經濟部智慧財產局貝工消费合作社印製 419679 A7 ____B7______ 五、發明說明（/ ) 發明背景 本發明係關於負溫度係數（N T C )熱敏電阻元件。 特別是，本發明係關於具有電性導體終端焊接在在熱敏電 阻主體電極上之N T C熱敏電阻元件。 此種類型的N T C熱敏電阻元件可描述爲一個具有負 電阻係數之碟狀熱敏電阻主體，且在該主體每個製造歐姆 接觸的主要表面上具有電極*每個電極均有連接線焊接於 其上，以作爲電性導體終端，且以樹脂材料覆蓋整個熱敏 電阻主體以防備濕氣及高熱。電極通常使用銀作爲其主要 成分，如果該熱敏電阻元件係爲了抑制衝擊電流之目的， 通常使用含大量的錫或具有錫以作爲其主要成分之焊接劑 ，因爲在使用的同時會產生大量的熱量，故因此需要高阻 抗以對抗熱量。 然而，若此種具有銀作爲其主要成分之電極及錫作爲 其主要成分之焊接材料的元件放在高溫環境下一段相當長 的時間後，焊接劑內的錫成分將固相擴散至電極內，對電 極及熱敏電阻主體之間的結合有不利之影響，且導致電極 內的銀成分固相擴散至焊接劑內。因此，電極內的銀與錫 反應以產生錫化銀。將減弱電極及熱敏電阻主體之間的歐 姆接觸，且因此逐漸增加熱敏電阻元件之電阻。 當連接電線焊接到電極或在其後使用元件時，可能會 導致產生錫化銀之高溫條件。當在高溫環境下使用時，產 生錫化銀之速率將增加。當溫度超過1 4 0 °C時，此問題 變得特別明顯。 3 本&張尺度適用中國國家& (CNS)A4規格（210 X 297公釐） ------!·裝--------訂--11--! ·線 (請先M讀背面之注意事項再本買) 419679 Α7 Β7 經濟部智慧財產局貝工消费合作社印製 五、發明說明（>) 因此’當熱敏電阻元件係用在抑制衝擊電流且使用錫 成分增加之焊接材料時，將需要改良此種對抗高溫的電阻 値’且因爲電流持續地通過熱敏電阻元件，熱敏電阻元件 總是在產生熱量的情況下，故上述之問題係非常嚴重的β 當熱敏電阻元件作爲高溫感測器使用時，亦出現類似之問 題。 發明槪要 本發明之目的係提供一種能解決上述問題之N T C熱 敏電阻元件。 簡單的說’本發明係關於使用一種改良焊接劑，以使 該焊接劑將如導電連接電線的終端構件附著於N T C電阻 之電極上’以及關於終端構件本身材料成分之選擇。更詳 細地說’作爲附著終端構件至電極上之焊接劑包含錫以作 爲其主要成分，同時亦包含含量在〇 · 〇 5 - 1 . 0重量 百分比的鎳’因此當錫擴散進入銀電極內時，將可抑制鍚 化銀之產生。因爲這亦可除去鉛，而鉛傾向於對鎳抑制錫 擴散進入電極內有不利之影響，故如本發明之終端其特徵 在於包含一種不含鉛之金屬材料。如本發明之較佳實施例 ，使用包含錫、銀及鎳之焊接劑。終端構件可能包含有電 線’由金屬板製造之電線終端或終端板。若使用電線，則 最好使用銀線、銅線、鍍錫鐵線、鍍錫不鏽鋼線及鍍錫銅 線。. 圖示簡單說明 結合在且形成本說明書之一部份的附圖，係圖示本發 4 I! — * ·丨！ I I 1 I 訂-------1 _線 C請先閲讀背面之注意事項再^^本頁》 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消费合作社印製 4 J 9 6 7 9 A7 B7 五、發明說明（2) 明之實施例，且與詳細說明一起說明本發明之原理。其中 圖1係本發明具體化之N T C熱敏電阻元件之示意剖 面圖； 圖2係圖1熱敏電阻元件部分放大之示意剖面圖，以 顯示如何抑制錫之擴散；以及 圖3係如圖1所示之習知技術熱敏電阻元件結構放大 之示意剖面圖，使用傳統材料且顯示如何發生錫擴散進入 電極內β 在此處’即使是不同熱敏電阻元件之成分，相同之圖 號則標示相似或相等之成分，且無需重複描述以簡化說明 〇 較佳實施例之詳細說明 圖1顯示一個本發明具體化之N T C熱敏電阻元件， 包含一個碟狀NTC熱敏電阻主體2，該熱敏電阻主體2 具有電極3係形成在相互面對的每個主要表面上以製造歐 姆接觸。作爲電性導體終端的連接線5係個別地焊接在電 極3上’而焊接劑則標示爲圖號4。如圖1所示之實施例 ，整個結構係包圍在圍體6內部，該圍體6係由能有效對 抗熱度及濕氣之材料所製造，例如硅氧樹脂。 這些電極3之主要成分係銀。藉著焊接以附著連接線 5至霉極3之焊接材料4並非僅有錫作爲其主要成分這一 種，其特徵在於具有含量在〇 . 〇 5 _ 1 . 0重量百分比 的鎳。舉例來說’可能使用包含錫、銀及鎳之焊接劑。 5 本紙張尺度適用中國國家標準（CNS)A4規格（2〗〇χ297公釐） Ί---I -------裝·--— — — — — 訂.---— I--— _ 線 (請先W讀背面之注意事項再Ϊ本頁) 41^β79 Α7 經濟部智慧財產局員工消费合作社印製 _________Β7_二 五、發明說明（f) 藉著使用此種除了以錫作爲主要成分亦包含錬含量在 〇 · 0 5 — 1 . 0重量百分比的焊接材料，能抑制錫從焊 接材料4入侵或擴散進入電極3。因此可想到，如圖2所 不’當電線5焊接至電極3時，形成一層穩定的三元素層 或銀錫鎳層7在以錫爲主要成分的焊接材料4及銀爲主要 成分的電極3之間’藉此可抑制焊接材料4之錫的固相擴 散進入電極3。因此，對電極3及熱敏電阻主體2表面的 歐姆接觸不會有不良的影響，且能有效的減少在高溫環境 下電阻値逐漸增加的現象。若鎳成分係小於〇 . 〇 5重量 百分比，則抑制錫入侵或擴散進入電極3的效果較小。相 反的’若鎮成分超過1 . 0重量百分比，因有鎳的存在， 故抑制錫入侵或擴散進入電極3的效果仍然很大，但在焊 接劑4的表面易形成裂縫且因此從實用的觀點來看不利使 用。 本發明亦揭示，因鉛之存在而對前述鎳抑制錫入侵或 擴散之效果有不利之影響。因此，不僅在製造連接線5的 基本材料使用不含鉛金屬，其表面處理亦需使用不含鉛金 屬。本發明之連接線5最好使用銀線、銅線、鍍錫鐵線、 鍍錫不鏽鋼線及鍍錫銅線。 再者，本發明亦順便描述本發明者所進行的測試及對 照實驗。模製物體包含燒結入錳、鎳、銅、鐵、鑭、鈷及 鉻等氧化物以獲得圖1中顯示爲圖號2的NT C熱敏電阻 主體。藉著印刷技術，加上一個以銀爲主要成分之電性導 體板在這些熱敏電阻主體之表面上，且接著加熱到8 0 0 6 張尺度適用中国园家標準（CNS)A4規格（210 X 297公f LIIII—--— — — — —— - I I I--- I *-ΙΙΙΙΙ1ίΙ {請先閲婧背面之注意事項再f本頁) 4 ^679 at _B7_ 五、發明說明（ί) 至8 5 0 °C以在其上形成電極3。 (請先閱讀背面之注意事項再$本頁) 接著，準備好焊接材料4，該焊接材料4含有3 . 5 重量百分比的銀及表1所示含量的鎳，而其餘則爲錫。亦 準備如表1所示之不同種類的連接線以製造如表1所示之 樣品。 經濟部智慧財產局員工消費合作社印製 表1 樣品編號 焊接劑內鎳成 分（重量百分 比） 連接線 電阻値改變率 1* 0 鍍錫/鉛銅線 51.5% 2* 0 . 05 鑛錫/鈴銅線 12 . 2% 3* 0 . 15 鍍鍚/鉛銅線 10 . 1% 4* 0 . 3 鍍錫/鉛銅線 9.6% 5* 0.7 鑛錫/錯銅線 9 . 1% 6* 1.0 鍍錫/鉛銅線 7.8% 7 0 . 15 銀線 -0.4% 8 0 . 15 銅線 0 . 1% 9 0 . 15 鑛錫鐵線 -0.3% 10 0 . 15 鍍錫不鏽鋼線 0.1% 11* 0 鍍錫銅線 32 . 8% 12* 0 . 03 鍍錫銅線 5.7% 13 鍍錫銅線 1.3% 14 0 . 15 鍍錫銅線 0.5% 15 0.3 鑛錫銅線 0 . 2% 16 0 . 7 鏡錫銅線 0.3% 17 1.0 鏡錫銅線 0.2% 18木 1.2 鍵錫銅線 0 . 2% 每個樣品以浸漬之方式將焊接劑4加到連接線5上， 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐> 4 ^6 79 A7 B7 經濟部智慧財產局員工消费合作社印製 五、發明說明（t) 接著以再流動製成焊接這些連接線5到電極3上。接著， 熱敏電阻主體2整個浸漬入有足夠抵抗力對抗熱度及溼度 之樹脂材料內以製造樹脂圍體6，以獲得NTC熱敏電阻 元件1之樣品。在表1中’非如本發明之樣品（亦即，對 照實施例）則以星號（*)標示。 每個樣品放在1 6 0 °C之高溫環境下1 〇 〇 〇小時， 且比較放置前後之電阻値。其結果亦顯示在表1中。 樣品1 - 6係對照實施例，因其連接線使用含鉛，或 是鍍錫/鉛銅線。即使在這些對照實施例中，可見到含鎳 在◦. 0 5 — 1 _ 0重量百分比之樣品2 — 6電阻値的部 分改變量係小於不含鎳之樣品1，顯示出鎳提供抑制焊接 劑4中錫固相擴散進入電極3。 雖然，從樣品1- 6來看鎳的效果係非常明顯，但即 使是樣品6的電阻値最小改變量亦大到7 . 8 %。樣品7 一 8其特徵在於其連接線5不含任何鉛。在這些樣品中， 如本發明之樣品係樣品7 - 1 0及1 3 - 1 7，這些樣品 含有鎳成分在〇 . 0 5 - 1 . 0重量百分比的範圍內。表 1明顯地顯示出，含鎳成分在如本發明所決定範圍內的這 些樣品，其電阻値具有較小的部分改變量，在降低電阻値 改變上顯示卓越之效果。再者，樣品2 - 6與樣品7 -1 0及1 3 — 1 7之間的對照明顯地顯示，鉛在鎳所表現的 抑制錫之擴散上具有明顯地不利影響。樣品1 8則實際顯 示出，因鎳成分高於1 . 0重量百分比而造成焊接劑4表 面形成裂縫的不良影響。 8 本紙張尺度適用中國國家標準（CNS)A4规格<210 X 297公釐）~' 一 1 —I— —III — — - 1 I I I I f I ^ — — — — — — I — I <請先《讀背面之注意事項再^¾本頁) 4咖79 A7 B7 五、發明說明（^) 簡單的說，本發明需要使用一種焊接材料，該焊接材 料以錫作爲其主要成分且包含鎳含量在0 . 〇 5 — 1 . 0 重量百分比，用以附著一導電終端構件，例如以銀爲主要 成分之連接線，且即使在高溫環境下亦能抑制錫化銀之生 成，以避免熱敏電阻主體表面上對電極之歐姆接觸的不利 影響。此外，終端構件僅能以不含鉛之材料彤成，否則因 鉛的存在，將對鎳抑制錫擴散之效果有不良之影響。Printed by Shelley Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 419679 A7 ____B7______ V. Description of the Invention (/) Background of the Invention The present invention relates to a negative temperature coefficient (N T C) thermistor element. In particular, the present invention relates to an NTC thermistor element having an electrical conductor terminal welded to a thermistor main electrode. This type of NTC thermistor element can be described as a dish-shaped thermistor body with a negative resistivity, and has electrodes on each major surface of the body that makes ohmic contact. Above, it is used as an electrical conductor terminal, and the entire thermistor body is covered with a resin material to prevent moisture and high heat. The electrode usually uses silver as its main component. If the thermistor element is for the purpose of suppressing inrush current, a solder containing a large amount of tin or having tin as its main component is usually used because a large amount of Heat, so high impedance is needed to counter heat. However, if this type of electrode with silver as its main component and solder with tin as its main component is placed in a high temperature environment for a considerable period of time, the tin component in the flux will diffuse the solid phase into the electrode, It adversely affects the bonding between the electrode and the thermistor body, and causes the solid component of the silver component in the electrode to diffuse into the solder. Therefore, the silver in the electrode reacts with tin to produce silver tin. The Ohm contact between the electrode and the thermistor body will be weakened, and therefore the resistance of the thermistor element will gradually increase. When connecting wires are soldered to electrodes or components are used afterwards, high temperature conditions of silver tin may result. When used in high temperature environments, the rate of silver tin production will increase. This problem becomes particularly noticeable when the temperature exceeds 140 ° C. 3 This & Zhang scale is applicable to China & (CNS) A4 specifications (210 X 297 mm) ------! · Installation -------- Order--11--! · Line ( Please read the precautions on the back before buying this) 419679 Α7 Β7 Printed by Shelley Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (>) Therefore 'When the thermistor element is used to suppress the inrush current and use tin When welding materials with increased composition, this type of resistance to high temperatures will need to be improved, and because the current continues to flow through the thermistor element, the thermistor element always generates heat, so the above problems are very serious. β Similar problems occur when the thermistor element is used as a high-temperature sensor. SUMMARY OF THE INVENTION The object of the present invention is to provide an NTC thermistor element capable of solving the above problems. In short, the present invention relates to the use of an improved solder so that the solder attaches a terminal member such as a conductive connection wire to an electrode of a NTC resistor, and a choice of material composition of the terminal member itself. In more detail, 'the solder as an attachment terminal member to the electrode contains tin as its main component, and also contains nickel in a content of 0.05-1.0 weight percent', so when tin diffuses into the silver electrode Will inhibit the generation of tritium silver. Because this also removes lead, which tends to have an adverse effect on nickel's inhibition of tin diffusion into the electrode, the terminal of the present invention is characterized by containing a lead-free metal material. As in the preferred embodiment of the present invention, a solder containing tin, silver, and nickel is used. The terminal member may include a wire ' wire terminal or terminal board made of a metal plate. If electric wires are used, silver wires, copper wires, tin-plated iron wires, tin-plated stainless steel wires, and tin-plated copper wires are preferred. Brief Description of the Drawings The accompanying drawings, which form a part of this specification, illustrate the present invention. 4 I! — * · 丨! II 1 I Order ------- 1 _ Line C, please read the notes on the back before ^^ This page "This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Wisdom of the Ministry of Economic Affairs 4 J 9 6 7 9 A7 B7 printed by the Property Cooperative Consumer Cooperative V. Description of the Invention (2) The embodiment described, and the principle of the invention will be explained together with the detailed description. Among them, FIG. 1 is a schematic sectional view of an NTC thermistor element embodying the present invention; FIG. 2 is a partially enlarged schematic sectional view of the thermistor element of FIG. 1 to show how to suppress the diffusion of tin; The conventional technology shown is a schematic enlarged sectional view of the thermistor element structure, using traditional materials and showing how tin diffusion occurs into the electrode. Β Here, even if the composition of different thermistor elements, the same figure number is indicated Similar or equivalent components, and no need to repeat the description to simplify the description. Detailed description of the preferred embodiment FIG. 1 shows an NTC thermistor element embodying the present invention, which includes a disc-shaped NTC thermistor body 2, the thermistor The resistor body 2 has electrodes 3 formed on each of the major surfaces facing each other to make an ohmic contact. The connecting wire 5 as the terminal of the electrical conductor is individually soldered to the electrode 3 'and the soldering flux is indicated by drawing number 4. As shown in the embodiment shown in FIG. 1, the entire structure is enclosed inside a surrounding body 6, which is made of a material that can effectively resist heat and moisture, such as silicone resin. The main component of these electrodes 3 is silver. The soldering material 4 to which the connecting wire 5 is attached to the mold pole 3 by welding is not only tin as its main component, but is characterized by having a content of 0.5 wt.% Nickel. For example, 'it is possible to use a solder containing tin, silver and nickel. 5 This paper size applies to China National Standard (CNS) A4 specifications (2〗 〇χ297mm) Ί --- I ------- -------order. --- -— _ line (please read the precautions on the back before clicking this page) 41 ^ β79 Α7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs _________ Β7_25. Description of the Invention (f) By using this type in addition to Tin as a main component also contains a solder material with a rhenium content of 0.05-1.0 weight percent, which can inhibit tin from invading or diffusing into the electrode 3 from the solder material 4. Therefore, it is conceivable that when the wire 5 is soldered to the electrode 3, a stable three-element layer or a silver-tin-nickel layer 7 is formed. In the solder material 4 mainly composed of tin and the electrode 3 mainly composed of silver In between, the solid phase diffusion of tin in the solder material 4 can be suppressed from entering the electrode 3. Therefore, the ohmic contact on the surface of the electrode 3 and the thermistor body 2 will not have an adverse effect, and it can effectively reduce the phenomenon that the resistance 値 gradually increases in a high temperature environment. If the nickel component is less than 0.05 weight percent, the effect of suppressing tin invasion or diffusion into the electrode 3 is small. On the contrary, if the composition of the town exceeds 1.0% by weight, the effect of suppressing tin invasion or diffusion into the electrode 3 is still great due to the presence of nickel, but cracks are easily formed on the surface of the solder 4 and therefore from a practical point of view Look at unfavorable use. The present invention also reveals that the presence of lead adversely affects the aforementioned nickel's effect of inhibiting tin invasion or diffusion. Therefore, not only the lead-free metal is used as the basic material for manufacturing the connecting wire 5, but the lead-free metal is also required for the surface treatment. The connecting wire 5 of the present invention is preferably a silver wire, a copper wire, a tin-plated iron wire, a tin-plated stainless steel wire, or a tin-plated copper wire. In addition, the present invention also describes the tests and control experiments performed by the inventor by the way. The molded object contains sintered oxides such as manganese, nickel, copper, iron, lanthanum, cobalt, and chromium to obtain an NT C thermistor body shown in Fig. 1 as Fig. 2. By printing technology, an electrical conductor plate with silver as the main component is added to the surface of these thermistor bodies, and then heated to 8 0 6 scales applicable to China Garden Standard (CNS) A4 specifications (210 X 297 Male f LIIII ---------II I --- I * -ΙΙΙΙΙΙ1ίΙ {Please read the precautions on the back of Jing before f this page) 4 ^ 679 at _B7_ V. Description of the Invention (ί) To 8 5 0 ° C to form electrode 3 thereon. (Please read the precautions on the back of this page before $ this page.) Next, prepare the solder material 4, which contains 3.5 weight percent of silver and nickel as shown in Table 1, and the rest is tin. Different kinds of connecting wires as shown in Table 1 were also prepared to make samples as shown in Table 1. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Table 1 Sample No. Nickel composition in the solder (percentage by weight) Connection line resistance 値 Change rate 1 * 0 Tin / lead copper wire 51.5% 2 * 0. 05 Ore tin / bell copper Wire 12. 2% 3 * 0. 15 hafnium / lead copper wire 10. 1% 4 * 0. 3 tin / lead copper wire 9.6% 5 * 0.7 mineral tin / copper wire 9. 1% 6 * 1.0 tin plating / Lead copper wire 7.8% 7 0. 15 silver wire -0.4% 8 0. 15 copper wire 0.1 .1% 9 0. 15 ore tin iron wire -0.3% 10 0. 15 tinned stainless steel wire 0.1% 11 * 0 plating Tin-copper wire 32 .8% 12 * 0. 03 Tin-plated copper wire 5.7% 13 Tin-plated copper wire 1.3% 14 0. 15 Tin-plated copper wire 0.5% 15 0.3 Mineral tin-copper wire 0.2 .1% 16 0. 7 Mirror Tin-copper wire 0.3% 17 1.0 Mirror tin-copper wire 0.2% 18 Wood 1.2-key tin-copper wire 0.2% For each sample, solder 4 is added to the connecting wire 5 by dipping. The paper size applies to Chinese national standards ( CNS) A4 specification (210 * 297 mm > 4 ^ 6 79 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (t) Then the connection wires 5 are welded to the electrode 3 by reflow. Next, the thermistor body 2 Samples were impregnated into a resin material having sufficient resistance to heat and humidity to make a resin enclosure 6 to obtain a sample of the NTC thermistor element 1. In Table 1, a sample that is not as good as the present invention (that is, a control implementation) Example) are marked with an asterisk (*). Each sample is placed in a high temperature environment at 160 ° C for 1000 hours, and the resistance before and after the comparison is compared. The results are also shown in Table 1. Sample 1- The 6 series comparative examples use lead-containing or tin-plated / lead copper wires as the connecting wires. Even in these comparative examples, it can be seen that nickel contains ◦. 0 5 — 1 _ 0 weight percent of the sample 2 — The resistance change of 6 値 is smaller than that of sample 1 which does not contain nickel, showing that nickel provides the inhibition of the solid-phase diffusion of tin in the solder 4 into the electrode 3. Although the effect of nickel is very obvious from samples 1-6, Even the smallest change in the resistance 样品 of sample 6 is as large as 7.8%. Samples 7 to 8 are characterized in that the connecting wire 5 does not contain any lead. Among these samples, the sample of the present invention is sample 7-1 0 And 1 3-17, these samples contain nickel components in the 0.05 to 1.0 weight Within percent. Table 1 clearly shows that, in these nickel-containing component within the sample as determined by the scope of the present invention, which has a smaller resistance Zhi portion change amount, showed excellent effect of reducing the resistance change Zhi. In addition, the comparison between samples 2-6 and samples 7-10 and 1 3-1 7 clearly shows that lead has a significant adverse effect on the inhibition of tin diffusion as shown by nickel. Sample 18 actually showed the adverse effect of the formation of cracks on the surface of flux 4 due to the nickel content higher than 1.0 weight percent. 8 This paper size applies to China National Standard (CNS) A4 specifications < 210 X 297 mm) ~ '1 1 —I — —III — —-1 IIII f I ^ — — — — — — I — I < Please "Precautions for reading the back side first ^ ¾ page) 4 Coffee 79 A7 B7 V. Description of the Invention (^) In short, the present invention requires the use of a soldering material with tin as its main component and containing nickel content In the range of 0.05 to 1.0 weight percent, it is used to attach a conductive terminal member, such as a connection cable with silver as the main component, and can inhibit the generation of silver tin, even in high temperature environments, to avoid thermistors. Adverse effects on the ohmic contact of the electrodes on the surface of the body. In addition, the terminal member can only be made of lead-free material, otherwise the presence of lead will adversely affect the effect of nickel in suppressing tin diffusion.
本揭示內容想要廣泛地解釋。應瞭解到，此名詞 >主 要成分〃意指成分係至少5 0重量百分比，C然嚿注 ，在測試樣品中，錫之成分達9 5重量百分比耳 J (請先閱讀背面之注意事項再铲λ本買) t *. 經濟部智慧財產局員工消f合作杜印製 本紙張尺度適用中困國家標準（CNSJA4規格（210 X 297公« )This disclosure is intended to be broadly explained. It should be understood that the term "main ingredient" means that the composition is at least 50 weight percent. However, note that in the test sample, the tin content reached 9 5 weight percent. J (Please read the precautions on the back first. Shovel λ this buy) t *. The staff of the Intellectual Property Bureau of the Ministry of Economic Affairs cooperated with Du Du to print this paper. The paper standard is applicable to the national standard (CNSJA4 specification (210 X 297 male «)