TW466524B - Contact-type image sensor unit - Google Patents
Contact-type image sensor unit Download PDFInfo
- Publication number
- TW466524B TW466524B TW89112175A TW89112175A TW466524B TW 466524 B TW466524 B TW 466524B TW 89112175 A TW89112175 A TW 89112175A TW 89112175 A TW89112175 A TW 89112175A TW 466524 B TW466524 B TW 466524B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting element
- frame
- discharge light
- discharge
- Prior art date
Links
Landscapes
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Image Input (AREA)
Abstract
Description
4 6 65 2 4 五、發明說明（l) 【發明之背景】 【發明之領域】 本發明係關於一種接觸式影像感測單元，特別是關於 一種接觸式影像感測單元上之框體之構造者。 【習知之技術】 以往即公知有將記載於原稿上之圖形等之内容作讀取 用之接觸式感測 is(CIS:Contact Image Sensor)。 第7圖及第8圖中係揭示習知之c I S單元1 0 0之一例。第 7圖為開示於特開平4-360458號（特許第2953595號）中之 CIS單元1〇〇之俯視圖’第8圖為第7圖所示之CIS單元100之 剖面圖。 如第7圖及第8圖所示，CIS單元1〇〇係具備有作為光源 之發光二極體（LED:Luminescent eiectric diode)陣列 101 與框體102 與感測 IC(Integrated circuit)103 與棒狀 透鏡陣列104與玻璃板105。 利用LED陣列101對夾持於壓板玻璃107與玻璃板1〇5間 之原稿1 0 6照射以光線，而其反射光係通過棒狀透鏡陣列 104傳達至感測IC103。之後’藉由前述感測IC103將反射 光變換成電子訊號，如此便可讀取原稿106之内容。 惟，如上述般於利用LED陣列1 0 1作為接觸式影像感測 單元之光源使用時乃會產生下述之問題。 LED晶片1 09係以裝配於基板上之狀態被組入至框體 102内。因此，於裝配LED晶片109時將會產生前述LED晶片 109之位置偏差。具體上係有LED晶片109偏置至第8圖之點4 6 65 2 4 V. Description of the invention (l) [Background of the invention] [Field of the invention] The present invention relates to a contact image sensing unit, and more particularly to the structure of a frame on the contact image sensing unit. By. [Known Technology] Conventionally, contact sensing is (CIS: Contact Image Sensor) is used to read the content of graphics and the like recorded on the original. 7 and 8 show examples of the conventional c I S unit 100. Fig. 7 is a top view of the CIS unit 100 shown in JP-A 4-360458 (Patent No. 2953595). Fig. 8 is a cross-sectional view of the CIS unit 100 shown in Fig. 7. As shown in FIG. 7 and FIG. 8, the CIS unit 100 is provided with a light emitting diode (LED: Luminescent eiectric diode) array 101, a frame 102, a sensing IC (Integrated circuit) 103, and a rod as light sources.状 lenticular array 104 and glass plate 105. The original array 106 held between the platen glass 107 and the glass plate 105 is irradiated with light by the LED array 101, and the reflected light is transmitted to the sensing IC 103 through the rod lens array 104. After that, the reflected light is converted into an electronic signal by the aforementioned sensing IC 103, so that the content of the original 106 can be read. However, when the LED array 101 is used as a light source of a contact image sensing unit as described above, the following problems arise. The LED wafer 109 is assembled into the housing 102 in a state of being mounted on a substrate. Therefore, when the LED chip 109 is assembled, the aforementioned positional deviation of the LED chip 109 will occur. Specifically, the LED chip 109 is biased to the point of FIG. 8
2075-3291-PF.ptd 第4頁 -6 6 5 2 4 五、發明說明（2) 線所示之位置之情形發生。 在此情形下’ L E D晶片1 0 9之發光中心I 〇 8係偏移至發 光中心1 0 8 a。然而’ L E D晶片1 0 9之光輸出係具有強烈的指 向性，朝向前方之光量與朝向斜前方之光量係有甚大之差 異。 又，在排列LED晶片1 09而製作線性光源時，因裝配節 距之限制，於L E D晶片1 0 9間將產生間隙，相對於前述^ e d 晶片1 0 9之排列方向’因上述裝配間隙之影響將發生光量 不均之現象。 又’LED晶片109之裝配精度（LED晶片1〇9之發光中心 108排列於一條線上時之精度）係會參差不齊，而因上述光 量之指向性之影響乃會使前述光量不均現象更為嚴重。 又’因LED晶片109本身之亮度之不均情形已十分嚴 重’故於排列L E D晶片1 0 9時其亮度之不均將造成排列線上 之亮度之參差現象。因此於照明全長上有難以得到平均之 光量之問題。 又’關於光量之問題’於作為影像感測器之光源時， 其所須之光量係被影像感測器之一條線之讀取時間所影響 而變化。此情形係意味著感測器之訊號輸出丨相對於讀取 速度（一條線之讀取時間T)與光源之亮度b係呈I 〇〇Τχ B之 關係。因此LED陣列光源者，於其讀取時間τ為較大之場合 (傳真機等之原稿讀取為〜1 〇ms/線左右）則可得到使用上無 問題之感測輸出。 惟，於讀取時間為〇· 5ms/線以下之高速讀取之場合則2075-3291-PF.ptd Page 4 -6 6 5 2 4 V. Description of the invention (2) The position shown by the line occurs. In this case, the light emission center I 08 of the 'L E D wafer 1 0 9 is shifted to the light emission center 10 8 a. However, the light output of the LED chip 109 has a strong directivity, and there is a great difference between the amount of light directed forward and the amount of light directed diagonally forward. In addition, when the linear light source is manufactured by arranging the LED chips 1 09, a gap will be generated between the LED chips 10 and 9 due to the limitation of the assembly pitch. The effect will be uneven light. Also, the assembly accuracy of the LED chip 109 (the accuracy when the light emitting centers 108 of the LED chip 10 are arranged on a line) will be uneven, and the aforementioned light amount unevenness will be more affected by the directivity of the light amount For serious. Also, "the unevenness of the brightness of the LED chip 109 itself is very serious", so the unevenness of the brightness when the LED chip 109 is arranged will cause the brightness unevenness on the arrangement line. Therefore, it is difficult to obtain an average amount of light over the entire length of the illumination. Also, "the problem about the amount of light", when used as a light source of an image sensor, the required amount of light is changed by the reading time of one line of the image sensor. This situation means that the signal output of the sensor relative to the reading speed (reading time T of a line) and the brightness b of the light source have a relationship of 〇〇Τχ B. Therefore, if the LED array light source has a large reading time τ (the original reading of a facsimile machine is ~ 10ms / line), it can obtain a sensing output without problems in use. However, in the case of high-speed reading with a reading time of 0.5 ms / line or less,
ο 65 2 4 五、發明說明（3) 無法得到充份的感測輸出β 【發明之概述】 本發明係為解決上述課題所完成者。本發明之目的在 於抑制CIS單元之讀取線上之照度之參差不齊，同時於高 速讀取之場合為可得到充份之感測輸出者。 ¥潑 0月有關之接觸式影像感測單元（CIS)係具備有框 體與組如於該框體内之放電發光元件與光電變換元件。光 電變換元件係被組入於框體内，將放電發光元件照射於原 稿上之光的反射光變換成電子訊號。又，於框體上設有支 持部’該支持部係支持放電發光元件之侧面並將放電發光 το件定位者。在此，前述支持部可為直接支持放電發光元 件之側面者’但亦可為間接地支持其者。 於本發明中，係可使用由本案發明人獨自開發出之接 觸式影像感測器用之放電發光元件。該等放電發光元件之 場合，不似LED之場合一般須要裝配於基板上，其發光之 中心位置係由其外形所決定。因此，藉由設置支持上述之 放電發光元件之側面的支持部即可將放電發光元件確實地 定位於既定之位置，可防止放電發光元件之發光中心之偏 移。又，對於高速讀取方面亦可得到充份的光電 (感測器）輸出。 上述支持部可為具有抵接於前述放電發光元件之側面 的抵接面。 如此，藉由直接支持放電發光元件之側面即可將放電 發光元件確實地定位於一定之位置。又’藉由以抿接面支 2075-3291-PF.ptd 第6頁ο 65 2 4 V. Description of the invention (3) Unable to obtain sufficient sensing output β [Summary of the invention] The present invention has been made to solve the above problems. The object of the present invention is to suppress the unevenness of the illumination on the reading line of the CIS unit, and at the same time, to obtain a sufficient sensing output in the case of high-speed reading. The contact-type image sensing unit (CIS) related to the month of April is provided with a frame and a discharge light-emitting element and a photoelectric conversion element such as the frame. The photoelectric conversion element is incorporated in a frame, and converts the reflected light of the light emitted by the discharge light-emitting element onto the original into an electronic signal. Further, a support portion is provided on the frame. The support portion supports a side of the discharge light emitting element and positions the discharge light emitting το member. Here, the aforementioned support section may be a side member 'that directly supports the discharge light emitting element, but may also support it indirectly. In the present invention, a discharge light-emitting element for a contact image sensor developed by the inventors of the present invention can be used. In the case of these discharge light-emitting elements, it is generally required to be mounted on a substrate, unlike the LED, and the center position of the light emission is determined by its shape. Therefore, by providing a supporting portion that supports the above-mentioned side surface of the discharge light-emitting element, the discharge light-emitting element can be reliably positioned at a predetermined position, and the light-emitting center of the discharge light-emitting element can be prevented from shifting. In addition, a sufficient photoelectric (sensor) output can be obtained for high-speed reading. The supporting portion may have a contact surface abutting a side surface of the discharge light emitting element. In this way, by directly supporting the side of the discharge light emitting element, the discharge light emitting element can be reliably positioned at a certain position. Again ’by supporting the surface with a 20 2075-3291-PF.ptd page 6
五、發明說明（4) 持放電發光元件乃可安定地 μ ·+•喊把找 地支持放電發光元件。 上述放電發光元件係具： 第1電極及第2電極間施加電严1極第2電極’藉由於 又，#…：/ 係可使放電發光元件發光。 使第1電極位於框體之始 - 時，係於盘肤筮1 φ Κ 4· 電發光凡件之安裝面側 町你於興此第〗電極相對向之部份μ夕j、+,—壯 置凹部。 丨™上之則途女裝面上設 因對第i電極輸入高電壓之驅動訊妒， 於框體（特別是具有導電性且設為 二 "化基板 電爆mi 1由此電容將施加於第1電極上之高 (ΛΛ播時’框體之電特性將呈現不安定之狀況 生干擾）。又，使第1電極之電位變化成某一值時，則 會產生須對前述電容作充電之狀況，將造成電力之浪fD 為此，藉由於第1電極之正下方之框體上設置凹部即 可減低上述電容，其除可減低驅動第丨電極用之電力外亦 可防止放電發光元件之發光效率之減低。 於上述框體上設置將放電發光元件所射出之光線導弓 至原稿上之導光路時則甚佳。 藉此’可將放電發光元件所輪出之光線確實地導引至 原稿上之讀取部份上。亦即，可抑制放電發光元件之光5 射到原稿之讀取部份及其附近以外之部份上。其結果，可 抑制不必要的反射光入射至光電變換元件，可防止讀取線 以外之無用之光資訊進入光電變換元件中，可得到讀取品 質為較優（有明暗對比，且中間色調（灰色圖像）之讀取亦 不會被讀取線以外之原稿狀況所影響）之c I s單元。V. Description of the invention (4) The light-emitting element holding the discharge can be stabilized μ · + • Find the ground to support the light-emitting element. The above-mentioned discharge light-emitting device is provided with a first electrode and a second electrode 'applied between the first electrode and the second electrode, and #…: / can make the discharge light-emitting device emit light. When the first electrode is located at the beginning of the frame, it is attached to the surface of the pan 筮 1 φ Κ 4 · The mounting surface side of the electroluminescence element. You are here to make the opposite part of the first electrode μ, j, +, — Build the recess.丨 ™ on the women's surface is set due to the driving voltage input to the i-th electrode on the frame (especially conductive and set to two " chemical substrate electric explosion mi 1), so the capacitor will be applied The height on the first electrode (the electrical characteristics of the frame will be disturbed when ΛΛ is broadcast). When the potential of the first electrode is changed to a certain value, the aforementioned capacitance must be adjusted. The state of charging will cause a wave of power fD. For this reason, the above capacitance can be reduced by providing a recess on the frame directly below the first electrode, which can reduce the power for driving the first electrode and prevent light emission Reduction of the luminous efficiency of the element. It is very good to set the above-mentioned frame to guide the light emitted by the discharge light-emitting element to the light-guide path on the original. By this, the light emitted by the discharge light-emitting element can be reliably guided It is guided to the reading portion on the original. That is, it is possible to suppress the light 5 of the discharge light-emitting element from being incident on the reading portion of the original and the vicinity thereof. As a result, it is possible to suppress the incidence of unnecessary reflected light To photoelectric conversion element, can prevent Useless light information outside the reading line enters the photoelectric conversion element, and the reading quality is better (with light and dark contrast, and the reading of the mid-tone (gray image) will not be read by the original condition outside the reading line. Affected) c I s unit.
2075-3291-PF.ptd 第7頁 4 6 652 4 五、發明說明（5) 於上述導光路徑内可設置反射光線用之反射材。 藉此，可將入射至導光路徑内之光線適當地反射可 將遠光線有效率地照射於原稿上之讀取部份上。又，作為 反射材可例舉出導光板及反射板等。在此，所謂導光板者 係指白色的PET(聚對笨二甲酸乙二醇酯）片等之白色反射 板或稱為鏡帶（mirror tape)之具有鏡面狀表面之鋁薄膜 等之帶狀化之物品，而前述導光板例如係貼著於CIS框體 上。藉由將前述導光板設置於導光路徑上可使放 件所射出之不與導光路徑平行之光被導光路徑壁面所反射 而，引至導光路徑之開口部，因導光路徑之開口部係接近 原稿照射面故出自前述開口部之光之照明範圍係被限制其 結果乃可達到提高讀取精度之目的。 上述框 放電發光元 性之材質者 如上述 體之電位固 又，框 由於該種框 换曲。又， 構成時藉由 光元件之散 亮度分布不 接著於框體 體者較佳 件接著於 可例舉出 ，藉由以 定化，可 體者以硬 體上接著 上述框體 將放電發 熱性。藉 均現象乃 上用之接 為由具有 此種框體 金屬或參 具有導電 抑制不必 度較高之 放電發光 為以金屬 光元件接 此，由放 可被抑制 著材若使 導電性 時將甚 雜有導 性之材 要的電 材質加 元件可 等之散 著於框 電發光 。又， 用熱傳 之材質 佳。在 電性物 質構成 容或雜 以構成 抑制放 熱性甚 體上則 元件之 作為將 導性較 所構成 此，具 質之樹 框體， 波等之 時則甚 電發光 佳之材 可提高 發熱所 放電發 佳之接 ，而將 有導電 脂等。 可將框 產生。 佳，藉 元件之 質加以 放電發 引起之 光元件 著材時2075-3291-PF.ptd Page 7 4 6 652 4 V. Description of the invention (5) A reflecting material for reflecting light may be provided in the above light guide path. Thereby, the light incident into the light guide path can be appropriately reflected, and the far light can be efficiently irradiated on the reading portion on the original. Examples of the reflective material include a light guide plate and a reflective plate. Here, the light guide plate refers to a white reflective plate such as a white PET (polyethylene terephthalate) sheet or a band shape such as an aluminum film having a mirror-like surface called a mirror tape. The light guide plate is attached to the CIS frame, for example. By arranging the aforementioned light guide plate on the light guide path, the light emitted by the part which is not parallel to the light guide path is reflected by the wall surface of the light guide path and is led to the opening of the light guide path. The opening is close to the illuminated surface of the original. Therefore, the illumination range of the light from the opening is limited. As a result, the reading accuracy can be improved. The material of the above-mentioned frame discharge light emitting element is the same as that of the above-mentioned body, and the frame is changed due to the kind of frame. In addition, when the structure is used, the light distribution of the light element is not adhered to the frame body, and the preferable parts are exemplified below. By fixing, the person can adhere the frame to the hardware to discharge the heat. . Based on the phenomenon of uniformity, it is used to connect the metal with such a frame or to have a high degree of electrical conductivity. It is not necessary to emit light with a high degree of discharge. It is connected with a metal light element. If the material can be suppressed, it will be very conductive. Electrical materials plus components required for conductive materials can be dispersed in the frame to emit light. Also, it is good to use heat transfer material. When the electrical material is composed or mixed to form a heat-suppressing material, the element's function will be more conductive than this structure. A qualitative tree frame, and a material with good electroluminescence at the time of waves can improve the discharge by heating. Fajia is connected, and there will be conductive grease and so on. Boxes can be generated. Good, by the quality of the component and discharge caused by the light element
4 6 65 2 4 五 '發明說明（6) 則甚佳。 將上述框體設為接地電位時則甚佳。 藉此’CIS之框體本身即具有屏蔽效果，可防止放電 發光元件之因施加高電壓所產生之輻射雜訊，與光電變換 元件為感測IC時之裝配驅動該感測IC時自數位回路所產生 之輻射雜訊輻射至外部。又，亦可遮斷來自外部之同樣的 雜訊，可使為微弱訊號之類比感測訊號之處理安定化。 【發明之實施型態】 首先’於具體說明本發明之實施型態之前，先說明本 案發明人所獨自開發出之放電發光元件1。 如第1圖所示’放電發光元件1係具備有基板2、透明 基板3、内部電極4、外部電極5、金屬母線6、絕緣層（電 介質層）7、第1螢光體8、第2螢光體9、封止層1〇與放電室 11° 基板2與透明基板3係由例如玻璃板等構成。透明基板 3係重疊於基板2上’具有朝向基板2延伸之壁部3a。該壁 部3a係介以封止層10及絕緣層7與基板2相接續。藉此，於 基板2與透明基板3間係形成放電室11 ^於此放電室11内係 封入有Xenon等之放電氣體。又，上述封止層1〇係由例如 熔融玻璃料所形成之玻璃層所構成。 内部電極4係形成於基板2上且被絕緣層7所覆蓋。絕 緣層7係由例如玻璃層所構成。於絕緣層7上形成有第1螢 光體8，而於透明基板3之表面上形成有第2螢光體9。 外部電極5係由例如ITO(Indium Tin Oxide)或Sn02等4 6 65 2 4 Five 'Invention Note (6) is very good. It is very good to set the above frame to ground potential. By this, the frame of the CIS itself has a shielding effect, which can prevent the radiation noise of the discharge light-emitting element due to the application of high voltage, and the assembly when the photoelectric conversion element is a sensing IC drives the self-digital circuit of the sensing IC The generated radiation noise is radiated to the outside. In addition, it can also block the same noise from the outside, and stabilize the processing of analog sensor signals that are weak signals. [Embodiment of the invention] First, before describing the embodiment of the present invention in detail, the discharge light-emitting element 1 developed by the inventor of the present invention will be described first. As shown in FIG. 1 'the discharge light emitting element 1 includes a substrate 2, a transparent substrate 3, an internal electrode 4, an external electrode 5, a metal bus bar 6, an insulating layer (dielectric layer) 7, a first phosphor 8, and a second The phosphor 9, the sealing layer 10, and the discharge cell 11 °. The substrate 2 and the transparent substrate 3 are made of, for example, a glass plate. The transparent substrate 3 is superimposed on the substrate 2 'and has a wall portion 3a extending toward the substrate 2. The wall portion 3a is connected to the substrate 2 via a sealing layer 10 and an insulating layer 7. Thereby, a discharge cell 11 is formed between the substrate 2 and the transparent substrate 3, and a discharge gas such as Xenon is sealed in the discharge cell 11. The sealing layer 10 is made of, for example, a glass layer formed of a molten glass frit. The internal electrode 4 is formed on the substrate 2 and is covered with an insulating layer 7. The insulating layer 7 is made of, for example, a glass layer. A first phosphor 8 is formed on the insulating layer 7, and a second phosphor 9 is formed on the surface of the transparent substrate 3. The external electrode 5 is made of, for example, ITO (Indium Tin Oxide) or Sn02.
2075-3291-PF.ptd 第9頁 4 6 65 2 4 五、發明說明（Ό 所構成’具有透光性。此外部電極5係形成於透明基板3之 外表面上而於外部電極5之周緣上形成有金屬母線6。 欲使具有上述構造之放電發光元件1發光時，可於内 部電極4與外部電極5間施加一定之電壓（例如1500〜2000V 左右）。藉此’放電氣體產生電離而放出紫外線，該紫外 線係照射於第1及第2榮光體8、9上，如第2圖所示使第1及 第2螢光體8、9發光。 如此所得之光之亮度較使用LED之習知例之場合為更 高，此事實已由本發明之發明人所證實。又，其亮度分布 亦甚平均’且放電發光元件1之壽命亦較LED之場合為更 長。又’亦可提高有效照明長之比例，可容易地縮小其長 度方向上之規格。而且因其不使用水銀等之有害物質故可 避免造成環境污染。 第1圖所示之放電發光元件1如上述般係具有各種優 點’而本案發明人為更提高該放電發光元件1之放電效 率，經過刻意的檢討係創作出第3圖所示之改良例。該等 改良例者係將外部電極1 3與内部電極4錯開配置者。藉此 可較第1圖等所示之晴形更提高其放電效率。 以下茲使用第4圖至第6圖說明有關組入有第3圖所示 之類型之放電發光元件1之CIS單元。 (實施型態1 ) 第4圖為揭示本發明之實施型態1中之CIS單元5〇之剖 面圖。 如第4圖所示，CIS單元50係具備有框體52、感測2075-3291-PF.ptd Page 9 4 6 65 2 4 V. Description of the invention (Ό is composed of 'translucent. This external electrode 5 is formed on the outer surface of the transparent substrate 3 and on the periphery of the external electrode 5' A metal bus bar 6 is formed thereon. When the discharge light-emitting element 1 having the above structure is to emit light, a certain voltage (for example, about 1500 to 2000 V) can be applied between the internal electrode 4 and the external electrode 5. This will cause the discharge gas to ionize and The ultraviolet rays are emitted, and the ultraviolet rays are irradiated on the first and second glory bodies 8 and 9 to make the first and second phosphors 8 and 9 emit light as shown in Fig. 2. The brightness of the light thus obtained is higher than that of the LEDs. The case of the conventional example is higher, and this fact has been confirmed by the inventor of the present invention. Moreover, the brightness distribution is also very even, and the life of the discharge light-emitting element 1 is longer than that of the case of LED. The ratio of effective lighting length can easily reduce the specifications in the length direction. Also, it can avoid environmental pollution because it does not use harmful substances such as mercury. The discharge light-emitting element 1 shown in Fig. 1 has various types as described above. Advantages' while the case To improve the discharge efficiency of the discharge light-emitting element 1 artificially, an improved example shown in FIG. 3 was created after deliberate review. Those improved examples are those in which the external electrodes 13 and the internal electrodes 4 are staggered. The discharge efficiency is improved compared to the clear shape shown in Fig. 1. The following describes the CIS unit incorporating the discharge light-emitting element 1 of the type shown in Fig. 3 using Figs. 4 to 6. (Implementation type) (State 1) FIG. 4 is a cross-sectional view illustrating a CIS unit 50 in Embodiment 1 of the present invention. As shown in FIG. 4, the CIS unit 50 is provided with a frame 52 and a sensor.
2075-3291-PF.ptd ^ 〇 65 2 4 五、發明說明（8) IC(光電變換元件）53、棒狀透鏡陣列54、玻璃板55與上述 放電發光元件1。 框體52例如為由鋁或鎂合金等之金屬或者為由導電性 樹脂等之具有導電性之材質所構成。藉此，可使框體52之 電位固定化，可抑制不必要之電容及雜訊等之產生。 框體52最好設為接地電位。藉此，CIS框體本身即具 有屏蔽效果，可防止放電發光元件之因施加高電壓所產生 之轄射雜訊，與光電變換元件為感測IC時之裝配驅動該感 測I C時自數位回路所產生之輻射雜訊輻射至外部。又，亦 可遮斷來自外部之同樣的雜訊’可使為微弱訊號之類比感 測訊號之處理安定化。 又’框體52為由上述之金屬等之硬度為較高之材質構 成時則甚佳’其具有安裝放電發光元件〗用之安裝面與支 持放電發光元件之侧面用之支持部51。 如上述’藉由以硬質之材質構成框體52，可抑制接著 於該框體52上之放電發光元件1產生撓曲。又，上述框體 52為以金屬等之散熱性甚佳之材質加以構成時藉由將放電 發光元件1接著於框體52上則可提高放電發光元件]之散熱 性。藉此’由放電發光元件1之發熱所引起之亮度分布不 均現象乃可被抑制。 Ί 支持部51在此場合係具有抵接於前述放電發光元件1 上之基板2與透明基板3之至少一方之側面上的抵接面。藉 由直設置該支持部51可將放電發光元件1確實地定位於一 定之位置’可防止放電發光元件1之發光中心產生偏移。2075-3291-PF.ptd ^ 〇 65 2 4 5. Description of the invention (8) IC (photoelectric conversion element) 53, rod lens array 54, glass plate 55, and the above-mentioned discharge light-emitting element 1. The frame body 52 is made of a metal such as aluminum or a magnesium alloy or a conductive material such as a conductive resin. Thereby, the potential of the frame 52 can be fixed, and unnecessary capacitance and noise can be suppressed. The frame 52 is preferably set to a ground potential. With this, the CIS frame itself has a shielding effect, which can prevent the emission noise of the discharge light-emitting element due to the application of high voltage, and the assembly when the photoelectric conversion element is a sensing IC drives the self-digital circuit of the sensing IC. The generated radiation noise is radiated to the outside. In addition, the same noise from the outside can be blocked, and the processing of the analog sensor signal which is a weak signal can be stabilized. The frame 52 is preferably made of a material having a high hardness such as the above-mentioned metal. The frame 52 has a mounting surface for mounting the discharge light-emitting element and a support portion 51 for supporting the side surface of the discharge light-emitting element. As described above, by forming the frame body 52 with a hard material, it is possible to prevent the discharge light-emitting element 1 adhering to the frame body 52 from being deflected. In addition, when the frame 52 is made of a material having a very good heat dissipation property such as metal, the heat dissipation of the discharge light emitting element can be improved by adhering the discharge light emitting element 1 to the frame 52]. Thereby, the uneven brightness distribution phenomenon caused by the heat generation of the discharge light-emitting element 1 can be suppressed. Ί The supporting portion 51 has a contact surface on at least one side surface of the substrate 2 and the transparent substrate 3 which are in contact with the discharge light emitting element 1 in this case. By directly providing the support portion 51, the discharge light emitting element 1 can be reliably positioned at a certain position ', and the light emitting center of the discharge light emitting element 1 can be prevented from being shifted.
2075-3291-PF.ptd 第11頁2075-3291-PF.ptd Page 11
五、發明說明（9) 又’支持部51只要可達到上述效 __ η拉1上+从， , 4双果可介以任意之70件 間接地支持放電發光元件1之側面。 4* ^ ^ , 人 支持部51可為支 持放電發光元件1之側面之至少一部份之物4。 ϋ發光元件係介以接著層56接著於框：以上。此 :丄：為接著材係可使用熱傳導性較佳之物品。藉此係可 =放電發光元件1 t散熱十生。而作為接著層56例如可使 用雙面膠帶。 (實施型態2) 接著，使用第5圖說明有關本發明之實施型態2。第5 圖為貫施型態2之CIS單元50之剖面圖。 如第5圖所示，本實施型態2者係於框體52之放電發光元 件1之安裝面上設置凹部5 7。凹部5 7係設上述安裝面側 上之與内部電極相對向之位置上。 藉此可抑制於内部電極4與框體52間產生不必要之電 谷及雜訊’且可防止放電發光元件1之放電效率之減低。 又’於將外部電極13配置於上述安裝面側之場合可於 與外部電極13相對向之位置上設置凹部57。於此場合，可 期望得到較上述内部電極4之場合為更顯著之效果。 又，第5圖所示之樣態者係使凹部57之斷面形狀成為v 字狀，但只要能達到上述效果，凹部5 7之斷面形狀可任意 選擇。 ^ (實施型態3) 接著’使用第6圖說明有關本發明之實施型態3。第6 圖為實施型態3之CIS單元50之剖面圖。V. Description of the invention (9) As long as the support portion 51 can achieve the above-mentioned effect, __ η pulls 1 up + from, 4 pairs of fruits can support the side of the discharge light-emitting element 1 through any 70 pieces indirectly. 4 * ^ ^, the human support portion 51 may be at least a part 4 that supports the side of the discharge light-emitting element 1. ϋ The light-emitting element is bonded to the frame via the bonding layer 56: above. This: 丄: For adhesive materials, articles with better thermal conductivity can be used. In this way, the discharge light emitting element can dissipate heat for 1 t. As the adhesive layer 56, for example, a double-sided tape can be used. (Embodiment 2) Next, Embodiment 2 of this invention is demonstrated using FIG. 5. FIG. FIG. 5 is a cross-sectional view of the CIS unit 50 in the second embodiment. As shown in Fig. 5, in the second embodiment, a recessed portion 57 is provided on the mounting surface of the discharge light-emitting element 1 of the frame body 52. The recessed portion 57 is provided at a position facing the internal electrode on the mounting surface side. This can prevent unnecessary valleys and noises from occurring between the internal electrode 4 and the frame 52, and prevent a reduction in discharge efficiency of the discharge light-emitting element 1. When the external electrode 13 is disposed on the mounting surface side, a recess 57 may be provided at a position facing the external electrode 13. In this case, a more significant effect can be expected than in the case of the internal electrode 4 described above. In the aspect shown in Fig. 5, the cross-sectional shape of the concave portion 57 is V-shaped, but the cross-sectional shape of the concave portion 57 can be arbitrarily selected as long as the above-mentioned effect can be achieved. ^ (Embodiment Mode 3) Next, Embodiment Mode 3 of the present invention will be described using FIG.6. Fig. 6 is a sectional view of a CIS unit 50 according to a third embodiment.
2075-3291-PF.ptd 第12頁 4 6 652 4 五、發明說明（ίο) 如第6圖所示，本實施型態2者係於框體52上設置導引 放電發光元件1所射出之光至原稿上之導光路徑。此導 光路控58係設於放電發光元件1之外部電極丨3間之領域之 上方。 藉由設置上述導光路徑58 ’可將放電發光元件1所輸 出之光線確實地導引至原稿上之讀取部份上，例如可抑制 放電發光元件之光照射到原稿之讀取部份及其附近以外之 部份上。 藉此’可抑制不必要的反射光入射至感測IC53，可防 止讀取線以外之無用之光資訊進入感測部中，可得到讀取， 品質為較優（有明暗對比，且中間色調（灰色圖像）之讀取 亦不會被讀取線以外之原稿狀況所影響）之c丨S單元5 〇。 於上述導光路徑58内可設置反射光線用之反射材59。 藉此’可將入射至導光路徑58内之光線適當地反射， 可將該光線有效率地照射於原稿上之讀取部份上。 一 又’作為反射材可例舉出導光板及反射板等。所謂導 光板者係指白色的PET(聚對笨二甲酸乙二醇酯）片等之白 色，射板或稱為鏡帶（mirr〇r tape)之具有鏡面狀表面之 薄膜等之帶狀化之物品，而前述導光板例如係貼著於框 體52上。 —藉由將前述導光板設置於導光路徑58上可使放電發光 ^件Ϊ所射出之不與導光路徑58平行之光被導光路徑58壁 所f射而導引至導光路徑58之開口部。因導光路徑58之 * 口邛係接近原稿照射面故出自前述開口部之光之照明範2075-3291-PF.ptd Page 12 4 6 652 4 V. Description of the Invention (ίο) As shown in FIG. 6, the second embodiment of the present invention is formed by setting a pilot discharge light-emitting element 1 on the frame 52. Light guide path to the original. The light guide 58 is provided above the area between the external electrodes 1 and 3 of the discharge light emitting element 1. By setting the light guide path 58 ′ described above, the light output from the discharge light-emitting element 1 can be surely guided to the reading portion on the original, for example, the light from the discharge light-emitting element can be prevented from irradiating the reading portion of the original and On the part outside it. In this way, unnecessary reflection light can be prevented from entering the sensing IC53, and useless light information other than the read line can be prevented from entering the sensing section, which can be read. The quality is superior (with light and dark contrast, and mid-tone (Gray image) reading will not be affected by the condition of the original outside the reading line) c 丨 S unit 50. A reflection material 59 for reflecting light may be provided in the light guide path 58. Thereby, the light incident into the light guide path 58 can be appropriately reflected, and the light can be efficiently irradiated on the reading portion on the original. Examples of the reflection material include a light guide plate and a reflection plate. The so-called light guide plate refers to the whiteness of white PET (polyethylene terephthalate) sheets, etc., and the banding of the film or mirror film with a mirror-like surface called a mirror tape. The light guide plate is attached to the frame 52, for example. -By disposing the aforementioned light guide plate on the light guide path 58, the light emitted by the discharge light emitting element ^ not parallel to the light guide path 58 is directed by the wall of the light guide path 58 and guided to the light guide path 58 Of openings. The light guide of the light guide path 58 is close to the original illuminated surface, so the light from the opening is illuminated.
2075-3291-PF.ptd ---- 五、發明說明（11) ---- 圍係被限制其結果乃可達到提高Cl s單元50之讀& 目的。 β取精度之 綜上所述，依本發明之CIS單元因可有效地阻止 發光元件之發光中心之偏移故可抑制讀取線上之照 均現象。又’因除去高電壓驅動之電極正下方之框體 易受放電發光元件所輸出之雜訊之影響可防止放電發光元 件之效率之降低。又’藉由設置導光路徑58，可】來自】 稿讀取線之反射光確實地射入至光電變換元件而可得到讀 取品值甚佳（原稿内容之真實重現）之CIS單元。 ° 【圖式簡單說明】 第1圖為本案發明人所創作出之放電發光元件之剖面 圖。 第2圖為第1圖之放電發光元件產生發光時之狀態之剖 面圖。 第3圖為第1圖之放電發光元件之改良例中之放電發光 元件之刹面圖。 第4圖為本發明之實施型態1之CI S單元之剖面圖。 第5圖為本發明之實施型態2之CIS單元之剖面圖。 第6圖為本發明之實施型態3之CIS單元之剖面圖。 第7圖為習知之CIS單元之俯視圖。 第8圖為第7圖所示之CIS單元之剖面圖。 【符號說明】 1〜放電發光元件； 2〜基板； 3~透明基板； 3a〜壁部；2075-3291-PF.ptd ---- V. Description of the invention (11) ---- The system is restricted, and the result can achieve the purpose of improving the reading of the Cl s unit 50 & To sum up the accuracy of β, according to the present invention, the CIS unit according to the present invention can effectively prevent the shift of the light-emitting center of the light-emitting element, and thus can suppress the average phenomenon on the reading line. In addition, since the frame immediately below the electrode driven by the high voltage is susceptible to the influence of noise output by the discharge light emitting element, the efficiency of the discharge light emitting element can be prevented from being lowered. Moreover, by setting the light guide path 58, the reflected light from the reading line of the manuscript can be surely incident on the photoelectric conversion element, and a CIS unit with excellent reading value (the true reproduction of the manuscript content) can be obtained. ° [Schematic description] Figure 1 is a cross-sectional view of a discharge light-emitting device created by the inventor of the present invention. Fig. 2 is a sectional view of a state when the discharge light-emitting element of Fig. 1 emits light. Fig. 3 is a brake surface view of a discharge light emitting element in a modified example of the discharge light emitting element of Fig. 1; FIG. 4 is a cross-sectional view of a CI S unit according to a first embodiment of the present invention. Fig. 5 is a sectional view of a CIS unit according to a second embodiment of the present invention. Fig. 6 is a sectional view of a CIS unit according to a third embodiment of the present invention. FIG. 7 is a top view of a conventional CIS unit. Fig. 8 is a sectional view of the CIS unit shown in Fig. 7. [Symbol description] 1 ~ discharge light-emitting element; 2 ~ substrate; 3 ~ transparent substrate; 3a ~ wall portion;
2075-3291-PF.ptd 第14頁 五、發明說明（12) 4〜内部電極； 6 ~金屬母線； 8〜第1螢光體； 1 0〜封止層； 50、100〜CIS 單元； 5 2、1 0 2〜框體； 54、104~棒狀透鏡 56〜接著層； 5 8〜導光路徑； 1 0卜LED陣列； 1 07〜壓板玻璃； 5、1 3〜外部電極； 7〜絕緣層； 9〜第2螢光體； 11〜放電室； 51〜支持部； 5 3、1 0 3〜感測I C ; 列；55、105〜玻璃板； 5 7 ~凹部； 5 9〜反射板； 1 0 6〜原稿； 108、108a〜發光中心。2075-3291-PF.ptd Page 14 V. Description of the invention (12) 4 ~ internal electrode; 6 ~ metal bus bar; 8 ~ first phosphor; 10 ~ sealing layer; 50, 100 ~ CIS unit; 5 2, 10 2 ~ frame; 54, 104 ~ rod lens 56 ~ adhesive layer; 5 8 ~ light guide path; 10 LED array; 10 ~ platen glass; 5, 1 3 ~ external electrode; 7 ~ Insulating layer; 9 to 2nd phosphor; 11 to discharge cell; 51 to support; 5 3, 10 to 3; sensing IC; column; 55, 105 to glass plate; 5 7 to recess; 5 9 to reflection Plate; 106 ~ original; 108, 108a ~ luminous center.
2075-3291-PF.ptd 第15頁2075-3291-PF.ptd Page 15
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000040691A JP2001230903A (en) | 2000-02-18 | 2000-02-18 | Contact-type image sensor unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW466524B true TW466524B (en) | 2001-12-01 |
Family
ID=18564034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW89112175A TW466524B (en) | 2000-02-18 | 2000-06-21 | Contact-type image sensor unit |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2001230903A (en) |
| TW (1) | TW466524B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI420054B (en) * | 2006-08-09 | 2013-12-21 | Philips Lumileds Lighting Co | Illumination device with wavelength converting element side holding heat sink |
-
2000
- 2000-02-18 JP JP2000040691A patent/JP2001230903A/en active Pending
- 2000-06-21 TW TW89112175A patent/TW466524B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI420054B (en) * | 2006-08-09 | 2013-12-21 | Philips Lumileds Lighting Co | Illumination device with wavelength converting element side holding heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001230903A (en) | 2001-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7279719B2 (en) | Light emitting diode | |
| JP4498286B2 (en) | Surface light source device and display device using the surface light source device | |
| CN106662308B (en) | Turn signal lamp | |
| JPH03224354A (en) | Photoelectric converter with improved lighting system and information processor with same converter mounted thereon | |
| JP2006011242A (en) | Liquid crystal display device | |
| US8625053B2 (en) | Light emitting diode and backlight unit and liquid crystal display device with the same | |
| KR101656100B1 (en) | A multilayer printed circuit board and liquid crystal display device comprising the same | |
| US8305520B2 (en) | Light source device and liquid crystal display apparatus including the same | |
| JP2004186004A (en) | Illumination device and liquid crystal display equipped with it | |
| JP2011165434A (en) | Light source, backlight unit, and liquid crystal display device | |
| US20090034296A1 (en) | Light Emitting Unit, Illumination Device Using Such Light Emitting Unit, and Image Scanner | |
| TW201240154A (en) | Structure of the LED package | |
| JP2744307B2 (en) | Photoelectric conversion device | |
| JP4726456B2 (en) | Liquid crystal display | |
| EP0420644A2 (en) | Contact type image sensor | |
| CN1840960A (en) | Spread illuminating apparatus of side light type | |
| KR100733840B1 (en) | Light projecting apparatus of light emitting diode chip module | |
| JP4587720B2 (en) | Light source device and liquid crystal display device having the same | |
| TW466524B (en) | Contact-type image sensor unit | |
| CN110313168B (en) | Illumination device and image reading device | |
| KR20170033972A (en) | Light-Emitting Apparatus and Backlight Unit having the same | |
| CN112767850B (en) | Display panel and display device | |
| CN111916434A (en) | Display device | |
| KR100594914B1 (en) | Discharge light-emitting device and contact image sensor utilizing the same | |
| TW455898B (en) | Discharge luminescent device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |