TW248611B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TW248611B
TW248611B TW83111810A TW83111810A TW248611B TW 248611 B TW248611 B TW 248611B TW 83111810 A TW83111810 A TW 83111810A TW 83111810 A TW83111810 A TW 83111810A TW 248611 B TW248611 B TW 248611B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
semiconductor
die
circuit
main structure
Prior art date
Application number
TW83111810A
Other languages
Chinese (zh)
Inventor
Noriyasu Ishikawa
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Application granted granted Critical
Publication of TW248611B publication Critical patent/TW248611B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

A circuit for semiconductor device consists of die carrier with conductive main structure for carrying die formed from semiconductor circuit. The semiconductor die and main structure are packaged with resin. It features that there is integrated circuit mechanism part and conductive layer forinsulation.
TW83111810A 1993-12-28 1994-12-17 Semiconductor device TW248611B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5338334A JP2755148B2 (en) 1993-12-28 1993-12-28 Semiconductor device

Publications (1)

Publication Number Publication Date
TW248611B true TW248611B (en) 1995-06-01

Family

ID=18317178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83111810A TW248611B (en) 1993-12-28 1994-12-17 Semiconductor device

Country Status (2)

Country Link
JP (1) JP2755148B2 (en)
TW (1) TW248611B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261010A (en) 1998-03-13 1999-09-24 Mitsubishi Electric Corp Semiconductor device and its manufacturing method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210646A (en) * 1981-06-19 1982-12-24 Seiko Epson Corp Resin-sealed semiconductor device

Also Published As

Publication number Publication date
JP2755148B2 (en) 1998-05-20
JPH07202077A (en) 1995-08-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees