TW202409572A - Compliant pin probes with extension springs or spring segments and ratcheting elements - Google Patents
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Abstract
Description
本發明的實施例是關於探針，用於測試電子電路（例如，用於晶圓級測試、晶片尺度封裝測試、或接口測試積體電路、或用於形成電性連接至PCB或其他電子組件）。在某些實施例中，該些探針為微探針，且其等可為針腳狀探針，具有彈簧元件，由相對剛性元件所支持，其中，該些探針高度可遠大於其等橫向尺寸，或該些尺寸可為相當。該些探針可具有單一接觸元件或多個接觸元件。實施例包括或提供探針，具有至少一伸張彈簧，亦可或亦可不包括一或多個壓縮彈簧。探針尖端在提供一回力的一或多個平面伸張彈簧或區段所提供的一彈性回力下壓縮朝向彼此，其中，在某些實施例中，該些伸張彈簧在接觸待測的一DUT前已預偏置，而在某些實施例中，探針包括可相對移動剛性元件，其中，操作間隙小於一般可在一組裝狀態下形成者，或具有變化間隙寬度，以提供有效形成及穩定探針操作，而額外其他實施例是關於形成探針及/或將該些探針組裝至探針陣列的方法。Embodiments of the present invention relate to probes for testing electronic circuits (e.g., for wafer-level testing, chip-scale package testing, or interface testing of integrated circuits, or for forming electrical connections to PCBs or other electronic components). In some embodiments, the probes are microprobes, and they may be pin-shaped probes with spring elements supported by relatively rigid elements, wherein the height of the probes may be much greater than their lateral dimensions, or the dimensions may be comparable. The probes may have a single contact element or multiple contact elements. Embodiments include or provide probes having at least one extension spring, and may or may not include one or more compression springs. The probe tips are compressed toward each other under a resilient return force provided by one or more planar extension springs or segments providing a return force, wherein, in some embodiments, the extension springs are pre-biased prior to contacting a DUT to be tested, and in some embodiments, the probes include relatively movable rigid elements, wherein the operating gap is smaller than that which can generally be formed in an assembled state, or has a variable gap width to provide efficient formation and stable probe operation, and other embodiments are related to methods of forming probes and/or assembling the probes into a probe array.
探針：Probe:
商業上已使用或提出許多電性接觸探針及針腳組態，某些可稱為先前技術，而其他則否。Many electrical contact probes and pin configurations have been used or proposed commercially, some may be considered prior art and others may not.
電化學製造：Electrochemical manufacturing:
過去及現在，位於加州凡奈斯的Microfabrica ®股份有限公司（前身為MEMGen公司）於商業上，在稱為EFAB及MICA FREEFORM ®的過程下，追求用於由多個黏著層來形成三維結構的電化學製造技術。 In the past and present, Microfabrica® Inc. (formerly MEMGen Corporation) of Van Nuys, California, commercially pursues the use of multiple adhesive layers to form three-dimensional structures under the processes known as EFAB and MICA FREEFORM®. Electrochemical manufacturing technology.
許多電化學製造技術描述於Adam Cohen的美國專利第6,027,630號，核發於2000年2月22日。Many electrochemical fabrication techniques are described in Adam Cohen's U.S. Patent No. 6,027,630, issued February 22, 2000.
使用電化學製造技術來形成微結構的一相關方法教示於Henry Guckel的美國專利第5,190,637號，名稱為「透過多水平深度X光微影配合犧牲金屬層來形成微結構」。A related method of forming microstructures using electrochemical fabrication techniques is taught in Henry Guckel's US Patent No. 5,190,637, titled "Formation of microstructures by multi-level depth X-ray lithography with sacrificial metal layers."
電化學製造以合理成本及合理時間來提供形成微型物體、部分、結構、裝置、及相似者的原型及量產的能力。事實上，電化學製造作為啟用者，形成迄今為止不可能生產的許多結構。電化學製造在許多工業領域敞開新設計及產品的譜系。雖然電化學製造提供此能力，而可理解的是，電化學製造技術可結合在許多領域中習知的設計及結構，以產生新結構，電化學製造的特定運用提供在先前技術狀態中尚非習知或明顯的設計、結構、能力、及/或特徵。Electrochemical manufacturing provides the ability to prototype and mass-produce microscopic objects, parts, structures, devices, and the like at reasonable cost and time. In fact, electrochemical fabrication serves as an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical manufacturing opens up a spectrum of new designs and products in many industrial sectors. While electrochemical fabrication provides this capability, and it is understood that electrochemical fabrication techniques can combine designs and structures known in many fields to create new structures, specific applications of electrochemical fabrication provide capabilities not yet available in the prior state of the art. Known or obvious design, structure, capabilities, and/or characteristics.
在許多領域中存在微型裝置的需求，以具有增進的特徵、增進的操作能力、減少的製造時間、減少的製造成本、簡化的製造過程、更大變通性於裝置設計、增進的材料選擇、增進的材料性質、更多成本效率及更少風險於生產該些裝置、及/或在幾何組態與選定的製造過程之間更多獨立性。There is a need in many fields for microdevices to have improved characteristics, improved operating capabilities, reduced manufacturing time, reduced manufacturing costs, simplified manufacturing processes, greater flexibility in device design, improved material selection, enhanced material properties, more cost efficiencies and less risk in producing these devices, and/or more independence between the geometry and the selected manufacturing process.
本發明的某些實施例的一目的是提供增進的順應性針腳探針（例如，具有筒體及柱塞型操作，或套體及雙柱塞操作），具有一或多個實質平面彈簧區段，其中，該些區段之至少一者操作成處於緊張，其中，該些探針更包括套體、或其他軌道、槽、通道、彈簧連接器臂、及/或其他接合結構，提供探針效能的增進的穩定性。It is an object of certain embodiments of the present invention to provide enhanced compliance needle probes (e.g., having barrel and plunger type operation, or sleeve and dual plunger operation) having one or more substantially planar spring regions segments, wherein at least one of the segments operates in tension, wherein the probes further include a sleeve, or other tracks, grooves, channels, spring connector arms, and/or other engagement structures to provide probe Enhanced stability of needle efficacy.
本發明的某些實施例的一目的是提供一種探針，具有至少一可移動接觸尖端，其中，探針的一相對端具有一結構，待連接或附著於一電性介面，或透過形成一探針本體、套體、或筒體的部分的一尖端而接觸於一電性介面。An object of certain embodiments of the present invention is to provide a probe having at least one movable contact tip, wherein an opposite end of the probe has a structure to be connected or attached to an electrical interface, or to contact an electrical interface through a tip forming part of a probe body, sleeve, or barrel.
本發明的某些實施例的一目的是提供一種探針，具有一套體，具有至少一端蓋，以限制至少一尖端自探針的該端過度縱向移動。An object of certain embodiments of the present invention is to provide a probe having a housing with at least one end cap to limit excessive longitudinal movement of at least one tip from the end of the probe.
本發明的某些實施例的一目的是提供一種探針，具有至少二個可移動接觸尖端，以接觸不同電子組件或相同電子組件上的不同墊片或凸塊，相對於探針的一套體、筒體、或其他非移動部分。An object of certain embodiments of the present invention is to provide a probe having at least two movable contact tips for contacting different electronic components or different pads or bumps on the same electronic component relative to a sleeve, barrel, or other non-moving portion of the probe.
本發明的某些實施例的一目的是提供一種探針，具有套體，至少具有二個端蓋，以限制該些尖端自探針的兩端過度縱向移動。An object of certain embodiments of the present invention is to provide a probe having a sleeve body and at least two end caps to limit excessive longitudinal movement of the tips from both ends of the probe.
本發明的某些實施例的一目的是提供一種針腳狀探針，具有二個尖端，其中，至少一者為一接觸尖端，其中，探針具有一組態以增進該二個尖端的指向準確度（亦即，當形成接觸或經歷壓縮時，減少尖端的橫向誤置及/或減少把持該些尖端並允許其等彼此縱向移動的縱向元件的角誤置，其中，例如，組態使得一或多個縱向臂或柱塞之間的間隙或空隙減少，相對於其等移動通過的通道或筒體，在最初壓縮該些尖端後朝向彼此（當在一工作狀態下時，可為預偏置壓縮或壓縮）。An object of certain embodiments of the present invention is to provide a pin-shaped probe having two tips, at least one of which is a contact tip, wherein the probe has a configuration to improve the pointing accuracy of the two tips (i.e., to reduce lateral misalignment of the tips when making contact or undergoing compression and/or to reduce angular misalignment of longitudinal elements that hold the tips and allow them to move longitudinally relative to each other, wherein, for example, the configuration reduces the gap or clearance between one or more longitudinal arms or plungers, relative to the channel or barrel through which they move, toward each other after initially compressing the tips (which may be pre-biased compressed or compressed when in an operating state).
本發明的某些實施例的一目的是提供探針，具有增進的指向準確度，是透過提供窄化間隙或空隙於一或多個（例如，開始、期間、或結束）位置，沿著一通道或筒體的一長度，相對於一臂或柱塞。An object of certain embodiments of the present invention is to provide a probe having improved pointing accuracy by providing a narrowed gap or void at one or more (e.g., beginning, during, or ending) locations along a length of a channel or barrel relative to an arm or plunger.
本發明的某些實施例的一目的是提供探針，具有增進的指向準確度，是透過提供窄化通道或筒體尺寸於一或多個（例如，開始、期間、及/或結束）位置，沿著一通道或筒體的一長度。An object of certain embodiments of the present invention is to provide a probe having improved pointing accuracy by providing narrowed channel or barrel dimensions at one or more (e.g., beginning, during, and/or ending) locations along a length of a channel or barrel.
本發明的某些實施例的一目的是提供探針，具有增進的指向準確度，是透過提供寬化的臂或柱塞尺寸於一或多個（例如，開始、期間、或結束）位置，沿著臂、該些臂、柱塞、或該些柱塞的一長度。It is an object of certain embodiments of the present invention to provide probes with improved pointing accuracy by providing broadened arm or plunger dimensions at one or more (e.g., start, middle, or end) positions, Along a length of an arm, the arms, the plunger, or the plungers.
本發明的某些實施例的一目的是形成探針，於其等兩側，例如，具有探針的縱軸，垂直於形成該些探針的層之平面的一正常方向。An object of certain embodiments of the present invention is to form probes having two sides, for example, with the longitudinal axis of the probes being perpendicular to a normal direction of the plane of the layer forming the probes.
本發明的某些實施例的一目的是形成探針，其中，於其等兩側，探針的任何平滑彎曲特徵是形成於個別層中，而探針組態逐層變化具備階梯式或至少部分不連續過渡。An object of certain embodiments of the present invention is to form a probe wherein any smoothly curved features of the probe are formed in separate layers on either side thereof, while the probe configuration changes from layer to layer with a stepped or at least partially discontinuous transition.
本發明的某些實施例的一目的是提供組態以在單一層中增進指向對齊，而其他實施例的一目的是提供組態以透過多個相鄰層來增進指向對齊，而額外其他實施例的一目的是提供組態以增進位於非相鄰層的指向對齊。It is an object of some embodiments of the present invention to provide arrangements to enhance pointing alignment in a single layer, while it is an object of other embodiments to provide arrangements to enhance pointing alignment through multiple adjacent layers, while still other implementations One purpose of the example is to provide configurations to enhance pointing alignment at non-adjacent layers.
本發明的某些實施例的一目的是提供一種探針，組態成提供將大部分電流分流通過一套體，而非通過該些彈簧元件的大部分長度。It is an object of certain embodiments of the present invention to provide a probe configured to provide for shunting a majority of the current through the sleeve rather than through a majority of the length of the spring elements.
本發明的某些實施例的一目的是提供一種探針，具有一組態以提供一順應性元件附著於套體，直接或間接滑動接觸於移動尖端。It is an object of certain embodiments of the present invention to provide a probe having a configuration to provide a compliant member attached to the housing in direct or indirect sliding contact with the moving tip.
本發明的某些實施例的一目的是提供一種探針，具有一組態以提供一順應性元件直接或間接附著於移動尖端，且直接或間接滑動接觸於一套體。It is an object of certain embodiments of the present invention to provide a probe having a configuration to provide a compliant element directly or indirectly attached to the moving tip and in direct or indirect sliding contact with the housing.
本發明的某些實施例的一目的是提供一種探針，具有一套體，形成為多個組件，其中，在形成負載該些彈簧區段並結合該些組件後，該些組件縱向推合在一起。An object of certain embodiments of the present invention is to provide a probe having a housing formed into a plurality of components, wherein after forming the load spring segments and joining the components, the components are pushed together longitudinally.
本發明的某些實施例的一目的是提供一種探針，具有一或多個結合結構，組態成允許將一順應性元件移動通過一接合特徵，以避免脫離。It is an object of certain embodiments of the present invention to provide a probe having one or more binding structures configured to allow movement of a compliant element through an engagement feature to avoid disengagement.
本發明的某些實施例的一目的是提供一種探針，具有至少某些彈簧區段，當自一建構組態過渡至一工作組態時，經歷張力負載。An object of certain embodiments of the present invention is to provide a probe having at least some spring sections that experience tension loading when transitioning from a construction configuration to a working configuration.
本發明的某些實施例的一目的是提供過渡法，包括將一順應性元件移動通過一接合特徵，以避免移動返回一建構組態。It is an object of certain embodiments of the present invention to provide a transition method comprising moving a compliant element through a bonding feature to avoid movement back to a built configuration.
本發明的某些實施例的一目的是提供探針，具有套體，包括一或多個棘輪或階梯式鎖定機制及一固定伸張止動件，以允許探針形成於一壓縮或緊實狀態（使用更少批量晶圓資產於探針的一本體或套體部分），然後縱向拉開套體的二個部分，以接合至少一棘輪機制，而沒有將該些彈簧或套體組件過度伸張的風險，使得探針透過至少一預偏置伸張彈簧而把持於一拉長或拉伸狀態。It is an object of certain embodiments of the present invention to provide a probe having a housing including one or more ratchet or stepped locking mechanisms and a fixed extension stop to allow the probe to be formed into a compressed or compacted state (Using less batch wafer resources for one body or housing portion of the probe) and then pulling the two housing portions apart longitudinally to engage at least one ratcheting mechanism without overstretching the spring or housing components The risk is such that the probe is held in an elongated or stretched state by at least one pre-biased extension spring.
本發明的某些實施例的一目的是提供探針，具有套體，包括一或多個棘輪或階梯式鎖定機制、一固定伸張止動件、及一輔助保持鎖，以允許該些探針形成於一壓縮或緊實狀態（使用更少批量晶圓資產於探針的一本體或套體部分），然後縱向拉開套體的二個部分，以接合至少一棘輪機制及輔助保持鎖，而沒有將該些彈簧或套體組件過度伸張的風險，使得該些探針透過至少一預偏置伸張彈簧而把持於一拉長或拉伸狀態。An object of certain embodiments of the present invention is to provide probes having a sleeve including one or more ratchet or step-type locking mechanisms, a fixed extension stop, and an auxiliary retention lock to allow the probes to be formed in a compressed or compacted state (using less bulk wafer assets on a body or sleeve portion of the probe) and then the two portions of the sleeve are pulled apart longitudinally to engage at least one ratchet mechanism and the auxiliary retention lock without the risk of over-extension of the springs or sleeve assemblies, so that the probes are held in an extended or stretched state by at least one pre-biased extension spring.
本發明的某些實施例的一目的是提供伸張探針，具有臂至彈簧之安裝板，其中具有探針尖臂或探針尖端之延伸部分可延伸的開口，其中，探針臂包括至少一棘輪特徵，可形成於該些安裝板之間，且其可移動超過該些安裝板，以將至少一伸張彈簧永久偏置，使得在使用期間，伸張彈簧總是具有一非零最初偏置或預載。It is an object of certain embodiments of the present invention to provide an extension probe having an arm to a spring mounting plate having an opening through which a probe tip arm or an extension portion of the probe tip can extend, wherein the probe arm includes at least one A ratchet feature may be formed between the mounting plates and movable beyond the mounting plates to permanently bias at least one extension spring such that during use the extension spring always has a non-zero initial bias or Preload.
本領域技術人員在閱讀本文的教示後可更明白本發明的許多實施例的其他目的及優點。本文明文記載或另外自本文的教示得知的本發明的許多實施例可單獨或結合解決上述該些目的的一或多個，或者，其等可解決自本文的教示得知的某些其他目的。並不表示本發明的任何單一觀點必須解決任何特別目的，甚至全部目的。Those skilled in the art will better understand other objects and advantages of many embodiments of the present invention after reading the teachings herein. Many embodiments of the invention, expressly described herein or otherwise learned from the teachings herein, may solve one or more of the above objects, alone or in combination, or may address certain other objects learned from the teachings herein. . It is not intended that any single aspect of the invention necessarily solves any particular object, or even all objects.
在本發明的一第一觀點中，一種探針，用於測試一DUT，包括：（a）一第一尖臂直接或間接連接至一第一尖端的一附著區域，以形成電性接觸至一第一電子電路元件；（b）一第二尖臂直接或間接連接至一第二尖端的一附著區域；（c）一第一止動板，具有一第一開口，直接或間接結合至第一尖臂，及一第二止動板，具有一第二開口，直接或間接結合至第二尖臂，其中，第一尖臂通過第二止動板的第二開口，而第二尖臂通過第一止動板的第一開口；及（d）一順應性結構，包括至少一彈簧區段，其中，順應性結構的一第一區域直接或間接結合第一止動板，且順應性結構的一第二區域直接或間接結合第二止動板；其中，第一及第二尖臂的相對位移導致順應性結構的至少一彈簧區段彈性拉伸且第二止動板移動遠離第一止動板。In a first aspect of the present invention, a probe for testing a DUT includes: (a) a first tip arm directly or indirectly connected to an attachment area of a first tip to form electrical contact to a first electronic circuit component; (b) a second tip arm directly or indirectly connected to an attachment area of a second tip; (c) a first stop plate having a first opening, directly or indirectly coupled to The first pointed arm and a second stop plate have a second opening and are directly or indirectly coupled to the second pointed arm, wherein the first pointed arm passes through the second opening of the second stop plate, and the second pointed arm the arm passes through the first opening of the first stop plate; and (d) a compliant structure including at least one spring section, wherein a first region of the compliant structure directly or indirectly engages the first stop plate and is compliant A second region of the compliant structure is directly or indirectly coupled to the second stop plate; wherein relative displacement of the first and second pointed arms causes at least one spring section of the compliant structure to elastically stretch and the second stop plate moves away First stop plate.
本發明的第一觀點可進行許多變化，並包括，例如：（1）順應性結構可包括多個彈簧區段；（2）探針可更包括一特徵選自由下列所組成的群組：（a）組態，可接合於一陣列結構上的特徵，以允許預偏置至少一彈簧區段；（b）至少一分流元件，引導電流自第一或第二尖臂之一者通過一非順應性結構，再通過第一或第二尖臂之另一者；及（c）至少一分流元件，引導電流自第一或第二尖臂之一者通過一非順應性結構，再通過第一或第二尖臂之另一者，其中，至少一分流元件為一表面，該些尖臂在其上滑動；（3）探針可更包括至少一引導結構，連接至第一及第二尖臂，並提供增進的穩定性及/或指向準確度於探針，及限制第一尖端及第二尖端沿著探針的一實質縱軸相對移動；（4）第二尖端可組態成形成電性連接至一第二電路元件，其中，組態選自由下列所組成的群組：（a）用於形成接觸連接的一尖端，及（b）用於形成附著連接的一尖端；（5）探針可具有一長度選自由下列所組成的群組：（a）小於2 mm、（b）小於3 mm、（c）小於5 mm、（d）小於8 mm、（e）大於2 mm、（f）大於3 mm、（g）大於5 mm、及（h）大於8 mm，及一寬度選自由下列所組成的群組：（a）小於100微米、（b）小於200微米、（d）小於300微米、（d）小於400微米、及（e）小於600微米；且（6）探針可組態於一陣列，用於晶圓級測試，或用於接口測試一或多個封裝IC。The first aspect of the invention is subject to numerous variations and includes, for example: (1) the compliant structure may include a plurality of spring segments; (2) the probe may further include a feature selected from the group consisting of: (a) a feature configured to be coupled to an array structure to allow pre-biasing of at least one spring segment; (b) at least one shunt element directing current from one of the first or second pointed arms through a non-compliant structure and then through the other of the first or second pointed arms; and (c) at least one shunt element directing current from one of the first or second pointed arms through a non-compliant structure and then through the other of the first or second pointed arms, wherein , at least one shunt element is a surface on which the pointed arms slide; (3) the probe may further include at least one guide structure connected to the first and second pointed arms and providing enhanced stability and/or pointing accuracy to the probe and limiting relative movement of the first tip and the second tip along a substantial longitudinal axis of the probe; (4) the second tip may be configured to form an electrical connection to a second circuit element, wherein the configuration is selected from the group consisting of: (a) a tip for forming a contact connection, and (b) a tip for forming an attachment connection; (5) the probe may have a length selected from the group consisting of: (a) less than 2 (a) less than 100 microns, (b) less than 200 microns, (d) less than 300 microns, (e) less than 400 microns, and (f) less than 600 microns; and (6) the probes can be configured in an array for wafer-level testing or for interface testing of one or more packaged ICs.
在本發明的一第二觀點下，一種探針，用於測試一DUT可更包括一多部分套體，至少具有：一第一偏置部分，包括至少一第一橫向元件靜置於第二止動板，及至少一第一縱向元件突出於至少一橫向元件；及一第二偏置部分，包括至少一第二橫向元件靜置於第一止動板，及至少一第二縱向元件突出於第二橫向元件而朝向第一偏置部分，其中，第一及第二偏置部分的第一及第二縱向元件可至少部分移動經過彼此，並包括各自的第一及第二棘輪特徵，當探針在不同工作條件下時，其等彼此具有不同位置。In a second aspect of the present invention, a probe for testing a DUT may further include a multi-part housing, at least having: a first biasing part, including at least a first transverse element resting on a second a stop plate, and at least one first longitudinal element protruding from at least one transverse element; and a second offset portion, including at least a second transverse element resting on the first stop plate, and at least one second longitudinal element protruding on the second transverse element towards the first offset portion, wherein the first and second longitudinal elements of the first and second offset portions are at least partially movable past each other and include respective first and second ratchet features, When the probes are under different operating conditions, they have different positions from each other.
本發明的第二觀點可能有許多變化，並包括，例如：（1）工作條件可選自由下列所組成的群組：（a）一中性、起始、或成形狀態；（b）一伸張、或預偏置、最終工作狀態；（2）第一偏置部分的棘輪特徵的一位置可選自由下列所組成的群組：（i）比起在一最終位置時更靠近第二止動板，（ii）比起在一最終位置時更遠離第一止動板，及（iii）比起在一最終位置時較不縱向置中於第一止動板；（3）第二偏置部分可包括至少二個第二縱向元件，皆突出於第二橫向元件而朝向第一偏置部分，並在兩者之間定義一空間，第一偏置部分的第一縱向元件在其中滑動；（4）第二偏置部分可包括棘輪特徵，關聯於該二個第二縱向元件，突入至空間；（5）第二偏置部分的第二橫向元件可具有一開口，第一偏置部分的第一縱向元件可通過其中；（6）第一偏置部分可更包括一額外橫向元件位於相對於第一橫向元件的一相對端，在探針的一最終工作條件下，額外橫向元件靜置於第二偏置部分的第二橫向元件；（7）第二偏置部分可更包括一額外橫向元件位於相對於第二橫向元件的一相對端；（8）在探針的一最終工作條件下，第二偏置部分的額外橫向元件可靜置於第一偏置部分；（10）第一偏置部分可更包括一輔助鎖特徵位於相對於第二橫向元件的一相對端，而在探針的一最終工作條件下，第二偏置部分的額外橫向元件可接合於由輔助鎖特徵所定義的一額外空間；（9）輔助鎖特徵可為一C形特徵，具有一內部開放額外空間；（10）該些棘輪特徵可選自由下列所組成的群組：（a）可偏轉斜臂閂鎖；（b）可移動經過一剛性特徵的可偏轉元件；（c）移動經過彼此的一系列棘輪元件；（d）移動經過彼此的一系列單獨棘輪元件；（e）傾斜金屬刷毛。The second aspect of the invention may have many variations and include, for example: (1) The operating condition may be selected from the group consisting of: (a) a neutral, initial, or formed state; (b) an extension , or pre-biased, final operating condition; (2) A position of the ratchet feature of the first biased portion may be selected from the group consisting of: (i) Closer to the second stop than in a final position plate, (ii) further away from the first stop plate than in a final position, and (iii) less longitudinally centered on the first stop plate than in a final position; (3) second offset The portion may include at least two second longitudinal elements, both protruding from the second transverse element toward the first offset portion, and defining a space therebetween in which the first longitudinal element of the first offset portion slides; (4) The second offset portion may include a ratchet feature, associated with the two second longitudinal elements, protruding into the space; (5) The second transverse element of the second offset portion may have an opening, and the first offset portion may have an opening. The first longitudinal element can pass through it; (6) the first offset portion can further include an additional transverse element located at an opposite end relative to the first transverse element. Under a final operating condition of the probe, the additional transverse element is static A second transverse element placed in the second offset portion; (7) the second offset portion may further include an additional transverse element located at an opposite end relative to the second transverse element; (8) in a final work of the probe Conditions, the additional transverse element of the second offset portion can rest on the first offset portion; (10) the first offset portion can further include an auxiliary locking feature located at an opposite end relative to the second transverse element, and In a final operating condition of the probe, the additional transverse elements of the second offset portion may engage an additional space defined by the auxiliary lock feature; (9) the auxiliary lock feature may be a C-shaped feature with an interior open additional space; (10) The ratcheting features may be selected from the group consisting of: (a) deflectable angled arm latches; (b) deflectable elements movable past a rigid feature; (c) movable past each other a series of ratcheting elements; (d) a series of individual ratcheting elements moving past each other; (e) inclined metal bristles.
在本發明的第二觀點下，至少第二尖臂可直接或間接把持至少一棘輪特徵，且其中，至少一棘輪特徵可移動通過第一止動板的第一開口，以將探針（600；700）自一中性狀態永久過渡至一預偏置最終工作狀態。In a second aspect of the invention, at least the second pointed arm can directly or indirectly hold at least one ratchet feature, and wherein at least one ratchet feature can move through the first opening of the first stop plate to permanently transition the probe (600; 700) from a neutral state to a pre-biased final working state.
本發明的第二觀點可能有許多變化，並包括，例如：（1）第一尖臂及第二尖臂皆可直接或間接把持各自的棘輪特徵，且該些棘輪特徵可移動通過第一及第二止動板的各自的開口以將探針自中性狀態永久過渡至一預偏置最終工作狀態；及（2）該些棘輪特徵可選自由下列所組成的群組：（a）可偏轉斜臂閂鎖；（b）可移動經過一剛性特徵的可偏轉元件；（c）移動經過彼此的一系列棘輪元件；（d）移動經過彼此的一系列單獨棘輪元件；（e）當尖臂承載一或多個剛性後止動特徵時，自尖臂移動至該些止動板的可偏轉構件。本領域技術人員在閱讀本文的教示後可理解並可進行許多進一步變化。Many variations of the second aspect of the invention are possible, and include, for example: (1) the first and second pointed arms may both directly or indirectly hold respective ratchet features, and the ratchet features may be moved through respective openings of the first and second stop plates to permanently transition the probe from a neutral state to a pre-biased final working state; and (2) the ratchet features may be selected from the group consisting of: (a) a deflectable ramp arm latch; (b) a deflectable element that is movable past a rigid feature; (c) a series of ratchet elements that are movable past each other; (d) a series of individual ratchet elements that are movable past each other; (e) a deflectable member that is movable from the pointed arm to the stop plates when the pointed arm carries one or more rigid rear stop features. Many further variations will be understood and can be made by those skilled in the art after reading the teachings herein.
本領域技術人員在閱讀本文的教示後可理解本發明的額外其他觀點。本發明的其他觀點可包括本發明的上述該些觀點的結合。本發明的該些其他觀點可提供上述該些觀點的許多結合，並提供上文未具體記載，但由本文所記載的其他具體教示所教示，或由本文整體所記載的教示所教示的其他組態、結構、功能關係、及過程。Additional aspects of the present invention will be apparent to those skilled in the art upon reading the teachings herein. Other aspects of the invention may include combinations of the above aspects of the invention. These other aspects of the invention may provide for many combinations of the aspects described above, and provide for other combinations not specifically described above but taught by other specific teachings recorded herein, or by the teachings recorded herein as a whole. state, structure, functional relationships, and processes.
一般電化學製造General electrochemical manufacturing
圖1A至圖1I繪示一替代性多層、多材料電化學製造過程中的許多狀態的側視圖。圖1A至圖1G繪示在多層製造過程中形成單一層的許多階段，其中，一第二金屬沉積於一第一金屬及第一金屬中的開口中，使得第一及第二金屬形成該層的部分。圖1A顯示具有一表面88的一基板82的一側視圖，可圖案化光阻84沉積、塗佈、或噴灑於其上，如圖1B所示。圖1C顯示透過將光阻固化、曝光、並顯影而來的一光阻圖案。將光阻84圖案化導致開口或開孔92(a)至92(c)自光阻的一表面86經由光阻的厚度而延伸至基板82的表面88。在圖1D中，一金屬94（例如，鎳）呈現為已電鍍於該些開口92(a)至92(c)中。在圖1E中，光阻已自基板移除（亦即，以化學方式或剝離），以將基板82未覆蓋有第一金屬94的區域曝光。在圖1F中，一第二金屬96（例如，銀）呈現為已覆蓋電鍍於基板82（可導電）的整個曝光部分及第一金屬94（亦可導電）。圖1G顯示完成結構的第一層，產生自將第一及第二金屬平面化而低至一高度，以將第一金屬曝光，並設定第一層的一厚度。圖1H顯示多次重複圖1B至圖1G所顯示的該些過程步驟以形成多層結構的結果，其中，各層由二個材料所組成。針對大部分應用，移除該些材料之一者，如圖1I所示，產生一所需3D結構98（例如，組件或裝置）或多個該些結構。1A-1I illustrate side views of various states in an alternative multi-layer, multi-material electrochemical fabrication process. Figures 1A-1G illustrate the stages of forming a single layer in a multi-layer manufacturing process in which a second metal is deposited in a first metal and openings in the first metal such that the first and second metals form the layer part. Figure 1A shows a side view of a
在某些變化中，結構可分離自基板。例如，將結構（或多個結構，若形成於一批量過程）釋放自基板可發生於當將結構釋放自犧牲材料時，特別是當犧牲材料的一層位於結構的第一層與基板之間時。替代方法可包括，例如，使用可在移除犧牲材料前、中、或後分離的一可溶解基板，在移除犧牲材料前或後將基板加工去除，或使用圍繞結構而可溶解、熔化、抑或用於在移除犧牲材料前、中、或後將結構分離自基板的不同中間材料。In some variations, the structure can be separated from the substrate. For example, releasing the structure (or structures, if formed in a batch process) from the substrate may occur when the structure is released from the sacrificial material, particularly when a layer of sacrificial material is located between a first layer of the structure and the substrate . Alternative methods may include, for example, using a dissolvable substrate that can be detached before, during, or after removal of the sacrificial material, processing the substrate away before or after removing the sacrificial material, or using a surrounding structure that can be dissolvable, melted, Or different intermediate materials used to separate the structure from the substrate before, during, or after removal of the sacrificial material.
本發明的許多觀點的許多實施例是關於自材料形成三維結構，其等某些或全部可為電沉積或無電沉積（如圖1A至圖1I所示）。某些該些結構可形成自單一構建水平（例如，一平面化層），形成自一或多個沉積材料，而其他形成自多個構建水平，各包括至少二個材料（例如，二或更多層，更佳是五或更多層，而最佳是十或更多層）。在某些實施例中，層的厚度可小至1微米或大至5微米。在其他實施例中，可使用薄層，而在其他實施例中可使用厚層，而在額外其他實施例中，層的厚度可在形成相同結構的不同水平的期間變化。在某些實施例中，微尺度結構具有橫向特徵定位成0.1至10微米等級的精度，及最小特徵尺寸為數微米至數十微米數量級。在其他實施例中，可形成具有較不精準特徵放置及/或更大最小特徵的結構。在額外其他實施例中，可能需要更高精度及更小最小特徵尺寸。在本應用中，中尺度及毫米尺度具有相同意義，而涉及裝置可具有一或多個尺寸，可延伸至0.1至50毫米的範圍或以上，及特徵定位成在微米至100微米的範圍中的精度且為數微米至數百微米數量級的最小特徵尺寸。Many embodiments of many aspects of the invention relate to forming three-dimensional structures from materials, some or all of which may be electro-deposited or electroless deposited (as shown in Figures 1A to 1I). Some of these structures may be formed from a single build level (e.g., a planarization layer) formed from one or more deposited materials, while others are formed from multiple build levels, each including at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers). In some embodiments, the thickness of the layer may be as small as 1 micron or as large as 5 microns. In other embodiments, thin layers may be used, while in other embodiments thick layers may be used, and in still other embodiments, the thickness of the layer may vary during the formation of different levels of the same structure. In certain embodiments, microscale structures have lateral feature positioning with an accuracy on the order of 0.1 to 10 microns, and a minimum feature size on the order of microns to tens of microns. In other embodiments, structures with less precise feature placement and/or larger minimum features may be formed. In still other embodiments, higher accuracy and smaller minimum feature sizes may be required. In this application, mesoscale and millimeter scale have the same meaning, and the devices involved may have one or more dimensions that may extend to the range of 0.1 to 50 millimeters or more, and feature positioning with an accuracy in the range of microns to 100 microns and a minimum feature size on the order of microns to hundreds of microns.
本文所揭露的許多實施例、替代例、及技術可使用單一圖案化技術於全部層或使用不同圖案化技術於不同層而形成多層結構。例如，本發明的許多實施例可執行選擇性圖案化操作，是使用一致性接觸遮罩及遮罩操作（亦即，操作所使用的遮罩接觸於但非黏著於一基板）、接近式遮罩及遮罩操作（亦即，操作所使用的遮罩至少部分選擇性遮蔽一基板，是透過其等接近於基板，即使沒有形成接觸）、非一致性遮罩及遮罩操作（亦即，遮罩及操作是基於接觸表面並非明顯一致的遮罩）、黏著遮罩及遮罩操作（遮罩及操作所使用的遮罩黏著於其上發生選擇性沉積或蝕刻的一基板，而不只是接觸之）、及/或選擇性圖案化沉積材料（例如，透過擠壓、噴射、或控制電沉積），而非遮罩圖案化沉積。一致性接觸遮罩、接近式遮罩、及非一致性接觸遮罩共有的性質是其等被執行並帶往或接近於一待處理表面（亦即，待處理表面的該些曝光部分）。該些遮罩一般可移除，而不破壞遮罩或其等接觸或位置接近的接受處理之表面。黏著遮罩一般形成於待處理表面（亦即，待遮罩表面的部分），並連接於該表面，使得其等不完全摧毀或破壞至超出再使用的任何程度就無法分離自該表面。黏著遮罩可以許多方式來形成，包括：（1）透過應用一光阻，將光阻選擇性曝光，然後將光阻顯影，（2）選擇性轉印預圖案化遮罩材料，及/或（3）自電腦控制材料沉積直接形成遮罩。在某些實施例中，黏著遮罩材料可使用作為該層的一犧牲材料或可使用只作為一遮罩材料，在完成形成一層前替代成另一材料（例如，介電或導電材料），其中，替代材料可視為各自的層的犧牲材料。在將材料沉積至其中包括的空洞或開口中前或後，遮罩材料可或可不平面化。Many of the embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, many embodiments of the present invention may perform selective patterning operations using conformal contact masks and masking operations (i.e., masks used in operations that contact but are not adhered to a substrate), proximity masks and masking operations (i.e., masks used in operations that at least partially selectively mask a substrate by being in close proximity to the substrate even if no contact is made), non-conformal masks and masking operations (i.e., masks and operations are based on masks that are not significantly conformal to the contact surface), adherent masks and masking operations (masks and operations used in operations that adhere to, rather than merely contact, a substrate on which selective deposition or etching occurs), and/or selectively patterned deposition of materials (e.g., by extrusion, spraying, or controlled electro-deposition) rather than mask patterned deposition. The common property of conformal contact masks, proximity masks, and non-conformal contact masks is that they are applied and brought to or near a surface to be processed (i.e., those exposed portions of the surface to be processed). These masks are generally removable without destroying the mask or the surface to be processed that it contacts or is located near. Adhesive masks are generally formed on the surface to be processed (i.e., the portion of the surface to be masked) and are connected to the surface so that they cannot be separated from the surface without completely destroying or damaging it to any extent beyond reuse. Adhesive masks can be formed in a number of ways, including: (1) by applying a photoresist, selectively exposing the photoresist, and then developing the photoresist, (2) selectively transferring pre-patterned mask materials, and/or (3) directly forming the mask from computer-controlled material deposition. In some embodiments, the adhesive mask material may be used as a sacrificial material for the layer or may be used only as a mask material and replaced with another material (e.g., a dielectric or conductive material) before completing the formation of a layer, wherein the replacement material may be considered a sacrificial material for the respective layer. The mask material may or may not be planarized before or after depositing the material into the voids or openings included therein.
圖案化操作可用於選擇性沉積材料及/或可用於選擇性蝕刻材料。選擇性蝕刻區域可透過覆蓋沉積或相似者來填充或選擇性填充不同所需材料。在某些實施例中，逐層建構可包括同時形成多層的部分。在某些實施例中，沉積形成於某些層級可導致沉積於其他層級的區域（亦即，設置於上下邊界水平中而定義不同層的幾何組態的區域）。該種使用選擇性蝕刻及/或交錯材料沉積於多層描述於Smalley於2003年5月7日申請的美國專利申請案第10/434,519號，現在是美國專利7,252,861，名稱為「透過交錯層或透過選擇性蝕刻並填充空洞來電化學製造結構的方法及裝置」。Patterning operations may be used to selectively deposit materials and/or may be used to selectively etch materials. Selectively etched areas may be filled or selectively filled with different desired materials by blanket deposition or the like. In some embodiments, layer-by-layer construction may include forming portions of multiple layers simultaneously. In some embodiments, deposition formation at certain levels may result in deposition of regions at other levels (i.e., regions disposed in upper and lower boundary levels to define different layer geometries). This use of selective etching and/or interleaved material deposition in multiple layers is described in U.S. Patent Application No. 10/434,519 filed May 7, 2003 by Smalley, now U.S. Patent No. 7,252,861, entitled "Method and Apparatus for Electrochemically Fabricating Structures by Interleaving Layers or by Selectively Etching and Filling Voids."
其上可形成結構的暫時基板可為犧牲型（亦即，在分離沉積材料的期間摧毀或破壞至其等無法再使用的程度）或非犧牲型（亦即，不摧毀或過度破壞，亦即，不破壞至其等可能無法再使用的程度，例如，具有一犧牲或釋放層，位於基板與形成的一結構的該些最初層之間）。非犧牲基板可視為可再使用，需要極少或不需要重工（例如，將一或多個選定的表面再平面化，或施加一釋放層，及相似者），雖然其等因許多理由而可或可不再使用。The temporary substrate on which structures may be formed may be sacrificial (i.e., destroyed or damaged during separation of the deposited material to the extent that it cannot be reused) or non-sacrificial (i.e., not destroyed or excessively damaged, i.e. , not damaged to the extent that they may no longer be usable, for example, with a sacrificial or release layer between the substrate and the initial layers of a formed structure). Non-sacrificial substrates may be considered reusable, requiring little or no rework (e.g., replanarizing one or more selected surfaces, or applying a release layer, and the like), although they may or may not be used for many reasons. Can no longer be used.
本領域技術人員可理解的是，許多用語及觀念的定義可用於理解本發明的該些實施例（無論是針對該些裝置本身、形成該些裝置的某些方法、或使用該些裝置的某些方法）。It will be understood by those skilled in the art that many definitions of terms and concepts may be used to understand the embodiments of the invention (whether directed to the devices themselves, certain methods of forming the devices, or certain methods of using the devices). some methods).
探針實施例：Probe Example:
本發明的許多實施例的探針可採用許多形式。各探針包括至少一實質平面張力彈簧區段，以相對於一第二尖端（可為或可不為一接觸尖端）而偏置一測試接觸尖端，其中，該些探針一般包括結構元件，以確保穩定且堅固的探針功能。在某些實施例中，該些探針更包括多個實質平面彈簧區段，只為伸張型或結合一或多個伸張彈簧與一或多個壓縮彈簧。在某些實施例中，彈簧組態成在功能上串聯或並聯操作，其中，該些彈簧區段至少部分設置成側對側或面對面，而非邊對邊或端對端。在某些實施例中，探針變形限於沿著探針的軸壓縮（例如，當探針尖端或電路結合元件移動至更接近位置時，實質縱向壓縮）。The probes of the many embodiments of the present invention may take many forms. Each probe includes at least one substantially planar tension spring segment to bias a test contact tip relative to a second tip (which may or may not be a contact tip), wherein the probes generally include structural elements to ensure stable and robust probe function. In some embodiments, the probes further include multiple substantially planar spring segments, either extension-only or combining one or more extension springs with one or more compression springs. In some embodiments, the springs are configured to operate in series or parallel in function, wherein the spring segments are at least partially arranged side-to-side or face-to-face, rather than edge-to-edge or end-to-end. In some embodiments, probe deformation is limited to compression along the axis of the probe (e.g., substantial longitudinal compression as the probe tip or circuit-engaging element moves to a closer position).
可進行許多其他變化，其等某些在本文中明文或隱含記載，而其他則為本領域技術人員在閱讀本文的教示後可明白。某些變化包括將該些探針用於測試積體電路、半導體晶圓上的模具、或其他電子電路。其他變化包括將該些探針組裝於陣列中，以用於測試應用或用於永久接觸應用。額外實施例包括形成該些探針或形成該些陣列的方法。Many other variations may be made, some of which are explicitly or implicitly described herein, while others will be apparent to those skilled in the art upon reading the teachings herein. Some variations include using the probes to test integrated circuits, molds on semiconductor wafers, or other electronic circuits. Other variations include assembling the probes into arrays for test applications or for permanent contact applications. Additional embodiments include methods of forming the probes or forming the arrays.
元件符號包括於許多該些圖式中，其中，相似符號是用於表示不同實施例中的相似結構或特徵。Reference numerals are included throughout many of the drawings, wherein like numerals are used to represent similar structures or features in different embodiments.
第一組實施例：探針具有一或多個伸張彈簧，把持於套體中The first set of embodiments: the probe has one or more extension springs, held in the sleeve
圖2A提供一探針200A的一示意性繪圖，其中，單一張力彈簧或彈簧區段201連接於二個尖臂的兩端，特別是一上尖臂211及一下尖臂212，具有對應上下尖端211T及212T。特別是，上下尖臂211、212透過各自的可移動止動板或橫向臂，特別是，一上止動板264及一下止動板262而連接至彈簧區段201，上尖臂211的一下部分連接至下止動板262，而下尖臂212的一上部分連接至上止動板464。適合地，上止動板264具有一開口202-1，而下止動板262具有一開口402-2，上尖臂211及下尖臂212可分別自由通過之，該些開口202-1及202-2的該些壁體的功能為該些尖臂的縱向移動引導元件。在此處及下文中，相關用語諸如「上」、「下」、「上方」、「下方」、及相似者是為了簡潔起見，參考圖式所給予的繪圖而使用。同理，用語諸如「左」及「右」仍將參考該些圖式使用。Figure 2A provides a schematic drawing of a probe 200A in which a single tension spring or
圖2B-1至圖2B-3提供一探針200B的示意性繪圖，相似於圖2A的探針200A，其中，探針更包括一套體或框結構235，其中，顯示一左側及右側。特別是，套體或框結構235設定一最小距離在上下止動板264及262之間，其中，套體235適合地至少包括上止動特徵232-1、下止動特徵232-2、及間隔件或間隔區段234。圖2B-1顯示探針200B在一未偏轉狀態，其中，該些可移動止動板262、264分別靜置於套體235的上下止動特徵232-1及232-2。圖2B-2顯示探針200B，其中，下尖端212T壓縮朝向套體235（例如，透過接觸於一下接觸結構250，例如，一電子電路元件，諸如一待測裝置DUT，移動朝向套體235下方），其中，當可移動上止動板264受力遠離套體235上方時，彈簧區段201受偏置或拉伸。圖2B-3顯示探針200B在上尖端211T壓縮朝向套體235（例如，透過接觸於一上接觸結構255，例如，一電子電路元件，諸如一測試電路，特別是連接測試電路的一空間轉換器或一PCB，移動朝向套體235上方），其中，當可移動下止動板262受力遠離套體235下方時，彈簧區段20受進一步偏置或拉伸。2B-1 to 2B-3 provide schematic illustrations of a
特別是，上下尖臂211、212的相對位移導致彈簧區段201彈性拉伸且上止動板264移動遠離下止動板262。In particular, the relative displacement of the upper and lower pointed
在某些實施例中，套體235可具備實心前後面或前後框結構，以在該些止動板262、264移動的期間，協助提供橫向引導。在某些實施例中，套體235及/或可移動止動板262、264可包括額外特徵，以允許在該些尖臂211、212、連接的止動板262、264、及彈簧區段201相對於套體235而縱向移動的期間，保持橫向相對位置。In some embodiments, the
圖2C提供一探針200C的另一示意性繪圖，相似於圖4A的探針400，其中，將彈簧區段201預偏置，是透過使用一更高套體或框結構235，以將可移動上下止動板264、262把持於更大相對分隔，因此確保上下尖端211T、212T兩者最初接觸於一表面（例如，一電子電路元件的一墊片、凸塊、或其他接觸表面）將伴隨一非零恢復或回力。FIG. 2C provides another schematic illustration of a
第二組實施例：探針具有伸張彈簧或彈簧區段，把持於一套體中，具備棘輪特徵Second set of embodiments: The probe has an extension spring or spring section, held in a housing, and has ratchet features
圖3A至圖3B提供一含套體伸張彈簧探針300的一示意性剖面圖，併同其中包括的一套體335的一側的一***圖，其為一多部分套體。更特別是，圖3A顯示伸張彈簧探針300在一第一工作條件下，對應於一中性、起始、或成形狀態，併同套體335的一側的一***圖，而圖3B顯示伸張彈簧探針300在一第二工作條件下，對應於一伸張、或預偏置、最終工作狀態，併同套體335的一側的一***圖。3A-3B provide a schematic cross-sectional view of a sleeve-containing extension spring probe 300, together with an exploded view of one side of the sleeve 335, which is a multi-part sleeve. More specifically, Figure 3A shows an exploded view of the extension spring probe 300 in a first operating condition, corresponding to a neutral, initial, or formed state, and one side of the sleeve 335, while Figure 3B shows The extension spring probe 300 is in a second operating condition, corresponding to an extended, or pre-biased, final operating condition and an exploded view of one side of the sleeve body 335 .
圖3A及圖3B的伸張彈簧探針300相似於圖2B-1至圖2B-3的探針200B，並包括單一張力彈簧區段301，透過各自的止動板或橫向臂362及364而連接於二個尖臂311及312的兩端，具有對應尖端311T及312T，套體335設定一最小距離在該些下止動板362與上止動板364之間。特別是，上尖臂311的一下部分連接至一下止動板362，而下尖臂312的一上部分連接至上止動板364。此外，上止動板364具有一開口302-1，而下止動板362具有一開口302-2，各自的上下尖臂311、312可自由通過之，其中，該些開口的壁體的功能為縱向移動引導元件。如上所述，下尖端312T可用於接觸於一下接觸結構，例如，一電子電路元件，諸如一待側裝置DUT，移動朝向套體335下方，而上尖端231T可用於接觸於一上接觸結構，例如，一電子電路元件，諸如一測試電路，特別是連接測試電路的一空間轉換器或一PCB，移動朝向套體335上方，其中，彈簧區段301從而受拉伸。The tension spring probe 300 of Figures 3A and 3B is similar to the
如圖3A及圖3B所示，套體335包括二個相同側340，各側340包括二個可移動偏置部分或柄部，特別是，至少一第一或上柄部350及一第二或下柄部370，設置於上止動板364及下止動板362之間，組態成彼此相對滑動。更特別是，上柄部350包括至少一橫向臂或止動元件352靜置於上止動板364，及一縱向元件354突出於止動元件352而朝向下柄部370，其進而包括至少一橫向臂或止動元件372靜置於下止動板362，及至少二個縱向元件374-1及374-2突出於止動元件372而朝向上柄部350，並在兩者之間定義一空間380，上柄部350的縱向元件354在其中滑動。As shown in Figures 3A and 3B, the sleeve 335 includes two identical sides 340, each side 340 includes two movable offset portions or handles, specifically, at least a first or upper handle 350 and a second or lower handle 370, disposed between an upper stop plate 364 and a lower stop plate 362, configured to slide relative to each other. More particularly, the upper handle 350 includes at least one transverse arm or stop element 352 stationary on the upper stop plate 364, and a longitudinal element 354 protruding from the stop element 352 toward the lower handle 370, which further includes at least one transverse arm or stop element 372 stationary on the lower stop plate 362, and at least two longitudinal elements 374-1 and 374-2 protruding from the stop element 372 toward the upper handle 350, and defining a space 380 therebetween, in which the longitudinal element 354 of the upper handle 350 slides.
適合地，套體335的各側340包括棘輪或交錯特徵，其等接合於當套體335最初經歷伸展，自如圖3A所示的一最初工作狀態（可為一成形狀態或一更少偏置工作狀態）至如圖3B所示的預偏置最終工作狀態時。特別是，上柄部350及下柄部370包括各自的棘輪或交錯特徵356及376，例如，形式為傾斜特徵，例如，可偏轉斜臂閂鎖或傾斜金屬刷毛，如圖式所示，適合關聯於其等縱向元件354、374-1、及374-2，以彼此接合於當上下柄部350、370彼此相對移動時，該些縱向元件354、374-1、及374-2至少部分移動經過彼此，如圖3B所示。Suitably, each side 340 of the sleeve 335 includes ratchets or staggered features that engage when the sleeve 335 initially undergoes extension from an initial operating state as shown in Figure 3A (which may be a formed state or a less biased state). working state) to the pre-biased final working state as shown in Figure 3B. In particular, upper handle 350 and lower handle 370 include respective ratcheting or staggered features 356 and 376, for example, in the form of angled features, such as deflectable angled arm latches or angled metal bristles, as shown in the drawings, suitable for Longitudinal elements 354, 374-1, and 374-2 are associated with each other so as to at least partially move when the upper and lower handles 350, 370 move relative to each other. passing each other, as shown in Figure 3B.
在批量形成多個探針後，該些探針可個別釋放或成組（例如，成綑之群組）釋放。在釋放成組的該些探針或個別探針後，該些探針可置於夾具中，以將該些探針把持於所需定向，接著，套體的上部分的該些上柄部或其他特徵可相對於套體的下部分的該些下柄部或其他特徵來操縱，使得上下部分移動分開，以接合該些棘輪特徵，使得探針的彈簧變成永久偏置，而套體變成永久拉長。After a plurality of probes are formed in a batch, the probes may be released individually or in groups (e.g., bundled groups). After releasing the groups of probes or individual probes, the probes may be placed in a fixture to hold the probes in a desired orientation, and then the upper handles or other features of the upper portion of the sleeve may be manipulated relative to the lower handles or other features of the lower portion of the sleeve so that the upper and lower portions move apart to engage the ratchet features, causing the springs of the probes to become permanently biased and the sleeve to become permanently elongated.
特別是，上柄部350的棘輪特徵356的一位置可選自由下列所組成的群組：（i）比起在最終位置時更靠近上止動板364，（ii）比起在一最終位置時更遠離下止動板362，及（iii）比起在最終位置時較不縱向置中於下止動板362。In particular, a position of the ratchet feature 356 of the upper handle 350 can be selected from the group consisting of: (i) closer to the upper stop plate 364 than in a final position, (ii) farther from the lower stop plate 362 than in a final position, and (iii) less longitudinally centered on the lower stop plate 362 than in a final position.
圖4A至圖4B提供一含套體伸張彈簧探針400的一示意性剖面圖，包括至少一彈簧區段401及一套體435，併同套體435的一側的一***圖，仍為一多部分套體，具有二個相同但鏡射側440。如上，圖4A顯示伸張彈簧探針400在一第一工作條件下，對應於一中性、起始、或成形狀態，併同套體435的一側的一***圖，而圖3B顯示伸張彈簧探針400在一第二工作條件下，對應於一伸張、或預偏置、最終工作狀態，併同套體435的一側的一***圖。4A-4B provide a schematic cross-sectional view of a sleeve-containing extension spring probe 400, including at least one spring segment 401 and a sleeve 435, together with an exploded view of one side of the sleeve 435, again being a multi-part sleeve, with two identical but mirrored sides 440. As above, FIG4A shows the extension spring probe 400 in a first operating condition, corresponding to a neutral, initial, or formed state, together with an exploded view of one side of the sleeve 435, and FIG3B shows the extension spring probe 400 in a second operating condition, corresponding to an extended, or pre-biased, final operating state, together with an exploded view of one side of the sleeve 435.
套體435的各側440包括二個可移動柄部，特別是，至少一第一或上柄部450及一第二或下柄部470，設置在一上止動板464與一下止動板462之間，並組態成彼此相對滑動。Each side 440 of the sleeve 435 includes two movable handles, specifically, at least a first or upper handle 450 and a second or lower handle 470, disposed between an upper stop plate 464 and a lower stop plate 462, and configured to slide relative to each other.
更特別是，上柄部450包括至少一第一或上橫向臂或止動元件452-1靜置於上止動板464，及一縱向元件454突出於上止動元件452-1而朝向下柄部470。上柄部450亦包括一第二或下橫向臂或止動元件452-2，在探針400的最終工作條件下，靜置於下柄部470。More particularly, the upper handle 450 includes at least a first or upper transverse arm or stop element 452-1 stationary on the upper stop plate 464, and a longitudinal element 454 protruding from the upper stop element 452-1 toward the lower handle 470. The upper handle 450 also includes a second or lower transverse arm or stop element 452-2 stationary on the lower handle 470 in the final working condition of the probe 400.
下柄部470進而包括至少一下橫向臂或止動元件472-1靜置於下止動板462，及至少二個縱向元件474-1及474-2突出於下止動元件472-1而朝向上柄部450，並在兩者之間定義一空間480，上柄部450的縱向元件454在其中滑動。根據圖4A及圖4B的替代實施例，下柄部460的下止動元件472-1具有一開口478，使得上柄部450的縱向元件454可通過下柄部470的下止動元件472-1，且在探針400的最終工作條件下，上柄部450的下止動元件452-2同樣可靜置於下柄部470的下止動元件472-1。The lower handle 470 further comprises at least one lower transverse arm or stop element 472-1 resting on the lower stop plate 462, and at least two longitudinal elements 474-1 and 474-2 protruding from the lower stop element 472-1 towards the upper handle 450 and defining a space 480 therebetween in which the longitudinal element 454 of the upper handle 450 slides. According to an alternative embodiment of FIGS. 4A and 4B , the lower stop element 472-1 of the lower handle 460 has an opening 478 so that the longitudinal element 454 of the upper handle 450 can pass through the lower stop element 472-1 of the lower handle 470, and the lower stop element 452-2 of the upper handle 450 can likewise rest on the lower stop element 472-1 of the lower handle 470 in the final working condition of the probe 400.
此外，下柄部470包括一上橫向臂或止動元件472-2，相對於下止動元件472-1而位於相對端，在探針400的最終工作條件下，上止動元件472-2靜置於上柄部的上止動元件452-1，如圖4B所示。In addition, the lower handle 470 includes an upper transverse arm or stop member 472-2 located at an opposite end relative to the lower stop member 472-1. In the final operating condition of the probe 400, the upper stop member 472-2 The upper stop element 452-1 rests on the upper handle, as shown in Figure 4B.
適合地，套體435的各側440包括棘輪或交錯特徵，其等接合於當套體435最初經歷伸展，自如圖4A所示的一最初工作狀態（可為一成形狀態或一更少偏置工作狀態）至如圖4B所示的預偏置最終工作狀態時。特別是，上柄部450及下柄部470包括各自的棘輪或交錯特徵456及476，彼此接合於當上下柄部450、470彼此相對移動時。Suitably, each side 440 of the sleeve 435 includes ratchets or staggered features that engage when the sleeve 435 initially undergoes extension from an initial operating state as shown in Figure 4A (which may be a formed state or a less biased state). working state) to the pre-biased final working state as shown in Figure 4B. In particular, the upper and lower handles 450, 470 include respective ratcheting or staggered features 456 and 476 that engage each other when the upper and lower handles 450, 470 move relative to each other.
以相似於如上所述關於圖3A至圖3B的方式，預偏置該些彈簧區段401及套體435的發生可自透過拉動柄部450、470而改成下部分的該些縱向元件與套體的上部分可推向彼此，以接合該些棘輪特徵，使得探針400彈簧區段401變成永久偏置，而套體435變成永久伸張。3A-3B , pre-biasing of the spring sections 401 and the sleeve 435 can occur by pulling the handles 450, 470 so that the longitudinal elements of the lower portion and the upper portion of the sleeve can be pushed toward each other to engage the ratchet features such that the spring section 401 of the probe 400 becomes permanently biased and the sleeve 435 becomes permanently extended.
圖5A至圖5B提供根據本發明的另一實施例的一含套體伸張彈簧探針500的一示意性剖面圖，併同其套體535的一側的一***圖。圖5A顯示伸張彈簧探針500在一第一工作條件下，對應於一中性、起始、或成形狀態，併同套體535的一側的一***圖，而圖5B顯示伸張彈簧探針500在一第二工作條件下，對應於一伸張、或預偏置、最終工作狀態，併同套體535的一側的一***圖。5A-5B provide a schematic cross-sectional view of a sleeve-containing extension spring probe 500 according to another embodiment of the present invention, together with an exploded view of one side of its sleeve 535. FIG5A shows the extension spring probe 500 in a first working condition, corresponding to a neutral, initial, or formed state, together with an exploded view of one side of the sleeve 535, and FIG5B shows the extension spring probe 500 in a second working condition, corresponding to an extended, or pre-biased, final working state, together with an exploded view of one side of the sleeve 535.
關於圖5A及圖5B的實施例，上柄部550包括一輔助鎖特徵552C，形式為一C形端，位於其上止動元件552-1，定義一額外空間580-2，下柄部570的上止動元件572-2可接合其中，如圖5B所示，當套體535最初經歷伸展，自起始狀態至預偏置最終工作狀態時，進一步關聯於上下柄部550、570的該些縱向元件554、574-1、及574-2的棘輪或交錯特徵556及576分別接合。With respect to the embodiment of Figures 5A and 5B, the upper handle 550 includes a secondary locking feature 552C in the form of a C-shaped end on which the upper stop element 552-1 defines an additional space 580-2, the lower handle 570 The upper stop element 572-2 may be engaged therein, as shown in Figure 5B, when the sleeve 535 initially undergoes extension from the initial state to the pre-biased final operating state, further associated with the upper and lower handles 550, 570. The ratcheting or staggering features 556 and 576 of the longitudinal elements 554, 574-1, and 574-2 respectively engage.
如同圖4A至圖4B的實施例，預偏置此實施例的該些彈簧區段501及套體535的發生可透過拉動柄部550、570或改成下部分的該些縱向元件與套體535的上部分推向彼此，以接合該些棘輪特徵，使得探針500的彈簧區段501變成永久偏置，而套體535變成永久伸張。As with the embodiment of Figures 4A-4B, pre-biasing the spring sections 501 and sleeve 535 of this embodiment can occur by pulling the handles 550, 570 or changing the longitudinal elements and sleeves of the lower portion The upper portions of probe 535 are pushed toward each other to engage the ratchet features so that spring section 501 of probe 500 becomes permanently biased and sleeve 535 becomes permanently stretched.
第三組實施例：探針具有伸張彈簧或彈簧區段，具備棘輪特徵Third set of embodiments: The probe has an extension spring or spring section with ratchet features
圖6A至圖6B提供根據本發明的再一實施例的一伸張彈簧探針600的示意性剖面圖，在一第一工作條件下，對應於一中性、起始、或成形狀態（圖6A），及在一第二工作條件下，對應於一伸張、或預偏置、最終工作狀態（圖6B）。根據此實施例，探針600的上下尖臂611、612各包括棘輪特徵640-1及640-2，分別可移動通過上下止動板664、662所提供的開口602-1、602-2，以自中性狀態或起始狀態永久過渡至一預偏置最終工作狀態。在此實施例中，由於該些探針600的該些尖臂611、612把持該些棘輪特徵640-1及640-2，永久預偏置該些彈簧區段601的發生可單純透過將上下探針尖端611T、612T按壓在一起。根據一替代實施例，當多個探針位於一橫向間隔陣列組態中時，可達成最終組態，或在完成預偏置其等彈簧後，該些探針可組裝於其等橫向陣列組態中。6A-6B provide schematic cross-sectional views of an extension spring probe 600 according to yet another embodiment of the present invention, in a first operating condition, corresponding to a neutral, starting, or forming state (FIG. 6A), and in a second operating condition, corresponding to an extended, or pre-biased, final operating state (FIG. 6B). According to this embodiment, the upper and lower pointed arms 611, 612 of the probe 600 each include ratchet features 640-1 and 640-2, respectively movable through openings 602-1, 602-2 provided by upper and lower stop plates 664, 662, to permanently transition from the neutral or starting state to a pre-biased final operating state. In this embodiment, permanent pre-biasing of the spring sections 601 may occur simply by pressing the upper and lower probe tips 611T, 612T together, as the pointed arms 611, 612 of the probes 600 hold the ratchet features 640-1 and 640-2. According to an alternative embodiment, the final configuration may be achieved when the probes are in a transversely spaced array configuration, or the probes may be assembled in their transverse array configuration after pre-biasing their springs.
圖7A至圖7B提供根據本發明的又一實施例的一伸張彈簧探針700的一示意性剖面圖，在一第一工作條件下，對應於一中性、起始、或成形狀態（圖7A），及在一第二工作條件下，對應於一伸張、或預偏置、最終工作狀態（圖7B）。根據此替代實施例，只有一尖臂，例如，下尖臂711包括一棘輪特徵740可移動通過一下止動板762的一開口702-2，以將探針700自中性狀態永久過渡至預偏置最終工作狀態。探針700及預偏置彈簧區段相似於先前實施例，但該些棘輪元件並非提供於二個尖臂，而只提供於該些尖臂的單一者。7A-7B provide a schematic cross-sectional view of an extension spring probe 700 in a first operating condition corresponding to a neutral, initial, or formed state (Fig. 7A), and in a second operating condition corresponding to an extended, or pre-biased, final operating state (Fig. 7B). According to this alternative embodiment, only one pointed arm, for example, lower pointed arm 711 including a ratchet feature 740 can move through an opening 702-2 in lower stop plate 762 to permanently transition probe 700 from the neutral state to the preset state. Bias final working state. The probe 700 and pre-biased spring section are similar to the previous embodiments, but the ratchet elements are not provided on two pointed arms, but only on a single one of the pointed arms.
圖3A至圖3B的基於棘輪或鎖定的預偏置實施例可進行許多變化，並包括該些棘輪元件，除了繪示的該些可偏轉斜臂閂鎖之外，採用不同組態，例如，棘輪對可包括可移動經過一剛性特徵的一可偏轉元件，以替代移動經過彼此的一系列棘輪元件，該些棘輪元件基本上可為單獨。在圖6A至圖6B及圖7A至圖7B的該些實施例，該些棘輪元件的形式可為可偏轉構件，當該些尖臂承載一或多個剛性後止動特徵時，可自該些尖臂移動至該些板。The ratchet or lock based pre-biased embodiment of Figures 3A-3B may be varied in many ways and include the ratchet elements in different configurations other than the deflectable bevel arm latches shown, for example, the ratchet pair may include a deflectable element that moves past a rigid feature, instead of a series of ratchet elements that move past each other, the ratchet elements may be substantially separate. In the embodiments of Figures 6A-6B and 7A-7B, the ratchet elements may be in the form of deflectable members that move from the pointed arms to the plates when the pointed arms carry one or more rigid rear stop features.
適合地，根據上述該些實施例之任一者的探針可具有一長度選自由下列所組成的群組：（1）小於2 mm、（2）小於3 mm、（3）小於5 mm、（4）小於8 mm、（5）大於2 mm、（6）大於3 mm、（7）大於5 mm、及（8）大於8 mm，及一寬度選自由下列所組成的群組：（1）小於100微米、（2）小於200微米、（3）小於300微米、（4）小於400微米、及（5）小於600微米。Suitably, a probe according to any of the above embodiments may have a length selected from the group consisting of: (1) less than 2 mm, (2) less than 3 mm, (3) less than 5 mm, (4) less than 8 mm, (5) greater than 2 mm, (6) greater than 3 mm, (7) greater than 5 mm, and (8) greater than 8 mm, and a width selected from the group consisting of: (1) ) less than 100 microns, (2) less than 200 microns, (3) less than 300 microns, (4) less than 400 microns, and (5) less than 600 microns.
探針可組態於一陣列，用於晶圓級測試，或用於接口測試一或多個封裝積體電路。Probes can be configured in an array for wafer-level testing, or for interface testing of one or more packaged integrated circuits.
根據上述該些實施例之任一者的探針亦可具有一順應性結構包括多個結合彈簧區段。A probe according to any of the embodiments described above may also have a compliant structure including a plurality of binding spring segments.
根據其他實施例，探針可更包括一特徵選自由下列所組成的群組：（1）多個組態，可接合於一陣列結構上的多個特徵，以允許預偏置至少一彈簧區段；（2）至少一分流元件，引導電流自第一或第二尖臂之一者通過一非順應性結構，再通過第一或第二尖臂之另一者；及（3）至少一分流元件，引導電流自第一或第二尖臂之一者通過一非順應性結構，再通過第一或第二尖臂之另一者，其中，至少一分流元件為一表面，該些尖臂在其上滑動。探針可具備一引導結構，連接至第一及第二尖臂，並提供增進的穩定性及/或指向準確度於探針，及限制第一尖端及第二尖端沿著探針的一實質縱軸相對移動。According to other embodiments, the probe may further include a feature selected from the group consisting of: (1) a plurality of features that can be coupled to an array structure to allow pre-biasing of at least one spring segment; (2) at least one shunt element that directs current from one of the first or second pointed arms through a non-compliant structure to the other of the first or second pointed arms; and (3) at least one shunt element that directs current from one of the first or second pointed arms through a non-compliant structure to the other of the first or second pointed arms, wherein at least one shunt element is a surface on which the pointed arms slide. The probe may have a guide structure connected to the first and second pointed arms and providing enhanced stability and/or pointing accuracy to the probe and limiting relative movement of the first tip and the second tip along a substantial longitudinal axis of the probe.
可透過將本文所記載的許多實施例及其等之替代例結合於其他實施例及其等之替代例來創造額外其他實施例。Still other embodiments may be created by combining many of the embodiments described herein and their alternatives with other embodiments and their alternatives.
額外意見及結論Additional Comments and Conclusions
存在本發明的許多其他實施例。某些該些實施例可基於將本文的教示結合於許多習知教示。例如，某些製造實施例可不使用任何覆蓋沉積過程。某些實施例可使用選擇性沉積過程或覆蓋沉積過程於某些層，而非電沉積過程。某些實施例可使用鎳或鎳鈷作為一結構材料，而其他實施例可使用不同材料。例如，較佳彈簧材料包括鎳（Ni）、銅（Cu）結合於一或多個其他材料、鈹銅（BeCu）、鎳磷（Ni-P）、鎢（W）、鋁銅（Al-Cu）、鋼、P7合金、鈀、鈀鈷、銀、鉬、錳、黃銅、鉻、鉻銅（Cr-Cu）、及其等之結合。某些實施例可使用銅作為結構材料，具有或沒有一犧牲材料。There are many other embodiments of the invention. Some of these embodiments may be based on combining the teachings herein with many conventional teachings. For example, some fabrication embodiments may not use any blanket deposition process. Some embodiments may use a selective deposition process or a blanket deposition process on certain layers rather than an electrodeposition process. Some embodiments may use nickel or nickel cobalt as a structural material, while other embodiments may use different materials. For example, preferred spring materials include nickel (Ni), copper (Cu) combined with one or more other materials, beryllium copper (BeCu), nickel phosphorus (Ni-P), tungsten (W), aluminum copper (Al-Cu) ), steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chromium, chromium-copper (Cr-Cu), and combinations thereof. Certain embodiments may use copper as the structural material, with or without a sacrificial material.
結構或犧牲介電材料可以許多不同方式來納入於本發明的實施例。該些材料可形成一第三材料或更高沉積材料於選定的層或可形成前二個材料之一者，沉積於某些層。Structural or sacrificial dielectric materials may be incorporated into embodiments of the present invention in many different ways. These materials may form a third material or higher deposited material at selected layers or may form one of the first two materials deposited at certain layers.
某些實施例可採用擴散連接或相似者，以增進材料連續層之間的黏著或減少應力。Certain embodiments may employ diffusion bonds or the like to enhance adhesion or reduce stress between continuous layers of material.
存在本發明的許多其他實施例。某些該些實施例可基於將本文的教示結合於許多習知教示。形成實施例的某些方法可不使用任何覆蓋沉積過程及/或其等可不使用一平面化過程。某些實施例可使用選擇性沉積過程或覆蓋沉積過程於某些層，而非電沉積過程。某些實施例可例如使用鎳、鎳磷、鎳鈷、鈀、鈀鈷、金、銅、錫、銀、鋅、焊錫、銠、錸作為結構材料，而其他實施例可使用不同材料。某些實施例可例如使用銅、錫、鋅、焊錫、或其他材料作為犧牲材料。某些實施例可使用不同結構材料於不同層或單一層上的不同部分。某些實施例可移除一犧牲材料，而其他實施例則否。某些實施例可使用光阻、聚酰亞胺、玻璃、陶瓷、其他聚合物、及相似者作為介電結構材料。There are many other embodiments of the invention. Some of these embodiments may be based on combining the teachings herein with many conventional teachings. Certain methods of forming embodiments may not use any blanket deposition process and/or they may not use a planarization process. Some embodiments may use a selective deposition process or a blanket deposition process on certain layers rather than an electrodeposition process. Certain embodiments may use, for example, nickel, nickel phosphorus, nickel cobalt, palladium, palladium cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials, while other embodiments may use different materials. Certain embodiments may use copper, tin, zinc, solder, or other materials as sacrificial materials, for example. Certain embodiments may use different structural materials on different layers or different portions of a single layer. Some embodiments may remove a sacrificial material, while other embodiments may not. Certain embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.
本領域技術人員可理解的是，額外操作可用於變化上述形成實施例的方法。該些額外操作可例如執行清潔功能，而其等可執行活化功能及監視功能、及相似者。It will be appreciated by those skilled in the art that additional operations may be used to vary the methods of forming the embodiments described above. These additional operations may, for example, perform cleaning functions, while others may perform activation functions and monitoring functions, and the like.
亦可理解的是，本發明的某些觀點的該些探針元件可透過非常不同於本文所記載者的過程來形成，並不表示本發明的結構觀點必須只透過本文所教示的該些過程，或透過本文所教示的顯而易見的過程來形成。It is also understood that the probe elements of certain aspects of the present invention may be formed by processes that are very different from those described herein, and it is not intended that the structural aspects of the present invention must be formed only by the processes taught herein, or by processes that are obvious from the teachings herein.
雖然本說明書的許多部分已具備標題，並不表示該些標題用於將在本說明書的一部分中發現的教示的應用限制應用於本說明書的其他部分。例如，關聯於一實施例而得知的替代例是用於應用於全部實施例，使得不同實施例的該些特徵足以使得該些應用發揮功能，但不牴觸或移除所套用的實施例的全部益處。存在本發明的許多其他實施例。某些該些實施例可基於將本文所記載的教示結合於許多習知教示。Although many parts of this specification have titles, it is not intended that these titles are used to limit the application of the teachings found in one part of this specification to other parts of this specification. For example, alternatives learned in connection with one embodiment are used to apply to all embodiments, so that the features of the different embodiments are sufficient to enable the applications to function, but do not conflict with or remove all the benefits of the applied embodiment. There are many other embodiments of the present invention. Some of these embodiments can be based on combining the teachings recorded in this article with many known teachings.
須表示，本文所記載的本發明的任何觀點呈現獨立發明說明，是申請人認為完全且完整的發明說明，申請人相信可記載成獨立請求項，只要一旦寫成該些獨立請求項即已明文記載於其等中，而不需要自本文所記載的其他實施例或觀點導入額外限制或元件來解釋或澄清。亦可理解的是，本文所記載的該些觀點的任何變化表示個別且分離的特徵，而可形成分離的獨立請求項、個別加入獨立請求項中、或新增成附屬請求項以進一步定義一發明，應該寫成各自的該些附屬請求項來主張。It is to be noted that any viewpoint of the invention described herein presents an independent invention description, which the applicant believes is a complete and complete invention description, and the applicant believes that it can be recorded as an independent claim, as long as the independent claim is written as it is clearly stated therein, and no additional limitations or elements are introduced from other embodiments or viewpoints described herein to explain or clarify. It is also understood that any variation of the viewpoints described herein represents individual and separate features, and can form separate independent claims, be added to independent claims individually, or be added as dependent claims to further define an invention, and should be written as the respective dependent claims to be asserted.
有鑑於本文的教示，本領域技術人員可明白用於設計及運用本發明的該些實施例的許多額外實施例、替代例。因此，並不表示本發明限於上述特別敘述的實施例、替代例、及運用，但純粹由下文的申請專利範圍來界定。In view of the teachings herein, those skilled in the art will appreciate that many additional embodiments and alternatives to the embodiments of the present invention can be designed and used. Therefore, it is not intended that the present invention be limited to the embodiments, alternatives, and uses specifically described above, but are solely defined by the scope of the patent application below.
82:基板 84:光阻 86:表面 88:表面 92(a):開孔 92(b):開孔 92(c):開孔 94:金屬 96:金屬 98:3D結構 200B:探針 200C:探針 201:彈簧區段 202-1:開口 202-2:開口 211:上尖臂 211T:尖端 212:下尖臂 212T:尖端 232-1:上止動特徵 232-2:下止動特徵 234:間隔件 235:套體 250:下接觸結構 255:上接觸結構 262:上止動板 264:下止動板 300:伸張彈簧探針 301:彈簧區段 302-1:開口 302-2:開口 311:尖臂 311T:尖端 312:尖臂 312T:尖端 335:套體 340:側 350:上柄部 352:止動元件 354:縱向元件 356:棘輪特徵 362:止動板 364:止動板 370:下柄部 372:止動元件 374-1:縱向元件 374-2:縱向元件 376:棘輪特徵 380:空間 400:探針 401:彈簧區段 402-1:開口 402-2:開口 411:尖臂 411T:尖端 412:尖臂 412T:尖端 435:套體 440:側 450:上柄部 452-1:止動元件 452-2:止動元件 454:縱向元件 456:棘輪特徵 462:下止動板 464:上止動板 476:棘輪特徵 470:下柄部 472-1:止動元件 472-2:止動元件 474-1:縱向元件 474-2:縱向元件 478:開口 480:空間 480-2:額外空間 500:伸張彈簧探針 501:彈簧區段 502-1:開口 502-2:開口 511:尖臂 511T:尖端 512:尖臂 512T:尖端 535:套體 540:側 550:上柄部 552-1:上止動元件 552C:C狀端 554:縱向元件 556:棘輪特徵 562:止動板 564:止動板 570:下柄部 572-1:橫向元件 572-2:橫向元件 574-1:縱向元件 574-2:縱向元件 576:棘輪特徵 578:開口 580:空間 580-2:額外空間 600:探針 601:彈簧區段 602-1:開口 602-2:開口 611:尖臂 611T:尖端 612:尖臂 612T:尖端 640-1:棘輪特徵 640-2:棘輪特徵 662:止動板 664:止動板 700:探針 701:彈簧區段 702-1:開口 702-2:開口 711:尖臂 711T:尖端 712:尖臂 712T:尖端 740:棘輪特徵 762:止動板 764:止動板 82: substrate 84: photoresist 86: surface 88: surface 92(a): opening 92(b): opening 92(c): opening 94: metal 96: metal 98: 3D structure 200B: probe 200C: probe 201: spring section 202-1: opening 202-2: opening 211: upper tip arm 211T: tip 21 2: Lower tip arm 212T: Tip 232-1: Upper stop feature 232-2: Lower stop feature 234: Spacer 235: Sleeve 250: Lower contact structure 255: Upper contact structure 262: Upper stop plate 264: Lower stop plate 300: Extension spring probe 301: Spring section 302-1: Opening 302-2: Opening 311: Pointed arm 311T: tip 312: Pointed arm 312T: tip 335: sleeve 340: side 350: upper handle 352: stop element 354: longitudinal element 356: ratchet feature 362: stop plate 364: stop plate 370: lower handle 372: stop element 374-1: longitudinal element 374-2: longitudinal element 376 : Ratchet features 380: Space 400: Probe 401: Spring section 402-1: Opening 402-2: Opening 411: Pointed arm 411T: Tip 412: Pointed arm 412T: Tip 435: Sleeve 440: Side 450: Upper handle 452-1: Stop element 452-2: Stop element 454: Longitudinal element 456: Ratchet features 462: Lower stop plate 464: Upper stop plate 476: Ratchet features 470: Lower handle 472-1: Stop element 472-2: Stop element 474-1: Longitudinal element 474-2: Longitudinal element 478: Opening 480: Space 480-2: Additional space 500: Extension spring probe 501: Spring section 502 -1: opening 502-2: opening 511: pointed arm 511T: tip 512: pointed arm 512T: tip 535: sleeve 540: side 550: upper handle 552-1: upper stop element 552C: C-shaped end 554: longitudinal element 556: ratchet feature 562: stop plate 564: stop plate 570: lower handle 572- 1: Horizontal element 572-2: Horizontal element 574-1: Longitudinal element 574-2: Longitudinal element 576: Ratchet feature 578: Opening 580: Space 580-2: Additional space 600: Probe 601: Spring section 602-1: Opening 602-2: Opening 611: Pointed arm 611T: Tip 612: Pointed arm 61 2T: Tip 640-1: Ratchet feature 640-2: Ratchet feature 662: Stop plate 664: Stop plate 700: Probe 701: Spring section 702-1: Opening 702-2: Opening 711: Pointed arm 711T: Tip 712: Pointed arm 712T: Tip 740: Ratchet feature 762: Stop plate 764: Stop plate
圖1A至圖1F示意性顯示使用黏著遮罩電鍍來形成一結構的一第一層，其中，覆蓋沉積一第二材料，以覆蓋一第一材料的沉積位置之間的該些開口及第一材料本身兩者。1A to 1F schematically illustrate the use of adhesive mask plating to form a first layer of a structure, wherein a second material is blanket deposited to cover both the openings between deposition locations of a first material and the first material itself.
圖1G顯示透過將該些沉積材料平面化至一所需水平而完成形成第一層。FIG. 1G shows the completion of forming the first layer by planarizing the deposited materials to a desired level.
圖1H及圖1I分別顯示在形成結構的多層後及在自犧牲材料釋放結構後的過程狀態。Figures 1H and 1I show the process state after forming multiple layers of the structure and after releasing the structure from the sacrificial material, respectively.
圖2A、圖2B-1至圖2B-3、及圖2C提供一探針的一示意性繪圖，其中，具備單一張力彈簧或彈簧區段的止動板可在探針操作期間移動，而在某些例子中具有一套體。Figures 2A, 2B-1 through 2B-3, and 2C provide a schematic drawing of a probe in which a stop plate with a single tension spring or spring segment can move during probe operation. Some examples have a set of bodies.
圖3A至圖3B、圖4A至圖4B、及圖5A至圖5B提供根據本發明的多個實施例的一含套體伸張彈簧探針在二個不同工作條件下的示意性剖面圖，併同套體的一側的一***圖。3A to 3B, 4A to 4B, and 5A to 5B provide schematic cross-sectional views of a sleeve-containing extension spring probe under two different working conditions according to multiple embodiments of the present invention, and An exploded view of one side of the same body.
圖6A至圖6B及圖7A至圖7B提供根據本發明的二個實施例的一伸張彈簧探針在二個不同工作條件下的示意性剖面圖。6A to 6B and 7A to 7B provide schematic cross-sectional views of an extension spring probe under two different working conditions according to two embodiments of the present invention.
200B:探針 200B: Probe
201:彈簧區段 201: Spring section
202-1:開口 202-1: Opening
202-2:開口 202-2: Opening
211:上尖臂 211: Upper pointed arm
211T:上尖端 211T: Top tip
212:下尖臂 212: Lower pointed arm
212T:下尖端 212T: Lower tip
262:上止動板 262: Upper stop plate
264:下止動板 264:Lower stop plate
Claims (23)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/854,756 | 2022-06-30 | ||
| US17/898,446 | 2022-08-29 | ||
| US17/898,400 | 2022-08-29 |
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| Publication Number | Publication Date |
|---|---|
| TW202409572A true TW202409572A (en) | 2024-03-01 |
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