TW232051B - Measuring device of heating power of circuit module - Google Patents
Measuring device of heating power of circuit moduleInfo
- Publication number
- TW232051B TW232051B TW82107470A TW82107470A TW232051B TW 232051 B TW232051 B TW 232051B TW 82107470 A TW82107470 A TW 82107470A TW 82107470 A TW82107470 A TW 82107470A TW 232051 B TW232051 B TW 232051B
- Authority
- TW
- Taiwan
- Prior art keywords
- enclosed chamber
- heat
- component
- measuring
- heat conduction
- Prior art date
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
A heat power measuring device installed on the component of circuit board,which the radiation surface departs from the circuit board, includes: - a tubular body that can be placed on circuit component to orient thexis of the body approximately vertical to the plane of circuit board inttempt to build a heat conduction path to let most of the power of theomponent surface flow through this body; - a highly heat-conductive first separation board where is located in theody but some distance away from the radiation surface of the componenterving as the top of the first enclosed chamber and the bottom of theecond enclosed chamber; - a highly heat-conductive second separation board where is located inhe body serving as the top of the second enclosed chamber. - a heat conduction device where is located in the first enclosed chamberor providing better heat conduction path between the component and theirst separation board; - a heat conduction substance that is stuffed in the above-mentionedecond enclosed chamber to generate temperature difference between theirst and the second separation board when heat is passing through; - a device, which measures the temperature difference of theeat-conductive substance passing through the second enclosed chamber,onsisting of the first temperature sensing component for measuring theemperature of the first separation board and the second temperatureensing component for measuring the temperature of the second separationoard; Therefore, the temperature difference measured according to the heatresistance in the second enclosed chamber and temperature measuring devicecan be used to calculate the heat power arising from the circuit componentsurface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW82107470A TW232051B (en) | 1993-09-09 | 1993-09-09 | Measuring device of heating power of circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW82107470A TW232051B (en) | 1993-09-09 | 1993-09-09 | Measuring device of heating power of circuit module |
Publications (1)
Publication Number | Publication Date |
---|---|
TW232051B true TW232051B (en) | 1994-10-11 |
Family
ID=51348666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW82107470A TW232051B (en) | 1993-09-09 | 1993-09-09 | Measuring device of heating power of circuit module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW232051B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8107493B2 (en) | 2005-06-09 | 2012-01-31 | Samsung Electronics Co., Ltd. | Method and apparatus for transmitting and receiving legacy format data in high throughput wireless network |
CN104914299A (en) * | 2015-07-15 | 2015-09-16 | 福州大学 | Comparison heat measuring device for measuring loss of magnetic element and measurement method thereof |
-
1993
- 1993-09-09 TW TW82107470A patent/TW232051B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8107493B2 (en) | 2005-06-09 | 2012-01-31 | Samsung Electronics Co., Ltd. | Method and apparatus for transmitting and receiving legacy format data in high throughput wireless network |
US8660140B2 (en) | 2005-06-09 | 2014-02-25 | Samsung Electronics Co., Ltd. | Method and apparatus for transmitting and receiving legacy format data in high throughput wireless network |
CN104914299A (en) * | 2015-07-15 | 2015-09-16 | 福州大学 | Comparison heat measuring device for measuring loss of magnetic element and measurement method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |