491752 A7 ____· Β7___ 五、發明說明（丨） [技術領域] 本發明，係關於一種在製造如ULSI之半導體元件之 方法中，適用於半導體平坦化硏磨等之硏磨裝置。 [習知技術] 近年來，作爲半導體元件等表面之全晶圓平坦化技術 ，係採用化學機械硏磨(化學機械硏磨或化學機械平坦化， 以下稱CMP)技術。CMP，係在物理硏磨中倂用化學作用( 硏磨劑，經由溶液之溶出)來除去晶圓表面凹凸之製程。以 CMP進行硏磨之硏磨裝置，具備硏磨墊等之硏磨體、與固 定晶圓等硏磨對象物之夾頭等的保持部，在硏磨體與前述 硏磨對象物間介入於硏磨劑之狀態下，對硏磨體與硏磨對 象物施加負荷，且藉由相對移動，來硏磨硏磨對象物。 此種硏磨裝置，對硏磨對象物進行硏磨時，因硏磨體 與硏磨對象物之相對移動，而有硏磨體之一部份暫時自硏 磨對象物之周圍突出。習知技藝中，提供了一種例如將面 朝上而被真空吸附於夾頭之晶圓，以安裝在具角度追隨性 之彈性硏磨頭部之小硏磨墊（較晶圓直徑小之硏磨墊）加以 硏磨時，硏磨墊從晶圓暫時突出的硏磨裝置。 [發明欲解決課題] 晶圓等之硏磨對象在硏磨時，前述習知之使硏磨墊等 之硏磨體從硏磨對象物之周圍突出的硏磨裝置，因硏磨墊 從晶圓突出時產生之突出，有以下說明的3個問題。 4 ^紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐^" " ' ' ' · I I I Γ--ί ^ . I I------ (請先閱讀背面之注意事項再填寫本頁} 491752 A7 ___；_B7 _ 五、發明說明（/ ) (請先閱讀背面之注意事項再填寫本頁) 第1問題係「硏磨墊之傾斜」。習知之硏磨裝置，爲 了吸收起因於加工組裝之硏磨墊面與夾頭面之平行度誤差 、及晶圓表面之***等，係採用頭部爲具角度追隨性之彈 性機構。因而，在搖動中當硏磨墊從晶圓突出時，相反地 此彈性會出現在背面而使硏磨墊向突出側傾斜，產生無法 進行期望之硏磨的問題。具體而言，硏磨墊對晶圓施加之 壓力不能形成均等分布，其結果產生晶圓端部被削去最多 之(edge first)現象，硏磨難以均一進行。 第2問題係「硏磨墊之高低差」。硏磨墊未從晶圓突 出之部位雖被加壓力壓潰，但突出之部位由於硏磨墊材料 之復原力而變得較未突出之部分爲厚。加壓力釋放後回復 此厚度之區域，因頭部之旋轉而再度接觸晶圓。此高低差 部跨上晶圓之瞬間，由於加壓力釋放後之硏磨墊面再被急 遽壓縮，因此晶圓所承受之加壓狀態在邊緣附近是不均一 的。被壓潰之硏磨墊在自加壓力釋放之瞬間亦會發生同樣 現象。由於此一原因，在晶圓之邊緣附近無法得到所期望 之硏磨。 第3問題係「硏磨墊之加壓力」。硏磨墊對晶圓之加 壓力，對硏磨狀態具有非常大的影響力。基本上’爲了對 晶圓全體進行均一之硏磨，硏磨墊對晶圓之每單位面積的 加壓力最好是均等。但是，如上所述，習知硏磨墊從晶圓 突出時導致接觸面積變化，結果每單位面積之施加壓力變 化。 爲解決此等問題，可考慮設置一導件，以在晶圓硏磨 5__ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 _____R7___ 五、發明說明（> ) 時支持從晶圓周圍突出之硏磨墊的突出部分。此時，若將 導件支持前述突出部分之引導面，配置在與晶圓之硏磨面 大致相同之面內的話，即使硏磨墊從晶圓突出，亦與硏磨 墊未從晶圓突出之狀態實質上同等之狀態，前述第1至第 3問題可獲得解決而能均一進行硏磨對象物之硏磨。 但是，由於硏磨墊突出部分與導件互相摩擦，因此前 述部分之硏磨墊有加速磨損之危險，且導件亦有磨損之危 險。不過，引導面之高度與晶圓之硏磨面之高度差愈小， 愈能充分發揮支持硏磨構件突出部分之導件的效果，而能 充分解決上述第1至第3問題。因此，基板上，導件係使 用較晶圓耐磨損性更佳之材料。因而，硏磨墊之磨損進一 步加速進行時，硏磨墊之壽命變短。又，即使導件使用耐 磨損性優良之材料，導件之磨損進行愈慢愈好。 又，由於如前述般引導面之高度與晶圓之硏磨面之高 度差愈小愈好，所以在導件之設置時，以兩者之高度一致 設定導件之高度。但，持續使用時，導件逐漸磨損’兩者 高度差變大。因而，有必要再度調整導件高度使兩者之高 度一致。當然，亦可交換導件而不進行高度之再調整，但 將造成成本的增加。是以，相應於導件磨損之進行有調整 導件高度之必要，且此一調整要求能容易的進行。 此外，前述硏磨裝置，在持續使用時，會因硏磨墊堵 塞而無法得到充分之硏磨特性。因而，係以一適當頻率’ 使用修整器等進行調整。但是，習知者卻無法在晶圓之硏 磨中進行調整，使得晶圓硏磨之效率降低。 6 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） *裝----*---.— 訂--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _______B7______ 五、發明說明（々） 本發明，有鑑於上述情事，其目的係提供一種將硏磨 體從硏磨對象物周圍突出所導致之問題，以導件支持前述 突出部分來加以解決，且能降低導件與硏磨體之磨損的硏 磨裝置。 又，本發明之另一目的，係提供一種將硏磨體從硏磨 對象物周圍突出所導致之問題，以導件支持前述突出部分 來加以解決，且能容易進行導件高度調整的硏磨裝置。 本發明之再一目的，係提供一種將硏磨體從硏磨對象 物周圍突出所導致之問題，以導件支持前述突出部分來加 以解決，且在硏磨對象物之硏磨中多少可得硏磨體之調整 效果與提升硏磨對象物之硏磨效率的硏磨裝置。 本發明人之硏究結果，發現例如將晶圓等以具角度追 隨性之彈性支持機構的夾頭加以保持，使晶圓等從硏磨墊 等之硏磨體周圍突出之硏磨裝置，亦會產生與前述第1問 題同樣之問題。 ： 因而，本發明之目的，係針對此種型式之硏磨裝置， 亦能提供一種能解決與前述第1問題相同問題的硏磨裝置 [解決課題之手段] 爲解決上述課題，本發明之第1態樣之硏磨裝置，具 備硏磨體、·與保持硏磨對象物之保持部，在將硏磨劑介入 於前述硏磨體與前述硏磨對象物之狀態下，藉於前述硏磨 體與前述硏磨對象物之間施加負荷，且使其等相對移動， _ 7 本紙張尺€^中國國家標—準（CNS)A4規格（21〇 x 297公爱） ~ — -------------I I.---•丨訂--------I (請先閱讀背面之注意事項再填寫本頁) 491752 A7 ____B7_______；_ 五、發明說明（< ) 以硏磨前述硏磨對象物，其特徵在於·具備導件，其具 有位在與前述硏磨對象物之硏磨面大致同一面內之引導面 ，並以前述引導面支持前述硏磨對象物硏磨時自前述硏磨 對象物周圍突出之前述硏磨體之突出部分；前述導件’係 被支持爲能在與前述硏磨對象物之硏磨面大致平行之面內 的既定方向，與前述保持部獨1的運動自如。 根據此第1態樣，由於具備導件’所以可解決硏磨體 從硏磨對象物周圍突出所伴隨之前述第1至第3問題。此 外，前述第1態樣中，導件係被支持爲與保持部呈獨立的 運動自如，因此與後述之第3態樣般，藉由與硏磨體突出 部分之摩擦力使導件隨著突出部分移動，或如後述之第4 態樣般，藉由致動器驅動導件’以一體固定導件與保持部 之情形等相較，可降低硏磨體之突出部分與導件中與前述 突出部分相對部分的相對速度。因此，根據前述第1態樣 ，能降低硏磨墊等之硏磨體與導件之磨損。 本發明第2態樣之硏磨裝置，係前述第1態樣中之前 述導件，被支持爲與前述保持部呈獨立地、繞與前述保持 部之旋轉軸大致相同軸旋轉自如。以此第2態樣之方式支 持導件，即能使機構變得簡單而降低成本。惟，前述第1 態樣並非僅限於此例。 本發明第3態樣之硏磨裝置，係前述第丨或第2態樣 中之則述導件，藉由從則述突出部分接受之摩擦力而隨著 前述突出部分移動。 根據此第3態樣，由於僅需以所謂自邮方式支持 8 本紙張尺度適i中國國家標準（CNS)A4;m格（210 X 297公0 ---—-- ------------^^裝----.----丨tr··--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 ____B7____ 五、發明說明（V ) 導件即可，因此不需致動器而使成本降低。 本發明第4態樣之硏磨裝置，係前述第1或第2態樣 中，具有用以驅動前述導件之致動器。 根據此第4態樣，由於能藉致動器使導件種動的進行 運動，因此能任意設定硏磨體之突出部分與導件的相對速 度。承上所述，根據前述第4態樣，在例如，如後述第5 態樣般，使硏磨體之突出部分與導件中與前述突出部分面 對部分的相對速度降低，或如後述第8態樣般，導件具有 修整區域之情形時，使前述突出部分與前述修整區域間之 相對速度成爲適合前述硏磨體之調整的速度。 本發明第5態樣之硏磨裝置，係於前述第4態樣中具 備用以控制前述致動器之控制部，以使前述突出部分與前 述導件中與前述突出部分面對之部分間的相對速度降低。 根據第5態樣，由於前述突出部分與前述導件中與前 述突出部分面對之部分間的相對速度會降低，因此能減少 硏磨體與導件之磨損。前述第3態樣，由於導件係藉由突 出部分接受之摩擦力而隨之移動，因此無法避免突出部分 與引導部分間之相對速度產生滑動成分之速度。對此，前 述第5態樣，由於能藉由致動器使導件主動進行運動，因 此能消除此滑動成分，使突出部分與導件間之相對速度更 爲降低。因此，可使硏磨體與導件之磨損更加減少。 本發明第6態樣之硏磨裝置，係前述第1或第2態樣 中，具備使前述導件振動之勵振部，以藉由振動在前述引 導面形成凹凸。 9 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------------'1 ^--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 ____B7_________ 五、發明說明（Ί ) 前述振動，雖以超音波振動或其它之高頻振動較佳， 但並不僅限於此。前述勵振部，例如可在前述引導面產生 駐波、亦可產生行波。前述勵振部，例如可使用壓電元件 、電應變元件或磁應變元件等各種電氣機械能量轉換元件 來構成。上述各點，於後述第9態樣中亦同。 根據第6態樣，由於藉由振動在導件之引導面形成凹 凸，因此引導面相對硏磨體之接觸面積變小，兩者間看起 來摩擦係數變小。因此能更進一步的降低硏磨體與導件之 磨損。又，藉由前述振動，能獲得消除硏磨體堵塞之調整 效果。因而，在硏磨對象物未在硏磨中時不需進行硏磨體 的調整，或降低硏磨以外時之調整的次數，提升硏磨對象 物之硏磨效率。 本發明第7態樣之硏磨裝置，係前述第1或第2態樣 中’對應施加之電氣信號而產生體積變化之元件，係設置 成視該元件之體積變化，而變化以前述硏磨對象物之硏磨 面爲基準之前述引導面的相對高度。 作爲前述元件，例如，可使用壓電元件、電應變元件 或磁應變元件等。此點，於後述之第10與第U態樣中亦 同。 根據第7態樣，由於能藉由變更對前述元件施加之電 氣信號，來調整導件引導面之高度，故該調整變得容易。 本發明第8態樣之硏磨裝置，係前述第1或第2態樣 中’前述引導面之至少一部份爲能進行前述硏磨體之調整 的修整區域。 10 本紙張尺度過用中國國家標準（CNS)A4規格（210 X 297公釐） ·裝----*---丨訂--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _ ___B7___ 五、發明說明（多） 如第8態樣般，若引導面之至少一部份爲修整區域的 話，只要修整區域與硏磨體間之相對速度不完全爲零’即 能在硏磨對象物之硏磨中進行硏磨體之調整。因此’不需 在硏磨對象物之硏磨以外時進行硏磨體之調整’或者’降 低硏磨以外時進行調整之頻率，提昇硏磨對象物之硏磨效 率。 本發明第9態樣之硏磨裝置，具備硏磨體、與保持硏 磨對象物之保持部，在將硏磨劑介入於前述硏磨體與前述 硏磨對象物之狀態下，藉於前述硏磨體與前述硏磨對象物 之間施加負荷，且使其等相對移動，以硏磨前述硏磨對象 物，其特徵在於，具備··導件，前述導件具有位在與前述 硏磨對象物之硏磨面大致同一面內之引導面，並以前述引 導面支持前述硏磨對象物硏磨時自前述硏磨對象物周圍突 出之前述硏磨體之突出部分；以及勵振部’以使前述導件 振動，藉由振動在前述引導面形成凹凸。 根據第9態樣，由於具備導件，因此能解決硏磨體從 硏磨對象物周圍突出所伴隨之問題。再者，根據前述第9 態樣，由於藉由振動在導件之引導面形成凹凸’因此與前 述第6態樣同樣的，能降低硏磨體與導件之磨損，且提昇 硏磨對象物之硏摩效率。 本發明第10態樣之硏磨裝置，係前述第9態樣中具備 對應所施加之電氣信號而產生體積變化之元件’前述元件 被設置成視該元件之體積變化，而變化以前述硏磨對象物 之硏磨面爲基準之前述引導面的相對高度’而前述勵振部 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----------裝----·---—訂--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 ______B7__ 五、發明說明（1 ) 包含兼用作前述元件之電氣機械能量轉換元件。 根據第10態樣，與前述第7態樣同樣的，能容易地調 整導件引導面之高度。再者，此第10態樣中產生體積變化 之元件，係以構成勵振部之電氣機械能量轉換元件兼用， 因此能降低成本。 本發明第11態樣之硏磨裝置，具備硏磨體、與保持硏 磨對象物之保持部，在將硏磨劑介入於前述硏磨體與前述 硏磨對象物之狀態下，藉於前述硏磨體與前述硏磨對象物 之間施加負荷，且使其等相對移動，以硏磨前述硏磨對象 物，其特徵在於，具備：導件，前述導件具有位在與前述 硏磨對象物之硏磨面大致同一面內之引導面，並以前述引 導面支持前述硏磨對象物硏磨時自前述硏磨對象物周圍突 出之前述硏磨體之突出部分；以及對應所施加之電氣信號 而產生體積變化之元件；前述元件係被設置成視該元件之 體積變化，而變化以前述硏磨對象物之硏磨面爲基準之前 述引導面的相對高度。 根據第11態樣，由於具備導件，因此能解決硏磨體從 硏磨對象物周圍突出所伴隨之問題。再者，根據前述第Π 態樣，與前述第7態樣同樣的，能容易地調整導件引導面 之高度。 本發明第12態樣之硏磨裝置，具備硏磨體、與保持硏 磨對象物之保持部，在將硏磨劑介入於前述硏磨體與前述 硏磨對象物之狀態下，藉於前述硏磨體與前述硏磨對象物 之間施加負荷，且使其等相對移動，以硏磨前述硏磨對象 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -------It---------. 491752 A7 _______B7___ 五、發明說明（\ 0 ) 物，其特徵在於，具備：導件，前述導件具有位在與前述 硏磨對象物之硏磨面大致同一面內之引導面，並以前述引 導面支持前述硏磨對象物硏磨時自前述硏磨對象物周圍突 出之前述硏磨體之突出部分，而前述導件之前述引導面之 至少之一部份，係能進行前述硏磨體之調整的修整區域。 根據第12態樣，由於具備導件，因此能解決硏磨體從 硏磨對象物周圍突出所伴隨之問題。此外，根據前述第12 態樣，與第8態樣同樣的，只要修整區域與硏磨體間之相 對速度不完全爲零，即能在硏磨對象物之硏磨中進行硏磨 體之調整，提昇硏磨對象物之硏磨效率。 本發明第13態樣之硏磨裝置，係前述第12態樣中之 前述導件，被支持爲能在與前述硏磨對象物之硏磨面大致 平行之面內的既定方向，與前述保持部呈獨立的運動自如 ;具備用以驅動前述導件之致動器，以及具備用以控制前 $致動器之控制部，以在前述突出部分與前述修整區域相 胃面時，使前述突出部分與前述修整區域間之相對速度， $舄適合前述硏磨體之調整的速度。 根據第13態樣，由於在突出部分與修整區域相對面時 ’突出部分與修整區域間之相對速度，成爲適合硏磨體之 調整的速度，因此能在硏磨對象物之硏磨中更有效果地進 行硏磨體之調整，進一步的提昇硏磨對象物之硏磨效率。 本發明第14態樣之硏磨裝置，係前述第13態樣中， 前述控制部在前述突出部分與前述修整區域不相對面時， 係控制前述致動器，使前述突出部分與前述導件中面對前 __ 13 本紙張尺中國國家標準（cns)a4規格（210 X 297公釐） ' 一 #裝——丨訂--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _____B7___ 五、發明說明（\\ ) 述突出部分之部分的相對速度降低。 根據第14態樣，由於硏磨體之突出部分與導件之修整 領域不相面對時，係使前述突出部分與前述導件中面對前 述突出部分之部分的相對速度降低，因此能降低硏磨體與 導件之磨損。 本發明第15態樣之硏磨裝置，係前述第13或第14 態樣中之前述導件，被支持爲與前述保持部呈獨立地、繞 與前述保持部之旋轉軸大致相同軸旋轉自如。以此第15態 樣之方式支持導件，即能使機構變得簡單而降低成本。惟 ，前述第13及第14態樣並非僅限於此例。 本發明第16態樣之硏磨裝置，具備硏磨體、與保持硏 磨對象物之保持部，在將硏磨劑介入於前述硏磨體與前述 硏磨對象物之狀態下，藉於前述硏磨體與前述硏磨對象物 之間施加負荷，且使其等相對移動，以硏磨前述硏磨對象 物，其特徵在於：具備導件，前述導件具有位在與前述硏 磨對象物之硏磨面大致同一面內之引導面，並以前述引導 面支持前述硏磨對象物硏磨時自前述硏磨體周圍突出之前 述硏磨對象物之突出部分。 前述第1至第15態樣中，導件係支持在硏磨對象物之 硏磨時從硏磨對象物周圍突出之硏磨體的突出部分，而此 第16態樣中，導件則係支持在硏磨對象物之硏磨時從前述 硏磨體周圍突出之硏磨對象物的突出部分，兩者之支持對 象不同。 根據第16態樣，由於具備導件，因此能解決硏磨對象 14 --------I 訂--------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) '~" 491752 A7 _______B7^____ 五、發明說明（丨y ) 物從硏磨體周圍突出所伴隨之問題(與前述第1問題同樣之 問題）。 本發明第17態樣之硏磨裝置，係前述第16態樣中之 前述導件，被支持爲能在前述硏磨對象物之硏磨時、與前 述硏磨體之硏磨面大致相同面內的既定方向，與前述硏磨 體呈獨立的運動自如。根據第17態樣，能獲得與前述第2 態樣相同的優點。 前述第16與第17態樣，可單獨或任意組合而具備分 別對應前述第3至第7態樣之各特徵事項。 [圖式之簡單說明] 第1圖係以示意方式顯示本發明第1實施例之硏磨裝 置硏磨時之狀態的槪略剖面圖。 第2圖係第1圖中之C部附近的擴大圖。 第3圖係第1圖中之D-D’箭頭方向剖面圖。 第4圖係顯示比較例的槪略俯視圖。 第5圖係以示意方式顯示本發明第2實施例之硏磨裝 置之主要部位的槪略擴大剖面圖。 第6圖係以示意方式顯示本發明第3實施例之研:磨裝 置之主要部位的分解立體圖。 第7圖係顯示本發明第2實施例之硏磨裝置槪略俯視 圖。 第8圖係以示意方式顯不本發明第4實施例之研:磨裝 置之主要部位的槪略擴大剖面圖。 15 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) -- (請先閱讀背面之注意事項再填寫本頁) -裝-------—訂---------. 491752 B7 五、發明說明（ 第9圖係顯示本發明第4實施例之硏磨裝置之主要部 位的分解立體圖。 第10圖係顯示壓電元件之驅動電路與勵振情形的圖。 第Π圖（a)、（b)係顯示施加於壓電元件之電壓例的波 形圖。 第12圖（a)、（b)係顯示勵振情形的說明圖。 第13圖（a)、（b)係顯示施加於壓電元件之電壓之另一 例的波形圖。 第14圖（a)、（b)係顯示施加於壓電元件之電壓之再一 例的波形圖。 第15圖係以示意方式顯示本發明第5實施例之硏磨裝 置硏磨時之狀態的槪略剖面圖。 (請先閱讀背面之注意事項再填寫本頁) -------—訂·-------- % [符號說明] 1 硏磨構件 2 晶圓 3 保持部 4 硏磨劑供給部 5 導件 5a 引導面 6 硏磨平台 7 硏磨體(硏磨墊) 12, 49 軸承 21 馬達 16 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 ___ B7 五、發明說明（\令） 22, 23 齒輪 24 馬達控制部 31 修整器 31a 修整區域 40 壓電元件 41 壓電體 42 接地用電極板 43A A相用電極板 43B B相用電極板 44, 45, 46 滑環 50 驅動電路 51 交流電源 52 相移器 (請先閱讀背面之注意事項再填寫本頁) 一裝 一5J- [發明之較佳實施形態] 以下，針對本發明之硏磨裝置參照圖式詳細說明。 《第1實施例》 第1圖，係以示意方式顯示本發明第1實施例之硏磨 裝置硏磨時之狀態的槪略剖面圖。第2圖，係第1圖中之 c部附近的擴大圖。第3圖，係第1圖中之D-D’箭頭方向 剖面圖。 - 本實施例之硏磨裝置，具備：硏磨構件1，將硏磨對 象物之被加工晶圓2保持於該硏磨構件1之下側的保持部 17 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 ____B7___ 五、發明說明（\S) 3，將硏磨劑(漿)供給至晶圓2上的硏磨劑供給部4，以及 在晶圓2之硏磨時將自晶圓2周圍突出之硏磨體7之突出 部分以引導面5a加以支持的導件5。導件5之引導面5a， 係位在與晶圚2之硏磨面大致同一面內。 硏磨構件1，係將硏磨體(硏磨墊)7固定於硏磨平台6 之下面者，藉未圖式之機構，如第1及第3圖中之箭頭J， K，Μ所示，能進行旋轉、上下移動與左右搖動(來回移動) 。硏磨體7，例如，可使用片狀之發泡聚胺酯、或表面具 有槽構之無發泡樹酯等。 保持部3，係具有夾頭8(具有未圖示之多數通氣路、 能將晶圓2真空吸附於上面）、夾頭台9(用以支持夾頭8) 與構成旋轉軸之構件10形成爲一體之周知構造。又，在保 持部3，設有用以真空吸附等之管路11。晶圓2，藉由真 空吸附支持在保持部3上，晶圓2上面爲硏磨面。保持部 3，藉由使用電動馬達作爲驅動器之未圖示的機構，如第1 圖中之箭頭Ν所示，可以旋轉。 硏磨構件1之直徑較晶圓2之直徑小。硏磨晶圓2時 ’因硏磨構件1之箭頭Μ所示方向之擺動，如第1與第3 圖所示，硏磨體7之一部分會暫時從晶圓2向其周圍突出 〇 導件5，係被支持爲能在與晶圓2之硏磨面大致平行 之面內的既定方向，與保持部3呈獨立的運動自如。 具體來說，本實施例中，導件5係以氧化锆或氧化鋁 等具優異耐磨性之陶瓷材料等構成爲環狀，與保持部3同 _ 18 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） ---------------.—ί ^--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _________ 五、發明說明（l k ) 軸沿保持部3之外周配置。導件5之上面，即爲硏磨時支 持硏磨體7之突出部分的引導面5a。又，導件5，係透過 與保持部同軸設置之環狀軸承12安裝在構件13，被支持 爲透過軸承12藉由構件13，與保持部3同軸但與保持部3 呈獨立的旋轉運動自如。前述構件13，係顯示將保持部3 支持爲於箭頭N方向旋轉自如之構件或固定於此之構件。 例如，在採用揭示於特開2000-127028號公報之分度工作 台構造時，構件13即爲分度工作台或固定於此之構件。分 度工作台，係將複數個保持部3分別支持爲旋轉自如者。 若使用分度工作台的話，當某一保持部3位在硏磨台時， 其它保持部3可位在裝載位置與卸載位置等，而能以良好 效率硏磨複數片晶圓2。雖然如此，本發明之硏磨裝置， 亦可僅具有單一保持部3。 本實施例中，爲防止硏磨劑旋轉進入軸承12，如第2 圖所示，導件5與構件13之間隙，係採用迷宮狀 (labyrinth)構造。不過，例如使用樹脂製等之密封構件，來 防止硏磨劑旋轉進入軸承12亦可。 又，亦可透過軸承12將導件5安裝在構件13，來取 代透過軸承12將導件5安裝在保持部3。此時，導件5雖 係以保持部3加以支持，但係與保持部3呈獨立而旋轉自 如。 根據本實施例之硏磨裝置，硏磨構件1，係邊向箭頭J 方向旋轉邊向箭頭Μ方向擺動，以既定壓力壓接於保持部 3上之晶圓2上面。使保持部3朝箭頭Ν方向旋轉則晶圓 19 本紙張尺度適用中國國家標準（CNS)A4規格（21G X 297公g ) »裝—.—^訂--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 ____B7 __ 玉、發明說明（\Ί) (請先閱讀背面之注意事項再填寫本頁) 2亦朝箭頭N方向旋轉，而使晶圓2與硏磨構件1進行相 對運動。一般之硏磨，爲提升硏磨率，係如第3圖所示， 使晶圓2之旋轉方向(箭頭N方向)與硏磨體7之旋轉方向( 箭頭J方向)相反，以提升相對速度。 於此狀態下，將硏磨劑從硏磨劑供給部4供給至晶圓 2上，硏磨記於晶圓2上擴散，隨硏磨構件1與晶圓2之 相對運動進入硏磨體7與晶圓2之間，來硏磨晶圓2之硏 磨面。亦即，硏磨構件1與晶圓2之相對運動之機械硏磨 與硏磨劑之化學作用相成作用，而進行良好之硏磨。 此時，如第1圖所示，因硏磨構件1朝第1圖中Μ方 向之擺動，硏磨體7之一部份會暫時從晶圓向其周圍突出 。但是，由於此突出部分係在與晶圓2之硏磨面大致同一 面處，以接近晶圓2外周之導件5加以支持，因此硏磨體 7與從晶圓2未突出之狀態實質係同等狀態。其結果’消 除了前述第1至第3問題，而能均一的進行晶圓2之硏磨 〇 又，本實施例中，由於導件5係被支持爲與保持部3 同軸、但與保持部3呈獨立的旋轉自如，因此如第3圖所 示，導件5因承受自硏磨體7之突出部分的摩擦力，而隨 硏磨體7之突出部分移動，朝箭頭Ρ方向旋轉。因此’硏 磨體7之突出部分的周速、與導件5中與前述突出部分面 對之部分的周速成爲大致同速，兩者之相對速度扣除滑動 部分的話，趨近於零。因而，若根據本實施例，能顯著地 壓低硏磨體7及導件5之磨損。又，由於導件5之周速與 20 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 ________B7____ 五、發明說明（丨公） 硏磨體7之周速大致相等，是以因硏磨劑或硏磨所產生之 晶圓2之粒子亦不致受額外之外力而能順利排出，該等粒 子不易侵入硏磨體7之纖維內部，造成硏磨體7之阻塞。 接著’就與本實施例比較之比較例，參照第4圖加以 說明。第4圖係對應第3圖之槪略俯視圖，第4圖中，與 第3圖中相同或對應之元件係賦予相同符號，並省略其重 複說明。此比較例與本實施例不同處在於，導件5係一體 固定於保持部3，朝與晶圓2之旋轉方向(箭頭N方向)相 同之箭頭P’方向旋轉。因此，此比較例中，硏磨體7之突 出部分、與導件5中與前述突出部分面對部分之相對速度 顯著變大，硏磨體7之突出部分與導件5之磨損變大。又 ’由於導件5與硏磨體7之相對速度大，是以因硏磨劑或 硏磨所產生之晶圓2之粒子受到不必要之外力而排出，因 此易潛入硏磨體7之纖維內部，易引起硏磨體7阻塞。亦 即’即使在導件5 —體固定於構件13之場合，前述相對速 度變得相當大，硏磨體7與導件5之磨損終究會變大，易 引起硏磨體之阻塞。 《第2實施例》 第5圖，係以示意方式顯示本發明第2實施例之硏磨 裝置之主要部位的槪略擴大剖面圖，與前述第2圖對應。 第7圖’係顯示本實施例之硏磨裝置的槪略俯視圖，與前 述第3圖對應。第5及第7圖中，與第2及第3圖中相同 或對應之元件賦予相同符號，並省略其重複說明。 _ 21 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） *t--------IT--------- (請先閱讀背面之注意事項再填寫本頁)491752 A7 ____ · B7___ 5. Description of the Invention (丨) [Technical Field] The present invention relates to a honing device suitable for semiconductor planarization honing in a method for manufacturing a semiconductor element such as ULSI. [Known Technology] In recent years, as a full-wafer planarization technology for the surfaces of semiconductor devices, chemical mechanical honing (chemical mechanical honing or chemical mechanical planarization, hereinafter referred to as CMP) technology has been used. CMP is a process of removing unevenness on the wafer surface by chemical action (honing agent, dissolution through solution) in physical honing. A honing apparatus for honing by CMP, including a honing body such as a honing pad, and a holding part such as a chuck for fixing a honing object such as a wafer, and interposing between the honing body and the honing object. In the state of the honing agent, a load is applied to the honing body and the honing object, and the honing object is honed by the relative movement. With this type of honing device, when the honing object is honing, a part of the honing body temporarily protrudes from the periphery of the honing object due to the relative movement of the honing body and the honing object. In the conventional art, a small honing pad (for example, a wafer having a smaller diameter than a wafer diameter) is provided, for example, a wafer which is vacuum-adhered to a chuck and faces upward, and is mounted on an elastic honing head with angular followability. (Hopping pad) A honing device in which the honing pad temporarily protrudes from the wafer when honing. [Problems to be Solved by the Invention] When a honing object such as a wafer is honing, the conventional honing device that causes a honing body such as a honing pad to protrude from the periphery of the honing object, because the honing pad is lifted from the wafer There are three problems described below when highlighting. 4 ^ Paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm ^ " " '' 'III Γ--ί ^. I Please read the note on the back first Please fill in this page again for matters} 491752 A7 ___; _B7 _ 5. Description of the invention (/) (Please read the notes on the back before filling out this page) The first question is "Tilt of the honing pad". Known honing device, In order to absorb the parallelism error between the honing pad surface and the chuck surface caused by processing and assembling, and the ridge of the wafer surface, the elastic mechanism with the head following the angle is adopted. Therefore, when the honing pad is shaken, When protruding from the wafer, this elasticity will, on the contrary, appear on the back side and cause the honing pad to tilt toward the protruding side, resulting in the problem that the desired honing cannot be performed. Specifically, the pressure applied to the wafer by the honing pad cannot be equalized. Distribution, as a result, the edge of the wafer is chipped at the edge (edge first) phenomenon, the honing is difficult to uniformly. The second problem is the "height of the honing pad". Although the honing pad does not protrude from the wafer, It was crushed by pressure, but the protruding part was restored by the honing pad material. The part that becomes less prominent due to the force is thicker. After the pressure is released, the area returned to this thickness will contact the wafer again due to the rotation of the head. The moment the level difference crosses the wafer, the pressure is released after the pressure is released. The surface of the honing pad is compressed again, so the pressure state of the wafer is not uniform near the edge. The same phenomenon occurs when the crushed honing pad is released from the pressure. For this reason The desired honing can not be obtained near the edge of the wafer. The third problem is the "pressure of the honing pad". The pressure of the honing pad on the wafer has a great influence on the honing state. Basic In order to uniformly hob the entire wafer, it is preferable that the honing pad applies a uniform pressure to the wafer per unit area. However, as described above, the conventional honing pad causes a contact area when protruding from the wafer. Change, resulting in a change in the applied pressure per unit area. In order to solve these problems, a guide can be considered to hob the wafer 5__ This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 491752 A7 _____R7___ 5. In the description of the invention (>), the protruding portion of the honing pad protruding from the wafer is supported. At this time, if the guide supports the guiding surface of the protruding portion, it is arranged substantially the same as the honing surface of the wafer. If the honing pad is protruding from the wafer, the state is substantially the same as the state where the honing pad is not protruding from the wafer. The first to third problems can be solved and the honing object can be uniformly performed. However, since the protruding portion of the honing pad and the guide member rub against each other, the honing pad of the aforementioned section may be subject to accelerated wear, and the guide member may also be subject to wear. However, the height of the guide surface is the same as that of the wafer. The smaller the height difference of the honing surface, the more fully the effect of the guide supporting the protruding portion of the honing member can be fully exerted, and the above-mentioned first to third problems can be fully solved. Therefore, on the substrate, the guide is made of a material with better wear resistance than the wafer. Therefore, when the wear of the honing pad is further accelerated, the life of the honing pad becomes shorter. In addition, even if the guide is made of a material having excellent wear resistance, the slower the wear of the guide is, the better. In addition, as described above, the smaller the difference between the height of the guide surface and the height of the honing surface of the wafer is, the better, so when the guide is set, the height of the guide is set in accordance with the height of the two. However, when continuously used, the guide member gradually wears out 'and the difference in height between the two becomes larger. Therefore, it is necessary to adjust the height of the guide again so that the heights of the two are consistent. Of course, it is also possible to exchange the guides without readjusting the height, but this will increase the cost. Therefore, it is necessary to adjust the height of the guide according to the wear of the guide, and this adjustment can be easily performed. In addition, the honing device described above cannot obtain sufficient honing characteristics due to blockage of the honing pad during continuous use. Therefore, adjustment is performed using a trimmer or the like at an appropriate frequency. However, the knowledgeable person cannot adjust the wafer honing, which reduces the efficiency of wafer honing. 6 This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) * Packing ---- * ---.— Order --------- (Please read the notes on the back first (Fill in this page again) 491752 A7 _______B7______ 5. Description of the invention (々) In view of the foregoing, the purpose of the present invention is to provide a problem caused by the protrusion of the honing body around the object to be honed, and the guide supports the aforementioned protrusion. The honing device can be partially solved, and the wear of the guide and the honing body can be reduced. In addition, another object of the present invention is to provide a honing problem in which the honing body is protruded from around the honing object, and the protrusion is supported by a guide, and the height of the guide can be easily adjusted. Device. Yet another object of the present invention is to provide a problem caused by protruding a honing body from around the object to be honed, and to solve the problem by supporting the protruding part with a guide, and how much can be obtained in the honing of the object to be honed. Honing device for adjusting the honing body and improving the honing efficiency of the honing object. As a result of investigations by the present inventors, it has been found that, for example, a honing device that holds a chuck of an elastic support mechanism with angular followability such as a wafer, and protrudes the wafer or the like from the periphery of a honing body such as a honing pad, The same problem as the above-mentioned first problem occurs. : Therefore, the object of the present invention is to provide a honing apparatus of this type, which can also solve the same problem as the aforementioned first problem. [Means for solving problems] In order to solve the above problems, the first The honing apparatus according to one aspect includes a honing body and a holding part for holding a honing object, and the honing agent is interposed in the state of the honing body and the honing object by the honing. A load is applied between the body and the above-mentioned honing object, and the relative movement is performed, _ 7 paper rule € ^ China National Standard-Standard (CNS) A4 specification (21〇x 297 public love) ~----- --------- I I .--- • 丨 Order -------- I (Please read the notes on the back before filling in this page) 491752 A7 ____ B7 _______; _ 5. Description of the invention ( <) Honing the aforementioned honing object, characterized in that it is provided with a guide having a guide surface located substantially in the same plane as the honing surface of the honing object, and supporting the honing with the guide surface The protruding part of the honing body protruding from the periphery of the honing object during honing; It is able to support a predetermined direction in the plane WH WH object of grinding the grinding of substantially parallel with the holding portion only 1 motion freely. According to this first aspect, since the guide member 'is provided, it is possible to solve the aforementioned first to third problems associated with the honing body protruding from around the object to be honed. In addition, in the first aspect described above, the guide is supported to move independently from the holding portion. Therefore, like the third aspect described later, the guide follows the frictional force of the protruding portion of the honing body. The movement of the protruding portion, or the fourth aspect described later, by using the actuator to drive the guide to 'fix the guide and the holding portion integrally, can reduce the protrusion of the honing body and the guide. The relative speed of the opposing portion of the aforementioned protruding portion. Therefore, according to the first aspect described above, it is possible to reduce the wear of the honing body and the guide of the honing pad and the like. The honing device according to the second aspect of the present invention is the guide member described in the first aspect, and is supported to be rotatable around the same axis as the rotation axis of the holding portion independently from the holding portion. Supporting the guide in this second aspect makes the mechanism simple and reduces costs. However, the aforementioned first aspect is not limited to this example. A honing device according to a third aspect of the present invention is the guide according to the first or second aspect, and moves with the protruding portion by a frictional force received from the protruding portion. According to this third aspect, since only 8 paper sizes need to be supported by the so-called self-mail method in accordance with Chinese National Standard (CNS) A4; m grid (210 X 297 public 0 ------- ------ ------ ^^ 装 ----.---- 丨 tr ·· --------- (Please read the precautions on the back before filling this page) 491752 A7 ____B7____ V. Invention Note (V) The guide is sufficient, so the actuator is not required to reduce the cost. The honing device of the fourth aspect of the present invention is the first or second aspect, and has a mechanism for driving the foregoing guide. Actuator. According to this fourth aspect, since the guide can be moved by the actuator, the relative speed of the protruding portion of the honing body and the guide can be arbitrarily set. According to the foregoing, according to the foregoing, In the fourth aspect, for example, as described in the fifth aspect described later, the relative speed of the protruding portion of the honing body and the facing portion facing the aforementioned protruding portion in the guide is reduced, or as in the eighth aspect described later, the guide is reduced. When there is a trimming area, the relative speed between the protruding portion and the trimming area is set to a speed suitable for the adjustment of the honing body. The honing device according to a fifth aspect of the present invention is The fourth aspect includes a control unit for controlling the actuator, so that the relative speed between the protruding portion and a portion of the guide facing the protruding portion is reduced. According to the fifth aspect, since The relative speed between the protruding portion and the portion facing the protruding portion of the guide member is reduced, so that the wear of the honing body and the guide member can be reduced. In the third aspect, the guide member is received by the protruding portion. The frictional force moves accordingly, so it is impossible to avoid the speed of the sliding component caused by the relative speed between the protruding portion and the guide portion. In this regard, in the fifth aspect, since the guide can be actively moved by the actuator, This sliding component can be eliminated, and the relative speed between the protruding portion and the guide is further reduced. Therefore, the wear of the honing body and the guide can be further reduced. The honing device of the sixth aspect of the present invention is the first one described above. Or in the second aspect, it is provided with an excitation unit that vibrates the guide member to form irregularities on the guide surface by vibration. 9 Wood paper size applies the Chinese National Standard (CNS) A4 standard (210 X 297) %) ------------------ '1 ^ --------- (Please read the notes on the back before filling this page) 491752 A7 ____B7_________ V. Description of the invention (Ί) Although the aforementioned vibration is preferably ultrasonic vibration or other high-frequency vibration, it is not limited to this. The excitation unit may generate a standing wave or a traveling wave, for example, on the guide surface. The excitation unit can be configured using various electromechanical energy conversion elements such as a piezoelectric element, an electric strain element, or a magnetic strain element. The above points are the same in the ninth aspect described later. According to the sixth aspect, since the The irregularities are formed on the guide surface of the guide by vibration, so the contact area between the guide surface and the honing body becomes smaller, and the friction coefficient between the two appears to be smaller. Therefore, the wear of the honing body and the guide can be further reduced. In addition, by the vibration described above, an adjustment effect of eliminating clogging of the honing body can be obtained. Therefore, it is not necessary to adjust the honing body when the honing object is not in the honing, or to reduce the number of adjustments when the honing object is not in order to improve the honing efficiency of the honing object. The honing device of the seventh aspect of the present invention is a component that generates a volume change corresponding to an applied electrical signal in the first or second aspect, and is arranged to change the component according to the change in volume of the component according to the aforementioned honing. The honing surface of the object is the relative height of the aforementioned guide surface. As the aforementioned element, for example, a piezoelectric element, an electric strain element, a magnetic strain element, or the like can be used. This point is the same in the tenth and Uth aspects described later. According to the seventh aspect, since the height of the guide surface of the guide can be adjusted by changing the electrical signal applied to the aforementioned element, the adjustment becomes easy. The honing device according to the eighth aspect of the present invention is the trimming area where at least a part of the 'leading surface' in the first or second aspect is capable of adjusting the honing body. 10 This paper has been used in China National Standard (CNS) A4 specification (210 X 297 mm) · Packing ---- * --- 丨 Order --------- (Please read the notes on the back first (Fill in this page again) 491752 A7 _ ___B7___ 5. Explanation of the invention (multiple) As in the eighth aspect, if at least a part of the guide surface is a trimming area, as long as the relative speed between the trimming area and the honing body is not completely Zero 'can adjust the honing body in the honing of the honing object. Therefore, ‘it is not necessary to adjust the honing body when it is not honing the object’ or to reduce the frequency of adjustment when it is not honing to increase the honing efficiency of the object. A honing apparatus according to a ninth aspect of the present invention includes a honing body and a holding part for holding a honing object. The honing agent is interposed between the honing body and the honing object, and the above A load is applied between the honing body and the honing object, and the relative movement is performed to hon the honing object. The hoisting object is provided with a guide, and the guide is provided with the honing object. The honing surface of the object is a guide surface in substantially the same plane, and the guide surface supports the protruding portion of the honing body protruding from the periphery of the honing object when honing the honing object; and the excitation portion. The guide member is vibrated, and irregularities are formed on the guide surface by the vibration. According to the ninth aspect, since the guide is provided, the problem that the honing body protrudes from around the honing object can be solved. Furthermore, according to the ninth aspect, since the unevenness is formed on the guide surface of the guide by vibration, the same as the sixth aspect, the wear of the honing body and the guide can be reduced, and the honing object can be improved. Try to figure out efficiency. The honing device of the tenth aspect of the present invention is an element having a volume change corresponding to the applied electrical signal in the ninth aspect. The aforementioned element is set to change depending on the volume of the element, and the change is performed by the aforementioned honing. The relative height of the aforementioned guide surface based on the honing surface of the object ', and the aforementioned paper size of the excitation section 11 applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) --------- --Installation ---- · ---- Order --------- (Please read the precautions on the back before filling out this page) 491752 A7 ______B7__ 5. Description of the invention (1) Contains both the aforementioned components Electrical mechanical energy conversion element. According to the tenth aspect, similarly to the seventh aspect, the height of the guide surface of the guide can be easily adjusted. In addition, the element that causes a volume change in this tenth aspect is also used as an electromechanical energy conversion element constituting the excitation unit, so that the cost can be reduced. The honing apparatus according to the eleventh aspect of the present invention includes a honing body and a holding portion for holding a honing object. The honing agent is interposed between the honing body and the honing object, and the above-mentioned A load is applied between the honing body and the honing object, and the relative movement is performed to hon the honing object. The honing object is provided with a guide, and the guide is provided with the honing object. The honing surface of the object is a guiding surface substantially in the same plane, and the aforementioned guiding surface supports the protruding portion of the honing body protruding from around the honing object when honing the honing object; and corresponding to the applied electrical A component that generates a volume change based on a signal; the foregoing component is set to change the relative height of the guide surface based on the honing surface of the honing object as a reference, depending on the volume change of the component. According to the eleventh aspect, since the guide is provided, the problem that the honing body protrudes from around the object to be honed can be solved. In addition, according to the aforementioned fourth aspect, as in the aforementioned seventh aspect, the height of the guide surface of the guide can be easily adjusted. A twelfth aspect of the present invention includes a honing body and a holding portion for holding a honing object. The honing agent is interposed in the honing body and the honing object in a state in which the honing body is interposed. Apply a load between the honing body and the honing object, and move them relative to honing the honing object. 12 This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm). (Please Read the precautions on the back before filling out this page) ------- It ---------. 491752 A7 _______B7___ V. Description of the invention (\ 0), which is characterized by: The guide has a guide surface located substantially in the same plane as the honing surface of the honing object, and the guiding surface supports the honing object protruding from around the honing object when honing the honing object. The protruding part of the grinding body, and at least a part of the guide surface of the guide member is a trimming area capable of adjusting the honing body. According to the twelfth aspect, since the guide is provided, it is possible to solve the problem associated with the honing body protruding from the periphery of the honing object. In addition, according to the twelfth aspect, as in the eighth aspect, as long as the relative speed between the trimming area and the honing body is not completely zero, the honing body can be adjusted in the honing of the honing object. To improve the honing efficiency of the honing object. The honing device of the thirteenth aspect of the present invention is the guide member of the twelfth aspect, and is supported in a predetermined direction in a plane substantially parallel to the honing surface of the honing object, and held in the predetermined direction. The part can move independently; it is provided with an actuator for driving the aforementioned guide and a control part for controlling the front actuator so that the aforementioned protrusion is protruded when the aforementioned protruding portion is in contact with the aforementioned trimming area. The relative speed between the part and the aforementioned trimming area is suitable for the adjustment speed of the aforementioned honing body. According to the thirteenth aspect, since the relative speed between the protruding portion and the dressing area when the protruding portion faces the dressing area is a speed suitable for the adjustment of the honing body, it can be more effective in honing the object to be honed. Effectively adjust the honing body to further improve the honing efficiency of the honing object. According to a fourteenth aspect of the present invention, the honing device is the thirteenth aspect. When the protruding portion is not opposed to the trimming area, the control unit controls the actuator so that the protruding portion and the guide are in contact with each other. Middle face front __ 13 This paper ruler Chinese national standard (cns) a4 size (210 X 297 mm) 'One # pack —— order --------- (Please read the precautions on the back first Fill out this page again) 491752 A7 _____B7___ 5. The relative speed of the prominent part of the description of the invention (\\) decreases. According to the fourteenth aspect, when the protruding portion of the honing body does not face the trimming area of the guide, the relative speed of the protruding portion and the portion of the guide facing the protruding portion is reduced, so that it can be reduced. Wear of honing bodies and guides. The honing device of the fifteenth aspect of the present invention is the aforementioned guide in the thirteenth or fourteenth aspect, and is supported to be rotatable around the same axis as the rotation axis of the holding portion independently from the holding portion. . Supporting the guide in such a manner as in the fifteenth aspect can simplify the mechanism and reduce the cost. However, the aforementioned 13th and 14th aspects are not limited to this example. A honing apparatus according to a sixteenth aspect of the present invention includes a honing body and a holding part for holding a honing object. The honing agent is interposed between the honing body and the honing object, and the above A load is applied between the honing body and the honing object, and the relative movement is performed to honing the honing object. The honing object is provided with a guide, and the guide is provided with the honing object. The honing surfaces are substantially the same as the guide surfaces, and the guide surfaces support the protruding portions of the honing object protruding from the periphery of the honing body during honing of the honing object. In the aforementioned first to fifteenth aspects, the guide is a protruding part of the honing body that protrudes from the periphery of the honing object during honing of the honing object, and in the sixteenth aspect, the guide is When supporting a protruding portion of the honing object protruding from the periphery of the honing body during honing of the honing object, the supporting objects of the two are different. According to the 16th aspect, the honing object can be solved because of the guide. 14 -------- I Order --------- (Please read the precautions on the back before filling this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) '~ " 491752 A7 _______ B7 ^ ____ V. Description of the invention (丨 y) Issues associated with the protrusion of objects from around the honing body (compared with the aforementioned The first question is the same question). The honing device of a seventeenth aspect of the present invention is the guide member of the sixteenth aspect, and is supported to be substantially the same as the honing surface of the honing body when honing the honing object. The predetermined direction inside is free to move independently from the aforementioned honing body. According to the seventeenth aspect, the same advantages as those of the second aspect can be obtained. The aforementioned sixteenth and seventeenth aspects can be individually or arbitrarily combined to have respective characteristic items corresponding to the aforementioned third to seventh aspects, respectively. [Brief description of the drawings] Fig. 1 is a schematic cross-sectional view showing the state of the honing apparatus of the first embodiment of the present invention when honing. Fig. 2 is an enlarged view near the part C in Fig. 1. Fig. 3 is a sectional view taken along the arrow D-D 'in Fig. 1. Fig. 4 is a schematic plan view showing a comparative example. Fig. 5 is a schematic enlarged cross-sectional view showing a main part of a honing apparatus according to a second embodiment of the present invention. Fig. 6 is an exploded perspective view schematically showing a main part of a grinding device of a third embodiment of the present invention. Fig. 7 is a schematic plan view showing a honing apparatus according to a second embodiment of the present invention. Fig. 8 is a schematic enlarged cross-sectional view showing the main part of the grinding device of the fourth embodiment of the present invention. 15 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)-(Please read the precautions on the back before filling this page) -----. 491752 B7 V. Description of the invention (FIG. 9 is an exploded perspective view showing the main parts of the honing device according to the fourth embodiment of the present invention. FIG. 10 is a diagram showing the driving circuit and excitation of the piezoelectric element Figures (a) and (b) are waveform diagrams showing examples of voltages applied to piezoelectric elements. Figures (a) and (b) are explanatory diagrams showing excitation situations. Figure 13 ( (a) and (b) are waveform charts showing another example of the voltage applied to the piezoelectric element. (a) and (b) are waveform charts showing still another example of the voltage applied to the piezoelectric element. The figure is a schematic cross-sectional view showing the state of the honing device of the fifth embodiment of the present invention when honing. (Please read the precautions on the back before filling this page) --------- Order --------% [Description of Symbols] 1 Honing member 2 Wafer 3 Holding section 4 Honing agent supply section 5 Guide 5a Guide surface 6 Honing platform 7 Honing body (honing pad) 12, 49 Bearing 21 Motor 16 This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 491752 A7 ___ B7 V. Description of the invention (\ order) 22, 23 Gear 24 Motor control unit 31 Dresser 31a Dressing area 40 Piezoelectric element 41 Piezoelectric body 42 Ground electrode plate 43A A-phase electrode plate 43B B-phase electrode plate 44, 45, 46 Slip ring 50 Drive circuit 51 AC power 52 Phase shifter (Please read the precautions on the back before Fill out this page) 5J- [Preferred embodiment of the invention] Hereinafter, the honing device of the present invention will be described in detail with reference to the drawings. [First Embodiment] FIG. 1 is a schematic view showing the first embodiment of the present invention. A schematic cross-sectional view of the state of the honing device in the first embodiment when honing. Fig. 2 is an enlarged view near the part c in Fig. 1. Fig. 3 is a DD 'arrow in Fig. 1 A cross-sectional view in the direction.-The honing device of this embodiment includes a honing member 1 and a holding portion 17 for holding a processed wafer 2 of a honing object on a lower side of the honing member 1. The paper size is applicable to China. National Standard (CNS) A4 (210 X 297 mm) 4 91752 A7 ____B7___ 5. Description of the Invention (\ S) 3, the honing agent (slurry) is supplied to the honing agent supply part 4 on the wafer 2 and will protrude from the periphery of the wafer 2 during the honing of the wafer 2 A guide member 5 supported by a protruding portion of the honing body 7 with a guide surface 5a. The guide surface 5a of the guide member 5 is positioned substantially in the same plane as the honing surface of the crystal hob 2. The honing member 1 is used to fix the honing body (honing pad) 7 below the honing platform 6 by an unillustrated mechanism, as shown by arrows J, K, and M in Figs. 1 and 3. , Can rotate, move up and down and shake left and right (back and forth). As the honing body 7, for example, a sheet-like foamed polyurethane or a non-foamed resin having a groove structure on the surface can be used. The holding part 3 is formed with a chuck 8 (having a large number of air passages (not shown) and capable of vacuum-adhering the wafer 2 to it), a chuck table 9 (for supporting the chuck 8), and a member 10 constituting a rotating shaft. Well-known structure for one body. The holding portion 3 is provided with a pipe 11 for vacuum suction and the like. The wafer 2 is supported on the holding portion 3 by vacuum suction, and the upper surface of the wafer 2 is a honing surface. The holding portion 3 can be rotated by an unillustrated mechanism using an electric motor as a driver, as indicated by an arrow N in FIG. 1. The diameter of the honing member 1 is smaller than the diameter of the wafer 2. When honing the wafer 2, due to the swing in the direction indicated by the arrow M of the honing member 1, as shown in Figs. 1 and 3, a part of the honing body 7 temporarily protrudes from the wafer 2 toward the periphery. 5. It is supported to move independently from the holding portion 3 in a predetermined direction in a plane substantially parallel to the honing surface of the wafer 2. Specifically, in this embodiment, the guide 5 is made of a ceramic material, such as zirconia or alumina, which has excellent wear resistance, and is formed in a ring shape. ) A4 specification (21〇X 297 mm) ---------------.— ί ^ --------- (Please read the notes on the back before filling in this (Page) 491752 A7 _________ 5. Description of the Invention (lk) The shaft is arranged along the outer periphery of the holding portion 3. The upper surface of the guide 5 is a guide surface 5a that supports the protruding portion of the honing body 7 during honing. The guide 5 is mounted on the member 13 through an annular bearing 12 provided coaxially with the holding portion. The guide 5 is supported to pass through the bearing 12 through the member 13 and is coaxial with the holding portion 3 but independently rotates from the holding portion 3 freely. . The aforementioned member 13 is a member that supports the holding portion 3 as a member that can rotate freely in the direction of the arrow N or a member that is fixed thereto. For example, when the indexing table structure disclosed in JP-A-2000-127028 is adopted, the component 13 is an indexing table or a member fixed thereto. The indexing table supports a plurality of holding portions 3 as rotatable ones. If an indexing table is used, when one of the holding sections 3 is located at the honing table, the other holding sections 3 may be located at the loading position and the unloading position, etc., and can hob a plurality of wafers 2 with good efficiency. Nevertheless, the honing apparatus of the present invention may have only a single holding portion 3. In this embodiment, in order to prevent the honing agent from rotating into the bearing 12, as shown in FIG. 2, the gap between the guide 5 and the member 13 adopts a labyrinth structure. However, a sealing member made of resin or the like may be used to prevent the honing agent from rotating into the bearing 12, for example. Alternatively, the guide 5 may be attached to the member 13 through the bearing 12, instead of attaching the guide 5 to the holding portion 3 through the bearing 12. At this time, although the guide 5 is supported by the holding portion 3, it is rotatable independently from the holding portion 3. According to the honing apparatus of this embodiment, the honing member 1 swings in the direction of the arrow M while rotating in the direction of the arrow J, and is crimped onto the wafer 2 on the holding portion 3 with a predetermined pressure. If the holding part 3 is rotated in the direction of the arrow N, the wafer 19 paper size is applicable to the Chinese National Standard (CNS) A4 specification (21G X 297g). »Installation —.— ^ Order --------- (please first Read the notes on the back and fill in this page) 491752 A7 ____B7 __ Jade and invention description (\ Ί) (Please read the notes on the back before filling in this page) 2 also rotate in the direction of arrow N, so that the wafer 2 and 硏The grinding member 1 performs a relative movement. In general, in order to increase the honing rate, as shown in FIG. 3, the rotation direction of the wafer 2 (the arrow N direction) is opposite to the rotation direction of the honing body 7 (the arrow J direction) to increase the relative speed. . In this state, the honing agent is supplied from the honing agent supply unit 4 to the wafer 2, and the honing is spread on the wafer 2 and enters the honing body 7 with the relative movement of the honing member 1 and the wafer 2. To the honing surface of the wafer 2 with the wafer 2. That is, the mechanical honing of the relative movement of the honing member 1 and the wafer 2 and the chemical action of the honing agent interact to perform good honing. At this time, as shown in FIG. 1, as the honing member 1 swings in the M direction in FIG. 1, a part of the honing body 7 temporarily protrudes from the wafer toward its periphery. However, since this protruding portion is substantially on the same surface as the honing surface of the wafer 2 and is supported by the guide 5 near the outer periphery of the wafer 2, the honing body 7 and the state not protruding from the wafer 2 are substantially related. Equivalent status. As a result, the aforementioned first to third problems are eliminated, and the wafer 2 can be honed uniformly. In this embodiment, since the guide 5 is supported coaxially with the holding portion 3, but with the holding portion 3 3 is independently rotatable. Therefore, as shown in FIG. 3, the guide 5 receives the frictional force from the protruding portion of the honing body 7, and moves with the protruding portion of the honing body 7 and rotates in the direction of arrow P. Therefore, the peripheral speed of the protruding portion of the 'honing body 7' and the peripheral speed of the guide member 5 facing the aforementioned protruding portion become approximately the same speed. When the sliding speed is subtracted from the relative speed of the two, it approaches zero. Therefore, according to this embodiment, the wear of the honing body 7 and the guide 5 can be significantly reduced. In addition, because the peripheral speed of the guide 5 and the 20 paper standards are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 491752 A7 ________B7____ 5. Description of the invention (丨 Male) The peripheral speed of the honing body 7 is approximately equal Therefore, the particles of the wafer 2 generated by the honing agent or the honing can be smoothly discharged without being subjected to an external force, and these particles cannot easily penetrate into the fiber of the honing body 7 and cause the blockage of the honing body 7. Next, a comparative example compared with this embodiment will be described with reference to Fig. 4. FIG. 4 is a schematic plan view corresponding to FIG. 3, and in FIG. 4, the same or corresponding elements as those in FIG. 3 are given the same symbols, and repeated explanations are omitted. This comparative example differs from this embodiment in that the guide 5 is integrally fixed to the holding portion 3 and rotates in the direction of arrow P 'which is the same as the direction of rotation (arrow N direction) of the wafer 2. Therefore, in this comparative example, the relative speed of the protruding portion of the honing body 7 and the facing portion of the guide member 5 facing the aforementioned protruding portion becomes significantly larger, and the wear of the protruding portion of the honing body 7 and the guide member 5 becomes larger. Also, because the relative speed of the guide 5 and the honing body 7 is large, the particles of the wafer 2 generated by the honing agent or honing are discharged by unnecessary external force, so it is easy to sneak into the fibers of the honing body 7 Inside, it is easy to cause the honing body 7 to block. That is, even when the guide member 5 is fixed to the member 13 as a whole, the aforementioned relative speed becomes quite large, and the wear of the honing body 7 and the guide member 5 will eventually increase, which will easily cause the honing body to be blocked. «Second Embodiment» Fig. 5 is a schematic enlarged sectional view of a main part of a honing apparatus according to a second embodiment of the present invention, and corresponds to the aforementioned second figure. Fig. 7 'is a schematic plan view showing the honing apparatus of the present embodiment, and corresponds to Fig. 3 described above. In Figs. 5 and 7, the same or corresponding elements as those in Figs. 2 and 3 are assigned the same reference numerals, and repeated descriptions thereof are omitted. _ 21 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) * t -------- IT --------- (Please read the precautions on the back before (Fill in this page)
I 491752 A7 _ B7__ 五、發明說明（\?) 本實施例不同於前述第1實施例處，只在於以下說明 各點。本實施例中，追加了電動馬達21以作爲用以驅動導 件5之致動器，馬達21係以馬達控制部24加以控制。與 保持部3同軸配置、其外周形成有齒部之環狀齒輪22，則 固定在導件5下部之外周側。此齒輪22 ’與固定在馬達21 輸出軸21a之齒輪23咬合，以馬達21加以驅動，使導件 5與保持部3同軸旋轉。 若根據本實施例，由於能藉由馬達21使導件5主動旋 轉，因此能自由任意設定硏磨體7之突出部分與導件5之 相對速度。 例如·，控制部24，係控制馬達21，以使硏磨體7之 突出部分與導件5之相對速度降低(例如使該相對速度成爲 最小）。例如，如第7圖所示，設晶圓2之旋轉中心(亦即 保持部3之旋轉中心)爲〇丨、硏磨體7之旋轉中心爲02、 包含點與點〇2之直線與導件5之內周及外周相交之各 交點之中點爲A、線段02A之長度爲LKt)、線段0!Α之 長度爲L2、硏磨體7之旋轉速度爲rKt)、導件5之旋轉速 度爲r2(t)時，控制部24，即控制馬達21，使導件5以滿足 下列式1之旋轉速度r2⑴進行旋轉。式1，係表示導件5 在A點之移動速度、與硏磨體7在A點之移動速度相等的 條件。但，硏磨體7之擺動方向(箭頭Μ方向)與包含點 與〇2之直線之方向一致。又，本例中，LKt)、rjt)、r2(t) 係隨時間變動之値。 22 -------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 ___El___ 五、發明說明（〆） (式l) i*2(t) = ri(t) · L{(t)/L2 亦即，控制部24，能從控制硏磨體7之旋轉、擺動與 保持部3之旋轉的控制部（未圖示）、與編碼器等其它檢測 器等獲得Mt)、1^)與L⑴之資訊。 前述第1實施例中，由於導件5係因承受自硏磨體7 之摩擦力而隨之移動，因此作爲硏磨體7之突出部分與導 件5之相對速度無法避免產生滑動成分之速度。相對於此 ，本實施例中，例如若能滿足上述式1之方式使導件5主 動旋轉的話，前述滑動成分即會減少’硏磨體7之突出部 分與導件2之相對速度更爲降低，硏磨體7與導件5之磨 損更爲減少。 《第3實施例》 第6圖，係以示意方式顯示本發明第3實施例之硏磨 裝置之主要部位的分解立體圖。第6圖中，與第2圖及第 3圖中相同或對應之元件係賦予同一符號，並省略其重複 說明。 本實施例與前述第3實施例不同處，只在以下說明各 點。本實施例中，於導件5之一部份中埋有修整器31。修 整器31，具有在不銹鋼板以黏著劑等固著鑽石磨粒之構造 ，磨粒面31a位在與導件5之引導面5a相同之面內。導件 5與修整器31整體構成支持硏磨體7之突出部分之導件。 修整器31之魔粒面31a與導件5之引導面5a，其整體構 23 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ·£--------tr--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _____B7________ 五、發明說明（y() 成支持硏磨體7之突出部分之引導面。磨粒面31a，構成 可調整硏磨體7之修整區域。 而本實施例中，控制部24，在硏磨體7之突出部分與 修整區域31a相對面時，係以使硏磨體7之突出部分與修 整區域31a之相對速度成爲適合硏磨體7之調整的速度之 方式，控制馬達21。又，控制部24，在硏磨體7之突出部 分與修整區域31a不面對時，係以使硏磨體7之突出部分 、與導件5中與硏磨體7之突出部分面對之部分的相對速 度降低之方式，例如以滿足前述式（1)之方式，控制馬達21 〇 又，亦可視需要，使修整區域31a之調整對硏磨體7 全面作用，例如以若干週期一次的比率，進行硏磨體7沿 箭頭Μ方向之擺動以增大硏磨體7之突出量。 若根據本實施例，即使在晶圓2之硏磨中，亦能以整 修區域31a進行硏磨體7之調整，因此不需在晶圓2之硏 磨以外時進行硏磨體7之調整，或者能減少調整之進行頻 率，提昇晶圓2之硏磨效率。 又，控制部24，亦可恆以例如滿足前述式（1)之方式進 行馬達21之控制。又，前述第1實施例中，亦可將引導面 5a之一部份作爲修整器31a。即使在此等情形中，亦能藉 修整區域31A多少進行硏磨體7之調整，來降低硏磨以外 時進行調整之頻率，提昇晶圓2之硏磨效率。 又，本實施例中，雖將導件5之引導面5a之一部份作 爲修整區域31a，但將導件5之引導面5a全體作爲修整區 24 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) _裝--------訂---------, 491752 A7 _______B7__ 五、發明說明（yT) 域亦可。此時，僅以修整器來構成導件5即可。將導件5 之引導面5a全體作爲修整區域時，控制部24，例如，通 常以滿足前述式（1)之方式控制馬達21，使修整區域與硏磨 體7之相對速度成爲最小，定期或視需要進行馬達21之控 制’以使修整區域與硏磨體7之相對速度成爲適合調整之 速度即可。 進一步的，本實施例中，去除軸承12，將導件5固定 於構件亦可。 《第4實施例》 第8圖，係以示意方式顯示本發明第4實施例之硏磨 裝置之主要部位的槪略擴大剖面圖，對應前述第2圖。第 '9圖，係顯示本實施例之硏磨裝置之主要部位的分解立體 圖。又，第9圖中之上下與第8圖中之上下相反，但以下 說明中之上下則以第8圖之上下爲準。第1〇圖，係顯示壓 電元件之驅動電路與勵振情形的圖。第11圖，係顯示施加 於壓電元件之電壓例的波形圖。第12圖，係顯示勵振情形 的說明圖。第8圖與第9圖中，與第1圖及第2圖相同或 對應之元件係賦予同一符號，並省略其重複說明。 本實施例與前述第1實施例不同之處，僅在以下說明 各點。 本實施例，追加了作爲使導件5振動之勵振部的壓電 元件40，以藉由振動在導件5之引導面5a形成凹凸。壓 電元件40，係由以第9圖之箭頭X所示之厚度方向爲分極 25 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) ' (請先閱讀背面之注意事項再填寫本頁) --------訂--------- 491752 A7 ___ B7 —_ 五、發明說明（/ ) 方向之環狀壓電體41、1片環狀接地用電極板42、8片A 相用電極板43A及8片B相用電極板43B所構成。 於導件5下面，壓電體42透過電極板42與導件5同 軸黏著。接地用電極板42，具有與滑環44滑接之刷部 42a(滑環44係與保持部3同軸固定於構件13之適當位置) 。將壓電體41下面沿圓周方向16等分之16個區域中，每 隔1個之8個區域41A上分別黏著A相電極板43A，其餘 8個區域41B上則分別黏著B相用電極板43B。電即板 43A，具有與滑環45滑接之刷部43a(滑環45係與保持部3 同軸固定於構件13之其它適當位置上）。電極板43B，具 有與滑環46滑接之刷部43b(滑環46係與保持部3同軸固 定於構件13另外之其它適當位置）。又，A相用電極板 43A與B相用電極板43B，係形成爲不致於產生相互電氣 短路。 本實施例中，壓電元件40，係透過與保持部3同軸、 分別配置在內周側與外周側之環狀安裝構件47, 48，分別 安裝於軸承12, 49。安裝構件47, 48，係分別固著在電極 板43A，43B下面之內周側位置與外周側位置。本實施例中 ，除軸承12外，亦追加軸承49之原因，係爲了將導件5 更安定的支持爲與保持部3同軸旋轉自如，但不一定非追 加軸承49不可。 本實施例，導件5之材料以耐磨損性高且適合勵振之 材料較佳，例如氧化锆系或氧化鋁系之陶瓷。 第10圖，係顯示將導件與壓電元件40沿圓周方向展 26 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) '--- -----------*t--------tr--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 ___ _B7 ___ 五、發明說明（对） 開，及用以驅動壓電元件40之驅動電路的一例。 本實施例中，驅動電路50，係由交流電源51與變相 器52(使輸出電壓變相180度來輸出)構成。又，驅動電路 50，透過滑環44〜46(第10圖中未圖示），如第1〇圖般電 氣連接於電極42, 43A，43B，於各電極43A與電極42之間 施加如第U(a)圖所示之交流電壓Va，於各電極43B與電 極42之間則施加第11(b)圖所示之交流電壓Vb。交流電壓 Va，Vb之頻率，係與8次彎曲模式頻率相等，以勵振由導 件5與壓電元件40所構成之環狀構件的8次彎曲模式。藉 由此電壓Va，Vb之施加，即於導件5之引導面5a，產生 第10圖中之虛曲線與一點鏈曲線所示之駐波。第12(a)圖 ，係顯示對應第10圖中虛曲線之時點的壓電體41之伸縮 與導件5引導面5a之凹凸的情形。第12(b)圖，係顯示對 應第10圖中之一點鏈曲線之時點的壓電體41之伸縮與導 件5引導面5a之凹凸的情形。 如上述般，由於導件5之引導面5a上因駐波產生凹凸 ，因此引導面5a對硏磨體7之接觸面積變小’兩者間外觀 上之摩擦係數顯著降低。因而，若根據本實施例’能更進 一步降低硏磨體7與導件5之磨損。又，藉由此微小超音 波振動，亦能獲得消除硏磨體7之阻塞的調整效果。僅爲 了得到此效果之目的，而以壓電元件40勵振導件5亦可。 此時，可不需在晶圓2之硏磨中隨時進行勵振’而僅在欲 獲得調整效果時進行勵振。 此外，在引導面5a產生的不是駐波、而是產生例如進 27 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----------·£--------1T--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _____B7___ 五、發明說明（〆） 行波時，亦可得到同樣效果。爲了產生進行波，可使用90 。變相之變相器取代180 °變相之變相器52。 本實施例中，雖係藉由軸承12, 49，將導件5支持爲 與保持部3同軸、但與保持部3呈獨立旋轉自如，但去除 該等軸承12, 49，例如將安裝構件47, 48固定在構件13亦 可。即使在此情形下，由於因駐波使引導面5a對硏磨體7 之接觸面積變小，因此除能獲得降低硏磨體7與導件5之 磨損的效果，亦可獲得前述調整效果。 再者，由於壓電元件40，係如前述般設在導件5與軸 承12, 49之間，因此在各電極43A，43B與電極42間分別 施加直流電壓Vx時，體積會隨該電壓Vx變化，引導面 5a之高度即成爲對應電壓Vx之高度。 承上所述，若將第13(a)、（b)圖所示之電壓Va，Vb(分 別相當於在第11(a)、（b)圖所示之交流電壓加上直流電壓 Vx之電壓），分別施加於各電極43A與電極42之間、及各 電極43B與電極42之間，而能以可變電阻器等來調整直 流電壓Vx之大小的話(此電路構成本身係習知），即能極容 易的調整導件5之引導部5a之高度。因此，即使在導件5 因長期使用產生磨損而須進行高度方向之再調整時，其調 整亦極爲簡單。 在僅以進行此種高度調整爲目的而利用壓電元件40之 情形時，於各電極43A與電極42之間、及各電極43B與 電極42之間，只要施加不包含第14(a)、（b)圖分別顯示之 交流成分、能調整位準之直流電壓Va，Vb即可。此時，當 28 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ·裝-------丨訂--------- (請先閱讀背面之注意事項再填寫本頁) 491752 A7 _____Β7 ____ 五、發明說明〇 ) 然不須分割成8片電極43A與8片電極43B，而可以1片 電極取代之。 此外，前述第1實施例藉追加驅動導件5之馬達21而 得到前述第2實施例，同樣地，本實施例亦可追加驅動導 件5之馬達。 又，本實施例與其前述各變形例中，皆可如前述第3 實施例同樣的，使導件5之引導面5a之一部份、或導件5 之引導面5a之全體爲修整區域。 《第5實施例》 第15圖，係以示意方式顯示本發明第5實施例之硏磨 裝置硏磨時之狀態的槪略剖面圖。第15圖中，與第1圖及 第2圖中相同或對應之元件係賦予同一符號，並省略其重 複說明。又，第15圖中，省略了硏磨劑供給部4之圖式。 本實施例與前述第1實施例不同之處，僅在以下說明 各點。本實施例中，保持晶圓2之保持部與硏磨構件1之 位置關係上下相反。保持部3，具備有角度追追隨性之弓單 性支持機構71，所保持之晶圓2係自由支持於傾斜方向。 硏磨構件1，藉未圖式之機構而能如第15圖中箭_ Ν’所示般進行旋轉。保持部3，藉未圖示之機構，而能 第15圖中箭頭Γ，Κ’，Μ’所示般，進行旋轉、上下移動與 左右擺動(來回移動）。晶圓2之硏磨時，藉保持部3 $胃 頭Μ’方向之擺動，如第15圖所示，晶圓2之〜部份會暫 時從硏磨體7往其周圍突出。 29 ,·裝--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 -------- B7_ 五、發明說明（7/p 導件5，係配置在硏磨體7周圍，以其引導面5a來支 持晶圓2之硏磨時從硏磨體7往其周圍突出之晶圓2的突 出部份。晶圓2之硏磨時，由於晶圓2之加壓使硏磨體7 變形，而使硏磨體7之硏磨面高度變低，因此導件5引導 面5a之高度，係被設定成與此時硏磨體7之硏磨面高度大 致一致。亦即，導件5之引導面5a，係位於晶圓2硏磨時 與硏磨體2之硏磨面大致相同面內。本實施例中，在導件 5之上部內周側形成有去角部5b，以在晶圓2從硏磨體2 突出時，能使晶圓2平順的移動至導件5之引導面5a上。 導件5，雖與前述第1實施例同樣的被支持爲旋轉自 如，但係透過軸承12安裝在將硏磨構件1支持爲旋轉自如 之構件72，據此，被支持爲在晶圓2之硏磨時、與硏磨體 7之硏磨面大致相同面內的既定方向，與硏磨體7呈獨立 的運動自如(實施例中，係與硏磨體7同軸旋轉自如）。 假設沒有導件5的話，當晶圓2從硏磨體7突出時， 保持部3之支持機構71之角度追隨性將會出現於背面，使 晶圓2傾斜於突出側，而無法進行期望之硏磨。 相對於此，本實施例中，由於晶圓2之硏磨時從硏磨 體7周圍突出之晶圓2之突出部分係以導件5加以支持， 因此實現了晶圓2未從硏磨體7突出之狀態實質上同等之 狀態，能均勻的進行晶圓2之硏磨° 此外，本實施例中，導件5，係被支持爲與硏磨體7 同軸、與保持部3呈獨立的旋轉自如，因此能與前述第1 實施例同樣的，獲得顯著抑止導件5之磨損等之優點。當 30 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐1 ' (請先閱讀背面之注意事項再填寫本頁) ^4--------^---------. ^1752 A7 ----___B7____ 五、發明說明) 然，本發明中，亦可將導件5固定在構件72、或固定在硏 磨構件1。 再者，本實施例中，由於導件5係支持晶圓2之突出 部分而不是支持硏磨體7之突出部分，因此作爲導件5之 材料，以使用較陶瓷等耐磨損性高之材料軟、摩擦係數小 ，樹脂中以耐藥性佳之材料，例如樹脂系之PTFE與PEEK 較佳。 以改變前述第1實施例而得前述第2至第4實施例、 與該等之變形例相同之方法(但不含修整器之點），來變更 此第5實施例，即能得本發明更進一步之其它種種實施例 〇 以上，雖針對本發明之各實施例及該等之變形例作了 說明，但本發明並不限於此。 [發明效果] 如以上之說明般，若根據本發明，能將硏磨墊等之硏 磨體從硏磨對象周圍突出所伴隨之問題，以導件支持該突 出部分來加以解決，以減低導件與硏磨體之磨損。 又，若根據本發明，能將硏磨體從硏磨對象周圍突出 所伴隨之問題，以導件支持該突出部分來加以解決’而容 易地進行導件之高度調整。 再者，若根據本發明，能將硏磨體從硏磨對象周圍突 出所伴隨之問題，以導件支持該突出部分來加以解決’於 硏磨對象物之硏磨時多少可得硏磨體之調整效果’提昇硏 31 ·裝--------訂---------^9. (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 491752 A7 _B7_ 五、發明說明（>/) 磨對象物之硏磨效率。 更進一步的，若根據本發明，能將硏磨對象物從硏磨 體周圍突出所伴隨之問題，以導件支持該突出部分來加以 解決， 此外，若根據本發明，能將硏磨對象物從硏磨體周圍 突出所伴隨之問題，以導件支持突出部分來加以解決，而 減低導件之磨損。 32 ^紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐i (請先閱讀背面之注意事項再填寫本頁) ---------訂---------*5^^ ·I 491752 A7 _ B7__ V. Description of the Invention (\?) This embodiment is different from the aforementioned first embodiment only in the following points. In this embodiment, an electric motor 21 is added as an actuator for driving the guide 5, and the motor 21 is controlled by a motor control section 24. The ring gear 22 arranged coaxially with the holding portion 3 and having teeth formed on its outer periphery is fixed to the outer peripheral side of the lower portion of the guide 5. This gear 22 'meshes with a gear 23 fixed to the output shaft 21a of the motor 21 and is driven by the motor 21 to rotate the guide 5 and the holding portion 3 coaxially. According to this embodiment, since the guide member 5 can be actively rotated by the motor 21, the relative speed of the protruding portion of the honing body 7 and the guide member 5 can be arbitrarily set. For example, the control unit 24 controls the motor 21 to reduce the relative speed between the protruding portion of the honing body 7 and the guide 5 (for example, to minimize the relative speed). For example, as shown in FIG. 7, suppose that the rotation center of the wafer 2 (that is, the rotation center of the holding portion 3) is 〇 丨, the rotation center of the honing body 7 is 02, and the straight line including the point and the point 〇2 is guided. The middle point of the intersection of the inner and outer perimeters of piece 5 is A, the length of line segment 02A is LKt), the length of line segment 0! A is L2, the rotation speed of honing body 7 is rKt), the rotation of guide 5 When the speed is r2 (t), the control unit 24, that is, the motor 21, rotates the guide 5 so as to satisfy the rotation speed r2⑴ of the following formula 1. Equation 1 represents a condition that the moving speed of the guide 5 at the point A is equal to the moving speed of the honing body 7 at the point A. However, the swing direction (direction of arrow M) of the honing body 7 coincides with the direction of the straight line including the point and θ2. In this example, LKt), rjt), and r2 (t) are changes over time. 22 ------------------- Order --------- (Please read the precautions on the back before filling this page) This paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 mm) 491752 A7 ___El___ 5. Description of the invention (〆) (Formula l) i * 2 (t) = ri (t) · L {(t) / L2 That is, the control unit 24. The information of Mt), 1 ^) and L⑴ can be obtained from a control unit (not shown) that controls the rotation of the honing body 7, the swing and the rotation of the holding unit 3, and other detectors such as an encoder. In the aforementioned first embodiment, since the guide member 5 moves due to receiving the frictional force from the honing body 7, the relative speed of the protruding part of the honing body 7 and the guide member 5 cannot avoid the speed of the sliding component. . In contrast, in this embodiment, for example, if the guide member 5 can be actively rotated in a manner satisfying the above formula 1, the aforementioned sliding component will be reduced, and the relative speed of the protruding portion of the honing body 7 and the guide member 2 will be further reduced. The wear of the honing body 7 and the guide 5 is further reduced. [Third Embodiment] Fig. 6 is an exploded perspective view schematically showing a main part of a honing apparatus according to a third embodiment of the present invention. In Fig. 6, the same or corresponding elements as those in Figs. 2 and 3 are given the same reference numerals, and repeated descriptions are omitted. This embodiment is different from the third embodiment described above, and only points will be described below. In this embodiment, a dresser 31 is buried in a part of the guide 5. The dresser 31 has a structure in which diamond abrasive grains are fixed on a stainless steel plate with an adhesive or the like, and the abrasive grain surface 31a is positioned in the same plane as the guide surface 5a of the guide 5. The guide 5 and the dresser 31 integrally constitute a guide that supports the protruding portion of the honing body 7. The overall structure of the magic grain surface 31a of the finisher 31 and the guide surface 5a of the guide 5 is 23. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). £ -------- tr --------- (Please read the precautions on the back before filling this page) 491752 A7 _____B7________ V. Description of the invention (y () is a guide surface supporting the protruding part of the honing body 7. The abrasive surface 31a constitutes the trimming area of the adjustable honing body 7. In this embodiment, the control unit 24 is configured to make the protrusion of the honing body 7 and The relative speed of the dressing area 31a is a method suitable for the adjustment speed of the honing body 7. The motor 21 is controlled. The control unit 24 controls the motor 21 when the protruding portion of the honing body 7 does not face the dressing area 31a. The method of reducing the relative speed of the protruding portion of the grinding body 7 and the portion of the guide 5 facing the protruding portion of the honing body 7 is, for example, a method of satisfying the aforementioned formula (1), and controlling the motor 21. It is necessary that the adjustment of the trimming area 31a has a full effect on the honing body 7, for example, a ratio of once in several cycles The honing body 7 is swung in the direction of the arrow M to increase the protruding amount of the honing body 7. According to this embodiment, the honing body 7 can be performed with the repair area 31a even in the honing of the wafer 2. Therefore, it is not necessary to adjust the honing body 7 when the honing of the wafer 2 is not performed, or it is possible to reduce the frequency of the adjustment and improve the honing efficiency of the wafer 2. In addition, the control unit 24 may also keep the For example, the control of the motor 21 is performed in a manner satisfying the aforementioned formula (1). Also, in the aforementioned first embodiment, a part of the guide surface 5a may be used as the dresser 31a. Even in these cases, the dressing can be borrowed In the area 31A, the honing body 7 is adjusted to reduce the frequency of adjustments other than honing to improve the honing efficiency of the wafer 2. In this embodiment, although a part of the guide surface 5a of the guide 5 is Copies are used as the trimming area 31a, but the entire guide surface 5a of the guide 5 is used as the trimming area 24. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling in this (Page) _Installation -------- Order ---------, 491752 A7 _______B7__ V. The description (yT) domain is also possible. At this time, only the guide 5 may be constituted by a trimmer. When the entire guide surface 5a of the guide 5 is used as a trimming area, the control unit 24 usually satisfies the aforementioned formula ( 1) Control the motor 21 so that the relative speed between the dressing area and the honing body 7 is minimized. Periodically or as needed, control the motor 21 'to make the relative speed between the dressing area and the honing body 7 a suitable speed for adjustment. Further, in this embodiment, the bearing 12 may be removed and the guide 5 may be fixed to the component. [Fourth Embodiment] Fig. 8 is a schematic enlarged cross-sectional view of a main part of a honing apparatus according to a fourth embodiment of the present invention, corresponding to the aforementioned second figure. Fig. 9 is an exploded perspective view showing the main parts of the honing apparatus of this embodiment. Note that the upper and lower positions in FIG. 9 are opposite to the upper and lower positions in FIG. 8, but the upper and lower positions in the following description are based on the upper and lower positions in FIG. 8. Fig. 10 is a diagram showing a driving circuit and an excitation situation of the piezoelectric element. Fig. 11 is a waveform diagram showing an example of a voltage applied to a piezoelectric element. Fig. 12 is an explanatory diagram showing an excitation situation. In Figs. 8 and 9, elements that are the same as or corresponding to those in Figs. 1 and 2 are given the same reference numerals, and repeated descriptions thereof are omitted. This embodiment is different from the first embodiment described above, and only points will be described below. In this embodiment, a piezoelectric element 40 is added as an excitation unit that vibrates the guide 5 to form irregularities on the guide surface 5a of the guide 5 by vibration. The piezo element 40 is polarized by the thickness direction indicated by the arrow X in FIG. 9 as the polar division. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). '(Please read the precautions on the back first (Fill in this page again) -------- Order --------- 491752 A7 ___ B7 —_ 5. Description of the invention (/) Ring-shaped piezoelectric body 41 in the direction of /, 1 ring ground The electrode plate 42 is composed of eight A-phase electrode plates 43A and eight B-phase electrode plates 43B. Below the guide 5, a piezoelectric body 42 is adhered to the guide 5 in the same axis through the electrode plate 42. The ground electrode plate 42 has a brush portion 42a which is in sliding contact with the slip ring 44 (the slip ring 44 is coaxially fixed with the holding portion 3 at an appropriate position of the member 13). A phase electrode plate 43A is adhered to each of the 16 areas divided by 16 in the circumferential direction below the piezoelectric body 41, and phase A electrode plates 43A are adhered to 41A of every other area, and phase electrode plates B are adhered to the remaining 8 areas 41B, respectively. 43B. The electric plate 43A has a brush portion 43a which is in sliding contact with the slip ring 45 (the slip ring 45 is coaxially fixed with the holding portion 3 at other appropriate positions of the member 13). The electrode plate 43B has a brush portion 43b which is in sliding contact with the slip ring 46 (the slip ring 46 is coaxially fixed with the holding portion 3 at another appropriate position of the member 13). The A-phase electrode plate 43A and the B-phase electrode plate 43B are formed so as not to cause an electrical short circuit with each other. In this embodiment, the piezoelectric element 40 is attached to the bearings 12, 49 through annular mounting members 47, 48 which are coaxial with the holding portion 3, and are disposed on the inner peripheral side and the outer peripheral side, respectively. The mounting members 47 and 48 are fixed to the inner peripheral side position and the outer peripheral side position of the lower surfaces of the electrode plates 43A and 43B, respectively. In the present embodiment, the reason for adding the bearing 49 in addition to the bearing 12 is to support the guide 5 in a stable manner so as to rotate coaxially with the holding portion 3, but it is not necessarily necessary to add the bearing 49. In this embodiment, the material of the guide 5 is preferably a material with high abrasion resistance and suitable for excitation, such as zirconia-based or alumina-based ceramics. Figure 10 shows that the guide and the piezoelectric element 40 are spread in the circumferential direction. The paper size is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm). '--- ------- ---- * t -------- tr --------- (Please read the precautions on the back before filling this page) 491752 A7 ___ _B7 ___ 5. Description of the invention (to) Open And an example of a driving circuit for driving the piezoelectric element 40. In this embodiment, the driving circuit 50 is composed of an AC power source 51 and a phase changer 52 (the output voltage is changed by 180 degrees). In addition, the driving circuit 50 is electrically connected to the electrodes 42, 43A, 43B through the slip rings 44 to 46 (not shown in FIG. 10) as shown in FIG. The AC voltage Va shown in U (a) is shown, and the AC voltage Vb shown in FIG. 11 (b) is applied between each of the electrodes 43B and 42. The frequency of the alternating voltage Va, Vb is equal to the frequency of the eighth bending mode, and the eighth bending mode of the ring-shaped member composed of the guide 5 and the piezoelectric element 40 is excited. By the application of this voltage Va, Vb, the standing wave shown by the imaginary curve and the one-point chain curve in Fig. 10 is generated on the guide surface 5a of the guide member 5. Fig. 12 (a) shows the expansion and contraction of the piezoelectric body 41 and the unevenness of the guide surface 5a of the guide 5 corresponding to the time point of the dashed curve in Fig. 10. Fig. 12 (b) shows the expansion and contraction of the piezoelectric body 41 and the unevenness of the guide surface 5a of the guide 5 corresponding to the point of the chain curve of one point in Fig. 10. As described above, since the guide surface 5a of the guide member 5 has irregularities due to standing waves, the contact area between the guide surface 5a and the honing body 7 becomes smaller ', and the coefficient of friction between the two is significantly reduced. Therefore, according to this embodiment ', the wear of the honing body 7 and the guide 5 can be further reduced. In addition, the adjustment effect of eliminating the blockage of the honing body 7 can also be obtained by the minute ultrasonic vibration. For the purpose of obtaining this effect, the piezoelectric element 40 may be used to excite the guide 5. In this case, it is not necessary to perform the excitation at any time during the honing of the wafer 2 ', and the vibration can be performed only when the adjustment effect is desired. In addition, instead of standing waves generated on the guide surface 5a, for example, 27 papers are produced. This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) ----------- £ -------- 1T --------- (Please read the notes on the back before filling out this page) 491752 A7 _____B7___ 5. Description of the invention (〆) The same effect can be obtained when traveling waves . To generate a progressive wave, 90 ° can be used. A phase changer replaces the 180 ° phase changer 52. In this embodiment, although the guide member 5 is supported coaxially with the holding portion 3 by bearings 12, 49, but independently rotates freely from the holding portion 3, the bearings 12, 49 are removed, for example, the mounting member 47 , 48 may be fixed to the member 13. Even in this case, since the contact area of the guide surface 5a with the honing body 7 is reduced due to the standing wave, in addition to the effect of reducing the wear of the honing body 7 and the guide 5, the aforementioned adjustment effect can be obtained. Furthermore, since the piezoelectric element 40 is disposed between the guide 5 and the bearings 12, 49 as described above, when a DC voltage Vx is applied between each of the electrodes 43A, 43B and the electrode 42, the volume will follow the voltage Vx. The height of the guide surface 5a becomes the height corresponding to the voltage Vx. As mentioned above, if the voltages Va and Vb shown in Figs. 13 (a) and (b) (respectively correspond to the AC voltage shown in Figs. 11 (a) and (b) plus the DC voltage Vx) Voltage), which is applied between each electrode 43A and electrode 42 and between each electrode 43B and electrode 42 and the magnitude of the DC voltage Vx can be adjusted by a variable resistor or the like (this circuit configuration itself is known) That is, the height of the guide portion 5a of the guide 5 can be adjusted very easily. Therefore, even when the guide 5 needs to be readjusted in the height direction due to wear due to long-term use, its adjustment is extremely simple. In the case where the piezoelectric element 40 is used only for the purpose of performing such height adjustment, between the electrodes 43A and 42 and between the electrodes 43B and 42 as long as the 14th (a), (B) The AC components shown in the figure and the DC voltages Va and Vb that can adjust the level are sufficient. At this time, when 28 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) · installed ------- 丨 order --------- (Please read the Please fill in this page again for the matters needing attention) 491752 A7 _____ Β7 ____ V. Description of the invention 0) It is not necessary to divide into 8 electrodes 43A and 8 electrodes 43B, but one electrode can be used instead. In addition, in the aforementioned first embodiment, the aforementioned second embodiment is obtained by adding the motor 21 for driving the guide 5, and in the same manner, the motor for driving the guide 5 may be added in this embodiment. In addition, in this embodiment and the foregoing modification examples, as in the aforementioned third embodiment, a part of the guide surface 5a of the guide 5 or the entire guide surface 5a of the guide 5 may be a trimming area. «Fifth Embodiment» Fig. 15 is a schematic cross-sectional view showing a state when a honing apparatus of a fifth embodiment of the present invention is honing. In Fig. 15, the same or corresponding elements as those in Figs. 1 and 2 are assigned the same reference numerals, and repeated explanations are omitted. In FIG. 15, the pattern of the honing agent supply unit 4 is omitted. This embodiment is different from the first embodiment described above, and only points will be described below. In this embodiment, the positional relationship between the holding portion holding the wafer 2 and the honing member 1 is reversed up and down. The holding unit 3 is provided with an angular follow-up bow unisexual support mechanism 71, and the held wafer 2 is freely supported in an oblique direction. The honing member 1 can be rotated as shown by an arrow _N 'in FIG. 15 by a mechanism (not shown). The holding unit 3 can rotate, move up and down, and move left and right (back and forth) as shown by arrows Γ, κ ', and M' in FIG. 15 by a mechanism not shown in the figure. During the honing of wafer 2, the holding portion 3 is swung in the direction of the stomach head M ′. As shown in FIG. 15, parts ~ of wafer 2 will temporarily protrude from the honing body 7 to the periphery thereof. 29, · Installation -------- Order --------- (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 491752 A7 -------- B7_ V. Description of the invention (7 / p guide 5 is arranged around the honing body 7 and uses its guide surface 5a to support the honing of wafer 2 The protruding portion of the wafer 2 protruding from the honing body 7 to the periphery. During the honing of the wafer 2, the honing body 7 is deformed due to the pressure of the wafer 2 and the honing surface of the honing body 7 is deformed. The height becomes lower, so the height of the guide surface 5a of the guide 5 is set to be approximately the same as the height of the honing surface of the honing body 7. At this time, the guide surface 5a of the guide 5 is located on the wafer 2 硏. During grinding, it is substantially in the same plane as the honing surface of the honing body 2. In this embodiment, a chamfered portion 5b is formed on the inner peripheral side of the upper portion of the guide 5, so that when the wafer 2 protrudes from the honing body 2, The wafer 2 can be smoothly moved to the guide surface 5a of the guide member 5. Although the guide member 5 is supported to be rotatable freely as in the first embodiment described above, it is mounted through the bearing 12 to support the honing member 1 Is a rotatable member 72, It is supported to move independently from the honing body 7 in a predetermined direction in the same plane as the honing surface of the honing body 7 during honing of the wafer 2 (in the embodiment, it is connected to the honing body 7). Coaxial rotation is free.) Assuming that the guide 5 is not provided, when the wafer 2 protrudes from the honing body 7, the angle followability of the support mechanism 71 of the holding portion 3 will appear on the back surface, so that the wafer 2 is inclined to the protruding side. On the other hand, in this embodiment, since the protruding portion of the wafer 2 protruding from the periphery of the honing body 7 during the honing of the wafer 2 is supported by the guide 5, it is realized. The state where the wafer 2 does not protrude from the honing body 7 is substantially equal, and the honing of the wafer 2 can be performed uniformly. In addition, in this embodiment, the guide 5 is supported to be coaxial with the honing body 7 It can rotate independently from the holding part 3, so it can obtain the advantages of significantly reducing the wear of the guide 5 as in the first embodiment described above. When 30 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm 1 '(Please read the notes on the back before filling this page) ^ 4 ----- --- ^ ---------. ^ 1752 A7 ----___ B7____ 5. Description of the invention) Of course, in the present invention, the guide 5 can also be fixed to the component 72 or to the honing component. 1. Furthermore, in this embodiment, since the guide 5 supports the protruding portion of the wafer 2 instead of the protruding portion of the honing body 7, the material of the guide 5 is used to have a higher wear resistance than ceramics or the like. High materials are soft and have a low friction coefficient. Among the resins, materials with good chemical resistance, such as resin-based PTFE and PEEK, are preferred. The above-mentioned second to fourth embodiments are obtained by changing the first embodiment, and The same method of the modified example (but does not include the conditioner), to change this fifth embodiment, you can get further various embodiments of the present invention. Above, although for the embodiments of the present invention and these The modification has been described, but the present invention is not limited to this. [Effects of the Invention] As described above, according to the present invention, it is possible to solve the problems associated with honing bodies such as honing pads protruding from the periphery of the honing object, and to support the protruding parts with a guide to solve the problem. Wear of parts and honing bodies. Further, according to the present invention, it is possible to solve the problems associated with protruding the honing body from around the object to be honed, and to support the protruding portion with the guide to solve the problem ', and to easily adjust the height of the guide. Furthermore, according to the present invention, a problem associated with protruding the honing body from around the honing object can be solved by supporting the protruding portion with a guide. 'How many honing bodies can be obtained during honing of the honing object. The effect of the adjustment 'enhance 硏 31 · install -------- order --------- ^ 9. (Please read the precautions on the back before filling in this page) This paper size applies to Chinese national standards (CNS) A4 size (210 X 297 mm) 491752 A7 _B7_ V. Description of the invention (> /) Honing efficiency of grinding object. Furthermore, according to the present invention, it is possible to solve the problems associated with the honing object protruding from the periphery of the honing body, and the protruding part is supported by the guide. In addition, according to the present invention, the honing object can be solved. The problems accompanying the protrusion from the honing body are solved by the guide supporting the protruding portion, thereby reducing the wear of the guide. 32 ^ Paper size applies to China National Standard (CNS) A4 (210 X 297 mmi (please read the precautions on the back before filling this page) --------- Order ------- -* 5 ^^ ·