TW237561B - Stagger bond pad design - Google Patents

Stagger bond pad design

Info

Publication number
TW237561B
TW237561B TW083105742A TW83105742A TW237561B TW 237561 B TW237561 B TW 237561B TW 083105742 A TW083105742 A TW 083105742A TW 83105742 A TW83105742 A TW 83105742A TW 237561 B TW237561 B TW 237561B
Authority
TW
Taiwan
Prior art keywords
bond pad
pad design
stagger
basis point
stagger bond
Prior art date
Application number
TW083105742A
Other languages
Chinese (zh)
Inventor
Shyh-Wen Lii
Gwo-Tarng Lin
Torng-Jou Maa
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW083105742A priority Critical patent/TW237561B/en
Application granted granted Critical
Publication of TW237561B publication Critical patent/TW237561B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4905—Shape
    • H01L2224/4909—Loop shape arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H01L2224/49173—Radial fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

A stagger bond pad design without crossing line includes: 1. choosing the basis point; 2. setting the position of the chip bond pad by polar coordinate method with the basis point as origin; 3. extending from the connecting line between the basis point and bond pas to form the routing layout of guiding line.
TW083105742A 1994-06-24 1994-06-24 Stagger bond pad design TW237561B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW083105742A TW237561B (en) 1994-06-24 1994-06-24 Stagger bond pad design

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW083105742A TW237561B (en) 1994-06-24 1994-06-24 Stagger bond pad design

Publications (1)

Publication Number Publication Date
TW237561B true TW237561B (en) 1995-01-01

Family

ID=51400690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105742A TW237561B (en) 1994-06-24 1994-06-24 Stagger bond pad design

Country Status (1)

Country Link
TW (1) TW237561B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303948B1 (en) 1996-02-29 2001-10-16 Kabushiki Kaisha Toshiba Pad layout and lead layout in semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303948B1 (en) 1996-02-29 2001-10-16 Kabushiki Kaisha Toshiba Pad layout and lead layout in semiconductor device
US6617622B2 (en) 1996-02-29 2003-09-09 Kabushiki Kaisha Toshiba Pad layout and lead layout in semiconductor device having a center circuit

Similar Documents

Publication Publication Date Title
ATE82499T1 (en) OCULAR HYPOTENSIVE AGENTS.
IT1123805B (en) PROCEDURE TO PRODUCE CONNECTIONS OR SIMILAR FOR TUBULAR JOINTS, AS WELL AS TOOL TO IMPLEMENT THE PROCEDURE AND CONNECTION OR SIMILAR PRODUCT ACCORDING TO THAT PROCEDURE
DE3781114D1 (en) SOLDER CONNECTING DEVICE.
ATE310826T1 (en) INDUCTION OF MALE STERILITY IN PLANTS BY INCREASED EXPRESSION OF STREPTAVIDIN
DE69523862D1 (en) Lead-free soft solder
TW344092B (en) Semiconductor device provided with low melting point metal bumps and process for producing same
IT8519791A0 (en) PROXIMITY SWITCH AS WELL AS CONTROL CIRCUIT ARRANGEMENT FOR SAID.
ITRM930194A0 (en) MATERNITY DRESS FOR A DOLL THAT SIMULATES PREGNANCY.
TW237561B (en) Stagger bond pad design
LU90470B1 (en) Printing tools
ATE337102T1 (en) SPRAY DEVICE WITH AT LEAST ONE SEPARATION POINT
IT1228564B (en) ADJUSTMENT DEVICE TO CHANGE THE POSITIONS OF GUIDED UNITS ON MACHINES.
ES1032658U (en) End sections of connections for mineral wool conduits of the "climaver plus" type
EP0717441A3 (en) Method of solder bonding a body, e.g. a silicon chip, to another body
MY105266A (en) Supply pin rearrangement for an i.c.
EP0127234A3 (en) A retro-inverso analogue of the (5-14) decapeptide of equine angiotensinogen, as a specific renin inhibitor with high resistance to enzymatic hydrolysis
FR2527399B1 (en) INPUT IMPEDANCE CIRCUIT, HIGH
EP0394878A3 (en) Semiconductor device having multi-layered wiring structure
ES2121209T3 (en) CROSSING HEART POINT.
SE8702053L (en) SLANGFOERINGSANORDNING
ATE50142T1 (en) ANAL SUPPLEMENTS AND PACKAGING THEREOF.
JPS57114246A (en) Master-slice type semiconductor device
DE3581314D1 (en) SWITCHING FAULT PROTECTOR OD. DGL.
DE69517506D1 (en) CIRCUIT FOR A LAMP CONSISTING OF 2 ARMS CONNECTED TO THE LAMP
Branch Soldering Ultrafine Magnet Wire

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent