TW262418B - - Google Patents
Info
- Publication number
- TW262418B TW262418B TW082106869A TW82106869A TW262418B TW 262418 B TW262418 B TW 262418B TW 082106869 A TW082106869 A TW 082106869A TW 82106869 A TW82106869 A TW 82106869A TW 262418 B TW262418 B TW 262418B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00432—Auxiliary operations, e.g. machines for filling the moulds
- B29D11/00461—Adjusting the refractive index, e.g. after implanting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Laser Beam Processing (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/952,938 US5257706A (en) | 1992-09-29 | 1992-09-29 | Method of cleaning laser ablation debris |
Publications (1)
Publication Number | Publication Date |
---|---|
TW262418B true TW262418B (zh) | 1995-11-11 |
Family
ID=25493375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082106869A TW262418B (zh) | 1992-09-29 | 1993-08-25 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5257706A (zh) |
CN (1) | CN1087307A (zh) |
AU (1) | AU4656893A (zh) |
MX (1) | MX9305791A (zh) |
TW (1) | TW262418B (zh) |
WO (1) | WO1994007638A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5319183A (en) * | 1992-02-18 | 1994-06-07 | Fujitsu Limited | Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
US5378582A (en) * | 1992-09-29 | 1995-01-03 | Bausch & Lomb Incorporated | Symmetric sweep scanning technique for laser ablation |
US5359173A (en) * | 1992-09-29 | 1994-10-25 | Bausch & Lomb Incorporated | Scanning technique for laser ablation |
AU4660193A (en) * | 1992-09-29 | 1994-04-26 | Bausch & Lomb Incorporated | Symmetric scanning technique for laser ablation |
US5367141A (en) * | 1993-03-26 | 1994-11-22 | The United States Of America As Represented By The United States Department Of Energy | Photochemical cutting of fabrics |
US5637245A (en) * | 1995-04-13 | 1997-06-10 | Vernay Laboratories, Inc. | Method and apparatus for minimizing degradation of equipment in a laser cleaning technique |
WO1996033839A1 (en) | 1995-04-26 | 1996-10-31 | Minnesota Mining And Manufacturing Company | Method and apparatus for step and repeat exposures |
US5780805A (en) * | 1995-05-03 | 1998-07-14 | Gerber Garment Technology, Inc. | Pattern shifting laser cutter |
US5662762A (en) * | 1995-07-07 | 1997-09-02 | Clover Industries, Inc. | Laser-based system and method for stripping coatings from substrates |
DE19752203A1 (de) * | 1997-11-25 | 1999-06-02 | Fraunhofer Ges Forschung | Verfahren zum Beseitigen von Ablationsrückständen beim Laserstrukturierungsprozeß durch Ablation |
JP3303787B2 (ja) * | 1998-08-24 | 2002-07-22 | 株式会社村田製作所 | 電極の切除方法 |
SG84519A1 (en) * | 1998-12-07 | 2001-11-20 | Advanced Systems Automation | Method and apparatus for removal of mold flash |
DE60124619T2 (de) | 2000-05-25 | 2007-09-20 | Novartis Ag | Kontaktlinse mit gespritzter Inversionsmarkierung |
US6693255B2 (en) | 2001-03-22 | 2004-02-17 | R. F. Envirotech, Inc. | Laser ablation cleaning |
US6577448B2 (en) | 2001-09-25 | 2003-06-10 | Siemens Dematic Electronic Assembly Systems, Inc. | Laser system by modulation of power and energy |
WO2005032757A1 (en) * | 2003-09-30 | 2005-04-14 | Matsushita Electric Industrial Co. Ltd. | Mold for optical components |
US7531283B2 (en) * | 2005-06-20 | 2009-05-12 | Xerox Corporation | Laser ablation of welded seam area |
US7901075B2 (en) * | 2007-12-27 | 2011-03-08 | Johnson & Johnson Vision Care, Inc. | Laser enhanced lens |
DE102011103793A1 (de) * | 2011-03-10 | 2012-09-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Fertigung optischer Elemente durch Bearbeitung mit energetischer Strahlung |
JP5892198B2 (ja) * | 2014-06-26 | 2016-03-23 | 横浜ゴム株式会社 | モールドの洗浄システム |
JP6457981B2 (ja) * | 2016-07-08 | 2019-01-23 | 株式会社スギノマシン | ノズルのクリーニング方法、およびレーザー加工装置 |
CN107350227A (zh) * | 2017-09-05 | 2017-11-17 | 镇江金海创科技有限公司 | 焦距可调式激光清洗振镜 |
EP3540090A1 (en) * | 2018-03-12 | 2019-09-18 | Solmates B.V. | Method for pulsed laser deposition |
TWI686256B (zh) * | 2018-04-13 | 2020-03-01 | 財團法人工業技術研究院 | 雷射清潔裝置及方法 |
US20220175449A1 (en) * | 2020-12-07 | 2022-06-09 | FA Corporation | Aesthetic laser apparatus for performing treatment by irradiating a human skin to be treated by a variable pulsed laser beam |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4307046A (en) * | 1979-07-16 | 1981-12-22 | Neefe Charles W | Method of laser machining contact lenses |
US4417948A (en) * | 1982-07-09 | 1983-11-29 | International Business Machines Corporation | Self developing, photoetching of polyesters by far UV radiation |
US4568632A (en) * | 1982-10-07 | 1986-02-04 | International Business Machines Corporation | Patterning of polyimide films with far ultraviolet light |
US4563565A (en) * | 1983-03-02 | 1986-01-07 | Minnesota Mining And Manufacturing Company | Method for forming a peripheral edge on contact lenses |
US4713518A (en) * | 1984-06-08 | 1987-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device manufacturing methods |
US4752668A (en) * | 1986-04-28 | 1988-06-21 | Rosenfield Michael G | System for laser removal of excess material from a semiconductor wafer |
DE3809211A1 (de) * | 1988-03-18 | 1989-10-05 | Max Planck Gesellschaft | Verfahren zur ablation von polymeren kunststoffen mittels ultrakurzer laserstrahlungsimpulse |
IE883228L (en) * | 1988-10-25 | 1990-04-25 | Provost Fellows Ans Scholars O | Laser polishing of lens surface |
US5061342A (en) * | 1990-05-18 | 1991-10-29 | Bausch & Lomb Incorporated | Target domain profiling of target optical surfaces using excimer laser photoablation |
-
1992
- 1992-09-29 US US07/952,938 patent/US5257706A/en not_active Expired - Lifetime
-
1993
- 1993-06-30 WO PCT/US1993/006195 patent/WO1994007638A1/en active Application Filing
- 1993-06-30 AU AU46568/93A patent/AU4656893A/en not_active Abandoned
- 1993-08-25 TW TW082106869A patent/TW262418B/zh active
- 1993-09-21 MX MX9305791A patent/MX9305791A/es unknown
- 1993-09-25 CN CN93118097A patent/CN1087307A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO1994007638A1 (en) | 1994-04-14 |
MX9305791A (es) | 1994-05-31 |
AU4656893A (en) | 1994-04-26 |
US5257706A (en) | 1993-11-02 |
CN1087307A (zh) | 1994-06-01 |