TW202409675A - Backlights including patterned glass diffusers and methods for fabricating the backlights - Google Patents
Backlights including patterned glass diffusers and methods for fabricating the backlights Download PDFInfo
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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Abstract
Description
[相關申請的交叉引用]本案根據美國專利法主張2022年4月19日提出申請的美國臨時申請序號63/332373的優先權益，依賴該申請的內容並且該申請全文以引用方式併入本文。[Cross-reference to related applications] This case claims the priority rights of U.S. Provisional Application Serial No. 63/332373 filed on April 19, 2022, in accordance with U.S. patent law. It relies on the content of this application and the full text of this application is incorporated herein by reference.
本案大體上係關於用於顯示器的背光。更具體地，本案係關於包括支撐光源的圖案化玻璃漫射器的背光。This case is generally about backlighting for displays. More specifically, the case relates to backlighting that includes a patterned glass diffuser that supports a light source.
液晶顯示器(LCD)通常用於各種電子裝置，諸如蜂巢式電話、膝上型電腦、電子平板電腦、電視和電腦監視器。LCD是基於光閥的顯示器，其中顯示面板包括可單獨定址的光閥的陣列。LCD可包括用於產生光的背光，接著可對光進行波長轉換、濾波及/或偏振以從LCD產生圖像。背光可以是側光式或直光式。側光式背光可包括邊緣耦合到導光板的發光二極體(LED)陣列，該導光板從其表面發射光。直光式背光可包括位於LCD面板正後方的二維(2D) LED陣列。Liquid crystal displays (LCDs) are commonly used in a variety of electronic devices, such as cellular phones, laptops, electronic tablets, televisions, and computer monitors. LCDs are light valve-based displays, where the display panel includes an array of individually addressable light valves. The LCD may include a backlight for generating light, which may then be wavelength converted, filtered, and/or polarized to generate images from the LCD. Backlighting can be edge-lit or direct-lit. An edge-lit backlight may include an array of light emitting diodes (LEDs) edge-coupled to a light guide plate that emits light from its surface. Direct-lit backlighting can include a two-dimensional (2D) LED array located directly behind the LCD panel.
與側光式背光相比，直光式背光可具有改進的動態對比度的優勢。例如，具有直光式背光的顯示器可獨立調節每個LED的亮度，以設定跨圖像的亮度的動態範圍。這通常稱為局部調光。然而，為了實現期望的光均勻性及/或避免直光式背光中的熱點，可將漫射器板或薄膜定位在距LED一定距離的位置，因此使整體顯示器厚度大於側光式背光的厚度。定位在LED上方的透鏡已經用於改進直光式背光中光的側向傳播。然而，在此類配置中，光在LED與漫射器板或薄膜之間行進的光學距離(OD) (例如，從至少10毫米至通常約20-30毫米)仍然會導致不合需要的高整體顯示器厚度及/或這些配置可能會隨著背光厚度的減小而產生不期望的光學損失。雖然側光式背光可能更薄，但是來自每個LED的光可跨導光板的較大區域傳播，使得關閉個別LED或LED組可對動態對比率具有僅最小影響。Direct-lit backlighting may have the advantage of improved dynamic contrast compared to edge-lit backlighting. For example, a display with a direct-lit backlight can adjust the brightness of each LED independently to set a dynamic range of brightness across the image. This is often called local dimming. However, to achieve the desired light uniformity and/or avoid hot spots in direct-lit backlights, the diffuser plate or film can be positioned some distance from the LEDs, thus making the overall display thickness greater than that of edge-lit backlights . Lenses positioned above the LEDs have been used to improve the lateral spread of light in direct-lit backlights. However, in such configurations, the optical distance (OD) that light travels between the LED and the diffuser plate or film (e.g., from at least 10 mm to typically about 20-30 mm) still results in undesirably high overall Display thickness and/or these configurations may produce undesirable optical losses as backlight thickness decreases. Although edge-lit backlights may be thinner, the light from each LED can spread across a larger area of the light guide, so that turning off individual LEDs or groups of LEDs can have only minimal impact on dynamic contrast ratio.
本案的一些實施方案涉及一種背光。背光包括圖案化玻璃漫射器、再分佈層、複數個光源和黏合劑。圖案化玻璃漫射器包括玻璃基板和位於玻璃基板的第一表面上的可變漫射器圖案。複數個光源電耦合到再分佈層並且靠近玻璃基板的與第一表面相對的第二表面。黏合劑位於再分佈層與圖案化玻璃漫射器之間。Some embodiments of the present invention relate to a backlight. The backlight includes a patterned glass diffuser, a redistribution layer, multiple light sources and adhesives. The patterned glass diffuser includes a glass substrate and a variable diffuser pattern located on a first surface of the glass substrate. A plurality of light sources are electrically coupled to the redistribution layer and proximate a second surface of the glass substrate opposite the first surface. The adhesive is located between the redistribution layer and the patterned glass diffuser.
本案的又其他實施方案涉及一種背光。背光包括圖案化玻璃漫射器、再分佈層、複數個光源、阻焊劑層和黏合劑。複數個光源電耦合到再分佈層並且靠近圖案化玻璃漫射器。阻焊劑層靠近再分佈層。黏合劑位於阻焊劑層與圖案化玻璃漫射器之間。Still other embodiments of this case relate to a backlight. The backlight includes a patterned glass diffuser, a redistribution layer, multiple light sources, a solder mask layer and adhesive. A plurality of light sources are electrically coupled to the redistribution layer and proximate the patterned glass diffuser. The solder resist layer is close to the redistribution layer. The adhesive is located between the solder mask layer and the patterned glass diffuser.
本案的又其他實施方案涉及一種用於製造背光的方法。該方法包括將剝離層施加到第一玻璃基板，以及在剝離層上形成再分佈層。該方法包括將複數個光源電耦合到再分佈層，以及在再分佈層和複數個光源上方施加黏合劑。該方法包括將第二玻璃基板附接到黏合劑，以及從再分佈層移除第一玻璃基板。Still other embodiments of the present invention relate to a method for manufacturing a backlight. The method includes applying a release layer to a first glass substrate and forming a redistribution layer on the release layer. The method includes electrically coupling a plurality of light sources to the redistribution layer and applying an adhesive over the redistribution layer and the plurality of light sources. The method includes attaching a second glass substrate to the adhesive and removing the first glass substrate from the redistribution layer.
本文所揭示的背光製造方法與習知發光二極體(LED)轉移和維修裝備相容。背光可使用習知頂部發射LED晶片。玻璃電路板(例如，包括玻璃基板、再分佈層和LED)可在與圖案化玻璃漫射器整合之前進行測試和維修。在所揭示的背光中，可消除用於光分佈的附加光學部件，諸如圓頂透鏡。與典型背光相比，所揭示的背光由於圖案化玻璃漫射器與LED之間的光學結合可具有更高光發射效率。背光內的LED可改進與圖案化玻璃漫射器的可變漫射器圖案的對準，原因是它們藉由黏合劑結合到圖案化玻璃漫射器。可在將玻璃電路板附接到圖案化玻璃漫射器基板之後製造(例如，印刷)圖案化玻璃漫射器的可變漫射器圖案以使可變漫射器圖案相對於每個個別LED精確對準。由於在移除玻璃電路板的玻璃基板之後的單芯基板結構，因此所揭示的背光可具有薄的外形尺寸。所揭示的背光可具有窄邊框或無邊框，該邊框具有低CTE單芯基板結構。由於無芯電路板結構(例如，抬起玻璃基板)，可改進背光的熱管理設計。即使對於較大大小顯示器，也可實現包括沒有平鋪的全大小LED電路板的背光。另外，在抬起玻璃電路板的玻璃基板之後，可將外部連接電纜或外部驅動積體電路(IC)板附接到背光。The backlight manufacturing method disclosed herein is compatible with known light emitting diode (LED) transfer and repair equipment. The backlight can use known top emitting LED chips. The glass circuit board (e.g., including a glass substrate, a redistribution layer, and LEDs) can be tested and repaired before integration with a patterned glass diffuser. In the disclosed backlight, additional optical components used for light distribution, such as dome lenses, can be eliminated. Compared to a typical backlight, the disclosed backlight can have a higher light emission efficiency due to the optical bond between the patterned glass diffuser and the LEDs. The LEDs within the backlight can improve alignment with the variable diffuser pattern of the patterned glass diffuser because they are bonded to the patterned glass diffuser by an adhesive. The variable diffuser pattern of the patterned glass diffuser can be manufactured (e.g., printed) after the glass circuit board is attached to the patterned glass diffuser substrate so that the variable diffuser pattern is precisely aligned with respect to each individual LED. Due to the single core substrate structure after removing the glass substrate of the glass circuit board, the disclosed backlight can have a thin form factor. The disclosed backlight can have a narrow bezel or no bezel, which has a low CTE single core substrate structure. Due to the coreless circuit board structure (e.g., lifting the glass substrate), the thermal management design of the backlight can be improved. Even for larger size displays, a backlight including a full-size LED circuit board without tiling can be realized. In addition, after lifting the glass substrate of the glass circuit board, external connection cables or external drive integrated circuit (IC) boards can be attached to the backlight.
附加的特徵和優點將在以下詳細描述中進行陳述，並且熟習此項技術者根據該描述很容易理解或藉由實踐如本文所述的實施方案(包括以下實施方式、請求項以及附圖)將很容易認識其部分內容。Additional features and advantages will be set forth in the following detailed description, and will be readily understood by those skilled in the art from the description, or may be learned by practice of the embodiments described herein, including the following description, claims, and drawings. It's easy to recognize parts of it.
應當理解，上述一般描述和以下詳細描述均僅是示例性的，並且旨在為理解請求項的本質和特徵提供概要或框架。包括附圖以提供對實施方案的進一步理解並且該附圖併入本說明書且構成本說明書的一部分。附圖說明一或多個實施方案，並且與描述一起解釋各種實施方案的原理和操作。It is to be understood that both the foregoing general description and the following detailed description are exemplary only and are intended to provide an overview or framework for understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding of the embodiments, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments and, together with the description, explain the principles and operations of the various embodiments.
現將詳細參考本案的實施方案，其實例在附圖中予以說明。在任何可能的情況下，所有附圖中相同元件符號將用以代表相同或相似的部分。然而，本案可被體現為許多不同的形式並且不應被解釋為限於本文所闡述的實施方案。Reference will now be made in detail to the embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to represent the same or similar parts. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
範圍在本文中可表達為從「約」一個特定值及/或到「約」另一個特定值。當表達這種範圍時，另一個實施方案包括從該一個特定值及/或至該另一個特定值。類似地，在藉由使用先行詞「約」將值表達為近似值時，應當理解特定值形成另一個實施方案。還應當理解，範圍中的每一個的端點相對於另一端點以及獨立於另一端點都是有意義的。A range may be expressed herein as from "about" one particular value and/or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when a value is expressed as an approximation by use of the antecedent "about," it should be understood that the particular value forms another embodiment. It should also be understood that each endpoint of a range is significant relative to and independent of the other endpoint.
如本文所用的方向性術語—例如上、下、右、左、前、後、頂、底、豎直、水平—僅參考如所繪製的圖作出，並且並不旨在暗示絕對取向。Directional terms used herein—eg, up, down, right, left, front, back, top, bottom, vertical, horizontal—are made only with reference to the figures as drawn and are not intended to imply an absolute orientation.
除非另外明確地表達，否則本文所闡述的任何方法決不意圖被理解為要求其步驟以具體次序執行，也不意圖要求任何設備特有的取向。因此，在方法請求項實際上並未敘述有待由其步驟遵循的次序或任何設備請求項實際上並未敘述個別部件的次序或取向，或請求項或說明書中並未以其他方式明確陳述步驟局限於具體次序或並未敘述設備的部件的具體次序或取向的情況下，決不意圖在任何方面推斷次序或取向。這適用於任何可能的非明示解釋基礎，包括：關於步驟佈置的邏輯事項；操作流程；部件次序；或部件取向；從語法組織或標點得出的明顯含義；和說明書中所描述的實施方案的數目或類型。Unless otherwise expressly stated, any method described herein is not intended to be construed as requiring that its steps be performed in a specific order, nor is it intended to require any particular orientation of the apparatus. Thus, in the event that a method claim does not actually state an order to be followed by its steps or any apparatus claim does not actually state an order or orientation of individual components, or the claim or specification does not otherwise explicitly state that the steps are limited to a specific order or does not state a specific order or orientation of components of the apparatus, no order or orientation is intended to be inferred in any respect. This applies to any possible non-express basis for interpretation, including: logical matters regarding arrangement of steps; operational flow; order of components; or orientation of components; obvious meaning derived from grammatical organization or punctuation; and the number or type of embodiments described in the specification.
因此，除非上下文另外明確指出，否則如本文所用，單數形式「一個(種)」和「該」包括複數個指示物。因此，例如，除非上下文另外明確指示，否則對「一個」部件的引用包括具有兩個或更多個此類部件的態樣。Thus, as used herein, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a" component includes aspects with two or more such components, unless the context clearly indicates otherwise.
為了保持與有機發光二極體(OLED)顯示器和各種新興顯示技術諸如量子點(QD) OLED顯示器、微型LED顯示器等的爭用，液晶顯示器(LCD)的圖像品質正得以改進。LCD被設計來包括更高解析度、更高峰值亮度、高動態範圍(HDR)和更高對比率，以及改進的美學設計，諸如窄(或無)邊框和更薄外形尺寸。二維(2D)局部可調光直光式背光技術可滿足更高峰值亮度、高動態範圍和更高對比率的需求。最近，微型LED引起2D局部可調光直光式背光應用的關注，原因是微型LED可藉由減小光學距離(OD)來實現更薄外形尺寸，藉由增加調光區的數量來提高對比，為HDR提高峰值亮度，並且實現窄邊框或無邊框設計。To keep up with organic light-emitting diode (OLED) displays and various emerging display technologies such as quantum dot (QD) OLED displays, micro-LED displays, etc., the image quality of liquid crystal displays (LCDs) is being improved. LCDs are designed to include higher resolution, higher peak brightness, high dynamic range (HDR), and higher contrast ratios, as well as improved aesthetics such as narrow (or no) bezels and thinner form factors. Two-dimensional (2D) locally dimmable direct backlight technology can meet the needs of higher peak brightness, high dynamic range, and higher contrast ratios. Recently, micro-LEDs have attracted attention for 2D locally dimmable direct backlight applications because micro-LEDs can achieve thinner form factors by reducing the optical distance (OD), improve contrast by increasing the number of dimming zones, increase peak brightness for HDR, and achieve narrow bezel or no bezel designs.
然而，背光中的微型LED改型可能需要新材料和堆疊設計。由於微型LED的尺寸很小，表面貼裝技術(SMT)裝備需要高圖案精度和電路板的尺寸穩定性。習知塑膠基印刷電路板(PCB)可能已經達到微型LED背光LCD顯示器的圖案精度和尺寸穩定性的極限。包括固有抗彎剛度、平坦表面和更高熱尺寸穩定性的玻璃或玻璃陶瓷基板可替代典型基板材料，諸如FR-4。玻璃電路板(GCB)可提高更大大小(例如，大於約400 x 500毫米的典型PCB大小)的LED轉移良率和焊接可靠性，這可實現更低成本和更可靠背光。However, retrofitting micro-LEDs in backlights may require new materials and stacking designs. Due to the small size of micro-LEDs, surface mount technology (SMT) equipment requires high pattern accuracy and dimensional stability of the circuit board. It is known that plastic-based printed circuit boards (PCBs) may have reached the limits of pattern accuracy and dimensional stability of micro-LED-backlit LCD displays. Glass or glass-ceramic substrates that include inherent bending stiffness, flat surfaces, and greater thermal dimensional stability can replace typical substrate materials, such as FR-4. Glass circuit boards (GCBs) improve LED transfer yield and soldering reliability at larger sizes (e.g., greater than the typical PCB size of about 400 x 500 mm), which enables lower cost and more reliable backlighting.
除了玻璃電路板之外，還期望藉由減小光學距離來實現更薄外形尺寸。從數千個微型LED晶片產生的光應該經分佈以產生背光的均勻照射，並且微型LED背光的光學結構應當佔據有限豎直空間。可利用圖案化導光板(LGP)實現藉由減小OD的更薄形狀係數，該導光板包括表面上的工程反射和光提取圖案。圖案化玻璃漫射器(PGD)可能會大大減小OD。In addition to glass circuit boards, there is also a desire to achieve thinner form factors by reducing optical distances. The light generated from thousands of micro-LED dies should be distributed to produce uniform illumination of the backlight, and the optical structure of the micro-LED backlight should occupy a limited vertical space. Thinner form factors by reducing OD can be achieved using patterned light guide plates (LGPs), which include engineered reflection and light extraction patterns on the surface. Patterned glass diffusers (PGD) may significantly reduce OD.
實現更薄背光的許多典型設計與習知LED晶片和SMT裝備不相容，需要底部發射LED晶片或附加改裝。另外，在整合之前測試典型LED板可能很困難。一旦整合完成，發生故障的LED晶片就無法利用習知維修裝備進行維修。Many typical designs for achieving thinner backlights are incompatible with conventional LED chips and SMT equipment, requiring bottom-emitting LED chips or additional modifications. Additionally, testing typical LED boards before integration can be difficult. Once the integration is completed, the failed LED chip cannot be repaired using conventional repair equipment.
因此，本文揭露使用LED (例如，微型LED)的直光式背光，其中整合GCB和PGD以包括單個玻璃基板。背光可使用習知頂部發射LED晶片使用SMT和維修裝備來製造。GCB將電流遞送到LED，並且PGD光學結合到每個LED，以在薄的外形尺寸中實現均勻的亮度。因為GCB和PGD均包括匹配的熱膨脹係數(CTE)，所以LED可與PGD的圖案對準，使得提高光學效能。在從GCB抬起玻璃基板之後，可實現單個基板結構，從而得到極薄外形尺寸背光。Thus, disclosed herein is a direct-lit backlight using LEDs (e.g., micro-LEDs) in which the GCB and PGD are integrated to include a single glass substrate. The backlight can be manufactured using known top-emitting LED chips using SMT and repair equipment. The GCB delivers current to the LEDs, and the PGD is optically bonded to each LED to achieve uniform brightness in a thin form factor. Because both the GCB and PGD include matching coefficients of thermal expansion (CTE), the LEDs can be aligned with the pattern of the PGD, resulting in improved optical efficiency. After lifting the glass substrate from the GCB, a single substrate structure can be achieved, resulting in an extremely thin form factor backlight.
現在參考圖1A，圖示示例性背光100a的簡化剖視圖。背光100a包括再分佈層102、複數個光源108 (一個光源在圖1A中例示)、黏合劑120和圖案化玻璃或其他合適的材料(例如，塑膠)漫射器122。在某些示例性實施方案中，圖案化漫射器122可包括玻璃基板128和位於玻璃基板的第一表面124上的可變漫射器圖案130。在其他實施方案中，圖案化漫射器122可包括塑膠(例如，PMMA)基板128和位於塑膠基板的第一表面124上的可變漫射器圖案130。複數個光源108電耦合到再分佈層102並且靠近基板128的與第一表面124相對的第二表面126。Referring now to FIG. 1A , a simplified cross-sectional view of an exemplary backlight 100a is illustrated. Backlight 100a includes a redistribution layer 102, a plurality of light sources 108 (one light source is illustrated in FIG. 1A), an adhesive 120, and a patterned glass or other suitable material (eg, plastic) diffuser 122. In certain exemplary embodiments, patterned diffuser 122 may include a glass substrate 128 and a variable diffuser pattern 130 located on first surface 124 of the glass substrate. In other embodiments, the patterned diffuser 122 may include a plastic (eg, PMMA) substrate 128 and a variable diffuser pattern 130 located on the first surface 124 of the plastic substrate. A plurality of light sources 108 is electrically coupled to the redistribution layer 102 and proximate a second surface 126 of the substrate 128 opposite the first surface 124 .
再分佈層102包括由介電材料(例如，樹脂) 106分離的導電材料(例如，金屬，諸如銅)跡線104。每個光源108包括藉由導電材料(例如，焊料) 112電耦合到再分佈層102的第一觸點110a和第二觸點110b。在某些示例性實施方案中，每個光源108可包括頂部發射發光二極體(例如，微型LED)。The redistribution layer 102 includes conductive material (e.g., metal, such as copper) traces 104 separated by dielectric material (e.g., resin) 106. Each light source 108 includes a first contact 110a and a second contact 110b electrically coupled to the redistribution layer 102 by a conductive material (e.g., solder) 112. In certain exemplary embodiments, each light source 108 may include a top emitting light emitting diode (e.g., a micro-LED).
黏合劑120位於再分佈層102與圖案化漫射器122之間。黏合劑120可包括反射矽黏合劑或另一種合適的黏合劑。在某些示例性實施方案中，黏合劑120可包括有機基黏合劑和反射顆粒的混合物。根據反射顆粒的混合比，黏合劑120的光學性質諸如反射率、霧度和透射率以及黏度是可變的。黏合劑120的厚度可足以覆蓋複數個光源108。另外，黏合劑120的厚度可設定圖案化漫射器122與再分佈層102之間的距離。The adhesive 120 is located between the redistribution layer 102 and the patterned diffuser 122. The adhesive 120 may include a reflective silicone adhesive or another suitable adhesive. In certain exemplary embodiments, the adhesive 120 may include a mixture of an organic-based adhesive and reflective particles. Depending on the mixing ratio of the reflective particles, the optical properties of the adhesive 120, such as reflectivity, haze, and transmittance, and viscosity are variable. The thickness of the adhesive 120 may be sufficient to cover the plurality of light sources 108. In addition, the thickness of the adhesive 120 may set the distance between the patterned diffuser 122 and the redistribution layer 102.
根據各種實施方案，基板128可包括用於照明和顯示應用的任何合適的透明玻璃材料。如本文所用，術語「透明」旨在表示基板在光譜的可見區域(約420-750奈米)中的500毫米的長度上具有大於約70%的光學透射率。在某些實施方案中，示例性透明玻璃材料在紫外(UV)區域(約100-400奈米)中的500毫米的長度上可具有大於約50%的光學透射率。根據各種實施方案，對於從約450奈米至約650奈米範圍內的波長，基板可包括在50毫米的路徑長度上至少95%的光學透射率。According to various embodiments, substrate 128 may include any suitable transparent glass material for lighting and display applications. As used herein, the term "transparent" is intended to mean that the substrate has an optical transmission of greater than about 70% over a length of 500 millimeters in the visible region of the spectrum (about 420-750 nanometers). In certain embodiments, exemplary transparent glass materials can have an optical transmission of greater than about 50% over a length of 500 millimeters in the ultraviolet (UV) region (about 100-400 nanometers). According to various embodiments, the substrate can include an optical transmission of at least 95% over a path length of 50 millimeters for wavelengths ranging from about 450 nanometers to about 650 nanometers.
基板的光學性質可能受透明玻璃材料的折射率影響。根據各種實施方案，基板128可具有從約1.3至約1.8範圍內的折射率。在其他實施方案中，基板128可具有相對低位準的光衰減(例如，由於吸收及/或散射)。對於從約420-750奈米範圍內的波長，基板128的光衰減(α)可例如小於約5分貝/公尺。基板128可包括鋁矽酸鹽、鹼-鋁矽酸鹽、硼矽酸鹽、鹼-硼矽酸鹽、鋁硼矽酸鹽、鹼-鋁硼矽酸鹽、鈉石灰或其他合適的玻璃。適合用作玻璃基板128的市售玻璃的非限制性實例包括來自康寧公司的EAGLE XG®、Lotus™、Willow®、IrisTM和Gorilla®玻璃。在其他實施方案中，基板128可具有相對高位準的光衰減。對於從約420-750奈米範圍內的波長，基板128的光衰減(α)可例如大於約5分貝/公尺。The optical properties of the substrate may be affected by the refractive index of the transparent glass material. According to various embodiments, the substrate 128 may have a refractive index ranging from about 1.3 to about 1.8. In other embodiments, the substrate 128 may have a relatively low level of light attenuation (e.g., due to absorption and/or scattering). For wavelengths ranging from about 420-750 nanometers, the light attenuation (α) of the substrate 128 may be, for example, less than about 5 dB/m. The substrate 128 may include aluminosilicate, alkali-aluminosilicate, borosilicate, alkali-borosilicate, aluminum borosilicate, alkali-aluminum borosilicate, soda lime, or other suitable glass. Non-limiting examples of commercially available glasses suitable for use as glass substrate 128 include EAGLE XG®, Lotus™, Willow®, IrisTM, and Gorilla® Glass from Corning Incorporated. In other embodiments, substrate 128 may have a relatively high level of light attenuation. For wavelengths ranging from about 420-750 nanometers, the light attenuation (α) of substrate 128 may be, for example, greater than about 5 dB/meter.
可變漫射器圖案130分佈來自複數個光源108的光以均勻照亮基板128內的背光100a。可變漫射器圖案130可藉由減小接近每個光源108的區域中的光密度(例如，在每個光源108正上方)以及提取其他區域中(例如，光源108之間)的光來實現均勻的光分佈。在某些示例性實施方案中，可變漫射器圖案130可包括有機基透明材料(藉由UV或熱固化)加上反射顆粒。雖然圖案化漫射器122在本文中可稱為圖案化玻璃漫射器122，但是實施方案也適用於圖案化塑膠漫射器122。The variable diffuser pattern 130 distributes light from the plurality of light sources 108 to uniformly illuminate the backlight 100a within the substrate 128. The variable diffuser pattern 130 can achieve uniform light distribution by reducing the light density in the area close to each light source 108 (e.g., directly above each light source 108) and extracting light in other areas (e.g., between the light sources 108). In certain exemplary embodiments, the variable diffuser pattern 130 can include an organic-based transparent material (cured by UV or heat) plus reflective particles. Although the patterned diffuser 122 may be referred to herein as a patterned glass diffuser 122, embodiments are also applicable to patterned plastic diffusers 122.
圖1B是圖1A的背光100a的頂視圖，其包括複數個光源108和位於再分佈層102上的黏合劑120。光源108佈置成包括複數列和複數行的2D陣列。雖然在圖1B中以三列和三行例示九個光源108，但是在其他實施方案中，背光100a可包括以任何合適數量的列和任何合適數量的行佈置的任何合適數量的光源108。光源108也可佈置成其他週期性圖案，例如六邊形或三角形晶格，或者佈置成準週期性或非嚴格週期性圖案。例如，光源108之間的間距在背光的邊緣及/或拐角處可更小。FIG. 1B is a top view of the backlight 100a of FIG. 1A , which includes a plurality of light sources 108 and adhesive 120 on the redistribution layer 102 . The light sources 108 are arranged in a 2D array including columns and rows. Although nine light sources 108 are illustrated in three columns and three rows in Figure IB, in other implementations, backlight 100a may include any suitable number of light sources 108 arranged in any suitable number of columns and any suitable number of rows. The light sources 108 may also be arranged in other periodic patterns, such as hexagonal or triangular lattices, or in quasi-periodic or non-strictly periodic patterns. For example, the spacing between light sources 108 may be smaller at the edges and/or corners of the backlight.
再分佈層102 (圖1A)將電訊號傳遞到每個光源108以用於單獨控制每個光源。複數個光源108之每一者可例如是LED (例如，大小大於約0.5毫米)、微型LED (例如，大小在約0.1毫米與約0.5毫米之間)、微型LED (例如，大小小於約0.1毫米)、有機LED (OLED)或具有從約400奈米至約750奈米範圍內的波長的另一個合適的光源。在其他實施方案中，複數個光源108之每一者可具有短於400奈米及/或長於750奈米的波長。來自每個光源108的光被光學耦合到圖案化玻璃漫射器128。如本文所用，術語「光學耦合」旨在表示光源定位成靠近圖案化玻璃漫射器122的表面並且直接地或藉由黏合劑與圖案化玻璃漫射器122光學連通，以便將由於全內反射而至少部分地傳播的光引入圖案化玻璃漫射器122中。來自每個光源108的光被光學耦合到圖案化玻璃漫射器122，使得光的第一部分由於全內反射而在基板128中側向行進並且藉由可變漫射器圖案130從基板128提取出來，並且光的第二部分由於在黏合劑120的反射表面以及可變漫射器圖案130處的多次反射而在黏合劑120與可變漫射器圖案130之間側向行進或在(例如，用於LCD顯示器的)背光上方的光學膜堆疊(未示出)與黏合劑120之間側向行進。The redistribution layer 102 (FIG. 1A) transmits electrical signals to each light source 108 for controlling each light source individually. Each of the plurality of light sources 108 may be, for example, an LED (e.g., having a size greater than about 0.5 mm), a micro-LED (e.g., having a size between about 0.1 mm and about 0.5 mm), a micro-LED (e.g., having a size less than about 0.1 mm), an organic LED (OLED), or another suitable light source having a wavelength ranging from about 400 nm to about 750 nm. In other embodiments, each of the plurality of light sources 108 may have a wavelength shorter than 400 nm and/or longer than 750 nm. Light from each light source 108 is optically coupled to the patterned glass diffuser 128. As used herein, the term “optically coupled” is intended to mean that a light source is positioned proximate to a surface of the patterned glass diffuser 122 and is in optical communication with the patterned glass diffuser 122 either directly or through an adhesive so as to direct light at least partially propagating due to total internal reflection into the patterned glass diffuser 122 . Light from each light source 108 is optically coupled to the patterned glass diffuser 122 such that a first portion of the light travels laterally in the substrate 128 due to total internal reflection and is extracted from the substrate 128 through the variable diffuser pattern 130, and a second portion of the light travels laterally between the adhesive 120 and the variable diffuser pattern 130 due to multiple reflections at the reflective surface of the adhesive 120 and the variable diffuser pattern 130 or between an optical film stack (not shown) above a backlight (e.g., for an LCD display) and the adhesive 120.
圖1C是示例性背光100b的簡化剖視圖。背光100b類似於先前參考圖1A描述和說明的背光100a。然而，在背光100b中，再分佈層102形成連接器142 (例如，柔性連接器)。另外，剝離層140附接到再分佈層102的底表面。連接器142可電連接到光源驅動電路以控制每個光源108。剝離層140可用於實現上面形成有再分佈層102的基板的抬起，如下文更詳細地描述。剝離層140可包括3M® LTHC (光-熱轉換塗層)或另一種合適的材料。Figure 1C is a simplified cross-sectional view of an exemplary backlight 100b. Backlight 100b is similar to backlight 100a previously described and illustrated with reference to FIG. 1A. However, in backlight 100b, redistribution layer 102 forms connector 142 (eg, a flexible connector). Additionally, a release layer 140 is attached to the bottom surface of the redistribution layer 102 . Connector 142 may be electrically connected to light source driving circuitry to control each light source 108 . The release layer 140 may be used to effect lifting of the substrate with the redistribution layer 102 formed thereon, as described in greater detail below. Release layer 140 may include 3M® LTHC (light-to-heat conversion coating) or another suitable material.
圖1D是示例性背光100c的簡化剖視圖。背光100c類似於先前參考圖1C描述和說明的背光100b。然而，背光100c還包括位於玻璃基板128的第二表面126上的均勻漫射器圖案132。在此實施方案中，玻璃基板128的第二表面126以及均勻漫射器圖案132面對複數個光源108，並且玻璃基板128的第一表面124以及可變漫射器圖案130背對複數個光源108。然而，在其他實施方案中，玻璃基板128的第二表面126以及均勻漫射器圖案132可背對複數個光源108，並且玻璃基板128的第一表面124以及可變漫射器圖案130可面對複數個光源108。與背光100b相比，均勻漫射器圖案132可提高背光100c的光效率。在某些示例性實施方案中，均勻漫射器圖案132可包括有機基透明材料(藉由UV或熱固化)加上反射顆粒。FIG. 1D is a simplified cross-sectional view of an exemplary backlight 100c. Backlight 100c is similar to backlight 100b previously described and illustrated with reference to FIG. 1C. However, backlight 100c further includes a uniform diffuser pattern 132 located on the second surface 126 of glass substrate 128. In this embodiment, the second surface 126 of glass substrate 128 and the uniform diffuser pattern 132 face the plurality of light sources 108, and the first surface 124 of glass substrate 128 and the variable diffuser pattern 130 face away from the plurality of light sources 108. However, in other embodiments, the second surface 126 of glass substrate 128 and the uniform diffuser pattern 132 may face away from the plurality of light sources 108, and the first surface 124 of glass substrate 128 and the variable diffuser pattern 130 may face the plurality of light sources 108. The uniform diffuser pattern 132 can improve the light efficiency of the backlight 100c compared to the backlight 100b. In some exemplary embodiments, the uniform diffuser pattern 132 can include an organic-based transparent material (cured by UV or heat) plus reflective particles.
圖1E是示例性背光100d的簡化剖視圖。背光100d類似於先前參考圖1A描述和說明的背光100a。然而，在背光100d中，玻璃基板128的第二表面126背對複數個光源108，並且玻璃基板128的第一表面124和可變漫射器圖案130面對複數個光源108。Figure IE is a simplified cross-sectional view of an exemplary backlight 100d. Backlight 100d is similar to backlight 100a previously described and illustrated with reference to Figure 1A. However, in the backlight 100d, the second surface 126 of the glass substrate 128 faces away from the plurality of light sources 108, and the first surface 124 of the glass substrate 128 and the variable diffuser pattern 130 face the plurality of light sources 108.
圖1F是示例性背光100e的簡化剖視圖。背光100e類似於先前參考圖1A描述和說明的背光100a。然而，背光100e還包括位於玻璃基板128的第一表面124上的均勻漫射器圖案132。可變漫射器圖案130形成在均勻漫射器圖案132上，使得均勻漫射器圖案132位於玻璃基板128與可變漫射器圖案130之間。與背光100a相比，均勻漫射器圖案132結合可變漫射器圖案130可提高背光100e的光效率。FIG. IF is a simplified cross-sectional view of an exemplary backlight 100e. Backlight 100e is similar to backlight 100a previously described and illustrated with reference to FIG. 1A. However, backlight 100e also includes a uniform diffuser pattern 132 on first surface 124 of glass substrate 128. Variable diffuser pattern 130 is formed on uniform diffuser pattern 132 such that uniform diffuser pattern 132 is located between glass substrate 128 and variable diffuser pattern 130 . Compared with the backlight 100a, the uniform diffuser pattern 132 combined with the variable diffuser pattern 130 can improve the light efficiency of the backlight 100e.
圖1G是示例性背光100f的簡化剖視圖。背光100f類似於先前參考圖1A描述和說明的背光100a。然而，背光100f包括位於再分佈層102上方的反射黏合劑層120和位於反射黏合劑層120上方的散射黏合劑層150。散射黏合劑層150接觸玻璃基板128的第二表面126。反射黏合劑層120可被分配到再分佈層102上並且固化。接下來，散射黏合劑層150可被施加在反射黏合劑層120上方。散射黏合劑層150可包括比反射黏合劑層120更少的反射顆粒含量。與背光100a相比，反射黏合劑層120結合散射黏合劑層150可提高背光100f的光學效能。FIG. 1G is a simplified cross-sectional view of an exemplary backlight 100f. Backlight 100f is similar to backlight 100a previously described and illustrated with reference to FIG. 1A. However, backlight 100f includes a reflective adhesive layer 120 located above redistribution layer 102 and a scattering adhesive layer 150 located above reflective adhesive layer 120. Scattering adhesive layer 150 contacts second surface 126 of glass substrate 128. Reflective adhesive layer 120 can be dispensed onto redistribution layer 102 and cured. Next, scattering adhesive layer 150 can be applied over reflective adhesive layer 120. Scattering adhesive layer 150 can include less reflective particle content than reflective adhesive layer 120. Compared with the backlight 100a, the reflective adhesive layer 120 combined with the scattering adhesive layer 150 can improve the optical performance of the backlight 100f.
圖1H是示例性背光100g的簡化剖視圖。背光100g類似於先前參考圖1A描述和說明的背光100a。然而，背光100g包括位於再分佈層102與圖案化玻璃漫射器122之間的圖案化反射膜160。在此實施方案中，圖案化反射膜160接觸玻璃基板128的第二表面126。圖案化反射膜160包括對應於複數個光源108的複數個通孔(圖1H中例示一個通孔)。黏合劑120填充圖案化反射膜160、圖案化玻璃漫射器122與再分佈層102之間的剩餘空間。在此實施方案中，黏合劑120可以是透明黏合劑，其還在每個光源108與圖案化玻璃漫射器122之間提供光學結合。圖案化反射膜160可充當圖案化玻璃漫射器122與再分佈層102之間的間隔件。因此，圖案化反射膜160的厚度可大於每個光源108的頂部與再分佈層102之間的距離。在某些示例性實施方案中，圖案化反射膜160可包括有機基透明材料(藉由UV或熱固化)加上反射顆粒。FIG. 1H is a simplified cross-sectional view of an exemplary backlight 100g. The backlight 100g is similar to the backlight 100a previously described and illustrated with reference to FIG. 1A. However, the backlight 100g includes a patterned reflective film 160 located between the redistribution layer 102 and the patterned glass diffuser 122. In this embodiment, the patterned reflective film 160 contacts the second surface 126 of the glass substrate 128. The patterned reflective film 160 includes a plurality of through holes (one through hole is illustrated in FIG. 1H) corresponding to the plurality of light sources 108. The adhesive 120 fills the remaining space between the patterned reflective film 160, the patterned glass diffuser 122 and the redistribution layer 102. In this embodiment, the adhesive 120 may be a transparent adhesive that also provides an optical bond between each light source 108 and the patterned glass diffuser 122. The patterned reflective film 160 may act as a spacer between the patterned glass diffuser 122 and the redistribution layer 102. Therefore, the thickness of the patterned reflective film 160 may be greater than the distance between the top of each light source 108 and the redistribution layer 102. In certain exemplary embodiments, the patterned reflective film 160 may include an organic-based transparent material (cured by UV or heat) plus reflective particles.
圖1I是示例性背光100h的簡化剖視圖。背光100h類似於先前參考圖1A描述和說明的背光100a。然而，背光100h包括靠近(例如，接觸)再分佈層102的阻焊劑層170。在某些示例性實施方案中，阻焊劑層170可包括反射阻焊劑層(例如，白色阻焊劑層)。阻焊劑層170包圍每個光源108。黏合劑120位於阻焊劑層170與圖案化玻璃漫射器122之間。在此實施方案中，黏合劑120可以是包括散射顆粒的透明或透光黏合劑，該散射顆粒充當從光源108的側面發射的光的光路以提高光效率。在某些示例性實施方案中，每個光源108可在光源的頂表面上塗有反射層以最小化熱點。在此情況下，利用位於每個光源108的頂表面上的反射層，黏合劑120可增強背光100h的光學效能。Figure II is a simplified cross-sectional view of an exemplary backlight 100h. Backlight 100h is similar to backlight 100a previously described and illustrated with reference to Figure 1A. However, backlight 100 h includes solder resist layer 170 proximate (eg, contacting) redistribution layer 102 . In certain exemplary embodiments, solder resist layer 170 may include a reflective solder resist layer (eg, a white solder resist layer). A layer of solder resist 170 surrounds each light source 108 . Adhesive 120 is located between solder resist layer 170 and patterned glass diffuser 122 . In this embodiment, adhesive 120 may be a transparent or light-transmitting adhesive that includes scattering particles that act as a light path for light emitted from the sides of light source 108 to increase light efficiency. In certain exemplary embodiments, each light source 108 may be coated with a reflective layer on the top surface of the light source to minimize hot spots. In this case, adhesive 120 may enhance the optical performance of backlight 100h using a reflective layer on the top surface of each light source 108.
圖1J是示例性背光100i的簡化剖視圖。背光100i類似於先前參考圖1C描述和說明的背光100b。然而，背光100i包括附接到再分佈層102的底表面的功能層180。功能層180可藉由剝離層140或另一種合適的材料諸如黏合劑材料或焊料附接到再分佈層102。功能層180可包括用於複數個光源108的熱管理的散熱器或散熱膜、用於下游製程及/或用於完成的背光的保護膜、電路板(例如，用於驅動器積體電路以驅動複數個光源108)或另一個合適的層。FIG1J is a simplified cross-sectional view of an exemplary backlight 100i. The backlight 100i is similar to the backlight 100b previously described and illustrated with reference to FIG1C. However, the backlight 100i includes a functional layer 180 attached to the bottom surface of the redistribution layer 102. The functional layer 180 may be attached to the redistribution layer 102 by a peeling layer 140 or another suitable material such as an adhesive material or solder. The functional layer 180 may include a heat sink or heat sink film for thermal management of the plurality of light sources 108, a protective film for downstream processing and/or for the finished backlight, a circuit board (e.g., for a driver integrated circuit to drive the plurality of light sources 108), or another suitable layer.
圖2A至圖2G是示例性圖案化玻璃漫射器製造步驟的簡化剖視圖。圖2A是玻璃基板128的剖視圖。玻璃基板128的大小可基於有待製造的背光大小來設定，使得玻璃基板128在剩餘製造製程期間不經受切割。玻璃基板128包括第一表面124和與第一表面124相對的第二表面126。2A to 2G are simplified cross-sectional views of exemplary patterned glass diffuser manufacturing steps. FIG. 2A is a cross-sectional view of a glass substrate 128. The size of the glass substrate 128 can be set based on the size of the backlight to be manufactured so that the glass substrate 128 is not cut during the remaining manufacturing process. The glass substrate 128 includes a first surface 124 and a second surface 126 opposite the first surface 124.
圖2B是在玻璃基板128的第一表面124上形成可變漫射器圖案130之後圖2A的玻璃基板128的剖視圖。可變漫射器圖案130可藉由印刷(例如，噴墨印刷、絲網印刷)、光微影和蝕刻製程或其他合適的製程形成。製程材料和條件可基於可變漫射器圖案130的解析度、期望的反射率、可擴展性等。2B is a cross-sectional view of the glass substrate 128 of FIG. 2A after forming a variable diffuser pattern 130 on the first surface 124 of the glass substrate 128. The variable diffuser pattern 130 may be formed by printing (e.g., inkjet printing, screen printing), photolithography and etching processes, or other suitable processes. Process materials and conditions may be based on the resolution, desired reflectivity, scalability, etc. of the variable diffuser pattern 130.
圖2C是在玻璃基板128的第二表面126上形成均勻漫射器圖案132之後圖2B的玻璃基板128和可變漫射器圖案130的剖視圖。可在玻璃基板128的第二表面126上印刷、層壓或使用另一種合適的製程形成均勻漫射器圖案132。2C is a cross-sectional view of the glass substrate 128 and the variable diffuser pattern 130 of FIG. 2B after the uniform diffuser pattern 132 is formed on the second surface 126 of the glass substrate 128. The uniform diffuser pattern 132 may be formed on the second surface 126 of the glass substrate 128 by printing, laminating, or using another suitable process.
圖2D是在玻璃基板128的第一表面124上形成均勻漫射器圖案132並且在均勻漫射器圖案132上形成可變漫射器圖案130之後圖2A的玻璃基板128的剖視圖。可在玻璃基板128的第一表面124上印刷、層壓或使用另一種合適的製程形成均勻漫射器圖案132。可變漫射器圖案130接著可藉由印刷(例如，噴墨印刷、絲網印刷)、光微影和蝕刻製程或其他合適的製程在均勻漫射器圖案132上形成。在其他實施方案中，可同時形成均勻漫射器圖案132和可變漫射器圖案130。FIG2D is a cross-sectional view of the glass substrate 128 of FIG2A after a uniform diffuser pattern 132 is formed on the first surface 124 of the glass substrate 128 and a variable diffuser pattern 130 is formed on the uniform diffuser pattern 132. The uniform diffuser pattern 132 may be formed on the first surface 124 of the glass substrate 128 by printing, laminating, or using another suitable process. The variable diffuser pattern 130 may then be formed on the uniform diffuser pattern 132 by printing (e.g., inkjet printing, screen printing), photolithography and etching processes, or other suitable processes. In other embodiments, the uniform diffuser pattern 132 and the variable diffuser pattern 130 may be formed simultaneously.
圖2E是在將反射膜160施加到玻璃基板128的第二表面126之後圖2B的玻璃基板128的剖視圖。反射膜160可包括感光膜。在此情況下，可使用光微影製程對感光膜進行圖案化，以限定對應於複數個光源的佈置的圖案162。光微影製程可形成具有精決定位的精細圖案，因此光源可被放置成與圖案化玻璃漫射器對準而無需另外的對準製程。2E is a cross-sectional view of the glass substrate 128 of FIG. 2B after the reflective film 160 is applied to the second surface 126 of the glass substrate 128. FIG. The reflective film 160 may include a photosensitive film. In this case, the photosensitive film may be patterned using a photolithography process to define a pattern 162 corresponding to the arrangement of the plurality of light sources. The photolithography process creates fine patterns with precise positioning, so the light source can be placed in alignment with the patterned glass diffuser without the need for additional alignment processes.
圖2F是在移除由圖案162限定的部分以形成穿過反射膜160的通孔164之後圖2E的具有反射膜160的玻璃基板128的剖視圖。如果使用光微影來限定圖案162，則可使用蝕刻製程移除由圖案162限定的部分。在其他實施方案中，可在將反射膜施加到玻璃基板128之前使用衝壓製程移除由圖案162限定的部分。雖然衝壓製程具有成本效益，但是衝壓製程可能以低於光微影製程的精度形成圖案化反射膜。2F is a cross-sectional view of the glass substrate 128 with reflective film 160 of FIG. 2E after removing the portion defined by pattern 162 to form through hole 164 through reflective film 160. If photolithography is used to define pattern 162, an etching process may be used to remove the portions defined by pattern 162. In other embodiments, a stamping process may be used to remove the portion defined by pattern 162 before applying the reflective film to glass substrate 128 . Although the stamping process is cost-effective, the stamping process may form patterned reflective films with lower accuracy than the photolithography process.
圖2G是在將黏合劑120施加到玻璃基板128的第二表面126以及圖案化反射膜160的暴露部分之後具有圖2F的圖案化反射膜160的玻璃基板128的剖視圖。在此實施方案中，黏合劑120可以是透明或透光黏合劑。可在黏合劑固化之前將光源108***相應通孔164中。2G is a cross-sectional view of the glass substrate 128 having the patterned reflective film 160 of FIG. 2F after adhesive 120 is applied to the second surface 126 of the glass substrate 128 and the exposed portions of the patterned reflective film 160. In this embodiment, adhesive 120 may be a transparent or light-transmitting adhesive. The light source 108 may be inserted into the corresponding through hole 164 before the adhesive is cured.
圖3A至圖3E是示例性玻璃電路板製造步驟的簡化剖視圖。圖3A是玻璃基板300的剖視圖。在其他實例中，基板300可包括除玻璃之外的材料。玻璃基板300可類似於先前所描述的玻璃基板128。在某些示例性實施方案中，玻璃基板300的大小可基於有待製造的背光大小來設定，使得一個玻璃基板300用於製造背光。在其他實施方案中，玻璃基板300的大小可被設定成使得多個(例如，2個、3個、4個等)玻璃基板300可用於製造背光。3A to 3E are simplified cross-sectional views of exemplary glass circuit board manufacturing steps. FIG. 3A is a cross-sectional view of a glass substrate 300. In other examples, the substrate 300 may include materials other than glass. The glass substrate 300 may be similar to the glass substrate 128 described previously. In certain exemplary embodiments, the size of the glass substrate 300 may be set based on the size of the backlight to be manufactured so that one glass substrate 300 is used to manufacture the backlight. In other embodiments, the size of the glass substrate 300 may be set so that multiple (e.g., 2, 3, 4, etc.) glass substrates 300 can be used to manufacture the backlight.
圖3B是在玻璃基板300上施加剝離層140之後圖3A的玻璃基板300的剖視圖。剝離層140可包括黏合劑膜或其他合適的材料，以使得能夠在背光的製造製程期間稍後抬起玻璃基板300。3B is a cross-sectional view of the glass substrate 300 of FIG. 3A after applying a release layer 140 on the glass substrate 300. The release layer 140 may include an adhesive film or other suitable material to enable the glass substrate 300 to be lifted later during the manufacturing process of the backlight.
圖3C是在剝離層140上形成再分佈層102之後圖3B的玻璃基板300和剝離層140的剖視圖。可藉由在剝離層140上沉積第一金屬(例如，銅)層並且圖案化第一金屬層以形成圖案化第一金屬層106a來形成再分佈層102。接著可在剝離層140和圖案化第一金屬層106a的暴露部分上方沉積介電層(例如，樹脂)層並且圖案化該介電層以形成圖案化介電層104。接著可在圖案化第一金屬層106a和圖案化介電層104的暴露部分上方沉積第二金屬(例如，銅)層並且圖案化該第二金屬層以形成圖案化第二金屬層106b。在某些示例性實施方案中，第一金屬層和第二金屬層可被濺射、濺鍍和電鍍，或者是箔。3C is a cross-sectional view of the glass substrate 300 and the release layer 140 of FIG. 3B after the redistribution layer 102 is formed on the release layer 140. Redistribution layer 102 may be formed by depositing a first metal (eg, copper) layer on liftoff layer 140 and patterning the first metal layer to form patterned first metal layer 106a. A layer of dielectric layer (eg, resin) may then be deposited over the peel layer 140 and the exposed portions of the patterned first metal layer 106 a and patterned to form the patterned dielectric layer 104 . A second metal (eg, copper) layer may then be deposited over the patterned first metal layer 106a and the exposed portions of the patterned dielectric layer 104 and patterned to form the patterned second metal layer 106b. In certain exemplary embodiments, the first metal layer and the second metal layer may be sputtered, sputtered and electroplated, or foils.
圖3D是在再分佈層102上施加阻焊劑層170之後圖3C的玻璃基板300、剝離層140和再分佈層102的剖視圖。可將阻焊劑層沉積在圖案化介電層104和圖案化第二金屬層106b的暴露部分上方並且圖案化該阻焊劑層以形成圖案化阻焊劑層170。圖案化阻焊劑層170包括用於光源108的開口172。阻焊劑層170可以是白色的以提高反射率，這可降低黏合劑層120需要是反射性的程度。3D is a cross-sectional view of the glass substrate 300, the peeling layer 140, and the redistribution layer 102 of FIG. 3C after applying a solder resist layer 170 on the redistribution layer 102. The solder resist layer may be deposited over the patterned dielectric layer 104 and the exposed portion of the patterned second metal layer 106b and patterned to form a patterned solder resist layer 170. The patterned solder resist layer 170 includes an opening 172 for the light source 108. The solder resist layer 170 may be white to increase reflectivity, which may reduce the degree to which the adhesive layer 120 needs to be reflective.
圖3E是在將複數個光源108 (一個光源在圖3中例示)電耦合到再分佈層102之後圖3D的玻璃基板300、剝離層140、再分佈層102和圖案化阻焊劑層170的剖視圖。每個光源108的第一觸點110a和第二觸點110b可藉由焊料112電耦合到圖案化第二銅層106b。表面貼裝技術(SMT)製程可用於將複數個光源108放置並電耦合到再分佈層102。在某些示例性實施方案中，阻焊劑層170可保留在再分佈層102上。FIG. 3E is a cross-sectional view of the glass substrate 300, the peeling layer 140, the redistribution layer 102, and the patterned solder resist layer 170 of FIG. 3D after a plurality of light sources 108 (one light source is illustrated in FIG. 3 ) are electrically coupled to the redistribution layer 102. The first contact 110 a and the second contact 110 b of each light source 108 may be electrically coupled to the patterned second copper layer 106 b by solder 112. A surface mount technology (SMT) process may be used to place and electrically couple the plurality of light sources 108 to the redistribution layer 102. In certain exemplary embodiments, the solder resist layer 170 may remain on the redistribution layer 102.
圖4A和圖4B是示例性背光製造步驟的簡化剖視圖。圖4A是將如圖2A至圖2G中所指示製造的圖案化玻璃漫射器122附接到如圖3A至圖3E中所指示製造的玻璃電路板的剖視圖。在此實施方案中，黏合劑120被施加到圖案化玻璃漫射器122及/或再分佈層102。在其他實施方案中，黏合劑層120和150可被施加到圖案化玻璃漫射器122及/或再分佈層102，如圖1G所示，或者圖案化反射膜160和黏合劑120可被施加到圖案化玻璃漫射器122及/或再分佈層102，如圖1H所示。4A and 4B are simplified cross-sectional views of exemplary backlight manufacturing steps. FIG. 4A is a cross-sectional view of attaching a patterned glass diffuser 122 manufactured as indicated in FIG. 2A to FIG. 2G to a glass circuit board manufactured as indicated in FIG. 3A to FIG. 3E. In this embodiment, adhesive 120 is applied to patterned glass diffuser 122 and/or redistribution layer 102. In other embodiments, adhesive layers 120 and 150 may be applied to patterned glass diffuser 122 and/or redistribution layer 102, as shown in FIG. 1G, or patterned reflective film 160 and adhesive 120 may be applied to patterned glass diffuser 122 and/or redistribution layer 102, as shown in FIG. 1H.
接下來，在黏合劑120尚未固化的情況下，圖案化玻璃漫射器122附接到再分佈層102，使得可變漫射器圖案130與複數個光源108對準。可使用輥式(線壓)或板式(區壓)壓床向圖案化玻璃漫射器122和玻璃基板300施加壓力以擠出多餘黏合劑，直到玻璃基板128的第二表面126幾乎到達複數個光源108的頂表面為止。複數個光源108可用作圖案化玻璃漫射器122與再分佈層102之間的間隔件。少量黏合劑可保持在玻璃基板128的第二表面126與每個光源108的頂表面之間以用於光學結合，與玻璃基板128的第二表面126與每個光源108的頂表面之間沒有間隙相比，這可改進散射。在放置和按壓製程之後，可在固化黏合劑120之前檢查和調節複數個光源108與可變漫射器圖案130之間的對準以改進光學效能。一旦固化黏合劑120，執行對準就可能由於黏合劑固結而變得困難。Next, while the adhesive 120 has not yet cured, the patterned glass diffuser 122 is attached to the redistribution layer 102 such that the variable diffuser pattern 130 is aligned with the plurality of light sources 108 . A roller (line pressure) or plate (zone pressure) press may be used to apply pressure to the patterned glass diffuser 122 and glass substrate 300 to squeeze out excess adhesive until the second surface 126 of the glass substrate 128 is almost to the top surface of the light source 108. The plurality of light sources 108 may serve as spacers between the patterned glass diffuser 122 and the redistribution layer 102 . A small amount of adhesive may be maintained between the second surface 126 of the glass substrate 128 and the top surface of each light source 108 for optical bonding, with no adhesive between the second surface 126 of the glass substrate 128 and the top surface of each light source 108 This improves scattering compared to gaps. After the placement and pressing process, the alignment between the plurality of light sources 108 and the variable diffuser pattern 130 can be checked and adjusted to improve optical performance before the adhesive 120 is cured. Once the adhesive 120 is cured, performing alignment may become difficult due to adhesive consolidation.
在某些示例性實施方案中，玻璃基板300可在完成的背光中保持附接到再分佈層102。在其他實施方案中，玻璃基板300可從再分佈層102被移除，如圖4B所示。In certain exemplary embodiments, the glass substrate 300 may remain attached to the redistribution layer 102 in the completed backlight. In other embodiments, the glass substrate 300 may be removed from the redistribution layer 102, as shown in FIG. 4B .
圖4B是從再分佈層102移除玻璃基板300的剖視圖。在此實施方案中，當玻璃基板300從再分佈層102被移除時，剝離層140保持在再分佈層102上。在其他實施方案中，當玻璃基板300從再分佈層102被移除時，剝離層140可保持在玻璃基板300上。從再分佈層102移除剝離層140的一個優點在於，利用連接器142促進與驅動器電路的互連來提供對兩個金屬層的獲取。在從再分佈層102移除玻璃基板300之後，如圖1J所示的功能層180可藉由剝離層140或另一個合適的層(例如，黏合劑、焊料等)附接到再分佈層102。藉由移除玻璃基板300，可製造更薄外形尺寸的背光並且避免玻璃基板300的成本，因為該基板接著可被回收並且再次用於製造GCB。玻璃基板300提高在高轉變溫度(Tg)下的尺寸穩定性、抗翹曲性和高剛度，以提高光源108轉移良率。在與圖案化玻璃漫射器122整合之後，玻璃基板128可在玻璃基板300被移除之後維持玻璃基板300的功能。玻璃基板128也可具有與LCD背板和濾色器中使用的玻璃相同的CTE，因此PGD及其整合光源與LCD面板之間的對準跨所有溫度範圍保持不變，從而允許顯示器具有非常窄的邊框。除了減小背光的總厚度之外，柔性連接器142可被製造用於藉由使玻璃基板300與再分佈層102分離來電連接到驅動器積體電路及/或電源。電路則也不受阻礙地變得與散熱器接觸以改進冷卻。4B is a cross-sectional view of the glass substrate 300 being removed from the redistribution layer 102. In this embodiment, the peeling layer 140 remains on the redistribution layer 102 when the glass substrate 300 is removed from the redistribution layer 102. In other embodiments, the peeling layer 140 may remain on the glass substrate 300 when the glass substrate 300 is removed from the redistribution layer 102. One advantage of removing the peeling layer 140 from the redistribution layer 102 is that access to two metal layers is provided by using connectors 142 to facilitate interconnection with driver circuitry. After removing the glass substrate 300 from the redistribution layer 102, the functional layer 180 as shown in FIG. 1J can be attached to the redistribution layer 102 by the peeling layer 140 or another suitable layer (e.g., adhesive, solder, etc.). By removing the glass substrate 300, a thinner form factor backlight can be manufactured and the cost of the glass substrate 300 can be avoided because the substrate can then be recycled and reused to manufacture GCBs. The glass substrate 300 improves dimensional stability at high transition temperatures (Tg), warp resistance, and high rigidity to improve the light source 108 transfer yield. After integration with the patterned glass diffuser 122, the glass substrate 128 can maintain the functionality of the glass substrate 300 after the glass substrate 300 is removed. The glass substrate 128 may also have the same CTE as the glass used in the LCD backplane and color filters, so the alignment between the PGD and its integrated light source and the LCD panel remains constant across all temperature ranges, allowing the display to have very narrow bezels. In addition to reducing the overall thickness of the backlight, the flexible connector 142 can be made for electrical connection to the driver integrated circuit and/or power supply by separating the glass substrate 300 from the redistribution layer 102. The circuitry then also has unimpeded access to the heat sink for improved cooling.
圖5A至圖5H是例示用於製造背光諸如先前參考圖1A至圖1J所描述和說明的背光100a-100i的示例性方法500的流程圖。如圖5A中的502處所示，方法500包括將剝離層施加到第一玻璃基板。例如，方法500可包括將剝離層140施加到第一玻璃基板300，如圖3B所示。在504處，方法500包括在剝離層上形成再分佈層。例如，方法500可包括在剝離層140上形成再分佈層102，如圖3C所示。在506處，方法500包括將複數個光源電耦合到再分佈層。例如，方法500可包括將複數個光源108電耦合到再分佈層102，如圖3E所示。在508處，方法500包括在再分佈層和複數個光源上方施加黏合劑。例如，方法500可包括在再分佈層102和複數個光源108上方施加黏合劑120，如圖4A所示。在510處，方法500包括將第二玻璃基板附接到黏合劑。例如，方法500可包括將第二玻璃基板128附接到黏合劑120，如圖4A所示。在512處，方法500包括從再分佈層移除第一玻璃基板。例如，方法500可包括從再分佈層102移除第一玻璃基板300，如圖4B所示。5A-5H are flowcharts illustrating an exemplary method 500 for manufacturing a backlight such as the backlights 100a-100i previously described and illustrated with reference to FIGS. 1A-1J. As shown at 502 in Figure 5A, method 500 includes applying a release layer to the first glass substrate. For example, method 500 may include applying release layer 140 to first glass substrate 300, as shown in Figure 3B. At 504, method 500 includes forming a redistribution layer on the release layer. For example, method 500 may include forming redistribution layer 102 on release layer 140, as shown in Figure 3C. At 506, method 500 includes electrically coupling a plurality of light sources to the redistribution layer. For example, method 500 may include electrically coupling a plurality of light sources 108 to redistribution layer 102, as shown in Figure 3E. At 508, method 500 includes applying an adhesive over the redistribution layer and the plurality of light sources. For example, method 500 may include applying adhesive 120 over redistribution layer 102 and plurality of light sources 108, as shown in Figure 4A. At 510, method 500 includes attaching a second glass substrate to the adhesive. For example, method 500 may include attaching second glass substrate 128 to adhesive 120, as shown in Figure 4A. At 512, method 500 includes removing the first glass substrate from the redistribution layer. For example, method 500 may include removing first glass substrate 300 from redistribution layer 102, as shown in Figure 4B.
如圖5B中的514處所示，方法500還可包括在第二玻璃基板的第一表面上形成可變漫射器圖案。例如，方法500可包括在第二玻璃基板128的第一表面124上形成可變漫射器圖案130，如圖2B所示。形成可變漫射器圖案可包括印刷可變漫射器圖案。在某些示例性實施方案中，將第二玻璃基板附接到黏合劑包括將第二玻璃基板附接到黏合劑以使可變漫射器圖案與複數個光源對準。如圖5C中的516處所示，方法500還可包括在第二玻璃基板的第一表面或與第一表面相對的第二表面上形成均勻漫射器圖案。例如，方法500可包括如圖2D所示在第二玻璃基板128的第一表面124上或如圖2C所示在第二玻璃基板128的第二表面126上形成均勻漫射器圖案132。As shown at 514 in Figure 5B, method 500 may also include forming a variable diffuser pattern on the first surface of the second glass substrate. For example, method 500 may include forming variable diffuser pattern 130 on first surface 124 of second glass substrate 128, as shown in Figure 2B. Forming the variable diffuser pattern may include printing the variable diffuser pattern. In certain exemplary embodiments, attaching the second glass substrate to the adhesive includes attaching the second glass substrate to the adhesive to align the variable diffuser pattern with the plurality of light sources. As shown at 516 in Figure 5C, method 500 may further include forming a uniform diffuser pattern on a first surface of the second glass substrate or a second surface opposite the first surface. For example, method 500 may include forming uniform diffuser pattern 132 on first surface 124 of second glass substrate 128 as shown in FIG. 2D or on second surface 126 of second glass substrate 128 as shown in FIG. 2C.
如圖5D中的518處所示，方法500還可包括在施加黏合劑之前測試複數個光源並且維修有缺陷的光源。例如，方法500可包括在將複數個光源108電耦合到再分佈層102之後測試複數個光源108並且維修有缺陷的光源，如圖3E所示。如圖5E中的520處所示，方法500還可包括在移除第一玻璃基板之後將功能層附接到再分佈層。例如，方法500可包括在如圖4B所示移除第一玻璃基板300之後如圖1J所示將功能層180附接到再分佈層102。如圖5F中的552處所示，方法500還可包括在施加黏合劑之前在再分佈層上方施加阻焊劑層。例如，方法500可包括在如圖4A所示施加黏合劑120之前如圖3D所示在再分佈層102上施加阻焊劑層170。As shown at 518 in Figure 5D, method 500 may also include testing the plurality of light sources and repairing defective light sources before applying the adhesive. For example, method 500 may include testing the plurality of light sources 108 and repairing defective light sources after electrically coupling the plurality of light sources 108 to the redistribution layer 102, as shown in Figure 3E. As shown at 520 in Figure 5E, method 500 may further include attaching the functional layer to the redistribution layer after removing the first glass substrate. For example, method 500 may include attaching functional layer 180 to redistribution layer 102 as shown in FIG. 1J after removing first glass substrate 300 as shown in FIG. 4B. As shown at 552 in Figure 5F, method 500 may also include applying a solder resist layer over the redistribution layer prior to applying the adhesive. For example, method 500 may include applying solder resist layer 170 on redistribution layer 102 as shown in FIG. 3D prior to applying adhesive 120 as shown in FIG. 4A.
如圖5G中的524處所示，方法500還可包括在再分佈層上施加反射黏合劑層。在526處，方法500還可包括在反射黏合劑層上方施加散射黏合劑層。例如，方法500可包括在再分佈層102上方施加反射黏合劑層120，以及在反射黏合劑層120上方施加散射黏合劑層150，如圖1G所示。如圖5H中的528處所示，方法500還可包括在將第二玻璃基板附接到黏合劑之前將圖案化反射膜施加到第二玻璃基板。例如，方法500可包括在如圖2G所示將第二玻璃基板128附接到黏合劑120之前如圖2E至圖2F所示將圖案化反射膜160施加到第二玻璃基板128。As shown at 524 in Figure 5G, method 500 may also include applying a layer of reflective adhesive on the redistribution layer. At 526, method 500 may also include applying a scattering adhesive layer over the reflective adhesive layer. For example, method 500 may include applying reflective adhesive layer 120 over redistribution layer 102 and applying scattering adhesive layer 150 over reflective adhesive layer 120, as shown in FIG. 1G. As shown at 528 in Figure 5H, method 500 may also include applying a patterned reflective film to the second glass substrate prior to attaching the second glass substrate to the adhesive. For example, method 500 may include applying patterned reflective film 160 to second glass substrate 128 as shown in FIGS. 2E-2F prior to attaching second glass substrate 128 to adhesive 120 as shown in FIG. 2G.
圖6例示示例性多磚塊背光製造製程600。在602處，製造圖案化玻璃漫射器620 (例如，如先前參考圖2A至圖2G所描述和說明)。在此實施方案中，圖案化玻璃漫射器620可被製造為全大小背光。在604處，在玻璃基板621上製造複數個玻璃電路板磚塊622 0至622 2(三個磚塊在604處例示) (例如，如先前參考圖3A至圖3E所描述和說明)。在某些示例性實施方案中，每個玻璃電路板磚塊622 0至622 2的大小(例如，長度和寬度)可能會受到光源(例如，LED)轉移製程的限制。在其他實施方案中，每個玻璃電路板磚塊622 0至622 2的大小可被選擇來限制每個板上的光源的數量，以簡化每個玻璃電路板的測試及/或維修及/或降低製造無法維修的玻璃電路板的可能性。在任何情況下，藉由在背光中使用單個全大小圖案化玻璃漫射器620，與在背光中使用多個圖案化玻璃漫射器相比可獲得改進的光學效能。在606處，玻璃電路板磚塊622 0至622 3可按大小切割，可將光源(例如，LED)轉移到玻璃電路板磚塊，可執行光源功能檢查，並且在光源未能通過功能檢查時對它們進行維修。 Figure 6 illustrates an exemplary multi-brick backlight manufacturing process 600. At 602, a patterned glass diffuser 620 is fabricated (eg, as previously described and illustrated with reference to Figures 2A-2G). In this implementation, the patterned glass diffuser 620 can be fabricated as a full-size backlight. At 604, a plurality of glass circuit board bricks 6220-6222 (three bricks are illustrated at 604 ) are fabricated on the glass substrate 621 (eg, as previously described and illustrated with reference to Figures 3A-3E). In certain exemplary embodiments, the size (eg, length and width) of each glass circuit board tile 622 0 - 622 2 may be limited by the light source (eg, LED) transfer process. In other embodiments, the size of each glass circuit board tile 622 0 - 622 2 may be selected to limit the number of light sources on each board to simplify testing and/or repair of each glass circuit board and/or Reduces the likelihood of creating irreparable glass circuit boards. In any case, by using a single full-size patterned glass diffuser 620 in the backlight, improved optical performance can be achieved compared to using multiple patterned glass diffusers in the backlight. At 606, the glass circuit board bricks 6220 to 6223 can be cut to size, a light source (eg, an LED) can be transferred to the glass circuit board brick, a light source functional check can be performed, and when the light source fails the functional check Have them repaired.
在608處，圖案化玻璃漫射器620可與第一玻璃電路板622 0整合(例如，如先前參考圖4A所描述和說明)。在610處，可移除玻璃電路板磚塊的玻璃基板622 0，從而暴露玻璃電路板的柔性連接器624 0(例如，如先前參考圖4B所描述和說明)。在612處，再重複三次608和610的程序，使得分別具有柔性連接器624 0至624 3的玻璃電路板622 0至622 3附接到圖案玻璃漫射器620。雖然在圖6中示出四個玻璃電路板磚塊622 0至622 3以覆蓋圖案化玻璃漫射器620，但是在其他實施方案中，可根據圖案化玻璃漫射器的大小使用任何合適數量的玻璃電路板磚塊，諸如2個、3個、5個、6個、7個、8個等。在614處，根據應用，可將功能層630層壓到玻璃電路板磚塊622 0至622 3(例如，如先前參考圖1J所描述和說明)。 At 608, the patterned glass diffuser 620 can be integrated with the first glass circuit board 6220 (e.g., as previously described and illustrated with reference to FIG. 4A). At 610, the glass substrate 6220 of the glass circuit board tile can be removed, thereby exposing the flexible connector 6240 of the glass circuit board (e.g., as previously described and illustrated with reference to FIG. 4B). At 612, the process of 608 and 610 is repeated three more times, so that the glass circuit boards 6220-6223 having the flexible connectors 6240-6243 , respectively , are attached to the patterned glass diffuser 620. Although four glass circuit tiles 622 0-622 3 are shown in FIG6 to cover the patterned glass diffuser 620, in other embodiments, any suitable number of glass circuit tiles may be used depending on the size of the patterned glass diffuser, such as 2, 3, 5, 6, 7, 8, etc. At 614, a functional layer 630 may be laminated to the glass circuit tiles 622 0-622 3 (e.g., as previously described and illustrated with reference to FIG1J ), depending on the application.
對熟習此項技術者將顯而易見的是，可在不脫離本發明的精神和範圍的情況下對本案的實施方案進行各種修改和變更。因此，意欲本案涵蓋所述修改和變更，只要其屬於隨附申請專利範圍和其均等物的範圍內。It will be apparent to those skilled in the art that various modifications and changes can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Accordingly, it is intended that this case cover said modifications and changes as long as they fall within the scope of the appended patent application and its equivalents.
100a:示例性背光 100b:示例性背光 100c:示例性背光 100d:示例性背光 100e:示例性背光 100f:示例性背光 100g:示例性背光 100h:示例性背光 100i:示例性背光 102:再分佈層 104:圖案化介電層 106:介電材料(例如，樹脂) 106a:圖案化第一金屬層 106b:圖案化第二金屬層 108:光源 110a:第一觸點 110b:第二觸點 110c:示例性背光 112:焊料 120:黏合劑 122:圖案化玻璃漫射器 124:第一表面 126:第二表面 128:第二玻璃基板 130:可變漫射器圖案 132:均勻漫射器圖案 140:剝離層 142:連接器 160:圖案化反射膜 162:圖案 164:通孔 170:阻焊劑 180:功能層 300:玻璃基板 500:示例性方法 502:步驟 504:步驟 506:步驟 508:步驟 510:步驟 512:步驟 514:步驟 516:步驟 518:步驟 520:步驟 522:步驟 524:步驟 526:步驟 528:步驟 600:示例性多磚塊背光製造製程 602:步驟 604:步驟 606:步驟 608:步驟 610:步驟 612:步驟 614:步驟 620:圖案化玻璃漫射器 622 0:玻璃電路板 622 1:玻璃電路板 622 2:玻璃電路板 622 3:玻璃電路板 624 0:柔性連接器 624 1:柔性連接器 624 2:柔性連接器 624 3:柔性連接器 100a: Exemplary backlight 100b: Exemplary backlight 100c: Exemplary backlight 100d: Exemplary backlight 100e: Exemplary backlight 100f: Exemplary backlight 100g: Exemplary backlight 100h: Exemplary backlight 100i: Exemplary backlight 102: Redistribution layer 104: Patterned dielectric layer 106: Dielectric material (eg, resin) 106a: Patterned first metal layer 106b: Patterned second metal layer 108: Light source 110a: First contact 110b: Second contact 110c: Exemplary backlight 112: Solder 120: Adhesive 122: Patterned glass diffuser 124: First surface 126: Second surface 128: Second glass substrate 130: Variable diffuser pattern 132: Uniform diffuser pattern 140 :Peel layer 142:Connector 160:Patterned reflective film 162:Pattern 164:Through hole 170:Solder resist 180:Functional layer 300:Glass substrate 500:Exemplary method 502:Step 504:Step 506:Step 508:Step 510 : Step 512: Step 514: Step 516: Step 518: Step 520: Step 522: Step 524: Step 526: Step 528: Step 600: Exemplary multi-brick backlight manufacturing process 602: Step 604: Step 606: Step 608: Step 610: Step 612: Step 614: Step 620: Patterned glass diffuser 622 0 : Glass circuit board 622 1 : Glass circuit board 622 2 : Glass circuit board 622 3 : Glass circuit board 624 0 : Flexible connector 624 1 :Flexible connector 624 2 :Flexible connector 624 3 :Flexible connector
圖1A是示例性背光的簡化剖視圖；1A is a simplified cross-sectional view of an exemplary backlight;
圖1B是示例性背光的頂視圖；FIG. 1B is a top view of an exemplary backlight;
圖1C至圖1J是其他示例性背光的簡化剖視圖；1C to 1J are simplified cross-sectional views of other exemplary backlights;
圖2A至圖2G是示例性圖案化玻璃漫射器製造步驟的簡化剖視圖；2A to 2G are simplified cross-sectional views of exemplary patterned glass diffuser manufacturing steps;
圖3A至圖3E是示例性玻璃電路板製造步驟的簡化剖視圖；3A-3E are simplified cross-sectional views of exemplary glass circuit board manufacturing steps;
圖4A和圖4B是示例性背光製造步驟的簡化剖視圖；4A and 4B are simplified cross-sectional views of exemplary backlight manufacturing steps;
圖5A至圖5H是例示用於製造背光的示例性方法的流程圖；並且5A-5H are flowcharts illustrating an exemplary method for manufacturing a backlight; and
圖6例示示例性多磚塊(multi-tile)背光製造製程。Figure 6 illustrates an exemplary multi-tile backlight manufacturing process.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None
100a:示例性背光 100a: Example backlight
102:再分佈層 102: redistribution layer
104:圖案化介電層 104:Patterned dielectric layer
106:介電材料(例如，樹脂) 106: Dielectric material (e.g., resin)
108:光源 108:Light source
110a:第一觸點 110a: first contact
110b:第二觸點 110b: Second contact
112:焊料 112:Solder
120:黏合劑 120: Adhesive
122:圖案化玻璃漫射器 122:Patterned Glass Diffuser
124:第一表面 124: First surface
126:第二表面 126: Second surface
128:第二玻璃基板 128: Second glass substrate
130:可變漫射器圖案 130: Variable diffuser pattern
Claims (21)
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| Application Number | Priority Date | Filing Date | Title |
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| US202263332373P | 2022-04-19 | 2022-04-19 | |
| US63/332,373 | 2022-04-19 |
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| TW202409675A true TW202409675A (en) | 2024-03-01 |
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| TW112113769A TW202409675A (en) | 2022-04-19 | 2023-04-13 | Backlights including patterned glass diffusers and methods for fabricating the backlights |
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| Country | Link |
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| CN (1) | CN116909054A (en) |
| TW (1) | TW202409675A (en) |
| WO (1) | WO2023204962A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200821694A (en) * | 2006-11-01 | 2008-05-16 | Au Optronics Corp | Reflective light source device and manufacture method thereof |
| TW202036060A (en) * | 2018-11-12 | 2020-10-01 | 美商康寧公司 | Backlight including patterned reflectors, diffuser plate, and method for fabricating the backlight |
| US11112652B2 (en) * | 2018-12-11 | 2021-09-07 | Lg Display Co., Ltd. | Backlight unit and display device including the same technical field |
| US20220228722A1 (en) * | 2019-07-01 | 2022-07-21 | Dai Nippon Printing Co., Ltd. | Diffusion member, stacked body, diffusion member set, led backlight, and displaying apparatus |
| CN115698838A (en) * | 2020-04-29 | 2023-02-03 | 康宁公司 | Display device with tile-shaped assembly |
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