TW364919B - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- TW364919B TW364919B TW084112322A TW84112322A TW364919B TW 364919 B TW364919 B TW 364919B TW 084112322 A TW084112322 A TW 084112322A TW 84112322 A TW84112322 A TW 84112322A TW 364919 B TW364919 B TW 364919B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- thermosetting resin
- group
- polycarbodiimide
- amino group
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
A thermosetting resin composition which comprises a resin in which at least one compound having a graft-reactive group such as a carboxyl group, a primary amino group or a secondary amino group and a carboxylic anhydride group has been grafted on a polycarbodiimide and an epoxy compound. The said thermosetting resin composition retains heat resistance, electrically insulating properties and mechanical properties characteristic of polycarbodiimide, is excellent in solubility in various solvents and storage stability in the form of a solution and can be easily cured under mild conditions, and can produce a cured product excellent in humidity resistance, transparency, chemical stability and adhesives to various substrates.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18521394 | 1994-07-15 | ||
JP19402895A JP3470464B2 (en) | 1994-07-15 | 1995-07-07 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
TW364919B true TW364919B (en) | 1999-07-21 |
Family
ID=26502970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084112322A TW364919B (en) | 1994-07-15 | 1995-11-20 | Thermosetting resin composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3470464B2 (en) |
TW (1) | TW364919B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4037958B2 (en) | 1998-05-11 | 2008-01-23 | 日清紡績株式会社 | Thermosetting resin composition |
JP3588263B2 (en) * | 1998-05-15 | 2004-11-10 | 日清紡績株式会社 | Epoxy resin composition |
JP3472156B2 (en) * | 1998-09-30 | 2003-12-02 | 日清紡績株式会社 | Film sealant for electronic components |
DE19954500A1 (en) * | 1999-11-11 | 2001-05-17 | Basf Ag | Carbodiimides with carboxyl or caboxylate groups |
JP2007138080A (en) * | 2005-11-21 | 2007-06-07 | Nisshinbo Ind Inc | Modified polycarbodiimide composition and modified polycarbodiimide |
JP2008189815A (en) * | 2007-02-05 | 2008-08-21 | Nitto Denko Corp | Dispersant, filler, heat-conductive resin composition and heat-conductive sheet |
AU2012371722B2 (en) | 2012-02-29 | 2016-07-14 | Nobel Scientific Sdn. Bhd. | Method of making a polymer article and resulting article |
JP6092036B2 (en) * | 2012-08-02 | 2017-03-08 | 三菱樹脂株式会社 | Resin composition, water trapping agent, barrier film, organic electronic device and organic EL device using the same |
JP6210407B2 (en) * | 2013-06-25 | 2017-10-11 | ダイニック株式会社 | Thermal transfer receiving sheet for use in hot melt transfer recording systems |
JP2015009558A (en) * | 2013-06-26 | 2015-01-19 | ダイニック株式会社 | Thermal transfer receiving sheet |
JP6849269B2 (en) * | 2015-04-06 | 2021-03-24 | 日清紡ケミカル株式会社 | Modified polycarbodiimide compound, curing agent and thermosetting resin composition |
JP6533812B2 (en) * | 2017-09-01 | 2019-06-19 | ノーベル サイエンティフィック エスディーエヌ.ビーエイチディー. | Method of making polymer article and resulting article |
-
1995
- 1995-07-07 JP JP19402895A patent/JP3470464B2/en not_active Expired - Lifetime
- 1995-11-20 TW TW084112322A patent/TW364919B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0881545A (en) | 1996-03-26 |
JP3470464B2 (en) | 2003-11-25 |
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Legal Events
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---|---|---|---|
MK4A | Expiration of patent term of an invention patent |