TW202407278A

TW202407278A - Water cooling device for cooling double heat sources

Info

Publication number: TW202407278A
Application number: TW111129960A
Authority: TW
Inventors: 馬迅嘉; 莊子賢
Original assignee: 十銓科技股份有限公司
Priority date: 2022-08-10
Filing date: 2022-08-10
Publication date: 2024-02-16
Also published as: CN117631786A; CN218004070U

Abstract

The utility model provides a water cooling device for cooling double heat sources, which is characterized in that a heat dissipation fin tube of a heat dissipation assembly is communicated with a first circulating pump, the first circulating pump is communicated with a first heat exchange assembly through a first pipeline, and the first heat exchange assembly correspondingly abuts against and cools a first heat source. The first heat exchange assembly is communicated with a second heat exchange assembly through a second pipeline, the first heat exchange assembly correspondingly abuts against and cools a second heat source, the second heat exchange assembly is communicated with the first circulating pump through a third pipeline, and fluid circulating in the water cooling device used for cooling the double heat sources is cooled through the heat dissipation fin pipe. The device cools two heat sources at the same time, and the occupied space of the device is further reduced.

Description

用於冷卻雙熱源之水冷裝置Water cooling device for cooling dual heat sources

本發明是關於一種用於冷卻雙熱源之水冷裝置，尤其係指一種可於電子元件上快速拆裝之散熱結構。The present invention relates to a water cooling device for cooling dual heat sources, and in particular, to a heat dissipation structure that can be quickly disassembled and assembled on electronic components.

隨著科技的發展，現今電腦硬體已朝向高速、高頻的方向發展，藉以提升電腦的運作效率，電腦硬體長時間在高速、高頻的環境下運作，相對的會產生高溫。記憶體為了配合處理器高速度的運算，相對的電子元件的工作溫度也越來越高，持續上升的溫度勢必影響電子元件的效能，甚至會導致記憶體損毀。With the development of science and technology, computer hardware has been developing towards high speed and high frequency to improve the operating efficiency of computers. When computer hardware operates in a high speed and high frequency environment for a long time, it will generate relatively high temperatures. In order to cope with the high-speed operation of the processor, the working temperature of the corresponding electronic components of the memory is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the electronic components and even cause the memory to be damaged.

由於電競風氣興盛以及不少電腦被改裝的流行趨勢，許多的電競電腦的使用者或廠商會將電競電腦的機殼改換為可透視的機殼，而此一改裝風氣亦逐漸地盛行，電競電腦的內部零組件，例如：CPU、顯示卡、記憶體，會較一般個人電腦具較佳之效能，因而相對性產生較多的熱能。Due to the rise of e-sports and the popular trend of many computers being modified, many e-sports computer users or manufacturers will replace the cases of e-sports computers with see-through cases, and this modification trend has gradually become popular. , the internal components of e-sports computers, such as CPU, graphics card, and memory, will have better performance than ordinary personal computers, thus generating relatively more heat energy.

習知發熱之電子元件，例如：CPU、顯示卡、記憶體，設置於電路板並以連接介面插設至電腦系統。因前述電競產品的需求，相關電子元件之工作頻率逐漸往高頻化發展，使電子元件有更高的資料傳輸速率及更高的電量消耗，導致電子元件更容易積熱；當電子元件的工作溫度越來越高，超過容許的溫度值時，電子元件的效能會明顯降低，同時也增加了模組保持資料或運算的錯誤率，導致電腦系統不穩定，由於過多的熱能會降低電子元件的效能，因此人們會在這些電子元件安裝散熱器。It is known that electronic components that generate heat, such as CPUs, graphics cards, and memories, are installed on circuit boards and plugged into computer systems through connection interfaces. Due to the aforementioned demand for e-sports products, the operating frequencies of related electronic components are gradually developing towards higher frequencies, resulting in higher data transmission rates and higher power consumption of electronic components, which makes electronic components more likely to accumulate heat; when electronic components The operating temperature is getting higher and higher. When it exceeds the allowable temperature value, the performance of electronic components will be significantly reduced. It also increases the error rate of the module to retain data or perform calculations, causing the computer system to become unstable. Excessive heat energy will degrade the electronic components. performance, so people will install heat sinks on these electronic components.

接續上述，為求更快速之散熱，產業界逐漸推出水冷式散熱裝置，以克服電子元件的工作溫度越來越高之問題，但，又由於機殼(容置需散熱裝置之外殼)體積縮小之情況下，散熱設備多被要求進一步縮小體積，使設備可以在最有限的空間下，仍能進行長時間不停機的高速資料處理及運算，然而水冷式散熱裝置係一個散熱器對應一個發熱之電子元件，若需散熱多個電子元件，須佔用多個空間，且多個散熱器將消耗更多能源，於機殼體積縮小之趨勢下，產業界紛紛急需一種可用於冷卻超過一個熱源之水冷裝置。Continuing from the above, in order to achieve faster heat dissipation, the industry has gradually introduced water-cooled heat dissipation devices to overcome the problem of increasingly high operating temperatures of electronic components. However, due to the shrinkage of the chassis (the casing that houses the device that needs heat dissipation) Under such circumstances, heat dissipation equipment is often required to further reduce the size so that the equipment can still perform high-speed data processing and calculations without downtime for a long time in the most limited space. However, water-cooled heat dissipation devices correspond to one radiator and one heat sink. If electronic components need to dissipate multiple electronic components, they must occupy multiple spaces, and multiple radiators will consume more energy. With the trend of shrinking the size of the chassis, the industry is in urgent need of a water cooling that can be used to cool more than one heat source. device.

有鑑於上述習知技術之問題，本發明提供一種用於冷卻雙熱源之水冷裝置，其係以二個熱交換組件個別對應冷卻二個熱源，並以一散熱組件對應將流經二個熱交換組件之流體之熱排出，利用此裝置同時冷卻二個熱源，進一步減少裝置之佔用空間。In view of the above-mentioned problems of the prior art, the present invention provides a water cooling device for cooling dual heat sources, which uses two heat exchange components to respectively cool the two heat sources, and uses a heat dissipation component to correspondingly flow through the two heat exchangers. The heat of the fluid in the component is discharged, and this device is used to simultaneously cool two heat sources, further reducing the space occupied by the device.

本發明之一目的在於提供一種用於冷卻雙熱源之水冷裝置，其係以單一散熱組件，連通二個熱交換組件，二個熱交換組件個別對應冷卻二個熱源，利用此裝置同時冷卻二個熱源，進一步減少裝置之佔用空間，且二個熱交換組件互相連通，以其中之一熱交換組件接收流經另一熱交換組件之流體，減少水冷裝置之能源消耗。One object of the present invention is to provide a water cooling device for cooling dual heat sources. It uses a single heat dissipation component to connect two heat exchange components. The two heat exchange components respectively cool two heat sources. This device is used to simultaneously cool two heat sources. The heat source further reduces the space occupied by the device, and the two heat exchange components are connected to each other. One of the heat exchange components receives the fluid flowing through the other heat exchange component, reducing the energy consumption of the water cooling device.

為達到上述所指稱之各目的與功效，本發明提供一種用於冷卻雙熱源之水冷裝置，其用於冷卻一第一熱源以及一第二熱源，該用於冷卻雙熱源之水冷裝置包含，一散熱組件、一第一管路、一第一熱交換組件、一第二管路、一第二熱交換組件以及一第三管路，該散熱組件包含一框架、一散熱鰭管以及一第一循環泵，該散熱鰭管設置於該框架之一內側，該第一循環泵連通該散熱鰭管之二端，該第一管路之一端連通該第一循環泵，該第一熱交換組件包含一第二循環泵以及一第一導熱件，該第二循環泵連通該第一管路之另一端，該第一導熱件設置於該第二循環泵之一下方，該第一導熱件對應抵接於該第一熱源，該第二管路之一端連通該第二循環泵，該第二熱交換組件包含一容置槽以及一第二導熱件，該容置槽連通該第二管路之另一端，該第二導熱件設置於該容置槽之一下方，該第二導熱件對應抵接於該第二熱源，該第三管路之一端連通該容置槽，該第三管路之另一端連通該第一循環泵，其中，一流體設置於該散熱鰭管之一內側，該第一循環泵對應輸送該流體至該第三管路，該流體經過該第三管路後流至該容置槽，該流體經過該容置槽後流至該第二管路，該流體經過該第二管路後流至該第二循環泵，該流體經過該第二循環泵後流至該第一管路，該流體經過該第一管路後流至該第一循環泵以及該散熱鰭管，其中，該第一熱源產生熱能並傳導至該第一導熱件，再由該第一導熱件傳導至該第二循環泵，該第二熱源產生熱能並傳導至該第二導熱件，再由該第二導熱件傳導至該容置槽；利用此結構提供可同時冷卻二個熱源之水冷結構。In order to achieve the above-mentioned purposes and effects, the present invention provides a water-cooling device for cooling dual heat sources, which is used to cool a first heat source and a second heat source. The water-cooling device for cooling dual heat sources includes: a A heat dissipation component, a first pipeline, a first heat exchange component, a second pipeline, a second heat exchange component and a third pipeline. The heat dissipation component includes a frame, a heat dissipation fin tube and a first Circulation pump, the heat dissipation fin tube is arranged on one inside of the frame, the first circulation pump is connected to two ends of the heat dissipation fin tube, one end of the first pipeline is connected to the first circulation pump, the first heat exchange component includes A second circulation pump and a first heat conduction member. The second circulation pump is connected to the other end of the first pipeline. The first heat conduction member is disposed below one of the second circulation pumps. The first heat conduction member corresponds to the Connected to the first heat source, one end of the second pipeline is connected to the second circulation pump. The second heat exchange component includes an accommodating tank and a second heat conductive member. The accommodating tank is connected to the second pipeline. At the other end, the second heat conducting member is disposed below one of the accommodating grooves. The second heat conducting member is in contact with the second heat source. One end of the third pipe is connected to the accommodating groove. The third pipe is connected to the accommodating groove. The other end is connected to the first circulation pump, wherein a fluid is disposed inside one of the heat dissipation fins, and the first circulation pump correspondingly delivers the fluid to the third pipeline, and the fluid flows through the third pipeline. to the holding tank, the fluid flows to the second pipeline after passing through the holding tank, the fluid flows to the second circulation pump after passing through the second pipeline, and the fluid flows to the second circulation pump after passing through the second circulation pump. The first pipeline, the fluid flows to the first circulation pump and the heat dissipation fin tube after passing through the first pipeline, wherein the first heat source generates heat energy and conducts it to the first heat conductive member, and then the first heat conduction member The heat-conducting member conducts heat to the second circulation pump, and the second heat source generates heat and conducts it to the second heat-conducting member, and then conducts it to the accommodating tank from the second heat-conducting member. This structure is used to provide a cooling system that can simultaneously cool two heat sources. Water cooling structure.

本發明之一實施例中，其中該第一熱源係一中央處理器(CPU)。In one embodiment of the present invention, the first heat source is a central processing unit (CPU).

本發明之一實施例中，其中該第二熱源係一固態硬碟(SSD)。In one embodiment of the present invention, the second heat source is a solid state drive (SSD).

本發明之一實施例中，其中該第一循環泵之一側設置一第一進水口以及一第一出水口，該第一進水口連通該散熱鰭管之一端，該第一出水口連通該散熱鰭管之另一端，該流體由該第一進水口進入該散熱鰭管，該流體經過該散熱鰭管後由該第一出水口流至該第一循環泵。In one embodiment of the present invention, a first water inlet and a first water outlet are provided on one side of the first circulation pump, the first water inlet is connected to one end of the heat dissipation fin tube, and the first water outlet is connected to the At the other end of the heat dissipation fin tube, the fluid enters the heat dissipation fin tube from the first water inlet. After passing through the heat dissipation fin tube, the fluid flows from the first water outlet to the first circulation pump.

本發明之一實施例中，其中該第一循環泵之另一側設置一第二進水口以及一第二出水口，該第二進水口連通該第一管路之該端，該第二出水口連通該第三管路之該另一端，該流體經過該第一管路後由該第二進水口進入該第一循環泵，該流體由該第二出水口進入該第三管路。In one embodiment of the present invention, a second water inlet and a second water outlet are provided on the other side of the first circulation pump. The second water inlet is connected to the end of the first pipeline, and the second outlet The water port is connected to the other end of the third pipeline, the fluid enters the first circulation pump through the second water inlet after passing through the first pipeline, and the fluid enters the third pipeline through the second water outlet.

本發明之一實施例中，其中該散熱組件更包含一風扇，該風扇對應該散熱鰭管設置於該框架之一側。In one embodiment of the present invention, the heat dissipation component further includes a fan, and the fan is disposed on one side of the frame corresponding to the heat dissipation fin tube.

本發明之一實施例中，其中一氣體進入該風扇之一側，該氣體進入該風扇後流至該框架之該內側，並經過該散熱鰭管之一外側，該氣體經過該散熱鰭管之該外側後，該氣體流出該框架。In one embodiment of the present invention, a gas enters one side of the fan. After entering the fan, the gas flows to the inside of the frame and passes through one outside of the heat dissipation fin tube. The gas passes through the heat dissipation fin tube. After the outside, the gas flows out of the frame.

本發明之一實施例中，其中該第一管路、該第二管路以及該第三管路個別係一柔性管路。In one embodiment of the present invention, the first pipeline, the second pipeline and the third pipeline are each a flexible pipeline.

本發明之一實施例中，其中該第二熱交換組件更包含一固定架，該固定架設置於該第二導熱件之一下方，且該固定架以及該第二導熱件夾設該第二熱源。In one embodiment of the present invention, the second heat exchange component further includes a fixing bracket, the fixing bracket is disposed below one of the second heat conducting members, and the fixing frame and the second heat conducting member sandwich the second heat conducting member. heat source.

本發明之一實施例中，其中該第一熱源之溫度大於等於該第二熱源之溫度。In an embodiment of the present invention, the temperature of the first heat source is greater than or equal to the temperature of the second heat source.

為使　貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識，謹佐以實施例及配合說明，說明如後：In order to enable the review committee to have a further understanding and understanding of the characteristics and effects achieved by the present invention, we would like to provide examples and accompanying explanations, which are as follows:

有鑑於上述習知技術之問題，本發明係一散熱組件之一第一循環泵以一第一管路連通一第一熱交換組件之一第二循環泵，且該第一熱交換組件對應冷卻一第一熱源，該第一熱交換組件之該第二循環泵以一第二管路連通一第二熱交換組件之一容置槽，該第一熱交換組件對應冷卻一第二熱源，該第二熱交換組件之該容置槽再以一第三管路連通該第一循環泵，並利用該散熱組件之一散熱鰭管冷卻流動於該些元件之一流體，以此裝置解決習知技術若需散熱多個電子元件，須佔用多個空間之問題。In view of the above-mentioned problems of the prior art, the present invention is a first circulation pump of a heat dissipation component connected to a second circulation pump of a first heat exchange component through a first pipeline, and the first heat exchange component corresponds to the cooling A first heat source, the second circulation pump of the first heat exchange component is connected to a receiving tank of a second heat exchange component through a second pipeline, the first heat exchange component correspondingly cools a second heat source, the The accommodating tank of the second heat exchange component is connected to the first circulation pump through a third pipeline, and a heat dissipation fin of the heat dissipation component is used to cool the fluid flowing in the components. This device solves the conventional problem The problem with technology is that if multiple electronic components need to be dissipated, multiple spaces must be occupied.

請參閱第1圖，其為本發明之一實施例之結構***示意圖，如圖所示，本實施例係一種用於冷卻雙熱源之水冷裝置1，其用於冷卻一第一熱源2以及一第二熱源3，該用於冷卻雙熱源之水冷裝置1包含一散熱組件10、一第一管路20、一第一熱交換組件30、一第二管路40、一第二熱交換組件50以及一第三管路60。Please refer to Figure 1, which is an exploded schematic diagram of the structure of one embodiment of the present invention. As shown in the figure, this embodiment is a water cooling device 1 for cooling dual heat sources, which is used to cool a first heat source 2 and a first heat source. The second heat source 3. The water cooling device 1 for cooling dual heat sources includes a heat dissipation component 10, a first pipeline 20, a first heat exchange component 30, a second pipeline 40, and a second heat exchange component 50. and a third pipeline 60.

再次參閱第1圖，如圖所示，於本實施例中，該散熱組件10包含一框架12、一散熱鰭管14以及一第一循環泵16，該散熱鰭管14設置於該框架12之一內側，其中該第一循環泵16連通該散熱鰭管14之二端，該第一管路20之一端連通該第一循環泵16，該第一熱交換組件30包含一第二循環泵32以及一第一導熱件34，該第二循環泵32連通該第一管路20之另一端，其中該第一導熱件34設置於該第二循環泵32之一下方，且該第一導熱件34對應抵接於該第一熱源2，於本實施例中，該第一導熱件34係抵接於該第一熱源2之一上方，但不在此限制；該第二管路40之一端連通該第二循環泵32，該第二熱交換組件50包含一容置槽52以及一第二導熱件54，該容置槽52連通該第二管路40之另一端，該第二導熱件54設置於該容置槽52之一下方，其中該第二導熱件54對應抵接於該第二熱源3，於本實施例中，該第二導熱件54係抵接於該第二熱源3之一上方，但不在此限制；該第三管路60之一端連通該容置槽52，該第三管路60之另一端連通該第一循環泵16，於此完成一循環通道。Referring to Figure 1 again, as shown in the figure, in this embodiment, the heat dissipation component 10 includes a frame 12, a heat dissipation fin tube 14 and a first circulation pump 16. The heat dissipation fin tube 14 is disposed on the frame 12 An inner side, where the first circulation pump 16 is connected to both ends of the heat dissipation fin tube 14, one end of the first pipeline 20 is connected to the first circulation pump 16, and the first heat exchange component 30 includes a second circulation pump 32 And a first heat conduction member 34, the second circulation pump 32 is connected to the other end of the first pipeline 20, wherein the first heat conduction member 34 is disposed below one of the second circulation pumps 32, and the first heat conduction member 34 corresponds to the first heat source 2. In this embodiment, the first heat conductive member 34 is in contact with an upper part of the first heat source 2, but is not limited to this; one end of the second pipe 40 is connected to The second circulation pump 32 and the second heat exchange component 50 include an accommodating tank 52 and a second heat conducting member 54. The accommodating tank 52 is connected to the other end of the second pipeline 40. The second heat conducting member 54 Disposed below one of the accommodating grooves 52 , the second heat conducting member 54 is in contact with the second heat source 3 . In this embodiment, the second heat conducting member 54 is in contact with the second heat source 3 . Above, but not limited to this; one end of the third pipeline 60 is connected to the accommodation tank 52, and the other end of the third pipeline 60 is connected to the first circulation pump 16, thereby completing a circulation channel.

接續上述，於本實施例中，該第一熱源2係一中央處理器(CPU)，包含該中央處理器之固定架，利用該第一熱交換組件30與該第一熱源2進行熱交換，以降低該第一熱源2之溫度。Continuing from the above, in this embodiment, the first heat source 2 is a central processing unit (CPU), including a fixing frame of the CPU, and the first heat exchange component 30 is used to perform heat exchange with the first heat source 2. To reduce the temperature of the first heat source 2.

接續上述，於本實施例中，該第二熱源3係一固態硬碟(SSD)，例如PCle SSD，利用該第二熱交換組件50與該第二熱源3進行熱交換，以降低該第二熱源3之溫度。Continuing from the above, in this embodiment, the second heat source 3 is a solid state drive (SSD), such as a PCle SSD. The second heat exchange component 50 is used to perform heat exchange with the second heat source 3 to reduce the second heat source 3. The temperature of heat source 3.

接續上述，於本實施例中，該散熱鰭管14係以一個舉例，但本實施例不在此限制，其也可為複數個散熱鰭管14設置於該框架12內側，進一步提升熱效率。Continuing from the above, in this embodiment, the heat dissipation fin pipe 14 is taken as an example, but this embodiment is not limited thereto. It can also be a plurality of heat dissipation fin pipes 14 disposed inside the frame 12 to further improve thermal efficiency.

接續上述，於本實施例中，該第一管路20、該第二管路40以及該第三管路60個別係一柔性管路，例如使用塑膠、矽膠材料之管體，用以適應不同之機箱環境，使該第一熱交換組件30以及該第二熱交換組件50可以對應抵接不同平面、角度之該第一熱源2以及該第二熱源3。Continuing from the above, in this embodiment, the first pipeline 20 , the second pipeline 40 and the third pipeline 60 are each a flexible pipeline, such as a pipe made of plastic or silicone material, to adapt to different conditions. The chassis environment allows the first heat exchange component 30 and the second heat exchange component 50 to contact the first heat source 2 and the second heat source 3 with different planes and angles.

再次參閱第1圖以及參閱第2A圖至第2B圖，第2A圖至第2B圖為本發明之一實施例之流體流動路徑示意圖，如圖所示，於本實施例中，一流體F設置於該散熱組件10之該散熱鰭管14之一內側，使該流體F流動於該散熱鰭管14之該內側進行降溫，該第一循環泵16對應輸送該流體F至該第三管路60之一內側，該流體F經過該第三管路60後流至該第二熱交換組件50之該容置槽52之一內側，該流體F於該容置槽52之該內側進行內循環，該流體F經過該容置槽52後流至該第二管路40之一內側，該流體F經過該容置槽52後流至該第一熱交換組件30之該第二循環泵32之一內側，該流體F經過該第二循環泵32後流至該第一管路20之一內側，該流體F經過該第一管路20後流至該散熱組件10之該第一循環泵16之一內側，該第一循環泵16再以將該流體F輸送至該散熱鰭管14進行降溫，於此完成一次循環。Refer again to Figure 1 and Figures 2A to 2B. Figures 2A to 2B are schematic diagrams of the fluid flow path of one embodiment of the present invention. As shown in the figure, in this embodiment, a fluid F is provided The fluid F flows inside an inner side of the heat dissipation fin tube 14 of the heat dissipation component 10 to cool down, and the first circulation pump 16 correspondingly delivers the fluid F to the third pipeline 60 The fluid F flows to an inner side of the receiving tank 52 of the second heat exchange component 50 after passing through the third pipeline 60, and the fluid F circulates internally on the inner side of the receiving tank 52, The fluid F flows to an inner side of the second pipe 40 after passing through the accommodating groove 52 . The fluid F flows to one of the second circulation pumps 32 of the first heat exchange assembly 30 after passing through the accommodating groove 52 . Inside, the fluid F flows to the inside of the first pipeline 20 after passing through the second circulation pump 32. The fluid F flows to the first circulation pump 16 of the heat dissipation assembly 10 after passing through the first pipeline 20. On the inner side, the first circulation pump 16 delivers the fluid F to the heat dissipation fin tube 14 for cooling, thereby completing a cycle.

接續上述，於本實施例中，該流體F係冷卻液、水，本實施例不在此限制。Continuing from the above, in this embodiment, the fluid F is cooling liquid or water, which is not limited in this embodiment.

接續上述，於本實施例中，該第一熱源2產生熱能，並傳導至該第一熱交換組件30之該第一導熱件34，再由該第一導熱件34傳導至該第二循環泵32，同時該流體F流動於該第二循環泵32之該內側，並吸收傳導至該第二循環泵32之熱能，進一步降低該第一熱源2之溫度。Continuing from the above, in this embodiment, the first heat source 2 generates heat energy and conducts it to the first heat conduction member 34 of the first heat exchange component 30, and then conducts it to the second circulation pump from the first heat conduction member 34. 32. At the same time, the fluid F flows in the inside of the second circulation pump 32 and absorbs the heat energy transmitted to the second circulation pump 32, further reducing the temperature of the first heat source 2.

接續上述，於本實施例中，該第二熱源3產生熱能，並傳導至該第二熱交換組件50之該第二導熱件54，再由該第二導熱件34傳導至該容置槽52，同時該流體F流動於該容置槽52之該內側，並吸收傳導至該容置槽52之熱能，進一步降低該第二熱源3之溫度。Continuing from the above, in this embodiment, the second heat source 3 generates heat energy and conducts it to the second heat conducting member 54 of the second heat exchange component 50, and then conducts it to the receiving groove 52 from the second heat conducting member 34. , at the same time, the fluid F flows in the inside of the accommodating groove 52 and absorbs the heat energy transmitted to the accommodating groove 52, further reducing the temperature of the second heat source 3.

接續上述，於本實施例中，該第一導熱件34可與該第二循環泵32之殼體一體成形，且該第一導熱件34之材料可使用金屬、矽膠或石墨烯，本實施例不在此限制。Continuing from the above, in this embodiment, the first thermal conductive member 34 can be integrally formed with the housing of the second circulation pump 32, and the material of the first thermal conductive member 34 can be metal, silicone or graphene. In this embodiment Not limited to this.

接續上述，於本實施例中，該第二導熱件54可與該容置槽52之殼體一體成形，且該第二導熱件54之材料可使用金屬、矽膠或石墨烯，本實施例不在此限制。Continuing from the above, in this embodiment, the second thermal conductive member 54 can be integrally formed with the housing of the receiving groove 52 , and the material of the second thermal conductive member 54 can be metal, silicone or graphene. this restriction.

接續上述，於本實施例中，該第一熱源2之溫度大於等於該第二熱源3之溫度，因此該流體F於該散熱組件10之該散熱鰭管14冷卻後，優先輸送至該第二熱交換組件50對應冷卻該第二熱源3，再將流經該第二熱交換組件50之該流體F輸送至該第一熱交換組件50，對應冷卻溫度較高之該第一熱源2，以此冷卻流體之循環，減少能源之消耗。Continuing from the above, in this embodiment, the temperature of the first heat source 2 is greater than or equal to the temperature of the second heat source 3. Therefore, the fluid F is preferentially transported to the second heat source 3 after being cooled by the heat dissipation fins 14 of the heat dissipation component 10. The heat exchange component 50 correspondingly cools the second heat source 3, and then delivers the fluid F flowing through the second heat exchange component 50 to the first heat exchange component 50 to correspondingly cool the first heat source 2 with a higher temperature, so as to This circulation of cooling fluid reduces energy consumption.

接續上述，於本實施例中，該第二熱交換組件50更包含一固定架56，該固定架56設置於該第二導熱件54之一下方，且該固定架56以及該第二導熱件54夾設該第二熱源3，使該第二導熱件54與該第二熱源3更緊密接觸，提升散熱效率，並該防止該第二熱源3鬆脫。Continuing from the above, in this embodiment, the second heat exchange component 50 further includes a fixing bracket 56. The fixing bracket 56 is disposed below one of the second heat conducting parts 54, and the fixing bracket 56 and the second heat conducting part The second heat source 3 is sandwiched by 54 so that the second heat conductive member 54 is in closer contact with the second heat source 3, thereby improving the heat dissipation efficiency and preventing the second heat source 3 from loosening.

再次參閱第1圖至第2B圖，如圖所示，於本實施例中，該第一循環泵16之一側設置一第一進水口161以及一第一出水口162，該第一進水口161連通該散熱鰭管14之一端，該第一出水口162連通該散熱鰭管14之另一端，該流體F由該第一進水口161進入該散熱鰭管，該流體F經過該散熱鰭管14後由該第一出水口162流至該第一循環泵16之該內側。Referring again to Figures 1 to 2B, as shown in the figures, in this embodiment, a first water inlet 161 and a first water outlet 162 are provided on one side of the first circulation pump 16. The first water inlet 161 is connected to one end of the heat dissipation fin tube 14, and the first water outlet 162 is connected to the other end of the heat dissipation fin tube 14. The fluid F enters the heat dissipation fin tube from the first water inlet 161, and the fluid F passes through the heat dissipation fin tube. 14 and then flows from the first water outlet 162 to the inside of the first circulation pump 16 .

接續上述，於本實施例中，該第一循環泵16之另一側設置一第二進水口163以及一第二出水口164，該第二進水口163連通該第一管路20之該端，該第二出水164口連通該第三管路60之該另一端，該流體F經過該第一管路20後由該第二進水口163進入該第一循環泵16，該流體F由該第二出水口164進入該第三管路60。Continuing from the above, in this embodiment, a second water inlet 163 and a second water outlet 164 are provided on the other side of the first circulation pump 16 , and the second water inlet 163 is connected to the end of the first pipeline 20 , the second water outlet 164 is connected to the other end of the third pipeline 60, the fluid F enters the first circulation pump 16 from the second water inlet 163 after passing through the first pipeline 20, and the fluid F flows from the The second water outlet 164 enters the third pipeline 60 .

請參閱第3圖，其為本發明之一實施例之風扇結構及其作動示意圖，如圖所示，本實施例係基於上述實施例，該散熱組件10更包含一風扇18，該風扇18對應該散熱鰭管14設置於該框架12之一側，於本實施例中，該風扇18係以螺紋件固設於該框架12之該側，但本實施例不在此限制。Please refer to Figure 3, which is a schematic diagram of the fan structure and its operation according to one embodiment of the present invention. As shown in the figure, this embodiment is based on the above-mentioned embodiment. The heat dissipation assembly 10 further includes a fan 18, and the fan 18 pairs The heat dissipation fins 14 should be disposed on one side of the frame 12. In this embodiment, the fan 18 is fixed on this side of the frame 12 with screws, but this embodiment is not limited to this.

接續上述，於本實施例中，一氣體A進入該風扇18之一側，該氣體A進入該風扇18後，該氣體A流至該框架12之該內側，並經過該散熱鰭管14之一外側與該散熱鰭管14進行熱交換，使該散熱鰭管14之該內側之該流體F(如第2B圖所示)降溫，該氣體A經過該散熱鰭管14之該外側後，該氣體A流出該框架12。Continuing from the above, in this embodiment, a gas A enters one side of the fan 18 . After the gas A enters the fan 18 , the gas A flows to the inside of the frame 12 and passes through one of the heat dissipation fins 14 The outside performs heat exchange with the heat dissipation fin tube 14 to cool down the fluid F (as shown in Figure 2B) on the inside of the heat dissipation fin tube 14. After the gas A passes through the outside of the heat dissipation fin tube 14, the gas A flows out of the frame 12.

接續上述，於本實施例中，該氣體A係空氣，本實施例不在此限制。Continuing from the above, in this embodiment, the gas A is air, and this embodiment is not limited thereto.

綜上所述，本發明提供一種用於冷卻雙熱源之水冷裝置，其係以單一散熱組件，連通二個熱交換組件，二個熱交換組件個別對應冷卻二個熱源，利用此裝置同時冷卻二個熱源，進一步減少裝置之佔用空間，且二個熱交換組件互相連通，以其中之一熱交換組件接收流經另一熱交換組件之流體，以降溫需求較高之熱源，接收降溫需求較低之熱源之冷卻液，於進一步縮小體積之同時，減少整體水冷裝置之能源消耗，解決習知水冷裝置係一個散熱器對應一個發熱之電子元件，若需散熱多個電子元件，須佔用多個空間之問題，以及解決習知水冷裝置，須使用多個散熱器將消耗更多能源之問題。To sum up, the present invention provides a water cooling device for cooling dual heat sources. It uses a single heat dissipation component to connect two heat exchange components. The two heat exchange components respectively cool two heat sources. This device is used to simultaneously cool two heat sources. A heat source further reduces the space occupied by the device, and the two heat exchange components are connected to each other. One of the heat exchange components receives the fluid flowing through the other heat exchange component to receive the heat source with higher cooling demand and receive the heat source with lower cooling demand. The cooling liquid of the heat source further reduces the volume and at the same time reduces the energy consumption of the overall water-cooling device. It solves the problem that conventional water-cooling devices have one radiator corresponding to one heating electronic component. If multiple electronic components need to be dissipated, multiple spaces must be occupied. problem, and to solve the problem that conventional water-cooling devices require the use of multiple radiators and consume more energy.

故本發明實為一具有新穎性、進步性及可供產業上利用者，應符合我國專利法專利申請要件無疑，爰依法提出發明專利申請，祈鈞局早日賜准專利，至感為禱。Therefore, this invention is indeed novel, progressive and can be used industrially. It should undoubtedly meet the patent application requirements of my country's Patent Law. I file an invention patent application in accordance with the law and pray that the Office will grant the patent as soon as possible. I am deeply grateful.

惟以上所述者，僅為本發明一實施例而已，並非用來限定本發明實施之範圍，故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本發明之申請專利範圍內。However, the above is only an embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, all changes and modifications can be made equally in accordance with the shape, structure, characteristics and spirit described in the patent scope of the present invention. All should be included in the patentable scope of the present invention.

1:用於冷卻雙熱源之水冷裝置 2:第一熱源 3:第二熱源 10:散熱組件 12:框架 14:散熱鰭管 16:第一循環泵 161:第一進水口 162:第一出水口 163:第二進水口 164:第二出水口 18:風扇 20:第一管路 30:第一熱交換組件 32:第二循環泵 34:第一導熱件 40:第二管路 50:第二熱交換組件 52:容置槽 54:第二導熱件 56:固定架 60:第三管路 A:氣體 F:流體 1: Water cooling device for cooling dual heat sources 2: The first heat source 3: Second heat source 10: Cooling components 12:Frame 14: Cooling fin tube 16: First circulation pump 161:First water inlet 162:First water outlet 163:Second water inlet 164:Second water outlet 18:Fan 20:First pipeline 30: First heat exchange component 32: Second circulation pump 34:The first thermal conductor 40:Second pipeline 50: Second heat exchange component 52: Accommodation tank 54:Second thermal conductor 56:fixed frame 60:Third pipeline A:Gas F: fluid

第1圖：其為本發明之一實施例之結構***示意圖；第2A圖至第2B圖：其為本發明之一實施例之流體流動路徑示意圖；以及第3圖：其為本發明之一實施例之風扇結構及其作動示意圖。 Figure 1: This is an exploded schematic diagram of the structure of one embodiment of the present invention; Figure 2A to Figure 2B: This is a schematic diagram of a fluid flow path according to an embodiment of the present invention; and Figure 3: This is a schematic diagram of the fan structure and its operation according to an embodiment of the present invention.

1:用於冷卻雙熱源之水冷裝置 1: Water cooling device for cooling dual heat sources

2:第一熱源 2: The first heat source

3:第二熱源 3: Second heat source

10:散熱組件 10: Cooling components

12:框架 12:Frame

14:散熱鰭管 14: Cooling fin tube

16:第一循環泵 16: First circulation pump

18:風扇 18:Fan

20:第一管路 20:First pipeline

30:第一熱交換組件 30: First heat exchange component

32:第二循環泵 32: Second circulation pump

34:第一導熱件 34:The first thermal conductor

40:第二管路 40:Second pipeline

50:第二熱交換組件 50: Second heat exchange component

52:容置槽 52: Accommodation tank

54:第二導熱件 54:Second thermal conductor

60:第三管路 60:Third pipeline

Claims

一種用於冷卻雙熱源之水冷裝置，其用於冷卻一第一熱源以及一第二熱源，該用於冷卻雙熱源之水冷裝置包含：一散熱組件，其包含一框架、一散熱鰭管以及一第一循環泵，該散熱鰭管設置於該框架之一內側，該第一循環泵連通該散熱鰭管之二端；一第一管路，其一端連通該第一循環泵；一第一熱交換組件，其包含一第二循環泵以及一第一導熱件，該第二循環泵連通該第一管路之另一端，該第一導熱件設置於該第二循環泵之一下方，該第一導熱件對應抵接於該第一熱源；一第二管路，其一端連通該第二循環泵；一第二熱交換組件，其包含一容置槽以及一第二導熱件，該容置槽連通該第二管路之另一端，該第二導熱件設置於該容置槽之一下方，該第二導熱件對應抵接於該第二熱源；以及一第三管路，其一端連通該容置槽，該第三管路之另一端連通該第一循環泵；其中，一流體設置於該散熱鰭管之一內側，該第一循環泵對應輸送該流體至該第三管路，該流體經過該第三管路後流至該容置槽，該流體經過該容置槽後流至該第二管路，該流體經過該第二管路後流至該第二循環泵，該流體經過該第二循環泵後流至該第一管路，該流體經過該第一管路後流至該第一循環泵以及該散熱鰭管；其中，該第一熱源產生熱能並傳導至該第一導熱件，再由該第一導熱件傳導至該第二循環泵，該第二熱源產生熱能並傳導至該第二導熱件，再由該第二導熱件傳導至該容置槽。 A water-cooling device for cooling dual heat sources, which is used to cool a first heat source and a second heat source. The water-cooling device for cooling dual heat sources includes: A heat dissipation component, which includes a frame, a heat dissipation fin tube and a first circulation pump. The heat dissipation fin tube is arranged on an inner side of the frame, and the first circulation pump communicates with the two ends of the heat dissipation fin tube; A first pipeline, one end of which is connected to the first circulation pump; A first heat exchange component, which includes a second circulation pump and a first heat conduction member. The second circulation pump is connected to the other end of the first pipeline, and the first heat conduction member is disposed under the second circulation pump. On the other side, the first thermal conductive member corresponds to the first heat source; a second pipeline, one end of which is connected to the second circulation pump; A second heat exchange component, which includes an accommodating groove and a second heat conductive member, the accommodating groove is connected to the other end of the second pipeline, the second heat conductive member is disposed below one of the accommodating grooves, the The second heat conducting member corresponds to the second heat source; and A third pipeline, one end of which is connected to the accommodation tank, and the other end of the third pipeline is connected to the first circulation pump; Wherein, a fluid is disposed inside one of the heat dissipation fins, and the first circulation pump correspondingly delivers the fluid to the third pipeline. The fluid passes through the third pipeline and then flows to the accommodating tank. The fluid passes through the After the holding tank flows to the second pipeline, the fluid flows to the second circulation pump after passing through the second pipeline, the fluid flows to the first pipeline after passing through the second circulation pump, and the fluid passes through the The first pipeline then flows to the first circulation pump and the heat dissipation fin tube; Wherein, the first heat source generates heat energy and conducts it to the first heat conduction member, and then conducts it to the second circulation pump from the first heat conduction member. The second heat source generates heat energy and conducts it to the second heat conduction member, and then the second heat conduction member conducts it to the second heat conduction member. The second heat conducting component is conducted to the accommodating groove.

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該第一熱源係一中央處理器(CPU)。The water cooling device for cooling dual heat sources as described in claim 1, wherein the first heat source is a central processing unit (CPU).

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該第二熱源係一固態硬碟(SSD)。The water cooling device for cooling dual heat sources as described in claim 1, wherein the second heat source is a solid state drive (SSD).

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該第一循環泵之一側設置一第一進水口以及一第一出水口，該第一進水口連通該散熱鰭管之一端，該第一出水口連通該散熱鰭管之另一端，該流體由該第一進水口進入該散熱鰭管，該流體經過該散熱鰭管後由該第一出水口流至該第一循環泵。The water cooling device for cooling dual heat sources as described in claim 1, wherein a first water inlet and a first water outlet are provided on one side of the first circulation pump, and the first water inlet is connected to one end of the heat dissipation fin tube , the first water outlet is connected to the other end of the heat dissipation fin tube, the fluid enters the heat dissipation fin tube from the first water inlet, and the fluid flows through the heat dissipation fin tube from the first water outlet to the first circulation pump .

如請求項4所述之用於冷卻雙熱源之水冷裝置，其中該第一循環泵之另一側設置一第二進水口以及一第二出水口，該第二進水口連通該第一管路之該端，該第二出水口連通該第三管路之該另一端，該流體經過該第一管路後由該第二進水口進入該第一循環泵，該流體由該第二出水口進入該第三管路。The water cooling device for cooling dual heat sources as described in claim 4, wherein a second water inlet and a second water outlet are provided on the other side of the first circulation pump, and the second water inlet is connected to the first pipeline The second water outlet is connected to the other end of the third pipeline. After passing through the first pipeline, the fluid enters the first circulation pump from the second water inlet. The fluid enters the first circulation pump from the second water outlet. Enter this third pipeline.

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該散熱組件更包含一風扇，該風扇對應該散熱鰭管設置於該框架之一側。As claimed in claim 1, the water cooling device for cooling dual heat sources, wherein the heat dissipation component further includes a fan, and the fan is disposed on one side of the frame corresponding to the heat dissipation fin tube.

如請求項6所述之用於冷卻雙熱源之水冷裝置，其中一氣體進入該風扇之一側，該氣體進入該風扇後流至該框架之該內側，並經過該散熱鰭管之一外側，該氣體經過該散熱鰭管之該外側後，該氣體流出該框架。The water cooling device for cooling dual heat sources as described in claim 6, wherein a gas enters one side of the fan, and after entering the fan, the gas flows to the inside of the frame and passes through one outside of the heat dissipation fin tube, After the gas passes through the outer side of the heat dissipation fin tube, the gas flows out of the frame.

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該第一管路、該第二管路以及該第三管路個別係一柔性管路。The water cooling device for cooling dual heat sources as described in claim 1, wherein the first pipeline, the second pipeline and the third pipeline are each a flexible pipeline.

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該第二熱交換組件更包含一固定架，該固定架設置於該第二導熱件之一下方，且該固定架以及該第二導熱件夾設該第二熱源。As claimed in claim 1, the water cooling device for cooling dual heat sources, wherein the second heat exchange component further includes a fixing bracket, the fixing bracket is disposed below one of the second heat conductive members, and the fixing bracket and the third The second heat source is sandwiched between two heat conductive members.

如請求項1所述之用於冷卻雙熱源之水冷裝置，其中該第一熱源之溫度大於等於該第二熱源之溫度。The water cooling device for cooling dual heat sources as described in claim 1, wherein the temperature of the first heat source is greater than or equal to the temperature of the second heat source.