TW480646B - Operation of vacuum treatment device and method for processing wafer - Google Patents

Operation of vacuum treatment device and method for processing wafer Download PDF

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Publication number
TW480646B
TW480646B TW089118856A TW89118856A TW480646B TW 480646 B TW480646 B TW 480646B TW 089118856 A TW089118856 A TW 089118856A TW 89118856 A TW89118856 A TW 89118856A TW 480646 B TW480646 B TW 480646B
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Taiwan
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processing
wafer
program processing
program
processing device
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TW089118856A
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Chinese (zh)
Inventor
Toru Ueno
Shigeru Nakamoto
Masashi Okiguch
Hideki Yamazaki
Koji Nishihata
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Hitachi Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing And Monitoring For Control Systems (AREA)

Abstract

The present invention is to provide a method for operating a vacuum treatment equipment and a method for processing a wafer, in which at least two processing device operate in a vacuum treatment device. When an abnormal condition of the treatment chamber occurs, the relationship between two processing device is not restricted and the normal treatment chamber is then set to be used and to operate, so as to increase the performance. A method for operating a vacuum treatment equipment consists of a plurality of wafer processing devices for executing a series of different processes for each wafer, a transportation equipment for carrying the wafers, and a controller for controlling the above processes and the transportation equipment. The method for operating the vacuum treatment equipment includes at least two kinds of wafer processing paths including a plurality of the wafer processing devices. In this method, it is determined whether each processing device in each wafer-processing path is effective for operation or not. Only the processing devices, which are determined to be ineffective for operation, are separated. Using the processing devices determined to be effective for operation, processing paths for executing a series of processes are rebuilt to process the wafers using only the processing devices effective for operation.

Description

480646 A7 B7 五、發明說明（1 ) 【發明之背景】 【發明之領域】 (請先閱讀背面之注意事項再填寫本頁) 本發明係有關真空處理裝置的運轉方法及晶圓的處理 方法’以進行程序處理之程序處理裝置，及進行晶圓運送 之運送處理裝置被構成，使用至少2個以上之程序處理裝置 進行晶圓處理。 【先前之技術】 習知技術之真空處理裝置’係譬如，如日本專利（案 )特開昭6 3 - 1 3 3 5 3 2號公報在運送室用以連接處理室之系統 中’有關在正常之運轉狀態下使試料處理被實施時，將分 別之晶圓在分別之處理室同時執行，或將晶圓經由2個以上 之處理室可進行處理之裝置及其運送。 又其他有關先前之真空處理裝置，係如日本專利（案 )特開平3-274746號公報將2條經路之程序處理同時進行運 轉，在含於一條經路之處理室用以實施維修作業時，則將 另外經路之處理室以過渡性的共用於2條經路之程序處理之 裝置的運轉方法。 經濟部智慧財產局員工消費合作社印製 進而，在特開平1 1-67 869號公報’係被揭示用以產生 顯示各程序處理裝置之運轉有效或運轉無效的各運轉資訊 信號並將運轉資訊信號產生裝置設於各程序處理裝置，並 設運轉資訊信號記憶裝置用以記憶該各運轉資訊信號，將 各運轉資訊信號還原不使用運轉無效之該程序處理裝置， 而使用另外運轉有效之程序處理裝置設有裝置控制裝備。 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 480646 A7 ____B7___ 五、發明說明（2 ) 前述特開昭63- 1 3 35 3 2號公報或特開平3-274746號公報 之真空處理裝置，係將2個以上之處理室做爲處理經路使用 並進行運轉之運轉中，對於哪個之處理室由於故障等不能 使用時則使用正常之處理室用以續行處理之運轉及復舊處 理，係未被考慮。又，將2個以上之處理室做爲處理經路使 用並在運轉中使其運轉暫時中斷，到中斷爲止在該運轉之 處理經路將未使用之處理室做爲處理經路使用並優先用以 執行***處理，在終了該***處理之後使暫時中斷之處理 續行的運轉方法，對於順序也未被考慮。 經濟部智慧財產局員工消費合作社印製 另外，特開平1 1 -67869號公報，係一種真空處理裝置 之運轉方法’其構成係具有：複數之程序處理裝置，對各晶 圓進行一連串不同之程序處理；運送處理裝置，進行前述晶 圓之運送；及控制裝置，用以控制前述各程序處理裝置及運 送處理裝置；並在一種真空處理裝置之運轉方法，係具有含 複數之程序處理裝置至少2組之晶圓的處理經路用以進行各 自前述一連串的程序處理，並複數並行進行前述程序處理 用以處理晶圓，而在運轉開始時有必要修復處理室時，則 使用正常的處理室之組，被記載有對於用以運轉裝置之方 法’程序。可是，在用以構成組之處理室中有正常的處理 室時’則分開用以構成該組的處理室全體。 譬如，接連有同種之處理室時，在運轉中使用他方之 正常的處理室對於用以續行運轉之裝置的運轉方法係未被 号慮，係屬運轉率低的裝置。 父’爲了除去程序處理裝置內之異物而進行洗淨處理 -5- (請先閱讀背面之注意事項再填寫本頁) 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480646 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（3 ) ，或關於在進行晶圓處理之前將程序處理裝置內爲了做爲 晶圓處理狀態進行老化處理，也以提高運轉率之觀點並未 充分被考慮。 【發明之槪要】 本發明之目的，係提供一種真空處理裝置的運轉方法 及晶圓的處理方法，使用至少2組以上之程序處理裝置藉由 進行處理真空處理裝置在運轉中，哪組之處理室由於故障 等不能使用時，不被拘束用以構成各2組程序處理裝置之關 係，將正常之處理室做爲處理經路使用並運轉可更提高運 轉率。 本發明之另外目的，係提供一種真空處理裝置的運轉 方法及晶圓的處理方法，關於洗淨處理或老化處理，皆可 提高運轉率。 爲了達成上述目的，本發明之真空處理裝置的運轉方 法’其構成係具有：複數之程序處理裝置，對各晶圓進行一 連串的不同程序處理；運送處理裝置，進行前述晶圓之運送； 控制裝置，用以控制前述各程序處理裝置及運送處理裝置； 而真空處理裝置的運轉方法，係具有至少2組之晶圓的處理 經路含進行各自前述一連串的程序處理之複數的程序處理 裝置’其特徵爲··爲了進行前述各程序處理使各組之各程 序處理裝置進行運轉有效或運轉無效之狀態判斷，以該判 斷僅割斷運轉無效之程序處理裝置，而用以使用運轉有效 之程序處理裝置，爲了進行前述一連串之程序處理用以再 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -6 - I---------I 裝--------訂---------AWI (請先閱讀背面之注意事項再填寫本頁) 480646 A7 B7__ 五、發明說明（4 ) 構築前述處理經路，僅使用該運轉有效之程序處理裝置並 進行前述晶圓之處理。 (請先閱讀背面之注意事項再填寫本頁) 本發明之另外特徵，係進行前述一連串不同之程序處 理使複數之程序處理裝置的2組，含程序處理裝置分別進行 晶圓之第一處理（譬如蝕刻處理）及第二處理（譬如後處 理），並爲了進行前述各程序處理使各組之各程序處理裝 置，進行運轉有效或運轉無效之狀態判斷，以該判斷進行1 組之程序處理裝置之中的第二處理而程序處理裝置係運轉 無效時，則僅割斷進行該第二處理之程序處理裝置，並使 用進行2個之第一處理的程序處理裝置及進行1個之第二處 理的程序處理裝置，用以再構築2組之處理經路爲了進行前 述一連串的程序處理，並使用該2組之處理經路用以進行前 述晶圓之處理。 經濟部智慧財產局員工消費合作社印製 本發明之另外特徵，係一種真空處理裝置的運轉方法 ，其構成係具有：複數之程序處理裝置，對各晶圓進行一連 串的不同程序處理；運送處理裝置，進行前述晶圓之運送；控 制裝置，用以控制前述各程序處理裝置及運送處理裝置； 而爲j進fi則述各程序處理使各組之各程序處理裝置進行 運轉有效或運轉無效之狀態判斷，在前述程序處理裝置產 生運轉無效時，則在該程序處理裝置進行是否餘存晶圓之 判斷，有餘存晶圓時，則將預先被設定之複數的處理條件 之其中之一做爲可選擇，根據該被選擇之處理條件可進行 前述餘存晶圓之處理。 本發明之另外特徵，係一種真空處理裝置的運轉方法 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480646 A7 B7 五、發明說明（5 ) (請先閱讀背面之注意事項再填寫本頁) ，其構成係具有：複數之程序處理裝置，對各晶圓進行一連 串的不同程序處理；連送處理裝置，進行前述晶圓之運送；控 制裝置，用以控制前述各程序處理裝置及運送處理裝置；而 爲了進行前述各程序處理用以設定自動運轉條件之後，在 用以開始自動運轉中，在前述自動運轉條件之設定，關於 卡匣及處理室用以固定複數之一對關係並以運送晶圓之平 行處理經路，或不使前述卡匣及處理室之對應關係固定可 設定處理經路用以運送晶圓到空的處理室。 本發明之另外特徵，係一種真空處理裝置的運轉方法 ，其構成係具有：複數之程序處理裝置，進行程序處理；運送 處理裝置，進行前述晶圓之運送；控制裝置，用以控制此等； 並使至少2個以上之程序處理裝置被安裝於運送處理裝置， 使用該2個以上之程序處理裝置用以處理晶圓，而在用以開 始前述卡匣內之晶圓處理之前，同時用以運送2片假晶圓到 2個之程序處理裝置，以並行用以進行老化處理。 經濟部智慧財產局員工消費合作社印製 本發明之另外特徵’係一種晶圓的處理方法，其構成 係具有：複數之程序處理裝置，對各晶圓進行一連串的不同 程序處理；連送處理裝置’進fr則述晶圓之運送；控制裝置， 用以控制前述各程序處理裝置及運送處理裝置；而晶圓的處 理方法係藉由真空處理裝置具有至少2組之晶圓的處理經路 含進行各自前述一連串的程序處理之複數的程序處理裝置 ，爲了進行前述各程序處理使各組之各程序處理裝置進行 運轉有效或運轉無效之狀態判斷，以該判斷僅割斷運轉無 效之程序處理裝置，而用以使用運轉有效之程序處理裝置 -8 - 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480646 A7 ________B7_____ 五、發明說明（6 ) ’爲了進行則述一連串之程序處理用以再構築前述處理經 (請先閱讀背面之注意事項再填寫本頁) 路’僅使用該運轉有效之程序處理裝置並進行前述晶圓之 處理。 若依據本發明，則可提供真空處理裝置的運轉方法及 晶圓的處理方法，使用2組以上之程序處理裝置並藉由處理 之真空處理裝置在運轉中，哪組之處理室由於故障等在不 能使用時’不被拘束用以構成各2組的程序處理裝置的關係 ，將正常之程序處理裝置做爲處理經路使用並進行運轉可 更提局運轉率。 又’可fcn供一種真空處理裝置的運轉方法及晶圓的處 理方法，即使關於洗淨處理或老化處理，也可提高運轉率 0 【圖式之簡單說明】 圖丨係或不根據本發明之真空處理裝置的一實施例之平 面圖。 圖2係圖1之真空處理裝置中之裝置控制裝備的控制構 成圖。 經濟部智慧財產局員工消費合作社印製 圖3係顯示圖1之真空處理裝置中之裝置控制裝備的運 轉資訊信號圖。 圖4係顯示圖1之真空處理裝置中之裝置控制裝備的處 理順序資訊信號圖。 圖5係圖1之真空處理裝置中，運轉模式之說明圖。 圖6係圖1之真空處理裝置中之裝置控制裝備的自動運 -9- 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 480646 Α7 Β7 五、發明說明（7) 轉之流程圖ϋ 圖7係圖丨之真空處理裝置中，經路指定方法之說明圖 〇 圖8係顯示圖ό之自動運轉流程之詳細流程圖。 圖9係顯示圖1之真空處理裝置中，餘存晶圓之處理條 件的例圖。 圖1 0係根據本發明之洗淨運轉的流程圖。 圖11係顯示圖1之真空處理裝置中，異常發生時之運送 經路變更的動作狀態圖。 圖1 2係顯示圖1之真空處理裝置中，復舊秘訣，再試處 理時的狀態圖。 圖1 3係顯示圖1之真空處理裝置中，並行處理時之干擾 晶圓之回收處理的動作狀態圖。 圖1 4係顯示圖1之真空處理裝置中，由維修模式之自動 運轉時的狀態圖。 圖1 5係顯示根據本發明之連串老化處理時之狀態圖。 圖1 6係顯示根據本發明之真空處理裝置之其他實施例 的平面圖。 【元件編號之說明】 1…運送處理裝置， 2 - 1〜2 - 4…程序處理裝置， 3…裝載鎖定室’ 4 ...下載鎖定室 4，5…真空機械人， 6…空氣運送裝置， 7、7-1〜7-3卡匣， 8···空氣機械 人’ 1 1…主控制部，1 2、2 3…中央控制裝置， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) — ！— 訂··-------- 經濟部智慧財產局員工消費合作社印製 -10- 五、 發明說明（8) U、26…顯示裝置，14、25…輸入裝置，15〜裝置控 制裝備，16.··處理順序資訊記憶裝置，17…運轉資訊 h唬記憶裝置，19-1〜19-4…運轉資訊信號，20、21·· 通訊裝置，22、25、26…補助操作盤，24…終端控制 裝置。 【發明之實施形態】 以下，將本發明之一實施例顯示於圖1〜圖Μ。 圖1係原爲本發明之一實施例的真空處理裝置一實施例 之構成圖。該實施例之真空處理裝置，係使4室之程序處理 衣置被連接於1個之運送處理裝置，在處理裝置爲了用以搬 入晶圓之卡匣係設置於處理裝置本體之前設置於空氣運送 裝置’由該卡匣1片丨片取出並搬入於處理裝置顯示處理之 裝置構成。尙有，程序處理裝置，係比4室更多被連接也無 妨。 圖1中，2 - 1〜2 - 4，係程序處理裝置進行晶圓之程序處 理。做爲該處理裝置，係蝕刻處理，後處理，成膜，濺射 ，C V D，水處理等，若有進行晶圓之程序處理的處理，則 任何皆可。1係運送處理裝置進行晶圓之運送，將裝載鎖定 室3之晶圓根據晶圓之運送預定計畫運送到程序處理裝# 卜2-4，在某程序處理裝置將處理終了之晶圓運送到其；:欠$ 程序處理裝置，並將全部之程序處理終了的晶圓運送_ τ 載鎖定室4室。 裝載鎖定室3係將在空氣運送裝置6之晶圓搬入到_ _ (請先閱讀背面之注意事項再填寫本頁) 訂----------擎 經濟部智慧財產局員Η消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -11 - 480646 A7 B7 五、發明說明（9 ) (請先閱讀背面之注意事項再填寫本頁) 處理裝置之室，而下載鎖定室4將在真空處理室之晶圓搬出 到空氣運送裝置6之室。5係真空機械人被設置於運送處理 置內並進行晶圓之連送，6係空氣運送裝置爲了設置收容 晶圓之卡匣，7係卡匣用以收容處埋之晶圓並分有用以收容 製品用晶圓之卡匣及用以收容洗淨用晶圓之卡匣。8係空氣 機械人’將空氣運送裝置上之卡匣內的晶圓由卡匣搬出， 並搬入到裝載鎖定室3，又將下載鎖定室4之晶圓送回到原 來之卡匣。1 1係主控制部用以控制裝置全體，具有顯示裝 置丨3 ’輸入裝置丨4。操作者，係使用該顯示裝置丨3，輸入 裝置14對主控制部1 1進行運轉條件之設定後進行運轉之開 始指示。 1 9- 1〜1 9-4，係運轉資訊信號產生裝置用以產生運轉資 訊信號顯示程序處理裝置2-1〜2-4之運轉有效/無效。本 實施例，係設於程序處理裝置，但在設於何處皆可。 經濟部智慧財產局員工消費合作社印製 又，使用在補助操作盤2 2內之顯示裝置2 6，輸入裝置 25 ’可進行爲了用以保養、維修真空處理裝置之操作。該 補助操作盤22係可搬型之操作終端（譬如筆記型個人電腦 )，搬運到真空處理裝置之附近爲止，用以目視裝置狀態 同時將被顯示於顯示裝置26之裝置資訊（譬如輸出入二進 制位之ON / OFF資訊，錯誤資訊等）可活用於保養、維修 之操作，使保養、維修之操作性提高。在該補助操作盤22 ，係具有與主控制部1 1同樣機能，但爲了對操作者確保安 全性同時進行主控制部1 1及補助操作盤2 2時，則只能有· 方可操作輸入設有誤操作防止機能。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -12- 480646480646 A7 B7 5. Description of the invention (1) [Background of the invention] [Field of the invention] (Please read the precautions on the back before filling out this page) The present invention relates to the operation method of the vacuum processing device and the method of processing wafers' A program processing device that performs program processing and a transport processing device that performs wafer transfer are configured to perform wafer processing using at least two program processing devices. [Previous technology] The vacuum processing device of the conventional technology is, for example, Japanese Patent Laid-Open No. 6 3-1 3 3 5 3 2 in a system for connecting a processing room to a transportation room. When the sample processing is carried out under normal operating conditions, separate wafers are simultaneously executed in separate processing chambers, or the wafers can be processed by two or more processing chambers and their transportation. Still other related vacuum processing devices are, for example, Japanese Patent (Laid-Open) Publication No. 3-274746, which simultaneously processes the processes of two routes, and when the processing room contained in one route is used for maintenance operations. , Then the processing room of the other route is used in a transitional way for the operation method of the two process routes. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and disclosed in Japanese Patent Application Laid-Open No. 1 1-67 869, which is used to generate various operation information signals indicating whether the operation of each program processing device is effective or invalid. The generating device is set in each program processing device, and an operation information signal storage device is set to memorize each operation information signal, restore each operation information signal without using the program processing device whose operation is invalid, and use another program processing device which is effective in operation. Equipped with device control equipment. 4 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 public love) 480646 A7 ____B7___ V. Description of the invention (2) The aforementioned Japanese Patent Application Laid-Open No. 63- 1 3 35 3 No. 2 or Japanese Patent Application Laid-Open No. 3-274746 The vacuum processing device of the bulletin refers to the operation in which two or more processing chambers are used as a processing path and is running. For which processing chamber cannot be used due to a failure, etc., a normal processing chamber is used for continuous processing. The operation and restoration process have not been considered. In addition, two or more processing chambers are used as a processing path, and the operation is temporarily interrupted during the operation. Until the interruption, the unused processing chamber is used as a processing path and prioritized. The operation method for executing the insertion process and continuing the temporarily interrupted process after the end of the insertion process is not considered for the order. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, Japanese Patent Laid-Open No. 1 1-67869 is a method for operating a vacuum processing device. Its structure includes a plurality of program processing devices that perform a series of different programs on each wafer. Processing; transportation processing device for carrying out the aforementioned wafer transportation; and control device for controlling the foregoing program processing device and transportation processing device; and a method for operating a vacuum processing device having a plurality of program processing devices including at least 2 The processing path of the group of wafers is used to perform the aforementioned series of procedures, and the foregoing processes are performed in parallel to process the wafers. When it is necessary to repair the processing chamber at the beginning of the operation, the normal processing chamber is used. The group describes the procedure for the method used to operate the device. However, when there are normal processing chambers among the processing chambers constituting the group, the entire processing chambers constituting the group are separated. For example, when successive processing chambers of the same type are used, the normal processing chamber of the other party is used during operation, and the operation method of the device for continuous operation is not considered, and it is a device with a low operation rate. "Father's cleaning process in order to remove foreign objects in the program processing device -5- (Please read the precautions on the back before filling in this page) The size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) 480646 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (3), or regarding the aging treatment of the program processing device as the wafer processing state before the wafer processing, to improve the operating rate This view is not fully taken into account. [Summary of the invention] The object of the present invention is to provide a method for operating a vacuum processing apparatus and a method for processing a wafer. At least two sets of program processing apparatuses are used to process the vacuum processing apparatus during operation. When the processing room is unavailable due to malfunctions, it is not restricted to form the relationship between the two sets of program processing devices. Using and operating a normal processing room as a processing path can increase the operating rate. Another object of the present invention is to provide a method for operating a vacuum processing apparatus and a method for processing a wafer. Regarding a cleaning process or an aging process, the operation rate can be improved. In order to achieve the above-mentioned object, the operation method of the vacuum processing apparatus according to the present invention has a configuration including a plurality of program processing apparatuses that perform a series of different program processes on each wafer; a transport processing apparatus that performs the aforementioned wafer transport; a control apparatus To control each of the aforementioned program processing apparatuses and transport processing apparatuses; and the operation method of the vacuum processing apparatus is a process path having at least two sets of wafers including a plurality of program processing apparatuses that perform the aforementioned series of program processing, respectively. The characteristics are: In order to perform the foregoing program processing, each program processing device of each group is judged as to whether the operation is valid or invalid. Based on the judgment, only the program processing device that is invalid is cut off, and the program processing device that is effective is used. In order to carry out the above-mentioned series of procedures, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -6-I --------- I equipment ---- ---- Order --------- AWI (Please read the precautions on the back before filling out this page) 480646 A7 B7__ V. Description of the invention (4) Constructing the aforementioned treatment process Only the program processing device which is effective in operation is used and the aforementioned wafer processing is performed. (Please read the precautions on the back before filling this page) Another feature of the present invention is to perform the aforementioned series of different program processing to make two sets of plural program processing devices, including the program processing device to perform the first processing of the wafers respectively ( For example, etching processing) and second processing (such as post-processing), and in order to perform the foregoing program processing, each program processing device of each group is judged as to whether the operation is effective or invalid, and a set of program processing devices is performed based on the judgment. When the second processing process is ineffective and the program processing device is ineffective, only the program processing apparatus that performs the second processing is cut off, and the program processing apparatus that performs two first processings and the one that performs one second processing are used. A program processing device is used to construct two sets of processing paths in order to perform the aforementioned series of program processing, and uses the two sets of processing paths to perform the aforementioned wafer processing. Another feature of the invention printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is a method for operating a vacuum processing device, which is composed of a plurality of program processing devices that perform a series of different program processing on each wafer; a transport processing device To carry out the aforementioned wafer transportation; the control device is used to control the aforementioned program processing devices and the transport processing devices; and the state of each program processing is to make each program processing device of each group effective or invalid. It is judged that when the foregoing program processing device has an invalid operation, the program processing device determines whether there is a remaining wafer, and when there is a remaining wafer, one of a plurality of processing conditions set in advance is made possible. Select, according to the selected processing conditions, the aforementioned remaining wafers can be processed. Another feature of the present invention is a method for operating a vacuum processing device. The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 480646 A7 B7 V. Description of the invention (5) (Please read the note on the back first (Please fill in this page again for more information), its structure is: a plurality of program processing devices, which perform a series of different program processing on each wafer; the processing device is connected to carry the aforementioned wafers; and the control device is used to control the aforementioned programs Processing device and transport processing device; and for performing the foregoing program processing to set the automatic operation conditions, in order to start the automatic operation, in the setting of the foregoing automatic operation conditions, the cassette and the processing chamber are used to fix one of the plurality A parallel processing path for transporting wafers or a fixed relationship between the aforementioned cassettes and processing chambers may not be fixed. A processing path may be set to transport wafers to an empty processing chamber. Another feature of the present invention is a method for operating a vacuum processing apparatus, which is composed of a plurality of program processing apparatuses for performing program processing; a transport processing apparatus for performing the aforementioned wafer transport; and a control device for controlling these; At least two or more program processing apparatuses are installed in the transport processing apparatus, and the two or more program processing apparatuses are used to process the wafers, and are used to simultaneously process the wafers in the cassette before starting to process the wafers. Conveys 2 dummy wafers to 2 program processing units for parallel aging. Another feature of the invention printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is a method for processing wafers, the composition of which includes: a plurality of program processing devices that perform a series of different program processing on each wafer; 'In fr, the wafer is conveyed; the control device is used to control the foregoing program processing device and the conveying processing device; and the wafer processing method includes a vacuum processing device having at least two sets of wafer processing paths including In order to perform the aforementioned program processing, each of the plural program processing apparatuses performs a series of state judgments on whether the program processing apparatuses of the respective groups are effective or invalid, and judges only the program processing apparatuses whose operation is invalid. And to use the effective program processing device-8-This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 480646 A7 ________B7_____ 5. Description of the invention (6) 'For the sake of execution, a series of Program processing is used to reconstruct the aforementioned processing script (please read the precautions on the back before filling this page) The circuit 'uses only the program processing apparatus which is effective in operation and performs the aforementioned wafer processing. According to the present invention, a method for operating a vacuum processing apparatus and a method for processing a wafer can be provided. Two or more sets of program processing apparatuses are used and the processing vacuum processing apparatus is in operation. Which group of processing chambers are at fault due to a failure or the like. When it is unavailable, it is not restricted to the relationship between the two sets of program processing devices, and normal program processing devices can be used as processing channels and operated to increase the operating rate. It is also possible to provide a method for operating a vacuum processing device and a method for processing a wafer, which can improve the operation rate even with regard to cleaning processing or aging processing. A plan view of an embodiment of a vacuum processing apparatus. FIG. 2 is a control configuration diagram of the device control equipment in the vacuum processing device of FIG. 1. FIG. Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 3 is a signal diagram showing the operation information of the device control equipment in the vacuum processing device of Figure 1. FIG. 4 is a signal diagram showing the processing sequence information of the device control equipment in the vacuum processing device of FIG. 1. FIG. FIG. 5 is an explanatory diagram of an operation mode in the vacuum processing apparatus of FIG. 1. FIG. Figure 6 is the automatic operation of the device control equipment in the vacuum processing device of Figure 1. -9- This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) 480646 Α7 Β7 V. Description of the invention (7) Figure 7 is a flow chart of the method for specifying the route in the vacuum processing device of Figure 丨 Figure 8 is a detailed flowchart of the automatic operation flow of Figure 6. FIG. 9 is a diagram showing an example of processing conditions of the remaining wafers in the vacuum processing apparatus of FIG. 1. FIG. FIG. 10 is a flowchart of a washing operation according to the present invention. Fig. 11 is a diagram showing the operation state of the conveyance path when the abnormality occurs in the vacuum processing apparatus of Fig. 1; Fig. 12 is a diagram showing the state of the old method in the vacuum processing apparatus of Fig. 1 when re-treating. Fig. 13 is a diagram showing the operation state of the wafer recycling process in the vacuum processing apparatus of Fig. 1 during the parallel processing. Fig. 14 is a diagram showing the state of the vacuum processing apparatus of Fig. 1 when it is automatically operated in the maintenance mode. Fig. 15 is a diagram showing a state during a series of aging treatments according to the present invention. Fig. 16 is a plan view showing another embodiment of the vacuum processing apparatus according to the present invention. [Description of component numbers] 1 ... transport processing device, 2-1 ~ 2-4 ... program processing device, 3 ... load lock room '4 ... download lock room 4,5 ... vacuum robot, 6 ... air delivery device , 7, 7-1 ~ 7-3 cassettes, 8 ... Air Manipulators' 1 1… Main Control Department, 1 2, 2 3… Central Control Device, This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) (Please read the notes on the back before filling out this page) —! — Order ·· -------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -10- V. Description of the invention (8) U, 26 ... display device, 14, 25 ... input device, 15 ~ device control Equipment, 16. ·· Processing sequence information memory device, 17 ·· Operation information h 唬 memory device, 19-1 ~ 19-4 ················································ Communication devices, 22, 25, 26 ... auxiliary operation panel , 24 ... terminal control device. [Embodiment of the invention] An embodiment of the present invention is shown below in FIGS. 1 to M. Fig. 1 is a structural diagram of an embodiment of a vacuum processing apparatus which is an embodiment of the present invention. The vacuum processing apparatus of this embodiment is such that the four-chamber process processing clothes are connected to one transport processing apparatus, and the cassette is installed in the air transport before the cassette of the processing apparatus is used to carry the wafer. The device 'is constituted by a device for taking out one piece of the cassette and carrying it into a processing device for display processing. No, the program processing device is connected more than 4 rooms. In Fig. 1, 2-1 to 2-4 are the program processing equipment for the wafer processing. As the processing device, it is an etching process, post-processing, film formation, sputtering, CVD, water treatment, etc., and any processing is possible if there is a process for performing wafer processing. The first series of processing equipment carries wafers, and the wafers in the load lock chamber 3 are transferred to the program processing equipment according to the scheduled schedule of wafer transportation. # 2-4, the finished wafers are transported in a certain program processing equipment To it ;: owe $ to the program processing device, and transport all the finished wafers to the processing _ τ load lock chamber 4 room. The load lock chamber 3 is used to carry the wafers in the air transport device 6 to _ _ (Please read the precautions on the back before filling this page) Order ---------- Member of the Intellectual Property Bureau of the Ministry of Economy The paper size printed by the cooperative is applicable to China National Standard (CNS) A4 (210 X 297 mm) -11-480646 A7 B7 V. Description of the invention (9) (Please read the precautions on the back before filling this page) Processing device And the download lock chamber 4 carries the wafers in the vacuum processing chamber to the chamber of the air transport device 6. The 5 series vacuum robot is installed in the transport processing unit and performs wafer continuous transfer. The 6 series air transport device is used to set a cassette for accommodating wafers. The 7 series cassette is used to store wafers buried in the storage area and divided into A cassette for accommodating wafers for products and a cassette for accommodating wafers for cleaning. The 8 series air robot ′ removes the wafers in the cassettes on the air conveying device from the cassettes and loads them into the load lock chamber 3, and sends the wafers in the download lock chamber 4 back to the original cassette. The 1 1 series main control unit is used to control the entire device, and has a display device 3 and an input device 4. The operator uses the display device 3, and the input device 14 sets the operating conditions for the main control section 11 and instructs the start of the operation. 1 9- 1 ~ 1 9-4 is the operation information signal generating device used to generate the operation information signal display program processing devices 2-1 to 2-4. The operation is valid / invalid. This embodiment is provided in a program processing device, but may be installed anywhere. Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Furthermore, the display device 26 used in the auxiliary operation panel 22 and the input device 25' can be used for maintenance and repair of the vacuum processing device. The auxiliary operation panel 22 is a portable operation terminal (such as a notebook personal computer) and is carried near the vacuum processing device to visually display the device status and display device information (such as input and output binary bits) on the display device 26 ON / OFF information, error information, etc.) can be used for maintenance and repair operations to improve the operability of maintenance and repair. The auxiliary operation panel 22 has the same function as the main control unit 11; however, when the main control unit 11 and the auxiliary operation panel 22 are simultaneously performed to ensure the safety of the operator, only the operation input can be performed. Equipped with misoperation prevention function. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -12- 480646

經濟部智慧財產局員工消費合作社印製 五、發明說明（1〇) 圖2係顯示本實施例之控制裝置的構成圖。本實施例， 係顯示使裝置全體之主控制部1 1被搭載於運送處理裝置1的 情形。做爲控制裝置，係僅記述選出有關本發明之特徵的 部分，對於啓動裝置必要的輸出入控制部分（DI /〇、 AI /〇 )，係未記述。尙有，裝置全體之主控制部1丨，係在 運送處理裝置以外也無妨。又顯示裝置1 3，輸入裝置1 4係 與主控制部1 1做爲另外之控制單元的構成也可。 12係中央控制裝置譬如CPU (Central Processor Unit) ° Π係顯示裝置，進行運轉狀態，運轉條件之設定內容， 運轉之開始指示/終了之顯示，譬如CRT。14係輸入裝置 ’進行運轉條件之設定，運轉之開始指示輸入，程序處理 條件，保養或維修之操作輸入等，譬如鍵盤。1 6係處理順 序資訊記憶裝置，用以記憶真空處理裝置內之晶圓的處理 順序’譬如RAM (Random Access Memory)。該晶圓之處 理順序，係在運轉開始前使用顯示裝置丨3，輸入裝置1 4藉 由操作者使被輸入之數據被記憶。1 7係運轉資訊信號記憶 裝置’用以記憶運轉資訊信號顯示程序處理裝置2-1〜2-4之 運轉有效/無效，譬如R A Μ。 1 5係裝置控制裝備’用以判斷運轉資訊信號狀態顯示 上述程序處理裝置2-1〜2-4之運轉有效/無效，在自動運 中使程序處理裝置2-1〜2-4之哪個即使成爲不可運轉而不使 用該程序處理裝置，使用其他之程序處理裝置用以記憶續 行運轉之處理順序的裝置’譬如R〇M ( R e a d〇η 1 y M e m 〇 r y )-上述丨3〜1 7 ’係藉由中央控制裝置丨2被控制。 I.--->------裝--------訂---------AWI (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13- 480646 A7 B7 五、發明說明（11) 做爲運轉貝$丨目5虎產生裝置1 9 - 1〜1 9 - 4用以產生運轉畜 訊信號，係 1 )使用程序處理裝置之裝置電源的遮斷信號，或 2 )使用運轉切換信號（譬如，切換開關）用以設定程序處 理裝置之使用有效/無效，或 3 )做爲運轉控制信號顯示程序處理裝置之使用有效/無 效，使用者可使用設定輸入之輸入資訊。 20及2 1係通訊裝置，用以連接控制裝置全體之主控制 部11及補助操作盤22。補助操作盤22、25、26係使用於上 述之用途。24係終端控制裝置，以補助操作盤用以控制終 端功能並用以記憶處理順序」2 3係中央控制裝置由上述2 1 、24用以控制 26，譬如，CPU ( Central Processor Unh )。 在通常之運轉時，操作者，係將收容製品用晶圓之卡 匣7-1 (或7-2 )及收容洗淨用晶圓之卡匣7-3設置於空氣運 送裝置6。使用顯示裝置1 3，輸入裝置14進行運轉條件之設 定後進行運轉開始指示。使運轉被開始則開始晶圓之搬送 並被搬送到程序處理裝置2-1 (含2-2〜2-4 )，進行程序處 理被返回到原來之卡匣。使原來之卡匣內的晶圓全部被處 理則爲了該卡匣之回收進行該圖未圖示之警報器警鳴，用 以通報卡匣回收要求給操作者，使操作者拿掉卡匣。 終了收容製品用晶圓之卡匣的處理，則由卡匣7-3將洗 淨用晶圓搬出到程序處理裝置2-1、2-2、2-3、2-4，進行 洗淨處理並返回到卡匣7-3。該情形，使用1片之洗淨用假 晶圓依順序搬出到程序處理裝置2-1、2-2、2_3、2-4，也 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (10) Fig. 2 is a block diagram showing the control device of this embodiment. This embodiment shows a case where the main control unit 11 of the entire apparatus is mounted on the transport processing apparatus 1. As the control device, only the part which selects the characteristics of the present invention is described, and the input / output control part (DI / 〇, AI / 〇) necessary for starting the device is not described. Yes, the main control unit 1 of the entire device may be other than the transport processing device. The display device 13, the input device 14 and the main control unit 11 may be configured as separate control units. 12 series central control devices, such as CPU (Central Processor Unit) ° Π series display devices, perform the running status, the setting content of the operating conditions, the start / end indication of operation, such as CRT. 14 series input device ’Set the operation conditions, input the start instruction of operation, program processing conditions, and maintenance or repair operation input, such as the keyboard. The 16-series processing sequence information storage device is used to memorize the processing sequence of wafers in the vacuum processing device, such as RAM (Random Access Memory). This wafer processing sequence uses the display device 3 before the operation starts, and the input device 1 4 memorizes the input data by the operator. 1 7 series operation information signal storage device 'is used to memorize the operation information signal display program processing devices 2-1 to 2-4, such as R A M. 1 5 series device control equipment 'is used to judge the status of the operation information signal and show that the operation of the above-mentioned program processing devices 2-1 to 2-4 is valid / invalid. During automatic operation, which of the program processing devices 2-1 to 2-4 is enabled. It becomes inoperable without using the program processing device, and a device that uses other program processing devices to memorize the processing sequence of continuous operation. For example, ROM (R ead〇η 1 y M em 〇ry)-the above 3 ~ 1 7 'is controlled by the central control unit 2. I .--- > ------ install -------- order --------- AWI (Please read the precautions on the back before filling this page) This paper size applies China National Standard (CNS) A4 specification (210 X 297 mm) -13- 480646 A7 B7 V. Description of the invention (11) As a running shell $ 丨 目 5 Tiger generating device 1 9-1 ~ 1 9-4 for Generate running animal signals, 1) use the power-off signal of the device of the program processing device, or 2) use the operation switching signal (for example, a switch) to set whether the use of the program processing device is enabled / disabled, or 3) do In order to show whether the use of the program processing device is enabled / disabled by the operation control signal, the user can use the input information of the setting input. 20 and 21 are communication devices for connecting the main control unit 11 and the auxiliary operation panel 22 of the entire control device. The auxiliary operation panels 22, 25, and 26 are used for the aforementioned purposes. The 24 series terminal control device is used to assist the operation panel to control the terminal functions and used to memorize the processing sequence. 2 The 3 series central control device is used by the above 2 1 and 24 to control 26, such as CPU (Central Processor Unh). In normal operation, the operator sets the cassette 7-1 (or 7-2) for storing wafers for products and the cassette 7-3 for cleaning wafers in the air transport device 6. Using the display device 13 and the input device 14 to set the operation conditions, the operation start instruction is given. When the operation is started, the wafer transfer is started, and the wafer is transferred to the program processing apparatus 2-1 (including 2-2 to 2-4), and the program processing is returned to the original cassette. If all the wafers in the original cassette are processed, an alarm not shown in the figure is sounded for the recycling of the cassette, so as to notify the operator of the cassette recycling request, so that the operator can remove the cassette. After the processing of the cassette containing the product wafer is finished, the cleaning wafer is carried out by the cassette 7-3 to the program processing apparatus 2-1, 2-2, 2-3, and 2-4 for cleaning processing. And return to cassette 7-3. In this case, one piece of dummy wafer for cleaning is sequentially carried out to the program processing equipment 2-1, 2-2, 2_3, 2-4, and this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling this page)

ϋ n ϋ 一-ov ϋ ϋ ϋ ϋ ϋ I I I I 經濟部智慧財產局員工消費合作社印製 -14- 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（12) 可進行洗淨處理，又做爲另外方法係搬送1片1片到程序處 理裝置2-1、2-2、2-3、2-4，也可同時進行洗淨處理。又 前述之洗淨處理係終了收容製品用晶圓之卡匣的處理，則 由卡匣7-3將洗淨用假晶圓搬出到程序處理裝置2- 1、2-2、 2-3、2_4，並進行洗淨處理，但不將洗淨用假晶圓搬出到 程序處理裝置2-1、2-2、2-3、2-4也可進行洗淨處理。 又，如以上在1卡匣分之製品用晶圓之處理終了後加上 進行洗淨處理，做爲洗淨周期在處理之製品晶圓的各片數 (該片數係可適當設定）由卡匣7-3將洗淨用假晶圓搬出到 程序處理裝置2-1、2-2、2-3、2-4，也可進行洗淨處理。 又做爲洗淨周期在處理之製品晶圓的各片數（該片數係可 適當設定）由卡匣7-3不將洗淨用假晶圓搬出到程序處理裝 置2-1、2-2、2-3、2-4，也可進行洗淨處理。又，使收容 製品用晶圓之卡匣的處理在預先被設定之卡匣數實施後， 由卡匣7-3將洗淨用假晶圓搬出到程序處理裝置2-1、2-2、 2-3、2-4，也可進行洗淨處理。 其次，在收容製品晶圓之卡匣的處理開始前由卡匣7-3 不將假晶圓搬出到程序處理裝置2-1、2-2、2-3、2-4，在 老化處理後也可進行上述晶圓處理。又，在收容製品晶圓 之卡匣的處理開始前由卡匣7-3將假晶圓搬出到程序處理裝 置2-1、2-2、2-3、2-4，在老化處理後將假晶圓返送到卡 匣7-3，並將本老化處理在預先設定之晶圓片數實施後也可 進行上述晶圓處理。 尙有，在運轉條件設定之一部分的處理經路之設定中 (請先閱讀背面之注意事項再填寫本頁) --裝 ----訂---------^-· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -15- 480646 A7 ___B7__ 五、發明說明（13) ’將使用於該處理之程序處理裝置依晶圓之處理順序使用 程序處理裝置之記號等進行設定。 (請先閱讀背面之注意事項再填寫本頁) 圖3係本實施例之運轉資訊的信號圖。在各程序處理裝 置被記憶顯示運轉有效/無效之資訊。該情形，有效時，則 顯示1，無效時，則顯示0若有可區別之內容，則以記號或 數字皆可。該資訊，係被反應運轉資訊信號產生裝置1 9- 1〜 1 9_4的信號狀態，被記憶於運轉資訊信號記憶裝置丨7。 圖4係本實施例之處理順序資訊圖。做爲運轉條件設定 之一 ’係使操作者在運轉開始前使用顯示裝置1 3，輸入裝 置14用以設定晶圓處理之順序的資訊。該資訊係被記憶於 處理順序資訊記憶裝置。 圖5所示係將該晶圓之處理順序的一例，做爲運轉模式 〇 經濟部智慧財產局員工消費合作社印製 以下以該運轉模式之說明則程序處理裝置2-2及2-3係 進行同一之程序處理（本實施例係做爲蝕刻處理），而程 序處理裝置2 - 1及2 - 4係進行同一之程序處理（本實施例係 做爲後處理）加以說明。又做爲程序處理之實施例，係進 行使用程序處理裝置2-2或2-3之蝕刻處理之後，進行使用 程序處理裝置2-1或2-4之後處理。尙有，在1卡匣分之製品 用晶圓的處理後由卡匣7-3將洗淨用晶圓由程序處理裝置2一 3 C或2-2 )搬出到程序處理裝置2-4 (或2-1 )，對於進行 洗淨處理之運轉加以說明。 但，本發明，係並不被限定於圖5之運轉模式，藉由晶 圓之處理條件則僅蝕刻處理也可。又，程序處理裝置2〜2及ϋ n ϋ I-ov ϋ ϋ ϋ ϋ ϋ IIII Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-14- 480646 A7 B7 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) Can be cleaned As another method, one piece is transferred to the program processing devices 2-1, 2-2, 2-3, and 2-4, and the washing process can be performed at the same time. Moreover, the aforementioned cleaning processing is the processing of the cassette for accommodating the wafers for the products, and the dummy wafers for cleaning are carried out by the cassette 7-3 to the program processing apparatus 2-1, 2-2, 2-3, 2_4, and the cleaning process is performed, but the cleaning wafer can also be cleaned without carrying out the dummy wafer for cleaning to the program processing apparatuses 2-1, 2-2, 2-3, and 2-4. In addition, as described above, after the processing of the wafers for the products in one cassette is completed, a cleaning process is added, and the number of wafers of the processed wafers in the cleaning cycle (the number of wafers can be appropriately set) is The cassette 7-3 can carry out cleaning dummy wafers to the program processing apparatuses 2-1, 2-2, 2-3, and 2-4, and can also perform cleaning processing. It is also used as the number of wafers of the processed product wafer in the cleaning cycle (the number of wafers can be appropriately set). The cassette 7-3 does not carry the cleaning fake wafers out to the program processing apparatus 2-1, 2- 2, 2-3, 2-4, can also be washed. In addition, after the processing of the cassette for storing product wafers is performed in a preset number of cassettes, the dummy wafers for cleaning are carried out by the cassette 7-3 to the program processing apparatuses 2-1, 2-2. 2-3, 2-4, can also be washed. Secondly, the cassette 7-3 does not carry the fake wafer out to the program processing apparatus 2-1, 2-2, 2-3, and 2-4 before the processing of the cassette containing the product wafer is started. After the aging process, The above-mentioned wafer processing may also be performed. In addition, before the processing of the cassette containing the product wafer is started, the dummy wafer is carried out by the cassette 7-3 to the program processing apparatuses 2-1, 2-2, 2-3, and 2-4. The dummy wafer is returned to the cassette 7-3, and the above-mentioned wafer processing can also be performed after the aging process is implemented in a preset number of wafers.尙 Yes, in the setting of the processing route as part of the setting of the operating conditions (please read the precautions on the back before filling this page) --------------------------- The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -15- 480646 A7 ___B7__ V. Description of the invention (13) 'The program processing device that will be used for this process will use the process according to the processing order of the wafer Set the device symbol, etc. (Please read the precautions on the back before filling this page.) Figure 3 is a signal diagram of the operation information of this embodiment. In each program processing unit, the effective / invalid information is displayed. In this case, 1 is displayed when it is valid, 0 is displayed when it is not valid. If there is distinguishable content, either a mark or a number can be used. This information is a signal state of the operation information signal generating device 19- 1 to 19_4, and is stored in the operation information signal storage device 丨 7. FIG. 4 is a processing sequence information diagram of this embodiment. As one of the setting of the operation conditions, the operator uses the display device 13 before the start of the operation, and inputs information of the device 14 to set the order of wafer processing. The information is stored in the processing sequence information storage device. Figure 5 shows an example of the processing sequence of this wafer as the operation mode. It is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The following description of this operation mode is performed by the program processing devices 2-2 and 2-3. The same program processing (this embodiment is used as an etching process), and the program processing devices 2-1 and 2-4 perform the same program processing (this embodiment is used as a post-processing) will be described. As another embodiment of the program processing, after performing the etching processing using the program processing apparatus 2-2 or 2-3, the processing is performed after using the program processing apparatus 2-1 or 2-4. Yes, after processing the wafers for products in one cassette, the cassettes 7-3 carry the cleaning wafers out of the program processing apparatus 2-3 C or 2-2) to the program processing apparatus 2-4 ( Or 2-1), the operation for performing the cleaning process will be described. However, the present invention is not limited to the operation mode shown in Fig. 5, and only the etching process may be used depending on the processing conditions of the wafer. The program processing devices 2 to 2 and

480646 A7 B7 五、發明說明（14) 2-3與程序處理裝置2-1及2-4，若進行蝕刻處理，後處理， 成膜，濺射，CDV，水處理等，晶圓之程序處理之處理， (請先閱讀背面之注意事項再填寫本頁) 則任何組合皆可。又，進行同一之程序處理的處理室之數 ，在實施例之數也不必限定。 1 ) 1卡匣1秘訣（r e c i p e )並列運轉 同一之程序處理條件（以下，將程序處理條件稱爲秘 訣）下由被收容處理之晶圓的卡匣內之最下段或最上段晶 圓，依順序由卡匣選出並搬送到運送處理裝置進行程序處 理。晶圓，係使用在程序處理裝置2-2進行蝕刻處理後在程 序處理裝置2- 1進行後處理並返回到原來之卡匣的經路（稱 爲經路A )，及在程序處理裝置2-3進行蝕刻處理後在程序 處理裝置2-4進行後處理並返回到原來之卡匣的經路（稱爲 經路B )。 以本實施例之處理順序係， 經路Α··卡匣7_1—程序處理裝置2-2—程序處理裝置2-1 —卡匣7- i 經路B:卡匣7-1—程序處理裝置2-3—程序處理裝置2-4 經濟部智慧財產局員工消費合作社印製 —卡丨里7 - 1 經路C:卡匣7-1—程序處理裝置2-2—程序處理裝置2-4 —卡匣7 - 1 經路D:卡匣7-1—程序處理裝置2-3—程序處理裝置2-1 —卡匣7 — 1 之組合也可。 -17- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 480646 A7 B7 五、發明說明（15) 晶圓之處理，則以第1片之晶圓係經路a，第2片係經路 B，第3片之晶圓係經路A，第4片係經路B，…之順序進行卡 匣內之最後晶圓爲止之處理。 圖6係顯不本實施例之裝置運轉流程圖。操作者係在運 轉開始前做爲處理裝置被構成之程序處理裝置內，由於故 障等不能使用’或爲了保養（含等離子體洗淨）不使用用 以判斷是否有程序處理裝置（30)。若有不能使用（或， 不使用）程序處理裝置，則使用運轉資訊信號產生裝置i 9 進行設定成記述於圖3之狀態（3 2 )。做爲該設定方法之一 1 )使用程序處理裝置之裝置電源的遮斷信號時，將該程序 處理裝置之裝置電源供給用電磁開關器呈OFF狀態。藉此， 使遮斷信號產生，並傳達到運轉資訊信號記憶裝置丨7，做 爲被記載於圖3之資訊並被記憶。 2 )使用運轉切換信號（譬如，切換開關）用以設定程序處 理裝置之有無使用時，則將分配於該程序處理裝置之切換 開關設定呈有效或無效之狀態。藉此，使切換信號進行確 定’並傳達到運轉資訊信號記憶裝置丨7，做爲被記載於圖3 之資訊並被記憶。 3)做爲運轉控制信號顯示程序處理裝置之使用有效/無效 ，使操作者使用設定輸入之輸入資訊時，操作者，係將分 於該程序處理裝置之設定資訊由輸入裝置1 4進行輸入。藉 此，使設定資訊進行確定，並傳達到運轉資訊信號記憶裝 置17，做爲被記載於圖3之資訊並被記憶。決定裝置連接構 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1·---.------·装--------訂 -------- (請先閱讀背面之注意事項再填寫本頁) 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（16) 成之後，用以設定自動運轉條件（34 )，用以開始自動運 轉（36 )。 在自動運轉條件之設定（34 )，係將晶圓處理之順序 ，做爲如下製品處理條件加以設定。 1)用以選擇晶圓之運轉模式。 選擇^ 1卡匣1秘訣並列」，「2卡匣1秘訣並列」，「2 卡匣2秘訣並列」，「1卡匣1秘訣直列」之其中之一 2 )用以設定晶圓之運送經路。 在各卡匣將晶圓之處理經路使用程序處理裝置之記號 用以設定平行或串聯處理。將代表性的設定例顯示於如下 。（晶圓處理經路，係如前述可組合） 2-1 )平行處理之情形： 卡匣 7 —1:E1—A1，卡匣 7 - 1:E2—A2 卡匣 7-2:Ε1— A1，卡匣 7 —2:E2—A2 El:程序處理裝置2-2，E2:程序處理裝置2-3 A 1:程序處理裝置2-1，A2:程序處理裝置2-4 2-2 )串聯處理之情形： 卡匣 7- 1:E1— E2-> A1 卡匣 7-2··Ε2— El— A2 3 )在各程序處理室用以設定程序處理條件（也稱爲程 序秘訣）。 圖7係做爲自動運轉條件之設定（34 )的一例，用以指 (請先閱讀背面之注意事項再填寫本頁) 裝 tr---------Φ1. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -19- 480646 A7 B7 五、發明說明（17) (請先閱讀背面之注意事項再填寫本頁) 定晶圓之運送經路的方法說明圖。圖7之A係關於卡匣及處 理室用以固定2組之-對關係並用以設定運送晶圓之平行處 理圖。圖7之B係顯示不使卡匣及處理室的對應關係固定， 用以運送晶圓到空的處理室之情形。 尙有，在自動運轉條件之設定中，無指定處理經路時 ，進行一連串不同之程序處理做爲複數之程序處理裝置之 組，分別進行晶圓之蝕刻及後處理用以自動設定含程序處 理裝置之對的處理經路也可。 又，分別進行晶圓之蝕刻或後處理對於程序處理裝置 之1組或2組之對，在1次之各處理，交替切換使用之程序處 理裝置，將各程序處理裝置之消耗度一致也可。 用以設定以上之製品處理條件後，用以開始自動運轉 (36)。 經濟部智慧財產局員工消費合作社印製 圖8係顯示本實施例之自動運轉的流程圖。用以開始自 動運轉，則用以判斷是否將全部應處理晶圓進行運送，若 運送完成則終了處理，若有必要運送，則進到自動運轉處 理（40 )。在自動運轉中發生異常等，用以判斷運轉是否 在暫時中斷之狀態（42 )。若無異常，則繼續進行運轉（ 到44 )。有不能使用運轉之程序處理裝置時，則不使用該 程序處理裝置使操作者用以判斷是否可繼續進行運轉（7 0 )。不能繼續進行時，則使操作者藉由進行自動運轉之中 ±設定，使裝置進行自動運轉停止處理（90)。即使在可 繼續進行時，但在程序處理裝置有剩餘晶圓之形，在真空 機械人之柄上有剩餘晶圓之情形，在裝載鎖定室或下載鎖 -20- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（18) 定室有剩餘晶圓之情形等。 將處理裝置內剩餘有晶圓之處理例顯示於如下。首先 ’用以判斷在裝置內是否有剩餘之晶圓（72 )。將裝置內 剩餘之晶圓原封不動用以判斷是否繼續運轉（73 )。 艮P，操作者，用以選擇以下（1 ) 、 （ 2 )其中之一。 (1)將剩餘於裝置內之晶圓直接進行繼續運轉。 • (2)將剩餘於裝置內之晶圓不直接進行繼續運轉，進行 必要的處置再開始運轉。此係在自動運轉中在發生異常之 時點爲了確定處理裝置內的全晶圓之運送·處理的預定計 畫，不返回到取出發生異常之機器的晶圓之卡匣則會使晶 圓之運送·處理的預定計畫粉亂，由自動運轉之暫時中斷 狀態形成不能再開、繼續進行自動運轉。 將剩餘於裝置內之晶圓直接進行繼續運轉時，則將該 晶圓能運出到原來卡匣進行晶圓資訊變更（77 )。即將剩 餘於發生異常之機器內的晶圓不搬出到原來之卡匣將該晶 圓剩餘於發生異常之機器內的狀態下，進行晶圓資訊變更 將該晶圓能搬出到原來之卡匣。譬如，將剩餘於異常發生 之處理裝內的晶圓原封放著，進行晶圓資訊之變更能將該 晶圓搬出到原來之卡匣之後，對於在製品之晶圓由暫時中 斷狀態使繼續進行再開始、自動運轉並使終了 1批（1 lot) 處理，使自動運轉終了之後’將剩餘之晶圓返回到原來之 卡匣時被使用。尙有，做爲另外之實施例，將剩餘於發生 異常之機器內的晶圓不搬出到原來之卡匣將該晶圓對於剩 餘於發生異常之機器內的在製品之晶圓由暫時中斷狀態使 (請先閱讀背面之注意事項再填寫本頁) i裳 訂」--------_ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -21 - 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（19) 繼續進行再開、自動運轉並使終了 1批之處理，使終了自動 運轉之後，也可將剩餘之晶圓返回到原來之卡匣。 將剩餘於裝置內的晶圓原封不動不繼續運轉時，則用 以判斷是否進行剩餘晶圓之中的蝕刻處理（74 )。 在進行蝕刻處理時，則用以選擇剩餘晶圓之處理條件 (75 )。做爲剩餘晶圓之處理條件，係譬如如圖9所示，預 先準備5項選擇體放著。 (1 )由處理中斷時間進行再試，繼續進行處理。 (2 )僅對發生異常之晶圓，以復原用之秘訣處.理，由 其次之晶圓，以原來之秘訣繼續進行處理。 (3 )用以搬出發生異常之晶圓，並用以搬入下次之晶 圓繼續進行處理。 (4 )用以搬出發生異常之晶圓，在原來之卡匣進行回 收後，將發生異常之處理經路由自動運轉割離繼續進行處 理。 (5 )形成維修模式，進行中斷運轉。 返回到圖8，剩餘於處理室內晶圓之中，在蝕刻處理之 途中發生異常時，則進行實施剩餘之蝕刻處理之後（76 ) ，將晶圓返回到原來之卡匣（7 8 )。 此係，儘可能爲了用以救濟晶圓所進行地。又在真空 機械人之晶圓柄上有剩餘晶圓時，或在裝載鎖定室下載鎖 定室有剩餘晶圓時，則進行機器個別之操作（鎖定室之排 氣/漏氣，晶圓之運送），將該晶圓返回到原來之卡匣（78 (請先閱讀背面之注意事項再填寫本頁) --裝 丨i訂--------1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -22- 480646 A7 B7____ 五、發明說明（2〇) 如以上，發生異常之機器的晶圓係用以實施必要的處 理並返回到原來之卡匣後，進行用以再開暫時中斷之自動 運轉的操作。以如此發生異常之機器（處理室或真空機械 人等）的晶圓之漏電痕跡（tracking )資訊，係在正常之經 路與被處理之資訊形成同等，成爲可再開自動運轉。如以 上進行剩餘於處理裝置內的晶圓之處理後，對不使用程序 處理裝置與圖6之（3 2 )所示內容相同進行運轉資訊信號產 生裝置之切換操作（80)。將異常發生資訊進行重設定（82) ’並繼續進行自動運轉。 在正常的運轉狀態下，將下次之晶圓的運送經路被記 億於處理順序資訊記憶裝置1 6的資訊進行讀出（44 )，並 用以決定被記憶於運轉資訊信號記憶裝置1 7之資訊及進行 整合處理運送順路（46 )。決定之運送順路係由卡匣在各 搬出之晶圓持有運送順路數據也可，並與處理順序資訊記 憶裝置1 6另外作成處理順序資訊表，在進行運送晶圓時， 能用以參考該表也可。決定運送順路則空氣機械人8係由卡 匣7用以搬出晶圓（48 )，並運送到被登記於上述決定之運 送順路的程序處理裝置（5 0 )，並進行晶圓處理（5 2 )。 在該晶圓運送處理及程序處理發生異常時，接著爲了 繼續進行自動運轉可繼續進行處理的處理係使該個個之處 理終了爲止進行執行後，將自動運轉呈暫時中斷狀態。譬 如若有第N片之晶圓的蝕刻處理中，則在終了該第n片之晶 _的蝕刻處理爲止繼續進行蝕刻處理，並在終了之時點將 自I力運轉進行暫時中斷。又藉由真空機械人在晶圓運送中 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公楚） I---------·-裝 (請先閱讀背面之注意事項再填寫本頁)480646 A7 B7 V. Description of the invention (14) 2-3 and program processing devices 2-1 and 2-4, if etching, post-processing, film formation, sputtering, CDV, water treatment, etc., wafer process processing (Please read the notes on the back before filling out this page), then any combination is fine. In addition, the number of processing chambers that perform the same program processing is not necessarily limited in the embodiment. 1) 1 cassette 1 recipe (recipe) runs in parallel under the same program processing conditions (hereinafter, the process processing conditions are referred to as recipes). The order is selected by the cassette and transported to the transport processing device for program processing. Wafers are processed by the program processing device 2-2 after the etching process is performed in the program processing device 2-1 and returned to the original cassette (referred to as the route A), and in the program processing device 2 -3 After the etching process, the post-processing is performed in the program processing device 2-4 and returns to the original cassette path (called the path B). Based on the processing sequence of this embodiment, route A ·· cassette 7_1—program processing device 2-2—program processing device 2-1—cassette 7-i route B: cassette 7-1—program processing device 2-3—Program processing device 2-4 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy—Card 7- 1 Route C: Cassette 7-1—Program processing device 2-2—Program processing device 2-4 — Cassette 7-1 Path D: Cassette 7-1 — Program processing device 2-3 — Program processing device 2-1 — Cassette 7 — 1 is also possible. -17- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 480646 A7 B7 V. Description of the invention (15) For wafer processing, the first One wafer is route a, the second wafer is route B, the third wafer is route A, the fourth wafer is route B, and so on. deal with. FIG. 6 is a flowchart showing the operation of the device of this embodiment. The operator is in a program processing device constructed as a processing device before the start of operation. It cannot be used due to a fault or the like, or it is not used for maintenance (including plasma cleaning) to determine whether a program processing device is available (30). If a program processing device cannot be used (or not used), the operation information signal generating device i 9 is used to set it to the state described in FIG. 3 (3 2). As one of the setting methods 1) When using the interruption signal of the device power of the program processing device, turn off the electromagnetic switch for the device power supply of the program processing device. Thereby, the interruption signal is generated and transmitted to the operation information signal memory device 7 as the information recorded in FIG. 3 and memorized. 2) When the operation switching signal (for example, a switching switch) is used to set whether the program processing device is used, the setting of the switching switch allocated to the program processing device is enabled or disabled. Thereby, the switching signal is determined 'and transmitted to the operation information signal memory device 7 as the information recorded in FIG. 3 and memorized. 3) As the operation control signal, the use of the program processing device is enabled / disabled. When the operator uses the input information of the setting input, the operator inputs the setting information of the program processing device through the input device 14. Thereby, the setting information is determined and transmitted to the operation information signal storage device 17 as the information recorded in FIG. 3 and memorized. Determine the paper size of the connection structure of the device. Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 1 · ---.------------------ Order --- ----- (Please read the precautions on the back before filling out this page) 480646 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (16) is used to set the automatic operation conditions (34) To start automatic operation (36). In the setting of automatic operation conditions (34), the order of wafer processing is set as the following product processing conditions. 1) Used to select the operation mode of the wafer. Choose ^ 1 cassette 1 secret side by side "," 2 cassette 1 secret side by side "," 2 cassette 2 secret side by side "," 1 cassette 1 secret side by side "2) to set the wafer delivery process road. In each cassette, the processing path of the wafer is marked with a program processing device to set parallel or serial processing. A typical setting example is shown below. (Wafer processing path can be combined as described above) 2-1) Parallel processing: Cassette 7 —1: E1—A1, Cassette 7-1: E2—A2 Cassette 7-2: E1— A1 , Cassette 7 —2: E2 — A2 El: program processing device 2-2, E2: program processing device 2-3 A 1: program processing device 2-1, A2: program processing device 2-4 2-2) Processing situation: Cassette 7- 1: E1—E2- > A1 Cassette 7-2 ·· Ε2— El- A2 3) It is used to set program processing conditions (also called program secrets) in each program processing room. Figure 7 is an example of the setting of automatic operation conditions (34), which refers to (please read the precautions on the back before filling in this page). Loading tr --------- Φ1. This paper size is applicable to China National Standard (CNS) A4 Specification (210 X 297 mm) -19- 480646 A7 B7 V. Description of the Invention (17) (Please read the precautions on the back before filling this page) Instructions on how to determine the transport route of the wafer Illustration. Fig. 7A is a parallel processing diagram for the cassette and the processing room for fixing the two pairs of pairs and for setting the wafer to be transported. FIG. 7B shows a case where the correspondence between the cassette and the processing chamber is not fixed, and is used to transport wafers to an empty processing chamber.尙 Yes, in the setting of automatic operation conditions, when there is no designated processing route, a series of different program processing is performed as a group of a plurality of program processing devices, which respectively perform wafer etching and post-processing for automatic setting of program-containing processing It is also possible to deal with the device pair. In addition, the wafer etching or post-processing is performed separately. For one or two pairs of program processing devices, the processing devices used are alternately switched at each processing, and the consumption levels of the program processing devices may be consistent. . After setting the above product processing conditions, it is used to start automatic operation (36). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Figure 8 is a flowchart showing the automatic operation of this embodiment. It is used to start the automatic operation, and it is used to judge whether all the wafers to be processed are transported. If the transport is completed, the processing is terminated. If it is necessary to transport, it goes to the automatic operation processing (40). An abnormality occurs during automatic operation to determine whether the operation is temporarily suspended (42). If there is no abnormality, continue the operation (to 44). When there is a program processing device that cannot be used, the program processing device is not used and the operator is used to judge whether the operation can be continued (70). When it is not possible to continue, the operator is caused to perform automatic operation stop processing by performing an automatic operation ± setting (90). Even when it can be continued, but in the case of the remaining wafers in the program processing device and the remaining wafers on the handle of the vacuum robot, in the load lock chamber or download lock-20-This paper standard applies to Chinese national standards (CNS) A4 specification (210 X 297 mm) 480646 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (18) There are excess wafers in the fixed room. A processing example of a wafer remaining in the processing apparatus is shown below. First, it is used to judge whether there are remaining wafers in the device (72). The remaining wafers in the device are left intact to determine whether to continue operation (73). That is, the operator is used to select one of (1) and (2) below. (1) The wafer remaining in the device is directly continued to operate. • (2) The wafers remaining in the device will not continue to operate directly, and the necessary treatment will be performed before restarting the operation. This is a scheduled plan for confirming the transportation and processing of all wafers in the processing equipment at the time of abnormality during automatic operation. The wafer cassette will not be returned to the cassette that takes out the wafer from the abnormal machine. • The scheduled processing process is messed up, and the temporary interruption state of the automatic operation can no longer be opened, and the automatic operation is continued. When the wafer remaining in the device is directly continued to be operated, the wafer can be carried out to the original cassette to change the wafer information (77). That is, the wafer remaining in the abnormal machine is not carried out to the original cassette, and the wafer is left in the abnormal machine, and the wafer information is changed to carry the wafer out to the original cassette. For example, if the wafer remaining in the processing package where the abnormality occurred is left intact, and the wafer information is changed, the wafer can be moved out of the original cassette, and the wafer in process will be temporarily suspended from the interrupted state. After restarting, automatic operation, and finishing 1 lot processing, after the automatic operation is finished, it is used when returning the remaining wafers to the original cassette. Yes, as another example, the wafer remaining in the machine where the abnormality occurred does not move out to the original cassette, and the wafer is temporarily suspended from the wafer in the work in progress remaining in the machine where the abnormality occurs. (Please read the precautions on the reverse side before filling out this page) iSandbook "--------_ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -21-480646 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (19) Continue the reopening, automatic operation, and the final batch of processing. After the automatic operation ends, the remaining wafers can be returned to the original Cassette. When the wafer remaining in the device is left intact and does not continue to operate, it is used to determine whether to perform an etching process in the remaining wafer (74). During the etching process, it is used to select the processing conditions for the remaining wafers (75). As the processing conditions for the remaining wafers, for example, as shown in Fig. 9, five options are prepared and placed in advance. (1) Retry from the processing interruption time and continue processing. (2) Only the wafers that have anomalies will be treated with the secrets of recovery, and the next wafer will be processed with the original secrets. (3) It is used to carry out the abnormal wafer, and it is used to carry in the next wafer to continue processing. (4) It is used to carry out the abnormal wafer. After the original cassette is recovered, the abnormal processing will be automatically separated by routing to continue processing. (5) Establish a maintenance mode and interrupt the operation. Returning to FIG. 8, the remaining wafer is left in the processing chamber. If an abnormality occurs during the etching process, the remaining etching process is performed (76), and the wafer is returned to the original cassette (78). This system is used as much as possible to relieve the wafer. When there are remaining wafers on the wafer handle of the vacuum robot, or when there are remaining wafers in the loading lock chamber and the download lock chamber, the individual operations of the machine are performed (exhaust / leak of the lock chamber, and wafer transport ), Return the wafer to the original cassette (78 (please read the precautions on the back before filling out this page) --- installation 丨 order -------- 1 This paper size applies to Chinese national standards ( CNS) A4 specification (210 X 297 public love) -22- 480646 A7 B7____ 5. Description of the invention (2) As above, the wafer of the machine where the abnormality occurred is used to perform the necessary processing and return to the original cassette To restart the automatic operation temporarily interrupted. The tracking information of the wafer of the abnormal machine (processing room or vacuum robot) is in the normal path and the processed information. Equivalent, it can be restarted and operated automatically. After the wafer remaining in the processing device is processed as above, the operation information signal generating device is switched without using a program processing device and the content shown in (6) of FIG. 6 Operation (80). Reset the abnormality occurrence information (82) 'and continue the automatic operation. Under the normal operation state, read the information of the next wafer conveyance path recorded in the processing sequence information storage device 16 ( 44), and used to determine the information stored in the operation information signal storage device 17 and carry out integrated processing (46). The determined shipping sequence is the cassette holding the shipping sequence data on each wafer being removed, In addition, a processing order information table is prepared with the processing order information storage device 16 to refer to the table when the wafer is being transported. When the delivery route is decided, the air robot 8 is used by the cassette 7 to carry out the wafer. (48), and transfer it to the program processing device (50) registered in the above-determined shipping route, and perform wafer processing (52). When an abnormality occurs in the wafer shipping processing and program processing, the next step is to continue The automatic processing can continue the processing. After the individual processing is completed, the automatic operation will be temporarily suspended. For example, if there is an erosion of the Nth wafer In the process, the etching process is continued until the etching process of the nth wafer_ is finished, and the self-power operation is temporarily interrupted at the end time. The vacuum robot is used to transport the paper to the paper size. Applicable to China National Standard (CNS) A4 specification (210 X 297 cm) I --------- · -installation (please read the precautions on the back before filling this page)

馨 MV MM ----^ « — — — —— —I — - 經濟部智慧財產局員工消費合作社印製 -23- 480646 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（21) 以另外處理若發生異常，則真空機械人，係對預定之場所 在終了晶圓運送的時點將自動運轉進行暫時中斷。之後使 威示發生異常之異常發生資訊（未圖示）被記憶之後，將 裝置呈暫時中斷狀態並將中斷顯示於顯示裝置丨3同時對操 作者將未圖示的警報器產生警鳴。之後返回到（42 )，以 預定之流程進行處理。 其次’根據圖1 0之本發明將洗淨運轉的流程加以說明 。將最後晶圓被搬入到卡匣7- 1，則使洗淨用晶圓由卡匣7一 3被搬入到裝載鎖定室3 (圖丨o — A)。接著，使在程序處理 裝置2-2內之最後晶圓若被運送到程序處理裝置2—1，則將 洗淨用晶圓連送到程序處理裝置2 一 2，使洗淨處理被開始（ 圖 10-B )。 在程序處理裝置2 - 3終了洗淨處理，則將洗淨用晶圓由 程序處理裝置2-3運送到程序處理裝置2-4，並進行洗淨處 理。到此時爲止若被設置有下次之製品用卡匣7一 1，則由卡 匣7-1將製品用晶圓之第2片運送到程序處理裝置2一2，並進 行程序處理。在程序處理裝置2 — 4終了洗淨處理，則將洗淨 用曰η圓返回到裝載鎖疋室4 (圖1〇 一 c)。又，卡匣7-1內之 全部晶圓的處理終了則將卡匣1之處理終了及卡匣交換爲 J通報給ί架作者將該圖未圖示警報器發出警鳴。 使卡fe 7- 1之處理若全部終了，則進行卡匣7-2的處理 。又’在程序處理裝置2-2終了洗淨處理，則將洗淨用晶圓 由程序處理裝置2-2運送到程序處理裝置2—i，並進行洗淨 處理。終Γ冼淨處理，則將洗淨用晶圓返回到卡匣7一3」 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -24- I---_------裝--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 480646 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（22) 如此對於卡匣7-2也與卡匣7- 1的情形同樣依順序進行 處理，將卡匣7-2內的全部進行處理終了則將卡匣7-2之處 理終了及卡匣交換爲了通報給操作者將該圖未圖示警報器 發出警鳴（10 —D )。 以後重複進行該運轉循環。終了該運轉時，則由主控 制部1 1進行運轉終了之操作輸入並使運轉終了。 做爲終了處理之方法，有以下5模式。 A) 停止供應晶圓：由處理中之卡匣用以中止晶圓取出 。（將2卡匣做爲1批進行運時，則由指定之卡匣用以中止 晶圓取出。） B) 停止供應卡匣：將現在處理中之卡匣內的晶圓全部 處理終了後，用以中止被設置於該處理終了爲止的卡匣之 處理。（將2卡匣做爲1批進行運轉時，則將指定之卡匣內 的晶圓全部處理終了後，用以中止被設置於該時爲止之卡 匣的處理。） C) 停止循環：現在執行中之程序處理，排氣，漏氣， 運送等之動作終了後當場進行停止。 D) 暫時停止處理室：對於指定處理室’現在處理中之 程序處理終了後進行停止。該情形，藉由運轉之再開始操 作由暫時停止之狀態可用以再開始運轉。又只有該處理室 可手動操作。 E) 立刻停止：將執行中之全部動作進行即時停止。 當處理終了時藉由以上任何方法皆可° 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -25 - I- . 裝--------訂---------AWI (請先閱讀背面之注意事項再填寫本頁) 480646 A7 B7 五、發明說明（23) 2 ) 2卡匣1秘訣並列運轉 在同一之程序處理條件（秘訣）被收容處理之晶圓的 卡匣內由最下段或最上段之晶圓依順序選出並搬入到運送 處理裝置進行程序處理。該情形，由卡匣選出搬入運送處 理裝置進行程序處理使運轉與前述之「1卡匣1秘訣並列運 轉」的情形不同。 前述之「1卡匣1秘訣並列運轉」的情形，係由同一卡 匣依順序選出晶圓搬入到運送處理裝置並進行程序處理1 全部終了該卡匣之晶圓後移動到下次之卡匣的晶圓處理， 但本「2卡匣1秘訣並列運轉」，係由卡匣7-1及卡匣7-2交 替選出晶圓搬入到運送處理裝置並進行程序處理。晶圓之 處理經路係與前述之「1卡匣1秘訣並列運轉」的情形相同 ，使用在程序處理裝置2-2進行蝕刻處理後在程序處理裝置 2- 1進行後處理並返回到原來之卡匣的經路（稱爲經路A ) ，及在程序處理裝置2-3進行蝕刻處理後在程序處理裝置2-4進行後處理並返回到原來之卡匣的經路（稱爲經路B )之 兩方進行處理。 在該實施例對於處理順序之經路A、B或經路C、D係與 前述^ 1卡匣1秘訣並列運轉」的情形相同。 晶圓之處理，係依順序第1片之晶圓係由卡匣7 -1將第1 片經由經路A，第2片係由卡匣7-2將第1片經由經路B，第3 片之晶圓係由卡匣7 - 1將第2片經由經路A，第4片係由卡匣7 -2將第2片經由經路B，…進行卡匣內之最後晶圓爲止的處 理-將卡匣7- 1或卡匣7-2內之全部晶圓處理終了則將卡匣7 (請先閱讀背面之注意事項再填寫本頁) --裝 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -26 - 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（24) - 1 (或卡匣7-2 )之處理終了及卡匣交換爲了通報給操作者 將該圖未圖示之警報器發出警鳴。使該終了之卡匣拿掉被 設置新的卡匣之前，僅有他方之卡匣側的處理被繼續進行 。使新的卡匣被設置則如前述由卡匣7 - 1及卡匣7 - 2交替選 出晶圓搬入到運送處理裝置並進行程序處理。以後重複進 行該運轉循環。將該運轉進行終了時，由主控制部丨丨進行 運轉終了之操作輸入使運轉進行終了。終了方法係與 前述「1卡匣1秘訣並列運轉」的情形相同。又，對於洗淨 處理，係與上述1 )同樣。 3 ) 2卡匣2秘訣並列運轉 本運轉，係藉由使卡匣7- 1及卡匣7-2之晶圓處理秘訣 的不同在程序處理裝置使處理時間不同。該情形，由卡匣7 -1及卡匣7-2之晶圓搬出係不交替，在程序處理裝置終了處 理’用以搬出晶圓到其他之程序處理裝置後將下次之晶圓 運送到該程序處理裝置之處理以外係前述「2卡匣1秘訣並 列運轉」的情形相同。對於該晶圓，或洗淨處理，係與上 述1 )同樣。 4 ) 1卡匣1秘訣直列運轉 本運轉’係以同一之程序處理條件（秘訣）由被收容 進行處理之晶圓的卡匣內最下段或最上段之晶圓依順序由 卡匣選出並搬入到運送處理裝置進行程序處理係前述「1卡 匣丨秘訣並列運轉_的情形相同j但晶圓之處理經路係與前 (請先閱讀背面之注意事項再填寫本頁) •裝 I!訂：--------, 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -27- 480646 A7 B7 五、發明說明（25) 述「1卡匣1秘訣並列連轉」的情形不同。本「1卡匣1秘訣 直列運轉」，係晶圓在程序處理裝置2-2 (或程序處5里裝置 2-3 )進行蝕刻處理後，在程序處理裝置2-1 (或程序處理 裝置2-4 )進行後處理並返回到原來之卡匣的經路（稱爲經 路E )進行處理。 晶圓之處理，係依順序第1片之晶圓係經由經路E，第2 片係經由經路E ’弟3片之晶圓經由經路E，第4片係經由經 路E，…進行卡匣內之最後晶圓爲止的處理。將卡匣7一丨內 之全部處理終了則將卡匣7- 1之處理終了及卡匣交換爲了通 報給操作者將該圖未圖示之警報器發出警鳴。 到此時爲止使卡匣7 - 2若有被設置，則在卡匣7 - 1之處 理終了接著移動到卡匣7-2。對於卡匣7-2也與卡匣7-1之情 形同樣依順序進行處理，將卡匣7-2內之全部晶圓處理終了 則將卡匣7-2之處理終了及卡匣交換爲了通報給操作者將該 圖未圖示之警報器發出警鳴。到此時爲止若被設置有卡匣7 -1，則在卡匣7-2之處理終了接著移動到卡匣7-1之處理。 以後重複進行該運轉循環。將該運轉進行終了時，由主控 制部1 1進行運轉終了之操作輸入使運轉進行終了。終了方 法係與前述^ 1卡匣1秘訣並列運轉」的情形相同。又，對 於洗淨處理，係與上述1)同樣。 以上，由1 )到4 )之運轉方法，係對於代表事例做了 說明，所以藉由與卡匣、秘訣，並列/直列運轉之組合可考 慮其他之運轉方法，本發明係不限定於上述由1 )到4 )之 運轉方法。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ·-I n ·ϋ 1 ϋ Jr， 1 l^i ϋ ϋ ϋ ϋ I < 經濟部智慧財產局員工消費合作社印製 -28- 經濟邨智慧財產局員工消費合作社印製 480646 A7 ___B7____ 五、發明說明（26) 圖1 1係顯示異常發生後之自動經路變更的處理圖。圖 1 1之Α係圖5之「1卡匣1秘訣並列運轉」的運轉模式，使晶 圓之運送經路形成如下。 卡匣 7—1 :E1 一 A1 及 E2— A2 卡匣 7 —2:E1— A1 及 E2— A2 於此，E2係第（N )片之晶圓在蝕刻處理中而A 1係第（ N-1 )片之晶圓在後處理中時，如圖1 1之B所示在A2發生異 常，則以後由運轉模式之處理經路不使用A2，用以繼續進 行運轉。即如圖Η之C所示晶圓之後處理係全部以A 1處理。 卡厘 7—1:E1— A1 及 E2— A1 卡匣7-2:E1— A1及E2— A1可運轉。 若依據本實施例，則在「1卡匣1秘訣並列運轉」時， 則用以構成1秘訣運轉之1個的對處理室之其中之一發生故 障時，用以解除對關係，將用以構成1個之對有效的處理室 ，與用以構成其他之對處理室組合，用以構成新的運送經 路並進行處理，所以將故障時之效率降低可抑制下降。 譬如，故障之處理室係後處理室，比起蝕刻處理使後 處理之所要時間爲1 /2，則使用未故障2個處理室及1個後處 理室，在全體之處理時間幾乎不會受到影響，可進行處理 (請先閱讀背面之注意事項再填寫本頁) •裝 - 痛 · I a··· 一··· him mbh a·· I · 言 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -29 - 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（27) 又，以前述判斷使進行1組之程序處理裝置的蝕刻處理 之程序處理裝置，及進行另外1組的程序處理裝置之中的後 處理之程序處理裝置運轉無效時，則分開運轉無效的程序 處理裝置，並使用另外1組進行鈾刻處理之程序處理裝置， 及進行1組之後處理的程序處理裝置。爲了進行一連串程序 處理用以再構築1組之處理經路，使用該1組之處理經路進 行前述晶圓之處理也可。 進而，圖1 2係用以說明復原秘訣之再試圖。圖1 2之A係 圖5之「1卡匣1秘訣並列運轉」的運轉模式。如圖12之B所 示’在處理室（E2 )發生異常時，操作者，係用以選擇以 下之剩餘晶圓的處理條件之其中之一，並進行如下之再試 〇 (1 )由處理中斷時間進行再試，繼續進行處理。 (2 )僅對發生異常之晶圓，以復原用之秘訣處理，由 下次之晶圓，以原來之秘訣繼續進行處理。 (3 )用以搬出發生異常之晶圓，並用以搬入下次之晶 圓繼續進行處理。 (4)用以搬出發生異常之晶圓，在原來之卡匣進行回 收後，將發生異常之處理經路由自動運轉割離繼續進行處 理。 C 5 )形成維修模式，進行中斷運轉。 如此，異常發生時，不以機械性的處理，使操作者根 據好像無錯誤爲了可選擇剩餘晶圓之處理條件，可採用適 應於裝置狀態的適當恢復處置。 (請先閱讀背面之注意事項再填寫本頁) -裝 *I !—訂- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -30- 480646 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（28) 爲了協助操作者之判斷，在異常發生時關於真空處理 裝置之狀態將儘可能更多的資訊，顯示於顯示裝置1 3、26 爲佳。 尙有，剩餘晶圓之處理條件，並不限定於上述5項，根 據必要進行適當變更即可。 其次，圖13係在並列處理時在A2隨著發生異常，用以 說明回收干擾晶圓圖。圖1 3之A係圖5之「1卡匣1秘訣並列 運轉」的運轉模式。在圖1 3之B中，由卡匣7- 1預定運送到 發生異常之處理室（E2 )的晶圓，係使用真空機械人5，如 圖13之C所示，經由下載鎖定室4返回到原來之卡匣7-1。而 且，如圖13之D所示，由運轉模式之處理經路將處理室E及 A2分離之狀態下，繼續進行運轉。 其次，圖1 4係由維修模式用以說明自動運轉復位圖。 圖14之A係圖5之「1卡匣1秘訣並列運轉」的運轉模式，晶 圓之運送經路係形成如下。 卡匣 7 —1:Ε1-> A1 及 E2— A2 卡匣 7-2:Ε1— A1 及 E2— A2 於此，在E2係使第（N )片之晶圓在蝕刻處理中，在A 1 係使第（N-1 )片之晶圓在後處理中時，如圖14之B所示在 處理室E2發生異常。該狀態下，終了蝕刻處理，並使A 1之 第（N- 1 )片的晶圓終了後處理之後，不搬出到下載鎖定室 4將自動運轉暫時中斷。 之後，如圖14之C所示，將發生異常之處理室E2的晶圓 回收到卡匣7-2。而且，對於E2、A2係藉由圖8之運轉資訊 (請先閱讀背面之注意事項再填寫本頁) -裝 » - I ϋ ϋ ϋ ϋ ·1 ϋ I ϋ ϋ I . 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -31 - 480646 經濟部智慧財產局員工消費合作社印製 A7 __________B7^_____ 五、發明說明（29) 信號產生裝置進行更換操作（步驟8〇 )，如圖3所示將程序 處理裝置4 ( A2 )之運轉資訊做爲「無效：0」。將該異常發 生資訊加以重設（圖8之8 2 )，並繼續進行自動運轉。 再度開始後，如圖14之D所示A2的第（N-1 )片之晶圓 係被運送到下載鎖定室4 ’以後係不使用由運轉模式之處理 經路E2、A2，而繼續進行運轉。 其次’對於將運轉資訊做爲「無效：〇」之程序處理裝 置4 ( A2 )，係使用補助操作盤22爲了用以追究異常原因， 對程序處理裝置4 ( A2 )爲了進行機器動作而進行操作輸入 。譬如’用以認識進行程序處理裝置4 ( A 2 )內未顯示於本 圖之晶圓推上操作動作。 藉由如此作可Μ策異常原因，使做爲「無效：〇」之程 序處理裝置4 ( Α2 )復位到晶圓之處理經路。 上述實施例，係在自動運轉中將Ε2及Α2由自動運轉處 理經路做爲分離裝置藉由運轉停止操作發出停止指示進行 分離’但做爲另外方法藉由裝入於處理裝置之檢測器的機 能也可發出停止指示。做爲一例，係由裝入於處理裝置之 異物監視器裝置用以檢測異物測定監視器値超過設定於運 轉前之設定値，以該超過之信號在自動運轉中發出指示於 Ε2及Α2進行與運轉停止操作同樣功能。 其次，圖1 5係說明系列老化圖。老化晶圓，係如圖1 5 a 所示以系列進行運送進行老化也可。將老化藉由並行進行 ，可用以縮短老化時間。 如上述，若依據本發明之實施例，則在自動運轉中使 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -32 - I-丨丨1·!丨丨--丨訂-----丨—丨- (請先閱讀背面之注意事項再填寫本頁) 480646 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（30) 用未使用於該處理之處理室的處理，及對該處理室可操作 可用以執行單肺運轉。 圖1 6係顯示本發明另外之一實施例，使程序處理裝置4 室被連接於運送處理裝置，爲了用以搬入晶圓到處理裝置 之卡匣係設置於處理裝置本體內之裝載鎖定室3A，由卡匣 取出各1片搬入到處理裝置並進行處理之裝置成圖。使程序 處理裝置在此以上被連接也無妨。做爲裝置構成係由圖1所 示構成爲了用以設置收容晶圓之卡匣除去空氣運送裝置6， 空氣機械人8。由晶圓之卡匣的搬出係由裝載鎖定室3所構 成，對卡匣之收容係形成下載鎖定室4A以外各機器之功能 及構成係與圖1相同。 又，做爲洗淨處理，係將用以收容洗淨用晶圓之卡匣 設置於裝載鎖定室3A (或下載鎖定室4A )，並將洗淨用晶 圓搬出到程序處理裝置2 - 1、2 - 2、2 - 3、2 - 4，進行洗淨處 理並返回到原來卡匣。 又運轉模式中，係 1) 1卡匣1秘訣並列運轉 同一之程序處理條件（秘訣）下由被收容處理之晶圓 的卡匣內之最下段或最上段晶圓依順序由卡匣選出並搬送 到程序處理裝置進行程序處理。晶圓，係使用在程序處理 裝置2-2進行蝕刻處理後在程序處理裝置2- 1進行後處理並 返回到原來之卡匣的經路（稱爲經路A )，及在程序處理裝 置2-3進行蝕刻處理後在程序處理裝置2_4進行後處理並返 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -33- I---·------裝--------訂---------AWI (請先閱讀背面之注意事項再填寫本頁) 480646 A7 B7 五、發明說明（31 ) 回到原來之卡匣的經路（稱爲經路B )。 以本貫施例之處理順序係， (請先閱讀背面之注意事項再填寫本頁)Xin MV MM ---- ^ «— — — —— —I —-Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -23- 480646 Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (21 ) If an abnormality occurs by another process, the vacuum robot will automatically stop the scheduled operation at the point where the wafer transportation is finished. After the abnormality occurrence information (not shown) of the indication abnormality is memorized, the device is temporarily suspended and the interruption is displayed on the display device. 3 At the same time, the operator alarms an unillustrated alarm. After that, it returns to (42) and processes according to a predetermined process. Next, the flow of the washing operation will be described according to the present invention of FIG. 10. When the last wafer is transferred to the cassette 7-1, the wafers for cleaning are transferred from the cassette 7-3 to the load lock chamber 3 (Fig. 丨 o-A). Next, if the last wafer in the program processing apparatus 2-2 is transported to the program processing apparatus 2-1, the cleaning wafer is connected to the program processing apparatus 2-2, and the cleaning process is started ( Figure 10-B). After the cleaning process is completed in the program processing apparatus 2-3, the cleaning wafer is transported from the program processing apparatus 2-3 to the program processing apparatus 2-4, and the cleaning process is performed. Until this time, if the next product cassette 7-1 is set, the second wafer of the product wafer is transferred from the cassette 7-1 to the program processing device 2-2, and program processing is performed. After the washing process is completed in the program processing devices 2 to 4, the washing cycle is returned to the loading lock chamber 4 (Fig. 10c). In addition, when the processing of all wafers in cassette 7-1 is completed, the processing of cassette 1 is ended and the cassette is exchanged as J. The author is notified of the alarm in the figure (not shown). If all the processing of the card fe 7-1 is completed, the processing of the cassette 7-2 is performed. When the cleaning process is completed in the program processing apparatus 2-2, the cleaning wafer is transported from the program processing apparatus 2-2 to the program processing apparatus 2-i, and the cleaning process is performed. After the final cleaning process, the cleaning wafers will be returned to the cassette 7-3. ”This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) -24- I ---_-- ---- Equipment -------- Order --------- (Please read the notes on the back before filling this page) 480646 Printed by the Consumers Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 5 Explanation of the invention (22) Thus, the processing of the cassette 7-2 is performed in the same order as in the case of the cassette 7-1, and the processing of the cassette 7-2 is completed, and the processing of the cassette 7-2 is completed. In order to notify the operator and the cassette exchange, an alarm (10-D) is sounded (not shown). This operation cycle is repeated later. When this operation is terminated, the main control unit 11 makes an operation end operation input and terminates the operation. As the final processing method, there are the following 5 modes. A) Stop supply of wafers: The cassettes in use are used to stop wafer removal. (When the 2 cassettes are shipped as a batch, the designated cassette is used to stop the wafer removal.) B) Stop the supply of cassettes: After all the wafers in the cassettes currently being processed have been processed, It is used to stop the processing of the cassette set until the end of the processing. (When two cassettes are operated as one batch, after all the wafers in the designated cassette have been processed, it is used to stop the processing of the cassette set at that time.) C) Stop the cycle: now The execution of the program processing, exhaust, leak, and transportation will stop on the spot. D) Temporarily stop the processing room: For the designated processing room, the current processing is finished and the processing is stopped. In this case, the operation can be resumed by temporarily stopping the operation by restarting the operation. Only this processing chamber can be operated manually. E) Stop immediately: Stop all actions in execution immediately. When the processing is finished, it can be done by any of the above methods. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -25-I-. ------ AWI (Please read the precautions on the back before filling this page) 480646 A7 B7 V. Description of the invention (23) 2) 2 Cassettes 1 Secrets running side by side under the same program Processing conditions (secrets) are contained In the cassette of the processed wafer, the lowest or uppermost wafers are sequentially selected and transferred to the transport processing device for program processing. In this case, the cassette is selected and carried into the transport processing device for program processing to make the operation different from the case of the "1 cassette and 1 recipe parallel operation" described above. In the case of “1 cassette and 1 recipe running side by side”, the wafers are sequentially selected from the same cassette and transferred to the transport processing device and processed. 1 After all the wafers in the cassette are terminated, they are moved to the next cassette. Wafer processing, but in this "2 Cassettes 1 Tips for Parallel Operation", cassettes 7-1 and 7-2 are used to alternately select wafers and transfer them to a transport processing device for program processing. The processing route of the wafer is the same as that in the case of the "1 cassette 1 secret parallel operation" mentioned above. After the etching processing is performed in the program processing device 2-2, the post processing is performed in the program processing device 2-1 and the original is returned to the original The path of the cassette (referred to as the path A), and after the etching process is performed by the program processing device 2-3, the post processing is performed in the program processing device 2-4 and returned to the original cassette (referred to as the path B) The two parties deal with it. In this embodiment, the process A, B or C, D of the processing sequence is the same as the case of the above-mentioned ^ 1 cassette 1 secret operation. The processing of the wafers is based on the order of the first wafer through cassette 7-1 through the first via A, and the second wafer through cassette 7-2 through the first via B. 3 wafers pass the second wafer through the path A through cassette 7-1, 4 wafers pass the second wafer through the path B through cassette 7-2, ... until the last wafer in the cassette Handling-After processing all wafers in cassette 7-1 or cassette 7-2, cassette 7 will be processed (please read the precautions on the back before filling this page) The paper size printed by the cooperative applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -26-480646 A7 B7 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (24)-1 (or card In order to notify the operator that the processing of the cassette 7-2) is completed and the cassette exchange is performed, an alarm not shown in the figure is sounded. Until the final cassette is removed and a new cassette is set, only the processing on the other cassette side is continued. When a new cassette is set, the wafers are alternately selected from cassettes 7-1 and 7-2 as described above, and the wafers are transferred to the transport processing device and processed. This operation cycle is repeated later. When this operation is completed, the main control unit 丨 performs operation end operation input to terminate the operation. The ending method is the same as in the case of "1 cassette and 1 secret operation in parallel". The cleaning process is the same as the above 1). 3) 2 Cassette 2 Tips for Parallel Operation This operation is based on the difference in wafer processing recipes for cassette 7-1 and cassette 7-2 in the processing equipment to make the processing time different. In this case, the wafers carried out by cassette 7-1 and cassette 7-2 are not alternated. After the process processing device is finished, it is used to transfer the wafers to another process processing device to transport the next wafer to Except for the processing of the program processing device, the above-mentioned case of "parallel operation of 2 cassettes and 1 secret operation" is the same. This wafer or cleaning process is the same as 1) above. 4) 1 cassette 1 secret operation in-line This operation is based on the same procedure processing conditions (secret) from the lowest or uppermost wafer in the cassette of the wafer to be processed for processing. The program processing to the transport processing device is the same as the above-mentioned "1 cassette 丨 the secret operation is the same situation_ but the wafer processing route is the same as before (please read the precautions on the back before filling this page) • Install I! Order ： --------, This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -27- 480646 A7 B7 V. Description of the invention (25) The "1 cassette and 1 secret juxtaposition" The situation is different. In this "1 cassette 1 secret operation in-line", after the wafer is etched in the program processing device 2-2 (or the device 2-3 in the 5th place), the wafer is processed in the program processing device 2-1 (or the program processing device 2). -4) The post-processing and return to the original cassette path (called the path E) for processing. The processing of the wafers is in accordance with the sequence of the first wafer via the route E, the second wafer via the route E 'three wafers via the route E, the fourth wafer via the route E, ... Processing is performed up to the last wafer in the cassette. After all the processing in cassette 7-1 is finished, the processing of cassette 7-1 is finished and the cassette is exchanged to notify the operator of an alarm not shown in the figure. If cassette 7-2 is set so far, it is finished at cassette 7-1 and moved to cassette 7-2. Case 7-2 is also processed in the same order as in case of case 7-1. After processing all wafers in case 7-2, the end of case 7-2 and the exchange of the case are notified. The operator sounds an alarm not shown in the figure. If the cassette 7-1 is set up to this point, the processing of the cassette 7-2 is ended and then the processing is moved to the cassette 7-1. This operation cycle is repeated later. When the operation is completed, the main control unit 11 performs an operation end operation input to terminate the operation. The end method is the same as in the case of the "^ 1 cassette 1 secret operation in parallel". The cleaning process is the same as the above 1). In the above, the operation methods from 1) to 4) have been described for representative examples. Therefore, other operation methods can be considered by combining with cassettes, tips, and parallel / in-line operation. The invention is not limited to the above 1) to 4). This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) · -I n · ϋ 1 ϋ Jr, 1 l ^ i ϋ ϋ ϋ ϋ I < Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -28- Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Economic Village 480646 A7 ___B7____ V. Description of the Invention (26) Figure 1 1 Processing diagram. Fig. 11A is the operation mode of "1 cassette and 1 secret parallel operation" shown in Fig. 5, and the wafer transportation path is formed as follows. Cassette 7-1: E1-A1 and E2-A2 Cassette 7 -2: E1-A1 and E2-A2 Here, E2 is the (N) th wafer in the etching process and A1 is the (N -1) When the wafer is being post-processed, as shown in FIG. 11B, an abnormality occurs at A2. In the future, the processing mode of the operation mode does not use A2 to continue the operation. That is, as shown in FIG. C, the wafer post-processing is all processed by A 1. Cali 7—1: E1—A1 and E2—A1 Cassettes 7-2: E1—A1 and E2—A1 are operational. According to this embodiment, when "1 cassette and 1 recipe are operated in parallel", when one of the pair of processing chambers constituting one recipe operation fails, it will be used to release the pair relationship and will be used to A pair of processing chambers that are effective is combined with another pair of processing chambers to form a new transport path and perform processing. Therefore, the efficiency can be reduced in the event of a failure. For example, a defective processing room is a post-processing room. Compared with an etching process, the time required for post-processing is 1/2, so two processing rooms and one post-processing room that are not faulty are used, and the entire processing time is hardly affected. The impact can be dealt with (please read the precautions on the back before filling out this page) • Packing-Pain · I a ··· One ··· him mbh a ·· I · This paper size applies Chinese National Standards (CNS) A4 specification (210 X 297 mm) -29-480646 A7 B7 Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (27) In addition, based on the foregoing judgment, the etching process of the first group of program processing equipment is performed. When the processing device and the program processing device that performs post-processing among the other group of program processing devices are ineffective, the invalid program processing device is separately operated, and the other group of program processing devices for uranium etching is used, and One set of program processing devices for post processing. In order to perform a series of program processing to construct a processing path of one group, the processing process of the one group may also be used to process the aforementioned wafer. Further, Fig. 12 is a re-explanation for explaining the secret of recovery. A of FIG. 12 is an operation mode of “1 cassette and 1 secret parallel operation” of FIG. 5. As shown in FIG. 12B, when an abnormality occurs in the processing chamber (E2), the operator selects one of the processing conditions of the remaining wafers below and performs the following retry. (1) The processing is interrupted Time to retry and continue processing. (2) Only the wafer with abnormality will be processed with the recovery recipe, and the next wafer will be processed with the original recipe. (3) It is used to carry out the abnormal wafer, and it is used to carry in the next wafer to continue processing. (4) Used to carry out abnormal wafers. After the original cassette is recovered, the abnormal processing will be automatically separated by routing to continue processing. C 5) Form a maintenance mode and interrupt the operation. In this way, when an abnormality occurs, mechanical processing is not performed, so that the operator can select the processing conditions of the remaining wafers based on the fact that there is no error, and can adopt appropriate recovery and treatment suitable for the state of the device. (Please read the precautions on the back before filling in this page) -Packing * I! —Order- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -30- 480646 A7 B7 Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau's Consumer Cooperatives V. Description of the Invention (28) In order to assist the operator's judgment, as much information as possible about the status of the vacuum processing device when an abnormality occurs, is preferably displayed on the display devices 1 and 26. However, the processing conditions of the remaining wafers are not limited to the above five items, and can be appropriately changed as necessary. Next, Fig. 13 is a diagram showing an abnormality in A2 during parallel processing. A of FIG. 13 is an operation mode of “1 cassette and 1 secret parallel operation” of FIG. 5. In FIG. 13B, wafers scheduled to be transported from the cassette 7-1 to the processing chamber (E2) where the abnormality occurred are vacuum robots 5, as shown in FIG. 13C, and returned via the download lock chamber 4. Go to the original cassette 7-1. Further, as shown in FIG. 13D, the operation is continued while the processing chambers E and A2 are separated by the processing path of the operation mode. Secondly, Fig. 14 is a diagram for explaining the automatic operation reset by the maintenance mode. A of FIG. 14 is an operation mode of the “one cassette and one secret parallel operation” of FIG. 5, and a wafer transportation path system is formed as follows. Cassette 7 —1: E1- > A1 and E2— A2 Cassette 7-2: E1— A1 and E2— A2 Here, in E2, the (N) th wafer is etched in A, 1. When the (N-1) th wafer is being post-processed, an abnormality occurs in the processing chamber E2 as shown in FIG. 14B. In this state, after the etching process is terminated and the wafer of the (N-1) th wafer of A 1 is post-processed, the automatic operation is temporarily suspended without being moved out of the download lock chamber 4. Thereafter, as shown in FIG. 14C, the wafer in the processing chamber E2 in which the abnormality occurred is recovered to the cassette 7-2. Moreover, for E2 and A2, use the operation information of Figure 8 (please read the precautions on the back before filling this page) -Installation »-I ϋ ϋ ϋ 1 · 1 1 I ϋ ϋ I Standard (CNS) A4 specification (210 X 297 mm) -31-480646 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 __________ B7 ^ _____ V. Description of the invention (29) The signal generating device is replaced (step 8). As shown in FIG. 3, the operation information of the program processing device 4 (A2) is set to "invalid: 0". Reset the abnormal occurrence information (8 2 in Figure 8), and continue the automatic operation. After restarting, as shown in D of FIG. 14, the wafer of the (N-1) th wafer of A2 is transported to the download lock chamber 4 ′, and the processing paths E2 and A2 in the operation mode are not used, and continue. Operational. Secondly, for the program processing device 4 (A2) whose operation information is “invalid: 0”, the auxiliary operation panel 22 is used to investigate the cause of the abnormality, and the program processing device 4 (A2) is operated for the purpose of machine operation. Enter. For example, it is used to recognize the operation of performing the wafer push-up operation in the program processing device 4 (A 2) which is not shown in the figure. By doing so, the cause of the abnormality can be eliminated, and the program processing device 4 (Α2) which is set to "invalid: 0" is reset to the processing path of the wafer. In the above-mentioned embodiment, E2 and A2 are separated from the automatic operation processing route as a separation device by the operation stop operation and a stop instruction is issued for separation in the automatic operation. However, as another method, the detection device installed in the processing device The function can also issue a stop instruction. As an example, the foreign matter monitor device installed in the processing device is used to detect the foreign matter measurement monitor (exceeds the setting before operation), and an instruction is given to Ε2 and Α2 during the automatic operation with the signal exceeding this value. The function of stop operation is the same. Next, Fig. 15 is a series of aging diagrams. The aging wafer may be transported and aged in a series as shown in Fig. 15a. Aging can be performed in parallel to shorten the aging time. As mentioned above, according to the embodiment of the present invention, the paper size is adapted to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) during automatic operation -32-I- 丨 丨 1 ·! 丨 丨- -丨 Order ----- 丨 — 丨-(Please read the precautions on the back before filling out this page) 480646 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (30) The processing of the processing chamber and the operation of the processing chamber can be used to perform single lung operation. FIG. 16 shows another embodiment of the present invention, in which the chamber 4 of the program processing apparatus is connected to the transport processing apparatus, and a cassette for carrying wafers to the processing apparatus is provided in the load lock chamber 3A of the processing apparatus body. , Take out one piece from the cassette and carry it to the processing device for processing. It is also possible to connect the program processing device above. As the device configuration, the air conveying device 6 and the air robot 8 are used for installing a cassette for accommodating wafers as shown in FIG. 1. The unloading of the cassette from the wafer is constituted by the load lock chamber 3, and the functions and structure of each device other than the download lock chamber 4A for the cassette storage system are the same as those of Fig. 1. As a cleaning process, a cassette for accommodating cleaning wafers is set in the load lock chamber 3A (or download lock chamber 4A), and the cleaning wafers are carried out to the program processing apparatus 2-1 , 2-2, 2-3, 2-4, wash and return to the original cassette. In the operation mode, 1) 1 cassette and 1 recipe are operated in parallel under the same program processing conditions (secrets). The lowest or highest wafer in the cassette of the wafer to be processed is selected by the cassette in order and selected. Transfer to a program processing device for program processing. Wafers are processed by the program processing device 2-2 after the etching process is performed in the program processing device 2-1 and returned to the original cassette (referred to as the route A), and in the program processing device 2 -3 After the etching process, post-processing is performed in the program processing device 2_4 and the paper size is returned to the Chinese national standard (CNS) A4 specification (210 X 297 mm) -33- I --- · ------ pack- ------- Order --------- AWI (Please read the notes on the back before filling out this page) 480646 A7 B7 V. Description of the invention (31) Way back to the original cassette (Referred to as Path B). The processing sequence of this example is (Please read the precautions on the back before filling this page)

經路A:裝載鎖定室3內卡匣7-1A—程序處理裝置2-2 — 程序處理裝置2 - 1—下載鎖定室4A內卡匣7 - 2APath A: Loading cassette 7-1A in lock chamber 3—program processing device 2-2 —program processing device 2-1—download cassette 7 in lock room 4A

經路B:裝載鎖定室3A內卡匣7-1A —程序處理裝置2-3 — 程序處理裝置2-4—下載鎖定室4A內卡匣7-2APath B: Loading cassette 7-1A in lock room 3A — Program processing device 2-3 — Program processing device 2-4 — Downloading cassette 7-2A in lock room 4A

經路C:裝載鎖定室3A內卡匣7-1 A—程序處理裝置2-2 — 程序處理裝置2-4—下載鎖定室4A卡匣7-2A 經路D:裝載鎖定室3 A內卡匣7-1 A—程序處理裝置2-3 — 程序處理裝置2- 1—下載鎖定室4A內卡匣7-2A 之組合也可。又上述處理順序係使處理的晶圓返回到下載 鎖定室4A內卡匣7-2A但返回到取出晶圓之裝載鎖定室3內卡 匣7-1 A也可。 經濟部智慧財產局員工消費合作社印製 本實施例係顯示將經路A及經路B並行由裝載鎖定室3內 之卡匣7-丨A選出之晶圓係返回到下載鎖定室4A內之卡匣7-2 A處理之例。晶圓之處理，係第1片之晶圓係經路a，第2片 係經路B，第3片之晶圓係經路A，第4片係經路B，…之順序 進行卡匣內之最後晶圓爲止處理。將裝載鎖定室3 A內卡匣7 - 1 A內之全部處理終了及裝載鎖定室內卡匣及下載鎖定室4 A 內卡匣7-2A之處理終了及卡匣交換爲了通報給操作者將該 圖未圖示之警報器發出警鳴。其次將放入新的未處理晶圓 之卡匣設置於裝載鎖定室3A，將空的卡匣設置於下載鎖定 室4A，以後重複進行該運轉循環。終了該運轉時，則由主 控制部1 1進行運轉終了之操作輸入並用以終了運轉。終了 -34- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 480646 A7 B7 五、發明說明（32) 方法係與前述「1卡匣1秘訣並列運轉」之情形同樣。 2 ) 2卡匣1秘訣並列運轉 在同一之程序處理條件（以下，係將程序處理條件稱 爲秘訣）被收容處理之晶圓的卡匣內由最下段或最上段之 晶圓依順序由卡匣選出並搬入到程序處理裝置進行程序處 理。 前述之「1卡匣1秘訣並列運轉」的情形，係由同——^ 匣依順序選出晶圓搬入到程序處理裝置並實施程序處理， 經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 全部終了該卡匣之晶圓後移動到下次之卡匣的晶圓處理， 但本「2卡匣1秘訣並列運轉」’係由裝載鎖定室3 A內卡匣7 - 1A及下載鎖定室4A內之卡匣7-2A交替選出晶圓搬入到程 序處理裝置並實施程序處理。晶圓之處理經路係與前述之 「1卡匣1秘訣並列運轉」的情形相同，使用在程序處理裝 置2-2進行蝕刻處理後在程序處理裝置2-1進行後處理並返 回到原來之卡匣的經路（稱爲經路A )，及在程序處理裝置 2-3進行蝕刻處理後在程序處理裝置2-4進行後處理並返回 到原來之卡匣的經路（稱爲經路B )之兩方進行處理。 在該實施例對於處理順序之經路A、B或經路c、D彳系肖 前述「1卡匣1秘訣並列運轉」的情形相同。 晶圓之處理’係依順序第1片之晶圓係由裝載鎖定室3 a 內卡匣7- 1 A將第1片經由經路A，第2片係由下載鎖定室內卡 fe將第1片經由經路B，第3片之晶圓係由裝載鎖定室3 A內之 长匣7-1 A將第2片經由經路A，第4片係由下載鎖定室4八卡 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱1 - 35 - — 480646 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（33) 匣7-2 A將第2片經由經路B，…進行卡匣內之最後晶圓爲止 的處理。將裝載鎖定室3A內或下載鎖定室4A內卡匣7-2A內 之全部晶圓處理終了則將裝載鎖定室3 A內（或下載鎖定室 4 A內）卡匣之處理終了及卡匣交換爲了通報給操作者將該 圖未圖不之警報器發出警鳴。使該終了之卡匣被拿掉被設 置新的卡厘爲止’係僅他方之卡厘側之處理被繼續。被設 置新的卡匣及如前述裝載鎖定室3 A內由下載鎖定室4 A內卡 匣交替選出晶圓搬入到程序處理裝置用以實施程序處理。 以後重複進行該運轉循環。將該運轉進行終了時，由主控 制部Π進行運轉終了之操作輸入使運轉進行終了。終了方 法係與前述「1卡匣1秘訣並列運轉」的情形相同。 3 ) 2卡匣2秘訣並列運轉 本運轉，係藉由使裝載鎖定室3A內之卡匣7- 1 A及下載 鎖定室4A內卡匣7-2A之晶圓處理秘訣的不同。該情形，由 卡匣7-1及卡匣7-2之晶圓搬出係不交替，在程序處理裝置 終了處理，用以搬出晶圓到其他之程序處理裝置後將下次 之晶圓運送到該程序處理裝置之處理以外係前述「2卡匣1 秘訣並列運轉」的情形相同。對於該晶圓，或洗淨處理， 係與上述1 )同樣。 4 ) 1卡匣1秘訣直列運轉 本運轉，係以同一之程序處理條件（以下，係將程序 處理條件稱爲秘訣）由被收容進行處理之晶圓的卡匣內最 -裝--------訂·丨 ------ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -36- 經濟部智慧財產局員工消費合作社印製 480646 A7 B7__ 五、發明說明（34) 下段或最上段之晶圓依順序由卡匣選出並搬入到程序處理 裝置進行程序處理係前述「1卡匣1秘訣並列運轉」的情形 相同。但晶圓之處理經路係與前述「1卡匣1秘訣並列運轉 」的情形不同。 本「1卡匣1秘訣直列運轉」，係晶圓在程序處理裝置2 -2 (或程序處理裝置2-3 )進行蝕刻處理後，進而在程序處 理裝置2-3 (或程序處理裝置2-2 )進行蝕刻處理之後，在 程序處理裝置2-1 (或程序處理裝置2-4)進行後處理並返 回到原來之卡匣的經路（稱爲經路E )進行處理。 本實施例係顯示，在經路E由裝載鎖定室3A內的卡匣7-1 A選出之晶圓係返回到下載鎖定室4A內之卡匣7-2A的處理 例。 晶圓之處理’係依順序第1片之晶圓係經路E，第2片係 經路E，第3片之晶圓係經路e，第4片係經路e，…進行卡匣 內之最後晶圓爲止的處理。將卡匣內之全部處理終了則將 裝載鎖定室3A內卡匣7-1 A及下載鎖定室4A內卡匣7-2A之處 理終了及卡匣交換爲了通報給操作者將該圖未圖示之警報 器發出警鳴。其次將放入新的未處理晶圓之卡匣設置於裝 載鎖定室3A，將空的卡匣設置於下載鎖定室4A，以後重複 進行該運轉循環。將該運轉進行終了時，由主控制部丨丨進 行運轉終了之操作輸入使運轉進行終了。終了方法係與前 述「1卡匣1秘訣並列運轉」之情形相同。 如以上說明’若依據本發明，則可提供一種真空處理 裝置的運轉方法及晶圓的處理方法，使用2組以上之程序處 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公董） -37· ----------裝--------訂---------AWI (請先閱讀背面之注意事項再填寫本頁) 480646 A7 B7 五、發明說明（35) 理裝置進行處理藉由真空處理裝置在運轉中，哪個之處理 室由於故障等不能使用時，不被拘束於用以構成各2組之程 序處理裝置的關係，將正常的處理室做爲處理經路使用並 運轉可提高運轉率。 又，可提供-種真空處理裝置的運轉方法及晶圓的處 理方法，關於洗淨處理或老化處理，也可提高運率。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -38 -Path C: Loading cassette 7-1 A in the lock room 3A—Program processing device 2-2—Program processing device 2-4—Downloading the cassette in the lock room 4A 7-2A Path D: Loading card in the lock room 3 A Cassette 7-1 A—program processing device 2-3—program processing device 2-1—Downloading a combination of cassette 7-2A in lock room 4A is also possible. The processing sequence described above may return the processed wafer to the cassette 7-2A in the download lock chamber 4A, but may return to the cassette 7-1 A in the load lock chamber 3 to remove the wafer. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. This example shows that the wafer selected by cassette 7- 丨 A in loading lock chamber 3 in parallel to route A and route B is returned to the download lock chamber 4A. Example of cassette 7-2 A handling. The processing of wafers is performed in the order of the first wafer being route a, the second wafer being route B, the third wafer being route A, and the fourth wafer being route B. Processing within the last wafer. All the processing in the loading lock chamber 3 A inside the cassette 7-1 A and the loading lock indoor cassette and download lock chamber 4 A inside the cassette 7-2A are finished and the cassette exchange is notified to the operator The alarm is not shown in the picture. Next, a cassette containing a new unprocessed wafer is set in the load lock chamber 3A, and an empty cassette is set in the download lock chamber 4A. This operation cycle is repeated thereafter. When the operation is terminated, the main control unit 11 performs an operation end operation input and uses it to terminate the operation. End -34- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 480646 A7 B7 V. Description of the invention (32) The method is the same as in the case of "1 cassette and 1 secret operation in parallel". 2) 2 cassettes 1 secrets are operated side by side under the same process processing conditions (hereinafter, the process processing conditions are referred to as the secrets). The cassettes of the wafers that are contained and processed are sequentially processed by the lowermost or uppermost wafers in order. The cassette is selected and carried into a program processing device for program processing. The above-mentioned "1 cassette and 1 secret operation in parallel" situation is the same-^ cassette is selected in order to move the wafer to the program processing device and implement the program processing, printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read first Note on the back, please fill in this page again.) After all the wafers of this cassette have been terminated, the wafers will be moved to the next cassette processing. Cassettes 7-1A and cassettes 7-2A in the download lock chamber 4A alternately select wafers and carry them to a program processing device to perform program processing. The processing route of the wafer is the same as that in the case of the "1 cassette 1 secret parallel operation" mentioned above. After the etching processing is performed in the program processing device 2-2, the post processing is performed in the program processing device 2-1 and the original is returned The path of the cassette (referred to as the path A), and the post-processing in the program processing apparatus 2-4 after the etch processing by the program processing device 2-3 and the return to the original cassette (called the path B) The two parties deal with it. In this embodiment, the process A, B, or c, D of the processing sequence is the same as in the case of the "1 cassette and 1 secret operation in parallel". The processing of the wafers is that the first wafer is loaded in the lock chamber 3 a in the inner cassette 7-1 A in order to pass the first wafer through the route A, and the second wafer is downloaded in the lock chamber. The wafer passes through the path B. The third wafer passes through the long box 7-1 A in the load lock chamber 3 A. The second wafer passes through the path A and the fourth wafer passes through the download lock chamber. Applicable to China National Standard (CNS) A4 specifications (210 X 297 Public Love 1-35--480646 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (33) Box 7-2 A will pass the second piece Via route B, ... the last wafer in the cassette is processed. After all the wafers in the cassette 7-2A in the load lock chamber 3A or in the download lock chamber 4A are processed, the wafer in the load lock chamber 3A is processed ( Or download the lock room 4 A) The processing of the cassette is completed and the cassette exchange is to notify the operator that the alarm is not shown in the figure. The finished cassette is removed until a new caliper is set. 'Only the processing on the cali side of the other side is continued. A new cassette and a cassette in the load lock chamber 3 A and the download lock chamber 4 A are installed as described above. The selected wafer is carried into the program processing device for program processing. The operation cycle is repeated later. When the operation is completed, the main control unit Π performs operation end operation input to terminate the operation. The method of termination is the same as that described above. The situation is the same for "1 cassette 1 secret parallel operation" 3) 2 cassette 2 secret parallel operation This operation is performed by making cassette 7- 1 A in load lock chamber 3A and cassette 7 in download lock chamber 4A -2A wafer processing tips are different. In this case, the wafers carried out by cassettes 7-1 and 7-2 are not alternated, and are processed at the end of the program processing device. They are used to move the wafers to other process processing devices and transport the next wafers to The process of the program processing device is the same as in the case of "2 cassettes and 1 secret operation in parallel". This wafer or cleaning process is the same as 1) above. 4) 1 cassette 1 secret operation in-line This operation is based on the same program processing conditions (hereinafter, the program processing conditions are referred to as the secret). ---- Order · 丨 ------ (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -36- Ministry of Economy Printed by the Intellectual Property Bureau employee consumer cooperative 480646 A7 B7__ V. Description of the invention (34) The wafers in the lower or upper stages are selected from the cassettes in order and transferred to the program processing device for program processing. The aforementioned “1 cassette 1 secret parallel operation "The situation is the same. However, the processing route of the wafer is different from the case of the "1 cassette and 1 secret operation in parallel". In this "1 cassette 1 secret operation in-line", after the wafer is etched in the program processing apparatus 2-2 (or the program processing apparatus 2-3), the wafer is further processed in the program processing apparatus 2-3 (or the program processing apparatus 2- 2) After the etching process is performed, the program processing device 2-1 (or the program processing device 2-4) performs post-processing and returns to the path of the original cassette (referred to as the path E) for processing. This embodiment shows a processing example in which the wafer selected in the path E from the cassette 7-1 A in the load lock chamber 3A is returned to the cassette 7-2A in the download lock chamber 4A. The processing of wafers is based on the order of wafer E of the first wafer, E of the second wafer, E of the third wafer, e of the fourth wafer, and so on. Processing up to the last wafer. When all the processing in the cassette is completed, the processing of cassette 7-1 A in the loading lock chamber 3A and the cassette 7-2A in the download locking chamber 4A are completed and the cassette exchange is notified to the operator The alarm sounds. Next, a cassette containing a new unprocessed wafer is set in the load lock chamber 3A, and an empty cassette is set in the download lock chamber 4A. This operation cycle is repeated thereafter. When this operation is completed, the main control unit 丨 performs operation end operation input to terminate the operation. The ending method is the same as in the case of "1 cassette and 1 secret operation in parallel" described above. As explained above, 'If according to the present invention, a method for operating a vacuum processing device and a method for processing wafers can be provided, using more than two sets of procedures. The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) Dong) -37 · ---------- Installation -------- Order --------- AWI (Please read the precautions on the back before filling this page) 480646 A7 B7 V. Description of the invention (35) The processing device is used for processing. When a vacuum processing device is in operation, which of the processing rooms cannot be used due to a failure or the like, it is not restricted to the relationship of the program processing devices used to form each of the two groups. The normal processing room is used as a processing path and operated to improve the operation rate. In addition, it is possible to provide a method of operating a vacuum processing apparatus and a method of processing a wafer. With regard to a cleaning process or an aging process, a throughput rate can be improved. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized for the Chinese National Standard (CNS) A4 (210 X 297 mm) -38-

Claims (1)

々、申請專利範圍 第8 9 1 1 8 8 5 6號專利申請案 中文申請專利範圍修正本 民國91年1月修正 1 . 一種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理； 運送處理裝置，進行前述晶圓之運送；及 控制裝置，用以控制前述各程序處理裝置及運送處理裝‘置 而真空處理裝置的運轉方法，係具有至少2組之晶圓的 處理經路含進行各自前述一連串的程序處理之複數的程序 處理裝置，其特徵爲： 爲了進行前述各程序處理使各組之各程序處理裝置進 行運轉有效或運轉無效之狀態判斷， 以該判斷僅分離運轉無效之程序處理裝置， 而用以使用運轉有效之程序處理裝置，爲了進行前述 一連串之程序處理用以再構築前述處理經路， 僅使用該運轉有效之程序處理裝置並進行前述晶圓之 處S。 2 _如申請專利範圍第1項所記載之真空處理裝置的運 轉方法，係進行前述一連串不同之程序處理使複數之程序 處理裝置的2組，含程序處理裝置分別進行晶圓之第一處理 及第二處理， 並爲了進行前述各程序處理使各組之各程序處理裝置 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 、?! 經濟部智慧財產局員工消費合作社印製 4i〇646 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 ，進行運轉有效或運轉無效之狀態判斷， 以該判斷進行1組之程序處理裝置之中的第二處理而程 序處理裝置係運轉無效時，則僅分離進行該第二處理之程 序處理裝置， 並使用進行2個之第一處理的程序處理裝置及進行1個 之第二處理的程序處理裝置，用以再構築2組之處理經路爲 了進行前述一連串的程序處理， 並使用該2組之處理經路用以進行前述晶圓之處理。 3 ·如申請專利範圍第1項所記載之真空處理裝置时運 轉方法，係進行前述一連串不同之程序處理使複數之程序 處理裝置的2組，含程序處理裝置分別進行晶圓之第一處理 及第二處理， 並爲了進行前述各程序處理使各組之各程序處理裝置 ，進行運轉有效或運轉無效之狀態判斷， 以該判斷使進行1組之程序處理裝置之第一處理的程序 處理裝置，及進行另外1組之程序處理裝置之中第二處理的 程序處理裝置運轉無效時，則分離該無效之程序處理裝置 並使用進行前述另外1組之第一處理的程序處理裝置， 及進行前述1組之第二處理的程序處理裝置，用以再構築1 組之處理經路爲了進行前述一連串的程序處理， 並使用該1組之處理經路用以前述晶圓之處理。 4 . 一種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐1 一~ -2- (請先閲讀背面之注意事項再填寫本頁) 訂 480646 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 序處理； 運送處理裝置，進行前述晶圓之運送；及 控制裝置，用以控制前述各程序處理裝置及運送處理裝置； 其特徵爲： 爲了進行前述各程序處理使各組之各程序處理裝置進 行運轉有效或運轉無效之狀態判斷， 並在前述程序處理裝置發生運轉無效時，則在該程序 處理裝置進行是否有餘存晶圓之判斷， 有餘存晶圓時，則將預先被設定之複數的處理條件'之 其中之一做爲可選擇，根據該被選擇之處理條件可進行前 述餘存晶圓之處理。 5 ·如申請專利範圍第4項所記載之真空處理裝置的運 轉方法，係含處理條件，做爲前述餘存晶圓之處理條件的 選擇項之一，係用以搬出發生異常之晶圓並回收到原來之 卡匣後將發生異常之處理經路由自動運轉分離並繼續進行 處理。 6. —種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理； 運送處理裝置，進行前述晶圓之運送；及 控制裝置，用以控制前述各程序處理裝置及運送處理 裝置；其特徵爲： 爲了進行前述各程序處理使各組之各程序處理裝置進 行運轉有效或運轉無效之狀態判斷， (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -3- 480646 A8 B8 C8 D8 々、申請專利範圍 並在前述程序處理裝置發生運轉無效時，則在該程序 處理裝置進行是否有餘存晶圓之判斷， 有餘存晶圓時，做爲該餘存晶圓之處理條件可選擇以 下之（1)〜（5)， (1 )由處理中斷時間進行再試，並繼續進行處理； (2 )僅對發生異常之晶圓，以復原用之秘訣處理，由 其次之晶圓，以原來之秘訣繼續進行處理； (3 )用以搬出發生異常之晶圓，並用以搬入下次之晶 圓繼續進行處理； · (4)用以搬出發生異常之晶圓，在原來之卡匣進行回 收後，將發生異常之處理經路由自動運轉分離並繼續進行： 處理；以及 (5 )形成維修模式，進行中斷運轉。 7 . —種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理； 運送處理裝置，進行前述晶圓之運送； 控制裝置，用以控制前述各程序處理裝置及運送處理 裝置； 而爲了進行前述各程序處理用以設定自動運轉條件之 後，在用以開始自動運轉中，其特徵爲： 在前述自動運轉條件之設定’關於卡匣及處理室用以 固定複數之對關係並以運送晶圓之平行處理經路，或不使 前述卡匣及處理室之對應關係固定可設定處理經路用以運 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ，裝-- (請先閱讀背面之注意事項再填寫本頁) 、π 經濟部智慧財產局員工消費合作社印製 -4- 480646 A8 B8 C8 D8 々、申請專利範圍 送晶圓到空的處理室。 (請先閲讀背面之注意事項再填寫本頁) 8 · —種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理； 運送處理裝置，進行前述晶圓之運送； 控制裝置’用以控制前述各程序處理裝置及運送處理 裝置； 而爲了進行前述各程序處理用以設定自動運轉條件之 後，在用以開始自動運轉中，其特徵爲： · 在前述自動運轉條件之設定中，無指定處理經路時， 做爲進行一連串不同的程序處理之複數的程序處理裝置之： 組，用以自動設定處理經路含程序處理裝置之對分別進行 晶圓之第一處理及第二處理。 9 · 一種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理； 運送處理裝置，進行前述晶圓之運送； 經濟部智慧財產局員工消費合作社印製 控制裝置，用以控制前述各程序處理裝置及運送處理 裝置； 而爲了進行前述各程序處理用以設定自動運轉條件之 後，在用以開始自動運轉中，其特徵爲： 在前述自動運轉條件之設定中，對於程序處理裝置之i 組或2組之對分別進行晶圓之第一處理及第二處理，在各1 次之處理，以交替用以切換進行使用之程序處理裝置。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X：297公釐） -5- 經濟部智慧財產局員工消費合作社印製 480646 A8 B8 C8 ____ D8 夂、申請專利範圍 10· —種真空處理裝置的運轉方法，其構成係具有： 複數之程序處理裝置，進行程序處理； 運送處理裝置，進行晶圓之運送； 控制裝置，用以控制此等； 並使至少2個以上之程序處理裝置被安裝於運送處理裝 置，使用該2個以上之程序處理裝置用以處理晶圓，其特徵 爲： 在用以開始前述卡匣內之晶圓處理之前，同時用以運 送2片假晶圓到2個之程序處理裝置，以並行用以進行老化 處理。 11· 一種晶圓的處理方法，係藉由真空處理裝置，其 構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理·， 運送處理裝置，進行前述晶圓之運送； 控制裝置，用以控制前述各程序處理裝置及運送處理 裝置；其特徵爲： 爲了進行前述各程序處理使各組之各程序處理裝置進 行運轉有效或運轉無效之狀態判斷， 以該判斷僅分離運轉無效之程序處理裝置，而用以使 用運轉有效之程序處理裝置，爲了進行前述一連串之程序 處理用以再構築前述處理經路， 僅使用該運轉有效之程序處理裝置並進行前述晶圓之 處理。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） —I.-------------訂------^9 (請先閱讀背面之注意事項再填寫本頁) -6 - 480646 A8 B8 C8 __ D8 々、申請專利範圍 1 2 · —種晶圓的處理方法，係藉由真空處理裝置，其 構成係具有： 複數之程序處理裝置，對各晶圓進行一連串的不同程 序處理； 運送處理裝置，進行前述晶圓之運送； 控制裝置，用以控制前述各程序處理裝置及運送處理 裝置；其特徵爲： 爲了進行前述各程序處理使各組之各程序處理裝置進 行運轉有效或運轉無效之狀態判斷， 並在前述程序處理裝置發生運轉無效時，則在該程序 處理裝置進行是否有餘存晶圓之判斷， 有餘存晶圓時，則將預先被設定之複數的處理條件之 其中之一做爲可選擇，根據該被選擇之處理條件可進行前 述餘存晶圓之處理。 — I!---- (請先閱讀背面之注意事項再填寫本頁) 、π 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家樣準（CNS ) A4規格（210X297公釐）々, Patent application scope No. 8 9 1 1 8 8 5 6 Chinese patent application scope amendment Amendment in January of the Republic of China 1. A method for operating a vacuum processing device, which is composed of: a plurality of program processing devices A series of different programs are processed for each wafer; a transport processing device performs the aforementioned wafer transportation; and a control device for controlling the operation methods of the aforementioned program processing devices and the transport processing device and the vacuum processing device, The processing path including at least two groups of wafers includes a plurality of program processing devices that perform the aforementioned series of program processing, and is characterized in that the program processing devices of each group are enabled or disabled to perform the foregoing program processing. To determine the state, only the program processing device with invalid operation is separated, and the program processing device with effective operation is used. In order to perform the aforementioned series of program processing to reconstruct the aforementioned processing path, only the program with valid operation is used. Process the device and perform the aforementioned wafer location S. 2 _The operation method of the vacuum processing device described in item 1 of the scope of the patent application is to perform the aforementioned series of different program processing to make two sets of plural program processing devices, including the program processing device to perform the first processing of the wafer and The second process, and in order to carry out the aforementioned program processes, make the paper size of each group of each program processing device applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) ?! Printed by the Intellectual Property Bureau employee consumer cooperative of the Ministry of Economic Affairs 4i〇646 Printed by the Intellectual Property Bureau employee consumer cooperative of the Ministry of Economic Affairs printed by A8 B8 C8 D8 6. Apply for a patent scope and make a judgment of whether the operation is valid or invalid, and use this judgment to perform 1 When the second processing of the group of program processing devices is ineffective and the operation of the program processing device is invalid, only the program processing device that performs the second processing is separated, and two program processing devices that perform the first processing are used and one is performed. The second processing program processing device is used to construct two sets of processing routes in order to perform the aforementioned series of programs. Processing, and the two sets of processing routes are used for the aforementioned wafer processing. 3 · The operation method of the vacuum processing device as described in item 1 of the scope of patent application, is to perform a series of different program processing as described above to make two sets of program processing devices, including the program processing device to perform the first processing of the wafer and The second process is to make each of the program processing devices of each group perform a state judgment of whether the operation is effective or invalid in order to perform the foregoing program processing, and use this judgment to make the program processing device that performs the first processing of one group of program processing devices, And the program processing device that performs the second processing among the program processing devices of the other group is invalid, the invalid program processing device is separated and the program processing device that performs the first processing of the other another group is used, and the above-mentioned 1 The program processing device of the second processing group of the group is used to construct another processing path of the first group in order to perform the aforementioned series of program processing, and the processing path of the first group is used for the processing of the aforementioned wafer. 4. A method for operating a vacuum processing device, comprising: a plurality of program processing devices that perform a series of different passes on each wafer. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm 1 1 ~- 2- (Please read the precautions on the back before filling out this page) Order 480646 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives A8 B8 C8 D8 6. Apply for patent processing in sequence; Transport processing device for the aforementioned wafer transport; And a control device for controlling each of the foregoing program processing devices and transportation processing devices; characterized in that, in order to perform the foregoing program processing, each of the program processing devices of each group is judged as to whether the operation is effective or invalid, and is processed in the foregoing program; When the device fails to operate, the program processing device determines whether there are remaining wafers. When there are remaining wafers, one of a plurality of pre-set processing conditions is selected as an option. The selected processing conditions can be used to process the remaining wafers. 5 · As described in item 4 of the scope of patent application The operation method of the empty processing device includes processing conditions, which is one of the options for the processing conditions of the remaining wafers. It is used to remove the abnormal wafer and recover it to the original cassette. Separate and continue processing by routing automatic operation. 6. A method of operating a vacuum processing device, which has: a plurality of program processing devices that perform a series of different program processing on each wafer; a processing device that performs the aforementioned crystal processing Round transportation; and a control device for controlling the foregoing program processing devices and transportation processing devices; characterized in that: in order to perform the foregoing program processing, the program processing devices of each group are judged as to whether the operation is effective or ineffective, ( Please read the notes on the back before filling in this page) This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -3- 480646 A8 B8 C8 D8 々, patent application scope and operation in the aforementioned program processing device When it is invalid, the program processing device judges whether there are remaining wafers, The following conditions can be selected as the processing conditions for the remaining wafers: (1) to (5). (1) Retry from the processing interruption time and continue processing; (2) Only for abnormal wafers To use the secrets for recovery, follow the second wafer and continue the processing with the original secrets; (3) To carry out the abnormal wafer and use it to carry on the processing to the next wafer; · (4) It is used to carry out the abnormal wafer. After the original cassette is recovered, the abnormal processing is separated by the automatic operation of the route and continued: processing; and (5) the maintenance mode is formed to interrupt the operation. The operation method of the vacuum processing device is composed of: a plurality of program processing devices that perform a series of different program processing on each wafer; a transport processing device that performs the aforementioned wafer transportation; a control device that controls the aforementioned program processing Device and transport processing device; and for performing the foregoing program processing to set automatic operation conditions, and to start automatic operation, the characteristics are: The setting of the automatic operation conditions described above is about the parallel relationship between the cassettes and the processing chambers to fix the multiple pairs and the wafers to be processed in parallel, or to set the processing pathways without fixing the corresponding relationship between the cassettes and the processing chambers. Applicable to China National Standards (CNS) A4 specifications (210X297 mm) with this paper size, installed-(Please read the precautions on the back before filling this page), π printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs-4 -480646 A8 B8 C8 D8 々, patent application scope sends wafers to empty processing room. (Please read the precautions on the back before filling in this page) 8-A method of operating a vacuum processing device, which has: a plurality of program processing devices that perform a series of different program processing on each wafer; a transport processing device, The aforementioned wafers are transported; the control device 'is used to control the aforementioned program processing devices and transport processing devices; and in order to perform the aforementioned program processings to set the automatic operation conditions, in order to start the automatic operation, its characteristics are: · In the setting of the above-mentioned automatic operating conditions, when there is no designated processing route, as a plurality of program processing devices for performing a series of different program processing: group, which is used to automatically set the processing route and the pair of program processing devices separately. First and second processing of the wafer. 9 · A method for operating a vacuum processing device, comprising: a plurality of program processing devices that perform a series of different program processing on each wafer; a transport processing device that performs the aforementioned wafer transportation; consumption by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs The cooperative prints a control device to control the aforementioned program processing devices and transportation processing devices; and to set the automatic operation conditions in order to perform the foregoing program processing, and in order to start the automatic operation, it is characterized by: In the setting of the conditions, the first processing and the second processing of the wafer are performed respectively for the i group or the two groups of the program processing device, and the processing is performed once each to alternately use the program processing device for switching. This paper size applies to China National Standard (CNS) A4 specifications (210X: 297 mm) -5- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 480646 A8 B8 C8 ____ D8 夂, patent application scope 10 · — a kind of vacuum processing device The operation method includes: a plurality of program processing devices for performing program processing; a transport processing device for performing wafer transportation; a control device for controlling these; and at least two or more program processing devices being installed In the transport processing device, the two or more program processing devices are used to process wafers, and are characterized in that they are used to transport two dummy wafers to two at the same time before the wafer processing in the cassette is started. The program processing device is used in parallel for aging processing. 11. A method for processing a wafer by means of a vacuum processing device, the structure of which includes: a plurality of program processing devices that perform a series of different program processing on each wafer; and a transport processing device that performs the aforementioned wafer transport; A control device is used to control the aforementioned program processing devices and transportation processing devices; it is characterized in that, in order to perform the aforementioned program processing, each program processing device of each group performs a state judgment of whether the operation is effective or invalid, and only the operation is separated based on the judgment. An invalid program processing device is used to use an effective program processing device. In order to perform the aforementioned series of program processing to reconstruct the aforementioned processing path, only the program processing device that is effective to operate and perform the aforementioned wafer processing are used. This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) —I .------------- Order ------ ^ 9 (Please read the notes on the back first (Fill in this page again.) -6-480646 A8 B8 C8 __ D8 々, patent application scope 1 2 ·-a wafer processing method, using a vacuum processing device, its composition is: a plurality of program processing devices, each The wafer is processed by a series of different programs; the transport processing device performs the aforementioned wafer transportation; the control device is used to control the aforementioned program processing devices and the transport processing device; its characteristics are: Each program processing device judges whether the operation is valid or invalid, and when the foregoing program processing device fails to operate, the program processing device determines whether there are remaining wafers. When there are remaining wafers, they will be judged in advance. One of the plurality of set processing conditions is optional, and the aforementioned remaining wafer processing can be performed according to the selected processing conditions. — I! ---- (Please read the notes on the back before filling this page), π Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210X297 mm)
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