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Priority claimed from JP4342644Aexternal-prioritypatent/JPH06194419A/en
Application filed by Mitsui Toatsu ChemicalsfiledCriticalMitsui Toatsu Chemicals
Application grantedgrantedCritical
Publication of TW237468BpublicationCriticalpatent/TW237468B/en
An electrically conductive copper paste, which is characterized in containing: copper powder, bakelite A modified by terephthalic phenol as the modified terephthalic phenol, epoxy resin, and one inorganic filler with particle size of 0.1~1.0 #gm of aluminum oxide or kaolin, and necessary organic solvent, in which the ratio of the total weight of modified terephthalic phenol and epoxy resin to the weight of copper powder is 0.14~0.25, the ratio of inorganic filler fine particle to the weight of copper powder is 0.05~0.2, the ratio of the weight of epoxy resin to the weight of modified terephthalic phenol is 0.65~0.80.