TW460994B

TW460994B - Packaging structure of the image sensor chip and method for packaging thereof

Info

Publication number: TW460994B
Application number: TW89124336A
Authority: TW
Inventors: Meng-Nan He; Shiou-Wen Du; Ching-Shuei Jeng; Li-Huan Chen; Fu-Jou Liou
Original assignee: Kingpak Tech Inc
Priority date: 2000-11-16
Filing date: 2000-11-16
Publication date: 2001-10-21

Abstract

The present invention provides a packaging structure of the image sensor chip and a method for packaging thereof, which comprises a substrate, the substrate consists of a plurality of linearly arranged metal sheets and the gel sealing said plurality of the metal sheets. A first surface and a second surface are formed on the substrate, and said metal sheets expose from the first surface and the second surface; a chip is set up on the substrate; a plurality of leads are respectively electrically connected to the chip and the substrate in order that the chip and the substrate are electrically connected. A transparent layer is set up on the chip, thus a packaging structure of the image sensor of the substrate made of plastics is formed to simplify the package process and reduce the production cost.

Description

460994460994

五、發明說明（1) 本發明為一種影像减θ 土法，特別係於一链^ 阳片.之封裝結構及其封裝方材具有金屬】I1用塑膠體形成承載晶片之基材及該基 ^者屬片接_之封裝結構1其製造時可降低生產成係以陶磁：j m:^ 了達到散熱及高密封性之需求，置於基板上，；目ΐ導通之〔型接腳，*晶片腳，而後以透光玻璃、罢於曰=片與該基板上表面之接之接腳與電路板形成電連接。土伋卜表面此種以陶磁材料作為影像成測曰gλ. 型時，必狺、、*立险乂丨豕a成1日日片之基板，其加工成 /主恩陶磁材料成份之選擇以及加工、、w择& 4 制，若其選擇或控制不當，將造度的控者，該陶磁基板結構盖ς 成該基板變形或龜裂。再造’無法進行大量生$告甘以致於製造時必須單顆製再者，其生產成本相當的㉟。 , ;“土板下表面之接腳係用以電連接於啻此’該接腳必須形成較平整之電路 ΐ反：電！板之電連接。然而，習知之接腳係=影響基—形成C字形散，以作為基板上、下表面之冲^之方其不易_得到較為平整之_接_ ” ，是以，號傳遞。w之接腳，而影響到影像感測晶片之訊以55亥〔型接腳所形成之電訊號傳遞距離較* 以，亦影響晶片至基板之訊號傳遞。雖車又長，是V. Description of the invention (1) The present invention is an image reduction θ earth method, which is particularly related to a chain ^ positive film. The packaging structure and its packaging square material have metal] I1 uses a plastic body to form the substrate of the carrier wafer and the substrate. ^ It is a package structure of chip connection_1 When it is manufactured, it can reduce the production to ceramic magnetism: jm: ^ It is placed on the substrate to meet the requirements of heat dissipation and high sealability; the [type pin, * The chip pins are then electrically connected to the circuit board by light-transmitting glass, and the pins connected to the upper surface of the substrate. This type of ceramic surface is used to measure the gλ. Type on the surface of the soil, and it must be used as a substrate for 1 day. It is processed into the main component of the ceramic material and the choice of the ceramic material. If it is not properly selected or controlled, it will cover the ceramic substrate structure to deform or crack the substrate. Recycling ’ca n’t produce a lot of money, so that it must be manufactured individually at the time of manufacture, and its production cost is quite high. , "The pins on the lower surface of the soil plate are used for electrical connection. This pin must form a flatter circuit. Opposite: electricity! Electrical connection of the plate. However, the conventional pin system = influence base-formation C-shaped scatter, it is difficult to _ get a more flat _ connection _ ”as the impact of the upper and lower surfaces of the substrate, and it is transmitted with,. w pin, which affects the signal of the image sensing chip. The transmission distance of the electrical signal formed by the 55-type pin is longer than *, and it also affects the signal transmission from the chip to the substrate. Although the car is long, yes

460994 五、發明說明（2) 有鑑於此，發明人本於精益求精、創新突破之精神，研發出本發明影像感測晶片之封裝結構及其方法，其可降低生產成本，並提高晶片訊號之傳遞。本發明之主要目的，在於提供一種影像感測晶片之封裝結構及其方法，其具有大量生產之功效，以違到降低生產成本之目的。本發明之另一目的，在於提供一種影像感測晶片之封裝結構及其方法，其具有縮短晶片訊號傳遞之距離，以達到較佳訊號傳遞之目的。是以，為達上述之目的，本發明之特徵在於包括有一 f 基材，該基材係由多數個相互排列之金屬片及將該多數個金屬片封密之膠體所組成，使該基材形成一第一表面及第二表面，而該等金屬片分別由該第一表面及該第二表面露出，以形成一第一接點及一第二接點；一晶片係設於該基材之第一表面上，具有複數個焊墊；複數個導線分別電連 •接於該晶片之焊墊與基材之第一表面之第一接點上，使該晶片與基材形成電性連接，並將晶片之電訊號傳遞至基材之第二表面之第二接點上；一透光層係設於晶片上。如是，該金屬片所形成之第二接點可平整地與電路板 .. 電連接，且亦可有效縮短晶片與電路板訊號傳遞之距離，（: 以得到較佳之訊號傳遞。再者，以膠體封密金屬片所形成之基板，可將基板予以裁切，是以，可以灌模之方式大量製造，以降低生產成本。為使貴審查委員進一步瞭解本發明之創作目的與特460994 V. Description of the invention (2) In view of this, the inventor has developed the packaging structure and method of the image sensing chip of the present invention based on the spirit of excellence, innovation and breakthrough, which can reduce the production cost and improve the transmission of chip signals . The main object of the present invention is to provide a packaging structure and method for an image sensing wafer, which has the effect of mass production, so as to defeat the purpose of reducing the production cost. Another object of the present invention is to provide a packaging structure and method for an image sensing chip, which has the advantage of shortening the distance of signal transmission of the chip to achieve better signal transmission. Therefore, in order to achieve the above-mentioned object, the present invention is characterized in that it includes an f substrate, which is composed of a plurality of metal sheets aligned with each other and a colloid sealing the plurality of metal sheets, so that the substrate A first surface and a second surface are formed, and the metal sheets are exposed from the first surface and the second surface, respectively, to form a first contact and a second contact; a wafer is disposed on the substrate The first surface has a plurality of bonding pads; the plurality of wires are electrically connected respectively to the first contact of the bonding pad of the wafer and the first surface of the substrate, so that the wafer and the substrate form an electrical connection. And transmitting the electrical signal of the wafer to the second contact on the second surface of the substrate; a light transmitting layer is disposed on the wafer. If so, the second contact formed by the metal sheet can be electrically connected to the circuit board flatly, and can also effectively shorten the signal transmission distance between the chip and the circuit board, (: to get better signal transmission. Furthermore, to The substrate formed by the colloid-sealed metal sheet can be cut, and it can be mass-produced in a way that can be cast to reduce the production cost. In order to make your reviewers better understand the creative purpose and characteristics of the present invention

第6頁 460994Page 6 460994

460994 五、發明說明（4) 一 ~~ "—---- 曰曰片12係黏設於基材1〇之第—表面2〇的凹槽μ内，其上具有複數個焊墊（bond pad)34 ’用以藉由導線15與美 1 〇形成電連接。複數個導線1 5以打線之方式分別電連接於晶片丨2之焊墊（bond pad) 34與基材10之第一表面2〇之第一接點26上J 使晶片1 2與基材1 〇之第一表面20的第—接點26形成電性連接’而可將晶片1 2之電訊號傳遞至基材丨〇之第二表面22之第二接點28上，使基板1〇藉由第二接點28與電路板（圖未顯示）電連接。由於金屬片1 6為一薄片，因此，第一接點 2 6與弟_ .接點2 8之傳遞距離相當.短可有效地將晶片1 2之訊號傳遞至第二接點28 ’且晶片1 2 ▲ —平整之薄片，當基（材10固定於電路板（圖未顯示）時，晶片12可有效地與電^ 板（圖未顯示）電接觸。. 透光層14為一透光玻璃，係設於基材之第一表面2〇的凸緣3 0上，將晶片1 2覆蓋住，使晶片1 2得以接收光訊號’以形成一影像感測晶片。請參閱圖四，基材1 0之凸緣3 0係黏著於基材丨〇上，使基材1 0形成一用以容置晶片1 2之凹槽3 2，而透光層1 4則黏著於凸緣30上，使晶片1 2得以接收光訊號。本發明影像感測晶片之封裝方法，首先提供一具有多（數個相互排列之金屬片1 6及將多數個金屬片.j 6封密之膠體 1 8所組成基材1 〇，使基材1 〇开》成有—第—表面2 〇及一第二表面22，而金屬片16則由第一表面20及第二表面22露出，以形成一第一接點26與第二接點28。將凸緣30設於基板10460994 V. Description of the invention (4) A ~~ " ------ The sheet 12 is glued in the groove μ of the first surface 20 of the substrate 10, and has a plurality of pads ( A bond pad 34 ′ is used to form an electrical connection with the United States 10 through a wire 15. The plurality of wires 15 are electrically connected to the bond pad 34 of the wafer 2 and the first contact 26 of the first surface 20 of the substrate 10 by wire bonding. The wafer 12 and the substrate 1 are electrically connected. The first contact 20 of the first surface 20 forms an electrical connection, and the electrical signal of the chip 12 can be transmitted to the second contact 28 of the second surface 22 of the substrate, so that the substrate 10 can be borrowed. The second contact 28 is electrically connected to a circuit board (not shown). Because the metal piece 16 is a thin sheet, the transmission distance between the first contact 26 and the brother _. Contact 28 is equivalent. The short signal can effectively transmit the signal of the chip 12 to the second contact 28 'and the chip 1 2 ▲ —Flat sheet, when the substrate 10 is fixed on the circuit board (not shown), the wafer 12 can effectively make electrical contact with the electric board (not shown). The light-transmitting layer 14 is a light-transmitting The glass is arranged on the flange 30 of the first surface 20 of the substrate, and covers the wafer 12 so that the wafer 12 can receive the light signal 'to form an image sensing wafer. Please refer to FIG. The flange 30 of the material 10 is adhered to the substrate 10, so that the substrate 10 forms a groove 32 for receiving the wafer 12, and the light-transmitting layer 14 is adhered to the flange 30. So that the wafer 12 can receive the light signal. The packaging method of the image sensing wafer of the present invention firstly provides a colloid 1 8 having a plurality of (a plurality of mutually arranged metal pieces 16 and a plurality of metal pieces sealed. J 6). The base material 10 is composed, so that the base material 10 has a first surface 20 and a second surface 22, and the metal sheet 16 is composed of the first surface 20 and the second surface. 22 is exposed, to form a first contact 26 and second contact 28. The flange 30 is provided on the substrate 10

第8頁 460994 五、發明說明（5) - 之第一表面2 0上’使基板1 〇形成有一用以容置晶片1 2之凹槽3 2 ’而後將晶片1 2置入凹槽3 2内，並以導線1 5連接於晶片1 2之焊塾3 4與基板1 〇之第一接點2 6，使晶片1 2與基板1 〇形成電連接，而將晶片1 2之訊號傳遞至基板丨〇之第二接點 28，使基板10之第二接點28可與電路板（圖未顯示）電接觸。而後將透光層14黏設於基材1〇之第—表面2〇的凸緣3〇上’將晶片12覆蓋住，使晶片12得以接收光訊號，以形成一影像感測器。藉如上之封裝結構及封裝方法，本發明具有如下之優點，， 1.基材10藉由薄的金屬片16將晶片U之訊號傳遞至電路 t。可獲传車父之傳遞距離’而具有較佳之訊號傳遞效金屬片16具有平整之表面，可與電路板形成較佳之電接觸效果。低〜取权 3. 由於塑膠材質之基材1〇於而造多數個基材，再予以裁切^裁切因而可同時灌模製这声椒-Τ- ^再予裁切成早顆之基材，因此，：yL f造通度陕，可降低生產成本。八i& 4. 塑膠材質製成之基材1〇，复_ 太險使封裝成本大為降低。”原枓成本較陶磁材料低，可法確ΐΐ以,ΐ說明，本發明影像感測晶片之封裝社構及方其:r::r，而具有新穎性== 專利性權，實感德便。〜予審查’並早曰核予本發明之Page 8 460994 V. Description of the invention (5)-On the first surface 20, 'the substrate 10 is formed with a groove 3 2 for accommodating the wafer 12, and then the wafer 1 2 is placed in the groove 3 2 Inside, and is connected to the solder joint 34 of the wafer 12 with the wire 15 and the first contact 26 of the substrate 10, so that the wafer 12 and the substrate 10 are electrically connected, and the signal of the wafer 12 is transmitted to The second contact 28 of the substrate 10 allows the second contact 28 of the substrate 10 to be in electrical contact with a circuit board (not shown). Then, the light-transmitting layer 14 is adhered on the flange 30 of the first surface 20 of the substrate 10 'to cover the wafer 12 so that the wafer 12 can receive a light signal to form an image sensor. With the above packaging structure and packaging method, the present invention has the following advantages. 1. The substrate 10 transmits the signal of the chip U to the circuit t through the thin metal sheet 16. It can obtain the transmission distance of the driver ’s seat and has better signal transmission effect. The metal piece 16 has a flat surface and can form a better electrical contact effect with the circuit board. Low ~ take the right 3. Because the plastic material base material 10 is used to make a large number of base materials, and then cut ^ cutting, so this pepper -T- ^ can be cast into early pieces at the same time The base material, therefore: yL f can make a thorough understanding of Shaanxi, which can reduce production costs.八 i & 4. Base material made of plastic material 10, complex _ Too dangerous, greatly reducing packaging costs. "The original cost is lower than that of ceramic magnetic materials. It can be confirmed that the packaging structure and method of the image sensing chip of the present invention are: r :: r, and it has novelty == patentability. . ~ Reviewed and approved the invention

460994460994

第10頁 / 460994Page 10 of 460994

圖式簡單說明圖為本發明影像感測 B 曰曰片之封裝結構的剖視圖〇圖二為本發明影像感測晶片之封裝方法的第- -示意圖圖二為本發明影像感測晶片之基材的立體圖c ) 圖四為本發明影像感測晶片之封裝方法的第二二示意圖圖號說明基材 10 凸緣 30 晶片 12 凹槽 32 透光層 14 焊墊 3 4 導線 15 金屬片 16 膠體 18 第一— 表面 20 第一— 表面 22 膠帶 24 第 ——— 接點 26 第 W·" 接點 28Brief description of the figure The figure is a cross-sectional view of the packaging structure of the image sensing chip B of the present invention. Figure 2 is a schematic diagram of the method of packaging the image sensing chip of the present invention.-Figure 2 is a substrate of the image sensing chip of the present invention. Perspective view c) Figure 4 is the second and second schematic diagram of the packaging method of the image sensing chip of the present invention. The figure illustrates the substrate 10 flange 30 wafer 12 groove 32 light transmitting layer 14 solder pad 3 wire 15 metal sheet 16 colloid 18 First — Surface 20 First — Surface 22 Tape 24 — — Contact 26 # W · " Contact 28

Claims

460994 六、申請專利範圍 1 · 一種影像感測晶片之封裝結構，其包括有；一基材’該基材係由多數個相互排列之金屬片及將該多數個金屬片封密之膠體所組成，使該基材形成一第一表面及第二表面，而該等金屬片分別由該第一表面及該第二表面露出’以形成一第一接點及·—第二接點，而該基材之第一表面周邊設有凸緣，使該基材形成有一凹槽；一晶片係設於該基材的凹槽内上，其上具有複數個焊墊；複數個導線分別電連接於該晶片之焊墊與基材之第一表面之第一接點上，使該晶片與基材形成電性連接，並將晶片之電訊號傳遞至該基材之第二表面今第二接點上；一透光層係設於該基材之第~表面的凸緣上，使該晶片得以接收光訊號。 2. 如申請專利範圍第1項所述之影像感測晶片之封裝結構’其中e亥f貪體為ί辰氧化塑膠混合物（E p 〇 χ y Μ 〇 1 d Compound)、BT、FR4、FR5 或PPE 等塑膠材質。 3. 如申请專利範圍第i項所述之影像感測晶片之封裝結構’其中該等金屬片為平整之金屬片。 4. 如申請專利範圍第！項所述之影像感測晶片之封裝結構，其中s玄等金屬線係以打線（wi r e b〇ndi ng )之方式與晶片之焊墊及基材之第一接點連接。 5. 如申請專利範圍第i項所述之影像感測晶片之封裝結構’其中該透光層為一透光玻璃。 6· 一種影像感測晶片之封裝方法，其包括下列步驟； a.提供一基材，該基材具有複數個金屬片及用以包覆該等460994 VI. Scope of patent application 1. A packaging structure for an image sensing chip, which includes: a substrate 'the substrate is composed of a plurality of metal sheets arranged in parallel with each other and a colloid sealing the plurality of metal sheets. So that the substrate forms a first surface and a second surface, and the metal pieces are exposed from the first surface and the second surface, respectively, to form a first contact and a second contact, and the A flange is provided on the periphery of the first surface of the base material, so that the base material is formed with a groove; a wafer is arranged in the groove of the base material, and has a plurality of solder pads thereon; At the first contact between the pad of the wafer and the first surface of the substrate, the wafer is electrically connected to the substrate, and the electrical signal of the wafer is transmitted to the second contact of the second surface of the substrate. A light-transmitting layer is arranged on the flange on the first surface of the substrate, so that the chip can receive light signals. 2. The packaging structure of the image sensing chip as described in item 1 of the scope of the application for patents, wherein the body is an oxidized plastic compound (E p 〇χ y 〇〇 1 d Compound), BT, FR4, FR5 Or plastic materials such as PPE. 3. The packaging structure of the image sensing chip as described in item i of the patent application scope, wherein the metal sheets are flat metal sheets. 4. If the scope of patent application is the first! The packaging structure of the image sensing chip described in the above item, wherein the metal wires such as s-xuan are connected to the pads of the wafer and the first contact of the substrate by means of wiring (wi r ebondng). 5. The packaging structure of the image sensing chip as described in item i of the patent application range, wherein the transparent layer is a transparent glass. 6. · A method for packaging an image sensing chip, comprising the following steps: a. Providing a substrate, the substrate has a plurality of metal sheets and is used to cover the

460994 六、申請專利範圍金屬片之膠體，使該基材形成一第一表面及一第二表面’ 該金屬片則分別由該第一表面及第二表面露出，以形成一第一接點及一第二接點，而該基材之第一表面周邊設有凸緣’使基材形成一凹槽；將設有複數個焊墊之晶片固著於該基材之第一表面的四槽内；將複數個導線連接於該晶片之焊塾與基材之第一表面之第一接點上；將透光層設置於基板之第/表面的凸緣上，而將晶片覆蓋 .住。 „ 7. 如申請專利範圍第6項所述之影像感測晶片之封裝方法’其中該等金屬片係黏設於一膠帶（tape)上，再將該膠體封住該等金屬片，以形成該基材，而後將膠帶（tape )予以撕除。 8. 如申請專利範圍第6項所述之影像感測晶片之封裝方法，其中該膠體為環氧化塑膠混合物·（ Epoxy Mold Compound)、BT、FR4、FR5 或PPE 等塑膠材質。 9 ·如申請專利範圍第6項所述之影像感測晶片之封裝方法’其中該專金屬線係以打線（w i r e b 〇 n d i n g)方式與晶片之焊墊及基材之第一接點連接。 1 0 ·如申請專利範圍第6項所述之影像感測晶片之封裝方法’其中該透光層為一透光玻璃。 11.如申請專利範圍第6項所述之影像感測晶片之封裝方法 ’其中該基板與該凸緣係黏著於基材之第一表面上。460994 VI. Colloid of metal sheet for patent application, so that the substrate forms a first surface and a second surface. The metal sheet is exposed from the first surface and the second surface, respectively, to form a first contact and A second contact, and a flange is provided on the periphery of the first surface of the substrate so that the substrate forms a groove; a wafer provided with a plurality of pads is fixed to four slots on the first surface of the substrate Inside; connecting a plurality of wires to the first contact between the solder pad of the wafer and the first surface of the substrate; setting the light-transmitting layer on a flange on the / face of the substrate, and covering the wafer. „7. The method for packaging an image sensing chip as described in item 6 of the scope of patent application ', wherein the metal sheets are adhered to a tape, and the colloid is used to seal the metal sheets to form The substrate is then stripped of tape. 8. The method for packaging an image sensing chip as described in item 6 of the scope of patent application, wherein the colloid is an epoxy mold compound, (BT) , FR4, FR5 or PPE, etc. 9 · The packaging method of the image sensing chip as described in item 6 of the scope of the patent application ', where the special metal wire is wired with the solder pad of the chip and The first contact of the base material is connected. 1 0. The method of packaging an image sensing chip as described in item 6 of the scope of the patent application, wherein the light-transmitting layer is a light-transmitting glass. In the method for packaging an image sensing chip, the substrate and the flange are adhered to a first surface of a substrate.

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