TW218430B - - Google Patents

Info

Publication number: TW218430B
Authority: TW; Taiwan

Application number

TW081108111A

Other languages

Chinese (zh)

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-01-30

Filing date

1992-10-13

Publication date

1994-01-01

1992-10-13 Application filed by Motorola Inc filed Critical Motorola Inc

1994-01-01 Application granted granted Critical

1994-01-01 Publication of TW218430B publication Critical patent/TW218430B/zh

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

TW081108111A 1992-01-30 1992-10-13 TW218430B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US82843592A	1992-01-30	1992-01-30

Publications (1)

Publication Number	Publication Date
TW218430B true TW218430B (en)	1994-01-01

Family

ID=25251798

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW081108111A TW218430B (en)	1992-01-30	1992-10-13

Country Status (5)

Country	Link
CN (1)	CN1075589A (en)
IL (1)	IL103439A0 (en)
MX (1)	MX9300505A (en)
TW (1)	TW218430B (en)
WO (1)	WO1993015594A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7026060B2 (en)	2001-07-03	2006-04-11	N.V. Bekaert S.A.	Layered structure providing shielding characteristics
EP1481575A4 (en) *	2002-03-04	2007-11-28	Printar Ltd	Digital application of protective soldermask to printed circuit boards
US7709766B2 (en)	2002-08-05	2010-05-04	Research Foundation Of The State University Of New York	System and method for manufacturing embedded conformal electronics
EP2273182B1 (en) *	2009-07-07	2018-12-19	Siteco Beleuchtungstechnik GmbH	Three-dimensional LED holder element with thermal conductivity
CN111263529A (en) *	2020-01-20	2020-06-09	安捷利（番禺）电子实业有限公司	Preparation method of high-frequency flexible circuit board, high-frequency flexible circuit board and electronic equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB938365A (en) *	1959-01-08	1963-10-02	Photocircuits Corp	Method of making printed circuits
US3425864A (en) *	1965-07-21	1969-02-04	Templeton Coal Co	Method for making electric resistance heaters
JPS5534415A (en) *	1978-09-01	1980-03-11	Sumitomo Bakelite Co	Method of manufacturing printed circuit board
US4424408A (en) *	1979-11-21	1984-01-03	Elarde Vito D	High temperature circuit board
US4532152A (en) *	1982-03-05	1985-07-30	Elarde Vito D	Fabrication of a printed circuit board with metal-filled channels
DD247467A1 (en) *	1986-03-31	1987-07-08	Forschungszentrum Des Werkzeugmaschinenbaues,Dd	METHOD OF COATING THE SURFACE / SUB-SURFACE OF PLASTER SUBSTRATES
US4940623A (en) *	1988-08-09	1990-07-10	Bosna Alexander A	Printed circuit board and method using thermal spray techniques
JPH02222593A (en) *	1989-02-23	1990-09-05	Fuji Xerox Co Ltd	Wiring board and manufacture thereof
DE3928434A1 (en) *	1989-08-24	1991-02-28	Schering Ag	Direct metallisation of non-conductive polymer substrate - by electroplating onto reduced or thermally decomposed metal cpd. layer

1992
- 1992-10-13 TW TW081108111A patent/TW218430B/zh active
- 1992-10-14 WO PCT/US1992/008681 patent/WO1993015594A1/en active Search and Examination
- 1992-10-15 IL IL103439A patent/IL103439A0/en unknown
1993
- 1993-01-09 CN CN93100249A patent/CN1075589A/en active Pending
- 1993-01-29 MX MX9300505A patent/MX9300505A/en unknown

Also Published As

Publication number	Publication date
CN1075589A (en)	1993-08-25
MX9300505A (en)	1993-07-01
WO1993015594A1 (en)	1993-08-05
IL103439A0 (en)	1993-03-15

Publication	Publication Date	Title
TW222251B (en)	1994-04-11
DE9200027U1 (en)	1993-06-17
DE9217165U1 (en)	1993-02-18
DE9200071U1 (en)	1992-04-30
TW218430B (en)	1994-01-01
DE9200192U1 (en)	1992-03-05
DE9200034U1 (en)	1992-03-19
DE9200172U1 (en)	1992-03-12
DE9200099U1 (en)	1992-04-02
DE9200181U1 (en)	1992-03-05
DE9200083U1 (en)	1992-02-27
DE9200051U1 (en)	1992-03-19
DE9200056U1 (en)	1993-05-13
DE9200180U1 (en)	1992-03-05
DE9200148U1 (en)	1992-10-08
DE9200169U1 (en)	1992-03-19
DE9200131U1 (en)	1992-07-30
DE9203694U1 (en)	1992-04-30
DE9200091U1 (en)	1992-02-27
DE9200130U1 (en)	1992-03-19
TW252113B (en)	1995-07-21
DE9200107U1 (en)	1992-03-05
DE9200168U1 (en)	1992-03-19
DE9200089U1 (en)	1993-05-06
DE9200143U1 (en)	1993-05-13