TW490725B

TW490725B - Cleaning substrate for cleaning and regenerating molds

Info

Publication number: TW490725B
Application number: TW90114357A
Authority: TW
Inventors: Kuang-Chwn Chou
Original assignee: Advanced Semiconductor Eng
Priority date: 2001-06-12
Filing date: 2001-06-12
Publication date: 2002-06-11

Abstract

A kind of cleaning substrate for cleaning and regenerating molds is disclosed in the present invention. The mold is contaminated after using thermal-set resin repeatedly to package semiconductor devices. When the cleaning mold is placed inside the mold, the cleaning substrate has at least one protrusion capable of matching completely to accommodate in at least one cavity edge of the mold.

Description

五、發明說明（1) 【發明領域本叙明係有關於一種用於 -特別有關於一種清導ς再生模具之清潔基板，【先前技術】 ’、體封羞杈具的清潔基板。 j^·矛|J用才装目、熱固性樹脂；= =料的封膠過程中，該表面而加以脫模。私4松蜊會滲出至該模具之内之脫模特性會降低;、使得；封勝步驟，模塑件的導因為該熱固性樹脂封膠材觀變差。這些缺點具之内表面，在γ _ Μ ^卜已3之脫模劑滲入該模污染材料層使該脫模劑失去其積下处漸惡化’因此被為解決上述問題，必須勃、主失效之被㈣㈣層、 1 =以去除使脫模劑 (-l_e resin)封膠材料置於該模具内，：= ί =之被污染材料一體成型並固化成為-本體“模具内取出，因此將該模具的内表面清潔乾淨，體後自核第1及2圖揭示一習用半導體封裝模具10，該模具101 一罐（pot ) 11用以儲藏封膠塑料，該罐丨丨係經由澆道 (rUnner)12以及洗道口（gate)13連接模穴14，該模穴“用以放置-半導體晶片（未示於圖中）。當要封裝半導體晶片時，一柱塞1 5向下壓縮該封膠塑料，該封膠塑料會液化並且經由該澆道12以及澆道口 13而充滿模穴14以包覆該半導體晶只，畲該封膠塑料硬化後將模具丨〇打開取出模製產品。 'V. Description of the Invention (1) [Field of the Invention] The present invention relates to a cleaning substrate for-in particular, a cleaning and regeneration mold, [prior art], and a cleaning substrate for a body seal. j ^ · lance | J is used to install the eye, thermosetting resin; = = during the sealing process of the material, the surface is demoulded. Private 4 pine clams will ooze out into the mold, and the mold release property will be lowered, so that, in the sealing step, the molded parts will be deteriorated because of the thermosetting resin sealing material. These shortcomings have an inner surface, and the release agent in the γ_M ^ 3 has penetrated into the mold contaminated material layer to make the release agent lose its accumulation and gradually deteriorate. Therefore, in order to solve the above problems, it must be vigorous and the main failure The bedding layer, 1 = the mold release agent (-l_e resin) sealing material is placed in the mold to remove: = ί = the contaminated material is integrally formed and cured into a-body "mold is taken out, so this The inner surface of the mold is clean and clean. Figures 1 and 2 reveal the conventional semiconductor packaging mold 10. The mold 101 has a pot 11 for storing the sealing plastic. The pot is passed through a runner (rUnner). ) 12 and a gate 13 are connected to a cavity 14 "for placing a semiconductor wafer (not shown). When a semiconductor wafer is to be packaged, a plunger 15 compresses the sealant plastic downward, the sealant plastic will liquefy and fill the cavity 14 to cover the semiconductor crystal via the runner 12 and the runner opening 13, 畲After the sealing plastic is hardened, the mold is opened to take out the molded product. '

P01-058.ptd 第4頁五、發明說明（2) 在不斷重覆材料層，特別是二：】後’該模具10之内表面產生-污染製產品的外顴兀=、八4内表面的污染材料層將造成該模層。如第2圖所示，“貝：广亥模具10之 >可染材料 2〇置於該模具中時’將—清潔基板 )>i ^ Μ ^ ^ 糸塑料（cleaning compound 竭面的;=當該清潔塑料固化時，其將與模穴塑件，然一體成型成為-模二：^次後即可將模具的内表面清潔乾淨。此每一次將清潔塑料注 ==千板狀。因穴14夕*拉,,、古 UU之权八14都必須將該模 =14之谷積（v〇iume)填滿，經過多次的注模後，1P01-058.ptd Page 4 V. Description of the invention (2) After continuously repeating the material layer, especially two:] After 'the inner surface of the mold 10 is produced-the outer surface of the contaminated product =, the inner surface of the 4 The layer of contaminated material will cause the mold layer. As shown in Figure 2, "Be: Guanghai mold 10 > dyeable material 20 when placed in the mold 'will-clean the substrate) > i ^ Μ ^ ^ 糸 plastic (cleaning compound exhausted; = When the clean plastic is cured, it will be integrated with the mold cavity plastic parts, and then integrated into-Mold 2: The inner surface of the mold can be cleaned after ^ times. This time, the clean plastic will be injected each time. Due to the cave 14 night * pull, the ancient UU right 8 14 must be filled with the mold = 14 valley product (v〇iume), after several injections, 1

清潔塑料不必要的浪費。 ’… I 有鑑於此，有需要提供一種用以清潔半導體封Unnecessary waste of clean plastic. ’... In view of this, there is a need to provide a method for cleaning semiconductor packages.

清潔基板，在不改變原製程設備情況節省：：塑料的使用量- 幻即名，月 >糸【發明概要】主^發明之主要目的在於提供一種用於清潔及再生模且之，月潔基板，當每一次在使用清潔塑料清潔半導體封^且時，能夠節省清潔塑料的使用量。衣俱八為達上述目的，本發明提供一種清潔基板使用於、主再生-用以封裝半導體裝置之模[該模具在重覆：用1 固性樹脂封裝半導縣置後被Μ，當該清潔该模具内時，該清潔基板具有一突出部，置於 1 J兀王配合容納於Clean the substrate without changing the original process equipment. Savings: The amount of plastic used-magic name, month > 糸 [Summary of the invention] The main purpose of the invention is to provide a cleaning and regeneration mold. When the substrate is cleaned with a clean plastic every time, the substrate can save the amount of clean plastic used. In order to achieve the above purpose, the present invention provides a mold for cleaning substrates, which is mainly used for recycling-for packaging semiconductor devices. [The mold is repeated after being sealed with a semi-conductive resin in a solid resin. When cleaning the mold, the cleaning substrate has a protruding portion, which is placed in a space of 1 J

P〇l-058.ptd 第5頁 49〇725P〇l-058.ptd Page 5 49〇725

發明說明（3) ，模具之一模穴邊緣内用以縮小該模穴之容積（v〇lume)，藉此節省清潔塑料的使用量。根據本發明另一觀點之清潔基板’其中該清潔基板之突出部輪廓對應於該模穴邊緣。尺根據本發明另一觀點之清潔基板，其中該清潔基板係由紙所製成。 μ 本發明另提供一種模具的清潔方法，其包含以下步驟： (a )提供一模具，該模具設有至少一模穴；（b )將一呈有至少一第一突出部之清潔基板置於該模穴内，該突出^ 了元全配合谷納於違模穴邊緣内；（c )將清潔塑料 (cleaning compound)注入該模具之模穴内；（d)硬化 #亥清潔塑料使得該清潔塑料與該清潔基板π體成型成為_ 模製品；及（e )打開該模具以取出該模製品。根據本發明之用以清潔半導體封裝模具的清潔基板，當要清潔該模具時’係將該清潔基板置於該模具内，其中該清潔基板之數個突出部可分別完全容納於該模具之數穴邊緣内。然後，將清潔塑料注入該模穴内。由於該基板設有該突出部，因此可減少該清潔塑料每次注膠時的使用量。【發明說明】目則半導體業界一般利用習知的傳遞模塑法（t r a n s f e r molding)形成封膠體來密封晶片與基板。一般鑄模裝置 (molding apparatus)設有罐（p〇t)供封膠材料置放。該罐係經由澆道（runner)以及澆道口（gate)連接模穴Description of the invention (3), the edge of the cavity of one of the molds is used to reduce the volume of the cavity (v〇lume), thereby saving the use of clean plastic. The cleaning substrate according to another aspect of the present invention, wherein the outline of the protruding portion of the cleaning substrate corresponds to the edge of the cavity. Ruler A cleaning substrate according to another aspect of the present invention, wherein the cleaning substrate is made of paper. μ The present invention further provides a method for cleaning a mold, which includes the following steps: (a) providing a mold having at least one cavity; (b) placing a cleaning substrate having at least one first protrusion on In the mold cavity, the protrusion ^ Yuanquan cooperates with the valley in the edge of the mold cavity; (c) injects a cleaning compound into the cavity of the mold; (d) hardened # ハ clean plastic makes the cleaning plastic and The clean substrate π body is formed into a molded article; and (e) the mold is opened to take out the molded article. According to the cleaning substrate for cleaning a semiconductor packaging mold according to the present invention, when the mold is to be cleaned, the cleaning substrate is placed in the mold, wherein the protrusions of the cleaning substrate can be completely accommodated in the mold respectively. Inside the edge of the hole. Then, clean plastic is injected into the cavity. Since the substrate is provided with the protruding portion, the usage amount of the cleaning plastic can be reduced each time the plastic is injected. [Explanation of the Invention] The semiconductor industry generally uses a conventional transfer molding method (t r a n s f r r molding) to form a sealing compound to seal the wafer and the substrate. A general molding apparatus is provided with a pot (pot) for placing the sealant material. The tank is connected to the mold cavity through a runner and a gate.

P01-058.ptd 第6頁 490725P01-058.ptd Page 6 490725

該鑄模物頂出係先將將封膠之柱塞以及洗料充滿塑料硬 i ng)並在不斷料層。 (cavity) p i η)用以該封膠該鑄模裝具；接著料，使其與基板。預定時間具，去洗推出模穴面將產生。此外，將模製產製程一般置，然後，在罐内經由洗道當封膠塑直至封膠道（degat 。然而，一污染材裝置係設模穴。已裝設半材料置於 (plunger 道口而充模穴後，化。然後且利用該重覆上述有複數個頂針（eject 導體晶片之基板片置入罐中，並且密合夾緊模 )開始移動壓縮封膠材滿模穴以密封密封晶片柱塞保持靜止且持續一 ’柱塞上升，打開模複數個頂針將模製產物步驟後，該模具之内表The mold is ejected by filling the plastic sealing plunger and the washing material with plastic and hard material. (cavity) p i η) is used for the sealant and the mold assembly; Predetermined time, go to wash out the cavity surface will be produced. In addition, the molding process is generally set, and then the plastic is sealed in the tank through the washing channel to the sealing channel (degat. However, a contaminated material device is provided with a mold cavity. A semi-material has been installed and placed in the plunger pass After the cavity is filled, the cavity is changed. Then, using the above-mentioned multiple ejector pins (the substrate sheet of the conductor conductor wafer is placed in a can, and the clamping mold is tightly closed), the compression cavity is filled with the cavity to seal The wafer plunger remains stationary and the plunger rises. After opening the mold, a number of thimbles are used to mold the product.

第3及4圖揭示根據本發明較佳具體實施例之一半導體封裝模具1 0 0，此模具1 〇〇適於製造具有印刷電路板之半導體裴置，如BGA，該模具1〇〇具有一上模具11〇a及一下模具 110b 上板具110设有複數個凹陷部111，當該上模旦 11 0a與該下模具11 〇b閉合時其二者間於凹陷部丨丨1形模穴1 2 0。此外，該模具1 〇〇具有複數個罐丨3 〇、複數道1 4 0及複數個澆道口 1 5 〇，該罐1 3 〇係經由澆道丨4 〇以及洗道口 1 5 0連接模穴1 2 0。如第4圖所示，當要清潔該模具1 〇〇時，密合夾緊該模具 100使得一清潔基板20 0置於該模穴120内。該清潔基板2〇〇具有複數個第一突出部2 1 0設於其上表面，該複數個突出部2 1 0與該清潔基板2 〇〇係為一體成型，其較佳由紙所製成。該每一突出部2 1 0可分別完全容納於該模具1 〇〇之模穴Figures 3 and 4 show a semiconductor packaging mold 100 according to one of the preferred embodiments of the present invention. This mold 100 is suitable for manufacturing a semiconductor device having a printed circuit board, such as BGA. The mold 100 has a The upper mold 110a and the lower mold 110b are provided with a plurality of recessed portions 111. When the upper mold 1 10a and the lower mold 1 10b are closed, they are in the recessed portions. 1 2 0. In addition, the mold 1 00 has a plurality of tanks 3 0, a plurality of channels 1 40, and a plurality of runner gates 1 50. The tank 1 3 0 is connected to the mold cavity through a runner 1 4 0 and a washing channel 1 50. 1 2 0. As shown in FIG. 4, when the mold 100 is to be cleaned, the mold 100 is tightly clamped so that a cleaning substrate 200 is placed in the mold cavity 120. The cleaning substrate 2000 has a plurality of first protruding portions 2 10 provided on the upper surface thereof. The plurality of protruding portions 2 1 0 and the cleaning substrate 2 are integrally formed. It is preferably made of paper. . Each of the protruding portions 2 1 0 can be completely received in a mold cavity of the mold 1 0.

P01-058.ptd 第7頁 490725 五、發明說明（5) 1 2 0邊、，本内°亥大出部2 1 0之輪廓較佳對應於該模穴丨2 〇邊 ί : = ί熱固性三聚氰胺樹脂（melamine resin )(未不於圖中）儲存於該罐13〇。_柱塞16〇向下移動壓縮该清潔塑料，使其經由澆道14〇以及澆道口 15〇而充滿模 =20主且·覆蓋於該清潔基板⑽上表面，硬化該清潔塑料使付该々潔塑料與 >可染材料層以及該清潔基板2〇〇一體成型成為-模製品後’打開該模具1〇〇以取出該模製品使該 :染：料層自該模穴i 20内表面移除。由於該清潔基板2〇〇设有突出部210，因此可有效縮小該模穴12〇之容積，藉此節省清潔塑料的使用量。 9 第5圖揭示根據本發明另一較佳具體實施例之一半導體封裝模具100，此模具丨00適於製造具有導線架之半導體裝置，如QFP、TSOP等，該模具100具有一上模具n〇a及一 ^ 模具110c，該上模具11 〇a設有複數個第一凹陷部丨丨“，該下模具1 1 0c設有複數個第二凹陷部丨丨lb，當該上模具丨1〇& 及邊下模具11 0 c密合壓緊時，該第一凹陷部丨丨丨a及該二凹部111b —起疋義一模穴i2〇a。此外，該模具1〇〇具^^ 複數個罐13G、複數個澆道14〇及複數個澆道口15〇，該罐一 130係經由澆道140以及澆道口 15〇連接模穴12〇&。如第5圖所示，當要清潔該模具丨〇〇時，密合夾緊該模具 1 0 0使得一清潔基板2 0 0置於該模穴1 2 〇 a内。該清潔基板 20 0具有複數個第一突出部2 1 0a設於其上表面以及複數個第二突出部210b設於其下表面，該複數個突出部2丨〇a、 2 1 0 b與該清潔基板2 0 0係為一體成型，其較佳由紙所製P01-058.ptd Page 7 490725 V. Description of the invention (5) 1 2 0 side, the contour of the inner part 2 1 0 preferably corresponds to the cavity 丨 2 〇 side ί: = ί thermosetting Melamine resin (not shown) is stored in the tank 130. _The plunger 160 moves downward to compress the cleaning plastic, so that it fills the mold through the runner 1440 and the runner opening 15o = 20 main and covers the upper surface of the cleaning substrate ，, hardens the cleaning plastic 使Clean plastic is integrated with the > dyeable material layer and the clean substrate 2000 into a molded product-after opening the mold 100 to remove the molded product so that the: dye: material layer is from the cavity i 20 Surface removed. Since the cleaning substrate 2000 is provided with a protruding portion 210, the volume of the cavity 120 can be effectively reduced, thereby saving the amount of cleaning plastic used. 9 FIG. 5 illustrates a semiconductor packaging mold 100 according to another preferred embodiment of the present invention. This mold 00 is suitable for manufacturing semiconductor devices with lead frames, such as QFP, TSOP, etc. The mold 100 has an upper mold n. 〇a and ^ mold 110c, the upper mold 11 〇a is provided with a plurality of first depressions 丨丨 ", the lower mold 1 1 0c is provided with a plurality of second depressions 丨丨 lb, when the upper mold 丨 1 〇 & When the side mold 11 0 c is tightly pressed, the first recessed portion 丨丨丨 a and the two recessed portions 111b—uprising first mold cavity i2〇a. In addition, the mold 100 has ^^ A plurality of tanks 13G, a plurality of runners 1440, and a plurality of runner openings 150 are connected to the cavity 120 through the runner 140 and the runner opening 150. As shown in FIG. 5, when the When the mold is cleaned, the mold 100 is tightly clamped so that a clean substrate 200 is placed in the cavity 1 20a. The clean substrate 200 has a plurality of first protrusions 2 1 0a The upper surface and a plurality of second protruding portions 210b are provided on a lower surface thereof. The plurality of protruding portions 2 丨 a, 2 1 0 b and the cleaning substrate 2 are provided. 0 0 series is integrally formed, which is preferably made of paper

490725 五、發明說明（6) 成。該第一突出部21 〇a可完全配合容納於該上模具11 〇a之第一凹陷部111a邊緣内，該第二突出部21〇b可完全配合容納於該下模具11 〇 b之第二凹陷部11 1 b邊緣内，該第一突出部2 1 0 a之輪廓較佳對應於該第一凹陷部11丨a邊緣，該第二突出部21 Ob之輪廓較佳對應於該第二凹陷部丨〗lb邊緣。一清潔塑料如熱固性三聚氰胺樹脂（melamine resin)(未示於圖中）儲存於該罐130。一柱塞160向下移動塵縮該清潔塑料，使其經由澆道140以及澆道口 15〇而充滿模穴丨2〇且覆蓋於該清潔基板2〇〇上表面，硬化該清潔塑料使得該清潔塑料與污染材料層以及該清潔基板2 〇〇一體成型成一模製品後，打開該模具丨00以取出該模製品，使詖二材料層自該模穴120内表面移除。由於該清心木突出部21〇’因此，可有效縮小該模穴12〇，欠：省清潔塑料的使用量。頁精此即雖然本發明已以前述較佳實施例揭示定本發明，任何熟習此技蓺；，：:雜並非用以限490725 Fifth, the description of the invention (6). The first protruding portion 21 〇a can be completely fit and received in the edge of the first recessed portion 111a of the upper mold 11 〇a, and the second protruding portion 21 〇 can be completely fit and received in the second lip of the lower mold 11 〇b Within the edge of the recessed portion 11 1 b, the contour of the first protruding portion 2 1 0 a preferably corresponds to the edge of the first recessed portion 11 丨 a, and the contour of the second protruding portion 21 Ob preferably corresponds to the second recess. Department 丨〗 lb edge. A cleaning plastic such as a thermosetting melamine resin (not shown) is stored in the tank 130. A plunger 160 moves downward to shrink the cleaning plastic, so that it fills the cavity through the runner 140 and the gate 15 and covers the upper surface of the cleaning substrate 2000. The cleaning plastic is hardened to make the cleaning After the plastic and the contaminated material layer and the cleaning substrate 2000 are integrally formed into a molded product, the mold is opened to remove the molded product, so that the second material layer is removed from the inner surface of the cavity 120. Because the clear wood protruding portion 21〇 ', the cavity 120 can be effectively reduced, and the amount of clean plastic is saved. This page is here. Although the present invention has been disclosed in the foregoing preferred embodiments, anyone familiar with this technology;

範^，當可：各種之更動與修改。因此本；神〜和圍當視後附之申請專利範圍所界定者為 \月之保 ^yyj I δ jFan ^, Dang Ke: Various changes and modifications. Therefore, the scope of the patent application enclosed by Shen ~ and Wei Dangshi is defined as \ month's guarantee ^ yyj I δ j

【圖示說明】第1圖：其用圖0 以說明習用，、申、4 ^ β基板使用於一模具之上視圖第2圖：為根據第1圖清潔基板使用於一模具之部分剖視第3圖：其用以說明本發明一模具之上視圖。較佳實施例清潔基板使用於一 ΓΛ: 據，第3圖本發明較佳實施例清潔基板使用於一杈具之部分剖視圖。苐5圖•用以說明木發明萁 ^ x 不^月另一較佳實施例清潔基板使用於一模具之部分剖視圖。【圖號說明】模具 11 澆道口（gate) 1 4 清潔基板模具 110a 下模具凹陷部 111a 模穴 120a 澆道 150 清潔基板 210 第二突出部罐(pot ) 12 模穴 15 上模具 110b 第〆凹陷部1 1 1 b 模穴 130 澆道口 160 突出部 210a 繞道（runner) 柱塞第二凹陷部罐柱塞第一突出部[Illustration] Figure 1: It uses Figure 0 to explain the conventional use, and Shen, 4 ^ β substrate used in a mold top view Figure 2: Partial cross-section view of the cleaning substrate used in a mold according to Figure 1 FIG. 3 is a top view illustrating a mold of the present invention. According to the preferred embodiment, the cleaning substrate is used in a ΓΛ: According to FIG. 3, a partial cross-sectional view of the preferred embodiment of the cleaning substrate of the present invention is used in a tool.苐 5Figures to illustrate the wood invention 木 x 不 ^ 月 Another preferred embodiment of the cleaning substrate is used in a cross-sectional view of a mold. [Illustration of the drawing number] Mould 11 Gate 1 1 Clean the substrate mold 110a Lower mold recess 111a Cavity 120a Sprue 150 Clean substrate 210 Second protrusion pot (pot) 12 Cavity 15 Upper mold 110b First depression 1 1 1 b cavity 130 runner gate 160 protrusion 210a runner plunger second recess pot plunger first protrusion

10 13 20 100 110c 111 120 140 200 210b10 13 20 100 110c 111 120 140 200 210b

P01-058.ptd 第10頁P01-058.ptd Page 10

Claims

、、志 490725 六、申請專利範圍 1 · 一種用於清潔及再生模具之清潔基板，該模具在重裝半導體裝置後被污染，當該清潔基板被置於該模具時，該清潔基板具有至少一突出部可完全配合容納於具之至少一模穴邊緣内。、 2 ·依申請專利範圍第1項之用於清潔及再生模具之清板，該突出部之輪廓對應於該模穴邊緣。 3 ·依申請專利範圍第1項之用於清潔及再生模具之板，該清潔基板係由紙所製成。 4. 一種用於清潔及再生模具之清潔基板，該模具用熱固性樹脂封裝半導體裝置後被污模具及一下模具，該上模且 &衩，、3又模旦設有至少一m -耦八°又有至y 一第—凹陷部緊時’該第-凹陷部及該第二凹陷部一：定 τ:; 清潔基板具有i少一第一突出部設於其上表面以及時，該第一突出ς二表面，當該清潔基板被置於該部邊緣内，該第二突屮上杈具之第二凹陷部邊緣内。 17 70王配合谷納於該下模 5 ·依申請專利筋囹楚兮锿和圍第4項之用於清潔及再生槿且夕、主板，I玄第一突街部之輪生拉具之 >月 1之輪屝對應於該上模具之第一凹户覆封内該模《基《基覆利一上該下合壓、 Chi 490725 VI. Application Patent Scope 1 · A cleaning substrate for cleaning and regenerating a mold. The mold is contaminated after reinstalling a semiconductor device. When the cleaning substrate is placed in the mold, the cleaning substrate has at least one The protrusion can be completely fit and received in the edge of at least one cavity of the tool. 2. According to the cleaning plate for cleaning and regenerating mold according to item 1 of the patent application scope, the outline of the protruding part corresponds to the edge of the cavity. 3. The plate for cleaning and recycling molds according to item 1 of the scope of patent application, the clean substrate is made of paper. 4. A clean substrate for cleaning and regenerating a mold. The mold is contaminated with a mold and a lower mold after the semiconductor device is encapsulated with a thermosetting resin. The upper mold is provided with at least one m-couple eight. ° When there is y-first-recessed portion tight, the first-recessed portion and the second recessed portion are: fixed τ :; the cleaning substrate has i less than a first protruding portion provided on its upper surface, and the first One protrudes two surfaces, and when the cleaning substrate is placed in the edge of the part, the edge of the second recessed part of the upper part of the second protrusion. 17 70 King cooperated with Gu Na in the lower mold 5. According to the patent application, Chu Xixi and He No. 4 are used to clean and regenerate the hibiscus, the main board, and the Xuansheng pull of the first street of Ixuan. > The wheel of month 1 corresponds to the first recess of the upper mold of the upper mold.

具内凹陷之第 490725 六、申請專利範圍No. 490725 of Inner Depression

緣’該第二突出部之輪廓對應於該下模具之第緣0 6 ·依申請專利範圍第4項之用於清潔及再生模具之清潔基板，該清潔基板係由紙所製成。 ’、土 7 · —種清潔模具的方法，其包含：提供一模具，該模具設有至少一模穴；將一具有至少一第一突出部之清潔基板置於該模穴内該突出部可完全配合容納於該模六邊緣内；將清潔塑料（cleaning compound )注入該掇向· 供，、之杈穴硬化該清潔塑料使得該清潔塑料與該清潔基板成為一模製品；及體成型打開該模具以取出該模製品。 8塑法’其中該清潔S 心m甲靖專利範圍第丫項之清設有一上模具及一下模具，該部’該下描目m少一第二凹陷部，該上模具^凹該上模設模部’該下模具設有至少 — 具密合壓緊時’該第-凹陷部及該第二凹：；：：該-穴，該清潔基板之第一突出部係設於其上表面 5亥/1Edge 'The contour of the second protruding portion corresponds to the edge of the lower mold. The cleaning substrate for cleaning and regenerating the mold according to item 4 of the patent application scope, the cleaning substrate is made of paper. ', Soil 7 · — A method for cleaning a mold, comprising: providing a mold, the mold is provided with at least one cavity; placing a cleaning substrate having at least one first protrusion in the cavity, the protrusion can be completely Fit into the six edges of the mold; inject a cleaning compound into the direction, supply, and harden the cleaning plastic so that the cleaning plastic and the cleaning substrate become a molded product; and body molding opens the mold To take out the molded article. 8 plastic method 'where the clean S heart m Jiajing patent scope item ya is provided with an upper mold and a lower mold, the part' the lower profile m is less a second depression, the upper mold ^ concave the upper mold Set the mold section 'the lower mold is provided with at least-the first recessed portion and the second recessed when tightly compacted';; ::-the first cavity of the clean substrate is provided on the upper surface thereof; 5h / 1

490725 六、申請專利範圍基板另設有至少一第二突出部於其下表面，當該清潔基板被置於該模具内時，該第一突出部可完全配合容納於該上模具之第一凹陷部邊緣内，且該第二突出部可完全配合容納於該下模具之第二凹陷部邊緣内。 1 0.依申請專利範圍第7項之清潔模具的方法，該清潔基板係由紙所製成。490725 6. The scope of the patent application The substrate is provided with at least a second protrusion on its lower surface. When the cleaning substrate is placed in the mold, the first protrusion can be completely fitted and received in the first depression of the upper mold. And the second protruding portion can be completely fit and received in the edge of the second recessed portion of the lower mold. 10. The method for cleaning a mold according to item 7 of the scope of patent application, the cleaning substrate is made of paper.

P01-058.ptd 第13頁P01-058.ptd Page 13