TW202339148A - Apparatus and method for attaching heat dissipation sheet - Google Patents
Apparatus and method for attaching heat dissipation sheet Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 19
- 238000004806 packaging method and process Methods 0.000 claims description 136
- 238000007789 sealing Methods 0.000 claims description 26
- 238000010030 laminating Methods 0.000 claims description 16
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing & Machinery (AREA)
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- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本揭露是有關於一種散熱貼片貼合設備及散熱貼片貼合方法。The present disclosure relates to a heat dissipation patch laminating equipment and a heat dissipation patch laminating method.
現行的薄膜覆晶封裝（Chip on Film, COF）結構為增進散熱效果，會採用貼附散熱貼片於薄膜覆晶封裝結構的表面上的方式，藉以增加散熱面積進而提高散熱效果。由於晶片為薄膜覆晶封裝結構最主要的發熱源，將散熱貼片貼附於晶片及其周邊區域的可撓性薄膜上可達到最直接且最佳的散熱效果。In order to improve the heat dissipation effect, the current Chip on Film (COF) structure uses a heat dissipation patch attached to the surface of the Chip on Film packaging structure to increase the heat dissipation area and thereby improve the heat dissipation effect. Since the chip is the main heat source of the film flip-chip packaging structure, attaching the heat dissipation patch to the flexible film in the chip and its surrounding area can achieve the most direct and best heat dissipation effect.
在習知技術中，當將散熱貼片貼附於薄膜覆晶封裝結構已完成封膠的晶片（下稱封膠晶片）上時，因為封膠晶片與可撓性薄膜具有高度差異，為避免貼片吸取頭下壓貼附散熱貼片於薄膜覆晶封裝結構上時，壓觸晶片導致晶片損傷，貼片吸取頭僅會將散熱貼片置放於封膠晶片及其周邊區域的可撓性薄膜上，再利用中央具有對應封膠晶片讓位開槽的滾輪沿著封膠晶片的長邊滾壓散熱貼片位於封膠晶片的長邊兩旁的部分，以使散熱貼片與薄膜覆晶封裝結構緊密地貼合在一起。然而，散熱貼片位於封膠晶片的短邊兩旁的部分由於未受到滾輪滾壓，因而使得散熱貼片在該區域易產生剝離或皺摺等缺陷，進而影響散熱效率，甚至降低產品良率及封裝結構的可靠性。In the conventional technology, when a heat dissipation patch is attached to a wafer that has been sealed with a film flip-chip packaging structure (hereinafter referred to as the sealed wafer), because the sealed wafer and the flexible film are highly different, in order to avoid When the patch pick-up head presses down to attach the heat dissipation patch to the film flip-chip packaging structure, the chip is pressed and damaged, and the patch pick-up head only places the heat dissipation patch on the encapsulated chip and its surrounding area. On the plastic film, use a roller with a groove in the center corresponding to the sealing chip to roll along the long side of the sealing chip to roll the parts of the heat dissipation patch located on both sides of the long sides of the sealing chip, so that the heat dissipation patch and the film cover The chip package structure is tightly fitted together. However, the parts of the heat dissipation patch located on both sides of the short sides of the sealant chip are not rolled by rollers, so the heat dissipation patch is prone to defects such as peeling or wrinkles in this area, which in turn affects the heat dissipation efficiency and even reduces product yield and The reliability of the packaging structure.
本揭露提供一種散熱貼片貼合設備及散熱貼片貼合方法，其可使散熱貼片與封裝結構緊密貼合，因而可提升散熱效率及產品良率。The present disclosure provides a heat dissipation patch bonding equipment and a heat dissipation patch bonding method, which can closely bond the heat dissipation patch with the packaging structure, thereby improving heat dissipation efficiency and product yield.
本揭露的一種散熱貼片貼合設備包括封裝捲帶輸送裝置、貼片吸取頭以及升降平台。封裝捲帶輸送裝置用以承載並輸送封裝捲帶的封裝結構至工作區。貼片吸取頭可移動地設置於工作區上方並經配置以吸取散熱貼片並將散熱貼片壓置於封裝結構上，其中貼片吸取頭具有對應封裝結構的封膠晶片的凹口，當貼片吸取頭將散熱貼片壓置於封裝結構上時，封膠晶片的多個側表面被凹口的多個側壁所環繞。升降平台設置於工作區並位於封裝捲帶下方以將封裝捲帶以及貼片吸取頭向上頂升，以使散熱貼片貼合於封裝結構。The disclosed heat dissipation patch laminating equipment includes a packaging tape conveying device, a patch suction head and a lifting platform. The packaging tape conveying device is used to carry and transport the packaging structure of the packaging tape to the work area. The patch pick-up head is movably disposed above the work area and is configured to pick up the heat dissipation patch and press the heat dissipation patch onto the packaging structure. The patch pick-up head has a notch corresponding to the sealing chip of the packaging structure. When the patch pick-up head presses the heat dissipation patch onto the packaging structure, multiple side surfaces of the encapsulated chip are surrounded by multiple side walls of the notch. The lifting platform is set in the work area and is located under the packaging tape to lift the packaging tape and the patch suction head upward so that the heat dissipation patch can fit into the packaging structure.
本揭露的一種散熱貼片貼合方法包括下列步驟。以封裝捲帶輸送裝置承載封裝捲帶並將封裝捲帶的封裝結構輸送至工作區。以貼片吸取頭吸取散熱貼片並移動至工作區的上方，其中貼片吸取頭具有凹口。將吸取散熱貼片的貼片吸取頭朝工作區的方向移動至貼片吸取頭將散熱貼片壓置於封裝結構上，其中當貼片吸取頭將散熱貼片壓置於封裝結構上時，封裝結構的封膠晶片的多個側表面被凹口的多個側壁所環繞。以升降平台頂升封裝捲帶以及貼片吸取頭，以使散熱貼片貼合於封裝結構。A heat dissipation patch bonding method disclosed in the present disclosure includes the following steps. The packaging tape conveyor is used to carry the packaging tape and transport the packaging structure of the packaging tape to the work area. Use the chip suction head to suck up the heat dissipation patch and move it to the top of the work area, where the chip suction head has a notch. Move the chip suction head that absorbs the heat dissipation patch toward the working area to the chip suction head and press the heat dissipation patch on the packaging structure. When the chip suction head presses the heat dissipation patch on the packaging structure, Multiple side surfaces of the encapsulated wafer of the packaging structure are surrounded by multiple side walls of the recess. Use the lifting platform to lift the packaging tape and the patch pick-up head so that the heat dissipation patch fits the packaging structure.
基於上述，本揭露的散熱貼片貼合設備的貼片吸取頭具有對應封裝結構的封膠晶片的凹口，當貼片吸取頭將散熱貼片壓置於封裝結構上時，封膠晶片的多個側表面分別被凹口的多個側壁所環繞，以使凹口與封裝結構共同形成一封閉空間，以容納封膠晶片。如此，透過貼片吸取頭上對應封膠晶片的凹口的設計，且使封膠晶片的多個側表面都被凹口的多個側壁所環繞，貼片吸取頭的表面可將散熱貼片位於封膠晶片周圍的部分全面地壓合於封裝結構上，使其完整包覆封膠晶片，以防止或減少散熱貼片與封裝結構因貼合不良而導致散熱貼片剝離或是產生皺摺等問題，因此，本揭露的散熱貼片貼合設備及貼合方法可有效提升封裝結構的散熱效率及可靠性。Based on the above, the patch pick-up head of the heat dissipation patch laminating equipment of the present disclosure has a notch corresponding to the sealing wafer of the packaging structure. When the patch pick-up head presses the heat dissipation patch onto the packaging structure, the sealing wafer is The plurality of side surfaces are respectively surrounded by the plurality of side walls of the recess, so that the recess and the packaging structure jointly form a closed space to accommodate the sealing chip. In this way, through the design of the notch on the patch suction head corresponding to the sealing chip, and the multiple side surfaces of the sealing wafer are surrounded by the multiple side walls of the notch, the surface of the patch pickup head can position the heat dissipation patch at the The surrounding parts of the sealing chip are fully pressed onto the packaging structure to completely cover the sealing chip to prevent or reduce the peeling or wrinkles of the heat dissipation patch due to poor fit between the heat dissipation patch and the packaging structure. Therefore, the heat dissipation patch bonding equipment and bonding method disclosed in the present disclosure can effectively improve the heat dissipation efficiency and reliability of the packaging structure.
此外，本揭露的散熱貼片貼合方法先是將貼片吸取頭往下移動至將散熱貼片初步地輕壓置放於封裝結構上。接著，升降平台再往上移動，以頂升封裝捲帶以及貼片吸取頭，藉由貼片吸取頭與升降平台相反方向的力量相互夾持，即可使散熱貼片緊密地貼附於封裝結構上，省略了傳統製程中須透過滾輪滾壓散熱貼片以緊密地貼合散熱貼片於封裝結構上的步驟，進而簡化散熱貼片貼合製程。In addition, the heat dissipation patch bonding method of the present disclosure first moves the patch suction head downward to initially lightly press the heat dissipation patch and place it on the package structure. Then, the lifting platform moves upward to lift the packaging tape and the patch pick-up head. The heat-dissipation patch can be tightly attached to the package by clamping the patch pick-up head and the lifting platform in opposite directions. Structurally, the step of rolling the heat dissipation patch through a roller to closely fit the heat dissipation patch on the package structure in the traditional manufacturing process is omitted, thereby simplifying the heat dissipation patch bonding process.
有關本揭露之前述及其他技術內容、特點與功效，在以下配合參考圖式之各實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而並非用來限制本揭露。並且，在下列各實施例中，相同或相似的元件將採用相同或相似的標號。The aforementioned technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of each embodiment with reference to the drawings. Directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the disclosure. Furthermore, in the following embodiments, the same or similar elements will be given the same or similar numbers.
圖1是依照本揭露的一實施例的一種散熱貼片貼合設備的局部示意圖。圖2是依照本揭露的一實施例的一種散熱貼片貼合設備的封裝捲帶輸送裝置承載並輸送封裝捲帶的示意圖。請同時參照圖1及圖2，在一些實施例中，散熱貼片貼合設備100可包括封裝捲帶輸送裝置110、貼片吸取頭130以及升降平台120。在本實施例中，封裝捲帶輸送裝置110可包括用以承載並輸送封裝捲帶201的輸送軌道，其可由第一軌架111及第二軌架113所構成。在本實施例中，第一軌架111及第二軌架113可分別位於封裝捲帶201的相對兩側，以共同承載封裝捲帶201。在本實施例中，封裝捲帶輸送裝置110更包括兩個捲帶轉盤114、116，分別設置於第一軌架111及第二軌架113所定義出的輸送軌道的相對兩端，封裝捲帶201的兩端可分別捲繞於捲帶轉盤114、116上，藉由轉動捲帶轉盤114、116以透過張力帶動封裝捲帶201沿著輸送軌道移動，並將封裝捲帶201上的多個封裝結構200依序傳送至輸送軌道中的一工作區112。在本實施例中，封裝結構200可為薄膜覆晶封裝結構，封裝捲帶201可包括一薄膜基材210、定義於薄膜基材210上的多個封裝單元211以及分別設置於這些封裝單元211中的多個封膠晶片220。這些封裝單元211間隔且依序排列於薄膜基材210，且各個封裝單元211內具有形成於薄膜基材210上的圖案化金屬層（圖未繪示）。更詳細而言，在本實施例中，各個封裝結構200即為設置有封膠晶片220的各個封裝單元211。換言之，封裝結構200包括薄膜基材210、圖案化金屬層以及電性連接圖案化金屬層的封膠晶片220。此外，在本實施例中，封裝捲帶201是以封膠晶片220朝上的方式輸送。FIG. 1 is a partial schematic diagram of a heat dissipation patch laminating equipment according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a packaging tape conveying device of a heat dissipation patch laminating equipment carrying and transporting packaging tapes according to an embodiment of the present disclosure. Please refer to FIGS. 1 and 2 at the same time. In some embodiments, the heat dissipation
在一實施例中，散熱貼片貼合設備100更可包括散熱貼片輸送裝置150，其可鄰近於封裝捲帶輸送裝置110的工作區112設置。如此配置，貼片吸取頭130可移動地設置於工作區112上方，並經配置以吸取散熱貼片輸送裝置150上的散熱貼片300，並將散熱貼片300壓置於位在工作區112內的封裝結構200上。具體而言，當封裝捲帶201上的封裝結構200被封裝捲帶輸送裝置110輸送至工作區112時，貼片吸取頭130可於散熱貼片輸送裝置150與工作區112之間來回作動，以將散熱貼片300壓置於位在工作區112內的封裝結構200上。舉例來說，貼片吸取頭130可藉由旋轉機構（例如旋轉馬達）160而樞設於多個軸向移動機構（例如X軸移動機構、Y軸移動機構及Z軸移動機構），使貼片吸取頭130可分別沿著多個軸向（例如X軸方向、Y軸方向及Z軸方向）滑移。並且，旋轉機構160可用以旋轉貼片吸取頭130且旋轉機構160能夠繞著Z軸移動機構的Z軸方向轉動，而將散熱貼片輸送裝置150上的散熱貼片300吸附後再將其旋轉對位於位在工作區112的封裝結構200。In one embodiment, the heat dissipation
在一實施例中，升降平台120可設置於工作區112並位於封裝捲帶201的下方，以將封裝捲帶201以及貼片吸取頭130向上頂升，以使散熱貼片300貼合於封裝結構200。在本實施例中，升降平台120可例如沿著Z軸方向移動。換句話說，在貼片吸取頭130將散熱貼片300壓置於位在工作區112的封裝結構200上時，升降平台120可將位於工作區112的封裝捲帶201以及貼片吸取頭130一起沿著Z軸方向頂升，使得貼片吸取頭130可獲致相對方向的頂抵力量而可更緊密地將散熱貼片300貼附於封裝結構200上。In one embodiment, the
圖3是依照本揭露的一實施例的一種散熱貼片貼合設備的封裝捲帶輸送裝置承載封裝捲帶的剖面示意圖。請同時參照圖2及圖3，在本實施例中，第一軌架111及第二軌架113可分別具有L型的剖面形狀，封裝捲帶201的相對兩側可分別如圖3所示地承靠於第一軌架111及第二軌架113的L型平台部上。在一實施例中，封裝捲帶201的相對兩側邊為傳動區，傳動區內可包括以一固定間距接續排列的多個傳動孔212，而封裝捲帶201是以傳動區承靠於第一軌架111及第二軌架113的平台部上，以減少封裝捲帶201與第一軌架111及第二軌架113的摩擦面積，進而降低靜電及金屬微粒產生機率。此外，請參考圖3，在本實施例中，封膠晶片220為已完成封膠的晶片結構，其可包括晶片221與封裝膠體222。封裝膠體222填充於晶片221與薄膜基材210之間並且包覆晶片221的側壁，藉以保護晶片221以及晶片221與薄膜基材210的電性接點，防止水氣或異物進入晶片221的接合區域內部。在本實施例中，封裝膠體222的材質可例如是底部填充膠（underfill），且形成封裝膠體222的方法可例如是點膠方式。3 is a schematic cross-sectional view of a packaging tape conveying device of a heat dissipation patch laminating equipment carrying a packaging tape according to an embodiment of the present disclosure. Please refer to Figures 2 and 3 at the same time. In this embodiment, the
圖4是依照本揭露的一實施例的一種散熱貼片貼合設備的貼片吸取頭的底視示意圖。圖5是依照本揭露的一實施例的一種貼合散熱貼片的封裝結構的俯視示意圖。請同時參照圖4及圖5，其中，圖5繪示了封裝捲帶201上的多個封裝結構200的其中之一作為示例。在本實施例中，貼片吸取頭130可包括對應封裝結構200的封膠晶片220的凹口132，且凹口132形成在貼片吸取頭130朝向封裝結構200的表面131。此外，在本實施例中，貼片吸取頭130可為真空吸附壓合頭，更詳細而言，貼片吸取頭130的表面131可具有多個真空孔138，以利用真空吸附而使散熱貼片300穩固地被吸附於貼片吸取頭130的表面131上。在本實施例中，封裝結構200還可包括防銲層230，防銲層230局部覆蓋圖案化線路層且暴露出設置晶片221的區域。如圖5所示，當散熱貼片300貼合於封裝結構200時，散熱貼片300是貼附於封膠晶片220及封膠晶片220周邊的防銲層230上。4 is a schematic bottom view of a patch suction head of a heat dissipation patch bonding equipment according to an embodiment of the present disclosure. FIG. 5 is a schematic top view of a packaging structure with a heat dissipation patch according to an embodiment of the present disclosure. Please refer to FIGS. 4 and 5 simultaneously. FIG. 5 illustrates one of the
圖6至圖8是依照本揭露的一實施例的一種使用散熱貼片貼合設備貼合散熱貼片的方法流程示意圖。請先參照圖1及圖6，在將散熱貼片300貼合於封裝結構200具有封膠晶片220的表面的流程中，封裝捲帶輸送裝置110會將待作業的封裝結構200輸送至工作區112，此時，貼片吸取頭130可如圖1所示地於散熱貼片輸送裝置150與工作區112之間來回作動，以吸附位在散熱貼片輸送裝置150上的散熱貼片300，並移動至工作區112的上方，且透過影像擷取設備及資訊處理設備計算貼附位置，以將散熱貼片300對位於封裝結構200。6 to 8 are schematic flow diagrams of a method for bonding a heat dissipation patch using a heat dissipation patch bonding equipment according to an embodiment of the present disclosure. Please refer to FIGS. 1 and 6 . During the process of attaching the
請同時參照圖4、圖5及圖7，接著，將吸取散熱貼片300的貼片吸取頭130朝工作區112的方向（即第一方向D1）移動，直至貼片吸取頭130將散熱貼片300壓置於封裝結構200上。當貼片吸取頭130將散熱貼片300壓置於封裝結構200上時，封膠晶片220的多個側表面223（例如四個側表面223）分別被凹口132的多個側壁134（例如四個側壁134）所環繞。更詳細而言，封膠晶片220的多個側表面223是由包覆晶片221的側壁的封裝膠體222所形成。再者，如圖5及圖7所示，凹口132的各個側壁134與封膠晶片220的對應的側表面223之間的最短距離大於零，也就是說，凹口132的各個側壁134不會接觸封膠晶片220的對應的側表面223。舉例而言，在本實施例中，封膠晶片220具有四個側表面223，而凹口132具有對應的四個側壁134。凹口132的四個側壁134與封膠晶片220的對應的四個側表面223之間的最短距離d1、d2、d3、d4，其皆大於零，其中，最短距離d1、d2、d3、d4可全部相等或全部不相等，也可以兩兩相等，例如最短距離d1與最短距離d3相等，最短距離d2與最短距離d4相等，本發明並不加以限制。如此配置，當貼片吸取頭130將散熱貼片300壓置於封裝結構200上時，凹口132與封裝捲帶201共同形成一封閉空間S1，以容納封膠晶片220。進一步而言，當貼片吸取頭130將散熱貼片300壓置於封裝結構200上時，散熱貼片300順應凹口132而形成一容置空間S2包覆封膠晶片220。散熱貼片300對應凹口132之外的其他區域可受到貼片吸取頭130的表面131抵壓，而平整的壓置於封裝結構200上。換言之，散熱貼片300位於封膠晶片220的四個側表面223旁的部分皆可被貼片吸取頭130的表面131抵壓到。因此，透過貼片吸取頭130上對應封膠晶片220的凹口132的設計，且使封膠晶片220的四個側表面223都被凹口132的四個側壁134所環繞，貼片吸取頭130的表面131可將散熱貼片300位於封膠晶片220周圍的部分全面地壓合於封裝結構200上，使其完整包覆封膠晶片220，防止散熱貼片300與封裝結構200因貼合不良而導致散熱貼片300剝離或是產生皺摺等問題，以有效提升封裝結構200的散熱效率及可靠性。Please refer to Figure 4, Figure 5 and Figure 7 at the same time. Then, move the
請同時參照圖7及圖8，當貼片吸取頭130沿第一方向D1移動至將散熱貼片300壓置於封裝結構200上時，貼片吸取頭130向下抵壓封裝捲帶201至第一高度h1，並將散熱貼片300輕壓置放於封裝結構200上。接著，升降平台120沿第二方向D2頂升封裝捲帶201以及貼片吸取頭130，以使散熱貼片300緊密貼合於封裝結構200。此時，貼片吸取頭130位於高於第一高度h1的第二高度h2。也就是說，貼片吸取頭130先是往下移動至將散熱貼片300初步地輕壓置放於封裝結構200上，此時，貼片吸取頭130與封裝結構200向下移動至第一高度h1。接著，升降平台120再往上移動，以抵頂並抬升封裝捲帶201以及貼片吸取頭130至第二高度h2，藉由貼片吸取頭130向下的抵壓力量以及升降平台120向上的頂抵力量相互夾持，使得散熱貼片300可緊密地貼附於封裝結構200上。本發明藉由升降平台120來提供向上頂抵致使緊密貼合的力量，由於升降平台120具有較大面積的平整表面，施力可較為均勻，因此，可提升散熱貼片300與封裝結構200的貼合品質。Please refer to FIGS. 7 and 8 at the same time. When the patch pick-up
值得一提的是，為能符合薄膜覆晶封裝結構於後續應用時之彎折需求及維持其可撓特性，一般會採用具可撓性的薄型散熱貼片，其結構通常包括一散熱層、貼合於散熱層一表面的一絕緣保護層及形成於散熱層另一表面的一底部黏膠層。絕緣保護層的材料可例如是聚醯亞胺（polyimide，PI）等可撓性材料，用以保護散熱層，以避免散熱層刮傷受損。散熱層的材料可包括金屬箔或石墨類薄膜，而金屬箔例如是鋁箔或銅箔。絕緣保護層可透過黏膠層貼合於散熱層的表面。當貼片吸取頭130向下壓置散熱貼片300時，凹口132的側壁134會對散熱貼片300產生剪應力，而過於垂直的側壁134對於散熱貼片300產生的瞬間應力較大，可能導致散熱貼片300局部剝離或者散熱貼片300的絕緣保護層與散熱層之間發生脫層的現象。圖9是依照本揭露的一實施例的一種散熱貼片貼合設備的貼片吸取頭的剖面示意圖。在本實施例中，貼片吸取頭130a的凹口132a的頂面136a與多個側壁134a分別夾一鈍角θ1，其中，鈍角θ1約介於100度至120度之間。換句話說，如此配置，凹口132a的側壁134a為一斜面而非垂直面，如此，受貼片吸取頭130a壓合的散熱貼片300也可順著貼片吸取頭130a的斜面側壁134a而以較平緩的坡度由封膠晶片220的頂面延伸貼附至薄膜基材210，因而可降低貼片吸取頭130a壓合時的應力集中問題，進而避免散熱貼片300局部剝離或者散熱貼片300的絕緣保護層與散熱層之間發生脫層的問題。It is worth mentioning that in order to meet the bending requirements of the film flip-chip packaging structure in subsequent applications and maintain its flexibility, a flexible thin heat dissipation patch is generally used. Its structure usually includes a heat dissipation layer, An insulating protective layer attached to one surface of the heat dissipation layer and a bottom adhesive layer formed on the other surface of the heat dissipation layer. The material of the insulating protective layer can be, for example, a flexible material such as polyimide (PI), which is used to protect the heat dissipation layer to prevent the heat dissipation layer from being scratched and damaged. The material of the heat dissipation layer may include metal foil or graphite film, and the metal foil is, for example, aluminum foil or copper foil. The insulating protective layer can be attached to the surface of the heat dissipation layer through the adhesive layer. When the
綜上所述，本揭露的散熱貼片貼合設備的貼片吸取頭具有對應封裝結構的封膠晶片的凹口，當貼片吸取頭將散熱貼片壓置於封裝結構上時，封膠晶片的多個側表面分別被凹口的多個側壁所環繞，以使凹口與封裝結構共同形成一封閉空間，以容納封膠晶片。如此，透過貼片吸取頭上對應封膠晶片的凹口的設計，且使封膠晶片的多個側表面皆被凹口的多個側壁所環繞，貼片吸取頭的表面可將散熱貼片位於封膠晶片周圍的部分全面地壓合於封裝結構上，使其完整包覆封膠晶片，以防止或減少散熱貼片與封裝結構因貼合不良而導致散熱貼片剝離或是產生皺摺等問題，因此，本揭露的散熱貼片貼合設備及貼合方法可有效提升封裝結構的散熱效率及可靠性。To sum up, the patch pick-up head of the heat dissipation patch bonding equipment of the present disclosure has a notch corresponding to the sealant chip of the packaging structure. When the patch pick-up head presses the heat dissipation patch onto the packaging structure, the sealant Multiple side surfaces of the chip are respectively surrounded by multiple side walls of the recess, so that the recess and the packaging structure jointly form a closed space to accommodate the encapsulated chip. In this way, through the design of the notch on the patch pick-up head corresponding to the sealing chip, and the multiple side surfaces of the sealing wafer are surrounded by the multiple side walls of the notch, the surface of the patch pick-up head can position the heat dissipation patch at The surrounding parts of the sealing chip are fully pressed onto the packaging structure to completely cover the sealing chip to prevent or reduce the peeling or wrinkles of the heat dissipation patch due to poor fit between the heat dissipation patch and the packaging structure. Therefore, the heat dissipation patch bonding equipment and bonding method disclosed in the present disclosure can effectively improve the heat dissipation efficiency and reliability of the packaging structure.
此外，本揭露的散熱貼片貼合方法先是將貼片吸取頭往下移動至將散熱貼片初步地輕壓置放於封裝結構上。接著，升降平台再往上移動，以頂升封裝捲帶以及貼片吸取頭，藉由貼片吸取頭與升降平台相反方向的力量相互夾持，即可使散熱貼片緊密地貼附於封裝結構上，省略了傳統製程中須透過滾輪滾壓散熱貼片以緊密地貼合散熱貼片於封裝結構上的步驟，進而簡化散熱貼片貼合製程。In addition, the heat dissipation patch bonding method of the present disclosure first moves the patch suction head downward to initially lightly press the heat dissipation patch and place it on the package structure. Then, the lifting platform moves upward to lift the packaging tape and the patch pick-up head. The heat-dissipation patch can be tightly attached to the package by clamping the patch pick-up head and the lifting platform in opposite directions. Structurally, the step of rolling the heat dissipation patch through a roller to closely fit the heat dissipation patch on the package structure in the traditional manufacturing process is omitted, thereby simplifying the heat dissipation patch bonding process.
100:散熱貼片貼合設備
110:封裝捲帶輸送裝置
111:第一軌架
112:工作區
113:第二軌架
114、116:捲帶轉盤
120:升降平台
130、130a:貼片吸取頭
131:表面
132、132a:凹口
134a:側壁
136a:頂面
150:散熱貼片輸送裝置
160:旋轉機構
200:封裝結構
201:封裝捲帶
210:薄膜基材
211:封裝單元
212:傳動孔
220:封膠晶片
221:晶片
222:封裝膠體
223:側表面
230:防銲層
300:散熱貼片
D1:第一方向
D2:第二方向
d1、d2、d3、d4:最短距離
h1:第一高度
h2:第二高度
S1:封閉空間
S2:容置空間
θ1:鈍角
100:Heat dissipation patch laminating equipment
110: Packaging tape conveyor device
111:The first rail frame
112:Workspace
113:
圖1是依照本揭露的一實施例的一種散熱貼片貼合設備的局部示意圖。 圖2是依照本揭露的一實施例的一種散熱貼片貼合設備的封裝捲帶輸送裝置承載並輸送封裝捲帶的示意圖。 圖3是依照本揭露的一實施例的一種散熱貼片貼合設備的封裝捲帶輸送裝置承載封裝捲帶的剖面示意圖。 圖4是依照本揭露的一實施例的一種散熱貼片貼合設備的貼片吸取頭的底視示意圖。 圖5是依照本揭露的一實施例的一種貼合散熱貼片的封裝結構的俯視示意圖。 圖6至圖8是依照本揭露的一實施例的一種使用散熱貼片貼合設備貼合散熱貼片的方法流程示意圖。 圖9是依照本揭露的一實施例的一種散熱貼片貼合設備的貼片吸取頭的剖面示意圖。 FIG. 1 is a partial schematic diagram of a heat dissipation patch laminating equipment according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a packaging tape conveying device of a heat dissipation patch laminating equipment carrying and transporting packaging tapes according to an embodiment of the present disclosure. 3 is a schematic cross-sectional view of a packaging tape conveying device of a heat dissipation patch laminating equipment carrying a packaging tape according to an embodiment of the present disclosure. 4 is a schematic bottom view of a patch suction head of a heat dissipation patch bonding equipment according to an embodiment of the present disclosure. FIG. 5 is a schematic top view of a packaging structure with a heat dissipation patch according to an embodiment of the present disclosure. 6 to 8 are schematic flow diagrams of a method for bonding a heat dissipation patch using a heat dissipation patch bonding equipment according to an embodiment of the present disclosure. 9 is a schematic cross-sectional view of a patch suction head of a heat dissipation patch bonding equipment according to an embodiment of the present disclosure.
100:散熱貼片貼合設備 100:Heat dissipation patch laminating equipment
120:升降平台 120: Lifting platform
130:貼片吸取頭 130:SMD suction head
132:凹口 132: Notch
200:封裝結構 200:Package structure
201:封裝捲帶 201: Packaging tape and reel
210:薄膜基材 210:Film substrate
220:封膠晶片 220: Sealed chip
300:散熱貼片 300:Heat dissipation patch
D1:第一方向 D1: first direction
h1:第一高度 h1: first height
S1:封閉空間 S1: Enclosed space
S2:容置空間 S2: Accommodation space
Claims (11)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111109458A TWI796166B (en) | 2022-03-15 | 2022-03-15 | Apparatus and method for attaching heat dissipation sheet |
| CN202210722557.0A CN116798902A (en) | 2022-03-15 | 2022-06-24 | Heat dissipation patch attaching equipment and heat dissipation patch attaching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111109458A TWI796166B (en) | 2022-03-15 | 2022-03-15 | Apparatus and method for attaching heat dissipation sheet |
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| Publication Number | Publication Date |
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| TWI796166B TWI796166B (en) | 2023-03-11 |
| TW202339148A true TW202339148A (en) | 2023-10-01 |
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| TW111109458A TWI796166B (en) | 2022-03-15 | 2022-03-15 | Apparatus and method for attaching heat dissipation sheet |
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| CN (1) | CN116798902A (en) |
| TW (1) | TWI796166B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10079194B1 (en) * | 2017-03-07 | 2018-09-18 | Novatek Microelectronics Corp. | Chip on film package |
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- 2022-03-15 TW TW111109458A patent/TWI796166B/en active
- 2022-06-24 CN CN202210722557.0A patent/CN116798902A/en active Pending
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| Publication number | Publication date |
|---|---|
| TWI796166B (en) | 2023-03-11 |
| CN116798902A (en) | 2023-09-22 |
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