TW341720B - Plasma processing apparatus - Google Patents
Plasma processing apparatusInfo
- Publication number
- TW341720B TW341720B TW086106910A TW86106910A TW341720B TW 341720 B TW341720 B TW 341720B TW 086106910 A TW086106910 A TW 086106910A TW 86106910 A TW86106910 A TW 86106910A TW 341720 B TW341720 B TW 341720B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- web
- segments
- chamber
- shaped
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
A plasma processing apparatus comprising: a chamber having a substantially tubular shape with a closed upper end thereof; a first electrode disposed on the chamber and connected to a high-frequency power supply; a second electrode disposed on the chamber for generating a plasma between the second electrode and the first electrode, the second electrode being connected to ground or a power supply which supplies electric energy of a lower frequency than electric energy supplied by the high frequency power supply; insulator means disposed outside of the chamber for having the electrodes secured thereto; and conductor means mounted on the insulator means; characterized in each of the first electrode and the second electrode comprising a plurality of web-shaped electrode segments, the web-shaped electrode segments of the first electrode and the web-shaped electrode segments of the second electrode being vertically alternately arranged in spaced relationship, each of the web-shaped electrode segments having opposite ends fastened to the insulator means, the web-shaped electrode segments of the first electrode being electrically connected to each other by the conductor means, and the web-shaped electrode segments of the second electrode being electrically connected to each other by the conductor means.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30139996A JP3569090B2 (en) | 1996-11-13 | 1996-11-13 | Plasma processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW341720B true TW341720B (en) | 1998-10-01 |
Family
ID=17896407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086106910A TW341720B (en) | 1996-11-13 | 1997-05-22 | Plasma processing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3569090B2 (en) |
| TW (1) | TW341720B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3868217B2 (en) * | 2001-02-09 | 2007-01-17 | 東京応化工業株式会社 | Plasma processing equipment |
| KR100808862B1 (en) * | 2006-07-24 | 2008-03-03 | 삼성전자주식회사 | Apparatus for treating substrate |
| JP5191159B2 (en) | 2007-04-04 | 2013-04-24 | ルネサスエレクトロニクス株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
-
1996
- 1996-11-13 JP JP30139996A patent/JP3569090B2/en not_active Expired - Fee Related
-
1997
- 1997-05-22 TW TW086106910A patent/TW341720B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10144495A (en) | 1998-05-29 |
| JP3569090B2 (en) | 2004-09-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |