TW202407350A - Inspection jig and inspection device - Google Patents
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- 238000007689 inspection Methods 0.000 title claims abstract description 146
- 239000004020 conductor Substances 0.000 claims abstract description 460
- 239000000523 sample Substances 0.000 claims abstract description 127
- 239000012212 insulator Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 42
- 230000000694 effects Effects 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
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- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
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- 230000007797 corrosion Effects 0.000 description 1
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- 239000006071 cream Substances 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
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Abstract
Description
本發明是有關於一種用以進行電性檢查的檢查治具以及檢查裝置。The present invention relates to an inspection fixture and an inspection device for electrical inspection.
先前已知在檢查設備時所使用的傳輸路產生寄生電感。而且,已知若不考慮寄生電感,則難以對設備進行充分的測試(例如參照專利文獻1)。 [現有技術文獻] [專利文獻] It has previously been known that transmission paths used when inspecting equipment generate parasitic inductances. Furthermore, it is known that it is difficult to adequately test the device without taking parasitic inductance into account (for example, see Patent Document 1). [Prior art documents] [Patent Document]
[專利文獻1]日本專利特開2010-286453號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2010-286453
[發明所欲解決之課題] 因此,存在降低用以對檢查對象的設備進行檢查的配線所產生的電感、所謂的寄生電感的需求。 [Problem to be solved by the invention] Therefore, there is a need to reduce the inductance, so-called parasitic inductance, generated in the wiring for inspecting the equipment to be inspected.
本發明的目的在於提供一種容易降低用以進行電性檢查的配線路徑所產生的電感的檢查治具以及檢查裝置。 [解決課題之手段] An object of the present invention is to provide an inspection jig and an inspection device that can easily reduce the inductance generated in a wiring path used for electrical inspection. [Means to solve the problem]
本發明的一例的檢查治具包括:第一探針,用以與檢查對象物的第一端子接觸;第二探針,用以與所述檢查對象物的第二端子接觸;以及線纜,包括用以向所述第一探針供給電流的平面狀的第一導體與用以向所述第二探針供給電流的平面狀的第二導體,所述第一導體與所述第二導體之間隔著絕緣物而彼此相向配置,以自所述相向的方向觀察時所述第一導體與所述第二導體的重疊成為最大的方式,配置所述第一導體與所述第二導體。An inspection jig according to an example of the present invention includes: a first probe for contacting a first terminal of an object to be inspected; a second probe for contacting a second terminal of an object to be inspected; and a cable, It includes a planar first conductor for supplying current to the first probe and a planar second conductor for supplying current to the second probe. The first conductor and the second conductor The first conductor and the second conductor are arranged facing each other with an insulator interposed therebetween, and the first conductor and the second conductor are arranged so that the overlap of the first conductor and the second conductor becomes maximum when viewed from the facing direction.
而且,本發明的一例的檢查裝置包括:所述檢查治具;大致板狀的第一導體板,連接於所述第一導體;大致板狀的第二導體板,連接於所述第二導體,之間隔著絕緣物而與所述第一導體板相向配置;電源部,經由所述第一導體板及所述第二導體板而向所述第一導體及所述第二導體供給電流;以及檢查部,藉由自所述檢查對象物測定電壓及電流的至少一者,而進行所述檢查對象物的檢查。Furthermore, an inspection device according to an example of the present invention includes: the inspection jig; a substantially plate-shaped first conductor plate connected to the first conductor; and a substantially plate-shaped second conductor plate connected to the second conductor. , arranged opposite to the first conductor plate with an insulator between them; a power supply unit supplies current to the first conductor and the second conductor via the first conductor plate and the second conductor plate; and an inspection unit that inspects the inspection object by measuring at least one of a voltage and a current from the inspection object.
而且,本發明的一例的檢查裝置包括:連接器,能夠連接於用以與檢查對象物的第一端子接觸的第一探針及用以與所述檢查對象物的第二端子接觸的第二探針;大致板狀的第一導體板,連接於所述連接器;大致板狀的第二導體板,連接於所述連接器,之間隔著絕緣物而與所述第一導體板相向配置;電源部,經由所述第一導體板及所述第二導體板而向所述連接器供給電流;以及檢查部,藉由自所述檢查對象物測定電壓及電流的至少一者,而進行所述檢查對象物的檢查。 [發明的效果] Furthermore, an inspection device according to an example of the present invention includes a connector connectable to a first probe for contacting a first terminal of an inspection object and a second probe for contacting a second terminal of the inspection object. A probe; a substantially plate-shaped first conductor plate connected to the connector; a substantially plate-shaped second conductor plate connected to the connector and arranged to face the first conductor plate with an insulator in between. ; A power supply unit that supplies current to the connector via the first conductor plate and the second conductor plate; and an inspection unit that measures at least one of voltage and current from the inspection target object. Inspection of the inspection object. [Effects of the invention]
此種結構的檢查治具以及檢查裝置容易降低用以進行電性檢查的配線路徑所產生的電感。The inspection jig and inspection device with such a structure can easily reduce the inductance generated by the wiring path used for electrical inspection.
以下,基於圖式對本發明的實施方式進行說明。再者,在各圖中標註相同的符號的結構表示為相同的結構,並省略其說明。在各圖中,為了明確方向關係,而適當示出XYZ正交座標軸。Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the structures denoted by the same symbols in the respective drawings are represented as the same structures, and descriptions thereof are omitted. In each figure, in order to clarify the directional relationship, the XYZ orthogonal coordinate axes are shown appropriately.
圖1所示的檢查裝置1包括檢查裝置本體2、及檢查治具3。檢查治具3相對於檢查裝置本體2而能夠拆裝。檢查裝置本體2包括電源部4、數位示波器51、數位萬用錶52、及檢查部53。The inspection device 1 shown in FIG. 1 includes an
檢查部53例如使用微電腦或個人電腦等而構成,對數位示波器51及數位萬用錶52進行控制。並且,檢查部53基於由數位萬用錶52所測定的電壓及電流中的至少一者檢查下文所述的檢查對象物DUT。而且,檢查部53亦可基於由數位示波器51所測定的電壓及電流中的至少一個波形檢查下文所述的檢查對象物DUT。The inspection unit 53 is configured using, for example, a microcomputer or a personal computer, and controls the digital oscilloscope 51 and the digital multimeter 52 . Furthermore, the inspection unit 53 inspects the inspection target DUT described below based on at least one of the voltage and current measured by the digital multimeter 52 . Furthermore, the inspection unit 53 may inspect the inspection target DUT described below based on at least one waveform of voltage and current measured by the digital oscilloscope 51 .
檢查裝置本體2由框架21所支持。在框架21的-Y側的側面安裝有板狀的側面面板22。The
如圖2所示,在檢查裝置本體2的側面面板22安裝有連接器CN1。在連接器CN1連接第一導體板61及第二導體板62的一端(-Y側),第一導體板61及第二導體板62的另一端(+Y側)連接於電源部4。As shown in FIG. 2 , connector CN1 is attached to the
電源部4的+及-端子中的其中一端子藉由省略圖示的電源端子而連接於第一導體板61的另一端(+Y側),另一端子藉由省略圖示的電源端子而連接於第二導體板62的另一端(+Y側)。在圖2中省略了圖示,但例如藉由在第一導體板61及第二導體板62設置切口以避開將另一者連接於電源部4的部位,而能夠在+及-端子中的其中一者連接第一導體板61,在另一者連接第二導體板62。圖6中作為電路圖而示出電源部4的+端子41及-端子42。One of the + and - terminals of the
如圖7所示,第一導體板61及第二導體板62具有大致板狀形狀。在圖7中,第一導體板61及第二導體板62的外形線一致。如圖2所示,第一導體板61及第二導體板62之間隔著絕緣物63而相向配置。具體而言,第一導體板61與第二導體板62以自相向的方向、即第一導體板61及第二導體板62的厚度方向觀察時第一導體板61與第二導體板62的重疊成為最大的方式,配置第一導體板61與第二導體板62。進而,更佳為以自相向的方向觀察時第一導體板61與第二導體板62一致並重疊的方式配置第一導體板61與第二導體板62。As shown in FIG. 7 , the
例如,在圖2中,以將電源部4的+端子41(參照圖6)連接於第一導體板61的+Y側端部、將電源部4的-端子42(參照圖6)連接於第二導體板62的+Y側端部的情況為例,對能夠減少電感的理由進行說明。若在第一導體板61的+Y側端部連接電源部4的+端子41,且在第一導體板61的-Y側端部連接連接器CN1,則自電源部4的+端子41供給的電流自第一導體板61的+Y側端部流向-Y側端部的連接器CN1。For example, in FIG. 2 , the + terminal 41 (refer to FIG. 6 ) of the
另一方面,若在第二導體板62的+Y側端部連接-端子42,在第二導體板62的-Y側端部連接連接器CN1,則自-Y側端部的連接器CN1流出的電流流向+Y側端部的-端子42。即,在第一導體板61中,電流自+Y側端部流向-Y側端部,在第二導體板62中,電流自-Y側端部流向+Y側端部。其結果為,電流在第一導體板61與第二導體板62中沿彼此相反的方向流通。同樣地,在將-端子42連接於第一導體板61的+Y側端部、將+端子41連接於第二導體板62的+Y側端部的情況下,亦為電流在第一導體板61與第二導體板62中沿彼此相反的方向流通。On the other hand, if the -
如上所述,藉由將電流沿彼此相反的方向流通的第一導體板61與第二導體板62相向配置,第一導體板61所產生的磁場與第二導體板62所產生的磁場相抵,結果為第一導體板61的電感L(61)與第二導體板62的電感L(62)減少。其結果為,能夠減少自電源部4至連接器CN1的配線路徑的電感。As described above, by arranging the
在所述情況下,由於磁場強度與距離成反比例,故而越縮短第一導體板61與第二導體板62的距離,磁場越強地相抵,電感的減少效果越增大。因此,絕緣物63的厚度較佳為在能夠確保絕緣耐壓的範圍內儘量薄。In this case, since the magnetic field strength is inversely proportional to the distance, the shorter the distance between the
而且,面狀導體所產生的磁場可近似於將多根直線導體集合所產生的磁場。因此,將具有寬幅的大致板狀形狀的第一導體板61及第二導體板62相向配置而成的結構可近似為將多根直線導體相向配置而成的結構。若將多根直線導體相向配置,則與直線導體的根數相應地,磁場相抵的機會增大,磁場的相抵效果增大。因此,藉由將具有寬幅的大致板狀形狀的第一導體板61及第二導體板62相向配置,能夠減少自電源部4至連接器CN1的配線路徑的電感。Moreover, the magnetic field generated by the planar conductor can be approximated by the magnetic field generated by a collection of multiple linear conductors. Therefore, the structure in which the
作為第一導體板61及第二導體板62,例如可適宜地使用銅板,亦可以耐腐蝕性高的其他金屬對第一導體板61及第二導體板62的表面進行鍍敷等。As the
檢查治具3包括沿著XY平面的底板31、安裝於底板31的+Y側端部且沿著XZ平面的壁板32、將壁板32固定於底板31的三角托架33、連接器CN2、線纜7、連接板M1、連接板M2、中繼基板8、第一配件K1、第二配件K2、第一導體塊B1、第二導體塊B2、第一探針P1、第二探針P2、及檢查探針KP。The
在壁板32設置有開口部32h。連接器CN2以自開口部32h向+Y方向突出的方式安裝於壁板32。連接器CN2相對於壁板32而沿XY方向有游隙地安裝。在連接器CN2連接有線纜7的一端。The
壁板32例如使用省略圖示的螺栓等以能夠裝卸的方式安裝於側面面板22。藉此,將檢查治具3安裝於檢查裝置本體2。藉由將檢查治具3安裝於檢查裝置本體2,而將連接器CN1與連接器CN2連接。The
藉由在連接器CN2相對於壁板32的安裝中設置游隙,且使用柔性線纜作為線纜7,在將檢查治具3安裝於檢查裝置本體2時,連接器CN2能夠移動而吸收連接器CN1與連接器CN2的位置偏移。By providing play in the installation of the connector CN2 relative to the
在線纜7的其中一面形成有用以向第一探針P1供給電流的平面狀的第一導體71,在線纜7的另一面形成有用以向第二探針P2供給電流的平面狀的第二導體72。即,第一導體71與第二導體72之間隔著作為線纜基材的絕緣物73而彼此相向配置。A planar
如圖8所示,線纜7具有帶狀形狀。第一導體71與第二導體72的外形線一致。第一導體71與第二導體72的表面被樹脂等包層74所覆蓋。在圖2的截面圖中省略了包層74的記載。在線纜7的長度方向兩端部無包層74,而露出第一導體71及第二導體72。As shown in Fig. 8, the
第一導體71與第二導體72以自相向的方向、即線纜7的厚度方向觀察時第一導體71與第二導體72的重疊成為最大的方式,配置第一導體71與第二導體72。進而,更佳為以自相向的方向觀察時第一導體71與第二導體72一致並重疊的方式配置第一導體71與第二導體72。The
作為線纜7,可適宜地使用兩面設置有導體圖案的雙面柔性線纜。可使用柔性線纜兩面的導體圖案作為第一導體71及第二導體72。As the
如圖2所示,第一導體71及第二導體72的一端分別連接於連接器CN2的省略圖示的連接端子。並且,若將連接器CN1與連接器CN2連接,則第一導體板61與第一導體71導通,第二導體板62與第二導體72導通。第一導體71及第二導體72的另一端連接於下文所述的中繼基板8。As shown in FIG. 2 , one ends of the
如上所述,電流在第一導體板61及第二導體板62中沿彼此相反的方向流通,因此電流在分別與第一導體板61及第二導體板62導通連接的第一導體71及第二導體72中亦沿彼此相反的方向流通。如上所述,藉由將電流沿彼此相反的方向流通的第一導體71與第二導體72相向配置,第一導體71所產生的磁場與第二導體72所產生的磁場相抵,結果為第一導體71的電感L(71)與第二導體72的電感L(72)減少。其結果為,能夠減少自連接器CN2至中繼基板8的配線路徑的電感。As described above, the current flows in opposite directions in the
在所述情況下,由於磁場強度與距離成反比例,故而越縮短第一導體71與第二導體72的距離,磁場越強地相抵,電感的減少效果越增大。因此,絕緣物73的厚度較佳為在能夠確保絕緣耐壓的範圍內儘量薄。In this case, since the magnetic field strength is inversely proportional to the distance, the shorter the distance between the
而且,如上所述,藉由將面狀導體相向配置,磁場的相抵效果增大。因此,藉由將寬幅的平面狀的第一導體71及第二導體72相向配置,能夠減少自連接器CN2至中繼基板8的配線路徑的電感。Furthermore, as mentioned above, by arranging the planar conductors to face each other, the canceling effect of the magnetic fields is increased. Therefore, by arranging the wide planar
而且,藉由使用柔性線纜作為將連接器CN2與中繼基板8連接的線纜7,容易提高中繼基板8、第一探針P1、及第二探針P2的配置的自由度。Furthermore, by using a flexible cable as the
在底板31設置有開口部31h。中繼基板8在開口部31h的+Z側以沿著XZ平面的方式立設於底板31。在中繼基板8的其中一面形成有擴展為面狀的第一導體圖案81。與圖1所示的第一導體圖案81同樣,在中繼基板8的另一面形成有擴展為面狀的第二導體圖案82。第一導體圖案81與第二導體圖案82之間隔著中繼基板8的作為絕緣物的基材83而相向配置。The
第一導體圖案81的+Z側端部藉由大致板狀的連接板M1而與第一導體71導通連接,第二導體圖案82的+Z側端部藉由大致板狀的連接板M2而與第二導體72導通連接。連接板M1、連接板M2例如彎折為截面L字型。作為連接板M1、連接板M2,例如可適宜地使用銅板等導電性的金屬板。The +Z-side end of the
連接板M1與連接板M2彼此相向配置。如上所述,電流在第一導體71及第二導體72中沿彼此相反的方向流通,因此電流在分別與第一導體71及第二導體72導通連接的連接板M1及連接板M2中亦沿彼此相反的方向流通。如上所述,藉由將電流沿彼此相反的方向流通的連接板M1與連接板M2相向配置,連接板M1所產生的磁場與連接板M2所產生的磁場相抵,結果為能夠減少連接板M1的電感L(M1)與連接板M2的電感L(M2)。The connection plate M1 and the connection plate M2 are arranged facing each other. As mentioned above, the current flows in opposite directions in the
第一導體圖案81與第二導體圖案82以自相向的方向、即中繼基板8的厚度方向觀察時第一導體圖案81與第二導體圖案82的重疊成為最大的方式,配置第一導體圖案81與第二導體圖案82。具體而言,較佳為以自相向的方向觀察時第一導體圖案81與第二導體圖案82的重疊成為80%以上的方式相向配置,進而更佳為以第一導體圖案81與第二導體圖案82一致並重疊的方式配置第一導體圖案81與第二導體圖案82。The
如上所述,電流在連接板M1及連接板M2中沿彼此相反的方向流通,因此電流在分別與連接板M1及連接板M2導通連接的第一導體圖案81及第二導體圖案82中亦沿彼此相反的方向流通。如上所述,藉由將電流沿彼此相反的方向流通的第一導體圖案81與第二導體圖案82相向配置,第一導體圖案81所產生的磁場與第二導體圖案82所產生的磁場相抵,結果為第一導體圖案81的電感L(81)與第二導體圖案82的電感L(82)減少。其結果為,能夠減少中繼基板8的電感。As mentioned above, the current flows in opposite directions to each other in the connection plate M1 and the connection plate M2, so the current also flows in the
在所述情況下,由於磁場強度與距離成反比例,故而越縮短第一導體圖案81與第二導體圖案82的距離,磁場越強地相抵,電感的減少效果越增大。因此,基材83的厚度較佳為在能夠確保絕緣耐壓的範圍內儘量薄。In this case, since the magnetic field strength is inversely proportional to the distance, the shorter the distance between the
而且,如上所述,藉由將面狀導體相向配置,磁場的相抵效果增大。因此,藉由將擴展為面狀的第一導體圖案81及第二導體圖案82相向配置,而能夠減少中繼基板8的電感。可在中繼基板8適宜地安裝例如下文所述的緩衝電路SB等。Furthermore, as described above, by arranging the planar conductors to face each other, the canceling effect of the magnetic fields is increased. Therefore, by arranging the
參照圖9,在第一導體圖案81中的+Z側端部中央的導體圖案85a連接連接板M1的一端。藉此,將第一導體圖案81與第一導體71導通連接。參照圖10,在第二導體圖案82中的+Z側端部中央的導體圖案85b連接連接板M2的一端。藉此,將第二導體圖案82與第二導體72導通連接。第一導體圖案81及第二導體圖案82擴展至基材83的大致整個面。Referring to FIG. 9 , the
以下,將圖9所示的中繼基板8的-Y側的面稱為表面,將圖10所示的中繼基板8的+Y側的面稱為背面。在中繼基板8的-Y側表面中,在-X側端部附近存在三個區域A1~區域A3,在+X側端部附近存在三個區域A4~區域A5。Hereinafter, the surface on the -Y side of the
在圖9所示的中繼基板8的-Y側表面連接有電源部4的+端子。在區域A1設置導體圖案A1A、導體圖案A1B、導體圖案A1C、導體圖案A1D。在導體圖案A1A與導體圖案A1B之間安裝電容元件C1A。在導體圖案A1B與導體圖案A1C之間安裝電容元件C1B。在導體圖案A1C與導體圖案A1D之間安裝電容元件C1C。將電容元件C1A、電容元件C1B、電容元件C1C的合成電容稱為電容C1。在導體圖案A1D與導體圖案81A之間安裝開關元件SW1。導體圖案81A與導體圖案82A(參照圖10)導通。對於區域A2~區域A6亦同樣地安裝電容元件,將各自的合成電容稱為電容C2~電容C6。The + terminal of the
在圖10所示的中繼基板8的+Y側表面中,在+X側端部附近存在三個區域B1~區域B3,在-X側端部附近存在三個區域B4~區域B5。在區域B1設置導體圖案B1A、導體圖案B1B、導體圖案B1C。在導體圖案B1A與導體圖案B1B之間安裝電阻元件R1A。在導體圖案B1B與導體圖案B1C之間安裝電阻元件R1B。將電阻元件R1A、電阻元件R1B的合成電阻稱為電阻R1。對於區域B2~區域B6亦同樣地安裝電阻元件,將各自的合成電阻稱為電阻R2~電阻R6。參照圖6,若接通開關元件SW1,則自導體圖案85a向導體圖案85b連接。再者,亦可在區域A1~區域A6安裝電阻R1~電阻R6,在區域B1~區域B6安裝電容C1~電容C6。In the +Y side surface of the
如圖3、圖9、圖10所示,在中繼基板8的-Z側端部設置有向-Z側突出的突出部84。第一導體圖案81及第二導體圖案82沿著突出部84延伸,並覆蓋突出部84的兩面。在突出部84中的第一導體圖案81安裝有第一配件K1,在突出部84中的第二導體圖案82安裝有第二配件K2。As shown in FIGS. 3 , 9 , and 10 , a protruding
具體而言,突出部84中的第一導體圖案81的無抗蝕劑的焊墊部84a焊接有第一配件K1。在突出部84中的第二導體圖案82的無抗蝕劑的焊墊部84b焊接有第二配件K2。在將膏狀焊料塗佈於焊墊部84a、焊墊部84b後,在與基板相抵的狀態下加熱基部K1a、基部K2a,藉此將第一配件K1及第二配件K2焊接。焊墊部84a、焊墊部84b大於基部K1a、基部K2a。藉由在安裝於焊墊部84a、焊墊部84b的基部K1a、基部K2a中裝滿焊料,而進一步提高接合強度。Specifically, the first fitting K1 is soldered to the resist-free pad portion 84 a of the
第一配件K1及第二配件K2具有將大致板狀的金屬板彎折為大致L字型而成的形狀。具體而言,第一配件K1包括沿著XZ平面的板狀的基部K1a、及自基部K1a的-X側端部朝向-Y方向沿著YZ平面延伸的臂部K1b。第二配件K2包括沿著XZ平面的板狀的基部K2a、及自基部K2a的-X側端部朝向-Y方向沿著YZ平面延伸的臂部K2b。The first fitting K1 and the second fitting K2 have a shape in which a substantially plate-shaped metal plate is bent into a substantially L-shape. Specifically, the first attachment K1 includes a plate-shaped base K1a along the XZ plane, and an arm K1b extending along the YZ plane from the −X side end of the base K1a toward the −Y direction. The second attachment K2 includes a plate-shaped base K2a along the XZ plane, and an arm K2b extending along the YZ plane from the −X side end of the base K2a toward the −Y direction.
並且,將基部K1a以面接觸的方式安裝於突出部84的第一導體圖案81,臂部K1b自基部K1a的-X側端部向-Y方向延伸。將基部K2a以面接觸的方式安裝於突出部84的第二導體圖案82,臂部K2b以在與臂部K1b之間隔開微小的間隔SP而相向的方式自基部K2a的-X側向-Y方向延伸。Furthermore, the base K1a is attached to the
藉此,將基部K1a與基部K2a相向配置,且將基部K2a與臂部K2b相向配置。其結果為,以整體的形式將第一配件K1與第二配件K2相向配置。而且,將基部K1a與基部K2a以自中繼基板8的厚度方向(Y方向)觀察時重疊成為最大的方式配置。第一配件K1與第二配件K2連接於中繼基板8的表背。進而,更佳為第一配件K1與第一導體圖案81面接觸的區域和第二配件K2與第二導體圖案82面接觸的區域自中繼基板8的厚度方向(Y方向)觀察時一致。Thereby, the base K1a and the base K2a are arranged facing each other, and the base K2a and the arm K2b are arranged facing each other. As a result, the first accessory K1 and the second accessory K2 are integrally arranged to face each other. Furthermore, the base K1 a and the base K2 a are arranged so as to maximize their overlap when viewed from the thickness direction (Y direction) of the
如圖3、圖5所示,在臂部K1b的+X側的面安裝有第一導體塊B1,在臂部K2b的-X側的面安裝有第二導體塊B2。第一導體塊B1及第二導體塊B2具有大致長方體狀的形狀。作為第一導體塊B1及第二導體塊B2,例如可適宜地使用銅等導電性的金屬塊。As shown in FIGS. 3 and 5 , the first conductor block B1 is attached to the +X side surface of the arm part K1b, and the second conductor block B2 is attached to the −X side surface of the arm part K2b. The first conductor block B1 and the second conductor block B2 have a substantially rectangular parallelepiped shape. As the first conductor block B1 and the second conductor block B2, for example, conductive metal blocks such as copper can be suitably used.
如圖4所示,第一導體塊B1與第二導體塊B2以彼此的側面隔開間隔SP而相對向的方式配置。As shown in FIG. 4 , the first conductor block B1 and the second conductor block B2 are arranged so that their side surfaces face each other with a gap SP.
在第一導體塊B1中埋入一個或多個第一探針P1。在第二導體塊B2中埋入一個或多個第二探針P2。One or more first probes P1 are embedded in the first conductor block B1. One or more second probes P2 are embedded in the second conductor block B2.
在第一導體塊B1的與第二導體塊B2相向的側面B1a形成有槽B1b,該槽B1b的Z方向的寬度大於臂部K1b的Z方向的寬度,深度與臂部K1b的厚度大致相同,且沿Y方向延伸。在槽B1b內固著有臂部K1b。A groove B1b is formed on the side B1a of the first conductor block B1 facing the second conductor block B2. The width of the groove B1b in the Z direction is greater than the width of the arm K1b in the Z direction, and the depth is substantially the same as the thickness of the arm K1b. and extends along the Y direction. The arm K1b is fixed in the groove B1b.
在第二導體塊B2的與第一導體塊B1相向的側面B2a形成有槽B2b,該槽B2b的Z方向的寬度大於臂部K2b的Z方向的寬度,深度與臂部K2b的厚度大致相同,且沿Y方向延伸。在槽B2b內固著有臂部K2b。A groove B2b is formed on the side B2a of the second conductor block B2 opposite to the first conductor block B1. The width of the groove B2b in the Z direction is greater than the width of the arm K2b in the Z direction, and the depth is substantially the same as the thickness of the arm K2b. and extends along the Y direction. The arm K2b is fixed in the groove B2b.
藉此,槽B1b、槽B2b以外的側面B1a、側面B2a間的間隔及安裝於槽B1b、槽B2b內的臂部K1b、臂部K2b間的間隔均成為微小的間隔SP。如上所述,將電流沿+與-的相反方向流通的第一配件K1與第二配件K2相向配置,並將第一導體塊B1與第二導體塊B2相向配置,藉此第一配件K1及第一導體塊B1所產生的磁場與第二配件K2及第二導體塊B2所產生的磁場相抵,結果為第一配件K1的電感L(K1)、第一導體塊B1的電感L(B1)、第二配件K2的電感L(K2)、及第二導體塊B2的電感L(B2)減少。其結果為,能夠減少自中繼基板8至第一探針P1及第二探針P2的配線路徑的電感。Thereby, the distance between the side surfaces B1a and B2a other than the grooves B1b and grooves B2b and the distance between the arm parts K1b and K2b installed in the grooves B1b and grooves B2b become a minute distance SP. As described above, the first fitting K1 and the second fitting K2 that flow current in the opposite directions of + and - are arranged to face each other, and the first conductor block B1 and the second conductor block B2 are arranged to face each other, so that the first fitting K1 and the second fitting K2 are arranged to face each other. The magnetic field generated by the first conductor block B1 offsets the magnetic field generated by the second accessory K2 and the second conductor block B2. The result is the inductance L (K1) of the first accessory K1 and the inductance L (B1) of the first conductor block B1. , the inductance L (K2) of the second accessory K2, and the inductance L (B2) of the second conductor block B2 decrease. As a result, the inductance of the wiring path from the
在第一導體塊B1中埋入有一個或多個第一探針P1。在第二導體塊B2中埋入有一個或多個第二探針P2。第一探針P1及第二探針P2整體具有大致棒狀形狀。以第一探針P1及第二探針P2的軸方向沿著Z方向的方式埋入第一導體塊B1及第二導體塊B2中。One or more first probes P1 are embedded in the first conductor block B1. One or more second probes P2 are embedded in the second conductor block B2. The first probe P1 and the second probe P2 have a substantially rod-like shape as a whole. The first conductor block B1 and the second conductor block B2 are embedded in the first conductor block B1 and the second conductor block B2 so that the axial directions of the first probe P1 and the second probe P2 are along the Z direction.
第一導體塊B1及第二導體塊B2的沿著第一探針P1及第二探針P2的軸方向的長度H、即Z方向的長度H長於與第一探針P1及第二探針P2的軸方向正交的方向的長度W、即X方向的長度W。The length H of the first conductor block B1 and the second conductor block B2 along the axial direction of the first probe P1 and the second probe P2, that is, the length H in the Z direction is longer than that of the first probe P1 and the second probe. The length W in the direction orthogonal to the axial direction of P2 is the length W in the X direction.
藉由第一導體塊B1及第二導體塊B2的Z方向的長度H長於X方向的長度W,第一導體塊B1與第一探針P1的接觸面積、及第二導體塊B2與第二探針P2的接觸面積增大,結果為自第一導體塊B1至第一探針P1的電阻、及自第二導體塊B2至第二探針P2的電阻降低。Since the length H in the Z direction of the first conductor block B1 and the second conductor block B2 is longer than the length W in the X direction, the contact area between the first conductor block B1 and the first probe P1, and the contact area between the second conductor block B2 and the second The contact area of the probe P2 increases, resulting in a decrease in the resistance from the first conductor block B1 to the first probe P1 and from the second conductor block B2 to the second probe P2.
如圖5所示,將基部K1a與基部K2a以自中繼基板8中的突出部84的厚度方向(Y方向)觀察時重疊成為最大的方式配置,結果為在第一配件K1中流通的電流I1的路徑長度與在第二配件K2中流通的電流I2的路徑長度的差成為僅間隔SP、中繼基板8的厚度t8、及第二配件K2的角部的長度。其結果為,容易使電流I1的路徑長度與電流I2的路徑長度的差成為所需最小限度,而儘量減小路徑長度的差。As shown in FIG. 5 , the base K1 a and the base K2 a are arranged so as to maximize their overlap when viewed from the thickness direction (Y direction) of the protruding
藉由減小電流I1的路徑長度與電流I2的路徑長度的差,磁場未相抵的部分減少。其結果為,容易減少第一配件K1的電感L(K1)、及第二配件K2的電感L(K2)。By reducing the difference between the path length of current I1 and the path length of current I2, the portion of the magnetic field that does not offset is reduced. As a result, it is easy to reduce the inductance L (K1) of the first accessory K1 and the inductance L (K2) of the second accessory K2.
參照圖4,第一探針P1包括:大致筒狀的筒部Pb;大致棒狀的接觸件Pa,***筒部Pb中,前端部自筒部Pb及第一導體塊B1向-Z方向突出;以及盤簧Pc,收容於筒部Pb內,將接觸件Pa推向-Z方向。接觸件Pa的前端部例如可為瓶蓋狀、圓錐狀等各種形狀。Referring to FIG. 4 , the first probe P1 includes: a substantially cylindrical barrel part Pb; a substantially rod-shaped contact piece Pa inserted into the barrel part Pb, with a front end protruding from the barrel part Pb and the first conductor block B1 in the -Z direction. ; And the coil spring Pc is contained in the cylinder part Pb and pushes the contact piece Pa to the -Z direction. The front end portion of the contact Pa can have various shapes such as bottle cap shape and conical shape.
第二探針P2以與第一探針P1同樣的方式構成,因此省略其說明。第一探針P1中的接觸件Pa的前端部與檢查對象物的第一端子T1接觸。第二探針P2中的接觸件Pa的前端部與檢查對象物的第二端子T2接觸。作為第一探針P1及第二探針P2,亦可使用被稱為所謂彈簧針的接觸端子。The second probe P2 is configured in the same manner as the first probe P1, and therefore its description is omitted. The front end portion of the contact piece Pa in the first probe P1 is in contact with the first terminal T1 of the object to be inspected. The front end portion of the contact piece Pa in the second probe P2 is in contact with the second terminal T2 of the inspection target object. As the first probe P1 and the second probe P2, contact terminals called so-called spring pins may be used.
再者,第一探針P1及第二探針P2未必包括接觸件Pa、筒部Pb、及盤簧Pc,例如亦可由單一的接觸件所構成。而且,第一探針P1及第二探針P2並不限於直接與第一導體塊B1及第二導體塊B2接觸的例子。第一探針P1及第二探針P2亦可在與第一導體塊B1及第二導體塊B2之間介置導電性的其他構件,而間接地與第一導體塊B1及第二導體塊B2導通連接。Furthermore, the first probe P1 and the second probe P2 do not necessarily include the contact piece Pa, the barrel portion Pb, and the coil spring Pc. For example, they may also be composed of a single contact piece. Furthermore, the first probe P1 and the second probe P2 are not limited to the example of directly contacting the first conductor block B1 and the second conductor block B2. The first probe P1 and the second probe P2 may also be indirectly connected to the first conductor block B1 and the second conductor block B2 by interposing other conductive components. B2 conductive connection.
根據以上結構,可降低自檢查對象物的第一端子T1經由第一探針P1、第一配件K1、第一導體圖案81、連接板M1、第一導體71、連接器CN1、連接器CN2、及第一導體板61而至電源部4的電流路徑的電感。而且,可降低自檢查對象物的第二端子T2經由第二探針P2、第二配件K2、第二導體圖案82、連接板M2、第二導體72、連接器CN1、連接器CN2、及第二導體板62而至電源部4的電流路徑的電感。According to the above structure, it is possible to lower the first terminal T1 of the self-inspection object via the first probe P1, the first fitting K1, the
檢查治具3可更包括一個或多個檢查探針KP。The
如圖6所示,檢查對象物DUT例如可設為將絕緣閘雙極性電晶體(Insulated Gate Bipolar Transistor,IGBT)Q1、IGBT Q2串聯連接而成的IGBT模組。再者,檢查對象物DUT並不限於IGBT模組,亦可為成為電性檢查的對象的各種設備等。As shown in FIG. 6 , the inspection target DUT may be, for example, an IGBT module in which insulated gate bipolar transistors (IGBT) Q1 and IGBT Q2 are connected in series. Furthermore, the inspection target DUT is not limited to the IGBT module, but may also be various equipment that is the target of electrical inspection.
檢查對象物DUT至少包括第一端子T1及第二端子T2。在圖6所示的例子中,第一端子T1及第二端子T2成為檢查對象物DUT的電源端子。檢查對象物DUT除了第一端子T1及第二端子T2以外亦包括連接端子T3、連接端子T4、連接端子T5。The inspection target DUT includes at least a first terminal T1 and a second terminal T2. In the example shown in FIG. 6 , the first terminal T1 and the second terminal T2 become the power terminals of the inspection target DUT. In addition to the first terminal T1 and the second terminal T2, the inspection target DUT also includes a connection terminal T3, a connection terminal T4, and a connection terminal T5.
較佳為與電源部4並聯連接用以使電源電壓變得穩定的大電容的電容CP。電容CP在將電源部4接近配置於第一導體板61及第二導體板62的情況下可內置於電源部4中,亦可在電源部4的外部設置於第一導體板61及第二導體板62的附近。It is preferable that a capacitor CP having a large capacitance for stabilizing the power supply voltage is connected in parallel with the
可在中繼基板8並聯連接一個或多個緩衝電路SB。緩衝電路SB包括電容C及電阻R的串聯電路。緩衝電路SB的一端連接於第一導體圖案81,另一端連接於第二導體圖案82。緩衝電路SB例如可經由開關元件SW而連接於第一導體圖案81或第二導體圖案82,亦可藉由開關元件SW的接通斷開而使緩衝電路SB的並聯數量可變。One or more buffer circuits SB can be connected in parallel to the
在圖6中,為了方便記載,而記載為在電感L(81)與電感L(M1)之間、及電感L(82)與電感L(M2)之間連接緩衝電路SB,但實際上成為分散連接於電感L(81)、電感L(82)的中間部分的等效電路。In FIG. 6 , for convenience of description, it is described that the snubber circuit SB is connected between the inductor L ( 81 ) and the inductor L ( M1 ) and between the inductor L ( 82 ) and the inductor L ( M2 ). However, in fact, it is An equivalent circuit that is distributed and connected to the middle part of the inductor L (81) and the inductor L (82).
電源部4的+極經由電感L(61)、電感L(71)、電感L(M1)、電感L(81)、電感L(K1)、電感L(B1)、及電感L(P1)而連接於檢查對象物DUT的第一端子T1。The + pole of the
電源部4的-極經由電感L(62)、電感L(72)、電感L(M2)、電感L(82)、電感L(K2)、電感L(B2)、及電感L(P2)而連接於檢查對象物DUT的第二端子T2。The - pole of the
例如檢查探針KP分別與第一端子T1、第二端子T2、及連接端子T3、連接端子T4、連接端子T5接觸。並且,各檢查探針KP中的任一者藉由省略圖示的訊號配線連接於數位示波器51,各檢查探針KP中的任一者藉由省略圖示的訊號配線連接於數位萬用錶52。For example, the inspection probe KP is in contact with the first terminal T1, the second terminal T2, and the connection terminal T3, the connection terminal T4, and the connection terminal T5 respectively. In addition, any one of the inspection probes KP is connected to the digital oscilloscope 51 through a signal wiring (not shown), and any one of the inspection probes KP is connected to the digital multimeter 52 through a signal wiring (not shown).
並且,例如基於藉由經由檢查探針KP而自省略圖示的訊號產生裝置向連接端子T3、連接端子T4供給控制訊號而接通、斷開IGBT Q1、IGBT Q2時的數位示波器51或數位萬用錶52的測定結果,利用檢查部53進行檢查對象物DUT的檢查。Furthermore, for example, the digital oscilloscope 51 or the digital multimeter when the IGBT Q1 and the IGBT Q2 are turned on and off by supplying a control signal to the connection terminal T3 and the connection terminal T4 from a signal generating device (not shown) via the inspection probe KP. 52, the inspection unit 53 is used to inspect the inspection target DUT.
在所述情況下,可自檢查探針KP觀察到經由檢查對象物DUT而至電源部4的配線路徑的電感L(61)、電感L(71)、電感L(M1)、電感L(81)、電感L(K1)、電感L(B1)、及電感L(P1)、電感L(62)、電感L(72)、電感L(M2)、電感L(82)、電感L(K2)、電感L(B2)、及電感L(P2)。In this case, the inductance L ( 61 ), the inductance L ( 71 ), the inductance L ( M1 ), and the inductance L ( 81 ) of the wiring path to the
因此,該些配線路徑的電感會對數位示波器51及數位萬用錶52的測定結果造成影響。其結果為,有利用檢查部53的檢查對象物DUT的檢查精度降低之虞。Therefore, the inductance of these wiring paths will affect the measurement results of the digital oscilloscope 51 and the digital multimeter 52 . As a result, the inspection accuracy of the inspection target DUT by the inspection unit 53 may decrease.
然而,藉由所述檢查裝置1的結構,電感L(61)、電感L(71)、電感L(M1)、電感L(81)、電感L(K1)、電感L(B1)、及電感L(P1)、電感L(62)、電感L(72)、電感L(M2)、電感L(82)、電感L(K2)、電感L(B2)、及電感L(P2)分別降低,結果為容易降低該些配線路徑的電感。其結果為,容易降低檢查對象物DUT的檢查精度降低的擔憂。However, with the structure of the inspection device 1, the inductor L (61), the inductor L (71), the inductor L (M1), the inductor L (81), the inductor L (K1), the inductor L (B1), and the inductor L (P1), inductor L (62), inductor L (72), inductor L (M2), inductor L (82), inductor L (K2), inductor L (B2), and inductor L (P2) are reduced respectively, As a result, it is easy to reduce the inductance of these wiring paths. As a result, it is easy to reduce the concern that the inspection accuracy of the inspection target DUT is reduced.
再者,檢查裝置1亦可不包括檢查治具3。而且,檢查裝置1可不包括連接器CN1、連接器CN2,而將檢查裝置本體2與檢查治具3一體連結。而且,線纜7並不限於柔性線纜,可為各種配線構件。Furthermore, the inspection device 1 may not include the
而且,可為如下結構:檢查治具3不包括第一導體塊B1及第二導體塊B2,第一探針P1及第二探針P2連接於第一配件K1及第二配件K2、第一導體圖案81及第二導體圖案82、或第一導體71及第二導體72。Moreover, the following structure may be adopted: the
而且,可為如下結構:檢查治具3不包括第一配件K1及第二配件K2,第一導體塊B1及第二導體塊B2連接於第一導體圖案81及第二導體圖案82、或第一導體71及第二導體72。Furthermore, the
而且,可為如下結構:檢查治具3不包括中繼基板8,第一配件K1及第二配件K2連接於第一導體71及第二導體72。Furthermore, the
再者,本技術可採用如以下的結構。Furthermore, this technology can adopt the following structure.
(1)一種檢查治具,其包括:第一探針,用以與檢查對象物的第一端子接觸;第二探針,用以與所述檢查對象物的第二端子接觸;以及線纜,包括用以向所述第一探針供給電流的平面狀的第一導體與用以向所述第二探針供給電流的平面狀的第二導體,所述第一導體與所述第二導體之間隔著絕緣物而彼此相向配置,以自所述相向的方向觀察時所述第一導體與所述第二導體的重疊成為最大的方式,配置所述第一導體與所述第二導體。(1) An inspection jig, which includes: a first probe for contacting the first terminal of the inspection object; a second probe for contacting the second terminal of the inspection object; and a cable , including a planar first conductor for supplying current to the first probe and a planar second conductor for supplying current to the second probe, the first conductor and the second The conductors are arranged facing each other with an insulator interposed therebetween, and the first conductor and the second conductor are arranged so that the overlap of the first conductor and the second conductor becomes maximum when viewed from the facing direction. .
根據該結構,藉由將第一導體與第二導體以重疊成為最大的方式相向配置,彼此的磁通相抵。其結果為,容易降低用以進行電性檢查的配線路徑所產生的電感。According to this structure, by arranging the first conductor and the second conductor to face each other so as to maximize overlap, magnetic fluxes of each other cancel each other out. As a result, it is easy to reduce the inductance generated in the wiring path used for electrical inspection.
(2)一種檢查治具,更包括:第一探針,用以與檢查對象物的第一端子接觸;第二探針,用以與所述檢查對象物的第二端子接觸;中繼基板,在其中一面形成有第一導體圖案,在另一面與所述第一導體圖案相向形成有第二導體圖案;大致板狀的第一配件,與所述第一導體圖案面接觸;以及大致板狀的第二配件,與所述第二導體圖案面接觸,且與所述第一配件相向配置,所述第一探針經由所述第一配件而連接於所述第一導體圖案,所述第二探針經由所述第二配件而連接於所述第二導體圖案。(2) An inspection jig, further comprising: a first probe for contacting the first terminal of the inspection object; a second probe for contacting the second terminal of the inspection object; a relay substrate , a first conductor pattern is formed on one side, and a second conductor pattern is formed on the other side opposite to the first conductor pattern; a generally plate-shaped first accessory is in surface contact with the first conductor pattern; and a generally plate-shaped first accessory is in surface contact with the first conductor pattern; A second fitting in the shape of a shape is in surface contact with the second conductor pattern and is arranged opposite to the first fitting. The first probe is connected to the first conductor pattern through the first fitting, and the first probe is connected to the first conductor pattern through the first fitting. The second probe is connected to the second conductor pattern via the second accessory.
根據該結構,藉由將第一導體圖案與第二導體圖案相向配置,將第一配件與第二配件相向配置,彼此的磁通相抵。其結果為,容易降低作為用以進行電性檢查的配線路徑的中繼基板、第一配件、及第二配件所產生的電感。According to this structure, by arranging the first conductor pattern and the second conductor pattern to face each other, and arranging the first fitting and the second fitting to face each other, mutual magnetic fluxes cancel each other. As a result, it is easy to reduce the inductance generated by the relay substrate, the first component, and the second component as wiring paths for electrical inspection.
(3)如(2)所記載的檢查治具,其中以所述第一配件與所述第一導體圖案面接觸的部位和所述第二配件與所述第二導體圖案面接觸的部位自所述中繼基板的厚度方向觀察時重疊的方式,將所述第一配件及第二配件連接於所述中繼基板的表背。(3) The inspection jig according to (2), wherein the portion where the first fitting is in surface contact with the first conductor pattern and the portion where the second fitting is in surface contact with the second conductor pattern are separated from each other. The first fitting and the second fitting are connected to the front and back of the relay substrate in such a way that they overlap when viewed in the thickness direction of the relay substrate.
根據該結構,由於將第一配件及第二配件以在中繼基板的表背處重疊的方式配置,故而電流所流通的路徑在中繼基板的表背處容易一致。其結果為,磁通容易相抵。因此,容易降低作為用以進行電性檢查的配線路徑的第一配件及第二配件所產生的電感。According to this structure, since the first fitting and the second fitting are arranged to overlap on the front and back of the relay substrate, the paths through which the current flows are easily aligned on the front and back of the relay substrate. As a result, the magnetic fluxes tend to cancel each other out. Therefore, it is easy to reduce the inductance generated by the first fitting and the second fitting as wiring paths for electrical inspection.
(4)如(2)或(3)所記載的檢查治具,更包括:大致長方體狀的第一導體塊,埋設有所述第一探針;以及大致長方體狀的第二導體塊,埋設有所述第二探針,且與所述第一導體塊相向配置,沿著所述第一探針的軸方向的所述第一導體塊的長度長於與所述第一探針的軸方向正交的方向的所述第一導體塊的長度,沿著所述第二探針的軸方向的所述第二導體塊的長度長於與所述第二探針的軸方向正交的方向的所述第二導體塊的長度,所述第一導體塊經由所述第一配件而連接於所述第一導體圖案,所述第二導體塊經由所述第二配件而連接於所述第二導體圖案。(4) The inspection jig as described in (2) or (3) further includes: a substantially rectangular parallelepiped-shaped first conductor block in which the first probe is embedded; and a substantially rectangular parallelepiped-shaped second conductor block in which the first probe is embedded. The second probe is arranged facing the first conductor block, and the length of the first conductor block along the axial direction of the first probe is longer than the length of the first conductor block along the axial direction of the first probe. The length of the first conductor block in the orthogonal direction and the length of the second conductor block in the axial direction of the second probe are longer than the length in the direction orthogonal to the axial direction of the second probe. The length of the second conductor block, the first conductor block is connected to the first conductor pattern via the first fitting, and the second conductor block is connected to the second conductor pattern via the second fitting. conductor pattern.
根據該結構,容易增大第一探針與第一導體塊的接觸面積、及第二探針與第二導體塊的接觸面積。其結果為,容易降低第一探針與第一導體塊之間的電阻、及第二探針與第二導體塊之間的電阻。According to this structure, it is easy to increase the contact area between the first probe and the first conductor block and the contact area between the second probe and the second conductor block. As a result, the resistance between the first probe and the first conductor block and the resistance between the second probe and the second conductor block can be easily reduced.
(5)如(1)所記載的檢查治具,更包括:大致長方體狀的第一導體塊,埋設有所述第一探針;以及大致長方體狀的第二導體塊,埋設有所述第二探針,且與所述第一導體塊相向配置,沿著所述第一探針的軸方向的所述第一導體塊的長度長於與所述第一探針的軸方向正交的方向的所述第一導體塊的長度,沿著所述第二探針的軸方向的所述第二導體塊的長度長於與所述第二探針的軸方向正交的方向的所述第二導體塊的長度,所述第一探針經由所述第一導體塊而與所述第一導體導通,所述第二探針經由所述第二導體塊而與所述第二導體導通。(5) The inspection jig as described in (1), further comprising: a substantially rectangular parallelepiped-shaped first conductor block in which the first probe is embedded; and a substantially rectangular parallelepiped-shaped second conductor block in which the first probe is embedded. Two probes are arranged facing the first conductor block, and the length of the first conductor block along the axial direction of the first probe is longer than the direction orthogonal to the axial direction of the first probe. The length of the first conductor block, the length of the second conductor block along the axial direction of the second probe is longer than the length of the second conductor block in the direction orthogonal to the axial direction of the second probe. The length of the conductor block, the first probe is connected to the first conductor via the first conductor block, and the second probe is connected to the second conductor via the second conductor block.
根據該結構,容易增大第一探針與第一導體塊的接觸面積、及第二探針與第二導體塊的接觸面積。其結果為,容易降低第一探針與第一導體塊之間的電阻、及第二探針與第二導體塊之間的電阻。According to this structure, it is easy to increase the contact area between the first probe and the first conductor block and the contact area between the second probe and the second conductor block. As a result, the resistance between the first probe and the first conductor block and the resistance between the second probe and the second conductor block can be easily reduced.
(6)如(1)或(5)所記載的檢查治具,其中所述線纜為柔性線纜。(6) The inspection fixture as described in (1) or (5), wherein the cable is a flexible cable.
根據該結構,能夠使線纜柔軟地彎曲,因此容易提高第一探針及第二探針的配置的自由度。According to this structure, the cable can be bent flexibly, so the degree of freedom in arranging the first probe and the second probe is easily increased.
(7)一種檢查裝置,其包括:如(1)~(6)中任一項所記載的檢查治具;大致板狀的第一導體板,連接於所述第一導體;大致板狀的第二導體板,連接於所述第二導體,之間隔著絕緣物而與所述第一導體板相向配置;電源部,經由所述第一導體板及所述第二導體板而向所述第一導體及所述第二導體供給電流;以及檢查部,藉由自所述檢查對象物測定電壓及電流的至少一者,而進行所述檢查對象物的檢查。(7) An inspection device comprising: the inspection jig according to any one of (1) to (6); a substantially plate-shaped first conductor plate connected to the first conductor; a substantially plate-shaped A second conductor plate is connected to the second conductor and is disposed opposite to the first conductor plate with an insulator in between; a power supply unit is connected to the first conductor plate and the second conductor plate to the second conductor plate. The first conductor and the second conductor supply current; and the inspection unit performs inspection of the inspection object by measuring at least one of voltage and current from the inspection object.
根據該結構,藉由檢查治具降低電感,結果為容易提高檢查精度。According to this structure, the inductance is reduced by the inspection jig, and as a result, inspection accuracy can be easily improved.
(8)如(7)所記載的檢查裝置,更包括連接器,所述連接器將所述第一導體及所述第二導體與所述第一導體板及所述第二導體板連接。(8) The inspection device according to (7), further comprising a connector connecting the first conductor and the second conductor to the first conductor plate and the second conductor plate.
根據該結構,可藉由連接器裝卸第一導體及第二導體、以及第一導體板及第二導體板。其結果為,容易裝卸檢查治具。According to this structure, the first conductor and the second conductor, and the first conductor plate and the second conductor plate can be attached and detached through the connector. As a result, the inspection jig can be easily attached and detached.
(9)一種檢查裝置,其包括:連接器,能夠連接於用以與檢查對象物的第一端子接觸的第一探針及用以與所述檢查對象物的第二端子接觸的第二探針;大致板狀的第一導體板,連接於所述連接器;大致板狀的第二導體板,連接於所述連接器,之間隔著絕緣物而與所述第一導體板相向配置;電源部,經由所述第一導體板及所述第二導體板而向所述連接器供給電流;以及檢查部,藉由自所述檢查對象物測定電壓及電流的至少一者,而進行所述檢查對象物的檢查。(9) An inspection device including a connector connectable to a first probe for contacting a first terminal of an inspection object and a second probe for contacting a second terminal of the inspection object. a needle; a substantially plate-shaped first conductor plate connected to the connector; a substantially plate-shaped second conductor plate connected to the connector and arranged to face the first conductor plate with an insulator between; a power supply unit that supplies current to the connector via the first conductor plate and the second conductor plate; and an inspection unit that performs the above steps by measuring at least one of voltage and current from the inspection target object. Describes the inspection of inspection objects.
根據該結構,藉由將第一導體板與第二導體板相向配置,彼此的磁通相抵。其結果為,第一導體板及第二導體板的電感降低,容易提高檢查精度。According to this structure, by arranging the first conductor plate and the second conductor plate to face each other, magnetic fluxes of each other are offset. As a result, the inductances of the first conductor plate and the second conductor plate are reduced, making it easier to improve inspection accuracy.
1:檢查裝置 2:檢查裝置本體 3:檢查治具 4:電源部 7:線纜 8:中繼基板 21:框架 22:側面面板 31:底板 31h、32h:開口部 32:壁板 33:三角托架 41:+端子 42:-端子 51:數位示波器 52:數位萬用錶 53:檢查部 61:第一導體板 62:第二導體板 63、73:絕緣物 71:第一導體 72:第二導體 74:包層 81:第一導體圖案 81A、81B、82A、82B、85、85a、85b、A1A、A1B、A1C、A1D、B1A、B1B、B1C:導體圖案 82:第二導體圖案 83:基材 84:突出部 84a、84b:焊墊部 A1~A6、B1~B6:區域 B1:第一導體塊 B1a、B2a:側面 B1b、B2b:槽 B2:第二導體塊 C、C1~C6、CP:電容 CN1、CN2:連接器 DUT:檢查對象物 H、W:長度 I1、I2:電流 K1:第一配件 K1a、K2a:基部 K1b、K2b:臂部 K2:第二配件 KP:檢查探針 L:電感 M1、M2:連接板 P1:第一探針 P2:第二探針 Pa:接觸件 Pb:筒部 Pc:盤簧 Q1、Q2:IGBT R、R1~R6:電阻 SB:緩衝電路 SP:間隔 SW、SW1~SW6:開關元件 T1:第一端子 T2:第二端子 T3、T4、T5:連接端子 t8:厚度 +X、+Y、+Z、-X、-Y、-Z:側 II-II、IV-IV:線 1: Check the device 2: Check the device body 3: Check the fixture 4:Power supply department 7: Cable 8:Relay substrate 21:Frame 22:Side panel 31: Bottom plate 31h, 32h: opening 32:Siding 33:Triangle bracket 41:+ terminal 42:-Terminal 51:Digital oscilloscope 52:Digital multimeter 53:Inspection Department 61:First conductor plate 62:Second conductor plate 63, 73: Insulation 71:First conductor 72:Second conductor 74: Cladding 81: First conductor pattern 81A, 81B, 82A, 82B, 85, 85a, 85b, A1A, A1B, A1C, A1D, B1A, B1B, B1C: conductor pattern 82: Second conductor pattern 83:Substrate 84:Protrusion 84a, 84b: soldering pad part A1~A6, B1~B6: area B1: First conductor block B1a, B2a: side B1b, B2b: slot B2: Second conductor block C, C1~C6, CP: capacitor CN1, CN2: Connector DUT: Inspection object H, W: length I1, I2: current K1: The first accessory K1a, K2a: base K1b, K2b: arm K2: Second accessory KP: Check probe L: inductance M1, M2: connecting board P1: first probe P2: Second probe Pa: contact piece Pb:tube Pc:coil spring Q1, Q2: IGBT R, R1~R6: Resistor SB: buffer circuit SP:interval SW, SW1~SW6: switching elements T1: first terminal T2: Second terminal T3, T4, T5: connection terminals t8:Thickness +X, +Y, +Z, -X, -Y, -Z: side II-II, IV-IV: line
圖1是表示本發明的一實施方式的包括檢查治具3的檢查裝置1的結構的一例的概念性的立體圖。
圖2是圖1的II-II線截面圖。
圖3是表示中繼基板8的下端部周邊的部分說明圖。
圖4是第一導體塊B1及第二導體塊B2的IV-IV線截面圖。
圖5是用以對在第一配件K1中流通的電流I1與在第二配件K2中流通的電流I2的路徑長度進行說明的概念性的說明圖。
圖6是表示檢查裝置1的等效電路的一例的說明圖。
圖7是第一導體板61及第二導體板62的平面圖。
圖8是線纜7的平面圖。
圖9是從-Y側觀察中繼基板8的印刷配線板(printed wiring board,PWB)的平面圖。
圖10是從+Y側觀察中繼基板8的PWB的平面圖。
FIG. 1 is a conceptual perspective view showing an example of the structure of an inspection device 1 including an
2:檢查裝置本體 2: Check the device body
3:檢查治具 3: Check the fixture
4:電源部 4:Power supply department
7:線纜 7: Cable
8:中繼基板 8:Relay substrate
22:側面面板 22:Side panel
31:底板 31: Bottom plate
31h、32h:開口部 31h, 32h: opening
32:壁板 32:Siding
61:第一導體板 61:First conductor plate
62:第二導體板 62:Second conductor plate
63、73:絕緣物 63, 73: Insulation
71:第一導體 71:First conductor
72:第二導體 72:Second conductor
81:第一導體圖案 81: First conductor pattern
82:第二導體圖案 82: Second conductor pattern
83:基材 83:Substrate
84:突出部 84:Protrusion
B1:第一導體塊 B1: First conductor block
CN1、CN2:連接器 CN1, CN2: Connector
K1:第一配件 K1: The first accessory
KP:檢查探針 KP: Check probe
M1、M2:連接板 M1, M2: connecting board
P1:第一探針 P1: first probe
+Y、+Z、-Y、-Z:側 +Y, +Z, -Y, -Z: side
Claims (9)
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TW112123570A TW202407350A (en) | 2022-06-28 | 2023-06-26 | Inspection jig and inspection device |
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TW (1) | TW202407350A (en) |
WO (1) | WO2024004988A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5875490U (en) * | 1981-11-13 | 1983-05-21 | 株式会社明電舎 | GTO protection circuit |
JP2001099889A (en) * | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | Inspection equipment for high frequency circuit |
JP2005049163A (en) * | 2003-07-31 | 2005-02-24 | Yokowo Co Ltd | Test jig and probe for test apparatus of device for high frequency and high speed |
JP5413349B2 (en) * | 2010-09-30 | 2014-02-12 | 富士電機株式会社 | Semiconductor test equipment and semiconductor test circuit connection equipment |
CN102012440B (en) * | 2010-11-11 | 2014-04-09 | 嘉兴斯达微电子有限公司 | Optimally-designed test fixture for power module |
JP6482438B2 (en) * | 2015-09-09 | 2019-03-13 | 高周波熱錬株式会社 | Induction heating power supply |
CN106802386B (en) * | 2017-02-27 | 2023-04-25 | 扬州国扬电子有限公司 | Low-sensitivity test equipment with laminated busbar |
DE102019102457B3 (en) * | 2019-01-31 | 2020-07-09 | Infineon Technologies Ag | TEST DEVICE WITH BUSBAR MECHANISM FOR TESTING A DEVICE TO BE TESTED |
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