TW466107B - Infrared thermal image detection system - Google Patents

Infrared thermal image detection system Download PDF

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Publication number
TW466107B
TW466107B TW89100200A TW89100200A TW466107B TW 466107 B TW466107 B TW 466107B TW 89100200 A TW89100200 A TW 89100200A TW 89100200 A TW89100200 A TW 89100200A TW 466107 B TW466107 B TW 466107B
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Taiwan
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infrared
circuit
gain
patent application
digital
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TW89100200A
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Chinese (zh)
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Ou Jang
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Telesis Tech Inc
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Abstract

The present invention provides an infrared thermal image detection system which comprises an infrared detection device, a circuit device and a display device, wherein the infrared detection device is to detect the amount of radiation of the object to be detected, and generate a digital signal corresponding to the amount of radiation; the circuit device is to have the gain and level shift processing to the electrical signal based on the preset coefficient in the specific operation environment and the output signal of the infrared detector, and form the picture frame data corresponding to the amount of radiation; and the display device to receive the picture frame data of said circuit device and display it; thereby the effect of high precision, simple operation, assembly and convenient replacement, cost reduction can be achieved.

Description

466107 15 20 A7 五、發明說明(1) 本發明係提供一種紅外線熱影像债測系統,特別是指 一種應用於醫療用途的紅外線熱影像偵測系統者。 按,由於不管任何東西產生都會熱輕射 ,因此可用紅 外線摘測器來{貞測該樣東西的存在位置、溫度或形狀等 5尤其在醫療上’由於人體隨箸自身溫度的變化所發出 不同熱輻射量’利用紅外線熱影像偵測器來被動檢測人 體的身體狀態,可避免利用侵入性或主動性(由儀器釋放 能量收取返回信號)設備(如内視鏡取樣、χ &、斷層掃 瞄、甚至超音波等)來檢測所可能產生之危害…般而 10言,紅外線偵測器是產生與熱輻射量呈線性化關係的電 訊號,且利用一裝置來處理該電訊號並形成隨溫度不同 而顯示不同顏色的影像,以供醫生參考。 雖然’熱輻射量與光譜波長及溫度有冑切關係,但是 熱輻射量並不與溫度呈線性關係,故如何準確計算出熱 輕射與溫度的正確關係、(或者可以說是溫度與電訊號之 間的關係)’以供參考,-直是業者所努力的重點,且在 現今熱影像機械操作時,往往需由使用者鍵入一些設定 資料如溫度等係數’而對使用者造成不便,故操作手續 的簡化是醫療人員所迫切需要的事項。 有鑑於習知之缺點,是以,本發明人累積多年從事該 行業之經驗,積極從事研究,終有本發明『紅外線熱影 像偵測系統』之產生。 本發明之一目的係提供一種紅外線熱影像偵測系統, 使達提升精確度的效果。 第4買 '本紙張尺度適用中國國家標準(CNS)A4規(210 X 297公釐) --^i------tr·---------線 {請先閱讀背面之注意事項再填寫本頁) 466107 A7 _______B7__ 五、發明說铒(2 ) ' 本發明之另—目的係提供一種紅外偵測系統 化操作流程之效果。 ί請先閱讀背面之注項再填寫本頁) 本發明之又-目的係提供一種紅外線熱影像積測*** ,藉將紅外偵測裝置内的組件模㈣匕,而達到組裝與抽 5 換方便之效果。 本發明之再一目的係提供一種紅外線偵測模組系統, 藉將電路裝置模組化成一 pCI外接卡,以達組裝與抽換 方便之功效。 本發明之更一目的係提供一種紅外線熱影像偵測系統 10 ,藉將組件模組化,以達降低成本之效果。 線 爰是,為達到上述之目的,本發明之紅外線熱影像偵 測系統係包括一紅外線偵測裝置、一電路裝置及一顯示 裝置’其中;該紅外線偵測裝置,用以偵測一待測物的輻 射量且對應該輻射量產生一數位電訊號;該電路裝置, 15依據以在特定操作環境所預先設定的係數及紅外線偵測 器之輸出訊號,對該電訊號作增益及位階偏移處理並形 成對應該待測物之輻射量的圖框資料;及該顯示裝置, 用以接收上述該電路裝置之圖框資料並顯示於該顯示裝 經濟部智慧財產局貝工消费合作社印製 置。 20 有關本發明為達上述目的、特徵所採用的技術手段及 其功效’茲例舉較佳實施例並配合圖式說明如下: 第一圖係本發明較佳實施例之電路方塊圖。 第二圖係本發明較佳實施例之電路裝置之電路方塊圖 〇 第5頁 本紙張尺度適用中國固家標準(CNS)A4規格(210 X 297公爱)466107 15 20 A7 V. Description of the invention (1) The present invention provides an infrared thermal image debt measurement system, particularly an infrared thermal image detection system for medical applications. Press, because whatever is generated will be hot and light, so you can use an infrared pick-up to measure the existence position, temperature, or shape of such things. 5 Especially in medical treatment, because the human body changes with the change of its own temperature. The amount of thermal radiation 'uses infrared thermal image detectors to passively detect the body condition of the human body, which can avoid the use of intrusive or active (energy released by the instrument to receive the return signal) equipment (such as endoscope sampling, χ &, tomography Sight, even ultrasound, etc.) to detect the possible harm ... Generally speaking, 10 infrared detectors generate electrical signals that have a linear relationship with the amount of thermal radiation, and use a device to process the electrical signals and form Different temperatures display different color images for doctors' reference. Although the amount of thermal radiation has a tangential relationship with the wavelength and temperature of the spectrum, the amount of thermal radiation does not have a linear relationship with temperature. Therefore, how to accurately calculate the correct relationship between thermal radiation and temperature, (or it can be said that temperature and electrical signals The relationship between them) 'for reference,-it is the focus of the efforts of the industry, and in the current operation of thermal imaging machinery, users often need to enter some setting data such as temperature and other coefficients, which causes inconvenience to the user, so Simplification of procedures is an urgent need for medical staff. In view of the shortcomings of conventional knowledge, the inventor has accumulated years of experience in the industry and actively engaged in research. Eventually, the "infrared thermal image detection system" of the present invention was produced. It is an object of the present invention to provide an infrared thermal image detection system to achieve the effect of improving accuracy. Buy No. 4 'This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm)-^ i ------ tr · --------- line {Please read the back first Please pay attention to this page and fill in this page again) 466107 A7 _______B7__ V. Invention 铒 (2) 'Another purpose of the present invention is to provide the effect of a systematic operation process of infrared detection. (Please read the note on the back before filling in this page) Another purpose of the present invention is to provide an infrared thermal image measurement system, which facilitates assembly and extraction by changing the components in the infrared detection device. The effect. Yet another object of the present invention is to provide an infrared detection module system, which is used to modularize a circuit device into a pCI external card to achieve the convenience of assembly and replacement. A further object of the present invention is to provide an infrared thermal image detection system 10, which achieves the effect of reducing costs by modularizing components. The line is that in order to achieve the above-mentioned object, the infrared thermal image detection system of the present invention includes an infrared detection device, a circuit device, and a display device. Among them, the infrared detection device is used to detect an object to be tested. The electronic device generates a digital electric signal corresponding to the amount of radiation; the circuit device 15 performs gain and level shift on the electric signal based on the coefficients preset in the specific operating environment and the output signal of the infrared detector. Processing and forming frame data corresponding to the radiation amount of the object to be measured; and the display device for receiving the frame data of the circuit device and displaying it on the display device printed by the Shelley Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs . 20 The technical means adopted by the present invention to achieve the above-mentioned objects and features, and their effects, are described below with reference to the preferred embodiments. The first diagram is a circuit block diagram of the preferred embodiment of the present invention. The second figure is a circuit block diagram of the circuit device of the preferred embodiment of the present invention. 〇 Page 5 This paper size is applicable to China Solid Standard (CNS) A4 specification (210 X 297 public love)

4 6 61 〇T A7 ___B7_;__五、發明說明(3 ) 第三圖係本發明較佳實施例之紅外線偵測裝置之局部 分解示意圖。 第四圖係本發明較佳實施例之熱輻射計算示意圖。 第五圖係本發明較佳實施例之動作流程圖。 5 第六圖係本發明較佳實施例組合於一工作平台上之示 意圖。 圖號對照表: 1紅外線偵測裝置 11紅外線鏡頭組 12熱電致冷器 13聚焦面陣列偵測器 、 14放大電路模組 141放大電路集合 I42放大電源供應查路集合 15類比至數位轉換電路集合模組 16輸入/輸出電路集合模組 17系統電源供應電路集合模組 10 15 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員Η消費合作社印製 20 2電路裝置 22閂鎖電路 體 24訊號處理電路 242位階偏移單元 244暫存電路 25 PCI介面 21傳輸線路 23增益/位階偏移記憶 241增益乘法單元 243介面電路 245 PCI圖框儲存單元 26 PCI匯流排 31電腦主機 3顯示裝置 310主機板之pc I匯排流312微處理器 313影像卡 314平行埠 第6頁 尺度適用令,國圉家標準(CNS)A4規格⑵〇 x 297公爱) .^—l!tr----------線- 4661 0? A7 B7 五、發明說明(4 ) 32電腦螢幕 32,電視螢幕 34硬碟 36光碟機 4工作平台 411高台之頂面 43滑輪 經 濟 部 智 慧 財 產 局 貝 X. 消 費 合 作 社 印 33電源供應器 35軟碟 3?數據機 41高台 42平置板 44滑軌 首先'^參考第一圖所示,係本發明之紅外線熱影像 偵測系統之較佳實施例,本實施例大體包括一紅外線偵 測裝置1、一電路裝置2及一顯示裝置3;其中: 該紅外線偵測裝置1,用以偵測一待測物如人體的熱 輻射量且對應其之輻射通量形成一數位電訊號,具有— 紅外線鏡頊組(IR 〇pt i cs ) i i、一熱電致冷器(τΕ〇 )工2 、一聚焦面陣列偵測器(FpA Dewar) 13、—放大電路模 組14' 一類比至數位轉換電路集合模組(Anal〇gCCA) 15 、一輸入/輸出電路集合模組(I/() CCA) 16及一系統電 源供應電路集合模組17 ( System P/S CCA),其中: 該紅外線鏡頭組U,係用以蒐集入射之紅外線 ,具有一濾光片,用以供適當波長紅外線通過,及一 遮光月,用以在偵測待測物之前,先遮蔽該鏡頭丨I以 阻擋紅外線入射,先讓該紅外線熱影像偵測系統擷取 一參考電訊號,以配合校準使用,在本實施例中,可 對應該聚焦面偵測器13所偵測之紅外線波長而選擇不 同之規格之鏡頭,在此對應人體所產生熱輻射之紅外 |___第7頁 本紙張尺度適用尹國國家標準(CNS>A4規格(210 κ 297公楚)一 一 --- - 10 15 20 (請先閱讀背面之注意事項再填寫本頁) -4---!|訂·!·線 4661 0 7 A7 B7 五、發明說明(5 ) 線波長為8〜12# m,故選擇可供波長8〜12# m通過之紅 外鏡頭11。 該非冷卻式聚焦面陣列偵測器13,係包含多數 個紅外線偵測胞,各該紅外線偵測胞接收各該對應方 5 向入射之紅外線輪射量並產生一類比電訊號,以形成 一類比電訊號集合,而該偵測器丨3係可為銻化銦(比沾 )、矽化鉑(PtSi)、銦隔汞(MCT)及熱輻射檢知器( Micro-Bolometer )中的一個,在本實施例中選擇利用 I 熱敏電阻之熱輻射檢知器當作偵測器13,由於該熱輕 10 射檢知器之偵測器13為非冷卻式*故可在室溫下正常 運作’而不需冷卻系統,以相對於習知延長偵測器之 壽命且可長時間待機,但在本實施例中,為確保該偵 測器13在溫度上升時仍可正常運作,在偵測器13前 I δ又置一熱電致冷器12用以冷卻該非冷卻式聚焦面陣列 15 偵測器13至適當溫度。 該放大電路模組14,係連接聚焦面陣列偵測器13 ’用以放大該聚焦面陣列偵測器13所輸出的類比電訊 號集合至該類比至數位轉換電路15,具有—放大電路 集合(Preamp CCA) 141以放大該類比電訊號集合至適 20 當的電壓準位(例如:―卜iv),及一放大電源供應電路 I 集合(Preamp P/S CCA )用以供應該放大電路集合141 電源8 該類比至數位轉換電路集合模組】5,係連接該 放大電路模組14 ’用以接收經該放大電路模組】4放大 | 第8頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 x 297公釐) ---- (請先閲讀背面之注意事項再填寫本頁) .d---------訂---------線: 經濟部智慈財產局員工消費合作社印製 4 6 61 0 7 五、發明說明(6 ) 之類比電訊號集合轉換成數位電訊號。 該輸入/輸出電路集合模組16,係連接該類比至 數位轉換電路集合模組15,用以使該類比至數位轉換 電路的數位電訊號經該模組16輸出至電路裝置2。 5 該系統電源供應電路集合模組17,係分別電氣 連接該類比至數位轉換電路集合模組丨5、輸入/輪出電 路集合模組16及放大電源供應電路集合M2,以供應 電源至這些組件。 對應參照第三圖所示,在本實施例中之紅外線偵 10 測裝置1 ’分別將放大電路模組14、類比至數位轉換 電路集合模組15、輸入/輸出電路集合模組16及系統 電源供應電路集合模組17模组化,相較習知將這些電 路作在同一電路板上,本發明在更換不同之紅外線鏡 頭組11及聚焦面陣列13時,只需抽換部分電路模組 15 如放大電路模組14,而習知卻必須將整塊電路板更換 ’故本發明只需較低成本即可更換紅外線鏡頭組1 1或 聚焦面陣列偵測器13,對使用者而言,更符合經濟成 本。 請參照第二圖所示,顯示本發明之計算紅外線熱幅測 20之電路裝置2之電路方塊圖,此電路裝置2以模組化為 一 PCI外接卡為較佳實施,該電路裝置係包括一傳輸線 路(HOT Link Transeviers) 21、一閂鎖電路(16 bit Latch )22、一增盈/位階偏移記憶體(Gain/〇ffset rAM) 23、 一訊號處理電路24、一 PCI介面(PC〗 lnterface) 25及 第9頁 4661 07 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明(7 , 一 PCI 匯流排(PCI bus) 26,其中: 3亥傳輸線路21 ’係分別連接紅外線彳貞測裝置1 及電路裝置2,以傳輸數位電訊號經電路裝置2的一問 鎖電路22至增益乘法單元241。 5 該增益/位階偏移記憶體23,用以儲存多組增益 及位階偏移係數,而其中一組係數是對應特定操作環 境所設定,如在溫度21。(:下密室内。 該訊號處理電路24,係連接電氣連接該閂鎖電 路22,·以接收紅外線偵測裝置1所輪出的數位電訊號 ,並自上述增益/位階偏移記憶體23擷取所須之係數 對該數位電訊號作適當處理而輸出一 PCI圓框資料, 係包括一增益乘法單元(Gain multiplier) 241、. 一位 階偏移單元(Of fset Image )242、一介面電路(Interface EPLD) 243、一暫存電路(FIFO) 244、一 PCI 圖框資 料儲存單元(PCI Frame Store) 245。其中:該增益乘 法單元241係連接閂鎖電路22以接收數位電訊號,並 自上述增益/位階偏移記憶體23擷取一增益係數而增 益該數位電訊號;該位階偏移單元242,係分別連接上 述增益/位階偏移記憶體23及增益乘法單元241,用以 自該增益/位階偏移記憶體23擷取一位階偏移係數而 對經該增益乘法單元241增益之數位電訊號進行位階 偏移並形成一影像訊號輸出;該介面電路243,係連接 上述位階偏移單元242,並規格化自該位階偏移單元242 之影像訊號而形成PCI圖框資料而輸出至上述pci介 第10頁 10 15 20 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 χ 297公釐) (請先閲讀背面之注意事項再填寫本頁) -·111!111 ^ · ί I --- 4 6 61 0 7 A74 6 61 〇T A7 _B7_; __ V. Description of the invention (3) The third diagram is a partial exploded view of the infrared detection device of the preferred embodiment of the present invention. The fourth figure is a schematic diagram of the heat radiation calculation of the preferred embodiment of the present invention. The fifth diagram is an operation flowchart of the preferred embodiment of the present invention. 5 The sixth diagram is a schematic view of a preferred embodiment of the present invention combined on a working platform. Chart number comparison table: 1 Infrared detection device 11 Infrared lens group 12 Thermoelectric cooler 13 Focusing surface array detector 14 Amplifying circuit module 141 Amplifying circuit set I42 Amplifying power supply path finding set 15 Analog to digital conversion circuit set Module 16 I / O circuit assembly module 17 System power supply circuit assembly module 10 15 (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 20 2 Circuit device 22 Latch Circuit body 24 signal processing circuit 242 level shift unit 244 temporary storage circuit 25 PCI interface 21 transmission line 23 gain / level shift memory 241 gain multiplication unit 243 interface circuit 245 PCI frame storage unit 26 PCI bus 31 computer host 3 display Device 310 motherboard pc I bus 312 microprocessor 313 image card 314 parallel port page 6 standard application order, National Standard (CNS) A4 specification (〇x 297 public love). ^ — L! Tr- --------- Line-4661 0? A7 B7 V. Description of the invention (4) 32 Computer screen 32, TV screen 34 Hard disk 36 Optical drive 4 Working platform 411 Top of the platform 43 Pulley Wisdom of the Ministry of Economy Production Bureau X. Consumer Cooperative Printing 33 Power Supply 35 Floppy Disk 3? Data Machine 41 High Platform 42 Flat Plate 44 Slide Rail First '^ Refer to the first figure, which is a comparison of the infrared thermal image detection system of the present invention This embodiment generally includes an infrared detection device 1, a circuit device 2 and a display device 3; wherein: the infrared detection device 1 is configured to detect a heat radiation amount of a test object such as a human body, and Corresponding to its radiant flux, it forms a digital electrical signal. It has-infrared mirror unit (IR 〇pt i cs) ii, a thermoelectric cooler (τΕ〇) 2 and a focused surface array detector (FpA Dewar) 13.—Amplifying circuit module 14 'An analog-to-digital conversion circuit assembly module (AnalOgCCA) 15, an input / output circuit assembly module (I / () CCA) 16 and a system power supply circuit assembly module 17 (System P / S CCA), where: the infrared lens group U is used to collect incident infrared rays, has a filter for infrared rays of appropriate wavelengths to pass through, and a shading month for detecting Before measuring the object, first shield the lens 丨 I to block For external incident, first let the infrared thermal image detection system capture a reference electrical signal for calibration. In this embodiment, different specifications can be selected according to the infrared wavelength detected by the focus plane detector 13. The lens corresponds to the infrared of the thermal radiation generated by the human body. ___ page 7 This paper is based on the national standard of Yin State (CNS > A4 specification (210 κ 297)) ----10 15 20 (Please Read the precautions on the back before filling this page) -4 ---! | Order ·! · Line 4661 0 7 A7 B7 V. Description of the invention (5) The wavelength of the line is 8 ~ 12 # m, so you can choose a wavelength of 8 ~ 12 # m through the infrared lens 11. The non-cooling focusing surface array detector 13 includes a plurality of infrared detection cells, each of which detects the amount of infrared radiation emitted by the corresponding party in five directions and generates an analog electrical signal to form an analog A collection of electrical signals, and the detector 3 can be one of indium antimonide (specific adhesion), platinum silicide (PtSi), indium mercury barrier (MCT), and thermal radiation detector (Micro-Bolometer). In this embodiment, a thermal radiation detector using an I thermistor is selected as the detector 13. Since the detector 13 of the thermal light 10-ray detector is non-cooled, it can operate normally at room temperature. 'No cooling system is required to extend the life of the detector compared to the conventional one and it can be used for a long time, but in this embodiment, to ensure that the detector 13 can still operate normally when the temperature rises, A thermoelectric cooler 12 is placed in front of the device 13 to cool the non-cooled focusing surface array 15 detector 13 to an appropriate temperature. The amplifying circuit module 14 is connected to the focus plane array detector 13 ′ to amplify the set of analog electrical signals output by the focus plane array detector 13 to the analog to digital conversion circuit 15, and has an amplifier circuit set ( Preamp CCA) 141 to amplify the analog signal set to a proper voltage level (for example:-iv), and an amplifier power supply circuit I set (Preamp P / S CCA) to supply the amplifier circuit set 141 Power supply 8 This analog-to-digital conversion circuit assembly module] 5, is connected to the amplifier circuit module 14 'for receiving via the amplifier circuit module] 4 amplification | page 8 This paper size applies to Chinese National Standard (CNS) A4 Specifications (21〇x 297mm) ---- (Please read the precautions on the back before filling this page) .d --------- Order --------- Line: Economy Printed by the Consumers' Cooperative of the Ministry of Intellectual Property Bureau 4 6 61 0 7 V. Invention Description (6) The analog signal set is converted into a digital signal. The input / output circuit assembly module 16 is connected to the analog-to-digital conversion circuit assembly module 15 so that the digital electrical signals of the analog-to-digital conversion circuit are output to the circuit device 2 through the module 16. 5 The system power supply circuit collection module 17 is electrically connected to the analog-to-digital conversion circuit collection module 丨 5, the input / round-out circuit collection module 16 and the amplified power supply circuit collection M2 to supply power to these components . Correspondingly referring to the third figure, the infrared detection device 10 in this embodiment 1 ′ includes an amplifier circuit module 14, an analog-to-digital conversion circuit assembly module 15, an input / output circuit assembly module 16, and a system power supply, respectively. The supply circuit assembly module 17 is modularized. Compared with the conventional methods of using these circuits on the same circuit board, the present invention only needs to replace some circuit modules 15 when replacing different infrared lens groups 11 and focusing surface arrays 13. For example, if the circuit module 14 is enlarged, the conventional circuit board must be replaced. Therefore, the present invention can replace the infrared lens group 11 or the focus plane array detector 13 at a lower cost. For users, More in line with economic costs. Please refer to the second figure, which shows a circuit block diagram of the circuit device 2 for calculating the infrared thermal measurement 20 of the present invention. This circuit device 2 is preferably implemented by being modularized into a PCI external card. The circuit device includes A transmission line (HOT Link Transeviers) 21, a latch circuit (16 bit Latch) 22, a gain / level shift memory (Gain / 〇ffset rAM) 23, a signal processing circuit 24, a PCI interface (PC 〖Lnterface) 25 and page 9 4661 07 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (7, a PCI bus 26 (PCI bus) 26, of which: 3H transmission line 21 'are connected to infrared respectively彳 The test device 1 and the circuit device 2 transmit digital signals through a question lock circuit 22 of the circuit device 2 to a gain multiplication unit 241. 5 The gain / level shift memory 23 is used to store multiple sets of gains and levels Offset coefficient, and a set of coefficients is set corresponding to a specific operating environment, such as at a temperature of 21. (: under the dense room. The signal processing circuit 24 is connected to the electrical connection to the latch circuit 22, to receive infrared detection Hold 1 round digital signal, and the necessary coefficients are retrieved from the above-mentioned gain / level offset memory 23. The digital signal is appropriately processed to output a PCI round frame data, which includes a gain multiplication unit (Gain multiplier) 241. First-order offset unit (Of fset Image) 242, an interface circuit (Interface EPLD) 243, a temporary storage circuit (FIFO) 244, a PCI frame data storage unit (PCI Frame Store) 245. Among them : The gain multiplication unit 241 is connected to the latch circuit 22 to receive a digital signal, and retrieves a gain coefficient from the above-mentioned gain / level shift memory 23 to gain the digital signal. The level shift unit 242 is respectively The gain / level offset memory 23 and the gain multiplying unit 241 are connected to obtain a one-level offset coefficient from the gain / level offset memory 23 and perform a step on the digital electrical signal that has been gained by the gain multiplying unit 241 Shift and form an image signal output; the interface circuit 243 is connected to the above-mentioned level shift unit 242 and normalizes the image signal from the level shift unit 242 to form a PCI frame Output to the above pci introduction page 10 10 15 20 This paper size applies the Chinese National Standard (CNS) A4 specification (21〇χ 297 mm) (Please read the precautions on the back before filling this page)-· 111! 111 ^ · ί I --- 4 6 61 0 7 A7

f琦先閱磧背面之注意事項再填寫本頁)(Fqi first read the notes on the back of 碛 before filling out this page)

^il-----訂 i'J^ il ----- Order i'J

n I 線 4 β 61 Ο 7 Α7 經濟部智慧財產局負工消費合作社印製n I line 4 β 61 Ο 7 Α7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

五、發明說明(9 ) 送至顯示螢幕32供使用者觀看,在此,該顯示螢幕32 係以電細f幕(PG MGnitQr )為較佳實施,但亦可利用 RS-170傳輸線連接至電視螢幕(TV Monitor) 32,顯示。 再者,在本實例中,由於可利用PCI圖框資料儲存單元245 5儲存大置的資料,故晝面係可為320 x 240像素(pixel) 、640X48G像素或1()24x議像素,且在電腦主機31内 儲存控制軟體讓每一像素所顯示的顏色是對應該待測物 之該點位置發射之輻射量所換算而成的溫度,故隨溫度 不同顯色亦隨之改變,可利用印表機38將顯示在顯示螢 幕32之畫面列印出來,在此該印表機38係以彩色印表 機較佳實施例,以方便使用者觀看。 請參照第四圖’以下說明本發明之電路裝置2之計算 方式: 1.輻射通量(Radiant Flux)計算方式: 首先’本案發明人依據蒲郎克定律計算在人體溫度之 範圍内’待測物所發出的光強度與紅外線波長及溫度之 關係如下列公式1所示: L (VtW__Ci Watts λ5 {exp(C2/(λΤ)) -1} cm2 - sr - μιη “》 其中:Le =光強度 λ=紅外線波長 T=待測物絕對溫度 C!=常數= ll,911pm5Watts/(cm2-sr —μηι) C2 =常數= 14,388μιη-Κ 而經紅外線鏡頭組11所收集在某一區段波長之幅射 通量如下列公式2所示: ^121 I 10 15 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)5. Description of the invention (9) Sent to the display screen 32 for viewing by the user. Here, the display screen 32 is preferably implemented with a fine screen f (PG MGnitQr), but it can also be connected to a TV using an RS-170 transmission line. Screen (TV Monitor) 32, display. Furthermore, in this example, since the large frame data can be stored using the PCI frame data storage unit 245 5, the daytime system can be 320 x 240 pixels (pixel), 640X48G pixels, or 1 (24x24 pixels), and The control software is stored in the computer host 31 so that the color displayed by each pixel is the temperature converted from the amount of radiation emitted at the point of the object to be measured. Therefore, the color changes with different temperatures, which can be used. The printer 38 prints the screen displayed on the display screen 32. Here, the printer 38 is a preferred embodiment of a color printer for the convenience of the user. Please refer to the fourth figure 'below to explain the calculation method of the circuit device 2 of the present invention: 1. Radiant Flux calculation method: First,' the inventor of this case calculates within the range of human body temperature according to Planck's law 'to be measured The relationship between the light intensity emitted by the object and the infrared wavelength and temperature is shown in the following formula 1: L (VtW__Ci Watts λ5 {exp (C2 / (λΤ)) -1} cm2-sr-μιη "" Where: Le = light intensity λ = infrared wavelength T = absolute temperature of the object to be measured C! = constant = ll, 911pm5Watts / (cm2-sr —μηι) C2 = constant = 14,388μηη-κ and collected by the infrared lens group 11 in a certain wavelength range The radiation flux is shown in the following formula 2: ^ 121 I 10 15 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

"!1 訂_| [n n I I I 4 β 61 0 7 Α7 Β7 五、發明說明() φ ε (λ,τ) = τ〇 J· L (人,τ批Watts …公式2 4ρ2 λ, 其中:Φβ=轄射通量(Radiant Flux) Ad =增益 F=紅外線頻率 τ〇 =時間間隔 2.經聚焦面陣列偵測器a所產生之類比電訊號集合 10 經 部 智 慧 財 產 局 負 工 消 費 合 作 社 印 製 15 由於聚焦面陣列偵測器13所產生之類比電訊號集合11 與所接收的輻射通量呈線性關係,兩者之關係可利用下 列公式3表示: v = R<l>eVo〖t,"公式 3 其中:v =偵測器輸出(Detector Output) 3.進入類比至數位轉換電路集合模組15的類比電訊 號集合: 由於類比電訊號集合在傳輸的過程會有位階偏移的情 況發生,以及在經放大電路模組14會增益放大以達到適 當之電壓準位,故進入類比至數位轉換電路集合模組15 的電訊號與原先聚焦面陣列偵測器13所輸出的電訊號之 間的關係如下列公式4所示: V = G(V - v〇)volts.,.公式4 其中·· V =類比至數位轉換器之輸入(ADCIntput) v〇 =位階偏移的值(Offset) 4·類比至數位轉換電路集合模組15所輸出的數位電 訊號: 經類比至數位轉換電路集合模組〗5所輸出的數位電 填 第13頁 本紙張尺度適用中關家標準(CNS)A4規格(21Q x 297公楚 46610 7 A7 五、發明說明(11 ) 訊號與輸入的類比電訊號集合的關係如下列公式5所示: N = r(V + l)c〇unt …公式5 其中·· N =類比至數位轉換電路集合模組之輸出(ADc 〇说 r = 4095/2Counts/Volt 5.電路袭置2之訊號處理方式: 在電路敦置2接收到紅外線偵測裝置】之輸出後,利 用上列公式推算出適當的增益及位階偏移係數,以儲存 在增益/位階偏移記憶體23,故可直接在電路裝置2上利 用增益乘法單元241及位階偏移單元242進行增益放大 及位階偏移動作,以計算出正確的輻射通量,然後再經 規格化處理後,送至顯示裝置3電腦主機内的控制軟體 使不同的輻射通量顯示出不同顏色,亦即不同的溫度 會顯示不同顏色,故觀看顯示螢幕32上的晝面,即可知 道代測物的溫度分佈,而使用者可藉由觀看該畫面來判 斷代測物如人體是否有何處溫度異常。 6·紅外線偵測器的補償方式: 由於應用在醫療用途的紅外線熱影像偵測系統,往往 設置一密閉小空間内且該空間通常維持在—固定特定溫 度(一病房内大都維持在2KC),故本系統内先儲存在此 空間内該溫度下紅外線鏡頭組所擷取的輻射通量,以作 為參考資料,故使用者只需直接擷取待測物的輻射通量 ,而擷取後的輻射通量會與預先儲存的資料及對應此特 定環境的係數進行比較修正後,而於顯示螢幕32上顯示 正確的畫面,以避免習知中需使用者先鍵入一大堆的設 定資料才能使用的缺點,達到簡化使用者操作的效果; ____苐〗4頁 本紙張尺度適用中國國家標準(CNS>A4規格(210 X 297公楚 5 (請先閲讀背面之注意事項再填窝本頁:> 10 15 20 ^--------訂 ίι·------線 15 20 4 6 61 0 7 五、發明說明(u) 此外,在本實施例中,由於利用紅外線偵測装置1擷取 待測物之輻射通量之前,該紅外線鏡頭組u之遮光片作 先作動遮蔽鏡頭11 ,以阻擋紅外線入射,使在沒有紅外 線入射之下,先作一次背景晝面取樣當作背景資料,而 5後在待測物定位及遮光片移開不再阻撞紅外線人射的狀 況下,再擷取輻射通量與先前背景資料作比較,以在聚 焦面陣列偵測器13内的諸紅外線偵測胞若有工作效能不 同的情況(如有些紅外線偵測胞對相同輻射通量反應不 同’即在公式3的R值不同)下’仍可顯示出正破圖框 10資料。 請參照第五圖,係為本發明較佳實施例的流程圖,本 實施例搭配一軟體控制,使在已預先設定特定溫度下仍 可自動做即時修正,以避免醫療人員的操作困難,首先 ,虽紅外線偵測系統開始啟動後,進入步驟,命令聚 焦面陣列偵測器13進入"輸入(IN) ”模式,即對紅外線 價測裝置1與電路裝置2設定相關㈣,與紅外線鏡頭 組II之遮光片作先作動遮蔽鏡頭u,以阻擋紅外線入射 ,使可在沒有紅外線入射之下,先作一次背景晝面取樣 當作背景資料;接著進行步驟S2,設定聚焦面陣列偵測器 13至中溫(Mid-Temp),此中溫為一特定溫度如21β(:;其 次,進行步驟S3,對應該中溫設定溫度Τι與類比至數位 轉換電路集合模組15之輸出化之間的關係,·接著步驟^ 傳送對應該中溫的等於丨的原始增益係數至增益查法單 元241;再者,進行步驟S5,計算出對應中溫的原始位階 ,___第15頁 本紙張尺度適用中國國家標準<CNS)A—4^·^;四) < 閲讀背面之注意事項再填寫本頁> ^--------訂 -------哞. 4 6 61 0 7 A7 B7 經 濟 部 智 慧 財 產 局 貝 工 消 費 合 作 杜 五、發明說明(13 ) 偏移係數至位階偏移單元242 ;其中,步驟S4與S5是為 了使整體位階偏移最佳化,而後在步驟S6中,自位階偏 移單兀242寫入原始增益至增益/位階偏移記憶體123間 始進行增益;接著步驟S7利用上述的設定係數截獲中溫 影像資料及平均值之圖框(背景資料);跳至步驟S8利 用該圖框s·(•舁準確位階偏移係數;其次,步驟S9傳送準 蜂的位階偏移係數至位階偏移單元242 ;跳至步驟§ 1 〇 , 命令聚焦面陣列偵測器13進入"輸出(〇ϋτ) „模式,即 移開遮光片開始接收外界(待測物)紅外線的紅外線輻 射;跳至步驟S11針對影像傳送方式利用直接記憶體存 取(Direct Memory Access ; DM)控制器來執行影像傳 送,以獲得更快之傳送速度以及更好之傳送效率;接著 在步驟S12中根據送入的資料影像重新繪製影像資料之 圖框;而後步驟S13,對影像資料畫面模式進行控制以供 顯示在電腦螢幕32上;跳至步驟S14進行實物成像(Ufe Imagery)’使影像晝面資料顯示於電腦螢幕32上;接著 步驟S15·,再命令聚焦面陣列偵測器13進入"輸入(IN) "模式;而後步驟S16設定聚焦面陣列偵測器13至高溫 (Hi-Temp),此高溫高於步驟S2的中溫;跳至步驟si7 ,在聚焦面陣列偵測器13設定到高溫時,截獲類比至數 位轉換電路集合模組15輸出在高溫的數位計算結果;其 次至步驟S18設定聚焦面陣列偵測器13至低溫(L〇_Temp ),此低溫低於步驟S2的中溫,而後截獲類比至數位轉 換電路集合模組15輸出在低溫的數位計算結果;跳至步 ι_____ 第16頁 本紙張尺度適用中關家標準(CNS)A4規格咖x挪公楚j 5 10 15 20 --------_-------4 (請先閱讀t·面之注意事項再填寫本頁) 4661 Ο 7 五、發明說叼(Μ ) 驟s】9,根擄步驟s】7與步驟S18的數位計算結果來計算 介於高溫與低溫之間一適當中溫,並設定聚焦面_ 測器13至中溫,此中溫之數值可能與步驟⑵之中溫之 數值有所差異;接著至步驟S2〇,截獲類比至數位轉換電 路本《模』15輸出在此中溫的數位計算結果;跳至步禪 S2卜對應計算結果來產生正確溫度,·其次至步驟奶命 令聚焦面陣列偵測器13切換至"輸出"模式;而在本實施 例中更利用硬碟34來儲存一資料庫,資料庫内儲存多筆 因應不同環境、不同溫度等條件所應有設^資料;在步 驟S23中,判斷在步驟奶中聚焦面陣列偵測器13輸出 之訊號是否為資料庫内所具有的㈣;若為是,則跳至 步驟S24由資料庫存取設定資料以加速進行成像動作, 並接著至步驟S25進行截獲成像;若為否時,直接跳至 步驟25利用前述提及公式來進行截獲成像;接著至步驟 S26將截獲的成像與輻射紀錄儲存至資料庫;其次在步釋 S27中判斷截獲的成像是否成功;若不成功時,則跳至步 驟S23依照前述之步驟繼續進行截獲成像的動作;若成 功時,則跳回步驟S14實物成像,接著至步驟微進行 判斷,在步驟S28若確定成像資料與在步驟su的原始 成像資料雷同’直接跳至步驟S13控制影像資料晝面模 式來修正不同處而後至步驟S14實物成像;若經步驟犯8 判斷該成像資料與在步驟S13的原始成像資料影像資料 刀不同但需設定係數相同時,則跳至步驟S7重新截獲 影像資料;若經步驟S28判斷該成像資料與在步驟S13 ____ 第17頁 • 本紙張尺度舶躲咖 5 10 15 線 20 經濟部智慧財產局員工消費合作社印製 4 6 6|0? A7 I--------- 五、發明說明(u) 的原始成像f料的需設定係數皆不相同時,則跳至步驟SI f新設定再循環—次;藉此來精準呈現實物的成像。 如第六圖所示,在上述之紅外線熱影像偵測系統係可 設置於—工作平台4上,該工作平台4内可供容置電腦 5主機31,在其頂面更向上延伸一高台41及向前延伸一平 置板42 ’且在其之底部設置滑輪“,並在其之一侧垂直 組裝滑軌44。在該兩台之頂面411適於放置一顯示 螢幕32纟平置板42適於平置一鍵盤或滑鼠等控制元件 。在該滑軌44上適於組裝紅外線谓測裝置1,且該紅外 線偵測裝置1可在其上垂直上下移動。故利用該工作平 台4之滑輪43,使紅外線偵測裝置i可前後左右移動, 以及利用滑軌44使紅外伯測裝置i可上下移動,達到使 紅外線偵測裝置1可於三維空間移動之優點。"! 1 Order_ | [nn III 4 β 61 0 7 Α7 Β7 V. Description of the invention () φ ε (λ, τ) = τ〇J · L (person, τ batch Watts… formula 2 4ρ2 λ, where: Φβ = Radiant Flux Ad = Gain F = Infrared frequency τ〇 = Time interval 2. Analog signal set generated by the focus area array detector a 10 Printed by the Ministry of Intellectual Property Bureau Off-line Consumer Cooperative Since the analog signal set 11 generated by the focal plane array detector 13 is linear with the received radiant flux, the relationship between the two can be expressed by the following formula 3: v = R < l > eVo 〖t, " Equation 3 where: v = Detector Output 3. The analog signal set entering the analog-to-digital conversion circuit set module 15: Because the analog signal set has a level shift in the transmission process Occurred, and the amplifier circuit module 14 will gain gain to achieve the appropriate voltage level, so the analog signal to the digital conversion circuit collection module 15 and the electrical signal output by the original focus area array detector 13 The relationship is as follows: Indicate: V = G (V-v〇) volts.,. Formula 4 where ... V = analog-to-digital converter input (ADCIntput) v〇 = level offset value (Offset) 4 analog-to-digital conversion circuit Digital electrical signals output by assembly module 15: Digital analog output from analog-to-digital conversion circuit assembly module [5] Page 13 This paper applies the Zhongguanjia Standard (CNS) A4 specification (21Q x 297) 46610 7 A7 V. Description of the invention (11) The relationship between the signal and the input analog signal set is shown in the following formula 5: N = r (V + l) c〇unt… formula 5 where N = analog to digital conversion Output of the circuit assembly module (ADc 〇 said r = 4095 / 2Counts / Volt 5. Signal processing method of circuit set 2: After the infrared detection device is received at circuit set 2], use the formula above to calculate Appropriate gain and level shift coefficients are stored in the gain / level shift memory 23, so the gain multiplication unit 241 and the level shift unit 242 can be used directly on the circuit device 2 to perform gain amplification and level shift operations. Calculate the correct radiant flux and then normalize it After processing, it is sent to the control software in the host computer of the display device 3 so that different radiation fluxes display different colors, that is, different temperatures will display different colors, so watching the daylight surface on the display screen 32, you can know the proxy measurement The temperature distribution of the object, and the user can judge whether there is any abnormal temperature of the measured object such as the human body by watching the screen. 6. Compensation method of infrared detectors: As infrared thermal image detection systems used in medical applications are often set in a closed small space and the space is usually maintained at a fixed temperature (mostly in a ward at 2KC), Therefore, the radiant flux captured by the infrared lens group at this temperature in this space is first stored in this system as a reference, so the user only needs to directly capture the radiant flux of the object to be measured, and the captured The radiant flux will be compared and corrected with the pre-stored data and the coefficient corresponding to this specific environment, and the correct screen will be displayed on the display screen 32 to avoid the need for the user to type a large amount of setting data before use Shortcomings, to achieve the effect of simplifying the user's operation; ____ 苐〗 4 pages of this paper size applies to Chinese national standards (CNS > A4 specifications (210 X 297 Gong Chu 5) (Please read the precautions on the back before filling in this page: > 10 15 20 ^ -------- Orders 15-20 4 6 61 0 7 V. Description of the invention (u) In addition, in this embodiment, since infrared detection is used, Test device 1 captures the DUT Before the radiation flux, the light-shielding sheet of the infrared lens group u acts as the shielding lens 11 first to block the incidence of infrared rays, so that in the absence of infrared rays, a background day-time sampling is taken as background data, and after 5 Under the condition that the object to be measured and the light shielding plate are no longer blocked by infrared light, the radiation flux is then compared with the previous background data, so that the infrared detection cells in the focus plane array detector 13 In the case of different work efficiency (for example, some infrared detection cells respond differently to the same radiant flux 'that is, the R value of formula 3 is different)' can still display the data of the front broken frame 10. Please refer to the fifth figure, This is a flowchart of a preferred embodiment of the present invention. This embodiment is equipped with a software control so that real-time correction can still be made automatically at a specific temperature that has been set in advance to avoid difficult operation for medical personnel. First, although the infrared detection system starts After starting, enter the step, and command the focus area array detector 13 to enter the "IN" mode, that is, set the infrared price measuring device 1 and the circuit device 2 to be related, and the infrared The light shielding film of the lens group II is used to shield the lens u first to block the infrared rays from entering, so that without the infrared rays entering, a background day-plane sampling is taken as the background data first; then step S2 is performed to set the focus plane array detection Device 13 to Mid-Temp, which is a specific temperature such as 21β (:; secondly, step S3 is performed, corresponding to the set temperature Ti of the middle temperature and the output of the analog-to-digital conversion circuit collection module 15 The relationship between them, and then step ^ sends the original gain coefficient corresponding to the medium temperature to the gain query unit 241; further, step S5 is performed to calculate the original level corresponding to the medium temperature, ___ page 15 of this paper Standards are applicable to Chinese National Standards < CNS) A-4 ^ · ^; 4) < Read the notes on the back and fill out this page > ^ -------- Order ------- 哞. 4 6 61 0 7 A7 B7 Shellfish consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs Du V. Description of the invention (13) Offset coefficient to level shift unit 242; where steps S4 and S5 are to optimize the overall level shift , And then in step S6, write from the level shift unit 242 The gain is started from the gain to the gain / level shift memory 123. Then, step S7 uses the above-mentioned set coefficients to capture the frame (background data) of the medium temperature image data and the average value; skip to step S8 to use the frame s · (• 舁 exact level shift coefficient; secondly, step S9 transmits the level shift coefficient of the quasi-bee to the level shift unit 242; skip to step § 1 〇, and instruct the focus area array detector 13 to enter " output (〇ϋτ ) „Mode, that is, remove the light shielding sheet and start receiving infrared radiation from the outside (the object to be measured); skip to step S11 for direct image access (Direct Memory Access; DM) controller to perform image transmission for the image transmission method, To obtain faster transmission speed and better transmission efficiency; then in step S12 redraw the frame of the image data based on the input data image; and then in step S13, control the image data screen mode for display on the computer screen 32; skip to step S14 for Ufe Imagery 'to make the image daytime data display on the computer screen 32; then proceed to step S15 ·, and then order The focal plane array detector 13 enters the " IN "mode; then step S16 sets the focal plane array detector 13 to a high temperature (Hi-Temp), which is higher than the middle temperature of step S2; skip to step si7, when the focus area array detector 13 is set to a high temperature, the analog-to-digital conversion circuit collection module 15 is output to the digital calculation result at a high temperature; next, go to step S18 to set the focus area array detector 13 to a low temperature (L0). _Temp), the low temperature is lower than the intermediate temperature in step S2, and then intercept the digital calculation result of the analog-to-digital conversion circuit assembly module 15 at low temperature; ) A4 size coffee x Norong Chu j 5 10 15 20 --------_------- 4 (Please read the precautions for t and noodles before filling out this page) 4661 Ο 7 V. The invention says that (M) step s] 9, based on the digital calculation results of step s] 7 and step S18 to calculate an appropriate intermediate temperature between high and low temperature, and set the focus plane _ detector 13 to intermediate temperature, The value of the middle temperature may be different from the value of the middle temperature in step ⑵; then, go to step S20 to intercept the analogy The digital conversion circuit "Mod" 15 outputs the digital calculation result at this intermediate temperature; skip to Buchan S2 and corresponding calculation results to generate the correct temperature, and then go to step milk to command the focus area array detector 13 to switch to " output "mode; and in this embodiment, a hard disk 34 is used to store a database, and the database stores a plurality of data required for different environments, different temperatures and other conditions; in step S23, it is determined in step S23 Whether the signal output by the focus area array detector 13 in the milk is a ㈣ in the database; if so, skip to step S24 to take the setting data from the database to accelerate the imaging operation, and then proceed to step S25 to intercept Imaging; if not, skip to step 25 to intercept the imaging using the aforementioned formula; then go to step S26 to store the intercepted imaging and radiation records in the database; then judge whether the intercepted imaging is successful in step S27 ; If unsuccessful, skip to step S23 to continue the capturing and imaging operation according to the foregoing steps; if successful, skip back to step S14 to perform physical imaging, and then go to Step micro judgment is made. If it is determined in step S28 that the imaging data is the same as the original imaging data in step su, skip directly to step S13 to control the day-to-day mode of the image data to correct the differences and then go to step S14 to perform physical imaging. If the imaging data is different from the original imaging data in step S13 but the image data needs to be set to the same coefficient, skip to step S7 to recapture the image data; if the imaging data is judged in step S28 and in step S13 ____ page 17 • This Paper scales evading coffee 5 10 15 Line 20 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 6 6 | 0? A7 I --------- V. Original image of the invention description (u) If the set coefficients are not the same, skip to step SI f to set a new recirculation-time; this will accurately present the imaging of the real object. As shown in the sixth figure, the above-mentioned infrared thermal image detection system can be set on a work platform 4 which can accommodate a computer 5 host 31 and extend a high platform 41 on its top surface. And a flat plate 42 'is extended forward, and a pulley "is provided at the bottom thereof, and a slide rail 44 is vertically assembled on one side thereof. On the top surface 411 of the two units, a display screen 32 纟 flat plate 42 is placed. It is suitable for arranging a control element such as a keyboard or a mouse horizontally. An infrared measuring device 1 is suitable for assembling the slide rail 44, and the infrared detecting device 1 can be vertically moved up and down. Therefore, the working platform 4 is used. The pulley 43 enables the infrared detection device i to move forward, backward, left and right, and the slide rail 44 enables the infrared primary measurement device i to move up and down, thereby achieving the advantages of enabling the infrared detection device 1 to move in a three-dimensional space.

就上所述,本發明之紅外線偵測裝置確實具有以下之 15優點: N 1.精準度高: | 在人體溫度範圍内的溫度與熱輻射間的關係可 發明前面提及公式i及2來精準表示,故可解決以往無 法精準對應轉換熱輻射與溫度之間關係,再者,讓擷 20的影像資料與利用遮光片取得的背景資料與預先儲 系統内料溫度的參考資料作比較,以避免因部分^ 故障及外在溫度改變而導致的不正確影像, 比較,以達精準度高的優點。 ^ 夕-人 2.簡化操作: 第18頁 本紙張尺度適用中關家標準(CNS)A4規格(2IG χ 297公釐 I — — ——— — — — ----ml ^ilm—ί (請先閱讀背面之注意事項再填寫本頁) 46 6丨 ο 7 五、發明說叼(Ιό ) 利用控制放置本發明之密閉室在—特定溫度如211 ’且在本系統内直接儲存在此空間内該溫度下紅外線鏡 頭組11所擷取的輻射通量資料當作參考資料,與直接利 用對應此特定環境預先儲存之係數來轉換,讓醫療人員 5不需鍵入任何設定資料’僅需直接擷取待測物之熱輻射 即可,達到簡化操作之功效,且由於使用非冷卻式聚焦 面陣列偵測器13,故可直接在特定溫度下操作而不需冷 卻系統來降溫,使聚焦面陣列偵測器13的壽命可延伸。 3.組裝及更換方便: 10 在本實施例中,分別將放大電路模組14、類比至數 位轉換電路集合模組15'輸入/輸出電路集合模組16及 系統電源供應電路集合模組17模組化,相較習知將這些 電路作在同一電路板上,本發明在更換不同之紅外線鏡 頭組11及聚焦面陣列13時,只需抽換部分電路模組如 放大電路模組〗4,而習知卻必須將整塊電路板更換,故 本發明只需較低成本即可更換紅外線鏡頭組U或聚焦面 陣列偵測器13,對使用者而言,更符合經濟成本;此外 ,習知中必須定製特殊影像卡以進行所需影像處理如增 益、位階偏移等,使成本一直高居不下,而在本發明中 先行將影像處理以模組化成一 PC I的pc外接卡的電路裝 置2來處理,故可直接插置在一般電腦内使用,而不 更換影像卡,使成本大為下降 4.成本下降: 如前所述’分別將放大電路模組14、類比至數位轉 _ 第19頁 本紙張尺度適用中關家標準(CNS)A4規格(210 X 297公釐〉 15 20 需 (請先閱讀背面之注意事項再填寫本頁) U--------^-!-------線 4 661 0 7 五、發明說明(17 ) 換電路集合模組15、輸入/輸出電路集合模組16及系統 電源供應電路集合模組17模組化,使更換組件時的所需 成本下降,與將電路裝置2模組化,以避免訂製特殊影 像卡所費不貲,且由於電路裝置2可利用燒錄不同環境 5下資料,來達到可適用不同環境之功效,所以電路裝置2 可大ϊ製造以降低成本,僅需在出廠前燒錄所輸的資料 即可,故本發明確實有降低成本之優點。 / 綜上所述,本發明之『紅外線熱影像偵測系統』,確 能藉上述所揭露之構造、裝置,達到預期之目的與功效 10 ,且申睛别未見於刊物亦未公開使用,符合發明專利之 新穎、進步等要件。 惟,上述所揭之圖式及說明,僅為本發明之實施例 而已,非為限定本發明之實施;大凡熟悉該項技藝之人 仕,其所依本發明之特徵範疇,所作之其他等效變化或 15修飾,皆應涵蓋在以下本案之申請專利範圍内。 -J------------1------線 (猜先閲請背面之注項再填寫本頁) 經濟部智慧財產局員工消费合作社印製As mentioned above, the infrared detection device of the present invention does have the following 15 advantages: N 1. High accuracy: | The relationship between temperature and thermal radiation in the human body temperature range can be invented by the aforementioned formulas i and 2 Accurate representation, so it can solve the relationship between the conversion of thermal radiation and temperature that could not be accurately corresponded in the past. Furthermore, compare the image data of the captured 20 with the background data obtained by using the light shield and the reference data of the material temperature in the storage system in advance. Avoid incorrect images caused by partial failures and external temperature changes, and compare them to achieve the advantage of high accuracy. ^ Xi-ren 2. Simplified operation: page 18 This paper is applicable to the Zhongguanjia Standard (CNS) A4 specification (2IG χ 297 mm I — — — — — — — ---- ml ^ ilm—ί ( Please read the precautions on the back before filling in this page) 46 6 丨 ο 7 V. Invention 叼 (Ιό) Use the control to place the enclosed room of the invention at a specific temperature such as 211 'and store it directly in this space in this system The radiation flux data captured by the infrared lens group 11 at this temperature is used as reference data, and is directly converted by using the coefficients stored in advance corresponding to this specific environment, so that the medical staff 5 does not need to enter any setting data. The thermal radiation of the object to be measured can be obtained to achieve the effect of simplifying the operation, and because the uncooled focusing surface array detector 13 is used, it can be directly operated at a specific temperature without cooling the system to cool down, so that the focusing surface array The life of the detector 13 can be extended. 3. Easy to assemble and replace: 10 In this embodiment, the amplifier circuit module 14, the analog to digital conversion circuit assembly module 15 ', the input / output circuit assembly module 16 and System power supply The circuit assembly module 17 is modularized. Compared with the conventional circuit boards, these circuits are used on the same circuit board. When replacing different infrared lens groups 11 and focusing surface arrays 13 in the present invention, only a part of the circuit modules need to be replaced, such as magnification. Circuit module] 4, but the conventional circuit board must be replaced, so the present invention can replace the infrared lens group U or the focus plane array detector 13 at a lower cost, which is more consistent for the user. Economic cost; In addition, it is necessary to customize a special image card to perform the required image processing such as gain, level shift, etc., so that the cost is always high. In the present invention, the image processing is first modularized into a PC I. PC external card circuit device 2 for processing, so it can be directly inserted into a general computer without replacing the video card, which greatly reduces the cost. 4. Cost reduction: As described above, 'the amplifier circuit module 14 will be separately amplified. 、 Analog to digital transfer_ page 19 This paper size applies the Zhongguanjia Standard (CNS) A4 specification (210 X 297 mm> 15 20 required) (Please read the precautions on the back before filling this page) U ---- ---- ^-! ------- line 4 661 0 7 V. Description of the invention (17) Modularization of the circuit assembly module 15, the input / output circuit assembly module 16, and the system power supply circuit assembly module 17 are modularized, which reduces the required cost when replacing components, and reduces the circuit device 2 Modularization to avoid the inconvenience of ordering special video cards, and because the circuit device 2 can use the data in different environments 5 to achieve the effect of adapting to different environments, the circuit device 2 can be manufactured to reduce costs It is only necessary to burn the inputted data before leaving the factory, so the present invention does have the advantage of reducing costs. / In summary, the "infrared thermal image detection system" of the present invention can indeed use the information disclosed above. The structure and device achieve the expected purpose and efficacy10, and Shen Jingbei has not been seen in publications or used publicly, which meets the requirements of novelty and progress of invention patents. However, the figures and descriptions disclosed above are only examples of the present invention, and are not intended to limit the implementation of the present invention. Anyone who is familiar with the technology, based on the features and scope of the present invention, etc. Effective changes or 15 modifications should be covered by the scope of patent application in the following case. -J ------------ 1 ------ line (guess first read the note on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

Claims (1)

4 6 61 0 7 A8 B8 C8 D8 15 經濟部智慧財產局員工消費合作社印製 20 、申請專利範圍 18 紅外線熱影像偵測系統,係包括有: 对卜線偵’則裝置,用以偵測一待測物的輻射量且對應 射量產生—數位電訊*; . έ電路裝置’以依據'特定操作環境下所預先設定係數及 、,工外線偵測器之輸出訊號,對該電訊號作增益及位階 處理並形成對應該待測物之輻射量的圖框資料一 及 顯不裝置,用以接收上碟該電路裝置之圖框資料並顯 示於該顯示裝置。 , 2」申明專利㈣第丨項所述之紅外線熱料制系統 ’其中該紅外線偵測裝置係包括: 一紅外線鏡頭組,用以蒐集入射之紅外線; _非冷卻式聚焦面陣冽偵測器,係包含多數個紅外線偵 測胞,各該紅外線偵測胞係用以接收各該對應方向入 射之紅外線輻射量產生一類比電訊號,以形成一類比 電訊號集合; , 一類比至數位轉換電路集合模組,甩以將上述聚焦面陣 列偵測器所輸出的類比電訊號集合轉換成數位電訊號 ;及 ° 一輸入/輸出電路集合模組,用以使上述類比至數位轉 換電路的數位電訊號經該電路集合輸出β 3,如申請專利範圍第2項所述之紅外線熱影像伯測系統 ’其中該紅外線偵測裝置之紅外線鏡頭組更包括有二慮 光片,用以供適當波長紅外線通過。 Λ ί裝J J (請先閲讀背面之注意f項再填寫本^) -線- 本紙張尺度適用中國國家標準(CNS > A4規格(210X297#趣1 f 4661 0 7 A8 B8 C8 D8 經濟部智慧財產局員工消费合作社印製 六、申請專利範園 19 1如申請專利範圍第2或3項所述之紅外線熱影像價測 系統,其中紅外線偵測裝置更包括一熱電致冷器,用以 冷卻該聚焦面陣列偵測器於適當的溫度《 5. 如申請專利範圍第2或3項所述之紅外線熱影像偵測 5 系統,其中該紅外線偵測裝置更包括一放大電路模組, 用以放大該聚焦面陣列偵測器所輸出的類比電訊號集合 至該類比至數位轉換電路模組。 6. 如申請專利範圍第2項所述之紅外線熱影像偵測系統 ’其中該紅外線偵測裝置之紅外線鏡頭組更包括一遮光 10 片,以配合紅外線入射校準使用。 7. 如申請專利範圍第1項所述之紅外線熱影像偵測系統 ,其中該電路裝置,係包括: 一傳輸線路’係連接上述紅外線偵測裝置,用以傳輸該 數位電訊號; 15 —增益/位階偏移記憶體’用以儲存數組增益及位階偏 移之係數; 一訊號處理電路·>用以接收上述傳輸線路所輸入數位電 訊號’並自上述增益/位階偏移記憶體擷取所須之係 數對該數位電訊號作適當處理而輸出一 PCi圖框資料 20 ; 一 PCI介面,用以將收上述訊故處理電路之pci圖框資 料;及 一 PC I匯流排’用以接收上述PC I介面之pc;[圖框資料 並輸出至上述顯示裝置。 本紙張尺度適用中囷囷家揉率(CNS ) A4規格(21〇><297^髮今 (诸先閲讀背面之注意事項再填寫本页) •裝' 訂' 線 • 1^1 —^14 6 61 0 7 A8 B8 C8 D8 15 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20, patent application scope 18 Infrared thermal image detection system, which includes: Radiation quantity of the object to be measured and corresponding radiation quantity generation-digital telecommunications *;. The circuit device 'according to the preset coefficients and the output signal of the external line detector in the specific operating environment, the gain of the electrical signal And level processing to form the frame data corresponding to the radiation quantity of the object to be tested, and a display device, which is used to receive the frame data of the circuit device on the disk and display it on the display device. "2" declares that the infrared hot material manufacturing system described in Patent ㈣ Item 丨 wherein the infrared detection device includes: an infrared lens group for collecting incident infrared rays; _ uncooled focusing area array detector The system includes a plurality of infrared detection cells, and each of the infrared detection cells is used to receive the amount of infrared radiation incident in the corresponding direction to generate an analog electrical signal to form an analog electrical signal set; an analog-to-digital conversion circuit Aggregate module to convert the analog electrical signal set output by the above-mentioned focus area array detector into a digital electrical signal; and an input / output circuit assembly module to enable the digital telecommunication of the analog-to-digital conversion circuit described above No. 3 is output through the circuit set, such as the infrared thermal imaging primary measurement system described in item 2 of the scope of the patent application, where the infrared lens set of the infrared detection device further includes an infrared light sheet for an infrared of an appropriate wavelength. by. Λ ί installed JJ (please read the note f on the back before filling in this ^) -line-This paper size applies to Chinese national standards (CNS > A4 specifications (210X297 # 趣 1 f 4661 0 7 A8 B8 C8 D8 Ministry of Economy Wisdom Printed by the Consumer Cooperative of the Property Bureau VI. Patent Application Fanyuan 19 1 The infrared thermal image price measurement system described in item 2 or 3 of the patent application scope, in which the infrared detection device further includes a thermoelectric cooler for cooling The focusing surface array detector is at an appropriate temperature. 5. The infrared thermal image detection 5 system described in item 2 or 3 of the scope of patent application, wherein the infrared detection device further includes an amplifying circuit module for Amplify the set of analog electrical signals output by the focus area array detector to the analog-to-digital conversion circuit module. 6. The infrared thermal image detection system described in item 2 of the patent application scope, wherein the infrared detection device The infrared lens group also includes a light-shielding 10 pieces for infrared incident calibration. 7. The infrared thermal image detection system described in the first item of the patent application scope, wherein the circuit device is Including: A transmission line 'is connected to the above infrared detection device for transmitting the digital electric signal; 15 —Gain / level shift memory' is used to store the coefficients of array gain and level shift; a signal processing circuit · > Used to receive the digital signal input from the transmission line 'and retrieve the coefficients required from the above-mentioned gain / level offset memory to properly process the digital signal to output a PCi frame data 20; a PCI interface, It is used to collect the pci picture frame data of the above-mentioned processing circuit; and a PC I bus' for receiving the pc of the above PC I interface; [picture frame data and output to the above display device. This paper standard is applicable. Home kneading rate (CNS) A4 specification (21〇 > < 297 ^ fat (read the precautions on the back before filling out this page) • Install the 'Order' line • 1 ^ 1 — ^ 1 4 6 610 7 ------- __ 、申請專利範圍 20 士申吻專利範圍第7項所述之紅外線熱影像偵測系統 ,其中該電路裝置之訊號處理電路係包括: 心益乘法單元,係連接上述傳輸線路,並自上述增益 /位階偏移記憶體擷取一增益係數而增益自該傳輸線 路所輪入之數位電訊號; 一位階偏移單元,係連接上述增益/位階偏移記憶體及 增益乘法單元,用以自該增益/位階偏移記憶體擷取 一位階偏移係數而對經_增益乘法單元增益之數位電 訊嬈進行位階偏移並形成一影像訊號輸出;及 —介面電路,係連接上述位階偏移單元,並規格化自該 位階偏移單元之影像訊號而形成PCI圊框資料而輸出 至上述PCI介面。 9·如申請專利範圍第8項所述之紅外線熱影像偵測系統 ’其中該電路裝置更包括一 PCI圖框資料儲存單元,係 連接上述位階偏移單元及介面電路,用以暫存多個pci 10·如申請專利範圍為第1項所述之紅外,其 中該電路裝置係模組化為一外接卡。 11·如申請專利範圍第1項所述之紅外線熱影像偵測系統 ’更包括一工作平台以放置該顯示裝置,且該工作平台 之一側直立組裝一滑軌,俾使該紅外線偵測裝置適於藉 該滑執上下移動。 12·如申請寻利範圍第11項所述之紅外線熱影像债測系 統’其f該工作平台之底部裝設滑輪,以利於該工作平 本紙張中賴家制t ( CNS )纟4絲(210X 297屢一 --- (詩先閲绩背面之注意事項再填寫本頁) 10 15 '訂. 線 經濟部智慧財產局員工消費合作社印製 20 6 6 4 ο ABCD 々、申請專利範圍 21台之移動。 ----------裝— (請先閲讀背面之注意事項再填寫本頁) 線 經濟部智慧財產局員工消費合作社印製 本 I國 國 -中 I用 .ii CN /1* 準 標 A BT # :办 97 2 X4 6 610 7 ------- __, patent application scope 20 The infrared thermal image detection system described in item 7 of the Shi Shen kiss patent scope, wherein the signal processing circuit of the circuit device includes: Xinyi multiplication unit Is connected to the above transmission line, and a gain coefficient is retrieved from the above-mentioned gain / level offset memory, and the gain is a digital electric signal rotated by the transmission line; a first-order offset unit is connected to the above-mentioned gain / level offset A memory and a gain multiplying unit for extracting a first-order offset coefficient from the gain / level-shifting memory to perform a level-shifting of the digital telecommunication signal that is gained by the _gain multiplying unit and form an image signal output; The interface circuit is connected to the above-mentioned level shift unit, and normalizes the image signal from the level shift unit to form PCI frame data and outputs it to the above PCI interface. 9. The infrared thermal image detection system according to item 8 of the scope of the patent application, wherein the circuit device further includes a PCI frame data storage unit, which is connected to the above-mentioned level shift unit and interface circuit for temporarily storing multiple pci 10 · The infrared range as described in the first patent application, wherein the circuit device is modularized as an external card. 11. The infrared thermal image detection system described in item 1 of the scope of the patent application, further includes a work platform to place the display device, and one side of the work platform is assembled with a slide rail upright to enable the infrared detection device. Suitable for moving up and down by this slider. 12. The infrared thermal imaging debt measurement system as described in item 11 of the application for profit-seeking scope ', which is equipped with a pulley at the bottom of the working platform to facilitate the home-made t (CNS) 纟 4 wire in the working paper. 210X 297 repeated one --- (Notes on the back of the poem before reading the results and then fill out this page) 10 15 'Order. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Online Economics 20 6 6 4 ο ABCD 々, 21 patent applications ---------- Install— (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Online Economy / 1 * Standard A BT #: Office 97 2 X
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11543297B2 (en) 2019-07-19 2023-01-03 Industrial Technology Research Institute Sensing devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11543297B2 (en) 2019-07-19 2023-01-03 Industrial Technology Research Institute Sensing devices

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