TW429316B - IC test apparatus - Google Patents

IC test apparatus

Info

Publication number
TW429316B
TW429316B TW088104557A TW88104557A TW429316B TW 429316 B TW429316 B TW 429316B TW 088104557 A TW088104557 A TW 088104557A TW 88104557 A TW88104557 A TW 88104557A TW 429316 B TW429316 B TW 429316B
Authority
TW
Taiwan
Prior art keywords
test
tested
test apparatus
precision
match
Prior art date
Application number
TW088104557A
Other languages
Chinese (zh)
Inventor
Hiroto Nakamura
Noboru Saito
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW429316B publication Critical patent/TW429316B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Discharge Of Articles From Conveyors (AREA)

Abstract

The subject of this invention is to increase the precision of tested IC position relative to the contact portion. The solving means is shown below. For the IC test apparatus of this invention, the test is performed after input/output terminal HB is pressed on the contact pin 51 of the test head. The hole 23, which is embedded to match with the soldering ball HB of the tested IC, is installed at the inserted device 16 of the test tray for the tested IC.
TW088104557A 1998-04-02 1999-03-23 IC test apparatus TW429316B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10106923A JPH11287842A (en) 1998-04-02 1998-04-02 Ic tester

Publications (1)

Publication Number Publication Date
TW429316B true TW429316B (en) 2001-04-11

Family

ID=14445949

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088104557A TW429316B (en) 1998-04-02 1999-03-23 IC test apparatus

Country Status (7)

Country Link
JP (1) JPH11287842A (en)
KR (1) KR100722643B1 (en)
CN (1) CN1171093C (en)
DE (1) DE19914775A1 (en)
MY (1) MY125922A (en)
SG (1) SG81268A1 (en)
TW (1) TW429316B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384242B (en) * 2007-04-12 2013-02-01 Chroma Ate Inc Method for testing system-in-package devices
TWI717595B (en) * 2017-04-28 2021-02-01 日商阿德潘鐵斯特股份有限公司 Carrier for electronic component testing device

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067000A1 (en) * 2001-02-21 2002-08-29 Advantest Corporation Insert for electronic component test device
JP2003066104A (en) * 2001-08-22 2003-03-05 Advantest Corp Insert and electronic component handling apparatus having the same
DE10297654B4 (en) * 2002-03-06 2010-08-05 Advantest Corp. Holding insert and handling device with such a holding insert for electronic components
JP4043339B2 (en) 2002-10-22 2008-02-06 川崎マイクロエレクトロニクス株式会社 Test method and test apparatus
KR100613168B1 (en) 2004-10-01 2006-08-17 삼성전자주식회사 Insert block for testing semiconductor device
JP2006292727A (en) * 2005-03-18 2006-10-26 Alps Electric Co Ltd Semiconductor transfer tray, burn-in board using the same, inspection apparatus for burn-in test, burn-in test method, and semiconductor manufacturing method
KR100659153B1 (en) 2006-01-26 2006-12-19 삼성전자주식회사 Insert for semiconductor package having supporting substrate
KR100647494B1 (en) * 2006-03-29 2006-11-23 주식회사 엠디플렉스 Measurement device for the electronic circuit and the method for measuring of the same
US7522401B2 (en) * 2006-05-26 2009-04-21 Intel Corporation Static dissipative layer system and method
JP4927493B2 (en) * 2006-10-13 2012-05-09 株式会社エンプラス Socket for electrical parts
WO2008123608A1 (en) * 2007-04-04 2008-10-16 Nhk Spring Co., Ltd. Conductive contact holder and conductive contact unit
WO2008125011A1 (en) * 2007-04-12 2008-10-23 Semiconductor Testing Advanced Research Lab Inc. Method and apparatus for testing system-in-package devices, micro sd devices
JP2012163550A (en) * 2011-01-18 2012-08-30 Unitechno Inc Semiconductor conveyance fixture
JP2013137286A (en) * 2011-12-28 2013-07-11 Advantest Corp Electronic component testing device
TWI470233B (en) * 2012-09-28 2015-01-21 Taiwan Elite Nano Technology Corp Probe structure and manufacture thereof
KR102010275B1 (en) * 2013-04-03 2019-08-13 (주)테크윙 Handler for testing semiconductor
CN103412251A (en) * 2013-07-24 2013-11-27 昆山迈致治具科技有限公司 PCB performance detection jig with stroke-limiting mechanism
KR102220334B1 (en) * 2014-10-16 2021-02-25 세메스 주식회사 Insert assembly for receiving electronic device
JP6404104B2 (en) * 2014-12-11 2018-10-10 株式会社エンプラス Socket for electrical parts
CN106290990A (en) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 Can the positioner of the most electronic units fixes and the implement of application thereof
CN105929321B (en) * 2016-06-12 2023-03-03 深圳市斯纳达科技有限公司 Integrated circuit test equipment
CN110572954A (en) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 pin assembly guide and circuit board assembly
TWI760230B (en) * 2020-06-09 2022-04-01 台灣愛司帝科技股份有限公司 Chip-detecting method, chip-detecting structure and chip-carrying structure
CN113884511B (en) * 2021-09-28 2023-09-29 北京环境特性研究所 Material transmissivity test support and test system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199531A (en) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp Measuring device for semiconductor
JPH05326757A (en) * 1990-12-18 1993-12-10 Toshiba Corp Ic socket
JPH06102311A (en) * 1992-09-21 1994-04-15 Kawasaki Steel Corp Test method and apparatus for semiconductor package
JPH07122625A (en) * 1993-10-22 1995-05-12 Sony Corp Positioning method for semiconductor device
US5635832A (en) * 1994-06-15 1997-06-03 Advantest Corporation IC carrier for use with an IC handler
KR0146216B1 (en) * 1995-04-24 1998-11-02 정문술 Loading, unloading apparatus of semiconductor detector
JP3644553B2 (en) * 1995-11-20 2005-04-27 株式会社アドバンテスト IC socket
JPH1058367A (en) * 1996-08-23 1998-03-03 Advantest Corp Ic carrying device
US6097201A (en) * 1997-10-31 2000-08-01 Kinetrix, Inc. System to simultaneously test trays of integrated circuit packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384242B (en) * 2007-04-12 2013-02-01 Chroma Ate Inc Method for testing system-in-package devices
TWI717595B (en) * 2017-04-28 2021-02-01 日商阿德潘鐵斯特股份有限公司 Carrier for electronic component testing device

Also Published As

Publication number Publication date
JPH11287842A (en) 1999-10-19
KR19990082895A (en) 1999-11-25
SG81268A1 (en) 2001-06-19
MY125922A (en) 2006-08-30
CN1230691A (en) 1999-10-06
KR100722643B1 (en) 2007-05-28
DE19914775A1 (en) 1999-11-11
CN1171093C (en) 2004-10-13

Similar Documents

Publication Publication Date Title
TW429316B (en) IC test apparatus
TW428096B (en) IC testing apparatus
ATE371196T1 (en) DEVICE FOR AN INTERFACE BETWEEN ELECTRONIC HOUSINGS AND TEST DEVICES
WO2003100445A3 (en) Probe for testing a device under test
WO2003041122A3 (en) Preconditioning integrated circuit for integrated circuit testing
HK1199106A1 (en) Improved integrated circuit contact with test apparatus
MY114793A (en) Test section for use in an ic handler
DE68924744T2 (en) Contact pin electronics device with phase adjustment for an IC tester and method for phase adjustment.
TW200506394A (en) Electronic part test device (1)
WO1999066337A3 (en) Device for measuring and analyzing electrical signals of an integrated circuit component
TW200700301A (en) Method of holding an electronic component in a controlled orientation during parametric testing
DE50206869D1 (en) Guide system for contact plug
TW334607B (en) Method for high speed testing a semiconductor device
PT1724397E (en) Method and device for measuring railway line parameters
TW557736U (en) Device for adjusting components of a chair
MY125628A (en) Ic testing apparatus
TWI256122B (en) Integrated circuit and associated packaged integrated circuit
EP0851235A3 (en) Circuit and method to externally adjust internal circuit timing
DE59208473D1 (en) Test device for integrated circuits
TW367415B (en) Test method for ball grid array integrated circuit
ATE369644T1 (en) BRANCH BOX
MY149802A (en) Device and method for testing electronic components
DE50102881D1 (en) DEVICE FOR CONNECTING TWO COMPONENTS
ATE245779T1 (en) SEALING DEVICE
ATE304114T1 (en) DEVICE FOR CONNECTING TWO PARTS

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent