TW345699B - Process for reducing surface dissolution of photoresist - Google Patents
Process for reducing surface dissolution of photoresistInfo
- Publication number
- TW345699B TW345699B TW086118428A TW86118428A TW345699B TW 345699 B TW345699 B TW 345699B TW 086118428 A TW086118428 A TW 086118428A TW 86118428 A TW86118428 A TW 86118428A TW 345699 B TW345699 B TW 345699B
- Authority
- TW
- Taiwan
- Prior art keywords
- photoresist
- pattern region
- photoresist layer
- dissolution
- semiconductor substrate
- Prior art date
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A photoresist treatment process for reducing surface dissolution of a photoresist, the process at least comprising: providing a semiconductor substrate including an un-exposed photoresist layer formed on the semiconductor substrate; forming a dissolution inhibiting layer on the photoresist layer; exposing the semiconductor substrate thereby transferring a pattern defined on a mask to the photoresist layer, the photoresist layer containing a pattern region which is to be retained and a non-pattern region which is to be removed; and developing the photoresist layer thereby removing the non-pattern region and retaining the pattern region, the dissolution inhibiting layer being used to inhibit the dissolution of the pattern region on the photoresist layer during the process of developing, thereby reducing the dissolution of a surface portion of the pattern region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086118428A TW345699B (en) | 1997-12-03 | 1997-12-03 | Process for reducing surface dissolution of photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086118428A TW345699B (en) | 1997-12-03 | 1997-12-03 | Process for reducing surface dissolution of photoresist |
Publications (1)
Publication Number | Publication Date |
---|---|
TW345699B true TW345699B (en) | 1998-11-21 |
Family
ID=58263845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086118428A TW345699B (en) | 1997-12-03 | 1997-12-03 | Process for reducing surface dissolution of photoresist |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW345699B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7989146B2 (en) * | 2007-10-09 | 2011-08-02 | Eastman Kodak Company | Component fabrication using thermal resist materials |
-
1997
- 1997-12-03 TW TW086118428A patent/TW345699B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7989146B2 (en) * | 2007-10-09 | 2011-08-02 | Eastman Kodak Company | Component fabrication using thermal resist materials |
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