TW333743B - The method for producing multi-layers circuit board - Google Patents
The method for producing multi-layers circuit boardInfo
- Publication number
- TW333743B TW333743B TW086104905A TW86104905A TW333743B TW 333743 B TW333743 B TW 333743B TW 086104905 A TW086104905 A TW 086104905A TW 86104905 A TW86104905 A TW 86104905A TW 333743 B TW333743 B TW 333743B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- layer
- foil
- blind hole
- barrier
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086104905A TW333743B (en) | 1997-04-16 | 1997-04-16 | The method for producing multi-layers circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086104905A TW333743B (en) | 1997-04-16 | 1997-04-16 | The method for producing multi-layers circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW333743B true TW333743B (en) | 1998-06-11 |
Family
ID=58262935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086104905A TW333743B (en) | 1997-04-16 | 1997-04-16 | The method for producing multi-layers circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW333743B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10039184B2 (en) | 2016-11-30 | 2018-07-31 | Unimicron Technology Corp. | Circuit board structure and manufacturing method thereof |
-
1997
- 1997-04-16 TW TW086104905A patent/TW333743B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10039184B2 (en) | 2016-11-30 | 2018-07-31 | Unimicron Technology Corp. | Circuit board structure and manufacturing method thereof |
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