TW436354B

TW436354B - Pattern correcting device and its method

Info

Publication number: TW436354B
Application number: TW88108291A
Authority: TW
Inventors: Masahiro Saruta; Akihiro Yamanaka; Shigeo Shimizu; Takayuki Oishi
Original assignee: Ntn Toyo Bearing Co Ltd
Priority date: 1998-07-29
Filing date: 1999-05-20
Publication date: 2001-05-28

Abstract

To provide a device and method of correcting a pattern defect on a substrate having a wide-ranging thickness and shape. The pattern correcting device includes a substrate table 10, a laser beam irradiating device 1, an optical system 21 that adjusts the laser beam to a micro beam diameter, and a table control means for controlling the movement of the table 10 so that the beam scans the entirety of the area to be corrected.

Description

43635 4 五、發明說明（i) 發明所屬技術領域本發明係關於按照在基板上所形成圖案之缺陷部之狀況除去、附加固定形狀之圖案或相同修正機會地進行除去和附加之修正裝置及修正方法，尤其係關於在液晶顯示器 (Liquid Crystal Display :LCD)或電漿顯示器（Piasma Display Panel :PDP)等平面顯示器之基板及印刷電路板所形成之圖案之修正裝置及修正方法。習知技術隨著在LCD基板上形成之圖案之高精細化之進展，在圖案中之信號用汲極配線或閘極線發生短路部或圖案過粗等需要除去固定形狀之圖案之缺陷之頻次增加。而，由於敍刻條件之過剩或異物之混入也發生圖案之斷線或脫落等需要附加固定形狀之圖案之缺陷。發生這兩種缺陷之傾向有隨著基板大型化、高精細化及電極線之線寬變細而變得顯著之傾向。首先’說明發生了需要除去固定形狀之圖案之缺陷之情況。在發生了上述之缺陷之情況，使用圖9所示裝置修正，削除該缺陷部。即’自具有電光學Q開關（EOQ開關）之YAG(Yttrium Aluminum Garnet)雷射光射出裝置101射出之巨脈波之雷射光’首先’利用配置於雷射光光學系121之輸出功率控制機構102控制其功率，利用縫隙機構1〇4形成配合缺陷部形狀之光束截面形狀。然後，通過成像透鏡1〇6及物鏡43635 4 V. Description of the invention (i) Technical field of the invention The present invention relates to the removal and addition of correction devices and corrections based on the removal of defective portions of patterns formed on substrates, the addition of fixed-shape patterns, or the same correction opportunities. The method, in particular, relates to a device and method for correcting a pattern formed on a substrate of a flat display such as a liquid crystal display (LCD) or a plasma display (Piasma Display Panel: PDP) and a printed circuit board. With the advancement of the high-definition pattern of the pattern formed on the LCD substrate, the frequency of the short-circuited part of the signal in the pattern using the drain wiring or the gate line or the pattern is too thick. increase. In addition, due to the excess of the narrative conditions or the incorporation of foreign objects, defects such as disconnection or peeling of the pattern that require a fixed shape pattern also occur. These two types of defects tend to be noticeable as the substrate becomes larger and finer and the line width of the electrode wires becomes smaller. First, a description will be given of a case where a defect of a pattern having a fixed shape has to be removed. In the case where the above-mentioned defect has occurred, the device shown in Fig. 9 is used to correct the defective portion. That is, "the laser light of a giant pulse wave emitted from a YAG (Yttrium Aluminum Garnet) laser light emitting device 101 with an electro-optic Q switch (EOQ switch)" is first controlled by the output power control mechanism 102 disposed in the laser optical system 121 With its power, the slot mechanism 104 is used to form a beam cross-sectional shape that matches the shape of the defect. Then, through the imaging lens 106 and the objective lens

第4頁 436354 五、發明說明（2) 1 〇 8，以脈波照射於係包括圖案之缺陷部之基板之工件1 〇 9 上° 而，工件109裝載於XY工作台1 10上，可令移至所要位置。此時，使用透射照明光111或落射照明光11 2，可利用 CCD照相機1 1 3觀察圖案缺陷部或雷射光照射區域。又，利用該縫隙光11 4也可確認圖案缺陷部附近之雷射光之截面形狀，即雷射光照射形狀。其次說明發生了需要附加或形成固定形狀之圖案之缺陷（斷線等缺陷）之情況。關於這些斷線等缺陷之修正，如在如特開平8_292442 號公報等所示般，令在缺陷部塗膠後烘烤而修正。在烘烤 H方法上有將基板整體放入電氣爐等烘烤之方法和利用 Y^G(Yttrium Aluminum Garnet)雷射、雷射、 ^導體雷射、0)2雷射等只局部烘烤膠之部分之洪烤方發明要解決之課題利用自具有E0Q開關之YAG雷射斛之罝射出之巨脈波之雷射光單發或夕發之削除大面積（例如 . 圖岽盔1 且傻ΙΟΟμιη)之修正，在園系馬1/ζιη以下之薄膜之情況有效。 .^ ^ 格超過^ L 可是’在圖案之膜厚义垃之情況，在完全除去應削料因受』除之圖案之中，電極材付u又到该巨脈波之雷射光之照射 4 全修正雷极^ W而發生變質等’有難完卜I电極材料之情況。在此情況陷部，成ή ^ m 月况，未完全修正圖案之缺取為動作不良之原因。而’在以附加固定形狀之圖幸攸τ β 系修正之情況，採用使用Page 4 436354 V. Description of the invention (2) 1 〇8, the workpiece 1 109 is irradiated with a pulse wave on the substrate including the defective part of the pattern. Moreover, the workpiece 109 is loaded on the XY table 1 10, which can make Move to the desired position. At this time, using the transmitted illumination light 111 or the epi-illumination light 112, the pattern defect portion or the laser light irradiation area can be observed with the CCD camera 1 1 3. Also, the cross-sectional shape of the laser light near the pattern defective portion, that is, the shape of the laser light irradiation, can be confirmed by using the slit light 114. Next, it will be explained that a defect (defect such as a broken line) where a pattern having a fixed shape needs to be added or formed has occurred. As for the correction of these defects such as disconnection, as shown in Japanese Patent Application Laid-Open No. 8_292442, etc., the defective portion is baked and then corrected. In the baking method H, there are baking methods such as placing the entire substrate in an electric furnace, and using only Y ^ G (Yttrium Aluminum Garnet) laser, laser, ^ conductor laser, 0) 2 laser, etc. The problem to be solved by Hong Bafang of the plastic part is to use the laser light from the YAG laser with the E0Q switch to emit large pulses of single light or evening hair to remove a large area (for example. Figure 岽 helm 1 and silly The correction of 100 μιη) is effective in the case of thin films below 1 / ζιη. . ^ ^ Grid exceeds ^ L, but in the case of the film thickness of the pattern, in the case of completely removing the material that should be shaved, the electrode material returns to the laser light irradiation of the giant pulse 4 It may be difficult to complete the correction of the electrode material due to deterioration of the lightning pole ^ W. In this case, the depression, the monthly price, and the lack of full correction of the pattern are taken as the cause of poor operation. In the case where ′ β is corrected with an additional fixed shape, use

々36354 五'發明說明（3) 電氣爐烘烤基板整體之方法時，隨著基板之爐等没備也不得不大型化，結果，無法避免又’不僅價格’藉著烘烤基板整體，大型化發生變形等問題。又’在利用雷射光等之照射烘烤之情況裝置裝載雷射光射出裝置，可構成小型之裝於在雷射光照射區域内之圖案部和未形成圖比值’發生未適當地烘烤之情況。因此’本發明之第1目的在於提供可簡j 將具有和形狀之固定形狀削除、減厚之圖案修正裝置及修正方法。其他目的在於提供一種圖案修正裝置及需要附加固定形狀之圖案之缺陷部之修正上光照射區域内之圖案部之比值之大小，總是當之雷射光烘烤。、又，另外之目的在於提供一種圖案修正法’在係需要削除和附加之位置混在一起之種藏在一起之情況’並在缺陷之性質上削除之h况，或加大地附加後削除的較好之情況定形狀後附加固定形狀，或在加大地附加固成指定之形狀，進行微修正。解決課題之手段關於在本發明之第1局面之圖案修正裝j 射光修正在基板所形成之圖案的，在構造上大型化’電氣價格上漲等。之基板因熱而 ’藉著在修正置。可是，由案之基板部之 I地修正需要缺陷部之圖案修正方法，在 ’不管在雷射可藉著照射適裝置及修正方情況，或無那後附加的較好 ’可在削除固定形狀後削除 :’係利用雷包括：工作々36354 Description of the 5 'invention (3) In the method of baking the entire substrate of the electric furnace, the substrate furnace has to be enlarged as the substrate and the like are not prepared. Problems such as deformation. In the case of "baking by irradiation with laser light or the like", the device is equipped with a laser light emitting device, which can constitute a small-sized pattern portion installed in the laser light irradiated area and a non-formation ratio. Therefore, a first object of the present invention is to provide a pattern correction device and a correction method that can simplify and reduce the thickness and shape of a fixed shape. The other purpose is to provide a pattern correcting device and the ratio of the ratio of the pattern portion in the light irradiated area of the defective portion that needs to be added to the pattern with a fixed shape, and always be laser light baked. In addition, another purpose is to provide a pattern correction method 'in the case where the seeds that need to be removed and added are mixed together and hidden', and the condition of the removal of the nature of the defect, or a larger comparison after removal In a good case, a fixed shape is added after the shape is fixed, or it is fixed to a specified shape after being enlarged to perform a slight correction. Means for Solving the Problem Regarding the pattern correction device of the first aspect of the present invention, the light beam correction pattern formed on the substrate has been increased in size due to its structure, and the electrical price has increased. The substrate is heated due to heat. However, the pattern correction method of the defective part of the substrate part of the case requires a pattern correction method for the defective part. The 'fixed shape can be removed regardless of whether the laser can be adapted to the device and the correction situation, or it can be added after that'. Post-removal: 'Department of mine use includes: work

第6頁Page 6

~ 1 ------ 436354 五、發明說明（4) 台’可在支撐基板之平面移内動；雷射光射出裝置，射出雷射光；光學系，將該雷射光以直徑比圖案修正區域小之光束聚光於基板上；以及工作台控制裝置，如該光束掃描該圖案修正區域之全區域般控制該工作台之移動。藉著採用上述之構造，因雷射光聚光於圖案修正區域之一部分’能量密度高之雷射光依次掃描修正區域之全區域下去’即使膜厚厚之位置也完全地修正，可得到漂亮之切割面。該雷射光係連續波之雷射光，掃描該圖案修正區域之全區域之該工作台之移動設為連續之情況多。藉著使用上述之雷射光，在修正時充滿雷射光之熱，變成更熱加工性，配合將基板之移動設為連續性之效果，可得到平滑、切割鋒利之切割面。又’該雷射光係頻率5〇OHz以上之脈波狀之連續波之~ 1 ------ 436354 V. Description of the invention (4) The stage can move within the plane of the supporting substrate; the laser light emitting device emits laser light; the optical system corrects the area of the laser light with a diameter ratio pattern The small beam is focused on the substrate; and the table control device controls the movement of the table as the beam scans the entire area of the pattern correction area. By adopting the above-mentioned structure, the laser light is condensed on a part of the pattern correction area. "High-energy-density laser light scans the entire area of the correction area sequentially" Even if the thickness of the film is completely corrected, a beautiful cut is obtained surface. The laser light is continuous laser light, and it is often the case that the movement of the table that scans the entire area of the pattern correction area is set to be continuous. By using the above laser light, the heat of the laser light is filled during the correction, which becomes hotter workability. With the effect of making the movement of the substrate continuous, a smooth and sharp cutting surface can be obtained. Also, the laser light is a continuous wave having a pulse shape with a frequency above 50 Hz.

雷射光’掃描該圖案修正區域之全區域之該工作台之移動設為連續的也可。 D 若係如述之高頻之脈波狀雷射光，實質上和連續波之雷射光無差異，熱加性要素高，可確保切割鋒利。藉著將工作台之移動設為連續的，可得到平滑之切割面，這和上述一樣。光束徑比該圖案修正區域小之雷射光設為在圖案上Μ 以下之局面多。藉著將光束杻縮小至在圖案上3〇以下，可提高恭射光照射區域之雷射光之能量密度，即使膜厚厚之圖案田也The laser light 'may scan the entire area of the pattern correction area, and the movement of the table may be continuous. D If it is a high-frequency pulsed laser light as described above, it is substantially the same as the continuous-wave laser light, and the thermal additive factor is high, which can ensure the cutting sharpness. By setting the table movement continuously, a smooth cutting surface can be obtained, which is the same as above. The laser light having a beam diameter smaller than the pattern correction area is set to be more than M on the pattern. By reducing the beam chirp to less than 30 on the pattern, the energy density of the laser light in the area where the laser light is irradiated can be increased, even for a pattern field with a thick film.

436354 五、發明說明（5) 可令邊移動基板邊確實地修正° 此外，為了得到切割漂亮之修正結果，雷射光射出裝置採用YAG或YLFCLiYF4)雷射光射出裝置，該雷射光係自該YAG或YLF雷射光射出裝置射出之第2調諧波雷射光^ & 用波長係500〜600nm的。藉著使用上述之雷射光，在令基板移動下可鋒利地士刀割。此外，該雷射光使用連續波之雷射光也可，使用_ _ 500Hz以上之脈波狀雷射光也可。又，該圖案修正裝置大多包括：圖案觀察用CCD照相機；處理自該CCD照相機得到之影像之影像處理機構了以及依據該影像決定應修正之掃描區域之裝置。藉著具有上述之機構，因可簡單地設定斜择描咬大面積之掃描區域’在需要斜加工等之複雜之形狀之缺陷部，也不會降低作業效率地修正。 11 包括該CCD照相機之觀察用光學系之光學轴設為和將該雷射光聚光之光學系之光學軸同軸之情況多。 σ、藉著設為同軸’在識別圖案之修正處後，必令修正用之雷射光之雷射光光學系移動。結果，不必將修正處和雷射光光學系對準，可提高修正位置之精度和欵率。田上述之裝置用於實施成為本發明之基本之其次說明之修正方法。這是利用雷射光修正在基板所形成之圖案之圖案修正方法’將光束徑比圖案修正區域小之該雷射光照射於該圖案修正區域，如該光束掃描該圖案修正區域之全區域般控制裝載了基板之工作台移動。436354 V. Description of the invention (5) Correction can be made while moving the substrate. In addition, in order to obtain a beautiful cutting result, the laser light emitting device uses YAG or YLFCLiYF4). The laser light emitting device is from the YAG or The second tuned laser light emitted from the YLF laser light emitting device ^ & uses a wavelength of 500 to 600 nm. By using the laser light described above, the substrate can be cut sharply by moving the substrate. In addition, as the laser light, a continuous wave laser light may be used, and a pulse wave laser light of _ 500 Hz or more may be used. In addition, most of the pattern correction devices include: a CCD camera for pattern observation; an image processing mechanism that processes an image obtained from the CCD camera; and a device that determines a scanning area to be corrected based on the image. By having the above-mentioned mechanism, it is possible to simply set a scan area with a large area obliquely to select a scan area with a large area, and to correct a defective portion having a complicated shape such as oblique processing, without reducing work efficiency. 11 It is often the case that the optical axis of the optical system for observation including the CCD camera is coaxial with the optical axis of the optical system that focuses the laser light. σ. By setting the coaxial position to the correction position of the recognition pattern, the laser optical system of the correction light must be moved. As a result, it is not necessary to align the correction portion with the laser optical system, and the accuracy and power of the correction position can be improved. The above-mentioned device is used to implement a correction method which is the second and second explanation of the basics of the present invention. This is a pattern correction method that uses laser light to correct the pattern formed on the substrate. 'The laser light with a beam diameter smaller than the pattern correction area is irradiated to the pattern correction area, and the loading is controlled as the beam scans the entire area of the pattern correction area. The workbench moves the substrate.

第8頁 43 63 5 4 五、發明說明（6) 利用上述之方法，即使係膜厚厚而且大面積之修正區域也可確實且漂亮地切割。又，上述之圖案修正方法，最好應用於膜厚係丨"爪以上之圖案。利用上述之修正方法，可確實地修正用習知之利用i 個脈波或多個脈波之雷射擊發之方法無法完全修正之應修正之區域’可表示上述修正方法之有效性。本發明之在其他局面之圖案修正裝置，係利用觀察用光學裝置觀察在該基板所形成之圖案，識別修正處，在續修正處塗膠後修正之圖案修正裝置，包括：雷射光射出裝置；影像處理機構，自該觀察用光學裝置所得到之影像求該雷射光照射區域内之圖案部及膠部之總面積和未形成圖案之基板部之面積之比；以及自該比決定藉著將該雷射光照射於該膠附近之烘烤條件之裝置。藉著具有如上述之裝置，利用雷射光之照射烘烤之膠之溫度變為定值，和雷射光照射區域内之圖案部及膠部之總面積與基板部之面積之比無關，隨時都可適當地烘烤。又，因不將基板放入電氣爐等烘烤，基板大型化也不會變形。此外，利用雷射光射出裝置和通過雷射光傳播中之輸率控制機構可控制f射光照射條件之中之雷射光照射月t*置 0 該圖案修正裝置大多具有量測照射雷射光而烘烤中之 …射區域之溫度之溫度量測機構和依據該溫度量測結果決Page 8 43 63 5 4 V. Description of the invention (6) With the above method, even if the thickness of the system film is large and the correction area is large, it can be cut accurately and beautifully. In addition, the above-mentioned pattern correction method is preferably applied to a pattern having a thickness of more than "claws". By using the above-mentioned correction method, it is possible to positively correct the area to be corrected which cannot be completely corrected by the conventional method of firing with i pulses or multiple pulses, which can indicate the effectiveness of the above-mentioned correction method. The pattern correction device in other aspects of the present invention is a pattern correction device for observing a pattern formed on the substrate by using an observation optical device, identifying a correction position, and applying a glue correction to the subsequent correction position, including a laser light emitting device; An image processing mechanism, from the image obtained by the observation optical device, finds the ratio of the total area of the pattern portion and the glue portion in the laser light irradiation area to the area of the unpatterned substrate portion; The laser light irradiates the device in the baking condition near the glue. By having the device as described above, the temperature of the glue baked by laser light irradiation becomes a fixed value, regardless of the ratio of the total area of the pattern portion and the glue portion in the laser light irradiation area to the area of the substrate portion, at any time. Can be baked properly. In addition, since the substrate is not baked in an electric furnace or the like, the substrate is not deformed even if it is enlarged. In addition, the laser light emitting device and the transmission rate control mechanism in the laser light transmission can control the laser light irradiation time t * set to 0 in the irradiation conditions of the laser light. Most of the pattern correction devices have a measurement of the irradiation laser light and are baking. The temperature measurement mechanism of the temperature in the shooting area and the determination based on the temperature measurement result

第9頁 436354 五、發明說明（Ό 定該雷射光之照射條件之裝置。藉著還具有如上述之機構’可更穩地烘烤膠。在上述之圖案修正裝置之雷射光射出裝置和雷射光光學系大多係用以削除在基板上形成之圖案之剩餘部。藉著令雷射光射出裝置和其光學系也具有如上述之功能’可適當地修正各種形態之缺陷。上述之裝置用於實施其次說明之本發明之圖案修正方法之情況。在本發明之圖案修正方法，係利用觀察用光學裝置觀察在該基板所形成之圖案，識別修正處，在該修正處塗膠後，將雷射光照射該膠而烘烤、修正之圖案修正方法’包括自該觀察用光學裝置所得到之影像求該雷射光照射區域内之圖案部及膠部之總面積和未形成圖案之基板部之面積之比之步驟’在圖案材料對該雷射光之吸收率比基板材料對該雷射光之吸收率大之情況，在該比值小之範圍提高該雷射光之照射能量，隨著該比值變大，降低該雷射光之照射能量。藉著上述之方法’利用雷射光之照射烘烤之膠之溫度變為定值，和雷射光照射區域内之圖案部及膠部之總面積與基板部之面積之比無關，隨時都可適當地烘烤。上述之圖案修正方法大多係包括照射雷射光後量測供烤中之照射區域之溫度之步驟，依據該溫度量測結果增減該雷射光之照射能量的。藉著依據雷射光照射中之溫度資訊進一步控制雷射光照射條件，可更穩定地烘烤膠。Page 9 436354 V. Description of the invention (Ό Device for determining the irradiation conditions of the laser light. By having a mechanism as described above, the glue can be baked more stably. The laser light emitting device and the laser in the pattern correction device described above The light-emitting optical system is mostly used to remove the remaining part of the pattern formed on the substrate. By making the laser light emitting device and its optical system also have the functions described above, the defects of various forms can be appropriately corrected. The above-mentioned device is used for In the case of implementing the pattern correction method of the present invention described next. In the pattern correction method of the present invention, the pattern formed on the substrate is observed with an observation optical device, the correction position is identified, and the correction is applied to the correction position. Pattern correction method for baking and correcting by irradiating light with the glue, including calculating the total area of the pattern portion and the glue portion in the laser light irradiation area and the area of the substrate portion without patterning from the image obtained by the observation optical device The step of the ratio 'is in the case where the absorption rate of the pattern material to the laser light is larger than the absorption rate of the substrate material to the laser light. The irradiation energy of the laser light is increased, and as the ratio becomes larger, the irradiation energy of the laser light is reduced. By the method described above, the temperature of the glue baked by the irradiation of the laser light becomes a fixed value, and the laser light is irradiated. The total area of the pattern part and the glue part in the area has nothing to do with the ratio of the area of the substrate part, and can be baked properly at any time. Most of the above-mentioned pattern correction methods include measuring the temperature of the irradiation area during baking after irradiating laser light. In the step, the irradiation energy of the laser light is increased or decreased according to the temperature measurement result. By further controlling the laser light irradiation conditions according to the temperature information in the laser light irradiation, the glue can be baked more stably.

第10頁五、發明說明（8) 〜此外，在上述之本發明之所有的修正裝置及修正方法’其修正包括只削除固定形狀之情況、或只附加固定形狀之情況、或削除固定形狀後附加固定形狀之情況、或^ 大地附加固定形狀後削除成指定之形狀之情況。發明之實施例實施形態1 圖1係表示本發明之圖案修正裝置之構造圖。用輸出功率控制機構2控制自YAG或YLF等連續雷射光射出裝置 Η包括500Hz以上之脈波雷射）射出之雷射光16之輸出功率，通過分光鏡5、7，利用物鏡8聚光成微小之光束徑例如1 〇 // m之光束徑後，照射於工件9上。另一方面，依照自個人電腦（圖上未示）側所設定之掃描區域同步操作XY工作台1 〇，可和掃描區域之厚度或形狀等無關地修正寬範圍之缺陷。又’因具備CCD照相機13，可正確地監視修正中之狀態。在藉著短路部等之削除等設定應修正之掃描區域時，如圖2A所示，為了也可適應斜加工，將3點p、q、r輪入自 CCD照^相機所得到之個人電腦畫面上之影像。利用此輪就將由pq方向和pr方向形成之平行四邊形登記為掃描區域此外’最初所設定之2點係p、q之情況，如圖2 b所不’可決定為沿著pq方向進行主掃描、以pr方向為副掃描方向掃描。因此，可簡單地設定，可令作業效率提高。例如’對於將圖2A之電極線51、52短路之短路部53，Page 10 V. Description of the invention (8) ~ In addition, in all the correction devices and correction methods of the present invention described above, the correction includes a case where only a fixed shape is removed, or a case where only a fixed shape is added, or a fixed shape is removed When a fixed shape is added, or when a fixed shape is added to the ground and cut to a specified shape. Embodiment of the Invention Embodiment 1 FIG. 1 is a structural diagram showing a pattern correction device of the present invention. The output power control mechanism 2 is used to control the continuous laser light emitting device such as YAG or YLF (including pulse lasers above 500Hz). The output power of laser light 16 emitted by the beam splitters 5 and 7 is focused by the objective lens 8 After the beam diameter is, for example, a beam diameter of 10 // m, the workpiece 9 is irradiated. On the other hand, by operating the XY table 10 in synchronization with the scanning area set from the personal computer (not shown), a wide range of defects can be corrected regardless of the thickness or shape of the scanning area. Furthermore, since the CCD camera 13 is provided, the state during correction can be accurately monitored. When setting the scanning area to be corrected by the removal of the short-circuit part, etc., as shown in FIG. 2A, in order to also be able to adapt to oblique processing, 3 points p, q, and r are turned into a personal computer obtained from a CCD camera. The image on the screen. Use this round to register the parallelogram formed by the pq direction and the pr direction as the scanning area. In addition, if the two points originally set are p and q, as shown in Figure 2b, you can decide to perform the main scan along the pq direction. Scan with the pr direction as the sub-scanning direction. Therefore, it can be set simply, and work efficiency can be improved. For example, 'for the short-circuit portion 53 which short-circuits the electrode wires 51, 52 of FIG. 2A,

第Π頁 436354 五、發明說明（9) 如圖2B所示，雷射光束徑掃描，依次修正下去，一直至電極線51和52分離。這種修正，不管應修正圖案處之膜厚厚或寬，都可簡單地設定掃描區域並高效率地進行。在修正條件之參數上，有雷射光之功率、掃描光束間之重疊範圍（掃描密度）、XY工作台之速度等’這些設定可自個人電腦側任意地設定。因此，可極簡便且確實地修正圖案。圖3係表示上述本發明之裝置之整體構造例之圖。如上述所示’在主電腦33上可使用個人電腦，也可容易地設疋上述之掃描區域或修正條件。在圖3，將工件9固定於夾具座15 ’該夾具座15裝在ΧΥ工作台1〇上，利用控制用電腦 32及控制裝置31控制成在χγ平面内移動。在本發明所指的「工作台控制裝置」裝入上述之控制裝置31、控制用電腦32以及主電腦33。雷射光之光學系21藉著控制Ζ輪工作台22可對準焦點。。 …、實施形態2 其次說明斷線等需要附加固定形狀之圖案之缺陷之修正 0 在雷射光照射區域之圖案部和形成固定形狀之附加部之穆·部之總面積和剩下之面積之比變化時，變成無法利用適當之雷射光照射烘烤《這是由於投入一樣之雷^光照射能量’也因圖案材料和基板材料對於雷射光之吸收率不同，溫度上升就變動。Page 436354 V. Description of the invention (9) As shown in FIG. 2B, the laser beam path is scanned and corrected in sequence until the electrode lines 51 and 52 are separated. This correction, regardless of the thickness or width of the film where the pattern should be corrected, can be easily set and efficiently performed. The parameters of the correction conditions include the power of the laser light, the overlap range between scanning beams (scanning density), the speed of the XY table, and the like. These settings can be arbitrarily set from the personal computer side. Therefore, the pattern can be corrected easily and reliably. Fig. 3 is a diagram showing an example of the overall structure of the apparatus of the present invention. As shown above, a personal computer can be used on the host computer 33, and the above-mentioned scanning area or correction conditions can be easily set. In FIG. 3, the workpiece 9 is fixed to the clamp base 15 ', and the clamp base 15 is mounted on the XY table 10, and is controlled to move in the χγ plane by the control computer 32 and the control device 31. The "table control device" referred to in the present invention incorporates the aforementioned control device 31, control computer 32, and host computer 33. The optical system 21 of the laser light can be aligned with the focal point by controlling the Z-wheel table 22. . …, Embodiment 2 Next, the correction of defects such as broken lines that require a fixed shape pattern will be described. 0 The ratio of the total area of the pattern portion in the laser light irradiation area and the fixed portion of the additional portion to the remaining area. When it changes, it becomes impossible to use appropriate laser light to irradiate. "This is because the same amount of laser light irradiation energy is used." Because the pattern material and the substrate material have different absorption rates for laser light, the temperature rises.

第〗2頁 436354 五、發明説明（11) 藉著具有這些裝置’可知道雷射光照射中之照射區域之溫度’依照其溫度還可精密地控制。結果，圖案材料之成分等偏離一般的而對於雷射光之吸收率有變動，也可穩定地完成烘烤。在無那種變動之情況，還可精密、穩定地烘烤。其次說明本裝置之操作方法。首先，利用CCD照相機13觀察XY工作台1〇所襞載之基板中塗抹膠之部分40時，得到圖8所示之影像。利用縫$ 機構12決定雷射光照射區域41之大小，利用影像處理機構 31照射區域41内之圖案部43及膠部4〇之總面積和玻璃部杜之面積之比。雷射光之照射可利用雷射光射出裝置〗本體和輸出功率控制機構2調整。藉著在烘烤時利用溫度内之溫度後對雷射光射，可將烘烤狀態保持固部之比例之大小，可利殘留變形地簡單地進行構18，也可柔軟地適應無那種變動之情況，可全是舉例，本發明之範明之範圍依據專利請求求範圍具有均等之意義在需要更穩定之烘烤之情況，量測機構1 8量測雷射光照射區域4 1 出裝置1和輸出功率控制機構2回授定。藉著使用這種装置，不管圖案，雷射光照射烘烤膠，可在基板不高精度修正。藉著利用溫度量測機工業上、日常上發生之變動，又在更穩疋、南精度地挺烤。 ^外，上述公開之實施形態完益®主-實施形態。本發範圍表不，還意指包括在和專利請Page 2 436354 V. Description of the invention (11) By having these devices, 'the temperature of the irradiation area in the laser light irradiation' can be accurately controlled according to the temperature. As a result, the composition and the like of the pattern material deviate from the ordinary, and the absorption rate of the laser light varies, and the baking can be performed stably. In the absence of such changes, baking can be performed with precision and stability. The operation method of the device will be described next. First, when using the CCD camera 13 to observe the glue-applied portion 40 on the substrate loaded on the XY table 10, an image shown in Fig. 8 is obtained. The size of the laser light irradiation area 41 is determined by the slit mechanism 12, and the ratio of the total area of the pattern portion 43 and the rubber portion 40 in the irradiation area 41 by the image processing mechanism 31 and the area of the glass portion. The laser light irradiation can be adjusted by using the laser light emitting device and the output power control mechanism 2. By utilizing the temperature within the temperature during laser baking, the laser light can be used to maintain the proportion of the solid portion in the baked state, which can be easily constructed with residual deformation and can be flexibly adapted to no such changes. All the cases can be taken as examples. The scope of the present invention is based on the patent request. The range has equal meaning. In the case of more stable baking, the measuring mechanism 1 measures the laser light irradiation area 4 1 out of the device 1 and Output power control mechanism 2 feedback setting. By using this device, regardless of the pattern, the laser light irradiates the baking glue, and the substrate can not be corrected with high accuracy. By using the temperature measuring machine in the industrial and daily changes, it is still roasting with more stability and accuracy. ^ In addition, the embodiment disclosed in the above is a completed embodiment of the main embodiment. The scope of this publication is not intended to mean

第14頁 43635 4 五、發明說明（12) 及範圍内之所有的變更。發明之效果關於需要固定形狀之圖案之削除、減厚等之缺陷部之修正，藉著應用本發明之圖案修正裝置及修正方法，因將光束徑縮小了之雷射光照射於修正區域，邊令基板移動邊修正修正區域，不管修正區域係厚或是大面積，都可漂亮地修正。又，因對於自CCD照相機所得到個人電腦畫面上之衫像可簡早地設定修正區域，作業效率提高。又，關於需要固定形狀之圖案之附加、形成等之缺陷部^修正，藉著應用本發明之圖案修正裝置及修正方法， ί ^ ΐ Ϊ部之比例之A小’可穩定地烘烤膠，彳簡便、高還藉著量測烘烤時之溫度後對雷射光照射回杈’可更穩定、高精度地烘烤。和附加之位置混在-起之情況，或無那種此在一起之情況，並在缺陷較好之情％’或加大地附加後削除軔：上：除後附加的和附加形成順序顛倒，在各好之情況’將削除到上述之效S。則除和形成之製程，可分別得圖式簡單說明示ir之圖案修正裝置之構造圖。圖2係表不本發明之設定圖圖2A係表示在配線中發生之短路部之區域二方法之圖。短路部之雷射光之掃描方法之圖。。圖係表示除去圖3係表示本發明之裝置之整體構造例之圖。Page 14 43635 4 V. Description of the Invention (12) and all changes within its scope. Effects of the Invention Regarding the correction of defective parts such as pattern removal and thickness reduction that require a fixed shape, by applying the pattern correction device and the correction method of the present invention, the laser beam with a reduced beam diameter is irradiated to the correction area. The correction area is corrected while the substrate is moving, and it can be beautifully corrected regardless of whether the correction area is thick or large. In addition, since the correction area can be set early for the shirt image on the PC screen obtained from the CCD camera, the work efficiency is improved. In addition, regarding the defective portion ^ correction that requires the addition, formation, etc. of a pattern with a fixed shape, by applying the pattern correction device and the correction method of the present invention, the ratio A of the ί Ϊ portion is small, and the glue can be baked steadily,彳 Simple, high, and by measuring the temperature at the time of baking, the laser light is irradiated back to the fork, and it can be baked more stably and accurately. In the case where it is mixed with the position of addition, or there is no such situation, and it is deleted after the defect is better% 'or added. 上: Above: The order of addition and addition is reversed. Each good case 'will be eliminated to the above effect S. Then the process of division and formation can be obtained separately. The diagram shows the structure of the pattern correction device of ir. Fig. 2 is a diagram showing a setting of the present invention. Fig. 2A is a diagram showing a method of a region 2 of a short-circuit portion occurring in wiring. Scanning method of laser light in the short circuit part. . The figure is a figure excluding the figure. Figure 3 is a diagram showing an example of the overall structure of the device of the present invention.

IH 第15頁 436354 五、發明說明（13) 圖4係表示波長對形成電極線之鉻和係基板材料之玻璃之雷射光吸收率之影響之圖。圖5係表示用以進行適當之烘烤之鉻和玻璃之面積比以及雷射光輸出功率之關係之圖。圖6係本發明之圖案修正裝置之整體圖。圖7係表示本發明之雷射光學系和與該雷射光學系裝成同軸之觀察用光學系之構造之圖。圖8係表示雷射光照射區域之放大圖。圖9係表示習知之圖案修正裝置之圖。符號說明 1 雷射光射出裝置 2 輸出功率控号 3 分光鏡 4 縫隙機構 5 分光鏡 6 成像透鏡 7 分光鏡 8 物鏡 9 工件 10 XY工作台 11 透射照明光 12 落射照明光 13 CCD照相機 14 縫隙光 15 夾具座 16 雷射光 18 溫度量測機構 21 雷射光光學 22 Z軸工作台 26 塗膠機構 31 控制裝置 32 控制用電腦 33 主電腦 40 膠部 41 雷射光照射區域 42 玻璃部 43 圖案部 51 、5 2 電極線IH Page 15 436354 V. Description of the invention (13) Figure 4 is a graph showing the influence of the wavelength on the laser light absorption of the chromium forming the electrode wire and the glass of the substrate material. Fig. 5 is a graph showing the relationship between the area ratio of chromium and glass used for proper baking and the output power of laser light. Fig. 6 is an overall view of a pattern correction device of the present invention. Fig. 7 is a diagram showing the structure of a laser optical system of the present invention and an observation optical system mounted coaxially with the laser optical system. FIG. 8 is an enlarged view showing a laser light irradiation area. Fig. 9 is a diagram showing a conventional pattern correction device. DESCRIPTION OF SYMBOLS 1 Laser light emitting device 2 Output power control number 3 Beamsplitter 4 Slit mechanism 5 Beamsplitter 6 Imaging lens 7 Beamsplitter 8 Objective lens 9 Workpiece 10 XY stage 11 Transmitted illumination light 12 Epi-illumination light 13 CCD camera 14 Slit light 15 Fixture base 16 Laser light 18 Temperature measuring mechanism 21 Laser light optics 22 Z-axis table 26 Glue mechanism 31 Control device 32 Control computer 33 Host computer 40 Glue section 41 Laser light irradiation area 42 Glass section 43 Pattern section 51, 5 2 electrode wire

第16頁 d3635 4 五、發明說明（14) 5 3 短路部 p、q、r 指定應修正掃描區域之3點Page 16 d3635 4 V. Description of the invention (14) 5 3 Short-circuit part p, q, r Specify 3 points of scanning area to be corrected

IIHI 第17頁IIHI Page 17

Claims

六、申請專利範圍 1· 一種圖案修正裝置，利用雷射光修正在基板所形成之圖案，包括：工作台，可在支撐基板之平面移内動；雷射光射出裝置，射出雷射光；光學系，將該雷射光以直徑比圖案修正區域小之光束聚光於基板上；以及工作台控制裝置，如該光束掃描該圖案修正區域之全區域般控制該工作台之移動。 2·如申請專利範圍第1項之圖案修正裝置，其中該雷射光係連續波之雷射光，掃描該圖案修正區域之全區域之該工作台之移動係連續的。 3. 如申請專利範圍第1項之圖案修正裝置，其中該雷射光係頻率5〇〇Hz以上之脈波狀之連續波之雷射光，掃描該圖案修正區域之全區域之該工作台之移動係連續的。 4. 如申請專利範圍第1、2或3項之圖案修正裝置，其中光束徑比該圖案修正區域小之雷射光係在該圖案上30 y m以下。 5. 如申請專利範圍第1、2或3項之圖案修正裝置，其 _該雷射光射出裝置係YAG或YLF雷射光射出裝置，該雷射光係自該YAG或YLF雷射光射出裝置射出之第2調諧波雷射光，其波長係50 0 ~ 6 0 0nm。 6. 如申請專利範圍第1、2或3項之圖案修正裝置，其中該圖案修正裝置包括：圖案觀察用CCD照相機；6. Scope of Patent Application 1. A pattern correction device that uses laser light to correct a pattern formed on a substrate, including: a table that can move within the plane of a supporting substrate; a laser light emitting device that emits laser light; an optical system, Focusing the laser light on the substrate with a light beam having a diameter smaller than the pattern correction area; and a table control device that controls the movement of the table as the light beam scans the entire area of the pattern correction area. 2. The pattern correction device according to item 1 of the scope of the patent application, wherein the laser light is continuous wave laser light, and the movement of the table that scans the entire area of the pattern correction area is continuous. 3. For example, the pattern correction device in the scope of patent application, wherein the laser light is a pulsed continuous wave laser light having a frequency of 500 Hz or more, scanning the movement of the table in the entire area of the pattern correction area. Department of continuous. 4. For the pattern correction device in the scope of patent application No. 1, 2 or 3, the laser light with a beam diameter smaller than the pattern correction area is below 30 y m on the pattern. 5. If the pattern correction device of item 1, 2 or 3 of the scope of patent application, the laser light emitting device is a YAG or YLF laser light emitting device, and the laser light is the first one emitted from the YAG or YLF laser light emitting device 2 Tuning wave laser light, its wavelength is 50 0 ~ 600 nm. 6. The pattern correction device as claimed in item 1, 2, or 3, wherein the pattern correction device includes: a CCD camera for pattern observation;

第18頁 436354 六'申請專利範圍處理自該CCD照相機得到之影像之影像處理機構；以依據該影像決定應修正之掃描區域之裝置° 7·如申請專利範圍第6項之圖案修正裝置’其中包括該CCD照相機之觀察用光學系之光學轴係和將該雷射光聚光之光學系之光學軸同軸。 8. —種圖案修正方法，利用雷射光修正在基板所形成之圖案’該圖案修正方法包括：將光東經比圖案修正區域小之該雷射光照射於該圖案修正區域；以及如該光束掃描該圖案修正區域之全區域般控制裝載了基板之工作台移動。 9. 如申請專利範圍第8項之圖案修正方法，其中在該基板上所形成之圖案之膜厚係1 以上。 ^ 1〇. 一種圖案修正裝置，利用觀察用光學裝置觀察在該基板所形成之圖案，識別修正處，在該修正處塗正，該圖案修正裝置包括： > 雷射光射出裝置；影像處理機構，自該觀察用光學裝該雷射光照射區域内之圖案部及膠部之總：2像;I 案之基板部之面積之比；以及 4面積和未形成圈自“比決疋藉著將該雷射光照射件之裝置。 Θ跟附近之烘烤箱 π·如申請專利範圍第10項之圖案修正裝具中該Page 18 436354 Six 'Applicable patent scope Image processing mechanism that processes the image obtained from the CCD camera; a device that determines the scanning area to be corrected based on the image The optical axis of the observation optical system including the CCD camera and the optical axis of the optical system that focuses the laser light are coaxial. 8. A pattern correction method that uses laser light to correct a pattern formed on a substrate. The pattern correction method includes: irradiating the laser light with a light east longitude smaller than the pattern correction region to the pattern correction region; and if the beam scans the pattern The entire area of the pattern correction area controls the movement of the table on which the substrate is mounted. 9. The pattern correction method according to item 8 of the scope of patent application, wherein the film thickness of the pattern formed on the substrate is 1 or more. ^ 10. A pattern correction device, which uses an observation optical device to observe a pattern formed on the substrate, identifies a correction portion, and corrects the correction portion. The pattern correction device includes: > a laser light emitting device; an image processing mechanism The total number of pattern parts and rubber parts in the laser light irradiation area from the observation optical device: 2 images; the ratio of the area of the substrate part of the case I; and 4 areas and the unformed circle. The device for irradiating the laser light. Θ and the nearby baking box π · As stated in the pattern correction fixture of the scope of patent application No. 10

4 3 6 3 5 4 六、申請專利範圍圖案修正裝置具有量測照射雷射光而烘烤中之照射區域之溫度之溫度量測機構和依據該溫度量測結果決定該雷射光之照射條件之裝置。 12.如申請專利範圍第1〇或η項之圖案修正裝置，其中該雷射光射出裝置和雷射光光學系係用以削除在基板上形成之圖案之剩餘部。 13· —種圖案修正方法，利用觀察用光學裝置觀察在該基板所形成之圖案’識別修正處，在該修正處塗膠後，將雷射光照射該膠而烘烤、修正，該圖案修正方法包括自該觀察用光學裝置所得到之影像求該雷射光照射區域内之圖案部及膠部之總面積和未形成圖案之基積之比之步驟； 1 ^ ® 在圖案材料對該雷射光之吸收率比基板材料光之吸收率大之情況，在該比值小之範圍提高該雷夕照射能量，隨著該比值變大，降低該雷射光之照射处二, 1 4 _如申凊專利範圍第丨3項之圖案修正方法，圖案修正方法係包括照射雷射光後量測烘烤中之昭、〜 =之步驟，依據該溫度量測結果增減該雷射4 3 6 3 5 4 6. The patent-patterned pattern correction device has a temperature measuring mechanism for measuring the temperature of the irradiated area during laser light irradiation and baking, and a device for determining the irradiation conditions of the laser light based on the temperature measurement result . 12. The pattern correction device according to item 10 or η of the patent application scope, wherein the laser light emitting device and the laser optical system are used to cut off the remainder of the pattern formed on the substrate. 13. · A pattern correction method, which uses an observation optical device to observe the pattern 'recognition correction position' formed on the substrate, applies glue to the correction position, and irradiates laser light to the glue to bake and correct the pattern correction method. Including the step of obtaining the ratio of the total area of the patterned part and the glued part in the laser light irradiation area to the base product of the unformed pattern from the image obtained by the observation optical device; 1 ^ When the absorptivity is larger than the light absorptivity of the substrate material, increase the ray irradiation energy in the range where the ratio is small. As the ratio becomes larger, reduce the irradiation position of the laser light. The pattern correction method of the third item, the pattern correction method includes the steps of measuring the ~, = in the baking after irradiating the laser light, and increasing or decreasing the laser according to the temperature measurement result