TW364919B - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
TW364919B
TW364919B TW084112322A TW84112322A TW364919B TW 364919 B TW364919 B TW 364919B TW 084112322 A TW084112322 A TW 084112322A TW 84112322 A TW84112322 A TW 84112322A TW 364919 B TW364919 B TW 364919B
Authority
TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
group
polycarbodiimide
amino group
Prior art date
Application number
TW084112322A
Other languages
Chinese (zh)
Inventor
Masayuki Takahashi
Hiromi Komatsu
Kazuo Kawaguchi
Hideetsu Fujiwara
Original Assignee
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Synthetic Rubber Co Ltd filed Critical Japan Synthetic Rubber Co Ltd
Application granted granted Critical
Publication of TW364919B publication Critical patent/TW364919B/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

A thermosetting resin composition which comprises a resin in which at least one compound having a graft-reactive group such as a carboxyl group, a primary amino group or a secondary amino group and a carboxylic anhydride group has been grafted on a polycarbodiimide and an epoxy compound. The said thermosetting resin composition retains heat resistance, electrically insulating properties and mechanical properties characteristic of polycarbodiimide, is excellent in solubility in various solvents and storage stability in the form of a solution and can be easily cured under mild conditions, and can produce a cured product excellent in humidity resistance, transparency, chemical stability and adhesives to various substrates.
TW084112322A 1994-07-15 1995-11-20 Thermosetting resin composition TW364919B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18521394 1994-07-15
JP19402895A JP3470464B2 (en) 1994-07-15 1995-07-07 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
TW364919B true TW364919B (en) 1999-07-21

Family

ID=26502970

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084112322A TW364919B (en) 1994-07-15 1995-11-20 Thermosetting resin composition

Country Status (2)

Country Link
JP (1) JP3470464B2 (en)
TW (1) TW364919B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4037958B2 (en) 1998-05-11 2008-01-23 日清紡績株式会社 Thermosetting resin composition
JP3588263B2 (en) * 1998-05-15 2004-11-10 日清紡績株式会社 Epoxy resin composition
JP3472156B2 (en) * 1998-09-30 2003-12-02 日清紡績株式会社 Film sealant for electronic components
DE19954500A1 (en) * 1999-11-11 2001-05-17 Basf Ag Carbodiimides with carboxyl or caboxylate groups
JP2007138080A (en) * 2005-11-21 2007-06-07 Nisshinbo Ind Inc Modified polycarbodiimide composition and modified polycarbodiimide
JP2008189815A (en) * 2007-02-05 2008-08-21 Nitto Denko Corp Dispersant, filler, heat-conductive resin composition and heat-conductive sheet
AU2012371722B2 (en) 2012-02-29 2016-07-14 Nobel Scientific Sdn. Bhd. Method of making a polymer article and resulting article
JP6092036B2 (en) * 2012-08-02 2017-03-08 三菱樹脂株式会社 Resin composition, water trapping agent, barrier film, organic electronic device and organic EL device using the same
JP6210407B2 (en) * 2013-06-25 2017-10-11 ダイニック株式会社 Thermal transfer receiving sheet for use in hot melt transfer recording systems
JP2015009558A (en) * 2013-06-26 2015-01-19 ダイニック株式会社 Thermal transfer receiving sheet
JP6849269B2 (en) * 2015-04-06 2021-03-24 日清紡ケミカル株式会社 Modified polycarbodiimide compound, curing agent and thermosetting resin composition
JP6533812B2 (en) * 2017-09-01 2019-06-19 ノーベル サイエンティフィック エスディーエヌ.ビーエイチディー. Method of making polymer article and resulting article

Also Published As

Publication number Publication date
JPH0881545A (en) 1996-03-26
JP3470464B2 (en) 2003-11-25

Similar Documents

Publication Publication Date Title
TW364919B (en) Thermosetting resin composition
CA2057537A1 (en) Heat resistant resin compositions, articles and method
EP0657497A4 (en) Thermoplastic resin composition and process for molding the same.
EP0194054A3 (en) Adhesive compositions based on phenolic resins and products formed from them
EP0398700A3 (en) Latent hardeners for epoxy resin compositions
JPS56103260A (en) Conductive paint containing copper powder
ATE207093T1 (en) LINEAR EPOXY FUNCTIONAL POLYESTER RESINS
KR970006381A (en) Thermosetting resin composition
AU4510199A (en) Coating composition
ES8504231A1 (en) Heat-curable binder composition.
JPS5655474A (en) Radiofrequency heating curable adhesive
AU2286183A (en) Block copolymer and coating composition
GB1493199A (en) Thermosetting compositions based on a bis-imide and a polyurethane
EP0319581A4 (en) Resin composition
EP0957122A3 (en) Epoxy resin composition
AU3047392A (en) New transparent amorphous compositions with high resistance to chemical agents
JPS52132099A (en) Thermosetting resin compositions
JPS56109261A (en) Expansion type rust-inhibiting material
GB1383985A (en) Film posessing an adhesive coating
JPS5556155A (en) Thermoplastic polymer composition and filmy adhesive
TW343215B (en) Synergistic improvement in vinyl ester resin shelf life through esterification to a low epoxy value and the addition of copper naphthenate
CA2279249A1 (en) Polyarylenesulfide resin composition
NZ338050A (en) Glycidylesters and thermosetting resin composition comprising the glycidylester
JPS5716023A (en) Thermosetting resin composition
JPS55129415A (en) Production of unsaturated epoxy ester resin

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent