丄 A7 B7 五、發明說明（ 發明領域： 本,明概有關於半導體封裝體之儲存匣。更特別地， 本發月疋關於—種半導體封裝體所用的儲存匿，可載 導體積體電路半加工你0 ^ ^ ^ ^ ^ 物αα，並及於諸多程序之間將彼等 互傳送或傳輸。 相_關技藝說 半導體封裝程序是一種保護半導體晶片不受外部機 械性、物理性與化學性影響的技術，冑由將諸高品質半導 體晶片彼此區隔，而於製作與測試晶圓的電子特徵之後， 將彼等具封為一封裝體，讓彼等得以維持其諸電子與機體 特徵，並得被跨架於pCB(印刷電路板）上。 可於半導體封裝程序中採用一種模鑄（die)附接程 序來利用導電性環氧基樹脂黏著劑，將半導體晶片貼附 於條帶形鉛框拍板（以下簡稱為「半導體晶片」），該樹脂 可藉由在後續程序中將該瓜載置於儲存匣上，而安全地傳 送或傳輸半導體積體電路半加工物品。 一傳統式並用以載置這種半導體條帶，且於模鑄附接 程序之後將彼等在諸半導體程序間相互傳送或傳輸之儲 存£(10)，會在各個端點處具備一入方/出方（11)以載置與 卸放半導體條帶，即如第1圖所示者，同時具有多個於各 側按單一區塊方式所構成的導槽，此係按鋁值材料所製。 載置之半導體條帶的長度，係由其上構有導槽之該側的長 度（12)所決定，而載置半導體條帶的數量，則是可由構形 第3頁 (請先閱讀背面之注意事項再填寫本頁) ’ --------訂---------線· 經濟部智慧財產局員工消費合作社印製 492051 A7 五、發明說明（） 於側邊之導槽載置步階數目（13)所決定，並且載置半導體 條帶的寬度是由兩側之間的寬度（1 4)所決定。 此外，半導體封裝程序中所製造的半導體條帶尺寸會 有所不同。特別是，大多數決定儲存匣大小的重要因素是 「半導體條帶的寬度』，而非載置步階數目或半導體條帶數量 所決定。 因此’傳統式儲存匣的缺點在於不易控制其尺寸、製 作儲存II的成本極高，以及，因需製作各種大小的儲存匡 方可於其上載置各種尺寸之半導體條帶，使得製作儲存匿 的時間過長。除此之外，由於單一儲存匣的材質係由銘質 所製’該者惜屬沉重而不易於搬運。 並且’當含有靜電之半導體條帶上的半導體晶片接觸 到鋁質的儲存匣，彼等會瞬時地放電並而造成靜電損堂， 產生半導體製作上的不良狀況。 r請先閱讀背面之注意事項再填寫本頁} 發明目的及概诫： 本發明係為解決該些問題，並因而本發明目的在於 供一種適用於半導體封裝體之儲存匣，其上可載置各種 寸的半導體條帶而無需增加製作成本與製造時段。 本發明之另一目的，在於提供一種適用於半導體封 體之儲存匣，可防止因靜電傷害所造成的半導體製造、 狀況。 、 為達成上述目標’本發明提供一種適用於半導體封 體之儲存匣以載置半導體條帶，俾利於半導體封裝程序 提 尺 裝 良 裝 中 --------^--------- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐 I I — I - 492051 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 予以傳送’其中包含一機體而於其某面上具有多個導槽以 載置該些半導體條帶、由該些機體所分隔且具有對應於該 半導體條帶之寬度的上側和下側鎊板、以及用來連接該機 體與上側和下側鑄板的連接裝置。 而該機體與上側和下側鑄板最好是以銘質為佳。 此外，本發明可提供一種適用於半導體麵·裝體之儲存 匣以載置半導體條帶，俾利於半導體封裝程序中予以傳 送，其中包含了導電性工程用塑膠機體，具有多個構成於 其上某側的導槽來載置半導體條帶、導電性工程用塑膠上 側和下側鑄板，由該些機體所分隔且具有對應於該半導體 條帶之寬度、以及用來連接該機體與上側和下側鎮板的連 接裝置。 如係按非晶質樹脂所製者，則該導電性工程用塑膠最 好是具有1 〇〇0c或更高的玻璃移態溫度，而如係按晶質樹 脂所製者，則該者最好是具有200QC或更高的熔點。 此外，該導電性二程用塑膠最好是具有1〇3〇到10u Ω的表面電阻。 此外，該導電性工程用塑膠最好是由一組含有碳纖 維、黑碳、強化水晶、鎳鍍層碳纖維、不銹鋼碳纖維與銅 鍍層纖維之群組中所選出者。 上述諸機體與上側和下側鑄板最好·是根據該半導體 條帶尺寸而特定地彩化’並且遠上侧和下側缚板最好是彼 此間以不同顏色繪示。 該連接裝置最好是包含一構成於該機體與上側和下 第5頁 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公爱） ""' (請先閱讀背面之注意事項再填寫本頁) -n n n an I n >ϋ I n a^i mmi n n tame n I 1 1 ϋ n I n ϋ ·ϋ ai^ I I I tan i^i 1 ·1. 492051 A7 B7 五、發明說明（） 側铸板之上的區塊，以及一構成於該上側和下側鑄板或是 機體之上的凹槽，而該區塊係固定於此内。並且，該連接 裝置最好是具有一掛釣或針腳。 此外，本發明之儲存匣可更包含構成於該些機體或該 上側和下側鱗板之雙緣的邊幅控制投映局部，以及構成於 該上侧和下側镑板或該些機體之雙緣並定位於相對到該 投映局部之處的邊幅控制凹槽。此外，本發明之儲存匿可 更包含一塑膠端帽以支持載置於該些機體上的半導體條 帶，以防止出現滑落。 岡式簡箪 第1圖為先前技藝用於半導體封裝體之儲存匣略圖； 第2圖為根據本發明某具體實施例，用於半導體封裝 體之儲存匣略圖； 第3圖為根據本發明某具體實施例，一半導體封裝體 内之諸機體與該上側和下側鑄板間的連接局部略圖。 (請先閱讀背面之注意事項再填寫本頁) # 訂---------線· 經濟部智慧財產局員工消費合作社印製 同號對照說明二 10 儲存匣 11 入方/出方 12 長度 13 步階數目 14 寬度 30 儲存匣 3 1 機體 32 上側铸板 33 下側铸板 34 端帽 第6頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 492051 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 3 5 針腳 4 0 區塊 41 邊幅控制投映局部 50 掛鉤 發明詳細說明與較佳具體實施例： 後文中將參酌於諸圖示，以說明本發明較佳具體實施 例0 第2圖為根據本發明某具體實施例，用於半導體封裝 體之儲存匣略圖。 即如第2圖所示者，一根據本發明某具體實施例而用 於半導體封裝體之儲存匣（3 0)，個別地按於其某面上構築 具多個導槽以載置半導體條帶之機體（31、31，）、與對應於 半導體條帶尺寸之上側鑄板（32)和下側鑄板（33)等所製 作’而其上構成有諸多導槽之連接裝置（3 i、3 Γ)，則係利 用像是位在垂直於組合方向之針腳（3 5)的連線裝置來相對 置放且加以固定。 該機體（3 1、3 1，）與上側鑄板（32)和下側鑄板（3 3)係由 銘質或導電性工程用塑膠所備製。同時，如該導電性工程 用塑膠晶係按非晶質樹脂所製者，則會採用具有丨00〇c或 更高的玻璃移態溫度的導電性工程用塑膠，而如係按晶質 樹脂所製者，則會採用具有200〇c或更高熔點的導電性工 程用塑膠《並且，該導電性工程用塑膠具有1 03 Ω到1 〇 12 Ω的表面電阻，而可為碳纖維、黑碳、強化水晶、鎳鍍層 碳纖維、不銹鋼碳纖維與銅鍍層纖維等等。 在此’由於鋁質之半導體封裝體儲存匣具有約1 〇〇 Ω 第7頁 (請先閱讀背面之注意事項再填寫本頁) • « n άΜβ H -ϋ n fl_— n J彳，i n ϋ ϋ n f MMt I it memmw 言 矣 本紙張尺度適國家標準（CNS)A4規格（210 X 297公爱） 492051 A7 五、發明說明（） 的表面電阻和 1 〇 〇 %的導雷 ., 如果於半導體製造過程中 諸材質无斥著靜電，則會立即 、布τ 汉散出靜電，並造成所製之7A7 B7 V. Description of the invention (Field of the invention: This and the following are all about the storage box of the semiconductor package. More specifically, this post is about a storage package used for semiconductor packages, which can carry semi-conductor circuits. Process your 0 ^ ^ ^ ^ ^ thing αα, and transfer or transfer them to and from many programs. Related technology says that the semiconductor packaging program is a kind of protection for semiconductor wafers from external mechanical, physical and chemical properties. The technology that has been affected is to separate high-quality semiconductor wafers from each other, and after manufacturing and testing the electronic characteristics of the wafers, they are sealed into a package so that they can maintain their electronic and body characteristics. It must be straddled on a pCB (printed circuit board). A die attach process can be used in the semiconductor packaging process to use a conductive epoxy resin adhesive to attach the semiconductor wafer to the strip Lead frame clapper (hereinafter referred to as "semiconductor wafer"), the resin can be safely transferred or transferred by semi-processing of semiconductor integrated circuits by placing the melon on a storage box in subsequent procedures Articles. A storage that is traditionally used to carry such semiconductor strips and that transfers or transfers them between semiconductor processes after the die attach process. (10) will have one at each endpoint. The in / out side (11) is used to place and unload semiconductor strips, that is, as shown in Figure 1, and has multiple guide grooves formed on each side in a single block manner. This is based on the aluminum value. The length of the semiconductor strip to be placed is determined by the length (12) of the side on which the guide groove is formed, and the number of semiconductor strips to be placed can be determined by the configuration. Page 3 ( Please read the precautions on the back before filling out this page) '-------- Order --------- Line · Printed by the Consumer Consumption Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 492051 A7 V. Description of Invention ( ) The number of steps (13) on the side of the guide groove is determined, and the width of the semiconductor strip is determined by the width (1 4) between the two sides. In addition, the semiconductor packaging process Semiconductor strip sizes can vary. In particular, the most important factor determining the size of a magazine is the "semiconductor The width of the strip ”is not determined by the number of mounting steps or the number of semiconductor strips. Therefore, the disadvantages of the traditional storage box are that it is difficult to control its size, the cost of making the storage II is extremely high, and it is necessary to make various sizes You can place semiconductor strips of various sizes on it, making it too long to make storage. In addition, because the material of a single storage box is made by Mingzhi, it is a heavy and difficult task. And 'When the semiconductor wafer on the semiconductor strip containing static electricity comes in contact with the aluminum storage box, they will be discharged instantly and cause static electricity damage, which will cause the semiconductor manufacturing defects. R Please read the back Please pay attention to this page before filling in this page} Object and general command of the invention: The present invention is to solve these problems, and therefore the object of the present invention is to provide a storage case suitable for a semiconductor package, on which various kinds of semiconductor bars can be placed. Tape without increasing production costs and manufacturing time. Another object of the present invention is to provide a storage case suitable for a semiconductor package, which can prevent semiconductor manufacturing and conditions caused by electrostatic damage. In order to achieve the above-mentioned objective, the present invention provides a storage case suitable for a semiconductor package to carry semiconductor strips, which is beneficial to the semiconductor packaging process. ---- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm II — I-492051 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () to be transmitted) A body having a plurality of guide grooves on one side thereof to carry the semiconductor strips, upper and lower pound boards separated by the bodies and having a width corresponding to the semiconductor strips, and for connecting The connection device between the body and the upper and lower cast plates. The body and the upper and lower cast plates are preferably made of high quality. In addition, the present invention can provide a storage box suitable for a semiconductor surface and a body. The placement of the semiconductor strip is convenient for the semiconductor packaging process. It contains a conductive engineering plastic body with a plurality of guide grooves formed on one side to carry the semiconductor strip and the upper side of the conductive engineering plastic. And the lower cast plate, separated by the bodies and having a width corresponding to the semiconductor strip, and a connecting device for connecting the body with the upper and lower ballast plates. If made of amorphous resin , The conductive engineering plastic preferably has a glass transition temperature of 1000 c or higher, and if it is made of crystalline resin, it preferably has a melting point of 200 QC or higher. In addition, the conductive second-pass plastic preferably has a surface resistance of 1030 to 10u Ω. In addition, the conductive engineering plastic is preferably composed of a group containing carbon fiber, black carbon, reinforced crystal, and nickel-plated carbon fiber. Selected from the group of stainless steel carbon fiber and copper-plated fiber. The above-mentioned bodies and the upper and lower cast plates are best · colored specifically according to the size of the semiconductor strip 'and the upper and lower side binding plates It is best to show each other in different colors. The connecting device preferably includes a body and upper and lower sides. Page 5 This paper size applies Chinese National Standard (CNS) A4 (210x297 public love) " " '(Please read the back first (Please fill in this page again) -nnn an I n > ϋ I na ^ i mmi nn tame n I 1 1 ϋ n I n ϋ · ϋ ai ^ III tan i ^ i 1 · 1. 492051 A7 B7 5 Description of the invention () The block above the side casting plate, and a groove formed on the upper and lower side casting plate or the machine body, and the block is fixed therein. And, the connection device is the most Fortunately, it has a hook or pin. In addition, the storage box of the present invention may further include a margin control projection part formed on the bodies or the double edges of the upper and lower scale plates, and formed on the upper and lower sides. The two edges of the pound board or the bodies are positioned at the edge control grooves opposite to the projection part. In addition, the storage enclosure of the present invention may further include a plastic end cap to support the semiconductor strips mounted on the bodies to prevent slipping. Figure 1 is a schematic diagram of a storage box used for a semiconductor package in the prior art; FIG. 2 is a schematic diagram of a storage box used for a semiconductor package according to a specific embodiment of the present invention; and FIG. In a specific embodiment, a partial sketch of the connection between the bodies in a semiconductor package and the upper and lower cast plates. (Please read the precautions on the back before filling this page) # Order --------- Line · The Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the same number comparison instructions II 10 Storage Box 11 In / Out 12 Length 13 Number of steps 14 Width 30 Storage box 3 1 Body 32 Upper side cast plate 33 Lower side cast plate 34 End cap Page 6 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 492051 Economy Printed by the Intellectual Property Bureau of the Ministry of Intellectual Property and Consumer Cooperatives A7 B7 V. Description of the invention () 3 5 Pin 4 0 Block 41 Margin control projection local 50 Hook up Detailed description of the invention and preferred embodiments: In the following, reference will be made to the illustrations, To illustrate a preferred embodiment 0 of the present invention, FIG. 2 is a schematic diagram of a storage case for a semiconductor package according to a specific embodiment of the present invention. That is, as shown in FIG. 2, a storage box (30) for a semiconductor package according to a specific embodiment of the present invention is individually constructed with a plurality of guide grooves on one side thereof to carry semiconductor bars. The body (31, 31,) of the belt, and the upper side cast plate (32) and the lower side cast plate (33) corresponding to the size of the semiconductor strip are made of a connecting device (3 i , 3 Γ), it is relatively placed and fixed by using a connecting device like a pin (3 5) located perpendicular to the combination direction. The body (3 1, 3, 1), the upper cast plate (32) and the lower cast plate (3 3) are made of Ming quality or conductive engineering plastics. At the same time, if the conductive engineering plastic crystal is made of amorphous resin, the conductive engineering plastic with a glass transition temperature of OOc or higher will be used. The manufacturer will use conductive engineering plastics with a melting point of 200 ° C or higher. Also, the conductive engineering plastics have a surface resistance of 1 03 Ω to 1012 Ω, and can be carbon fiber or black carbon. , Reinforced crystal, nickel-plated carbon fiber, stainless steel carbon fiber and copper-plated fiber, etc. Here's because the aluminum semiconductor package storage box has about 1 00Ω. Page 7 (Please read the precautions on the back before filling out this page) • «n άΜβ H -ϋ n fl_— n J 彳 ， in ϋ ϋ nf MMt I it memmw 矣 This paper is in accordance with the national standard (CNS) A4 specification (210 X 297 public love) 492051 A7 V. Description of the invention () Surface resistance and 100% lightning resistance. If used in semiconductors During the manufacturing process, the materials are not repelled by static electricity, and the static electricity will be dissipated immediately, which will cause the produced
半導體的不良狀況而損害產品。 π I ^^ 。不過，當半導體封裝體儲 存匡（30)是由袈时儲 ^所製成時，由於導電性工 程用塑膠具有1〇3Ω到1〇!2〇的 、表面電阻，故彼可保確本 導體條帶不受靜電傷害，並且因ζ τ保叹+ 因而減少在整體封裝程序内 的不良產品比率。 此外，由於按鋁質所製之封五 4策體為早一色彩，故不易 分辨其貨品批號並因而會產生材料 π秤混淆問題。不過，按導 電性工程用塑膠所製之封裝髀 河装把確可根據條帶大小而著色 為多種色彩，故得以將上側鑄板 攸和下側鑷板者染不同顏 色，藉此解決貨批之材料混淆問題，從而有助於封裝程序 中的半導料帶之貨批庫存管埋並防止材料混清問題。 並且，當對按導電性工程用塑膠所製之封裝體進行約 一個月的175〇c熱性穩定度測試時，彼並未顯示出外形變 化’同時於化學固抗測試裡，亦不會受高溫酸性與鹼性物 質所影響。 在電漿特徵測試之後，彼亦仍維持其機械性強度及大 小’而在電漿裝置的内部並未發現污染狀況，並且在機械 強度測試中，將該儲存匣自1.5米的高度落下，亦未出現 裂痕。據此，可藉按輕型導電性工程用塑膠來構建之，而 得讓該半導體封裝體儲存匣的重量可更為輕巧，但仍維持 與按鋁質所製作時之相同的正面特徵。 並且，當一具有適當尺寸的半導體條帶被載置到由所 第8頁 參紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公釐 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 I · ·ϋ H ϋ n β—i^*eJ« n n Mt n -1 - i§ I 1« n ϋ ϋ I ·ϋ l ·ϋ ·ϋ n n ϋ n I t n l_1 n n n *-ϋ y 492051 A7Defective semiconductors can damage the product. π I ^^. However, when the semiconductor package storage module (30) is made of shishi storage ^, since the conductive engineering plastic has a surface resistance of 103 to 12.0, it can guarantee the authenticity of the conductor The strips are not damaged by static electricity, and because of ζ τ sigh +, the ratio of defective products in the overall packaging process is reduced. In addition, since the seal 5 made of aluminum is an early color, it is not easy to distinguish the lot number of the goods and confusion of the material π scale will arise. However, according to the size of the strip, the package of Luohe equipment made of conductive engineering plastic can be colored into a variety of colors. Therefore, the upper cast plate and the lower tweezer plate can be dyed in different colors to solve the problem of shipment approval. The problem of material confusion can help to bury the stock of semiconducting tape in the packaging process and prevent the problem of material mixing. In addition, when a package made of conductive engineering plastics was subjected to a thermal stability test of 175 ° C for about one month, he did not show a change in the shape. At the same time, it was not subjected to high temperature in the chemical solid resistance test. Affected by acid and alkaline substances. After the plasma characteristic test, he still maintained its mechanical strength and size, and no pollution was found inside the plasma device. In the mechanical strength test, the storage box was dropped from a height of 1.5 meters. No cracks appeared. According to this, it can be constructed by using light-weight conductive engineering plastics, so that the semiconductor package storage box can be made lighter in weight, but still maintain the same positive characteristics as when made of aluminum. And, when a semiconductor strip with appropriate size is placed on the paper size on page 8, the Chinese National Standard (CNS) A4 specification (21 × 297 mm) is applied (please read the precautions on the back before filling in this Page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs I · · ϋ H ϋ n β—i ^ * eJ «nn Mt n -1-i§ I 1« n ϋ ϋ I · ϋ l · ϋ · ϋ nn ϋ n I tn l_1 nnn * -ϋ y 492051 A7
五、發明說明（） 機體（31、31’）與上側鑄板（32)和下側鑄板（33)構成之儲存 匣上時，一端帽（34)會與其併合，讓既載於儲存匣上的半 導體條帶不會於半導體封裝程序中掉落，並可安全地加以 傳送。該端帽（34)係按塑膠所製，可固定於機體（3i、31，） 而不會掉落，且慮及塑膠彈性方決定該端帽的組合尺寸為 佳。按傳統式單一儲存匣，由於無法利用端帽，故半導體 條帶或將掉落而傷菩到半導體，或甚損毁模塑程序中的録 鑄遮罩，造成不良半導體製作情況，但是如按本發明之儲 存匣’由於可簡易地利用端帽，故無須擔憂半導體條帶或 將掉落，因而損壞半導體，而尤其是可降低模塑程序中的 不良產品比率。 第3圖為根據本發明某具體實施例，一半導體封裝體 内之諸機體與該上侧和下侧鑄板間的連接局部略圖。 雖然在第2圖中，針腳（3 5)係用來作為連接上側鑄板 (32) 和下側鑄板（33)與機體（3卜3 Γ)的連接裝置，如方形、 橢圓形等等各種形狀的區塊（40)，確可用來連接第3圖中 的上側鑄板（32)和下側鑄板（33)與機體（31、3Γ)。詳細地 說，區塊（40)係構形於上側鑄板（32)和下側鑄板（3 3)之上， 而凹槽則是位於機體（3 1、3 η上，並接著按照讓具諸多導 槽之諸側可彼此相對的方式來置放該機體（3 1、3 Γ)，同時 將具有對應於該半導體條帶尺寸之寬度的上側鑄板（3 2)和 下側鑄板（3 3)的區塊（40)***到該些凹槽内。該區塊（40) 可構形於該機體（31、3 1·)，而非上側鑄板（32)和下側鑄板 (33) 之上，而彼等亦可同時地構形於該機體（31、31，）與上 第9頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------訂---------線 經濟部智慧財產局員工消費合作社印製 492051 A7 B7 五、發明說明（） 側鑄板（32)和下側鑄板（33)上。 (請先閱讀背面之注意事項再填寫本頁) 並且’可利用掛鉤（50)作為連於該上側鑄板（32)和下 側鑄板（3 3)與該機體（31、31，）之連接裝置。更詳細地說， 將掛鉤安裝於該上側鑄板（32)和下側鑄板（33)，或者是該 機體（31、31’）上，安放該機體（31、31，）的方式，是讓其上 構形有諸多導槽之各側會彼此面對，而具有對應於半導體 條帶尺寸之寬度的上側鑄板（32)和下侧鑄板（33)可緊密·地 附接於該些機體處，並且接著利用該掛鉤（50)來連接該上 侧鑄板（32)和下側鑄板（33)以及機體（3 1、3 1，）。 經濟部智慧財產局員工消費合作社印製 此外，相對於儲存匣整體長度的邊幅會出現在連接該 上側和下側鑄板以及機體之程序中，而為對此加以控制， 可在該機體（3 1、3 1，）的兩側構成一個邊幅控制投映局部 (4 1 )，而可在上側和下側鑄板的兩邊相對於該邊幅控制投 映局部（4 1)處構成一個邊幅控制凹槽。由此，該上側鑄板 (32)和下側鑄板（3 3)以及機體（31、3厂）可正確地連接到該 機體（31、31·)上的邊幅控制投映局部（41)，而無需定位出 該機體（3 1、31’）以得其邊幅，藉此其上構成有諸多導槽之 各側可彼此相對，且得將具對應於半導體條帶尺寸之寬度 的上側（32)和下側鑄板（3 3)邊幅控制凹槽正確地附接，然 後再藉連接裝置來連接該上側鑄板（32)和下側鑄板（33)以 及機體（31、31，）。該邊幅控制投映局部（41)與邊幅控制凹 槽的位置可互換或交錯。 當於半導體封裝程序裡，利用如前述方式所構成之儲 存匣（3 0)來傳送特定尺寸半導體條帶時，可載置不同尺寸 第10頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 492051 A7 五、發明說明（） 的半導體條帶，而無需再藉由將該上侧（32)和下側（33)铸 板與儲存匣的機體（3 1、3 1 ·)分開，來製作另外的儲存E ’ 按照彼些具有對應於不同尺寸半導體條帶的寬度來改變 該上侧（3 2)和下側（3 3)鑄板，然後再如前述方式將其連接 到機體（31、31，）。 雖然上揭具體實施例採取針腳（35)、區塊（40)以及掛 鉤（5 0)等方式來連接機體（31、3 Γ)以及該上側鑄板（32)和 下側鑄板（33)，不過，一般的連接裝置，像是螺絲與滑孔（尤 其是將諸滑孔構成於該上側（32)和下側（33)鑄板的側邊 上，將相對於該上側和下側鑄板之側邊的諸滑孔構成於該 機體（3 1、3 1 ’）的侧邊上並再連接各個滑孔），亦確可採用 之。 即如前釋，根據於本發明，適合於各種半導體條帶尺 寸的機體與多個上側和下側鑄板，可個別地製造與組裝， 以構成一半導體封裝體儲存匣，其上可載置各種尺寸的半 導體條帶而無需另外製作儲存匣，因而可降低儲存匣製作 成本並縮短儲存匣製作時程。此外，可改善半導體製程產 出，這是因為可利用導電性工程用塑膠來構成儲存g，藉 此防止對半導體晶片的電子損害。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 第11頁V. Description of the invention () When the storage box composed of the body (31, 31 ') and the upper side cast plate (32) and the lower side cast plate (33) is on, one end cap (34) will be merged with it, so as to be contained in the storage box The semiconductor strips on it do not drop during the semiconductor packaging process and can be safely transferred. The end cap (34) is made of plastic and can be fixed to the body (3i, 31,) without falling, and considering the plastic elasticity, the combined size of the end cap is better. According to the traditional single storage box, because the end cap cannot be used, the semiconductor strip may drop and damage the semiconductor, or even damage the recording mask in the molding process, resulting in poor semiconductor manufacturing conditions. The invented storage box can easily use the end cap, so there is no need to worry about the semiconductor strip or falling, thereby damaging the semiconductor, and in particular, it can reduce the ratio of defective products in the molding process. Fig. 3 is a partial schematic view of the connection between the bodies in a semiconductor package and the upper and lower cast plates according to a specific embodiment of the present invention. Although in the second figure, the pins (35) are used as connection devices for connecting the upper cast plate (32) and the lower cast plate (33) to the body (3, 3, 3), such as square, oval, etc. The blocks (40) of various shapes can be used to connect the upper cast plate (32) and the lower cast plate (33) to the body (31, 3Γ) in the third figure. In detail, the block (40) is configured on the upper casting plate (32) and the lower casting plate (3 3), and the groove is located on the body (3 1, 3 η), and then according to the The body with the plurality of guide grooves can be placed in a manner opposite to each other (3 1, 3 Γ), and at the same time, an upper cast plate (3 2) and a lower cast plate having a width corresponding to the size of the semiconductor strip The block (40) of (3 3) is inserted into the grooves. The block (40) can be configured in the body (31, 3 1 ·) instead of the upper side casting plate (32) and the lower side casting Plate (33), and they can be simultaneously configured on the body (31, 31,) and page 9 above. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ( Please read the precautions on the back before filling this page) -------- Order --------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 492051 A7 B7 V. Description of the invention () The side casting plate (32) and the lower casting plate (33). (Please read the precautions on the back before filling this page) and 'can use the hook (50) to connect the upper casting plate (32) and the lower side. Cast plate (3 3) and the body ( 31, 31,). In more detail, the hook is installed on the upper casting plate (32) and the lower casting plate (33), or on the body (31, 31 '), and the body (31, 31') is placed. 31, 31,), so that the sides on which a plurality of guide grooves are configured will face each other, and the upper side cast plate (32) and the lower side cast plate (33) have a width corresponding to the size of the semiconductor strip. ) Can be tightly attached to the bodies, and then the hook (50) is used to connect the upper cast plate (32) and the lower cast plate (33) and the body (31, 31). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, the margin relative to the entire length of the storage box will appear in the process of connecting the upper and lower cast plates and the body. To control this, the body (3 The sides of 1, 3, 1) constitute a margin control projection part (4 1), and both sides of the upper and lower cast plates can form a margin control groove with respect to the margin control projection part (4 1). As a result, the upper cast plate (32), the lower cast plate (3 3), and the body (31, 3 plants) can be straightened. The margins connected to the body (31, 31 ·) control the projection part (41) without positioning the body (31, 31 ') to obtain the margins, thereby forming a plurality of guide grooves on the body. The sides can be opposite each other, and the upper side (32) and the lower side casting plate (3 3) of the width corresponding to the size of the semiconductor strip must be correctly attached, and then the upper side is connected by the connecting device. The plate (32) and the lower side cast plate (33) and the machine body (31, 31,). The positions of the edge control projection part (41) and the edge control groove can be interchanged or staggered. When using the storage box (30) constructed as described above to transfer semiconductor tapes of a specific size in the semiconductor packaging process, different sizes can be placed. Page 10 This paper is sized to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) 492051 A7 V. The semiconductor strip of the invention (), without the need to cast the upper (32) and lower (33) plates and the body of the storage box (3 1, 3 1 ·) Separate to make additional storage E 'Change the upper (3 2) and lower (3 3) cast plates according to the widths of the semiconductor strips corresponding to different sizes, and then change them as before Connect to the body (31, 31,). Although the specific embodiment of the upper cover adopts pins (35), blocks (40), and hooks (50) to connect the body (31, 3 Γ) and the upper cast plate (32) and the lower cast plate (33). However, general connection devices, such as screws and slide holes (especially the slide holes are formed on the sides of the upper (32) and lower (33) cast plates, will be cast relative to the upper and lower sides. The slide holes on the side of the board are formed on the side of the body (31, 3 1 ') and connected to each slide hole), and it can be used. That is, as explained before, according to the present invention, a body suitable for various semiconductor strip sizes and a plurality of upper and lower cast plates can be individually manufactured and assembled to form a semiconductor package storage box on which can be placed. Various sizes of semiconductor strips without the need for additional storage cassettes, which can reduce the cost of storage cassette production and shorten the time of storage cassette production. In addition, the semiconductor process output can be improved because conductive storage plastics can be used to constitute the storage g, thereby preventing electronic damage to the semiconductor wafer. (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 11
• · I n H —.1 H ·1 n · n n n I n n 1· I I ϋ I ϋ I I I 1^1 ·1 I I ϋ I ϋ n n i I n n ·• · I n H —. 1 H · 1 n · n n n I n n 1 · I I ϋ I ϋ I I I 1 ^ 1 · 1 I I ϋ I ϋ n n i I n n ·