TW348270B - Semiconductor manufacturing line capable of minimizing wet process unit - Google Patents
Semiconductor manufacturing line capable of minimizing wet process unitInfo
- Publication number
- TW348270B TW348270B TW086116235A TW86116235A TW348270B TW 348270 B TW348270 B TW 348270B TW 086116235 A TW086116235 A TW 086116235A TW 86116235 A TW86116235 A TW 86116235A TW 348270 B TW348270 B TW 348270B
- Authority
- TW
- Taiwan
- Prior art keywords
- wet process
- process unit
- manufacturing line
- semiconductor manufacturing
- line capable
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8284953A JP2853677B2 (ja) | 1996-10-28 | 1996-10-28 | 半導体装置製造ライン |
Publications (1)
Publication Number | Publication Date |
---|---|
TW348270B true TW348270B (en) | 1998-12-21 |
Family
ID=17685223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086116235A TW348270B (en) | 1996-10-28 | 1997-10-28 | Semiconductor manufacturing line capable of minimizing wet process unit |
Country Status (5)
Country | Link |
---|---|
US (1) | US6328768B1 (zh) |
JP (1) | JP2853677B2 (zh) |
KR (1) | KR100262710B1 (zh) |
GB (1) | GB2318686B (zh) |
TW (1) | TW348270B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6551488B1 (en) * | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Segmenting of processing system into wet and dry areas |
JP2002289671A (ja) * | 2001-03-28 | 2002-10-04 | Toshiba Corp | 半導体製造装置及び半導体装置の製造システム |
TWI256700B (en) * | 2005-01-06 | 2006-06-11 | Chunghwa Picture Tubes Ltd | Manufacturing system and operative method thereof |
US9059227B2 (en) | 2005-06-18 | 2015-06-16 | Futrfab, Inc. | Methods and apparatus for vertically orienting substrate processing tools in a clean space |
US10651063B2 (en) | 2005-06-18 | 2020-05-12 | Frederick A. Flitsch | Methods of prototyping and manufacturing with cleanspace fabricators |
US9339900B2 (en) | 2005-08-18 | 2016-05-17 | Futrfab, Inc. | Apparatus to support a cleanspace fabricator |
US11024527B2 (en) | 2005-06-18 | 2021-06-01 | Frederick A. Flitsch | Methods and apparatus for novel fabricators with Cleanspace |
US10627809B2 (en) | 2005-06-18 | 2020-04-21 | Frederick A. Flitsch | Multilevel fabricators |
US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
US9159592B2 (en) | 2005-06-18 | 2015-10-13 | Futrfab, Inc. | Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator |
US7513822B2 (en) * | 2005-06-18 | 2009-04-07 | Flitsch Frederick A | Method and apparatus for a cleanspace fabricator |
US7467024B2 (en) * | 2005-08-26 | 2008-12-16 | Flitsch Frederick A | Method and apparatus for an elevator system for a multilevel cleanspace fabricator |
CN105304529B (zh) | 2005-09-18 | 2019-03-15 | 弗雷德里克·A·弗里奇 | 用于在洁净空间中垂直定位基片处理设备的方法和装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2559375B2 (ja) * | 1986-08-29 | 1996-12-04 | 株式会社日立製作所 | 半導体装置の搬送方法 |
JP2539447B2 (ja) * | 1987-08-12 | 1996-10-02 | 株式会社日立製作所 | 枚葉キャリアによる生産方法 |
JPH07101706B2 (ja) * | 1988-09-14 | 1995-11-01 | 富士通株式会社 | ウェーハの連続処理装置及び連続処理方法 |
US5536128A (en) | 1988-10-21 | 1996-07-16 | Hitachi, Ltd. | Method and apparatus for carrying a variety of products |
JPH04240714A (ja) | 1991-01-25 | 1992-08-28 | Fujitsu Ltd | 半導体装置製造工場のレイアウト |
JPH0590118A (ja) | 1991-09-30 | 1993-04-09 | Hitachi Ltd | 半導体製造ライン |
US5256204A (en) | 1991-12-13 | 1993-10-26 | United Microelectronics Corporation | Single semiconductor water transfer method and manufacturing system |
JP3282219B2 (ja) | 1992-07-09 | 2002-05-13 | 株式会社日立製作所 | 半導体製造ラインの構成方法 |
DE69205571T2 (de) * | 1992-08-04 | 1996-06-13 | Ibm | Unter Druck stehende Koppelsysteme zum Transferieren von einem Halbleiterwafer zwischen einem tragbaren abdichtbaren unter druckstehenden Behälter und einer Bearbeitungsanlage. |
JPH0684740A (ja) | 1992-09-02 | 1994-03-25 | Hitachi Ltd | 半導体製造ラインの構成方法 |
JPH0722488A (ja) | 1993-07-06 | 1995-01-24 | Sumitomo Metal Ind Ltd | 半導体装置製造工場のウエハ搬送システム |
JP3654597B2 (ja) * | 1993-07-15 | 2005-06-02 | 株式会社ルネサステクノロジ | 製造システムおよび製造方法 |
JPH0766265A (ja) | 1993-08-30 | 1995-03-10 | Hitachi Ltd | 製造装置 |
US5344365A (en) | 1993-09-14 | 1994-09-06 | Sematech, Inc. | Integrated building and conveying structure for manufacturing under ultraclean conditions |
US5795356A (en) * | 1996-05-31 | 1998-08-18 | Slsp Partners, Inc. | Microelectronic component fabrication facility, and process for making and using the facility |
-
1996
- 1996-10-28 JP JP8284953A patent/JP2853677B2/ja not_active Expired - Fee Related
-
1997
- 1997-10-27 US US08/958,157 patent/US6328768B1/en not_active Expired - Fee Related
- 1997-10-28 KR KR1019970055630A patent/KR100262710B1/ko not_active IP Right Cessation
- 1997-10-28 TW TW086116235A patent/TW348270B/zh active
- 1997-10-28 GB GB9722782A patent/GB2318686B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR19980033234A (ko) | 1998-07-25 |
GB2318686B (en) | 1998-12-16 |
KR100262710B1 (ko) | 2000-09-01 |
JPH10135302A (ja) | 1998-05-22 |
US6328768B1 (en) | 2001-12-11 |
GB9722782D0 (en) | 1997-12-24 |
JP2853677B2 (ja) | 1999-02-03 |
GB2318686A (en) | 1998-04-29 |
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