TW452843B - Semiconductor processing apparatus having linear conveyor system - Google Patents

Abstract

A transport system for manipulating a semiconductor wafer in a processing tool is set forth. The system includes a transport unit guide disposed within the processing tool for supporting a wafer transfer unit as the unit moves between a first position and a second position. The transport unit guide comprises a frame, a lateral guide rail mounted on the frame, and a series of magnetic segments arranged upon the transport unit guide proximate the lateral guide rail. The wafer transfer unit includes a tram translatably attached to the lateral guide rail and a wafer transfer arm assembly for manipulating the semiconductor wafer. An electromagnet is mounted on the tram in cooperative relation with the magnetic segments for moving the transfer unit along the guide rail. Actuators are used for controlling the position of the transfer unit and transfer arm assembly, and sensors are used for determining the position of the transfer unit and the transfer arm assembly. A controller is disposed remote of the wafer transfer unit and directs the movement of the transfer unit and transfer arm assembly in response to the sensors using the actuators. A communication link is established between the actuators, sensors and controller. Preferably, the communication link is a fiber optic link.

Description

經濟部中央標準局貝工消費合作社印裝 4 52 8 43 A7 ___B7_ __ 五、發明説明（） 發明背景 由半導體晶圓之半導體積體電路及其他半導體物件之 製造，提供多個金屬層在晶圓上用來當作互連的金屬包覆 通常是必需的，該金屬包覆以電力地連接在積體電路上不 同裝置至其他裝置。傳統上鋁已被用於這類交互連接，然 而銅金屬包覆係較佳地β 銅運用於半導體晶圓，特別地證明爲一巨大技術挑戰 。此時銅金屬包覆已不能達成經濟目的由於以可靠而且有 效率的方式形成銅層之實際問題。這一部份由相對困難所 導致在實行反應離子蝕刻或其他選擇的移除銅在適當製造 溫度。銅的選擇移除係良好的以形成模式層而且提供介於 該晶圓或其他晶圓鄰近層間之導電交互連接。 因爲反應離子蝕刻不能有效地使用，工業尋求克服形 成銅模式層之問題藉由使用金屬鑲崁電鍍過程，其中孔更 普遍地稱爲通孔’溝及其他凹部使用於銅模式。在金屬鑲 崁過程，隨後金屬電鍍步驟期間該晶圓首先被提供一種用 來傳導電流之金屬種子層。該種子層係非常薄金屬層可被 使用在一或多個過程中。例如，金屬之種子層被安裝使用 物理氣相沉積或化學氣相沉積過程以製造i⑽〇埃厚之層。 該種子層可有效地由銅，黃金，鎳，鈀及大部分或其他金 屬所製造°該種子層形成在表面，該表面藉由孔，溝，或 被凹陷之其他裝置特徵被卷積。該接觸面之卷積本質提供 (請先閱讀背面之注意事項再填寫本頁) -装 -5 本威張尺度適用中國囤家標孳（CNS ) A4規格（2IOX 297公煃） 4528 43 Α7 Β7 五、發明説明（） 增加的困難以均勻的方式形成該種子層。在種子層之不均 勻可導致在隨後電鍍過程中自該接觸面通過之電流變化。 這可輪流地導致在銅層之不均勻，該銅層隨後被電鍍進種 子層。這種不均勻可引起在被形成之最終半導體變形及破 壞。 在金屬鑲崁過程，被電鍍入該種子層之銅層係以舖布 層形式出現。該舖布層被鍍上至某程度形成一重疊層’完 全提供一銅層塡充該孔，溝而且延伸一定數量之目的。這 一舖布層將典型地被形成/⑽⑽-/5⑽ίϊ埃數量級（厂人5微 米）之厚度。 經濟部中央標準局員工消费合作社印製 ---------辦衣------'訂 (請先閏讀背面之注意事項再填寫本頁) 該金屬鑲崁過程也包括目前在孔，溝或其他凹部外過 多金屬材料之移除。該金屬被移除以提供被形成之半導體 積體電路中最終形式金屬層^該過多電鍍金屬可被移除’ 例如使用化學機械平面化。化學機械平面化係一加工步驟 ’其使用化學移除劑及磨損之組合作用以磨碎及抛光該接 觸表面以移除被運用於該電鍍步驟之金屬層不適宜部分。 銅電鍍過程之自動化是不一定的，而且在習知技術中 需要用於改善半導體電鍍系統，此系統可_造在均勻的半 導體物件之銅層而且以有效及經濟的方式被製造。更特別 地’足夠的需要以提供一銅電鍍系統，該系統係有效率地 及可靠地自動化。 ____ 5____ 本紙張又度適用中國國家榡孪（CNS ) Α4说格（2丨0Χ297公釐） 4 528 43 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 發明摘要 用於操縱半導體晶圓在加工過程中之運送裝置被表示。 該系統包括被放置於加工器具內輸送單元導件用於支撐一晶 圓輸送單元，當該單元介於第一位置與第二位置間移動。該 輸送單元導件包括框架，架設於該框架之側向導軌，及一系 列磁性部分配置在鄰近側向導軌之輸送單元導件。該晶圓輸 送單元包括軌道車以移動地附著至側向導軌及用於操作該半 導體晶圓之晶圓輸送臂。電磁鐵被架設於以合作關係之軌道 車與磁性部分，該磁性部分用於沿著該導軌移動該輸送單元 。致動器用來控制該輸送單元及輸送臂總成之位置，而且感 測器用來決定該輸送單元及輸送臂總成之位置。控制器被放 置遠離該晶圓輸送單元而且導引輸送單元及輸送臂總成之運 動以反應使用致動器之感測器。通訊鏈路被建立介於該致動 器，感測器及控制器間。較佳地，通訊桿係纖維光學鏈路。 元件符號說明 ----------If -------^訂---------線 . {請先閲讀背面之注意事項再填寫本頁) 、 10 加工器具 11 工作空間 12 介面部分 14 加工部分 15-17 曰簡 B曰圓囲· 18 鎖合表面 19 加工模組 20 電鍍模組 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） 4 52 8 43 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 22 預濕模組 24 抵抗條模組 26 空氣補充管 30 使用者介面 32, 33 進出口 34 視窗 35, 36 動力門 37 通氣孔 38, 39 介面模組 40, 41 晶圓匣轉門 42, 43 晶圓匣升降機 44 動力軸 45, 46 鞍台 47, 48 晶圓匣支撐 49 晶圓匣轉門軸 50 匣托盤 51 胃基部 52 側支撐 53 溝槽 54 直立部分 57 通氣孔 58, 59 排放導管 60 晶圓輸送器 62 輸送單元 7 (請先閱讀背面之注意事項再填寫本頁) ----— ！ I 訂 ----— — lit 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐） 452843 A7 B7 五、發明說明（ 經濟部智慧財產局員工消費合作社印製 62a, 62b 晶圓輸送單元 63 導軌 64 輸送單元 65 框架 66 單元導件 68 路徑 69 突出部分 70 路徑 71 驅動操作器 72, 73 電纜護板 74 驅動操作器 75 突出部分 76 線性軸承 77 輥子 79 電磁鐵 81 光線發射器 82 中心線 83 — 軸 84 軌道車 85 蓋 86 晶圓輸送臂總成 87 第一突出部分 88 第二突出部分 89 真空支撐 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐） 4528 43 A7 B7 五、發明說明（） 經濟部智慧財產局員工消費合作社印製 90 輸送臂升降機/輸送臂升降機總成 91 CCD陣列 100 控制系統 101， 102 原控制器 110 控制次系統 113-119 控制次系統/加工模組控制 126, 127 資料鏈 129 資料鏈 130-132 主控制器 140-147 被動控制器 150, 160-162 記憶映射裝置 170-172 被動處理器 176, 177 伺服控制器 187 升降機上升馬達 188 升降機轉動馬達 180 介面控制卡 184 加工元件 185 轉門馬達 186 控制鞍台馬達 190 轉門編碼器 191 鞍台編碼器 192 上升編碼器 193 旋轉編碼器 194 輸送臂馬達 9 (諝先閱讀背面之>±.意事項再填寫本頁>Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives 4 52 8 43 A7 ___B7_ __ V. Description of the invention () Background of the invention Manufactured from semiconductor integrated circuits and other semiconductor objects of semiconductor wafers, providing multiple metal layers on the wafer Metal coatings used as interconnects are usually necessary. The metal coatings are used to electrically connect different devices on the integrated circuit to other devices. Aluminum has traditionally been used for this type of interconnection, but copper metal cladding is preferably beta copper for semiconductor wafers, which proves to be a huge technical challenge in particular. At this time, copper metal cladding has failed to achieve economic goals due to the practical problem of forming a copper layer in a reliable and efficient manner. This part is caused by the relative difficulty in performing reactive ion etching or other selective removal of copper at appropriate manufacturing temperatures. The selective removal of copper is good to form a pattern layer and provide a conductive interactive connection between the wafer or other adjacent layers of the wafer. Because reactive ion etching cannot be used effectively, the industry seeks to overcome the problem of forming a copper pattern layer by using a metal damascene plating process, where holes are more commonly referred to as through-hole 'trenches and other recesses used in copper patterns. During the metal damascene process and subsequent metal plating steps, the wafer is first provided with a metal seed layer for conducting current. The seed layer is a very thin metal layer that can be used in one or more processes. For example, a seed layer of metal is installed using a physical vapor deposition or chemical vapor deposition process to make a layer that is 100 angstroms thick. The seed layer can be effectively made of copper, gold, nickel, palladium, and most or other metals. The seed layer is formed on a surface that is convoluted by holes, grooves, or other device features that are recessed. The convolution of this contact surface is provided in essence (please read the precautions on the back before filling in this page)-Pack-5 This scale is applicable to the Chinese storehouse standard (CNS) A4 specification (2IOX 297 male) 4528 43 Α7 Β7 V. Description of the invention () The increased difficulty forms the seed layer in a uniform manner. The unevenness in the seed layer may cause a change in the current passing through the contact surface during the subsequent plating process. This may in turn lead to unevenness in the copper layer, which is then electroplated into the seed layer. This non-uniformity can cause deformation and destruction of the final semiconductor formed. During the metal inlaying process, the copper layer electroplated into the seed layer appears as a paving layer. The paving layer is plated to a certain extent to form an overlapping layer ' to completely provide a copper layer to fill the holes, grooves and extend a certain number of purposes. This ply will typically be formed to a thickness of the order / ⑽⑽- / 5⑽⑽ίϊAngel (factory 5 micrometers). Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs --------- Clothing -------- (Please read the precautions on the back before filling this page) The metal inlaying process also includes Excessive metal material is currently removed outside holes, grooves or other recesses. The metal is removed to provide the final form of metal layer in the formed semiconductor integrated circuit. The excess plated metal can be removed ', for example using chemical mechanical planarization. Chemical mechanical planarization is a processing step 'which uses a combination of chemical remover and abrasion to grind and polish the contact surface to remove unsuitable portions of the metal layer used in the plating step. The automation of the copper electroplating process is not necessarily, and there is a need in the art for improving the semiconductor electroplating system, which can be fabricated on the copper layer of a uniform semiconductor object and manufactured in an efficient and economical manner. More particularly, there is a need to provide a copper electroplating system that is efficiently and reliably automated. ____ 5____ This paper is again applicable to China National Twin (CNS) Α4 grid (2 丨 0 × 297 mm) 4 528 43 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () The abstract is used for manipulation The conveying device of the semiconductor wafer during processing is shown. The system includes a transport unit guide placed in a processing tool for supporting a wafer transport unit when the unit moves between a first position and a second position. The conveying unit guide includes a frame, a lateral guide rail mounted on the frame, and a series of conveying unit guides with magnetic portions disposed adjacent to the lateral guide rail. The wafer transfer unit includes a rail car for mobile attachment to a side rail and a wafer transfer arm for handling the semiconductor wafer. The electromagnet is erected between the railcar and the magnetic part in a cooperative relationship, and the magnetic part is used to move the conveying unit along the guide rail. The actuator is used to control the position of the conveying unit and the arm assembly, and the sensor is used to determine the position of the conveying unit and the arm assembly. The controller is placed away from the wafer transfer unit and guides the movements of the transfer unit and the transfer arm assembly in response to a sensor using an actuator. A communication link is established between the actuator, the sensor and the controller. Preferably, the communication rod is a fiber optic link. Component symbol description ---------- If ------- ^ Order --------- line. (Please read the precautions on the back before filling this page), 10 Processing Utensil 11 Work space 12 Interface part 14 Processing part 15-17 Jane B. Round 囲 18 Locking surface 19 Machining module 20 Electroplating module The paper size is applicable to China National Standard (CNS) A4 (210 * 297 mm) ) 4 52 8 43 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () 22 Pre-wet module 24 Resistance strip module 26 Air supplement pipe 30 User interface 32, 33 Import and export 34 Windows 35, 36 Power door 37 Air vent 38, 39 Interface module 40, 41 Cassette swing door 42, 43 Cassette lifter 44 Power shaft 45, 46 Saddle 47, 48 Cassette support 49 Cassette swing door shaft 50 Cassette tray 51 Stomach base 52 Side support 53 Groove 54 Upright part 57 Vent hole 58, 59 Draining duct 60 Wafer conveyor 62 Conveying unit 7 (Please read the precautions on the back before filling this page) ----— !! I order ---- — — lit This paper size applies to Chinese National Standard (CNS) A4 (210x 297 mm) 452843 A7 B7 V. Description of the invention (Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 62a, 62b wafers Conveying unit 63 Rail 64 Conveying unit 65 Frame 66 Unit guide 68 Path 69 Projection 70 Path 71 Drive operator 72, 73 Cable shield 74 Drive operator 75 Projection 76 Linear bearing 77 Roller 79 Electromagnet 81 Light emitter 82 Centerline 83 — Shaft 84 Rail car 85 Cover 86 Wafer conveying arm assembly 87 First protrusion 88 Second protrusion 89 Vacuum support (Please read the precautions on the back before filling this page) This paper size applies to Chinese national standards (CNS) A4 specification (210x 297 mm) 4528 43 A7 B7 V. Description of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 90 Conveyor lift / conveyor lift assembly 91 CCD array 100 Control system 101, 102 The original controller 110 control subsystem 113-119 control subsystem / processing module control 126, 127 data chain 129 resources Chain 130-132 Main controller 140-147 Passive controller 150, 160-162 Memory mapping device 170-172 Passive processor 176, 177 Servo controller 187 Lifter lift motor 188 Lifter rotation motor 180 Interface control card 184 Processing element 185 revolutions Door motor 186 Control saddle motor 190 Turntable encoder 191 Saddle encoder 192 Rising encoder 193 Rotary encoder 194 Conveyor arm motor 9 (Read the > ±. On the back first and then fill out this page >

裝--------訂i tf i tr n n .^1 I 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公爱） 528 4 3 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 195 輸送臂高度馬達 196 線性編碼器 197 轉動編碼器 198 輸送臂高度編碼器 199 絕對編碼器 201 氣壓閥致動器 202 運轉繼電器 203 底部平板 210 下肘部殼體 211 底部平板 212 上架設螺絲 214 下架設螺絲 216 壓花樞軸 218 側向溝槽 220 水平調整螺絲 222 架設螺絲 223 〇形環 224 埋頭孔 225 突緣 226 肩部 303 電鍍槽總成 316 電鍍槽 317 外部槽側牆 319 槽底部 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------^.-------訂--------1 I (諳先閱讀背面之沒意事項再填寫本頁) 523 43 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 320 杯總成 321 流體杯部分 323 杯底部 324 開口 325 流體輸入線 330 冒口管 322 杯側牆 334 屏蔽支撐陽極 345 溢流室 362 管接頭 371 依存裙部 375 擴散平板 386 擴散器高度調整機構 393 陽極屏蔽 394 陽極屏蔽結件 401 晶圓支撐 401 a-401 e 晶圓固持器 406 加工頭 ^ 407 操作器臂 409 接合指針總成 410 晶圓固持器 414 指針 426 軸 427 上升馬達 11 (諝先閲讀背面之注意事項再填寫本頁)Loading -------- Order i tf i tr nn. ^ 1 I This paper size applies to China National Standard (CNS) A4 (210 x 297 public love) 528 4 3 A7 B7 Employees ’Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the cooperative V. Description of the invention 195 Conveyor height motor 196 Linear encoder 197 Rotary encoder 198 Conveyor height encoder 199 Absolute encoder 201 Pneumatic valve actuator 202 Operation relay 203 Bottom plate 210 Lower elbow housing 211 Bottom plate 212 Mounting screw 214 Mounting screw 216 Embossing pivot 218 Side groove 220 Leveling screw 222 Mounting screw 223 O-ring 224 Countersink 225 Flange 226 Shoulder 303 Plating tank assembly 316 Plating tank 317 External tank side wall 319 Tank bottom 10 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ------------ ^ .------- Order- ------- 1 I (I read the unintentional matter on the back before filling this page) 523 43 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () 320 cup assembly 321 fluid cup Part 323 cup bottom 324 opening 325 Body input line 330 Riser tube 322 Cup side wall 334 Shield support anode 345 Overflow chamber 362 Pipe joint 371 Dependent skirt 375 Diffuse plate 386 Diffuser height adjustment mechanism 393 Anode shield 394 Anode shield junction 401 Wafer support 401 a- 401 e Wafer holder 406 Processing head ^ 407 Manipulator arm 409 Joint pointer assembly 410 Wafer holder 414 Pointer 426 Shaft 427 Ascending motor 11 (Please read the precautions on the back before filling this page)

--------訂----I I I i I 本紙張尺度適用_國國家標準（CNS)A4規格（210 X 297公釐） 52 8 4 3 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 428 轉動馬達 430 軸 435 增量轉動編碼器 455 增量上升運動編碼器 456 上升驅動軸 478 晶圓固持器 480 旋轉馬達 498 增量旋轉編碼器 502 氣壓活塞 540 數位-類比轉換器平板 541 絕對編碼器 541 絕對編碼器 544a, 544b 晶圓輸送單元導件 560 晶圓輸送器 562a, 562b 晶圓輸送單元 563a, 564a 上導軌 563b， 564b 下導軌 565 框架 566 晶圓輸送單元導件 568 路徑 570 路徑 571 驅動操作器 572, 573 電纜護板 573 電纜護板 12 --1 -----I --- ------ I . I---t i f I (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) 4 52 8 4 3 A7 B7 五、發明說明（） 574 576 576a 576b 579 582 583 584 585 586 587, 588 589 590 591， 592 593 594 595 596 597 598 599 604 605 607 驅動操作器 線性軸承 上線性軸承 下線性軸承 電磁鐵 中心軸 軸 軌道車 蓋 晶圓/輸送臂臂總成 突出部分 晶圓支撐 輸送臂升降機 絕對編碼器 底部馬達 編碼器 機械腕絕對編碼器 左絕對編碼器 機械肘絕對編碼器 線性編碼器 頭軌道編碼器 加工流體槽 運轉泵 泵排放過濾器 13 經濟部智慧財產局員工消費合作社印製 <請先閲璜背面之泷意事項再填寫本頁) 裝— 訂---------^ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 4 528 43 A7 B7 五、發明說明（） 652 656 657, 658 658 800 805 810 820 824 825 830 835 850 860 865 870 875 880 900 904 906 908, 909 917 970 補充歧管 後壓力調節器 流體感測器 流體感測器 輸入/輸出總成 加工模組 加工模組/晶圓固持器 頂部排放總成 指針總成 端部平板 入口 出口 晶圓對準站 晶圓對準控制器 _ 機械控制器 晶圓映射感應器 系統控制電腦 四軸控制器 第二半導體加工站 加工室 晶圓轉子總成 臂 槽邊緣總成 殼體 14 (請先閱讀背面之注意事項再填寫本頁) ------- 訂---------線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 B7 五、發明說明（） 979 晶圓接合指針 984 轉子總成 W 晶圓 經濟部智慧財產局員工消費合作社印製 4528^3 圖式簡單說明 第一圖係本發明半導體晶圓加工器具之等角透視® ’ 2 第二圖係顯示於第一圖之半導體晶圓加工器具沿線^ 所得之剖面圖； 第三圖至第八圖本發明之半導體晶圓加工器具較隹# 模組之晶圓匣轉門與升降機之略圖，用以介於固持位眞與抽 出位置間交換晶圓匣； 第九圖係較佳晶圓匣托盤之等角透視圖，該托盤可接合 該半導體晶圓加工器具之介面模組之轉門； 第十圖至第十五圖係依形式，其中該加工器具可被模組 化以利連續的加工單元之縱向連接； 第十六圖至第十九圖係顯示本發明之實施例中晶圓輸送 系統； — 第二十圖至第二十五圖係顯示本發明之更進一步實施例 中晶圓輸送系統； 第二十六圖係半導體晶圓加工器具之控制系統實施例之 功能方塊圖； 第二十七圖係用於控制晶圓匣介面模組之介面模組控制 次系統之主/從組態之功能方塊圖； 第二十八圖係接合該加工器具之晶圓匣介面模組構件之 15 ----— — — —— — — — 装·— — C请先S!讀背面Mif-意事读符填寫本 —訂---------線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 4 5 2 8 4 V- A7 B7 五、發明說明（) 介面模組控制次系統之功能方塊圖； 第二十九圖係與該加工器具之晶圓輸送器構件接合之晶 圓輸送器控制次系統之功能方塊圖； 第三十圖係與該加工器具之晶圓輸送器元件接合之晶圓 加工模組控制次系統之功能方塊圖； 第三十一圖係與該加工器具之晶圓介面模組構件接合之 介面模組控制次系統從處理器之功能方塊圖； 第三十二係與該加工器具之晶圓輸送器元件接合晶圓輸 送器控制次系統之功能方塊圖；及 第三十三圖係使用於電鍍半導體晶圓朝下表面之加工站 剖面圖。 (請先閱讀背面之注意事項再填寫本頁) 裝------ - I訂------ --線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 452843-------- Order ---- III i I This paper size is applicable _ National Standard (CNS) A4 specification (210 X 297 mm) 52 8 4 3 A7 B7 Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printing 5. Description of the invention (428) Rotating motor 430 Shaft 435 Incremental rotary encoder 455 Incremental upward motion encoder 456 Ascending drive shaft 478 Wafer holder 480 Rotary motor 498 Incremental rotary encoder 502 Pneumatic piston 540 Digital- Analog converter plate 541 Absolute encoder 541 Absolute encoder 544a, 544b Wafer transfer unit guide 560 Wafer transfer unit 562a, 562b Wafer transfer unit 563a, 564a Upper rail 563b, 564b Lower rail 565 Frame 566 Wafer transport unit Guide 568 Path 570 Path 571 Drive operator 572, 573 Cable shield 573 Cable shield 12 --1 ----- I --- ------ I. I --- tif I (please first Read the notes on the reverse side and fill out this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 male f) 4 52 8 4 3 A7 B7 V. Description of the invention () 574 576 576a 576b 579 582 583 584 585 586 587, 588 589 590 591, 59 2 593 594 595 596 597 598 599 604 605 607 Drive manipulator linear bearing upper linear bearing lower linear bearing electromagnet shaft axle rail car cover wafer / conveyor arm assembly protruding part wafer support conveyor arm lifter absolute encoder bottom Motor encoder, mechanical wrist absolute encoder, left absolute encoder, mechanical elbow absolute encoder, linear encoder head, orbital encoder, processing fluid tank, running pump, and discharge filter. Please fill in this page on the back of the matter.) Binding — Order --------- ^ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 4 528 43 A7 B7 V. Invention Description () 652 656 657, 658 658 800 805 810 820 824 825 830 835 850 860 865 870 875 880 900 904 906 908, 909 917 970 After adding the manifold pressure regulator fluid sensor fluid sensor input / output total Into processing module processing module / wafer holder top emission assembly pointer assembly end plate inlet exit wafer alignment station wafer alignment controller _ mechanical controller wafer Radio sensor system control computer four-axis controller Second semiconductor processing station Wafer rotor assembly Arm slot edge assembly housing 14 (Please read the precautions on the back before filling this page) ------- Order --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) A7 B7 V. Description of the invention () 979 crystal Circular joint pointer 984 Rotor assembly W Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Wafer Economy 4528 ^ 3 The diagram is a simple illustration. The first diagram is an isometric perspective of the semiconductor wafer processing apparatus of the present invention. '2 The second diagram shows The cross-sectional views of the semiconductor wafer processing equipment in the first figure are taken along the line ^; Figures 3 to 8 are schematic diagrams of the semiconductor wafer processing equipment of the present invention compared to the # swing-out door of the module and the lifter. The wafer cassette is exchanged between the holding position 眞 and the extraction position; the ninth figure is an isometric perspective view of a preferred wafer cassette tray, which can be engaged with the revolving door of the interface module of the semiconductor wafer processing apparatus; tenth Figure to Fifteenth Series Form, in which the processing tool can be modularized to facilitate the longitudinal connection of continuous processing units; Figures 16 to 19 show the wafer conveying system in the embodiment of the present invention;-Figures 20 to 19 The twenty-fifth figure is a functional block diagram of an embodiment of a control system for a semiconductor wafer processing apparatus, and the twenty-seventh figure is used to control a wafer. Function block diagram of the master / slave configuration of the interface module control sub-system of the round box interface module; The twenty-eighth figure is 15 of the components of the wafer box interface module connected to the processing tool ------------ —— — — — 装 · —— — C Please S! Read the Mif on the back and fill in the book — Order --------- The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) 4 5 2 8 4 V- A7 B7 V. Description of the invention () Function block diagram of the interface module control sub-system; The twenty-ninth figure is the crystal bonded to the wafer conveyor component of the processing instrument Functional block diagram of the circular conveyor control sub-system; Figure 30 is related to the processor The functional block diagram of the wafer processing module control sub-system of the wafer conveyor component bonding; the thirty-first figure is the interface module control sub-system from the processor that is connected to the wafer interface module component of the processing instrument. Functional block diagram; The thirty-second series is a functional block diagram of the wafer conveyor control sub-system that is bonded to the wafer conveyor element of the processing instrument; and the thirty-third diagram is used for the processing of the lower surface of the plated semiconductor wafer Station cross section. (Please read the precautions on the back before filling out this page) Packing ---------I Order ---------Printed on paper scales of the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs, Chinese national standards ( CNS) A4 size (210 X 297 mm) 452843

經濟部中央標準局員工消费合作社印製 五、發明説明（） 發明內容 參考第一圖，顯示該半導體晶圓加工器具川之較佳 實施例。該加工器具可包括一介面部分/2及加工部分 3包括複數個半導體晶圓之半導體晶圖匣76，晶圓大致 上被指定爲W可被載入加工器具或經由介面部分72卸 載。特別地，晶圓匣/6係較佳地被載入或卸載通過至少一 進出口如在加工器具之向外面牆之第一進出口。一附加 第二進出口 W可被提供在加工器具ii?之介面部分/2內用 來改善存取而且進出口·?2可被當作輸入端及進出口 B可 被當作輸出端。 個別地動力門i5, 可被利用於覆蓋存取進出口 i2, 55因此隔絕加工器具川內部與潔淨室。每個門%可 包括兩部分。該上部分與下部分別地向上及向下移動進入 加工器具川之前表面以開啓進出口 ^ B而且允許存取。 晶圓匣典型地被用來以輸送複數個半導體晶圓。 該晶圓匣76較佳地被定位以提供在上方或垂直位置對於穩 定之半導體晶圖在半導體晶圓進入或離開加工器具之輸 送期間。 ’ 該加工器具之前方向外表面有效地加入一潔淨室 以減少有害污染物之數量，該污染物在晶圓匣Μ***或移 8 ^紙張尺度適用中國因家標；U’NS ) Μ規格（2i0 X 297公釐） ： (請先閱讀背面之注意事項再填寫本頁) -裝 528 43 A7 B7__ 五、發明説明（） 除期間被導入加工器具再者，複數個晶圓匣被導 入加工器具/0或同時被移除以減少進出口 i2, 之開孔而 且加工器具川暴露於該潔淨室環境。 介面部分加入加工器具之加工部分7·/。該加工 部分"包括用於實行不同半導體加工步驟之複數個半導體 晶圓加工模組。特別地，顯示於第一圖加工器具之實施 例包括限定加工部分以之第一側表面之電鍍模組⑼。加 工器具之加工部分有效地包括增加的模組，如預濕 模組U及抵抗條模組W，相對於電鍍模組Μ。 經湳部中央標準局員工消費合作社印装 ---------裝------訂 (請先閱讀背面之注意事項再填寫本頁) 可選擇地，用於實行增加加工功能之其他模組被提供 在加工器具iO內。由加工器具/0之加工模組所實行之特 殊加工可不相同或相同性質。不同液體及氣體加工步驟以 不同連續關係被使用。該加工器具係特別地有效於允許 一連串複合程序被連續地運作以不同加工模組，對不同加 工溶液被建立。全部程序有效地達成不需要人員操作而且 在高度控制工作空間"，因此降低人員操作時間及污染半 導體晶圓之機率。 加工器具川之加工模組較佳地係模組化，可交換的 ，孤立單元。由加工器具70所實行之加工功能被改變，在 加工器具之架設增加彈性而且允許加工方法改變。附加 晶圓加工模組可被加入該加工器具ii?或取代現存加工模組 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X297公釐） 4 52 8 經濟部中失標準局員工消費合作社印家 Α7 Β7 五、發明説明（） 19。 本發明之加工器具較佳地包括後方鎖合表面Μ結 合該加工器具之側邊。如第一圖所示，空氣補充管26 有效地被提供加工部分之中間對靣加工模組。該介面部 分i2，該加工部分之側邊，鎖合表面，及空氣補充 管26較佳地提供在加工器具/0內封閉工作空間"，該空 氣補充管26可包括一導管連接過濾空氣源（未顯示）用於 提供淸潔空氣進入加工器具川。更特別地，該空氣補充管 26包括複數個通氣孔中間加工模組/9用於導引淸潔空氣 進入工作空間 參考第十六圖，排放導管59被提供鄰近晶圓輸送 單元導件66之框架65以移除該循環淸潔空氣及污染物。 排放導管Μ與每個加工模組/9連接用於吸引補充淸潔 空氣通過該處》特別地，淸潔空氣被捕充至加工器具之 工作空間ii經由空氣補充管26。該空氣被吸引鄰近晶圓 輸送單元6久料而且經由複數通氣孔·57進入加工模組79 ，該通氣孔由連接排放導管輸出之排放風扇（未顯 示）形成在支架或加工甲板內。在加工器具/0內每個加工 模組Μ被直接地連接排放導管兄，59。該空氣可被抽出加 工器具川之排放導管59通過後方鎖合表靣Μ或通過 加工器具之表面底部。提供封閉工作空間而且控制在工 作空間內環境明顯地降低在加工器具中污染物的出現。 _ 10 本紙张尺度適用中國®家標準（CNS ) Λ4規格（210X 297公釐） I - -I ^^1 ί -'- n - 士 j/ n : —^1 ΐ» ·-0 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標隼局員工消費合作社印焚 528 43 A7 __B7_ 五、發明说明（） 每個加工模組有效地存取通過個別模組之外部平板， 該模組形成加工器具it)之側邊。該加工器具川之側邊可 鄰近灰室環境。灰室與該潔淨室作比較具較少防止污染物 之預防措施。利用此規格降低工廠成本，當允許加工元件 及加工器具之晶圓模組電子之獲得，該加工器具要求正 常維護。 使用者介面被提供如第一圖所示之加工器具之向 外面對前表靣。該使用者介面30有效地係觸摸螢幕陰極射 線管控制顯示器允許手指接觸該顯示器螢幕以使用加工器 具70內不同控制功能。一增加使用者介面JO被提供在加 工器具川之後方或在個別加工模組內以至於加工器具川 運轉可起作用自另一位置環繞加工器具更進一步，移 動式使用者介面被提供允許操作者環繞加工器具/(?移 動而且觀察加工元件之運作。該使用者介面被運用以熟 習特殊功能及運轉至加工模組及半導體晶圓輸送單元 62, 64。 在加工器具^^內每個模組20, 22, 24較佳地包括視窗 以自灰室允許加工器具川運轉之視覺檢'査。更進—步， 通氣孔有效地被提供在每個加工模組2£), 2_?，N之上表 面內。加工模組電子線路較佳地係被放置鄰近該通氣孔 允許循環空氣以排放由适類電子線路所生成之熱量3 ___11 本紙張尺度適用中囷S家標皁（CNsTa^格（-- {請先閲讀背面之注意事項再填寫本頁) 裝 *1Τ 452843 A7 B7 五、發明説明（） 在介面部分72之工作空間^及加工器具川實施例 之加工部分W顯示於第二圖。 該介面部分72包括兩介面模組59用於操作在加 工器具內晶圓匣/6。該介面模組5& 59接納晶圓匣/6 通過進出口 H D而且存放晶圓匣用於隨後半導體晶圓 之加工。此外’該介面模組5<§，存放晶圓匣用於自加工 器具移除’當在個別晶圓匣/6內半導體晶圓之加工完 成時β 經濟部中央標準局貝工消费合作社印11 (請先閱讀背面之法意事項再填寫本頁) 每個介面模組·?<§，外包括晶圓厘轉門40, W及晶圓匣 .升降機4二W。該晶圓匣轉門40, 大致上調換晶圓匣Μ 從穩定垂直方向至水平方向，該處半導體晶圓之獲得被改 善。每個晶圓匣升降機42. Μ具有個別晶圓匣支撐47,料 用於固定晶圓匣i6。每個晶圓匣升降機42, β被用來定泣 放置在輸送位置或抽出位置之晶圓匣/6。介面模組35,外 之運轉以下被仔細描述。 本發明之實施例，第一介面模組55當作輸入晶圓匣 介面用於接納未加工半導體晶圓進入加工盏具70。第二介 面模組可當作輸出晶圓匣介面用於固定自加工器具川 移除之已加工半導體晶圓。在加工器具內晶圓輸送單元 6Z以存取由任一介面模組刊所固定之晶圓匣Μ。 12 尺度^用中國囤家標準（CNSTA4規格（2丨0X 297公芨) ： 4 528 4 ο Α7 ___Β7 五、發明説明（） ---------裝------訂 {請先閱讀背面之注意事項再填寫本頁) 半導體晶圓輸送器60係顯示中間加工模組22. W 及介面模組Ji?，在第二圖中。該晶圓輸送器6£?包括晶 圓輸送單元H W用於轉移介於介面模組及晶圓加 工模組間個別半導體晶圓取。 晶圓輸送器60有效地包括輸送單元導件66,如延長 軌道，其限定複數個路徑6S, 70用於在加工器具內晶圓 輸送單元<52,以。在路徑妨之晶圓輸送單元62可通過晶 圓輸送單元^，沿輸送單元導件66在輸送單元<52,以運 動期間被定位在第二路徑70。該加工器具川可包括增加 的晶圓輸送單元以便利半導體晶圓FF輸送介於電鍍模組 2〇, 22, 24及晶圓介面模組3S, J9間。 經濟部中央標羋局員工消f合作社印製 更特別地，第二臂突出部分支撐半導體晶圓F經 由真空支撐適當輸送單元62,以藉由沿著輸送單元導 件66移動可接近晶圓支撐。在沿著單元導件66達到 適當位置後，第一突出部分87及第二突出部分轉動以 接近晶圓支撐3該第二突出部分S3被放置晶圓支撐 上方而且隨後降低朝向在晶圓支撐之接合指針總 成仰9。該真空従真空支撐<59被移除，而’且在加工模組內 指針總成抓住被放置此處之半導體晶圓第二突出部分 55可被降低而且從半導體晶圓下方被移除，該晶圓由晶圓 接合指針所固定。 本紙法尺度適川中國S家標準（CNS ) Λ4規格（2i0x297公釐） 4528 43 A7 B7 五、發明説明（） 在適當加工模組20, 22，內半導體晶圓之加工完成 後，晶圓輸送單元<52, <54取回晶圓而且不是輸送晶圓至另 一加工模組22, 24就是送回晶圓至晶圓匣用於自加 工器具川存放或移除。 經濟部中央標隼局員工消费合作社印製 · n^i I - - - I - - - -I s -- 1 i ^^^1 I ^ilf ^—J -* (請先閱讀背面之注意事項再填寫本頁) 每個晶圖輸送單元^ 存取鄰近輸送機之晶圓 匣用於從晶圓匣取回半導體晶圓或放置半導體晶圓 。特別地，晶圓輸送單元Μ係顯示從在顯示在第二圖之升 降機42上晶圓匣76取回半導體晶圚更特別地，相連 接的第二突出部分及真空支撐$9被***晶圓匣/6，該 晶圓匣被定位在抽出位置a第二突出部分及真空支撐 59進入由晶圓匣i6所固定之底部半導體晶圓F之下表面 下方。真空可被應用藉由真空支撐，當真空支撐<59被 定位在被移除半導體晶圓F之中心下方。該第二突出部分 ，真空支撐S9及半導體晶圓V附著此處經由輸送臂升 降機稍微提昇。最後，第一突出部分<57及第二突出部 分被轉動自晶圓匣/6移除半導體晶圓該晶圓輸送 單元^ W輸送半導體晶圓F至用於加工之加工模組79。 自此，晶圓輸送單元<52可沿著路徑運行至一鄰近 適當的加工模組22, 24之位置，該加工模組用於放置 半導體晶圓在用於半導體晶圓加工之晶圓加工支撐= _______ 14 泰紙張尺度適用中國阀家標準（CNS ) A4規格(ϋ〇χ 297公爱） ™ 經濟部中央標率局員工消费合作社印掣 52843 A7 B7 五、發明説明（） 介面模組 參考第三圖至第八圖，介面模組56之運轉係詳細地 顯示。以下討論限於晶圓介面模組但也適用於晶圓介面 模組，只要每個晶圓介面模組59大致上以相同方式 運轉。 較佳地，第一晶圓介面模組及第二晶圓介面模組 充當加工器具之個別半導體晶圓匣/6之輸入模組及 輸出模組。另一方面，兩模組可充當輸入及輸出。更特別 地，固定未加工半導體晶圓之晶圓匣/6可經由進出口 W 進入該加工器具而且暫時地儲存在第一晶圓介面模組 內，直到半導體晶圓自用於加工之晶圓匣76被移除。 已加工半導體晶圓可被輸送至在第二晶圓介面模組之晶 圓匣Μ，經由晶圓輸送單元62, 6¥用於暫時地自加工器具 川存放及/或移除 晶圓介面模組55, 39可直接地由用於輸送半導體晶圓 之加工器具Μ內晶圓輸送單元62,料被存取。焊據本發明 提供每個晶圓輸送單元62, 64可接近之複數個晶圓介面模 組55, 利於半導體晶圓F輸送通過加工器具Μ。 每個晶圖介面模組外較佳地包括晶圓匣轉門扣 及鄰近的晶圓匣升降機β。存取進出口 ^ W係鄰近分別 晶圓匣轉門W。半導體晶圓匣Μ經由進出口 J2, Β被 {請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國囿家標孳（CNS ) Α4規格（2!0x297公釐） 452843 A7 _B7_ 五、發明説明（） 引入加工器具μ或被移除。 半導體晶圓匣較佳地被放置在垂直位置在匣托盤 50輸送至加工器具前。該匣托盤係顯示第九圖。晶 圓匣及半導體晶圓之垂直位置提供一確定方位以維持在 用於輸送之半導體晶圓匣％內之半導體晶圓3 晶圓匣轉門仰，較佳地包括鞍台巧，仏被規劃以固 定晶圖匣°提供兩鞍台^又使兩晶圓匣76被放置進 入加工器具川或移除，在個別存取門JJ, 5(5之單一開孔將 加工器具川內工作空間7/接觸潔淨室環境降至最小。 每個鞍台45, 包括可與匣托盤50接合之兩叉。兩 鞍台爲晶圓匣轉門軸料內馬達所驅使用來以水平或 垂直方位定位晶圓匣該晶圓匣76及在該處半導體晶 圓較佳地垂直地被定位用來通過存取進出口 52, 之通道 經濟部中央標準局負工消費合作杜印掣 ,^1 ··-- ^^1 11 ^^1 ^^1 T-J« 士// --It. Hi .1— r^i ^1* U5, ，-e (請先閱讀背面之注意事項再填寫本頁) 而且水平地被定位在輸送或抽出位置以提供此處晶圓存取 至晶圓輸送單元62, 64。 在第三圖中由晶圓匣轉門所固定之晶圓匣也 稱爲晶圓匣/5在固定位置（被稱爲負載位'置在固定位 置晶圓匣Μ內半導體晶圓可被儲存用於隨後之加工。另一 方面，在固定位置晶圓厘Μ內半導體.晶圓可被儲存用於隨 後移除自加工器具川通過存取進出□ 3 _-— 16 . ' 本紙浪尺度通用中®國家標準（CNS > Λ4規格（210X297公竣)~ ~~~---— 4 528 4 3 Α7 Β7 五、發明説明（) 參考第三圖，由晶圓匣升降機所支撐之晶圓匣76 ，也被稱爲晶圓匣在抽出或交換位置。半導體晶圓不是 自晶圓匣移出就是被放置晶圓匣，該晶圓匣經由晶圓輸 送單元<52,料被定位於抽'出位置。 晶圓匣轉門W及晶圓厘升降機交換晶圚匣 以輸送晶圓匣77,該晶圓匣具有自抽出位置至固定位置用 於自加工器具Μ移除之已加工半導體晶圓。除此之外這類 交換可輸送晶圓厘77,該晶圓匣具有未加工半導體晶圓自 固定位置至抽出位置提供晶圓輸送單元<52_ 存取此處半 導體晶圓。 經濟部中央榡隼局買工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 晶圓匣U i7交換被描述參考第四圖至第八圖。特別 地，鞍台#被放置晶圓匣升降機β之動力軸#下方。該 軸^連接一用於固定半導體晶圓匣/6之動力晶圓匣支撐 47。附著此處之軸及晶圓厘支撐¥7被降低如第四圖所 示而且軸W通過介於鞍台Μ之雨叉間。 參考第五圖，軸^內馬達通過軸^繞一中心線轉動 晶圓匣支撐47,提供與晶圓匣7*5成相對ΐ係之晶圓匣U ，晶圓匣/5爲晶圓匣轉門/0所固定。晶圓匣轉門Μ之兩 鞍台隨後被傾斜成水平方向如第六圖所示。晶圓匣 升降機42之軸^被降低而且晶圓匣77與鞍台接合如 本紙張尺度適用中國阀家標準（CNS ) Α4規格（210ΧΜ7公釐） 452843 A7 _B7 五、發明説明（） 第七圖所示。該軸w及晶圓厘支撐被額外的降低至晶 圓厘76之轉動°參考第八圖’晶圓匣轉門轉動度 以調換晶圓匣？7。 具有已加工半導體晶圓之晶圓匣/7經由用於自加工 器具移除之進出口 可存取。具有未加工半導體之晶 圓匣巧被放置用於接合晶圓匣支撐47。顯示第三圖至第 八圖之輸送程序步驟可被倒轉以提昇晶圓匣進入抽出部 分，提供半導體晶圓至晶圓輸送單元62, 64之存取。 經濟部中央標隼局員工消費合作社印聚 ---------^------ΐτ (請先閲讀背面之注意ί項再填寫本頁) 第十圖顯示加工裝置被模組化之一種方式。如圖 所示，裝置包括輸入/輸出總成<5⑽，左及右加工模組 卯5, <?川，晶圓輸送系統邡，頂部排放總成，及端部 平板525。如圖所示*左與右加工模組以0環繞晶圓 輸送器被固定於另—模組以形成具有入口 及出口 555之加工室β複數個加工模組可被固定在縱向規格以提 供一延長加工室’該加工室可實行大部分加工程序在每個 晶圓，或可選擇同時地加工大部分晶圔3在此情形下’裝 置Μ之晶圓輸送系統<50被程式設計與一或多個先前或隨 後輸送系統仙之晶圓輸送系統仙共同運作。 第十一圖顯示配置加工頭在裝置·/〇內之一方式°在 此實施例，該左加工模組包括三個加工頭用於淸洗及 乾燥每個晶圓在電化學沉積後，及在電化學沉積前兩加工 ---H_—- 本纸伕尺度適用中國國家標準（CNS ) A4規格（2IOX297公釐） 452843 經濟部中央標隼局員工消费合作社印裂 A7 B7 五、發明说明（） 頭用於實行晶圓濕潤。大體上，該左加工模組S们包括支 撐模組，該模組具有加工頭使用於晶圓之預加工及後加工 相對於電化學銅沉積。該右模組包括一電鍍模組而且 包括五個用於電化學銅沉積之反應器頭。在第十一圖之實 施例，一晶圓對準站被提供以確定每個晶圓之厚度適 當方向，當每個晶圓在裝置內加工β晶圓對準可根據感應 每個晶圓上記號或其相似物。 第十二圖及第十三圖分別地顯示左與右加工模組抑J 及之實施例。在這些圖形中，分別地殼體之外部分已 被移除因此接觸不同系統元件。較佳地，電子元件如電源 供應，控制器等，係被放置在加工模組<505及之上部 分，當移動元件及類似物被放置在每個加工模組之下部分 第十四圖顯示輸入模組⑽之立體圖，其模組具有移 除平板如從裝置內部所觀察。第十五圖提供相對裝置 if?外部之輸入模組⑽之相似圖。在此圖示實施例，晶圓 對準站<55(5及晶圓對準控制器被提供在輸入模組別〇 。用來控制晶圓輸送系統仰之機械控制器被放置該處 。爲追蹤被加工之晶圓，輸入模組抑〇被搶供一或多個晶 圓映射感應器感應出現在每個匣的晶圓。在輸入模組 5⑽其他元件包括系統控制電腦<57^5及四軸控制器抑0 β該 系統控制電腦大致上負責調整裝置Μ之所有蓮轉。 19 ---------裝------訂 (請先閱讀背面之注意事項再填苑本頁) 本紙张尺度適用中國阈家標隼{ CNS ) Α4現格（2〗OX 297公* ) 452843 經濟部中央標率局負工消費合作社印製 A7 五、發明説明（） 半導體晶圓輸送器 加工器具包括用於輸送半導體晶圓通過該加工器 具之半導體晶圓輸送器仙。較佳地，半導體晶圓輸送 器60可存取每個晶圓匣介面模組ϋ J9及在用於轉移半導 體晶圓之加工器具內每個加工模組79。此包括從另一 側邊之加工模組。 半導體晶圓輸送器之實施例顯示於第十六圖。半 導體晶圓輸送器仰大致上包括晶圓輸送單元導件66較佳 地包括一架設於框架（55之延長脊或軌道。可選擇地，該輸 送單元導件可被形成一軌道或用於導引晶圓輸送單元 以之任意規格。晶圓輸送器抑之長度被變化而且被規 劃以允許晶圓輸送單元62, 64至介面模組5怂外及加工模 組20, 22. 24之存取。 晶圓輸送單元導件66限定連接輸送單元61 之運 動路徑仙，。參考第十六圖，輸送單元導件66之脊包括 架設於相反側邊之導軌6J，64。每個半導體輸送單元62, 64較佳地接合導軌（JJ,以。每個導軌可架設一或多個輸送 單元<52,以。突出部分仰，7J被固定於單先導件<56之相反 側邊，該導件用於提供輸送單元之穩定度而且防止 單元導件Μ磨損。每個輸送單元62, 64包括輥子77被規 劃以跨越沿著單元導件如之個別突出部分69, 7J。 20 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X 297公釐） "裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 452843 經濟部中央標準局質工消费合作社印si Α7 Β7 五、發明説明（） 可瞭解是晶圓輸送器<50被形成於另一規格依照加工 器具Μ內介面模組ϋ 39及加工模組20. 22, 之配置3 導管5<§, 59較佳地被以流體從每個加工模組i9連接突起部 分及用於自加工器具川之工作空間ϋ移除循環空氣之排 放風扇。 每個晶圓輸送單元心，以沿著分別的路徑砧，藉由 適當驅動器被驅動。更特別地，驅動操作器；7，Μ被架設 至輸送單元導件Μ之個別側邊以提供晶圓輸送單元<52, 之可控制軸向移動，沿著輸送單元導件<56 3 該驅動操作器7i,〜係縷性_磁性屋達月於沿著單元導 件Μ提供晶圓輸送單元62,以之詳細位置。特別地，驅動 操作器7/，74較佳地線性無刷式直流電馬達。這類較佳驅 動操作器7/, 74利用一系列傾斜磁性部分，該部分以磁性 地與架設於晶圓輸送單元<5, 6^之個別電磁鐵79以迫使該 單元沿著單元導件6<5。 電纜護板72, 被連接個別的晶圓輸送單元心，以及 框架Μ用於保護通訊及動力電纜。該電纜_板7, 包括 複數個交互連接部分以允許沿著輸送單元導件晶圓輯^舍 單元<52,以之運動範圍。 21 ---------^裝— (請先閱讀背面之注意事項再填寫本瓦) --5¾ 1- 本紙张尺度適用中囡珣家樣準（CNS ) Α4規格（210X 297公釐） 452843 經濟部中央標準局黃工消f合作社印袈 B7 五、發明説明（） 如第十七圖所示，第一晶圓輸送單元62被連接至導 件6<5脊之第一側邊。每個晶圓輸送單元<52, W包括一線性 軸承76用於接合線性導軌<5又64。更進一步，該晶圓輸送 單元6Z以每個較佳地包括一平行輥子77用於接合突出部 分69，該部分被形成在導件Μ之脊而且提供穩定性。 第十七圖附加地顯示第一晶圓輸送單元62之電磁鐵 79，該單元架設於以磁性地與驅動致動器77起反應之位置 。該驅動致動器7i及電磁鐵79沿著輸送單元導件66提供 晶圓輸送單元以之軸向移動及方向控制& 半導體晶圓輸送單元 晶圖輸送器<5(?之半導體晶圓輸送單元<52, 64之較佳 實施例被描述在第十八圖及第十九圖。 通常，半導體晶圓輸送單元d 包栝一可移動車架 或軌道車54連接至輸送單元導件66之個別側邊，一晶圓 輸送臂總成連接至軌道車用於支撐半導體晶圓V， 及晶圓輸送臂升降機用於調整相對軌道車^^之晶圓輸 送臂總成衫高度β 參考第十八圖，蓋<5*5環繞軌道車之部分，該車面 對遠離輸送單元導件於。該軌道車料包括線性軸承76用 於與個別導軌65,料接合，該導軌架設於輸送單元導件Μ j紙张尺度㈣巾卿家料（CNS ) Α4*«· ( 210Χ297-ή-# ) (請先閱讀背而之注意事項再填寫本頁) .^索. ，-* 4 52843 A7 B7 五、發明説明（） 。線性軸承76維持軌道車與輸送單元導件66之固定關 係而且允許軌道車之軸向運動β輥子77接合一個別突 出部分砂用於防止軌道車料繞導軌以轉動及提供晶 圓輸送單元62之穩定性ΰ電磁鐵係顯示連接至軌道車 在這類位置以磁性地與驅動操作器以，7J之個別晶圓輸 送單元以交互影響。 晶圓輸送臂總成延伸至軌道車頂端之上方。該 晶圓輸送臂總成56包括與軸Si連接在第一端之第一臂突 出部分<?7。第二臂突出部分55有效地連接至第一臂突出 部分<57之第二端。該第一臂突出部分87可環繞軸“旋轉 3仰度而且該第二臂突出部分料環繞中心線Μ旋轉· 度，該中心線通過連接第一及第二突出部分<57, 之一軸 〇 經濟部中央標準局負工消費合作社印裝 ---------，择------ir (請先閱讀背,&之注意事項再填寫本頁) 第二臂突出部分狀較佳地包括在末端之晶圓支擦砂 用於支撐半導體晶圓V，在沿著晶圓輸送器仙之輸送期間 。該晶圓輸送臂總成較佳地包括一氣室連接至晶圓支撐 沒9用於使用一真空而且固定一半導體晶圓 提供輸送臂總成之可調整高度，禮關軸幻中心、線 之第一突出部分S7轉動及有關们第二臂突出，曰 動允許輸送臂私可存取全部加工模組Μ之每個半導體曰曰 __ Εΐςί 1 〇 內 圓固持器而且每個半導體晶圓匣爲加工荷# 本紙婊尺度適用t®國家標率（CNS)Α4规格（2丨0x 297公釐> 452843 A7 B7 五、發明説明（） 介面模組39所固定。這類存取過程允許晶圓輸送單71； 62, W輸送半導體晶圓。 蓋S5已經從顯示於第十九圖之晶圓輸送單元移除以 顯示達接至軌道車及輸送臂總成之輸送臂升降機卯 。輸送臂升降機如調整相對軌道車輸送臂總成<56之垂 直位置，在輸送半導體晶圓介於晶圓支撐及晶圓固持器 5川與晶圓匣i<5間之期間。 沿著輸送單元導件每個晶圓輸送單元62, 之軌 道車<5彳位置被詳細地控制使用一位置指定陣列，如第十九 圖中CCZ)陣列W。加工器具20之較佳實施例，在加工模 .組內每個晶圓固持器Sii?具有相對光線或其他先線發射 器W，其架設於顯示在第二圖之加工模組79表面用於導 引光線朝向輸送單元導件仏。該光線發射器W可代表連 續光或被規劃以產生光線，當晶圓輸送單元62, 接近個 別地晶圓固持器川。 經濟部中央榡準局員工消费合作社印裝 (請先閱讀背面之注意事項再填寫本頁) 該輸送臂總成包括被定位於接收光線發射器W所 產生光線之CCZ)陣列9/。在軸上位置指定陣列W偵 測光線之存在以決定沿著輸送單元導件66'軌道車之位 置。晶圓輸送單元位置指示器之位置準確性較佳地係小於 之範圍（大約少於)。 本紙浪尺度適用中國國家標準（CNS )八料見格（210X297公楚） 4 52843 A7 B7 五、發明説明（） I'--- ^^1 ! - - I. ^^1 - n I— "Hi/ 1^^ ^^1 i I Hi ^^1 \—« (請先閱讀背面之洼意事項再填寫本頁) 顯示於第二十圖至第二十五圖晶圓輸送單元之 第二實施例而且相同地被提供連接至輸送單元導件<56之分 別側邊之可移動車架或軌道車5W，一晶圓臂總成以 移動地連接至用於支撐半導體晶圓F之軌道車，及用 於調整相對該軌道車W之晶圓臂總晈高度之晶圓輸 送臂升降機*5如。一蓋5幻環繞軌道車—部份^該軌 道車包括用於與架設於輸送單元導件66之個別導軌 <5又相接合之線性軸承5M。線性軸承5>6維持軌道車 5料與輸送單元導件66固定關係而且允許軌道車J料之軸 向運動。該電磁鐵579以磁性地與導件以反應以驅動致動 卷 71,74。 經濟部中央標率局員工消f合作社印製 晶圓輸送臂總成分6延伸軌道車5心之頂端上方。該 晶圓輸送臂總成包括第一臂突出部分別7與軸兄J連 接在第一端。第二臂突出部分5狀具有用於支撐半導體晶 圓W之晶圓支撐5<59，可有效地連接至該第一突出部分 兄7之第二端。該第一臂突出部分557繞軸J(?5旋轉J仙 度而且該第二臂突出部分5⑽繞中心軸5S2旋轉360度， 通過一軸連接第一及第二臂突出部分5S7, 。 如第一實施例，提供輸送臂總成対6 '之可調整高度， 第一臂突出部分繞軸5幻之中心軸轉動，而且第二臂 突出部分5抑繞軸分·?之轉動允許半導體晶圓輸送單元 •562«，以輸送半導體晶圓。 25 本紙張尺度適用中國囤家標率（CNS > Α4規格（210x 297公H 一 4 528 43 經濟部中央樟準局員工消費合作社印聚 A7 B7 五、發明説明（） 如第二十一圖所示，蓋己從晶圓輸送單元）_62办 移除，揭示晶圓輸送臂升降機連接軌道車5料及輸送 臂總成5⑽。該輸送臂升降機J卯調整相對軌道車J料之 輸送臂總成別<5之垂直位置，在半導體晶圓輸送期間。 該晶圓輸送單元5<526之第二實施例’光纖通訊 路徑，如光纖，取代電纜W至晶圓輸送單元通過數位_ 類比轉換器平板在每個晶圓輸送單元562α，562卜與 電線裝具相對之光纖使用降低輸送單元562义之慣性 質量而且改善可靠度。較佳地’這類通訊發生介於該輸送 單元與系統控制器$75間。 沿著輸送單元導件66每個晶圓輸送單元 之軌道車J以路徑及運轉位置被精細地控制使用編碼機之 組合以提供資料有關三軸空間軌道車5<^之位置’晶圓臂 總成及第二突出部分5⑽之位置。絕對編碼器’顯示 在以之位匱，被放置在升降機590。一絕對編碼器’ ΓΡ〇π，顯示在之位置，被放置在軸之底部馬達 。機械腕絕對編碼器’顯示在之位置’被放置在輸 送臂總成556之末端。機械肘絕對編碼器；心ί，597 被提供在軸之底部。左絕對編碼器59(5被放置沿著該 底部馬達。一線性編碼器5卯，頭軌道編碼器_5卯及軌 道CC/)陣列絕對編碼器被放置在軌道車5料基部之底 26 本紙張尺度適用中囤1¾家標嗥（CNS ) Λ4规格（210x 297公釐） (請先閲讀背面之注意事項再填商本瓦) 裝- 訂 452843 A7 B7 五、發明説明（） 部平板2W，該後者被放置用於感應架設於該加工模組/9 表面之光線發射器，如第二圖所示。前述允許精確及可 靠的位置精確度。 晶圓輸送單元之架設顯示於第二十二圖。如圖所示， —晶圓輸送器560包括晶圓輸送單元導件566,該導件包 括一延長脊或軌道被架設於框架5M。晶圓輸送單元導件 限定晶圓輸送單元導件之移動路徑5仰, 輸送單元導件之脊包括上導軌5Wa, 知及被 架設在另一側邊之下導軌W心。半導體晶圓輸送單 元導件W抑較佳地接合每個上導軌56“及下 導軌每對上及下導軌架設於一或多個輸送單 ft 544a，544b = 每個晶圓輸送單元·5#α, 被驅動沿著個別路徑 經濟部中央標隼局負工消費合作社印装 (請尤閲讀背面之注^^項再填寫本頁) 5怀570，藉驅動操作器57i, 574架設於輸送單元導件Μ 之個別側邊以沿著輸送單元導件提供晶圓輸送單元 以如，5^补之可控制軸向運動。該驅動操作器J7人57·/爲 線性磁性馬達用於提供晶圓輸送單元之精確定 位沿著導件566,而且較佳地係線性無刷式直流電馬達利 用串聯有角度磁性部分，該磁性部分以磁te地反應架設於 每個晶圓輸送單元以“，5料6之個別電磁鐵579以迫使該 單元沿著輸送單元導件566。 27 本紙伕尺度適用中國囚家標率（CNS ) Λ4現格（2!OX 297公埯） 4 528 43 A7 B7 經濟部中央橾準局員工消费合作社印製 五、發明説明（） 光纖電纜護板572，57J提供通訊與個別晶圓輸送單元 J料而且保護設置此處之光纖電纜。電纜護板572, 57J包括複數個互相連接部分以允許晶圓輸送單元 沿著單元導件_5<56之全部運動範圍。 如第二十二圖所示，晶圓輸送單元W外被連接 沿著單元導件566脊之每側邊。每個晶圓輸送單元 5446包括一上線性軸承*5760分別地用於與上線性導軌 56如連接。再者，每個晶圓輸送單元5心^包 括一下線性軸承接合下線性導軌56# ’提供穩 定性及負載於該軌道重量更均勻分佈= 參考第二十二圖至第二十四圖，該上及下線性軸承 576α, 57分也提供一裝置藉由延伸軌道車上方晶圓臂 總成556之垂直軸可被調整》晶圓臂總成轉動在一平 面儘可能接近至絕對水平平面在晶圓加工器具內晶圓輸 送是重要的。爲達此目的，該輸送臂總成之下肘部殼體 ，顯示於第二十五圖被架設於晶圓輸送單元之底 部平板被提供一傾斜調整。 該下肘部殼體以0被架設至底部平板’2"，如第二十 一圖，第二十三圖及第二十四圖通過上架設螺絲272及下 架設螺絲2以。該底部平板2"輪流地被固定於升降機馬 達3卯以上升或下降晶圓臂總成W，較佳見於第二十五Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention () With reference to the first figure, a preferred embodiment of the semiconductor wafer processing apparatus Sichuan is shown. The processing tool may include an interface section / 2 and the processing section 3 including a semiconductor wafer cassette 76 of a plurality of semiconductor wafers. The wafer is generally designated as W and can be loaded into the processing tool or unloaded through the interface section 72. In particular, the wafer cassette / 6 is preferably loaded or unloaded through at least one inlet and outlet such as the first inlet and outlet on the processing equipment toward the outer wall. An additional second import / export W can be provided in the interface part / 2 of the processing appliance II? To improve access and import / export? 2 can be used as an input and import / export B can be used as an output. Individually, the power door i5 can be used to cover the access door i2, 55, thus isolating the inside of the processing appliance from the clean room. Each gate% can consist of two parts. The upper part and the lower part respectively move up and down into the front surface of the processing appliance to open the inlet and outlet and allow access. A wafer cassette is typically used to transport a plurality of semiconductor wafers. The wafer cassette 76 is preferably positioned to provide a stable semiconductor pattern in an up or vertical position during the transfer of a semiconductor wafer into or out of a processing tool. 'A clean room was effectively added to the front surface of the processing appliance to reduce the amount of harmful pollutants. The pollutants were inserted or moved in the wafer cassette M. ^ The paper size is applicable to China ’s family standard; U'NS) M specifications ( 2i0 X 297 mm): (Please read the precautions on the back before filling out this page) -Packing 528 43 A7 B7__ V. Description of the invention () Except during the period when the processing equipment is introduced into the processing equipment, a plurality of wafer cassettes are introduced into the processing equipment / 0 or at the same time is removed to reduce the opening of the inlet and outlet i2, and the processing equipment is exposed to the clean room environment. The interface part is added to the processing part of the processing appliance 7 · /. The processing section " includes a plurality of semiconductor wafer processing modules for performing different semiconductor processing steps. In particular, the embodiment of the processing tool shown in the first figure includes a plating module ⑼ that defines a first side surface of the processing portion. The processing part of the processing appliance effectively includes added modules, such as a pre-wet module U and a resistance strip module W, as opposed to a plating module M. Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Justice ------------------------ Install (please read the precautions on the back before filling this page) Optionally, it can be used to implement additional processing Other modules of functions are provided in the processing tool iO. The special processing performed by the processing module of the processing appliance / 0 may be different or of the same nature. Different liquid and gas processing steps are used in different continuous relationships. The processing apparatus is particularly effective in allowing a series of composite programs to be continuously operated with different processing modules, and different processing solutions can be established. The whole procedure effectively achieves no human operation and is in a highly controlled working space ", thus reducing the human operation time and the probability of contaminating semiconductor wafers. The processing module of the processing appliance is preferably a modular, interchangeable, isolated unit. The processing function performed by the processing tool 70 is changed, adding flexibility to the setting of the processing tool and allowing the processing method to be changed. Additional wafer processing modules can be added to the processing equipment ii? Or replace existing processing modules. The paper size is applicable to Chinese National Standards (CNS) Λ4 specifications (210X297 mm) 4 52 8 Printed by the Consumers' Cooperative of the China Standards Bureau of the Ministry of Economic Affairs Home A7 B7 V. Description of the invention () 19. The processing tool of the present invention preferably includes a rear locking surface M that engages the sides of the processing tool. As shown in the first figure, the air supply pipe 26 is effectively provided with an intermediate facing processing module of the processing portion. The interface portion i2, the side of the processing portion, the locking surface, and the air supplement pipe 26 preferably provide a closed working space within the processing appliance / 0. The air supplement pipe 26 may include a duct to connect a filtered air source (Not shown) Used to provide clean air into processing equipment. More specifically, the air supplement pipe 26 includes a plurality of air vent intermediate processing modules / 9 for guiding clean air into the working space. Referring to FIG. 16, a discharge duct 59 is provided adjacent to the wafer conveying unit guide 66. The frame 65 is used to remove the circulating clean air and pollutants. The exhaust duct M is connected to each processing module / 9 for attracting replenishing clean air there. In particular, clean air is captured and filled into the working space of the processing appliance ii via the air replenishing pipe 26. This air is attracted to the wafer conveying unit for 6 hours and enters the processing module 79 through a plurality of air vents · 57, which are formed in a rack or a processing deck by a discharge fan (not shown) connected to a discharge duct output. Each processing module M is directly connected to the discharge duct, 59 in the processing tool / 0. This air can be drawn out of the discharge duct 59 of the processing tool through the rear locking table 靣 or through the bottom of the surface of the processing tool. Providing an enclosed work space and controlling the environment within the work space significantly reduces the occurrence of contaminants in processing equipment. _ 10 This paper size applies to China® Home Standard (CNS) Λ4 size (210X 297 mm) I--I ^^ 1 ί -'- n-士 j / n: — ^ 1 ΐ »· -0 (please first (Please read the notes on the back and fill in this page.) Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. The group forms the side of the processing appliance it). The side of the processing instrument can be adjacent to the gray room environment. Compared with the clean room, the ash room has fewer precautionary measures to prevent pollutants. Using this specification to reduce factory costs, when the wafer module electronics of processing components and processing equipment are allowed to be obtained, the processing equipment requires normal maintenance. The user interface is provided as shown in the first figure. The user interface 30 is effectively a touch screen cathode ray tube control display that allows a finger to touch the display screen to use different control functions within the processing tool 70. An additional user interface JO is provided behind the processing equipment or within individual processing modules so that the processing equipment can function from another location to surround the processing equipment. A mobile user interface is provided to allow the operator Move around the processing equipment / (? And observe the operation of the processing elements. This user interface is used to familiarize with special functions and run to processing modules and semiconductor wafer transfer units 62, 64. Each module within the processing equipment ^^ 20, 22, 24 preferably include a window with a visual inspection of the processing chamber to allow processing equipment to run. Further, stepwise, vent holes are effectively provided in each processing module 2)), 2_ ?, N Above the surface. The processing module electronic circuit is preferably placed adjacent to the vent hole to allow circulating air to discharge the heat generated by the appropriate type of electronic circuit. 3 ___11 This paper is suitable for China 囷 S house standard soap (CNsTa ^ 格 (-{PLEASE Please read the notes on the back before filling this page) Installation * 1T 452843 A7 B7 V. Description of the invention () The working space in the interface section 72 and the processing section of the processing equipment embodiment of the Sichuan are shown in the second figure. The interface section 72 includes two interface modules 59 for operating a wafer cassette / 6 in a processing tool. The interface module 5 & 59 accepts a wafer cassette / 6 through an HD port and stores the wafer cassette for subsequent semiconductor wafer processing . In addition 'The interface module 5 < §, Storage of cassettes for removal from processing equipment 'When the processing of semiconductor wafers in individual cassettes / 6 is completed β Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperatives 11 (Please read the back Please fill in this page for legal matters) Each interface module? < §, including wafer swing gate 40, W and wafer cassette. Lifter 42W. The wafer cassette revolving door 40 is used to roughly change the wafer cassette M from a stable vertical direction to a horizontal direction, and the semiconductor wafer acquisition there is improved. Each cassette lifter 42.M has an individual cassette support 47, which is intended to hold the cassette i6. Each cassette lifter 42, β is used to fix the cassettes / 6 placed in the transport position or withdraw position. The operation of the interface module 35 is described in detail below. In the embodiment of the present invention, the first interface module 55 is used as an input wafer cassette interface for receiving unprocessed semiconductor wafers into the processing jig 70. The second interface module can be used as an output cassette interface to fix processed semiconductor wafers removed from the processing equipment. The wafer transfer unit 6Z in the processing equipment can access the wafer cassette M fixed by any interface module. 12 Dimensions ^ Use Chinese storehouse standards (CNSTA4 specifications (2 丨 0X 297) 芨: 4 528 4 ο Α7 ___ Β7 V. Description of the invention () --------- Installation ------ Order { Please read the notes on the back before filling this page.) The semiconductor wafer conveyor 60 shows the intermediate processing module 22. W and the interface module Ji ?, as shown in the second figure. The wafer conveyor 6 includes a wafer transfer unit H W for transferring individual semiconductor wafers between the interface module and the wafer processing module. The wafer conveyor 60 effectively includes a transfer unit guide 66, such as an extension track, which defines a plurality of paths 6S, 70 for the wafer transfer unit in a processing tool < 52. The wafer conveyance unit 62 in the path may pass through the wafer conveyance unit ^, and along the conveyance unit guide 66 in the conveyance unit < 52, to be positioned on the second path 70 during the movement. The processing tool may include an additional wafer transfer unit to facilitate semiconductor wafer FF transfer between plating modules 20, 22, 24 and wafer interface modules 3S, J9. Employees of the Central Bureau of Standards, Ministry of Economic Affairs, printed by the cooperative. More specifically, the second arm protrusions support the semiconductor wafers. The vacuum conveys the appropriate conveying unit 62 to move the guides 66 along the conveying unit to access the wafer support. . After reaching the proper position along the unit guide 66, the first protruding portion 87 and the second protruding portion rotate to approach the wafer support 3. The second protruding portion S3 is placed above the wafer support and then lowered toward the wafer support. Engage the pointer assembly Yang 9.该 vacuum / vacuum support < 59 is removed, and the second protrusion 55 of the semiconductor wafer held by the pointer assembly in the processing module can be lowered and removed from below the semiconductor wafer. The wafer bonding pointer is fixed. The paper scale is suitable for Sichuan S Standard (CNS) Λ4 specification (2i0x297 mm) 4528 43 A7 B7 V. Description of the invention () After the processing of the semiconductor wafers 20 and 22 is completed, the wafer is transported unit < 52, < 54 Retrieve the wafer and either transport the wafer to another processing module 22, 24 or return the wafer to the wafer cassette for storage or removal from the processing tool. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs · n ^ i I---I----I s-1 i ^^^ 1 I ^ ilf ^ —J-* (Please read the notes on the back first (Fill in this page again.) Each wafer transfer unit ^ Accesses the wafer cassette adjacent to the conveyor for retrieving or placing semiconductor wafers from the cassette. In particular, the wafer transfer unit M is shown to retrieve the semiconductor wafer from the wafer cassette 76 on the elevator 42 shown in the second figure. More specifically, the connected second protruding portion and the vacuum support $ 9 are inserted into the wafer cassette. / 6, the cassette is positioned at the second protruding portion of the extraction position a and the vacuum support 59 enters below the lower surface of the bottom semiconductor wafer F fixed by the cassette i6. Vacuum can be applied by vacuum support, when vacuum support < 59 is positioned below the center of the removed semiconductor wafer F. The second protruding part, the vacuum support S9 and the semiconductor wafer V are attached here to be lifted slightly by the transfer arm lifter. Finally, the first highlight < 57 and the second protruding portion are rotated to remove the semiconductor wafer from the wafer cassette / 6. The wafer transfer unit ^ W transfers the semiconductor wafer F to the processing module 79 for processing. Since then, the wafer transfer unit < 52 can run along the path to a position adjacent to the appropriate processing module 22, 24, which is used to place the semiconductor wafer on the wafer processing support for semiconductor wafer processing = _______ 14 Thai paper size Applicable to China Valves Standard (CNS) A4 specification (ϋ〇χ 297 公 爱) ™ Printed by Employee Consumer Cooperatives of Central Standards Bureau, Ministry of Economic Affairs 52843 A7 B7 5. Description of the invention () Refer to the third to eighth interface module The operation of the interface module 56 is shown in detail. The following discussion is limited to wafer interface modules but is also applicable to wafer interface modules, as long as each wafer interface module 59 operates in substantially the same manner. Preferably, the first wafer interface module and the second wafer interface module serve as an input module and an output module of an individual semiconductor wafer cassette / 6 of a processing tool. On the other hand, two modules can act as input and output. More specifically, the wafer cassette / 6 holding the unprocessed semiconductor wafer can enter the processing instrument through the inlet and outlet W and be temporarily stored in the first wafer interface module until the semiconductor wafer is used in the cassette for processing 76 was removed. The processed semiconductor wafer can be transferred to the cassette M of the second wafer interface module, and is temporarily stored and / or removed from the processing equipment through the wafer transfer unit 62,6 ¥. The groups 55, 39 can be directly accessed by the wafer transfer unit 62 in the processing device M for transferring semiconductor wafers. According to the present invention, a plurality of wafer interface modules 55 accessible to each wafer transfer unit 62, 64 are provided, which facilitates the transfer of the semiconductor wafer F through the processing tool M. Each of the crystal map interface modules preferably includes a cassette swing door buckle and an adjacent cassette lift β. The access door ^ W is adjacent to the cassette swing door W respectively. The semiconductor wafer cassette M was imported and exported through J2, B. {Please read the precautions on the back before filling in this page.) This paper size is applicable to the Chinese standard (CNS) A4 specification (2! 0x297 mm) 452843 A7 _B7_ 5 2. Description of the invention () The processing device μ is introduced or removed. The semiconductor wafer cassette is preferably placed in a vertical position before the cassette tray 50 is transferred to the processing tool. The cassette tray is shown in the ninth figure. The vertical position of the wafer cassette and the semiconductor wafers provides a certain orientation to maintain the semiconductor wafers within the percentage of the semiconductor wafer cassettes used for transport. 3 The wafer cassette swing gates, preferably including saddles, are planned. Provide two saddles with a fixed crystal box °, and then place two wafer cassettes 76 into the processing equipment or remove them. The single opening of the individual access door JJ, 5 (5 will make the processing equipment Kawauchi working space 7 / Minimize contact with the clean room environment. Each saddle 45, including two forks that can be engaged with the cassette tray 50. The two saddles are driven by the in-box motor of the wafer box rotary door to position the crystal in a horizontal or vertical orientation. The wafer cassette 76 and the semiconductor wafers there are preferably positioned vertically for access through the access port 52, through the work of the Central Standards Bureau of the Ministry of Economic Affairs, consumer cooperation, Du Yinhua, ^ 1 ··- -^^ 1 11 ^^ 1 ^^ 1 TJ «taxi /// --It. Hi .1— r ^ i ^ 1 * U5,, -e (Please read the precautions on the back before filling this page) and level The ground is positioned in the transfer or extraction position to provide wafer access here to the wafer transfer units 62, 64. In the third figure, it is fixed by the cassette swing door The wafer cassette is also called a cassette / 5 in a fixed position (called a load position). The semiconductor wafer in the cassette M can be stored for subsequent processing. Semiconductor wafers within a circle of μm. Wafers can be stored for subsequent removal from processing equipment, and access through access □ 3 _-— 16. 'This paper wave standard is common in the national standard (CNS > Λ4 specification (210X297) ) ~~~~ ---— 4 528 4 3 Α7 Β7 V. Description of the invention () With reference to the third figure, the cassette 76 supported by the cassette elevator is also referred to as the cassette being pulled out or exchanged. Location. The semiconductor wafer is either removed from the cassette or placed in a cassette, which is passed through the wafer transfer unit. < 52, the material is positioned at the extraction position. The wafer cassette revolving door W and wafer centrifugal lifter exchange wafer cassettes to transport a wafer cassette 77 having a processed semiconductor wafer from a withdrawn position to a fixed position for removal from the processing tool M. In addition, this type of exchange can transport wafers 77 centimeters. This cassette has raw semiconductor wafers from the fixed position to the extraction position to provide a wafer transport unit. < 52_ Access the semiconductor wafer here. Printed by the Central Government Bureau of the Ministry of Economic Affairs, Consumer Cooperatives (please read the precautions on the back, and then fill out this page). The cassette U i7 exchange is described with reference to Figures 4 to 8. Specifically, the saddle # is placed under the power shaft # of the cassette elevator β. The shaft is connected to a power cassette support 47 for fixing the semiconductor cassette / 6. The shaft and wafer support attached here are reduced by ¥ 7 as shown in the fourth figure and the shaft W passes between the yoke between saddle M. Referring to the fifth figure, the inner motor of the shaft ^ rotates the wafer box support 47 around a center line through the shaft ^, and provides a wafer box U opposite to the wafer box 7 * 5, and the wafer box / 5 is a wafer box Turnstile / 0 fixed. The two saddles of the cassette revolving door M are then tilted horizontally as shown in the sixth figure. The shaft ^ of the wafer box elevator 42 is lowered and the wafer box 77 and the saddle are engaged. If the paper size is in accordance with the Chinese valve standard (CNS) A4 specification (210 × 7mm) 452843 A7 _B7 V. Description of the invention () As shown. The axis w and the wafer cent support are additionally reduced to the rotation of the wafer circle 76. Refer to the eighth figure ′ Rotating degree of the cassette swing door to exchange the cassette? 7. Cassettes / 7 with processed semiconductor wafers are accessible via inlets and outlets for removal from processing equipment. A wafer with raw semiconductors is placed for engaging the cassette support 47. The transfer process steps shown in Figures 3 to 8 can be reversed to lift the wafer cassette into the extraction section and provide access to the semiconductor wafers to the wafer transfer units 62, 64. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs --------- ^ ------ ΐτ (Please read the note on the back before filling this page) Figure 10 shows the processing device One way to organize. As shown, the device includes an input / output assembly < 5⑽, left and right processing module 卯 5, < Chuan, wafer transport system, top discharge assembly, and end plate 525. As shown in the figure * The left and right processing modules are fixed to the other with a 0-round wafer conveyor—the modules form a processing chamber with an inlet and an outlet 555. A plurality of processing modules can be fixed in a longitudinal specification to provide a Extended processing room 'This processing room can implement most of the processing procedures on each wafer, or you can choose to process most of the wafers at the same time. 3 In this case, the wafer transport system of the device M < 50 is programmed to work with one or more previous or subsequent wafer transfer system cents. The eleventh figure shows one way to configure the processing head in the device. In this embodiment, the left processing module includes three processing heads for cleaning and drying each wafer after electrochemical deposition, and Two processes before electrochemical deposition --- H _--- The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (2IOX297 mm) 452843 Employees' cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs and Consumer Cooperatives printed A7 B7 V. Description of the invention ( The head is used to perform wafer wetting. In general, the left processing modules S include a support module, which has a processing head for pre-processing and post-processing of wafers relative to electrochemical copper deposition. The right module includes an electroplating module and includes five reactor heads for electrochemical copper deposition. In the embodiment of FIG. 11, a wafer alignment station is provided to determine the proper direction of the thickness of each wafer. When each wafer is processed in the device, the β wafer alignment can be recorded on each wafer according to the induction. No. or its analogs. The twelfth figure and the thirteenth figure respectively show the embodiments of the left and right processing modules. In these figures, the outer part of the housing has been removed separately and thus contacts different system components. Preferably, electronic components such as power supply, controller, etc. are placed in the processing module < 505 and above, when mobile components and the like are placed under each processing module, the fourteenth figure shows a perspective view of the input module ，, whose module has a removal plate as viewed from the inside of the device . The fifteenth figure provides a similar diagram of the external device if? The embodiment shown here is a wafer alignment station < 55 (5 and wafer alignment controller are provided in the input module category. The mechanical controller used to control the wafer transport system is placed there. To track the processed wafer, the input module 〇Stood for one or more wafer mapping sensors to sense the wafers present in each cassette. In the input module 5 other components include a system control computer < 57 ^ 5 and four-axis controllers 0 β This system control computer is generally responsible for adjusting all the rotations of the device M. 19 --------- Installation ------ Order (please read the notes on the back before filling the page on this page) This paper size is applicable to the Chinese threshold family standard 隼 {CNS) Α4 OX 297 males *) 452843 Printed by A7 of the Central Standards Bureau, Ministry of Economic Affairs, Consumer Cooperatives. V. Description of the invention () Semiconductor wafer conveyor processing equipment includes semiconductor wafer conveyors used to transport semiconductor wafers through the processing equipment. . Preferably, the semiconductor wafer conveyor 60 has access to each of the cassette interface modules ϋ J9 and each processing module 79 in a processing tool for transferring semiconductor wafers. This includes processing modules from the other side. An embodiment of a semiconductor wafer conveyor is shown in FIG. The semiconductor wafer conveyor generally includes a wafer transfer unit guide 66 preferably including an extended ridge or rail mounted on a frame (55. Alternatively, the transfer unit guide may be formed into a track or used for guiding The length of the wafer transfer unit can be changed. The length of the wafer transfer unit is changed and planned to allow the wafer transfer unit 62, 64 to access the interface module 5 and the processing module 20, 22. 24. The wafer conveyance unit guide 66 defines a movement path to the conveyance unit 61. Referring to the sixteenth figure, the ridge of the conveyance unit guide 66 includes guide rails 6J, 64 mounted on opposite sides. Each semiconductor conveyance unit 62 64, preferably with guide rails (JJ, to. Each rail can be set up with one or more conveying units < 52. Protruding part, 7J is fixed to single pilot < 56 On the opposite side, the guide is used to provide stability of the conveying unit and prevent the unit guide M from being worn. Each of the conveying units 62, 64 includes rollers 77 which are arranged to straddle individual projections 69, 7J along the unit guides. 20 This paper size applies the Chinese National Standard (CNS) Λ4 specification (210X 297mm) " Packing-(Please read the precautions on the back before filling this page) Order 452843 Printed by the Quality and Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Α7 Β7 5. Description of the invention () It can be understood that it is a wafer conveyor < 50 is formed in another specification according to the processing tool M internal interface module ϋ 39 and the processing module 20. 22, the configuration 3 duct 5 < §, 59 is preferably a fluid exhaust connection fan from each processing module i9 connecting the protruding portion and the working space for removing the circulating air from the processing space. Each wafer transports the cell center to an anvil along a separate path and is driven by a suitable driver. More specifically, the operator is driven; 7, M is erected to individual sides of the transfer unit guide M to provide a wafer transfer unit < 52, which can control the axial movement along the guide of the conveying unit < 56 3 The drive operator 7i, is a sintering magnet. A magnetic wafer is provided along the unit guide M with a wafer transfer unit 62 with detailed positions. In particular, the actuators 7 /, 74 are preferably linear brushless DC motors. These preferred drive operators 7 /, 74 utilize a series of tilting magnetic sections that are magnetically and erected in the wafer transfer unit < 5, 6 ^ individual electromagnets 79 to force the unit along the unit guide 6 < 5. The cable shield 72 is connected to the individual wafer transfer unit cores, and the frame M is used to protect communication and power cables. The cable_board7 includes a plurality of interconnecting sections to allow the wafers to be guided along the transport unit. < 52, with its range of motion. 21 --------- ^ 装 — (Please read the precautions on the back before filling in this tile) --5¾ 1- This paper size is applicable to the Chinese Standard (CNS) Α4 size (210X 297) (Centi) 452843 Huang Gongxiao Cooperative Cooperative Association B7 of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention () As shown in the seventeenth figure, the first wafer transport unit 62 is connected to the guide 6 < First side of 5 ridges. Each wafer transfer unit < 52, W includes a linear bearing 76 for engaging linear guides < 5 and 64. Furthermore, the wafer conveying units 6Z each preferably include a parallel roller 77 for engaging the protruding portion 69, which is formed on the ridge of the guide member M and provides stability. The seventeenth figure additionally shows the electromagnet 79 of the first wafer transfer unit 62, which is set up at a position that magnetically reacts with the drive actuator 77. The drive actuator 7i and the electromagnet 79 provide the axial movement and direction control of the wafer transfer unit along the transfer unit guide 66. & Semiconductor wafer transfer unit Crystal pattern conveyor < 5 (? of semiconductor wafer transport unit < 52, 64 The preferred embodiments are described in Figs. 18 and 19. Generally, the semiconductor wafer transfer unit d includes a movable frame or a rail car 54 connected to individual sides of the transfer unit guide 66, and a wafer transfer arm assembly is connected to the rail car for supporting the semiconductor wafer V. And the wafer conveyor arm lifter is used to adjust the height of the wafer conveyor arm assembly shirt β relative to the rail car ^^ Refer to Figure 18, cover < 5 * 5 surrounds the part of the rail car which faces away from the guide of the conveying unit. The rail car material includes linear bearings 76 for engaging with individual guide rails 65, and the guide rails are erected on the guides of the conveying unit Μ j paper scale towels household materials (CNS) Α4 * «· (210Χ297-ή- #) (Please read the precautions before filling this page). ^ Request.,-* 4 52843 A7 B7 V. Description of the invention (). The linear bearing 76 maintains the fixed relationship between the railcar and the conveying unit guide 66 and allows the axial movement of the railcar. The β roller 77 engages a special protruding sand for preventing the railcar material from rotating around the guide rail and providing the wafer conveying unit 62 Stability: The electromagnet system is shown to be connected to the railcar at such locations to magnetically interact with the drive operator and individual wafer transfer units of 7J to interact with each other. The wafer transfer arm assembly extends above the top of the rail car. The wafer transfer arm assembly 56 includes a first arm protruding portion connected to the shaft Si at a first end. <? 7. The second arm projection 55 is effectively connected to the first arm projection < 57 of the second end. The first arm protruding portion 87 can be rotated around the axis by 3 degrees and the second arm protruding portion can be rotated around the center line M by a degree. The center line connects the first and second protruding portions by < 57, one axis 0 printed by the Consumers ’Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ---------, select ------ ir (please read the precautions before, and fill out this (Page) The second arm protruding portion preferably includes a wafer support wiper at the end for supporting the semiconductor wafer V during transportation along the wafer conveyor. The wafer transfer arm assembly preferably includes an air chamber connected to the wafer support module 9 for using a vacuum and fixing a semiconductor wafer to provide an adjustable height of the transfer arm assembly. A protruding part S7 rotates and the second arm protrudes, allowing the transfer arm to access each semiconductor of all processing modules __ Εΐςί 1 〇Inner circle holder and each semiconductor wafer cassette is Processing load # This paper's standard is applicable to the national standard (CNS) A4 specification (2 丨 0x 297 mm > 452843 A7 B7 V. Description of the invention () The interface module 39 is fixed. This type of access process allows wafers Conveying orders 71; 62, W convey semiconductor wafers. Cover S5 has been removed from the wafer conveying unit shown in Figure 19 to show the conveying arm lifter 卯 reaching the railcar and conveying arm assembly. Conveying arm lifter Such as adjusting the relative rail car conveyor arm assembly < 56 in the vertical position, the semiconductor wafer is transported between the wafer support and the wafer holder 5 < A period of 5 rooms. Along the transport unit guide, each wafer transport unit 62, tracks < 5 'position is controlled in detail using a position designation array, such as the CCZ array W in the nineteenth figure. In a preferred embodiment of the processing device 20, each wafer holder Sii in the processing mold group has a relative light or other front-line emitter W, which is mounted on the surface of the processing module 79 shown in the second figure for The light is guided towards the transport unit guide 仏. The light emitter W may represent continuous light or be planned to generate light, and when the wafer transfer unit 62 approaches an individual wafer holder. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) The conveyor arm assembly includes a CCZ array positioned to receive light generated by the light transmitter W) 9 /. The on-axis position designation array W detects the presence of light to determine the position of the railcar along the transport unit guide 66 '. The position accuracy of the position indicator of the wafer transfer unit is preferably within a range of less than (about less than). The scale of this paper is in accordance with the Chinese National Standard (CNS). Eight materials can be seen (210X297). 5 52843 A7 B7 V. Description of the invention () I '--- ^^ 1!--I. ^^ 1-n I— " Hi / 1 ^^ ^^ 1 i I Hi ^^ 1 \ — «(Please read the intent on the back before filling out this page) It is shown on the 20th to 25th page of the wafer transfer unit Two embodiments are also provided connected to the conveying unit guide < 56 a movable frame or a rail car 5W on each side, a wafer arm assembly is movably connected to a rail car for supporting the semiconductor wafer F, and is used to adjust a crystal relative to the rail car W Wafer conveyor arm lifter with round arm total height * 5. One cover 5 magic orbit rail car-part ^ The rail car includes individual guide rails for mounting on the guide 66 of the conveying unit < 5 In turn, a linear bearing 5M is engaged. The linear bearing 5> 6 maintains a fixed relationship between the rail car 5 and the conveying unit guide 66 and allows the axial movement of the rail car J material. The electromagnet 579 magnetically reacts with the guide to drive the actuation coils 71,74. Printed by the staff of the Central Standards Bureau of the Ministry of Economic Affairs, printed by the cooperative, the total components of the wafer conveying arm 6 extend above the top of the rail car 5 heart. The wafer transfer arm assembly includes a first arm protrusion 7 connected to a shaft brother J at a first end, respectively. The second arm protrusion 5 has a wafer support 5 for supporting a semiconductor wafer W. < 59, which can be effectively connected to the second end of the first protruding part 7. The first arm protruding portion 557 rotates around the axis J (° 5 by J centigrade) and the second arm protruding portion 5 rotates 360 degrees around the central axis 5S2, and the first and second arm protruding portions 5S7 are connected through one axis, such as the first The embodiment provides an adjustable height of the conveying arm assembly 対 6 ', the protruding portion of the first arm rotates around the central axis of the shaft 5 and the rotation of the protruding portion 5 of the second arm around the axis allows the semiconductor wafer to be transported. Unit • 562 «to transport semiconductor wafers. 25 This paper size applies to China's standard of housekeeping (CNS > Α4 size (210x 297 male H 1 4 528 43) Central Zhangzhun Bureau of the Ministry of Economic Affairs, Consumer Consumption Co-print A7 B7 5 Explanation of the invention () As shown in the twenty-first figure, the cover has been removed from the wafer conveying unit) _62, revealing that the wafer conveying arm lifter is connected to the rail car 5 and the conveying arm assembly 5 该. The conveying arm lifter J 卯Adjust the conveying arm assembly of J material relative to the rail car < 5 in the vertical position during semiconductor wafer transport. The wafer transfer unit 5 < 526 of the second embodiment 'optical fiber communication path, such as optical fiber, instead of the cable W to the wafer transport unit through the digital _ analog converter plate The inertial mass of the conveying unit 562 is reduced and the reliability is improved. Preferably, this type of communication takes place between the delivery unit and the system controller $ 75. The rail car J along each wafer transport unit of the transport unit guide 66 is finely controlled by the path and the operating position. The combination of encoders is used to provide information about the three-axis space rail car 5 < ^ position ' The position of the wafer arm assembly and the second protruding portion 5 '. Absolute encoders are displayed in place and placed on the lift 590. An absolute encoder ′ ΓΡ〇π, shown in the position, is placed at the bottom of the shaft motor. The robot wrist absolute encoder 'shown at position' is placed at the end of the transmission arm assembly 556. Mechanical elbow absolute encoder; heart, 597 is provided at the bottom of the shaft. The left absolute encoder 59 (5 is placed along the bottom motor. A linear encoder 5 卯, head track encoder_5 卯 and track CC /) array absolute encoder is placed on the bottom of the base of the railcar 5 material 26 books The paper size is suitable for 1¾ house standard (CNS) Λ4 size (210x 297 mm) (please read the precautions on the back before filling the tile) Binding-order 452843 A7 B7 V. Description of the invention () Flat panel 2W, The latter is used to sense the light emitter mounted on the surface of the processing module / 9, as shown in the second figure. The foregoing allows precise and reliable positional accuracy. The setup of the wafer transfer unit is shown in Figure 22. As shown in the figure, the wafer conveyor 560 includes a wafer transfer unit guide 566, which includes an extension ridge or rail and is mounted on the frame 5M. The wafer conveying unit guide defines the movement path 5 of the wafer conveying unit guide, and the ridge of the conveying unit guide includes the upper rail 5Wa, which is erected at the center of the rail W below the other side. The semiconductor wafer transfer unit guides preferably engage each of the upper and lower guide rails 56 "and each pair of upper and lower guide rails erected on one or more transfer units ft 544a, 544b = each wafer transfer unit · 5 # α, Driven along individual paths Printed by the Consumers ’Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the note ^^ on the back, and then fill out this page) 5 Huai 570, driven by the drive operators 57i, 574 to set up the transport unit The individual sides of the guide member M provide the wafer conveying unit along the conveying unit guide to control the axial movement, such as 5 ^. The driving operator J7 is 57 · / is a linear magnetic motor for providing wafers The precise positioning of the conveying unit is along the guide 566, and preferably a linear brushless DC motor uses an angled magnetic part in series. The magnetic part is magnetically mounted on each wafer conveying unit with 6 individual solenoids 579 to force the unit along the transport unit guide 566. 27 The standard of this paper is applicable to the standard of Chinese prisoners (CNS). Λ4 is present (2! OX 297). 4 528 43 A7 B7 Printed by the Consumers ’Cooperative of the Central Government Bureau of the Ministry of Economic Affairs. 5. Description of the invention () Optical fiber cable shield 572, 57J provides communication and individual wafer transport unit J material and protects the fiber optic cables provided here. Cable shields 572, 57J include multiple interconnected sections to allow the wafer transfer unit to follow the unit guides_5 < 56 The full range of motion. As shown in FIG. 22, the wafer transfer unit W is externally connected along each side of the ridge of the unit guide 566. Each wafer transfer unit 5446 includes an upper linear bearing * 5760 for connection with the upper linear guide 56 respectively. In addition, each wafer transfer unit 5 cores include the following linear bearing joints under the linear guide 56 # 'to provide stability and load on the track more evenly distributed = Refer to Figures 22 to 24, the The upper and lower linear bearings are 576α, 57 minutes. A device can also be adjusted by extending the vertical axis of the wafer arm assembly 556 above the railcar. The wafer arm assembly is rotated in a plane as close to the absolute horizontal plane as possible. Wafer transport within circular processing equipment is important. To achieve this, the elbow housing under the transfer arm assembly, shown in Figure 25, is erected on the bottom plate of the wafer transfer unit to provide a tilt adjustment. The lower elbow casing is erected to the bottom plate '2' at 0, as shown in Fig. 21, Fig. 23, and Fig. 24, with the upper mounting screw 272 and the lower mounting screw 2 being used. The bottom plate 2 " is alternately fixed to the elevator motor 3 卯 to raise or lower the wafer arm assembly W, preferably seen in the twenty-fifth

2S 氏张尺度適用中國國家標準（CNS} A4現格（210X297公釐） ---------藏------1τ (請先閱讀背面之注意事項再填寫本頁) 452843 經濟部中央橾準局員工消費合作社印製 A7 B7 五、發明説明（） 圖。如第二十六圖所見，以橫向地被放置介於上架設螺絲 2以是壓花樞軸以6在底部平板，該平板接合一相對， 然而稍小，側向溝槽在下肘部殼體該樞軸 較佳地被塑造，相對側向溝槽以$以提供間隙介於該底部 平板2/7與下肘部殼體2/i?間以至於大約0.9度傾斜係介 於其間可獲得。與一或多個水平調整螺絲220及上與下架 設螺絲W2, 274相結合，下肘部殼體2川之角度方位及附 著輸送臂總成兄&lt;5，可被調整及固定以提供輸送臂總成 之轉動盡可能接近在絕對水平平面內，在加工器具/&lt;?內輸 送晶圓期間。 其次，下線性軸承導件57&lt;$έ之順應附著是重要的對 於順暢沿著導件566之晶圓輸送單元W补運作。提 供這類順應附著，較佳地允許之浮標，在下線性 軸承導件57分被獲得藉由順應扣接技術之使用。漂浮插銷 22/關於架設螺絲222被定位，藉由Ο形環，較佳地 F/rCW被定位關於該漂浮插銷。當底部平板203之埋頭孔 內被設置於下線性軸承導件5766之螺孔，如第二十八 圖所示，螺絲支撐漂浮插銷2以之突緣，輪流地 支撐〇形環22J。該0形環225支撐埋頭孔之肩部-M6。 然而，即度當螺絲被拉緊，相對移動被允許介於下線 性軸承導件及該底部平板間以利於緩和在導件上 方運動。 29 __ ... _ 墨— —— &quot; 本紙》•尺度適用中國國家標準（CNS ) Λ4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) &quot;衣· 訂 4 52843 A7 B7 五、發明説明（） 控制系統 {請先閱讀背面之注意事項再填寫本頁) 參考第二十六圖，顯示加工器具之控制系統 實施例。如圖所示，該控制系統7⑽大致上包括至少一原 控制器用於控制和/或偵測加工器具川之全部功能。 該控制系統i⑽較佳地係被配置以分層規格^原控制 器包括一處理器以電力地連接複數個次系統控制單元 如第二十六圖所示。該控制次系統較佳地控制及偵測該相 對裝置之元件運作（即，晶圓輸送器60，加工模組2二 24,介面模組59)。該控制次系統較佳地係被規劃以 接納指令或運轉指令如軟體碼從個別原控制器/W，/们而 來。該控制次系統7川，較佳地提供過程與狀態資 料至個別原控制器/0/, 。 經濟部中央標準局貝工消资合作杜印製 更詳細地，原控制器連接至介面模組控制//0可 控制每個半導體晶圓介面模組59。再者，原控制器 連接至輸送控制器用於控制晶圓輸送器仙之運轉 及複數個加工模組控制/以.ii5相對於加工器具^^內半 導體晶圓加工模組20，22。根據本發明加工器具70之控制 系統i卯包括附加原控制器M2如第二十六圖所示用於偵 測或運轉附加次系統，這類附加晶圓加工瘼組經由附加加 工模組控制四控制次系統較佳地被連接至每個原控 制器/0人/02。該原控制器70/, 702較佳地互相連接而且 每個輸送加工資料至另一控制器中。 -电 ______30_______ 本紙ft尺度適用中國國家標準（CNS ) a4規格（21〇_X297公趁） 4 528 43 A7 ______B7 五、發明説明（） 每個原控制器川/, 接納及輸送資料至個別模組控 (請先閱讀背而之洼意事項再填寫本頁) 制次系統在控制系統/⑽之較佳實施例，雙向 記憶映射裝置被提供中間原控制器及被連接的每個模組次 系統。特別地’記憶映射裝置760，/6人被提供中間原 控制器及主控制器/30, U/, 在個別介面模組控制 輸送控制器/以及加工模組控制內。 在控制系統/⑽內每個記憶映射裝置/仰-M2較 佳地係雙埠兄必/由所提供用於同步地儲存資料。 特別地，原控制器Mi可寫資料至相對主控制器i50之記 憶位置而且主控制器DO可同時地讀取資料。另一方面， 原控制器可讀取資料由被主控制器HO所寫之映射記 憶裝置。利用記憶映射裝置以處理器速度提供資 料輸送。記憶映射裝置較佳地被提供中間使用介面％ 及原控制器川人用於輸送資料。 經濟部中央標準局員工消費合作社印製 使用者介面別較佳地連接每個原控制器Μ人702。該 使用者介面可較佳地架設於加工器具之外部或在遙 遠位置以提供一操作者加工器具之加工及狀態資料。附 加地，一操作者可輸入控制順序及加工指尚用於加工器具 經由使用者介面了該使用者介面較佳地被支撐由 加工器具內一般目的計算機。該一般目的計算機較佳地 包括一料6 /⑽Μ//::處理器，但其他處理器可被利用。 本紙張尺度適用中國國家標隼（CNS ) Α4規格（210Χ 297公廣） 4 5284,i Α7 五、發明説明（） 每個模組控制次系統，包括介面模組控制，晶圓 輸送控制器i/了及每個加工模組控制較佳地被 規劃以主動及被動排列。該模組控制次系統UO, 較佳地係包圍在個別模組內，如晶圓介面模組ϋ 39，晶 圓輸送器仙或加工模組2/λ 2Ζ 內。原控制器及相 對主控制器730,以人較佳地被實施在印刷電路板或 /iSZ板，該板被架設在一般目的計算機支撐使用者介面川 內。每個原控制器川2，川2較佳地包括Moiofo/ci所提供之 6&lt;1£：C㈨0處理器而且在控制系統7⑽內每個主控制器 及被動控制器較佳地包括/»&amp;/所提供之處理器。 每個主控制器730，以人被接合個別被動控制器經 由資料鏈/26, P7, /29如第二十七圖至第三十圖所示。每 個資料鏈72&lt;5; 727, /29較佳地包括一光學資料介質如 所提供之然而，該資料鏈 U7, 729可包括另一資料輸送介質。 經濟部中央標準局員工消费合作社印製 (請先閲讀背*之注意事項再填寫本頁) 參考第二十七圖，用於介面模組控制i川之主/被動控 制次系統被顯示。每個主動及相關被動規格較佳地相對單 一模組（即介面，輸送器，加工）在加工_具i〇內。然而 ，一主動控制或偵測複數個模組。該主/被動規格描述於第 二十七圖而且相對介面模組控制/川附加地應用於其他模 組控制次系統。 32 本紙伕尺度適用中國丨S]家榡率（CNS ) Μ規格{ 2丨0&gt;&lt; 297公缓） 4528 4 A7 B7 五、發明説明（） 該原控制器經由記憶映射裝置Y抑被連接至相對 介面模組控制/70內之主控制器750。該主控制器被 連接至複數個被動W人/β。Μ被動控制器可較佳地 連接至單一主控制器以化以2而且每個被動控制器可被規 劃以控制及偵測單一馬達或加工元件，或複數個馬達及加 工元件。 加工器具之控制系統i⑽較佳地利用閃速記億體 。更特別地，用於運轉在控制系統內之每個主控制器 及被動控制器i利-以7之運轉指令或程式碼有效地 .被儲存在相對原控制器/们之記憶體內。當動力上升 時，該原控制器探詢相對主控制器以(?-以2及下 載該適當運轉指令程式以運轉每個主控制器。相 同地，每個主控制器以卜/·^探詢個別被動控制器&quot;心^7 。此後，該主控制器啓動從原控制器7以，M2下 載適當程式至被動控制器i利-70經由主控制器/5心以2。 經濟部中央樣隼局貝工消资合作社印製 (請先閱讀背面之注意事項再填寫本頁) 每個被動控制器被規劃以控制及偵測單一馬達或複數 個馬達在相對加工模組W，介面模組5&amp; 59及晶圖輸送器 仰內。此外，每個被動控制器i仰-W7被’規劃以偵測及控 制加工模組/9內之加工元件任一被動控制器，如顯 示於第三十六圖之被動控制器，被規劃以控制和/或偵 測伺服馬達及加工元件以4。 33 ^紙掁尺度適用中囡S家標準（CNS ) A4規格（21〇&gt;&lt; 297公釐&gt; 452843 經濟部中央標率局員工消费合作社印製 Α7 Β7 五、發明説明（） 每個被動控制器包括一連接至複數個埠介面之被動處 理器。每個璋介面用於控制和/或偵測伺服馬達及加工元件 。例如，一璋可連接至伺服控制器/76，該控制卡被規 劃以運轉一晶圓輸送單元心α, 620。該被動處理器777運 轉晶圓輸送單元Μα, 經由該埠及伺服控制器i76。更 特別地，該被動處理器777運轉晶圓輸送單元內 之伺服馬達及偵測通過伺服控制器之馬達狀態。 另一方面，不同被動控制器以仏運轉在單一加工 器具裝置內不同元件’如介面模組這類。更特別地’介 面模組控制及介面模組之元件被描述於第三十二圖 .β被動控制器2仰運轉轉門馬達/衫及偵測該轉門扣之位 置經由增量轉門編碼器Υ卯。該被動控制器2川較佳地被 連接至轉門馬達/幻及轉門編碼器以0經由伺服控制卡（ 顯示於第三十五圖）^被動控制器以·/運轉及偵測轉門扣 之鞍台以藉由控制鞍台馬達及偵測鞍台編碼器經 由伺服控制卡。 被動處理器之可連接至介面控制卡用於控制及偵 測個別加工模組以內之加工元件。例如’流量感測器657 提供加工流體之資訊流量至該模組內之加工槽。該介面控 制卡被規劃以解釋由流量感測器心7所提供資料或其 他加工元件成爲一形式，該型式由相對被動處理器772所 34 — 本紙张尺度適用中國囚家檁準（CNS ) Λ4規格（2Ι0Χ 297公釐） ---------扯衣------，?τ------A (靖先閲讀背面之：&gt;x意事項再填寫本頁) 4528 43 經濟部中央標準局貝工消f合作社印製 A7 B7 五、發明说明（） 分析。再者，介面控制卡運轉一加工元件，如流量控 制器以反應自相對被動處理器772產生之指令。 被動控制器包括一或多個伺服控制器而且一 或多個介面控制連接被動處理器770-772之個別埠，該被 動處理器用於允許控制及偵測不同元件馬達之能力及自單 一被動控制器之加工元件， 另一方面，伺服控制器及介面控制器包括一安裝板上 處理器用於改善加工及運轉之速度。由編碼器或加工元件 所提供至伺服控制器或介面控制器之資料立即地被板上處 理器所處理，該處理器也控制個別伺服馬達或加工元件以 反應該資料》在此規格，該被動處理器輸送資料從介面處 理器或伺服控制處理器至個別主控制器及原控制器。 輸送器控制次系統 該輸送器控制次系統//5用於控制及偵測晶圓輸送器 60及晶圓輸送單元62α, 或5626或5以a, 5·/补 之運轉，顯示於第二十九圖。通常，輸送控制器/iJ之被 動控制器連接至驅動致動器77用於以控制地沿單元導 件移動及偵測晶圓輸送單元（52α。再秦，被動控制器 7心運轉晶圓輸送單元62α或562α或之輸送臂總成 56及半導體晶圓之輸送。相同地，被動控制器被規劃 以運轉晶圓輸送單元或5626或及驅動致動器 35 本紙倀尺度適用中國國家標準（CNS ) Λ4規洛（210X297公缝） I ( 1 i—^衣 I Ϊ I It ^ {請先閱讀背面之注意事項再填寫本頁) 452843 經濟部中央榡芈局負工消費合作社印製 Α7 Β7 五、發明説明（） 被動控制器及光偵測器97之接界，驅動致動器 以，線性編碼器及晶圓輸送單元62α詳細顯示於第三 十六圖。該被動控制器之被動處理器/7/較佳地連接 至伺服控制器776。被動處理器777控制晶圓輸送單元62α 之線性部分，藉經由伺服控制器776運轉驅動致動器W。 光偵測器沿著導件&lt;56提供晶圓輸送單元之線性位 置資料。附加地，線性編碼器被利用來詳細地沿著導 件Μ偵測晶圓輸送單元之位置。 被動處理器77i可控制及偵測相對晶圓輸送單元62α 之輸送臂總成批運轉。特别地，被動處理器/7/可被連接 至軸W內輸送臂馬達用於以控制地轉動第一及第二臂 突出部份&lt;57,利。增量輸送臂轉動編碼器/97被提供在晶 圓輸送單元62α之軸&lt;55內用於偵測輸送臂總成之轉動 及提供轉動資料至伺服控制器776及被動處理器/7/ = 被動控制器有效地連接至升降機90內輸透胃胃 度馬達用於控制輸送臂總成之高度位置。增窠 臂高度編碼器/卵被提供在輸送臂升降機德成如內用#@ 測輸送臂總成狀之高度。 此外，被動控制器被連接至空氣補充控制_致動 _^- 本紙張尺度適用中國S家標準（CNS ) Α4規格（2丨0'〆297公釐） ---------^------1Τ (請先閱讀背面之注意事項再填寫本f) A7 ^52843 五、發明説明（） 器（未顯示）經由一介面控制器用於控制一真空支撐59內 真空用於選擇地支撐半導體晶圓。 {請先閲讀背面之注意事項再填莴本頁) 絕對編碼器被提供在晶圓輸送器，介面模組 55, 59及加工模組/9以偵測運轉之極端條件及保護伺服馬 達。例如，絕對編碼器以9偵測一條件，輸送臂總成狀已 達成最大高度而且絕對編碼器i叩可關閉升降機仰以保護 輸送臂高度馬達 經濟部中央橾隼局員工消费合作社印製 相似方法可被分別地使用於晶圓輸送單元 及5彳#之第二及第三實施例之光纖訊號通訊系統。 特別地，被放置在升降機之編碼器59i，被放置在軸 5幻之底部馬達之編碼器592，被放置在軸之編碼 器·5Μ，腕絕對編碼器被放置在輸送臂總成之末 端而且被放置在軸5幻之底部之肘絕對編碼器J97提供第 三十五圖之旋轉編碼器之轉動輸出。同樣地，沿著底 部馬達被放置之上升絕對編碼器596，線性編碼器J对 ，頭軌道編碼器5ί&gt;9及軌道CCD陣列絕對編碼器分別 地提供第三十五圖之輸入用於上升編碼器792及絕對編碼 加工模組控制 根據本發明該控制系統川0較佳地包括加工模組控制 次系統相對於在加工器具內之每個晶圓加工模 本紙張尺度適用中國阀家標準（CNS ) AA规格（2IOX297公楚） 經濟部中央標準局員工消费合作社印來The 2S scale is applicable to the Chinese national standard (CNS) A4 (210X297 mm) --------- Hangang ------ 1τ (Please read the precautions on the back before filling this page) 452843 Printed by A7 B7 of the Consumer Cooperatives of the Central Provincial Government Bureau of the Ministry of Economic Affairs 5. Illustration of the invention (). As seen in the twenty-sixth figure, it is placed horizontally between the upper mounting screw 2 so that the embossed pivot is 6 at the bottom A flat plate that engages a relative, but slightly smaller, lateral grooves in the lower elbow housing. The pivot is preferably shaped. The opposite lateral grooves are provided with $ to provide a gap between the bottom plate 2/7 and the bottom. Elbow housing 2 / i? With an angle of about 0.9 degrees is available in between. Combined with one or more leveling screws 220 and upper and lower mounting screws W2, 274, the lower elbow housing 2 The angular orientation and attachment of the transfer arm assembly <5 can be adjusted and fixed to provide the rotation of the transfer arm assembly as close to the absolute horizontal plane as possible during the wafer transfer within the processing tool / <?. The compliant attachment of the lower linear bearing guide 57 is important for the smooth flow of the wafer along the guide 566 The sending unit W makes up the operation. To provide this type of compliant attachment, preferably allowable buoys, 57 points in the lower linear bearing guide are obtained through the use of compliant snap-on technology. The floating latch 22 / about the mounting screw 222 is positioned, by By the O-ring, preferably F / rCW is positioned with respect to the floating pin. When the countersunk hole in the bottom plate 203 is set in the screw hole of the lower linear bearing guide 5766, as shown in the twenty-eighth figure, the screw support The floating pin 2 has flanges that alternately support the O-ring 22J. The 0-ring 225 supports the shoulder of the countersunk hole-M6. However, when the screw is tightened, the relative movement is allowed between the lower linear bearing guide Between the piece and the bottom plate to ease the movement above the guide. 29 __ ... _ 墨 — —— &quot; This paper》 • Standards apply the Chinese National Standard (CNS) Λ4 specification (210X297 mm) (Please read the back first Please note this page before filling in this page) &quot; clothing and ordering 4 52843 A7 B7 V. Description of the invention () Control system {Please read the notes on the back before filling this page) Refer to the 26th figure to show the control of processing equipment System embodiment. As shown in the figure, the control system 7⑽ generally includes at least one original controller for controlling and / or detecting all functions of the processing instrument. The control system i is preferably configured in a layered format. The original controller includes a processor to electrically connect a plurality of sub-system control units as shown in Figure 26. The control sub-system preferably controls and detects the operation of the components of the relative device (ie, wafer conveyor 60, processing module 22-24, interface module 59). The control subsystem is preferably planned to accept instructions or operating instructions such as software code from individual original controllers / W, /. The control subsystem 7 provides better process and status data to individual original controllers / 0 / ,. Du printed by the Central Bureau of Standards of the Ministry of Economic Affairs, consumer and capital cooperation. In more detail, the original controller is connected to the interface module control // 0 to control each semiconductor wafer interface module 59. In addition, the original controller is connected to the transport controller for controlling the operation of the wafer conveyor and the control of a plurality of processing modules /. .Ii5 relative to the processing equipment ^ inner semiconductor wafer processing modules 20,22. The control system i of the processing tool 70 according to the present invention includes an additional original controller M2 as shown in FIG. 26 for detecting or operating an additional sub-system. Such an additional wafer processing unit is controlled by an additional processing module. The control subsystem is preferably connected to each primary controller / 0 person / 02. The original controllers 70 /, 702 are preferably interconnected and each transfers processing data to another controller. -Electric ______30_______ This paper ft scale applies Chinese National Standard (CNS) a4 specification (21〇_X297) while it is 4 528 43 A7 ______B7 V. Description of the invention () Each original controller /, receives and sends data to individual molds Group control (please read the back matter before filling this page) The preferred embodiment of the control system in the control system / ⑽, the two-way memory mapping device is provided with an intermediate original controller and each module connected system. In particular, the memory mapping device 760, / 6 people are provided with the intermediate original controller and the main controller / 30, U /, within the control of the individual interface module and the transport controller / and the processing module. Each memory-mapped device / Yang-M2 in the control system / ⑽ is preferably a dual-port brother / provided for storing data synchronously. In particular, the original controller Mi can write data to the memory position relative to the main controller i50 and the main controller DO can read data simultaneously. On the other hand, the original controller can read the mapping memory device whose data is written by the main controller HO. Memory mapping is used to provide data transfer at processor speed. The memory mapping device is preferably provided with an intermediate user interface and the original controller for transmitting data. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economics The user interface is preferably connected to each original controller 702. The user interface may preferably be erected outside the processing appliance or at a remote location to provide processing and status data for an operator's processing appliance. Additionally, an operator can enter control sequences and processing instructions that are still used in processing appliances. The user interface is preferably supported by a general purpose computer within the processing appliance via a user interface. The general purpose computer preferably includes a 6 / UM // :: processor, but other processors may be utilized. This paper size is applicable to China National Standards (CNS) Α4 specifications (210X 297 public broadcasting) 4 5284, i Α7 V. Description of the invention () Each module controls the sub-system, including interface module control, wafer transfer controller i The control of each processing module is preferably planned in an active and passive arrangement. This module controls the secondary system UO, which is preferably enclosed in individual modules, such as wafer interface module ϋ39, wafer conveyor or processing module 2 / λ 2Z. The original controller and the relative main controller 730 are preferably implemented on a printed circuit board or / iSZ board, which is set up in a general purpose computer support user interface Kawachi. Each of the original controllers 2 and 2 preferably includes a 6 &lt; 1: C㈨0 processor provided by Moiofo / ci and each of the main and passive controllers in the control system 7⑽ preferably includes / »& / Provided processor. Each main controller 730 is connected to a separate passive controller via data link / 26, P7, / 29 as shown in Figures 27 to 30. Each data chain 72 &lt;5; 727, / 29 preferably includes an optical data medium as provided. However, the data chain U7, 729 may include another data transmission medium. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back * before filling out this page). Refer to Figure 27. The active / passive control sub-system for the interface module control is displayed. Each active and related passive specification is better than a single module (ie interface, conveyor, processing) within the processing tool i0. However, a plurality of modules are actively controlled or detected. The active / passive specification is described in Figure 27 and is applied to the other module control subsystems in addition to the interface module control / channel. 32 This paper scale is applicable to China 丨 S] Furniture ratio (CNS) M specification {2 丨 0 &gt; &lt; 297 public delay) 4528 4 A7 B7 V. Description of the invention () The original controller is connected via the memory mapping device Y To the main controller 750 in the interface module control / 70. The master controller is connected to a plurality of passive W persons / β. M passive controllers can be better connected to a single main controller to each other and each passive controller can be programmed to control and detect a single motor or processing element, or multiple motors and processing elements. The control system i⑽ of the processing apparatus preferably makes use of a flash memory. More specifically, each of the main controllers and passive controllers used to operate in the control system is effectively stored in the memory of the original controller / s with the operating instructions or codes of 7. When the power rises, the original controller inquires the main controller with (?-To 2 and downloads the appropriate operation instruction program to run each main controller. Similarly, each main controller inquires about Passive controller &quot; Heart ^ 7. After this, the master controller starts downloading the appropriate program from the original controller 7, M2 to the passive controller i-70 via the master controller / 5, and 2. Printed by the Bureau Cooperative Consumer Cooperative (please read the precautions on the back before filling this page) Each passive controller is planned to control and detect a single motor or multiple motors in the relative processing module W, interface module 5 & amp 59 and Jingtu Conveyor Yangi. In addition, each passive controller i Yang-W7 is' planned to detect and control any passive controller of the processing elements in the processing module / 9, as shown in the 30th The passive controller of the six figures is planned to control and / or detect the servo motor and processing elements. 4. 33 ^ Paper size is applicable to China Standards (CNS) A4 specifications (21〇 &gt; &lt; 297 mm &gt; 452843 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Α7 Β7 Explanation of the invention () Each passive controller includes a passive processor connected to a plurality of port interfaces. Each interface is used to control and / or detect servo motors and processing elements. For example, one can be connected to servo control / 76, the control card is planned to operate a wafer transfer unit core α, 620. The passive processor 777 runs the wafer transfer unit Mα through the port and the servo controller i76. More specifically, the passive processor 777 runs the servo motor in the wafer conveying unit and detects the state of the motor through the servo controller. On the other hand, different passive controllers run on different components in a single processing device, such as interface modules. More special Ground 'interface module control and interface module components are described in Figure 32. β passive controller 2 turns the rotary door motor / shirt and detects the position of the rotary door buckle through the incremental rotary door encoder Υ被动. The passive controller 2 is preferably connected to the revolving door motor / magic and revolving door encoder via 0 through the servo control card (shown in Figure 35) ^ The passive controller operates / detects Turnstile The saddle controls the saddle motor and detects the saddle encoder through the servo control card. The passive processor can be connected to the interface control card for controlling and detecting the processing elements within the individual processing module. For example, 'flow sense The sensor 657 provides the information flow of the processing fluid to the processing slot in the module. The interface control card is planned to explain the data provided by the flow sensor core 7 or other processing elements into a form that is relatively passively processed. 772 所 34 — The size of this paper is applicable to the Chinese Prisoner's Standard (CNS) Λ4 specification (2Ι0χ 297 mm) --------- Drap clothes ------,? Τ ----- -A (Jing first read the back: &gt; x Italian matter and then fill out this page) 4528 43 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Bei Gong Xiao F Cooperative A7 B7 V. Description of Invention () Analysis. Furthermore, the interface control card operates a processing element, such as a flow controller, in response to instructions generated from the relative passive processor 772. The passive controller includes one or more servo controllers and one or more interfaces to control individual ports connected to the passive processors 770-772. The passive processor is used to allow the ability to control and detect the motors of different components and from a single passive controller Processing elements, on the other hand, the servo controller and interface controller include a processor mounted on the board to improve the speed of processing and operation. The data provided by the encoder or processing element to the servo controller or interface controller is immediately processed by the on-board processor, which also controls individual servo motors or processing elements to reflect the data. In this specification, the passive The processor sends data from the interface processor or servo control processor to the individual main controller and the original controller. Conveyor control sub-system The conveyor control sub-system // 5 is used to control and detect the operation of the wafer conveyor 60 and the wafer conveying unit 62α, or 5626 or 5 with a, 5 · / complement, shown on the second Nineteen figures. Normally, the transfer controller / iJ's passive controller is connected to a drive actuator 77 for moving and detecting the wafer transfer unit (52α) along the unit guides in a controlled manner. The passive controller 7 then operates the wafer transfer The unit 62α or 562α or the transfer arm assembly 56 and the semiconductor wafer transfer. Similarly, the passive controller is planned to operate the wafer transfer unit or 5626 or and drive the actuator 35. The paper size is applicable to Chinese national standards (CNS ) Λ4 gauge Luo (210X297 public sewing) I (1 i— ^ 衣 I Ϊ I It ^ {Please read the precautions on the back before filling in this page) 452843 Printed by the Central Government Bureau of the Ministry of Economic Affairs and Consumer Cooperatives Α7 Β7 Five Explanation of the invention () The interface between the passive controller and the light detector 97, which drives the actuator, and the linear encoder and wafer conveying unit 62α are shown in detail in Figure 36. The passive processor of the passive controller / 7 / is preferably connected to the servo controller 776. The passive processor 777 controls the linear portion of the wafer transport unit 62α, and drives the actuator W by operating through the servo controller 776. The photodetector moves along the guide &lt; 56 provide wafer transfer order Linear position data. In addition, a linear encoder is used to detect the position of the wafer transfer unit in detail along the guide M. The passive processor 77i can control and detect the transfer arm assembly relative to the wafer transfer unit 62α. Batch operation. In particular, the passive processor / 7 / can be connected to the inner arm of the shaft W to control the rotation of the first and second arm protrusions &lt; 57, Lee. Incremental conveyor arm rotation encoder / 97 is provided in the axis &lt; 55 of the wafer conveying unit 62α for detecting the rotation of the conveying arm assembly and providing rotation data to the servo controller 776 and the passive processor / 7 / = the passive controller is effectively connected to The stomach and stomach motor in the elevator 90 is used to control the height position of the conveying arm assembly. The height-enhancing encoder / egg is provided in the conveying arm elevator Dechengru # @ Measure the height of the conveying arm assembly. In addition, the passive controller is connected to the air supplement control_actuating _ ^-This paper size applies to the Chinese Standard (CNS) A4 specification (2 丨 0'〆297mm) --------- ^ ------ 1Τ (Please read the notes on the back before filling in this f) A7 ^ 52843 V. Description of the invention () The device (not shown) is used to control a vacuum support 59 to selectively support semiconductor wafers through an interface controller. {Please read the precautions on the back before filling this page) Absolute encoders are provided In the wafer conveyor, the interface modules 55, 59 and the processing module / 9 detect the extreme conditions of operation and protect the servo motor. For example, the absolute encoder detects a condition of 9, the conveyor arm assembly has reached the maximum height, and the absolute encoder i 关闭 can close the elevator to protect the height of the conveyor arm. The motor consumer central government bureau of the Ministry of Economic Affairs prints a similar method. The optical fiber signal communication system of the second and third embodiments of the wafer transport unit and the 5 # can be used separately. In particular, the encoder 59i placed on the lifter, the encoder 592 placed on the bottom of the shaft 5 motor, and the encoder 5m placed on the shaft, the wrist absolute encoder is placed at the end of the conveyor arm assembly and The elbow absolute encoder J97 placed on the bottom of the shaft 5 provides the rotary output of the rotary encoder shown in Figure 35. Similarly, the rising absolute encoder 596, the linear encoder J pair, the head track encoder 5 and 9 and the track CCD array absolute encoder placed along the bottom motor respectively provide the input of the thirty-fifth figure for ascending encoding. Controller 792 and absolute coding processing module control. According to the present invention, the control system Sichuan 0 preferably includes a processing module control sub-system. The paper size of each wafer processing mold in the processing device is subject to the Chinese valve standard (CNS). ) AA specification (2IOX297). Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs.

45284J Α7 Β7 五、發明説明（） 組22, 2[該控制系統7⑽也包括附加的加工模組控制 次系統用於控制和/或偵測附加的加工模組79。 個別加工模組控制&quot;V, 可控制及偵測介於相 對晶圓固持器及晶圓輸送單元或562α,兄乃 或間半導體晶圓酽之輸送=再者，加工模組控 制&quot;5, &quot;(5有效地控制和./或偵測每個加工模組 22, 24內半導體晶圓F之加工。 參考第三十圖，被動控制器以7運轉加工模組2&lt;?內 複數個晶圓固持器扣。另一方面，被動控制器 WJ, “6運轉及偵測單一晶圓固持器仰仰/6。附加的 被動控制器/对可被運用以運轉及偵測所有加工元件i料 (.即流量感測器，閥致動器，加熱器，溫度感測器）在單 一加工模組內。再者，如第三十七圖所示，單一被動控 制器運轉及偵測晶圓固持器WO及加工元件以4。 此外，單一被動控制器被規劃以運轉及偵測 一或多個晶圓固持器及加工元件。被動控制器 至晶圓固持器及加工元件兩者之接界係顯示於第三十 七圖之控制系統實施例。特別地，伺服控_器777及介面 控制器被連接至個別埠連接至被動控制器W5之被動 處理器772。該被動處理器/72運轉及偵測複數個晶圓固 持器部分經由伺服控制器/77=特別地，被動處理器772 38 本紙張尺度適用中國國家標準&lt; CNS ) Λ4規格（210X 297公釐) ---------裝------訂------Α (請先閱讀背面之注意事項再填寫本頁) 43 43 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（） 運轉上升馬達用於繞上升驅動軸提起操作器臂 ¥07。增量上升運動編碼器455被提供在晶圓固持器內 以提供操作器臂仰7之旋轉資料至個別被動處理器/72或 在伺服控制器777內之處理器。被動處理器/72也控制晶 圓固持器內轉動馬達用來轉動一加工頭7⑽繞軸 429. 介於加工位置及半導體晶圓輸送位置間。增量轉 動編碼器提供轉動資料關於加工頭至相對被動處 理器&quot;2。 旋轉馬達对0被控制藉由伺服控制器i77或被動處理 器772內處理器用於轉動晶圓固持器47^，在半導體晶圓 F加工期間。增量旋轉編碼器較佳地提供以偵測晶圓 固持器47$之轉動率及補充資料至被動處理器/72之比率 電鍍模組控制有效地運轉用於緊抓或釋放半導體 晶圓之晶圓固持器之指針。特別地，被動處理器 /72運轉一閥經由氣壓閥致動器用於補充空氣至氣壓 活塞，該活塞對致動指針用來緊抓半導體晶圓= 電鍍模組控制內被動控制器運轉閥致動器20/以 移除空氣補充因此從半導體晶圓釋放指針、&quot;。被動處理 器272也控制電路運用通過指針總成由運轉繼電器 M2之半導體晶圓加工期間。 * 39 ---------裝------訂------1 (請先閲讀背面之注意事項再填寫本頁) 本紙乐尺度適用中國國家標準（CNS ) Λ4規格（2:0x 297公釐） 經濟部中央榇率屬貝工消费合作社印装 452843 A7 五、發明説明（） 加工模組控制以又較佳地運轉及偵測相對晶 圓加工模組20, 22, 24內半導體晶圓之加工經由儀器或加 工元件。 參考第三十三圖，用於電鍍加工模組20之控制運轉 被描述。大致上，被動處理器172經由介面控制器偵 測和/或控制加工元件/以。電鍍模組控制內該被動處 理器/72運轉泵以抽拉製造溶液從加工流體槽至 泵排放過濾器該加工流體通過過濾器，進入補充歧 管652而且被輸送經由槽浦充線至複數加工電鍍槽，其中 該半導體晶圓被加工。每個槽補充線較佳地包括一流體感 測器M7連接至電鍍模組控制用於提供該加工流體之 流量資料。爲反應流體資料，被動處理器/72運轉在每槽 補充線內流體感測器之致動器以控制加工流體。被動 處理器也偵測及控制後壓力調節器用於維持補充 歧管&lt;552內預定的壓力水準。該後壓力調節器提供壓 力資料至電鍍加工控制模組以·/內被動處理器/72。 相同地，加工模組控制次系統/i5. 被規劃以控制 在相對預濕模組22及抵抗模組以內之半導體晶圓加工 介面模組控制 每個介面模組控制次系統較佳地控制及偵測介面 模組之運轉。更特別地，介面模組控制控制及 40 ---------1------ΐτ——------Λ. (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2I0X297公犛) 經濟部中央標準局負工消费合作社印裝 452843 A7 B7 五、發明説明（) 偵測晶圓匣轉門Ο及個別介面模組39之晶圓厘升 降機d β以交換晶圓匣之運轉。 介面模組控制之被動控制器仰內被動處理器 運轉及偵測介面模組ϋ Ji?之功能。特別地，被動處 理器/70運轉動力門55, J6用於提供存取進入加工器具川 ’經由埠J2, J5 β另一方面，主控制系統2㈨運轉動力門 參考第三十一圖，用於控制晶圓介面模組35之介面 模組控制部分之實施例被描述β特別地，被動處理器/70 連接至伺服控制器775。不是被動處理器i7(5就是安裝在 伺服控制器之處理器運轉介面模組％之元件。特別地 ’該被動處理器/叩控制用於運轉轉門仰之轉動功能之轉 門馬達’該轉門移動晶圓匣/6介於負載位置與輸送位 置間。增量轉門編碼器7卯偵測轉門利之位置及提供位置 資料至被動處理器。另一方面，伺服控制器/75包括 一處理器用於從轉門編碼器i9〇讀取資料及控制轉門馬達 i幻。伺服控制器/75改變被動處理器/70，當轉門仰已 達到預定位置。 每個晶圓匣轉門包括一馬達用於控制相連接鞍台 之位置。被動處理器770控制鞍台¥5, 46之位置通 過適當鞍台馬達/S6之運轉以定位晶圓匣/6附著水平與垂 本紙張足度適用中國國家榡準（CNS ) Λ4規格（210X297公埃） --------— (請先閲讀背面之注意事項再填莴本頁) 訂 -旅 4528 4 經濟部中央榡率局負工消费合作社印裝 Α7 Β7 五、發明説明（) 直方向之一。增量鞍台編碼器較佳地被提供在晶圓匣 轉門川內用於提供鞍台以，Μ之位置資料至個別被動處理 器 /70。 不是被動處理器/70就是伺服控制器/7J被規劃以控 制晶圓匣升降機&lt;2之運轉，該升降機用於輸送介於交換位 置及抽出位置間之晶圓匣76。被動處理器連接至升降 機上升馬達及升降機轉動馬達i«^用於控制升降機Κ 及匣支撐47之高度及轉動。增量上升編碼器及增量旋 轉編碼器補充升降機42及匣支撐47之高度資料至被 動處理器7邛。 絕對編碼器被用來注意極端條件之被動處理器* 當厘支撐47達到最大高度時。升降機上升馬達M7被停止 以反應由絕對編碼器/外之極端條件出現。 晶圓1M托盤 用於固持晶圓匣/6之晶圓匣托盤50係詳細顯示於第 九圖◊每個晶圓匣托盤50包括基部57及較佳地垂直於基 部57之直立部分兩側支撐52被形成在基部之相 對側邊而且向上延伸β該側支撐52助於$#持晶圓匣Μ於 固定位置，在晶圓匣76之交換，轉動及移動期間。每個側 支撐52包括一溝槽較佳地延伸該長度被規劃以接合鞍 台45. #之分叉。 42 (請先閱讀背面之注意事項再填寫本頁) 裝 本紙浪尺度適用中國围家標準（〔&gt;^)六4規格（210'/ 297公釐) 4 經濟部中央橾隼局員工消費合作权印掣 2 8 4 j A7 B7 五、發明説明（） 該晶圓匣托盤較佳地被利用在晶圓匣介面模組55. 內晶圓操作期間，晶圓匣被輸送從負載位置至抽出 位置以提供半導體晶圓F至輸送器內之晶圓輸送單元 &lt;57之存取。 電鍍站 第三十三圖顯示第二半導體加工站9⑽之主要元件係 特別地被應用及製造以充當一電鍍站。加工站9仙之兩主 要部分係晶圓馬達總成，大致顯示爲，及電鍍槽總成 303。 電鍍槽總成 第三十三圖顯示電鍍槽總成505。該電鍍槽總成包括 加工槽或電鍍槽具有外部槽側牆W7 ’槽底部及 槽邊緣總成該加工槽較佳地水平橫截面係圓形而且 大致上在形狀上係圓筒狀，雖然其他形狀係可能的。 該電鏟槽總成包括被放置於加工槽W7內之杯總 成320。該杯總成520包括流體杯部分固持用於電鍍 過程之化學物。該杯總成也具有延伸杯底煞下方之依 存裙部577而且具有用於流體通訊及收集氣體釋放之溝槽 開孔’當該氣室下方充滿流體。該杯較佳地從聚丙烦或其 他材料所製造。 43 __ ,I裝 訂------说 (請先閱讀背而之注意事項再填寫本頁) 本纸浪尺度適用中國囤家標準（CNS ) A4現格（2丨OX297公釐） 452843 A7 B7 經濟部中央標準局員工消費合作社印繁 五、發明説明（） 在杯總成3別底部牆之下方開孔連接於聚丙烯冒口管 ，該管可調整在高度相對於具螺紋連接處。該冒口管 之第一端被固定於陽極屏蔽J95之後方部分，該屏蔽 支撐陽極。流體輸入線被放置在冒口管內。 冒口管及流體輸入線兩者藉一管接頭被固定在電 鍍槽總成305。管接頭容納冒口管及輸入線J2J兩者 之高度調整。如此，介於管接頭562及冒口管間之連 接有助於陽極位置之垂直調整。該輸入線5-巧較佳地由傳 導物質製造，如鈦這類而且被用來傳導電流至陽極， 及捕充流體至杯。 加工流體被提洪至該杯通過流體輸入線而且前進 通過流體線開口 5以。電鍍流體充滿該氣室9料通過開口 ，如藉由液體泵（未顯示）或其他適合補充。 該杯側牆522之上端形成一堰限制在杯內電鍍液之高 度。此高度被選擇以至於只有晶圓W之底表面接觸電鍍液 。過多電鍍液溢出頂端表面進入溢流室。在溢流室jUJ 之液體高度較佳地被維持在預定範圍內對於運轉穩定，藉 由以適合感測器及致動器偵測流體高度。這可被達成使用 許多不同溢出規格。較佳規格係使用適合感測器感測高度 狀況及通過排出線排放流體，如控制閥所控制。可能是使 用立管配置（未顯示），及這被使用最後溢出保護裝置在 44 本紙張尺度適用中國S家標孪（CMS ) A4規格（210X 297公釐） ---------扣衣------1T------^ (請先閱讀背面之注意事項再填寫本頁) 452843 A7 B7 經濟部中央標隼局員工消費合作社印製 五、發明説明（） 較佳電鍍站。更複雜高度控制係可能的。 自溢流室溢出之流體較佳地被送回至適當容器。 該流體可被處理藉附加電鍍化合物或電鍍之其他組成或其 他加工液體及被再度使用。 在較佳使用根據本發明，該陽極係可消耗陽極’ 使用與銅及其他金屬電鍍至半導體晶圓。特別的陽極將改 變按照當被電鍍之金屬及使用的電鑛液。可獲得不同可消 耗陽極使用於陽極 第三十三圖顯示擴散平板提供在陽極上方用 於越過晶圓F提供更多流體電鍍浴之散佈。流體通道被提 供在所有擴散平板彡7J之部分以允許流體聯繫°該擴散平 板之高度可調整使用擴散器高度調整機構了狀3 該陽極屏蔽393被固定於ί吏用陽極屏蔽結件594之可 消耗陽極之下方以防止直接碰撞由電鍍液’當該液體 通過加工室時β該陽極屏蔽595及陽極屏蔽結件 較佳地從介電質製造，如聚偏二氟乙烯或聚丙煤這類°該 陽極屏蔽有效地大約釐米厚，更佳的犬約彡驚米厚。 該陽極屏蔽充當絕緣而且保護陽極之後側邊°這也降 低有機電鍍液附加劑之消耗量。雖然精確機構在此時未得 (請先閱讀背面之注意事項再填寫本頁) --° 本紙张尺度適用中國®家標準（CNS &gt;A4現格（210x297公楚） 經濟部中央標準局員工消費合作社印製 4 52 6，,. A7 ________B7 五、發明説明（） 知’該陽極屏蔽被認爲防止一定材質之干擾，該材質在陽 極之後側邊隨者時間發展°假如該陽極未被屏蔽，有機電 鍍液附加劑以非常大比率被消耗。隨著屏蔽放置，附加劑 未被快速地消耗。 晶圓轉子總成 該晶圓轉子總成如6固定晶圓用於在加工室內轉動 〇該晶圓轉子總成卯6包括具有複數個晶圓接合指針 之轉子總成，該轉子固定晶圓抵抗轉子之特色。該指 針979較佳地被應用於傳導電流介於晶圓與電鍍電力補充 而且被製造與不同規格一致充當電流。 該不同部分用來轉動轉子總成9以被放置在殼體970 。該固定殼體被連接至水平地延伸臂轉動，被連接以垂直 地延伸臂。該臂9⑽及卯9晶圓轉子總成卯6被提起及被 轉動從接合。 許多改良可被製造現存系統部偏離基本內容.雖然本 發明已被描述參考一或多個特別實施例，技術承認改變可 被製造而不偏離如附屬申請專利範圍所發出之精神。 餐------1T------^ (請先閱讀背面之注意事項再填寫本頁) 尺度適用@囚家橾单(CNS ) A4規格（210X297公釐&gt;45284J Α7 Β7 V. Description of the invention () Group 22, 2 [The control system 7⑽ also includes additional processing module control. The secondary system is used to control and / or detect the additional processing module 79. Individual processing module control &quot; V, can control and detect the transfer between the relative wafer holder and wafer transfer unit or 562α, or even between semiconductor wafers = further, processing module control &quot; 5 , &quot; (5 effectively controls and / or detects the processing of semiconductor wafers F in each processing module 22, 24. Referring to the thirty figure, the passive controller operates the processing module 2 &lt;? within the plural Wafer holder buckle. On the other hand, the passive controller WJ, "6 operates and detects a single wafer holder tilt / 6. Additional passive controllers / pairs can be used to operate and detect all processing elements The material (ie flow sensor, valve actuator, heater, temperature sensor) is in a single processing module. Furthermore, as shown in Figure 37, a single passive controller operates and detects Wafer holder WO and processing elements are 4. In addition, a single passive controller is planned to operate and detect one or more wafer holders and processing elements. Passive controllers to both wafer holders and processing elements The interface is an embodiment of the control system shown in Figure 37. In particular, the servo control The 777 and the interface controller are connected to a passive port 772 connected to the passive controller W5. The passive processor / 72 operates and detects a plurality of wafer holders via the servo controller / 77 = Specially, Passive processor 772 38 This paper size applies to Chinese National Standards &lt; CNS) Λ4 specification (210X 297 mm) --------- Installation ------ Order ------ Α (Please (Please read the notes on the back before filling in this page) 43 43 Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention A motion encoder 455 is provided in the wafer holder to provide the rotation data of the manipulator arm 7 to an individual passive processor / 72 or a processor in the servo controller 777. The passive processor / 72 also controls the wafer holding The rotary motor inside the device is used to rotate a processing head 7 around the axis 429. It is between the processing position and the semiconductor wafer conveying position. The incremental rotary encoder provides rotation information about the processing head to the relatively passive processor &quot; 2. 0 is controlled by servo controller i 77 or passive processor 772 The internal processor is used to rotate the wafer holder 47 ^ during the processing of the semiconductor wafer F. The incremental rotary encoder is preferably provided to detect the rotation rate of the wafer holder 47 $ and additional information The ratio to the passive processor / 72 electroplating module controls the effective operation of the wafer holder for gripping or releasing semiconductor wafers. In particular, the passive processor / 72 operates a valve via a pneumatic valve actuator for Replenish air to the pneumatic piston, which actuates the pointer to grip the semiconductor wafer = passive controller within the plating module control operates the valve actuator 20 / to remove the air to replenish and therefore release the pointer from the semiconductor wafer, &quot; . The passive processor 272 also controls the circuit during the processing of the semiconductor wafer by operating the relay M2 through the pointer assembly. * 39 --------- Installation ------ Order ------ 1 (Please read the notes on the back before filling this page) The paper scale is applicable to the Chinese National Standard (CNS) Λ4 Specifications (2: 0x 297 mm) The Central Ministry of Economic Affairs is a member of the Shellfish Consumer Cooperative Co., Ltd. 452843 A7. 5. Description of the invention () Processing module control for better operation and detection relative to wafer processing module 20, The processing of semiconductor wafers in 22, 24 is through instruments or processing elements. With reference to Figure 33, the control operation for the electroplating processing module 20 is described. Generally, the passive processor 172 detects and / or controls the processing elements via an interface controller. The passive processor / 72 runs the pump within the control of the electroplating module to pull the manufacturing solution from the process fluid tank to the pump to discharge the filter. The process fluid passes through the filter, enters the supplemental manifold 652, and is transported through the tank charge line to multiple processes. A plating bath in which the semiconductor wafer is processed. Each tank supplement line preferably includes a fluid sensor M7 connected to the plating module to control the flow data of the process fluid. In order to respond to the fluid data, the passive processor / 72 operates the actuator of the fluid sensor in the supplement line of each tank to control the processing fluid. The passive processor also detects and controls the post-pressure regulator to maintain a predetermined pressure level in the supplemental manifold &lt; 552. The rear pressure regulator provides pressure data to the electroplating processing control module // passive processor / 72. Similarly, the processing module control subsystem / i5. The semiconductor wafer processing interface module that is planned to be controlled within the relative pre-wet module 22 and the resistance module is controlled by each interface module. Detect the operation of the interface module. More specifically, interface module control and 40 --------- 1 ------ ΐτ ——------ Λ. (Please read the notes on the back before filling this page ) This paper size is applicable to Chinese National Standard (CNS) Λ4 specification (2I0X297 gong). Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. 452843 A7 B7. 5. Description of the invention () Detect the wafer box revolving door 0 and individual interface modules The wafer centrifugal lift d β of the group 39 is exchanged for the operation of the wafer cassette. Passive controller controlled by interface module Yangi passive processor runs and detects the function of interface module ϋ Ji ?. In particular, the passive processor / 70 operation power door 55, J6 is used to provide access to the processing equipment, and it is provided via the port J2, J5 β. On the other hand, the main control system 2㈨ operation power door is referred to the thirty-first figure for An embodiment of the interface module control section that controls the wafer interface module 35 is described. In particular, a passive processor / 70 is connected to the servo controller 775. It is not a passive processor i7 (5 is a component of the processor operation interface module% installed in the servo controller. In particular, the 'passive processor / 叩 controls the swing door motor used to operate the swing function of the swing door'. The door moving wafer cassette / 6 is between the load position and the conveying position. The incremental rotary door encoder 7 卯 detects the position of the rotary door and provides position data to the passive processor. On the other hand, the servo controller / 75 includes a The processor is used to read data from the rotary door encoder i90 and control the rotary door motor i. The servo controller / 75 changes the passive processor / 70 when the rotary door has reached the predetermined position. Each cassette rotary door includes A motor is used to control the position of the connected saddle. The passive processor 770 controls the saddle ¥ 5, 46. The proper position of the saddle motor / S6 is used to position the wafer cassette / 6 attachment level and the fullness of the paper. China National Standards (CNS) Λ4 specification (210X297 Angstroms) ---------- (Please read the precautions on the back before filling in the lettuce page) Order-Brigade 4528 4 Central Ministry of Economic Affairs, Ministry of Economic Affairs Printed by consumer cooperatives Α7 Β7 V. Description of invention () Straight One of the directions. The incremental saddle encoder is preferably provided in the wafer box gate to provide saddle and position information of M to individual passive processors / 70. Either passive processors / 70 or servo control / 7J is planned to control the operation of the wafer cassette lifter <2, which is used to transport the wafer cassette 76 between the exchange position and the withdrawal position. The passive processor is connected to the lifter motor and the lifter motor i « ^ Used to control the height and rotation of the elevator K and the box support 47. Incremental lifting encoder and incremental rotary encoder supplement the height data of the elevator 42 and the box support 47 to the passive processor 7 邛. Absolute encoders are used to pay attention Passive processor for extreme conditions * When the support 47 reaches the maximum height. The lifter motor M7 is stopped in response to the emergence of extreme conditions from the absolute encoder / wafer. The wafer 1M tray is used to hold the wafers of the wafer cassette / 6. The cassette tray 50 is shown in detail in the ninth figure. Each cassette tray 50 includes a base portion 57 and two side supports 52 which are preferably perpendicular to the upright portion of the base portion 57 are formed on opposite sides of the base portion and Upward extension β This side support 52 helps $ # hold the wafer cassette M in a fixed position during the exchange, rotation and movement of the wafer cassette 76. Each side support 52 includes a groove to preferably extend the length to be planned To join the saddle 45. # 的 分叉. 42 (Please read the precautions on the back before filling in this page) The scale of the paper is applicable to the Chinese standard ([&gt; ^) 6 4 specifications (210 '/ 297 mm) ) 4 The Central Government Bureau of the Ministry of Economic Affairs employees ’consumption cooperation rights stamp 2 8 4 j A7 B7 V. Description of the invention () The cassette tray is preferably used in the cassette interface module 55. The wafer operation period The wafer cassette is transported from the load position to the extraction position to provide access to the semiconductor wafer F to the wafer transport unit &lt; 57 in the conveyor. Plating station The thirty-third figure shows that the main components of the second semiconductor processing station 9 'are specifically applied and manufactured to function as a plating station. The two main parts of the processing station 9 cents are the wafer motor assembly, which is roughly shown as, and the plating tank assembly 303. Plating Tank Assembly Figure 33 shows the plating tank assembly 505. The plating tank assembly includes a processing tank or a plating tank having an external tank side wall W7 'and a tank bottom and a tank edge assembly. The processing tank is preferably horizontal in cross section and circular in shape, although other Shape is possible. The shovel slot assembly includes a cup assembly 320 placed in the processing slot W7. The cup assembly 520 includes a fluid cup portion that holds chemicals for the plating process. The cup assembly also has a dependency skirt 577 extending below the cup bottom brake and has a slot opening for fluid communication and collection of gas release 'when the gas chamber is filled with fluid. The cup is preferably made from polypropylene or other materials. 43 __, I binding ------ said (please read the precautions before filling in this page) The paper scale is applicable to the Chinese store standard (CNS) A4 (2 丨 OX297 mm) 452843 A7 B7 Yin Fan, the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention () A hole is connected to the polypropylene riser pipe under the bottom wall of the cup assembly 3, which can be adjusted in height relative to the threaded connection. The first end of the riser is fixed behind the anode shield J95, which shield supports the anode. The fluid input line is placed inside the riser tube. Both the riser and the fluid input line are fixed to the plating tank assembly 305 by a pipe joint. The pipe joint accommodates the height adjustment of both the riser pipe and the input line J2J. In this way, the connection between the pipe joint 562 and the riser tube facilitates the vertical adjustment of the anode position. The input line 5 is preferably made of a conductive substance, such as titanium, and is used to conduct current to the anode, and to trap fluid into the cup. The process fluid is pumped to the cup through the fluid input line and advanced through the fluid line opening 5. The plating fluid fills the air chamber 9 through the opening, such as by a liquid pump (not shown) or other suitable supplement. A weir is formed at the upper end of the cup side wall 522 to limit the height of the plating solution in the cup. This height is selected so that only the bottom surface of the wafer W contacts the plating solution. Excessive plating solution overflows the top surface into the overflow chamber. The liquid height in the overflow chamber jUJ is preferably maintained within a predetermined range for stable operation, and the height of the liquid is detected by a suitable sensor and actuator. This can be achieved using many different overflow specifications. A better specification is to use a suitable sensor to sense height conditions and discharge fluid through a discharge line, as controlled by a control valve. Possibly using a riser configuration (not shown), and this was used with a final overflow protection device in 44 paper sizes applicable to China S Family Standard (CMS) A4 specifications (210X 297 mm) --------- Buttoning clothes ----- 1T ------ ^ (Please read the notes on the back before filling in this page) 452843 A7 B7 Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs Jia plating station. More sophisticated height control systems are possible. The fluid overflowing from the overflow chamber is preferably returned to a suitable container. The fluid can be processed by additional plating compounds or other components of plating or other processing liquids and reused. In a preferred use according to the present invention, the anode system is a consumable anode &apos; which is electroplated to a semiconductor wafer with copper and other metals. Special anodes will change according to the metal to be electroplated and the electric mineral fluid used. Different consumable anodes are available for use in the anode. Figure 33 shows that a diffusion plate is provided above the anode for spreading the plating bath over wafer F. The fluid channel is provided in all the diffusion plates 7J to allow fluid communication. The height of the diffusion plate can be adjusted using a diffuser height adjustment mechanism. The anode shield 393 is fixed to the anode shield junction 594. The underside of the anode is consumed to prevent direct impact by the plating solution when the liquid passes through the processing chamber. The anode shield 595 and the anode shield junction are preferably manufactured from a dielectric such as polyvinylidene fluoride or polypropylene coal. The anodic shield is effectively approximately cm thick, and more preferably approximately 100 cm thick. The anode shield acts as insulation and protects the sides behind the anode. This also reduces the consumption of organic plating bath additives. Although the precise mechanism is not available at this time (please read the precautions on the back before filling out this page)-° This paper size is applicable to China® Home Standard (CNS &gt; A4 now (210x297)) Staff of the Central Bureau of Standards, Ministry of Economic Affairs Printed by the consumer cooperative 4 52 6 ,,. A7 ________B7 V. Description of the invention () Know that the anode shield is considered to prevent interference with a certain material, which develops over time following the anode. If the anode is not shielded The organic plating solution additive is consumed at a very large ratio. With the shielding placed, the additive is not consumed quickly. Wafer rotor assembly The wafer rotor assembly is such as 6 fixed wafers for rotation in the processing room. The wafer rotor assembly 卯 6 includes a rotor assembly having a plurality of wafer-bonding pointers, which fixes the characteristics of the wafer against the rotor. The pointer 979 is preferably used to conduct current between the wafer and the plating power supplement and It is manufactured to act as a current in accordance with different specifications. The different parts are used to rotate the rotor assembly 9 to be placed in the housing 970. The fixed housing is connected to the horizontally extending arm to rotate and is connected The arms 9⑽ and 卯 9 wafer rotor assembly 卯 6 are lifted and turned from engagement. Many improvements can be made to existing systems to deviate from the basic content. Although the present invention has been described with reference to one or more In a special embodiment, technical recognition changes can be made without departing from the spirit as issued in the scope of the attached patent application. Meal ----- 1T ------ ^ (Please read the notes on the back before filling this page ) Applicable scale @ prison 家 橾 单 (CNS) A4 size (210X297mm &gt;

Claims (1)

經濟部智慧財產局員工消t合作社印製 1 · 一種用於微電子製造之晶圓製造裝置，該晶圓製 造裝置包括 一晶圓輸送系統，該輸送系統包括一中間支撐沿著一 線性輸送路徑延伸， 第一晶圓輸送單元被放置在中間支撐之第一側邊而且 被架設用於沿著線性輸送路徑之移動運動， 第二晶圓輸送單元被放置在中間支撐之第二側邊，該 第二側邊與第一側邊係水平地間隔，而且被架設在該處用 於沿著線性輸送路徑平行於第一輸送單元之移動運動，第 二晶圓輸送單元之移動與第一晶圓輸送單元無關； 複數假晶圓加工模組鄰近晶圓輸送系統之相反側邊； 及 該第一及第二晶圓輸送單元用來分別地支撐個別的半 導體晶圓而且存取每個晶圓加工模組用於在晶圓處理站間 轉移半導體晶圓。 2 _如申請專利範圍第1項所述之晶圓製造裝置，其 數個處理站之至少一個處理站是電鍍處理站。 3·如申請專利範圍第1項所述之晶圓製造裝置，其 中第一及第二晶圓輸送單元係沿著使用個別的線性磁性馬 達之輸送路徑而移動。 4 ·如申請專利範圍第1項所述之晶圓製造裝置，其 中每個晶圓輸送裝置包括： 一軌道車； 一連接該軌道車之晶圓輸送臂，該晶圓輸送臂在大體 ^^1 cr ^^1 ^^1 n I ^ - ^^1 ^^1 rrf E n 一口， ^^1 n i 1^1 ^^1 ^^1 I n 1 (諳先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4覘格（210x297公釐） 45284 經濟部智慧財產局員工消費合作社印製 3 A8 * B8 C8 D8 六、申請專利範圍 上爲水平的平面上以大約2度移動，該晶圓輸送臂具有一 架設在末端用於固定一半導體晶圓之真空支撐； 一輸送臂升降機用於調整相對於軌道車的晶圓輸送臂 之垂直位置。 5·如申請專利範圍第1項所述之晶圓製造裝置，其 中第一及第二晶圓輸送單元包括一用來決定相對於晶圓加 工模組的個別晶圓輸送單元位置的位置感測器。 6 ·如申請專利範圍第1項所述之晶圓製造裝置，而 且其更進一步包括： 至少一晶圓介面模組鄰近該晶圓輸送器，該輸送器用 於支撐具有複數個半導體晶圓的晶圓匣； 該晶圓介面係安裝以放置該晶圓匣在突出位置以允許 至少第一及第二晶圓輸送單元之一用來存取在晶圓匣之半 導體晶圓，用來將晶圓轉移至數個晶圓處理站。 7 ·如申請專利範圍第6項所述之晶圓製造裝置，其 中在該至少一晶圓介面包括： 一晶圓匣轉門用來在介於負載位置及輸送位置間之移 動一晶圓匣； … 一晶圓匣升降機鄰近晶圓匣轉門而且被設計來輸送晶 圓匣及提供晶圓匣在抽回位置。 8 ·如申請專利範圍第6項所述之晶圓製造裝置，其 中該晶圓處理裝置更進一步包括一匣負載門鄰近至少一晶 圓介面模組而且安裝以允許晶圓匣通過其間。 9·如申請專利範圍第1項所述之晶圓製造裝置而且 2 n n i n n I »· · «^1 n l I ^ E I 簡 \ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t ) 452 8 4 3 888 8 ABCD 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 更進一步包括： 第一晶圓介面模組用於接納包括未加工半導體晶圓的 晶圓匣，該第一晶圓介面模組提出該未加工半導體晶圓至 在大致上水平抽出位置之晶圓模組總成； 第二晶圓介面模組用於接受已加工半導體晶圓從晶圓 輸送總成下方進入一晶圓匣’該第一晶圚介面模組接受該 已加工半導體晶圓從在大致上水平***位置之晶圓輸送總 成。 ]_ 〇 ·如申請專利範圍第1項所述之晶圓製造裝置， 其中該中間支撐： 一框架； 第一組磁性部分以固定的關係相對於框架沿著線性路 徑長度的第一側邊； 第二組磁性部分以固定的關係相對於框架沿著線性路 徑長度的第二側邊； 第—及第二側间導軌架設於框架之相反側邊而且分別 地支撐第一及第二晶圓輸送單元。 1 1 .如申請專利範圍第1 ◦項所述之晶圚&quot;製造裝置 ，其中第一及第二晶圓輸送單元兩者包括： 一軌道車以移動地附著於個別側向導軌； 一電磁鐵架設於該軌道車與個別磁性部分爲共同關係 ，用於沿著個別導軌移動該晶圓輸送單元； 複數個致動器反應控制訊號用來控制該晶圓輸送單元 及輸送臂總成之位置； 3 本紙張尺度適用中國國家標革（CNS)A.l规格公釐） ! I ------til — —— ^ ·1111111 ·1111!1!1 {請先閱讀背面之注意事項再填寫本頁) 452843 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 複數個感測器用來偵測該晶圓輸送單元及輸送臂總成 的位置。 12·如申請專利範圍第1項所述之晶圓製造裝置， 而且其中進一步包括一介於相對的晶圓處理模組中間的空 氣源用來將空氣補充至該半導體晶圓加工裝置。 13·如申請專利範圍第1項所述之晶圓製造裝置， 其中該晶圓輸送系統包括至少一鄰近排出槽道用於移除空 氣。 14·如申請專利範圍第1項所述之晶圓製造裝置， 其中晶圓加工模組係可交換的。 15·—種在使用於微電子製造的製造裝置之製造部 分中操縱一晶圓的輸送系統，該輸送系統包括： 晶圓輸送單元； 一輸送單元導件設置於加工裝置內用於支撐晶圓輸送 單元，當該導件介於第一位置及第二位置間移動，該輸送 單元導件包括一框架，架設於框架之側向導軌而且一連串 磁性部分配置在最接近該側向導軌的輸送單元導件； '該晶圓輸送單元包括移動地附著於該側向導軌的軌道 車，晶圓輸送臂總成用於操縱半導體晶圓，電磁鐵架設於 該軌道車以合作關係連接磁性部分用來沿著導軌移動該輸 送單元；及 一角度調整機構用來調整水平面的晶圓輸送臂總成相 對於該軌導車的角度方向。 1 6 ·如申請專利範圍第1 5項所述之輸送系統，而 4 t L Γ. i n I K n ΙΪ n n - n ^ f t In 11- 1 1 _ I 4 (請先閱讀背面之注意事項再填寫本頁) 本紙張反度適用中國國家標準（CNS)A4規烙（21ϋχ297公f ) 4 A8B8C8D8 六、申請專利範圍 且其更進一步包括： 複數個致動器反應於控制訊號用來控制該輸送單元及 輸送臂總成的位置； 複數個感應器用來偵測該輸送單元及輸送臂總成之位 置。 1 7 .如申請專利範圍第1 6項所述之輸送系統，而 且其更進一步包括： 控制器放置在遠離該輸送單元，該控制器反應由感測 器所接受的訊號而且提供控制訊號至致動器用來導引輸送 單元及輸送臂總成之移動；及 導引該輸送單元及輸送臂總成的移動；而且 通訊鏈路介於晶圓輸送單元及控制器間用來方便該晶 圓輸送單元運轉的控制。 1 8 _如申請專利範圍第i 7項所述之輸送系統，其 中該介於晶圓輸送單元及控制器間的通訊鏈路是光學通訊 鏈路。 1 9 .妬申請專利範圍第1 8項所述之輸送系統，其 一中光學通訊鏈路包括一或多個纖維光學線介於晶圓輸送單 元及控制器間延伸。 2 ◦•如申請專利範圍第1 5項所述之輸送系統而且 更進一步包括： 橫導軌架設於該框架而且與橫導軌架平行及垂直地放 置該側向導軌下方； 軌道車以移動地附著至側向導軌^ ___5 本纸張尺度適用中國因家標準（cns)a4規-----— &lt;請先閱讀背面之注意事項再填寫本頁) -I— -i-r-ej1 n 1 I &lt; 經濟部智慧財產局員工消費合作社印製 4528 4 3 A8 B8 C8 D8 、申請專利範圍 2 1 ·如申請專利範圍第2 0項所述之輸送系統，其 中該軌道車附著於側向導軌及與個別容許架設總成的進一 步側向導軌。 a--------訂---------線 &lt;锖先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作杜印S1S. 本紙張尺度適用中國國家標準（CNS)A4規格（210 497公釐）Printed by the Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs1. A wafer manufacturing device for microelectronics manufacturing, the wafer manufacturing device includes a wafer transfer system, the transfer system includes an intermediate support along a linear transfer path Extended, the first wafer transport unit is placed on the first side of the intermediate support and is set up for movement along the linear transport path, and the second wafer transport unit is placed on the second side of the intermediate support, the The second side is horizontally spaced from the first side, and is erected there for moving movement parallel to the first conveying unit along a linear conveying path, and the movement of the second wafer conveying unit and the first wafer The transfer unit is irrelevant; plural dummy wafer processing modules are adjacent to opposite sides of the wafer transfer system; and the first and second wafer transfer units are used to separately support individual semiconductor wafers and access each wafer process Modules are used to transfer semiconductor wafers between wafer processing stations. 2 _ The wafer manufacturing apparatus described in item 1 of the scope of patent application, at least one of the plurality of processing stations is an electroplating processing station. 3. The wafer manufacturing apparatus described in item 1 of the scope of patent application, wherein the first and second wafer transfer units move along a transfer path using individual linear magnetic motors. 4 · The wafer manufacturing device according to item 1 of the scope of patent application, wherein each wafer conveying device includes: a rail car; a wafer conveying arm connected to the rail car, the wafer conveying arm is generally ^^ 1 cr ^^ 1 ^^ 1 n I ^-^^ 1 ^^ 1 rrf E n sip, ^^ 1 ni 1 ^ 1 ^^ 1 ^^ 1 I n 1 (谙 Please read the notes on the back before filling in this (Page) This paper size is in accordance with Chinese National Standard (CNS) A4 grid (210x297 mm) 45284 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3 A8 * B8 C8 D8 2 degree movement, the wafer transfer arm has a vacuum support erected at the end for fixing a semiconductor wafer; a transfer arm lifter is used to adjust the vertical position of the wafer transfer arm relative to the rail car. 5. The wafer manufacturing apparatus according to item 1 of the scope of patent application, wherein the first and second wafer transfer units include a position sensing for determining positions of individual wafer transfer units relative to a wafer processing module. Device. 6 · The wafer manufacturing device according to item 1 of the scope of patent application, and further comprising: at least one wafer interface module is adjacent to the wafer conveyor, and the conveyor is used to support a wafer having a plurality of semiconductor wafers. A wafer cassette; the wafer interface is installed to place the wafer cassette in a protruding position to allow at least one of the first and second wafer transfer units to access a semiconductor wafer in the wafer cassette, Transfer to several wafer processing stations. 7 · The wafer manufacturing apparatus according to item 6 of the scope of patent application, wherein the at least one wafer interface includes: a wafer box swing door for moving a wafer box between a load position and a transport position … A cassette lift is adjacent to the cassette revolving door and is designed to transport the cassette and provide the cassette in the retracted position. 8. The wafer manufacturing apparatus according to item 6 of the scope of patent application, wherein the wafer processing apparatus further comprises a cassette load gate adjacent to at least one wafer interface module and installed to allow the cassette to pass therethrough. 9 · Wafer manufacturing equipment as described in item 1 of the scope of patent application and 2 nninn I »·« ^ 1 nl I ^ EI Jane (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 Specification (210 X 297 Gt) 452 8 4 3 888 8 ABCD Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. The scope of patent application further includes: The first wafer interface module is used to receive A wafer cassette including unprocessed semiconductor wafers, the first wafer interface module presents the unprocessed semiconductor wafer to a wafer module assembly at a substantially horizontal extraction position; the second wafer interface module is used for Accepting processed semiconductor wafers into a wafer cassette from below the wafer transport assembly. The first wafer interface module accepts the processed semiconductor wafers from the wafer transport assembly at a substantially horizontal insertion position. ] _ 〇 · The wafer manufacturing device described in item 1 of the scope of patent application, wherein the intermediate support: a frame; the first set of magnetic parts is in a fixed relationship with respect to the first side of the frame along the length of the linear path; The second set of magnetic parts is in a fixed relationship relative to the second side of the frame along the length of the linear path; the first and second side rails are mounted on opposite sides of the frame and support the first and second wafer transports, respectively. unit. 1 1. The crystalline wafer &quot; manufacturing device described in item 1 of the scope of the patent application, wherein both the first and second wafer transfer units include: a rail car movably attached to individual lateral guide rails; an electromagnetic The iron erected on the railcar has a common relationship with the individual magnetic parts, and is used to move the wafer transfer unit along individual guide rails; a plurality of actuator response control signals are used to control the position of the wafer transfer unit and the transfer arm assembly ; 3 This paper size applies to China National Standard Leather (CNS) Al specification mm)! I ------ til — —— ^ 1111111 · 1111! 1! 1 {Please read the precautions on the back before filling in this Page) 452843 A8 B8 C8 D8 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. Patent application. A number of sensors are used to detect the position of the wafer transfer unit and the transfer arm assembly. 12. The wafer manufacturing apparatus described in item 1 of the scope of patent application, and further comprising an air source interposed between the opposite wafer processing modules to supplement air to the semiconductor wafer processing apparatus. 13. The wafer manufacturing apparatus according to item 1 of the scope of patent application, wherein the wafer transport system includes at least one adjacent exhaust channel for removing air. 14. The wafer manufacturing apparatus according to item 1 of the scope of patent application, wherein the wafer processing module is interchangeable. 15 · —A conveying system for manipulating a wafer in a manufacturing part of a manufacturing device used in microelectronics manufacturing, the conveying system includes: a wafer conveying unit; a conveying unit guide is provided in a processing device for supporting the wafer Conveying unit, when the guide moves between the first position and the second position, the conveying unit guide includes a frame, which is mounted on the lateral guide rail of the frame and a series of magnetic parts are arranged on the conveying unit closest to the lateral guide rail. Guides; 'The wafer transfer unit includes a rail car movably attached to the side rail, a wafer transfer arm assembly is used to manipulate the semiconductor wafer, and an electromagnet is mounted on the rail car in a cooperative relationship to connect the magnetic part for The conveying unit is moved along the guide rail; and an angle adjusting mechanism is used to adjust the angular direction of the wafer conveying arm assembly of the horizontal plane relative to the guide rail of the rail. 1 6 · Conveying system as described in item 15 of the scope of patent application, and 4 t L Γ. In IK n ΙΪ nn-n ft In 11- 1 1 _ I 4 (Please read the precautions on the back before filling (This page) The inversion of this paper applies the Chinese National Standard (CNS) A4 (21ϋχ297 公 f) 4 A8B8C8D8 6. The scope of patent application and further includes: a plurality of actuators respond to control signals to control the conveying unit And the position of the transport arm assembly; a plurality of sensors are used to detect the position of the transport unit and the transport arm assembly. 17. The conveying system as described in item 16 of the scope of patent application, and further comprising: a controller placed away from the conveying unit, the controller responding to the signal received by the sensor and providing a control signal to the The actuator is used to guide the movement of the transfer unit and the transfer arm assembly; and to guide the movement of the transfer unit and the transfer arm assembly; and the communication link is interposed between the wafer transfer unit and the controller to facilitate the wafer transfer Control of unit operation. 1 8 _ The conveying system according to item i 7 of the scope of patent application, wherein the communication link between the wafer conveying unit and the controller is an optical communication link. 19. The transport system described in item 18 of the patent application scope, wherein one of the optical communication links includes one or more fiber optic lines extending between the wafer transport unit and the controller. 2 ◦ The conveying system as described in item 15 of the scope of patent application and further includes: a cross rail is mounted on the frame and placed below the lateral rail parallel and perpendicular to the cross rail frame; the railcar is attached to the mobile Side guides ^ ___5 This paper size applies the Chinese Standard (cns) a4 rule ------- &lt; Please read the precautions on the back before filling this page) -I— -ir-ej1 n 1 I & lt Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4528 4 3 A8 B8 C8 D8, patent application scope 2 1 · Conveyor system as described in item 20 of the patent application scope, in which the rail car is attached to the side rails and with Individual lateral mounting rails are allowed to be erected. a -------- Order --------- line &锖; 锖 Please read the precautions on the back before filling in this page) Employees ’Co-operation of Intellectual Property Bureau of the Ministry of Economy Du Yin S1S. This paper standard applies China National Standard (CNS) A4 specification (210 497 mm)