TW505616B - Method for producing micro-system chip by injection compression molding - Google Patents
Method for producing micro-system chip by injection compression molding Download PDFInfo
- Publication number
- TW505616B TW505616B TW90111119A TW90111119A TW505616B TW 505616 B TW505616 B TW 505616B TW 90111119 A TW90111119 A TW 90111119A TW 90111119 A TW90111119 A TW 90111119A TW 505616 B TW505616 B TW 505616B
- Authority
- TW
- Taiwan
- Prior art keywords
- micro
- heater
- plastic
- electromechanical
- technology
- Prior art date
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
五、發明說明（1) 可更型技術在近幾年來漸趨成·，使得此技術 於其他場合…壓縮成型技術主要是 以減少塑料在充填模穴時所需之=二成型：法2可 壓使得模穴内炫融塑膠壓力；；：出'f力’且由於均句加 ^ , m , σ ^ 七 此均勻7刀佈及克服凹陷、翹曲 寻’ 此在成品收缩率可 佟點，射Ψ茂w上、 侍到良好的控制。基於上述之 k ”、、占 射出壓鈿成型在目前的廏田 ^ 老詹φ與地所1 』的應用，者重在需要尺寸以及 考慮先學性質的光學用精密 )的製作。以常見的光碟片央：先碟片（Compact Dlsk 制作，合0 ^ α| + ”片耒看，若以傳統的射出成型來 去元全充填完整，亦即有短射現 象，由此可知對於面積大日祛 刑古、、4W、；玉—土、廿 且缚件的要求，以傳統的射出成 型方法似乎無法滿足，所n i ^ ^ ^ ^ έ ^ ^ Μ目别光碟皆是採用射出壓縮技 ,,,,&、，>、#"、、,成形4塑料在澆道側皆是保持熔 阳生狀I，所以右塑料的谁达 ^ 進允▲度相對較高，再加上模具 的施加壓力，即.可避免短射 、，m ^ 町4問過。美國專利 US006164952A，係利用射壓 寻 • 土力乂 生棋具（injection compression molding)制从 以I作DVD光碟片。在此專利中，乃 採用射出壓縮的方式以及在指— ,,LH ^ ^ 门 在杈穴中製作一傾斜角，以促進 塑料的流動’因此可完成面接 10Π •后命· η 乂面積大且薄的射出件（直徑： 12 Omm ，尽度· 0 · 6 mm ) 々 ^ , 广—& 一 J 但疋右要以此法製作面積更 大、厚度更薄、共面度更离、 &阿（成形品不容許有傾斜角）吱 是壓模板結構細緻且更複雜0士 y η 对月J忒 雜日守’例如射出件中有貫穿孔V. Description of the invention (1) In the past few years, the retrofit technology has gradually become ·, making this technology in other occasions ... Compression molding technology is mainly to reduce the plastic required to fill the cavity = two molding: Method 2 can The pressure makes the plastic cavity dazzle and melt the plastic pressure;;: 'f force' and due to the uniform sentence plus ^, m, σ ^ Seven uniform 7 knife cloth and to overcome the depression, warping. This can be a little shrinkage in the finished product, Shoot Ψ 茂 on w and wait for good control. Based on the application of the above-mentioned k ", injection injection molding in the current Putian ^ Lao Zhan φ and the Institute of Geosciences 1", the focus is on the production of precision and optics that require size and consideration of prior learning properties. Disc center: first disc (produced by Compact Dlsk, combined with 0 ^ α | + ”). If the traditional injection molding is used to complete the filling, that is, short shot phenomenon, it can be seen that for large areas Xinggu ,, 4W ,; the requirements of jade-soil, earthenware, and binding parts cannot be satisfied by the traditional injection molding method, so all of the ^ ^ ^ ^ ^ ^ ^ ^ All optical discs use injection compression technology ,,,, , & ,, >,# " ,,, and the forming 4 plastics on the runner side are all kept in the positive state I, so the right plastic's ^ Jinyun ▲ degree is relatively high, plus the mold's Apply pressure, that is, avoid short shots, and m ^ ^ 4. Asked. US patent US006164952A, using injection pressure to search • Geo-injection compression molding (injection compression molding) made from I for DVD discs. This patent In the middle, the compression method of injection and the finger ---, LH ^ ^ Make an inclination angle to promote the flow of plastic 'so you can complete the surface connection 10Π • Lifetime · η 乂 Large and thin injection parts (diameter: 12 Omm, best degree · 0 · 6 mm) 々 ^, 广 — & One J, but you need to use this method to make a larger area, thinner thickness, more coplanarity, & Ah (formed products do not allow tilt angle) squeegee structure is more detailed and more complex 0 ± y y pairs J J Miscellaneous Sun Shou 'For example, there are through holes in the injection
第5頁 505616 五、發明說明（2) 等，可能會有下列幾項問題發生： 1. 若採用單一進澆口方式，塑料無法完全充填完成。 2. 若採用多重進澆口方式，射出件溫度分佈不均，整體 溫差大，經冷卻後收縮不一致而造成翹曲變形。 3. 塑料流經結構物時會因受阻改變流速而分流，在最後 會合時會因塑料流動太長漸漸冷卻，使得溫度不足而 融合不完全，最後導致缝合線的產生。Page 5 505616 5. Description of the invention (2), etc., the following problems may occur: 1. If a single gate is used, the plastic cannot be completely filled. 2. If the multiple gate method is adopted, the temperature distribution of the injection parts is uneven, the overall temperature difference is large, and the shrinkage is inconsistent after cooling, causing warpage and deformation. 3. When the plastic flows through the structure, it will be shunted due to the obstruction of changing the flow rate. At the last meeting, the plastic will be cooled because the plastic flows too long, resulting in incomplete fusion due to insufficient temperature, and finally the production of sutures.
4. 由於射出件面積大且肉厚較薄，容易因塑料流動不佳 冷料情形），而隨後所施加的壓力，使得壓模板上細 微且複雜的微結構被損毁。 針對以上問題，本發明運用微機電製程技術，製作一 些微加熱器（micro - heaters )置於壓模板之下，其在 此有兩項主要的功能· 1.針對塑料在核穴中流動車父不易 處，例如：肉厚較薄、結構複雜、塑料冷卻較快以及塑料 本身流動性較差等等，以局部加熱來改善流動性。2 .當 射出件溫度分佈不均時，可用來調整溫度落差的部位，使 得射出件整體的溫差減到最少。4. Because the injection area is large and the meat is thin, it is easy to be caused by poor plastic flow and cold materials), and the subsequent applied pressure causes the fine and complex microstructures on the platen to be damaged. In view of the above problems, the present invention uses micro-electro-mechanical process technology to make some micro-heaters under the die plate, which has two main functions here. 1. For plastic car flow in the nuclear cavity Difficulties, such as: thinner meat, complicated structure, faster plastic cooling, and poor fluidity of the plastic itself, etc., to improve the fluidity by local heating. 2. When the temperature distribution of the injection part is not uniform, it can be used to adjust the temperature drop position to minimize the temperature difference of the entire injection part.
在微機電的領域方面，有鑒於精密射出成型技術的成 熟且塑膠材料價格低廉、容易大量生產，故塑膠等高分子 材料漸漸亦被用來當作遮蔽用或保護用的外殼或蓋子，使 得塑膠等高分子材料亦可在未來微機電領域上佔有一席之 地。長期以來，光學晶片、生物晶片與通訊被動元件乃以 類LIG A的方式製作熱壓（hot embossing)模具，將塑膠加In the field of micro-electromechanical, in view of the maturity of precision injection molding technology and the low cost of plastic materials, which are easy to mass-produce, polymer materials such as plastic are gradually being used as housings or covers for shielding or protection. And other polymer materials can also have a place in the future micro-electromechanical field. For a long time, optical chips, bio-chips, and communication passive components have been manufactured in hot embossing molds in a LIG A-like manner.
第6頁 505616 五、發明說明（3)Page 6 505616 V. Description of the invention (3)
熱至適當溫度，經模具加壓後而得到精密的細微結構或是 凹槽空穴。Hans-Dieter Baue r等人，乃運用L I G A及熱壓 模技術，製作塑膠高分子材料的光波導元件，由於光在傳 遞時，折射率將是影響光傳遞效率的主要關鍵，所以製作 光波導之元件尺寸及相對位置需相當的準確且精密，一般 以熱壓成型的方式雖可達成，但缺點是，不易獲得均勻的 壓力，故較大面積及精細結構變化較大處很難達成，且製 作速度也不快，相較於本發明中以射壓成型方式射出後一 次成型無需經後加工顯得遜色許多。此外熱壓模具上微結 構（細長比較高的結構）容易在加壓時斷裂或損毁。若以 微射出成型技術雖可達到相同細微結構的精密度，有鑒於 所謂晶圓級的製程與封裝需求，目前一般的晶片多半為六 对或八对，因此礙於微射出成型無法製作大面積的薄射出 件，而無法達到整合微機電製程技術之晶圓級封裝。基本 上以微機電製程技術在壓模板（s t a m p e r )上製作微加熱 器，使細微處或厚薄件得以完成良好流動，如此一來可以 達到面積大且薄射出件的需求，此技術將可運用在需要高 精密尺寸或細微結構的光學晶片、生物晶片與通訊晶片 等，配合有積體電路或微機電元件等在其上的基板，達成 所謂晶圓級的封裝，此法將可減少許多個體封裝的成本， 更符合快速且大量生產之經濟效益。Heat to a proper temperature and pressurize the mold to obtain a precise fine structure or cavity. Hans-Dieter Bauer et al. Used LIGA and hot stamping technology to make optical waveguides made of plastic polymer materials. Since light is transmitted, the refractive index will be the main key that affects the efficiency of light transmission. The size and relative position of the components need to be quite accurate and precise. Although generally achieved by hot pressing, the disadvantage is that it is not easy to obtain uniform pressure, so it is difficult to achieve large areas and fine structure changes. The speed is also not fast. Compared with the method of the present invention, the injection molding method does not require post-processing to appear much inferior. In addition, the microstructure (longer and taller structure) on the hot-pressed mold is easily broken or damaged during pressing. If micro-injection molding technology can achieve the same fine structure precision, in view of the so-called wafer-level process and packaging requirements, most of the current general wafers are six or eight pairs, so it is impossible to produce large areas due to micro-injection molding. Thin injection parts, but cannot achieve wafer-level packaging that integrates MEMS process technology. Basically, micro-electromechanical process technology is used to make micro-heaters on stampers, so that fine parts or thick and thin parts can complete good flow. In this way, the requirements of large area and thin injection parts can be achieved. This technology will be applied to Optical chips, biochips, and communication chips with high-precision dimensions or microstructures are required, with integrated circuits or microelectromechanical components and other substrates on them to achieve so-called wafer-level packaging. This method will reduce many individual packages. The cost is more in line with the economic benefits of rapid and mass production.
第7頁 5^S,6,16 五、發明說明（4) 發明目的 本發明的目的之一，採用射出壓縮成型方法及微機電製程 技術，製作需有細微圖案等微系統晶片。 本發明的目的之二，運用射出壓縮成型模具，並以微機電 製程技術製作微加熱器.，設置於壓模板中，使模穴中塑料 流動較不易處，透過局部溫度控制，使得以完成良好的流 動，如此可輕易達到面積大且薄射出件的需求。 本發明的目的之三，將本發明之技術，運用於需要高精密 尺寸及對位的光學晶片，以取代傳統使用製程繁雜且成本 高的熱壓成型模具。 本發明的目的之四，利用本發明之技術，於生物晶片上 的運用可製作細微結構之微流道、微通道。若考慮生物晶 片的材質，有所謂親水性與疏水性之差異，甚至更進一步 需要考慮生物相容性，皆可自行調配材料（塑膠料），滿 足自行之需求。 本發明的目的之五，以本發明之技術製作微空穴（c a v i t y )及貫穿孔（v i a ho 1 e)且具有遮蔽與保護功能的外殼或 蓋子，此法結合晶圓級的製程以封裝通訊晶片。 本發明的目的之六，除了微結構的射出成型之外，透過此 發明方法亦可解決一般射出成型射出件的縫合線、充填不 足及溫度分佈不均（溫差大）之問題。 本發明的目的之七，利用本發明之技術可解決因肉厚太薄 所造成塑料流動困難之問題，並達成次毫米級超薄件之精Page 7 5 ^ S, 6,16 V. Description of the invention (4) Purpose of the invention One of the purposes of the present invention is to use injection compression molding method and micro-electro-mechanical process technology to produce micro-system wafers that require fine patterns and the like. The second object of the present invention is to use injection compression molding molds and micro-electro-mechanical process technology to make micro-heaters. It is set in the die plate to make the plastic flow in the mold cavity difficult, and local temperature control is used to make it complete well. This makes it easy to meet the needs of large and thin injection parts. The third object of the present invention is to apply the technology of the present invention to optical wafers that require high precision size and alignment to replace the traditionally complicated and costly hot-pressing molds. The fourth object of the present invention is to use the technology of the present invention to produce micro-structured micro-channels and micro-channels by using it on a biochip. If the material of the biochip is considered, there is a difference between the so-called hydrophilicity and hydrophobicity, and even further, biocompatibility needs to be considered. All materials (plastic materials) can be blended by themselves to meet their own needs. A fifth object of the present invention is to use the technology of the present invention to make a housing or cover with microcavity and via holes (via ho 1 e) with shielding and protection functions. This method combines the wafer-level process to encapsulate communication Wafer. The sixth object of the present invention is to solve the problems of sutures, insufficient filling and uneven temperature distribution (large temperature difference) of general injection molding injection parts in addition to microstructure injection molding. The seventh object of the present invention is to use the technology of the present invention to solve the problem of difficult plastic flow caused by too thin meat thickness and achieve the precision of sub-millimeter ultra-thin parts.
第8頁 505616 五、發明說明（5) 密射出。 本發明的目的之八，此射出壓縮成型技術可達到晶圓級元 件的精密射出，可製作所謂晶圓級的塑膠片（6吋以上）， 配合有積體電路或微機電元件等在其上的基板，進行晶圓 級的封裝，減少許多個體封裝的成本。 為使貴審查委員能更進一步了解本發明，以下玆列舉出具 體實施例，並配合圖示、圖號等說明，詳細說明本發明之 構成内容及其所達成的功效。Page 8 505616 V. Description of the invention (5) Close shot. The eighth object of the present invention is that the injection compression molding technology can achieve the precise injection of wafer-level components, and it can produce so-called wafer-level plastic sheets (more than 6 inches) with integrated circuits or micro-electromechanical components. Substrate for wafer-level packaging, reducing the cost of many individual packages. In order to make your reviewing committee better understand the present invention, specific examples are given below, together with illustrations, drawing numbers, etc., to explain in detail the composition of the present invention and the effects it achieves.
各主要元件之名稱及圖號： 圖 號 名稱 圖號 名稱Name and drawing number of each main component: Drawing number Name Drawing number Name
11 固定側模板（一） 12 固定側模板（- 13 可動側模板 14 洗道襯套 15 流 道 16 模 穴 17 壓模板 18 固定銷 19 頂出銷 21 壓模板固定塊 23 外加電源裝置 30 微加熱器模組 31 微加熱器 33 二氧化矽 35 金屬通孔 37 外接電源線路層 40 射出件外徑 41 陶瓷基材 43 鎳導電層 45 接觸電極 號 名 稱 圖 號 名 稱11 Fixed-side template (1) 12 Fixed-side template (-13 Movable-side template 14 Wash channel bushing 15 Flow channel 16 Mold cavity 17 Press template 18 Fixing pin 19 Ejection pin 21 Press template fixing block 23 Power supply unit 30 Micro heating Device module 31 micro heater 33 silicon dioxide 35 metal through hole 37 external power circuit layer 40 injection part outer diameter 41 ceramic substrate 43 nickel conductive layer 45 contact electrode number name drawing number name
第9頁 505616 五 、發明說明 (6) 51 固定 螺栓 52 金屬墊片 53 絕緣 墊片 54 固定螺帽 56 外接電 源端子 57 熔融塑料 58 結構物 59 缝合線發生處 61 底鍍層 63 厚光阻 71 光纖放置槽 73 光纖波導槽 75 光纖 材料 77 光纖心部 79 波導 材料 83 塑膠連接器 實 施方 法 及實施 例 目 前 DVD光碟片主要採用射出壓; 縮成型技術製作' ， 其 射 出件 之 厚度約 為 0 . 6ram 而 此 厚度 .似 乎接近塑料所 能 流 動 的臨 界 厚度（ 當然要視 材 料 本 身的 流 動性而定）， 所 以 看 來塑 料 4 士口 it匕 厚度流動 時 若 無夕卜 ‘加 力量，較難順 利 流 動 。此 外 ，塑料 在模穴中 流 動 時 ，會 •漸 漸冷卻凝固下 來 而 減 少流 動 性，若 此時再以 壓 縮 的 力量 迫 使塑料繼續充 填 造成 塑 料被推 擠前進， 若 遇 有 細微 之 結構物時，會 很 容 易 造成 毁 損或斷 裂的情形 發 生 0 本發 •明 以微機電製程 技 術 結 合射 出 壓縮成 型技術製 作 微 加 熱器 即 可解決流動性 之 問 題 ，本 專 利將舉 出一些實 施 例 及 實施 ‘方 法說明微加熱 器 之 應用 實施例Page 9 505616 V. Description of the invention (6) 51 Fixing bolts 52 Metal gaskets 53 Insulating gaskets 54 Fixing nuts 56 External power terminals 57 Molten plastic 58 Structures 59 Where sutures occur 61 Under plating 63 Thick photoresist 71 Optical fiber Placed groove 73 fiber waveguide groove 75 fiber material 77 fiber core 79 waveguide material 83 plastic connector implementation methods and examples At present DVD discs are mainly produced by injection pressure; shrink molding technology ', the thickness of the injection part is about 0.6 ram And this thickness seems to be close to the critical thickness that the plastic can flow (of course, it depends on the fluidity of the material itself), so it seems that the thickness of the plastic 4 shikou it is difficult to flow smoothly without force when it flows. . In addition, when the plastic flows in the cavity, it will gradually cool and solidify to reduce its fluidity. At this time, if the plastic is forced to continue to be filled with compressive force, the plastic will be pushed forward. If it encounters fine structures, it will It is easy to cause damage or fracture. 0 This issue • Ming uses micro-electro-mechanical process technology combined with injection compression molding technology to make micro-heaters to solve the problem of fluidity. This patent will give some examples and implementation of the method. Application example of heater
第10頁 五、發明說明（7) 生物化學反應晶片。典型的生化反應晶片是核酸擴增 反應晶片（P C R C h i p ) ’匕疋在晶片表面運用微細加工技術 刻蝕出反應槽’並在其底部或反面製作微型電極陣列或附 加微加熱器組。近來此反應晶片乃採用高分子材料主要是 由於親水性與疏水性之.問題，甚至更進一步需要考慮生: 相谷性。目前一般生物曰曰片4 /泉道（^ i c r 〇 c h a η n e 1)之 截面尺寸約為20將一50〆m不等，而一般（^光碟片的 雷射讀取資料軌跡深度在〇 · 5髀以下，故如此細微的尺 寸結構可透過射壓成型技術及壓模板完全表現出來。 此實施方法是將微加熱器模組3 〇第二圖裝設於固定側模板 1 2上’直接對模穴1 6内塑料進行局部加熱，使可能冷卻凝 固塑料維持受熱並增加流動性，如第一圖所示。 以下為此方法之詳細實施細節： 1 *首先對於射出成品進行模流分析，以決定進澆方式、 進堯個數及位置，並觀察溶融塑料流動、溫度及壓力 的分佈情形，暸解肉厚較薄或是易發生缝合線處等流 動性較差之部位。以本例來說，由於面積大且肉厚 薄’故需 採取多點進澆之方式（必要時則需採用熱Page 10 V. Description of the invention (7) Biochemical reaction wafer. A typical biochemical reaction wafer is a nucleic acid amplification reaction wafer (P C R C h i p) ′, which uses a microfabrication technique on the wafer surface to etch out a reaction tank ’and makes a micro-electrode array or a micro-heater set at the bottom or the reverse side. Recently, this reaction chip uses polymer materials mainly because of the problems of hydrophilicity and hydrophobicity, and even further needs to consider the health: phase valley. At present, the cross-sectional dimensions of general biofilms 4 / quandao (^ icr 〇cha η ne 1) are about 20 to 50〆m, while the depth of the laser read data track for general (^ disc) is 0 · Below 5mm, so such a small size structure can be fully expressed through injection molding technology and die plate. This implementation method is to install the micro heater module 3 〇 The second picture is installed on the fixed side template 12 directly The plastic in the cavity 16 is locally heated to make it possible to cool and solidify the plastic to maintain heat and increase fluidity, as shown in the first figure. The detailed implementation details of this method are as follows: 1 * First, perform a mold flow analysis on the finished product to Decide the pouring method, number and location of pouring, and observe the distribution of molten plastic flow, temperature and pressure to understand the poor fluidity such as thin meat or sutures. For this example, Because the area is large and the meat is thin, multi-point pouring method is needed (when necessary, heat
第11頁 5^^^备 16 五、 發明說明 (8) 澆 道 的 方 式 ) 〇 2. 對 於 本 例 中 所 提 及 之 肉 厚 較 薄 或 是 易 發 生 缝 合 線 處 等 流 動 性 較 差 處 進 行 微 加 孰 4 器 分 佈 ( Lay οιτ t) 設 計 〇 根 據 模 流 分 析 時 的 溫 度 分 佈 情 況 亦 可 決 定 微 加 熱 器 31 之 位 置 〇 由 於 微 加 熱 器 屬 於 分 段 式 分 佈 故 每 個 位 置 的 微 加 敎 $ 器 可 透 過 外 加 流 或 壓 之 大 小 與 外 加 溫 度 控 制 器 ( 未 顯 示 於 圖 中 ) 而 設 定 不 同 之 溫 度 此 法 也 可 用 來 調 整 射 出 件 的 溫 度 分 佈 5 減 少 成 品 因 整 體 溫 差 太 大 冷 卻 後 收 縮 不 一 而 造 成 之 變 形 〇 第 六 圖 為 本 例 中 微 加 孰 哭 σσ 的 分 佈 情 形 主 要 是 針 對 壓 模 板 上 之 結 構 部 位 及 肉 厚 較 薄 或 易 發 生 缝 合 線 處 等 進 行 局 部 加 教 〇 第 七 圖 為 本 例 中 另 一 種 微 加 熱 哭 cm 的 5又 計 方 式 及 分 佈 情 形 〇 微 加 数 器 是 選 擇 適 當 的 電 阻 材 料 當 作 加 軌 4 源 一 般 常 被 用 來 當 作 加 孰 器 的 材 料 有 • 多 晶 矽 (Po] L y s i ] [icon) 碳 化 矽 ( S] lC) 及氮化欽 (1 ΠΝ) 等 等 1 其 主 要 具 有 向 電 阻 係 數 Λ 孰 穩 定 性 南 剛 性 佳 及 耐 腐 之 特 性 〇 當 材 料 面 積 愈 小 其 相 對 電 阻 值 會 愈 大 則 加 数 愈 容 易 ， 因 此 微 加 孰 器 應 5又 計 成 面 積 小 而 分 佈 密 集 之 方 式 所 有 的 微 加 孰 器 皆 是 埋 在 敎 傳 導 係 數 較 差 且 絕 緣 的 二 氧 化 矽 33 ( Si :〇2) 材 料 中 故 微 加 軌 器 對 周 遭 的 元 件 並 未 造 成 很 大 的 熱 效 應 5 如 此 可 達 到 較 佳 的 局 部 加 執 效 果 〇 3. 微 加 執 器 的 加 熱 主 要 是 以 電 阻 材 料 透 過 外 加 電 流 或 電 壓 的 方 式 而 達 到 加 埶 的 效 應 〇 在 本 例 中 加 孰 器 的 分 佈Page 11 5 ^^^ Preparation 16 V. Description of the invention (8) The way of the runner) 〇2. For the meat mentioned in this example, the thickness of the meat is thin or sutures are easy to occur, such as poor fluidity. Design of the distribution of four heaters (Lay οιτ t) 〇 The position of the micro heater 31 can also be determined according to the temperature distribution during the mold flow analysis. Because the micro heater is a segmented distribution, the micro heaters at each position The temperature can be set differently by the external flow or pressure and the external temperature controller (not shown in the figure). This method can also be used to adjust the temperature distribution of the injection part. 5 Reduce the finished product due to the overall temperature difference. Deformation caused. The sixth figure is the distribution of micro wailing σσ in this example, which is mainly for the structural parts on the stamper and the thinner meat or sutures. Partially add teaching. The seventh picture is another example of the micro heating and crying method in this example. The micro-adder is to select the appropriate resistance material as the rail. 4 The source is often used as The materials of the amplifier are: • polycrystalline silicon (Po) Lysi [icon] silicon carbide (S) lC) and nitride (1 ΠΝ), etc. 1 It mainly has a specific resistivity Λ 孰 stability, high rigidity and resistance Corrosion characteristics: When the area of the material is smaller, the relative resistance value will be larger, and the addition will be easier. Therefore, the micro-adder should be counted as a small area and densely distributed. All micro-adders are buried in 敎In the silicon dioxide 33 (Si: 〇2) material with poor conductivity and insulation, the micro rail adder does not cause a large thermal effect on the surrounding components. 5 This can achieve a better local application effect. 03. Micro plus Heating master Electrically resistive material is transmitted through the external power voltage, or flow manner and up to add flair to effect square distribution according to the present embodiment is what is added in
第12頁 五、發明說明 相當 33中 很重 或電 源端 連接 將外 將接 可與 4·本發 完成 後再 以壓 保壓 (9) 多且複 ’所以 要的問 壓的方 子5 6的 至下層 接電源 觸電極 外接電 明射壓 時，模 利用鎖 縮成型 動作。 雜，而且所 說要如何通 題。第五圖 法’從第二 兩端處，皆 ’同時在孔 的線路3 7接 4 5拉回上層 源端子5 6接 模具動作流 具不完全閉 模機構閉鎖 來完成模穴 有的加熱器 入外加的電 所示為本例 圖可看出在 拉出一些通 中鍍上金屬 做在下層， 表面，使接 觸。 程為在充填 鎖，當塑料 模具向模穴 1 6充填，等 皆是埋在二氧化矽 流或電壓變成一個 中如何通外加電流 微加熱器需外接電 孔 35 ( via hole) 膜當作導電層，並 最後再透過通孔35 觸電極4 5表面露出 之初塑料尚未充填 在模穴1 6充填完成 内塑料施加壓力， 充填完成後再進行 以下為此方法之詳細製作流程及細節： 本灵知例微加教哭之智藉可目 基材選擇，面，*用弟十〜十三圖。首先在 微機電製程，在文獻^亦二人使要是材料剛性強且適合 埶哭之其& ^獻中亦有人使用矽晶圓來當作製作柃+ 隔以^將石夕晶圓做背面餘刻，製作-空穴 …、政果。但由於矽基材易脆裂，若 為 f::=熱器固定時壓_，而且微加熱：易 用來加工進“部位，因此對”基材之使用；=Page 12 V. Description of the invention It is quite heavy in 33 or the power terminal is connected. The general will be able to connect with 4. After the completion of the hair, the pressure will be maintained (9) more and more complex, so the method of asking pressure 5 6 When the contact electrode of the power supply to the lower layer is connected to an external light source, the mold uses a shrink-molding operation. Miscellaneous, and how to solve the problem. Fifth picture method 'from both ends of the two' at the same time at the line of the hole 3 7 connect 4 5 pull back the upper source terminal 5 6 connect the mold action flow device incomplete mold closing mechanism lock to complete the mold cavity heater The added electricity is shown in the figure of this example. It can be seen that some metals are plated on the lower layer and the surface is brought into contact during the drawing. Cheng Wei is filling the lock. When the plastic mold is filled into the cavity 16 and so on, all are buried in the silicon dioxide flow or the voltage becomes one. How to pass the external current through the micro heater requires an external hole 35 (via hole). The film is conductive. Layer, and finally through the through-hole 35 contact electrode 4 5 the surface of the plastic is not yet filled in the mold cavity 1 6 after the filling is completed, the plastic pressure is applied, after filling is completed, the following detailed production process and details of this method: Knowing how to teach the wisdom of crying can be used to choose the substrate, face, * use brother ten to thirteen pictures. First in the micro-electro-mechanical process, in the literature ^ also two people make use of silicon wafers for making 柃 if the material is rigid and suitable for crying & In the last moment, making-hole ..., Zheng Guo. However, since the silicon substrate is fragile, if f :: = pressurized when the heater is fixed, and it is slightly heated: it is easy to be used to process into the "part, so the use of" substrate; =
505616 五、發明說明（10) 的考慮故在本例不宜採用 化矽33 ( Si 02)當做隔熱 一層的結構物幾乎都有二 部的隔熱作用，以確實地 蒸鍍沉積一銅金屬層3 7， 曝光〉顯影〉R I E乾钱刻〕 (pattern)， 隨後再沉 如第十一圖所示。第十二 複前述的方法，以微影蝕 及連接上層微加熱器與下 完成的微加熱器如第十三 製程亦可利用LTCC ( Low 低溫共燒陶瓷）的製程方 過印刷的方式將所需的結 多層的陶瓷基板上，最後 結合在一起。 豈^例二· °開始先以LPCVD沉積 : 如苐十圖所示，在 氧彳匕石夕做為元件之間及 4 ^元全局部加熱之效 透過微影蝕刻技術（塗 <故出外接電流或電壓 積一氧化矽3 3層並將表 圖及第十三圖所示之製 刻技術做出上層之微加 層線路3 7的金屬通孔層 圖所示。上述從第十〜 一層二氧 本例中每 元件與外 果。PVD 佈光阻> 線路圖案 面磨平， 程則是重 熱器31以 3 5，最後 十三圖之505616 V. Consideration of invention description (10) Therefore, in this example, it is not appropriate to use silicon 33 (Si 02) as a layer of heat insulation. Almost all of the structures have two heat insulation functions to reliably deposit a copper metal layer. 37. Exposure> Development> RIE dry money engraving] (pattern), and then sink as shown in Figure 11. The twelfth method mentioned above uses lithographic etching and connecting the upper micro heater with the micro heater completed below. For example, the thirteenth process can also use the LTCC (Low Low Temperature Co-fired Ceramic) process to print the process. The desired multilayer ceramic substrate is finally bonded together. What is the second example? LPCVD deposition is started first: As shown in Figure 10, the effect of heating between the element and the global part of the substrate is through the lithography etching technique (coating). The external current or voltage is used to integrate 3 3 layers of silicon monoxide, and the metal vias of the upper layer of the micro-addition circuit 37 are shown in the table and the engraving technology shown in the 13th figure. One layer of dioxin. In this example, each element and the outer fruit. PVD cloth photoresist> The pattern surface of the circuit is flattened. The process is reheater 31 to 3 5 and the last 13
Temperature Co-fired Ceramic 式達成。使用多層陶瓷基板並透 構形狀（pat tern)， 分別印在 以燒結的方式將所有的陶瓷基板 由於微波通訊晶片是以被動元件為最主要的部分，為 避免晶片上各元件間的相互干擾，通常會設計一蓋子來作 為各元件間的屏蔽作用，而高分子材料通常是較佳的選 擇，原因主要是成本低、容易取得且適合大量生產。本例 之設計是射出一 6时大小的塑膠薄件，實際厚度約〇 · 7腿Temperature Co-fired Ceramic. Multi-layer ceramic substrates and pat terns are printed on all ceramic substrates in a sintered manner. Because microwave communication chips are based on passive components, in order to avoid mutual interference between the various components on the wafer, A cover is usually designed to serve as a shielding effect between various components, and a polymer material is usually a better choice, mainly because of its low cost, easy availability, and suitability for mass production. The design of this example is to shoot a thin piece of plastic at 6 o'clock, with an actual thickness of about 0.7 legs.
第14頁 505616 五、發明說明（11)Page 14 505616 V. Description of the invention (11)
(結構最薄處約只有 0 · 4腿），為達成此所謂面積大且 超薄件的射出，雖採用射出壓縮成形技術，但是由於肉厚 實為太薄，溶融塑料在模穴中流動非常困難。運用此類的 模具設計方式參考第三圖以射出壓縮成型之方式進行射出 成型，融溶塑料從喷嘴被射出，經分流道後流入模穴中， 當塑料在模穴1 6流經壓模板1 7時，會因與壓模板接觸而被 冷卻，降低塑料流動性，最後造成塑料充填未滿之情形。 此外塑料在流動的過程中若遇有結構物5 8時，會使得塑料 流動受阻而分流，最後導致塑料再次會合時而留下缝合線 5 9的痕跡，如第九圖所示。因此為解決前述之問題，在模 具中設置多個微加熱器，使塑料在模穴中再次被適當地加 熱，特別針對肉厚較薄或是易發生縫合線處局部加熱，改 善流動困難的問題。 實施方法二(The thinnest part of the structure is only about 0.4 legs.) In order to achieve the injection of the so-called large area and ultra-thin parts, although injection compression molding technology is used, because the thickness of the meat is too thin, it is very difficult for the molten plastic to flow in the cavity. . Using this type of mold design method, refer to the third figure to perform injection molding by injection compression molding. The melted plastic is ejected from the nozzle, flows into the cavity after the runner, and when the plastic flows in the cavity 16 through the die plate 1 7 As a result, it will be cooled by contact with the die plate, which will reduce the fluidity of the plastic and finally cause the plastic to be underfilled. In addition, when the plastic encounters a structure 58 during the flow, the plastic flow will be blocked and shunted, and finally the plastic will reunite and leave traces of the suture 5 9 as shown in the ninth figure. Therefore, in order to solve the aforementioned problems, a plurality of micro-heaters are provided in the mold, so that the plastic is properly heated again in the cavity, especially for the problem of thin meat thickness or local heating where sutures are prone to improve flow difficulties . Implementation method two
此實施方法是將微加熱器3 1結合壓模板1 7—起製作於 可動側模板1 3中，微加熱器3 1透過壓模板1 7間接對塑料進 行局部加熱，除了使可能冷卻凝固等流動性較差的塑料可 繼續流動外，亦可透過微加熱器可控制溫度分佈之功效， 使整體溫度差降到最低，如第三圖所示。 以下為此方法之詳細實施細節： 由於本例和實施例一的設計流程及方法大同小異，所以可In this implementation method, the micro heater 31 is combined with the die plate 17 to be manufactured in the movable side template 13. The micro heater 31 is used to locally heat the plastic indirectly through the die plate 17. In addition to making it possible to cool and solidify, etc. Poor plastics can continue to flow, and the effect of temperature distribution can be controlled through the micro heater to minimize the overall temperature difference, as shown in the third figure. The detailed implementation details of this method are as follows: Because the design process and method of this example and the first embodiment are similar, they can be
第15頁 五、發明說明（12) 參考方法一之細節，唯一有別於方法一的地方就是微加執 器之，計位置，本例中射出產品的外型、結構及應用比右' 別於實施例一，當然微加熱器的分佈也就不盡相同。^乂 圖所示為本例微加熱器分佈情形，圖中的外圓虛線是 2 出件的外徑尺寸4 〇，而内部的方格陣列虛線是指射出^ 被切割成數個單元元件，本例是以達成大面積的射出，I 接與被動元件層封裝後，再進行切割成數個單元元件， 法可一次製作多個元件，節省多次封裝的成本及大 = 的經濟效益。在此提供另一種設計方式，也可以達到 加熱相同之效果，由於微加熱器之設計方二= 作流程上當然也不同。 故在製 以下為此方法之詳細製作流程及細節： 由，本例是將壓模板1 7直接做在微加熱器3丨上方第 ，制，t ΐ熱器直接對壓模板加熱，所以前段微加熱哭部 为衣程與實施例一相同，請參考第十〜三、:。 7賊，層錄金屬層於加熱器上做為電禱一時的底錢層 feeing laYer)，隨後再塗佈厚光阻β3,如第+ =於此層的結構物較高故採用su —8厚光阻型掣r回 :::η ::技術後再繼續電鑄鎳金屬至與所需之高度。 二十=所示。由於以電鑄的方式較難精確地 ： 度，而且因電流密度分佈不均所造成 〜馭厚 放電效應’故通常在電鑄完後會再：c:彳：J緣的尖端 )將表面磨平後再繼續隨後的製程， I機械研磨 體銅製程及微機電製程中是經常 : ~般半導 見的。弟十六圖所示的5. Description of the invention on page 15 (12) The details of the reference method one, the only difference from the method one is the micro-manipulator, counting the position. In this example, the appearance, structure and application of the injection product are different from the right. In the first embodiment, of course, the distribution of the micro heaters is different. ^ 乂 The figure shows the distribution of micro heaters in this example. The outer dashed line in the figure is the outer diameter dimension of 2 pieces, and the inner grid array dashed line refers to the shot. ^ It is cut into several unit elements. For example, to achieve a large area of injection, I and the passive component layer package, and then cut into several unit components, the method can make multiple components at once, saving multiple packaging costs and large economic benefits. Another design method is provided here, which can also achieve the same effect of heating, because the design method of the micro heater 2 is of course different in the working process. Therefore, the following is the detailed production process and details of this method: Therefore, in this example, the die plate 17 is directly made above the micro heater 3, and the t-heater directly heats the die plate. The heating process of the crying part is the same as that of the first embodiment. Please refer to the tenth to the third. 7 thief, layer the metal layer on the heater as the bottom layer of electric prayer (feeing laYer), and then apply a thick photoresistor β3, such as the + = higher structure in this layer, so use su —8 Thick photoresistance switch back to ::: η :: technology and then continue electroforming nickel metal to the required height. Twenty = shown. Because it is difficult to accurately use the electroforming method: and the thickness of the current density distribution is not enough to control the thick discharge effect, so after electroforming is usually done: c: 彳: the tip of the J edge) the surface is ground After the flattening, the subsequent processes are continued. I mechanical grinding body copper process and micro-electromechanical process are often: ~ semi-conducting. Brother sixteen
第16頁 505616 五、發明說明（13) 製程與第十五圖 sert Pin )電 及鎳金屬層6 ^多 完全相同，將做為貫穿通孔的***銷& 鑄至所需，高度。最後再將剩餘的光1 63 除後，即完成所有製程如第十七圖所示。 實施 光通 做為 訊號 陶瓷 的困 壓模 快速 的製 其中 中， 7 7相 7 5置 準， 例 三 訊是由 傳播媒 損失， 材料作 難。若 板，再 與大量 作成本 光纖將 而波導 同的材 入時， 如此光 電氣 介傳 故光 為連 以微 以射 生產 。第 置於 槽（ 料， 光纖 訊號 訊號轉換成光的強弱訊號後， 送至目的地。在傳遞過程中為 纖對位需要相當高的精細度， 接器 （C0UP1 er)，但在量產 機電及類L I G A製程技術製作具 壓成形製作晶圓級的塑膠連接 的製作方式’將可大幅降低光 十八圖為本實施例所示光纖對 鈾方之空槽（Optical fiber waveguide cavity) 7 3將填入 做為光訊號波導傳遞之媒介。 之心部7 7 ( c 〇 r e )將與波導 即透過波導而傳送至遠方，第 再利用光纖 了減少能量 目前多採用 上具有相當 有加熱器之 器8 3，如此 纖通訊元件 位連接器， cavity) 71 與光纖心部 所以當光纖 7 9精確地對 十九圖。 ，斤本貫施例中之對位光纖對位連接器細微結構（光纖心 =、皆位之處）與一般常見微系統晶片之細微程度相當，故 采用如别述貫施例之方法，製作—可加熱且可控制溫 505616 五、發明說明（14) _ 度分佈之壓模板，使細微處或厚薄件得以完成良好流動， 如此一來將可以達到面積大且薄射出件的需求。此外，實 施流程亦如同實施例二之方式。其唯一之差異是壓模板上 的幾何圖形，本例壓模板之幾何圖形如第十八圖，而其製 作方式及流程也將同於實施例二，故在此不再重複說明。Page 16 505616 V. Description of the invention (13) The manufacturing process is the same as that of the fifteenth figure (Sert Pin). The nickel and nickel metal layers are exactly the same, and the insertion pins & used as through-holes are cast to the required height. Finally, after the remaining light 1 63 is divided, all processes are completed as shown in the seventeenth figure. The implementation of Guangtong as a signal ceramic for the rapid production of stamping molds. Among them, 7 7 phase and 7 5 are accurate. Example 3 is caused by the loss of the propagation medium and the material is difficult. If the board is used together with a large amount of fiber and the same material as the waveguide, then the optical and electrical transmission is the reason why light is produced by micro-radiation. In the slot (material, the optical fiber signal is converted into the light intensity signal, and then sent to the destination. During the transmission process, a relatively high degree of fineness is required for the fiber alignment. The connector (C0UP1 er), but in mass production electromechanical And the LIGA-like process technology is used to produce the plastic connection at the wafer level by pressing. The manufacturing method will greatly reduce the light. Figure 18 shows the optical fiber to uranium square cavity (Optical fiber waveguide cavity) shown in this example. 7 3 It is filled in as a medium for the transmission of optical signal waveguides. The core 7 7 (c ore) will be transmitted to the distant through the waveguide, that is, the waveguide is reused to reduce energy. At present, most of the devices have a heater. 8 3, such a fiber communication component bit connector, cavity) 71 and the fiber core so when the fiber 7 9 is accurately aligned with the nineteenth figure. The fine structure of the aligned optical fiber alignment connector (fiber core =, wherever it is) in the present embodiment is equivalent to the fineness of common micro-system chips, so the method of the other embodiments is used to make —Can heat and control the temperature 505616 V. Description of the invention (14) _ Pressure distribution template for degree distribution, so that fine parts or thick and thin parts can complete good flow, so that the requirements of large area and thin injection parts can be achieved. In addition, the implementation process is the same as that of the second embodiment. The only difference is the geometry on the stamper. The geometry of the stamper in this example is shown in Figure 18. The manufacturing method and process will be the same as in the second embodiment, so it will not be repeated here.
第18頁 505616Page 505616
圖式簡單說明 圖7F 第一圖生物晶片射出件之模具局部示意圖。 第二圖微加熱器示意圖之一。 第三圖通訊晶片射出件之模具局部示意圖。 第四圖微加熱器示意圖.之二。 第五圖外接電源示意圖。Brief description of the drawing Figure 7F The first schematic diagram of the mold of the biochip injection part. The second figure is a schematic diagram of a micro heater. The third figure is a partial schematic view of the mold of the communication chip injection part. The fourth diagram is the micro heater schematic. The second. The fifth figure is an external power supply schematic diagram.
第六圖本發明之微加熱器分佈圖較佳實施例之一。 第七圖本發明之微加熱器分佈圖較佳實施例之二。 第八圖本發明之微加熱器分佈圖較佳實施例之三。 第九圖縫合線發生位置示意圖。 第十〜十七圖微加熱器製作流程圖。 第十八圖光纖聯結器示意圖。 第十九圖光纖對準示意圖。FIG. 6 is one of the preferred embodiments of the micro heater distribution diagram of the present invention. FIG. 7 is the second preferred embodiment of the micro heater distribution diagram of the present invention. FIG. 8 is a third preferred embodiment of the micro-heater distribution diagram of the present invention. The ninth figure shows the location of the suture. The tenth to seventeenth figure micro-heater manufacturing flowchart. Figure 18. Schematic diagram of fiber optic coupler. Figure 19. Schematic diagram of fiber alignment.
第19頁Page 19
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW90111119A TW505616B (en) | 2001-05-10 | 2001-05-10 | Method for producing micro-system chip by injection compression molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW90111119A TW505616B (en) | 2001-05-10 | 2001-05-10 | Method for producing micro-system chip by injection compression molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW505616B true TW505616B (en) | 2002-10-11 |
Family
ID=27621826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW90111119A TW505616B (en) | 2001-05-10 | 2001-05-10 | Method for producing micro-system chip by injection compression molding |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW505616B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7626255B2 (en) | 2003-10-15 | 2009-12-01 | Koninklijke Philips Electronics N.V. | Device, system and electric element |
| TWI487612B (en) * | 2008-02-20 | 2015-06-11 | Sumitomo Chemical Co | A heater, a resin molding device, a resin molding method, and a resin molded product |
| TWI730493B (en) * | 2019-11-06 | 2021-06-11 | 台灣愛司帝科技股份有限公司 | Non-conductive film having heating function and electronic device |
-
2001
- 2001-05-10 TW TW90111119A patent/TW505616B/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7626255B2 (en) | 2003-10-15 | 2009-12-01 | Koninklijke Philips Electronics N.V. | Device, system and electric element |
| TWI487612B (en) * | 2008-02-20 | 2015-06-11 | Sumitomo Chemical Co | A heater, a resin molding device, a resin molding method, and a resin molded product |
| US10131081B2 (en) | 2008-02-20 | 2018-11-20 | Sumitomo Chemical Company, Limited | Heater, resin molding apparatus, resin molding method and resin molded body |
| TWI730493B (en) * | 2019-11-06 | 2021-06-11 | 台灣愛司帝科技股份有限公司 | Non-conductive film having heating function and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW512129B (en) | Method for forming microelectronic spring structures on a substrate | |
| CN1988998B (en) | Processing method, processing apparatus, and fine structure produced by the method | |
| TWI223622B (en) | Built-in high frequency induction-heating module for injection molding and thereof applications | |
| US20050067286A1 (en) | Microfabricated structures and processes for manufacturing same | |
| WO2005033798A2 (en) | Electrochemical micromanufacturing system and method | |
| CN111403348B (en) | Ceramic substrate containing micro-channel and preparation method thereof | |
| Laakso et al. | Through-glass vias for glass interposers and MEMS packaging applications fabricated using magnetic assembly of microscale metal wires | |
| JPWO2005057634A1 (en) | Pattern formation method using nanoimprint and apparatus for executing the method | |
| TW505616B (en) | Method for producing micro-system chip by injection compression molding | |
| US20090166920A1 (en) | Molding apparatus, method of manufacturing molding apparatus, and molding method | |
| CN1607898B (en) | Circuit board fabrication method and circuit board | |
| CN101093263B (en) | Optical waveguide, method of manufacturing the same and optical communication module | |
| JP2007261197A (en) | Mold assembly for injection molding | |
| JP4919413B2 (en) | Method and apparatus for manufacturing plastic molded product | |
| US20100019408A1 (en) | Minute flow path structure body and die | |
| KR100404024B1 (en) | Manufacturing method of micro-lens | |
| US20040046281A1 (en) | Localized compression molding process for fabricating microstructures on thermoplastic substrates | |
| JP2006341581A (en) | Molding device, manufacturing method of the same, and molding method | |
| Shen et al. | Manufacture of an integrated three-dimensional structure nozzle plate using microinjection molding for a 1200-dpi inkjet printhead | |
| TW543334B (en) | Micro heater installed in a mold for locally controlling the temperature | |
| JP4414847B2 (en) | Electroforming mold and manufacturing method thereof | |
| Jiang et al. | Manufacture of microfluidic chips using a gap-control method based on traditional 3D printing technique | |
| TW552237B (en) | Molding apparatus for mass production of duplications having thereon a micro-pattern | |
| Zhang et al. | Micro‐Casting/Assembly Technology Based on Bismuth‐Based Liquid Metal | |
| Nakao et al. | Injection Molding Techniques for the Fabrication of MEMS Elements |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |