有晶片而言是相同的，而後者則是 各卡個別處理（例如序號、用戶識別密碼（ρ I N )等） 〇 目前用戶識別（S I Μ )卡通常以圖1中所币之方法 製造，並於下列說明： 第一個步驟是軟體開發，其需要約六個月的時間。依 據該軟體，製造一遮罩，並以其爲基礎依次製造一唯讀記 憶體（R〇Μ )晶片。此需要約十六個星期。該晶片接著 嵌入一模組並進行測試（約六個星期）°若發生缺點’便 進行軟體修改，並重複遮罩製造、晶片製造、模組製造、 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂---------線 -* (請先閱讀背面之注意事項再填寫本頁) 505889 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（2) 測試及修改等過程，直到測試結果通過。接著便展開一系 列的製造，其中首先製造唯讀記憶體（R〇M)晶片’並 嵌入一模組，其花費約十六個星期。接著製造塑膠卡（若 合用）並進行銘刻，而該晶片模組則嵌入获^ 之後則ϋ寸 該個人化資料施用於該晶片之上。 上述程序非常吃力，而且一方面造成相當長的交付時 間，另一方面則造成相當高的製造成本。 因而，本發明的一個目標是開發最初舉例之類型'的晶 片系列製造方法，如此一來可以降低製造的時間及成本。 該目標依據本發明而達成，其中首先將該晶片載具相 關個人化資料施用於該晶片之上；而用戶相關個人化資料 則與該晶片載具相關個人化資料無關地僅在稍後的製造步 驟中施用於該晶片之上。因而，本發明的基本觀念是不像 現有的技藝在製造步驟中執行晶片的個人化’而是將特定 客戶（即晶片載具相關）的個人化資料在預先個人化的過 程中施用於晶片上，並於稍後在內容中執行後個人化，而 用戶相關個人化資料（例如密鑰編號及識別編號）則接著 施用於該卡之上。預先及後個人化的分開導致製造成本的 大幅降低。此原因是用戶相關個人化資料是相當機密的資 料，必須僅在相對應之安全的環境中施用於晶片之上。而 現有技藝中，所有個人化資料在安全的環境中皆同步地施 用於晶片之上（其需要約一分鐘的程式執行時間），由於 依據本發明而受影響之個人化程序的分割，只有在將用戶 相關個人化資料施用於晶片之上時’晶片才需處於安全的 - ----------#--------訂---------線· (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） -5- 505889 A7 B7 五、發明說明（3) 環境。然而，此時間僅爲數秒鐘，以至於安全環境及監控 動作的成本很低。 依據一較佳具體實施例，進行r將晶片載具相關個人 化貪料在一製造步驟以及晶片模組製造中施用於該卡之上 的準備。本具體實施例的下列考慮是在其製造之後立即進 行’即晶片模組必須由測試裝置針對其功能進行測試；此 通常需要約4至5秒鐘。依據本發明，所使用的時間是非 常精確的，以執行預先個人化。經由相符數量的程式·讀寫 頭，便可能確定預先個人化，卻未減緩模組製造與檢查， 其約需2 0至8 0秒。在個別製造步驟中個人化的時間可 因而大幅減少。此亦有助於製造成本的降低。 預先個人化資料的應用程式可在模組製造的內容中由 具有1 6個以上相符數量的程式讀寫頭之個別設備加以執 行。同樣地，測試晶片的測試裝置亦可配備該數量的程式 讀寫頭。 替代地，可能已於較早的製造步驟中便提供預先個人 化的資料，例如於最後製造晶片之晶圓的製造中，或晶片 的製造中。晶圓通常亦接受功能測試，以便此間所需的測 試時間亦供預先個人化使用，而不減緩程序。個別設備可 再次提供予預先個人化或測試裝置，以便晶圓可配備至少 1 6個之相符數量的程式讀寫頭。 然而，最後不論個人化是在個別的製造步驟中或是倂 入現有的製造步驟中執行皆是無關緊要的。必要的是預先 個人化是無關乎後個人化而完成；預先個人化無疑地亦可 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝---- 訂---------線‘ 經濟部智慧財產局員工消費合作社印製 505889 經濟部智慧財產局員工消費合作社印製 A7 _______Β7______ 五、發明說明（4 ) 以多個步驟或層次而完成。 後個人化亦可由具有至少一個相對應程式遺馬頭的個 別程式設備來執行。然而.，依據一較佳具體實施例’進行 了將用戶相關個人化資料在一自動將晶片模組嵌入例如一 卡或多卡之載具的製造步驟中施用於該晶片之上的準備。 在模組嵌入程序中，用戶相關個人化資料的列間應用程式 使得製造時間進一步地減少，因爲該些資料不再需要被引 進個別的製造步驟中之故。 丨 依據本發明的進一步觀點，晶片使用快閃控制器取代 在此之前的唯讀記憶體（R 〇 Μ )。因而可能忽略諸如現 有技藝中的開發批次，而免於冗長的晶片製造流程。針對 縮短將軟體接口至其他半導體（硬體萃取層）上之程序的 相對應軟體平台，該軟體之後可立即用於與快閃控制器結 合。冗長的開發與測試時間因而司忽略或司大幅縮短。 就本發明的進一步有利的具體實施例而論，請參閱獨 立的申請專利範圍及下列參照附圖之示例具體實施例的說 明，其中： 圖1顯示一流程圖’描繪依據現有技藝之晶片卡的開 發及製造；及 圖2顯示一流程圖，描繪依據本發明之晶片卡的系列 製造方法。 在圖2所描繪依據本發明之晶片卡的系列製造方法中 ，首先發生的是相對應軟體程式的開發，如同現有技藝， 將花費約6個月。該軟體程式的設計，使其可將:接□至其 --------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁)Printed on 505889 A7 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A_B7 ^ _ V. Description of the Invention (1) The present invention relates to a series of wafer manufacturing methods, especially user identification (s I M) cards, including the following steps:-a Creating software programs;--The software program will be applied to a chip;--Chip carrier-related and user-related personal data will be applied to the chip. The present invention relates to the manufacture of various types of wafers, and is mainly related to the manufacture of so-called user identification (SI M) cards, that is, mobile radio cards, which are inserted into a mobile phone and must enter a user identification code (P IN) to activate so that Mobile phones can be used to make and receive calls. A chip on the subscriber identity (SIM) card stores the information required by the mobile phone to log in to the mobile radio network after it is turned on. The data that must be stored on the chip for that purpose is personalized data of the stomach; a distinction is made between the chip-related personalization data and the user-related personalization data, the former of the type expected by the chip (eg Watches, cards, etc.) are the same for all chips, and the latter is handled by each card individually (such as serial number, user identification password (ρ IN), etc.) 〇 At present, the user identification (SI) card is usually as shown in Figure 1. The method of making coins is described below: The first step is software development, which takes about six months. According to the software, a mask is manufactured, and a read-only memory (ROM) chip is sequentially manufactured based on the mask. This takes about sixteen weeks. The chip is then embedded in a module and tested (about six weeks). If a defect occurs, then the software is modified and the mask manufacturing, chip manufacturing, module manufacturing are repeated. The paper size is applicable to China National Standard (CNS) A4 Specifications (210 X 297 mm) ------------------- Order --------- Line- * (Please read the precautions on the back before filling (This page) 505889 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention (2) Testing and modification until the test results pass. Then, a series of manufacturing was started, in which a read-only memory (ROM) chip 'was first manufactured and embedded in a module, which took about sixteen weeks. Then, a plastic card (if used) is made and engraved, and the chip module is embedded, and then the personal data is applied to the chip. The above procedures are very laborious and cause considerable lead time on the one hand and considerable manufacturing costs on the other. Therefore, an object of the present invention is to develop a wafer series manufacturing method of the type exemplified at the beginning, so that the manufacturing time and cost can be reduced. The objective is achieved according to the present invention, in which the personalization data related to the wafer carrier is first applied to the wafer; and the personalization data related to the user is manufactured only later, regardless of the personalization data related to the wafer carrier. The step is applied on the wafer. Therefore, the basic idea of the present invention is not to execute the personalization of the wafer in the manufacturing steps like the existing technology, but to apply the personalized data of a specific customer (ie wafer carrier related) to the wafer in a pre-personalization process. , And then personalize it after executing it in the content, and the user's related personal data (such as the key number and identification number) is then applied to the card. The separation of pre- and post-personalization leads to a significant reduction in manufacturing costs. The reason for this is that user-related personal data is fairly confidential and must only be applied to the chip in a correspondingly secure environment. In the prior art, all personal data is simultaneously applied to the chip in a secure environment (which requires about one minute of program execution time). The division of the personalization program affected according to the present invention can only be achieved in When applying user-related personal information to the chip, the chip needs to be in a safe ----------- # -------- order --------- line · (Please read the precautions on the back before filling out this page) The paper size applies to the Chinese National Standard (CNS) A4 (210 χ 297 mm) -5- 505889 A7 B7 V. Description of the invention (3) Environment. However, this time is only a few seconds, so that the cost of the security environment and monitoring operations is very low. According to a preferred embodiment, preparations are performed for applying the personalization information related to the chip carrier to the card in a manufacturing step and chip module manufacturing. The following considerations of this specific embodiment are performed immediately after its manufacture ', i.e. the chip module must be tested for its function by a test device; this usually takes about 4 to 5 seconds. According to the present invention, the time used is very precise to perform pre-personalization. By matching the number of programs and read / write heads, it is possible to determine in advance personalization without slowing down module manufacturing and inspection, which takes about 20 to 80 seconds. The time for personalization in individual manufacturing steps can thus be significantly reduced. This also helps to reduce manufacturing costs. Applications with pre-personalized data can be executed by individual devices with more than 16 matching number of program read / write heads in the contents of the module manufacture. Similarly, the test device for testing the chip can also be equipped with this number of program heads. Alternatively, pre-personalized information may have been provided in earlier manufacturing steps, such as in the manufacture of the wafer from which the wafer was last manufactured, or in the manufacture of the wafer. Wafers are also typically functionally tested so that the test time required here is also pre-personalized without slowing down the process. Individual equipment can be re-provisioned to a pre-personalized or test device so that the wafer can be equipped with at least 16 matching read / write heads. However, it does not matter whether personalization is performed in individual manufacturing steps or incorporated into existing manufacturing steps in the end. It is necessary that pre-personalization is done independently of post-personalization; pre-personalization is undoubtedly also applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) on this paper size (please read the precautions on the back before (Fill in this page) Pack ---- Order --------- Line 'Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505889 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _______ Β7 ______ V. Description of Invention ) Done in multiple steps or levels. Post-personalization can also be performed by individual program equipment with at least one corresponding program horse head. However, according to a preferred embodiment, preparation for applying user-related personal data to a wafer in a manufacturing step of automatically embedding a chip module into a carrier such as a card or a multi-card is performed. In the module embedding process, the inter-column application of user-related personal data reduces the manufacturing time further, because the data no longer needs to be introduced into individual manufacturing steps.丨 According to a further aspect of the present invention, the chip uses a flash controller to replace the previous read-only memory (ROM). It is thus possible to ignore development batches such as those in the prior art, and avoid lengthy wafer manufacturing processes. For the corresponding software platform that shortens the process of interfacing the software to other semiconductors (hardware extraction layers), the software can be immediately used to integrate with the flash controller. The lengthy development and testing time is therefore neglected or significantly reduced. For further advantageous embodiments of the present invention, please refer to the scope of the independent patent application and the following description of the exemplary embodiments with reference to the drawings, in which: FIG. 1 shows a flowchart depicting a chip card according to the prior art Development and manufacturing; and FIG. 2 shows a flowchart depicting a series of manufacturing methods for a chip card according to the present invention. In the series of manufacturing methods of the chip card according to the present invention depicted in FIG. 2, the development of the corresponding software program first takes place, as in the prior art, which will take about 6 months. The software program is designed so that it can: connect to its ------------ order --------- line (please read first (Notes on the back then fill out this page)
經濟部智慧財產局員工消費合作社印製 505889 A7 _ B7 五、發明說明（5) 他半導體（硬體萃取層）的程序縮短至最少的時間及成本 ’並司用於連接快閃控制器。在該軟體開發的同時，快閃 控制器晶片被製造。該晶片接著以通常的方式及相對應的 機器嵌入模組中’並接著裝配所開發的軟體。以此方式裝 配程式的晶片模組經由例如輸送帶傳送至測試裝置，在此 針對其功能進行測試。該測試模式就其本身而言是已知的 ，因而此刻將不進一步地詳述。所感興趣的是2 〇至8〇 秒的測試時間是每一晶片所必須的，爲此原因，多個，晶片 同步測試，以便不致減緩模組製造與裝配程式的程序。 在功能檢查之後，預先個人化資料（即卡相關個人化 貪料）便施用於機能的晶片模組之上，爲此目的，該測試 裝置被配備予共計1 6個以上的程式讀寫頭，供晶片模組 自動地傳送至彼處。由於預先個人化較先前所執行的功能 測試花費較多的時間，便執行多個晶片的平行裝配程式， 爲此目的並提供相對應數量的程式讀寫頭。 晶片模組業已完成並裝配以預先個人化資料，接著並 以通常的方式嵌入塑膠卡片中。具有相對應的凹洞及*** 形狀之預先製造的空白卡片較佳地用於此目的。將用戶相 關個人化資料施用於晶片上的程序在嵌入之前或之後完成 ，但二者是在相同的製造步驟中。該個人化的步驟，代表 製造中唯一·相當安全的步驟（因爲其係唯一輸入密碼及識 別碼的地方），其係於一安全的環境中執行。由於該個人 化程序的部份僅需數秒，所以安全環境的成本可予以最小 化。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -8 - 裝--------訂---------線 (請，先閱讀背面之注意事項再填寫本頁) 505889 A7 ______B7______ 五、發明說明（6 ) 已發現使用依據本發明之方法可大幅減少製造的時間 及成本，即使用怏閃控制器而非唯讀記億體（R 〇 Μ )、 戶 用 之 間 期 卡 入 嵌 組 模 在 及 以 % 化。 人用 個應 先的 預料 中資 造化 製人 組個 模關 在相 (請先閱讀背面之注意事項再填寫本頁) 訂： 線· 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -9 -Printed by the Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economic Affairs 505889 A7 _ B7 V. Description of the Invention (5) The procedure of other semiconductor (hardware extraction layer) is shortened to the minimum time and cost ’and used to connect the flash controller. At the same time as the software was developed, a flash controller chip was manufactured. The chip is then embedded in a module 'in the usual manner with a corresponding machine' and then the developed software is assembled. The wafer module assembled in this way is transferred to a test device via, for example, a conveyor belt, where its function is tested. This test mode is known per se and will not be further elaborated at this time. What is of interest is that a test time of 20 to 80 seconds is required for each chip. For this reason, multiple, wafers are tested simultaneously so as not to slow down the module manufacturing and assembly process. After the function check, pre-personalized data (that is, card-related personalized information) is applied to the functional chip module. For this purpose, the test device is equipped with a total of 16 or more program read-write heads For the chip module to be automatically transferred there. Since pre-personalization takes more time than previously performed functional tests, parallel assembly programs for multiple chips are executed, and a corresponding number of program read-write heads are provided for this purpose. The chip module has been completed and assembled with pre-personalized information, and then embedded in a plastic card in the usual manner. A pre-made blank card with a corresponding recess and insertion shape is preferably used for this purpose. The process of applying user-related personal data to the chip is done before or after embedding, but both are in the same manufacturing steps. This personalized step represents the only and fairly secure step in manufacturing (because it is the only place to enter a password and identification code), and it is performed in a secure environment. Because the part of the personalization process takes only a few seconds, the cost of a secure environment can be minimized. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 public love) -8-Packing -------- Order --------- Line (Please read the note on the back first Please fill in this page again for matters) 505889 A7 ______B7______ 5. Description of the invention (6) It has been found that the use of the method according to the present invention can greatly reduce the manufacturing time and cost, that is, the use of a flash controller instead of a read-only recorder (R OM) ), The user will be stuck in the embedded module during the period. It is expected that the model used by the Chinese manufacturer will be closed (please read the precautions on the back before filling out this page). Order: Line · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives This paper is applicable to China Standard (CNS) A4 size (210 X 297 mm) -9-