TW237468B - Electrically conductive copper paste - Google Patents

Electrically conductive copper paste

Info

Publication number
TW237468B
TW237468B TW82100029A TW82100029A TW237468B TW 237468 B TW237468 B TW 237468B TW 82100029 A TW82100029 A TW 82100029A TW 82100029 A TW82100029 A TW 82100029A TW 237468 B TW237468 B TW 237468B
Authority
TW
Taiwan
Prior art keywords
weight
phenol
electrically conductive
terephthalic
modified
Prior art date
Application number
TW82100029A
Other languages
Chinese (zh)
Inventor
Hirohumi Hatanaka
Koichi Machida
Kazuki Suzuki
Toru Fukuda
Kunio Nishihara
Nakayama Ichiro
Original Assignee
Mitsui Toatsu Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4342644A external-priority patent/JPH06194419A/en
Application filed by Mitsui Toatsu Chemicals filed Critical Mitsui Toatsu Chemicals
Application granted granted Critical
Publication of TW237468B publication Critical patent/TW237468B/en

Links

Landscapes

  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)

Abstract

An electrically conductive copper paste, which is characterized in containing: copper powder, bakelite A modified by terephthalic phenol as the modified terephthalic phenol, epoxy resin, and one inorganic filler with particle size of 0.1~1.0 #gm of aluminum oxide or kaolin, and necessary organic solvent, in which the ratio of the total weight of modified terephthalic phenol and epoxy resin to the weight of copper powder is 0.14~0.25, the ratio of inorganic filler fine particle to the weight of copper powder is 0.05~0.2, the ratio of the weight of epoxy resin to the weight of modified terephthalic phenol is 0.65~0.80.
TW82100029A 1991-12-27 1993-01-05 Electrically conductive copper paste TW237468B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34604891 1991-12-27
JP4342644A JPH06194419A (en) 1992-12-22 1992-12-22 Testing method of semiconductor circuit

Publications (1)

Publication Number Publication Date
TW237468B true TW237468B (en) 1995-01-01

Family

ID=51400673

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82100029A TW237468B (en) 1991-12-27 1993-01-05 Electrically conductive copper paste

Country Status (1)

Country Link
TW (1) TW237468B (en)

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