TW474855B - Electro depositted grinding wheel - Google Patents

Abstract

A vitrified bond tool comprising: a support body; a vitrified bond layer which is formed on a working surface of said support body; and a plurality of abrasive grains which are held by said vitrified bond layer so as to be fixed relative to said working surface of said support body and which are spaced apart from each other with spacing between the adjacent ones of said abrasive grains.

Description

474855 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（1 [發明領域] 本發明有關-種包含用來對藉由CMp(化學機械研磨） 裝置研磨例如半導體晶圓等被研磨材表面時所用的研磨用 研磨墊（pad)進行再磨削（c〇nditi〇ning)的再磨削器 (conditioner)等所用的電積磨輪或金屬黏接（metal b〇nd)磨 輪之具有金屬結合相的磨輪。 本說明書係依據在日本國提出的專利申請案（特願平 11-247676 號、特願平 11-247677 號、特願平 ιι·269298 號、 特願平11-3 3 87 34號、特願2000-29614號）者，而本說明 書内有一部分包含該日本申請案所記載之内容。 [以往之技術] 以往，以化學且機械方式研磨從矽錠（silic〇n ing〇t)截 切的半導體晶圓（以下簡稱晶圓）表面的CMP裝置 (Chemical Mechanical Polisbing Machine)之一例中，有如 第32圖所示的裝置。 晶圓係隨著裝置（device)之微細化而被要求可進行鏡 面研磨成高精度且無缺陷表面。利用CMP研磨之機構 (mechanism)係根據複合了使用微粒子石夕等的機械性要素 (游離磨粒）、及使用驗性液或酸性液等的姓刻（etching)要 素的機械•化學研磨法者。 此CMP裝置1，係如第32圖所示，在安裝於中心軸2 的圓板狀旋轉台3上設置有由硬質尿烧（urethane)而成的 研磨用研磨墊4’而在與此研磨墊4相對向且從研磨墊4 之中心轴2偏心的位置配置有能自轉的晶圓保持盤（carrier〕 -------—訂-- ----I---線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1 311684 A7 五、發明制（2 ) " 一 ·〜^ 5。此晶圓保持盤5係較研磨塾4之直徑為小的圓板形狀以 保持晶圓6者，而此晶圓6係配置在晶圓保持盤5與研磨 塾4之間，用來研磨研磨塾4側之表面以進行鏡面加工。 (請先閱讀背面之注意事項再填寫本頁} 研磨時，由於係將例如由上述微粒子⑦等而成的游離 磨粒作為研磨劑使用，另外將混合有姓刻用驗性液等者作 為液狀研漿（slurry) 3而供給於研磨墊4之故，此研漿8將 在晶圓保持盤5所保持的晶圓6與研磨墊4之間流動，由 於晶圓保持盤5,晶圓6會自轉，同時研磨塾4將以中心 軸2為中心旋轉，故晶圓6之一面將被研磨墊4研磨。 在進行晶圓6之研磨的硬質尿烷製等的研磨墊4上設 置有多數個用以保持研漿s的微細發泡層，並以保持在此 等發泡層内的研漿s進行晶圓6之研磨。由於反覆進行晶 圓6之研磨將使研磨墊4之研磨面之平坦度下降或塞目， 而產生晶圓6之研磨精度及研磨效率下降的問題。 因此’向來在CMP裝置1上，如第32圖所示，設置 有研磨墊再磨削器8，以進行研磨墊4表面之再研磨或再 磨削（conditioning)。 經濟部智慧財產局員工消費合作社印製 此研磨墊再磨削器8，於設置在旋轉台3外部的旋轉 軸9上’透過臂〗〇設置有電積磨輪〗〗，利用旋轉軸使臂 1〇旋轉，在旋轉的研磨墊4上使電積磨輪U來回搖動， 並研磨研磨墊表面，以恢復或維持研磨墊4表面之平坦度 等’並解除塞目。或亦可在晶圓保持盤5上裝附電積磨輪 11而研磨。 此電積磨輪11 ’如第33圖（A)及（B)所示，係在圓形 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 2 311684 A7 A7 經濟部智慧財產局員工消費合作社印製 311684 五、發明說明（3 ) 板狀支座金屬12上，# 使上面形成平面狀，且按預定寬幅形 t環狀磨石粒層13’此磨石粒層13，例如第34圖所示， 係在支座金屬12上利用電鍍等將金剛石或CBN等超磨石 =14 ’以金屬電鍍相15予以分散固定。此金屬電鍍相15 係由例如鎳等所構成者。 卜在磨石粒層！ 3表面按例如45。等之間隔往直 徑方向形成有凹溝17，，、； # mi 苒7以使研漿S或切削粉末通過此凹溝 17而排出外部。 另外’在使用如此電積磨輪„以進行研磨墊4之研磨 的情形下’電積磨輪U係在研磨墊4上以至少相當於研磨 塾之半仏的距離進行來回搖動。如以分散配置在磨石粒 層13的超磨石粒14研磨，會將起毛-邊推倒，一邊切斷。 此時’由於超磨石粒14僅從成為磨削面的磨石粒層。之 表面突出大約超磨石粒14之平均粒徑之1/3左右，所以磨 石粒層13整個將完全碰撞使磨削壓力分散並滑動，以致有 起毛不被切斷而推倒，刀割效果不佳且容易塞目的缺點。 又另外有一種例如日本專利特開平9_19868號公報 所記載的電積磨輪。 .此電積磨輪聚集2至1〇個超磨石粒並配設成一個島 狀且藉由將此等島狀之超磨石粒分散配置於作為磨削面 的磨石粒層表面，以防土磨削時之塞目，而達成長時間的 磨削加工為目的者。如此的電積磨輪，係在支座金屬上進 行遮罩（masklng)而形成島狀之底電鍍，在此底電鍍部以電 鍍將2至1 〇個超磨石粒暫時固定一層份，然後將支座金屬 I -----I I II--- I I I i I — I 訂— — 1 — — - (請先閱讀背面之注意事項再填寫本頁) 4/4855 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 ‘ A7 B7 五、發明說明（4 ) 全體電鍍，以使超磨石粒電積於磨石粒層者。 然而’由於如此的電積磨輪，係在平坦的支座金屬表 面上使超磨石粒電積而固定，故磨石粒層之金屬電鍍相表 面與從此表面突出的超磨石粒的高度差，實質上僅為超磨 石粒之平均粒徑之1 /2以下程度。 因此’如將此電積磨輪作為研磨墊再磨削器使用時， 則被削材為由CMP裝置1之研磨墊4等具有發泡層的厚度 1.7mm等且軟質之起毛所構成，並在其下侧具備配設有厚 度3.5111111左右之執墊（(；113]1丨〇11)層的軟質或具柔軟性的構造 的情形下，在超磨石粒之平均粒徑之1 /2以下程度之高低 差而&，磨石粒層表面全體將會完全碰撞。於是磨削壓力 不會聚集在超磨石粒而分散至周圍並滑動，以致起毛不被 切斷而倒下，而有刀割效果不佳’發泡層之開口崩潰，切 削粉末之排出變成不充分，研磨墊容易塞目的缺點。 又，由於磨石粒層之超磨石粒與金屬電鍍相表面的高 低差（間隙）小’所以亦有研磨墊4之磨削液（例如純水）被潑 出而容易乾燥，以致損及濕式磨削作業的缺點。 [發明揭示] 本發明係鑒於上述的實情而以提供一種具有切割效果 佳，且切削粉末等之排出性良好的電積磨輪等之金屬結合 相的磨輪為目的。 又，本發明之其他目的係以提供一種研磨墊之發泡層 開口之切口銳利，且不會塞目而能保持發泡層内之研衆的 上述磨輪者。 311684 -------------— I I i 丨 i I 訂---— — — — — — (請先閱讀背面之注意事項再填寫本頁)474855 Printed by A7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the invention (1 [Field of the invention] The present invention relates to a method for grinding the surface of a material to be polished, such as a semiconductor wafer, by a CMP (Chemical Mechanical Polishing) device. The polishing pad used for polishing is a conditioner for re-grinding (connitioning), etc. The metal wheel is used for the electrodeposited grinding wheel or metal bond grinding wheel. This grinding wheel is based on a patent application filed in Japan (Japanese Patent Application No. 11-247676, Japanese Patent Application No. 11-247677, Japanese Patent Application No. 269298, Japanese Patent Application No. 11-3 3 87 34 No., No. 2000-29614), and a part of this specification contains the content described in the Japanese application. [Previous Technology] In the past, silicon ingots (silicone ing〇t) were chemically and mechanically ground. An example of a CMP device (Chemical Mechanical Polisbing Machine) on the surface of a cut semiconductor wafer (hereinafter referred to as a wafer) is the device shown in Fig. 32. The wafer is being miniaturized as the device is miniaturized. Request to enter The mirror surface is polished to a high-precision and defect-free surface. The mechanism using CMP polishing is based on the combination of mechanical elements (free abrasive particles) using fine particles such as stone slab, and the use of test liquids or acid liquids. Mechanical and chemical polishing of elements. This CMP apparatus 1 is made of hard urethane on a disc-shaped rotary table 3 mounted on a central axis 2 as shown in FIG. 32. A polishing pad 4 ′ is provided with a wafer carrier capable of rotation at a position facing the polishing pad 4 and being eccentric from the central axis 2 of the polishing pad 4. ---- I --- line (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 1 311684 A7 V. Invention System (2 ) " I · ~ ^ 5. This wafer holding disc 5 is a disc shape with a smaller diameter than the grinding 塾 4 to hold the wafer 6, and this wafer 6 is arranged on the wafer holding disc 5 and polishing塾 4 is used to grind the surface of 塾 4 side for mirror processing. (Please read the precautions on the back first Write this page} During grinding, for example, free abrasive grains made of the above-mentioned fine particles ⑦ are used as an abrasive, and a mixture of a test liquid for the last name and the like is supplied as a slurry 3. Because of the polishing pad 4, the slurry 8 will flow between the wafer 6 held by the wafer holding disc 5 and the polishing pad 4. Since the wafer holding disc 5 is used, the wafer 6 will rotate and the polishing pad 4 will Rotating around the central axis 2, one side of the wafer 6 will be polished by the polishing pad 4. A plurality of fine foamed layers for holding the slurry s are provided on a polishing pad 4 made of hard urethane or the like for polishing the wafer 6, and crystallized with the slurry s held in the foamed layers. Grinding of circle 6. The repeated polishing of the wafer 6 will cause the flatness of the polishing surface of the polishing pad 4 to be reduced or clogged, which will cause the problems of reduced polishing accuracy and polishing efficiency of the wafer 6. Therefore, as shown in FIG. 32, the CMP apparatus 1 has been provided with a polishing pad re-sharpener 8 for re-grinding or conditioning the surface of the polishing pad 4. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed this grinding pad re-sharpening device 8 on a rotating shaft 9 provided on the outside of the rotary table 3 'through the arm'; 'the electric grinding wheel is provided'; and the arm is used to make the arm 1 〇 Rotate, rotate the electrowinning grinding wheel U on the rotating polishing pad 4 and polish the surface of the polishing pad to restore or maintain the flatness of the surface of the polishing pad 4 and so on. Alternatively, the wafer holding disc 5 can be polished by attaching an electrowinning wheel 11. As shown in Figure 33 (A) and (B), the electro-abrasive grinding wheel 11 'is in the form of a circular paper. The Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied. 2 311684 A7 A7 Ministry of Economy Wisdom Printed by the Consumer Cooperative of the Property Bureau 311684 V. Description of the invention (3) On the plate-shaped support metal 12, # the upper surface is formed into a flat shape, and a ring-shaped grindstone layer 13 is formed in a predetermined width. 13. For example, as shown in FIG. 34, a superabrasive stone such as diamond or CBN = 14 'is dispersed and fixed on the support metal 12 by electroplating or the like. The metal plating phase 15 is made of, for example, nickel. Bu in the millstone grain layer! For 3 surfaces, press 45, for example. The grooves 17,,,; # mi 苒 7 are formed at equal intervals in the radial direction so that the slurry S or cutting powder passes through the grooves 17 and is discharged to the outside. In addition, 'in the case of using such an electric grinding wheel to perform grinding of the polishing pad 4', the electric grinding wheel U is shaken back and forth on the polishing pad 4 at a distance equivalent to at least half of the grinding 塾. Grinding the superabrasive grains 14 of the grindstone layer 13 will push the fluff-side down and cut at the same time. At this time, 'because the superabrasive grains 14 are only from the grindstone layer which becomes the grinding surface. The average particle size of the grindstone particles 14 is about 1/3, so the entire grindstone particle layer 13 will completely collide, dispersing and sliding the grinding pressure, so that the fluff is not cut and pushed down, the cutting effect is not good and it is easy to plug. Purpose and disadvantage. There is also another type of electrowinning wheel described in, for example, Japanese Patent Laid-Open No. 9_19868. This electrowinning wheel gathers 2 to 10 superabrasive stones and is arranged in an island shape. The island-shaped superabrasive grains are dispersedly arranged on the surface of the grinding grain layer as a grinding surface, in order to prevent clogging during soil grinding and achieve long-term grinding processing. Such an electrolytic grinding wheel is a system Masking on the support metal to form an island Bottom plating, in this bottom plating part, 2 to 10 superabrasive stone particles are temporarily fixed in a layer by plating, and then the support metal I ----- II II --- III i I — I order — — 1 — —-(Please read the precautions on the back before filling out this page) 4/4855 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs' A7 B7 V. Description of the invention (4) The whole is electroplated so that the superabrasive grains are electrolyzed However, because of such an electro-abrasive grinding wheel, the super-grindstone particles are electro-deposited and fixed on a flat support metal surface, so the surface of the metal plating phase of the grindstone particle layer and the surface protruding from this surface. The height difference of the superabrasive stone particles is substantially only less than 1/2 of the average particle size of the superabrasive stone particles. Therefore, if this electrowinning wheel is used as a polishing pad re-grinding device, the material to be cut is Composed of polishing pads 4 such as CMP device 1 with foam layer thickness of 1.7mm, etc., and soft fuzz, and a pad with a thickness of about 3.5111111 ((; 113) 1 丨 〇11) In the case of a layer with a soft or flexible structure, the average particle size of the superabrasive grains The difference between the heights below 1/2 and & the entire surface of the grindstone grain layer will completely collide. Therefore, the grinding pressure will not collect on the supergrind grain and spread to the surrounding and slide, so that the fluff will not be cut and will fall down. However, the cutting effect of the cutting layer is not good, the opening of the foam layer collapses, the discharge of the cutting powder becomes insufficient, and the polishing pad is easy to plug. The disadvantage is that the superabrasive grains of the grindstone layer and the surface of the metal plating phase The height difference (clearance) is small, so there is also a disadvantage that the grinding liquid (such as pure water) of the polishing pad 4 is spilled and is easy to dry, which damages the disadvantages of the wet grinding operation. [Disclosure of the Invention] The present invention is based on the above-mentioned In fact, the purpose is to provide a metal-bonded grinding wheel having a good cutting effect and a good discharge of cutting powder and the like, such as an electrowinning grinding wheel. In addition, another object of the present invention is to provide a sharpened notch in an opening of a foamed layer of a polishing pad, which can keep the researcher's grinding wheel in the foamed layer without blocking the eyes. 311684 -------------— I I i 丨 i I Order --- — — — — — — (Please read the notes on the back before filling this page)

·Α7· Α7

經濟部智慧財產局員工消費合作社印製 A7 ------------一 Β7 _ 五、發明說明（6 ) 粒層底部料磨削液之料切肖彳粉末之排純佳且在超磨 石粒之部分不會發生切削粉末的塞目。 小磨石粒層部亦可將從相鄰接的小磨石粒層部間之磨 石粒層底部的高度設為超磨石粒之平均粒徑以上。 將磨；5粒層之小磨石粒層部與磨^粒層底部的間 隙設為超磨石粒之平均粒徑以上，而可大大確保且不致完 全碰撞之下’使小磨石粒層部之超磨石部能維持高磨削麼 :且刀割效果銳利，能在磨石粒層底部保持磨削液等之同 時，切削粉末之排出性較佳，使切削粉末不致在超磨石粒 之部分發生塞目而排出性佳。 又犬部亦可形成具有角落R部及頂部的略圓柱狀， 亚在此等角落R部及頂部配設有超磨石粒。磨削時，可以 角落R部之超磨石粒進行粗磨削’接著以頂部之超磨石粒 進行精加工磨削。 、 亦了得各小磨石粒層部所設置而成的超磨石粒設 為11至500個，且以平面觀察時，相對於磨石粒層總面積 的超磨石粒所佔的比例可設定為2〇%至8〇%的範圍。 如超磨石粒少於11個，則不能連續實行對研磨塾4 的粗磨削及精加H而若多於500個，則有容易引起 超磨石粒之塞目的缺點。又，如超磨石粒之面積少於2〇%， 則在磨削時可此超磨石粒會脫落而使壽命變短，也可能在 研磨墊等之被削材上因超磨石粒扎刺而損傷，又如超過 80%時，則有可能引起電積磨輪的塞目。 又，小磨石粒層部係亦可除了磨石粒層表面之外 --------^----------^ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中_家標準（CNS)A4規格_(2Κ) χ挪公复） 6 311684 474855 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明（7 ) 域以外，排列在中央領域，使磨 僧輪搖動以進行磨削加工。 //小磨石粒層部係亦可除了磨石粒層表面之令央 領域之外’排列在周邊領域， 、 ,^ ^ — 使磨輪旋轉以進行磨削 加工之情形下，由於係在昤了 M 、在 了轉迷小的中央領域之外，配 設超磨石粒而能進行有效率的磨削加工。 、又’根據本發明的磨輪’磨石教層具備中央領域及周 邊領或π在中央領域，係按互相隔著間隔之方式形成有 複數個前述小磨石粒㈣’而對該小磨石粒層部以金屬社 合相分別裝附有複數個超磨石粒，在周邊領域，係超磨石 粒以金屬結合相裝附而纟’且周邊領域較中央領域，其超 磨石粒之集中度為高。 由於磨削時，電積磨輪之磨削面係周邊領域較中央領 域，其超磨石粒之集中度為高，磨削面將在外周側領域之 磨石粒層安定地接觸被削材，所以平面平衡較佳而能抑制 磨削時之振動，並且可以中央領域之小磨石粒層部之超磨 石粒進行磨削壓力較高且刀割效果銳利的磨削加工。又， 由於在小磨石粒層部設置超磨石粒，而可使小磨石粒層部 與相鄰接的小磨粒層部間的磨石粒層底部的高低差變大， 即使係CMP裝置之研磨墊等比較軟質之被削材也不致完 全碰撞而以小磨石粒層部之超磨石粒與被削材接觸進行磨 削’可維持高磨削壓力且刀割效果銳利。 另外’外周側領域之超磨石粒亦可個別分散配置於金 屬結合相中。或者亦可與中央領域同樣方式構成複數個小 磨石粒層部’並將此等複數個小磨石粒層部之相互間隔配 I ^----- (請先閱讀背面之注意事項再填寫本頁) 訂. --線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 311684 474855 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8 ) 設成較中央領域為小。或者，亦可將間隔設成與中央領域 相同之同時，將固定黏接在1個小磨石粒層部的超磨石粒 之個數設成較中央領域者為多。 有關本發明的磨輪’其特徵為：磨石粒層係在略中央 排列複數個且形成用以吐出磨削液的開口而成的小磨石粒 層部。. 由於在小磨石粒層部之略中央設置對其周圍之超磨石 粒供給磨削液的開口’而可直接對超磨石粒的磨削點供給 磨削液，並不致使各種磨削屑沈下滯積在超磨石粒間而可 排出，且降低因磨削屑之混合所引起的磨削液的黏性以順 利排出’且亦可促進超磨石粒之冷卻以抑制損傷。 又，亦可在小磨石粒層部（突部）以外之領域形成有排 出路。由於磨削液之供給源及排出路係隔著小磨石粒層部 之磨削點而配設在兩側，因而可將兩者之距離儘量縮短， 使磨削液充分流至磨削點，並防止磨削屑滯積在超磨石粒 以順利沖流。 又，小磨石粒層部之開口可使其直徑在0〇 5至3 之範圍。如P开1 口之直徑⑷較〇_5mm為小，則不能充分供給 磨削液於磨削點’而若超過3 .Omm，則小磨石粒層部存在 比例下降以致磨削能力下降，所以不理推。 又，突部之直徑（D)亦可為開口直徑（“的2至ι〇倍。 如在此範圍’則可防止磨_滯積於磨削點，而可順利地 沖流 相對於支座金屬的突部之高度可為〇 j至5 〇m ---I--------I --------訂·-------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） 8 311684 經 濟 部 智 慧 財 產 局 員 工 消 費 合 社 印 製 474855 五、發明說明（9 ) 圍。如在此範圍，則可在磨削點與在支座金屬上的排出路 之間’容易使磨削液或磨削屑流動以排岀。 相鄰接的突部間之距離（L)可為突部之平均外徑之 1/3至2倍之範圍。如在此範圍，則能恰當設定小磨石粒 層部之間隔並能維持較高的超磨石粒之磨削壓力，同時， 通過此間隙可將各種磨削屑藉由磨削液順利予以排出。 磨石粒層亦可形成複數層之環狀或螺旋狀。由此，可 使與被削材之相對移動方向略成平行的方向之各磨石粒層 之磨削長度之和，在與被削材之移動方向略成垂直相交^ 任意位置’形成均等。X，如以3層以上之複數層構成磨 石粒層時，則容易使在與略平行於被削材之相對移動方向 的方向略成垂直相交的任意位置的磨石粒層領域之面積之 和成為均等。 、 排出路可形成在在直徑方向隔著間隔所配置的複數層 磨石粒層之間。排出路可由，形成在各磨石粒層内之相^ 接的小磨石粒層部之間的副排出路、及形成環狀或螺旋狀 而在直徑方向相鄰接的複數層磨石粒層之間的主排出路而 成。在小磨石粒層部的磨削所產生的各種磨削層將與小磨 石粒層部之開口所供給的磨削液一起被沖出而流動於副排 出路，再經過主排出路後排出至外部，而可容易排出，並 可抑制磨削屑沈下滯積在超磨石粒之間。 又，小磨石粒層部亦可在金屬結合相之厚度方向僅固 疋黏接一層超磨石粒，將此稱為單層磨輪。 本發明之具有金屬結合相的磨輪，小磨石粒層部可具 a ^ (CNS)ATiF(210 ；297 i — 311684 I --- (請先閱讀背面之注意事項再填寫本頁) 訂： --線· 474855 A7 五、發明說明（l〇 B7 有相對 於 通過支座金 屬 中 心 的直 徑 傾斜的 第 1 小磨石粒層 部 Λ 以及 往 或反方 向 傾 斜的第2 小 磨 石 粒層 部 由 於 第 1及第2 小 磨 石 粒層 部 金屬之 中 心 方向，故 磨 削 時 之穩 座 接觸面 積 或接觸壓力 安 定 因此 不 不會對被 削 材發生局 部 性 損 害0 並 石粒層 部 係 配設成對 中 心 線 以正 反 在相對移 動 的被削材 與 上 述 磨輪相 粒層部 之 磨 削長度雖較長 且 容易 塞 層之磨 削 長度較短， 而 可 消 除塞 S 低。因 此 將 以精細之 方 式 進行磨 削 抑制磨 削 時 之微小振 動 〇 又 第 1及第2 小 磨 石 粒層 部 比者， 如 穩 座安定性 獲 改 善 且縱 寬 能力。 又 小 磨石粒層 部 可 為 互相 分 經 濟 列成放 射 狀 者。又， 磨 石 粒 層可 為 部 智 部交互 排 列 在支座金 屬 之 圓 周方 向 慧 財 產 移動的 被削 材與上述 磨 輪 之 相互 之 局 員 T 粒層部 之 一 方係磨削 長度較 長且 容 消 費 削長度較 短 ，故能消 除 塞 目 並防 止 A 社 由一邊 交 互 進行磨削 時 之 塞 目及 其 印 製 可抑制磨 削 時之微小 振動 並 可維持 本紙張尺度適用中國國家標準（CNS)A4規格(_21Q x 297公土- 邊進行磨削 311684 ---------------------訂·-------- (請先閱讀背面之注意事項再填寫本頁)Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ------------ One B7 _ V. Description of the invention (6) The material of the grinding liquid at the bottom of the granular layer is cut into small powder. In addition, clogging of cutting powder does not occur in the part of the superabrasive grain. The small grindstone particle layer portion may also have a height of the bottom of the grindstone particle layer between the adjacent small grindstone particle layer portions to be equal to or larger than the average particle size of the superground stone. The gap between the small grindstone layer of the 5 grindstone layer and the bottom of the grindstone layer is set to be larger than the average particle size of the supergrindstone, which can greatly ensure that the small grindstone particle layer is not completely collided. Can the superabrasive stone part maintain high grinding: the cutting effect is sharp, while the grinding fluid can be maintained at the bottom of the grindstone layer, the cutting powder has better discharge, so that the cutting powder will not be in the superabrasive stone. Partial clogging occurred and good drainage was achieved. The dog part can also be formed into a substantially cylindrical shape with a corner R part and a top part, and super abrasive stones are arranged in the corner R part and the top part. During grinding, the super-grindstone grains in the corner R can be used for rough grinding ', and then the super-grindstone grains on the top can be used for finishing grinding. The proportion of super-grindstone grains in the small-grindstone grain layer is set to 11 to 500, and when viewed in a plane, the proportion of super-grindstone grains relative to the total area of the millstone grain layer It can be set in the range of 20% to 80%. If there are less than 11 superabrasive grains, the rough grinding and fine addition of H to the grindstone 4 cannot be performed continuously. If there are more than 500, there is a disadvantage that the superabrasive grains are easily clogged. In addition, if the area of the superabrasive stone particles is less than 20%, the superabrasive stone particles may fall off during grinding, which shortens the life of the superabrasive stone particles. It may also be caused by the superabrasive stone particles on the ground material such as a polishing pad. Puncture and damage, and if it exceeds 80%, it may cause clogging of the electrowinning wheel. In addition, the small grindstone layer can also be used in addition to the surface of the grindstone layer -------- ^ ---------- ^ (Please read the precautions on the back before filling in this Page) Applicable to this paper standard _ Home Standard (CNS) A4 Specification _ (2KK) χ Norwegian Gongfu) 6 311684 474855 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The description of the invention (7) is listed outside the domain In the central area, the monk wheel is shaken for grinding. // The small grindstone layer can also be arranged in the surrounding area in addition to the central area of the surface of the grindstone layer. ， ^ ^ — In the case of rotating the grinding wheel for grinding processing, it is In addition to M, outside of the small central area, super-grind grains can be arranged for efficient grinding. And "the grinding wheel according to the present invention" has a central area and a peripheral collar or π in the central area, and a plurality of the aforementioned small millstone grains are formed at intervals from each other, and the small millstone is The grain layer part is equipped with a plurality of superabrasive grains with a metal phase. In the surrounding area, the superabrasive grains are attached with a metal bonding phase and the surrounding area is relatively central. Concentration is high. When grinding, the grinding surface of the electroplated grinding wheel is more peripheral than the central area, and the concentration of superabrasive grains is high. The grinding surface will be in stable contact with the material to be cut in the layer of grinding stones in the outer peripheral area. Therefore, the plane balance is better and the vibration during grinding can be suppressed, and the superabrasive grains of the small grinding stone grains in the central area can be used for grinding processing with high grinding pressure and sharp cutting effect. In addition, since the super-grindstone particles are provided in the small-grindstone particle layer portion, the height difference between the bottom of the stone-grain layer between the small-grindstone particle layer portion and the adjacent small-grind particle layer portion can be increased. The relatively soft material such as the polishing pad of the CMP device does not completely collide, and grinding is performed by contacting the superabrasive particles of the small grindstone layer with the material to be cut. 'It can maintain high grinding pressure and sharp cutting effect. In addition, superabrasive grains in the 'peripheral side' area may be individually dispersed and arranged in the metal-bound phase. Or you can form multiple small grindstone layers in the same way as in the central area, and arrange the intervals between these multiple small grindstone layers ^ ----- (Please read the precautions on the back before (Fill this page) Order.-Line · This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 311684 474855 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention (8) It is set smaller than the central area. Alternatively, the interval can be set to be the same as that in the central area, and the number of superabrasive particles fixedly adhered to a small grindstone layer portion can be set to be larger than those in the central area. The grinding wheel 'according to the present invention is characterized in that the grindstone grain layer is a small grindstone grain layer portion formed by arranging a plurality of grindstone grain layers at an approximately center and forming an opening for discharging a grinding fluid. The opening of the grinding fluid supply to the surrounding superabrasive grains is provided at the slightly center of the small abrasive grain layer portion, so that the grinding fluid can be directly supplied to the grinding point of the supergrind grains, which does not cause various grinding. Chips sink and accumulate between the superabrasive grains and can be discharged, and reduce the viscosity of the grinding fluid caused by the mixing of the grinding chips for smooth discharge ', and can also promote the cooling of the superabrasive grains to suppress damage. Further, a discharge path may be formed in a region other than the small grindstone layer portion (projection portion). The supply source and discharge path of the grinding fluid are arranged on both sides with the grinding point of the small grindstone layer part, so the distance between the two can be shortened as much as possible, so that the grinding fluid can fully flow to the grinding point. , And prevent the grinding debris from stagnating in the superabrasive grains to smoothly flow. In addition, the opening of the small grindstone grain layer portion can have a diameter ranging from 0.05 to 3. If the diameter 开 of the P opening is smaller than 0-5mm, the grinding fluid cannot be sufficiently supplied at the grinding point. If it exceeds 3.0mm, the proportion of the small grinding stone particle layer will decrease, which will cause the grinding capacity to decrease. So ignore it. In addition, the diameter (D) of the protrusion can also be 2 to ι0 times the diameter of the opening ("in this range" can prevent the grinding and stagnation at the grinding point, and can smoothly flow against the support The height of the metal protrusion can be 0j to 5 0m --- I -------- I -------- Order · -------- (Please read the back first Note: Please fill in this page again.) This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 public meals). 8 311684 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economy 474855 5. Description of invention (9). If it is within this range, it is possible to easily allow the grinding fluid or grinding chips to flow between the grinding point and the discharge path on the support metal. The distance between adjacent protrusions (L) may be It is a range of 1/3 to 2 times the average outer diameter of the protrusion. If it is within this range, the interval between the small grindstone grain layer portions can be properly set and the grinding pressure of the superabrasive stone grain can be maintained at the same time. Through this gap, various grinding debris can be smoothly discharged by the grinding fluid. The grindstone grain layer can also form a ring or spiral shape of multiple layers. Therefore, the relative movement with the material being cut can be made. The sum of the grinding lengths of the grindstone grain layers in a slightly parallel direction intersects slightly perpendicularly with the moving direction of the material being cut ^ Arbitrary positions' are formed equal. X, for example, if three or more layers are used to form the grinding In the case of the stone grain layer, it is easy to make the sum of the areas of the grinding stone grain layer in any position slightly orthogonal to the direction slightly parallel to the direction of the relative movement of the material being cut. The discharge path can be formed in the diameter The direction is between a plurality of grindstone grain layers arranged at intervals. The discharge path can be formed by a sub-drainage path between the small grindstone grain layer parts which are connected in each grindstone grain layer, and form a ring shape. Or spirally, the main discharge path between a plurality of grindstone grain layers adjacent to each other in the diameter direction. Various grinding layers produced by grinding in the small grindstone grain layer portion will be related to the small grindstone grain layer. The grinding fluid supplied from the opening of the part is flushed out and flows through the secondary discharge path, and then discharged to the outside after passing through the main discharge path. It can be easily discharged, and it can prevent the grinding debris from sinking and staying in the superabrasive particles. In addition, the small millstone grain layer portion can also be thicker than the metal-bonded phase. In the direction, only one layer of superabrasive stone particles is fixed and bonded, which is called a single-layer grinding wheel. In the grinding wheel with a metal bonding phase of the present invention, the small grinding stone particle layer portion may have a ^ (CNS) ATiF (210; 297 i — 311684 I --- (Please read the precautions on the back before filling out this page) Order:-Wire · 474855 A7 V. Description of the invention (10B7 has the first small mill inclined with respect to the diameter passing through the metal center of the support The stone grain layer portion Λ and the second small millstone grain layer portion inclined toward or in the opposite direction are stable due to the center direction of the metal of the first and second small millstone grain layer portions. Therefore, the stable contact area or contact pressure during grinding is stable. Therefore, there is no local damage to the material being cut. 0 The stone grain layer part is arranged to be centered to move relative to the front and back. The grinding length of the grain layer part of the grinding wheel is relatively long and Easy to plug layer, the grinding length is shorter, and the plug S can be eliminated. Therefore, grinding will be performed in a fine manner to suppress the small vibrations during grinding. 〇 Compared with the first and second small grinding stones, the stability of the seat is improved and the width is improved. And the small grindstone layer part can be economically arranged in a radial pattern. In addition, the grinding stone grain layer can be arranged by the Ministry of Intelligence and the Ministry of Intelligence alternately arranged in the circumferential direction of the support metal and the moving material of the cut material and the grinding wheel. The length is short, so it can eliminate the jamming and prevent the company A from grinding and printing on one side. It can suppress the small vibration during grinding and maintain the paper size. It is applicable to Chinese National Standard (CNS) A4. (_21Q x 297 public soil-while grinding 311684 --------------------- Order · -------- (Please read the note on the back first (Fill in this page again)

;、發明說明（11 ) 小磨石粒層部具有相對於 尚之中心線往—W 過支座金屬中心的直徑方 分。磨削時之稃;^ 分，以及往反方向傾斜的部 1石… 性佳，不易產生微小振動，並且小; Description of the invention (11) The small grindstone grain layer portion has a diameter square relative to the center line of the -W through the metal center of the support.稃 points when grinding; ^ points, and the part inclined in the opposite direction 1 stone ... Good performance, not easy to generate micro vibration, and small

磨石粒層部之—部公 J ^ , ^ a ^ 及/、他刀的一方為磨削長度較長，The part of the grain layer of the grinding stone-the ministry J ^, ^ a ^ and /, one of the other blades has a longer grinding length,

容易塞目，惟另—古兔# w e K 為磨削長度較短，故能消除塞 防止刀割效果之降低。 龙月b 磨石粒層部可具有成為曲線狀且配設成隔著中 心線在兩側相對向且面對面或沿著中心線挪移的第3小磨 石粒層部及第4小磨石粒層部。 小磨石粒層部可配列於支座金屬之全面，可更促進磨 削量之提升及塞目之消除。 本發月之電積磨輪之特徵為：小磨石粒層部係使單一 之超磨石粒以金屬、结合相固定黏接而成者。 由於各超磨石粒係按一個一個之方式固定黏接在各突 部之上，所以磨削屬或研漿等不致於堵塞在超磨石粒間並 滞積而成固結層，而可順利排出。並且，被削材即使係如 CMP裝置之研磨墊般的軟質者，仍不致完全碰撞而僅以小 磨石粒層σ卩之單超磨石粒接觸以進行磨削，故磨削壓力 較咼，刀割效果佳且磨削屑之排出性亦良好。 又，小磨石粒層部，亦可在支座金屬之突部上面所形 成的凹部内固定黏接有超磨石粒。在製造磨輪時，如將超 磨石粒載置於突部之凹部，並以電鍍等予以固定黏接，則 超磨石粒之定位容易之同時，能使超磨石粒之結晶體之稜 角部以朝向上方前端之方式突出而載置，且磨削精度或磨 --------------裝·--------訂----- ------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 297公爱） 11 3U684 經濟部智慧財產局員工消費合作社印製 A7 丨"""一 ’""""一…—- B7 _ 五、發明說明（I2 ) 削效率等磨削性能較高。 又’突部之外徑（D)可為超磨石粒之平均粒徑之1 3至 倍之範圍。如在此範圍，則可防止在磨削點的磨削屑之 滯積而順利將之沖洗，如較丨3倍為小，則突部之強度將 下降，且因磨削阻力使超磨石粒容易脫落，突部容易缺損， 如較3倍為大’則超磨石粒之配置間隔過大以致產生磨削 能力下降或加速超磨石粒之磨耗等缺點。 又’相對於支座金屬的突部高度可在〇 〇5至3 〇mm 之範圍。如在此範圍，則在磨削點與支座金屬上之排出路 之間可容易沖洗並排出磨削液或磨削屑。 有關本發明的電積磨輪之特徵為：超磨石粒係短而結 實的（blocky)超磨石粒。 短而結實的超磨石粒，雖較不規則的（irregUlar)超磨石 粒其刀割效果為劣，惟由於稜角部為不太突出的正六角形 等之正多角形或近似球狀之故，稜角部或稜線部等不易破 碎或脫落’因而不易產生因破碎的破片等，又，磨削時不 致於過削之故’被削材上不易產生刮痕。並且即使係短而 結實的超磨石粒’藉由以單一而互相分散設置，或在使複 數個短而結實的超磨石粒集合的狀態’將以金屬結合相固 疋黏接的小磨石粒層予以互相分散設置，可減少超磨石粒 之絕對數之同時，於各個小磨石粒層部如係單一超磨石粒 之情形，稜角部之切刻或刀割效果佳，又，如係複數個超 磨石粒之集合之情形，由於外周側之超磨石粒之列係在其 棱線進行磨削之故’切刻及刀割效果較佳而能確保磨削能 --裝·-------1 訂·----------線 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 12 311684 474855 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（13 v 力。 又，亦可在小磨石粒層部固定黏接有複數個超磨石 粒，而其外周侧之超磨石粒可為短而結實的超磨石粒。在 短而結實的超磨石粒之内側領域，因與其他磨石粒的關係 使刀割效果不佳，惟在無其他磨石粒之外周側之面，在其 稜角部及稜線部之切刻及刀割效果比較良好之故，可良好 地磨削加工被削材。小磨石粒層部所設置的超磨石可設為 1至500個，以平面觀察時相對於前述磨石粒層總面積的 超磨石所佔比率可設定為2%至8〇%之範圍。 又’本發明之電積磨輪亦可為CMP再磨削器。 [圖面之簡單說明] 第1圖係本發明第1實施形態的電積磨輪之磨削面之 平面圖。 第2圖係第i圖所示的電積磨輪之中央縱向剖面圖。 第3圖係第2圖所示的電積磨輪之小磨石粒層部之要 部放大剖面圖。 苐圖（A)至（D)係表示實施形態的電積磨輪之製過 程。 第5圖係使用實施形態的電積磨輪磨削後的研磨墊之 一部分的500倍照片。 第6圖係使用具有以往例之構造的電積磨輪磨削後的 研磨墊之—部分的500倍照片。 第7圖係本發明第2實施形態的電積磨輪之磨削面之 平面圖。 --------------裝--------訂--------*線 {請先閱讀背面之注意事項再填寫本頁)It is easy to plug the eyes, but the other— 古 兔 # w e K is a shorter grinding length, so it can eliminate the plug and prevent the reduction of the cutting effect. Longyue b The grindstone grain layer portion may have a third grindstone grain layer portion and a fourth grindstone grain portion that are curved and arranged to face each other across the center line and face to face or along the center line. Layer Department. The small grindstone layer can be arranged in the full range of the support metal, which can further promote the improvement of the grinding amount and the elimination of the clogging. The feature of the electrowinning wheel of this month is that the small grindstone grains are formed by a single superabrasive grain fixedly bonded with a metal and a bonding phase. Since each superabrasive grain is fixed and adhered to each protrusion one by one, the grinding genus or mortar can not be blocked between the superabrasive grains and stagnated to form a consolidated layer. Smooth out. In addition, even if the material to be cut is soft like a polishing pad of a CMP device, it does not completely collide, but only contacts with a single superabrasive grain of a small abrasive grain layer σ 卩 for grinding, so the grinding pressure is relatively high. , Good cutting effect and good discharge of grinding debris. In addition, the small grindstone grain layer portion may be fixed and bonded with a superabrasive grindstone in a recess formed on the upper surface of the protrusion of the support metal. In the manufacturing of grinding wheels, if the superabrasive stone particles are placed on the recesses of the protrusions and fixed and adhered by electroplating, the positioning of the superabrasive stones is easy, and the corners of the crystals of the superabrasive particles can be easily made. It is placed and protruded toward the upper front end, and the grinding accuracy or grinding -------------- install · -------- order ----- --- --- line (please read the notes on the back before filling this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Employee Cooperatives This paper is printed in accordance with the Chinese National Standard (CNS) A4 specification (210 297 public love) 11 3U684 Ministry of Economy Wisdom A7 printed by the Consumer Cooperative of the Property Bureau 丨 " " 一 '" " " " 一 ...—- B7 _ 5. Description of the invention (I2) The grinding performance such as cutting efficiency is high. The outer diameter (D) of the protrusion may be in a range of 13 to twice the average particle diameter of the superabrasive grains. If it is in this range, it can prevent the stagnation of the grinding debris at the grinding point and flush it smoothly. If it is less than 3 times, the strength of the protrusion will decrease, and the superabrasive stone will be caused by the grinding resistance. The grains are easy to fall off and the protrusions are easy to be damaged. If it is 3 times larger, the arrangement interval of the superabrasive grains is too large, which causes the disadvantages such as reduced grinding capacity or accelerated wear of the superabrasive grains. The height of the protrusion relative to the support metal may be in the range of 0.05 to 30 mm. If it is within this range, it is easy to rinse and discharge the grinding fluid or grinding chips between the grinding point and the discharge path on the support metal. The electrodeposition grinding wheel of the present invention is characterized in that the superabrasive grains are short and blocky superabrasive grains. Short and strong superabrasive grains, although the cutting effect of irregUlar superabrasive grains is inferior, but because the corners are regular polygons such as regular hexagons that are not too prominent or nearly spherical , Corners, ridges, etc. are not easy to break or fall off, so it is not easy to produce broken fragments, etc., and it is not to be over-cut during grinding, and it is not easy to produce scratches on the material being cut. And even if the short and strong superabrasive grains are 'separated by being arranged in a single or in a state where a plurality of short and strong superabrasive grains are assembled', the small abrasives that are firmly bonded by a metal bond The stone grain layers are dispersedly arranged to reduce the absolute number of superabrasive grains. At the same time, if each small millstone grain layer is a single superabrasive grain, the effect of cutting or slicing at the corners is good. In the case of a collection of a plurality of superabrasive grains, because the row of superabrasive grains on the outer side is ground at its ridgeline, the cutting and cutting effects are better, and the grinding energy can be guaranteed- -Packing -------- 1 Ordering ----------- Line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 specifications ( 210 X 297 mm) 12 311684 474855 A7 printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. A description of the invention (13 v force. In addition, a plurality of superabrasive stones can be fixedly adhered to the small millstone grain layer. , And the super-grindstone particles on the outer peripheral side may be short and firm super-grindstone particles. Inside the short and firm super-grindstone particles In the field, the cutting effect is not good because of the relationship with other grindstone particles. However, on the outer peripheral side of the surface without other grindstone particles, the cutting and cutting effects at the corners and edge lines are relatively good. The material to be cut is well ground. The number of super-grindstones in the small grindstone layer can be set to 1 to 500, and the ratio of the super-grindstones to the total area of the above-mentioned grindstone in the plane view can be It is set in the range of 2% to 80%. The electrowinning wheel of the present invention may also be a CMP resharpener. [Simplified description of the drawing] FIG. 1 is a view of the electrowinning wheel of the first embodiment of the present invention. Plan view of the grinding surface. Fig. 2 is a central longitudinal sectional view of the electrodeposited grinding wheel shown in Fig. I. Fig. 3 is an enlarged section of a main portion of the small grindstone layer of the electrodeposited grinding wheel shown in Fig. 2. Figures (A) to (D) show the manufacturing process of the electrodepositive grinding wheel of the embodiment. Figure 5 is a 500-times photograph of a part of the polishing pad after being grinded using the electrodepositive grinding wheel of the embodiment. Figure 6 This is a 500-times photograph of a part of a polishing pad after being grinded using an electrode wheel with the structure of the conventional example. The plan view of the grinding surface of the electrodeposited grinding wheel of the second embodiment. -------------- installation -------- order -------- * line (Please read the notes on the back before filling this page)

297公釐） 13 311684 474855 A7 R7 經濟部智慧財產局員工消費合作社印製 五、發明說明（14 ) 第8圖係第7圖所示的電積磨輪之中央縱向剖面圖。 第9圖係本發明第3實施形態的電積磨輪之磨削面之 平面圖。 第10圖係第9圖所示的電積磨輪之中央領域及周邊領 域之部分放大剖面圖。 第11圖係裝上本發明第4實施形態的磨輪之磨石粒層 的面之平面圖。 第12圖係第i丨圖所示的磨輪之第2磨石粒層之部分 放大圖。 第13圖係第12圖所示的磨輪之B-B線剖面圖。 第14圖（A)至（C)係表示第4實施形態的磨輪之製造過 程圖。 第1 5圖係就第11圖所示的磨輪以一點虛線隔開的半 圓部分’表示於研磨墊之旋轉方向的磨石粒層位置與工 量的關係圖。 第1 6圖係第5實施形態的磨輪之平面圖。 第17圖係第6實施形態的磨輪之平面圖。 第18圖係第17圖所示的磨輪之磨石粒層之部分放大 圖 面圖 圖 (請先閱讀背面之注意事項再填寫本頁) 第19圖係表示小磨石粒層部之其他形態的cw 線剖 第20圖係第7實施形態的磨輪之磨石粒層之部分放大 第2 1圖係第8實施形邊的磨輪之磨石粒層之部分放 大 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 474855 A7 B7 五、發明說明（15) 圖。 第22圖係第9實施形態的磨輪之磨石粒層之部分放大 圖。 ' (請先閱讀背面之注意事項再填寫本頁) 第23圖係第10實施形態的磨輪之磨石粒層之部分放 大圖。 第24圖係裝上第11實施形態的磨輪之磨石粒層的面 之平面圖。 第25圖係第24圖所示的磨輪之磨石粒層之部分放大 圖。 第26圖係第25圖所示的磨輪之小磨石粒層部之 線剖面圖。 第27圖（A)至（E)係表示第1]_實施形態的磨輪之製造 過程圖。 第28圖係第12實施形態的磨輪之平面圖。 第29圖係表示小磨石粒層部之突部的變形形者，（a) 係其他1個突部之平面圖及中央縱向剖面圖、（B)係另i個 突部之平面圖及側面圖。 經濟部智慧財產局員工消費合作社印製 第30圖係表示將超磨石粒二維投影後的像之2個對稱 軸之最長直徑之比者，（A)、（B)、（C)係表示短而結實的超 磨石粒、（D)係表示不規則的超磨石粒的圖。 第3 1圖係第30圖所示的小磨石粒層部之平面圖。 第32圖係以往之CMP裝置之要部斜視圖。 第33圖係第32圖所示的電積磨輪之為部分平面 圖、（B)、為（A)之A-A線縱向剖面圖。 15 311684 本紙張尺i適用中國國家標準（CNS)A4規格（21G X 297公楚] ------ 474855 A7 _B7_ 五、發明說明（16 ) 第34圖係第33圖所示之磨石粒層之部分縱向剖面 圖。 (請先閱讀背面之注意事項再填寫本頁) [元件符號之說明] 經濟部智慧財產局員工消費合作社印製 3 旋轉台 4 研磨墊 5 晶圓保持盤 8 再磨削器 10 臂 14 超磨石粒 19 支座金屬 19a 支座金屬的略成圓形的一面 20 電積磨輪（電積研磨盤）20a 磨削面 21 小丘部（突部） 21a 角落R部 21b 頂部 21c 側壁 22 磨石粒層 22a 磨石粒層底部 24 小磨石粒層部 25 金屬電鍍相 25a 底電鍍層 25b 第1金屬電鍍相 25c 第2金屬電鍍相 117 凹溝 120 電積磨輪（電積研磨盤 )122 磨石粒層 124 中央領域 126 周邊領域 127 凸平面部 217 導引溝 220 磨輪（單層磨刀石） 222 支座金屬 222a 一面 222A 第1磨石粒層 222B 第2磨石粒層 222C 第3磨石粒層 225 小丘部（突部） 226 開口 228 小磨石粒層部 230 通水路 232 副排出路 234 主排出路 320 磨輪（單層磨刀石） 322 支座金屬 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 16 311684 叶/叶OJJ 經濟部智慧財產局員工消費合作杜印製 五、發明說明（Π 322a —面 326小磨石粒層 332副拂出路 340磨輪 360磨輪 372 磨石粒層 374A小磨石粒層部A 374a小磨石粒層部a之 422 支座金屬 424磨石粒層 424B第2磨石粒層 425 小丘部（突部） 426 凹部 426A凹陷部 428 小磨石粒層部 431 主排出路 440 磨輪 442A第1磨石粒層 442C第3磨石粒層 518A超磨石粒列 S 研漿 h 面度 L 離開距離 P 研磨墊之移動方 324磨石粒層 330金屬結合相 336 小丘部（突部） 35〇磨輪 370磨輪 374 小磨石粒層部 3 74B小磨石粒層部b —半374b小磨石粒層部a之另一半 422a —面 424A第1磨石粒層 424C第3磨石粒層 425a小丘部之上面 426a開口部 427 金屬結合相 4 3 0 副排出路 434 遮罩部 442 磨石粒層 442B第2磨石粒層 518 超磨石粒 0 小丘部外握 Η 高度 Κ 發泡層開口 ρ 研磨墊旋轉方向 向 Ph 磨盤旋轉方肖 --------------裝--- (請先閱讀背面之注意事項再填寫本頁) -I5J1 . --線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐 17 311684 474855 Α7 Β7297 mm) 13 311684 474855 A7 R7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (14) Figure 8 is the central longitudinal section view of the electrodeposited grinding wheel shown in Figure 7. Fig. 9 is a plan view of a grinding surface of an electrodeposited grinding wheel according to a third embodiment of the present invention. Fig. 10 is an enlarged cross-sectional view of a part of a central area and a peripheral area of the electrodeposited grinding wheel shown in Fig. 9. Fig. 11 is a plan view of the surface of the grindstone grain layer on which the grinding wheel according to the fourth embodiment of the present invention is mounted. Fig. 12 is an enlarged view of a part of the second grinding stone grain layer of the grinding wheel shown in Fig. I 丨. Fig. 13 is a sectional view taken along the line B-B of the grinding wheel shown in Fig. 12. Figures 14 (A) to (C) are diagrams showing the manufacturing process of the grinding wheel according to the fourth embodiment. Fig. 15 is a diagram showing the relationship between the position of the grindstone grain layer and the amount of work in the direction of rotation of the polishing pad with respect to the semicircular portion of the grinding wheel shown in Fig. 11 separated by a dotted line. Fig. 16 is a plan view of a grinding wheel according to a fifth embodiment. Fig. 17 is a plan view of a grinding wheel according to a sixth embodiment. Figure 18 is an enlarged view of a part of the grinding stone grain layer of the grinding wheel shown in Figure 17 (please read the precautions on the back before filling this page). Figure 19 shows other forms of the small grinding stone grain layer. Figure 20 of the cw line section is an enlarged view of a part of the grindstone grain layer of the grinding wheel of the seventh embodiment. Fig. 21 is an enlarged view of a part of the grindstone grain layer of the grinding wheel of the 8th embodiment. CNS) A4 specification (210 X 297 mm) 474855 A7 B7 5. Description of the invention (15) Figure. Fig. 22 is an enlarged view of a part of the grindstone grain layer of the grinding wheel according to the ninth embodiment. '(Please read the precautions on the back before filling out this page) Figure 23 is an enlarged view of a part of the grindstone grain layer of the grinding wheel in the tenth embodiment. Fig. 24 is a plan view of the surface of the grindstone grain layer on which the grinding wheel of the eleventh embodiment is mounted. Fig. 25 is an enlarged view of a part of the grindstone grain layer of the grinding wheel shown in Fig. 24; Fig. 26 is a line sectional view of a small grindstone layer portion of the grinding wheel shown in Fig. 25; 27 (A) to (E) are diagrams showing the manufacturing process of the grinding wheel according to the first embodiment. Fig. 28 is a plan view of a grinding wheel according to a twelfth embodiment. Fig. 29 shows a deformed shape of a protrusion of a small grindstone layer portion, (a) is a plan view and a central longitudinal sectional view of another one protrusion, and (B) is a plan view and a side view of another i protrusion . Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 30 shows the ratio of the longest diameters of the two axes of symmetry of the image after the two-dimensional projection of superabrasive grains. (A), (B), (C) (D) is a diagram showing irregular and superabrasive grains. Figure 31 is a plan view of the small grindstone layer shown in Figure 30. Fig. 32 is a perspective view of a main part of a conventional CMP apparatus. Fig. 33 is a partial plan view of the electrodeposited grinding wheel shown in Fig. 32, and (B) is a longitudinal sectional view taken along line A-A of (A). 15 311684 This paper ruler applies the Chinese National Standard (CNS) A4 specification (21G X 297 Gongchu) ------ 474855 A7 _B7_ V. Description of the invention (16) Figure 34 is the millstone shown in Figure 33 Partial longitudinal section of the grain layer. (Please read the precautions on the back before filling out this page) [Explanation of component symbols] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3 Rotary table 4 Polishing pad 5 Wafer holding disk 8 Grinder 10 Arm 14 Superabrasive stone 19 Support metal 19a Slightly rounded surface of support metal 20 Electrolytic grinding wheel (electrolytic grinding disc) 20a Grinding surface 21 Hillock (projection) 21a Corner R Part 21b, top 21c, side wall 22, grindstone layer 22a, grindstone layer bottom 24, small grindstone layer section 25, metal plating phase 25a, bottom plating layer 25b, first metal plating phase 25c, second metal plating phase 117, groove 120, electroplated grinding wheel (Electrolytic grinding disc) 122 Grinding stone layer 124 Central area 126 Peripheral area 127 Convex flat portion 217 Guide groove 220 Grinding wheel (single-layer sharpening stone) 222 Support metal 222a One side 222A First grinding stone grain layer 222B Second Grinding stone layer 222C 3rd grinding stone layer 225 small Hill (protrusion) 226 Opening 228 Small millstone grain layer part 230 Water passage 232 Sub-discharge path 234 Main discharge path 320 Grinding wheel (single-layer whetstone) 322 Support metal This paper applies the Chinese national standard (CNS) A4 Specifications (210 X 297 mm) 16 311684 Leaf / leaf OJJ Dumpling production by the Intellectual Property Bureau of the Ministry of Economic Affairs, employee printing Du V. Description of the invention (Π 322a-surface 326 small millstone grain layer 332 pairs of roads 340 grinding wheels 360 grinding wheels 372 grinding Stone grain layer 374A Small millstone grain layer part A 374a Small millstone grain layer part A 422 Support metal 424 Millstone grain layer 424B Second millstone grain layer 425 Hilly part (protrusion) 426 Recessed part 426A Recessed part 428 Small grindstone layer section 431 Main discharge path 440 Grinding wheel 442A 1st grindstone layer 442C 3rd grindstone layer 518A Superabrasive stone column S Grinding h Plane L Departure distance P Moving pad 324 grinding stone Grain layer 330 Metal bonding phase 336 Small hill part (projection) 35 grind wheel 370 grind wheel 374 small grind stone grain part 3 74B small grind stone grain part b —half 374b the other half of the small grind grain grain part a 422a — Surface 424A, first grinding stone grain layer 424C, third grinding stone grain layer 425a, upper surface 426a opening portion 427 Metal bonding phase 4 3 0 Sub-discharge path 434 Masking section 442 Grinding stone layer 442B Second grinding stone layer 518 Super grinding stone 0 Outer grip of the hillock part Height K Foam layer opening ρ The direction of rotation of the polishing pad Ph Grinding Plate Rotating Square Shaw -------------- Install --- (Please read the precautions on the back before filling this page) -I5J1. --Line · This paper size applies to Chinese national standards (CNS) A4 specifications (210 X 297 mm 17 311684 474855 Α7 Β7

G 内徑 磨削 五、發明說明（ 磨削方向 D1 m 深度 q Μ 小丘部（突部）間之距離 [本發明之最佳實施形態] 以下使用所附圖面說明本發明之實施形態。在此與上 述之以往技術相同之部分，使用同一符號而省略其說明。 第1圖及第2圖所示實施形態的電積磨輪2〇(電積研 磨盤）’係在例如由不銹鋼等而成的圓板形支座金屬19之 略成為圓形的一面i 9a上，按預定間隔形成有略圓柱狀之 小丘部2 1 (突部），且在一面】9a之表面形成磨石粒層22， 並將其表面作為磨削面2〇a。另外，小丘部21係在除了一 面19a外周側之環狀周邊領域23以外的中央領域中，排列 成略格子狀或網目狀。 磨石粒層22係在例如由Ni(鎳）而成的金屬電鍍相25 中配置有金剛石或cBN等之超磨石粒14，而例如依電鍍 所製作者。並且超磨石粒14係僅固定黏接在各小丘部2 1 上’而不設置在小丘部21與小丘部21之間的磨石粒層底 部仏。在小丘部21中’將沿著其略圓柱狀之表面所設置 的超磨石粒14及金屬電鐘相25而成的磨石粒層22之領域 作為小磨石粒層部2 4。 於第3圖所示之小磨石粒層部24中，支座金屬”之 各小丘部2 1係由形成於整個周圍的側壁2 1 c及角落R部 21a以及頂部21b所形《，且於其表面全體 25固定黏接有例如u至5〇〇袖“ ^ 屬電鍍相 J如U至500個左右之超磨石粒 n Bn ft m In n nf i m - ri I HB —fl i I 1·1. It —EJ ff He vsm n m HI flu n I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 474855 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（19 ) 成。如超磨石粒14較1 i個為少， 為 則不能較連續實施對研 磨墊4的粗磨削及精加 ^ ^ 削’而較500個為多則有容易 引起超磨石粒之塞目的缺點。 各小磨石粒層部24係將最大直徑D作成為01至 版m範圍，從磨石粒層底部22a之高度h作成為超磨石 粒14之平均粒徑以上，較 平乂佳為千均粒徑之2倍以上，將超 磨石粒14之平均粒徑作成為 战马lmm以下，例如設定為0.1mm 至0.7賴左右。使高u作成為超磨石粒14之平均粒徑 以上之原因’係為了在進行研磨墊4磨削時，僅超磨石粒 14接觸研磨墊4而進行磨削加工以狀μ益 忠刖加工以防止磨石粒層底部22a 接觸研磨墊4。在此，各小磨石粒層部24係在同一高度者。 並且，在電積磨輪20之平面觀察下，相對於磨削面 2〇a總面積的超磨石粒14面積係設定為2〇%至8〇%之範 圍。如超磨石粒Μ之面積少於2〇%，則在磨削時超磨石 粒14有可能脫落而使壽命變短之同_，也可能因超磨石粒 14扎刺研磨墊4而傷及研磨墊4,又，如超過8〇%則有可 能產生電積磨輪20上之塞目。 本實施形態所用的電積磨輪2〇係如上之構成者，接 著，就電積磨輪20之製造方法，依第4圖說明如下。 第4圖（Α)中，以蝕刻（ethching)等除去例如由sus 3〇4 等而成的圓板形支座金屬19之一面19a，並按格子狀留下 複數個略成圓柱狀之小丘部21A…。以蝕刻除去的部分係 成為底部22A。具體而言，亦可將硫酸或硝酸等以高壓喷 射喷吹至一面19a’或使用電解蝕刻或放電加工，留下小 I 1 — — — — — — — — I I I · ! J I 1 f I I ^ · I ! 1 i I--- (請先閱讀背面之注意事項再填寫本頁) 474855 A7 B7 發明說明（2〇 丘部21A…而飾刻其他部分。如此，第4圖⑻所示之小丘 部21A將留下格子狀的凹凸面而形成於一面上。各小 丘部21土為具備有預定之外徑d及高度η的略圖柱狀。 接著，就此-面，採用喷砂打光（sh〇tbiast)或桶 ^研磨（barrel grindlng)等研磨各小丘部2! a之邊緣，藉以 =成如第4圖（C)所示之經倒角加卫的略成圓柱狀之小丘 P 或者亦可採用模具成型形成如第4圖（c)所示之 支座金屬。 接著，參照第3圖就超磨石粒14之電鍍說明如下。將 除了各小丘部21..·以外之部分予以遮罩⑽也叫），對各小 丘郤21之全面，作為底電鍍層25a施以例如由叫&〜 等亦可）而成的薄層底電錄。接著，採用電鍍在底電錢層 25a上，藉由例如由叫〜々等亦可）而成的第！金屬電 鑛相25b將複數個超磨石粒14進行固定黏接。欲後，從一 面⑽亲，i離遮罩片（刪klngsheet)，採用電鍍再度對全面 形成例如由Nl(Cu、Cr等亦可）而成的第2金屬電錢相〜。 在此，底部22A可以不用形成第2金屬電鐘相〜。在此 情形下，支座金屬19之底部22A將構成磨石粒層底部 22a ° 如此，便可形成以底電鍍層25a、第】及第2金屬電 鍵相25b、25c而成的金屬電鑛相25固定黏接超磨石粒μ 消 五 線- 的第3圖及第4圖⑼所示之磨石粒層^，並 輪20。 預還 此外，在上述說明中，係除了電積磨輪2〇之磨削面 本紙張尺度適用中國國家標準（CNS)A4規格（21Q X 297公;t )------—______ 20 311684 474855 五、發明說明（21 ) 2〇a之周邊領域23皆排列多數個小磨石粒層部24...，惟不 必受限於此，亦可在磨削面2〇a全面’排列形成小磨 層部24。 (請先閱讀背面之注意事項再填寫本頁) 本實施形態的電積磨輪20係具備有上述構成者，在第 32圖所#⑽裝置1之臂10上裝上電積磨輪20的狀態 下進行研磨墊4之再磨削時，對於例如在旋轉的旋轉台 3上之研磨墊4使臂1G搖動’藉以使電積磨輪⑽來回搖 動，並磨削研磨墊4以恢復或維持其平坦度。 當磨削之際，在電積磨輪20之各小磨石粒層部“首 先可使用角落R部21a之超磨石粒14進行研磨墊4之粗 磨削，接著使用連續於角落&部21a的頂部2ib之超磨石 粒14進行精加工磨削。並且當磨削之際，超磨石粒"係 從小丘部2!之角落尺部⑴沿著頂部m固定結接著， 由於磨石粒層22之磨削面全體與研磨墊4接觸也不會完全 碰撞，而係僅以小磨石粒層部24之超磨石粒14接觸並進 灯磨削，故可維持較高之施加於超磨石粒14的磨削壓力且 刀割效果銳利。 經濟部智慧財產局員工消費合作社印製 因此’由於研磨墊4之發泡層之開口可銳利地切斷而 不致使開口崩潰，故可維持較高的研漿8保有能力。並且， 由於不會完全碰撞之故，磨削時發泡層内部之磨削液不致 潑出而以含有水分的狀態進行磨削。 又’即使小磨石粒層部24之角落r部213之一部分 超磨石粒14磨耗，仍可以剩餘之角落尺部21&之超磨石 粒14繼續進行磨削以延長電積磨輪2〇之耐用命。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） 21 311684 474855 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（22 ) 再者，在磨削時，由於僅以小磨石粒層部2 4之超磨石 粒14接觸研磨墊4而磨石粒層底部22a不接觸研磨塾4 之故’可將磨削液滯留在小磨石粒層部24與小磨石粒層部 24之間的磨石粒層底部22a，並且可通過磨石粒層底部22a 排出切削粉末。 其次’將使用本實施形怨的電積磨輪20磨削研磨塾4 後的狀態，表示於第5圖。第5圖係研磨墊4表面之500 倍的照片。圖中，研磨墊4之表面係發泡層之開口 k不致 崩潰而銳利地被磨削而可恢復平坦度。由此，在進行晶圓 等之研磨（polishing)時，以能使研漿s等充分滯留於研磨 塾4之發泡層内的狀態恢復研磨墊4平坦度。 相對於此，第6圖表示使用以電鏟使超磨石粒固定黏 接於平坦的支座金屬上之底電鍍層’並將與磨石粒層底面 之間的高低差形成超磨石粒之平均粒徑之1/2以下的上述 以往例之構成的電積磨輪磨削研磨墊4的狀態。第6圖係 研磨塾4表面之500倍的照片。由此可看出，由於磨石粒 層之磨削面大約完全碰撞，使得研磨墊4表面的起毛被政 倒’且發泡層之開口 k大大地崩潰以致塞目。因此，研磨 塾4之研漿s之保持能力不足以致研磨墊4之加工性惡 化。 如上述’於本實施形態中，由於磨石粒層底部22a不 會接觸而使小磨石粒層部24之超磨石粒14接觸研磨塾以 進行磨削之故，從粗磨削至精加工磨削作業可連續進行， 且施加至超磨石粒14的磨削壓力高，而刀割效果佳，又可 — 1 丨 — — — — — — — — — — _ I I I I ---訂 - - --------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（cns)A4規格（21〇 x 297公釐） 22 311684 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 23 311684 474855 五、發明說明（23 使研磨墊4之發泡層之開口不致崩潰而銳利地磨削。又， 超磨石粒14中不致殘留切削粉末，不會塞目且切削粉末之 排出性佳。並且能在小磨石粒層部24,24間之磨石粒層底 部22a保持磨削液以抑制研磨墊4之發泡層内之磨削液被 潑出’且不致使研磨塾之再磨削變成乾式而可維持為進行 濕式磨削的良好水分保持狀態。 △其次，參照第7圖及第8圖說明本發明之第2實施形 態。與上述第1實施形態相同的部分、構件、則使用相同 符號說明之。 第7圖及第8圖所示第2實施形態的電積磨輪3〇中， 支座金屬19之一面19a上形成有磨石粒層22，而磨石粒 層22之中央領域31貝,】未設置小磨石教層部24，於周邊領 域32中按同心圓狀之方式複數層排列有多數之小磨石粒 層部24...至外周緣止。或同心圓的多數小磨石粒層部μ... 係往圓周方向及直徑方向互相分離，相鄰接的小磨石粒層 部24,24間係為磨石粒層底部22a。 並且’一面！9a上所設置的磨石板層22係僅於各小磨 石粒層部24以金屬電鍍相25分別固定純有複數個超磨 石粒14…。 本實施形態的電積磨輪30’可安裝於晶圓支持盤5並 在對研磨墊4成為偏心的位置使之旋轉同時進行磨削研磨 塾^用以替代再磨削器8。在此情形，由於電積磨輪30 之中央領域3!之轉速較小，磨削能力亦較小，故未設置有 小磨石粒層部24在磨削效率方面較為有利。 本紙張尺度適用中(CNS)A4 g⑽χ 297公楚〉 裝--------訂----------線 (請先閱讀背面之注意事項再填寫本頁) 幷/4奶 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐 24 A7 五、發明說明（24 ) 另外’取代具備有f 2實施形態的同心、圓狀之小磨石 粒層部24…的電積磨輪3〇,亦可在周邊領域_螺旋狀 配:又小磨石粒層部24..•。在此情形，亦可獲得與第2實施 形態同樣之作用效果。亦可按格子狀或網目狀等任意之間 隔排列小磨石粒層部24。又，此等小磨石粒層部Μ之排 列構成’亦可設置於磨削面2〇a之全面。 又，上述實施形態中，係將小磨石粒層部24及小丘部 21形成為略圓柱狀，惟小磨石粒層部24及小丘部21之形 狀並非受此限制者，而係只要從磨石粒層底部22a的高度 Η在超磨石粒14之平均粒徑以上即可，例如示可為半球狀 或三角錐形狀等之凸曲面狀。 其次’說明本發明之第3實施形態。 本實施形態的電積磨輪120(電積研磨盤）之基本構成 為與第1實施形態的電積磨輪20相同，磨石粒層122係使 其表面為磨削面20a，將中央之略圓形領域作為中央領域 12 4 ’將其外側之環狀領域作為周邊領域12 6。 於第9圖及第1〇圖所示支座金屬19之一面19a中， 在中央領域12 4上以預定間隔按格子狀或網目狀排列形成 有複數個略圓柱狀之小丘部21.“，在周邊領域ι26上形成 有例如成為寬幅3mm左右之小寬幅的環狀平坦面之凸平 面部127。小丘部21…及凸平面部127係作成為同樣高度。 於中央領域124’磨石粒層22係僅在各小丘部21上 以金屬電鍍相25固定黏接有複數個超磨石粒14，小丘部 2 1與小丘部2 1之間係作為僅由金屬電鍍相2 5而成的磨石 311684 ^ I------^--------^ (請先閱讀背面之注意事項再填寫本頁) 474855 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（25 ) 粒層底部22a而並未設有超磨石纟14。另外，在磨石粒層 底部22a上未設置有金屬電鍍相25亦可，在此情形時，I 座金屬之表面將露出以構成磨石粒層底部22a。於小丘 部2!中’磨石粒層22係沿著其略圓柱狀之表面設置超磨 石粒14及金屬電鍍相25的小磨石粒層部24。 本實施形態的電積磨輪12〇之製造方法係與第i實施 形態略同。參照第10圖說明金屬電鍍相25之製作方法如 下。於小磨石粒層部24中，支座金屬19之各小丘部21 係由形成於整個周圍的側壁21c及角落尺部2U以及頂部 21b所形成，在其表.面全體則有例如Η至個左右之超 磨石粒14以金屬電鍍相25固定黏接著。 在周邊領域126，在環狀之凸平面部127上有超磨石 粒14以金屬電鍍相25 —個一個地分散固定著，而此等超 磨石粒14與小磨石粒層部24位於同樣高度H。並且，周 邊領域126之超磨石粒14之集中度係作成為較中央領域 124之超磨石粒14之集中度為高者。 另外’在中央領域124及周邊領域126中，參照第10 圖’就超磨石粒14之電鍍說明如下。除凸平面部127及各 小丘部2 1...以外者予以遮罩，並對凸平面部127及各小丘 部21之全面施以作為底電鑛層25a、25b之例如由Ni(Cu、 Cr等亦可）而成的薄層之底電鍍。接著，利用電鍍在底電 鍍層25a、25b上’藉由例如由Ni(Cu、Cr等亦可）而成的 第1金屬電鍍相2 5c、25d固定黏接複數個超磨石粒14。 然後’從一面2 1 a剝離遮罩片並利用電鍍對全面再度形成 丨 — I— —lit I 1 I ϊ I 1 I --------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公愛） 25 311684G Internal diameter grinding 5. Description of the invention (grinding direction D1 m depth q Μ distance between hillocks (protrusions) [best embodiment of the present invention] The following describes the embodiment of the present invention using the drawings. Here, the same parts as those of the conventional technology described above are designated by the same reference numerals and their descriptions are omitted. The electrodeposited grinding wheel 20 (the electrodeposited grinding disc) of the embodiment shown in FIGS. 1 and 2 is made of, for example, stainless steel. On the slightly circular side i 9a of the formed disc-shaped support metal 19, slightly cylindrical hillock portions 2 1 (protrusions) are formed at predetermined intervals, and grinding stones are formed on the surface of 9 a Layer 22, and its surface is referred to as a grinding surface 20a. In addition, the hillock portions 21 are arranged in a grid-like or mesh-like manner in a central region other than the annular peripheral region 23 on the outer peripheral side of the one surface 19a. The stone grain layer 22 is made of, for example, superabrasive grains 14 such as diamond or cBN, which are arranged in a metal plating phase 25 made of Ni (nickel). For example, the superabrasive grains 14 are fixed only. Adhered to each of the hillock portions 2 1 ′ and not provided on the hillock portions 21 and 21 The bottom of the grindstone layer is 仏. In the hillock part 21, the area of the grindstone layer 22 formed by the super-grindstone particles 14 and the metal electric clock phase 25 arranged along its almost cylindrical surface. As the small grindstone grain layer portion 24. In the small grindstone grain layer portion 24 shown in FIG. 3, each of the small hill portions 21 of the supporting metal "is formed by the side walls 2 1c and corners around the entire periphery. The R portion 21a and the top portion 21b are shaped ", and are fixedly adhered to the entire surface 25 with, for example, u to 500 sleeves." A metal plating phase, such as U to 500 or more superabrasive grains n Bn ft m In n nf im-ri I HB —fl i I 1 · 1. It —EJ ff He vsm nm HI flu n I (Please read the precautions on the back before filling this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 474855 Economy A7 is printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau. 5. Description of the invention (19). If the number of superabrasive particles 14 is less than 1 i, the rough grinding and finishing of the grinding pad 4 cannot be implemented continuously. ^ If the number is more than 500, there is a disadvantage that it is easy to cause the plugging of super-grindstone grains. Each small millstone grain layer portion 24 has a maximum diameter D of 01 to 1 m The height h of the bottom 22a of the grindstone layer is made to be more than the average particle size of the supergrind particles 14, which is more than two times the thousand-average particle size. The value is less than 1 mm, for example, about 0.1 mm to 0.7 mm. The reason why the high u is equal to or larger than the average particle size of the superabrasive grains 14 is that only the superabrasive grains 14 are used when the grinding pad 4 is being ground. The grinding process is performed while contacting the polishing pad 4 so as to prevent the bottom 22 a of the grain layer from coming into contact with the polishing pad 4. Here, the small grindstone grain layer portions 24 are connected at the same height. In addition, the area of the superabrasive grains 14 with respect to the total area of the grinding surface 20a under the plane observation of the electrolytic grinding wheel 20 is set in a range of 20% to 80%. If the area of the superabrasive grains M is less than 20%, the superabrasive grains 14 may fall off during grinding, which shortens the life span. It may also be caused by the superabrasive grains 14 piercing the abrasive pad 4 If the polishing pad 4 is damaged, if it exceeds 80%, it may cause clogging on the electrowinning grinding wheel 20. The electrowinning grinding wheel 20 used in this embodiment is the one having the above structure. Next, the manufacturing method of the electrowinning grinding wheel 20 will be described with reference to FIG. 4 as follows. In FIG. 4 (A), one surface 19a of the disc-shaped support metal 19 made of, for example, sus 300 and the like is removed by etching or the like, and a plurality of slightly cylindrical small pieces are left in a grid shape.丘 部 21A…. The portion removed by etching becomes the bottom 22A. Specifically, sulfuric acid or nitric acid may be sprayed to a side 19a 'under high pressure or electrolytic etching or electric discharge machining may be used, leaving small I 1 — — — — — — — — III ·! JI 1 f II ^ · I! 1 i I --- (Please read the precautions on the back before filling out this page) 474855 A7 B7 Invention description (2〇 丘 部 21A ... and other parts are engraved. So, the small hill shown in Figure 4) The portion 21A will be formed on one surface with a grid-like uneven surface. Each of the hillock portions 21 is a sketched columnar shape having a predetermined outer diameter d and a height η. Then, on this surface, sandblasting is used ( sh〇tbiast) or barrel grindlng to grind the edge of each hillock 2! a, so that = into a slightly cylindrical hillock guarded by chamfering as shown in Figure 4 (C) P Alternatively, the support metal as shown in Fig. 4 (c) can also be formed by a mold. Next, the electroplating of superabrasive grains 14 will be described with reference to Fig. 3. Except for each hillock part 21 .. · The part is also covered by a mask (also called), and the whole of each hillock is 21, and the bottom plating layer 25a can be applied by, for example, & ~ etc. It consists of thinly bottom electrical recording. Then, the bottom layer 25a is plated by electroplating, and the first layer can be formed by, for example, calling ~ 々, etc.)! The metal ore phase 25b fixedly bonds a plurality of superabrasive grains 14. Afterwards, from one side, I will remove the mask sheet (delete the klngsheet), and then use electroplating to fully form a second metal electric power phase made of, for example, Nl (Cu, Cr, etc.). Here, it is not necessary to form the second metal electric clock phase at the bottom 22A. In this case, the bottom 22A of the support metal 19 will constitute the bottom 22a of the grindstone grain layer. In this way, a metal ore phase formed by the underplated layer 25a, the first] and the second metal key phases 25b, 25c can be formed. 25Fix the abrasive stone grains μ, the five-line of the superabrasive stone μ, as shown in Figure 3 and Figure 4⑼, and turn 20. In addition, in the above description, in addition to the grinding surface of the electric grinding wheel 20, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (21Q X 297 male; t) ---------- ______ 20 311684 474855 V. Description of the invention (21) The peripheral area 23 of 20a is arranged with a plurality of small grindstone layer portions 24 ..., but it is not necessary to be limited to this, and it can also be formed on the grinding surface 20a in a comprehensive manner.小 磨 层 部 24。 Small grinding layer 24. (Please read the precautions on the back before filling this page.) The electro-abrasive grinding wheel 20 of this embodiment is equipped with the above-mentioned configuration. The electro-abrasive grinding wheel 20 is mounted on the arm 10 of the device 1 in FIG. 32. When re-grinding the polishing pad 4, for example, the arm 1G is shaken with respect to the polishing pad 4 on the rotating rotary table 3, thereby swinging the electric grinding wheel ⑽ back and forth, and grinding the polishing pad 4 to restore or maintain its flatness . When grinding, in the small grindstone grain layer portion of the electrodeposited grinding wheel 20, "the rough grinding of the polishing pad 4 can be carried out by using the superabrasive stone grains 14 in the corner R portion 21a, and then continuously using the corner & portion The superabrasive grains 14 of the top 2ib of 21a are subjected to finishing grinding. And during the grinding, the superabrasive grains are fixed from the corner of the hillock part 2! The entire grinding surface of the stone grain layer 22 will not completely collide with the contact with the polishing pad 4, but only the super-grind stone grains 14 of the small grinding stone grain layer portion 24 are brought into contact with the lamp for grinding, so a higher application can be maintained. The grinding pressure of the superabrasive grain 14 is sharp and the cutting effect is sharp. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Therefore, 'the opening of the foamed layer of the polishing pad 4 can be cut sharply without causing the opening to collapse. It can maintain a high holding capacity of the slurry 8. In addition, since it does not completely collide, the grinding liquid inside the foamed layer is not splashed during grinding, and grinding is carried out in a state of containing water. A portion of the corner r portion 213 of the stone layer portion 24 is abraded by the superabrasive stone particles 14 and can still be used. The corner of the corner 21 & the superabrasive grain 14 continues to be ground to extend the durability of the electric grinding wheel 20. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 meals) 21 311684 474855 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (22) Furthermore, during grinding, only the super-grindstone particles 14 of the small-grindstone layer portion 2 4 are in contact with the polishing pad 4 for grinding The bottom 22a of the stone layer does not contact the grinding wheel 4. The grinding fluid can be retained in the bottom 22a of the stone layer between the small stone layer portion 24 and the small stone layer portion 24, and can pass through the stone. The bottom layer 22a of the granular layer discharges the cutting powder. Next, the state after grinding the 塾 4 using the electrowinning wheel 20 of this embodiment is shown in Fig. 5. Fig. 5 is a photograph of the surface of the polishing pad 4 500 times. In the figure, the opening k of the foamed layer on the surface of the polishing pad 4 is sharply ground without collapsing, and the flatness can be restored. Therefore, when polishing the wafer or the like, the slurry s can be ground. The flatness of the polishing pad 4 is restored when it is sufficiently retained in the foamed layer of the polishing pad 4. Here, FIG. 6 shows the use of an electroplated shovel to fix the superabrasive grains on a flat support metal and use a bottom plating layer 'to form the superabrasive grains with the difference in height from the bottom surface of the millstone grain layer. The state in which the electrodeposited grinding wheel of the above-mentioned conventional example is configured to grind the polishing pad 4 with an average particle diameter of 1/2 or less. Fig. 6 is a photograph of the surface of the polishing pad 4 500 times. The grinding surface of the layer approximately completely collided, causing the fluff on the surface of the polishing pad 4 to be collapsed, and the opening k of the foamed layer collapsed so much that it was clogged. Therefore, the holding ability of the grinding slurry s of the grinding pad 4 was insufficient to cause the polishing pad The processability of 4 deteriorates. As described above, in the present embodiment, since the bottom 22a of the grindstone grain layer does not contact, the superabrasive grain 14 of the small grindstone grain layer portion 24 is brought into contact with the grindstone for grinding, The grinding operation from rough grinding to finishing can be carried out continuously, and the grinding pressure applied to the superabrasive grains 14 is high, and the cutting effect is good, and it can be — 1 丨 — — — — — — — — — _ IIII --- Order----------- (Please read the notes on the back before filling this page) This paper size applies the Chinese National Standard (cns) A4 specification (21 × 297 mm) 22 311684 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 23 311684 474855 V. Description of the invention (23 The foaming layer of the polishing pad 4 The openings are sharpened without collapse. In addition, no cutting powder is left in the superabrasive grains 14, no clogging is caused, and the cutting powder has good dischargeability. In addition, the grinding liquid can be maintained at the bottom 22a of the grindstone grain layer between the small grindstone grain layer portions 24 and 24 to prevent the grinding fluid in the foamed layer of the polishing pad 4 from being splashed out, and not to regrind the grinding wheel. The cutting becomes dry and can be maintained in a good moisture-retaining state for wet grinding. △ Next, a second embodiment of the present invention will be described with reference to Figs. 7 and 8. The same parts and components as those in the first embodiment described above will be described using the same symbols. In the electrodeposited grinding wheel 30 of the second embodiment shown in FIG. 7 and FIG. 8, a grindstone grain layer 22 is formed on one surface 19a of the support metal 19, and the central area of the grindstone grain layer 22 is 31 ,,] The small millstone teaching layer portion 24 is not provided, and a plurality of small millstone grain layer portions 24 are arranged in a plurality of layers in a concentric manner in the peripheral area 32 to the outer periphery. Or most of the small grindstone grain layer portions concentric circles μ ... are separated from each other in the circumferential direction and the diameter direction, and the adjacent small grindstone grain layer portions 24, 24 are the bottom 22a of the grindstone grain layer. And ‘side! The grindstone slab layer 22 provided on 9a is only a plurality of superabrasive stone particles 14 fixed at the small grindstone particle layer portion 24 with a metal plating phase 25, respectively. The electro-abrasive grinding wheel 30 'of this embodiment can be mounted on the wafer support plate 5 and can perform grinding and polishing while rotating the polishing pad 4 at a position eccentric to the polishing pad 4 instead of the regrind 8. In this case, since the rotation speed of the central area 3! Of the electrolytic grinding wheel 30 is small and the grinding capacity is also small, the small grinding stone grain layer portion 24 is not advantageous in terms of grinding efficiency. This paper size is applicable (CNS) A4 g⑽χ 297 chuchus -------- Order ------------ Line (Please read the precautions on the back before filling this page) 幷 / 4 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Milk Economics. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm 24 A7) 5. Description of the invention (24) In addition, it replaces the concentricity with f 2 implementation. The round electromilled grinding wheel 30 of the small grindstone grain layer portion 24 can also be used in the peripheral area _ spiral shape: and the small grindstone grain layer portion 24 .. •. In this case, the same as the first 2 The same effect of the embodiment. The small grindstone grain layer portion 24 can be arranged at an arbitrary interval such as a grid or a mesh shape. Moreover, the arrangement structure of these small grindstone grain layer portions M can also be provided for grinding. The surface 20a is comprehensive. In the above embodiment, the small millstone grain layer portion 24 and the small hill portion 21 are formed into a substantially cylindrical shape, but the shapes of the small millstone grain layer portion 24 and the small hill portion 21 are not Subject to this limitation, it is only necessary that the height from the bottom 22a of the grindstone layer is equal to or greater than the average particle size of the supergrind particles 14, for example, Hemispherical or triangular-cone-shaped convex curved surfaces. Next, the third embodiment of the present invention will be described. The basic structure of the electrodeposition grinding wheel 120 (the electrodeposition grinding disc) of this embodiment is the same as that of the electrodeposition grinding wheel of the first embodiment. 20 is the same, the grindstone grain layer 122 has its surface as a grinding surface 20a, and the slightly circular area in the center is taken as the center area 12 4 ′ and the ring-shaped area outside it is taken as the peripheral area 12 6. 10, one surface 19a of the supporting metal 19 shown in FIG. 10 is formed with a plurality of approximately cylindrical hillocks 21. "on the central area 12 4 at a predetermined interval in a grid or mesh arrangement. On the peripheral area 26 A convex flat portion 127 is formed, for example, to form a small wide annular flat surface with a width of about 3 mm. The hillock portions 21 ... and the convex flat portion 127 are formed at the same height. In the central area 124 ', the grindstone grain layer 22 is formed. A plurality of superabrasive grains 14 are fixedly adhered to each of the hillock portions 21 by a metal plating phase 25, and the hillock portions 21 and the hillock portions 21 are formed only by the metal plating phases 25. Millstone 311684 ^ I ------ ^ -------- ^ (Please read the notes on the back before filling (This page) 474855 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (25) The bottom 22a of the grain layer is not provided with a super-grinding stone 14. In addition, the bottom 22a of the grain layer is not provided. It is also possible to have a metal plating phase 25. In this case, the surface of the metal in Block I will be exposed to constitute the bottom 22a of the grindstone grain layer. In the hillock part 2 ', the grindstone grain layer 22 is along a substantially cylindrical shape. The super-grindstone particles 14 and the small-grindstone particle layer portion 24 of the metal plating phase 25 are provided on the surface. The manufacturing method of the electrolytic grinding wheel 120 in this embodiment is slightly the same as that in the i-th embodiment. The method for producing the metal plating phase 25 will be described with reference to Fig. 10 as follows. In the small grindstone layer portion 24, each of the hillock portions 21 of the support metal 19 is formed by the side wall 21c, the corner ruler 2U, and the top portion 21b formed on the entire periphery. One or more superabrasive grains 14 are fixed and adhered with a metal plating phase 25. In the peripheral area 126, on the annular convex plane portion 127, superabrasive grains 14 are dispersed and fixed one by one with a metal plating phase 25, and these superabrasive grains 14 and small millstone grain layer portions 24 are located The same height H. In addition, the concentration of the superabrasive particles 14 in the peripheral area 126 is made higher than that of the superabrasive particles 14 in the central area 124. In addition, in the central area 124 and the peripheral area 126, referring to Fig. 10, the electroplating of the superabrasive grains 14 will be described below. Except for the convex plane portion 127 and each of the hillock portions 2 1..., The entire surface of the convex plane portion 127 and each of the hillock portions 21 is covered with, for example, Ni ( Cu, Cr, etc.) is a thin layer of underplating. Next, a plurality of superabrasive grains 14 are fixed and adhered to the underplated layers 25a, 25b by electroplating with the first metal plating phases 25c, 25d made of, for example, Ni (Cu, Cr, etc.). Then 'peel off the mask sheet from one side 2 1 a and use electroplating to fully form it again 丨 — I — —lit I 1 I ϊ I 1 I --------- (Please read the precautions on the back before filling (This page) This paper size applies to China National Standard (CNS) A4 (21〇x 297 public love) 25 311684

474855 五、發明說明（26 ) 由Ni(Cu、Cr等亦可）而成的第2金屬電鍍相25e、25f。 或者’亦可在維持遮罩之下，僅對凸平面部127及小 丘部21形成第2金屬電鍍相25e、25f，在此情形，成為 凹部的磨石粒層底部22a上，則不會形成金屬電鍍相25。 如此，將形成藉由底電鍍層25a、25b，第1及第2金 屬電鑛相25c、25d、25e、25f而成的金屬電鑛相25使各 個超磨石粒14固定黏接於小丘部21及凸平面部127的第 1 0圖所示的磨石粒層丨22 ’以形成電積磨輪120。 在此情形，藉由將小磨石粒層部24之間隔適當予以設 定，可將周邊領域126之超磨石粒14之集中度設定為較中 央領域124之超磨石粒14之集中度為高。或者，亦可以其 他製法，將小丘部21…及凸平面部127之一方交互予以遮 罩並分別予以電鍍。在此情形下，只要增減調整電鍍液中 之超磨石粒14之添加量，則可調整周邊領域127與中央領 域124之集中度成為不相同。 又亦可在支座金屬19之小丘部21及凸平面部127不 實施底電鍍層之下，直接以電鍍形成磨石粒層24，另外進 行遮罩之除去而對底部22A實施電鍍以形成磨石粒層底部 22a。 另外，將電積磨輪120之直徑作成例如1〇lmm並設定 周邊領域126之寬幅為例如約3mm以下。電積磨輪12〇 之平面觀察下，相對於磨削面20a總面積的超磨石粒14 面積則設定為20%至80%之範圍。 本實施形態之電積磨輪120具備有上述構成，而再 I I I I I II — — ----· I — III I I ---- I I --- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS〉A4規格（210 297公釐） 26 311684 474855 A7 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 五、發明說明（27 ) 削作業可與第1實施形態大致同樣地進行。 並且’特別是在本實施形態之電積磨輪12〇，由於在 磨削面20a之周邊領域126較中央領域124的超磨石粒14 之集中度為高’故磨削時之電積磨輪12〇之穩定度較高， 電積磨輪120朝上下方向搖動之振動較少，平面平衡較 佳。又可從適宜設置在周邊領域126的凹溝17將切削粉末 等排出至外部。 周邊領域126係使超磨石粒14與金屬電鍍相25的高 低差為超磨石粒14之平均粒徑的大約1/3左右且集中度 高，所以在磨削時容易完全碰撞，惟由於將周邊領域126 之寬幅設定為例如約3mm以下之故，即使超磨石粒14發 生塞目，對刀割效果方面之影響亦少，且對中央領域124 的磨削性能幾乎無不良影響。 如上述，本實施形態中，由於在電積磨輪12〇之周邊 領域126可接觸研磨墊4而保持良好平面平衡，故可抑制 磨削時之振動。並且，在中央領域124,磨石粒層底部 係不接觸研磨墊4而僅有小磨石粒層部24之超磨石粒Μ 接觸研磨墊4並進行磨削之故，施加於超磨石粒14的磨削 壓力較高’ ϋ可從粗磨削連續進行至精加工磨削且刀割效 果佳，又不致使研磨墊4之發泡層之開口崩潰而可銳利地進行磨削。 又，對於周邊領域126,可與中央領域124同樣地， 將多數之小磨石粒層部24按預定間隔形成並使超磨石粒 14以金屬電㈣25固定黏接在小丘部21上。在此情形， 本紙張尺度適射關家標準（CNS)A4規格⑽- 27 311684 --------------裝— (請先閱讀背面之注意事項再填寫本頁) 訂· -線474855 V. Description of the invention (26) The second metal plating phases 25e, 25f made of Ni (Cu, Cr, etc. are also acceptable). Alternatively, 'the second metal plating phases 25e and 25f may be formed only on the convex flat portion 127 and the small hill portion 21 while maintaining the mask. In this case, the bottom 22a of the grindstone layer that becomes the concave portion may not be formed. A metal plating phase 25 is formed. In this way, the metal-electric phase 25 formed by the underplated layers 25a, 25b, the first and second metal-electric phases 25c, 25d, 25e, 25f is formed, and each superabrasive grain 14 is fixedly adhered to the hillock. The grindstone particle layer 22 ′ shown in FIG. 10 of the portion 21 and the convex plane portion 127 forms the electrowinning grinding wheel 120. In this case, by appropriately setting the interval of the small grindstone grain layer portion 24, the concentration of the supergrind 14 in the peripheral area 126 can be set to be higher than that of the supergrind 14 in the central area 124. high. Alternatively, one of the hillock portions 21 ... and the convex plane portion 127 may be alternately masked and plated separately by other manufacturing methods. In this case, as long as the amount of superabrasive grains 14 in the plating solution is increased or decreased, the degree of concentration of the peripheral area 127 and the central area 124 can be adjusted to be different. It is also possible to directly form the grindstone grain layer 24 by electroplating under the hillock portion 21 and the convex plane portion 127 of the support metal 19 without performing the underplating layer, and additionally remove the mask and perform plating on the bottom portion 22A to form磨石 粒 层 底 22a. The diameter of the electrolytic grinding wheel 120 is set to, for example, 101 mm, and the width of the peripheral area 126 is set to, for example, about 3 mm or less. The area of the superabrasive grains 14 with respect to the total area of the grinding surface 20a is set to a range of 20% to 80% under the plane observation of the electric grinding wheel 120. The electro-abrasive grinding wheel 120 in this embodiment has the above-mentioned structure, and then IIIII II — — ---- · I — III II ---- II --- (Please read the precautions on the back before filling this page) Economy Printed by the Intellectual Property Bureau of the Ministry of Intellectual Property Cooperatives The paper is printed in accordance with Chinese national standards (CNS> A4 specification (210 297 mm) 26 311684 474855 A7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives V. Invention Description (27) Cutting operations It can be performed in substantially the same manner as in the first embodiment. In addition, in the electrowinning wheel 12 of the present embodiment, the concentration degree of the superabrasive grains 14 in the peripheral area 126 of the grinding surface 20a is smaller than that in the central area 124 is High ', so the stability of the electric grinding wheel 120 during grinding is high, the electric grinding wheel 120 shakes in the up and down direction with less vibration, and the plane balance is better. It can also be set from the groove 17 suitable for the surrounding area 126. The cutting powder and the like are discharged to the outside. In the peripheral area 126, the height difference between the superabrasive particles 14 and the metal plating phase 25 is about 1/3 of the average particle size of the superabrasive particles 14 and the concentration is high. Time It is easy to completely collide, but because the width of the surrounding area 126 is set to, for example, less than about 3 mm, even if the superabrasive particles 14 are clogged, the effect on the cutting effect is small, and the central area 124 is ground. There is almost no adverse effect on performance. As mentioned above, in the present embodiment, since the peripheral area 126 of the electric grinding wheel 120 can contact the polishing pad 4 to maintain a good planar balance, vibrations during grinding can be suppressed. In addition, in the central area 124. The bottom of the grindstone layer does not contact the polishing pad 4 and only the supergrind particles M of the small grindstone layer portion 24 contact the polishing pad 4 and perform grinding. The pressure is high 'ϋ It can be continuously performed from rough grinding to finishing grinding with good cutting effect without sharpening the opening of the foamed layer of the polishing pad 4 and sharpening. Peripheral area 126 In the same manner as in the central area 124, a plurality of small grindstone grain layer portions 24 are formed at predetermined intervals, and the superabrasive stone grains 14 are fixedly adhered to the small hill portion 21 with a metal electrode 25. In this case, this paper Standards for Family Safety Standards (CNS) A4 Specifications ⑽-27 311684 -------------- install — (Please read the notes on the back before filling this page) Order · -line

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五、發明說明（28 使】、磨石粒層部24之直徑d及古庐M 124 ^及呵度Ή成為與中央領域 同’並使小磨石粒層部24之門眩 > 上 者為狹窄Br > 間&較中央領域H 狹窄，則可提高超磨石粒14之隼 定黏接於周邊126e t @ ”中度。或者，可將固 之個數J 層部24的超磨石粒14 個^成較中央領域24之小磨石粒層㈣為多。 如採用如此的構成，則即使在 果亦佳， 门透領域126 ’刀割效 果？ 1可確實抑制塞目並提高切削粉末之排出性。 用同央領域124中的小磨石粒層部24之排列可採 螺旋狀等適當之排列形狀以替代格子狀或網 IIIIIIIII — · I 1 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 另外，金屬結合相可不依金屬電鍍相2 ::::燒結以保持超磨石粒之方法，只要是具二: 5相的磨輪即可。 第11圖所示的第4實施形態之磨輪22〇(單層研磨盤 係構成為，如第12圖；5笛 弟12圖及第13圖所不，在形成圓板形之支 座金屬222之略圓形的一面222,外周 <則設置有由形成同心 圓（可為非同心圓）之環狀複數層（圖中為3層）而成的磨石 粒層224。磨石粒層224之最外周側形成有最大直徑（例如 與支座金屬222同一直徑）的第1磨石粒層224八，在其内 側’隔著間隔形成有第2磨石粒層224b，在最内側，則隔 著間隔形成有最小直徑的第3磨石粒層224C。第3磨石粒 層224C之内側則未形成有磨石粒層。 於支座金屬222之一面222a，第i至第3磨石粒層 222A、B、C之環狀領域係設定為較其他領域在厚度方白 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公复）V. Description of the invention (28), the diameter d of the grindstone grain layer portion 24 and the ancient house M 124 ^ and Huduo are the same as those in the central field and make the door of the small grindstone grain layer portion 24 dazzle> In order to be narrower, Br > is narrower than the central area H, the fixed adhesion of the superabrasive grains 14 to the periphery 126e t @ ”can be increased. Alternatively, the number of solid J layers 24 can be increased. The 14 millstone grains are more than the small millstone grains in the central area 24. If this structure is adopted, even in fruit, the cut-through area 126 'knife effect? 1 can effectively suppress the plug and Improve the discharge of the cutting powder. Use the arrangement of the small grindstone layer layer 24 in the Tongyang area 124 to adopt a suitable arrangement such as a spiral shape instead of a grid or a mesh IIIIIIIII — · I 1 (Please read the note on the back first Please fill in this page for further information.) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, the metal binding phase may not be based on the metal plating phase 2 :::: sintering to maintain the superabrasive grains, as long as it has a 2: 5 phase grinding wheel The grinding wheel 22 of the fourth embodiment shown in FIG. 11 (a single-layer grinding disc is configured as follows, Figure 12; Figure 5 and Figure 12 and Figure 13, not on the slightly circular side 222 of the disc-shaped support metal 222, the outer periphery < is provided by the formation of concentric circles (can be non-concentric circles ), A grindstone grain layer 224 formed by a plurality of rings (three layers in the figure). The first grindstone having the largest diameter (for example, the same diameter as the support metal 222) is formed on the outermost side of the grindstone grain layer 224. The grain layer 224 is formed with a second grindstone grain layer 224b at intervals on its inner side, and a third grindstone grain layer 224C with a minimum diameter is formed at intervals on the innermost side. The third grindstone grain layer 224C There is no grindstone layer on the inner side. On the one surface 222a of the support metal 222, the ring-shaped areas of the i-th to third grindstone layers 222A, B, and C are set to be thicker than the other areas. Standards apply to China National Standard (CNS) A4 specifications (210 X 297 public reply)

訂： --線· 855Order:-line · 855

五、發明說明（29 ) 一層(例如第13圖所示高度Η之高低差)，將此稱為第 座金屬# 222Α、第2支座金屬部222Β、第3 屬部222C。 再者在第12圖及第13圖所示之第2支座金屬部 α 2Β上，按預定間隔形成有複數個圓筒狀之小丘部225(突 j )在其中央則形成有斷面圓形之開口 226。並且在小丘 部225上面形成有略環狀之小磨石粒層部以，此小磨石 教層部228係在Nl《Nl合金之金屬結合相（金屬電鍍 相）2 1 5中分散配置並固定黏接有金剛石或等之超磨 石粒2U。此小磨石粒層部⑵係構成在其厚度方向僅配 j 1層超磨石粒2 1 4的單層磨輪，且例如以電鍍所製作者。 另外，在第1支座金屬部222A，第3支座金屬部22% 上亦設置有同一構造之多數個小磨石粒層部228。 亚且，在支座金屬222内部，如第13圖所示，橫跨第 1至第3磨石粒層部224A、224B、224C之領域形成有通 水路230。此通水路230係連通至形成在第i至第3磨石 粒層224A、224B、224C之各小磨石粒層部228中央的開 口 226,並從未圖示的供給源供給例如純水作為磨削液在 通水路230内循環後從各開口 226排出至外部。 在此，開口 226之内徑d為設定在例如〇 5至3mm之 範圍，又，小丘部225(突部）之直徑D設定為2(1至l〇d之 範圍。又，從小丘部225之各支座金屬部222A，B，c的 高度h係設定在0.1至5mm之範圍。再者，相鄰的2個小 丘部225,225之間隔距離L則設定為小丘部225之直徑d I --- (請先閱讀背面之注意事項再填寫本頁) 訂： --線· 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 29 311684 474855 A7 B7 五、發明說明（30) 之1/3至2倍之範圍。 並且，於各支座金屬部222A，B，r λ L中，相鄰的小丘 2 2 5，2 2 5之間係構成例如形成網目狀 狀的田排出路232， 在此副排出路232未形成有磨石粒層， a 向係藉由磨削液排 出研磨墊4之磨削屑或研漿s之固化物笼 _ ^ 化物荨。再者，在第1 至第3磨石粒層224A，B，C間之間隙，形成有略環狀之 主排出路234。主排出路234,234係較副排出路234為寬， 而深度亦形成與支座金屬部222A，222B，222c之高低差 Η同樣距離份的深度。 — 又，在第1至第3磨石粒層224Α，Β，C中，按預定 間隔，例如按45。間隔’往直徑方向形成有為排出研漿s 或磨削屑用的凹溝117。此凹溝U7在第U圖中，係相對 於第1至第3磨石粒層224A，B，c形成一列直線，其底 面係設定在與主排出路234略同樣深度的位置。 另外，凹溝117不一定需要形成一列，而可在第i至 第3磨石粒層224A，B，C中往圓周方向挪移至不同位置 並朝向直徑方向配設。又，對内側之層，亦可增加外侧之 層的凹溝U7。予以如此形成，則在第1至第3磨石粒層 224 A，B，C間之冷卻效率及磨削屑之排出性較佳。 本實施形態之磨輪20係如上述方式所構成，其次，參 照第14圖，就磨輪22〇之製造方法加以說明。 第14圖（A)中’將例如由sus 304等而成的圓板狀支 座金屬222之一面222a利用蝕刻等予以部分性去除，並按 環狀方式留下複數層之***部以作成第1支座金屬部 — I I I I ! ! I I -- (請先閱讀背面之注意事項再填寫本頁) · -線· 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中關家標华（CNS)A4 χ观公^ 30 311684 474855 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（31 ) 222A、第2支座金屬部222B、第3支座金屬部222c。以 餘刻所去除的部分中，各支座金屬部222A，B，c之間的 領域將成為主排出路234。如此，可形成支座金屬奶之 一面222a。在此，亦可以模具成型等替代蝕刻形成一面 222a。 另外，在支座金屬222之内冑，在與第j至第3支座 金屬部222A’ B，C相對向的領域形成有中空之通水路 230,此通水路230係連通至在第1至第3支座金屬部 222A，B，C上按預定間隔穿孔的開口 226。 其-人’於第14圖（A)中，留下相當於與通水路23〇連 通的第1至第3支座金屬部222Α，β，c上之各開口以 周圍的小丘部222的領域並予以遮罩，藉由沁或沁基合 金電鐘而以包圍開口 226周. _ 因市周圍之方式以略圓筒形狀使所鍍 金屬析出後’將第14圖⑻所示之小丘部25...按預定間隔 分別形成多數個。在此’亦可以蝕刻或放電加工等取代電 鍍來形成小丘部225。 在此，各支座金屬部222a，b，c中除去小丘部225一 以外的領域將構成副排出路2 3 2。 並且，當進行磨石粒電積時，如第14圖中，將除了小 丘部225...以外的主副排出路234,232等予以樹脂遮罩， 從通水路230通過各開口 226 一邊排出空氣—邊進行電 鍍。如此，如第丨4圖（C)所示，超磨石粒14將以別等之 金屬結合相15固定黏接在除了通水路23〇以外之各小丘部 2 2 5上面。 ‘紙張尺度適用中國國家標準（CNS)A4規格297公髮 311684 I-------- ^---------^ (請先閱讀背面之注意事項再填寫本頁) 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 311684 474855 A7 ______ — B7 ______ 五、發明說明（32 ) 在此’亦可通過通水路230而從各開口 226排出包含 超磨石粒14的電鍍液後在小丘部225上進行電鍵之方式。 在此情形’通水路230中會析出所鍍金屬，但超磨石粒14 無法固定黏接。 另外’在直徑方向隔著預定間隔的第1至第3磨石粒 層224A，B，C，其寬幅Wa、Wfc、Wc係設定成最内側之 磨石粒層224C為最大，而愈往外側之層寬幅愈狹窄的方 式。因此，設定成Wa<Wb<Wc。在此，第1至第3之各磨 石粒層224A ’ B，C之各寬幅分別成為一定寬幅。 如此設定之目的，如第11圖，係使與研磨墊4之旋轉 方向P略成垂直相交的方向之任意位置之假想線a，b，c 内接於各磨石粒層224A，B，C的情形時，為使與直徑較 大之外側磨石粒層交叉的磨削長度（例如假想線d之磨削 長度Ldl)能較與内側之直徑小的磨石粒層交叉的磨削長 度為大，並使磨削時之工作量（磨削長度）能更大起見，而 將更内侧之磨石粒層之寬幅增大以使各磨石粒層之磨削 度（工作量）更為均等之故。 、 例如1 U圖中’將相對於第！至第3磨石粒層 224A ’B’CS研磨塾4之旋轉方向p成略平行的方向延 伸的假想線，朝與此方向略垂直相交的方向挪移並於任意 之位置劃出假想線a，b，C，d，作成為例如假想線a，^ 與第1至第3磨石粒層224A，B，C交又，假想線c盘第 磨石粒層224C外接並與第！及第2磨石粒層224a，b 交叉’假想線d與第ϊ磨石粒層224A内接並交叉之方式。 ‘本紙張尺度適用中國國規格⑽X 297公楚)---~ --- --------------裝---------訂-------- 1線 (請先閱讀背面之注意事項再填寫本頁) 經 濟 部 智 慧 財 產 局 員 工 消 費 合 社 印 製 474855 A7 ___ B7 五、發明說明（33 ) 並將各假想線a’ b，c，d所交叉的第1至第3磨石粒層 224A，B，C之領域的磨削長度按如下設定之。 如將在最靠近磨輪220之中心0的假想線a交又的第 1至第3磨石粒層224A，B，C之磨削長度（面積）設為Lal、 La2、La3，將在對旋轉中心0第二靠近的假想線b交叉的 第1至第3磨石粒層224A，B ’ C之磨削長度（面積）設為 Lbl、Lb2、Lb3，將在對旋轉中心〇其次靠近的假想線〇 交叉的第1及第2磨石粒層224A，B之磨削長度（面積）設 為Lcl、Lc2，將在離旋轉中心〇最遠的外側假想線（1交 叉的第1磨石粒層224A之磨削長度設為Ldl，則成為： 2x (Lai + La2 + La3)= 2x (Lb 1 + Lb2 + Lb3) = 2χ (Lcl +5. Description of the invention (29) One layer (such as the height difference shown in Fig. 13), this is called the first seat metal # 222A, the second seat metal portion 222B, and the third belonging portion 222C. Furthermore, on the second support metal portion α 2B shown in FIG. 12 and FIG. 13, a plurality of cylindrical hillock portions 225 (projection j) are formed at predetermined intervals, and a cross-section is formed in the center thereof. Circular opening 226. In addition, a small ring-shaped small grindstone layer layer portion is formed on the small hill portion 225. The small grindstone layer portion 228 is dispersedly arranged in the metal bonded phase (metal plating phase) of Nl and Nl 2 1 5 Super fixed abrasive grains with diamond or other 2U are fixed. This small grindstone grain layer part is a single-layered grinding wheel configured with only one supergrind grain 2 1 4 in its thickness direction, and is produced, for example, by electroplating. In addition, a plurality of small grindstone grain layer portions 228 having the same structure are also provided on the first support metal portion 222A and the third support metal portion 22%. Further, as shown in Fig. 13, inside the support metal 222, a water passage 230 is formed across the areas of the first to third millstone grain layer portions 224A, 224B, and 224C. This water passage 230 communicates with an opening 226 formed in the center of each of the small grindstone grain layer portions 228 formed in the i-th to third grindstone grain layers 224A, 224B, and 224C, and supplies pure water as an unillustrated supply source, for example. The grinding fluid is circulated in the water passage 230 and is discharged from each opening 226 to the outside. Here, the inner diameter d of the opening 226 is set in a range of, for example, 0.5 to 3 mm, and the diameter D of the small hill portion 225 (protrusion) is set to a range of 2 (1 to 10 d.). The height h of each support metal portion 222A, B, and 225 of the 225 is set in the range of 0.1 to 5 mm. In addition, the distance L between two adjacent small hill portions 225, 225 is set to the diameter d of the small hill portion 225. I --- (Please read the notes on the back before filling out this page) Order: --Line Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297) Love) 29 311684 474855 A7 B7 V. Description of the invention (30) 1/3 to 2 times. And, in each support metal part 222A, B, r λ L, the adjacent hillock 2 2 5 The field discharge path 232 having a mesh shape is formed between 2 2 5. The auxiliary discharge path 232 is not formed with a grindstone grain layer, and a direction is used to discharge the grinding chips or grinding chips of the polishing pad 4 through the grinding liquid. The solidified material cage of the pulp s ^ 荨 荨. In addition, a slightly annular main discharge path 234 is formed in the gap between the first to third millstone grain layers 224A, B, and C. The main row The exit paths 234 and 234 are wider than the secondary exhaust path 234, and the depth is the same as the height difference between the support metal portions 222A, 222B, and 222c. Also, the first to third millstone grain layers 224A, In B and C, a groove 117 is formed at a predetermined interval, for example, 45. The groove 117 is used to discharge the grinding slurry s or grinding chips in the diameter direction. This groove U7 is shown in FIG. The third grindstone grain layer 224A, B, and c form a line of straight lines, and the bottom surface is set at a position approximately the same depth as the main discharge path 234. In addition, the grooves 117 do not necessarily need to form a line, but may be formed in the i-th to 3 The grindstone grain layers 224A, B, and C are moved to different positions in the circumferential direction and arranged toward the diameter direction. In addition, for the inner layer, the groove U7 of the outer layer can also be added. The cooling efficiency between the first to third grindstone grain layers 224 A, B, and C and the discharge of grinding chips are better. The grinding wheel 20 of this embodiment is configured as described above, and secondly, referring to FIG. 14, the grinding wheel The manufacturing method of 22〇 is explained. In FIG. 14 (A), a circular plate made of, for example, sus 304 or the like is used. One surface 222a of the pedestal support metal 222 is partially removed by etching or the like, and a plurality of raised portions are left in a ring manner to form the first support metal portion — IIII!! II-(Please read the note on the back first Please fill in this page again for the matters)--Line · Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed on a paper scale applicable to Zhongguanjiabiaohua (CNS) A4 χ 公 公 30 311684 474855 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 Five Description of the Invention (31) 222A, second support metal portion 222B, and third support metal portion 222c. Of the portions removed in the remaining time, the area between the support metal portions 222A, B, and c becomes the main discharge path 234. In this way, one side 222a of the support metal milk can be formed. Here, one side 222a may be formed by mold molding or the like instead of etching. In addition, within the support metal 222, a hollow water passage 230 is formed in a region facing the jth to third support metal portions 222A 'B, C, and this water passage 230 is connected to the first to third parts. Openings 226 perforated at predetermined intervals in the third support metal portions 222A, B, and C. Its “person” is shown in FIG. 14 (A), leaving the openings corresponding to the first to third support metal portions 222A, β, and c of the surrounding hillock portion 222 communicating with the water passage 23 °. The area is covered by a Qin or Qinji alloy electric clock to surround the opening for 226 weeks. _ After the plated metal is deposited in a slightly cylindrical shape because of the way around the city, the hillock shown in Figure 14 The sections 25 ... are formed in a plurality at a predetermined interval, respectively. Here, it is also possible to form the hillock portion 225 instead of electroplating by etching or electric discharge machining. Here, the area other than the hillock portion 225 of each of the support metal portions 222a, b, and c constitutes the sub-exhaust path 2 3 2. In addition, when the grindstone granulation is performed, as shown in FIG. 14, the main and auxiliary discharge paths 234, 232 and the like except the hillock portion 225 ... are covered with resin, and the air is discharged from the water passage 230 through each opening 226. -While plating. In this way, as shown in FIG. 4 (C), the superabrasive stone particles 14 are fixedly adhered to each of the hillock portions 2 2 5 except for the water passage 23 by the other metal bonding phase 15. 'The paper size applies the Chinese National Standard (CNS) A4 specification 297 public issue 311684 I -------- ^ --------- ^ (Please read the precautions on the back before filling this page) Economy Printed by the Consumer Cooperative of the Ministry of Intellectual Property Bureau 311684 474855 A7 ______ — B7 ______ V. Description of the Invention (32) Here, 'the plating solution containing the superabrasive stone particles 14 can also be discharged from the openings 226 through the water passage 230, and then the small A method of performing electric keys on the hill 225. In this case, the plated metal is precipitated in the water passage 230, but the superabrasive grains 14 cannot be fixedly adhered. In addition, the first to third millstone grain layers 224A, B, and C with a predetermined interval in the diameter direction are set to have the widest Wa, Wfc, Wc so that the innermost millstone grain layer 224C is the largest, and the more The narrower width of the outer layer. Therefore, it is set to Wa < Wb < Wc. Here, the widths of the first to third grindstone grain layers 224A 'B, C are each a certain width. The purpose of this setting is, as shown in FIG. 11, an imaginary line a, b, c at any position in a direction which intersects the rotation direction P of the polishing pad 4 slightly perpendicularly. The imaginary lines a, b, and c are inscribed in the respective grindstone grain layers 224A, B, and C. In the case that the grinding length intersecting with the grindstone layer with a larger diameter on the outer side (for example, the grinding length Ldl of the imaginary line d) can be greater than the grinding length intersecting with a grindstone layer with a small diameter on the inner side, Large, so that the workload (grinding length) during grinding can be greater, and the width of the inner grindstone grain layer is increased to make the grinding degree (workload) of each grindstone grain layer More even. For example, 1 ′ in the U figure will be relative to the first! The rotation direction p of the third grinding stone grain layer 224A 'B'CS grinding 塾 4 extends in an approximately parallel imaginary line, moves in a direction slightly perpendicular to this direction, and draws an imaginary line a at an arbitrary position. b, C, d, for example, the imaginary line a, ^ intersects with the first to third millstone grain layers 224A, B, C, and the imaginary line c disk millstone grain layer 224C is connected to the first! And the second grindstone grain layer 224a, b intersects' a virtual line d and the second grindstone grain layer 224A is inscribed and intersected. 'This paper size applies to China's national standard (X 297 Gongchu) ------- --- -------------- installation --------- order ----- --- Line 1 (Please read the precautions on the back before filling out this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 474855 A7 ___ B7 V. Description of the invention (33) and the imaginary lines a 'b, c The grinding length of the first to third millstone grain layers 224A, B, and C intersected by, d is set as follows. For example, if the grinding lengths (areas) of the first to third millstone grain layers 224A, B, and C intersect at the imaginary line a closest to the center 0 of the grinding wheel 220 are set to Lal, La2, and La3, they will rotate in pairs. The grinding length (area) of the first to third millstone grain layers 224A, B'C intersecting the imaginary line b that is the second closest to center 0 is set to Lbl, Lb2, and Lb3, and the imaginary next to the center of rotation 〇 The grinding length (area) of the first and second millstone grain layers 224A and B intersecting with the line 〇 is set to Lcl, Lc2, and the imaginary line (the first millstone grain that crosses 1) at the outermost imaginary line farthest from the rotation center 〇 The grinding length of layer 224A is set to Ldl, then: 2x (Lai + La2 + La3) = 2x (Lb 1 + Lb2 + Lb3) = 2χ (Lcl +

Lc2)与2x (Ldl)之方式，設定第i至第3磨石粒層224a， B，C 之寬幅 Wa，Wb，Wc。由此成為，Wa<Wb<Wc。 本實施形態之磨輪220係具備上述構成者，當進行研 磨墊4之再磨削時’-邊旋轉研磨墊4 -邊使磨輪22〇旋 轉以磨削研磨墊4之起毛，並恢復或維持其平坦度。 磨削之際，在磨石粒層224之第1至第3磨石粒層 224A，B，C之各小磨石粒層部228，通過通水路23〇，從 形成在其中央的開口 226對超磨石粒214與研磨墊4之間 的磨削點，一邊供給磨削液，例如純水，一邊進行磨削。 據此，可抑制因小磨石粒層部228之超磨石粒2ΐ4·.的磨 削所產生的研磨墊4之磨削層或殘留在研磨墊4的矽晶圓 之電路金屬或矽之磨削屬等附著並固定黏接於超磨石= 2 14…間’並使含有此等磨削屑的磨削液之黏性降低以促進 本紙張尺度適用t國國家標準（CNS)A4 g (21() x 297公楚 — 33 311684 ---I ----I I I I I I ' 1 I I i I I I ·1!11!111 (請先閱讀背面之注音？事項再填寫本頁)Lc2) and 2x (Ldl), the widths Wa, Wb, and Wc of the i-th to third grindstone grain layers 224a, B, and C are set. As a result, Wa < Wb < Wc. The grinding wheel 220 of this embodiment is provided with the above-mentioned structure. When re-grinding the polishing pad 4, the grinding wheel 4 is rotated while the grinding wheel 4 is rotated to grind the fluff of the polishing pad 4 and restore or maintain it. flatness. During grinding, the small grindstone grain layer portions 228 of the first to third grindstone grain layers 224A, B, and C of the grindstone grain layer 224 pass through the water passage 23 and pass through the opening 226 formed in the center thereof. The grinding point between the superabrasive grains 214 and the polishing pad 4 is ground while supplying a grinding fluid such as pure water. Accordingly, it is possible to suppress the grinding layer of the polishing pad 4 generated by the grinding of the superabrasive grains 2ΐ4 ·· of the small grinding stone grain layer portion 228 or the circuit metal or silicon of the silicon wafer remaining on the polishing pad 4. Grinding gens are adhered and fixedly attached to the superabrasive stone = 2 14 ... and reduce the viscosity of the grinding fluid containing these grinding chips to promote the application of this national standard (CNS) A4 g (21 () x 297 Gongchu — 33 311684 --- I ---- IIIIII '1 II i III · 1! 11! 111 (Please read the note on the back? Matters before filling out this page)

474855 五、發明說明（34 ) 通過釗排出路232而對主排出路234的排出。並且可藉由 磨削液促進超磨石粒2 14之冷卻以防止超磨石粒2 14之損 傷，並抑制各種磨削屑沈下滞積在超磨石粒214 214間。 因而，設置在各磨石粒層224A，B，C的小磨石粒層 部228之超磨石粒214…所生成的研磨墊4之磨削屑或其 他各種磨削屑等將被從開口 226所排出的磨削液沖流，且 不致堵塞於超磨石粒214…之間而通過小磨石粒層部228 周圍之副排出路232後排出，再通過主排出路234、導引 溝2 1 7，而排出外部。 並且’各小磨石粒層部228之超磨石粒214…所產生 的磨削點係從相鄰接的開口 226所供給的磨削液充份普 及，且磨削屑不致滯積在超磨石粒214…間而會被沖流的 程度之大小D，再者，磨削點與副排出路232的高低差h 係設定為能容易排出磨削液或磨削屑的程度。 再者，於磨石粒層224之第1至第3磨石粒層224A， B，C中，就朝向與研磨墊4之旋轉方向p略垂直相交的 方向，從磨輪220之中心〇挪移而排列的複數個任意位置 之假想線a’ b ’ c而論，由於各假想線上之磨削長度之和（面 積之和）2x (Lal + La2+La3)与 2x (Lbl + Lb2 + Lb3)4 2x (Lcl + Lc2)与2x (Ldl)大致相同之故，如第ι5圖所示，對 與磨石粒層224之P方向略成垂直相交的搖動方向之全部 領域’可按略均等的工作量進行磨削加工。 因而，於研磨墊4之再磨削中’僅係將磨輪载置於研 磨墊4上並使之旋動，而不一定需要做搖動運動， 進 ---------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公；t ) 34 311684 A7474855 V. Description of the invention (34) The main discharge path 234 is discharged through the Zhao discharge path 232. In addition, the grinding fluid can be used to promote the cooling of the superabrasive grains 2 14 to prevent the damage of the superabrasive grains 2 14 and to suppress the accumulation of various grinding debris in the superabrasive grains 214 214. Therefore, the superabrasive grains 214 of the small millstone grain layer portions 228 provided in each of the millstone grain layers 224A, B, C, etc., the grinding chips of the grinding pad 4 or other various grinding chips, etc. will be removed from the opening. The grinding fluid discharged from 226 is flushed and does not block between the superabrasive grains 214 ... and is discharged through the auxiliary discharge path 232 around the small millstone grain layer portion 228, and then passes through the main discharge path 234 and the guide groove. 2 1 7 while draining outside. In addition, the grinding points generated by the super-grindstone grains 214 of each small grindstone grain layer portion 228 are sufficiently popular with the grinding fluid supplied from the adjacent opening 226, and the grinding debris will not stagnate in the super The magnitude D of the degree to which the grindstone particles 214 ... are washed away, and the height difference h between the grinding point and the auxiliary discharge path 232 is set to such an extent that the grinding fluid or grinding debris can be easily discharged. Furthermore, among the first to third grindstone grain layers 224A, B, and C of the grindstone grain layer 224, they are moved from the center of the grinding wheel 220 in a direction slightly perpendicular to the rotation direction p of the polishing pad 4, and moved As for the permuted imaginary lines a 'b' c at any arbitrary position, since the sum of the grinding lengths (sum of area) on each imaginary line is 2x (Lal + La2 + La3) and 2x (Lbl + Lb2 + Lb3) 4 2x (Lcl + Lc2) is roughly the same as 2x (Ldl). As shown in Figure ι5, for all areas of the shaking direction that intersects with the P direction of the millstone grain layer 224 slightly perpendicularly, it can work slightly equally. Grinding. Therefore, in the re-grinding of the polishing pad 4, 'only the grinding wheel is placed on the polishing pad 4 and rotated, and it does not necessarily need to make a shaking movement, to advance ------------ --------- Order --------- (Please read the precautions on the back before filling out this page) The paper size printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese national standard ( CNS) A4 size (210 X 297 male; t) 34 311684 A7

474855 五、發明說明（35 ) 行有效率且平坦度更高的研磨墊4之磨削加工。 如上述，依本實施形態，可使研磨墊4之磨削屑或崎 漿S之固化物、矽晶圓之電路金屬或矽之磨削屑等各種磨 削屑，從本身為磨削點的小磨石粒層部228之超磨石粒 214··.，藉由與此相鄰接的開口 226之磨削液容易流出至副 排出路232,以確實抑制堵塞在超磨石粒214…間。並且^ 藉由此磨削液可抑制超磨石粒214因各種磨削屑而摩耗或 摩滅，且可促進超磨石粒214<冷卻以抑制超磨石粒^ 之損傷。並且，由於對研磨墊4之旋轉方向p成略平行的 方向之磨石粒層224之各磨削長度之和（面積之和）大致相 等之故，可進行平坦度更高的磨削加工。 其次，參照第16圖，就本發明之第5實施形態加以現 明。 第16圖所示之磨輪24〇具有與第i實施形態之磨輪 220同樣的基本構造，其不同點在於磨石粒層⑷形成工 層連續的螺旋狀，而較佳為至少有磨石粒層242在直徑方 向隔著間隔捲繞3層以上者(第16圖中形成為3層）。 在此實施形態中，磨石粒層242’以從直徑方向外側 往内側的3層來看，係按依次形成之方式以螺旋狀連續形 成有最外周之第1磨石粒層242A、第2磨石粒層242β、 最内側之第3磨石粒層242C。並且，在各磨石粒層242八、 242B、242C之間形成有螺旋狀之主排出路⑽，各磨石粒 層 242A、242B、242C 牴基箱仝 者預&間隔L設置有多數個小 磨石粒層部228.·.，在其間隙則形成有 出路⑴。 ! ^ --------^---------^ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員Μ消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規^^) χ 297公爱） 35 311684 474855 A7 五、發明說明（36 ) 本實施形態亦可獲得與第4實施形態同樣的效果。 以下’就本發明之第6實施形態加以說明。 第17圖及第18圖所示實施形態之磨輪320(單層研磨 盤）在圓板形支座金屬322之成為略圓形的一面322a之外 周側，設置有成為略環狀的磨石粒層324。磨石粒層324， 例如以平面觀察之下’係成為略長方形狀或棒狀的小磨石 粒層部326將其長邊方向朝向與支座金屬322之中心近似 的方向往圓周方向排列複數個。在此，在磨石粒層324之 領域往圓周方向互相分離之方式所排列的小磨石粒層部 326…之間’則構成副排出路332。 各小磨石粒層部3 2 6 ’如第1 9圖之縱向剖面圖所示’ 儀藉由形成有從支座金屬322之一面322a上按略直方體形 狀***的小丘部336 ’並於此小丘部336之上面336a以金 屬結合相3 3 0固定黏接超磨石粒丨4…之方式而形成。每^ 個小磨石粒層部326的超磨石粒14之個數係設為3至25〇 個。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 (請先閱讀背面之注意事項再填寫本頁) 由於使對於支座金屬322之一面322a的小丘部336 之高度設為0.1至5.〇mm的範圍，在磨削點與副排出路332 之間不致使磨削液或磨削屑堵塞而可順利沖流並排出， 又，即使本身為被削材的研磨塾4係軟質者，磨石粒層似 仍不會完全碰撞而可僅以超磨石粒“之磨削點接觸；磨 墊4，故可維持較高的磨削壓力。如474855 V. Description of the invention (35) Grinding of the polishing pad 4 with higher efficiency and higher flatness. As described above, according to this embodiment, various grinding chips such as the grinding chips of the polishing pad 4 or the solidified product of the slab slurry S, the circuit metal of the silicon wafer, or the grinding chips of silicon can be ground points by themselves. The superabrasive grain 214 of the small grindstone layer portion 228 easily flows out of the grinding fluid through the opening 226 adjacent to this to the sub-discharge passage 232, so as to surely block the superabrasive grain 214 ... between. In addition, the grinding fluid can suppress the wear and tear of the superabrasive grains 214 due to various grinding debris, and can promote the cooling of the superabrasive grains 214 to suppress the damage of the superabrasive grains ^. In addition, since the sum of the grinding lengths (sum of the areas) of the grindstone grain layers 224 that are slightly parallel to the rotation direction p of the polishing pad 4 can be approximately equal, a grinding process with a higher flatness can be performed. Next, a fifth embodiment of the present invention will be described with reference to FIG. The grinding wheel 24 shown in FIG. 16 has the same basic structure as the grinding wheel 220 of the i-th embodiment. The difference lies in that the grindstone grain layer ⑷ forms a continuous spiral of the working layer, and preferably has at least the grindstone grain layer. 242 is wound three or more layers at intervals in the diameter direction (three layers are formed in FIG. 16). In this embodiment, the first grindstone grain layer 242A, the second grindstone grain layer 242A, the second grindstone layer 242A, and the second grindstone layer are formed continuously in a spiral shape when viewed from three layers from the outer side to the inner side in the diameter direction. The grindstone grain layer 242β and the innermost third grindstone grain layer 242C. In addition, a spiral-shaped main discharge path is formed between each of the grindstone grain layers 242, 242B, and 242C, and each of the grindstone grain layers 242A, 242B, and 242C has a plurality of pre-amplifier intervals L. The small grindstone layer portion 228 ... has a way out in the gap. ! ^ -------- ^ --------- ^ (Please read the notes on the back before filling out this page) Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, M Consumer Cooperative, printed on paper standards applicable in China Standard (CNS) A4 regulations ^^) 297 public love) 35 311684 474855 A7 5. Description of the invention (36) This embodiment can also obtain the same effect as the fourth embodiment. Hereinafter, a sixth embodiment of the present invention will be described. The grinding wheel 320 (single-layer grinding disc) of the embodiment shown in FIG. 17 and FIG. 18 is provided with a slightly annular grinding stone grain on the outer peripheral side of the disc-shaped support metal 322 on the outer surface 322a of the approximately circular shape. Layer 324. The grindstone grain layer 324 is, for example, a small grindstone grain layer portion 326 which is slightly rectangular or rod-shaped in a plan view, and the long side direction is aligned toward the direction close to the center of the support metal 322 in the circumferential direction. Each. Here, between the small grindstone grain layer portions 326,..., Arranged in such a manner that the areas of the grindstone grain layer 324 are separated from each other in the circumferential direction constitute a sub discharge path 332. Each small grindstone layer portion 3 2 6 'as shown in the longitudinal cross-sectional view of FIG. 19' is formed by forming a small hill portion 336 which is raised in a substantially rectangular parallelepiped shape from the one surface 322a of the support metal 322 'and The upper surface 336a of the small hill part 336 is formed by fixing and bonding superabrasive grains 4 ... with a metal bonding phase 3 3 0. The number of superabrasive grains 14 per ^ small millstone grain layer portion 326 is set to 3 to 25. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Because the height of the small hill 336 for one side 322a of the support metal 322 is set to the range of 0.1 to 5.0 mm Between the grinding point and the auxiliary discharge path 332, the grinding fluid or grinding debris can be blocked and can be smoothly flushed and discharged. Moreover, even if it is a grinding 塾 4-series soft person who is the material to be cut, the grain layer of the grindstone It seems that it will still not completely collide, but can be contacted only by the grinding point of the superabrasive grain; the grinding pad 4 can maintain a high grinding pressure.

ί之高度H 低於0.1mm，則並無上述效果而容易 几主碰撞，如超出 5.0mm亦不能獲得更佳的效果之提 且形成超過5.0mm 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公爱） 311684 B7 B7 經 濟 部 智 慧 財 產 局 消 費 合 作 社 印 製 五、發明說明（37 ) 的高小丘部並不符經濟利益。 又’將小磨石粒層部326 車 -f- A，„ τ _ 之千面觀察下的略長方形狀 之尺寸权為長度Lax寬幅Lb，而寬Μ 平均粒徑的1.3至1〇戶左六，且# 勹&磨石粒之 ^ 倍左右，長度“設為寬幅以之3 倍以上之尺寸，而設定縱寬比 E π权亢之值。長度La設為2 至 15mm,例如設成 La=1〇mm、Lb = 2mm。 第17圖及第18圖中，小磨石4 J磨石叔層部326係將對於例If the height H is less than 0.1mm, there is no such effect and it is easy to collide. If it exceeds 5.0mm, it will not get a better effect and it will form more than 5.0mm. The paper size applies the Chinese National Standard (CNS) A4 specification. (210 x 297 public love) 311684 B7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People's Republic of China 5. The Invention Note (37) of Gao Xiaoqiu is not in line with economic interests. Also, the size of the slightly grindstone layer layer 326 car-f-A, „τ _ under the observation of a thousand rectangles is the length Lax wide Lb, and the width M average particle size of 1.3 to 10 Sixth from the left, and about ^ times of # 磨 & grindstone, the length "is set to a size more than 3 times the width, and the value of the aspect ratio E π weight is set. The length La is set to 2 to 15 mm, for example, La = 10 mm and Lb = 2 mm. In Figures 17 and 18, the small grindstone 4 J grindstone tertiary layer 326 is an example.

如中心線〇1在磨輪320之旋轉方向前方側者，作為對中心 線〇1成銳角之正角0傾斜的第1小磨石粒層部326Α，旋 轉方向S方側之小磨石粒層冑326則作為成負角的第2 小磨石粒層部326Β，-對小磨石粒層部以邱成為八字 型往圓周方向排列而構成。此等第i小磨石粒層部MM 及第2小磨石粒層部326Β係隔著通過中心〇的直徑方向 之中心線01成為略線對稱。 並且，例如第18圖中，如假設磨輪32〇係相對於被削 材的研磨墊4之移動方向ρ往抑方向旋轉，則可由兩方 向P,Ph之力的合成而設定磨石粒層324的磨削方向g。 此磨削方向G將按照磨石粒層324之圓周方向旋轉位 置’隨著方向Ph變化角度。 本實施形態的磨輪3 20具備有如上述之構成，當進行 研磨墊4之再磨削時，係一邊使研磨墊彳往卩方向旋轉， 一邊使磨輪320往Ph方向旋轉並磨削研磨墊4之起毛以 恢復或維持其平坦度。磨削之際，由於在環狀之磨石粒層 3 24上往圓周方向排列有略成八字形的縱寬比較大的複數 請 先 閱 讀 背 之 注 意 事 項 再 填二 I裝 本 . 頁 訂 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 37 311684 474855 A7 B7 五、發明說明（38 ) 對小磨石粒層部326A、326B，所以將對全周形成略線接 觸，比較環狀之磨石粒層做面接觸的以往之磨輪時，即使 (請先閱讀背面之注意事項再填寫本頁) 磨石粒層之表面有少許凹凸，穩座安定性仍佳且不易產生 磨削時之振動。因而可維持較高磨削壓力且不會對研磨塑 4造成局部性的損害。 又，第18圖中，在磨石粒層324某領域的形成略八字 型的各一對小磨石粒層部326A、326B中，由於第工小磨 石粒層部326A對於中心線〇丨形成靠近磨削方向G的傾斜 角Θ ’研磨墊4之磨削長度較長而可進行較長的磨削。因 此’由於磨削量大且所生成的磨削屑亦多，故容易發生塞 目。 位在此第1小磨石粒層部326A之旋轉方向後側的第： 小f石粒層部聰係以對磨削方向G接近略成直角的角 度交叉之故’研磨塾4之磨削長声鲈且 扪贲戾争乂長。因此能使在第1 小磨石粒層部326A產生而在兩小磨For example, if the centerline 〇1 is on the front side of the rotation direction of the grinding wheel 320, it is the first small grindstone grain layer portion 326A inclined at a positive angle of 0 to the centerline 〇1, and the small grindstone grain layer on the S side of the rotation direction.胄 326 is a second small millstone grain layer portion 326B having a negative angle, and is formed by arranging the small millstone grain layer portion in a circle shape in a Qiu shape. The i-th millstone grain layer portion MM and the second whetstone grain layer portion 326B are slightly line-symmetrical with the center line 01 in the diameter direction passing through the center 0. Furthermore, for example, in FIG. 18, if the grinding wheel 32 is rotated relative to the moving direction ρ of the polishing pad 4 of the material to be cut, the grinding stone grain layer 324 can be set by combining the forces of two directions P and Ph. Grinding direction g. This grinding direction G will change its position in accordance with the circumferential rotation position of the grindstone grain layer 324 according to the angle Ph. The grinding wheel 3 20 of the present embodiment is configured as described above. When regrinding the polishing pad 4, the grinding pad 彳 is rotated in the 卩 direction while the grinding wheel 320 is rotated in the Ph direction and the grinding pad 4 is ground. Raising to restore or maintain its flatness. During grinding, there is a large figure with a large figure width in the shape of a circle in the circumferential direction on the ring-shaped grindstone layer 3 24. Please read the precautions on the back before filling in the second I. Paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 37 311684 474855 A7 B7 V. Description of the invention (38) For the small grindstone layer 326A, 326B, it will form a slight line contact with the entire circumference When comparing the previous grinding wheel with a ring-shaped grinding stone grain surface, even if (please read the precautions on the back before filling this page) the surface of the grinding stone grain layer is slightly uneven, the stability and stability of the seat is still good and not easy. Vibration during grinding. Therefore, a high grinding pressure can be maintained without causing local damage to the abrasive plastic 4. In Fig. 18, in the pair of small grindstone grain layer portions 326A and 326B formed in a slightly figure-eight shape in a certain area of the grindstone grain layer 324, the first small grindstone grain layer portion 326A is aligned with the center line. The inclination angle θ ′ forming the inclination angle θ ′ near the grinding direction G has a longer grinding length and enables longer grinding. Therefore, since the amount of grinding is large and the amount of generated grinding chips is large, clogging is likely to occur. Located at the rear side of the rotation direction of the first small grinding stone layer portion 326A: The small f stone layer layer Satoshi intersects at an angle that is slightly at a right angle to the grinding direction G. Grinding of grinding 塾 4 Long perch and contention. Therefore, the first small millstone grain layer portion 326A can be generated and

J選石粒層部326A、326B 間塞目的磨削屑與磨削液等一起蒋 ^ 咤移動至小磨石粒層部 326B之後方，並排出磨輪32〇 r #而可消除塞目。 經濟部智慧財產局員工消費合作社印製 :，：於磨輪320之磨石…24呈現環狀，視其旋 轉位置，其旋轉方向Ph可能會位在 上n m 士丄丄 牧兴研磨塾4之旋轉方 向P同一方向或相反方向，在此情 月A之磨削方向G將會往 P方向或/及Ph方向重疊，惟在此 馆开/亦由於一對第1及 第2小磨石粒層部326A，326B係 刀別對中心線〇 1互相技 相反側傾斜之故，多半為磨削方向灵互相往 將斜向橫過小磨石粒 層部326,而可如上述之方式，由— __々之小磨石粒層部3 2 6 ^纸張尺度適用中國國家標準規格（21〇 x 297公楚·^-------- 38 311684 經濟部智慧財產局員工消費合作社印製 474855 五、發明說明（39 進行長的磨削，而由另一方之小磨石粒層部326進行短的 磨削，並使磨削屑往旋轉方向Ph後方排 如上述，本實施形態的磨輪320中，由於=目離配 置的複數個小磨石粒層部326係對H G傾斜卻仍往略 直徑方向延伸存在，以致複數個小磨石粒層部326……與 研磨墊4略做線接觸，故可安定與研磨墊4的接觸面積或 接觸壓力，即使小磨石粒層部326之表面有凹凸，其穩座 安定性仍佳，且可抑制磨削時發生之微小振動，並抑制磨 削力之降低而可防止對研磨墊4的局部性損害。 又，藉由對中心線01互相往相反側傾斜配置的複數對 小磨石粒層部326A，326B......，可交互確保磨削量，並 消除磨削肩之塞目以提升磨削層之排出性並抑制刀割效果 之降低。 其-人，參照第20圖，就本發明之第7實施形態加以說 明。 第20圖所示之磨輪34〇中，在支座金屬332之一面 322a外周側之磨石粒層341中，在小丘部336上以略成八 字形並往圓周方向依次排列有與第6實施形態的小磨石粒 層部326同-形狀之第1及第2小磨石粒層部326A、 326B。並且，在成對的第！及第2小磨石粒層部326A， 326B之間設置有較小磨石粒層部326之縱寬比為小的第3 小磨石粒層部342A及4小磨石粒層部342B，而第3及第 4小磨石粒層冑342A、342B係分別從其他小磨石粒廣部 分離配置者。 — III1III1III1 --- I 1 1 Ϊ I 訂------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度綱+ S g家標準（CNS)A4規格（210 X 297公爱） 39 311684 4/4855 經濟部智慧財產局員工消費合作社印製 A7 -----------g?- _— _ 五、發明說明（40 ) 此第3小磨石粒層部324A具有寬幅Lb而長度Lc(<La) 的縱寬比，且形成與例如第！小磨石粒層部326八在長度 方向略成平行延伸存在。第4小磨石粒層部SUB具有寬 幅Lb而長度Ld(<La)的縱寬比，且形成與例如第2小磨石 粒層部326B在長度方向略成平行延伸存在。 又’在對於第1及第2小磨石粒層部326A、326B而 與第3及第4小磨石粒層部342Α、342β成圓周方向相反 側上分別設置有具有與小磨石粒層部326同一寬幅而 縱寬比較小的第5小磨石粒層部342c及第6小磨石粒層 部342D ’第5及第6小磨石粒層部342C、342D，係分別 從其他小磨石粒層部326Α、326Β、342Α、342β分離而配 置。此等小磨石粒層部342A、342B、342C、342D亦形成 在小丘部上。 第7實施形態之磨輪340係具備有上述構成者，藉由 將第3至6小磨石粒層部342八至342D適宜地分散至第i 及第2小磨石粒層部326A、326B之間，並與小磨石粒層 部326A、326B之任一略成平行排列，於研磨墊4之磨削 加工時’磨削長度較長的複數個小磨石粒層部326A、 342A、342C將可與容易排出磨削層的複數個小磨石粒層 部326B、342B、342D在圓周方向交互連續，而可更加提 升磨削效率，同時，並可適宜消除磨削屑之塞目。 並且’由於小磨石粒層部342A至342D之增加而更能 提升磨輪340之磨削面的穩座安定性。 其次’參照第2 1圖’就本發明之第8實施形態加以說 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 311684 裝---------訂---------線 (請先閱讀背面之注意事項再填寫本頁)The grinding debris of the plugged between the stone layer portion 326A and 326B is moved to the rear of the small stone layer portion 326B together with the grinding fluid and the like, and the grinding wheel 32 〇 # is discharged to eliminate the plug. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ::: The grinding stone on the grinding wheel 320 ... 24 is ring-shaped, depending on its rotation position, the rotation direction Ph may be located on the upper nm Shishi Muxing grinding 塾 4 rotation The direction P is the same or the opposite direction. In this case, the grinding direction G of the month A will overlap the direction P or / and Ph. However, it is also opened in this hall because of a pair of first and second small grindstone layers. The parts 326A and 326B are inclined to the center line and opposite sides of the center line. Most of them are in the direction of grinding, and they will cross the small grindstone layer 326 obliquely. However, as described above, from — _ _The scale of the small millstone granule 3 2 6 ^ The paper size is applicable to the Chinese national standard specifications (21 × 297 Gongchu ^ -------- 38 311684 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 474855 V. Description of the invention (39) Long grinding is performed, while short grinding is performed by the other small grindstone layer portion 326, and the grinding chips are arranged backward in the rotation direction Ph as described above. The grinding wheel of this embodiment In 320, due to the multiple small millstone grain layer sections 326 arranged in the meshing distance, they are still slightly straight to HG Existing in the direction, so that the plurality of small grindstone grain layer portions 326 ... are in slight linear contact with the polishing pad 4, so the contact area or contact pressure with the polishing pad 4 can be stabilized, even if the surface of the small grindstone grain layer portion 326 has Concavity and convexity, its seat stability is still good, and it can suppress the small vibration that occurs during grinding, and suppress the reduction of the grinding force, and can prevent local damage to the polishing pad 4. Also, by centering on the center line 01, The plural pairs of small grindstone grain layer portions 326A, 326B, etc. arranged obliquely on the opposite side can ensure the grinding amount interactively, and eliminate the clogging of the grinding shoulder to improve the discharge of the grinding layer and suppress the cutting. The effect is reduced. A person will explain the seventh embodiment of the present invention with reference to FIG. 20. In the grinding wheel 34 shown in FIG. 20, the grindstone grain layer on the outer peripheral side of the one surface 322a of the support metal 332. In 341, the first and second small millstone grain layer portions 326A having the same shape as the small millstone grain layer portion 326 of the sixth embodiment are arranged in a small figure in a zigzag shape in the circumferential direction on the small hill portion 336. , 326B. And, it is provided between the paired first and second small millstone grain layer portions 326A, 326B. The third small millstone grain layer portion 342A and the fourth small millstone grain layer portion 342B having a small aspect ratio of the small millstone grain layer portion 326 are small, and the third and fourth small millstone grain layer portions 342A, 342B They are separated and arranged separately from the wide part of other small millstones. — III1III1III1 --- I 1 1 Ϊ I Order ------- (Please read the precautions on the back before filling this page) Sg Standard (CNS) A4 Specification (210 X 297 Public Love) 39 311684 4/4855 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ----------- g?-__ _ 5 Explanation of the invention (40) The third small millstone grain layer portion 324A has a width-to-width ratio of Lb and a length Lc (< La), and forms, for example, the first! The small millstone grain layer portion 326 extends slightly parallel in the longitudinal direction. The fourth small grindstone grain layer portion SUB has a width-to-width ratio of Lb and a length Ld (< La), and is formed to extend slightly parallel to, for example, the second small grindstone grain layer portion 326B in the longitudinal direction. Also, the first and second small grindstone grain layer portions 326A and 326B are provided on the opposite sides of the third and fourth small grindstone grain layer portions 342A and 342β in the circumferential direction, respectively. The portion 326 has the same width and a small longitudinal width of the fifth small grindstone grain layer portion 342c and the sixth small grindstone grain layer portion 342D. The fifth and sixth small grindstone grain layer portions 342C and 342D are respectively from other The small grindstone grain layer portions 326A, 326B, 342A, and 342β are arranged separately. These small grindstone grain layer portions 342A, 342B, 342C, and 342D are also formed on the hillock portions. The grinding wheel 340 of the seventh embodiment is provided with the above-mentioned structure, and the third to sixth small millstone grain layer portions 342 to 342D are appropriately dispersed among the i and second small millstone grain layer portions 326A and 326B. And are arranged slightly parallel to any of the small grindstone grain layer portions 326A, 326B, and during the grinding process of the polishing pad 4, a plurality of small grindstone grain layer portions 326A, 342A, 342C having a longer grinding length It can continuously interact with a plurality of small grindstone grain layer portions 326B, 342B, and 342D that can easily discharge the grinding layer in the circumferential direction, which can further improve the grinding efficiency, and at the same time, can appropriately eliminate the clogging of the grinding debris. Also, the increase in the small grindstone layer portions 342A to 342D can further improve the stability of the grinding surface of the grinding wheel 340. Next, 'refer to Figure 21' for the eighth embodiment of the present invention. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 311684 Pack --------- Order- -------- Line (Please read the notes on the back before filling this page)

五、發明說明（41 ) 明。 第21圖所示之磨輪350中，在圓板形支座金屬322 之一面322a外周側形成有略環狀之磨石粒層352。此磨石 粒層352係將各2對之第1小磨石粒層部326A、32从及 第2小磨石粒層部326B、326B組合成菱形（或略井格狀） 以構成菱形組部354，此菱形組部354係形成往直徑方向 例如各2组並於圓周方向依次排列。因此，並排在直徑方 向的2組菱形组部354、354係形成中心線〇1與略二分各 菱形組部352的對角線相疊合。 並且，在各菱形組部354中’各2個第！小磨石粒層 部326A、326A及第2小磨石粒層部326b、326B係以互 相相對的方式而配置，而各小磨石粒層部326Α、326β係 以互相分離之方式配置。 依如此之構成’則於各菱形組部354中，將按交互方 式排列有在磨輪350之直徑方向具有與磨削方向G近似的 角度’而磨削長度較長的第1小磨石粒層部326A，以及與 磨削方向G略成垂直相交而磨削長度較短的第2小磨石板 層部326B，且在圓周方向亦同樣地，有第1小磨石粒層部 326A，及第2小磨石粒層部326B按交互方式排列。 因而具有可確保較大磨削量之同時，每遇磨削層之塞 目’即可有效排出的效果。並且’由於小磨石粒層部3 2 6 之增加’磨削時之穩座安定性亦將提升。 其次’參照第22圖’就本發明之第9實施形態加以說 明。 -------------裝---------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規袼（21〇 X 297公釐） 41 311684 474855 A75. Description of the invention (41). In the grinding wheel 350 shown in FIG. 21, a substantially annular grinding stone grain layer 352 is formed on the outer peripheral side of one surface 322 a of the disc-shaped support metal 322. This grindstone layer 352 is composed of two pairs of the first small grindstone grain layer portions 326A, 32 and the second small grindstone grain layer portions 326B, 326B into a rhombus (or slightly well-shaped) to form a rhombus group. The portion 354, which is a diamond-shaped group portion 354, is formed in a diameter direction, for example, two groups each, and is sequentially arranged in the circumferential direction. Therefore, the two groups of diamond-shaped group sections 354, 354, which are arranged side by side in the diameter direction, form a center line 〇1 and a diagonal line of each of the two groups of diamond-shaped group sections 352 is superimposed. And, in each of the diamond-shaped group sections 354, two are each! The small grindstone grain layer portions 326A and 326A and the second small grindstone grain layer portions 326b and 326B are arranged so as to face each other, and the small grindstone grain layer portions 326A and 326β are arranged separately from each other. According to such a structure, the first small grindstone grain layer having a longer grinding length is arranged alternately in each of the diamond-shaped group portions 354 so as to have an angle similar to the grinding direction G in the diameter direction of the grinding wheel 350. The portion 326A and the second small millstone plate layer portion 326B which intersects the grinding direction G slightly perpendicularly and has a short grinding length, and also has a first small millstone grain layer portion 326A in the circumferential direction, and The two small grindstone layer portions 326B are arranged in an interactive manner. Therefore, it has the effect of ensuring that a large amount of grinding can be ensured and that it can be effectively discharged every time the plug 'of the grinding layer is encountered. And “the increase in the small grindstone grain layer portion 3 2 6” will improve the seat stability during grinding. Next, referring to Fig. 22, a ninth embodiment of the present invention will be described. ------------- Install --------- Order --------- line (please read the precautions on the back before filling this page) The paper size printed by the Property Cooperative's Consumer Cooperative is subject to the Chinese National Standard (CNS) A4 (21 × 297 mm) 41 311684 474855 A7

五、發明說明（42 ) 第22圖所示之磨輪36〇中， 压龙屬322之一面322a 之磨石粒層3 62係將2對笫】/ 耵弟1小磨石粒層部326A與第2 小磨石粒層部326B組合成菱形（或 、 (次略井格狀）以構成菱形 組部364’且將構成各邊的筮1 X合透的第1小磨石粒層冑326A或第2 小磨石粒層部326B作為共通邊來僅用 透水便用而按網目狀排列 成多數個菱形組部364。在各寡拟知加，^ , 在谷愛形組部364中，各2個第j 小磨石粒層部326A、326A，艿諠ο 1 ，及第2小磨石粒層部326b、 326B係以互相相對向之方式配置，而各小磨石粒層部 326A、326B係按互相分離的方式配設。在本實施形態中， 由於在一面322a之全面排列有複數個菱形組部364……之 故’當磨削之際，由於具有與磨削方向〇近似的角度而磨 削長度較大的帛1小磨石粒層部326A或第2小磨石粒層 p 326B及與研削方向略成垂直相交而磨削長度較短的第 2小磨石粒層部326B或第小磨石粒層部係以交互方式 配置之故，具有可確保較大磨削量之同時，每遇磨削屑之 塞目即可有效排出的效果。並且，由於小磨石粒層部3 2 6 之增加’磨削時之穩座安定性亦將更提升。 經濟部智慧財產局員工消費合作社印製 其-欠’參照第2 3圖’就本發明之第1 〇實施形態加以 說明。 第23圖所示之磨輪37〇中，在支座金屬322之一面 3 22a之外周側形成有略環狀之磨石粒層372。在此磨石粒 層372中，隔著以預定間隔所劃的中心線〇 1，在其兩侧有 複數個略成圓弧狀（曲線狀）之小磨石粒層部374......，往中 心線〇 1之延伸存在方向將其位置依次挪移小磨石粒層部 本氏張尺度適用中國國家標华（CNS)A4規格（210 X 297公爱 42 311684 A7 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明（43 ) 374之略1/2長度，並以交互相對士斗、 相對向之方式配設。將隔著 此等中心線〇1相對向而依次挪移的小磨石粒層部W之一 方作為第3小磨石粒層部374A，將另—方作為第4小磨石 粒層部374B。 為此’在磨㉝370之平面觀察下，於其外周側例如名 中心線οι之左側，以圓藏中心點位在中心線qi方向之$ 式配設有略圓孤狀之第3小磨石粒層部374a，在中心線 οι之右側’從與第三小磨石粒層部374a成線對稱之位置 僅以第3小磨石粒層部374A之略1/2長度，從中心點挪移 而配設有第4小磨石粒層部374B。並且隔著中心線〇1僅 以略1/2長度挪移而相對向的第3及第4小磨石粒層部 3 74 A 3 74B係於各中心線〇 i例如每2對排列在圓周方向 以構成磨石粒層3 7 2。 各小磨石粒層部374A、374B係分別互相分離者，又， 各小磨石粒層部374A、374B之兩端係在從中心線〇1略等 距離之處。 亚且，由於小磨石粒層部374係略圓弧狀之故，第 圖中，由於小磨石粒層部374A之一方的一半374a係呈現 接近磨削方向G的傾斜角，所以磨削長度較長，另一方之 半3 74b係與磨削方向G略垂直相交而交叉，所以能消 除塞目。又，在第4小磨石粒層部3 74B，則一方之一半 374a及另一方之一半374b係配置成與第3小磨石粒層部 37 4 A在長度方向相反的方向。 因此’具有可確保較大磨削量之同時’每遇磨削屑 裝--------* ^ ί --------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺錢射關家標準（CNS)A4規格（210 X 297公爱） 43 311684 474855 A7 b/ 五、發明說明（44 ) 塞目可有效消除，且磨削時之穩座安定性亦佳的效果。 在此，曲線狀之小磨石粒層部374不一定需要將略圓 弧狀相對向配置，僅配置一方即可。又，第3小磨石粒層 部374A及第4小磨石粒層部374B亦可不需偏移中心線〇1 方向而予以相對向配置。 又，作為略曲線狀之小磨石粒層部374之其他形狀 例，亦可將S字狀者互相往直徑方向及圓周方向排列以構 成之。 亦可將上述的適當小磨石粒層部，例如由第i及第2 小磨石粒層部326A、遍之組合而成的磨石粒層似等， 如第Η圖同樣（方式）形成3層等之複數層環狀，或如第μ 圖所示方式形成螺旋狀。 圖至L1二圖實施形態之磨輪42°(單層研磨盤)係在第24 圖二圖所示例如圓板形支座金屬422之成為略圓形的 :L:二周側’設置有由成為同心圓(可為非同心圓) 支座金屬42^2 Π之取外周側形成有成為最大直徑(例如與 支座金屬422同樣直徑）的第i磨石 隔著間隔形； a ，在最内側 ”㈣成有第2磨石粒層424B，在最 成有成為最小直徑的第3 s隔形 A0/tn 拉層424C。第3磨石鈿a 424C之内側則未形成磨石㈣。 板層 於支座金屬422之一面4士 層…、c之各環狀領域上:：，第=第3磨石粒 有複數個略二Si圓::圓 料 317^Γ 請 先 閲 讀 背 Φ 之 注 意 事 項 再 填 寫 頁 裝 I I ! 訂 A7V. Description of the invention (42) In the grinding wheel 36 shown in FIG. 22, the grindstone grain layer 3 62 of the one face 322a of the genus 322 is 2 pairs. The second small millstone grain layer portion 326B is combined into a rhombus (or, (second slightly well-shaped)) to form the diamond group portion 364 ', and the first small millstone grain layer 胄 A that is composed of the sides 构成 1 X is completely penetrated. Or the second small millstone grain layer portion 326B is used as a common edge and is used only for water permeation, and is arranged in a mesh shape into a plurality of diamond-shaped group portions 364. In each of the widows, ^, in the valley love-shaped group portion 364, Each of the two j-th small grindstone grain layer portions 326A, 326A, 艿 1, and the second small-grindstone grain layer portions 326b, 326B are arranged so as to face each other, and each of the small grindstone grain-layer portions 326A And 326B are arranged separately from each other. In this embodiment, since a plurality of diamond-shaped groups 364 ... are arranged on one side 322a, it is similar to the grinding direction when grinding.小 1 small millstone grain layer portion 326A or the second small millstone grain layer p 326B with a larger grinding length, and the grinding length which is slightly perpendicular to the grinding direction and shorter The second small grindstone layer portion 326B or the second small grindstone layer portion is arranged in an interactive manner, which has the effect of ensuring that a large amount of grinding can be ensured and that it can be effectively discharged every time the plug of the grinding debris is encountered. And, with the increase of the small grindstone layer section 3 2 6, the stability and stability of the seat during grinding will also be improved. It is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-owed 'refer to Figure 2 3' The tenth embodiment of the present invention will be described. In the grinding wheel 37 shown in FIG. 23, a slightly annular grindstone grain layer 372 is formed on the outer side of one surface 3 22a of the support metal 322. Here, the grindstone In the grain layer 372, a plurality of small millstone grain layer portions 374 which are slightly arc-shaped (curved) are arranged on both sides of the center line 〇1 drawn at predetermined intervals. The extension of the centerline 〇1 moves its position in order and shifts its position in order. The scale of this millstone is applicable to China National Standards (CNS) A4 specifications (210 X 297 public love 42 311684 A7 A7. Employees ’intellectual property bureau consumption Cooperative prints 5. Slightly 1/2 the length of Invention Note (43) 374 One way is to set one of the small millstone grain layer portions W that are sequentially moved opposite to each other across these center lines 〇1 as the third small millstone grain layer portion 374A, and the other one is used as the fourth small millstone grain layer 374A. Layer section 374B. To this end, under the plane view of Mohan 370, on the outer side, for example, to the left of the center line, a circle-shaped center point in the direction of the center line qi is provided with a slightly rounded solitary section. 3 small grindstone layer portion 374a, to the right of the center line ο ′, is only a half of the length of the third small grindstone layer portion 374A from a position that is line symmetrical with the third small grindstone layer portion 374a. A fourth small grindstone layer portion 374B is disposed to move from the center point. In addition, the third and fourth small grindstone layer portions 3 74 A 3 74B facing each other across the center line 〇 by a slight 1/2 length are tied to each center line. For example, every two pairs are arranged in the circumferential direction. To form a millstone grain layer 3 7 2. Each of the small grindstone grain layer portions 374A and 374B are separated from each other, and both ends of each of the small grindstone grain layer portions 374A and 374B are located at approximately equal distances from the center line 〇1. In addition, since the small grindstone grain layer portion 374 is slightly arc-shaped, in the figure, half of the small grindstone grain layer portion 374A has an inclination angle close to the grinding direction G, so it is ground. The length is longer, and the other half 3 74b intersects with the grinding direction G slightly perpendicularly and intersects, so the plugging can be eliminated. In the fourth small grindstone layer portion 3 74B, one half 374a and the other half 374b are arranged in a direction opposite to the length direction of the third small grindstone layer portion 37 4 A. Therefore, 'has the ability to ensure a large amount of grinding at the same time' each time the grinding chip is installed -------- * ^ ί -------- line (please read the precautions on the back before filling in this (Page) This paper ruler (CNS) A4 specification (210 X 297 public love) 43 311684 474855 A7 b / V. Description of the invention (44) The plug can be effectively eliminated, and the stability of the seat during grinding is stable Also good effect. Here, the curved small grindstone grain layer portion 374 does not necessarily need to be arranged in a relatively arcuate shape, but only one side may be arranged. In addition, the third small grindstone grain layer portion 374A and the fourth small grindstone grain layer portion 374B may be disposed opposite to each other without shifting the direction of the center line 〇1. In addition, as another example of the shape of the slightly curved small grindstone grain layer portion 374, S-shaped persons may be arranged in a diameter direction and a circumferential direction with each other. It is also possible to form the appropriate small grindstone grain layer portion, for example, the grindstone grain layer formed by combining the i-th and second small grindstone grain layer portions 326A, and the like, as shown in the figure (the same way). A plurality of layers such as three layers are ring-shaped, or formed into a spiral shape as shown in FIG. The grinding wheel 42 ° (single-layer grinding disc) of the embodiment shown in Figure 2 to Figure L1 is shown in Figure 24. For example, the disc-shaped support metal 422 becomes slightly circular as shown in Figure 2. A concentric circle (may be a non-concentric circle). The i-millstone with the largest diameter (for example, the same diameter as the support metal 422) is formed on the outer peripheral side of the support metal 42 ^ 2. The "inside" is formed with a second grindstone grain layer 424B, and at the most formed there is a third s spacer A0 / tn pull layer 424C which has the smallest diameter. The inner side of the third grindstone a 424C is not formed with a grindstone. Plate The layer is on each ring area of one side of the support metal 422 ..., c ::, the third grinding stone grain has a plurality of slightly two Si circles :: round material 317 ^ Γ Please read the back Φ first Matters needing attention to fill in the page II! Order A7

A7 經濟部智慧財產局員工消費合作社印M 五、發明說明（45 ) 方式來士 P 425(大部），並在其上面425a之中央按陷沒之 係^ 1 '有例如略圓錐形狀之凹部426。並且，此凹部426 货、將其開口部426 ^〜 6a之内徑D1設定為較超磨石粒14之平 均粒役為小的尺寸， 再沬度m則設定為例如超磨石粒14 炙平均粒徑之略1/2以下。 因此，此凹部4-)<丄 26中，使單一之金剛石或CBN等超磨 ^ ,陷下例如平均粒徑之約1/4至2/5左右並嵌入且固 ^二接。並且，由於小丘部425之上面425a被Ni或Ni "'口金之金屬電錢相等之金屬結合相427所覆蓋，使超磨 石粒 14之,邱八、尖 刀 '.固疋黏接而構成小磨石粒層部4 2 8。換 在j丘。卩425上形成有單一之超磨石粒14被金屬結 合相427所固定黏接的電積磨輪。 立由於使超磨石纟14之前端細狀之角部或尖銳部陷入 P 425内，而使相對向的另一端之角部或尖銳部向上方 大出以構成用以磨削被削材的磨削點W參照第％圖）。 並且，於第1至第3磨石粒層424A、B、C之各個中， 在圓周方向相鄰接的小丘部425、425之間構成例如副排出 路430，在此副排出路43〇上並未形成有磨石粒層，而係 藉由磨削液排出研磨墊4之磨削屑或研漿s之固化物等^ 再者’在第1至第3磨石粒層424A、B、C間之直卢方向 之間隙中，形成有略環狀之主排出路43 i。 主排出路4 3 1及副排出路4 3 0係形成例如同樣深产 此等主副排出路431、430之磨削屑等將通過最外 J -弟 1 磨石粒層424A之副排出路430而排出至外部。 II----I------· I I--III — 111 — — — I 1 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 45 311684 474855 經濟部智慧財產局員工消費合作社印製 A7 ______B7 — ----— , -_____ 五、發明賴（46 ) ' 在此，小丘部425之基部之外徑D係設定在超磨石粒 14之平均粒徑之1.3至3倍之範圍。如在此範圍内則可 防止在磨削點滯積磨削屑以順利沖流，如較〗3倍為小 則小丘部425之強度降低，而因磨削電阻使得超磨石粒η 容易脫落，小丘部425容易缺損，如較3倍為大，則超磨 石粒14之配置間隔過大以致將發生磨削能力降低，或加快 超磨石粒14之磨耗等缺點。 又，對於支座金屬422之—面422a的小丘部425之高 度Η可為0.05至3.Omm之範圍。 ° 如在此範圍内，可在磨削點與支座金屬422上之主副 排出路431、430之間使磨削液或磨削屑容易沖洗而排出。 在此，如在支座金屬422之一面422a上形成有金屬電鍍相 等時’則從此金屬電鍍相等的距離成為高度Η。 於直徑方向及圓周方向相鄰接的小丘部425、425間之 距離Μ係設為小丘部425之外徑D的} /3至2倍之範圍。 如在此範圍則可確保磨削性能而將小丘部425、425間作為 主排出路431及副排出路43〇，使磨削液或磨削屑容易沖 流以排出，如較1/3倍為小，則磨削性能會升高，惟磨削 屑等易堵塞，如較2倍為大，則磨削效率會降低。 本實施形態之磨輪420係如上述方式所構成者。接 著，參照第27圖，就磨輪42〇之製造方法加以說明。 第27圖（A)中，將例如由SUS3〇4等而成的圓板形支 座金屬422之一面422a ’利用蝕刻或切削加工等予以部分 性去除成略圓錐狀，並按同圖（B)所示，將凹陷部426A…… --------aST---------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度賴巾_家鮮（CNS)A4祕^^^97 46 311684 474855 經濟部智慧財產局員工消費合作社印製 A7 -------------- 五、發明說明（47 ) 按預定間隔形成環狀’且對應第1至第3磨石粒層424A、 B、C，在直徑方向隔著適當間隔形成3層。在此，可採用 放電加工或模具成型代替姓刻，在-面422a上形成凹陷部 426A。 接著於第27圖（〇中，於一面422a上留下相當於各 凹陷部426A周圍之小丘部化的領域並進行樹脂遮罩， 並使用Νι或Νι基合金電鍍在凹陷部426A及其周圍析出 被鍍金屬使之***，再按預定間隔各自形成多數個第27 圖⑼所示之小丘冑425......。此時，電錢金屬係在凹陷部 426A及其周圍以均等厚度析出，故在小丘部425之上面 425a會形成凹部426。 在此’為了將小丘部425電錢形成圓錐台形狀，則可 將遮翠部434之側面434a從支座金屬422之一面422&突 出至上方之程度往外側突出，而以圓錐台形狀使之傾斜配 置，藉以控制電鍍金屬之析出領域。又，為了將小丘部425 形成略圓柱狀，則可將遮罩部434之側面43乜形成直立之 圓筒狀。 接著，使超磨石粒14例如一邊振動一邊掉落各小丘部 425之上面42 5a的凹部426中。其時，由於凹部426之開 口直徑D1係設定為較超磨石粒14之平均粒徑為小之故， 位在超磨石粒14之角部或尖銳部會掉落並略成相對向的 位置的其他角部或尖銳部將突出於上方前端側。 當磨石電積之際，第27圖（E)中，將除各小丘部425 之上面42 5a以外的其他領域，亦即將主副排出路々η、4 ] I 1 !| — — — — — — 1! *1! - ---11 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格 297公笼） 47 311684 4/4855 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（48 ) 等以遮罩部434予以樹脂遮罩而 早向進仃電錢。由此，可在各 小丘部425之上面425a將超廢丈如，， (磨石粒14以]sii或Ni基合金 等之金屬結合相427固定黏接。你a超从人 從金屬結合相427的超磨 石粒14之突出量將成例如平均粒徑之2/3至々π左右。 又，第24圖中，將對第1至第3磨石粒層424A、B、 C朝向與研磨墊4之旋轉方向 n F略成平订的方向延伸的假 想線’往與此方向略垂直相夺沾士a 相乂的方向1挪移並在任意位置 劃出假想線a、b、C、d。於是’由於與上述第4實施形態 同樣方式，各假想線a、b、c所交叉的第】至第3磨石粒 層424A、B、C之領域的各磨削長度（面積=工作量）之和形 成略均等，故可進行平坦度更高的磨削加工。 本實施形態之磨輪420係具備有上述構成者，如進行 研磨墊4之再磨削，則可抑制使用各小磨石粒層部428之 超磨石粒14磨削所產生的研磨墊4之磨削屑或殘留在研磨 墊4的矽晶圓之電路金屬或矽之磨削屑等附著並固定黏接 於超磨石粒4……間，並使含有此等磨削屑的磨削液之黏 性降低後通過副排出路4 3 0及主排出路4 3 i以促進向外部 之排出。並且’藉由磨削液促進超磨石粒1 4之冷卻可防止 超磨石粒1 4之損傷，且可抑制各種磨削屑沈下滯積於超磨 石粒14、14間。 其次，參照第2 8圖，說明本發明之第12實施形態， 與上述之第11實施形態同一或同樣之構件則採用同一符 號而省略其說明。 第28圖所示磨輪440係具有與第11實施形態之磨輪 ---------I----裝----------訂*^-------* 綠 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 48 311684 474855 B7 五、發明說明（49 ) CO相同基本構造者，不同 小磨石粒層部428·..ι益 文預疋“排列複數個 旋狀，轉佳為至少磨石Μ 成1層連續的螺 3層以上者（第28 Η +， Η 直徑方向隔著間隔捲繞 者（第28圖中係形成3層）。 在此實施形態中，磨石粒層442 向内側的3層觀察時 從直…外側朝 形成有最外周之第成之方式以螺旋狀連續 田 η之弟1磨石粒層442八，第2磨石粒層442Β， 取内側之第3磨石粒層442e。 成有螺旋狀之主排出路431，並在j各磨石粒層之間形 亚在各磨石粒層之小磨石教 間形成有與主排出路431連通的多數個副排 在此，小丘部425，亦可採用其他凹冑426以替代上述 實施形態所用者。例如第29圖⑷所示，亦可在支座金屬 422之一面422a上不形成凹陷部426a，而將小丘部& 予以電鑛形成略圓錐台形狀或略圓柱形狀，㈣於上面 425a之中央部形成例如圓錐狀之凹部445。或可在形成小 丘部425之後，在上面425a之直徑方向以切削加工等形成 例如斷面V字狀之凹部4 4 6 又，小丘部425及金屬結合相427可以金屬黏結 bond)形成以替代利用電積鍍金等之形成方法。或小丘部 425可與支座金屬422 —體進行模具成型 第14實施形態之電積磨輪（電積磨輪）具備有與上述各 實施形態，例如第1實施形態所示之電積磨輪2〇略同一構 造，尤其係在支座金屬19之各突部21上之小磨石粒層部 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 311684 ^/4855 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（50 ) 24上，有i個或複數個短而結實的超磨石粒由金屬結合相 固定黏接的構成。 口 在此，短而結實的超磨石粒係指第3〇圖（A)，（B)，（C) 所示之二維投影後的磨石粒像中，具有2個對稱軸之最大 尺寸的X軸與y轴之比（偏心度）y/x為在丨至丨2者，係接 近正六面體等之正多角形或球形的形狀之超磨石粒之意。 相對於此’ y軸與x軸之比在以上者稱為不規則超磨 石粒，係指第30圖（D)所示之超磨石粒或以往技術之第34 圖所示之超磨石粒14之意。在此，第3〇圖（A)，（b) , 所不之各磨石粒518為y/X=l_〇 ’而同圖（D)所示之超磨石 粒 14 則為 y/x = 2.〇。 此超磨石粒518係在電積磨輪20之磨石粒層22之表 面全體上有例如i至500個，較佳為u至5〇〇個之範圍的 超磨石粒518以金屬電鍍相25固定黏接而構成者。 又，固定在各小磨石粒層部24的複數個超磨石粒 518.·.係如第31圖所示，使至少排列成外周側之環狀的複 數個超磨石粒列5 1 8 A僅以短而結實的超磨石粒5丨8排列 並固定黏接。並且，此超磨石粒列518A亦包含有固定黏 接在突部21之側面21C的超磨石粒18，而此等亦係僅以 短而結實的超磨石粒排列者。 因而，被環狀超磨石粒列518A所包圍的内側超磨石 粒可3有不規則的超磨石粒，惟為了製造上之方便起見， 亦可短而結實的超磨石粒518構成全部超磨石粒。 使用如此電積磨輪以進行磨削的情形下，在電積磨輪 -----------------I-----訂---------線 (請先閱讀背面之注意事項再填寫本頁} 私纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 50 311684 經濟部智慧財產局員工消費合作社印製 五、發明說明（51 20之各小磨石粒層部24係首先以角落r部之短而結實的 超磨石粒518進行研磨墊4之粗磨削，接著以連續到角落 R部的頂部之超磨石粒’尤其以外周之超磨石粒列518A 之短而結實的超磨石粒518進行精加工磨削。尤其外周之 超磨石粒列5 1 8 A之面向外側的角部或稜線部不致太過銳 利而可以適度的刀割效果磨削，即使產生刮痕，仍可抑制 為微小刮痕。 上述的本實施形態中，由於使用短而結實的超磨石粒 518構成小磨石粒層部24之故，平面觀察下可以外周之超 磨石粒列518A之各短而結實的超磨石粒518…之面向外 側的部分進行不致太過銳利而刀割效果佳磨削且不致因 為未採用不規則的超磨石粒而發生銳利的部分粉碎或缺 才貝即使被削材產生刮痕，仍可止於小刮痕。並且磨削時 角部或稜線部等銳利的部分不致破碎而殘留於研磨墊4， 並刮擦晶圓等之被削材表面或形成刮傷等情事，而可進行 良好的鏡面磨削。 又，上述各實施形態之各電積磨輪可用於裝在晶圓保 持盤5並於對研磨墊4偏心的位置使之一邊旋轉一 研磨塾以替代再磨削器8。 又，上述各實施形態中，係將小磨石粒層部24…及小 丘部21..·形成略圓柱狀或直方體狀者，惟小磨石粒層部或 突部之形狀不受此限制，只要從磨石粒層底部2。的高度 Η為超磨石粒14之平均粒徑以上即可，例如亦可為半 或三角錐形狀等之凸曲面狀。 本氏張尺度適用中國國家標準（CNS)A4規格X 公笼 311684 - - ------ - --- . I III--- I -1^11 — — — I I I {請先閱讀背面之注意事項再填寫本頁} 51 474855 .A7 -----—B7____ 五、發明說明（52 ) 又，構成本發明之各實施形態中的磨輪的電積磨輪 20 ’ 30，120，磨輪220 ’ 240...等，除CMP裝置所用的再 磨削器以外，當然亦可採用於其他研磨磨削裝置。 -------------裝--- (請先閱讀背面之注意事項再填寫本頁) 訂---------線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 52 311684A7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, M. V. Description of the invention (45) Method Rishi P 425 (mostly), and press the sunken system at the center of 425a above it ^ 1 'For example, a slightly conical recess 426. In addition, the inner diameter D1 of the concave portion 426 and the opening portion 426 ^ ~ 6a is set to a size smaller than the average grain size of the superabrasive grain 14, and the repetition degree m is set to, for example, the superabrasive grain 14. The average particle size is slightly less than 1/2. Therefore, in this recessed portion 4-) < 单一 26, a single diamond or CBN is super-abrasive ^, sinked, for example, about 1/4 to 2/5 of the average particle diameter, and embedded and fixed. In addition, because the upper surface 425a of the small hill portion 425 is covered by Ni or Ni " 'metallic metal equivalent of metal alloy phase 427, the superabrasive grains 14, Qiu Ba, sharp knife'. The small grindstone layer portion 4 2 8 is formed. For j hill. A single electro-abrasive wheel with a single superabrasive grain 14 fixedly bonded by a metal bonded phase 427 is formed on the 卩 425. Since the fine corner or sharp part of the front end of the superabrasive stone 纟 14 is plunged into P 425, the corner or sharp part of the opposite end is made larger upward to constitute a material for grinding the material to be cut. Grinding point W (see Fig.%). In addition, in each of the first to third millstone grain layers 424A, B, and C, a sub-exhaust path 430 is formed between the hillock portions 425 and 425 adjacent to each other in the circumferential direction, and the sub-exhaust path 43 is here. There is no grindstone layer formed on the surface, but the grinding chips or solidified product of the slurry s are discharged from the grinding pad 4 by the grinding fluid. ^ Furthermore, the first to third grindstone layers 424A, B In the gap in the straight direction between C and C, a slightly annular main discharge path 43 i is formed. The main exhaust path 4 31 and the auxiliary exhaust path 4 3 0 form, for example, the secondary exhaust path of the main and auxiliary exhaust paths 431 and 430, which are also produced in the same way, and will pass through the outer exhaust path of the outermost J-brother 1 grindstone layer 424A. 430 and discharged to the outside. II ---- I ------ · I I--III — 111 — — — I 1 (Please read the notes on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 45 311684 474855 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ______B7 — ---- —, -_____ V. Invention (46) 'Here, outside the base of Xiaoqiu 425 The diameter D is set in a range of 1.3 to 3 times the average particle diameter of the superabrasive grains 14. If it is within this range, it can prevent the stagnation of grinding chips at the grinding point to smoothly flow. If it is 3 times smaller, the strength of the small hill portion 425 decreases, and the supergrind η is easy due to the grinding resistance. Falling off, the small hill portion 425 is easy to be damaged. If it is larger than 3 times, the arrangement interval of the superabrasive grains 14 is too large, so that the grinding ability is reduced, or the wear of the superabrasive grains 14 is accelerated. In addition, the height Η of the small hill portion 425 on the surface 422a of the support metal 422 may be in the range of 0.05 to 3.0 mm. ° If it is within this range, the grinding liquid or grinding debris can be easily washed out and discharged between the grinding point and the main and auxiliary discharge paths 431 and 430 on the support metal 422. Here, if a metal plating layer is formed on one surface 422a of the support metal 422 ', the distance equal to the metal plating becomes a height 成为. The distance M between the small hill portions 425 and 425 adjacent to each other in the diameter direction and the circumferential direction is set to a range of / 3 to 2 times the outer diameter D of the small hill portions 425. If it is within this range, the grinding performance can be ensured, and the small hills 425 and 425 are used as the main discharge path 431 and the auxiliary discharge path 43. The grinding fluid or grinding debris can be easily flushed and discharged, such as less than 1/3. If the magnification is smaller, the grinding performance will be increased, but the grinding chips and the like are easily clogged. If it is larger than 2 magnification, the grinding efficiency will be reduced. The grinding wheel 420 of this embodiment is configured as described above. Next, a manufacturing method of the grinding wheel 42 will be described with reference to FIG. 27. In FIG. 27 (A), one surface 422a of a disc-shaped support metal 422 made of, for example, SUS304 and the like is partially removed into a slightly conical shape by etching or cutting, and the same figure (B ), The recessed part 426A ... -------- aST ---------- (Please read the precautions on the back before filling this page) This paper size Lai towel_ 家 鲜(CNS) A4 Secret ^^^ 97 46 311684 474855 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 -------------- V. Description of the invention (47) Form a ring at predetermined intervals 'And corresponding to the first to third millstone grain layers 424A, B, and C, three layers are formed at appropriate intervals in the diameter direction. Here, instead of the last name engraving, electrical discharge machining or die molding may be used to form a recessed portion 426A on the-surface 422a. Next, in FIG. 27 (0), a region corresponding to the hillock formation around each recessed portion 426A is left on one side 422a and a resin mask is formed, and Ni or Ni-based alloy plating is used on the recessed portion 426A and its surroundings. Precipitate the plated metal to swell, and then form a plurality of small hills 425 as shown in Figure 27 at predetermined intervals. At this time, the electric money metal is evenly formed on the recessed portion 426A and its surroundings. The thickness is precipitated, so a recess 426 will be formed on the upper surface 425a of the small hill portion 425. Here, in order to form the small hill portion 425 into a truncated cone shape, the side surface 434a of the covering portion 434 can be removed from one side of the support metal 422 422 & protrudes to the outside so as to protrude to the upper side, and it is arranged obliquely in the shape of a truncated cone to control the deposition area of the electroplated metal. In addition, in order to form the small hill portion 425 into a substantially cylindrical shape, the mask portion 434 The side surface 43 乜 is formed into an upright cylindrical shape. Next, the superabrasive grain 14 is dropped into the recessed portion 426 on the upper surface 42 5a of each hillock portion 425, for example, while vibrating. At this time, the opening diameter D1 of the recessed portion 426 is set. The average grain size is 14 For the sake of smallness, other corners or sharp portions located at the corners or sharp portions of the superabrasive stone particles 14 will fall and slightly oppose each other, and they will protrude from the upper front side. In FIG. 27 (E), other fields except the upper surface 42 5a of each hillock portion 425 will be discharged from the main and auxiliary roads 々η, 4] I 1! | — — — — — — 1! * 1! ---- 11 (Please read the precautions on the back before filling this page) This paper size is applicable to the Chinese National Standard (CNS) A4 size 297 cages 47 311684 4/4855 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the Invention (48) The resin is masked by the masking portion 434 and the electricity is advanced early. As a result, on the upper surface 425a of each hillock portion 425a, the super waste can be fixed and adhered, such as (millstone 14 with) sii or a metal-based alloy such as Ni-based alloy. The protrusion amount of the superabrasive grains 14 of the phase 427 will be, for example, about 2/3 to 々π of the average grain size. In FIG. 24, the first to third millstone grain layers 424A, B, and C will face The imaginary line 'extending in a direction that is slightly flat with the rotation direction n F of the polishing pad 4 is shifted in the direction 1 which is slightly perpendicular to this direction, and the imaginary line a, b, C, d. Therefore, 'the grinding length (area = work) of the area between the third to third grinding stone grain layers 424A, B, and C (the area where the imaginary lines a, b, and c intersect each other) is the same as the fourth embodiment. The amount of the sum is slightly uniform, so it is possible to perform grinding operations with a higher flatness. The grinding wheel 420 of this embodiment is provided with the above-mentioned structure. If the grinding of the polishing pad 4 is re-grinded, the use of each small grinding can be suppressed. Grinding debris of the polishing pad 4 generated by the grinding of the superabrasive stone particles 14 of the stone layer portion 428 or the circuit metal or silicon of the silicon wafer remaining on the polishing pad 4 The grinding chips and the like adhere to and adhere to the superabrasive grains 4... And reduce the viscosity of the grinding fluid containing the grinding chips, and then pass through the auxiliary discharge path 4 3 0 and the main discharge path 4 3 i to promote the discharge to the outside. And 'the cooling of the superabrasive grains 14 by the grinding fluid can prevent the damage of the superabrasive grains 14 and can suppress the accumulation of various grinding debris on the superabrasive grains. Between 14 and 14. Next, the twelfth embodiment of the present invention will be described with reference to FIGS. 28 and 8. The same reference numerals are used for the same or the same members as the eleventh embodiment described above, and the description is omitted. The grinding wheel 440 shown in FIG. 28 The grinding wheel with the 11th embodiment --------- I ---- install ---------- order * ^ ------- * green (please read first Note on the back, please fill in this page again) This paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 48 311684 474855 B7 V. Description of the invention (49) Those with the same basic structure of CO, different small millstones Layer section 428 · .. Yiwen preliminarily "arrange a plurality of spirals, and it is better to have at least the millstone M into one continuous spiral or more than three layers (28th Η +, Η spaced in the diameter direction) The winder (three layers are formed in Fig. 28). In this embodiment, the grindstone grain layer 442 is continuous in a spiral shape from the outer side toward the first formation of the outermost circumference when viewed from the three layers inward. The younger brother Tian Tian 1 has a grindstone grain layer 442 eight, a second grindstone grain layer 442B, and takes the inner third grindstone grain layer 442e. A spiral main discharge path 431 is formed, and There are a number of sub-rows that are connected to the main discharge path 431 in the small millstones of each millstone grain layer. Here, the small hill portion 425 can also use other recesses 426 to replace those used in the above embodiment. . For example, as shown in FIG. 29 (a), the recessed portion 426a may not be formed on one surface 422a of the support metal 422, and the hillock portion & electricity may be formed into a slightly truncated cone shape or a substantially cylindrical shape, and be held on the upper surface of 425a. A conical recessed portion 445 is formed in the central portion. Alternatively, after the hillock portion 425 is formed, a cutting process such as a cross-section V-shaped recess 4 4 6 may be formed in the diameter direction of the upper surface 425a by cutting or the like. The hillock portion 425 and the metal bonding phase 427 may be formed by metal bonding. Instead of forming methods such as electroplating gold plating. Alternatively, the hillock portion 425 can be molded integrally with the support metal 422. The electrowinning wheel (electrowinning wheel) of the fourteenth embodiment includes the electrowinning wheel 2 described in the first embodiment, for example, the first embodiment. The same structure, especially the small millstone grain layer on the protrusions 21 of the support metal 19 The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 311684 ^ / 4855 Ministry of Economy Printed by A7 of the Intellectual Property Bureau's Consumer Cooperative. V. Invention Description (50) 24. There are i or a plurality of short and strong superabrasive grains which are fixed and bonded by metal bonding phase. Here, the short and strong super-grindstone grains refer to the largest two-axis images of the grindstone grains after the two-dimensional projection shown in Figures (A), (B), and (C). The ratio of the X-axis to the y-axis of the dimension (eccentricity) y / x is from 丨 to 丨 2, which is the meaning of super-grindstone particles that are close to a regular polygon or a spherical shape such as a regular hexahedron. Contrary to this, the ratio of the y-axis to the x-axis is referred to as an irregular superabrasive stone, which refers to the superabrasive stone shown in Fig. 30 (D) or the superabrasive stone shown in Fig. 34 of the prior art. The meaning of stone grain 14. Here, in Fig. 30 (A) and (b), all the grindstone particles 518 are y / X = l_0 ', and the superabrasive stone particles 14 shown in the same figure (D) are y / x = 2.〇. The superabrasive grains 518 are formed on the entire surface of the abrasive grain layer 22 of the electrodepositive grinding wheel 20 by, for example, i to 500, preferably u to 500, the superabrasive grains 518 in a metal plating phase. 25 fixed glued and constituted. In addition, as shown in FIG. 31, a plurality of super-grindstone particles 518 fixed to each small-grindstone particle layer portion 24 are arranged in a row of at least a plurality of super-grindstone particles 5 1 on the outer peripheral side. 8 A is only arranged in short and strong superabrasive grains 5 丨 8 and fixedly bonded. Moreover, the superabrasive grain row 518A also includes superabrasive grains 18 fixedly adhered to the side surface 21C of the protrusion 21, and these are also arranged by short and strong superabrasive grains. Therefore, the inner superabrasive grains surrounded by the annular superabrasive grain row 518A may have irregular superabrasive grains, but for the sake of convenience of manufacture, short and strong superabrasive grains 518 may also be used. Make up all superabrasive grains. In the case of using such an electric grinding wheel for grinding, in the case of an electric grinding wheel ----------------- I ----- order --------- (Please read the notes on the back before filling out this page) The private paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 50 311684 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Consumption Cooperative (51 20 of each small grindstone grain layer portion 24 is first rough grinding of the polishing pad 4 with short and strong superabrasive grains 518 in the corner r portion, and then the supergrind that continues to the top of the corner R portion The grains are especially short and strong superabrasive grains 518A in the outer periphery for finishing grinding. In particular, the outer corners or ridges of the superabrasive grains in the outer periphery 5 1 8 A are not excessive. It is sharp and can be ground with a moderate cutting effect, and even if a scratch is generated, it can be suppressed to a small scratch. In the present embodiment described above, the small grind stone layer portion 24 is formed by using short and strong superabrasive stone particles 518. Therefore, in the plane view, the outer portions of the super-grindstone grains 518A in the outer periphery can be inserted into the short-facing super-grindstone grains 518 ... It is not too sharp and has a good cutting effect, and it does not cause sharp partial smashing or missing due to the use of irregular superabrasive grains. Even if the material being cut produces scratches, it can still be stopped by small scratches. During grinding, sharp parts such as corners and ridges do not break and remain on the polishing pad 4 and scratch the surface of the material to be cut, such as wafers, or cause scratches, etc., so that good mirror grinding can be performed. Each of the electro-abrasive grinding wheels of the above-mentioned embodiments can be used for mounting on the wafer holding disc 5 and rotating one side of the polishing pad at a position eccentric to the polishing pad 4 instead of the re-sharpener 8. In the above-mentioned embodiments, The small grindstone layer layer portion 24 ... and the small mound portion 21 .... are formed into a slightly cylindrical or cuboid shape, but the shape of the small grindstone layer layer portion or protrusion is not limited by this. The height。 of the layer bottom 2 should be equal to or larger than the average particle size of the superabrasive grains 14. For example, it can also be a convex surface in the shape of a half or a triangular cone. The scale of this scale applies to the Chinese National Standard (CNS) A4 specification X Male cage 311684------------. I III --- I -1 ^ 11 — — — III {Please read the precautions on the back before filling in this page} 51 474855 .A7 -----— B7____ 5. Description of the invention (52) In addition, the electric wheel 20 '30 which constitutes the grinding wheel in each embodiment of the present invention , 120, grinding wheels 220 '240 ... etc., of course, besides the re-grinding device used in CMP equipment, of course, it can also be used in other grinding and grinding equipment. -(Please read the precautions on the back before filling out this page) Order --------- Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics This paper is sized for the Chinese National Standard (CNS) A4 (210 X 297 mm) 52 311684

Claims (1)

經濟部智慧財產局員Η消費合作社印制衣 C8 — D8 六、申請專利範圍 1· 一種具有金屬結合相的磨輪，係具有在支座金屬上形成 有複數個突部，而在此等突部以互相隔著間隔之方式設 置有複數個將超磨石粒以金屬結合相固定黏接的小磨 石粒層部而成的磨石粒層。 2.如申請專利範圍f !項之磨輪，其中前述小磨石粒層部 各自裝附有複數個超磨石粒。 3·如申請專利範圍第1項之磨輪，其中前述小磨石粒層部 係將從相鄰接的小磨石粒層部間之磨石粒層底部的高 度設為超磨石粒之平均粒徑以上。 4.如申請專利範圍第1項之磨輪，其中前述突部係形成具 有角落R部及頂部的略圓柱狀，而此等角落r部及頂 部配設有超磨石粒。 5·如申請專利範圍第1項之磨輪，其中設置在前述各小磨 石粒層部而成的超磨石粒係設為u至5〇〇個，而平面 觀察下相對於前述磨石粒層總面積的超磨石粒所佔比 例係設定為20%至80%之範圍。 6.如申請專利範圍第1項之磨輪’其中前述小磨石粒層部 係排列在除了磨石粒層表面之周邊領域以外的中央領 域。 7·如申請專利範圍第1項之磨輪，其中前述小磨石粒層部 係排列在除了磨石粒層表面之中央領域以外的周邊領 域。 8.如申請專利範圍第1項之磨輪，其中磨石粒層具備中央 領域及其外周側之周邊領域，在前述中央領域中係以互 -------------裝 — —·------訂----------線 (請先閱讀背面之注意事項再填寫本頁) 本，·.氏張尺度適用中_家標準（CNS)A4規格⑽χ视公爱） 53 311384 經濟部智慧財產局員工消費合作社印製 • π -r t’j孕巳固 相隔著間隔之方式形成有前 石粒層部上m 』厲石粒層部，而該小磨 各自以金屬結合相裝附古 粒，在前述周邊領域則係 磨石 石粒，且周邊相固定黏接有超磨 W領域之超磨石粒之集中度較前述中央領域 石冷同 0 9.如申請專利範圍第i項之磨 尨 具中刖述小磨石粒層部 '、 央开々成用以排出磨削液的開口。 、、申明專利範圍第1項之磨輪’其中排出路係形成在前 述小磨石粒層部以外之領域。 U_如申請專利範圍第9項之磨輪’其中前述小磨石粒層部 ^ 之直役為在00.5至3. Omm之範圍。 12·如申凊專利範圍第9項之磨輪，其中前述突部之直徑為 前述開口直徑之2至1 〇倍。 1 3 _如•申請專利範圍第i項之磨輪，其中相對於前述支座金 屬之底面的突部高度為在0.1至5.0mm之範圍。 14. 如申請專利範圍第1項之磨輪，其中相鄰接的前述突部 間之距離為在突部之平均直徑的1/3至2倍之範圍。 15. 如申喷專利範圍第1項之磨輪，其中前述磨石粒層係形 成複數層之環狀或螺旋狀。 16. 如申請專利範圍第9項之磨輪，其中排出路係形成在於 直徑方向隔著間隔所配設的前述磨石粒層之間。 1 7 _如申請專利範圍第1項之磨輪，前述小磨石粒層部係在 金屬結合相之厚度方向僅固定黏接一層超磨石粒。 18.如申請專利範圍第1項之磨輪，其中前述小磨石粒層 — — — — 1 — — — — — — — * I S I I 訂-- - ---— II (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4_i^ (210 X 297公釐） 54 311384Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed clothing C8 — D8 of Consumer Cooperatives 6. Application scope of patent 1. A grinding wheel with a metal bonding phase, which has a plurality of protrusions formed on the support metal. A plurality of small grindstone grain layers formed by fixedly adhering the superabrasive stone grains with a metal bonding phase are arranged at intervals from each other. 2. The grinding wheel according to the scope of patent application f !, wherein each of the aforementioned small grindstone grain layers is provided with a plurality of superabrasive grits. 3. The grinding wheel according to item 1 in the scope of the patent application, wherein the small grindstone grain layer part is set from the height of the bottom of the grindstone grain layer between the adjacent small grindstone grain layer parts to the average of the super grindstone grains. Particle size or more. 4. The grinding wheel according to item 1 of the patent application range, wherein the aforementioned protrusions are formed into a substantially cylindrical shape with corners R and tops, and these corners R and tops are provided with superabrasive grains. 5. The grinding wheel according to item 1 of the scope of patent application, wherein the super-grindstone particles formed at the aforementioned small grindstone particle layer portions are set to u to 500, and compared to the above-mentioned grindstone particles in plan view The proportion of superabrasive grains in the total area of the layer is set in the range of 20% to 80%. 6. The grinding wheel of item 1 of the scope of the patent application, wherein the small grindstone grain layer portion is arranged in a central area other than the peripheral area of the surface of the grindstone grain layer. 7. The grinding wheel according to item 1 of the patent application range, wherein the small grindstone grain layer portion is arranged in a peripheral area other than the central area of the surface of the grindstone grain layer. 8. As for the grinding wheel in the scope of the first patent application, the grain layer of the grindstone has a central area and a peripheral area on the outer peripheral side thereof. — — · ------ Order ---------- line (please read the precautions on the back before filling this page), .. The Zhang scale is applicable in China _ home standard (CNS) A4 Specifications ⑽χ depending on public love) 53 311384 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs • π -r t'j Pregnancy 巳 Solid phase is formed with an interval m m 前 a stone layer layer section, and The small mills are each attached to the ancient grains in a metal bond phase, and in the aforementioned peripheral areas are millstone grains. The concentration of the superabrasive grains in the superabrasive W domain fixedly adhered to the peripheral phase is lower than that in the central domain. 0 9. As described in the grinding tool of the scope of application for the patent, the small grinding stone grain layer portion ′ and the central opening are used to discharge the grinding fluid. The grinding wheel of claim 1, wherein the discharge path is formed in a field other than the small grindstone layer. U_ 如 Wave of patent application No. 9 of the grinding wheel 'wherein the direct service of the aforementioned small grindstone layer ^ is in the range of 00.5 to 3. Omm. 12. The grinding wheel according to item 9 of the patent application, wherein the diameter of the protrusion is 2 to 10 times the diameter of the opening. 1 3 _If • The grinding wheel in the scope of application for item i, wherein the height of the protrusion relative to the bottom surface of the aforementioned support metal is in the range of 0.1 to 5.0 mm. 14. The grinding wheel according to item 1 of the scope of patent application, wherein the distance between the adjacent protrusions is in the range of 1/3 to 2 times the average diameter of the protrusions. 15. The grinding wheel according to item 1 of the patent application scope, in which the above-mentioned grindstone grain layer is formed into a plurality of layers in a ring shape or a spiral shape. 16. The grinding wheel according to item 9 of the scope of patent application, wherein the discharge path is formed between the aforementioned grinding stone grain layers arranged at intervals in the radial direction. 1 7 _ As for the grinding wheel in the first scope of the patent application, the aforementioned small grindstone grain layer portion is only fixed and adhered to one layer of supergrindstone grains in the thickness direction of the metal bonding phase. 18. For the grinding wheel in the scope of patent application item 1, in which the aforementioned small grindstone layer — — — — 1 — — — — — — — ISII Order-----— II (Please read the precautions on the back first (Fill in this page again.) The paper size applies to Chinese National Standard (CNS) A4_i ^ (210 X 297 mm) 54 311384 ^、申請專利範圍 請 先 閱 讀 背 © 之 注 意 事 項 再 填 * I $ 頁 I 相對於通過支座金屬中心的直徑方向之中心線往 向傾斜的第i小磨石粒層部；以及往與 石粒層部或反方向傾斜的第2小磨石粒層部。第 請專利範圍第18項之磨輪’纟中前述及第2 石粒層部各自包含縱寬比不相同者。 A申°月專利乾圍第18項之磨輪，其中前逑小磨石粒層 P係以互相分離之方式形成略菱形並排列成放射狀。 .如申請專利範圍第18項之磨輪，丨中前述第1及第2 小磨石粒層部係以交互方式排列在支座金屬之圓周方 向而成為環狀。 22.如申請專利範圍第1項之磨輪，其中前述小磨石粒層部 具有.相對於通過支座金屬中心的直徑方向之中心線往 方向傾斜的部分；以及往反方向傾斜的部分。 23·^申請專利範圍第22項之磨輪，其中前述小磨石粒層 部具有成為曲線狀，且以隔著直徑方向之中心線在兩側 相對向且面對或沿著中心線挪移之方式所配設的第3 小磨石粒層部及第4小磨石粒層部。 經濟部智慧財產局員工消費合作社印製 24_如申請專利範圍第丨項之磨輪，其中前述小磨石粒層部 係配設在支座金屬之全面。 25.如申請專利範圍第〗項之磨輪，其中前述小磨石粒層部 係將卓之超磨石粒以金屬結合相固定黏接而成。 2 6.如申請專利範圍第2 5項之磨輪，其中前述小磨石粒層 部係在支座金屬之突部上面所形成的凹部内固定黏接 有超磨石粒。 本紙張尺度適用中國國家標準（CNS〉A4規格（210 X 297公釐） 55 311384 474855 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8 ~、申請專利範圍 27_如申凊專利範圍第25項之金屬黏結單層磨輪，其中前 述犬部之外徑為在超磨石粒之平均粒徑的丨3至3 範圍。 口 认如申請專利範圍第25項之磨輪，其中相對於前述支座 金屬之底面的突部高度為在〇 〇5至3 〇_之範圍。 29·如申請專利範圍第25項之磨輪，其中相鄰接的前述突 ::之距離為在突部之平均外徑㈣…倍之範圍。 如申請專利範圍第丨項之磨輪， « ^ 傲彻/、中刖述小磨石粒層部 係將1或複數個短而結實的超磨 磨石粒以金屬結合相固 疋黏接而成。 Η.如申請專利範圍第3〇項之磨石，装 Α Τ則述小磨石叙屉 部固疋黏接有複數個超磨石粒，而敌 係短而結實的超磨石粒。 、外周側之超磨石粒 32. 如申請專利範圍第3〇項之磨石，其、 部所設置的超磨石粒係設為i至5〇』述J磨石粒層 相對於前述磨石粒總面積的超磨石而平面觀察下 為2〇/0至80〇/〇之範圍。 斤占比例係設定 33. 如申請專利範圍第！項之磨輪，其 再磨削器。 別述磨輪係CMP 本紙張尺度適用_國國家標準（CNS)A4規格（210 X 297公釐） 裝---·-----訂---------線 (請先閱讀背面之注意事項再填寫本頁) 56 311384^ Please read the notice of the back of the scope of patent application, and then fill in * I $ Page I The i-th millstone grain layer section inclined with respect to the center line passing through the diameter direction of the metal center of the support; and The grain layer portion or the second small millstone grain layer portion inclined in the opposite direction. Each of the aforesaid and second stone grain layer portions in the grinding wheel 'of item 18 of the patent scope includes a different aspect ratio. A. Applicable to the grinding wheel of the dry patent No. 18 in the patent, in which the front small millstone grain layer P is formed into a slightly rhombic shape and arranged in a radial shape in a manner of being separated from each other. For the grinding wheel in the 18th scope of the patent application, the aforementioned first and second small grindstone grain layers are arranged in an interactive manner in the circumferential direction of the support metal to form a ring. 22. The grinding wheel according to item 1 of the patent application range, wherein the small grindstone grain layer portion has a portion inclined in a direction with respect to a center line passing in a diameter direction of the metal center of the support, and a portion inclined in a reverse direction. 23. The grinding wheel of the 22nd scope of the application for a patent, wherein the small grindstone layer portion has a curved shape, and is moved in a direction opposite to each other and facing or along the centerline across the centerline of the diameter direction The 3rd small grindstone grain layer part and the 4th small grindstone grain layer part arrange | positioned. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 24_ For the grinding wheel in the scope of patent application, the aforementioned small grindstone layer is arranged on the support metal. 25. The grinding wheel according to the scope of the patent application, wherein the small grindstone grain layer part is fixedly adhered to the super abrasive grains of Zhuo with a metal bonding phase. 2 6. The grinding wheel according to item 25 of the scope of the patent application, wherein the small grindstone grain layer part is fixed and bonded with superabrasive grits in the recess formed on the protrusion of the support metal. This paper size applies Chinese national standard (CNS> A4 specification (210 X 297 mm) 55 311384 474855 Printed by A8 B8 C8 D8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, patent application scope 27_If you apply for patent scope 25 Item of the metal bonded single-layer grinding wheel, wherein the outer diameter of the aforementioned dog part is in the range of 3 to 3 of the average particle size of the superabrasive stone. The grinding wheel recognized as the item 25 in the patent application scope, wherein it is relative to the aforementioned support The height of the protrusions on the bottom surface of the metal is in the range of 0.05 to 3.0. 29. For the grinding wheel in the scope of the patent application No. 25, wherein the distance between the adjacent protrusions :: is the average outer diameter of the protrusions. ㈣ ... multiply the range. For the grinding wheel in the scope of patent application No. 丨, «^ 彻 / / described in the small grindstone layer is a combination of 1 or a number of short and strong super-ground grindstone particles with metal bonding phase疋. If the grinding stone in the scope of patent application No. 30 is applied, the installation of AT is described as the small grinding stone and the drawer is fixedly bonded with a plurality of super grinding stones, and the enemy system is short and strong. Superabrasive granules. 、 Superabrasive granules on the outer side 32. Rushen Please refer to the grindstone of item 30 of the patent scope, and the super grindstone particles provided by the department are set to i to 50. The plane of the grindstone grain layer with respect to the supergrind of the total area of the grindstone grains is observed in a plane. The following is the range of 20/0 to 80/0. The proportion of the weight is set to 33. For example, the grinding wheel of the scope of patent application, the re-grinding device. Not to mention the grinding wheel system CMP This paper is applicable to national standards (CNS) A4 size (210 X 297 mm) Packing ---------- Order --------- Line (Please read the precautions on the back before filling this page) 56 311384