TW333743B - The method for producing multi-layers circuit board - Google Patents

The method for producing multi-layers circuit board

Info

Publication number
TW333743B
TW333743B TW086104905A TW86104905A TW333743B TW 333743 B TW333743 B TW 333743B TW 086104905 A TW086104905 A TW 086104905A TW 86104905 A TW86104905 A TW 86104905A TW 333743 B TW333743 B TW 333743B
Authority
TW
Taiwan
Prior art keywords
circuit board
layer
foil
blind hole
barrier
Prior art date
Application number
TW086104905A
Other languages
English (en)
Inventor
Ding-Haw Lin
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW086104905A priority Critical patent/TW333743B/zh
Application granted granted Critical
Publication of TW333743B publication Critical patent/TW333743B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW086104905A 1997-04-16 1997-04-16 The method for producing multi-layers circuit board TW333743B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086104905A TW333743B (en) 1997-04-16 1997-04-16 The method for producing multi-layers circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086104905A TW333743B (en) 1997-04-16 1997-04-16 The method for producing multi-layers circuit board

Publications (1)

Publication Number Publication Date
TW333743B true TW333743B (en) 1998-06-11

Family

ID=58262935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104905A TW333743B (en) 1997-04-16 1997-04-16 The method for producing multi-layers circuit board

Country Status (1)

Country Link
TW (1) TW333743B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10039184B2 (en) 2016-11-30 2018-07-31 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10039184B2 (en) 2016-11-30 2018-07-31 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof

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