TW278059B - Laser processing machine - Google Patents
Laser processing machineInfo
- Publication number
- TW278059B TW278059B TW084106413A TW84106413A TW278059B TW 278059 B TW278059 B TW 278059B TW 084106413 A TW084106413 A TW 084106413A TW 84106413 A TW84106413 A TW 84106413A TW 278059 B TW278059 B TW 278059B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing machine
- laser processing
- bend
- block
- mirror
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/003—Cooling means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Laser Beam Processing (AREA)
Abstract
A laser processing machine, characterized by comprising: a bend mirror for reflecting laser beam; a bend block on which the bend mirror to be mounted; a support frame for the bend block and the bend mirror; and an apparatus adapted to the support frame for adjusting the alignment of the bend block.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06940495A JP3178294B2 (en) | 1995-03-28 | 1995-03-28 | Laser processing machine |
Publications (1)
Publication Number | Publication Date |
---|---|
TW278059B true TW278059B (en) | 1996-06-11 |
Family
ID=13401641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084106413A TW278059B (en) | 1995-03-28 | 1995-06-22 | Laser processing machine |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3178294B2 (en) |
KR (1) | KR100208421B1 (en) |
CN (1) | CN1040513C (en) |
TW (1) | TW278059B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006251752A (en) * | 2005-02-14 | 2006-09-21 | Sharp Corp | Optical apparatus |
JP4785430B2 (en) | 2005-06-09 | 2011-10-05 | キヤノン株式会社 | Optical element and optical instrument having the optical element |
JP4965466B2 (en) | 2008-01-10 | 2012-07-04 | 三菱電機株式会社 | Laser oscillator |
JPWO2015151152A1 (en) * | 2014-03-31 | 2017-04-13 | ギガフォトン株式会社 | Mirror device |
CN104400091B (en) * | 2014-12-01 | 2017-03-08 | 江西洪都航空工业集团有限责任公司 | Ream frock for non-aqueous planar end surface |
CN105261926B (en) * | 2015-11-14 | 2018-11-23 | 山东能源重装集团大族再制造有限公司 | A kind of laser head, laser and application method comprising the laser head |
DE102019122064A1 (en) * | 2019-08-16 | 2021-02-18 | Bystronic Laser Ag | Processing device for laser processing of a workpiece, parts set for a processing device for laser processing of a workpiece and method for laser processing of a workpiece |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6228094A (en) * | 1985-07-30 | 1987-02-06 | Mitsubishi Electric Corp | Laser optical device for laser beam processing machine |
JPH01113193A (en) * | 1987-10-28 | 1989-05-01 | Matsushita Electric Ind Co Ltd | Laser beam machine |
TW225050B (en) * | 1990-11-30 | 1994-06-11 | Hitachi Ltd |
-
1995
- 1995-03-28 JP JP06940495A patent/JP3178294B2/en not_active Expired - Fee Related
- 1995-06-22 TW TW084106413A patent/TW278059B/en active
- 1995-08-10 CN CN95109865A patent/CN1040513C/en not_active Expired - Fee Related
- 1995-08-11 KR KR1019950024853A patent/KR100208421B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100208421B1 (en) | 1999-07-15 |
KR960033639A (en) | 1996-10-22 |
CN1132132A (en) | 1996-10-02 |
CN1040513C (en) | 1998-11-04 |
JPH08257782A (en) | 1996-10-08 |
JP3178294B2 (en) | 2001-06-18 |
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