經濟部智慧財產局員工消費合作社印製 ^ Ο 4 ； i ^ A7 〜____---- 31、發明說明（） 發明顇域： 本發明大致關係於基材之化學機械研磨，更明確地 說，關係於用於化學機械研磨之承載頭。 發明眢景‘· 積體電路典型為形成於基材上，特別是矽晶圓上，藉 由依序地沉積導體，半導體或絕緣層加以形成。於每一層 被沉積後，隨後係被蚀刻以創造電路特性。當一連_之屠 被依序沉積並蝕刻後，基材之最外或最上表面，即基材之 外露面變成相當不平坦<此不平坦面對積體電路製程中之 微影步驟產生了問題。因此，有必要以定期地平坦化基材 * 表面。 化學機械研磨（CMP)法為平坦化可以接受之一種方 式。此平坦化方法典型需要一基材被安裝於一承載台或研 磨頭上。基材之外露面係被靠於一旋轉研磨墊上。研磨整 可以是"標準"或一固定研磨墊。一標準研磨墊具有耐磨粗 表面’而固定研磨墊具有被保持於抑制媒體中之所磨粒 子。承載頭提供一可控制負載，即壓力於基材上，以將其 推向研磨墊。一些承載頭包含一彈性薄，其提供用於基材 之安裝面，以及，一扣環以夾持基材於安裝面下。於彈性 膜下之室之壓力化或柚真空控制了基材上之負載。包含至 少一化學反應劑，及若標準墊被使用的話，有研磨粒子之 研漿係被供給至研磨塾之表面。 ⑽製程之效用可以藉由其研磨率，及基材表面所得 本紙張尺度適用中國國家標準<CNS)A4 I-----11----- ----— — 11 訂-------* 線 I (請先閱讀背面之>i意事項再填寫本頁) A7 4 34 1 1 1 i __ B7___ __ 五、發明說明（） 光製（無小規格粗糙度）及平坦度（無大規格拓樸）加以量 測。研磨率’光製，及平坦度係由墊及研漿組合，及於基 材及塾間之相對速度’及將基材壓_向塾之力量加以決定。 於CMP中一再發生之問題是所謂之,，邊緣效應，，，即 基材邊緣傾向於與基材中心不同速率研磨。邊緣效應典型 造成於基材周邊，例如200毫米（mm)晶圓之最外三至十五 毫米處之不均勻研磨。一相關問題係所謂"中心慢速作用 "，即基材之中心傾向於欠研磨。 發明目的及概述： 於一方面中’本發明係有關於用於化學機械研磨設備 之承載頭。該承載頭具有第一可加壓室，該室係至少部份 .被一第一彈性膜所包圍’及一第二加壓室係定位以施加一 向下力量給第一室。第一彈性膜之下表面提供一第一面， 以施加一壓力至具有可控制大小之載入區中之基材，及第 一及第二室係被架構使得於第一室中之第一壓力控制施 加至載入區中基材上之壓力，及於第二室中之第二壓力控 制載入區之大小。 本發明之實施可以包含一或多數個以下特性。一垂直 可動基座可以形成第二可加壓室之上邊界之至少一部 份。一外殼可以連接至一驅動袖及一第三室可以安置於外 殼及基座之間。一扣環可以連接至基座，以維持基材於承 載頭之下=於第一及第二室間之邊界可以藉由一硬構件或 彈性構件加以形成，及第二室可以形成大致環形容積或大 第3頁 本纸張尺度適用中國g家標準（CNS)A4規格（210 x 297公釐） (請先閱讀背面之注意事項再填寫本頁) — — —— — — I— ·11111111 經濟部智慧財產局員工消費合作社印製 3 4 A7 B7 五、發明說明（) 致立體容積°第—彈性膜之下表面提供基材之安裝面，或 第二彈性膜可以延伸於第一彈性膜之下，以提供用於基材 之安裝面°於第—彈性膜及第二彈性膜間之體積可以定義 一第三可加塵室。第一彈性膜可以移動以接觸載入區中之 第二彈性膜之上表面，以施加壓力至基材上。第一彈性模 之下表面可以被組織，以於第一及第二彈性膜接觸時，提 供流體流動於其間。 第一支撐結構可以定位於第一室内，及第一彈性膜可 以延伸於第一支撐結構之外表面旁。一第一間隔環可以定 位於第一室外’第—彈性膜可以延伸於第一結構及第一間 隔環間之蛇形路徑中，並於第一間隔環之内表面旁，並向 外繞於第一間隔環之上表面。第二支撐結構可以定位於第 一及第二彈性膜間之第三室中，並定位以包圍第一支撐結 構。第二間隔環可以定位於第三室外於第二支撐環上，及 第二彈性膜可以延伸於第二支撐結構及第二間隔環間之 蛇形路徑中，於第二間隔環之内表面旁，並向外繞於第二 間隔環之上表面。 於另一方面，本發明係有關於一用於化學機械研磨之 承載頭，包含一基座，一第一彈性膜部，及第二彈性膜部。 第—彈性膜部延伸於基座下，並定義一第一加壓室，及第 —彈性膜之下表面提供一安裝面，以施加壓力給於具有可 控制大小之載入區中之基材。該第二彈性膜部連接第一彈 性膜部至基座並定義一第二加壓室，使得於第一加壓室中 之第一壓力控制施加至載入區中之基材的壓力’及於第二 第4頁 本紙張尺度適用中國國家標單（CNS)A4規格（210 χ 297公餐） I--1 K---l· I--- 裝-------訂.--------線 t (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員Η消費合作钍印製 434 7 1 1 A7 B7 經濟部智慧財產局員工消費合作杜印製 五、發明說明（ 室中之第—壓力控制載入區之大小。 於另一方面中，本發明係有關於用於化學機械研磨之 承載頭，其具有一基座，一第一彈性膜部，一第二彈性膜 部，及第二彈性膜部。第一彈性膜部延伸於基座下，並定 義一第一加壓室’及第一彈性膜之下表面提供一用於一基 材之去裝面。該弟一彈性膜部延伸於基座下並定義一第二 加壓至，及第二彈性膜之下表面接觸於具有可控制大小之 載入區中之第一彈性膜之上表面。第三彈性膜部連接該第 —彈性膜部至基座並定義一第三加壓室，使得於第二加壓 至中之第一壓力控制施加至載入區中之基材的壓力，及於 第三室中之第二壓力控制載入區之大小。 於另一方面中’本發明關係於化學機械研磨法之承載 頭，其包含一第一偏壓構件及一第二偏壓構件。該第一偏 壓構件包含一第一壓力室’及第一壓力室之下面係被一彈 性膜所包圍，該彈性膜提供第一面，以施加一負載至具有 可控制大小之載入區中之基材。諒第二偏壓構件係連接至 第一偏壓構件’及第二偏壓構件控制第一偏壓構件之垂直 位置’使得第二偏壓構件控制載入區之大小，及第一偏壓 構件控制施加至載入區中之基材之壓力。 於另一方面’本發明係關係於化學機械斫磨法之承載 頭’具有一彈性膜，其提供用於一基材之安装面，控制機 構’用以控制載入區域之大小’於該載入區中負載係被施 加至基材上’及控制機構，用以控制施加至載入區中之基 材之壓力。 第5頁 本紙張尺度適財國國家標翠（CNS)A4規格⑵G χ 297公爱） ---I l·---Γ I ! - 1 I I I I--^----I I.--t (請先Μ讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ Ο 4; i ^ A7 ~ ____---- 31. Description of the invention () Field of invention: The present invention is roughly related to the chemical mechanical polishing of the substrate, more specifically, Relating to carrier heads for chemical mechanical polishing.眢 景 ‘Integral circuits are typically formed on a substrate, especially on a silicon wafer, and are formed by sequentially depositing a conductor, semiconductor, or insulating layer. After each layer is deposited, it is subsequently etched to create circuit characteristics. When a series of __Tu_ are sequentially deposited and etched, the outermost or uppermost surface of the substrate, that is, the exposed surface outside the substrate becomes quite uneven < this uneven surface is generated by the lithography step in the integrated circuit manufacturing process problem. Therefore, it is necessary to regularly planarize the substrate * surface. Chemical mechanical polishing (CMP) is an acceptable method for planarization. This planarization method typically requires a substrate to be mounted on a carrier or grinding head. The exposed surface of the substrate is leaned against a rotating polishing pad. Grinding can be "standard" or a fixed abrasive pad. A standard abrasive pad has a rough abrasive surface ' and a fixed abrasive pad has abrasive particles held in a suppression medium. The carrier head provides a controlled load, i.e. pressure on the substrate to push it towards the polishing pad. Some carrier heads include an elastic sheet that provides a mounting surface for a substrate, and a buckle to hold the substrate under the mounting surface. The pressure in the chamber under the elastic membrane or the grapefruit vacuum controls the load on the substrate. A mortar containing abrasive particles is supplied to the surface of the abrasive pad if it contains at least one chemical reagent and if a standard pad is used.效 The effectiveness of the manufacturing process can be based on its grinding rate and the surface of the substrate. This paper size is applicable to the Chinese national standard < CNS) A4 I ----- 11 ------------- 11 Order- ----- * Line I (Please read the > i notice on the back before filling in this page) A7 4 34 1 1 1 i __ B7___ __ V. Description of the invention () Light system (no small size roughness) and Measure flatness (no large-scale topology). The polishing rate 'light system' and flatness are determined by the combination of pad and slurry, and the relative speed between the substrate and the substrate, and the force of pressing the substrate toward the substrate. The problem that repeatedly occurs in CMP is the so-called, edge effect, that is, the edge of the substrate tends to grind at a different rate from the center of the substrate. Edge effects are typically caused by uneven grinding around the substrate, such as at the outermost three to fifteen millimeters of a 200 millimeter (mm) wafer. A related problem is the so-called "center slow action", that is, the center of the substrate tends to be under-abrasive. OBJECTS AND SUMMARY OF THE INVENTION: In one aspect, the present invention relates to a carrier head for a chemical mechanical polishing apparatus. The carrier head has a first pressurizable chamber, which is at least partially surrounded by a first elastic membrane 'and a second pressurizing chamber is positioned to apply a downward force to the first chamber. A lower surface of the first elastic film provides a first surface to apply a pressure to a substrate in a load area having a controllable size, and the first and second chambers are structured such that the first in the first chamber The pressure controls the pressure applied to the substrate in the loading zone, and the second pressure in the second chamber controls the size of the loading zone. Implementations of the invention may include one or more of the following features. A vertical movable base may form at least part of the upper boundary of the second pressurizable chamber. A casing may be connected to a driving sleeve and a third chamber may be disposed between the casing and the base. A buckle can be connected to the base to keep the substrate under the carrier head = the boundary between the first and second chambers can be formed by a hard or elastic member, and the second chamber can form a generally annular volume Or page 3 This paper is in Chinese standard (CNS) A4 size (210 x 297 mm) (Please read the precautions on the back before filling this page) — — — — — — I— · 11111111 Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives 3 4 A7 B7 V. Description of the invention () The three-dimensional volume ° The first surface of the elastic film provides a mounting surface for the substrate, or the second elastic film can extend on the first elastic film In order to provide a mounting surface for the substrate, the volume between the first elastic film and the second elastic film can define a third dustable chamber. The first elastic film can be moved to contact the upper surface of the second elastic film in the loading area to apply pressure to the substrate. The lower surface of the first elastic mold can be organized to provide fluid flow between the first and second elastic membranes when they contact. The first support structure may be positioned in the first chamber, and the first elastic film may extend beside the outer surface of the first support structure. A first spacer ring can be positioned in the first outdoor'-first-the elastic membrane can extend in the serpentine path between the first structure and the first spacer ring, beside the inner surface of the first spacer ring, and wound outward. Upper surface of the first spacer ring. The second support structure may be positioned in a third chamber between the first and second elastic membranes and positioned to surround the first support structure. The second spacer ring can be positioned outside the third support ring outside the third space, and the second elastic membrane can extend in the serpentine path between the second support structure and the second spacer ring, next to the inner surface of the second spacer ring. , And wound outward on the upper surface of the second spacer ring. In another aspect, the present invention relates to a carrier head for chemical mechanical polishing, including a base, a first elastic film portion, and a second elastic film portion. The first-elastic film portion extends below the base and defines a first pressurizing chamber, and the lower surface of the first-elastic film provides a mounting surface to apply pressure to the substrate in a loading area having a controllable size . The second elastic membrane portion connects the first elastic membrane portion to the base and defines a second compression chamber, so that the first pressure in the first compression chamber controls the pressure applied to the substrate in the loading zone 'and On page 2 of this page, the paper size applies to China National Standards (CNS) A4 specifications (210 χ 297 meals) I--1 K --- l · I --- Packing ----- order. -------- line t (Please read the notes on the back before filling this page) Member of the Intellectual Property Bureau of the Ministry of Economic Affairs ΗConsumption Cooperation 钍 Printing 434 7 1 1 A7 B7 Consumption Cooperation of Employees of the Intellectual Property Bureau of Ministry of Economic Affairs 5. Description of the invention (the first in the chamber—the size of the pressure control loading zone. In another aspect, the present invention relates to a carrier head for chemical mechanical polishing, which has a base and a first elastic membrane A second elastic film portion, and a second elastic film portion. The first elastic film portion extends below the base and defines a first compression chamber and a lower surface of the first elastic film to provide a base The mounting surface of the material. The first elastic film portion extends below the base and defines a second pressure to, and the lower surface of the second elastic film contacts the controllable surface. The upper surface of the first elastic membrane in the loading area of a large size. The third elastic membrane portion connects the first elastic membrane portion to the base and defines a third compression chamber, so that the first compression membrane is pressurized at the second. The pressure controls the pressure applied to the substrate in the loading zone, and the second pressure in the third chamber controls the size of the loading zone. In another aspect, the invention relates to a bearing head of a chemical mechanical polishing method, which The first biasing member includes a first biasing member and a second biasing member. The first biasing member includes a first pressure chamber and a lower surface of the first pressure chamber is surrounded by an elastic film, and the elastic film provides a first surface. To apply a load to a substrate in a load area having a controllable size. The second biasing member is connected to the first biasing member 'and the second biasing member controls the vertical position of the first biasing member' The second biasing member controls the size of the loading area, and the first biasing member controls the pressure applied to the substrate in the loading area. In another aspect, the present invention relates to a bearing head of a chemical mechanical honing method. 'Has an elastic film that provides For surface mounting, the control mechanism is used to 'control the size of the loading area' in which the load is applied to the substrate 'and the control mechanism is used to control the pressure applied to the substrate in the loading area. 5 pages This paper is suitable for the national standard Cui (CNS) A4 size of the rich country ⑵ G χ 297 public love) --- I l · --- Γ I!-1 III I-^ ---- I I .-- t (Please read the notes on the back before filling in this page)
經濟部智慧財產局員工消费合作社印製 五、發明說明（ 於另~方面中，本發明關係於〆種化學機械研磨基 材之方法。於該方法中，基材係被’承載頭所靠於研磨 替，-負載係以承載頭中之第4被施加至載^中之基 /七少第二宫加以控制’及 材上，載入區之大小係以承載頭中 於基材及研磨墊間被創造有相對運動° .s . ^ B日找贫關於化學機械研磨系統 於另一万面中，本發明係爷1 中，檢測於承載頭中之基材的方法。於該方法+ $載頭 中之室係連接至壓力源。該室中之歷力係被量则為時間之 函數，及室中之壓力之導數係被计算。是否基材係鄰近於 承載頭中之基材接收面係由該導數決定° 本發明之實施可以包含以下特性。若導數超出一臨界 值，則表示基材出現，若導數未超出一臨界值，則表不基 材未出現。 本發明之優點可以包含如下。靠於基材之彈性膜之載 入區及壓力均可以加以變化’以補償不均勻研磨。基材之 不均勻研磨可以降低，及所得基材之平坦度及光製可以改 良。 本發明之其他優點及特性將由以下包含附圖及申請 專利範園之說明而變得更明顯。 圖式簡單說明： 第1圖為一化學機械研磨設備之分解立體圖° 第2圖為依據本發明之承載頭之剖面圖。 第3圖為由第2圖之承載頭來之基材襯墊组件之放大圖》 第6頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） <請先閱讀背面之注意事項再填寫本頁) - ------ 訂----I I --- ”4lit蠼 4 3 4 Π 1 ___Β7 五、發明說明（） 第4A及4B圖為剖面圖’例示於假想彈性膜上之恩力及力 量分配。 第5A及5B圖為剖面圖’例示由第2圖之承載頭靠於基材 之内部彈性膜之可變載入區。 第6圖為一圖表，例示接觸區之直徑與上浮動室之壓力間 之關係。 第7A及7B圖為一圖表，例示於下浮動室中之壓力之導數 (d P / d t)及壓力作為於基材檢測程序時之時間的函 數。 第8圖為具有内支撐板之承載頭之剖面圖。 第9圖為具有一脣部之彈性膜之承載頭之剖面圖。 第1 0圖為具有一彈性膜之承載頚之刦面圖，該彈性膜係 直接接觸於可變載入區中之基材。 第11圏為具有感應基材出現用之閥之承載頭之剖面圖。 於各圖中，相同參數號瑪係指定相同元件。具有字母 字尾之參考號碼表示一元件具有修改功能，操作或結構。 圖號對照說明： I I I I --l· I--· I I *1 I — I 1 訂.---I I I I I 線 -"·請先聞讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印制Λ 10 基材 20 CMP設備 25 研磨站 27 傳送站 30 旋轉平台 32 研磨墊 40 墊調整設備 50 研漿 52 研漿/清洗臂 60 可旋轉多頭轉盤 62 中心柱 64 多頭轉盤轴 第7頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公爱） 4 3 4 111 A7 B7 五、發明說明（） 經濟部智慧財產局員工消費合作社印製 66 轉盤支撐板 68 蓋部 70 承載頭 72 徑向槽 74 承載頭驅動軸 76 旋轉馬達 100 承載頭 1 02 外殼 104 基座組件 106 自由接頭機 108 負載室 110 扣環 1 12 基材襯墊组件 1 16 彈性内膜 1 18 彈性外膜 120 内支撐結構 122 内間隔環 124 底面 126 内表面 128 螺栓 130 垂直孔 132 通道 134 通道 140 環形體 144 下夹環 146 通道 148 固定件 152 彈性環 150 自由接頭桿 152 彈性環 154 路徑 160 環形滾動膜 162 内爽 164 外夹環 170 環形部 172 環形突出物 1 74 外表面 176 上表面 180 外表面 184 圓柱部 186 凸緣部 190 圓柱部 192 環形上緣 1 94 環形下緣 200 中心部 202 L形部 204 内轉板 206 外轉板 第8頁 -----I--^ ---* I I I I--I 訂 -- ---11 — -線 (諳先閱讀背面之泫意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)Α4規格（210 X 297公1 ) 4 3 4ι 1 ]卞 A7 B7 五、發明說明（） 208 圓 周 部 210 中 心 部 212 圓 周 部 214 邊緣 部 218 厚 部 230 外 支 撐 結 構 232 外 間 隔 環 234 浮 動 下 室 235 上 室 236 浮 動 上 室 238 可 加 壓 外室 250 環 形 鲁 部 260 中 心 部 262 圓 周 部 264 圓 柱 緣 266 内 轉 板 268 夾 環 270 上 表 面 272 外 轉 板 274 底 面 276 突 出 物 278 凹 槽 280 通 道 282 通 道 284 固 定 件 300 研 磨 器 302 彈 性 膜 304 硬 板 306 可 加 壓 室 308 圓 形 接 觸 區域 3 10 凹 部 3 12 頂 面 3 14 通 道 ---1 l· I--r--— 裝-- -----—訂---I -----線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 發明詳細說明： 參考第I圖，一或多數基材10係被一化學機械研磨 (CMP)設備20加以研磨。一類似CMP設備之說明可以於 美國專利第5,738,574號案中找到，該案之揭示係併入作 為參考β CMP設備20包含一連串之研磨站25及一傳送站27， 第9頁 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） 434 A7 B7 五、發明說明（） 用以加載及卸載諸基材。每一研磨站25包含一可旋轉平 台30,其上放置有一研磨墊32。若基材1〇為六吋（15〇毫 米）’或八吋（200毫米）直徑碟片，則平台3〇及研磨墊32 可以直fe為約20吋。若基材I 〇為十二吋（3〇〇毫米）直徑 碟片，則平台30及研磨墊32直徑可以是約3〇吋。對於 多數研磨處理，一平台驅動馬達（未示出）旋轉平台3〇，以 每分三十至二百轉之速度，但較低或較高轉速也可以使 用°每一研磨站25可以更包含一相關墊調整設備40，以 維持研磨墊之磨擦狀況》 一含反應劑（例如用於氧化物研磨之去離子水）及化學 反應催化劑（例如用於氧化物研磨之氫氧化卸）之研漿5 0 可以藉由一組合研漿/清洗臂52被施加至研磨墊32之表 面。若研磨墊3 2係為一標準墊，則研漿5 0可以同時包含 研磨粒子（例如用於氧化物研磨之二氧化矽）》典型地，足 夠研漿係被提供以覆蓋及濕潤整個研磨墊3 2 »研漿/清洗 臂52包含幾個噴嘴（未示出），其於每一研磨及調整週期之 結束時，提供研磨墊3 2之高壓清洗。 一可旋轉多頭轉盤6 0係由一中心柱6 2所支撐並被一 轉盤馬達組件（未示出）所旋轉於其上沿一轉盤軸64。多頭 轉盤60包含四個承載頭系統70,以對棧盤軸64呈等角距 方式安裝於一轉盤支撐板66上。承載頭系統之三個定位 基材於研磨站上，承載頭系統之一自傳送站接收一基材， 並將該基材傳送至該傳送站=轉盤馬達可以軌道繞行該承 載頭系統’將附著於其上之基材沿著於研磨站及傳送站間 第10頁 本紙張尺度適用令國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) --- ----—訂 *--- ----•線 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 之轉盤軸繞行。 每一承載頭系統7 0包含一研磨或承載頭1 〇 〇。每一承 載頭1 0 0個別地沿著其軸旋轉，及個別地橫向振動於形成 於轉盤支撐平台66中之徑向槽72中。一承載驅動軸74 延伸穿過槽72，以連接承載頭馬達76(由轉盤蓋68之四 分之一去除所示出）至承載頭100<>對於每一頭有一堪動軸 及馬達。每一馬達及驅動軸可以被支撐於—滑動件（未示 出上）’其可以被一徑向驅動馬達沿著槽作線性驅動，以 橫向振動承載頭。 於實際研磨時，三個承載頭係定位於三個研磨站上。 每一承載頭100將一基材降低與研磨墊；32接觸a承載頭 支撐基材與靠向研磨墊並將一力量分配於基材之背面。承 載頭係同時由驅動軸轉送力矩给基材。 參考第2圖，承載頭100包含一外殼102，一基座組 件1 0 4，一自由接頭機制1 0 6 (其可以認為是基座組件之一 部份），一負載室108, 一扣環110,及一基材襯墊組件112’ 其包含三個可加壓室，例如浮動上室236，一浮動上室234 及一外室238。一類似承載頭之說明可見於1 997年五月 21曰由路尼加等人所申請之名為"用於化學機械研磨系統 之具彈性膜之承載頭"之美國專利申請第08/861，260號 中’該案之揭示係併入作為參考。 外殼1 02可以連接至驅動軸74，以於沿著垂直於研磨 墊表面之旋轉軸107研磨時，隨著旋轉。外殼可以大 致呈圓形，以相對於予以研磨之基材之圓形架構。一垂直Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (In another aspect, the present invention relates to a method of chemical mechanical polishing of a substrate. In this method, the substrate is supported by a 'bearing head' Grinding replacement,-the load is controlled by the 4th of the carrier head to the base of the carrier / the second house of the seven minors, and the size of the loading area is based on the substrate and the polishing pad in the carrier head Relative motion was created between ° .s. ^ B. Finding poverty. About the chemical mechanical polishing system in another ten thousand faces, the present invention is the method of the substrate 1 in the carrier head. In this method + $ The chamber in the carrier is connected to a pressure source. The historical force in the chamber is a function of time and the derivative of the pressure in the chamber is calculated. Whether the substrate is received adjacent to the substrate in the carrier The surface is determined by the derivative. The implementation of the present invention can include the following characteristics. If the derivative exceeds a critical value, it means that the substrate appears, and if the derivative does not exceed a critical value, it means that the substrate does not appear. The advantages of the present invention can be Including the following. Both the entry area and pressure can be changed to compensate for uneven grinding. The uneven grinding of the substrate can be reduced, and the flatness and light quality of the obtained substrate can be improved. Other advantages and characteristics of the present invention will include the following drawings and The explanation of the patent application fan garden becomes more obvious. The diagram is briefly explained: Figure 1 is an exploded perspective view of a chemical mechanical grinding equipment ° Figure 2 is a sectional view of a bearing head according to the present invention. Figure 3 is Enlarged view of the substrate pad assembly from the carrier head shown in Figure 2 "page 6 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) < Please read the precautions on the back before filling in this (Page)------- Order ---- II --- "4lit 蠼 4 3 4 Π 1 ___ Β7 V. Description of the invention () Figures 4A and 4B are sectional views' exemplary grace on an imaginary elastic membrane Forces and force distribution. Figures 5A and 5B are cross-sectional views' illustrating the variable loading area of the internal elastic membrane against the substrate by the carrier head of Figure 2. Figure 6 is a chart illustrating the diameter and The relationship between the pressure in the upper floating chamber. Figures 7A and 7B are a chart, Derivatives of pressure (d P / dt) and pressure exemplified in the lower floating chamber as a function of time during the substrate inspection procedure. Figure 8 is a cross-sectional view of a load head with an internal support plate. Figure 9 is a A cross-sectional view of a bearing head of an elastic film of a lip. Fig. 10 is a cross-sectional view of a bearing plate having an elastic film, which is in direct contact with a substrate in a variable loading area. A sectional view of a bearing head with a valve for sensing the appearance of a substrate. In each figure, the same parameter number designates the same component. A reference number with a letter suffix indicates that a component has a modification function, operation or structure. Drawing No. Comparative description: IIII --l · I-- · II * 1 I — I 1 order. --- IIIII line- " Please read the precautions on the back before filling this page) Consumption by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the cooperative Λ 10 Base material 20 CMP equipment 25 Grinding station 27 Conveying station 30 Rotating platform 32 Grinding pad 40 Pad adjustment equipment 50 Grinding slurry 52 Grinding / washing arm 60 Rotatable multi-turntable 62 Center post 64 Multi-turntable shaft page 7 This paper size applies to Chinese national standards Standard (CNS) A4 (210 x 297 public love) 4 3 4 111 A7 B7 V. Description of the invention () Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economy 66 Turntable support plate 68 Cover 70 Bearing head 72 Radial groove 74 Bearing head drive shaft 76 Rotary motor 100 Bearing head 1 02 Housing 104 Base assembly 106 Free joint machine 108 Load chamber 110 Buckle ring 1 12 Substrate pad assembly 1 16 Elastic inner membrane 1 18 Elastic outer membrane 120 Inner support structure 122 Inner Spacer ring 124 bottom surface 126 inner surface 128 bolt 130 vertical hole 132 channel 134 channel 140 ring body 144 lower clamp ring 146 channel 148 fastener 152 elastic ring 150 free joint rod 152 elastic ring 154 path 160 ring rolling film 162 inner cool 164 outer clamp Ring 170 Ring portion 172 Ring protrusion 1 74 Outer surface 176 Upper surface 180 Outer surface 184 Cylindrical portion 186 Flange portion 190 Cylindrical portion 192 Ring upper edge 1 94 Ring lower edge 200 Center portion 202 L-shaped portion 204 Inner plate 206 Outer Page 8 --------- I-^ --- * III I--I order---- 11--line (read the intention on the back before filling this page) Be applicable National Standard (CNS) A4 Specification (210 X 297 male 1) 4 3 4 ι 1] 卞 A7 B7 V. Description of the invention (208) Circumferential portion 210 Central portion 212 Circular portion 214 Edge portion 218 Thick portion 230 Outer support structure 232 Outer Spacer ring 234 Floating lower chamber 235 Upper chamber 236 Floating upper chamber 238 Pressurized outer chamber 250 Circular lug 260 Central portion 262 Circumferential portion 264 Cylindrical edge 266 Inner rotation plate 268 Clip ring 270 Upper surface 272 Outer rotation plate 274 Bottom surface 276 protruding Object 278 Groove 280 Channel 282 Channel 284 Fixture 300 Grinder 302 Elastic membrane 304 Hard plate 306 Pressurizable chamber 308 Circular contact area 3 10 Recess 3 12 Top surface 3 14 Channel --- 1 l · I--r --- Install --------- Order --- I ----- line (Please read the precautions on the back before filling out this page) The detailed description of the invention printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs: Referring to Figure I, one or more substrates 10 are ground by a chemical mechanical polishing (CMP) apparatus 20. A description of a similar CMP device can be found in US Patent No. 5,738,574, the disclosure of which is incorporated as a reference β CMP device 20 includes a series of grinding stations 25 and a transfer station 27, page 9 This paper is applicable to China National Standard (CNS) A4 specification (210x297 mm) 434 A7 B7 V. Description of the invention () Used to load and unload substrates. Each polishing station 25 includes a rotatable platform 30 on which a polishing pad 32 is placed. If the substrate 10 is a six-inch (150 mm) 'or eight-inch (200 mm) diameter disc, the platform 30 and the polishing pad 32 can be approximately 20 inches. If the substrate 100 is a twelve inch (300 mm) diameter disc, the diameter of the platform 30 and the polishing pad 32 may be about 30 inches. For most grinding processes, a platform driving motor (not shown) rotates the platform 30 at a speed of 30 to 200 revolutions per minute, but lower or higher speeds can also be used. Each grinding station 25 can include more A related pad adjustment device 40 to maintain the friction of the polishing pad. A slurry containing a reagent (for example, deionized water for oxide grinding) and a chemical reaction catalyst (for example, hydroxide removal for oxide grinding). 50 can be applied to the surface of the polishing pad 32 by a combined slurry / washing arm 52. If the polishing pad 32 is a standard pad, the slurry 50 can also contain abrasive particles (such as silicon dioxide for oxide polishing). Typically, a sufficient slurry system is provided to cover and wet the entire polishing pad. 3 2 »The slurry / cleaning arm 52 includes several nozzles (not shown) that provide high pressure cleaning of the polishing pad 32 at the end of each grinding and adjustment cycle. A rotatable multi-head turntable 60 is supported by a center post 62 and rotated by a turntable motor assembly (not shown) along a turntable axis 64. The multi-head turntable 60 includes four carrier head systems 70, which are mounted on a turntable support plate 66 at an equal angular distance from the stacker shaft 64. The three positioning substrates of the carrier head system are on the grinding station. One of the carrier head systems receives a substrate from the transfer station and transfers the substrate to the transfer station = the turntable motor can orbit the carrier head system. The substrate attached to it is between the grinding station and the transfer station. Page 10 This paper applies the national standard (CNS) A4 specification (210 X 297). (Please read the precautions on the back before filling in this Page) --- ------ Order * --- ---- • Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () The rotary table shaft is detoured. Each carrier head system 70 includes a grinding or carrier head 100. Each of the load heads 100 individually rotates along its axis, and individually vibrates laterally in a radial groove 72 formed in the turntable support platform 66. A load-bearing drive shaft 74 extends through the slot 72 to connect the load-head motor 76 (shown removed by a quarter of the turntable cover 68) to the load-bearing head 100 < > a movable shaft and a motor for each head. Each motor and drive shaft may be supported on a slider (not shown) 'which may be linearly driven along a slot by a radial drive motor to vibrate the load head laterally. During actual grinding, the three carrier heads are positioned on three grinding stations. Each carrier head 100 lowers a substrate and a polishing pad; 32 contacts a. The carrier head supports the substrate and leans against the polishing pad and distributes a force on the back surface of the substrate. The load head transmits torque to the substrate from the drive shaft at the same time. Referring to FIG. 2, the carrier head 100 includes a housing 102, a base assembly 104, a free joint mechanism 106 (which can be considered as a part of the base assembly), a load chamber 108, and a retaining ring 110, and a substrate cushion assembly 112 'which includes three pressurizable chambers, such as a floating upper chamber 236, a floating upper chamber 234, and an outer chamber 238. A description of a similar bearing head can be found in U.S. Patent Application No. 08 /, entitled "Loading Head with Elastic Film for Chemical Mechanical Grinding System", applied by Luniga et al. On May 21, 1997. The disclosure of the case in No. 861, 260 is incorporated by reference. The housing 102 may be connected to the drive shaft 74 so as to rotate while grinding along the rotation axis 107 perpendicular to the surface of the polishing pad. The housing can be substantially circular, relative to the circular structure of the substrate being ground. A vertical
第11X 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公蔆） (請先閱讀背面之注意事項再填寫本頁) ·!1 — ！1 訂·--- 11 — 丨'線 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 4341111 A7 —_________B7__ 五、發明說明（） 孔130可以穿過形成於外殼令，另三個通道（只有通道 132，134係示於第2圖中）可以延伸穿過外殼，用以作為 承載頭之氣動控制。〇形環138可以用以於貫穿外殼之通 道及穿過驅動軸之通道間形成流體密封。 基座组件104為一位於外殼1〇2下之垂直可動組件。 基座組件1 04包含一大致硬環形體丨4()，一外夾環164 , 自由接頭106，及一下夾環144。一路徑146彳以延伸穿 過自由接頭機制之主體*環形體及夾環，及兩個固定件148 可以提供附著點，以連接一彈性管於外殼〖〇2及基座組件 1 04之間，以流體連接路徑1 34至基材襯墊組件π 3中之 室中，例如室238中。一第二路徑（未示出）可以延伸穿過 環形體1 4 0，及兩個固定件（未示出）可以提供附著點，以 .連接彈性管於外殼丨〇 2及基座組件1 〇 4之間，以流體連接 於外威中之未例示路徑至基材襯塾組件112中之第二室， 例如室2 3 6。 自由接頭機制1 06允許基座組件，以相對於外殼i 〇2 作樞動’使得扣環可以大致與研磨墊表面保持平行。自由 接頭機制106包含自由接頭桿150’其***垂直孔ι3〇中， 及一固定環152’其固定至環形體140中。自由接頭样15〇 可以沿著孔1 3 0垂直滑動’以提供基座組件丨〇 4之垂直動 作’但其防止基座組件1 〇 4相對於外殼1 〇 2之橫向移動， 並降低由基材靠向扣環之橫向面所產生之動量。自由接頭 1 50可以包含_路徑丨54，其延伸自由接頭之長度’以流 體連接孔130至基材襯整組件Π2中之第三室，例4室 第12頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） * » Μ----------------- (講先S3讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 4 3 4 】11 434 Μ 1» 1 Α7 Β7 五、發明說明（） 23 4 ° 負載室108係位於外殼102及基座組件104之間，施 加一負載，即向下壓力或重量至基座组件104。相對於研 磨墊32之基座組件1 之垂直位置同時也被負載室1 〇8 所控制一大致環形滾動膜160之内緣可以被夾至外殼 1 02，藉由内夾環1 62。滾動膜I 60之外緣可以被外夾環 1 64所夾至基座組件104。因此*滾動膜160密封了於外 殼I 02及基座組件1 04間之空間，以定義負載室ί 08。一 第一泵（未示出）可以藉由路徑1 3 2以流體連接至負載室 108，而控制於負載室中之壓力及基座組件104之垂直位 置。 扣環1 10可以是大致呈環形例如藉由鉚釘1 2 8被固定 .於基座組件1 04之外緣。當流體被抽入負載室1 08及基座 組件1 0 4被向下推時，扣環1 1 0同時被向下推，以施加一 負載室研磨墊32»扣環110之底面124可以大致呈平坦， 或其可以具有多數通道，以便利研漿由扣環外傳送至基 材。扣環110之内表面126嚙合基材，以防止其由承載頭 下脫離。 參考第2及3圖，基材襯墊組件112包含一彈性内膜 116’ 一彈性外暎ι18, 一内支撐結構120，一外支撐結構 230，一内間隔環122及一外間隔環232。支撐結構120 及230及間隔環112及232可以自由浮動”，即未被固定 至承載頭之其他部份，並可以被内及外彈性膜所保持於定 位0 第13頁 本紙張尺度適財開家標準（CN_^規格（21Q x 297 ^ ----“---J---- . ----— i t 訂，--------建 (請先閱續背面之注意事項再填寫本頁) Α7 Β7 «34 1 11« 五、發明說明（） 彈性内膜116包含一中心部200 ’其施加基材至一可 控制區，一具有"L形”剖面之相當厚環形部202，一環形 内轉板204,其由L形部角落延伸’一環形外轉板206, 其由L形部202之外緣延伸’及一圓周部208，其延伸於 内支擇結構120旁’以連接L形部202及中心部200。内 轉板204之邊緣係被夾於固定環152及環形體140之間’ 而外轉板206之邊緣係夾於外夹環1 64及下夾環1 44之 間。由轉板204所密封之於基座組件1〇4及内膜116間之 體積提供了一可加壓浮動下室234。由内轉板2〇4及外轉 板206所密封之於基座组件1 及内膜1 1 6間之環形體積 定義了一可加壓浮動上室236。—第二泵（未示出）可以連 接至未示出之路徑，以導引流體，例如空氣之氣體進出浮 動上室236。一第三泵（未示出）可以連接至孔130，以導引 例如空氣之氣體的流體進出浮動下室2 3 4 »第二泵控制於 上室中之壓力，及下室之垂直位置，及第三泵控制於下室 之壓力。如於以下所詳述，於浮動上室236中之整力將棱 制内膜116之接觸區域向外膜118之頂面。因此，第二策 控制施加壓力之基材的面積，即載入區之面積，而第 控制於載入區中之基材上之向下力。 外膜1 1 1 8包含延伸於外支撐結構230下之中心部份 210’以提供一安裝面以嚙合基材’及一呈蛇形路徑延伸 於外支撐結構230及予以固定至基座組件之外間隔環 問之圓周部2 12。例如，外膜之邊緣可以被夹持於下+ · 144及扣環110之間。於内膜丨16及外膜丨1〇間之密封體 第14頁 本紙張尺度適用令國國家標準(CNS)A4^T^1〇'兩公釐) -----l· I I I- I --- ------ I I 訂- It — !- I <請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 434111 A7 B7 五、發明說明（） 積定義了可壓縮外室238 ^因此，外室238可以實際延伸 於下室234之下。—第四泵（未示出）可以被連接至通道 134 ,以導引，例如氣體，如空氣之流體進出外室238。第 四泵控制於外室238中之墼力。 内支撐結樣12〇可以是大致一硬墊圈形體，位於浮動 下室234之内’以維持内膜116之想要形狀。或者，内支 撐結構可以是一碟形體’具有多數孔徑貫穿於其間。碟形 支撐結構將提供一襯墊面，以防止基材由於彎曲而被破 壞。 内間隔環1 2 2係大致為一硬環形體，其具有一 c型剖 面。内間隔環可以包含一圓柱部190, ~環形上凸緣192, 及一環形下凸緣1 94。内間隔環丨22可以位於内支撑結構 .120上之外室238中。環形下凸緣194可以被支撐結構所 支撐’而環形下凸緣1 9 2可以延伸於外支撐結構2 3 〇及外 間隔環2 3 2上。 内膜Η 6係由可彎及彈性材料，例如彈性體，彈性體 塗層纖維或熱塑彈性體（ΤΡΕ)，例如由美國達拉瓦州，紐 瓦克之杜邦公司購得之"HYTREL"或這些材料之組合所作 成。較佳地，内膜1 16係較外膜π 8為少之彈性。如上所 討論’内膜1 1 6之中心部200之可控制區可以接觸外膜u 8 之上表面並對之施加一向下負載。該負載係經由外膜傳送 至載入區中之基材上。内膜116之中心部200之底面可以 例如被作成具有小凹槽，以確保接觸時，流體可以流於内 及外膜之間。内膜之圓周部208向下延伸於内支撐結構 第15頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先w讀背面之注意事項再填冩本頁)11X This paper size applies to China National Standard (CNS) A4 specification (210 X 297 male diamond) (Please read the precautions on the back before filling this page) ·! 1 —! 1 Order · --- 11 — 丨 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer ’s Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4341111 A7 —_________ B7__ 5. Description of the invention The other three channels (only channels 132 and 134 are shown in Figure 2) can be extended through the housing for pneumatic control of the load head. The o-ring 138 may be used to form a fluid seal between a passage through the housing and a passage through the drive shaft. The base assembly 104 is a vertically movable assembly located under the housing 102. The base assembly 104 includes a substantially rigid ring body 4 (), an outer clamp ring 164, a free joint 106, and a lower clamp ring 144. A path 146 彳 extends through the main body * ring body and clamp ring of the free joint mechanism, and two fixing members 148 can provide attachment points to connect an elastic tube between the housing 〖〇2 and the base assembly 104. A fluid connection path 134 to a chamber in the substrate gasket assembly π 3, such as chamber 238. A second path (not shown) can extend through the ring body 140, and two fixing members (not shown) can provide attachment points to connect the elastic tube to the housing 丨 02 and the base assembly 1 〇 4, the unillustrated path fluidly connected to Waiwei to the second chamber in the substrate liner assembly 112, such as chamber 2 3 6. The free joint mechanism 106 allows the base assembly to pivot ' relative to the housing 〇2 so that the buckle can remain approximately parallel to the surface of the polishing pad. The free joint mechanism 106 includes a free joint rod 150 'which is inserted into the vertical hole 30, and a fixing ring 152' which is fixed to the ring body 140. The free joint-like 150 can slide vertically along the hole 130 to provide a vertical action of the base assembly 04, but it prevents the base assembly 104 from moving laterally relative to the housing 10, and reduces the Momentum generated by the material against the lateral surface of the retaining ring. The free joint 1 50 may include _path 丨 54, which extends the length of the free joint 'from the fluid connection hole 130 to the third chamber in the substrate lining assembly Π2, for example, the fourth chamber, page 12 This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 public love) * »Μ ----------------- (Talk about the precautions on the back of S3 before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee consumer cooperative 4 3 4】 11 434 Μ 1 »1 Α7 Β7 V. Description of the invention () 23 4 ° The load chamber 108 is located between the housing 102 and the base assembly 104, and applies a load, that is, downward pressure or Weight to base assembly 104. The vertical position of the base assembly 1 relative to the grinding pad 32 is also controlled by the load chamber 10, and the inner edge of a generally annular rolling film 160 can be clamped to the housing 102 by the inner clamp ring 162. The outer edge of the rolling film I 60 can be clamped to the base assembly 104 by the outer clamp ring 164. Therefore, the rolling film 160 seals the space between the housing I 02 and the base assembly 104 to define the load chamber 08. A first pump (not shown) can be fluidly connected to the load chamber 108 via path 1 2 3 to control the pressure in the load chamber and the vertical position of the base assembly 104. The buckle 1 10 may be substantially annular, for example, fixed by a rivet 1 2 8 on the outer edge of the base assembly 104. When the fluid is drawn into the load chamber 108 and the base assembly 104 is pushed down, the retaining ring 10 is simultaneously pushed down to apply a load chamber polishing pad 32. The bottom surface 124 of the retaining ring 110 can be roughly It is flat, or it can have many channels to facilitate the transfer of the slurry from the outside of the buckle to the substrate. The inner surface 126 of the buckle 110 engages the substrate to prevent it from detaching from under the carrier head. 2 and 3, the substrate pad assembly 112 includes an elastic inner film 116 ', an elastic outer mirror 18, an inner support structure 120, an outer support structure 230, an inner spacer ring 122 and an outer spacer ring 232. The support structures 120 and 230 and the spacer rings 112 and 232 can float freely, that is, they are not fixed to other parts of the bearing head, and can be held in position by the inner and outer elastic membranes. Home standard (CN_ ^ specifications (21Q x 297 ^ ---- "--- J ----. ----- it order, -------- Jian (please read the note on the back of the first) Please fill in this page again) Α7 Β7 «34 1 11« V. Description of the invention () The elastic inner membrane 116 includes a central portion 200 'which applies the substrate to a controllable area, and has a relatively thick " L-shaped " section. An annular portion 202, an annular inner turning plate 204, which extends from the corner of the L-shaped portion 'an annular outer turning plate 206, which extends from the outer edge of the L-shaped portion 202', and a circumferential portion 208, which extends to the inner supporting structure Next to 120, to connect the L-shaped portion 202 and the central portion 200. The edge of the inner rotation plate 204 is sandwiched between the fixing ring 152 and the ring body 140 ', and the edge of the outer rotation plate 206 is sandwiched between the outer clamping ring 1 64 and The lower clamp ring 1 44. The volume sealed between the base assembly 104 and the inner membrane 116 by the turn plate 204 provides a pressurized floating lower chamber 234. The inner turn plate 204 and the outer turn Board 206 The annular volume sealed between the base assembly 1 and the inner membrane 1 16 defines a pressurizable floating upper chamber 236.-A second pump (not shown) can be connected to a path not shown to direct fluid For example, the air in and out of the floating upper chamber 236. A third pump (not shown) can be connected to the hole 130 to guide the fluid such as air in and out of the floating lower chamber 2 3 4 »The second pump is controlled in the upper chamber The middle pressure, and the vertical position of the lower chamber, and the pressure controlled by the third pump in the lower chamber. As described in detail below, the entire force in the floating upper chamber 236 will edge the contact area of the inner membrane 116 to the outer membrane. The top surface of 118. Therefore, the second strategy controls the area of the substrate to which the pressure is applied, that is, the area of the loading area, and the second one controls the downward force on the substrate in the loading area. The outer film 1 1 1 8 contains A central portion 210 'extending below the outer support structure 230 to provide a mounting surface to engage the substrate' and a serpentine path extending from the outer support structure 230 and secured to the peripheral portion of the spacer ring outside the base assembly 2 12. For example, the edge of the outer membrane can be clamped between the lower + 144 and the retaining ring 110 Seals between inner film 16 and outer film 10 page 14 This paper applies the national standard (CNS) A4 ^ T ^ 10 'two millimeters) ----- l · II I- I --- ------ II Order-It —!-I < Please read the notes on the back before filling this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 434111 A7 B7 V. Description of the invention ( The product defines the compressible outer chamber 238. Therefore, the outer chamber 238 can actually extend below the lower chamber 234. -A fourth pump (not shown) may be connected to the channel 134 to direct, for example, a fluid such as air into and out of the outer chamber 238. The fourth pump controls the force in the outer chamber 238. The inner support knot pattern 120 may be a substantially hard washer-shaped body located within the floating lower chamber 234 'to maintain the desired shape of the inner membrane 116. Alternatively, the inner supporting structure may be a dish-shaped body 'having a plurality of apertures therethrough. The dish-shaped support structure will provide a cushioned surface to prevent the substrate from being damaged by bending. The inner spacer ring 1 2 2 is generally a hard annular body having a c-shaped cross section. The inner spacer ring may include a cylindrical portion 190, an annular upper flange 192, and an annular lower flange 194. The inner spacer ring 22 may be located in the outer chamber 238 on the inner support structure .120. The annular lower flange 194 may be supported by the support structure 'and the annular lower flange 192 may extend over the outer support structure 2 3 0 and the outer spacer ring 2 3 2. The inner membrane Η 6 is made of bendable and elastic materials, such as elastomers, elastomer-coated fibers or thermoplastic elastomers (TPE), such as "HYTREL" purchased from DuPont, Newark, Dalawa, USA Or a combination of these materials. Preferably, the inner membrane 1 16 is less elastic than the outer membrane π 8. As discussed above, the controllable area of the central portion 200 of the inner membrane 1 16 can contact the upper surface of the outer membrane u 8 and apply a downward load thereto. The load is transferred to the substrate in the loading area via an outer membrane. The bottom surface of the central portion 200 of the inner membrane 116 can be made, for example, with small grooves to ensure that fluid can flow between the inner and outer membranes during contact. The peripheral part 208 of the inner membrane extends down to the inner supporting structure. Page 15 This paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling this page)
* ( n mf n 一OJ* ·1 n .^1 .^1 I 經濟邹智慧財產局員Η消費合作社印製 4 3 4 U 1 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 120之外表面180，並向内延伸於内間隔環122之下凸緣 194及内支撐結構之上表面182之間，以連接至L型部202 之下緣。内膜之L型部2 02延伸於圓柱部190内並於内間 隔環122之環形上凸緣192上。 外支撐結構2 3 0係位於内膜1 1 6及外膜1 1 8間之外室 238内，以維持外膜118之想要形狀並於真空夹持時，密 封基材與外膜。明確地說，外支撐結構2 3 〇可以具有一大 致硬環形部170’具有由環形部邊緣向下延伸之環形突部 172。或者，突出物172可以定位以接觸外膜之頂面，以 優先抱加壓力至基材之選定區域，如於由史帝夫M.魯尼 加等人於1997年八月8曰所申請之美國專利案第 08/907,810號所"用於化學機械研磨設備之具區域壓力控 制之承載頭"所述，該案係受讓給本案之受讓人，其整個 揭示係併入作為參考。突出物丨72可以藉由黏著方式附著 —層可壓縮#料至環形部170之下表面加以形成。 外間隔環23 2係大致為位於扣環n 〇及外膜t丨8間之 環形構件。明確地說，外間隔環232可以位^外支撐結構 230上。外間隔環232包含-圓柱部184及-凸緣部186, 其向外延伸至扣環Π 〇之内砉；τ、 5 円表面,以維持外間隔環之 橫向位置。 外膜1 1 8係為大致一圓形片 即y片材，其係可彎曲及彈性材 料，例如氣丁二烯，或乙烯兩埽梭 橡勝或硬酮作成。應注意 的是’外膜之中心部21 0定義—m 用於基材之安裝面，而圓 周部212呈蛇形延伸於外支撐站媸、 八奸.、棟230及予以被夾持於基 第16頁 (請先閱讀背面之注意事項再填寫本頁) 裝--------訂---------線 434111 A7 B7 經濟部智慧財產局員工消費合作社印製 五'發明說明（) 座组件1 04及扣環丨丨〇間之外間隔環232之間。明確地說， 圓周部212向上延伸於外支揮結構230之外表面174之 旁’向内延伸於外間隔環2 3 2之凸緣部及外支撐結構23 〇 之上表面176間，並向上延伸於外間隔環232之圓柱部U4 旁’然後向外延伸至一邊緣部2丨4，其係被夾持於下夾環 1 44及扣環π 〇之間’以形成一流體密閉密封。外膜之一” #間隙"部2 1 6係延伸於邊緣部2丨4及外間隔環2 3 2之上 表面之外徑之間。外膜可以包含一厚部218，其向上 延伸於内間隔環1 2 2及外間隔環2 3 2之間。外膜可以預鑄 為蛇形》 於操作中’流體可以被抽進出浮動下室2 3 4，以控制 内膜116靠向外膜118之向下壓力，而靠向基材，及流體 被抽進出浮動上室236,以控制靠向外膜118之内膜Η6 的接觸區域。承載110控制載入區及施加至基材壓力之能 力將參考第4Α及4Β圖加以解釋。參考第4Α圖，一假想 及示意性研磨機300包含一"自由浮動》彈性膜3〇2，其定 義 可加壓^至·^06。假設沒有外力施加至彈性膜302上， 其將大致王球形’並具有内壓p1。然而，若騰被壓縮，例 如於硬板3 04及基材I 〇之間，彈性膜將變形成械園，而 與基材大致呈圓形接觸面區308。假設硬板3〇4施加向下 力F至彈性膜302，力量平衡需要P*AC，其中△ p為 於室306中之内部壓力及包圍彈性膜，及Ac係為接觸 區308之表面積》因此，接觸區域3〇8之直徑Dc將會是 第17頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) -----„---- ^--------^---------^ (諝先閱讀背面之注意事項再填窵本頁) 4 3 4 11 1 A7 B7 五、發明說明（* (n mf n-OJ * · 1 n. ^ 1. ^ 1 I Economy Zou Intellectual Property Bureau member 印 Printed by Consumer Cooperatives 4 3 4 U 1 A7 B7 Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 120 outer surface 180 and extends inwardly between the flange 194 below the inner spacer ring 122 and the upper surface 182 of the inner support structure to connect to the lower edge of the L-shaped portion 202. The L-shaped portion of the inner membrane 2 02 Extending in the cylindrical portion 190 and on the annular upper flange 192 of the inner spacer ring 122. The outer support structure 2 30 is located in the outer chamber 238 of the inner membrane 1 16 and the outer membrane 1 18 to maintain the outer membrane The desired shape of 118 is to seal the base material and the outer film when it is clamped in a vacuum. Specifically, the outer support structure 2 30 may have a substantially hard annular portion 170 'having an annular protrusion extending downward from the edge of the annular portion. 172. Alternatively, the protrusion 172 can be positioned to contact the top surface of the outer membrane to preferentially apply pressure to a selected area of the substrate, as applied by Steve M. Rouniga et al. On August 8, 1997. US Patent No. 08 / 907,810 " Carrier head with regional pressure control for chemical mechanical polishing equipment " As mentioned, the case was assigned to the assignee of the case, and the entire disclosure thereof is incorporated as a reference. The protrusions 72 can be formed by adhesively attaching a layer of compressible material to the lower surface of the annular portion 170. The outer spacer ring 23 2 is a generally annular member located between the retaining ring no and the outer membrane t8. Specifically, the outer spacer ring 232 can be positioned on the outer support structure 230. The outer spacer ring 232 includes a cylindrical portion 184 And-flange portion 186, which extends outward to the inside of the retaining ring Π 〇; τ, 5 円 surface to maintain the lateral position of the outer spacer ring. The outer membrane 1 1 8 is a roughly circular piece, that is, a y piece Material, which is a flexible and elastic material, such as gas butadiene, or vinyl dipper, or hard ketone. It should be noted that 'the central part of the outer film 21 0 definition-m for the mounting surface of the substrate , And the circumferential portion 212 extends in a serpentine shape at the outer support station 八, 奸., 栋 230, and is clamped on the base page 16 (please read the precautions on the back before filling this page) --- Order --------- Line 434111 A7 B7 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People's Republic of China on the 5 'Invention () Block Assembly 1 04 And the retaining ring 丨 丨 〇 between the outer spacer ring 232. Specifically, the circumferential portion 212 extends upwardly beside the outer surface 174 of the outer support structure 230 'inwardly extends to the flange of the outer spacer ring 2 3 2 And 176 upper surfaces of the outer support structure 23 and extending upwards beside the cylindrical portion U4 of the outer spacer ring 232 and then outwardly to an edge portion 2 丨 4, which is clamped by the lower clamp ring 1 44 And the retaining ring π ′ to form a fluid-tight seal. One of the outer membranes "#clearance" portion 2 1 6 extends between the outer diameter of the edge portion 2 4 and the upper surface of the outer spacer ring 2 3 2. The outer membrane may include a thick portion 218 that extends upwardly from Between the inner spacer ring 1 2 2 and the outer spacer ring 2 3 2. The outer membrane can be shaped like a snake. "In operation, the fluid can be drawn into and out of the floating lower chamber 2 3 4 to control the inner membrane 116 against the outer membrane. The downward pressure of 118 is directed to the substrate, and the fluid is drawn into and out of the floating upper chamber 236 to control the contact area of the inner membrane Η6 of the outer membrane 118. The load 110 controls the loading area and the pressure applied to the substrate. Capabilities will be explained with reference to Figures 4A and 4B. With reference to Figure 4A, an imaginary and schematic grinder 300 contains a " free floating " An external force is applied to the elastic film 302, which will be approximately spherical and have an internal pressure p1. However, if the Teng is compressed, for example, between the rigid plate 304 and the substrate I 0, the elastic film will become a mechanical circle, and The contact surface area 308 is approximately circular with the substrate. Assuming that the rigid plate 30 applies a downward force F to the elastic film 302, the force balance needs P * AC, where Δp is the internal pressure in the chamber 306 and the surrounding elastic membrane, and Ac is the surface area of the contact area 308. Therefore, the diameter Dc of the contact area 308 will be the paper size on page 17 China National Standard (CNS) A4 Specification (210 X 297 male f) ----- „---- ^ -------- ^ --------- ^ (谞 Read the back first Note for refill this page) 4 3 4 11 1 A7 B7 V. Description of the invention (
DcDc
結果，任一圓形接觸分佈及壓力可以藉由兩步驟處理 加以取得，於該處理中壓力Pt係被選定’及所施加之力 量F係被碉整以決定載入區之直徑。雖然第4A及4B圖以 示意方式例示出該概念，但本發明可以大致藉由施加一向 下力至自由浮動膜室加以實施。 參考第5A及5B圖，靠著外膜118之内膜之接觸 面，及壓力所施加至基材1〇之載入區可以藉由改變於浮 動上室236中之壓力加以控制。藉由將浮動上室236流醴 插出’内膜116之L型部202係被向上拉，藉以將中心部 2 0 0之外緣扳開外膜1 1 8，並減少載入區之直徑=相反地， 藉由將流體抽入浮動上室236時，内膜1丨6之L型部202 係被強迫向下，藉以將内膜之中心部2 0 0推向與外膜11 8 接觸’龙增加載入區之直徑。另外，若流體被強迫入外室 内膜116之L型部202係被強迫向上’藉以減少載 入區之直徑。因此，於承載頭1〇〇中，載入區之直徑將取 決於上室及下室中之壓力而定。 接觸面積之直徑為上室235，下室234及外室238之 壓力之函數之例示圖400係示於第6圖中。此一圖表可以 精由有限元件分析加以實驗或計算。於第6圖中之圖表 中，X軸代表於室234中之壓力，及y軸代表接觸面積。 諸級圖表線402-418代表於下壓236及外室238中之各種 墨力之上室壓力對接觸面積之關係，其係總結如下表中： <諳先閲讀背面之注意事項再填寫本頁) 裝------J訂-----I---線 經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 第仴頁 @ m ^ (CNS)A4 X 297公釐） 4 3 4As a result, any circular contact distribution and pressure can be obtained by a two-step process, in which the pressure Pt is selected and the applied force F is rounded to determine the diameter of the loading zone. Although Figures 4A and 4B illustrate the concept in a schematic way, the invention can be implemented roughly by applying a downward force to a free-floating membrane chamber. Referring to Figs. 5A and 5B, the contact surface of the inner film against the outer film 118, and the loading area to which the pressure is applied to the substrate 10 can be controlled by changing the pressure in the floating upper chamber 236. By inserting the floating upper chamber 236 out of the 'inner membrane 116, the L-shaped portion 202 of the inner membrane 116 is pulled upward, thereby pulling the outer edge of the central portion 2 0 away from the outer membrane 1 1 8 and reducing the diameter of the loading area. = Conversely, when the fluid is drawn into the floating upper chamber 236, the L-shaped portion 202 of the inner membrane 1 丨 6 is forced downward, thereby pushing the central portion 2 of the inner membrane 2 0 to contact the outer membrane 11 8 'Dragon increases the diameter of the load zone. In addition, if the fluid is forced into the L-shaped portion 202 of the inner membrane 116 of the outer chamber, it is forced upward 'to reduce the diameter of the loading area. Therefore, in the loading head 100, the diameter of the loading zone will depend on the pressure in the upper and lower chambers. An exemplary diagram 400 of the diameter of the contact area as a function of the pressure of the upper chamber 235, the lower chamber 234, and the outer chamber 238 is shown in FIG. This chart can be refined experimentally or calculated by finite element analysis. In the graph in Figure 6, the X-axis represents the pressure in the chamber 234, and the y-axis represents the contact area. The various levels of the graph lines 402-418 represent the relationship between the upper chamber pressure and the contact area in the lower pressure 236 and the various ink forces in the outer chamber 238, which are summarized in the following table: < 谙 Read the precautions on the back before filling in this Page) ------ J Order ----- I --- Member of the Intellectual Property Bureau of the Ministry of Economic Affairs X Printed by Consumer Cooperatives Page m @ m ^ (CNS) A4 X 297 mm) 4 3 4
A7B7I 五、發明說明（） 圖表線 於外室238 中之磨力P1 1^ 於下室234 壓力P2 P2-P1 402 1.0 1.5 0.5 404 1.0 2.0 1.0 406 3.0 —- 3.5 0.5 408 3.0 ...... 4.0 1.0 410 3.0 '''----- 4.5 1.5 412 5.0 5.5 0.5 414 5.0 6.0 —-- 1.0 416 5.0 6.5 1.5 418 5.0 7.0 2.0 {請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 承載頭1 0 0可以操作於’’標準"操作模式中，其中浮動 室2 34及236係被通風或減壓，以離開基材，外室238係 被加壓，以施加均勻壓力給基材之整個背面。 如前所討論’於C Μ P中之—再發生問題是基材中心 之非均勻研磨。然而’該可控制載入區可以用以補償研磨 分佈圖，其中基材之中心係藉由施加一連續之具不同直徑 之負載面積之研磨步驟而欠研磨。例如，承載頭可以用以 於第一期間Τι中，研磨具有半徑Γι之基材區域，然後， 於第二期間丁2中’研磨具有半徑Γ2之較大區域，然後， 於第三期間Τ'3研磨具有半徑r3之更大區域。這確保基材 之不同區域係以需要以降低研磨不均勻性之總時間及壓 力加以研磨。 第19頁 本紙張尺度適用中國國家標準（CNSM4規格（210 X 297公;g ) 4 3 4 1 1 1 - A7 經濟部智慧財產局員工消費合作社印製 --—___ B7__五、發明說明（） 如同先前所討論，# CMP中之另一常發生問題是於 基材邊緣之非均勺研磨。然而，外間隔環232可以用以控 制由接近基材邊.緣之外膜118所施加之壓力分佈β明確地 說，如於由史帝芬魯加等人申請於ί998年十月9日之美 國專利申請案第09/169,500號，名為，，用於化學機械研磨 之具有彈性膜之承載頭"，其係受讓給本案之受讓人，其 整個揭示係併入作為參考’外間隔環之上表面之表面積可 以被選擇以調整施加至外薄膜之角落對基材圓周之相對 壓力。 為了由研磨墊上移開基材，浮動上室236係被加壓， 以強迫外支撐結構230之突出物172向下靠在外薄膜118 之上表面。這強迫外薄膜與基材接觸，以形成一密封。浮 .動下室2 3 4係被通氣，例如，連接至外面大氣，及外室被 減壓。這使得薄膜118被向内抽，以真空夾持基材至承載 頭上。然後，浮動上室2 3 6係被減壓以將内及外薄膜向上 抽*並將基材抬舉離開研磨墊。最後’負載室係被抽 真空以抬舉基座組件1 04及基材襯墊组件離開研磨墊。 承載頭100之操作以加載一基材至傳送站27之承載 頭，由研磨站25之研磨墊放開基材，並由傳送站27之承 載頭卸載基材係被總結於以下表格中。 --1 —r ---裝ί丨丨丨I丨丨訂-------- *線 (諳先閲讀背面之注意事項再填寫本頁) 第20頁 1本紙張尺度㉟帽@家標準（CNS)A4規格（21〇 X 297公釐） Α7 經濟部智慧財產局員工消费合作社印製 4 3 4 111 ___Β7 五、發明說明（） 加載操作 步驟 啟始狀態 縮回 膨脹薄膜 將基材 抓取晶圓 下組件 推向薄膜 外 通氣 通氣 壓力 通氣 真空 下 通氣 通氣 通氣 通氣 通氣 上 通氣 真空 真空 真空 真空 環 真空 真空 真空 真空 真空 於膨脹，推壓及抓取步驟後可採之時間延遲。 釋放操作 步驟 啟始 施力P 抓取 由墊抬 由墊 狀態 密封力 基材 舉基材 抬舉環 外 通氣 通氣 真空 真空 真空 下 通氣 通氣 通氣 通氣 通氣 上 通氣 壓力 壓力 真空 真空 環 壓力 壓力 壓力 壓力 真空 於密封，抓取，及抬舉步驟後可發生時間延遲 卸載操作 步驟 啟始狀 延伸下 釋放基 送出基 令薄膜 態 組件 材 材 消氣 外 真空 真空 通氣 通氣 通氣 下 通氣 通氣 通氣 壓力 通氣 上 真空 壓力 通氣 通氣 通氣 環 真空 真空 真空 真空 真空 第21Τ (諳先閱讀背面之注意事項再填寫本頁) 裝.-------訂----- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印Μ衣 A7 B7 五、發明說明（） 於降下及送出步驟可以花之時間延遲。 為了於加載或釋放操作後’決定是否基材係成功地附 著至承載頭上，c Μ P設備可以執行一基材檢測程序。此程 序開始以外室238,上浮動室236及負載室108於真空下， 及下浮動室234被通氣。下浮動室234係被連接至固定壓 力之壓力源。參考第7Α圖’於下浮動室中之壓力係被量 測為時間之函數。參考第7Β圖，於下浮動室中之壓力之 一次導數（dP/dt)係被計算為室係被加壓。若基材未出現， 則下室將向下彎，並具有膨脹空間。相反地，若基材出現 並被夾持至承載頭上，於下室中之容積將受限，及隨後於 下室中之壓力將快速上升。因此，若基材藉由決定是否導 數dP/dt是否超出臨界值C!加以檢測出。此臨界值Ci可 .以實驗決定。若導數dP/dt超出臨界值C i，則基材出現。 另一方面，若導數dP/dt並未超出臨界值C 1，則基材未出 現。下浮動室234可以於基材檢測程序完成後回到真空。 參考第8圖，於另一實施例中，承載頭l〇〇a包含一 大致呈碟狀內支撐板120a，其提供於浮動上室236a及浮 動下室234a間之阻障。内膜1 1 6a係大致圓形片，具有中 心部份200a’及一被固定至基座組件1 〇4a之邊緣部240， 及一環形内區域或外緣242固定至内支撐板i 2〇a之外緣 244。内薄膜之中心部份200a延伸於内支撐板i2〇a之下， 以定義浮動下室2 3 4 a ’而於襯墊板及基座组件間之體積係 被内膜11 6a之邊緣部240所密封，該體積定義浮動上室 236a。碟形内支撐板120a增加了於浮動上室236a及浮動 第22頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------— I— ·1!11111 一SJ (請先閱讀背面之注意事項再填寫本頁) 4341 11 A7 B7 五、發明說明（） 下室234a間之接觸面積。 外支撐結構2 3 0 a可以包本一读带如 ° 衣形部170a，一環形凸 (請先閱讀背面之注意事項再填寫本頁) 緣部178a，其由環形部i7〇a之内缴南 〜門.家向上突出’及一突出 物1 72a ’其由環形部1 70a之外绫命下„认 < π ..家句下延伸，以接觸外薄 膜118a之上表面。外支樓杜进、 又伢心構h〇a〈凸緣部n8a可以 固定至内支樓板120a或内薄膜+ 門溥腰U6a。或者，外支撐結構 23 0a可以於外室238中自由浮動。 承載頭I〇〇a以類似於承載頭1〇〇之方式作動。明確 地說，於汁動上：E 23 6a中之壓力控制内膜靠向外膜上表 面之接觸面積，以及，於浮動下室234&之壓力控制施加 至載入區中之基材之壓力。為了由研磨墊上去除基材，浮 動上室236a係被加壓以強迫於外支撐結構23〇&上之突出 物172a靠向外膜118a之上表面。這使得外薄膜靠向基 材，以於其間形成流體密閉密封。然後，浮動下室係被通 氣’及外至2 3 8 a係被減壓，以將外薄膜拉向内薄膜。最 後，浮動上室係被減壓，以將基材抬離研磨墊。 經濟部智慧財產局員工消費合作社印*·'?} 參考第9圖，於另一實施例中，承載頭i〇〇b可以包 含具有環形脣部250之外薄膜1 I8b。當外室238c被抽真 空時’脣250可以被拉向基材1〇，以形成一密封並改變基 材之真空夾持，如於魯尼等人於1998年八月31曰所申請 之美國專利申請案第09/149,806號"用於化學機械研磨之 承載頭"所述，該案係受讓給本案之受讓人’其整個揭示 係併入作為參考。 參考第10圖，於另一實施例中，承載頭100c包含一 第23頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 434 Μ 1 Α7 經濟部智慧財產局員工消費合作社印製 B7 五、發明說明（） 單一彈性膜118c及一碟狀襯墊結構I22y彈性膜1 1 8c之 中心部260延伸於襯墊結構122c之下’以提供一安裝表 面以嚙合基材。彈性膜之圓周部2 62向上及向内延伸於襯 墊結構之圓柱緣264。圓周部262包含一内轉板.266 ’其 係被夾於一夹環208及襯墊結構122c之上表面270之間’ 及一外轉板272，其係包圍予以夾持於扣環1 1 及環形體 140c間之間隔環120c。因此，於塾結構122c及彈性膜1 18 間之體積定義一可壓縮浮動下室234c，及於基座組件104 及襯墊結構122c間被内及外轉板266及272所密封之體 積定義了可壓縮浮動上室236c » 一泵可以藉由一自由接頭桿150中之通道154連接至 浮動上室236c，及另一菜可以藉由於外殼102中之通道 .134,於基座組件104c中之通道280,及經由襯墊結構122c 之通道282連接至浮動下室234c。固定件284及286提供 用以彈性接管之附著點’以流體連接通道’諸通道流過基 座組件，及襯墊結構，以連接通道134至浮動下室234c。 襯墊結構之底面274可以具有一突出物276，其由結 構之外緣向下延伸。多數凹槽278可以形成於襯塾結構 1 22c之底面274中’以確保流體可以由襯墊結構及彈性膜 間柚出。 藉由控制於浮動上及下室中之壓力，彈性膜！丨8c靠 向基材之接觸壓力及負載面積可以被控制。為了由研磨执 上移開基材，浮動上室236c係被加壓以強边突出物276 向下並於基材及彈性膜間創造一密封，然後浮動下室234cA7B7I V. Description of the invention () The grinding force of the chart line in the outer chamber 238 P1 1 ^ In the lower chamber 234 Pressure P2 P2-P1 402 1.0 1.5 0.5 404 1.0 2.0 1.0 406 3.0 --- 3.5 0.5 408 3.0 ..... . 4.0 1.0 410 3.0 '' '----- 4.5 1.5 412 5.0 5.5 0.5 414 5.0 6.0 --- 1.0 416 5.0 6.5 1.5 418 5.0 7.0 2.0 (Please read the precautions on the back before filling out this page) Ministry of Economy Wisdom The property carrier employee consumer cooperative printed bearing head 1 0 0 can be operated in "standard" operation mode, in which the floating chamber 2 34 and 236 are ventilated or decompressed to leave the substrate, and the outer chamber 238 is pressurized To apply uniform pressure to the entire back of the substrate. As previously discussed 'in CMP—a recurring problem is the non-uniform grinding of the center of the substrate. However, the controllable loading area can be used to compensate the grinding profile, where the center of the substrate is under-ground by applying a continuous grinding step with a load area of different diameters. For example, the carrier head can be used to grind a substrate region having a radius Γι in the first period Tι, and then 'grind a larger region having a radius Γ2 in the second period D2, and then, in the third period T' 3 Grind a larger area with a radius r3. This ensures that different areas of the substrate are ground with the total time and pressure required to reduce the grinding unevenness. Page 19 This paper size applies Chinese national standards (CNSM4 specification (210 X 297 male; g) 4 3 4 1 1 1-A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs --- B7__ V. Description of the invention ( As discussed previously, another common problem in #CMP is non-uniform lapping on the edge of the substrate. However, the outer spacer ring 232 can be used to control the edge applied by the film 118 near the edge of the substrate. The pressure distribution β specifically states that, as in U.S. Patent Application No. 09 / 169,500, filed by Stephen Rugar et al. On October 9, 998, and named, a bearing head with an elastic film for chemical mechanical polishing "It is assigned to the assignee of this case, and its entire disclosure is incorporated as a reference. The surface area of the upper surface of the outer spacer ring can be selected to adjust the relative pressure applied to the corners of the outer film on the substrate circumference. In order to remove the substrate from the polishing pad, the floating upper chamber 236 is pressurized to force the protrusions 172 of the outer support structure 230 down against the upper surface of the outer film 118. This forces the outer film to contact the substrate to form a Sealed. Floating. Moving under the chamber The 2 3 4 system is aerated, for example, connected to the outside atmosphere, and the outer chamber is depressurized. This causes the film 118 to be drawn inward to clamp the substrate to the carrier head in a vacuum. Then, the floating upper chamber 2 3 6 system is Depressurize to pump up the inner and outer films * and lift the substrate away from the polishing pad. Finally, the load chamber is evacuated to lift the base assembly 104 and the substrate pad assembly away from the polishing pad. Operation of the carrier head 100 A substrate is loaded to a carrier head of the transfer station 27, the substrate is released by the polishing pad of the polishing station 25, and the substrate is unloaded by the carrier head of the transfer station 27. It is summarized in the following table. --1 --r- --Install 丨 丨 丨 I 丨 丨 Order -------- * Line (谙 Read the precautions on the back before filling this page) Page 20 1 paper size ㉟Cap @ 家 标准 （CNS) A4 Specifications (21 × X 297 mm) Α7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 4 111 ___ Β7 V. Description of the invention () The initial state of the loading operation procedure is to retract the expansion film and grasp the substrate to the lower component of the wafer Push out the membrane ventilation ventilation pressure ventilation ventilation vacuum ventilation ventilation ventilation The time of uptake, vacuum, vacuum, ring vacuum, vacuum, vacuum, and vacuum can be taken after the expansion, pushing, and grasping steps are delayed. The release operation step begins when the force is applied. Material lifting ring outside ventilation ventilation vacuum vacuum vacuum ventilation ventilation ventilation ventilation upper ventilation pressure pressure vacuum vacuum ring pressure pressure pressure pressure vacuum sealing, grasping, and lifting steps can occur after a time delay unloading operation steps start extended extension release Send out the base film thin-film module material out of the outer vacuum vacuum ventilation ventilation ventilation under ventilation ventilation ventilation pressure upper vacuum pressure ventilation ventilation ring vacuum vacuum vacuum vacuum vacuum 21T (谙 read the precautions on the back before filling this page) .------- Order ----- This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm). The Intellectual Property Bureau of the Ministry of Economic Affairs and the Consumer Cooperatives printed M7 A7 B7. 5. Description of the invention () At the steps of lowering and sending out To spend the time delay. To determine whether the substrate is successfully attached to the carrier after the loading or unloading operation, the CP device may perform a substrate inspection procedure. This procedure begins with the outer chamber 238, the upper floating chamber 236 and the load chamber 108 under vacuum, and the lower floating chamber 234 being vented. The lower floating chamber 234 is connected to a pressure source of a fixed pressure. Referring to Figure 7A ', the pressure in the lower floating chamber is measured as a function of time. Referring to Fig. 7B, the first derivative (dP / dt) of the pressure in the lower floating chamber is calculated as the chamber system is pressurized. If the substrate does not appear, the lower chamber will bend downwards with space for expansion. Conversely, if the substrate appears and is clamped to the carrier head, the volume in the lower chamber will be limited, and then the pressure in the lower chamber will increase rapidly. Therefore, if the substrate is detected by determining whether the derivative dP / dt exceeds the critical value C !. This critical value Ci can be determined experimentally. If the derivative dP / dt exceeds the critical value C i, the substrate appears. On the other hand, if the derivative dP / dt does not exceed the critical value C 1, the substrate does not appear. The lower floating chamber 234 may return to the vacuum after the substrate detection process is completed. Referring to FIG. 8, in another embodiment, the carrier head 100a includes a substantially dish-shaped inner support plate 120a, which provides a barrier between the floating upper chamber 236a and the lower floating chamber 234a. The inner membrane 1 16a is a generally circular sheet, having a central portion 200a 'and an edge portion 240 fixed to the base assembly 104a, and an annular inner region or outer edge 242 fixed to the inner support plate i2. a outer edge 244. The central portion 200a of the inner film extends below the inner support plate i2〇a to define the floating lower chamber 2 3 4 a 'and the volume between the cushion plate and the base component is the edge portion 240 of the inner film 11 6a Sealed, this volume defines the floating upper chamber 236a. The dish-shaped inner supporting plate 120a has been added to the floating upper chamber 236a and floating. Page 22 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---------— I— · 1! 11111 One SJ (Please read the notes on the back before filling out this page) 4341 11 A7 B7 V. Description of the invention () The contact area between the lower chambers 234a. The outer supporting structure 2 3 0 a can include a reading belt such as ° clothes-shaped portion 170a, a ring-shaped convex (please read the precautions on the back before filling this page) edge 178a, which is paid in by the ring-shaped portion i7〇a South ~ Gate. The home protrudes upwards and a protrusion 1 72a ', which is commanded from outside the ring portion 1 70a to extend below the home sentence to contact the upper surface of the outer film 118a. Outer branch building Du Jin, and the heart structure h〇a <The flange portion n8a can be fixed to the inner support floor 120a or the inner film + door lintel waist U6a. Alternatively, the outer support structure 23 0a can float freely in the outer chamber 238. Carrying head I 〇〇a acts in a similar manner to the bearing head 100. Specifically, on the juice movement: the pressure-controlled inner membrane contact surface area of the outer membrane on the upper surface of E 23 6a, and in the floating lower chamber 234 &; The pressure applied to the substrate in the loading area is controlled. In order to remove the substrate from the polishing pad, the floating upper chamber 236a is pressurized to force the protrusion 172a on the outer support structure 23 ° to outward. The upper surface of the film 118a. This places the outer film against the substrate to form a fluid-tight seal therebetween. The floating lower chamber was ventilated 'and the outside to 2 3 8 a was decompressed to pull the outer film toward the inner film. Finally, the floating upper chamber was decompressed to lift the substrate away from the polishing pad. Ministry of Economic Affairs Intellectual Property Bureau employee consumer cooperative stamp * · '?} Referring to FIG. 9, in another embodiment, the carrier head 100b may include a film 1 I8b with a ring-shaped lip 250 outside. When the outer chamber 238c is evacuated The lip 250 can be pulled towards the substrate 10 to form a seal and change the vacuum grip of the substrate, such as U.S. Patent Application No. 09 / 149,806, filed by Rooney et al. On August 31, 1998. " Carrier head for chemical mechanical polishing " According to this case, the entire transfer of the case to the assignee of the present case is incorporated by reference. Referring to FIG. 10, in another embodiment, the carrier head 100c contains a page 23 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 X 297 mm) 434 M 1 Α7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs B7 5. Description of the invention () Single elastic film 118c And a dish-shaped cushion structure I22y elastic film 1 1 8c center portion 260 extension Below the cushion structure 122c 'to provide a mounting surface to engage the substrate. The circumferential portion 2 62 of the elastic membrane extends upwardly and inwardly from the cylindrical edge 264 of the cushion structure. The circumferential portion 262 includes an inner turning plate. 266' It is sandwiched between a clamp ring 208 and the upper surface 270 of the cushion structure 122c 'and an outer rotating plate 272, which surrounds the spacer ring 120c sandwiched between the buckle ring 1 1 and the ring body 140c. Therefore, The volume between the cymbal structure 122c and the elastic membrane 118 defines a compressible floating lower chamber 234c, and the volume sealed between the base assembly 104 and the cushion structure 122c by inner and outer turning plates 266 and 272 defines the Compression floating upper chamber 236c »A pump can be connected to the floating upper chamber 236c through a channel 154 in a free joint rod 150, and another dish can be connected through a channel 134 in the housing 102, channel 280 in the base assembly 104c And is connected to the floating lower chamber 234c through the passage 282 of the cushion structure 122c. The fixing members 284 and 286 provide an attachment point for elastic takeover, and the channels are fluidly connected to the channel through the base assembly, and the pad structure is used to connect the channel 134 to the floating lower chamber 234c. The bottom surface 274 of the cushion structure may have a protrusion 276 extending downwardly from the outer edge of the structure. Most of the grooves 278 may be formed in the bottom surface 274 of the liner structure 1 22c to ensure that the fluid can flow out from the cushion structure and the elastic membrane. By controlling the pressure in the floating upper and lower chambers, the elastic membrane!丨 8c can be controlled by the contact pressure and load area to the substrate. In order to remove the substrate from the grinding holder, the floating upper chamber 236c is pressurized with a strong edge protrusion 276 downward and creates a seal between the substrate and the elastic film, and then the lower chamber 234c is floated.
第24T 私纸張尺度適用中囤國家標準（CNS)A4規格（210 X 297公f ) (請先閲讀背面之注意事項再填寫本頁) ------I I --------線 I . A7 4 3 4 1 1 B7_______ 五、發明說明（） 係被抽真空’以真空夾持基材至承載頭上° 參考第11圖，於另一實施例中’結構上類似於承載 頭100c之承載頭l〇〇d包含一閥路由定位系統300，於襯 整結構122d中，以流體連接上室236d至下室234d。閥路 由定位系統300包含一碟形閥體302及一環形閥凸緣 304«閥體302可以固定於襯墊結構1 22d中乏孔徑306中’ 及閥凸緣304可以黏著固定至襯墊結構122d之頂面312 中。環形密封308固定於頂面312中之淺凹部雜亂次系統 310中，該頂面包含孔徑306。多數垂直通道3丨4可以形 成貫穿碟形闕體302於密封308上，以流禮連接下室234d 及上室236d»閥凸緣304作動為一彈性彈簧以將閥體302 向下偏壓，使得垂直通道314靠於環形密封308，以關閉 該閥。然而，若閥體302係被強迫向上’則密封將不再接 觸閥體及流體可以經由通道3 14洩出。因此’閥300將被 打開及下室234d及上室236d將經由通道314而流體相 通。 閥300可以用以感應是否一基材已經被夾於彈性膜 1 1 8d上。明確地說，於上室234d中之第一壓力量測可以 以一壓力錶（未示出）完成於上室被加壓後，於下室被柚真 空之前。上室234d應與加壓或抽真空該室之泵隔離。然 後，於下室被抽真空後，於上室中壓力之第二量測係由壓 力錶完成。第一及第二壓力量測可以相比較，以決定是否 基材係成功地被真空夾持至承載頭上。 若基材被成功地真空夾持，則彈性膜1 1 8 d將被保持 第25頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） {請先閱讀背面之注意事項再填寫本頁) -------訂---1!11_ 線 I . 經濟部智慧財產局員工消費合作杜印製 434 111 Α7 Β7 五、發明說明（） 於接近基材，藉由於基材及彈性膜間之低壓袋。結果，間 3 00將於其閉合狀態保持偏壓，及於上室中之壓力將保持 不變或可以增加。另一方面，若基材未出現或未被真空失 持至承載頭’則當下室234d被抽真空時，彈性膜U8d將 向上彈。因此，彈性膜將施加一向上力至閥體3〇2並將打 開閥300，藉以流體連接下室234d至上室236d。這允許 流體經由下室23 4d被抽出上室23 6d之外。結果，於上室 中之所得壓力將為低，若基材並未出現或相較於基材被適 當附著時’基材未被真空夾持至彈性膜，這差異可以被檢 ;則以決定是否基材被夾持至承載頭。用以感應於承載頭中 之基材之出現之類似設備與方法係被描述於由布里斯 ^ 門等人所申請於1997年五月23曰之美國專利中請案第 .0 8 / 8 6 2，3 5 0號"用於化學機械研磨系統之具基材檢測機制 之承載頭”之中，其係受讓給本案之受讓人，其整個揭示 係併入作為參考。 可以執行本發明之承載頭有各種架構。例如，浮動上 室可以是一環形或固態體。上及下室可以藉由—彈性膜分 開或藉由一相當硬襯墊或支撐結構分開。基材可以藉由於 可變載入區中之彈性膜加以直接接觸，或一内薄膜可以以 於可變接觸面積來接觸外薄膜之内表面。支撐結構可以具 有孔徑貫穿於其間之環形或碟形體° 本發明已經以若干實施例加以描述然而*本發明並 不限定於所述及描述之實施例。相反地’本發明之範園係 由隨附之申請專利範圍所定義。 第26頁 (請先閲讀背面之注意事項再填寫本頁) I I I--I I 11111111 I . 經濟部智慧財產局負工消費合作社印製The 24T private paper standard applies to the national standard (CNS) A4 specification (210 X 297 male f) (Please read the precautions on the back before filling this page) ------ II ------- -Line I. A7 4 3 4 1 1 B7_______ V. Description of the invention () The system is evacuated to vacuum hold the substrate onto the carrier head. Refer to Figure 11 and in another embodiment, 'structure is similar to the carrier head. The carrier head 100d of 100c includes a valve routing positioning system 300, which is fluidly connected to the upper chamber 236d to the lower chamber 234d in the lining structure 122d. The valve routing and positioning system 300 includes a dish-shaped valve body 302 and a ring valve flange 304 `` The valve body 302 can be fixed in the gasket structure 1 22d in the bore 306 'and the valve flange 304 can be adhesively fixed to the gasket structure 122d Of the top surface 312. An annular seal 308 is fixed in the shallow recessed messy sub-system 310 in the top surface 312, which contains the aperture 306. Most of the vertical channels 3 and 4 can be formed to penetrate the dish-shaped body 302 on the seal 308, and the lower chamber 234d and the upper chamber 236d are connected by a streamer to act as an elastic spring to bias the valve body 302 downward. The vertical channel 314 is brought against the annular seal 308 to close the valve. However, if the valve body 302 is forced upwards', the seal will no longer contact the valve body and fluid can leak through the passages 3-14. Therefore, the 'valve 300 will be opened and the lower chamber 234d and the upper chamber 236d will be in fluid communication via the passage 314. The valve 300 can be used to sense whether a substrate has been clamped on the elastic film 118d. Specifically, the first pressure measurement in the upper chamber 234d can be performed with a pressure gauge (not shown) after the upper chamber is pressurized and before the lower chamber is vacuumed. The upper chamber 234d should be isolated from the pump that pressurizes or evacuates the chamber. Then, after the lower chamber is evacuated, the second measurement of the pressure in the upper chamber is performed by a pressure gauge. The first and second pressure measurements can be compared to determine if the substrate was successfully clamped to the carrier by the vacuum. If the substrate is successfully clamped in a vacuum, the elastic film 1 1 8 d will be maintained on page 25. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) {Please read the precautions on the back first (Fill in this page again.) ------- Order --- 1! 11_ Line I. Consumer Cooperation of Intellectual Property Bureau of the Ministry of Economic Affairs Du printed 434 111 Α7 Β7 V. Description of the invention () Close to the substrate, because Low pressure bag between substrate and elastic film. As a result, the interval 300 will remain biased in its closed state, and the pressure in the upper chamber will remain constant or can increase. On the other hand, if the substrate does not appear or is not held by the vacuum to the carrier head ', when the lower chamber 234d is evacuated, the elastic film U8d will spring up. Therefore, the elastic membrane will apply an upward force to the valve body 302 and will open the valve 300, thereby fluidly connecting the lower chamber 234d to the upper chamber 236d. This allows fluid to be drawn out of the upper chamber 23 6d via the lower chamber 23 4d. As a result, the pressure obtained in the upper chamber will be low. If the substrate does not appear or is compared to when the substrate is properly attached, the substrate is not clamped to the elastic film by vacuum. This difference can be checked; Whether the substrate is clamped to the carrier head. A similar device and method for sensing the presence of a substrate in a carrier head is described in U.S. Patent No. 0 8/8 8 2 filed on May 23, 1997, by Brysman et al. "No. 3 50" for a carrier head with a substrate detection mechanism for a chemical mechanical polishing system "is assigned to the assignee of the present case, and the entire disclosure thereof is incorporated as a reference. The present invention can be carried out The carrier head has various structures. For example, the floating upper chamber can be a ring or a solid body. The upper and lower chambers can be separated by an elastic membrane or by a relatively hard pad or support structure. The substrate can be separated by The elastic film in the variable loading area is brought into direct contact, or an inner film may contact the inner surface of the outer film with a variable contact area. The support structure may have a ring-shaped or dish-shaped body with an aperture passing therethrough. The examples are described. However, the present invention is not limited to the described and described examples. On the contrary, the scope of the present invention is defined by the scope of the attached patent application. Page 26 (Please read the notes on the back first Complete this page again) I I I -. I I 11111111 I Economic Affairs Intellectual Property Bureau of Consumer Cooperatives negative working printing