TW202344395A - Adhesive sheet which can fully suppress the peeling static electricity generated during peeling, and has excellent anti-static properties and long-term stability of peeling static voltage - Google Patents

Adhesive sheet which can fully suppress the peeling static electricity generated during peeling, and has excellent anti-static properties and long-term stability of peeling static voltage Download PDF

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TW202344395A
TW202344395A TW112106977A TW112106977A TW202344395A TW 202344395 A TW202344395 A TW 202344395A TW 112106977 A TW112106977 A TW 112106977A TW 112106977 A TW112106977 A TW 112106977A TW 202344395 A TW202344395 A TW 202344395A
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Taiwan
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adhesive sheet
mentioned
peeling
cation
weight
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TW112106977A
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Chinese (zh)
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黄恒昶
侯猛
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大陸商日東電工（上海松江）有限公司
日商日東電工股份有限公司
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Publication of TW202344395A publication Critical patent/TW202344395A/en

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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J165/00—Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Adhesives based on derivatives of such polymers
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    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
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    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2423/006—Presence of polyolefin in the substrate
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides an adhesive sheet. The adhesive sheet of the present invention comprises a base material layer and an adhesive layer provided on one side of the base material layer, wherein the peeling static voltage generated by peeling the adhesive sheet from the release film is 500 V or less in a peeling test with a peeling speed of 300 mm/min. The adhesive sheet of the present invention can fully suppress the peeling static electricity generated during peeling, and has excellent anti-static properties and long-term stability of peeling static voltage, thereby avoiding or reducing damage to the adhered material (for example, has excellent resistance to electrostatic breakdown). Moreover, the adhesive sheet can be easily peeled off after use without causing any residual adhesive pollution.

Description

黏合片Adhesive sheet

本發明涉及黏合片，尤其涉及具有優異的抗靜電性及黏合性且在使用之後可容易剝離而不產生殘膠污染的黏合片。The present invention relates to an adhesive sheet, and in particular to an adhesive sheet that has excellent antistatic properties and adhesive properties and can be easily peeled off after use without causing residual adhesive contamination.

在光學構件、電子構件等構件的製造工序中，在加工、組裝、檢查、輸送等時，為了防止此等構件的表面損傷，通常在此等構件的露出面貼附黏合片(表面保護薄膜)。此類黏合片在不需要表面保護時自此等構件剝離。表面保護薄膜、光學構件及電子構件的電絕緣性高，會由於摩擦、剝離而產生靜電。因此，在自光學構件及電子構件等構件剝離表面保護薄膜時，容易產生靜電。在此類情況下，容易對光學構件及電子構件等構件造成損害，且靜電的存在亦可能成為吸附塵埃、使操作性下降的因素。In the manufacturing process of optical components, electronic components, etc., in order to prevent surface damage of these components during processing, assembly, inspection, transportation, etc., an adhesive sheet (surface protection film) is usually attached to the exposed surface of these components. . Such adhesive sheets peel away from such components when surface protection is not required. Surface protection films, optical components, and electronic components have high electrical insulation properties and can generate static electricity due to friction and peeling. Therefore, static electricity is easily generated when the surface protective film is peeled off from components such as optical components and electronic components. In such a case, it is easy to cause damage to components such as optical components and electronic components, and the presence of static electricity may also become a factor that attracts dust and reduces operability.

為了防止靜電，已知對黏合片實施抗靜電處理的操作。例如對於黏合片之表面層(面塗層、背面層)，藉由形成抗靜電層、實施抗靜電塗覆來賦予抗靜電功能。但是，形成抗靜電層的黏合片亦存在如下問題：若自貼合於光學構件、電子構件等構件的露出面側的帶離型膜的黏合片將離型膜剝離，則會產生剝離靜電，對光學構件及電子構件造成損傷。且隨著時間的流逝，會發生表面電阻率或剝離靜電壓的上升等問題。若發生表面電阻率的上升(劣化)等，則自被黏附體上剝離黏合片時會產生靜電，被黏附體(例如電子構件等)所帶的靜電具有導致內置的電子部件惡化且擊穿的危險性。In order to prevent static electricity, it is known to subject an adhesive sheet to antistatic treatment. For example, the surface layer (top coat, back layer) of the adhesive sheet is provided with an antistatic function by forming an antistatic layer and applying antistatic coating. However, the adhesive sheet forming the antistatic layer also has the following problem: if the release film is peeled off from the adhesive sheet with the release film attached to the exposed surface side of optical components, electronic components, etc., peeling static electricity will be generated. Causes damage to optical components and electronic components. And as time passes, problems such as surface resistivity and peeling static voltage increase may occur. If the surface resistivity increases (deterioration), etc., static electricity will be generated when the adhesive sheet is peeled off from the adherend. The static electricity carried by the adherend (such as electronic components, etc.) has the potential to cause the built-in electronic components to deteriorate and breakdown. Danger.

發明要解決之問題 本發明是為了解決上述現有的問題而作出的，其目的在於，提供一種能夠形成防靜電性(防剝離靜電性)、再剝離性以及黏合性均優異且在使用之後可容易剝離而不產生殘膠污染的黏合片。 Invent the problem to be solved The present invention was made in order to solve the above-mentioned existing problems, and its object is to provide a device that is excellent in antistatic properties (anti-peeling properties), re-peelability and adhesiveness and can be easily peeled off after use without leaving any residue. Glue contaminated adhesive sheet.

用於解決問題之方案 本發明人等為了解決上述課題而進行了深入研究，結果發現，藉由將在剝離速度為300 mm/分鐘的剝離試驗中，黏合片自離型膜上剝離產生的剝離靜電壓控制在特定範圍內，能夠解決上述課題，從而完成了本發明。 solutions to problems The present inventors conducted in-depth research in order to solve the above-mentioned problems and found that by controlling the peeling static voltage generated by peeling the adhesive sheet from the release film in a peeling test at a peeling speed of 300 mm/min within a specific range In this way, the above-mentioned problems can be solved, and the present invention has been completed.

即，本發明如下。That is, the present invention is as follows.

[1]. 一種黏合片，其具備：基材層、以及設置於上述基材層的一側上的黏合劑層， 其中，在剝離速度為300 mm/分鐘的剝離試驗中，上述黏合片自離型膜上剝離產生的剝離靜電壓為500 V以下。 [1]. An adhesive sheet comprising: a base material layer, and an adhesive layer provided on one side of the base material layer, Among them, in the peeling test at a peeling speed of 300 mm/min, the peeling static voltage generated by peeling off the above-mentioned adhesive sheet from the release film was below 500 V.

[2]. 根據[1]所述的黏合片，其中，在剝離速度為30 m/分鐘的剝離試驗中上述黏合片自離型膜上剝離產生的剝離靜電壓為200V以下； 較佳地，在剝離速度為30 m/分鐘的剝離試驗中，上述黏合片自離型膜上剝離產生的剝離靜電壓為100V以下； 較佳地，上述黏合片之至少一個表面之表面電阻率為1.0×10 5至1.0×10 11Ω/□； 較佳地，上述黏合片經1至1.5倍360°方向拉伸後，上述基材層之表面電阻率為1.0×10 5至1.0×10 11Ω/□，上述黏合片之表面電阻率為1.0×10 11Ω/□以下。 [2]. The adhesive sheet according to [1], wherein the peeling static voltage generated when the adhesive sheet is peeled off from the release film in a peeling test at a peeling speed of 30 m/min is 200V or less; preferably, In a peeling test with a peeling speed of 30 m/min, the peeling static voltage generated by peeling off the above-mentioned adhesive sheet from the release film is below 100V; Preferably, the surface resistivity of at least one surface of the above-mentioned adhesive sheet is 1.0×10 5 to 1.0×10 11 Ω/□; Preferably, after the above-mentioned adhesive sheet is stretched 1 to 1.5 times in the 360° direction, the surface resistivity of the above-mentioned base material layer is 1.0×10 5 to 1.0×10 11 Ω/□ , the surface resistivity of the above-mentioned adhesive sheet is 1.0×10 11 Ω/□ or less.

[3]. 根據[1]或[2]所述的黏合片，其中，上述黏合劑層包括基礎聚合物、多官能寡聚物及抗靜電劑。[3]. The adhesive sheet according to [1] or [2], wherein the adhesive layer includes a base polymer, a multifunctional oligomer and an antistatic agent.

[4]. 根據[3]所述的黏合片，其中，上述基礎聚合物包含丙烯酸系聚合物； 較佳地，基於上述基礎聚合物的全部單體成分100重量份，上述基礎聚合物包含0.5至30重量份、較佳1至20重量份、更佳3至15重量份的機能性單體； 較佳地，上述機能性單體包含選自由含羥基單體、含羧基單體、含磺酸基單體、含有磷酸基之單體、含環氧基之單體、含異氰酸基之單體、含醯胺基之單體、具有含氮原子的環之單體、具有琥珀醯亞胺骨架之單體、馬來醯亞胺類單體、衣康醯亞胺類單體、(甲基)丙烯酸胺基烷基酯類單體、(甲基)丙烯酸烷氧基烷基酯類單體、乙烯基醚類單體及烯烴類單體組成之群中之至少一者。 [4]. The adhesive sheet according to [3], wherein the base polymer includes an acrylic polymer; Preferably, based on 100 parts by weight of all monomer components of the above-mentioned base polymer, the above-mentioned base polymer contains 0.5 to 30 parts by weight, preferably 1 to 20 parts by weight, and more preferably 3 to 15 parts by weight of functional monomers; Preferably, the above-mentioned functional monomers include monomers selected from the group consisting of hydroxyl-containing monomers, carboxyl-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, epoxy group-containing monomers, and isocyanate group-containing monomers. Monomers, monomers containing amide groups, monomers with rings containing nitrogen atoms, monomers with succinimide skeleton, maleimine monomers, itaconidimine monomers, ( At least one of the group consisting of meth)acrylic acid aminoalkyl ester monomers, (meth)acrylic acid alkoxyalkyl ester monomers, vinyl ether monomers and olefin monomers.

[5]. 根據[3]所述的黏合片，其中，上述多官能寡聚物的官能度為2以上，較佳3以上，更佳5以上； 較佳地，上述多官能寡聚物包含選自由丙烯酸改性樹脂、聚胺酯改性樹脂、環氧改性樹脂、酚醛改性樹脂、聚醚改性樹脂及有機矽改性樹脂組成之群中之至少一者； 較佳地，上述多官能寡聚物包含聚胺酯改性丙烯酸樹脂、丙烯酸改性聚胺酯樹脂、環氧改性丙烯酸樹脂、環氧改性聚胺酯樹脂、鄰甲酚醛改性樹脂、酚醛改性丙烯酸樹脂、酚醛改性聚胺酯樹脂、酚醛改性環氧樹脂、聚醚改性丙烯酸酯樹脂及有機矽改性丙烯酸酯樹脂中之至少一者； 較佳地，上述多官能寡聚物包含選自由聚胺酯改性丙烯酸酯、環氧改性丙烯酸酯、聚醚改性丙烯酸酯及有機矽改性丙烯酸酯組成之群中之至少一者。 較佳地，相對於上述基礎聚合物100重量份，上述多官能寡聚物之含量為20至200重量份，較佳30至150重量份，更佳40至120重量份。 [5]. The adhesive sheet according to [3], wherein the functionality of the multifunctional oligomer is 2 or more, preferably 3 or more, more preferably 5 or more; Preferably, the above-mentioned multifunctional oligomer includes a resin selected from the group consisting of acrylic modified resin, polyurethane modified resin, epoxy modified resin, phenolic modified resin, polyether modified resin and organosilicon modified resin. at least one; Preferably, the above-mentioned multifunctional oligomers include polyurethane-modified acrylic resin, acrylic acid-modified polyurethane resin, epoxy-modified acrylic resin, epoxy-modified polyurethane resin, o-cresol-modified resin, phenolic-modified acrylic resin, At least one of phenolic modified polyurethane resin, phenolic modified epoxy resin, polyether modified acrylate resin and silicone modified acrylate resin; Preferably, the above-mentioned multifunctional oligomer includes at least one selected from the group consisting of polyurethane-modified acrylate, epoxy-modified acrylate, polyether-modified acrylate, and silicone-modified acrylate. Preferably, the content of the polyfunctional oligomer is 20 to 200 parts by weight, preferably 30 to 150 parts by weight, and more preferably 40 to 120 parts by weight relative to 100 parts by weight of the base polymer.

[6]. 根據[3]所述的黏合片，其中，上述抗靜電劑包括選自由導電性聚合物、導電性無機微粒、金屬微粒或纖維、離子型化合物及離子型界面活性劑組成之群中之至少一者； 較佳地，上述導電性聚合物包含選自由聚苯胺、聚吡咯、聚噻吩、聚喹㗁啉、聚乙炔、聚乙烯亞胺及烯丙基胺系聚合物組成之群中之至少一者； 較佳地，上述導電性無機微粒包含選自由導電性金屬氧化物、碳奈米管、石墨烯、富勒烯、乙炔黑、科琴黑、天然石墨、人造石墨及鈦黑組成之群中之至少一者； 較佳地，上述金屬微粒或纖維包含金、銀、銅、鋁、鎳或其合金構成的微粒或奈米線； 較佳地，上述離子型化合物包含鹼金屬鹽及/或有機陽離子-陰離子鹽； 較佳地，上述離子型界面活性劑包含選自由陽離子型界面活性劑、陰離子型界面活性劑、兩性離子型界面活性劑及非離子型界面活性劑組成之群中之至少一者； 較佳地，相對於上述基礎聚合物100重量份，上述抗靜電劑之含量為0.0001至20重量份，較佳0.0002至10重量份。 [6]. The adhesive sheet according to [3], wherein the antistatic agent includes a group selected from the group consisting of conductive polymers, conductive inorganic particles, metal particles or fibers, ionic compounds, and ionic surfactants. At least one of them; Preferably, the conductive polymer includes at least one selected from the group consisting of polyaniline, polypyrrole, polythiophene, polyquinoline, polyacetylene, polyethyleneimine and allylamine polymers; Preferably, the conductive inorganic particles include conductive metal oxides, carbon nanotubes, graphene, fullerene, acetylene black, Ketjen black, natural graphite, artificial graphite and titanium black. at least one; Preferably, the above-mentioned metal particles or fibers include particles or nanowires composed of gold, silver, copper, aluminum, nickel or alloys thereof; Preferably, the above-mentioned ionic compound includes an alkali metal salt and/or an organic cation-anion salt; Preferably, the ionic surfactant includes at least one selected from the group consisting of cationic surfactants, anionic surfactants, zwitterionic surfactants and nonionic surfactants; Preferably, the content of the antistatic agent is 0.0001 to 20 parts by weight, preferably 0.0002 to 10 parts by weight relative to 100 parts by weight of the base polymer.

[7]. 根據[1]至[6]中任一項所述的黏合片，其中，上述黏合劑層亦包括光引發劑及/或交聯劑； 較佳地，相對於上述基礎聚合物100重量份，上述光引發劑之含量為0.5至10重量份，較佳0.5至5重量份； 較佳地，相對於上述基礎聚合物100重量份，上述交聯劑之含量為0.1至10重量份，較佳0.1至5重量份。 [7]. The adhesive sheet according to any one of [1] to [6], wherein the adhesive layer also includes a photoinitiator and/or a cross-linking agent; Preferably, the content of the above-mentioned photoinitiator is 0.5 to 10 parts by weight, preferably 0.5 to 5 parts by weight relative to 100 parts by weight of the above-mentioned base polymer; Preferably, the content of the cross-linking agent is 0.1 to 10 parts by weight, preferably 0.1 to 5 parts by weight relative to 100 parts by weight of the base polymer.

[8]. 根據[1]至[7]中任一項所述的黏合片，其中，上述黏合片滿足下述特性(a)至(d)中之至少一者： 特性(a)：利用下式(1)算出的黏合片之黏合力降低率為80%以上， 黏合力降低率(%)=[(N1-N2)/N1]×100   (1) 其中，N1表示上述黏合片之紫外線照射前的黏合力， N2表示上述黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力； 特性(b)：上述黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力N2為1N/20 mm以下； 特性(c)：上述黏合片之紫外線照射前的黏合力N1為0.5至40 N/20 mm； 特性(d)：上述黏合片之長度方向(MD方向)的拉伸斷裂強度與寬度方向(TD方向)的拉伸斷裂強度之比(MD方向的拉伸斷裂強度/ TD方向的拉伸斷裂強度)為0.8至1.2。 [8]. The adhesive sheet according to any one of [1] to [7], wherein the adhesive sheet satisfies at least one of the following characteristics (a) to (d): Characteristic (a): Utilization The adhesive force reduction rate of the adhesive sheet calculated by the following formula (1) is more than 80%. Adhesion force reduction rate (%) = [(N1-N2)/N1]×100 (1) Among them, N1 represents the ultraviolet ray of the above-mentioned adhesive sheet. The adhesive strength before irradiation, N2 represents the adhesive strength of the above-mentioned adhesive sheet after irradiation with ultraviolet rays with a cumulative light intensity of 300 mJ/cm 2 ; Characteristic (b): The adhesive strength of the above-mentioned adhesive sheet after irradiation with ultraviolet rays with a cumulative light intensity of 300 mJ/cm 2 N2 is 1N/20 mm or less; Characteristic (c): The adhesive force N1 of the above-mentioned adhesive sheet before ultraviolet irradiation is 0.5 to 40 N/20 mm; Characteristic (d): The tensile strength of the above-mentioned adhesive sheet in the length direction (MD direction) The ratio of the tensile breaking strength to the tensile breaking strength in the width direction (TD direction) (tensile breaking strength in MD direction/tensile breaking strength in TD direction) is 0.8 to 1.2.

[9]. 根據[1]至[8]中任一項所述的黏合片，其中，上述基材層之厚度為10至300 μm，較佳30至200 μm，更佳50至150 μm； 較佳地，上述基材層包含選自由熱塑性聚胺酯、聚乙烯、聚丙烯、聚丁烯、乙烯-醋酸乙烯酯共聚物及聚氯乙烯組成之群中之至少一者； 較佳地，上述基材層的內部及/或表面包含抗靜電劑。 [9]. The adhesive sheet according to any one of [1] to [8], wherein the thickness of the above-mentioned base material layer is 10 to 300 μm, preferably 30 to 200 μm, more preferably 50 to 150 μm; Preferably, the above-mentioned base material layer includes at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutylene, ethylene-vinyl acetate copolymer and polyvinyl chloride; Preferably, the interior and/or surface of the above-mentioned base material layer contains an antistatic agent.

[10]. 根據[1]至[9]中任一項所述的黏合片，其中，上述黏合片亦包括底塗層及/或背塗層， 上述背塗層設置於上述基材層的與上述黏合劑層相反的一側， 上述底塗層設置於上述基材層的與上述背塗層相反的一側， 較佳地，上述底塗層包括選自由熱固性的丙烯酸、聚胺酯及環氧體系樹脂組成之群中之至少一者； 較佳地，上述背塗層包括選自由熱固性的丙烯酸、聚胺酯及環氧體系樹脂組成之群中之至少一者。 [10]. The adhesive sheet according to any one of [1] to [9], wherein the adhesive sheet also includes a base coating and/or a back coating, The above-mentioned back coating layer is provided on the side opposite to the above-mentioned adhesive layer of the above-mentioned base material layer, The above-mentioned undercoat layer is provided on the opposite side of the above-mentioned base material layer to the above-mentioned backcoat layer, Preferably, the above-mentioned primer layer includes at least one selected from the group consisting of thermosetting acrylic, polyurethane and epoxy system resin; Preferably, the above-mentioned back coating includes at least one selected from the group consisting of thermosetting acrylic, polyurethane and epoxy system resins.

發明效應 根據本發明，能夠提供一種防靜電性(防剝離靜電性)、再剝離性以及黏合性均優異、且在使用之後可容易剝離而不產生殘膠污染的黏合片。本發明之黏合片能夠充分抑制剝離時產生的剝離靜電，實現優異的抗靜電性及剝離靜電壓的經時穩定性，從而避免或減輕對被黏物造成損傷(例如具有優異的耐靜電擊穿能力)。 invention effect According to the present invention, it is possible to provide an adhesive sheet that is excellent in antistatic properties (anti-peeling properties), re-peelability, and adhesiveness, and can be easily peeled off after use without causing residual adhesive contamination. The adhesive sheet of the present invention can fully suppress the peeling static electricity generated during peeling, achieve excellent antistatic properties and the stability of the peeling static voltage over time, thereby avoiding or reducing damage to the adherend (for example, having excellent resistance to electrostatic breakdown) ability).

以下，對本發明之適宜的實施例進行說明。本說明書中特別提及的事項以外的實施本發明所需的事項基於本說明書中記載的關於發明的實施的教示及申請時的技術常識可被熟習此項技術者所理解。本發明可基於本說明書中揭示的內容及該領域中的技術常識而實施。Hereinafter, suitable embodiments of the present invention will be described. Matters necessary for implementing the present invention other than those specifically mentioned in this specification can be understood by those skilled in the art based on the teachings regarding the implementation of the invention described in this specification and the technical common sense at the time of application. The present invention can be implemented based on the contents disclosed in this specification and technical common sense in the field.

另外，在以下的附圖中，有時對發揮相同作用的構件·部位標註相同符號而進行說明，重複的說明有時省略或簡化。此外，附圖中記載的實施例為了清楚地說明本發明而被示意化，不一定準確地表示實際提供的製品的尺寸、比例尺。In addition, in the following drawings, members and parts that perform the same functions may be described with the same reference numerals, and repeated descriptions may be omitted or simplified. In addition, the embodiments described in the drawings are schematically illustrated in order to clearly explain the present invention, and do not necessarily accurately represent the dimensions and scale of the products actually provided.

＜黏合片＞ 本發明之黏合片包括：基材層；及設置在上述基材層的一側上的黏合劑層，其中，在剝離速度為300 mm/分鐘的剝離試驗中，上述黏合片自離型膜上剝離產生的剝離靜電壓為500 V以下。 ＜Adhesive sheet＞ The adhesive sheet of the present invention includes: a base material layer; and an adhesive layer disposed on one side of the base material layer, wherein in a peeling test with a peeling speed of 300 mm/min, the adhesive sheet self-releases from the release film. The peeling static voltage generated by peeling is 500 V or less.

圖1係示意性表示本發明一個實施例的黏合片之結構的截面圖。如圖1所示，黏合片1包括基材層10及設置在基材層10的一側上的黏合劑層20，黏合劑層20較佳設置在基材層10的整個面上。FIG. 1 is a cross-sectional view schematically showing the structure of an adhesive sheet according to one embodiment of the present invention. As shown in FIG. 1 , the adhesive sheet 1 includes a base material layer 10 and an adhesive layer 20 disposed on one side of the base material layer 10 . The adhesive layer 20 is preferably disposed on the entire surface of the base material layer 10 .

圖2係示意性表示本發明之另一實施例的黏合片之結構的截面圖。該黏合片2亦具備背塗層30。如圖2所示，背塗層30設置於基材層10的與黏合劑層20相反的一側。FIG. 2 is a cross-sectional view schematically showing the structure of an adhesive sheet according to another embodiment of the present invention. The adhesive sheet 2 also has a back coating layer 30 . As shown in FIG. 2 , the back coating layer 30 is provided on the opposite side of the base material layer 10 to the adhesive layer 20 .

圖3係示意性表示本發明之又一實施例的黏合片之結構的截面圖。該黏合片3亦具備底塗層40。如圖3所示，底塗層40設置於基材層10的與背塗層30相反的一側、基材層10與黏合劑層20之間。FIG. 3 is a cross-sectional view schematically showing the structure of an adhesive sheet according to another embodiment of the present invention. The adhesive sheet 3 also has a primer layer 40 . As shown in FIG. 3 , the undercoat layer 40 is provided on the opposite side of the base material layer 10 to the back coating layer 30 and between the base material layer 10 and the adhesive layer 20 .

另外，雖然未圖示，但本發明之黏合片可在供於使用之前的期限出於保護黏合面的目的而在黏合劑層之外側設置有剝離襯墊。In addition, although not shown in the figures, the adhesive sheet of the present invention may be provided with a release liner outside the adhesive layer for the purpose of protecting the adhesive surface until it is used.

本說明書中所說的黏合片之概念中，可包括被稱為黏合帶、黏合標籤、黏合薄膜等的物體。需要說明的是，此處揭示的黏合片可為單片狀，亦可為被進一步加工成各種形狀的形態的黏合片。在一些較佳實施例中，本發明之黏合片可以長條狀來提供。The concept of the adhesive sheet mentioned in this specification may include objects called adhesive tapes, adhesive labels, adhesive films, etc. It should be noted that the adhesive sheet disclosed here may be in the form of a single sheet, or may be further processed into various shapes. In some preferred embodiments, the adhesive sheet of the present invention can be provided in a long strip shape.

本發明之黏合片具有如下特徵：在剝離速度為300 mm/分鐘的剝離試驗中，黏合片自離型膜上剝離產生的剝離靜電壓為500 V以下，較佳為200V以下，進一步較佳為150V以下，再進一步較佳為100V以下。The adhesive sheet of the present invention has the following characteristics: in a peeling test with a peeling speed of 300 mm/minute, the peeling static voltage generated by peeling the adhesive sheet from the release film is 500 V or less, preferably 200 V or less, and further preferably 150V or less, more preferably 100V or less.

在剝離速度為30 m/分鐘的剝離試驗中，黏合片自離型膜上剝離產生的剝離靜電壓為200V以下，較佳為100V以下。In the peeling test at a peeling speed of 30 m/min, the peeling static voltage generated by peeling the adhesive sheet from the release film is 200V or less, preferably 100V or less.

在本發明中，藉由將黏合片自離型膜上剝離產生的剝離靜電壓設為上述範圍，可抑制黏合片剝離時可能產生的剝離靜電，黏合片具有優異的防靜電性(防剝離靜電性)，剝離時不會損壞被黏物，能夠有效防止靜電擊穿等問題的發生。In the present invention, by setting the peeling static voltage generated when the adhesive sheet is peeled off from the release film to the above range, the peeling static electricity that may be generated when the adhesive sheet is peeled off can be suppressed, and the adhesive sheet has excellent antistatic properties (anti-peeling static electricity). properties), it will not damage the adherend when peeling off, and can effectively prevent problems such as electrostatic breakdown.

若剝離靜電壓大於500 V，則有剝離時產生大量剝離靜電，產生靜電擊穿等不利影響。上述剝離靜電壓例如可以在後述的實例中記載的方法來測定。If the peeling static voltage is greater than 500 V, a large amount of peeling static electricity will be generated during peeling, resulting in adverse effects such as electrostatic breakdown. The peeling electrostatic voltage can be measured, for example, by the method described in Examples described below.

在一些較佳的實施例中，本發明之黏合片之至少一個表面之表面電阻率為1.0×10 5至1.0×10 11Ω/□，較佳為1.0×10 6至1.0×10 9Ω/□。若為此類範圍，能夠滿足抗靜電功能，在貼合於電子部件材料等構件時，能夠防止電子部件材料的損傷。表面電阻率可基於JIS K 6911來測定(在23℃/50%氛圍下、電極面積：20 cm 2、施加電壓：100 V、施加時間：30秒、使用同心圓電極(探針))。 In some preferred embodiments, the surface resistivity of at least one surface of the adhesive sheet of the present invention is 1.0×10 5 to 1.0×10 11 Ω/□, preferably 1.0×10 6 to 1.0×10 9 Ω/ □. If it is within this range, the antistatic function can be satisfied, and when it is bonded to components such as electronic component materials, damage to the electronic component materials can be prevented. The surface resistivity can be measured based on JIS K 6911 (at 23°C/50% atmosphere, electrode area: 20 cm 2 , applied voltage: 100 V, application time: 30 seconds, using concentric electrodes (probes)).

在一些較佳的實施例中，本發明之黏合片經1至1.5倍360°方向拉伸後，基材層之表面電阻率為1.0×10 5至1.0×10 11Ω/□，較佳為1.0×10 6至1.0×10 9Ω/□，黏合片之表面電阻率為1.0×10 11Ω/□以下。 In some preferred embodiments, after the adhesive sheet of the present invention is stretched 1 to 1.5 times in the 360° direction, the surface resistivity of the base material layer is 1.0×10 5 to 1.0×10 11 Ω/□, preferably 1.0×10 6 to 1.0×10 9 Ω/□, and the surface resistivity of the adhesive sheet is 1.0×10 11 Ω/□ or less.

在一些較佳的實施例中，本發明之黏合片較佳亦滿足下述特性(a)至(d)中之至少一者： 特性(a)：利用下式(1)算出的黏合片之黏合力降低率為80%以上， 黏合力降低率(%)=[(N1-N2)/N1]×100   (1) 其中，N1表示上述黏合片之紫外線照射前的黏合力， N2表示上述黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力； 特性(b)：上述黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力N2為1 N/20 mm以下； 特性(c)：上述黏合片之紫外線照射前的黏合力N1為0.5至40 N/20 mm； 特性(d)：上述黏合片之長度方向(MD方向)的拉伸斷裂強度與寬度方向(TD方向)的拉伸斷裂強度之比(MD方向的拉伸斷裂強度/ TD方向的拉伸斷裂強度)為0.8至1.2。 In some preferred embodiments, the adhesive sheet of the present invention preferably also satisfies at least one of the following characteristics (a) to (d): Characteristic (a): The adhesive sheet calculated using the following formula (1) The adhesive force reduction rate is more than 80%. Adhesion force reduction rate (%) = [(N1-N2)/N1]×100 (1) Among them, N1 represents the adhesive force of the above-mentioned adhesive sheet before ultraviolet irradiation, and N2 represents the above-mentioned adhesive force. The adhesive force N2 of the above-mentioned adhesive sheet after being exposed to ultraviolet light with a cumulative light intensity of 300 mJ/cm 2 is 1 N/20 mm or less; Characteristic (b): The adhesive force N2 of the above-mentioned adhesive sheet after being irradiated with ultraviolet light with a cumulative light intensity of 300 mJ/cm 2 is 1 N/20 mm or less; (c): The adhesive force N1 of the above-mentioned adhesive sheet before ultraviolet irradiation is 0.5 to 40 N/20 mm; Characteristics (d): The tensile breaking strength of the above-mentioned adhesive sheet in the length direction (MD direction) and the width direction (TD direction) ) is 0.8 to 1.2.

在上述特性(a)中，利用上述式(1)算出的黏合片之黏合力降低率更佳為85%以上。In the above characteristic (a), the adhesive force reduction rate of the adhesive sheet calculated using the above formula (1) is more preferably 85% or more.

當黏合力降低率落入上述範圍內時，可充分發揮使用時所需的黏合性的效應，實現優異的黏合性，且在使用後可輕輕剝離，不會對被黏物造成損傷或產生殘膠污染。若黏合力降低率小於80%，剝離操作性差，容易產生殘膠污染。上述黏合力N1及N2例如可以在後述的實例中記載的方法來測定。When the adhesive force reduction rate falls within the above range, the required adhesive effect can be fully exerted during use to achieve excellent adhesive properties, and it can be peeled off gently after use without causing damage or production to the adherend. Residual glue contamination. If the adhesion reduction rate is less than 80%, the peeling operability will be poor and residual adhesive contamination will easily occur. The above-mentioned adhesive forces N1 and N2 can be measured, for example, by the method described in the examples described below.

在上述特性(b)中，黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力N2更佳為0.9 N/20 mm以下，進一步較佳為0.8  N/20 mm以下。 Among the above characteristics (b), the adhesive strength N2 of the adhesive sheet after being irradiated with ultraviolet rays with a cumulative light intensity of 300 mJ/cm 2 is more preferably 0.9 N/20 mm or less, and further preferably 0.8 N/20 mm or less.

當黏合力N2落入上述範圍內時，可具有優異的黏合性，且在使用後可輕輕剝離，不會對被黏物造成損傷或產生殘膠污染。若黏合力N2大於1 N/20 mm，剝離操作性差，容易產生殘膠污染。自具有優異的黏合性的方面考慮，黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力N2較佳為0.01 N/20 mm以上。 When the adhesive force N2 falls within the above range, it can have excellent adhesion and can be gently peeled off after use without causing damage to the adherend or residual glue pollution. If the adhesive force N2 is greater than 1 N/20 mm, the peeling operability will be poor and residual glue contamination will easily occur. From the perspective of excellent adhesiveness, the adhesive force N2 of the adhesive sheet after irradiation with ultraviolet rays with a cumulative light intensity of 300 mJ/cm 2 is preferably 0.01 N/20 mm or more.

本發明中，黏合片受到的紫外線照射係指越過基材層對該黏合片中的黏合劑層之紫外線照射(自基材層側照射)。300 mJ/cm 2的紫外線照射例如可藉由照射強度150 mW/cm 2的紫外線的2秒的照射來實現。 In the present invention, the ultraviolet irradiation received by the adhesive sheet refers to the ultraviolet irradiation of the adhesive layer in the adhesive sheet across the base material layer (irradiation from the base material layer side). Ultraviolet irradiation of 300 mJ/cm 2 can be achieved, for example, by irradiating ultraviolet rays with an intensity of 150 mW/cm 2 for 2 seconds.

在上述特性(c)中，黏合片之紫外線照射前的黏合力N1更佳為1至30 N/20 mm，進一步較佳為2至25 N/20 mm。Among the above characteristics (c), the adhesive force N1 of the adhesive sheet before ultraviolet irradiation is more preferably 1 to 30 N/20 mm, and further preferably 2 to 25 N/20 mm.

當黏合力N1落入上述範圍內時，能夠實現優異的黏合性。若黏合力N1小於0.5 N/20 mm，容易產生由於黏合性不充分而導致黏合片剝落。若黏合力N1大於40 N/20 mm，難以自被黏物上剝落，剝離操作性差，容易產生殘膠污染。When the adhesive force N1 falls within the above range, excellent adhesiveness can be achieved. If the adhesive force N1 is less than 0.5 N/20 mm, the adhesive sheet may peel off due to insufficient adhesion. If the adhesive force N1 is greater than 40 N/20 mm, it will be difficult to peel off from the adherend, the peeling operability will be poor, and residual glue contamination will easily occur.

在上述特性(d)中，黏合片之長度方向(MD方向)的拉伸斷裂強度與寬度方向(TD方向)的拉伸斷裂強度之比(MD方向的拉伸斷裂強度/ TD方向的拉伸斷裂強度)更佳為0.9至1.1。In the above characteristic (d), the ratio of the tensile breaking strength in the length direction (MD direction) of the adhesive sheet to the tensile breaking strength in the width direction (TD direction) (tensile breaking strength in the MD direction / tensile strength in the TD direction) Breaking strength) is more preferably 0.9 to 1.1.

當黏合片之MD方向的拉伸斷裂強度/TD方向的拉伸斷裂強度落入上述範圍內時，黏合片之剝離性優異，且能夠表現出對被黏物的凹凸台階差的良好的追隨性，且黏合片各方向擴展均勻，被加工的電器元器件間隙均勻，便於後道設備自動識別、拾取。若黏合片之MD方向的拉伸斷裂強度/TD方向的拉伸斷裂強度小於0.8或超過1.2，具有黏合片之柔軟性下降，難以得到良好的耐回彈性的傾向，黏合片各方向的伸長率、回彈性、追隨性等力學表現差異較大，擴展不均勻，會導致被加工器件間距不一，不利於後道設備自動識別及拾取。When the tensile breaking strength in the MD direction/the tensile breaking strength in the TD direction of the adhesive sheet falls within the above range, the adhesive sheet has excellent peelability and can show good followability to the uneven step difference of the adherend. , and the adhesive sheet expands evenly in all directions, and the gaps between the processed electrical components are even, which facilitates automatic identification and picking up by downstream equipment. If the tensile breaking strength in the MD direction/the tensile breaking strength in the TD direction of the adhesive sheet is less than 0.8 or exceeds 1.2, the flexibility of the adhesive sheet decreases and it is difficult to obtain good resilience resistance. The elongation in each direction of the adhesive sheet , resilience, followability and other mechanical performance differences are large, and the expansion is uneven, which will lead to uneven spacing between processed devices, which is not conducive to automatic identification and picking of subsequent equipment.

在一些較佳的實施例中，黏合片之拉伸斷裂強度較佳為10至60 MPa，更佳為15至50 MPa。當黏合片之長度方向(MD方向)的拉伸斷裂強度落入上述範圍內時，能較為輕鬆的實現擴展，且能適當地抑制黏合片之破損或撕裂，避免因拉伸後回彈過多導致的黏合片坍塌，進一步影響後道加工過程。上述拉伸斷裂強度例如可以在後述的實例中記載的方法來測定。In some preferred embodiments, the tensile breaking strength of the adhesive sheet is preferably 10 to 60 MPa, more preferably 15 to 50 MPa. When the tensile breaking strength in the length direction (MD direction) of the adhesive sheet falls within the above range, expansion can be achieved more easily, and damage or tearing of the adhesive sheet can be appropriately suppressed to avoid excessive rebound after stretching. The resulting adhesive sheet collapses, further affecting subsequent processing. The tensile breaking strength can be measured, for example, by the method described in Examples described below.

[黏合劑層] 在本發明中，黏合劑層為由黏合劑組合物形成的層。在一個較佳的實施例中，黏合劑層較佳為由包含基礎聚合物、多官能寡聚物及抗靜電劑的黏合劑組合物形成的層。黏合劑組合物的形態沒有特別限制，例如可為水分散型、溶劑型、熱熔型、活性能量射線固化型(例如光固化型)等各種形態的黏合劑組合物。 [Adhesive layer] In the present invention, the adhesive layer is a layer formed of an adhesive composition. In a preferred embodiment, the adhesive layer is preferably a layer formed from an adhesive composition including a base polymer, a multifunctional oligomer and an antistatic agent. The form of the adhesive composition is not particularly limited. For example, the adhesive composition may be in various forms such as water-dispersed type, solvent type, hot melt type, active energy ray curable type (for example, photocurable type).

以下，對本發明之黏合劑組合物的各成分進行詳細說明。Each component of the adhesive composition of the present invention will be described in detail below.

(基礎聚合物) 本發明之黏合劑組合物包含基礎聚合物。作為基礎聚合物，例如可包含丙烯酸系聚合物、橡膠系聚合物、聚酯系聚合物、胺基甲酸酯系聚合物、聚醚系聚合物、有機矽系聚合物、聚醯胺系聚合物、氟系聚合物等。較佳地，黏合劑組合物包含丙烯酸系聚合物作為基礎聚合物。 (base polymer) The adhesive composition of the present invention includes a base polymer. Examples of the base polymer include acrylic polymers, rubber polymers, polyester polymers, urethane polymers, polyether polymers, silicone polymers, and polyamide polymers. materials, fluoropolymers, etc. Preferably, the adhesive composition contains an acrylic polymer as a base polymer.

對基礎聚合物之含量沒有特別限制，自得到充分的黏接可靠性的觀點來看，相對於黏合劑組合物總量(總重量，100質量%)，較佳為30至90質量%，更佳為40至80質量%。藉由將黏合劑組合物中的基礎聚合物之含量調整為上述範圍內，可提供構成體系相容性更好、內聚力更強且對被黏物的黏附性優異的黏合劑組合物。The content of the base polymer is not particularly limited. From the viewpoint of obtaining sufficient bonding reliability, it is preferably 30 to 90 mass %, more preferably 30 to 90 mass % relative to the total amount of the adhesive composition (total weight, 100 mass %). Preferably, it is 40 to 80% by mass. By adjusting the content of the base polymer in the adhesive composition to be within the above range, an adhesive composition with better system compatibility, stronger cohesion and excellent adhesion to the adherend can be provided.

此處揭示的技術中的基礎聚合物較佳為下述單體成分的聚合物：上述單體成分包含軟單體(黏性單體)、硬單體(彈性單體)作為主要單體及與上述主要單體具有共聚性的機能性單體(共聚性單體)。此處主要單體係指構成基礎聚合物之單體成分中的主要成分，即該類單體成分中包含超過70重量%的成分。The base polymer in the technology disclosed here is preferably a polymer with the following monomer components: the above monomer components include soft monomers (viscous monomers), hard monomers (elastic monomers) as main monomers, and A functional monomer (copolymerizable monomer) that is copolymerizable with the above-mentioned main monomer. The main monomer here refers to the main component of the monomer components that constitute the base polymer, that is, such monomer components contain more than 70% by weight.

在一個較佳的實施例中，軟單體(黏性單體)包含(甲基)丙烯酸烷基酯。在本說明書中，術語「(甲基)丙烯酸烷基酯」係指丙烯酸烷基酯及/或甲基丙烯酸烷基酯。In a preferred embodiment, the soft monomer (sticky monomer) contains alkyl (meth)acrylate. In this specification, the term "alkyl (meth)acrylate" refers to alkyl acrylate and/or alkyl methacrylate.

作為(甲基)丙烯酸烷基酯，較佳為烷基的碳原子數為1至20的(甲基)丙烯酸烷基酯。作為烷基的碳原子數為1至20的(甲基)丙烯酸烷基酯之具體例，沒有特別限制，可列舉：(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯及(甲基)丙烯酸二十烷基酯。此等之中，較佳丙烯酸正丁酯(BA)、丙烯酸-2-乙基己酯(2EHA)及丙烯酸乙酯(EA)。(甲基)丙烯酸烷基酯可單獨使用或者組合兩種以上使用。As the (meth)acrylic acid alkyl ester, a (meth)acrylic acid alkyl ester in which the carbon number of the alkyl group is 1 to 20 is preferred. Specific examples of the (meth)acrylic acid alkyl ester in which the alkyl group has 1 to 20 carbon atoms are not particularly limited, and examples thereof include: (meth)n-butyl acrylate, (meth)isobutyl acrylate, (meth)acrylic acid alkyl ester, Secondary butyl methacrylate, tertiary butyl (meth)acrylate, amyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate Ester, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, ( Decyl methacrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, (meth)acrylate Myristyl methacrylate, Pentadecyl (meth)acrylate, Cetyl (meth)acrylate, Heptadecyl (meth)acrylate, Octadecyl (meth)acrylate Alkyl ester, nonadecyl (meth)acrylate and eicosanyl (meth)acrylate. Among these, n-butyl acrylate (BA), 2-ethylhexyl acrylate (2EHA), and ethyl acrylate (EA) are preferred. Alkyl (meth)acrylate can be used alone or in combination of two or more types.

基於基礎聚合物的全部單體成分100重量份，軟單體(黏性單體)之含量較佳為10至90重量份，更佳為15至80重量份。當軟單體之含量在上述範圍內時，黏合劑具備良好的流動性及初黏，能夠較好的潤濕被貼合面，從而得到優異的黏合性。Based on 100 parts by weight of all monomer components of the base polymer, the content of the soft monomer (viscous monomer) is preferably 10 to 90 parts by weight, more preferably 15 to 80 parts by weight. When the content of the soft monomer is within the above range, the adhesive has good fluidity and initial tack, and can better wet the bonded surface, thereby obtaining excellent adhesion.

作為硬單體，可適宜地使用可形成有較高玻璃化轉變點的硬質聚合物的硬單體。硬單體對於提高黏合劑層之內聚強度是有用的。硬單體可單獨使用1種或將2種以上組合使用。As the hard monomer, a hard monomer capable of forming a hard polymer having a relatively high glass transition point can be suitably used. Hard monomers are useful for increasing the cohesive strength of the adhesive layer. A hard monomer can be used individually by 1 type or in combination of 2 or more types.

作為硬單體的非限定性之具體實例，例如可列舉出：丙烯腈(AN)、甲基丙烯酸甲酯(MMA)、丙烯酸甲酯(MA)、乙酸乙烯酯(VAC)、苯乙烯等。Non-limiting specific examples of the hard monomer include acrylonitrile (AN), methyl methacrylate (MMA), methyl acrylate (MA), vinyl acetate (VAC), styrene, and the like.

基於基礎聚合物的全部單體成分100重量份，硬單體之含量較佳為5至80重量份，更佳為10至75重量份。當硬單體之含量在上述範圍內時，能夠為黏合劑體系提供支撐性，進一步提高黏合劑彈性模數、內聚強度及耐熱性，在一些切割過程中能夠較好的避免黏刀、殘膠等現象。Based on 100 parts by weight of all monomer components of the base polymer, the content of the hard monomer is preferably 5 to 80 parts by weight, more preferably 10 to 75 parts by weight. When the content of hard monomer is within the above range, it can provide support for the adhesive system, further improve the elastic modulus, cohesive strength and heat resistance of the adhesive, and can better avoid sticking to the knife and leaving residue during some cutting processes. Glue and other phenomena.

作為機能性單體(共聚性單體)，可適宜地使用具有極性基團之單體。具有極性基團之單體對於在基礎聚合物中導入交聯點、或者提高基礎聚合物的內聚力是有用的。機能性單體可單獨使用1種或將2種以上組合使用。As the functional monomer (copolymerizable monomer), a monomer having a polar group can be suitably used. Monomers with polar groups are useful for introducing cross-linking points into the base polymer or improving the cohesion of the base polymer. The functional monomer can be used individually by 1 type or in combination of 2 or more types.

作為機能性單體的非限定性之具體實例，例如可列舉出含羥基單體(含有羥基之單體)、含羧基單體(含有羧基之單體)、含磺酸基單體、含有磷酸基之單體、含環氧基之單體、含異氰酸基之單體、含醯胺基之單體、具有含氮原子的環之單體、具有琥珀醯亞胺骨架之單體、馬來醯亞胺類單體、衣康醯亞胺類單體、(甲基)丙烯酸胺基烷基酯類單體、(甲基)丙烯酸烷氧基烷基酯類單體、乙烯基醚類單體、烯烴類單體等。此等之中，較佳為選自含羥基單體及含羧基單體中的至少1種。Non-limiting specific examples of functional monomers include hydroxyl group-containing monomers (hydroxyl group-containing monomers), carboxyl group-containing monomers (carboxyl group-containing monomers), sulfonic acid group-containing monomers, and phosphoric acid group-containing monomers. Based monomers, epoxy group-containing monomers, isocyanate group-containing monomers, amide group-containing monomers, monomers with nitrogen-containing rings, monomers with succinimide skeleton, Maleimide monomers, itaconimine monomers, (meth)acrylic acid aminoalkyl ester monomers, (meth)acrylic acid alkoxyalkyl ester monomers, vinyl ethers monomers, olefin monomers, etc. Among these, at least one selected from the group consisting of hydroxyl group-containing monomers and carboxyl group-containing monomers is preferred.

基於基礎聚合物的全部單體成分100重量份，機能性單體之含量較佳為0.5至30重量份，更佳為1至20重量份，進一步較佳為3至15重量份。當機能性單體之含量在上述範圍內時，可很方便的藉由交聯劑調節黏合劑的交聯密度、損耗模數、儲能模數、內聚力等特性，能夠針對不同的貼合面優化黏合性。Based on 100 parts by weight of all monomer components of the base polymer, the content of the functional monomer is preferably 0.5 to 30 parts by weight, more preferably 1 to 20 parts by weight, and further preferably 3 to 15 parts by weight. When the content of functional monomers is within the above range, the cross-linking agent can be easily used to adjust the cross-linking density, loss modulus, storage modulus, cohesion and other characteristics of the adhesive, which can be used for different laminating surfaces. Optimize adhesion.

含羥基單體係指分子內具有至少一個羥基之單體。在用於構成基礎聚合物之單體成分包含含羥基單體的情況下，即，基礎聚合物包含源自含羥基單體之單體單元的情況下，由於形成與被黏物的氫鍵等次價鍵，因此基礎聚合物(適宜的係丙烯酸系聚合物)的內聚力提高，可更加有效地抑制黏合力經時變化，且剝離後對被黏物的殘膠更少，具有更高的聚集性。另外，藉由使基礎聚合物的原料單體含有含羥基單體，在使用交聯劑時，能夠有效地發生與該交聯劑的交聯反應，能夠充分地顯現作為黏合劑的效應。此外，亦可有效地防止剝離操作時的被黏物的破裂。本實施例的基礎聚合物可使用1種含羥基單體，亦可使用2種以上的含羥基單體。Hydroxyl-containing monomers refer to monomers with at least one hydroxyl group in the molecule. When the monomer component used to constitute the base polymer contains a hydroxyl-containing monomer, that is, when the base polymer contains a monomer unit derived from a hydroxyl-containing monomer, hydrogen bonding with the adherend, etc. Secondary valence bond, so the cohesion of the base polymer (suitable acrylic polymer) is improved, which can more effectively suppress changes in the adhesive force over time, and there is less residual glue on the adherend after peeling off, and it has higher aggregation sex. In addition, by making the raw material monomer of the base polymer contain a hydroxyl-containing monomer, when a cross-linking agent is used, a cross-linking reaction with the cross-linking agent can effectively occur, and the effect as a binder can be fully demonstrated. In addition, it can also effectively prevent the adherend from breaking during peeling operations. One type of hydroxyl-containing monomer may be used as the base polymer in this embodiment, or two or more types of hydroxyl-containing monomer may be used.

作為含羥基單體之具體例子，例如可列舉出：(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等(甲基)丙烯酸羥基烷基酯等。Specific examples of the hydroxyl-containing monomer include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, (meth)acrylate )3-hydroxypropyl acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate esters, (meth)acrylic acid hydroxyalkyl esters such as 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, etc.

對含羥基單體之含量沒有特別限定，例如，基於基礎聚合物的全部單體成分100重量份，含羥基單體之含量為0.5至15重量份，較佳1至13重量份。當含羥基單體之含量處於上述範圍內，由於形成與被黏物的氫鍵等次價鍵，因此基礎聚合物(適宜的係丙烯酸系聚合物)的內聚力提高，可更加有效地抑制黏合力經時變化，且剝離後對被黏物的殘膠更少，具有更高的聚集性。含羥基單體之含量小於0.5重量份時，得不到充分的黏接性，同時黏合劑交聯密度過低，內聚強度過低，會導致殘膠的風險增加。含羥基單體之含量大於15重量份時，黏合力變得過大，存在容易產生黏連的擔心。另外，剝離操作時存在容易產生被黏物的破裂的擔心。The content of the hydroxyl-containing monomer is not particularly limited. For example, based on 100 parts by weight of all monomer components of the base polymer, the content of the hydroxyl-containing monomer is 0.5 to 15 parts by weight, preferably 1 to 13 parts by weight. When the content of the hydroxyl-containing monomer is within the above range, the cohesive force of the base polymer (suitable acrylic polymer) is increased due to the formation of secondary valence bonds such as hydrogen bonds with the adherend, which can more effectively suppress the adhesive force. It changes over time, and leaves less residual glue on the adherend after peeling off, and has higher aggregation. When the content of hydroxyl-containing monomer is less than 0.5 parts by weight, sufficient adhesion will not be obtained. At the same time, the cross-linking density of the adhesive is too low and the cohesive strength is too low, which will increase the risk of residual glue. When the content of the hydroxyl-containing monomer exceeds 15 parts by weight, the adhesive force may become too large and adhesion may easily occur. In addition, there is a concern that the adherend may easily break during the peeling operation.

含羧基單體係指分子內具有至少一個羧基之單體。藉由使基礎聚合物的原料單體包含含羧基單體，由於形成與被黏物的氫鍵等次價鍵，因此基礎聚合物(適宜的係丙烯酸系聚合物)的內聚力提高，可更加有效地抑制黏合力經時變化，且剝離後對被黏物的殘膠更少，具有更高的聚集性。另外，藉由使基礎聚合物的原料單體含有含羧基單體，在使用交聯劑時，能夠有效地發生與該交聯劑的交聯反應，能夠充分地顯現作為黏合劑的效應，且亦可有效地防止剝離操作時的被黏物的破裂。Carboxyl-containing monomers refer to monomers with at least one carboxyl group in the molecule. By making the raw material monomer of the base polymer include a carboxyl group-containing monomer, secondary valence bonds such as hydrogen bonds are formed with the adherend, so the cohesion of the base polymer (suitable acrylic polymer) is improved, making it more effective. It effectively suppresses changes in adhesive force over time, leaves less adhesive residue on the adherend after peeling off, and has higher aggregation properties. In addition, by making the raw material monomer of the base polymer contain a carboxyl group-containing monomer, when a cross-linking agent is used, a cross-linking reaction with the cross-linking agent can effectively occur, and the effect as a binder can be fully expressed, and It can also effectively prevent the adherend from breaking during peeling operations.

作為含羧基單體之具體例子，例如可列舉出：丙烯酸、甲基丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、巴豆酸、異巴豆酸、富馬酸、衣康酸、馬來酸、檸康酸、馬來酸酐及衣康酸酐等。此等之中，較佳丙烯酸及甲基丙烯酸。上述含羧基單體可單獨使用任意1種或組合使用2種以上。Specific examples of the carboxyl group-containing monomer include: acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, crotonic acid, isocrotonic acid, fumaric acid, and ethanol. Conic acid, maleic acid, citraconic acid, maleic anhydride and itaconic anhydride, etc. Among these, acrylic acid and methacrylic acid are preferred. Any one type of the above-mentioned carboxyl group-containing monomer may be used alone or two or more types may be used in combination.

對含羧基單體之含量沒有特別限定，例如基於基礎聚合物的全部單體成分100重量份，含羧基單體之含量較佳為0.5至15重量份，更佳為1至12重量份。當含羧基單體之含量處於上述範圍內，由於形成與被黏物的氫鍵等次價鍵，因此基礎聚合物(適宜的係丙烯酸系聚合物)的內聚力提高，可更加有效地抑制黏合力經時變化，且剝離後對被黏物的殘膠更少，具有更高的聚集性。含羧基單體之含量大於15重量份時，黏合力變得過大，存在容易產生黏連的擔心。另外，剝離操作時存在容易產生被黏物的破裂的擔心。含羧基單體之含量小於0.5重量份時，得不到充分的黏接性。The content of the carboxyl group-containing monomer is not particularly limited. For example, based on 100 parts by weight of all monomer components of the base polymer, the content of the carboxyl group-containing monomer is preferably 0.5 to 15 parts by weight, more preferably 1 to 12 parts by weight. When the content of the carboxyl-containing monomer is within the above range, the cohesion of the base polymer (suitable acrylic polymer) is increased due to the formation of secondary valence bonds such as hydrogen bonds with the adherend, which can more effectively suppress the adhesive force. It changes over time, and leaves less residual glue on the adherend after peeling off, and has higher aggregation. When the content of the carboxyl group-containing monomer exceeds 15 parts by weight, the adhesive force may become too large and adhesion may easily occur. In addition, there is a concern that the adherend may easily break during the peeling operation. When the content of the carboxyl group-containing monomer is less than 0.5 parts by weight, sufficient adhesiveness cannot be obtained.

作為含磺酸基單體，例如可列舉出：苯乙烯磺酸、烯丙基磺酸、乙烯基磺酸鈉、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺基丙酯、(甲基)丙烯醯氧基萘磺酸等。Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, sodium vinylsulfonate, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamide propanesulfonic acid, (meth)acrylic acid sulfopropyl ester, (meth)acrylyloxynaphthalenesulfonic acid, etc.

作為含磷酸基單體，例如可列舉出：2-羥基乙基丙烯醯基磷酸酯等。Examples of the phosphoric acid group-containing monomer include 2-hydroxyethylacrylyl phosphate and the like.

作為含環氧基單體，例如可列舉出：(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸-2-乙基縮水甘油醚等含環氧基的丙烯酸酯、烯丙基縮水甘油醚、(甲基)丙烯酸縮水甘油醚等。Examples of the epoxy group-containing monomer include epoxy group-containing acrylates such as (meth)acrylic acid glycidyl ester and (meth)acrylic acid-2-ethyl glycidyl ether, and allyl glycidyl ether. , (meth)acrylic acid glycidyl ether, etc.

作為含異氰酸基單體，例如可列舉出：(甲基)丙烯酸2-異氰酸根合乙酯等。Examples of the isocyanato group-containing monomer include 2-isocyanatoethyl (meth)acrylate.

作為含醯胺基單體，例如可列舉出：(甲基)丙烯醯胺；N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二(正丁基)(甲基)丙烯醯胺、N,N-二(三級丁基)(甲基)丙烯醯胺等N,N-二烷基(甲基)丙烯醯胺；N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺等N-烷基(甲基)丙烯醯胺；N-乙烯基乙醯胺等N-乙烯基羧酸醯胺類；N,N-二甲基胺基丙基(甲基)丙烯醯胺、羥基乙基丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥乙基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-甲氧基乙基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、N-(甲基)丙烯醯基嗎啉等。Examples of the amide group-containing monomer include: (meth)acrylamide; N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide , N,N-dipropyl(meth)acrylamide, N,N-diisopropyl(meth)acrylamide, N,N-di(n-butyl)(meth)acrylamide, N,N-di(tertiary butyl)(meth)acrylamide and other N,N-dialkyl(meth)acrylamide; N-ethyl(meth)acrylamide, N-isopropylamine N-alkyl (meth)acrylamide, N-butyl (meth)acrylamide, N-n-butyl (meth)acrylamide, etc.; N-vinyl N-vinyl carboxylic acid amides such as acetamide; N,N-dimethylaminopropyl (meth)acrylamide, hydroxyethylacrylamide, N-hydroxymethyl (meth)acrylamide Amide, N-hydroxyethyl(meth)acrylamide, N-hydroxymethylpropane(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-methoxy Ethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N- (meth) acryl morpholine, etc.

作為具有含氮原子的環之單體，例如可列舉出：N-乙烯基-2-吡咯啶酮、N-甲基乙烯基吡咯啶酮、N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌𠯤、N-乙烯基吡𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基㗁唑、N-(甲基)丙烯醯基-2-吡咯啶酮、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯基吡咯啶、N-乙烯基嗎啉、N-乙烯基-3-嗎啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁𠯤-2-酮、N-乙烯基-3,5-嗎啉二酮、N-乙烯基吡唑、N-乙烯基異㗁唑、N-乙烯基噻唑、N-乙烯基異噻唑、N-乙烯基噠𠯤等。Examples of the monomer having a ring containing a nitrogen atom include N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, and N-vinylpiperidone. , N-vinyl pyrimidine, N-vinyl piperazine, N-vinyl pyrrole, N-vinyl pyrrole, N-vinylimidazole, N-vinyl 㗁azole, N-(meth)acrylyl- 2-pyrrolidinone, N-(meth)acrylylpiperidine, N-(meth)acrylylpyrrolidine, N-vinylmorpholine, N-vinyl-3-morpholinone, N- Vinyl-2-caprolactam, N-vinyl-1,3-㗁𠯤-2-one, N-vinyl-3,5-morpholindione, N-vinylpyrazole, N-ethylene Isothiazole, N-vinylthiazole, N-vinylisothiazole, N-vinylthiazole, etc.

作為具有琥珀醯亞胺骨架之單體，例如可列舉出：N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧六亞甲基琥珀醯亞胺等。Examples of the monomer having a succinimide skeleton include N-(meth)acryloxymethylenesuccinimide and N-(meth)acrylyl-6-oxohexamethylene. Succinimide, N-(meth)acryl-8-oxyhexamethylenesuccinimide, etc.

作為馬來醯亞胺類，例如可列舉出：N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、N-苯基馬來醯亞胺等。Examples of maleimides include N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide. acyl imine etc.

作為衣康醯亞胺類，例如可列舉出：N-甲基衣康醯亞胺、N-乙基衣康醯亞胺、N-丁基衣康醯亞胺、N-辛基衣康醯亞胺、N-2-乙基己基衣康醯亞胺、N-環己基衣康醯亞胺、N-月桂基衣康醯亞胺等。Examples of itaconidimines include N-methylitaconidimine, N-ethylitaconidimine, N-butylitaconidimine, and N-octylitaconidimine. Imine, N-2-ethylhexyl itaconidimine, N-cyclohexyl itaconidimine, N-lauryl itaconidimine, etc.

作為(甲基)丙烯酸胺基烷基酯類，例如可列舉出：(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二乙基胺基乙酯、(甲基)丙烯酸三級丁基胺基乙酯等。Examples of (meth)acrylic acid aminoalkyl esters include: (meth)acrylic acid aminoethyl ester, (meth)acrylic acid N,N-dimethylaminoethyl ester, (meth)acrylic acid N,N-diethylaminoethyl ester, (meth)acrylic acid tertiary butylaminoethyl ester, etc.

作為(甲基)丙烯酸烷氧基烷基酯類，例如可列舉出：(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸乙氧基丙酯等。Examples of (meth)acrylic acid alkoxyalkyl esters include: (meth)acrylic acid methoxyethyl ester, (meth)acrylic acid ethoxyethyl ester, (meth)acrylic acid propoxyethyl ester Ester, butoxyethyl (meth)acrylate, ethoxypropyl (meth)acrylate, etc.

作為乙烯基醚類，例如可列舉出：甲基乙烯基醚、乙基乙烯基醚等乙烯基烷基醚等。Examples of vinyl ethers include vinyl alkyl ethers such as methyl vinyl ether and ethyl vinyl ether.

作為烯烴類，例如可列舉出：乙烯、丁二烯、異戊二烯、異丁烯等。Examples of olefins include ethylene, butadiene, isoprene, isobutylene, and the like.

得到基礎聚合物的方法沒有特別限定，可適宜採用溶液聚合法、乳液聚合法、本體聚合法、懸浮聚合法、光聚合法等各種已知的聚合方法。例如，可較佳採用溶液聚合法。作為進行溶液聚合時之單體供給方法，可適當採用一次性供給全部單體原料的分批投料方式、連續供給(滴加)方式、分次供給(滴加)方式等。進行溶液聚合時的聚合溫度可根據使用之單體及溶劑的種類、聚合引發劑的種類等而適當選擇，例如可設定為20至170℃左右(典型的係40至140℃左右)。The method of obtaining the base polymer is not particularly limited, and various known polymerization methods such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and photopolymerization can be suitably used. For example, a solution polymerization method may be preferably used. As a monomer supply method when performing solution polymerization, a batch feeding method in which all monomer raw materials are supplied at once, a continuous supply (dropping) method, a divided supply (dropping) method, etc. can be appropriately adopted. The polymerization temperature during solution polymerization can be appropriately selected depending on the types of monomers and solvents used, the type of polymerization initiator, etc., and can be set to about 20 to 170°C (typically about 40 to 140°C), for example.

溶液聚合中使用的溶劑(聚合溶劑)可自現有公知的有機溶劑中適當選擇。例如，可使用選自甲苯等芳族化合物類(典型地為芳族烴類)；乙酸乙酯等乙酸酯類；己烷、庚烷、環己烷等脂族或脂環式烴類；1,2-二氯乙烷等鹵代烷烴類；異丙醇等低級醇類(例如碳原子數1至4的一元醇類)；三級丁基甲基醚等醚類；甲乙酮等酮類等中的任意一種溶劑或兩種以上的混合溶劑。The solvent (polymerization solvent) used in solution polymerization can be appropriately selected from conventionally known organic solvents. For example, it is possible to use aromatic compounds (typically aromatic hydrocarbons) such as toluene; acetic esters such as ethyl acetate; aliphatic or alicyclic hydrocarbons such as hexane, heptane, and cyclohexane; 1 , any of halogenated alkanes such as 2-dichloroethane; lower alcohols such as isopropanol (for example, monohydric alcohols with 1 to 4 carbon atoms); ethers such as tertiary butyl methyl ether; ketones such as methyl ethyl ketone, etc. One solvent or a mixture of two or more solvents.

聚合中使用的引發劑可根據聚合方法的種類自現有公知的聚合引發劑中適當選擇。例如，可較佳使用2,2'-偶氮二異丁腈(AIBN)等偶氮類聚合引發劑中的一種或兩種以上。作為聚合引發劑的其他示例，可列舉：過硫酸鉀等過硫酸鹽；過氧化苯甲醯、過氧化氫等過氧化物類引發劑；苯基取代乙烷等取代乙烷類引發劑；芳族羰基化合物等。作為聚合引發劑的另外的其他示例，可列舉由過氧化物與還原劑的組合得到的氧化還原類引發劑。此類聚合引發劑可單獨使用一種或組合使用兩種以上。聚合引發劑的使用量為通常的使用量即可，例如，相對於全部單體成分100重量份，可自約0.005重量份至約1重量份(典型地為約0.01重量份至約1重量份)的範圍選擇。The initiator used for polymerization can be appropriately selected from conventionally known polymerization initiators according to the type of polymerization method. For example, one or two or more azo polymerization initiators such as 2,2'-azobisisobutyronitrile (AIBN) can be preferably used. Other examples of polymerization initiators include persulfates such as potassium persulfate; peroxide initiators such as benzyl peroxide and hydrogen peroxide; substituted ethane initiators such as phenyl-substituted ethane; and aromatic initiators. Carbonyl compounds, etc. Another example of the polymerization initiator includes a redox initiator obtained by combining a peroxide and a reducing agent. Such polymerization initiators may be used alone or in combination of two or more. The polymerization initiator can be used in a usual amount, for example, from about 0.005 to about 1 part by weight (typically about 0.01 to about 1 part by weight) relative to 100 parts by weight of all monomer components. ) range selection.

在此揭示的技術中的基礎聚合物(適宜的係丙烯酸系聚合物)的重均分子量(Mw)沒有特別限制，例如可為2,000,000以下，較佳為400,000以上。通常情況下重均分子量Mw超過2,000,000時，具有凝聚力因聚合物的纏結帶來的效應而增大從而流動性降低的傾向，有時不能得到足夠的黏合面積而無法進行被黏物的固定。The weight average molecular weight (Mw) of the base polymer (preferably an acrylic polymer) in the technology disclosed here is not particularly limited, but may be, for example, 2,000,000 or less, preferably 400,000 or more. Generally, when the weight average molecular weight Mw exceeds 2,000,000, the cohesive force tends to increase due to the effect of polymer entanglement and the fluidity decreases. In some cases, sufficient bonding area cannot be obtained and the adherend cannot be fixed.

在此，重均分子量(Mw)係指藉由凝膠滲透層析法(GPC)得到的標準聚苯乙烯換算的值。GPC裝置例如可使用型號名「HLC-8320GPC」(柱：TSKgelGMH-H(S)、東曹公司製)。Here, the weight average molecular weight (Mw) refers to a value converted to standard polystyrene obtained by gel permeation chromatography (GPC). For example, the model name "HLC-8320GPC" (column: TSKgelGMH-H(S), manufactured by Tosoh Corporation) can be used as the GPC device.

(多官能寡聚物) 本發明中所用的術語「多官能」係指具有2個或多個官能度。在一些較佳的實施例中，自兼顧黏合劑層之黏接可靠性及UV照射後黏著力降低程度的觀點來看，多官能寡聚物的官能度較佳為2以上，更佳3以上，進一步較佳5以上。 (Polyfunctional oligomer) The term "polyfunctional" as used herein means having 2 or more functionalities. In some preferred embodiments, from the perspective of taking into account both the bonding reliability of the adhesive layer and the degree of reduction in adhesive force after UV irradiation, the functionality of the multifunctional oligomer is preferably 2 or more, and more preferably 3 or more. , further preferably 5 or more.

在一些較佳實施例中，上述多官能寡聚物包含選自由丙烯酸改性樹脂、聚胺酯改性樹脂、環氧改性樹脂、酚醛改性樹脂、聚醚改性樹脂、聚酯改性樹脂及有機矽改性樹脂組成之群中之至少一者。In some preferred embodiments, the above-mentioned multifunctional oligomers include acrylic modified resin, polyurethane modified resin, epoxy modified resin, phenolic modified resin, polyether modified resin, polyester modified resin and At least one member of the group consisting of organic silicon modified resin.

在一些較佳實施例中，上述多官能寡聚物包含聚胺酯改性丙烯酸樹脂、丙烯酸改性聚胺酯樹脂、環氧改性丙烯酸樹脂、環氧改性聚胺酯樹脂、鄰甲酚醛改性樹脂、酚醛改性丙烯酸樹脂、酚醛改性聚胺酯樹脂、酚醛改性環氧樹脂、聚醚改性丙烯酸酯樹脂、聚酯改性丙烯酸酯樹脂及有機矽改性丙烯酸酯樹脂中之至少一者。In some preferred embodiments, the above-mentioned multifunctional oligomers include polyurethane-modified acrylic resin, acrylic-modified polyurethane resin, epoxy-modified acrylic resin, epoxy-modified polyurethane resin, o-cresol-modified resin, phenolic-modified resin, etc. At least one of acrylic resin, phenolic modified polyurethane resin, phenolic modified epoxy resin, polyether modified acrylate resin, polyester modified acrylate resin and silicone modified acrylate resin.

在一些較佳實施例中，多官能寡聚物較佳包含聚胺酯改性丙烯酸酯、環氧改性丙烯酸酯、聚醚改性丙烯酸酯、聚酯改性丙烯酸酯及有機矽改性丙烯酸酯組成之群中之至少一者。In some preferred embodiments, the multifunctional oligomer preferably includes polyurethane-modified acrylate, epoxy-modified acrylate, polyether-modified acrylate, polyester-modified acrylate, and silicone-modified acrylate. At least one of the group.

作為聚胺酯改性丙烯酸酯，可藉由在胺基甲酸酯的骨架中加成了2個以上作為官能基的(甲基)丙烯醯基的胺酯(甲基)丙烯酸酯。胺酯(甲基)丙烯酸酯例如藉由使多元醇、異氰酸酯及羥基(甲基)丙烯酸酯(例如丙烯酸2-羥乙酯、丙烯酸4-羥丁酯)反應而得到。作為異氰酸酯，例如可列舉出：芳族異氰酸酯、脂族異氰酸酯，具體可舉出甲苯二異氰酸酯、異佛爾酮二異氰酸酯及六亞甲基二異氰酸酯。作為胺酯(甲基)丙烯酸酯，例如可列舉出：根上工業株式會社製造之Art Resin UN系列、新中村化學工業株式會社製造之NK Oligo U系列及日本合成化學工業株式會社製造之紫光UV系列。As the polyurethane-modified acrylate, urethane (meth)acrylate can be obtained by adding two or more (meth)acrylyl groups as functional groups to the urethane skeleton. The urethane (meth)acrylate is obtained, for example, by reacting a polyol, an isocyanate and a hydroxy(meth)acrylate (for example, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate). Examples of isocyanates include aromatic isocyanates and aliphatic isocyanates, and specific examples include toluene diisocyanate, isophorone diisocyanate, and hexamethylene diisocyanate. Examples of the urethane (meth)acrylate include: Art Resin UN series manufactured by Negami Industrial Co., Ltd., NK Oligo U series manufactured by Shin-Nakamura Chemical Industry Co., Ltd., and Purple UV series manufactured by Nippon Synthetic Chemical Industry Co., Ltd. .

作為環氧改性丙烯酸酯，可藉由環氧樹脂的環氧基及丙烯酸單體的羧基反應製得，例如可列舉出：在環氧的骨架中加成了2個以上作為官能基的(甲基)丙烯醯基的環氧(甲基)丙烯酸酯。環氧(甲基)丙烯酸酯例如藉由使丙烯酸2-羥乙酯、丙烯酸4-羥丁酯等(甲基)丙烯酸羥烷基酯、(甲基)丙烯酸等與環氧樹脂反應而得到2官能以上的預聚物。由於理論上幾乎所有的環氧基均可被丙烯酸酯化，環氧樹脂可為雙酚A型、酚醛環氧性、酸及酸酐改性的環氧等類型。根據需要引入軟性長鏈已克服環氧樹脂的脆性，引入不飽和鍵提高光固化效率，選擇調節分子量以控制樹脂相容性及固化收縮率等實用效應。作為環氧(甲基)丙烯酸酯，具體例可舉出昭和高分子株式會社製造之Ripoxy SP及Ripoxy VR、帝斯曼的AgiSyn 3050、2020、9750等以及Kyoeisha Chemical Co.,Ltd.製造之環氧酯系列。As an epoxy-modified acrylate, it can be produced by reacting the epoxy group of the epoxy resin and the carboxyl group of the acrylic monomer. Examples include: two or more functional groups added to the epoxy skeleton ( Meth)acrylyl epoxy (meth)acrylate. Epoxy (meth)acrylates are obtained by reacting hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl acrylate and 4-hydroxybutyl acrylate, (meth)acrylic acid, etc., with an epoxy resin. Prepolymers with higher functionality. Since in theory almost all epoxy groups can be acrylated, epoxy resins can be bisphenol A type, novolac epoxy, acid and acid anhydride modified epoxy, etc. Introducing soft long chains as needed has overcome the brittleness of epoxy resin, introducing unsaturated bonds to improve photocuring efficiency, and selectively adjusting molecular weight to control practical effects such as resin compatibility and curing shrinkage. Specific examples of the epoxy (meth)acrylate include Ripoxy SP and Ripoxy VR manufactured by Showa Polymer Co., Ltd., DSM's AgiSyn 3050, 2020, 9750, etc., and Ring manufactured by Kyoeisha Chemical Co., Ltd. Oxyester series.

作為聚醚改性丙烯酸酯，可由環氧乙烷或環氧丙烷與二元醇或多元醇在強鹼中經陰離子開環聚合，得到端羥基聚醚，再經丙烯酸酯化得到聚醚丙烯酸酯。由於酯化反應要在酸性條件下進行，而醚鍵對酸敏感，會被破壞，所以均用酯交換法來製備聚醚丙烯酸酯。一般將端羥基聚醚與過量的丙烯酸乙酯及阻聚劑混合加熱，在催化劑(如鈦酸三異丙酯)作用下發生酯交換反應，產生的乙醇及丙烯酸乙酯形成共沸物而蒸餾出來，經分餾塔，丙烯酸乙酯餾分重新回到反應釜，而乙醇分餾出來，使酯交換反應進行徹底，再把過量的丙烯酸乙酯真空蒸餾除去。作為聚醚改性丙烯酸酯的市售品，例如可列舉出：帝斯曼的AgiSyn 703及kingchem Americas公司生產的高性能CN550等。As polyether-modified acrylate, ethylene oxide or propylene oxide and diol or polyol can be subjected to anionic ring-opening polymerization in a strong base to obtain hydroxyl-terminated polyether, and then acrylic esterification can be performed to obtain polyether acrylate. . Since the esterification reaction must be carried out under acidic conditions, and the ether bond is sensitive to acid and will be destroyed, the transesterification method is used to prepare polyether acrylate. Generally, the hydroxyl-terminated polyether is mixed and heated with excess ethyl acrylate and polymerization inhibitor, and a transesterification reaction occurs under the action of a catalyst (such as triisopropyl titanate). The produced ethanol and ethyl acrylate form an azeotrope and are distilled. Come out, pass through the fractionation tower, the ethyl acrylate fraction returns to the reaction kettle, and the ethanol is fractionated out to complete the transesterification reaction, and then the excess ethyl acrylate is removed by vacuum distillation. Examples of commercially available polyether-modified acrylates include DSM's AgiSyn 703 and Kingchem Americas' high-performance CN550.

作為聚酯改性丙烯酸酯，可由丙烯酸羥基酯與酸酐反應，製得酸酐半加成物，再與聚酯多元醇酯化。亦可由多元酸及多元醇得到聚酯多元醇，再與丙烯酸酯化。聚酯改性丙烯酸酯具有較好的柔韌性及潤濕性。此外，亦可使用胺類改性聚酯丙烯酸酯，可降低氧阻聚，提高UV反應速率以及UV後膠層表面硬度。作為聚酯改性丙烯酸酯的市售品，例如可列舉出：長興化學的6312-100、6331以及巴斯夫的PE44F及PE56F等。As a polyester-modified acrylate, an acid anhydride semi-adduct can be obtained by reacting acrylic hydroxyester with an acid anhydride, and then esterified with a polyester polyol. Polyester polyol can also be obtained from polybasic acid and polyol, and then esterified with acrylic acid. Polyester modified acrylate has good flexibility and wettability. In addition, amine-modified polyester acrylate can also be used, which can reduce oxygen inhibition, increase the UV reaction rate and the surface hardness of the adhesive layer after UV. Examples of commercially available polyester-modified acrylic products include Changxing Chemical's 6312-100 and 6331, and BASF's PE44F and PE56F.

作為有機矽改性丙烯酸酯，可使用矽氫加成法、酯化法、水解法、縮合脫小分子法及胺基甲酸酯化加成法合成，例如使用二氯二甲基矽烷單體及丙烯酸羥乙酯在鹼催化下水解縮合，HEA作為端基引入聚矽氧烷鏈上得到有機矽改性的丙烯酸預聚物。作為有機矽改性丙烯酸酯的市售品，例如可列舉出Bossin的B-818等。As organosilicone modified acrylate, it can be synthesized using silicon hydroaddition method, esterification method, hydrolysis method, condensation removal of small molecules and urethanation addition method, for example, using dichlorodimethylsilane monomer And hydroxyethyl acrylate is hydrolyzed and condensed under alkali catalysis, and HEA is introduced into the polysiloxane chain as a terminal group to obtain an organosilicone-modified acrylic prepolymer. Examples of commercially available silicone-modified acrylates include Bossin's B-818 and the like.

在一些較佳實施例中，相對於基礎聚合物100重量份，多官能寡聚物之含量較佳為20至200重量份，更佳30至150重量份，進一步較佳40至120重量份。當多官能寡聚物之含量落入上述範圍內時，能夠得到充分的黏接性可靠性以及操作性，同時能夠兼顧黏著劑體系較好的相容性、內聚力以及照射紫外線後實現高效減黏的效應。In some preferred embodiments, relative to 100 parts by weight of the base polymer, the content of the multifunctional oligomer is preferably 20 to 200 parts by weight, more preferably 30 to 150 parts by weight, and further preferably 40 to 120 parts by weight. When the content of the multifunctional oligomer falls within the above range, sufficient adhesive reliability and operability can be obtained, and at the same time, the adhesive system can have better compatibility, cohesion, and efficient viscosity reduction after ultraviolet irradiation. effect.

(抗靜電劑) 作為上述黏合劑層形成用組合物中所含的抗靜電劑，例如可列舉出導電性聚合物、導電性無機微粒、金屬微粒或纖維、離子型化合物、離子型界面活性劑等。此等抗靜電劑可單獨使用，亦可混合使用2種以上。 (antistatic agent) Examples of the antistatic agent contained in the adhesive layer forming composition include conductive polymers, conductive inorganic fine particles, metal fine particles or fibers, ionic compounds, ionic surfactants, and the like. These antistatic agents can be used alone, or two or more types can be mixed and used.

＜導電性聚合物＞ 作為上述導電性聚合物，例如可列舉出：聚苯胺、聚吡咯、聚噻吩、聚喹㗁啉、聚乙炔、聚乙烯亞胺、烯丙基胺系聚合物等。此等之中，較佳使用易於形成水溶性導電性聚合物或水分散性導電性聚合物的聚苯胺、聚噻吩等。此等導電性聚合物可單獨使用，亦可混合使用2種以上。 ＜Conductive polymer＞ Examples of the conductive polymer include polyaniline, polypyrrole, polythiophene, polyquinoline, polyacetylene, polyethyleneimine, and allylamine-based polymers. Among these, polyaniline, polythiophene, etc., which are easy to form a water-soluble conductive polymer or a water-dispersible conductive polymer, are preferably used. These conductive polymers may be used alone, or two or more types may be mixed and used.

＜導電性無機微粒＞ 作為上述導電性無機微粒，例如可列舉出：導電性金屬氧化物、碳奈米管、石墨烯、富勒烯、乙炔黑、科琴黑、天然石墨、人造石墨、鈦黑等。此等導電性無機微粒可單獨使用，亦可混合使用2種以上。 ＜Conductive inorganic fine particles＞ Examples of the conductive inorganic fine particles include conductive metal oxides, carbon nanotubes, graphene, fullerene, acetylene black, Ketjen black, natural graphite, artificial graphite, titanium black, and the like. These conductive inorganic fine particles may be used alone, or two or more types may be mixed and used.

作為導電性金屬氧化物，例如可列舉：氧化錫類、氧化銻類、氧化銦類、氧化鋅類等金屬氧化物。作為氧化錫類的導電性微粒，例如除氧化錫以外，可列舉：銻摻雜氧化錫、銦摻雜氧化錫、鋁摻雜氧化錫、鎢摻雜氧化錫、氧化鈦-氧化鈰-氧化錫的複合物、氧化鈦-氧化錫的複合物等。微粒之平均粒徑為1至100 nm，較佳為2至50 nm。Examples of conductive metal oxides include metal oxides such as tin oxides, antimony oxides, indium oxides, and zinc oxides. Examples of tin oxide-based conductive fine particles other than tin oxide include antimony-doped tin oxide, indium-doped tin oxide, aluminum-doped tin oxide, tungsten-doped tin oxide, and titanium oxide-cerium oxide-tin oxide. Compounds, titanium oxide-tin oxide complexes, etc. The average particle diameter of the microparticles is 1 to 100 nm, preferably 2 to 50 nm.

＜金屬微粒或纖維＞＜Metal particles or fibers＞

作為上述金屬微粒或纖維，只要能夠獲得本發明之效應就可使用任意適合的聚合物。例如可列舉出：金、銀、銅、鋁、鎳或其合金構成的微粒、奈米線等。此等金屬微粒或纖維可單獨使用，亦可混合使用2種以上。As the above-mentioned metal particles or fibers, any suitable polymer can be used as long as the effects of the present invention can be obtained. Examples include particles and nanowires made of gold, silver, copper, aluminum, nickel or alloys thereof. These metal particles or fibers may be used alone, or two or more types may be mixed and used.

＜離子型化合物＞ 作為離子型化合物，例如可列舉出：鹼金屬鹽及/或有機陽離子-陰離子鹽等。本發明中所說的「有機陽離子-陰離子鹽」係指其陽離子部由有機物構成的有機鹽，陰離子部可為有機物，亦可為無機物。「有機陽離子-陰離子鹽」亦稱為離子性液體、離子性固體。此等離子型化合物可單獨使用，亦可混合使用2種以上。 ＜Ionic compounds＞ Examples of ionic compounds include alkali metal salts and/or organic cation-anion salts. The "organic cation-anion salt" mentioned in the present invention refers to an organic salt in which the cation part is composed of an organic substance, and the anion part may be an organic substance or an inorganic substance. "Organic cation-anion salts" are also called ionic liquids and ionic solids. This plasma type compound can be used alone, or two or more types can be mixed and used.

鹼金屬鹽可使用鹼金屬的有機鹽及無機鹽。As the alkali metal salt, organic salts and inorganic salts of alkali metal can be used.

作為構成鹼金屬鹽的陽離子部的鹼金屬離子，可列舉鋰、鈉、鉀等各離子。此等鹼金屬離子中，較佳為鋰離子。Examples of the alkali metal ions constituting the cation part of the alkali metal salt include ions such as lithium, sodium, and potassium. Among these alkali metal ions, lithium ions are preferred.

鹼金屬鹽的陰離子部可由有機物構成，亦可由無機物構成。The anion part of the alkali metal salt may be composed of an organic substance or an inorganic substance.

作為構成有機鹽的陰離子部，可列舉例如：CH 3COO -、CF 3COO -、CH 3SO 3 -、CF 3SO 3 -、(CF 3SO 2) 3C -、C 4F 9SO 3 -、C 3F 7COO -、(CF 3SO 2)(CF 3CO)N -、(FSO 2) 2N -、 -O 3S(CF 2) 3SO 3 -、PF 6 -、CO 3 2-、下述通式(1)至(4)所示的陰離子等。 (1)：(C nF 2n+1SO 2) 2N -(其中，n為1至10的整數)、 (2)：CF 2(C mF 2mSO 2) 2N -(其中，m為1至10的整數)、 (3)： -O 3S(CF 2) lSO 3 -(其中，l為1至10的整數)、 (4)：(C pF 2p+1SO 2)N -(C qF 2q+1SO 2) (其中，p、q為1至10的整數)。特別是，由於含有氟原子的陰離子部能夠得到電離性良好的離子化合物，因此較佳使用。 Examples of the anion part constituting the organic salt include: CH 3 COO - , CF 3 COO - , CH 3 SO 3 - , CF 3 SO 3 - , (CF 3 SO 2 ) 3 C - , C 4 F 9 SO 3 - , C 3 F 7 COO - , (CF 3 SO 2 )(CF 3 CO)N - , (FSO 2 ) 2 N - , - O 3 S(CF 2 ) 3 SO 3 - , PF 6 - , CO 3 2- , anions represented by the following general formulas (1) to (4), etc. (1): (C n F 2n+1 SO 2 ) 2 N - (where n is an integer from 1 to 10), (2): CF 2 (C m F 2m SO 2 ) 2 N - (where m is an integer from 1 to 10), (3): - O 3 S(CF 2 ) l SO 3 - (where l is an integer from 1 to 10), (4): (C p F 2p+1 SO 2 ) N - (C q F 2q+1 SO 2 ) (where p and q are integers from 1 to 10). In particular, an anionic part containing a fluorine atom is preferably used because an ionic compound with good ionization properties can be obtained.

作為構成無機鹽的陰離子部，可使用Cl -、Br -、I -、AlCl 4 -、Al 2Cl 7 -、BF 4 -、PF 6 -、ClO 4 -、NO 3 -、AsF 6 -、SbF 6 -、NbF 6 -、TaF 6 -、(CN) 2N -等。 As the anion part constituting the inorganic salt, Cl - , Br - , I - , AlCl 4 - , Al 2 Cl 7 - , BF 4 - , PF 6 - , ClO 4 - , NO 3 - , AsF 6 - , SbF 6 - , NbF 6 - , TaF 6 - , (CN) 2 N - , etc.

作為陰離子部，較佳為(CF 3SO 2) 2N -、(C 2F 5SO 2) 2N -等上述通式(1)表示的(全氟烷基磺醯)亞胺，特別較佳為(CF 3SO 2) 2N -表示的三氟甲磺醯亞胺。 As the anion part, (CF 3 SO 2 ) 2 N - , (C 2 F 5 SO 2 ) 2 N - and other (perfluoroalkylsulfonyl)imines represented by the above general formula (1) are preferred, and particularly preferred Preferred is trifluoromethanesulfonimide represented by (CF 3 SO 2 ) 2 N - .

作為鹼金屬的有機鹽，具體可列舉：乙酸鈉、藻酸鈉、木質素磺酸鈉、甲苯磺酸鈉、LiCF 3SO 3、Li(CF 3SO 2) 2N、Li(CF 3SO 2) 2N、Li(C 2F 5SO 2) 2N、Li(C 4F 9SO 2) 2N、Li(CF 3SO 2) 3C、KO 3S(CF 2) 3SO 3K、LiO 3S(CF 2) 3SO 3K等，其中，較佳為LiCF 3SO 3、Li(CF 3SO 2) 2N、Li(C 2F 5SO 2) 2N、Li(C 4F 9SO 2) 2N、Li(CF 3SO 2) 3C等，更佳為Li(CF 3SO 2) 2N、Li(C 2F 5SO 2) 2N、Li(C 4F 9SO 2) 2N等含氟醯亞胺鋰鹽，特別較佳為(全氟烷基磺醯)亞胺鋰鹽。 Specific examples of organic salts of alkali metals include sodium acetate, sodium alginate, sodium lignosulfonate, sodium toluenesulfonate, LiCF 3 SO 3 , Li(CF 3 SO 2 ) 2 N, Li(CF 3 SO 2 ) 2 N, Li(C 2 F 5 SO 2 ) 2 N, Li(C 4 F 9 SO 2 ) 2 N, Li(CF 3 SO 2 ) 3 C, KO 3 S(CF 2 ) 3 SO 3 K, LiO 3 S(CF 2 ) 3 SO 3 K, etc., among which, LiCF 3 SO 3 , Li(CF 3 SO 2 ) 2 N, Li(C 2 F 5 SO 2 ) 2 N, Li(C 4 F 9 SO 2 ) 2 N, Li(CF 3 SO 2 ) 3 C, etc., more preferably Li(CF 3 SO 2 ) 2 N, Li(C 2 F 5 SO 2 ) 2 N, Li(C 4 F 9 SO 2 ) 2N and other fluorine-containing lithium imine salts, particularly preferably (perfluoroalkylsulfonyl)imine lithium salts.

作為鹼金屬的無機鹽，可列舉高氯酸鋰、碘化鋰。Examples of inorganic salts of alkali metals include lithium perchlorate and lithium iodide.

本發明中使用的有機陽離子-陰離子鹽由陽離子成分及陰離子成分構成，上述陽離子成分由有機物構成。作為陽離子成分，具體可列舉：吡啶鎓陽離子、哌啶鎓陽離子、吡咯啶鎓陽離子、具有吡咯啉骨架的陽離子、具有吡咯骨架的陽離子、咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子、吡唑鎓陽離子、吡唑啉鎓陽離子、四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子等。The organic cation-anion salt used in the present invention is composed of a cation component and an anion component, and the cation component is composed of an organic substance. Specific examples of the cation component include: pyridinium cation, piperidinium cation, pyrrolidinium cation, cation having a pyrroline skeleton, cation having a pyrrole skeleton, imidazolium cation, tetrahydropyrimidinium cation, and dihydropyrimidinium cation. , pyrazolium cation, pyrazolinium cation, tetraalkyl ammonium cation, trialkyl sulfonium cation, tetraalkyl phosphonium cation, etc.

作為陰離子成分，可列舉例如：Cl -、Br -、I -、AlCl 4 -、Al 2Cl 7 -、BF 4 -、PF 6 -、ClO 4 -、NO 3 -、CH 3COO -、CF 3COO -、CH 3SO 3 -、CF 3SO 3 -、(CF 3SO 2) 3C -、AsF 6 -、SbF 6 -、NbF 6 -、TaF 6 -、(CN) 2N -、C 4F 9SO 3 -、C 3F 7COO -、(CF 3SO 2)(CF 3CO)N -、(FSO 2) 2N -、 -O 3S(CF 2) 3SO 3 -、下述通式(1)至(4)表示的陰離子等。 (1)：(C nF 2n+1SO 2) 2N -(其中，n為1至10的整數)、 (2)：CF 2(C mF 2mSO 2) 2N -(其中，m為1至10的整數)、 (3)： -O 3S(CF 2) lSO 3 -(其中，l為1至10的整數)、 (4)：(C pF 2p+1SO 2)N -(C qF 2q+1SO 2)、(其中，p、q為1至10的整數)。其中，特別是，由於含有氟原子的陰離子成分能夠得到電離性良好的離子化合物，因此較佳使用。 Examples of the anionic component include Cl - , Br - , I - , AlCl 4 - , Al 2 Cl 7 - , BF 4 - , PF 6 - , ClO 4 - , NO 3 - , CH 3 COO - , CF 3 COO - , CH 3 SO 3 - , CF 3 SO 3 - , (CF 3 SO 2 ) 3 C - , AsF 6 - , SbF 6 - , NbF 6 - , TaF 6 - , (CN) 2 N - , C 4 F 9 SO 3 - , C 3 F 7 COO - , (CF 3 SO 2 )(CF 3 CO)N - , (FSO 2 ) 2 N - , - O 3 S(CF 2 ) 3 SO 3 - , as follows Anions represented by general formulas (1) to (4), etc. (1): (C n F 2n+1 SO 2 ) 2 N - (where n is an integer from 1 to 10), (2): CF 2 (C m F 2m SO 2 ) 2 N - (where m is an integer from 1 to 10), (3): - O 3 S(CF 2 ) l SO 3 - (where l is an integer from 1 to 10), (4): (C p F 2p+1 SO 2 ) N - (C q F 2q+1 SO 2 ), (where p and q are integers from 1 to 10). Among them, in particular, anionic components containing fluorine atoms are preferably used because an ionic compound with good ionization properties can be obtained.

在一些較佳實施例中，有機陽離子-陰離子鹽較佳為含氮鎓鹽、含硫鎓鹽或含磷鎓鹽，更佳使用由下述通式(A)至(E)表示的有機陽離子成分及陰離子成分形成的鹽。此係因為能表現出優異的抗靜電能力。 In some preferred embodiments, the organic cation-anion salt is preferably a nitrogen-containing onium salt, a sulfur-containing onium salt or a phosphorus-containing onium salt, and more preferably organic cations represented by the following general formulas (A) to (E) are used A salt formed from components and anionic components. This is because it can show excellent antistatic ability.

式(A)中，Ra表示碳數4至20的烴基，Rb及Rc分別獨立地表示氫或碳數1至16的烴基。需要說明的是，Ra、Rb及Rc可包含雜原子。此外，氮原子藉由雙鍵進行鍵合時，不存在Rc。In formula (A), Ra represents a hydrocarbon group having 4 to 20 carbon atoms, and Rb and Rc each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. In addition, Ra, Rb and Rc may contain heteroatoms. In addition, when the nitrogen atom is bonded through a double bond, Rc does not exist.

式(B)中，Rd表示碳數2至20的烴基，Re、Rf及Rg分別獨立地表示氫或碳數1至16的烴基。Rd、Re、Rf及Rg可包含雜原子。In formula (B), Rd represents a hydrocarbon group having 2 to 20 carbon atoms, and Re, Rf, and Rg each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. Rd, Re, Rf and Rg may contain heteroatoms.

式(C)中，Rh表示碳數2至20的烴基，Ri、Rj及Rk分別獨立地表示氫或碳數1至16的烴基。Rh、Ri、Rj及Rk可包含雜原子。In formula (C), Rh represents a hydrocarbon group having 2 to 20 carbon atoms, and Ri, Rj, and Rk each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. Rh, Ri, Rj and Rk may contain heteroatoms.

式(D)中，Z表示氮、硫、或磷原子，Rl、Rm、Rn及Ro分別獨立地表示碳數1至20的烴基，且可包含雜原子。其中，Z為硫原子時，不存在Ro。In formula (D), Z represents a nitrogen, sulfur, or phosphorus atom, and Rl, Rm, Rn, and Ro each independently represent a hydrocarbon group having 1 to 20 carbon atoms, and may contain a heteroatom. Among them, when Z is a sulfur atom, Ro does not exist.

式(E)中，Rp表示碳數1至18的烴基，且可包含雜原子。In formula (E), Rp represents a hydrocarbon group having 1 to 18 carbon atoms, and may contain a heteroatom.

作為式(A)表示的陽離子，例如可列舉出吡啶鎓陽離子、哌啶鎓陽離子、吡咯啶鎓陽離子、具有吡咯啉骨架的陽離子、具有吡咯骨架的陽離子等。作為具體例，例如可列舉出：1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-3,4-二甲基吡啶鎓陽離子等吡啶鎓陽離子；1-丙基哌啶鎓陽離子、1-戊基哌啶鎓陽離子、1,1-二甲基哌啶鎓陽離子、1-甲基-1-乙基哌啶鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子、1-甲基-1-丁基哌啶鎓陽離子、1-甲基-1-戊基哌啶鎓陽離子、1-甲基-1-己基哌啶鎓陽離子、1-甲基-1-庚基哌啶鎓陽離子、1-乙基-1-丙基哌啶鎓陽離子、1-乙基-1-丁基哌啶鎓陽離子、1-乙基-1-戊基哌啶鎓陽離子、1-乙基-1-己基哌啶鎓陽離子、1-乙基-1-庚基哌啶鎓陽離子、1,1-二丙基哌啶鎓陽離子、1-丙基-1-丁基哌啶鎓陽離子、1,1-二丁基哌啶鎓陽離子等哌啶鎓陽離子；1,1-二甲基吡咯啶鎓陽離子、1-甲基-1-乙基吡咯啶鎓陽離子、1-甲基-1-丙基吡咯啶鎓陽離子、1-甲基-1-丁基吡咯啶鎓陽離子、1-甲基-1-戊基吡咯啶鎓陽離子、1-甲基-1-己基吡咯啶鎓陽離子、1-甲基-1-庚基吡咯啶鎓陽離子、1-乙基-1-丙基吡咯啶鎓陽離子、1-乙基-1-丁基吡咯啶鎓陽離子、1-乙基-1-戊基吡咯啶鎓陽離子、1-乙基-1-己基吡咯啶鎓陽離子、1-乙基-1-庚基吡咯啶鎓陽離子、1,1-二丙基吡咯啶鎓陽離子、1-丙基-1-丁基吡咯啶鎓陽離子、1,1-二丁基吡咯啶鎓陽離子等吡咯啶鎓陽離子；2-甲基-1-吡咯啉陽離子、1-乙基-2-苯基吲哚陽離子、1,2-二甲基吲哚陽離子、1-乙基咔唑陽離子等。Examples of the cation represented by formula (A) include pyridinium cation, piperidinium cation, pyrrolidinium cation, cation having a pyrroline skeleton, cation having a pyrrole skeleton, and the like. Specific examples include: 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl- Pyridinium cations such as 4-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation; 1-propylpiperidinium cation, 1 -Pentylpiperidinium cation, 1,1-dimethylpiperidinium cation, 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1- Methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidine onium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl- 1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1,1-dipropylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, 1, 1-Dibutylpiperidinium cation and other piperidinium cations; 1,1-dimethylpyrrolidinium cation, 1-methyl-1-ethylpyrrolidinium cation, 1-methyl-1-propyl Pyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl -1-Heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, 1,1-dipropylpyrrolidinium cation, 1-propyl-1-butyl Pyrrolidinium cation, 1,1-dibutylpyrrolidinium cation and other pyrrolidinium cations; 2-methyl-1-pyrroline cation, 1-ethyl-2-phenylindole cation, 1,2- Dimethylindole cation, 1-ethylcarbazole cation, etc.

作為式(B)表示的陽離子，例如可列舉出：咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子等。作為具體例，例如可列舉出：1,3-二甲基咪唑鎓陽離子、1,3-二乙基咪唑鎓陽離子、1-乙基-3-甲基咪唑鎓陽離子、1-丁基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子、1-辛基-3-甲基咪唑鎓陽離子、1-癸基-3-甲基咪唑鎓陽離子、1-十二烷基-3-甲基咪唑鎓陽離子、1-十四烷基-3-甲基咪唑鎓陽離子、1,2-二甲基-3-丙基咪唑鎓陽離子、1-乙基-2,3-二甲基咪唑鎓陽離子、1-丁基-2,3-二甲基咪唑鎓陽離子、1-己基-2,3-二甲基咪唑鎓陽離子等咪唑鎓陽離子；1,3-二甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3-三甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,5-四甲基-1,4,5,6-四氫嘧啶鎓陽離子等四氫嘧啶鎓陽離子；1,3-二甲基-1,4-二氫嘧啶鎓陽離子、1,3-二甲基-1,6-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,4-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,6-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,6-二氫嘧啶鎓陽離子等二氫嘧啶鎓陽離子等及1-丁基-3-甲基吡啶鎓雙醯亞胺等1-丁基-3-甲基吡啶鎓陽離子。Examples of the cation represented by formula (B) include imidazolium cation, ectohydropyrimidinium cation, dihydropyrimidinium cation, and the like. Specific examples include: 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, and 1-butyl-3 -Methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecane Base-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3- Dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation and other imidazolium cations; 1,3-dimethyl- 1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,4-tetramethyl- Tetrahydropyrimidinium cations such as 1,4,5,6-tetrahydropyrimidinium cation and 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation; 1,3- Dimethyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4-dihydropyrimidinium cation Cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidinium cation, 1,2,3, Dihydropyrimidinium cations such as 4-tetramethyl-1,6-dihydropyrimidinium cations and 1-butyl-3-methylpyridinium cations such as 1-butyl-3-methylpyridinium biscarboxylimide cation.

作為式(C)表示的陽離子，例如可列舉出：吡唑鎓陽離子、二氫化吡唑鎓陽離子等。作為具體例，例如可列舉出：1-甲基吡唑鎓陽離子、3-甲基吡唑鎓陽離子、1-乙基-2-甲基二氫化吡唑鎓陽離子等。Examples of the cation represented by formula (C) include pyrazolium cation, dihydropyrazolium cation, and the like. Specific examples include 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methyldihydropyrazolium cation, and the like.

作為式(D)表示的陽離子，可列舉出：四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子等。此外，亦可使用此等陽離子的烷基的一部分被取代為烯基、烷氧基、或環氧基的陽離子。此外，Rl、Rm、Rn及Ro如上所述為碳數1至20的烴基，較佳為碳數1至20的烷基。此外，Rl、Rm、Rn及Ro亦可為芳環基或脂環基。作為式(D)表示的陽離子之具體例，可列舉出：四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子、上述烷基的一部分被取代為烯基、烷氧基、進而環氧基而得到的陽離子等。作為具體例，例如可列舉出：N,N-二甲基-N-乙基-N-丙基銨陽離子、N,N-二甲基-N-乙基-N-丁基銨陽離子、N,N-二甲基-N-乙基-N-戊基銨陽離子、N,N-二甲基-N-乙基-N-己基銨陽離子、N,N-二甲基-N-乙基-N-庚基銨陽離子、N,N-二甲基-N-乙基-N-壬基銨陽離子、N,N-二甲基-N,N-二丙基銨陽離子、N,N-二甲基-N-丙基-N-丁基銨陽離子、N,N-二甲基-N-丙基-N-戊基銨陽離子、N,N-二甲基-N-丙基-N-己基銨陽離子、N,N-二甲基-N-丙基-N-庚基銨陽離子、N,N-二甲基-N-丁基-N-己基銨陽離子、N,N-二甲基-N-丁基-N-庚基銨陽離子、N,N-二甲基-N-戊基-N-己基銨陽離子、N,N-二甲基-N,N-二己基銨陽離子、三甲基庚基銨陽離子、N,N-二乙基-N-甲基-N-丙基銨陽離子、N,N-二乙基-N-甲基-N-戊基銨陽離子、N,N-二乙基-N-甲基-N-庚基銨陽離子、N,N-二乙基-N-丙基-N-戊基銨陽離子、三乙基甲基銨陽離子、三乙基丙基銨陽離子、三乙基戊基銨陽離子、三乙基庚基銨陽離子、N,N-二丙基-N-甲基-N-乙基銨陽離子、N,N-二丙基-N-甲基-N-戊基銨陽離子、N,N-二丙基-N-丁基-N-己基銨陽離子、N,N-二丙基-N,N-二己基銨陽離子、N,N-二丁基-N-甲基-N-戊基銨陽離子、N,N-二丁基-N-甲基-N-己基銨陽離子、三辛基甲基銨陽離子、N-甲基-N-乙基-N-丙基-N-戊基銨陽離子、四甲基銨陽離子、四乙基銨陽離子、四丁基銨陽離子、四己基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、二烯丙基二甲基銨陽離子等四烷基銨陽離子；三甲基鋶陽離子、三乙基鋶陽離子、三丁基鋶陽離子、三己基鋶陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子等三烷基鋶陽離子；四甲基鏻陽離子、四乙基鏻陽離子、四丁基鏻陽離子、四己基鏻陽離子、鏻陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等四烷基鏻陽離子等。Examples of the cation represented by formula (D) include tetraalkyl ammonium cation, trialkyl sulfonium cation, tetraalkyl phosphonium cation, and the like. In addition, a cation in which part of the alkyl group of these cations is substituted with an alkenyl group, an alkoxy group, or an epoxy group can also be used. In addition, Rl, Rm, Rn and Ro are hydrocarbon groups having 1 to 20 carbon atoms, preferably alkyl groups having 1 to 20 carbon atoms. In addition, Rl, Rm, Rn and Ro may also be an aromatic ring group or an alicyclic group. Specific examples of the cation represented by formula (D) include tetraalkyl ammonium cation, trialkyl sulfonium cation, tetraalkyl phosphonium cation, a part of the above-mentioned alkyl group substituted with an alkenyl group, an alkoxy group, and further Cations derived from epoxy groups, etc. Specific examples include: N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N ,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl -N-Heptyl ammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N- Dimethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N -Hexylammonium cation, N,N-dimethyl-N-propyl-N-heptyl ammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N,N-dimethyl N-N-butyl-N-heptyl ammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N-dihexylammonium cation, Trimethylheptyl ammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N, N-diethyl-N-methyl-N-heptyl ammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylmethyl ammonium cation, triethylpropyl ammonium cation, triethypentylammonium cation, triethyheptyl ammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N- Methyl-N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N- Dibutyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N- Ethyl-N-propyl-N-pentylammonium cation, tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrahexylammonium cation, tributylethylammonium cation, trimethyldecane Ammonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammonium cation, etc. Tetraalkylammonium cation; trimethylsulfonium cation, triethylsulfonium cation, tributylsulfonium cation, trihexylsulfonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecyl Trialkylsulfonium cations such as sulfonium cation; tetramethylphosphonium cation, tetraethylphosphonium cation, tetrabutylphosphonium cation, tetrahexylphosphonium cation, phosphonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation , trimethyldecylphosphonium cations and other tetraalkylphosphonium cations.

本發明中，在上述陽離子成分中，自能獲得特別優異的抗靜電能的方面考慮，較佳使用式(A)表示的陽離子(特別是1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-3,4-二甲基吡啶鎓陽離子等吡啶鎓陽離子)、式(D)表示的陽離子(特別是三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等非對稱的四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、二烯丙基二甲基銨陽離子、縮水甘油基三甲基銨陽離子等)等。In the present invention, among the above-mentioned cationic components, it is preferable to use a cation represented by the formula (A) (especially 1-ethylpyridinium cation, 1-butylpyridinium cation) in terms of obtaining particularly excellent antistatic energy. cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl pyridinium cations such as -3,4-dimethylpyridinium cation), cations represented by formula (D) (especially triethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, trimethyldecylphosphonium cation, etc. Asymmetric tetraalkyl ammonium cation, trialkyl sulfonium cation, tetraalkyl phosphonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, diene Propyl dimethyl ammonium cation, glycidyl trimethyl ammonium cation, etc.).

作為式(E)表示的陽離子之具體例，可列舉出具有例如甲基、乙基、丙基、丁基、己基、辛基、壬基、癸基、十二烷基、十三烷基、十四烷基、十八烷基等碳數1至18的烷基作為Rp的鋶鹽。Specific examples of the cation represented by formula (E) include, for example, methyl, ethyl, propyl, butyl, hexyl, octyl, nonyl, decyl, dodecyl, tridecyl, Alkyl groups having 1 to 18 carbon atoms such as tetradecyl and octadecyl are used as the sulfonium salt of Rp.

作為上述陰離子成分，只要能夠與上述陽離子成分一起形成離子性液體，就可使用任意適合的陰離子成分。例如可列舉出：Cl -、Br -、I -、AlCl 4 -、Al 2Cl 7 -、BF 4 -、PF 6 -、ClO 4 -、NO 3 -、CH 3COO -、CF 3COO -、CH 3SO 3 -、CF 3SO 3 -、(CF 3SO 2) 2N -、(CF 3SO 2) 3C -、AsF 6 -、SbF 6 -、NbF 6 -、TaF 6 -、F(HF) n -、(CN) 2N -、C 4F 9SO 3 -、(C 2F 5SO 2) 2N -、C 3F 7COO -、(CF 3SO 2)(CF 3CO)N等。疏水性的陰離子成分具有不易滲出至黏合劑表面的傾向，自低污染性的觀點考慮較佳使用。進而，包含氟原子的陰離子成分能夠獲得低熔點的離子型化合物，因此特別較佳使用。 As the anionic component, any appropriate anionic component may be used as long as it can form an ionic liquid together with the cationic component. Examples include: Cl - , Br - , I - , AlCl 4 - , Al 2 Cl 7 - , BF 4 - , PF 6 - , ClO 4 - , NO 3 - , CH 3 COO - , CF 3 COO - , CH 3 SO 3 - , CF 3 SO 3 - , (CF 3 SO 2 ) 2 N - , (CF 3 SO 2 ) 3 C - , AsF 6 - , SbF 6 - , NbF 6 - , TaF 6 - , F( HF) n - , (CN) 2 N - , C 4 F 9 SO 3 - , (C 2 F 5 SO 2 ) 2 N - , C 3 F 7 COO - , (CF 3 SO 2 )(CF 3 CO) N etc. Hydrophobic anionic components tend to be less likely to bleed onto the surface of the adhesive, and are preferably used from the viewpoint of low contamination. Furthermore, an anionic component containing a fluorine atom is particularly preferably used because an ionic compound with a low melting point can be obtained.

本發明中的有機陽離子-陰離子鹽可自上述陽離子成分及陰離子成分的組合中適當選擇且使用，例如可列舉出：1-丁基吡啶鎓四氟硼酸鹽、1-丁基吡啶鎓六氟磷酸鹽、1-丁基-3-甲基吡啶鎓四氟硼酸鹽、1-丁基-3-甲基吡啶鎓三氟甲烷磺酸鹽、1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)亞胺鹽、1-丁基-3-甲基吡啶鎓雙(五氟乙磺醯基)亞胺鹽、1-己基吡啶鎓四氟硼酸鹽、1,1-二甲基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-乙基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-丙基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-丁基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-戊基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-己基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-庚基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-丙基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-丁基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-戊基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-己基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-庚基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1,1-二丙基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-丙基-1-丁基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1,1-二丁基吡咯啶鎓雙(三氟甲磺醯基)亞胺鹽、1-丙基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-戊基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1,1-二甲基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-乙基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-丙基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-丁基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-戊基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-己基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基-1-庚基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-丙基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-丁基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-戊基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-己基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-1-庚基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1,1-二丙基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1-丙基-1-丁基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1,1-二丁基哌啶鎓雙(三氟甲磺醯基)亞胺鹽、1,1-二甲基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-乙基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-丙基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-丁基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-戊基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-己基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-庚基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-丙基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-丁基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-戊基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-己基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-庚基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1,1-二丙基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-丙基-1-丁基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1,1-二丁基吡咯啶鎓雙(五氟乙磺醯基)亞胺鹽、1-丙基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-戊基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1,1-二甲基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-乙基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-丙基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-丁基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-戊基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-己基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-甲基-1-庚基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-丙基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-丁基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-戊基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-己基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-1-庚基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1,1-二丙基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1-丙基-1-丁基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、1,1-二丁基哌啶鎓雙(五氟乙磺醯基)亞胺鹽、2-甲基-1-吡咯啉四氟硼酸鹽、1-乙基-2-苯基吲哚四氟硼酸鹽、1,2-二甲基吲哚四氟硼酸鹽、1-乙基咔唑四氟硼酸鹽、1-乙基-3-甲基咪唑鎓四氟硼酸鹽、1-乙基-3-甲基咪唑鎓乙酸鹽、1-乙基-3-甲基咪唑鎓三氟乙酸鹽、1-乙基-3-甲基咪唑鎓七氟丁酸鹽、1-乙基-3-甲基咪唑鎓三氟甲烷磺酸鹽、1-乙基-3-甲基咪唑鎓全氟丁磺酸鹽、1-乙基-3-甲基咪唑鎓雙氰胺鹽、1-乙基-3-甲基咪唑鎓雙(三氟甲磺醯基)亞胺鹽、1-乙基-3-甲基咪唑鎓雙(五氟乙磺醯基)亞胺鹽、1-乙基-3-甲基咪唑鎓三(三氟甲磺醯基)甲基化物、1-丁基-3-甲基咪唑鎓四氟硼酸鹽、1-丁基-3-甲基咪唑鎓六氟磷酸鹽、1-丁基-3-甲基咪唑鎓三氟乙酸鹽、1-丁基-3-甲基咪唑鎓七氟丁酸鹽、1-丁基-3-甲基咪唑鎓三氟甲烷磺酸鹽、1-丁基-3-甲基咪唑鎓全氟丁磺酸鹽、1-丁基-3-甲基咪唑鎓雙(三氟甲磺醯基)亞胺鹽、1-己基-3-甲基咪唑鎓溴化物、1-己基-3-甲基咪唑鎓氯化物、1-己基-3-甲基咪唑鎓四氟硼酸鹽、1-己基-3-甲基咪唑鎓六氟磷酸鹽、1-己基-3-甲基咪唑鎓三氟甲烷磺酸鹽、1-辛基-3-甲基咪唑鎓四氟硼酸鹽、1-辛基-3-甲基咪唑鎓六氟磷酸鹽、1-己基-2,3-二甲基咪唑鎓四氟硼酸鹽、1,2-二甲基-3-丙基咪唑鎓雙(三氟甲磺醯基)亞胺鹽、1-甲基吡唑鎓四氟硼酸鹽、3-甲基吡唑鎓四氟硼酸鹽、N,N-二甲基-N-乙基-N-丙基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-乙基-N-丁基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-乙基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-乙基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-乙基-N-庚基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-乙基-N-壬基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N,N-二丙基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丙基-N-丁基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丙基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丙基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丙基-N-庚基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丁基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丁基-N-庚基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-戊基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N,N-二己基銨雙(三氟甲磺醯基)亞胺鹽、三甲基庚基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二乙基-N-甲基-N-丙基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二乙基-N-甲基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二乙基-N-甲基-N-庚基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二乙基-N-丙基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、三乙基丙基銨雙(三氟甲磺醯基)亞胺鹽、三乙基戊基銨雙(三氟甲磺醯基)亞胺鹽、三乙基庚基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二丙基-N-甲基-N-乙基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二丙基-N-甲基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二丙基-N-丁基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二丙基-N,N-二己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二丁基-N-甲基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二丁基-N-甲基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、三辛基甲基銨雙(三氟甲磺醯基)亞胺鹽、N-甲基-N-乙基-N-丙基-N-戊基銨雙(三氟甲磺醯基)亞胺鹽、1-丁基吡啶鎓(三氟甲磺醯基)三氟乙醯胺鹽、1-丁基-3-甲基吡啶鎓(三氟甲磺醯基)三氟乙醯胺鹽、1-乙基-3-甲基咪唑鎓(三氟甲磺醯基)三氟乙醯胺鹽、四己基銨雙(三氟甲磺醯基)亞胺鹽、二烯丙基二甲基銨四氟硼酸鹽、二烯丙基二甲基銨三氟甲烷磺酸鹽、二烯丙基二甲基銨雙(三氟甲磺醯基)亞胺鹽、二烯丙基二甲基銨雙(五氟乙磺醯基)亞胺鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨四氟硼酸鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨三氟甲烷磺酸鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨雙(三氟甲磺醯基)亞胺鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨雙(五氟乙磺醯基)亞胺鹽、縮水甘油基三甲基銨三氟甲烷磺酸鹽、縮水甘油基三甲基銨雙(三氟甲磺醯基)亞胺鹽、縮水甘油基三甲基銨雙(五氟乙磺醯基)亞胺鹽、二烯丙基二甲基雙(五氟乙磺醯基)亞胺鹽等。The organic cation-anion salt in the present invention can be appropriately selected and used from the combination of the above-mentioned cationic components and anionic components. Examples thereof include: 1-butylpyridinium tetrafluoroborate and 1-butylpyridinium hexafluorophosphoric acid. Salt, 1-butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonate) Fluoromethanesulfonyl)imine salt, 1-butyl-3-methylpyridinium bis(pentafluoroethylsulfonyl)imine salt, 1-hexylpyridinium tetrafluoroborate, 1,1-dimethyl 1-Methylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-methyl-1-ethylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-methyl-1-propanol 1-Methyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-methyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-methyl-1-pentanol 1-Methyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-methyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-methyl-1-heptyl Pyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-ethyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-ethyl-1-butyl Pyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-ethyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1-ethyl-1-hexylpyrrole Bis(trifluoromethanesulfonyl)imide salt, 1-ethyl-1-heptylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1,1-dipropylpyrrolidinium Bis(trifluoromethanesulfonyl)imine salt, 1-propyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide salt, 1,1-dibutylpyrrolidinium bis( Trifluoromethanesulfonyl)imine salt, 1-propylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-pentylpiperidinium bis(trifluoromethanesulfonyl)imine salt , 1,1-dimethylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-methyl-1-ethylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1 -Methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-methyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1 -Methyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-methyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1- Methyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-ethyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1- Ethyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-ethyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1- Ethyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-ethyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1,1 -Dipropylpiperidinium bis(trifluoromethanesulfonyl)imine salt, 1-propyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1,1-di Butylpiperidinium bis(trifluoromethanesulfonyl)imide salt, 1,1-dimethylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-methyl-1-ethyl Pyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-methyl-1-propylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-methyl-1-butyl Pyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-methyl-1-pentylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-methyl-1-hexylpyrrole Bis(pentafluoroethylsulfonyl)imine salt, 1-methyl-1-heptylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl-1-propylpyrrole Bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl-1-butylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl-1-pentylpyrrole Bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl-1-hexylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl-1-heptylpyrrolidine Onium bis(pentafluoroethylsulfonyl)imide salt, 1,1-dipropylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-propyl-1-butylpyrrolidinium bis (Pentafluoroethylsulfonyl)imine salt, 1,1-dibutylpyrrolidinium bis(pentafluoroethylsulfonyl)imide salt, 1-propylpiperidinium bis(pentafluoroethylsulfonyl)imide )imine salt, 1-pentylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1,1-dimethylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1- Methyl-1-ethylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1-methyl-1-propylpiperidinium bis(pentafluoroethylsulfonyl)imide salt, 1- Methyl-1-butylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1-methyl-1-pentylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1- Methyl-1-hexylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1-methyl-1-heptylpiperidinium bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl 1-propylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1-ethyl-1-butylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1-ethyl 1-Pentylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1-ethyl-1-hexylpiperidinium bis(pentafluoroethylsulfonyl)imide salt, 1-ethyl -1-Heptylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1,1-dipropylpiperidinium bis(pentafluoroethylsulfonyl)imide salt, 1-propyl-1 -Butylpiperidinium bis(pentafluoroethylsulfonyl)imine salt, 1,1-dibutylpiperidinium bis(pentafluoroethylsulfonyl)imide salt, 2-methyl-1-pyrrole Phenoline tetrafluoroborate, 1-ethyl-2-phenylindole tetrafluoroborate, 1,2-dimethylindole tetrafluoroborate, 1-ethylcarbazole tetrafluoroborate, 1-ethylcarbazole tetrafluoroborate 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium trifluoroacetate, 1-ethyl-3- Methylimidazolium heptafluorobutyrate, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium perfluorobutanesulfonate, 1-ethyl -3-Methylimidazolium dicyandiamide salt, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt, 1-ethyl-3-methylimidazolium bis(penta) Fluoroethylsulfonyl)imide salt, 1-ethyl-3-methylimidazolium tris(trifluoromethanesulfonyl)methide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-Butyl-3-methylimidazolium hexafluorophosphate, 1-butyl-3-methylimidazolium trifluoroacetate, 1-butyl-3-methylimidazolium heptafluorobutyrate, 1 -Butyl-3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium perfluorobutanesulfonate, 1-butyl-3-methylimidazolium bis(trifluorobutanesulfonate) Methanesulfonyl)imide salt, 1-hexyl-3-methylimidazolium bromide, 1-hexyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium tetrafluoroborate, 1-hexyl-3-methylimidazolium hexafluorophosphate, 1-hexyl-3-methylimidazolium trifluoromethanesulfonate, 1-octyl-3-methylimidazolium tetrafluoroborate, 1- Octyl-3-methylimidazolium hexafluorophosphate, 1-hexyl-2,3-dimethylimidazolium tetrafluoroborate, 1,2-dimethyl-3-propylimidazolium bis(trifluorophosphate) Methanesulfonyl)imine salt, 1-methylpyrazolium tetrafluoroborate, 3-methylpyrazolium tetrafluoroborate, N,N-dimethyl-N-ethyl-N-propyl Ammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dimethyl-N-ethyl-N-butylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dimethyl Methyl-N-ethyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dimethyl-N-ethyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide base) imine salt, N,N-dimethyl-N-ethyl-N-heptyl ammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dimethyl-N-ethyl- N-Nonylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dimethyl-N,N-dipropylammonium bis(trifluoromethanesulfonyl)imine salt, N,N -Dimethyl-N-propyl-N-butylammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dimethyl-N-propyl-N-pentylammonium bis(trifluoromethyl) Methanesulfonyl)imine salt, N,N-dimethyl-N-propyl-N-hexylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dimethyl-N-propyl -N-Heptyl ammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dimethyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dimethyl-N-butyl-N-heptyl ammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dimethyl-N-pentyl-N-hexylammonium bis( Trifluoromethanesulfonyl)imine salt, N,N-dimethyl-N,N-dihexylammonium bis(trifluoromethanesulfonyl)imide salt, trimethylheptyl ammonium bis(trifluoromethyl Sulfonyl)imine salt, N,N-diethyl-N-methyl-N-propylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-diethyl-N-methyl N-pentylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-diethyl-N-methyl-N-heptyl ammonium bis(trifluoromethanesulfonyl)imine salt , N,N-diethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide salt, triethypropylammonium bis(trifluoromethanesulfonyl)imide salt , triethypentylammonium bis(trifluoromethanesulfonyl)imide salt, triethyheptyl ammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dipropyl-N-methyl N-ethylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dipropyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imine salt , N,N-dipropyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dipropyl-N,N-dihexylammonium bis(trifluoromethyl) Methanesulfonyl)imine salt, N,N-dibutyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imine salt, N,N-dibutyl-N- Methyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide salt, trioctylmethylammonium bis(trifluoromethanesulfonyl)imide salt, N-methyl-N-ethyl-N -Propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide salt, 1-butylpyridinium (trifluoromethanesulfonyl)trifluoroacetamide salt, 1-butyl-3- Methylpyridinium (trifluoromethanesulfonyl) trifluoroacetamide salt, 1-ethyl-3-methylimidazolium (trifluoromethanesulfonyl) trifluoroacetamide salt, tetrahexylammonium bis( Trifluoromethanesulfonyl)imine salt, diallyldimethylammonium tetrafluoroborate, diallyldimethylammonium trifluoromethanesulfonate, diallyldimethylammonium bis(trifluoromethanesulfonate) Fluoromethanesulfonyl)imine salt, diallyldimethylammonium bis(pentafluoroethylsulfonyl)imine salt, N,N-diethyl-N-methyl-N-(2-methyl Oxyethyl)ammonium tetrafluoroborate, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium trifluoromethanesulfonate, N,N-diethyl -N-Methyl-N-(2-methoxyethyl)ammonium bis(trifluoromethanesulfonyl)imide salt, N,N-diethyl-N-methyl-N-(2-methyl Oxyethyl) ammonium bis(pentafluoroethylsulfonyl)imine salt, glycidyltrimethylammonium trifluoromethanesulfonate, glycidyltrimethylammonium bis(trifluoromethanesulfonyl)imide Amine salt, glycidyltrimethylammonium bis(pentafluoroethylsulfonyl)imine salt, diallyldimethylbis(pentafluoroethylsulfonyl)imine salt, etc.

作為有機陽離子-陰離子鹽的合成方法，只要能夠得到作為目標的有機陽離子-陰離子鹽，就沒有特別限定，通常，可使用文獻「离子性液体-開発の最前線と未来-」[株式會社CMC出版發行]中記載的鹵化物法、氫氧化物法、酸酯法、絡合法、或中和法等。此外，亦可採用市售的有機陽離子-陰離子鹽。The method for synthesizing an organic cation-anion salt is not particularly limited as long as the target organic cation-anion salt can be obtained. Generally, the literature "Ionic Liquids-Kaixen no Frontier Future-" [CMC Publishing Co., Ltd.] can be used The halide method, hydroxide method, acid ester method, complex method, or neutralization method described in the "Issue". In addition, commercially available organic cation-anion salts may also be used.

＜離子型界面活性劑＞ 作為上述離子型界面活性劑，例如可列舉出：陽離子型界面活性劑(例如，四級銨鹽型、鏻鹽型、鋶鹽型等)、陰離子型界面活性劑(例如羧酸型、磺酸鹽型、硫酸鹽型、磷酸鹽型、亞磷酸鹽型等)、兩性離子型界面活性劑(例如磺基甜菜鹼型、烷基甜菜鹼型、烷基咪唑鎓甜菜鹼型等)、非離子型界面活性劑(例如多元醇衍生物、β-環糊精包合物、山梨糖醇酐脂肪酸單酯/二酯、聚氧化烯烴衍生物、氧化胺等)等。此等金離子型界面活性劑可單獨使用，亦可混合使用2種以上。 ＜Ionic surfactant＞ Examples of the ionic surfactant include cationic surfactants (for example, quaternary ammonium salt type, phosphonium salt type, sulfonate salt type, etc.), anionic surfactants (for example, carboxylic acid type, sulfonic acid type, etc.) Salt type, sulfate type, phosphate type, phosphite type, etc.), zwitterionic surfactants (such as sulfobetaine type, alkyl betaine type, alkyl imidazolium betaine type, etc.), nonionic Type surfactants (such as polyol derivatives, β-cyclodextrin inclusion compounds, sorbitan fatty acid monoesters/diesters, polyoxyalkylene derivatives, amine oxides, etc.), etc. These gold ion-type surfactants can be used alone, or two or more types can be mixed and used.

在一些較佳實施例中，相對於基礎聚合物100重量份，抗靜電劑之含量較佳為0.0001至20重量份，更佳0.0002至10重量份。當將抗靜電劑之含量設為上述範圍內時，能夠獲得充分的抗靜電效應，充分抑制剝離時產生的剝離靜電，有效抑制靜電擊穿等現象發生，從而避免或減輕對被黏物造成損傷。In some preferred embodiments, the content of the antistatic agent is preferably 0.0001 to 20 parts by weight, more preferably 0.0002 to 10 parts by weight relative to 100 parts by weight of the base polymer. When the content of the antistatic agent is set within the above range, a sufficient antistatic effect can be obtained, the peeling static electricity generated during peeling can be fully suppressed, and the occurrence of electrostatic breakdown and other phenomena can be effectively suppressed, thereby avoiding or reducing damage to the adherend. .

在本發明之黏合劑組合物中，在不損害本發明之效應的範圍內含有任意適當的其他成分。作為此類其他成分，可列舉例如交聯劑、光引發劑(光聚合引發劑)等。The adhesive composition of the present invention may contain any appropriate other components within the scope that does not impair the effects of the present invention. Examples of such other components include crosslinking agents, photoinitiators (photopolymerization initiators), and the like.

(交聯劑)(cross-linking agent)

在本發明中，為了調節內聚力等，黏合劑組合物較佳包含交聯劑。交聯劑可使用通常使用的交聯劑，例如可列舉環氧系交聯劑、異氰酸酯系交聯劑、三聚氰胺系交聯劑、氮丙啶系交聯劑、金屬螯合物系交聯劑等。藉由使用此等交聯劑，能夠產生適度的交聯反應，充分提高凝聚力，保證良好的黏附性，且能夠有效地防止剝離操作時的被黏物的破裂。此等交聯劑可單獨使用，亦可混合兩種以上使用。In the present invention, in order to adjust cohesion and the like, the adhesive composition preferably contains a cross-linking agent. As the cross-linking agent, commonly used cross-linking agents can be used, and examples thereof include epoxy-based cross-linking agents, isocyanate-based cross-linking agents, melamine-based cross-linking agents, aziridine-based cross-linking agents, and metal chelate-based cross-linking agents. wait. By using such cross-linking agents, a moderate cross-linking reaction can be generated, fully improving cohesion, ensuring good adhesion, and effectively preventing the adherend from breaking during peeling operations. These cross-linking agents may be used alone, or two or more types may be mixed and used.

作為環氧系交聯劑，可沒有特別限制地使用一分子中具有兩個以上環氧基的化合物。較佳一分子中具有3至5個環氧基的環氧系交聯劑。環氧系交聯劑可單獨使用一種或組合使用兩種以上。As the epoxy cross-linking agent, a compound having two or more epoxy groups in one molecule can be used without particular limitation. An epoxy cross-linking agent having 3 to 5 epoxy groups per molecule is preferred. The epoxy cross-linking agent can be used individually by 1 type or in combination of 2 or more types.

作為環氧系交聯劑之具體例，沒有特別限制，可列舉例如：雙酚A、表氯醇型的環氧系樹脂、伸乙基縮水甘油醚、N,N,N',N'-四縮水甘油基間苯二甲胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚甘油多縮水甘油醚等。作為環氧系交聯劑的市售品，可列舉三菱瓦斯化學公司製造之商品名「TETRAD-C」及商品名「TETRAD-X」、DIC公司製造之商品名「EPICLON CR-5L」、長瀨化成公司製造之商品名「DENACOL EX-512」、日產化學工業公司製造之商品名「TEPIC-G」等。Specific examples of the epoxy cross-linking agent are not particularly limited, and examples include bisphenol A, epichlorohydrin type epoxy resin, ethyl glycidyl ether, N,N,N',N'- Tetraglycidyl m-xylylenediamine, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, polyethylene glycol di Glycidyl ether, polyglycerol polyglycidyl ether, etc. Examples of commercially available epoxy cross-linking agents include the trade names "TETRAD-C" and "TETRAD-X" manufactured by Mitsubishi Gas Chemical Co., Ltd., the trade names "EPICLON CR-5L" manufactured by DIC Corporation, and the long-lasting The trade name is "DENACOL EX-512" manufactured by Sekasei Co., Ltd., the trade name "TEPIC-G" manufactured by Nissan Chemical Industry Co., Ltd., etc.

環氧系交聯劑的使用量沒有特別限制，例如，基於基礎聚合物100重量份，較佳為0.01至3重量份，更佳為0.05至2重量份。 The usage amount of the epoxy cross-linking agent is not particularly limited. For example, based on 100 parts by weight of the base polymer, it is preferably 0.01 to 3 parts by weight, and more preferably 0.05 to 2 parts by weight.

在含有環氧系交聯劑的實施例中，環氧系交聯劑的環氧當量較佳為80至120g/eq。In the embodiment containing an epoxy cross-linking agent, the epoxy equivalent weight of the epoxy cross-linking agent is preferably 80 to 120 g/eq.

作為異氰酸酯系交聯劑，可較佳使用多官能異氰酸酯(係指每一分子具有平均兩個以上異氰酸酯基的化合物，包括具有異氰脲酸酯結構的化合物)。異氰酸酯系交聯劑可單獨使用一種或組合使用兩種以上。As the isocyanate-based cross-linking agent, polyfunctional isocyanate (which refers to a compound having an average of two or more isocyanate groups per molecule, including compounds having an isocyanurate structure) can be preferably used. The isocyanate cross-linking agent can be used individually by 1 type or in combination of 2 or more types.

作為多官能異氰酸酯的實例，可列舉脂族多異氰酸酯類、脂環族多異氰酸酯類、芳族多異氰酸酯類等。Examples of polyfunctional isocyanates include aliphatic polyisocyanates, alicyclic polyisocyanates, aromatic polyisocyanates, and the like.

作為脂族多異氰酸酯類之具體例，可列舉：1,2-伸乙基二異氰酸酯；1,2-丁二異氰酸酯、1,3-丁二異氰酸酯、1,4-丁二異氰酸酯等丁二異氰酸酯；1,2-己二異氰酸酯、1,3-己二異氰酸酯、1,4-己二異氰酸酯、1,5-己二異氰酸酯、1,6-己二異氰酸酯、2,5-己二異氰酸酯等己二異氰酸酯；2-甲基-1,5-戊二異氰酸酯、3-甲基-1,5-戊二異氰酸酯、離胺酸二異氰酸酯等。Specific examples of aliphatic polyisocyanates include: 1,2-ethylidene diisocyanate; butanediisocyanates such as 1,2-butanediisocyanate, 1,3-butanediisocyanate, and 1,4-butanediisocyanate. ; 1,2-hexamethylene diisocyanate, 1,3-hexamethylene diisocyanate, 1,4-hexamethylene diisocyanate, 1,5-hexamethylene diisocyanate, 1,6-hexamethylene diisocyanate, 2,5-hexamethylene diisocyanate, etc. Diisocyanate; 2-methyl-1,5-pentanediisocyanate, 3-methyl-1,5-pentanediisocyanate, lysine diisocyanate, etc.

作為脂環族多異氰酸酯類之具體例，可列舉：異佛爾酮二異氰酸酯；1,2-環己基二異氰酸酯、1,3-環己基二異氰酸酯、1,4-環己基二異氰酸酯等環己基二異氰酸酯；1,2-環戊基二異氰酸酯、1,3-環戊基二異氰酸酯等環戊基二異氰酸酯；氫化苯二亞甲基二異氰酸酯、氫化甲苯二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化四甲基二甲苯二異氰酸酯、4,4'-二環己基甲烷二異氰酸酯等。Specific examples of alicyclic polyisocyanates include isophorone diisocyanate; cyclohexyl diisocyanate such as 1,2-cyclohexyl diisocyanate, 1,3-cyclohexyl diisocyanate, and 1,4-cyclohexyl diisocyanate. Diisocyanates; cyclopentyl diisocyanates such as 1,2-cyclopentyl diisocyanate and 1,3-cyclopentyl diisocyanate; hydrogenated xylylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated diphenylmethane diisocyanate , hydrogenated tetramethylxylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, etc.

作為芳族多異氰酸酯類之具體例，可列舉：2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、2,4'-二苯基甲烷二異氰酸酯、2,2'-二苯基甲烷二異氰酸酯、4,4'-二苯醚二異氰酸酯、2-硝基聯苯-4,4'-二異氰酸酯、2,2'-二苯基丙烷-4,4'-二異氰酸酯、3,3'-二甲基二苯基甲烷-4,4'-二異氰酸酯、4,4'-二苯基丙烷二異氰酸酯、間苯二異氰酸酯、對苯二異氰酸酯、萘-1,4-二異氰酸酯、萘-1,5-二異氰酸酯、3,3'-二甲氧基聯苯-4,4'-二異氰酸酯、苯二亞甲基-1,4-二異氰酸酯、苯二亞甲基-1,3-二異氰酸酯等。Specific examples of aromatic polyisocyanates include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and 2,4'-diphenylmethane. Diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4'-diphenyl ether diisocyanate, 2-nitrobiphenyl-4,4'-diisocyanate, 2,2'-diphenylpropane -4,4'-diisocyanate, 3,3'-dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-diphenylpropane diisocyanate, isophthalic diisocyanate, terephthalic diisocyanate Isocyanate, naphthalene-1,4-diisocyanate, naphthalene-1,5-diisocyanate, 3,3'-dimethoxybiphenyl-4,4'-diisocyanate, xylylene-1,4- Diisocyanate, xylylene-1,3-diisocyanate, etc.

作為較佳的多官能異氰酸酯，可例示每一分子平均具有3個以上異氰酸酯基的多官能異氰酸酯。上述三官能以上的異氰酸酯可為雙官能或三官能以上的異氰酸酯的多聚物(典型地為二聚物或三聚物)、衍生物(例如多元醇與兩分子以上的多官能異氰酸酯的加成反應產物)、聚合物等。可列舉例如：二苯基甲烷二異氰酸酯的二聚物或三聚物、己二異氰酸酯的異氰脲酸酯形式(異氰脲酸酯結構的三聚物加成物)、三羥甲基丙烷與甲苯二異氰酸酯的反應產物、三羥甲基丙烷與己二異氰酸酯的反應產物、多亞甲基多苯基異氰酸酯、聚醚多異氰酸酯、聚酯多異氰酸酯等多官能異氰酸酯。作為上述多官能異氰酸酯的市售品，可列舉旭化成化學公司製造之商品名「DURANATE TPA-100」、日本聚胺酯工業公司製造之商品名「CORONATE L」、日本聚胺酯工業公司製造之商品名「CORONATE HL」、日本聚胺酯工業公司製造之商品名「CORONATE HK」、日本聚胺酯工業公司製造之商品名「CORONATE HX」、日本聚胺酯工業公司製造之商品名「CORONATE2096」等。Preferable polyfunctional isocyanates include polyfunctional isocyanates having an average of three or more isocyanate groups per molecule. The above-mentioned trifunctional or higher isocyanate may be a multipolymer (typically a dimer or trimer) or a derivative (for example, the addition of a polyol and two or more molecules of polyfunctional isocyanate) of a bifunctional or trifunctional or higher isocyanate. reaction products), polymers, etc. Examples include dimers or trimers of diphenylmethane diisocyanate, isocyanurate forms of hexamethylene diisocyanate (trimer adducts of isocyanurate structures), trimethylolpropane The reaction product with toluene diisocyanate, the reaction product of trimethylolpropane and hexamethylene diisocyanate, polymethylene polyphenyl isocyanate, polyether polyisocyanate, polyester polyisocyanate and other multifunctional isocyanates. Commercially available products of the above-mentioned polyfunctional isocyanate include the trade name "DURANATE TPA-100" manufactured by Asahi Kasei Chemical Co., Ltd., the trade name "CORONATE L" manufactured by Nippon Polyurethane Industry Co., Ltd., and the trade name "CORONATE HL" manufactured by Nippon Polyurethane Industry Co., Ltd. ", the trade name "CORONATE HK" manufactured by Nippon Polyurethane Industry Co., Ltd., the trade name "CORONATE HX" manufactured by Nippon Polyurethane Industry Co., Ltd., the trade name "CORONATE2096" manufactured by Nippon Polyurethane Industry Co., Ltd., etc.

在含有異氰酸酯系交聯劑的實施例中，異氰酸酯系交聯劑中異氰酸酯基含量(NCO含量)較佳為7至15%。In the embodiment containing an isocyanate cross-linking agent, the isocyanate group content (NCO content) in the isocyanate cross-linking agent is preferably 7 to 15%.

異氰酸酯系交聯劑的使用量沒有特別限制，例如，基於基礎聚合物100重量份，較佳為0.1至6重量份，較佳為0.5至5重量份。 The usage amount of the isocyanate cross-linking agent is not particularly limited. For example, based on 100 parts by weight of the base polymer, it is preferably 0.1 to 6 parts by weight, and preferably 0.5 to 5 parts by weight.

作為三聚氰胺系交聯劑的實例，可列舉出：六羥甲基三聚氰胺、丁基化三聚氰胺樹脂(例如，可由DIC株式會社獲得的商品名「SUPER BECKAMINE J-820-60N」)等。Examples of melamine-based crosslinking agents include hexamethylol melamine, butylated melamine resin (for example, trade name "SUPER BECKAMINE J-820-60N" available from DIC Co., Ltd.).

三聚氰胺系交聯劑的使用量沒有特別限制，例如，基於基礎聚合物100重量份，較佳為0.5至12重量份，較佳為1至8重量份。The usage amount of the melamine cross-linking agent is not particularly limited. For example, based on 100 parts by weight of the base polymer, it is preferably 0.5 to 12 parts by weight, and preferably 1 to 8 parts by weight.

作為氮丙啶系交聯劑的實例，例如可列舉出：三羥甲基丙烷三[3-(1-氮丙啶基)丙酸酯]、三羥甲基丙烷三[3-(1-(2-甲基)氮丙啶基丙酸酯)]。作為氮丙啶系交聯劑，可使用市售品。例如可使用Chemitite PZ-33、Chemitite DZ-22E等Chemitite系列(NipponShokubai Co.,Ltd.製)等。Examples of the aziridine-based crosslinking agent include: trimethylolpropane tris[3-(1-aziridinyl)propionate], trimethylolpropane tris[3-(1- (2-methyl)aziridinylpropionate)]. As the aziridine-based cross-linking agent, commercially available products can be used. For example, Chemitite series (manufactured by Nippon Shokubai Co., Ltd.) such as Chemitite PZ-33 and Chemitite DZ-22E can be used.

作為金屬螯合物系交聯劑的實例，例如可列舉出：鋁螯合物系化合物、鈦螯合物系化合物、鋅螯合物系化合物、鋯螯合物系化合物、鐵螯合物系化合物、鈷螯合物系化合物、鎳螯合物系化合物、錫螯合物系化合物、錳螯合物系化合物、鉻螯合物系化合物等。Examples of metal chelate-based crosslinking agents include aluminum chelate-based compounds, titanium chelate-based compounds, zinc chelate-based compounds, zirconium chelate-based compounds, and iron chelate-based compounds. compounds, cobalt chelate compounds, nickel chelate compounds, tin chelate compounds, manganese chelate compounds, chromium chelate compounds, etc.

交聯劑的使用量相對於基礎聚合物100重量份較佳為0.01至15重量份。藉由將交聯劑之用量設為上述範圍內，可提高黏合劑的內聚力，防止在被黏物上產生殘膠，且亦具有適度的流動性，有對被黏物得到良好的潤濕性，進而得到密合性的傾向。在一些實施例中，自避免因過度的內聚力提高而引起的黏性降低的觀點出發，交聯劑相對於基礎聚合物100重量份的使用量更佳為10重量份以下。The usage amount of the cross-linking agent is preferably 0.01 to 15 parts by weight relative to 100 parts by weight of the base polymer. By setting the dosage of the cross-linking agent within the above range, the cohesion of the adhesive can be improved to prevent the generation of adhesive residue on the adherend. It also has moderate fluidity and good wettability to the adherend. , and then obtain the tendency of adhesion. In some embodiments, from the perspective of avoiding a decrease in viscosity due to excessive increase in cohesion, the usage amount of the cross-linking agent is preferably 10 parts by weight or less relative to 100 parts by weight of the base polymer.

為了更有效地進行上述交聯反應，亦可使用交聯催化劑。作為交聯催化劑，例如可較佳使用錫系催化劑(例如二月桂酸二辛基錫)。交聯催化劑的使用量沒有特別限制，例如相對於基礎聚合物100重量份，較佳為0.0001至1重量份。In order to carry out the above-mentioned cross-linking reaction more efficiently, a cross-linking catalyst may also be used. As the crosslinking catalyst, for example, a tin-based catalyst (eg, dioctyltin dilaurate) can be preferably used. The usage amount of the crosslinking catalyst is not particularly limited. For example, it is preferably 0.0001 to 1 part by weight relative to 100 parts by weight of the base polymer.

(光引發劑) 作為光引發劑，可列舉例如：苯偶姻醚系光聚合引發劑、苯乙酮系光聚合引發劑、α‑酮醇系光聚合引發劑、芳族磺醯氯系光聚合引發劑、光活性肟系光聚合引發劑、苯偶姻系光聚合引發劑、苯偶醯系光聚合引發劑、二苯甲酮系光聚合引發劑、縮酮系光聚合引發劑、9-氧硫𠮿系光聚合引發劑等。 (Photoinitiator) Examples of the photoinitiator include benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-ketol-based photopolymerization initiators, and aromatic sulfonyl chloride-based photopolymerization initiators. Polymerization initiator, photoactive oxime-based photopolymerization initiator, benzoin-based photopolymerization initiator, benzoyl-based photopolymerization initiator, benzophenone-based photopolymerization initiator, ketal-based photopolymerization initiator, 9 -oxygen sulfur𠮿 It is a photopolymerization initiator, etc.

作為苯偶姻醚系光聚合引發劑，可列舉例如：苯偶姻甲醚、苯偶姻***、苯偶姻丙醚、苯偶姻異丙醚、苯偶姻異丁醚、2 ,2‑二甲氧基‑1 ,2‑二苯基乙烷‑1‑酮、茴香醚甲醚等。作為苯乙酮系光聚合引發劑，可列舉例如：2 ,2‑二乙氧基苯乙酮、2 ,2‑二甲氧基‑2‑苯基苯乙酮、1‑羥基環己基苯基酮、4‑苯氧基二氯苯乙酮、4‑(三級丁基)二氯苯乙酮等。作為α‑酮醇系光聚合引發劑，可列舉例如：2‑甲基‑2‑羥基苯丙酮、1‑[4‑(2‑羥基乙基)苯基]‑2‑甲基丙烷‑1‑酮等。作為芳族磺醯氯系光聚合引發劑，可列舉例如：2‑萘磺醯氯等。作為光活性肟系光聚合引發劑，可列舉例如：1‑苯基‑1 ,1‑丙烷二酮‑2‑(o‑乙氧基羰基)‑肟等。作為苯偶姻系光聚合引發劑，可列舉例如苯偶姻等。作為苯偶醯系光聚合引發劑，可列舉例如苯偶醯等。作為二苯甲酮系光聚合引發劑，可列舉例如二苯甲酮、苯甲醯基苯甲酸、3 ,3 '‑二甲基‑4‑甲氧基二苯甲酮、聚乙烯基二苯甲酮、α‑羥基環己基苯基酮等。作為縮酮系光聚合引發劑，可列舉例如：苯偶醯二甲基縮酮等。作為9-氧硫𠮿系光聚合引發劑，可列舉例如：9-氧硫𠮿、2‑氯9-氧硫𠮿、2‑甲基9-氧硫𠮿、2 ,4‑二甲基9-氧硫𠮿、異丙基9-氧硫𠮿、2 ,4‑二異丙基9-氧硫𠮿、十二烷基9-氧硫𠮿等。Examples of benzoin ether photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2,2- Dimethoxy-1,2-diphenylethane-1-one, anisole methyl ether, etc. Examples of acetophenone-based photopolymerization initiators include: 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, 4-(tertiary butyl)dichloroacetophenone, etc. Examples of α-ketool photopolymerization initiators include 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane-1- Ketones etc. Examples of aromatic sulfonyl chloride-based photopolymerization initiators include 2-naphthalene sulfonyl chloride and the like. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1, 1-propanedione-2-(o-ethoxycarbonyl)-oxime, and the like. Examples of benzoin-based photopolymerization initiators include benzoin and the like. Examples of the benzilyl-based photopolymerization initiator include benzilyl and the like. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, and polyvinyl diphenyl Methyl ketone, α-hydroxycyclohexyl phenyl ketone, etc. Examples of the ketal photopolymerization initiator include benzyl dimethyl ketal and the like. As 9-oxysulfide𠮿 It is a photopolymerization initiator, for example: 9-oxosulfide , 2-chloro-9-oxosulfide𠮿 , 2-Methyl 9-oxosulfide𠮿 , 2,4-dimethyl 9-oxosulfide𠮿 , isopropyl 9-oxosulfide𠮿 , 2,4-diisopropyl 9-oxysulfide𠮿 , dodecyl 9-oxosulfide𠮿 wait.

在一些較佳的實施例中，相對於基礎聚合物100重量份，光引發劑之含量較佳為0.5至10重量份，更佳為0.5至5重量份。藉由將光引發劑之用量設為上述範圍內，可提高黏合性。當光引發劑之含量小於0.5重量份時，黏合劑在活性能量射線照射時不會充分固化。當光引發劑之含量大於10重量份時，黏合劑的儲存穩定性會降低。此外，引發劑含量過多亦可能會導致黏合片經UV照射後表面過於堅硬而難自被貼表面剝離的現象。In some preferred embodiments, relative to 100 parts by weight of the base polymer, the content of the photoinitiator is preferably 0.5 to 10 parts by weight, more preferably 0.5 to 5 parts by weight. By setting the amount of the photoinitiator within the above range, the adhesion can be improved. When the content of the photoinitiator is less than 0.5 parts by weight, the adhesive will not be fully cured when irradiated with active energy rays. When the content of the photoinitiator is greater than 10 parts by weight, the storage stability of the adhesive will be reduced. In addition, too much initiator content may cause the surface of the adhesive sheet to be too hard to peel off from the adhered surface after UV irradiation.

除了上述各成分以外，本發明之黏合劑組合物可在不損害本發明之效應的範圍內根據需要含有增塑劑、軟化劑、防老劑、抗氧化劑等黏合劑領域中通常的各種添加劑。關於此類各種添加劑，可藉由常規方法使用現有公知的添加劑。In addition to the above components, the adhesive composition of the present invention may contain various additives commonly used in the adhesive field such as plasticizers, softeners, antioxidants, and antioxidants as needed within the scope that does not impair the effects of the present invention. Regarding such various additives, conventionally known additives can be used by conventional methods.

(黏合劑層之形成) 在此揭示的黏合劑層可藉由現有公知的方法來形成。例如可採用藉由將黏合劑組合物直接施加(典型地為塗佈)至該基材層上且使其乾燥而形成黏合劑層之方法(直接法)。另外，亦可採用藉由將黏合劑組合物施加至具有剝離性的表面(剝離面)上且使其乾燥而在該表面上形成黏合劑層、且將該黏合劑層轉印至基材層上的方法(轉印法)。自生產率的觀點考慮，較佳轉印法。作為上述剝離面，可利用剝離襯墊的表面、進行了剝離處理的基材層背面等。需要說明的是，在此揭示的黏合劑層典型地是連續地形成，但並不限定於此類形態，亦可為形成為例如點狀、條紋狀等規則或不規則圖案的黏合劑層。 (Formation of adhesive layer) The adhesive layer disclosed herein can be formed by conventionally known methods. For example, a method of forming an adhesive layer by directly applying (typically coating) the adhesive composition onto the substrate layer and drying it (direct method) can be used. Alternatively, the adhesive composition may be applied to a peelable surface (peeling surface) and dried to form an adhesive layer on the surface, and the adhesive layer may be transferred to the base material layer. The above method (transfer method). From the viewpoint of productivity, the transfer method is preferred. As the release surface, the surface of a release liner, the back surface of a base material layer subjected to release treatment, etc. can be used. It should be noted that the adhesive layer disclosed here is typically formed continuously, but is not limited to such a form. It may also be an adhesive layer formed in a regular or irregular pattern such as dots or stripes.

黏合劑組合物的塗佈例如可使用凹版輥塗佈機、模塗佈機、棒塗佈機等現有公知的塗佈機來進行。或者，亦可藉由浸滲或簾塗法等塗佈黏合劑組合物。The adhesive composition can be coated using a conventionally known coater such as a gravure roll coater, a die coater, and a rod coater. Alternatively, the adhesive composition can also be applied by impregnation or curtain coating.

自促進交聯反應、提高製造效率等觀點考慮，黏合劑組合物的乾燥較佳在加熱下進行。乾燥溫度例如可設定為40至150℃左右，通常較佳設定為60至130℃左右。在使黏合劑組合物乾燥後，出於黏合劑層內的成分遷移的調節、交聯反應的進行、可能存在於基材膜或黏合劑層內的應變的鬆弛等目的，可進一步進行老化。From the viewpoint of self-promoting cross-linking reaction and improving manufacturing efficiency, drying of the adhesive composition is preferably performed under heating. The drying temperature can be set to about 40 to 150°C, for example, and is usually preferably set to about 60 to 130°C. After the adhesive composition is dried, aging may be further performed for the purpose of adjusting component migration in the adhesive layer, advancing cross-linking reactions, relaxing strains that may exist in the base film or the adhesive layer, and the like.

黏合劑層之厚度沒有特別限制，考慮對被黏物的黏接性與內聚性的平衡，黏合劑層之厚度較佳為1至100 μm，更佳為3至50 μm。藉由將黏合劑層之厚度設為上述範圍，可實現良好的黏接性。The thickness of the adhesive layer is not particularly limited. Considering the balance of adhesion and cohesion to the adherend, the thickness of the adhesive layer is preferably 1 to 100 μm, more preferably 3 to 50 μm. By setting the thickness of the adhesive layer within the above range, good adhesion can be achieved.

[基材層] 構成此處揭示的黏合片之基材層的材質沒有特別限定，可根據該黏合片之使用目的或使用方式等而適當選擇。作為可使用的基材層的非限定性之實例，可列舉出以聚乙烯、聚丙烯、聚丁烯、乙烯-丙烯共聚物等聚烯烴作為主要成分的聚烯烴薄膜、以聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯等聚酯作為主要成分的聚酯薄膜、以聚氯乙烯作為主要成分的聚氯乙烯薄膜、以流延聚丙烯作為主要成分的薄膜、熱塑性聚胺酯薄膜等塑膠薄膜；由聚胺酯發泡體、聚乙烯發泡體、聚氯丁二烯發泡體等發泡體形成的發泡體片；各種纖維狀物質(可為麻、棉等天然纖維、聚酯、維尼綸等合成纖維、乙酸酯等半合成纖維等)單獨或藉由混紡等得到的織布及不織布；日本紙、優質紙、牛皮紙、皺紋紙等紙類；鋁箔、銅箔等金屬箔等。此等之中，基材層較佳包含選自由熱塑性聚胺酯、聚乙烯、聚丙烯、聚丁烯、乙烯-醋酸乙烯酯共聚物及聚氯乙烯組成之群中之至少一者。亦可為將它們複合而成的構成的基材。作為此複合基材之實例，例如可列舉出金屬箔與上述塑膠薄膜層疊而成的結構的基材、用玻璃布等無機纖維強化了的塑膠基材等。 [Substrate layer] The material of the base material layer constituting the adhesive sheet disclosed here is not particularly limited, and can be appropriately selected depending on the purpose of use, use method, etc. of the adhesive sheet. Non-limiting examples of the base material layer that can be used include polyolefin films mainly composed of polyolefins such as polyethylene, polypropylene, polybutylene, and ethylene-propylene copolymers, and polyolefin films composed of polyterephthalic acid. Polyester films with polyesters such as ethylene glycol ester and polybutylene terephthalate as the main component, polyvinyl chloride films with polyvinyl chloride as the main component, films with cast polypropylene as the main component, thermoplastic Plastic films such as polyurethane film; foam sheets made of polyurethane foam, polyethylene foam, polychloroprene foam and other foams; various fibrous materials (can be natural fibers such as hemp, cotton, etc. , synthetic fibers such as polyester and vinylon, semi-synthetic fibers such as acetate, etc.) alone or by blending, etc.; Japanese paper, high-quality paper, kraft paper, crepe paper and other paper types; aluminum foil, copper foil etc. metal foil etc. Among these, the base material layer preferably contains at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutylene, ethylene-vinyl acetate copolymer, and polyvinyl chloride. It may also be a base material composed of a composite of these. Examples of the composite base material include a base material having a structure in which a metal foil and the above-mentioned plastic film are laminated, a plastic base material reinforced with inorganic fibers such as glass cloth, and the like.

對於本發明之基材層的表面，為了提高與鄰接的層的密合性及保持性等，可實施任意表面處理。作為上述表面處理，例如，可列舉出鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化輻射線處理等化學或物理處理、塗佈處理。The surface of the base material layer of the present invention may be subjected to any surface treatment in order to improve adhesion and retention with adjacent layers. Examples of the surface treatment include chemical or physical treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment, and coating treatments.

對於本發明之基材層之厚度，根據期望的強度或柔軟性、以及使用目的等，可設定為任意適當之厚度。基材層之厚度較佳為10至300 μm，更佳為30至200 μm，進一步較佳為50至150 μm。The thickness of the base material layer of the present invention can be set to any appropriate thickness depending on the desired strength or flexibility, the purpose of use, and the like. The thickness of the base material layer is preferably 10 to 300 μm, more preferably 30 to 200 μm, and further preferably 50 to 150 μm.

在一個實施例中，基材層的內部及/或表面亦可包含抗靜電劑。作為包含抗靜電劑的基材層，例如可使用混練有抗靜電劑的樹脂片。該樹脂片可由包含樹脂及抗靜電劑的基材形成用組合物形成。In one embodiment, the interior and/or surface of the substrate layer may also include an antistatic agent. As a base material layer containing an antistatic agent, for example, a resin sheet kneaded with an antistatic agent can be used. The resin sheet can be formed from a base material forming composition containing a resin and an antistatic agent.

作為樹脂，例如可列舉出：熱塑性聚胺酯、聚乙烯、聚丙烯、聚丁烯、乙烯-醋酸乙烯酯共聚物、聚氯乙烯等。Examples of the resin include thermoplastic polyurethane, polyethylene, polypropylene, polybutylene, ethylene-vinyl acetate copolymer, polyvinyl chloride, and the like.

作為基材層的內部及/或表面包含的抗靜電劑，只要能夠獲得本發明之效應就可使用任意適合的抗靜電劑。例如可使用上述黏合劑層中記載的抗靜電劑等。As the antistatic agent contained inside and/or on the surface of the base material layer, any suitable antistatic agent can be used as long as the effects of the present invention can be obtained. For example, the antistatic agent described in the adhesive layer mentioned above can be used.

作為使基材中含有抗靜電材料的方法，只要是上述抗靜電材料能夠均勻混合到基材所使用的樹脂中的方法就沒有特別限定，例如可列舉出使用加熱輥、班伯里混合機、加壓捏合機、雙螺桿混練機等使其包含在基材中的方法。 The method for containing an antistatic material in the base material is not particularly limited as long as the antistatic material can be uniformly mixed into the resin used for the base material. Examples thereof include the use of a heated roller, a Banbury mixer, Pressure kneader, twin-screw kneader, etc. to make it included in the base material.

[背塗層] 如圖2所示，本發明之黏合片亦可包括背面處理層30，亦稱背塗層，該背塗層30設置在基材層10的與黏合劑層20相反的一側。 [Back coating] As shown in FIG. 2 , the adhesive sheet of the present invention may also include a back treatment layer 30 , also called a back coating layer. The back coating layer 30 is disposed on the opposite side of the base material layer 10 to the adhesive layer 20 .

作為背塗層形成材料，沒有特別限定，可使用聚胺酯系樹脂、環氧系樹脂、聚酯系樹脂、丙烯酸系樹脂、聚醯胺系樹脂、三聚氰胺系樹脂、烯烴系樹脂、聚苯乙烯系樹脂、酚醛系樹脂、異氰脲酸酯系樹脂、聚乙酸乙烯酯系樹脂等中的1種或2種以上。在樹脂薄膜基材層上設置丙烯酸系等的黏合劑層之情況下，較佳聚胺酯系、環氧系、聚酯系、丙烯酸系的背塗層。The material for forming the back coat layer is not particularly limited, and polyurethane resin, epoxy resin, polyester resin, acrylic resin, polyamide resin, melamine resin, olefin resin, and polystyrene resin can be used. , one or more of phenolic resin, isocyanurate resin, polyvinyl acetate resin, etc. When an adhesive layer such as acrylic is provided on the resin film base material layer, a polyurethane-based, epoxy-based, polyester-based, or acrylic-based backcoat layer is preferred.

在一些較佳的實施例中，背塗層較佳包括選自由熱固性的丙烯酸、聚胺酯及環氧體系樹脂組成之群中之至少一者。In some preferred embodiments, the back coating preferably includes at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy system resins.

一些較佳的實施例中，背塗層較佳包含抗靜電劑。由此，黏合片之抗靜電性提高，可充分抑制剝離靜電壓。背塗層可為單層結構，亦可為2層以上的多層結構。在配置多層結構的背塗層的方式中，較佳將其中至少1層(典型的係包含與基材層接觸的層的至少1層)設為包含抗靜電劑的背塗層。In some preferred embodiments, the back coating preferably contains an antistatic agent. This improves the antistatic properties of the adhesive sheet and can fully suppress the peeling static voltage. The back coating can be a single-layer structure or a multi-layer structure of two or more layers. In the method of arranging a back coating layer of a multilayer structure, it is preferable that at least one layer (typically at least one layer including a layer in contact with the base material layer) is a back coating layer containing an antistatic agent.

作為抗靜電劑，例如可使用上述黏合劑層中記載的抗靜電劑等。例如可使用聚噻吩、聚苯胺、聚吡咯、聚乙烯亞胺、烯丙基胺系聚合物等導電性聚合物；導電性金屬氧化物、碳奈米管、石墨烯、富勒烯、乙炔黑、科琴黑、天然石墨、人造石墨、鈦黑等導電性無機微粒；金屬微粒或纖維等。此等可單獨使用1種或2種以上。As the antistatic agent, for example, the antistatic agents described in the above-mentioned adhesive layer can be used. For example, conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine-based polymers; conductive metal oxides, carbon nanotubes, graphene, fullerene, and acetylene black can be used , Ketjen black, natural graphite, artificial graphite, titanium black and other conductive inorganic particles; metal particles or fibers, etc. These may be used individually by 1 type or 2 or more types.

在配置背塗層的方式中，作為背塗層中可包含的導電性聚合物，可例示出聚噻吩及聚苯胺。作為聚噻吩，較佳聚苯乙烯換算的Mw為40×10 4以下、更佳30×10 4以下。作為聚苯胺，較佳Mw為50×10 4以下、更佳30×10 4以下。另外，此等導電性聚合物的Mw通常較佳為0.1×10 4以上、更佳為0.5×10 4以上。需要說明的是，本說明書中，聚噻吩係指未取代或取代噻吩的聚合物。作為此處揭示的技術中的取代噻吩聚合物的一個適宜之實例，可列舉出聚(3,4-乙烯二氧噻吩)。 When the back coat layer is provided, examples of conductive polymers that can be included in the back coat layer include polythiophene and polyaniline. As the polythiophene, the Mw in terms of polystyrene is preferably 40×10 4 or less, more preferably 30×10 4 or less. As polyaniline, Mw is preferably 50×10 4 or less, more preferably 30×10 4 or less. In addition, the Mw of these conductive polymers is generally preferably 0.1×10 4 or more, more preferably 0.5×10 4 or more. It should be noted that in this specification, polythiophene refers to a polymer of unsubstituted or substituted thiophene. As a suitable example of the substituted thiophene polymer in the technology disclosed herein, poly(3,4-ethylenedioxythiophene) can be cited.

一些較佳的方式中，背塗層可包含聚苯乙烯磺酸酯(PSS)作為摻雜物(例如，噻吩系聚合物的摻雜物)。在一些方式中，使用含有包含PSS的聚噻吩水溶液(可為在聚噻吩中添加PSS作為摻雜物的形態)的背塗層形成用組合物形成背塗層。上述水溶液可以1:1至1:10的重量比含有聚噻吩:PSS。上述水溶液中的聚噻吩與PSS的合計含量可為例如1至5重量%左右。In some preferred embodiments, the back coating may include polystyrene sulfonate (PSS) as a dopant (eg, a dopant of thiophene-based polymers). In some embodiments, the back coat layer is formed using a back coat layer forming composition containing a polythiophene aqueous solution containing PSS (which may be in a form in which PSS is added as a dopant to polythiophene). The above aqueous solution may contain polythiophene:PSS in a weight ratio of 1:1 to 1:10. The total content of polythiophene and PSS in the aqueous solution may be, for example, about 1 to 5% by weight.

對於導電性聚合物之用量，自提高抗靜電性的觀點出發，相對於背塗層中包含的樹脂100重量份，可設為約10重量份以上，通常設為25重量份以上為適當的，較佳為40重量份以上。若考慮背塗層中的導電性聚合物的相容性，導電性聚合物之用量相對於樹脂100重量份設為200重量份以下(例如150重量份以下)為適當的，較佳為120重量份以下(例如100重量份以下)。亦可將導電性聚合物之用量設為相對於樹脂100重量份為80重量份以下(例如60重量份以下)。The amount of the conductive polymer used can be about 10 parts by weight or more based on 100 parts by weight of the resin contained in the backcoat layer from the viewpoint of improving antistatic properties, and usually it is appropriate to set it at 25 parts by weight or more. Preferably it is 40 parts by weight or more. Considering the compatibility of the conductive polymer in the back coat layer, the amount of the conductive polymer is appropriately set to 200 parts by weight or less (for example, 150 parts by weight or less) based on 100 parts by weight of the resin, preferably 120 parts by weight. parts or less (for example, 100 parts by weight or less). The amount of the conductive polymer may be 80 parts by weight or less (for example, 60 parts by weight or less) based on 100 parts by weight of the resin.

背塗層中的抗靜電劑的總量(包含導電性聚合物、導電性無機微粒等全部抗靜電劑的合計量)可設為約5重量%(例如約10重量%以上)，設為約30重量%以上為適當的，例如亦可超過50重量%。背塗層中的抗靜電劑總量的上限沒有特別限定，為約90重量%以下(例如80重量%以下)為適當的，考慮與基材層的密合性等，亦可為約40重量%以下(例如約30重量%以下)。The total amount of the antistatic agent in the back coat layer (including the total amount of all antistatic agents such as conductive polymers and conductive inorganic particles) can be set to about 5% by weight (for example, about 10% by weight or more), and can be set to about 5% by weight (for example, about 10% by weight or more). 30% by weight or more is appropriate, and for example, it may exceed 50% by weight. The upper limit of the total amount of the antistatic agent in the backcoat layer is not particularly limited, but about 90% by weight or less (for example, 80% by weight or less) is appropriate. Considering the adhesion to the base material layer, etc., it may also be about 40% by weight. % or less (for example, about 30% by weight or less).

背塗層除了上述的導電劑以外亦可包含黏結劑。作為背塗層中可包含的黏結劑，可沒有特別限制地使用上述的背塗層形成用材料。其中，較佳使用熱固性的聚胺酯及/或環氧體系樹脂。黏結劑在背塗層整體中所占的比例例如可設為約30重量%以上，設為約40重量%以上(例如約50重量%以上)為適當的。另外，考慮到抗靜電性等，上述黏結劑的比例設為不足90重量%(不足80重量%)為適當的。In addition to the above-mentioned conductive agent, the back coating may also include a binder. As a binder that can be included in the back coat layer, the above-mentioned back coat layer forming materials can be used without particular limitation. Among them, thermosetting polyurethane and/or epoxy system resins are preferably used. The proportion of the binder in the entire back coating layer can be, for example, about 30% by weight or more, and it is appropriate to set it at about 40% by weight or more (for example, about 50% by weight or more). In addition, in consideration of antistatic properties and the like, it is appropriate to set the proportion of the above-mentioned binder to less than 90% by weight (less than 80% by weight).

另外，在一些方式中，背塗層含有交聯劑。作為交聯劑，可適宜選擇通常的樹脂的交聯中使用的三聚氰胺系、異氰酸酯系、環氧系等交聯劑而使用。由此，可較佳兼顧對基材層的錨固性。Additionally, in some aspects, the backcoat layer contains a cross-linking agent. As the cross-linking agent, melamine-based, isocyanate-based, epoxy-based cross-linking agents such as those commonly used for cross-linking of resins can be suitably selected and used. Therefore, the anchoring property to the base material layer can be better taken into consideration.

背塗層根據需要可含有抗氧化劑、著色劑、流動性調整劑、造膜助劑、界面活性劑、防腐蝕劑等添加劑。The back coating may contain antioxidants, colorants, fluidity adjusters, film-forming aids, surfactants, anti-corrosion agents and other additives as needed.

在一些較佳的實施例中，背塗層較佳藉由背面處理劑形成。作為背塗層的形成所能使用的背面處理劑，沒有特別限定，可根據目的、用途而使用有機矽系背面處理劑、氟系背面處理劑、長鏈烷基系背面處理劑等公知或慣用的處理劑。背面處理劑可單獨使用一種或組合使用兩種以上。In some preferred embodiments, the backcoat layer is preferably formed by a backside treatment agent. The back surface treatment agent that can be used to form the back coat layer is not particularly limited. Well-known or commonly used back surface treatment agents such as silicone-based back surface treatment agents, fluorine-based back surface treatment agents, long-chain alkyl-based back surface treatment agents, etc. can be used depending on the purpose and use. treatment agent. A back surface treatment agent can be used individually by 1 type or in combination of 2 or more types.

背塗層可藉由如下的方法適宜地形成：使用凹版輥塗機、逆轉輥塗機等公知或慣用的塗佈機，將上述樹脂成分及根據需要使用的添加劑分散或溶解於適當的溶劑而成的液態組合物(背塗層形成用的塗佈材料)賦予至基材層，必要時，包含乾燥、固化處理，由此形成。自形成厚度薄且均勻的層的觀點出發，上述塗佈材料的NV(不揮發成分)例如可設為5重量%以下(典型的係0.05至5重量%)。作為可構成塗佈材料的溶劑，可使用有機溶劑、水、或其混合溶劑中的任意者，較佳水或以水為主成分的混合溶劑(例如，水與乙醇的混合溶劑)。The back coat layer can be suitably formed by using a known or customary coater such as a gravure roll coater or a reverse roll coater to disperse or dissolve the above-mentioned resin component and additives as necessary in an appropriate solvent. The resulting liquid composition (coating material for forming the back coat layer) is applied to the base material layer and, if necessary, includes drying and curing processes to form. From the viewpoint of forming a thin and uniform layer, the NV (non-volatile content) of the coating material can be, for example, 5% by weight or less (typically 0.05 to 5% by weight). As the solvent that can constitute the coating material, any one of organic solvents, water, or mixed solvents thereof can be used, preferably water or a mixed solvent containing water as the main component (for example, a mixed solvent of water and ethanol).

此處揭示的技術中的背塗層之厚度沒有特別限定，通常為0.01 μm以上，自適當地表現背塗層的功能的觀點出發，設為0.05 μm以上為適當的，亦可較佳為0.1 μm以上(例如0.2 μm以上)。作為背塗層之厚度的上限，可設為50 μm以下(例如10 μm以下)，自透明性及塗佈性等觀點出發，設為3 μm以下為適當的，較佳為1 μm以下(例如0.6 μm以下)。The thickness of the backcoat layer in the technology disclosed here is not particularly limited, but is usually 0.01 μm or more. From the viewpoint of appropriately expressing the function of the backcoat layer, 0.05 μm or more is appropriate, and 0.1 μm is more preferable. and above (for example, above 0.2 μm). The upper limit of the thickness of the back coat layer can be 50 μm or less (for example, 10 μm or less). From the viewpoint of transparency and coating properties, it is appropriate to set it to 3 μm or less, and preferably 1 μm or less (for example, 1 μm or less). 0.6 μm or less).

[底塗層][Undercoat]

如圖3所示，本發明之黏合片亦可包括底塗處理層40(亦稱為「底塗層40」)，該底塗層40設置在基材層10的與背面處理層30相反的一側。As shown in FIG. 3 , the adhesive sheet of the present invention may also include a primer treatment layer 40 (also referred to as “undercoat layer 40 ”). The primer layer 40 is disposed on the base layer 10 opposite to the backside treatment layer 30 . one side.

作為底塗層形成材料，沒有特別限定，可使用聚胺酯系樹脂、環氧系樹脂、聚酯系樹脂、丙烯酸系樹脂、聚醯胺系樹脂、三聚氰胺系樹脂、烯烴系樹脂、聚苯乙烯系樹脂、酚系樹脂、異氰脲酸酯系樹脂、聚乙酸乙烯酯系樹脂等中的1種或2種以上。在樹脂薄膜基材層上設置丙烯酸系等的黏合劑層之情況下，較佳聚胺酯系、環氧系、聚酯系、丙烯酸系的底塗層。The material for forming the undercoat layer is not particularly limited, and polyurethane resin, epoxy resin, polyester resin, acrylic resin, polyamide resin, melamine resin, olefin resin, and polystyrene resin can be used. , one or more of phenolic resin, isocyanurate resin, polyvinyl acetate resin, etc. When an adhesive layer such as acrylic is provided on the resin film base material layer, a polyurethane-based, epoxy-based, polyester-based, or acrylic-based undercoat layer is preferred.

在一些較佳的實施例中，底塗層較佳包括選自由熱固性的丙烯酸、聚胺酯及環氧體系樹脂組成之群中之至少一者。In some preferred embodiments, the base coating preferably includes at least one selected from the group consisting of thermosetting acrylic, polyurethane, and epoxy system resins.

底塗層一些較佳的實施例中，底塗層較佳包含抗靜電劑。由此，黏合片之抗靜電性提高，可充分抑制剝離靜電壓。底塗層可為單層結構，亦可為2層以上的多層結構。在配置多層結構的底塗層的方式中，較佳將其中至少1層(典型的係包含與基材層接觸的層的至少1層)設為包含抗靜電劑的底塗層。Undercoat In some preferred embodiments, the undercoat preferably includes an antistatic agent. This improves the antistatic properties of the adhesive sheet and can fully suppress the peeling static voltage. The base coat can be a single-layer structure or a multi-layer structure of two or more layers. In the method of arranging the undercoat layer of a multilayer structure, it is preferable that at least one layer (typically at least one layer including a layer in contact with the base material layer) is an undercoat layer containing an antistatic agent.

作為抗靜電劑，例如可使用上述黏合劑層中記載的抗靜電劑等。例如可使用聚噻吩、聚苯胺、聚吡咯、聚乙烯亞胺、烯丙基胺系聚合物等導電性聚合物；導電性金屬氧化物、碳奈米管、石墨烯、富勒烯、乙炔黑、科琴黑、天然石墨、人造石墨、鈦黑等導電性無機微粒；金屬微粒或纖維等。此等可單獨使用1種或2種以上。As the antistatic agent, for example, the antistatic agents described in the above-mentioned adhesive layer can be used. For example, conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine-based polymers; conductive metal oxides, carbon nanotubes, graphene, fullerene, and acetylene black can be used , Ketjen black, natural graphite, artificial graphite, titanium black and other conductive inorganic particles; metal particles or fibers, etc. These may be used individually by 1 type or 2 or more types.

底塗層亦可含有任意適宜的添加劑。作為此類添加劑，可舉出例如紫外線吸收劑、抗老化劑、受阻胺系光穩定劑等光穩定劑、流平劑、低分子聚合物、防腐劑、阻聚劑、矽烷偶合劑、無機及有機的填充劑(例如氧化鈣、氧化鎂、氧化矽、氧化鋅、氧化鈦等)、金屬粉、著色劑、顏料、耐熱穩定劑等。The base coat may also contain any suitable additives. Examples of such additives include ultraviolet absorbers, anti-aging agents, light stabilizers such as hindered amine light stabilizers, leveling agents, low molecular polymers, preservatives, polymerization inhibitors, silane coupling agents, inorganic and Organic fillers (such as calcium oxide, magnesium oxide, silicon oxide, zinc oxide, titanium oxide, etc.), metal powder, colorants, pigments, heat-resistant stabilizers, etc.

在一些較佳的實施例中，底塗層較佳藉由底塗劑形成。作為底塗層的形成所能使用的底塗劑，沒有特別限定，可根據目的、用途而使用方便形成均勻牢固的、能有效提高黏著力投錨黏接性能的底塗劑。底面處理劑可單獨使用一種或組合使用兩種以上。In some preferred embodiments, the primer layer is preferably formed by a primer. The primer that can be used to form the base coat is not particularly limited. It can be easily used according to the purpose and use to form a uniform and strong primer that can effectively improve the adhesion and anchor bonding performance. The bottom surface treatment agent can be used individually by 1 type or in combination of 2 or more types.

底塗層之厚度沒有特別限制，較佳為0.05至2μm，更佳為0.1至1.5μm。藉由將底塗層之厚度設為上述範圍，可更好地實現本發明之效應。 The thickness of the primer layer is not particularly limited, but is preferably 0.05 to 2 μm, more preferably 0.1 to 1.5 μm. By setting the thickness of the undercoat layer to the above range, the effects of the present invention can be better achieved.

(黏合片之製造方法) 本發明之黏合片可藉由任意適當的方法來製造。例如可列舉出如下方法：在基材層上塗佈黏合劑組合物的方法、或將在任意適當的基體上塗覆黏合劑組合物而形成的塗覆層轉印至基材層上的方法等。 (Manufacturing method of adhesive sheet) The adhesive sheet of the present invention can be produced by any appropriate method. Examples include the following methods: a method of coating an adhesive composition on a base material layer, a method of transferring a coating layer formed by coating an adhesive composition on any appropriate base to the base material layer, etc. .

作為上述黏合劑組合物的塗覆方法，可採用任意適當的塗覆方法。例如，可在塗佈後進行乾燥而形成各層。作為塗佈方法，例如，可列舉出使用多重塗佈機、模塗機、凹版塗佈機、塗抹器、棒塗機塗佈、氣刀塗佈、逆轉輥塗佈、唇式塗佈、浸漬塗佈、膠版印刷、可撓性印刷、網版印刷等塗佈方法。作為乾燥方法，例如，可列舉出自然乾燥、加熱乾燥等。加熱乾燥的情況下的加熱溫度根據作為乾燥對象的物質的特性可設定為任意適當的溫度。As the coating method of the above-mentioned adhesive composition, any appropriate coating method can be adopted. For example, each layer can be formed by drying after coating. Examples of the coating method include multi-coater, die coater, gravure coater, applicator, bar coater coating, air knife coating, reverse roll coating, lip coating, and dipping. Coating methods such as coating, offset printing, flexible printing, and screen printing. Examples of drying methods include natural drying, heat drying, and the like. The heating temperature in the case of heat drying can be set to any appropriate temperature according to the characteristics of the substance to be dried.

(用途) 本發明之黏合片可貼附於光學構件、電子構件等各種構件或設備上，能夠充分抑制剝離時產生的剝離靜電，實現優異的抗靜電性及剝離靜電壓的經時穩定性，從而用於防止加工、組裝、檢查、輸送等時的該光學構件及該電子構件等構件的表面的損傷(例如具有優異的耐靜電擊穿能力)。 (use) The adhesive sheet of the present invention can be attached to various components or equipment such as optical components and electronic components. It can fully suppress peeling static electricity generated during peeling and achieve excellent antistatic properties and stability of peeling static voltage over time, thereby being used for Prevent damage to the surface of the optical component and the electronic component during processing, assembly, inspection, transportation, etc. (for example, it has excellent resistance to electrostatic breakdown).

實例 以下，藉由實例具體地對本發明進行說明，但本發明不受此等實例的限定。實例中的評價方法如下。另外，實例中，只要沒有特別說明，則「份」及「%」為重量基準。實例中未註明具體條件者，按照常規條件或製造商建議的條件進行。所用材料或儀器除非特別說明，均為可使用藉由市購獲得的常規產品。 Example Hereinafter, the present invention will be specifically described by using examples, but the present invention is not limited by these examples. The evaluation method in the example is as follows. In addition, in the examples, unless otherwise specified, "parts" and "%" are based on weight. If the specific conditions are not specified in the examples, the general conditions or the conditions recommended by the manufacturer shall be followed. Unless otherwise specified, the materials or instruments used are conventional products that can be purchased from the market.

(丙烯酸系聚合物A1之製備) 向具備攪拌器、溫度計、氮氣導入管及回流冷凝器的反應容器中，投入丙烯酸正丁酯(BA) (浙江衛星製造) 5份、丙烯酸-2-乙基己酯(2EHA) 62份、乙酸乙烯酯(VAC) 30份、丙烯酸4-羥基丁酯(HBA) 3份及作為聚合溶劑的乙酸乙酯200至300份，在65℃下在氮氣氛圍下攪拌1至1.5小時後，作為熱聚合引發劑投入2,2'-偶氮二異丁腈(AIBN) 0.1份，在65℃下進行6至8小時反應，將內浴溫度升至70至90℃，熟化2小時。得到丙烯酸系聚合物A1的溶液。該丙烯酸系聚合物A1的可溶性部分的重均分子量Mw為120萬。 (Preparation of acrylic polymer A1) Into a reaction container equipped with a stirrer, a thermometer, a nitrogen gas introduction pipe and a reflux condenser, 5 parts of n-butyl acrylate (BA) (manufactured by Zhejiang Satellite), 62 parts of 2-ethylhexyl acrylate (2EHA), and acetic acid 30 parts of vinyl ester (VAC), 3 parts of 4-hydroxybutyl acrylate (HBA) and 200 to 300 parts of ethyl acetate as a polymerization solvent were stirred at 65°C in a nitrogen atmosphere for 1 to 1.5 hours as a thermal polymerization Add 0.1 part of 2,2'-azobisisobutyronitrile (AIBN) as the initiator, react at 65°C for 6 to 8 hours, raise the internal bath temperature to 70 to 90°C, and mature for 2 hours. A solution of acrylic polymer A1 was obtained. The weight average molecular weight Mw of the soluble portion of the acrylic polymer A1 was 1.2 million.

(丙烯酸系聚合物A2至A5之製備) 除了如表1所示地改變單體成分之種類及用量以外，以與丙烯酸系聚合物A1相同的方式製備丙烯酸系聚合物A1至A5。 表1  (單位：份) 丙烯酸系聚合物 A1 A2 A3 A4 A5 軟單體 丙烯酸正丁酯(BA) 5 5 55    50 丙烯酸-2-乙基己酯(2EHA) 62 10    40 30 硬單體 丙烯酸甲酯(MA)    55 30 52    乙酸乙烯酯(VAC) 30 20       10 機能性單體 丙烯酸(AA)    10 5       丙烯酸4-羥基丁酯(HBA) 3    10       丙烯酸-2-羥基乙酯(HEA)          8 4 丙烯酸系聚合物的可溶性部分的重均分子量(萬) 120 80 100 50 120 (Preparation of Acrylic Polymers A2 to A5) Acrylic polymers A1 to A5 were prepared in the same manner as the acrylic polymer A1, except that the types and amounts of the monomer components were changed as shown in Table 1. Table 1 (unit: portion) Acrylic polymer A1 A2 A3 A4 A5 soft unit n-Butyl acrylate (BA) 5 5 55 50 2-ethylhexyl acrylate (2EHA) 62 10 40 30 Hard monomer Methyl acrylate (MA) 55 30 52 Vinyl acetate (VAC) 30 20 10 functional monomer Acrylic (AA) 10 5 4-hydroxybutyl acrylate (HBA) 3 10 2-hydroxyethyl acrylate (HEA) 8 4 Weight average molecular weight of the soluble part of the acrylic polymer (10,000) 120 80 100 50 120

＜黏合片之製作＞ 實例1 向上述丙烯酸系聚合物A1的溶液中，相對於該溶液中所含的丙烯酸系聚合物A1 100份，添加作為多官能寡聚物的聚胺酯改性丙烯酸樹脂A(官能度為10) 80份、作為抗靜電劑的奈米銀線2份、異氰酸酯交聯劑(日本聚胺酯工業公司製造，商品號：CORONATE L) 5份、改性三聚氰胺交聯劑(DIC株式會社製造，商品號：NDS) 1份及光引發劑(德國巴斯夫製造，商品號：IRGACURE 651) 3份，均勻地混合且使用適當乙酸乙酯進行稀釋，製備得到黏合劑組合物D1。 ＜Preparation of adhesive sheet＞ Example 1 To the solution of the acrylic polymer A1, 80 parts of polyurethane-modified acrylic resin A (functionality: 10) as a polyfunctional oligomer was added to 100 parts of the acrylic polymer A1 contained in the solution. As an antistatic agent, 2 parts of silver nanowires, 5 parts of isocyanate cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product number: CORONATE L), 1 part of modified melamine cross-linking agent (manufactured by DIC Co., Ltd., product number: NDS) and 3 parts of photoinitiator (manufactured by BASF, Germany, product number: IRGACURE 651), mix evenly and dilute with appropriate ethyl acetate to prepare adhesive composition D1.

將背塗層黏合劑E1(碳奈米管分散劑，廠家先豐奈米，牌號101371)在去離子水及異丙醇的混合溶液中稀釋至合適濃度，將其塗佈在厚度為150 μm聚烯烴薄膜(PO膜)的一面，然後在80℃懸浮烘箱中乾燥1分鐘，形成厚度1μm以下的背塗層。Dilute the back coating adhesive E1 (carbon nanotube dispersant, manufacturer Xianfeng Nano, brand number 101371) to a suitable concentration in a mixed solution of deionized water and isopropyl alcohol, and apply it to a thickness of 150 μm. One side of the polyolefin film (PO film) is then dried in a suspension oven at 80°C for 1 minute to form a back coating with a thickness of less than 1 μm.

然後將底塗層黏合劑F1(聚噻吩分散液，廠家歐依有機光電，牌號Polyelec OE-001)使用與背塗層類似方法塗佈在上述帶有背塗層的基材的另一面，由此形成底塗層，在一些多功能塗佈線中，底塗層及背塗層可同時完成。Then the primer F1 (polythiophene dispersion, manufacturer Oei Organic Optoelectronics, brand Polyelec OE-001) is coated on the other side of the substrate with the back coating using a similar method to the back coating. This forms the base coat. In some multi-functional coating lines, the base coat and back coat can be completed at the same time.

接著，將上述黏合劑組合物D1塗佈在厚度為50 μm的聚對苯二甲酸乙二酯(PET)剝離層上，然後在130℃下加熱3分鐘，將其轉貼至上述基材的底塗面，完成本黏合片之製作。在一些必要情況下，亦可將上述黏合片置放在適當溫度下進行熟化。評價結果示於表2中。 Next, the above-mentioned adhesive composition D1 is coated on a polyethylene terephthalate (PET) release layer with a thickness of 50 μm, and then heated at 130°C for 3 minutes, and then transferred to the bottom of the above-mentioned base material. Coat the surface to complete the production of this adhesive sheet. In some necessary cases, the above-mentioned adhesive sheet can also be placed at an appropriate temperature for aging. The evaluation results are shown in Table 2.

實例2至6 除了如表2所示地改變丙烯酸系聚合物的種類、多官能寡聚物之種類及用量、抗靜電劑之種類及用量、交聯劑之用量、光引發劑之種類及用量、黏合劑層厚度、背塗層的組成以及底塗層的組成以外，以與實例1相同的方式獲得黏合片。評價結果示於表2中。 Examples 2 to 6 In addition to changing the type of acrylic polymer, the type and amount of multifunctional oligomer, the type and amount of antistatic agent, the amount of cross-linking agent, the type and amount of photoinitiator, and the adhesive layer as shown in Table 2 An adhesive sheet was obtained in the same manner as in Example 1 except for the thickness, the composition of the back coat layer, and the composition of the undercoat layer. The evaluation results are shown in Table 2.

比較例1至4 除了如表2所示地改變丙烯酸系聚合物的種類、多官能寡聚物之種類及用量、抗靜電劑之種類及用量、交聯劑之用量、光引發劑之種類及用量以及黏合劑層厚度、以及不具有背塗層及底塗層以外，以與實例1相同的方式獲得黏合片。評價結果示於表3中。 表2    實例1 實例2 實例3 實例4 實例5 實例6 基材層 組成 PO PO PET PVC 抗靜電PO PO 厚度(μm) 150 80 50 80 100 50 黏合劑層 D 丙烯酸系聚合物(份) A1(100) A2(100) A3(100) A4(100) A5(100) A5(100) 多官能寡聚物 聚胺酯改性丙烯酸樹脂A 80 80 70    100    脂族環氧改性丙烯酸樹脂B    40    40       抗靜電劑 碳奈米管    0.0004 0.1    0.01 0.5 奈米銀線 2.0    2.0          鋰鹽       4.0 0.2       交聯劑 異氰酸酯系交聯劑 5    0.5    5 3 改性三聚氰胺交聯劑 1 2    8    1 環氧系交聯劑    0.5 0.1 0.05 1    光引發劑 UV引發劑 3 0.5 3 2 5    UV光敏劑    0.5 1          黏合劑層厚度(μm) 25 5 40 8 15 3 背塗層E 抗靜電劑 碳奈米管 (固含量，w%) 0.5                聚苯胺(固含量，w%)       2.6 2.6       聚噻吩(固含量，w%)    0.8             底塗層F 抗靜電劑 碳奈米管 (固含量，w%)          0.5       聚苯胺(固含量，w%)                   聚噻吩(固含量，w%) 0.8 0.8             物性 黏合劑層之內聚模數G'(MPa，23℃-UV前) 44231 14344 76554 92000 38021 36112 黏合劑層之損耗模數G''(MPa，23℃-UV前) 12118 67881 28905 32239 7231 6903 黏合劑Tg (℃，常溫-UV前) -15 5 -7 -1 -27 -28 對SUS430BA板黏合力(N/20 mm，常溫-UV前) 11.5 1.12 23.5 3.81 9.3 3.2 對SUS430BA板黏合力(N/20 mm，常溫-UV後) 0.12 0.02 0.12 0.23 0.12 3.2 黏合片之拉伸斷裂強度 (TD，MPa) 26.3 26.3 252.0 39.0 25.5 23.5 黏合片之拉伸斷裂強度(MD，MPa) 28.1 28.1 211.0 42.0 27.4 25.9 黏合片之斷裂伸長率(TD，%) 684.0 684.0 162 282.0 721 569 黏合片之斷裂伸長率(MD，%) 669.0 669.0 124 258.0 702 533 膠面表面電阻率 (Ω/□，擴膜前) 4.37×10 7 6.47×10 7 6.67×10 7 8.33×10 6 9.33×10 7 6.36×10 7 背面表面電阻率 (Ω/□，擴膜前) 1.96×10 7 1.96×10 7 1.90×10 7 5.22×10 6 1.92×10 7 7.24×10 12 膠面表面電阻率 (Ω/□，1.5倍擴膜後) 3.38×10 8 1.68×10 8 7.72×10 8 2.79×10 7 9.82×10 7 2.44×10 8 背面表面電阻率 (Ω/□，1.5倍擴膜後) 2.12×10 7 2.42×10 7 5.99×10 7 1.55×10 7 2.60×10 7 4.68×10 13 剝離靜電壓(V，m300 mm/分鐘) 43.0 43.0 33.0 24.0 14.0 56 剝離靜電壓(V，30 m/分鐘) 78.0 78.0 66.0 89.0 53.0 77 UV前對基板貼合性 ◎ ◎ ◎ ◎ ◎ ◎ UV後機械取片率 ◎ ◎ ◎ ◎ ◎ ◎ 擴膜性(MD) ◎ ◎ - ◎ ◎ ○ 擴膜性(TD) ◎ ◎ - ◎ ◎ ○ 擴膜後晶片排列規整性 ◎ ◎ - ◎ ◎ ○ 陷晶 ◎ ◎ ◎ ◎ ◎ ◎ 殘膠性 ◎ ◎ ◎ ◎ ◎ ◎ 綜合判定 ◎ ◎ ◎ ◎ ◎ ○ PO：聚烯烴薄膜 PET：聚對苯二甲酸乙二酯薄膜 PVC：聚氯乙烯薄膜 抗靜電PO：製造商：MATAI DC-VS 聚胺酯改性丙烯酸樹脂A：官能度為10，潤奧化工製造，商品號：FSP8531 脂族環氧改性丙烯酸樹脂B：官能度為5，維都斯電子材料有限公司製造，商品號：WDS-5709 鋰鹽：LiTFsl，CAS號：90076-65-6，上海默逸科技製造 異氰酸酯交聯劑：商品號：CORONATE L，日本聚胺酯工業公司製造 改性三聚氰胺交聯劑：DIC株式會社製造，商品號：NDS 環氧系交聯劑：商品號：TETRAD C，三菱瓦斯化學製造 UV引發劑：德國巴斯夫製造，商品號：IRGACURE 651 UV光敏劑：湖北古潤科技製造，商品號：GR-PS-1 「-」表示PET基材無法擴膜 表3    比較例1 比較例2 比較例3 比較例4 基材層 組成 PO PO PVC PI 厚度(μm) 150 80 70 50 黏合劑層 D 丙烯酸系聚合物(份) A5(100) A4(100) A1(100) A2(100) 多官能寡聚物 聚胺酯改性丙烯酸樹脂A    100 100 80 脂族環氧改性丙烯酸樹脂B    50       聚胺酯改性丙烯酸酯C 100          抗靜電劑 碳奈米管    0.03    0.03 交聯劑 異氰酸酯系交聯劑       3 2 改性三聚氰胺交聯劑    1    1 環氧系交聯劑 1 0.5       光引發劑 UV引發劑 5 3 5 1 黏合劑層厚度(μm) 15 10 15 20 物性 黏合劑層之內聚模數G'(MPa，23℃-UV前) 25013 75449 43112 12007 黏合劑層之損耗模數G''(MPa，23℃-UV前) 7666 26549 7880 45209 黏合劑Tg(℃，常溫-UV前) -34 -7 -22 2 對SUS430BA板黏合力(N/20 mm，常溫-UV前) 18.5 4.21 7.93 4.54 對SUS430BA板黏合力(N/20 mm，常溫-UV後) 12.2 0.07 0.13 2.49 黏合片之拉伸斷裂強度(MD，MPa) 25.5 21.5 41.2 227 黏合片之拉伸斷裂強度(TD，MPa) 27.4 20.9 43.0 203 黏合片之斷裂伸長率(MD，%) 731.0 601 255.0 72.0 黏合片之斷裂伸長率(TD，%) 673.0 624 267.0 106 膠面表面電阻率(Ω/□，擴膜前) 3.44×10 15 5.82×10 11 2.44×10 10 1.55×10 15 背面表面電阻率(Ω/□，擴膜前) 5.82×10 12 6.62×10 9 4.41×10 10 3.57×10 15 膠面表面電阻率(Ω/□，1.5倍擴膜後) 9.47×10 9 3.35×10 14 5.51×10 12 - 背面表面電阻率(Ω/□，1.5倍擴膜後) 2.04×10 7 7.93×10 9 7.71×10 11 - 剝離靜電壓(V，300 mm/分鐘) ＞3000 1233.0 540.0 ＞3000 剝離靜電壓(V，30 m/分鐘) ＞3000 ＞3000 ＞3000 ＞3000 UV前對基板貼合性 ◎ ◎ ◎ ○ UV後機械取片率 × ○ ○ × 擴膜性(MD) ○ ○ ○ × 擴膜性(TD) ○ ○ ○ × 擴膜後晶片排列規整性 ○ ○ ○ × 殘膠性 × × × × 陷晶 × ○ ○ × 綜合判定 × × × × PO：聚烯烴薄膜 PVC：聚氯乙烯薄膜 PI：聚醯亞胺薄膜 聚胺酯改性丙烯酸樹脂A：官能度為10，潤奧化工製造，商品號：FSP8531 脂族環氧改性丙烯酸樹脂B：官能度為5，維都斯電子材料有限公司製造，商品號：WDS-5709 聚胺酯改性丙烯酸樹脂C：官能度為2，潤奧化工製造，商品號：LuCure 8706 碳奈米管：江蘇先豐奈米材料科技有限公司製造，商品號：XFS28 異氰酸酯交聯劑：商品號：CORONATE L，日本聚胺酯工業公司製造 改性三聚氰胺交聯劑：DIC株式會社製造，商品號：NDS 環氧系交聯劑：商品號：TETRAD C，三菱瓦斯化學製造 UV引發劑：德國巴斯夫製造，商品號：IRGACURE 651 Comparative Examples 1 to 4 Except for changing the type of acrylic polymer, the type and amount of polyfunctional oligomer, the type and amount of antistatic agent, the amount of cross-linking agent, the type and amount of photoinitiator as shown in Table 2, An adhesive sheet was obtained in the same manner as in Example 1 except for the dosage and thickness of the adhesive layer, and not having a back coat layer or a base coat layer. The evaluation results are shown in Table 3. Table 2 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 base material layer composition PO PO PET PVC Antistatic PO PO Thickness(μm) 150 80 50 80 100 50 Adhesive layer D Acrylic polymer (parts) A1(100) A2(100) A3(100) A4(100) A5(100) A5(100) multifunctional oligomer Polyurethane modified acrylic resin A 80 80 70 100 Aliphatic epoxy modified acrylic resin B 40 40 antistatic agent carbon nanotubes 0.0004 0.1 0.01 0.5 Nanosilver wire 2.0 2.0 Lithium salt 4.0 0.2 Cross-linking agent Isocyanate cross-linking agent 5 0.5 5 3 Modified melamine cross-linking agent 1 2 8 1 Epoxy cross-linking agent 0.5 0.1 0.05 1 photoinitiator UV initiator 3 0.5 3 2 5 UV photosensitizer 0.5 1 Adhesive layer thickness (μm) 25 5 40 8 15 3 Back coating E antistatic agent Carbon nanotubes (solid content, w%) 0.5 Polyaniline (solid content, w%) 2.6 2.6 Polythiophene (solid content, w%) 0.8 Base coat F antistatic agent Carbon nanotubes (solid content, w%) 0.5 Polyaniline (solid content, w%) Polythiophene (solid content, w%) 0.8 0.8 physical properties Cohesive modulus G' of adhesive layer (MPa, 23℃-before UV) 44231 14344 76554 92000 38021 36112 Loss modulus G'' of adhesive layer (MPa, 23℃-before UV) 12118 67881 28905 32239 7231 6903 Adhesive Tg (℃, normal temperature - before UV) -15 5 -7 -1 -27 -28 Adhesion to SUS430BA board (N/20 mm, normal temperature - before UV) 11.5 1.12 23.5 3.81 9.3 3.2 Adhesion to SUS430BA board (N/20 mm, normal temperature-after UV) 0.12 0.02 0.12 0.23 0.12 3.2 Tensile breaking strength of adhesive sheet (TD, MPa) 26.3 26.3 252.0 39.0 25.5 23.5 Tensile breaking strength of adhesive sheet (MD, MPa) 28.1 28.1 211.0 42.0 27.4 25.9 Elongation at break of adhesive sheet (TD, %) 684.0 684.0 162 282.0 721 569 Elongation at break of adhesive sheet (MD, %) 669.0 669.0 124 258.0 702 533 Surface resistivity of rubber surface (Ω/□, before film expansion) 4.37×10 7 6.47×10 7 6.67×10 7 8.33×10 6 9.33×10 7 6.36×10 7 Back surface resistivity (Ω/□, before film expansion) 1.96×10 7 1.96×10 7 1.90×10 7 5.22×10 6 1.92×10 7 7.24×10 12 Surface resistivity of rubber surface (Ω/□, after 1.5 times expansion) 3.38×10 8 1.68×10 8 7.72×10 8 2.79×10 7 9.82×10 7 2.44×10 8 Back surface resistivity (Ω/□, after 1.5 times expansion) 2.12×10 7 2.42×10 7 5.99×10 7 1.55×10 7 2.60×10 7 4.68×10 13 Peeling static voltage (V, m300 mm/min) 43.0 43.0 33.0 24.0 14.0 56 Peeling static voltage (V, 30 m/min) 78.0 78.0 66.0 89.0 53.0 77 Adhesion to substrate before UV ◎ ◎ ◎ ◎ ◎ ◎ Mechanical film removal rate after UV ◎ ◎ ◎ ◎ ◎ ◎ Film expansion (MD) ◎ ◎ - ◎ ◎ ○ Film expansion (TD) ◎ ◎ - ◎ ◎ ○ Regularity of wafer arrangement after film expansion ◎ ◎ - ◎ ◎ ○ trapped crystal ◎ ◎ ◎ ◎ ◎ ◎ Residual glue ◎ ◎ ◎ ◎ ◎ ◎ Comprehensive judgment ◎ ◎ ◎ ◎ ◎ ○ PO: Polyolefin film PET: Polyethylene terephthalate film PVC: Polyvinyl chloride film Antistatic PO: Manufacturer: MATAI DC-VS Polyurethane modified acrylic resin A: Functionality is 10, manufactured by Runao Chemicals, Product number: FSP8531 Aliphatic epoxy modified acrylic resin B: functionality 5, manufactured by Vidus Electronic Materials Co., Ltd., product number: WDS-5709 Lithium salt: LiTFsl, CAS number: 90076-65-6, Shanghai Mo Isocyanate cross-linking agent manufactured by Yi Technology: Product No.: CORONATE L, Modified melamine cross-linking agent manufactured by Japan Polyurethane Industry Co., Ltd.: Manufactured by DIC Co., Ltd., Product No.: NDS Epoxy cross-linking agent: Product No.: TETRAD C, Mitsubishi Gas Chemical manufacturing UV initiator: Made by BASF, Germany, product number: IRGACURE 651 UV photosensitizer: Manufactured by Hubei Gurun Technology, product number: GR-PS-1 "-" means that the PET substrate cannot be expanded Table 3 Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 base material layer composition PO PO PVC PI Thickness(μm) 150 80 70 50 Adhesive layer D Acrylic polymer (parts) A5(100) A4(100) A1(100) A2(100) multifunctional oligomer Polyurethane modified acrylic resin A 100 100 80 Aliphatic epoxy modified acrylic resin B 50 Polyurethane modified acrylate C 100 antistatic agent carbon nanotubes 0.03 0.03 Cross-linking agent Isocyanate cross-linking agent 3 2 Modified melamine cross-linking agent 1 1 Epoxy cross-linking agent 1 0.5 photoinitiator UV initiator 5 3 5 1 Adhesive layer thickness (μm) 15 10 15 20 physical properties Cohesive modulus G' of adhesive layer (MPa, 23℃-before UV) 25013 75449 43112 12007 Loss modulus G'' of adhesive layer (MPa, 23℃-before UV) 7666 26549 7880 45209 Adhesive Tg (℃, normal temperature - before UV) -34 -7 -twenty two 2 Adhesion to SUS430BA board (N/20 mm, normal temperature - before UV) 18.5 4.21 7.93 4.54 Adhesion to SUS430BA board (N/20 mm, normal temperature-after UV) 12.2 0.07 0.13 2.49 Tensile breaking strength of adhesive sheet (MD, MPa) 25.5 21.5 41.2 227 Tensile breaking strength of adhesive sheet (TD, MPa) 27.4 20.9 43.0 203 Elongation at break of adhesive sheet (MD, %) 731.0 601 255.0 72.0 Elongation at break of adhesive sheet (TD, %) 673.0 624 267.0 106 Surface resistivity of rubber surface (Ω/□, before film expansion) 3.44×10 15 5.82×10 11 2.44×10 10 1.55×10 15 Back surface resistivity (Ω/□, before film expansion) 5.82×10 12 6.62×10 9 4.41×10 10 3.57×10 15 Surface resistivity of rubber surface (Ω/□, after 1.5 times expansion) 9.47×10 9 3.35×10 14 5.51×10 12 - Back surface resistivity (Ω/□, after 1.5 times expansion) 2.04×10 7 7.93×10 9 7.71×10 11 - Peeling static voltage (V, 300 mm/min) ＞3000 1233.0 540.0 ＞3000 Peeling static voltage (V, 30 m/min) ＞3000 ＞3000 ＞3000 ＞3000 Adhesion to substrate before UV ◎ ◎ ◎ ○ Mechanical film removal rate after UV × ○ ○ × Film expansion (MD) ○ ○ ○ × Film expansion (TD) ○ ○ ○ × Regularity of wafer arrangement after film expansion ○ ○ ○ × Residual glue × × × × trapped crystal × ○ ○ × Comprehensive judgment × × × × PO: Polyolefin film PVC: Polyvinyl chloride film PI: Polyimide film Polyurethane modified acrylic resin A: Functionality is 10, manufactured by Runao Chemical, product number: FSP8531 Aliphatic epoxy modified acrylic resin B: Functional The functionality is 5, manufactured by Vidus Electronic Materials Co., Ltd., product number: WDS-5709. Polyurethane modified acrylic resin C: the functionality is 2, manufactured by Runao Chemicals, product number: LuCure 8706. Carbon nanotubes: Jiangsu Xianfengnai Manufactured by Mi Material Technology Co., Ltd., product number: Product number: TETRAD C, manufactured by Mitsubishi Gas Chemical Co., Ltd. UV initiator: manufactured by BASF, Germany, product number: IRGACURE 651

＜評價試驗＞ (1)剝離靜電壓 在黏合片(寬70 mm×長130 mm)的黏合面貼合經過除電的離型膜(進行了有機矽處理的PET薄膜、東麗株式會社製造、商品名「Cerapeel」、厚度：38μm)的有機矽處理面，製作評價用樣品。此時，離型膜的長度方向端部自黏合片突出30 mm。此外，用手壓輥使黏合片及離型膜在基於JIS Z 0237 (2000年)的條件下(溫度：23℃、濕度50%RH)貼合。 ＜Evaluation test＞ (1) Peeling static voltage A release film (silicon-treated PET film, manufactured by Toray Co., Ltd., trade name "Cerapeel", thickness: 38 μm) is bonded to the adhesive surface of an adhesive sheet (width 70 mm x length 130 mm). Treat the surface with silicone and prepare samples for evaluation. At this time, the lengthwise end of the release film protrudes 30 mm from the adhesive sheet. In addition, the adhesive sheet and release film are bonded using a hand pressure roller under conditions based on JIS Z 0237 (2000) (temperature: 23°C, humidity 50%RH).

將評價用樣品在23℃、50%RH的環境下置放一日後，抓住離型膜的突出部分，將該離型膜以剝離角度150°、剝離速度300 mm/分鐘(或剝離速度為30 m/分鐘)沿長度方向剝離。在相對黏合劑表面為垂直的方向距離型膜及黏合片分離處100 mm的位置，測定剝離時產生的黏合劑層表面的電壓，將其最大值作為剝離電壓。需要說明的是，作為測定器，使用電位測定機(春日電器株式會社製造、商品名「KSD-0103」)。此外，測定環境設為23℃、50%RH。After leaving the evaluation sample in an environment of 23°C and 50% RH for one day, grasp the protruding part of the release film and peel the release film at a peeling angle of 150° and a peeling speed of 300 mm/min (or a peeling speed of 30 m/min) peel along the length direction. At a position 100 mm away from the separation of the type film and the adhesive sheet in a direction perpendicular to the adhesive surface, measure the voltage on the surface of the adhesive layer generated during peeling, and use its maximum value as the peeling voltage. In addition, as a measuring device, a potential measuring machine (manufactured by Kasuga Electric Co., Ltd., trade name "KSD-0103") was used. In addition, the measurement environment was set to 23°C and 50%RH.

(2)表面電阻率 在溫度23℃、50%RH的氛圍下，使用市售的電阻率計在23℃、50%RH的氛圍下基於在施加電壓100V、施加時間30秒的條件下測定面塗層表面的電阻率。作為電阻率計，可使用MITSUBISHI CHEMICAL ANALYTECH公司製的商品名「HIRESTA UP MCP-HT450型」或其類似製品。在面塗層的塗佈後即刻(初始表面電阻率)測定表面電阻率及在23℃×50%RH環境下照射紫外線(UV照射)且靜置後測定表面電阻率，分別作為初始表面電阻率[Ω/□]、UV照射後表面電阻率[Ω/□]。UV照射條件設為使用金屬鹵化物燈、照度90 mW/cm 2、累積光量3000 mJ/cm 2。照度及累積光量使用紫外線照度計(EYEGRAPHICS公司製、商品名「EYE UVMETER UVPF―A1」, Headsensor「PD-365」)進行測定。 (2) Surface resistivity was measured using a commercially available resistivity meter in an atmosphere of 23°C and 50% RH with an applied voltage of 100V and an application time of 30 seconds. The resistivity of the coating surface. As a resistivity meter, "HIRESTA UP MCP-HT450 type" manufactured by MITSUBISHI CHEMICAL ANALYTECH Co., Ltd. or a similar product can be used. The surface resistivity is measured immediately after the topcoat is applied (initial surface resistivity) and the surface resistivity is measured after irradiation with ultraviolet rays (UV irradiation) in an environment of 23°C × 50% RH and allowed to stand, respectively, as the initial surface resistivity. [Ω/□], surface resistivity after UV irradiation [Ω/□]. The UV irradiation conditions were set to use a metal halide lamp, illumination intensity of 90 mW/cm 2 , and cumulative light amount of 3000 mJ/cm 2 . The illuminance and the accumulated light amount were measured using an ultraviolet illuminance meter (manufactured by EYEGRAPHICS, trade name "EYE UVMETER UVPF-A1", Headsensor "PD-365").

膠面表面電阻率表示黏合劑層之表面電阻率。膠面表面電阻率之量測，探針接觸的係黏合劑層表面。The surface resistivity of the adhesive surface represents the surface resistivity of the adhesive layer. When measuring the surface resistivity of the adhesive surface, the probe contacts the surface of the adhesive layer.

背面表面電阻率表示基材層背面之表面電阻率。背面表面電阻率之量測，探針接觸的係基材層背面，即基材層的與黏合層相反面。The back surface resistivity represents the surface resistivity of the back surface of the base material layer. For the measurement of back surface resistivity, the probe contacts the back side of the base material layer, that is, the side of the base material layer opposite to the adhesive layer.

背面表面電阻率及膠面表面電阻率(1.5倍擴膜後)Back surface resistivity and rubber surface resistivity (after 1.5 times expansion)

使用擴摸設備將實例得到的黏合片擴展1.5倍後，使用上述擴摸前的方法對黏合片表面進行表面電阻率測試。After using the expansion equipment to expand the adhesive sheet obtained in the example 1.5 times, use the above method before expansion to conduct a surface resistivity test on the surface of the adhesive sheet.

(3)紫外線(UV)照射前黏合力 在23℃/50%RH遮蔽紫外線的環境下，將切成20 mm寬的黏合片之黏合劑層面黏貼於SUS430BA板(黏貼條件：2kg輥往返1次)。黏貼且經過20至40分鐘後，自SUS430BA板剝離黏合片，測定剝離強度(剝離速度：300 mm/分鐘、剝離角度：90°)。 (3) Adhesion before ultraviolet (UV) irradiation In a UV-blocking environment of 23℃/50%RH, the adhesive layer cut into a 20 mm wide adhesive sheet is pasted on the SUS430BA board (pasting conditions: 2kg roller reciprocates once). After 20 to 40 minutes of adhesion, the adhesive sheet was peeled off from the SUS430BA board, and the peel strength was measured (peeling speed: 300 mm/min, peeling angle: 90°).

(4)UV照射後黏合力(室溫條件下，23℃) 與上述(3)同樣地將黏合片黏貼於SUS430BA板，遮蔽紫外線的環境下靜置20至40 min。 (4) Adhesion after UV irradiation (at room temperature, 23°C) Paste the adhesive sheet on the SUS430BA board in the same manner as in (3) above, and let it sit for 20 to 40 minutes in a UV-shielded environment.

然後，使用高壓汞燈(UM-810(日機))自黏合片側對該層疊體照射紫外線(28mW/cm 2、10秒、280 mJ/cm 2)。 Then, the laminate was irradiated with ultraviolet rays (28 mW/cm 2 , 10 seconds, 280 mJ/cm 2 ) from the adhesive sheet side using a high-pressure mercury lamp (UM-810 (Japanese manufacturer)).

接著，自SUS430BA板剝離黏合片，測定剝離強度(剝離速度：300 mm/分鐘、剝離角度：90°)。Next, the adhesive sheet was peeled off from the SUS430BA board, and the peel strength was measured (peeling speed: 300 mm/min, peeling angle: 90°).

(5)拉伸斷裂強度 對於黏合片之拉伸斷裂強度，依據JIS K6251：2010中規定的方法來測定。更具體而言，拉伸試驗機使用台式精密萬能試驗機Autograph AG-5KNX(島津製作所製)，在測定溫度25℃、拉伸速度200 mm/分鐘、初始的夾具間距離40 mm或20 mm的測定條件下、對製成啞鈴狀號形或啞鈴狀號形(平行部分之寬度10 mm)的試驗片之長度方向(MD方向)或寬度方向(TD方向)實施拉伸試驗。然後，求出直至試驗片被切斷為止所記錄的最大的拉伸力，將其作為試驗片之拉伸斷裂強度(單位：MPa)。 (5) Tensile breaking strength The tensile breaking strength of the adhesive sheet was measured according to the method specified in JIS K6251:2010. More specifically, the tensile testing machine used a desktop precision universal testing machine Autograph AG-5KNX (manufactured by Shimadzu Corporation), and the measurement temperature was 25°C, the tensile speed was 200 mm/min, and the initial distance between clamps was 40 mm or 20 mm. Under the measurement conditions, a tensile test is performed in the longitudinal direction (MD direction) or the width direction (TD direction) of a test piece formed into a dumbbell-shaped horn or a dumbbell-shaped horn (width of parallel portion 10 mm). Then, the maximum tensile force recorded until the test piece was cut was determined and used as the tensile breaking strength (unit: MPa) of the test piece.

(6)擴膜後晶片排列規整性 將晶片以橫縱向相同的間距排列在黏合片膠面上，使用擴膜設備將黏合片擴展1.5倍後，量測晶片橫縱向的間距變化率。MD/TD變化率之比在0.8至1.2之間視為「◎」；若MD/TD變化率之比超過1.2倍，但沒有發生破膜，視為「○」；若無法擴膜或者發生破膜，視為「×」。 (6) Regularity of wafer arrangement after film expansion Arrange the wafers on the adhesive surface with the same horizontal and vertical spacing, use a film expansion device to expand the adhesive sheet 1.5 times, and then measure the change rate of the wafer spacing in both the horizontal and vertical directions. The MD/TD change rate ratio is between 0.8 and 1.2 as "◎"; if the MD/TD change rate ratio exceeds 1.2 times but no membrane rupture occurs, it is regarded as "○"; if the membrane cannot expand or rupture occurs Membrane is regarded as "×".

(7)黏合劑層之內聚模數G'(MPa) (23℃-UV前) 使用TA公司的扭轉流變儀ARES G2採用振盪模式對UV前的黏合劑層進行溫度掃描，頻率1Hz，溫度範圍為-70℃至100℃，取23℃時的儲能模數為G'。 (7) Cohesive modulus G' (MPa) of the adhesive layer (23℃-before UV) The torsional rheometer ARES G2 of TA Company was used to conduct temperature scanning of the adhesive layer before UV in oscillation mode with a frequency of 1Hz and a temperature range of -70°C to 100°C. The energy storage modulus at 23°C was taken as G'.

(8)黏合劑層之損耗模數G''(MPa) (23℃-UV前) 使用TA公司的扭轉流變儀ARES G2採用振盪模式對UV前的黏合劑層進行溫度掃描，頻率1Hz，溫度範圍為-70℃至100℃，取23℃時的損耗模數為G''。 (8) Loss modulus G'' (MPa) of the adhesive layer (23℃-before UV) The torsional rheometer ARES G2 of TA Company was used to conduct temperature scanning of the adhesive layer before UV in oscillation mode with a frequency of 1Hz and a temperature range of -70°C to 100°C. The loss modulus at 23°C was taken as G''.

(9)斷裂伸長率 對於各實例及各比較例中得到的黏合片，將各實例及各比較例中得到的黏合片切割為寬20 mm、長150 mm的尺寸製作試驗片。然後，將試驗片長度設定為50 mm，在溫度23℃、相對濕度50%的測定環境下，使用萬能材料試驗機(島津製作所製造、產品名「AG-X plus 電子萬能試驗機」)，以300 mm/分鐘的拉伸速度進行拉伸試驗，測定樣品的斷裂伸長率(%)。結果如表2及表3所示。 (9) Elongation at break The adhesive sheet obtained in each example and each comparative example was cut into a size of 20 mm in width and 150 mm in length to prepare a test piece. Then, the length of the test piece was set to 50 mm, and a universal material testing machine (manufactured by Shimadzu Corporation, product name "AG-X plus electronic universal testing machine") was used in a measurement environment with a temperature of 23°C and a relative humidity of 50%. A tensile test was conducted at a tensile speed of 300 mm/min, and the elongation at break (%) of the sample was measured. The results are shown in Table 2 and Table 3.

(10)UV前對基板貼合性 使用5kg的滾輪將黏合片貼合在封裝基板上，置放1H後觀測。黏合片與封裝基板之間貼合良好、無氣泡視為「◎」；黏合片與封裝基板之間有氣泡視為「○」。 (10) Adhesion to substrate before UV Use a 5kg roller to attach the adhesive sheet to the packaging substrate and observe after placing it for 1 hour. Good adhesion between the adhesive sheet and the packaging substrate and no bubbles are regarded as "◎"; bubbles between the adhesive sheet and the packaging substrate are regarded as "○".

(11)UV後機械取片率 對加工後的黏合片照射300 mJ/cm 2能量的紫外線，使用自動拾片裝置，拾取黏合片上的電子元器件。99%以上的電子元器件能被自動拾取，視為「◎」；95%以上且小於99%的電子元器件能被自動拾取，視為「○」；90%以下的電子元器件能被自動拾取，視為「×」。 (11) Mechanical pick-up rate after UV The processed adhesive sheet is irradiated with ultraviolet light of 300 mJ/cm 2 energy, and an automatic pick-up device is used to pick up the electronic components on the adhesive sheet. If more than 99% of the electronic components can be automatically picked up, it is regarded as "◎"; if more than 95% and less than 99% of the electronic components can be automatically picked up, it is regarded as "○"; if less than 90% of the electronic components can be automatically picked up, it is regarded as "○" Pick it up and treat it as "×".

(12)擴膜性(MD/TD) 在黏合片上畫一個3×3cm的網格，使用自動擴膜機(WE-4U(美壯精密機電)測試條件1.5倍擴膜，上升速度：5mm/s；上升高度56mm；加熱上盤50℃；加熱下盤170℃)將黏合片延360°均勻擴開1.5倍，取出後置放1H後觀測，量測網格點間距的變化。若黏合片不發生坍塌、破膜，同時網格點間距相差不超過5%，視為「◎」；若黏合片完整，網格點間距相差超過5%，視為「○」；若黏合片發生坍塌、破膜，視為「×」。 (12) Film expansion (MD/TD) Draw a 3×3cm grid on the adhesive sheet, use an automatic film expansion machine (WE-4U (Meizhuang Precision Electromechanical) test conditions to expand the film 1.5 times, rising speed: 5mm/s; rising height 56mm; heating upper plate 50℃ ; Heating the lower plate to 170°C) evenly expand the adhesive sheet 1.5 times along 360°, take it out and place it for 1 hour before observing to measure the change in grid point spacing. If the adhesive sheet does not collapse or break, and the difference between the grid point spacing does not exceed 5%, it is regarded as "◎"; if the adhesive sheet is intact and the grid point spacing differs by more than 5%, it is regarded as "○"; if the adhesive sheet If collapse or membrane rupture occurs, it is regarded as "×".

(13)陷晶 將1mm×1mm的矽晶片置放在黏合片膠面，貼合離型膜後，使用5kg滾輪往復壓合5次，放入50℃環境箱中24H後取出，照射300 mJ/cm 2紫外線，取出晶片後在雷射顯微鏡下量測晶片陷入深度。若晶片陷入深度不超過黏合片膠層厚度的1/3則視為「◎」；若晶片陷入深度超過1/3但不超過2/3，視為「○」；若晶片陷入深度超過2/3，視為「×」。 (13) Crystal trapping: Place a 1mm × 1mm silicon wafer on the adhesive surface. After attaching the release film, use a 5kg roller to reciprocate and press it 5 times. Place it in a 50°C environmental box for 24 hours and then take it out. Irradiate 300 mJ /cm 2 ultraviolet light, take out the wafer and measure the wafer sinking depth under a laser microscope. If the sinking depth of the chip does not exceed 1/3 of the thickness of the adhesive layer, it is regarded as "◎"; if the sinking depth of the chip exceeds 1/3 but does not exceed 2/3, it is regarded as "○"; if the sinking depth of the chip exceeds 2/3 3, regarded as "×".

(14)殘膠性 上述測試UV前後黏合力過程中，觀測SUS430BA板是否有殘膠。沒有殘膠則視為「◎」；有殘膠則視為「×」。 (14) Residual glue property During the above process of testing the adhesive force before and after UV, observe whether there is any residual glue on the SUS430BA board. If there is no residual glue, it will be regarded as "◎"; if there is residual glue, it will be regarded as "×".

(15)綜合判定 將上述測定值均優異且評價結果均為「◎」視為「◎」；將上述測定值均優異且評價結果中存在至少一個「○」時視為「○」；將上述測定值為差且評價結果中存在至少一個「×」時視為「×」。 (15) Comprehensive judgment The above-mentioned measured values are all excellent and the evaluation results are all "◎" as "◎"; the above-mentioned measured values are all excellent and there is at least one "○" in the evaluation results as "○"; the above-mentioned measured values are poor and If there is at least one "×" in the evaluation result, it is regarded as "×".

如表2所示，實例1至6能夠充分抑制剝離時產生的剝離靜電，具有優異的抗靜電性，能夠避免或減輕對被黏物造成損傷(例如具有優異的耐靜電擊穿能力)，且在使用之後可容易剝離而不產生殘膠污染。As shown in Table 2, Examples 1 to 6 can fully suppress the peeling static generated during peeling, have excellent antistatic properties, and can avoid or reduce damage to the adherend (for example, have excellent resistance to electrostatic breakdown), and It can be easily peeled off after use without causing residual glue contamination.

與之相對，如表3所示，比較例1至4自被黏附體上剝離黏合片時會產生靜電，被黏附體所帶的靜電具有導致內置的電子部件惡化且擊穿的危險性，且在使用之後產生殘膠污染。In contrast, as shown in Table 3, in Comparative Examples 1 to 4, static electricity was generated when the adhesive sheet was peeled off from the adherend. The static electricity carried by the adherend has the risk of causing deterioration and breakdown of the built-in electronic components, and Residual glue pollution occurs after use.

產業上的可利用性 本發明之黏合片能夠充分抑制剝離時產生的剝離靜電，具有優異的抗靜電性及剝離靜電壓的經時穩定性，從而避免或減輕對被黏物造成損傷(例如具有優異的耐靜電擊穿能力)，且在使用之後可容易剝離而不產生殘膠污染。 Industrial availability The adhesive sheet of the present invention can fully suppress the peeling static electricity generated during peeling, and has excellent antistatic properties and the stability of the peeling static voltage over time, thereby avoiding or reducing damage to the adherend (for example, having excellent resistance to electrostatic breakdown) ability), and can be easily peeled off after use without causing residual glue pollution.

1:黏合片 2:黏合片 3:黏合片 10:基材層 20:黏合劑層 30:背塗層 40:底塗層 1: Adhesive sheet 2: Adhesive sheet 3: Adhesive sheet 10:Substrate layer 20: Adhesive layer 30:Back coating 40: Base coat

圖1係示意性表示本發明一個實施例的黏合片之結構的截面圖。 圖2係示意性表示本發明之另一實施例的黏合片之結構的截面圖。 圖3係示意性表示本發明之又一實施例的黏合片之結構的截面圖。 FIG. 1 is a cross-sectional view schematically showing the structure of an adhesive sheet according to one embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing the structure of an adhesive sheet according to another embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing the structure of an adhesive sheet according to another embodiment of the present invention.

1:黏合片 1: Adhesive sheet

10:基材層 10:Substrate layer

20:黏合劑層 20: Adhesive layer

Claims (10)

一種黏合片，其特徵在於，其具備：基材層、以及設置於上述基材層的一側上的黏合劑層， 其中，在剝離速度為300 mm/分鐘的剝離試驗中，上述黏合片自離型膜上剝離產生的剝離靜電壓為500 V以下。 An adhesive sheet, characterized in that it includes: a base material layer, and an adhesive layer provided on one side of the base material layer, Among them, in the peeling test at a peeling speed of 300 mm/min, the peeling static voltage generated by peeling off the above-mentioned adhesive sheet from the release film was below 500 V. 如請求項1之黏合片，其中在剝離速度為30 m/分鐘的剝離試驗中，上述黏合片自離型膜上剝離產生的剝離靜電壓為200V以下； 較佳地，在剝離速度為30 m/分鐘的剝離試驗中，上述黏合片自離型膜上剝離產生的剝離靜電壓為100V以下； 較佳地，上述黏合片之至少一個表面之表面電阻率為1.0×10 5至1.0×10 11Ω/□； 較佳地，上述黏合片經1至1.5倍360°方向拉伸後，上述基材層之表面電阻率為1.0×10 5至1.0×10 11Ω/□，上述黏合片之表面電阻率為1.0×10 11Ω/□以下。 Such as the adhesive sheet of claim 1, wherein in the peeling test at a peeling speed of 30 m/min, the peeling static voltage generated by the peeling of the above-mentioned adhesive sheet from the release film is less than 200V; preferably, the peeling speed is 30 m/min. /min peeling test, the peeling static voltage generated by peeling off the above-mentioned adhesive sheet from the release film is below 100V; Preferably, the surface resistivity of at least one surface of the above-mentioned adhesive sheet is 1.0×10 5 to 1.0×10 11 Ω/□; Preferably, after the above-mentioned adhesive sheet is stretched 1 to 1.5 times in the 360° direction, the surface resistivity of the above-mentioned base material layer is 1.0×10 5 to 1.0×10 11 Ω/□, and the surface of the above-mentioned adhesive sheet The resistivity is 1.0×10 11 Ω/□ or less. 如請求項1或2之黏合片，其中上述黏合劑層包括基礎聚合物、多官能寡聚物及抗靜電劑。The adhesive sheet of claim 1 or 2, wherein the adhesive layer includes a base polymer, a multifunctional oligomer and an antistatic agent. 如請求項3之黏合片，其中上述基礎聚合物包含丙烯酸系聚合物； 較佳地，基於上述基礎聚合物的全部單體成分100重量份，上述基礎聚合物包含0.5至30重量份、較佳1至20重量份、更佳3至15重量份的機能性單體； 較佳地，上述機能性單體包含選自由含羥基單體、含羧基單體、含磺酸基單體、含有磷酸基之單體、含環氧基之單體、含異氰酸基之單體、含醯胺基之單體、具有含氮原子的環之單體、具有琥珀醯亞胺骨架之單體、馬來醯亞胺類單體、衣康醯亞胺類單體、(甲基)丙烯酸胺基烷基酯類單體、(甲基)丙烯酸烷氧基烷基酯類單體、乙烯基醚類單體及烯烴類單體組成之群中之至少一者。 The adhesive sheet of claim 3, wherein the base polymer includes an acrylic polymer; Preferably, based on 100 parts by weight of all monomer components of the above-mentioned base polymer, the above-mentioned base polymer contains 0.5 to 30 parts by weight, preferably 1 to 20 parts by weight, and more preferably 3 to 15 parts by weight of functional monomers; Preferably, the above-mentioned functional monomers include monomers selected from the group consisting of hydroxyl-containing monomers, carboxyl-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, epoxy group-containing monomers, and isocyanate group-containing monomers. Monomers, monomers containing amide groups, monomers with rings containing nitrogen atoms, monomers with succinimide skeleton, maleimine monomers, itaconidimine monomers, ( At least one of the group consisting of meth)acrylic acid aminoalkyl ester monomers, (meth)acrylic acid alkoxyalkyl ester monomers, vinyl ether monomers and olefin monomers. 如請求項3之黏合片，其中上述多官能寡聚物的官能度為2以上，較佳3以上，更佳5以上； 較佳地，上述多官能寡聚物包含選自由丙烯酸改性樹脂、聚胺酯改性樹脂、環氧改性樹脂、酚醛改性樹脂、聚醚改性樹脂、聚酯改性樹脂及有機矽改性樹脂組成之群中之至少一者； 較佳地，上述多官能寡聚物包含聚胺酯改性丙烯酸樹脂、丙烯酸改性聚胺酯樹脂、環氧改性丙烯酸樹脂、環氧改性聚胺酯樹脂、鄰甲酚醛改性樹脂、酚醛改性丙烯酸樹脂、酚醛改性聚胺酯樹脂、酚醛改性環氧樹脂、聚醚改性丙烯酸酯樹脂、聚酯改性丙烯酸酯樹脂及有機矽改性丙烯酸酯樹脂中之至少一者； 較佳地，上述多官能寡聚物包含選自由聚胺酯改性丙烯酸酯、環氧改性丙烯酸酯、聚醚改性丙烯酸酯、聚酯改性丙烯酸酯及有機矽改性丙烯酸酯組成之群中之至少一者； 較佳地，相對於上述基礎聚合物100重量份，上述多官能寡聚物之含量為20至200重量份，較佳30至150重量份，更佳40至120重量份。 Such as the adhesive sheet of claim 3, wherein the functionality of the above-mentioned multifunctional oligomer is 2 or more, preferably 3 or more, more preferably 5 or more; Preferably, the above-mentioned multifunctional oligomers include acrylic modified resin, polyurethane modified resin, epoxy modified resin, phenolic modified resin, polyether modified resin, polyester modified resin and silicone modified resin. At least one member of the group consisting of resin; Preferably, the above-mentioned multifunctional oligomers include polyurethane-modified acrylic resin, acrylic acid-modified polyurethane resin, epoxy-modified acrylic resin, epoxy-modified polyurethane resin, o-cresol-modified resin, phenolic-modified acrylic resin, At least one of phenolic modified polyurethane resin, phenolic modified epoxy resin, polyether modified acrylate resin, polyester modified acrylate resin and silicone modified acrylate resin; Preferably, the above-mentioned multifunctional oligomers include polyurethane-modified acrylates, epoxy-modified acrylates, polyether-modified acrylates, polyester-modified acrylates, and silicone-modified acrylates. At least one of them; Preferably, the content of the polyfunctional oligomer is 20 to 200 parts by weight, preferably 30 to 150 parts by weight, and more preferably 40 to 120 parts by weight relative to 100 parts by weight of the base polymer. 如請求項3之黏合片，其中上述抗靜電劑包括選自由導電性聚合物、導電性無機微粒、金屬微粒或纖維、離子型化合物及離子型界面活性劑組成之群中之至少一者； 較佳地，上述導電性聚合物包含選自由聚苯胺、聚吡咯、聚噻吩、聚喹㗁啉、聚乙炔、聚乙烯亞胺及烯丙基胺系聚合物組成之群中之至少一者； 較佳地，上述導電性無機微粒包含選自由導電性金屬氧化物、碳奈米管、石墨烯、富勒烯、乙炔黑、科琴黑、天然石墨、人造石墨及鈦黑組成之群中之至少一者； 較佳地，上述金屬微粒或纖維包含金、銀、銅、鋁、鎳或其合金構成的微粒或奈米線； 較佳地，上述離子型化合物包含鹼金屬鹽及/或有機陽離子-陰離子鹽； 較佳地，上述離子型界面活性劑包含選自由陽離子型界面活性劑、陰離子型界面活性劑、兩性離子型界面活性劑及非離子型界面活性劑組成之群中之至少一者； 較佳地，相對於上述基礎聚合物100重量份，上述抗靜電劑之含量為0.0001至20重量份，較佳0.0002至10重量份。 The adhesive sheet of claim 3, wherein the antistatic agent includes at least one member selected from the group consisting of conductive polymers, conductive inorganic particles, metal particles or fibers, ionic compounds and ionic surfactants; Preferably, the conductive polymer includes at least one selected from the group consisting of polyaniline, polypyrrole, polythiophene, polyquinoline, polyacetylene, polyethyleneimine and allylamine polymers; Preferably, the conductive inorganic particles include conductive metal oxides, carbon nanotubes, graphene, fullerene, acetylene black, Ketjen black, natural graphite, artificial graphite and titanium black. at least one; Preferably, the above-mentioned metal particles or fibers include particles or nanowires composed of gold, silver, copper, aluminum, nickel or alloys thereof; Preferably, the above-mentioned ionic compound includes an alkali metal salt and/or an organic cation-anion salt; Preferably, the ionic surfactant includes at least one selected from the group consisting of cationic surfactants, anionic surfactants, zwitterionic surfactants and nonionic surfactants; Preferably, the content of the antistatic agent is 0.0001 to 20 parts by weight, preferably 0.0002 to 10 parts by weight relative to 100 parts by weight of the base polymer. 如請求項1或2之黏合片，其中上述黏合劑層亦包括光引發劑及/或交聯劑； 較佳地，相對於上述基礎聚合物100重量份，上述光引發劑之含量為0.5至10重量份，較佳0.5至5重量份； 較佳地，相對於上述基礎聚合物100重量份，上述交聯劑之含量為0.1至10重量份，較佳0.1至5重量份。 The adhesive sheet of claim 1 or 2, wherein the adhesive layer also includes a photoinitiator and/or cross-linking agent; Preferably, the content of the above-mentioned photoinitiator is 0.5 to 10 parts by weight, preferably 0.5 to 5 parts by weight relative to 100 parts by weight of the above-mentioned base polymer; Preferably, the content of the cross-linking agent is 0.1 to 10 parts by weight, preferably 0.1 to 5 parts by weight relative to 100 parts by weight of the base polymer. 如請求項1或2之黏合片，其中上述黏合片滿足下述特性(a)至(d)中之至少一者： 特性(a)：利用下式(1)算出的黏合片之黏合力降低率為80%以上， 黏合力降低率(%)=[(N1-N2)/N1]×100   (1) 其中，N1表示上述黏合片之紫外線照射前的黏合力， N2表示上述黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力； 特性(b)：上述黏合片之照射累積光量300 mJ/cm 2的紫外線後的黏合力N2為1 N/20 mm以下； 特性(c)：上述黏合片之紫外線照射前的黏合力N1為0.5至40 N/20 mm； 特性(d)：上述黏合片之長度方向(MD方向)的拉伸斷裂強度與寬度方向(TD方向)的拉伸斷裂強度之比(MD方向的拉伸斷裂強度/ TD方向的拉伸斷裂強度)為0.8至1.2。 The adhesive sheet of claim 1 or 2, wherein the adhesive sheet satisfies at least one of the following characteristics (a) to (d): Characteristic (a): The reduction in the adhesive force of the adhesive sheet calculated using the following formula (1) The rate is more than 80%, and the adhesive force reduction rate (%) = [(N1-N2)/N1]×100 (1) Among them, N1 represents the adhesive force of the above-mentioned adhesive sheet before ultraviolet irradiation, and N2 represents the above-mentioned adhesive sheet after irradiation. The adhesive strength N2 of the above-mentioned adhesive sheet after ultraviolet irradiation with a cumulative light intensity of 300 mJ/cm 2 is 1 N/20 mm or less; Characteristic (c) : The adhesive force N1 of the above-mentioned adhesive sheet before ultraviolet irradiation is 0.5 to 40 N/20 mm; Characteristic (d): The tensile breaking strength in the length direction (MD direction) and the tensile strength in the width direction (TD direction) of the above-mentioned adhesive sheet The ratio of tensile breaking strength (tensile breaking strength in MD direction/tensile breaking strength in TD direction) is 0.8 to 1.2. 如請求項1或2之黏合片，其中上述基材層之厚度為10至300 μm，較佳30至200 μm，更佳50至150 μm； 較佳地，上述基材層包含選自由熱塑性聚胺酯、聚乙烯、聚丙烯、聚丁烯、乙烯-醋酸乙烯酯共聚物及聚氯乙烯組成之群中之至少一者； 較佳地，上述基材層的內部及/或表面包含抗靜電劑。 The adhesive sheet of claim 1 or 2, wherein the thickness of the above-mentioned base material layer is 10 to 300 μm, preferably 30 to 200 μm, more preferably 50 to 150 μm; Preferably, the above-mentioned base material layer includes at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutylene, ethylene-vinyl acetate copolymer and polyvinyl chloride; Preferably, the interior and/or surface of the above-mentioned base material layer contains an antistatic agent. 如請求項1或2之黏合片，其中上述黏合片亦包括底塗層及/或背塗層， 上述背塗層設置於上述基材層的與上述黏合劑層相反的一側， 上述底塗層設置於上述基材層的與上述背塗層相反的一側， 較佳地，上述底塗層包括選自由熱固性的丙烯酸、聚胺酯及環氧體系樹脂組成之群中之至少一者； 較佳地，上述背塗層包括選自由熱固性的丙烯酸、聚胺酯及環氧體系樹脂組成之群中之至少一者。 For example, the adhesive sheet of claim 1 or 2, wherein the adhesive sheet also includes a base coating and/or a back coating, The above-mentioned back coating layer is provided on the side opposite to the above-mentioned adhesive layer of the above-mentioned base material layer, The above-mentioned undercoat layer is provided on the opposite side of the above-mentioned base material layer to the above-mentioned backcoat layer, Preferably, the above-mentioned primer layer includes at least one selected from the group consisting of thermosetting acrylic, polyurethane and epoxy system resin; Preferably, the above-mentioned back coating includes at least one selected from the group consisting of thermosetting acrylic, polyurethane and epoxy system resins.
TW112106977A 2022-03-09 2023-02-24 Adhesive sheet which can fully suppress the peeling static electricity generated during peeling, and has excellent anti-static properties and long-term stability of peeling static voltage TW202344395A (en)

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