TW427550U - Device to reduce the device charging - Google Patents
Device to reduce the device chargingInfo
- Publication number
- TW427550U TW427550U TW87215496U TW87215496U TW427550U TW 427550 U TW427550 U TW 427550U TW 87215496 U TW87215496 U TW 87215496U TW 87215496 U TW87215496 U TW 87215496U TW 427550 U TW427550 U TW 427550U
- Authority
- TW
- Taiwan
- Prior art keywords
- reduce
- charging
- device charging
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW87215496U TW427550U (en) | 1998-09-18 | 1998-09-18 | Device to reduce the device charging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW87215496U TW427550U (en) | 1998-09-18 | 1998-09-18 | Device to reduce the device charging |
Publications (1)
Publication Number | Publication Date |
---|---|
TW427550U true TW427550U (en) | 2001-03-21 |
Family
ID=21636246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW87215496U TW427550U (en) | 1998-09-18 | 1998-09-18 | Device to reduce the device charging |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW427550U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111211032A (en) * | 2018-11-21 | 2020-05-29 | 台湾积体电路制造股份有限公司 | Method for manufacturing semiconductor structure and plasma processing equipment |
-
1998
- 1998-09-18 TW TW87215496U patent/TW427550U/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111211032A (en) * | 2018-11-21 | 2020-05-29 | 台湾积体电路制造股份有限公司 | Method for manufacturing semiconductor structure and plasma processing equipment |
US10879052B2 (en) | 2018-11-21 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Plasma processing apparatus and manufacturing method using the same |
TWI756584B (en) * | 2018-11-21 | 2022-03-01 | 台灣積體電路製造股份有限公司 | Methods for manufacturing semiconductor structures and plasma processing apparatus |
CN111211032B (en) * | 2018-11-21 | 2022-12-27 | 台湾积体电路制造股份有限公司 | Method for manufacturing semiconductor structure and plasma processing equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |