TW339461B - Device for conditioning polishing pads utilizing brazed cubic boron nitride technologies - Google Patents

Device for conditioning polishing pads utilizing brazed cubic boron nitride technologies

Info

Publication number
TW339461B
TW339461B TW086112211A TW86112211A TW339461B TW 339461 B TW339461 B TW 339461B TW 086112211 A TW086112211 A TW 086112211A TW 86112211 A TW86112211 A TW 86112211A TW 339461 B TW339461 B TW 339461B
Authority
TW
Taiwan
Prior art keywords
conditioner
boron nitride
cubic boron
polishing pads
conditioning polishing
Prior art date
Application number
TW086112211A
Other languages
Chinese (zh)
Inventor
Paul Holzapfel
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Application granted granted Critical
Publication of TW339461B publication Critical patent/TW339461B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

A osrt of polishign pad conditioner having the polishing pad including the panel on the polishing unit, used for polishing the surface of the workpiece, having the unit: conditioner by means of contact with the polishing pad, having the conditioner been solded by the cutting element of cubic boron nitride in the bottom of the conditioner; and the joining unit for the conditioner and the polishing pad for turning of the conditioner on top of the polishing pad for oscillation of the conditioner on it.
TW086112211A 1996-08-28 1997-08-26 Device for conditioning polishing pads utilizing brazed cubic boron nitride technologies TW339461B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70408896A 1996-08-28 1996-08-28

Publications (1)

Publication Number Publication Date
TW339461B true TW339461B (en) 1998-09-01

Family

ID=24828012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086112211A TW339461B (en) 1996-08-28 1997-08-26 Device for conditioning polishing pads utilizing brazed cubic boron nitride technologies

Country Status (2)

Country Link
TW (1) TW339461B (en)
WO (1) WO1998008651A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003535462A (en) * 2000-05-31 2003-11-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Polishing method and apparatus for manufacturing semiconductors and integrated circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1313762C (en) * 1985-11-19 1993-02-23 Sumitomo Electric Industries, Ltd. Hard sintered compact for a tool
US5011514A (en) * 1988-07-29 1991-04-30 Norton Company Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof
US4954139A (en) * 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads

Also Published As

Publication number Publication date
WO1998008651A1 (en) 1998-03-05

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