TW351050B - Heat sink and electronic device employing the same - Google Patents

Heat sink and electronic device employing the same

Info

Publication number
TW351050B
TW351050B TW086104019A TW86104019A TW351050B TW 351050 B TW351050 B TW 351050B TW 086104019 A TW086104019 A TW 086104019A TW 86104019 A TW86104019 A TW 86104019A TW 351050 B TW351050 B TW 351050B
Authority
TW
Taiwan
Prior art keywords
heat sink
same
electronic device
base plate
device employing
Prior art date
Application number
TW086104019A
Other languages
English (en)
Inventor
Masaharu Miyahara
Yasushi Inoue
Kenji Suga
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of TW351050B publication Critical patent/TW351050B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW086104019A 1996-04-04 1997-03-28 Heat sink and electronic device employing the same TW351050B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08082306A JP3127821B2 (ja) 1996-04-04 1996-04-04 ヒートシンク装置

Publications (1)

Publication Number Publication Date
TW351050B true TW351050B (en) 1999-01-21

Family

ID=13770880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104019A TW351050B (en) 1996-04-04 1997-03-28 Heat sink and electronic device employing the same

Country Status (3)

Country Link
US (1) US5940268A (zh)
JP (1) JP3127821B2 (zh)
TW (1) TW351050B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11252858A (ja) * 1998-02-27 1999-09-17 Matsushita Electric Ind Co Ltd 電動機及びそれを用いたヒートシンク装置
JP4015754B2 (ja) * 1998-06-23 2007-11-28 株式会社東芝 冷却装置および冷却装置を有する電子機器
GB2344855B (en) * 1998-12-14 2002-10-09 Sunonwealth Electr Mach Ind Co Miniature heat dissipating fans with minimized thickness
JP2000183577A (ja) * 1998-12-14 2000-06-30 Saku Seimitsu:Kk ファン付きヒートシンク
US6170563B1 (en) * 1999-07-26 2001-01-09 Hsieh Hsin-Mao Heat radiating device for notebook computer
US6437469B1 (en) 2000-09-25 2002-08-20 Aaon, Inc. Heat dissipating collar for motor
TW590169U (en) * 2000-12-27 2004-06-01 Delta Electronics Inc Embedded centrifugal cooling device
DE10110129A1 (de) * 2001-03-02 2002-09-05 Bosch Gmbh Robert Elektrische Maschine
US6970356B2 (en) * 2002-07-16 2005-11-29 Tseng Jyi Peng Heat sink system
KR100490158B1 (ko) * 2002-12-14 2005-05-16 엘지전자 주식회사 냉각 팬용 백 커버구조
US6796448B1 (en) * 2003-03-04 2004-09-28 Miner Enterprises, Inc. Railcar draft gear housing
US6816374B2 (en) * 2003-03-25 2004-11-09 International Business Machines Corporation High efficiency heat sink/air cooler system for heat-generating components
JP2005051127A (ja) * 2003-07-30 2005-02-24 Toshiba Home Technology Corp 冷却モジュールおよび放熱体の積層構造
TWI305486B (en) * 2004-08-27 2009-01-11 Delta Electronics Inc Heat-dissipating fan and its housing
TWI305612B (en) * 2004-08-27 2009-01-21 Delta Electronics Inc Heat-dissipating fan
CN100455822C (zh) * 2004-09-06 2009-01-28 台达电子工业股份有限公司 散热风扇及其扇框结构
TWI268995B (en) * 2004-12-24 2006-12-21 Foxconn Tech Co Ltd Fan duct device
JP2006269639A (ja) * 2005-03-23 2006-10-05 Denso Corp 放熱装置および車載電子機器
WO2007043119A1 (ja) * 2005-09-30 2007-04-19 Fujitsu Limited ファン装置
EP1948940A1 (en) * 2005-11-17 2008-07-30 University of Limerick A cooling device
CN101592165A (zh) * 2008-05-26 2009-12-02 鸿富锦精密工业（深圳）有限公司 风扇组件
JP4660620B1 (ja) * 2009-09-30 2011-03-30 株式会社東芝 電子機器
US9801277B1 (en) * 2013-08-27 2017-10-24 Flextronics Ap, Llc Bellows interconnect
CN108363075A (zh) * 2018-05-25 2018-08-03 北斗时空信息技术研究院（北京）有限公司 一种便携导航终端
US11716829B1 (en) * 2020-03-17 2023-08-01 Apple Inc. Integrated fan and heat sink for head-mountable device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3101746B2 (ja) * 1992-04-28 2000-10-23 株式会社日立製作所 半導体冷却装置
US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU

Also Published As

Publication number Publication date
JP3127821B2 (ja) 2001-01-29
US5940268A (en) 1999-08-17
JPH09275288A (ja) 1997-10-21

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