經濟部智慧財產局員工消費合作社印製 411292 A7 4953twf. doc/008 B7 五、發明説明（i ) 本發明是有關於一種用於化學機械硏磨（Chemical Mechanical Polishing，CMP)製程之裝置，且特別是有關於 一種硏號(slurry)供應緩衝裝置。 當前半導體製造爲因應電子器材之工作速度，已進入 .至深次微米(Deep Sub-Micron)的製程，而在此製程中，因 晶片尺寸的縮小、微影（Photo Lithography)儀器的景深 (Depth of Focus)愈來愈小以及多重金屬內連線(Multi-Level Metal Interconnect，MLM)製程堆積的層數愈來愈多，晶 片在製造過程中如何維持良好的平坦度(Planarization)變成 是一個重要的課題。 在半導體還未進入深次微米的製程時，旋塗式玻璃 (Spin-On Glass，SOG)製程是晶片平坦化主要的方法，但 此種方式僅能使晶片在區域性(Local)的地方維持平坦的效 果，並不能使整片晶片處在一個全面性（Global)平坦的情 形’使得在微影製程中因曝光機(Expose)本身的限制而造 成顯影情形不良的情形，以及在蝕刻（Etch)過程中容易造 成終點(End Point)偵測的訊號錯誤’而導致晶片良率(Yieid) 的降低，因此在進入深次微米的製程時，晶片的平坦化就 依賴化學機械硏磨（Chemical Mechanical Polishing，CMP) 製程來完成，其主要原因乃化學機械硏磨技術提供了晶片 良好的全面性平坦化的效果，也因此化學機械硏磨技術成 了深次微米製程中一個不可或缺的技術。 在化學機械硏磨製程中，硏漿是其中一種極爲重要的 材料’由於晶片在硏磨過程中是利用硏漿與晶片表面的接 __ 3 本紙張+國國家樣芈（CNS)从祕（21GX297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 -! 經濟部智慧財產局員工消費合作社印製 411^92 伙嵐d〇c舰 A7 ' _B7__ 五、發明説明（> ) 觸而達到其所硏磨的目的，因此硏漿的供應對化學機械硏 磨製程具有決定性的影響。 傳統之化學機械硏磨裝置直接將硏漿供應系統連接於 化學機械硏磨機台，往往因爲硏漿供應系統的故障，導致 化學機械硏磨機台必須跟著停機，造成連續的化學機械硏 磨製程的中斷，因而使得產能降低。 請參照第1圖，雖然習知在硏漿供應系統110與化學 機械硏磨機台150之間，配置硏漿緩衝槽（slurry buffer tank)130，藉以在硏漿供應系統110故障時，硏漿緩衝槽 130繼續供應硏漿至化學機械硏磨機台150,使化學機械 硏磨機台150仍可繼續工作，同時有緩衝時間可修復硏漿 供應系統110。 然而，當硏漿供應系統Π0停止供應硏漿而無警訊時， 常常會有硏漿緩衝槽130打空而無硏漿輸出之情形，使得 晶片在無硏漿的狀態下硏磨，造成晶片的報廢。 因此本發明提供一種硏漿供應緩衝裝置，可偵測硏漿 緩衝槽內硏漿之液面高度，藉以控制硏漿的輸入’並且當 硏漿之液面高度太低，可自動發出警訊，避免無硏漿輸出 之情形發生。 本發明提供一種硏漿供應緩衝裝置，至少包括.：一硏 漿緩衝槽，連接於一化學機械硏磨機台及一硏漿供應系統 之間，用以盛裝來自硏漿供應系統之硏漿’且輸出硏漿至 化學機械硏磨機台；一控制開關’配接於硏漿供應系統及 硏漿緩衝槽之間，由控制開關之開關狀態’控制硏漿供應 4 ^^1- ^—1» 0 -I - I I ijn —1ί :-1! (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家揉隼（CNS ) Α4規格{ 210X297公釐） 經濟部智慧財產局員工消費合作社印製 411S92 Ll f 4953 t wf.doc/008 ______B7__ 五、發明説明（}) 系統之硏漿是否輸入至硏漿緩衝槽：以及一液面偵測器， 用以偵測硏漿緩衝槽內之硏漿的液面位置，藉以決定控制 開關之開關狀態，來控制硏漿的輸入，並且避免硏漿緩衝 槽打空而無硏漿輸出之情形發生。 液面偵測器比如是使用一定壓氣體供應裝置及一壓力 感測器。定壓氣體供應裝置用以輸入一定壓之氣體至硏漿 緩衝槽，而壓力感測器用以偵測硏槳緩衝槽內之氣體壓 力’藉以判斷硏漿緩衝槽內之硏漿的液面位置，並且傳送 控制訊號至控制開關，藉以決定控制開關之開關狀態。使 用定壓氣體供應裝置及壓力感測器偵測硏漿之液面位置， 具有較佳之感測度，可迅速且正確地提供硏漿的液面位 置。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 圖式之簡單說明： 第1圖是繪示習知之硏漿緩衝槽，其與硏磨機台及硏 漿供應系統之連接關係示意圖； 第2圖是繪示依照本發明一較佳實施例之硏漿供應緩 衝裝置，其與硏磨機台及硏磨液供應系統之連接關係示意 圖；以及 第3圖是繪示依照本發明一較佳實施例之硏漿供應緩 衝裝置，其詳細之配置示意圖。 圖式之標記說明： 5 {請先閲讀背面之注$項再填寫本頁) _訂- f 本紙張尺度適用中國國家標準（CNS ) A4规格（210XW7公釐） 經濟部智慧財產局員工消費合作社印製 49541擔桃 E 五、發明説明) 100 :化學機械硏磨裝置 110 :硏漿供應系統 122 :管路 130 :硏漿緩衝槽 142 :管路 143 :幫浦 144 :管路 146 :管路 M8 :三向閥 150 ‘·化學機械硏磨機台 2〇〇 :硏漿供應緩衝裝置 210:硏漿緩衝槽 212 :緩衝槽容器 214 :硏漿 216 :液面 218 :氣體 220 :液面偵測器 222 :定壓氣體供應裝置 224 :壓力感測器 230 :控制開關 232 :閥門 234 :啓動裝置 300 :中央控制系統 較佳實施例 - I ^n. n n In n^i - - - i. n L---- r (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 么⑽8 經濟部智慧財產局員工消費合作社印製 D / 五、發明説明（〇 請參照第2圖，其繪示依照本發明一較佳實施例之硏 漿供應緩衝裝置，其與硏磨機台及硏磨液供應系統之連接 關係示意圖。在第2圖中，以硏漿供應緩衝裝置200，連 接於硏漿供應裝置Π0與化學機械硏磨機台150之間，取 代傳統之硏漿緩衝槽。 仍參照第2圖’硏漿供應緩衝裝置200包括硏漿緩衝 槽210、液面偵測器220、以及控制開關230。其中，硏漿 緩衝槽210連接於硏漿供應系統U0及化學機械硏磨機台 150之間，用以盛裝來自硏漿供應系統110之硏漿，且輸 出硏漿緩衝槽210內之硏漿至化學機械硏磨機台150供其 進行硏磨。 控制開關230配接於硏漿供應系統11〇及硏漿緩衝槽 210之間的管路上，或是直接配置於硏漿緩衝槽210之入 口，由控制開關230之開關狀態，控制決定硏漿供應系統 110所提供之硏漿，是否經由管路輸入至硏漿緩衝槽210。 也就是說，當控制開關230在"開"的狀態時，硏漿經過控 制開關230流入硏漿緩衝槽210，當控制開關230在”關” 的狀態時，則無硏漿流入硏漿緩衝槽210內。 液面偵測器220用以偵測硏漿緩衝槽210內之硏漿的 液面位置’並且由偵測之液面位置的高低，經由機械傳送 或是電訊傳送控制訊號至控制開關230,藉以決定控制開 關230之開關狀態，來控制硏漿是否輸入硏漿緩衝槽210。 藉由液面偵測器22〇偵測硏漿的液面位置，並且依據液面 位置控制硏漿的輸入，可達到自動回饋控制之效果。 7 本紙張尺度適用中關緖準（C^S )八4祕（21GX297公釐) ----------装---；--訂------戈 Μ - (請先閲讀背面之注意事項再填寫本頁) ^4T53fwf.docy doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（d) 另外*當液面偵測器220偵測到硏漿之液面水平位置 低於一定程度時’可傳送警告訊號至中央控制系統，停止 化學機械硏磨機台150的工作，避免晶片在無硏漿的狀態 下硏磨，造成晶片的報廢。 .實施例1 請參照第3圖，其繪示關於第2圖之一實施例，其爲 詳細之配置示意圖，請同時參照第2圖作爲對照。 化學機械硏磨裝置100中，硏漿供應系統110提供硏 漿經由管路I22輸送至硏漿緩衝槽210。硏漿緩衝槽210 由一密閉容器212所構成，形狀比如爲圓柱型，其尺寸比 如直徑約爲80cm，高約爲I〇〇cm，內部盛裝用作緩衝之 硏漿214，其餘爲氣體218。 在硏漿緩衝槽210上配置液面偵測器220，藉以偵測 硏漿緩衝槽210內硏漿214之液面位置216。液面偵測器 22〇比如由定壓氣體輸入裝置222及壓力感測器224所構 成。定壓氣體輸入裝置222比如是經由直徑1mm之細管， 通入壓力約爲lkg/cm2之氮氣(N2)至硏漿緩衝槽210中。 然後再藉由壓力感測器224偵測硏漿緩衝槽210中氣體218 之壓力，藉以判定硏漿之液面位置216的高低。使用定壓 氣體供應裝置222及壓力感測器224偵測硏漿之液面位置 216，具有較佳之感測度，可迅速且正確地提供硏漿的液 面位置。 當液面位置216維持固定時，壓力感測器216偵測到 固定之壓力，當液面位置216下降時’氣體218之空間隨 8 t- fin m ^—rf ^^^^1 (请先閲讀背面之注項再填寫本頁) 本紙張尺度適用中國國家標準（CNS > A4規格（2丨0X297公釐） 4953twf.d〇c/008 經濟部智慧財產局員工消費合作社印製 五、發明説明（)） 之增加，故壓力感測器224偵測到的壓力隨之下降。反之， 呈液面位置216上升時’壓力感測器224偵測到的壓力隨 之上升。因此’由壓力感測器224偵測到的壓力可判斷出 液面位置216之高低。並且，壓力感測器224將偵測的壓 力轉換成訊號分別傳送至控制開關230及中央控制系統 300 ’或是直接傳送至中央控制系統3〇〇，再由中央控制系 統300傳送控制訊號至控制開關230。 控制開關230配接於管路122中或是硏漿緩衝槽210 之入口。由控制開關230之開關狀態，控制從硏槳供應系 統11〇所提供之硏漿是否輸入至硏發緩衝槽21〇。控制開 關230比如是由閥門232及啓動裝置234所構成。啓動裝 置234接收傳自壓力感測器224之控制訊號，控制閥門232 之開關狀態。當啓動裝置234接收"開啓"之控制訊號，即 打開閥門232，使硏漿流入硏漿緩衝槽210。反之，當接 收"關閉"之控制訊號，即關閉閥門232，使硏漿無法流入 硏漿緩衝槽210。 硏漿緩衝槽210內之硏漿214管路輸出至化學機械硏 磨機台150，其間管路之配接比如是圖中所示。硏漿214 藉由幫浦143抽送，經過管路142、三向閥148及管路146， 進入化學機械硏磨機台150。另一管路144從三向閥14S 連接回硏漿緩衝槽210中。藉由三向閥M8決定硏漿2H 輸出至化學機械硏磨機台150或送回硏漿緩衝槽21〇。 當壓力感測器224偵測到硏漿緩衝槽21〇內硏漿2!4 之液面位置216位於設定之標準高度時’傳送"關閉"控制 9 本紙張尺度適用中國國家橾準（CNS ) A4规格（210X297公釐） —^1 ί -- I- - n n—P I -- 1 1^1 -- — I! - L*— -q *- (請先閲讀背面之注意事項再填寫本ί ) A7 B7 4HS92 4953twf.d〇c/〇〇8 五、發明説明（γ) 訊號至啓動裝置234，關閉閥門232，停止輸送硏漿至硏 漿緩衝槽210。當硏漿緩衝槽21〇內之硏漿2 Η輸出至化 學機械硏磨機台150時，硏漿214之液面位置216隨之下 降’比如設定當液面位置216下降至標準高度之四分之三 時’壓力感測器傳送”開啓，《控制訊號至啓動裝置234 ’打 開閥門232 ’使硏漿輸入硏發緩衝槽210中，回復液面位 置216至標準高度，再關閉閥門232。若液面位置216失 去控制’比如壓力感測器224偵測到液面位置216降至標 準局度之二分之一時，則壓力感測器224傳送警告訊號至 中央控制系統3〇0 ’促使維修人員緊急進行修復，而在此 同時’化學機械硏磨機台150仍有緩衝時間繼續運作。藉 由壓力感測器224偵測硏漿的液面位置216 ,並且依據液 面位置216來控制硏漿的輸入，可藉以達到自動回饋控制 之效果。 由上述本發明較佳實施例可知，應用本發明之硏漿供 應緩衝裝置，（1)可在硏漿供應系統發生故障時，能有足夠 之緩衝時間’進行故障排除。（2)藉由液面偵測器偵測硏漿 緩衝器內硏漿之液面高度，一方面可藉以控制硏漿的輸 入，達到自動回饋控制，而另一方面可在液面高度太低時， 發出警告訊號’避免無硏漿輸出之情形發生而造成晶片的 報廢。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明’任何熟習此技藝者，在不脫離本發明之精 神和範圍內’當可作各種之更動與潤飾，因此本發明之保 H 1 · ----------浪— * · (請先閲讀背面之注項再填寫本頁) 訂 經濟部智慧財產局员工消費合作社印製 本紙張尺度適用中困®家橾牟（CNS ) A4規格（210X297公釐） 411S92 A7 49S3twfd〇C/〇〇S_B7_ 五、發明説明（1 ) 護範圍當視後附之申請專利範圍所界定者爲準。 經濟部智慧財是局員工消资合作社印製 HI ^fn t^n 1^1 I ^^^1 1^1 — m· 0 、V3 * , (請先閏讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家揉準（CNS ) A4规格（210X297公釐）Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 411292 A7 4953twf. Doc / 008 B7 V. Description of the Invention (i) The present invention relates to a device for chemical mechanical polishing (CMP) process, and it is particularly It is about a slurry supply buffer device. The current semiconductor manufacturing has entered into the process of Deep Sub-Micron in response to the working speed of electronic equipment. In this process, due to the reduction in chip size, the depth of field of the Photo Lithography instrument (Depth) of Focus) is getting smaller and smaller and the number of layers stacked in the Multi-Level Metal Interconnect (MLM) process is increasing. How to maintain good planarity of the chip during the manufacturing process becomes an important issue. Subject. When the semiconductor has not yet entered the deep sub-micron process, the spin-on glass (SOG) process is the main method for wafer planarization, but this method can only maintain the wafer in a local area. The flat effect does not make the whole wafer in a global (flat) situation. This makes the development situation bad due to the limitations of the exposure machine (Expose) in the lithography process, and the etching (Etch) ) In the process, it is easy to cause the end point detection signal to be wrong, which leads to the decrease of the yield of the wafer. Therefore, when entering the deep sub-micron process, the planarization of the wafer depends on chemical mechanical honing. Polishing (CMP) process. The main reason is that chemical mechanical honing technology provides a good overall planarization effect of the wafer. Therefore, chemical mechanical honing technology has become an indispensable technology in deep sub-micron processes. In the chemical mechanical honing process, honing paste is one of the extremely important materials. 'Because the wafer is used in the honing process, the pulp is connected to the wafer surface. _ 3 This paper + National Samples (CNS) from the secret ( 21GX297 mm) (Please read the notes on the back before filling out this page) Order-! Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 411 ^ 92 Huolan doocc A7' _B7__ V. Description of the invention (>) It has achieved its purpose of honing, so the supply of honing slurry has a decisive influence on the chemical mechanical honing process. The traditional chemical mechanical honing device directly connects the chemical pulp honing system to the chemical mechanical honing machine. Often due to the failure of the chemical pulp honing system, the chemical mechanical honing machine must be stopped accordingly, resulting in a continuous chemical mechanical honing process. Disruption, which reduces production capacity. Please refer to FIG. 1. Although it is conventional to configure a slurry buffer tank 130 between the slurry supply system 110 and the chemical mechanical honing machine table 150, when the slurry supply system 110 fails, the slurry The buffer tank 130 continues to supply the honing slurry to the chemical mechanical honing machine table 150, so that the chemical mechanical honing machine table 150 can continue to work, and at the same time, there is a buffer time to repair the honing slurry supply system 110. However, when the pulp supply system Π0 stops supplying pulp without warning, there are often situations where the pulp buffer tank 130 is empty without pulp output, causing the wafer to be honed in a pulp-free state, resulting in wafers. Scrapped. Therefore, the present invention provides a slurry supply buffer device, which can detect the liquid level of the slurry in the slurry buffer tank, thereby controlling the input of the slurry, and when the liquid level of the slurry is too low, a warning signal can be automatically issued. Avoid situations where there is no pulp output. The present invention provides a slurry supply buffer device, which at least includes: a slurry buffer tank connected between a chemical mechanical honing machine table and a slurry supply system for holding the slurry from the slurry supply system ' And output the pulp to the chemical mechanical honing machine table; a control switch 'matched between the pulp supply system and the pulp buffer tank, the switch state of the control switch' controls the pulp supply 4 ^^ 1- ^ -1 »0 -I-II ijn —1ί: -1! (Please read the notes on the back before filling out this page) This paper size is applicable to China National Standards (CNS) Α4 specifications {210X297 mm) Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the consumer cooperative 411S92 Ll f 4953 t wf.doc / 008 ______B7__ V. Description of the invention (}) Whether the pulp of the system is input to the pulp buffer tank: and a liquid level detector for detecting the pulp buffer tank The position of the liquid level in the slurry is used to determine the switch state of the control switch to control the input of the slurry and avoid the situation where the slurry buffer tank is empty without the output of the slurry. The liquid level detector uses, for example, a constant-pressure gas supply device and a pressure sensor. The constant pressure gas supply device is used to input a certain pressure of gas to the slurry buffer tank, and the pressure sensor is used to detect the gas pressure in the blade paddle buffer tank to determine the liquid level position of the slurry in the slurry buffer tank. In addition, a control signal is transmitted to the control switch to determine the switching state of the control switch. The constant-pressure gas supply device and pressure sensor are used to detect the liquid level position of the slurry, which has a better sensing degree and can quickly and correctly provide the liquid level position of the slurry. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings for detailed description as follows: Brief description of the drawings: FIG. 1 It is a schematic diagram showing the connection relationship between the conventional pulp buffer tank, the honing machine table and the pulp supply system; FIG. 2 is a diagram illustrating a pulp supply buffer device according to a preferred embodiment of the present invention, and A schematic diagram of the connection relationship between the mill table and the honing liquid supply system; and FIG. 3 is a detailed configuration diagram of a pulp supply buffer device according to a preferred embodiment of the present invention. Explanation of the mark of the drawing: 5 {Please read the note on the back before filling in this page) _ order-f This paper size is applicable to China National Standard (CNS) A4 specification (210XW7mm) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 49541 Dan Tao E printed 5. Description of the invention 100: Chemical mechanical honing device 110: Pulp supply system 122: Piping 130: Pulp buffer tank 142: Piping 143: Pump 144: Piping 146: Piping M8: Three-way valve 150 '· Chemical mechanical honing machine table 200: Pulp supply buffer device 210: Pulp buffer tank 212: Bulk tank container 214: Pulp 216: Liquid surface 218: Gas 220: Liquid surface detection Detector 222: Constant pressure gas supply device 224: Pressure sensor 230: Control switch 232: Valve 234: Starting device 300: Central control system preferred embodiment-I ^ n. Nn In n ^ i---i. n L ---- r (Please read the notes on the back before filling in this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210X297 mm)? 8 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs D / 5. Description of the invention (Please refer to FIG. 2, which shows a comparison according to the present invention. The schematic diagram of the connection relationship between the pulp supply buffer device and the honing machine table and the honing liquid supply system of the preferred embodiment. In the second figure, the pulp supply buffer device 200 is connected to the pulp supply device Π0 and the chemical The mechanical honing machine table 150 replaces the traditional paddle buffer tank. Still referring to FIG. 2 'the paddle supply buffer device 200 includes a paddle buffer tank 210, a liquid level detector 220, and a control switch 230. Among them, The pulp buffer tank 210 is connected between the pulp supply system U0 and the chemical mechanical honing machine table 150 to hold the pulp from the pulp supply system 110 and output the pulp in the pulp buffer tank 210 to the chemical machinery. The honing machine table 150 is used for honing. The control switch 230 is connected to the pipeline between the pulp supply system 11 and the pulp buffer tank 210, or is directly arranged at the entrance of the pulp buffer tank 210, which is controlled by the control. The switch state of the switch 230 controls whether or not the pulp provided by the pulp supply system 110 is input to the pulp buffer tank 210 through the pipeline. That is, when the control switch 230 is in the "on" state, Pulp through control switch 230 flows into the mortar buffer tank 210, and when the control switch 230 is in the "off" state, no mortar flows into the mortar buffer tank 210. The liquid level detector 220 is used to detect the water in the mortar buffer tank 210. The liquid level position of the pulp 'and the detected liquid level position transmit the control signal to the control switch 230 through mechanical transmission or telecommunication, so as to determine the switch state of the control switch 230 to control whether the pulp is input into the pulp buffer tank. 210. The liquid level detector 22 detects the liquid level position of the slurry and controls the input of the slurry based on the liquid level position to achieve the effect of automatic feedback control. 7 This paper size applies to Zhong Guanxu Zhun (C ^ S) Eighty Four Secrets (21GX297 mm) ---------- install ---;-order --- Ge M-( Please read the notes on the back before filling this page) ^ 4T53fwf.docy doc / 008 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (d) In addition * When the liquid level detector 220 detects When the horizontal position of the slurry level is lower than a certain level, a warning signal can be transmitted to the central control system to stop the operation of the chemical mechanical honing machine table 150 to avoid wafer honing in the state without slurry, resulting in wafer scrap. Embodiment 1 Please refer to FIG. 3, which shows an embodiment related to FIG. 2, which is a detailed configuration diagram. Please refer to FIG. 2 for comparison. In the chemical mechanical honing apparatus 100, the pulp supply system 110 provides the pulp to be conveyed to the pulp buffer tank 210 via the pipeline I22. The mortar buffer tank 210 is composed of a closed container 212, and the shape is, for example, cylindrical. Its size is, for example, about 80 cm in diameter and about 100 cm in height. The mortar 214 is used for buffering, and the rest is gas 218. A liquid level detector 220 is arranged on the mortar buffer tank 210 to detect the liquid level position 216 of the mortar 214 in the mortar buffer tank 210. The liquid level detector 22 is composed of a constant pressure gas input device 222 and a pressure sensor 224, for example. The constant-pressure gas input device 222 is, for example, a nitrogen tube (N2) having a pressure of about 1 kg / cm2 through a thin tube having a diameter of 1 mm, and is passed into the pulp buffer tank 210. Then, the pressure of the gas 218 in the pulp buffer tank 210 is detected by the pressure sensor 224 to determine the level of the liquid level position 216 of the pulp. The constant pressure gas supply device 222 and the pressure sensor 224 are used to detect the liquid level position 216 of the slurry, which has a better sensing degree and can quickly and accurately provide the liquid level position of the slurry. When the liquid level position 216 remains fixed, the pressure sensor 216 detects a fixed pressure. When the liquid level position 216 drops, the space of 'gas 218 follows 8 t-fin m ^ —rf ^^^^ 1 (please first Read the note on the back and fill in this page) This paper size applies to Chinese national standards (CNS > A4 size (2 丨 0X297 mm) 4953twf.d〇c / 008 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Note ()) increases, so the pressure detected by the pressure sensor 224 decreases accordingly. Conversely, when the liquid level position 216 rises, the pressure detected by the 'pressure sensor 224 rises accordingly. Therefore, the pressure detected by the pressure sensor 224 can determine the level of the liquid level position 216. In addition, the pressure sensor 224 converts the detected pressure into signals and transmits them to the control switch 230 and the central control system 300 ′ or directly to the central control system 300, and then the central control system 300 transmits the control signals to the control. Switch 230. The control switch 230 is connected to the pipeline 122 or the entrance of the pulp buffer tank 210. The switch state of the control switch 230 controls whether the slurry supplied from the propeller supply system 110 is input to the burst buffer tank 21. The control switch 230 is constituted by a valve 232 and an activation device 234, for example. The starting device 234 receives a control signal from the pressure sensor 224 and controls the opening and closing status of the valve 232. When the activation device 234 receives the "open" control signal, it opens the valve 232 to allow the pulp to flow into the pulp buffer tank 210. On the other hand, when receiving the "close" control signal, the valve 232 is closed, so that the pulp cannot flow into the pulp buffer tank 210. The slurry 214 pipeline in the slurry buffer tank 210 is output to the chemical mechanical honing mill table 150, and the connection of the pipeline is shown in the figure, for example. The slurry 214 is pumped through the pump 143, passes through the pipeline 142, the three-way valve 148, and the pipeline 146, and enters the chemical mechanical honing machine table 150. The other line 144 is connected from the three-way valve 14S back to the pulp buffer tank 210. The three-way valve M8 determines whether the slurry 2H is output to the chemical mechanical honing machine table 150 or returned to the slurry buffer tank 21o. When the pressure sensor 224 detects that the liquid level position 216 of the pulp slurry 2! 4 in the pulp buffer tank 21 is at the set standard height, 'Transfer " Close " Control 9 This paper size is applicable to the Chinese national standard ( CNS) A4 specification (210X297 mm) — ^ 1 ί-I--nn—PI-1 1 ^ 1-— I!-L * — -q *-(Please read the notes on the back before filling (This document) A7 B7 4HS92 4953twf.doc / 〇〇8 V. Description of the invention (γ) Signal to start device 234, close valve 232, stop conveying pulp to pulp buffer tank 210. When the mortar 2 in the mortar buffer tank 21 is output to the chemical mechanical honing machine 150, the liquid level position 216 of the mortar 214 is lowered accordingly. For example, when the liquid level position 216 is lowered to a quarter of the standard height At three o'clock, the “pressure sensor transmission” is turned on, and the “control signal to the starting device 234 'open valve 232' causes the slurry to be input into the burst buffer tank 210, returns the liquid level position 216 to a standard height, and then closes the valve 232. The liquid level position 216 is out of control. 'For example, when the pressure sensor 224 detects that the liquid level position 216 has dropped to one-half of the standard level, the pressure sensor 224 sends a warning signal to the central control system 300. Maintenance personnel perform emergency repairs, and at the same time, the chemical mechanical honing machine table 150 still has a buffer time to continue to operate. The liquid level position 216 of the slurry is detected by the pressure sensor 224, and controlled based on the liquid level position 216 The input of pulp can achieve the effect of automatic feedback control. From the above-mentioned preferred embodiments of the present invention, it can be known that the application of the pulp supply buffer device of the present invention can (1) when the pulp supply system fails, it can have Enough buffer time 'to troubleshoot. (2) The liquid level detector detects the liquid level of the pulp in the pulp buffer. On the one hand, the input of the pulp can be controlled to achieve automatic feedback control, and the other On the one hand, when the liquid level is too low, a warning signal is issued to prevent scrapping of the wafer due to the occurrence of no slurry output. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. 'Any person skilled in this art will not deviate from the spirit and scope of the present invention.' It can be modified and retouched in various ways. Therefore, the guarantee of the present invention H 1 · ---------- Wave — * · ( Please read the note on the back before filling this page) Order the paper printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and apply the standard of the paper for the poor ® Jiashoumu (CNS) A4 (210X297 mm) 411S92 A7 49S3twfd〇C / 〇 〇S_B7_ V. Description of the invention (1) The scope of protection shall be determined by the scope of the attached patent application. Wisdom and wealth of the Ministry of Economic Affairs is printed by HI ^ fn t ^ n 1 ^ 1 I ^^^ 1 1 ^ 1 — m · 0 、 V3 *, (Please read the note on the back first Item and then fill in this page) This paper applies China National rub scale quasi (CNS) A4 size (210X297 mm)