TW446190U - Semiconductor package structure having multiple lead frames combined with plural chips - Google Patents

Semiconductor package structure having multiple lead frames combined with plural chips

Info

Publication number
TW446190U
TW446190U TW89200909U TW89200909U TW446190U TW 446190 U TW446190 U TW 446190U TW 89200909 U TW89200909 U TW 89200909U TW 89200909 U TW89200909 U TW 89200909U TW 446190 U TW446190 U TW 446190U
Authority
TW
Taiwan
Prior art keywords
semiconductor package
package structure
lead frames
multiple lead
plural chips
Prior art date
Application number
TW89200909U
Other languages
Chinese (zh)
Inventor
Jeng-Yuan Huang
Mei-Hung Lin
Jr-An Yang
Guei-Hua Liou
Original Assignee
Taiwan Ic Packaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Ic Packaging Corp filed Critical Taiwan Ic Packaging Corp
Priority to TW89200909U priority Critical patent/TW446190U/en
Publication of TW446190U publication Critical patent/TW446190U/en

Links

TW89200909U 2000-01-19 2000-01-19 Semiconductor package structure having multiple lead frames combined with plural chips TW446190U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89200909U TW446190U (en) 2000-01-19 2000-01-19 Semiconductor package structure having multiple lead frames combined with plural chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89200909U TW446190U (en) 2000-01-19 2000-01-19 Semiconductor package structure having multiple lead frames combined with plural chips

Publications (1)

Publication Number Publication Date
TW446190U true TW446190U (en) 2001-07-11

Family

ID=21663211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89200909U TW446190U (en) 2000-01-19 2000-01-19 Semiconductor package structure having multiple lead frames combined with plural chips

Country Status (1)

Country Link
TW (1) TW446190U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model