TW329052B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TW329052B
TW329052B TW086110485A TW86110485A TW329052B TW 329052 B TW329052 B TW 329052B TW 086110485 A TW086110485 A TW 086110485A TW 86110485 A TW86110485 A TW 86110485A TW 329052 B TW329052 B TW 329052B
Authority
TW
Taiwan
Prior art keywords
diffusion layers
insulating film
semiconductor substrate
gate electrodes
interlayer insulating
Prior art date
Application number
TW086110485A
Other languages
Chinese (zh)
Inventor
Kazuki Ozuki
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW329052B publication Critical patent/TW329052B/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/08Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements
    • G11C17/10Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM
    • G11C17/12Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices
    • G11C17/123Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices comprising cells having several storage transistors connected in series

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)

Abstract

A semiconductor memory includes a plurality of diffusion layers a plurality of gate electrodes , a plurality of MOS transistors , an interlayer insulating film , and a plurality of metal lines . The diffusion layers are arrayed parallel to each other in the major surface of a semiconductor substrate . The gate electrodes are arrayed parallel to each other on the semiconductor substrate via a gate insulating film in a direction perpendicular to the diffusion layers . The MOS transistors are formed in cross regions including the intersections between the diffusion layers in the major surface of the semiconductor substrate , and the gate electrodes to constitute memory cells . The cross regions include channels through which a channel current flows . Data is written in the memory cells by selectively ion-implanting an impurity in the channels . The interlayer insulating film is formed on the semiconductor substrate including the gate electrodes . The metal lines are formed on the interlayer insulating film in correspondence with the diffusion layers to function as a mask in ion-implanting the impurity .
TW086110485A 1996-07-26 1997-07-23 Semiconductor device TW329052B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19752996A JP3191689B2 (en) 1996-07-26 1996-07-26 Semiconductor memory device and method of manufacturing the same

Publications (1)

Publication Number Publication Date
TW329052B true TW329052B (en) 1998-04-01

Family

ID=16375992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110485A TW329052B (en) 1996-07-26 1997-07-23 Semiconductor device

Country Status (3)

Country Link
JP (1) JP3191689B2 (en)
KR (1) KR100286732B1 (en)
TW (1) TW329052B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI674661B (en) * 2015-04-09 2019-10-11 南韓商三星電子股份有限公司 Semiconductor device and method of fabricating the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137077B2 (en) 1998-06-16 2001-02-19 日本電気株式会社 Semiconductor device and manufacturing method thereof
JP2000114400A (en) 1998-10-08 2000-04-21 Nec Corp Semiconductor memory device and its manufacture
KR100546360B1 (en) 2003-08-06 2006-01-26 삼성전자주식회사 Method for manufacturing NOR type mask ROM device and semiconductor device including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI674661B (en) * 2015-04-09 2019-10-11 南韓商三星電子股份有限公司 Semiconductor device and method of fabricating the same

Also Published As

Publication number Publication date
JPH1041411A (en) 1998-02-13
JP3191689B2 (en) 2001-07-23
KR100286732B1 (en) 2001-07-12
KR980012618A (en) 1998-04-30

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