TW202339075A - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

Info

Publication number: TW202339075A
Authority: TW; Taiwan
Prior art keywords: substrate; processing; exposure device; exposure; mentioned
Prior art date: 2022-03-23

Application number

TW111144490A

Other languages

English (en)

Chinese (zh)

Other versions

TWI852179B (zh

Inventor

大宅宗明

三津林武

森井敬亮

Original Assignee

日商斯庫林集團股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2022-03-23

Filing date

2022-11-22

Publication date

2023-10-01

2022-11-22 Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司

2023-10-01 Publication of TW202339075A publication Critical patent/TW202339075A/zh

2024-08-11 Application granted granted Critical

2024-08-11 Publication of TWI852179B publication Critical patent/TWI852179B/zh

Links

239000000758 substrate Substances 0.000 title claims abstract description 541
238000012545 processing Methods 0.000 title claims abstract description 266
238000003672 processing method Methods 0.000 title claims abstract description 16
238000012805 post-processing Methods 0.000 claims abstract description 46
238000007781 pre-processing Methods 0.000 claims abstract description 43
238000012546 transfer Methods 0.000 claims description 227
238000000034 method Methods 0.000 claims description 120
230000008569 process Effects 0.000 claims description 110
230000032258 transport Effects 0.000 claims description 72
238000000576 coating method Methods 0.000 claims description 25
239000011248 coating agent Substances 0.000 claims description 24
230000007723 transport mechanism Effects 0.000 claims description 21
238000010586 diagram Methods 0.000 description 41
238000001816 cooling Methods 0.000 description 38
239000007788 liquid Substances 0.000 description 31
238000001035 drying Methods 0.000 description 23
238000004140 cleaning Methods 0.000 description 20
230000007246 mechanism Effects 0.000 description 18
238000010438 heat treatment Methods 0.000 description 11
230000002093 peripheral effect Effects 0.000 description 11
238000004519 manufacturing process Methods 0.000 description 8
230000001105 regulatory effect Effects 0.000 description 8
238000009434 installation Methods 0.000 description 7
239000004642 Polyimide Substances 0.000 description 6
238000011161 development Methods 0.000 description 6
230000014509 gene expression Effects 0.000 description 6
229920001721 polyimide Polymers 0.000 description 6
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
230000006870 function Effects 0.000 description 5
239000011521 glass Substances 0.000 description 5
239000002243 precursor Substances 0.000 description 5
238000007664 blowing Methods 0.000 description 4
230000001276 controlling effect Effects 0.000 description 4
238000005406 washing Methods 0.000 description 4
239000004973 liquid crystal related substance Substances 0.000 description 3
239000002904 solvent Substances 0.000 description 3
230000015572 biosynthetic process Effects 0.000 description 2
239000000470 constituent Substances 0.000 description 2
238000011109 contamination Methods 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
238000005401 electroluminescence Methods 0.000 description 2
238000007667 floating Methods 0.000 description 2
238000007689 inspection Methods 0.000 description 2
229920002120 photoresistant polymer Polymers 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
150000001412 amines Chemical class 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
238000004364 calculation method Methods 0.000 description 1
238000004891 communication Methods 0.000 description 1
239000000498 cooling water Substances 0.000 description 1
230000006837 decompression Effects 0.000 description 1
230000018044 dehydration Effects 0.000 description 1
238000006297 dehydration reaction Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000010419 fine particle Substances 0.000 description 1
239000005357 flat glass Substances 0.000 description 1
239000004519 grease Substances 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
239000002184 metal Substances 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
239000005416 organic matter Substances 0.000 description 1
229920005575 poly(amic acid) Polymers 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1
238000011144 upstream manufacturing Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Robotics (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

TW111144490A 2022-03-23 2022-11-22 基板處理裝置及基板處理方法 TWI852179B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2022-047055		2022-03-23
JP2022047055A JP7405889B2 (ja)	2022-03-23	2022-03-23	基板処理装置および基板処理方法

Publications (2)

Publication Number	Publication Date
TW202339075A true TW202339075A (zh)	2023-10-01
TWI852179B TWI852179B (zh)	2024-08-11

Family

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Also Published As

Publication number	Publication date
JP7405889B2 (ja)	2023-12-26
CN116804827B (zh)	2024-04-30
CN116804827A (zh)	2023-09-26
JP2023140960A (ja)	2023-10-05
KR20230138389A (ko)	2023-10-05

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