TW202321616A - Backlight device - Google Patents

Backlight device Download PDF

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TW202321616A
TW202321616A TW110143253A TW110143253A TW202321616A TW 202321616 A TW202321616 A TW 202321616A TW 110143253 A TW110143253 A TW 110143253A TW 110143253 A TW110143253 A TW 110143253A TW 202321616 A TW202321616 A TW 202321616A
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emitting diode
light
wire
electrically coupled
diode circuits
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TW110143253A
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Chinese (zh)
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TWI777858B (en
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林斯巖
黃馨諄
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友達光電股份有限公司
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Priority to CN202210335011.XA priority patent/CN114695331A/en
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Publication of TW202321616A publication Critical patent/TW202321616A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)
  • Polarising Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A backlight device includes a printed circuit board, a plurality of light-emitting diode circuits and a conductive structure. The printed circuit board has a first surface and a second surface that are opposite to each other. The plurality of light-emitting diode circuits are configured on the first surface of the printed circuit board and include a first row of light-emitting diode circuits and a second row of light-emitting diode circuits. The conductive structure is configured on the second surface of the printed circuit board and is electrically connected to the light-emitting diode circuits. The conductive structure includes a first conductor and a plurality of conductive wires. The first conductor is electrically connected to the first row of light-emitting diode circuits. The projection of the first conductor, onto the first surface of the printed circuit board, at least covers the first row of light-emitting diode circuits. The conductive wires are electrically connected to the first conductor, in which the impedances of the conductive wires basically match each other.

Description

背光裝置backlight

本案有關一種背光裝置，特別是一種具有導電結構的背光裝置。This case relates to a backlight device, especially a backlight device with a conductive structure.

背光裝置廣泛用於各種電子產品中，且背光裝置通常包含發光二極體電路。以習知的發光二極體電路而言，發光二極體電路的佈局走線方式(例如，X-Y線方式)可能受到阻抗不匹配的影響，導致不同位置的發光二極體電路接收不一致的電源信號而有不同發光程度，進而造成背光裝置亮度不均的問題。因此，要如何發展能夠克服上述問題之相關技術為本領域重要之課題。Backlight devices are widely used in various electronic products, and the backlight devices usually include LED circuits. In the case of conventional light-emitting diode circuits, the layout and routing of light-emitting diode circuits (for example, X-Y line method) may be affected by impedance mismatch, resulting in inconsistent power supply for light-emitting diode circuits in different positions Signals have different luminous levels, which in turn causes the problem of uneven brightness of the backlight device. Therefore, how to develop related technologies that can overcome the above problems is an important issue in this field.

本案的一個實施例是一種背光裝置，包含印刷電路板、多個發光二極體電路以及導電結構。印刷電路板具有彼此相對的第一表面和第二表面。上述多個發光二極體電路配置於上述印刷電路板的第一表面，其中上述多個發光二極體電路包含第一列發光二極體電路以及第二列發光二極體電路，第一列發光二極體電路與第二列發光二極體電路相鄰配置。導電結構配置於上述印刷電路板的第二表面，電性耦接上述多個發光二極體電路，用以傳送供應電源至上述多個發光二極體電路，其中上述導電結構包含第一導體以及複數導線，其中第一導體電性耦接第一列發光二極體電路，且於上述印刷電路板的第一表面上的投影至少覆蓋第一列發光二極體電路。多個導線電性耦接於第一導體，其中導線的阻抗大致上彼此匹配。An embodiment of the present application is a backlight device, which includes a printed circuit board, a plurality of LED circuits and a conductive structure. The printed circuit board has first and second surfaces facing each other. The above-mentioned multiple light-emitting diode circuits are arranged on the first surface of the above-mentioned printed circuit board, wherein the above-mentioned multiple light-emitting diode circuits include a first column of light-emitting diode circuits and a second column of light-emitting diode circuits, and the first column The light emitting diode circuit is arranged adjacent to the second row of light emitting diode circuits. The conductive structure is disposed on the second surface of the above-mentioned printed circuit board, electrically coupled to the above-mentioned multiple light-emitting diode circuits, and used to transmit and supply power to the above-mentioned multiple light-emitting diode circuits, wherein the above-mentioned conductive structure includes a first conductor and A plurality of wires, wherein the first conductor is electrically coupled to the first row of light-emitting diode circuits, and the projection on the first surface of the above-mentioned printed circuit board at least covers the first row of light-emitting diode circuits. A plurality of wires are electrically coupled to the first conductor, wherein impedances of the wires are substantially matched to each other.

本案的另一個實施例是一種背光裝置，包含印刷電路板、多列發光二極體電路以及鋪銅結構，其中印刷電路板具有彼此相對的第一表面和第二表面。多列發光二極體電路配置於上述印刷電路板的第一表面。鋪銅結構配置於上述印刷電路板的第二表面，至少電性耦接上述多列發光二極體電路中第一列發光二極體電路，其中鋪銅結構包含第一鋪銅層以及多個銅導線，其中第一鋪銅層電性耦接第一列發光二極體電路，且於上述印刷電路板的第一表面上的投影至少覆蓋第一列發光二極體電路。多個銅導線電性耦接於上述第一鋪銅層與輸入端之間，其中銅導線於上述第一鋪銅層與輸入端之間的長度大致上彼此相等。Another embodiment of the present application is a backlight device comprising a printed circuit board, a multi-row LED circuit and a copper-clad structure, wherein the printed circuit board has a first surface and a second surface opposite to each other. Multiple rows of light emitting diode circuits are arranged on the first surface of the above-mentioned printed circuit board. The copper-clad structure is disposed on the second surface of the above-mentioned printed circuit board, and is at least electrically coupled to the first column of the LED circuits in the above-mentioned multiple rows of LED circuits, wherein the copper-clad structure includes a first copper-clad layer and a plurality of The copper wire, wherein the first copper layer is electrically coupled to the first row of light-emitting diode circuits, and the projection on the first surface of the above-mentioned printed circuit board at least covers the first row of light-emitting diode circuits. A plurality of copper wires are electrically coupled between the first copper layer and the input end, wherein the lengths of the copper wires between the first copper layer and the input end are substantially equal to each other.

於本文中，當一元件被稱為「連接」或「耦接」時，可指「電性連接」或「電性耦接」。「連接」或「耦接」亦可用以表示二或多個元件間相互搭配操作或互動。此外，雖然本文中使用「第一」、「第二」、…等用語描述不同元件，該用語僅是用以區別以相同技術用語描述的元件或操作。除非上下文清楚指明，否則該用語並非特別指稱或暗示次序或順位，亦非用以限定本案。Herein, when an element is referred to as "connected" or "coupled", it may mean "electrically connected" or "electrically coupled". "Connected" or "coupled" may also be used to indicate that two or more elements cooperate or interact with each other. In addition, although terms such as “first”, “second”, . Unless the context clearly dictates otherwise, the terms do not specifically refer to or imply an order or sequence, nor are they intended to limit the case.

這裡使用的術語僅僅是為了描述特定實施例的目的，而不是限制性的。如本文所使用的，除非內容清楚地指示，否則單數形式「一」、「一個」和「該」旨在包括複數形式，包括「至少一個」。「或」表示「及/或」。如本文所使用的，術語「及/或」包括一個或多個相關所列項目的任何和所有組合。還應當理解，當在本說明書中使用時，術語「包括」及/或「包含」指定所述特徵、區域、整體、步驟、操作、元件的存在及/或部件，但不排除一個或多個其它特徵、區域整體、步驟、操作、元件、部件及/或其組合的存在或添加。The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "comprising" and/or "comprising" designate the stated features, regions, integers, steps, operations, the presence of elements and/or parts, but do not exclude one or more Existence or addition of other features, regions as a whole, steps, operations, elements, parts and/or combinations thereof.

第1圖是根據一些實施例所繪示的背光裝置100之示意圖。如第1圖所示，背光裝置100包括印刷電路板101、導電結構110以及複數個發光二極體電路120，其中印刷電路板101具有彼此相對的第一表面103與第二表面105，發光二極體電路120配置於印刷電路板101的第一表面103上，導電結構110配置於印刷電路板101的第二表面105上，並且導電結構110電性耦接發光二極體電路120，用以傳送供應電源VLED至上述發光二極體電路120。需說明的是，為方便及清楚說明起見，第1圖僅標示單個發光二極體電路120，但其數量不以第1圖所標示為限。換言之，第1圖所示導電結構110搭配發光二極體電路120的數量可以更多或更少，不限於第1圖所示。FIG. 1 is a schematic diagram of a backlight device 100 according to some embodiments. As shown in FIG. 1, the backlight device 100 includes a printed circuit board 101, a conductive structure 110, and a plurality of light-emitting diode circuits 120, wherein the printed circuit board 101 has a first surface 103 and a second surface 105 opposite to each other, and the light-emitting diodes The polar body circuit 120 is disposed on the first surface 103 of the printed circuit board 101, the conductive structure 110 is disposed on the second surface 105 of the printed circuit board 101, and the conductive structure 110 is electrically coupled to the LED circuit 120 for The power supply VLED is transmitted to the light-emitting diode circuit 120 . It should be noted that, for convenience and clarity, FIG. 1 only shows a single LED circuit 120 , but the number thereof is not limited to that shown in FIG. 1 . In other words, the number of conductive structures 110 and LED circuits 120 shown in FIG. 1 can be more or less, and is not limited to that shown in FIG. 1 .

如第1圖所示，在一些實施例中，發光二極體電路120與導電結構110的組合可作為一單元150，在印刷電路板101上可配置一或多個單元150，即是在印刷電路板101可以佈有或更多或更少類似的單元150，並且一或多個單元150中每一者電性耦接不同供應電源，舉例而言，如第1圖所示，三個單元151～153分別電性耦接不同供應電源，單元151電性耦接VLED1，單元152電性耦接VLED2，單元153電性耦接VLED3。第1圖所繪僅是示例，但並不用以限定本案。As shown in FIG. 1, in some embodiments, the combination of the light emitting diode circuit 120 and the conductive structure 110 can be used as a unit 150, and one or more units 150 can be configured on the printed circuit board 101, that is, on the printed circuit board 101. The circuit board 101 may have more or less similar units 150, and each of the one or more units 150 is electrically coupled to a different power supply, for example, as shown in FIG. 1, three units 151 - 153 are respectively electrically coupled to different power supplies, the unit 151 is electrically coupled to VLED1 , the unit 152 is electrically coupled to VLED2 , and the unit 153 is electrically coupled to VLED3 . The drawing in Figure 1 is only an example, but not intended to limit the present case.

如第1圖所示，在一些實施例中，發光二極體電路120以行列佈置，發光二極體電路120包括相鄰配置的第一列發光二極體電路122與第二列發光二極體電路124。在一些實施例中，在印刷電路板101的第一表面103上可以具有更多或更少類似的發光二極體電路120行列佈置，為了簡潔說明，並未繪示於圖中。As shown in FIG. 1 , in some embodiments, the light emitting diode circuits 120 are arranged in rows and columns, and the light emitting diode circuits 120 include a first column of light emitting diode circuits 122 and a second column of light emitting diodes arranged adjacently. body circuit 124. In some embodiments, there may be more or less similar LED circuits 120 arranged in rows and columns on the first surface 103 of the printed circuit board 101 , which are not shown in the figure for brevity.

第2圖是根據一些實施例所繪示第1圖的部分背光裝置100之示意圖。如第2圖所示，導電結構110包含第一導體211以及複數個導線213。第一導體211電性耦接第一列發光二極體電路122，且於印刷電路板101的第一表面103上的投影至少覆蓋第一列發光二極體電路122。上述導線213電性耦接於第一導體211，其中導線213的阻抗大致上彼此匹配。FIG. 2 is a schematic diagram of part of the backlight device 100 shown in FIG. 1 according to some embodiments. As shown in FIG. 2 , the conductive structure 110 includes a first conductor 211 and a plurality of wires 213 . The first conductor 211 is electrically coupled to the first row of LED circuits 122 , and its projection on the first surface 103 of the printed circuit board 101 at least covers the first row of LED circuits 122 . The wires 213 are electrically coupled to the first conductor 211 , wherein impedances of the wires 213 are substantially matched to each other.

在一些實施例中，導電結構110中的第一導體211與導線213用以傳送供應電源VLED至發光二極體電路120，且可由銅、鋁、銀等合適的導電材料組成。在一些實施例中，第一導體211與導線213是以銅來實現，但本案不以此為限。In some embodiments, the first conductor 211 and the wire 213 in the conductive structure 110 are used to transmit the power supply VLED to the light-emitting diode circuit 120 , and may be composed of suitable conductive materials such as copper, aluminum, and silver. In some embodiments, the first conductor 211 and the wire 213 are implemented by copper, but the present application is not limited thereto.

在一些實施例中，印刷電路板101具有多個孔洞230，其中第一導體211透過上述孔洞230電性耦接第一列發光二極體電路122與第二列發光二極體電路124。在一些實施例中，如第2圖所示，第一導體211在印刷電路板101的第一表面103上的投影還覆蓋上述電性耦接第一導體211與第二列發光二極體電路124的孔洞230。In some embodiments, the printed circuit board 101 has a plurality of holes 230 , wherein the first conductor 211 is electrically coupled to the first row of LED circuits 122 and the second row of LED circuits 124 through the holes 230 . In some embodiments, as shown in FIG. 2 , the projection of the first conductor 211 on the first surface 103 of the printed circuit board 101 also covers the circuit electrically coupling the first conductor 211 and the second row of LEDs. 124 holes 230 .

第3圖是根據一些實施例的第1圖的部分背光裝置100之示意圖。導電結構110中的導線包括導線314、315和316，其中導線314、315和316對應第2圖的導線213且電性耦接輸入端320，並用以自輸入端320接收供應電源VLED。在一些實施例中，導線314～316各自電性耦接第一導體211的不同端點，其中導線314電性耦接第一導體211的側端點324，導線315電性耦接第一導體211的中間端點325，導線316電性耦接第一導體211的側端點326。在進一步實施例中，導線314～316各自電性耦接第一導體211的長邊311的不同端點，例如：長邊上有側端點324和326以及中間端點325，分別與導線314～316電性連接。需說明的是，為方便及清楚說明起見，第3圖僅標示三條導線314～316，但其數量不以第3圖所標示為限。換言之，第3圖所示導電結構110中的導線213的數量可以是三條或更多條，不限於第3圖所示。FIG. 3 is a schematic diagram of a portion of the backlight device 100 of FIG. 1 according to some embodiments. The wires in the conductive structure 110 include wires 314 , 315 and 316 , wherein the wires 314 , 315 and 316 correspond to the wire 213 in FIG. 2 and are electrically coupled to the input end 320 for receiving the power supply VLED from the input end 320 . In some embodiments, the wires 314-316 are electrically coupled to different terminals of the first conductor 211, wherein the wire 314 is electrically coupled to the side terminal 324 of the first conductor 211, and the wire 315 is electrically coupled to the first conductor The middle terminal 325 of the first conductor 211 is electrically coupled to the side terminal 326 of the first conductor 211 by the wire 316 . In a further embodiment, the wires 314-316 are electrically coupled to different endpoints of the long side 311 of the first conductor 211, for example: the side endpoints 324 and 326 and the middle endpoint 325 on the long side are respectively connected to the wire 314. ~ 316 electrical connections. It should be noted that, for the sake of convenience and clarity, FIG. 3 only shows three wires 314-316, but the number thereof is not limited to that shown in FIG. 3 . In other words, the number of wires 213 in the conductive structure 110 shown in FIG. 3 may be three or more, and is not limited to that shown in FIG. 3 .

如第3圖所示，在一些實施例中，對第一導體211而言，側端點324與中間端點325之距離大致上等於側端點326與中間端點325之距離，即是導線314與導線315電性耦接第一導體211的不同端點間的距離大致上等於導線316與導線315電性耦接第一導體211的不同端點間的距離，藉著上述導線彼此大致上等長的佈置，使導線314～316的阻抗彼此匹配。As shown in FIG. 3, in some embodiments, for the first conductor 211, the distance between the side end point 324 and the middle end point 325 is substantially equal to the distance between the side end point 326 and the middle end point 325, that is, the wire 314 and the wire 315 are electrically coupled to the distance between the different ends of the first conductor 211 is substantially equal to the distance between the wire 316 and the wire 315 electrically coupled to the different ends of the first conductor 211, by the wires are substantially Arranged with equal lengths, the impedances of the wires 314-316 are matched to each other.

參照第1圖至第3圖，在一些實施例中，在背光裝置100中的印刷電路板101 佈有一或多個由發光二極體電路120與導電結構110組合的單元150，使導線314～316的阻抗彼此匹配，從而降低背光裝置100整體的亮度差距，改善了背光裝置亮度不均的問題。一般而言，習知的發光二極體電路與電源供應線路的佈局走線方式(例如，X-Y線方式)會導致背光裝置不同發光位置間的亮度差距為40%，與習知的佈局走線方式(例如，X-Y線方式)相比，本案實施例可用於使背光裝置整體的亮度差距降低到5%以內。Referring to Figures 1 to 3, in some embodiments, the printed circuit board 101 in the backlight device 100 is provided with one or more units 150 combined by the light emitting diode circuit 120 and the conductive structure 110, so that the wires 314- The impedances of 316 are matched with each other, thereby reducing the overall brightness difference of the backlight device 100 and improving the problem of uneven brightness of the backlight device. Generally speaking, the conventional layout and routing of light-emitting diode circuits and power supply lines (for example, X-Y line method) will cause the brightness difference between different light-emitting positions of the backlight device to be 40%, which is different from the conventional layout and routing. Compared with other methods (for example, X-Y line method), the embodiment of this case can be used to reduce the overall brightness difference of the backlight device to within 5%.

第4圖是根據一些實施例的第1圖的部分背光裝置100之示意圖。如第4圖所示，上述多個發光二極體電路120還包括與第二列發光二極體電路124相鄰配置的第三列發光二極體電路126。導電結構410其佈置與功能類似於上文討論的導電結構110(參照第2圖)，用以傳送供應電源VLED至上述發光二極體電路120。在一些實施例中，導電結構410包含第一導體411、第二導體412以及複數個導線413分別相應於導電結構110(參照第2圖)的第一導體211以及多個導線213，其中導體411電性耦接第一列發光二極體電路122與第二列發光二極體電路124，導體412電性耦接第三列發光二極體電路126。第一導體411於印刷電路板101的第一表面103上的投影至少覆蓋第一列發光二極體電路124，且第二導體412於印刷電路板101的第一表面103上的投影至少覆蓋第三列發光二極體電路126。上述導線413電性耦接於導體411和412，其中導線413的阻抗大致上彼此匹配。FIG. 4 is a schematic diagram of a portion of the backlight device 100 of FIG. 1 according to some embodiments. As shown in FIG. 4 , the plurality of light emitting diode circuits 120 further includes a third column of light emitting diode circuits 126 disposed adjacent to the second column of light emitting diode circuits 124 . The arrangement and function of the conductive structure 410 is similar to that of the conductive structure 110 discussed above (refer to FIG. 2 ), and is used to transmit the power supply VLED to the above-mentioned LED circuit 120 . In some embodiments, the conductive structure 410 includes a first conductor 411, a second conductor 412, and a plurality of wires 413 respectively corresponding to the first conductor 211 and the plurality of wires 213 of the conductive structure 110 (refer to FIG. 2 ), wherein the conductor 411 The conductor 412 is electrically coupled to the first column of LED circuits 122 and the second column of LED circuits 124 , and the conductor 412 is electrically coupled to the third column of LED circuits 126 . The projection of the first conductor 411 on the first surface 103 of the printed circuit board 101 covers at least the first row of light-emitting diode circuits 124, and the projection of the second conductor 412 on the first surface 103 of the printed circuit board 101 covers at least the first row of light-emitting diode circuits 124. Three columns of LED circuits 126 . The wire 413 is electrically coupled to the conductors 411 and 412 , wherein impedances of the wire 413 are substantially matched to each other.

在一些實施例中，導電結構410中的導體411和412與導線413用以傳送供應電源VLED至發光二極體電路120，且可由銅、鋁、銀等合適的導電材料組成，在一些實施例中，導體411和412與導線413是以銅實現，但本案不以此為限。In some embodiments, the conductors 411 and 412 and the wire 413 in the conductive structure 410 are used to transmit the power supply VLED to the light-emitting diode circuit 120, and may be made of suitable conductive materials such as copper, aluminum, silver, etc., in some embodiments In the embodiment, the conductors 411 and 412 and the wire 413 are realized by copper, but this case is not limited thereto.

在一些實施例中，印刷電路板101具有多個孔洞430，其中第一導體411透過上述孔洞430電性耦接第一列發光二極體電路122與第二列發光二極體電路124，第二導體412透過上述孔洞430電性耦接第三列發光二極體電路126。在一些實施例中，如第4圖所示，第一導體411在印刷電路板101的第一表面103上的投影還覆蓋上述電性耦接第一導體411與第二列發光二極體電路124的孔洞430。In some embodiments, the printed circuit board 101 has a plurality of holes 430, wherein the first conductor 411 is electrically coupled to the first row of LED circuits 122 and the second row of LED circuits 124 through the holes 430, and the second row of LED circuits 124. The two conductors 412 are electrically coupled to the third row of LED circuits 126 through the holes 430 . In some embodiments, as shown in FIG. 4 , the projection of the first conductor 411 on the first surface 103 of the printed circuit board 101 also covers the circuit electrically coupling the first conductor 411 and the second row of LEDs. 124 holes 430 .

第5圖是根據一些實施例的第1圖的部分背光裝置100之示意圖。如第5圖所示，導電結構410中的導線包括導線514～519，其中導線514～519對應第4圖的導線413且電性耦接輸入端520，並用以自輸入端520接收供應電源VLED。在一些實施例中，導線514～516各自電性耦接第一導體411的不同端點，其中導線514電性耦接第一導體411的側端點524，導線515電性耦接第一導體411的中間端點525，導線516電性耦接第一導體411的側端點526。而導線517～519各自電性耦接第二導體412的不同端點，其中導線517電性耦接第二導體412的側端點527，導線518電性耦接第二導體412的中間端點528，導線519電性耦接第二導體412的側端點529。在進一步實施例中，導線514～516各自電性耦接第一導體411的長邊511的不同端點，例如：長邊上有側端點524和526以及中間端點525，分別與導線514～516電性連接。而導線517～519各自電性耦接第二導體412的長邊512的不同端點，例如：長邊上有側端點527和529以及中間端點528，分別與導線517～519電性連接。需說明的是，為方便及清楚說明起見，第5圖僅標示六條導線514～519，但其數量不以第5圖所標示為限。換言之，第5圖所示導電結構410中的導線413的數量可以是六條或更多條，不限於第5圖所示。FIG. 5 is a schematic diagram of a portion of the backlight device 100 of FIG. 1 according to some embodiments. As shown in FIG. 5, the wires in the conductive structure 410 include wires 514-519, wherein the wires 514-519 correspond to the wire 413 in FIG. 4 and are electrically coupled to the input terminal 520, and are used to receive the power supply VLED from the input terminal 520. . In some embodiments, the wires 514-516 are electrically coupled to different terminals of the first conductor 411, wherein the wire 514 is electrically coupled to the side terminal 524 of the first conductor 411, and the wire 515 is electrically coupled to the first conductor The middle terminal 525 of the conductor 411 is electrically coupled to the side terminal 526 of the first conductor 411 by the wire 516 . The wires 517-519 are electrically coupled to different terminals of the second conductor 412, wherein the wire 517 is electrically coupled to the side terminal 527 of the second conductor 412, and the wire 518 is electrically coupled to the middle terminal of the second conductor 412. 528 , the wire 519 is electrically coupled to the side terminal 529 of the second conductor 412 . In a further embodiment, the wires 514-516 are electrically coupled to different endpoints of the long side 511 of the first conductor 411, for example: the side endpoints 524 and 526 and the middle endpoint 525 on the long side are respectively connected to the wire 514. ~ 516 electrical connections. The wires 517-519 are electrically coupled to different endpoints of the long side 512 of the second conductor 412. For example, there are side endpoints 527 and 529 and a middle endpoint 528 on the long side, which are electrically connected to the wires 517-519 respectively. . It should be noted that, for the sake of convenience and clarity, FIG. 5 only shows six wires 514-519, but the number is not limited to that shown in FIG. 5. In other words, the number of wires 413 in the conductive structure 410 shown in FIG. 5 can be six or more, and is not limited to that shown in FIG. 5 .

如第5圖所示，在一些實施例中，對第一導體411而言，側端點524與中間端點525之距離大致上等於側端點526與中間端點525之距離，即是導線514與導線515電性耦接第一導體411的不同端點間的距離大致上等於導線516與導線515電性耦接第一導體411的不同端點間的距離，並且對第二導體412而言，側端點527與中間端點528之距離大致上等於側端點529與中間端點528之距離，即是導線517與導線518電性耦接第二導體412的不同端點間的距離大致上等於導線519與導線518電性耦接第二導體412的不同端點間的距離，藉著上述導線彼此大致上等長的佈置，使導線514～519的阻抗彼此匹配。As shown in FIG. 5, in some embodiments, for the first conductor 411, the distance between the side end point 524 and the middle end point 525 is substantially equal to the distance between the side end point 526 and the middle end point 525, that is, the wire The distance between the different ends of the wire 514 and the wire 515 electrically coupled to the first conductor 411 is substantially equal to the distance between the different ends of the wire 516 and the wire 515 electrically coupled to the first conductor 411, and for the second conductor 412 In other words, the distance between the side end point 527 and the middle end point 528 is substantially equal to the distance between the side end point 529 and the middle end point 528, that is, the distance between different ends of the wire 517 and the wire 518 electrically coupled to the second conductor 412 It is substantially equal to the distance between different ends of the wire 519 and the wire 518 electrically coupled to the second conductor 412 , and the impedances of the wires 514 - 519 are matched to each other by the substantially equal lengths of the wires.

參照第1圖和第4圖至第5圖，在一些實施例中，發光二極體電路120與導電結構410的組合可作為一單元450，在印刷電路板101上可配置一或多個單元450，舉例而言，在印刷電路板101上佈有三個由發光二極體電路120與導電結構410組合的單元450，如第1圖和第4圖所示的。在一些實施例中，藉由上述一或多個單元450的配置，使其中的導線514～519的阻抗彼此匹配，從而降低背光裝置100整體的亮度差距，改善了背光裝置亮度不均的問題。在一些實施例中，與習知的發光二極體電路與電源供應線路的佈局走線方式(例如，X-Y線方式)相比，本案實施例可用於使背光裝置100整體的亮度差距降低到2%以內。Referring to FIG. 1 and FIG. 4 to FIG. 5, in some embodiments, the combination of the light emitting diode circuit 120 and the conductive structure 410 can be used as a unit 450, and one or more units can be configured on the printed circuit board 101 450, for example, three units 450 composed of LED circuits 120 and conductive structures 410 are arranged on the printed circuit board 101, as shown in FIG. 1 and FIG. 4 . In some embodiments, the impedances of the wires 514 - 519 are matched to each other through the arrangement of the one or more units 450 , thereby reducing the overall brightness difference of the backlight device 100 and improving the problem of uneven brightness of the backlight device. In some embodiments, compared with the conventional layout (for example, X-Y line method) of light-emitting diode circuits and power supply lines, the embodiment of the present case can be used to reduce the overall brightness difference of the backlight device 100 to 2 Within %.

第6圖是根據一些實施例所繪示的背光裝置100之示意圖。如第6圖所示，發光二極體電路120與導電結構110的組合可作為單元150，以及發光二極體電路120與導電結構410的組合可作為單元450，在印刷電路板101上可同時配置兩個單元151和152以及兩個單元451和452，換言之，在印刷電路板101上同時佈有由發光二極體電路120與導電結構110組合的兩個單元151和152以及由發光二極體電路120與導電結構410組合的兩個單元451和452，並且上述四個單元151、152、451和452分別電性連接供應電源VLED1、VLED2、VLED3和VLED4。在一些實施例中，在印刷電路板101上可同時佈有更多或更少類似的單元150和450，第6圖所繪僅是示例，但並不用以限定本案。FIG. 6 is a schematic diagram of a backlight device 100 according to some embodiments. As shown in FIG. 6, the combination of the light-emitting diode circuit 120 and the conductive structure 110 can be used as a unit 150, and the combination of the light-emitting diode circuit 120 and the conductive structure 410 can be used as a unit 450, which can be used on the printed circuit board 101 at the same time. Two units 151 and 152 and two units 451 and 452 are configured, in other words, two units 151 and 152 combined by light-emitting diode circuit 120 and conductive structure 110 and two units 151 and 152 composed of light-emitting diode circuit 120 are arranged on printed circuit board 101 at the same time. The body circuit 120 and the conductive structure 410 are composed of two units 451 and 452, and the four units 151, 152, 451 and 452 are electrically connected to the power supply VLED1, VLED2, VLED3 and VLED4 respectively. In some embodiments, more or less similar units 150 and 450 may be arranged on the printed circuit board 101 at the same time, and the drawing in FIG. 6 is only an example, but not intended to limit the present application.

綜上所述，本案藉由所提及的導電結構配置，使導電結構中的導線阻抗匹配，從而降低背光裝置不同發光位置間的亮度差距，改善了背光裝置亮度不均的問題。To sum up, in this case, through the configuration of the conductive structure mentioned above, the impedance of the wires in the conductive structure is matched, thereby reducing the brightness difference between different light-emitting positions of the backlight device, and improving the problem of uneven brightness of the backlight device.

雖然本案已以實施例揭露如上，然其並非用以限定本案，任何所屬技術領域中具有通常知識者，在不脫離本案的精神和範圍內，當可作些許的更動與潤飾，故本案的保護範圍當視後附的申請專利範圍所界定者為準。Although this case has been disclosed as above with the embodiment, it is not used to limit this case. Anyone with common knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this case. Therefore, the protection of this case The scope shall be defined by the scope of the appended patent application.

100:背光裝置 101:印刷電路板 103:第一表面 105:第二表面 110:導電結構 120:發光二極體電路 122:第一列發光二極體電路 124:第二列發光二極體電路 126:第三列發光二極體電路 150,151,152,153:單元 211:導體 213:導線230:孔洞 311:長邊314,315,316:導線 320:輸入端 324,325,326:端點 410:導電結構 411,412:導體 413:導線 430:孔洞 450,451,452:單元 511,512:長邊 514,515,516,517,518,519:導線 520:輸入端 524,525,526,527,528,529:端點 VLED,VLED1,VLED2,VLED3,VLED4:供應電源 100: Backlight device 101: Printed circuit board 103: first surface 105: second surface 110: Conductive structure 120: Light-emitting diode circuit 122: The first row of light-emitting diode circuit 124: The second row of light-emitting diode circuit 126: The third row of light-emitting diode circuit 150, 151, 152, 153: units 211: Conductor 213: Wire 230: Hole 311: long side 314, 315, 316: wire 320: input terminal 324, 325, 326: endpoints 410: Conductive structure 411,412: Conductors 413: wire 430: hole 450, 451, 452: units 511,512: long side 514,515,516,517,518,519: wires 520: input terminal 524,525,526,527,528,529: endpoints VLED, VLED1, VLED2, VLED3, VLED4: power supply

第1圖是根據一些實施例所繪示的背光裝置之示意圖。 第2圖是根據一些實施例所繪示的第1圖的部分背光裝置之示意圖。 第3圖是根據一些實施例所繪示的第1圖的部分背光裝置之示意圖。 第4圖是根據一些實施例所繪示的第1圖的部分背光裝置之示意圖。 第5圖是根據一些實施例所繪示的第1圖的部分背光裝置的之示意圖。 第6圖是根據一些實施例所繪示的背光裝置之示意圖。 FIG. 1 is a schematic diagram of a backlight device according to some embodiments. FIG. 2 is a schematic diagram of part of the backlight device of FIG. 1 according to some embodiments. FIG. 3 is a schematic diagram of part of the backlight device of FIG. 1 according to some embodiments. FIG. 4 is a schematic diagram of part of the backlight device of FIG. 1 according to some embodiments. FIG. 5 is a schematic diagram of part of the backlight device of FIG. 1 according to some embodiments. FIG. 6 is a schematic diagram of a backlight device according to some embodiments.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

100:背光裝置 100: Backlight device

101:印刷電路板 101: Printed circuit board

103:第一表面 103: first surface

105:第二表面 105: second surface

110:導電結構 110: Conductive structure

120:發光二極體電路 120: Light-emitting diode circuit

122:第一列發光二極體電路 122: The first row of light-emitting diode circuit

124:第二列發光二極體電路 124: The second row of light-emitting diode circuit

150,151,152,153:單元 150, 151, 152, 153: units

VLED,VLED1,VLED2,VLED3:供應電源 VLED, VLED1, VLED2, VLED3: power supply

Claims (10)

一種背光裝置，包含： 一印刷電路板，具有彼此相對的一第一表面和一第二表面； 複數個發光二極體電路，配置於該印刷電路板的該第一表面，其中該些發光二極體電路包含一第一列發光二極體電路以及一第二列發光二極體電路，該第一列發光二極體電路與該第二列發光二極體電路相鄰配置； 一導電結構，配置於該印刷電路板的該第二表面，電性耦接該些發光二極體電路，用以傳送一供應電源至該些發光二極體電路，其中該導電結構包含： 一第一導體，電性耦接該第一列發光二極體電路，且於該印刷電路板的該第一表面上的投影至少覆蓋該第一列發光二極體電路；以及 複數導線，電性耦接於該第一導體，其中該些導線的阻抗大致上彼此匹配。 A backlight device comprising: A printed circuit board has a first surface and a second surface opposite to each other; A plurality of light emitting diode circuits are arranged on the first surface of the printed circuit board, wherein the light emitting diode circuits include a first row of light emitting diode circuits and a second row of light emitting diode circuits, the The first row of light-emitting diode circuits is arranged adjacent to the second row of light-emitting diode circuits; A conductive structure, disposed on the second surface of the printed circuit board, electrically coupled to the light emitting diode circuits, for transmitting a power supply to the light emitting diode circuits, wherein the conductive structure includes: a first conductor electrically coupled to the first row of light-emitting diode circuits, and projected on the first surface of the printed circuit board to cover at least the first row of light-emitting diode circuits; and A plurality of wires are electrically coupled to the first conductor, wherein the impedances of the wires are substantially matched to each other. 如請求項1所述之背光裝置，其中 該些導線包含至少一第一導線、至少一第二導線以及至少一第三導線，其中該至少一第一導線、該至少一第二導線與該至少一第三導線電性耦接一輸入端，並用以自該輸入端接收該供應電源，該至少一第一導線電性耦接該第一導體之一第一側端點，該至少一第二導線電性耦接該第一導體之一第二側端點，該至少一第三導線電性耦接該第一導體之一中間端點，並且該第一側端點、該第二側端點以及該中間端點位於該第一導體的一長邊。 The backlight device as described in claim 1, wherein The wires include at least one first wire, at least one second wire and at least one third wire, wherein the at least one first wire, the at least one second wire and the at least one third wire are electrically coupled to an input terminal , and used to receive the power supply from the input terminal, the at least one first wire is electrically coupled to one of the first side terminals of the first conductor, and the at least one second wire is electrically coupled to one of the first conductors The second side terminal, the at least one third wire is electrically coupled to an intermediate terminal of the first conductor, and the first side terminal, the second side terminal and the intermediate terminal are located on the first conductor one long side. 如請求項1所述之背光裝置，其中 該些發光二極體電路更包含： 一第三列發光二極體電路，與該第二列發光二極體電路相鄰配置； 其中該導電結構更包含： 一第二導體，電性耦接該第三列發光二極體電路，且於該印刷電路板的該第一表面上的投影至少覆蓋該第三列發光二極體電路。 The backlight device as described in claim 1, wherein The LED circuits further include: a third row of light emitting diode circuits arranged adjacent to the second row of light emitting diode circuits; Wherein the conductive structure further includes: A second conductor is electrically coupled to the third row of light-emitting diode circuits, and its projection on the first surface of the printed circuit board at least covers the third row of light-emitting diode circuits. 如請求項3所述之背光裝置，其中 該些導線更包含至少一第一導線、至少一第二導線以及至少一第三導線，其中該至少一第一導線、該至少一第二導線與該至少一第三導線電性耦接該輸入端，並用以自該輸入端接收該供應電源，該至少一第一導線電性耦接該第二導體之一第一側端點，該至少一第二導線電性耦接該第二導體之一第二側端點，該至少一第三導線電性耦接該第二導體之一中間端點，並且該第一側端點、該第二側端點以及該中間端點位於該第二導體的一長邊。 The backlight device as described in claim 3, wherein The wires further include at least one first wire, at least one second wire and at least one third wire, wherein the at least one first wire, the at least one second wire and the at least one third wire are electrically coupled to the input end, and is used to receive the power supply from the input end, the at least one first wire is electrically coupled to a first side terminal of the second conductor, and the at least one second wire is electrically coupled to the second conductor A second side terminal, the at least one third wire is electrically coupled to an intermediate terminal of the second conductor, and the first side terminal, the second side terminal and the intermediate terminal are located at the second one long side of the conductor. 如請求項1所述之背光裝置，其中該印刷電路板具有複數孔洞，該第一導體透過該些孔洞電性耦接該第一列發光二極體電路與該第二列發光二極體電路，且該第一導體於該印刷電路板的該第一表面上的投影更覆蓋該些孔洞。The backlight device according to claim 1, wherein the printed circuit board has a plurality of holes, and the first conductor is electrically coupled to the first row of light-emitting diode circuits and the second row of light-emitting diode circuits through the holes , and the projection of the first conductor on the first surface of the printed circuit board further covers the holes. 一種背光裝置，包含： 一印刷電路板，具有彼此相對的一第一表面和一第二表面； 複數列發光二極體電路，配置於該印刷電路板的該第一表面； 一鋪銅結構，配置於該印刷電路板的該第二表面，至少電性耦接該些列發光二極體電路中一第一列發光二極體電路，其中該鋪銅結構包含： 一第一鋪銅層，電性耦接該第一列發光二極體電路，且於該印刷電路板的該第一表面上的投影至少覆蓋該第一列發光二極體電路；以及 複數銅導線，電性耦接於該第一鋪銅層與一輸入端之間，其中該些銅導線於該第一鋪銅層與該輸入端之間的長度大致上彼此相等。 A backlight device comprising: A printed circuit board has a first surface and a second surface opposite to each other; A plurality of rows of light-emitting diode circuits are arranged on the first surface of the printed circuit board; A copper-clad structure, configured on the second surface of the printed circuit board, is at least electrically coupled to a first column of LED circuits in the array of LED circuits, wherein the copper-clad structure includes: a first copper clad layer, electrically coupled to the first row of light-emitting diode circuits, and projected on the first surface of the printed circuit board to at least cover the first row of light-emitting diode circuits; and A plurality of copper wires are electrically coupled between the first copper layer and an input end, wherein the lengths of the copper wires between the first copper layer and the input end are substantially equal to each other. 如請求項6所述之背光裝置，其中 該些銅導線包含至少一第一銅導線、至少一第二銅導線以及至少一第三銅導線，其中該至少一第一銅導線電性耦接該第一鋪銅層之一第一側端點，該至少一第二銅導線電性耦接該第一鋪銅層之一第二側端點，該至少一第三銅導線電性耦接該第一鋪銅層之一中間端點，並且該第一側端點、該第二側端點以及該中間端點位於該第一鋪銅層的一長邊，該第一側端點與該中間端點之距離大致上等於該第二側端點與該中間端點之距離。 The backlight device as described in claim 6, wherein The copper wires include at least one first copper wire, at least one second copper wire and at least one third copper wire, wherein the at least one first copper wire is electrically coupled to a first side end of the first copper layer point, the at least one second copper wire is electrically coupled to a second side terminal of the first copper layer, and the at least one third copper wire is electrically coupled to a middle end of the first copper layer, And the first side endpoint, the second side endpoint and the middle endpoint are located on a long side of the first copper layer, and the distance between the first side endpoint and the middle endpoint is substantially equal to the second The distance between the side endpoint and the middle endpoint. 如請求項6所述之背光裝置，其中 該些列發光二極體電路中一第二列發光二極體電路與該第一列發光二極體電路相鄰配置，並且該些列發光二極體電路中一第三列發光二極體電路與該第二列發光二極體電路相鄰配置； 其中該鋪銅結構更包含： 一第二鋪銅層，電性耦接該第三列發光二極體電路，且於該印刷電路板的該第一表面上的投影至少覆蓋該第三列發光二極體電路。 The backlight device as described in claim 6, wherein A second column of light-emitting diode circuits in the series of light-emitting diode circuits is adjacent to the first column of light-emitting diode circuits, and a third column of light-emitting diode circuits in the series of light-emitting diode circuits The circuit is arranged adjacent to the second row of light-emitting diode circuits; Wherein the copper laying structure further includes: A second copper clad layer is electrically coupled to the third row of light-emitting diode circuits, and its projection on the first surface of the printed circuit board at least covers the third row of light-emitting diode circuits. 如請求項8所述之背光裝置，其中 該些銅導線更包含至少一第一銅導線、至少一第二銅導線以及至少一第三銅導線，其中該至少一第一銅導線電性耦接該第二鋪銅層之一第一側端點，該至少一第二銅導線電性耦接該第二鋪銅層之一第二側端點，該至少一第三銅導線電性耦接該第二鋪銅層之一中間端點，並且該第一側端點、該第二側端點以及該中間端點位於該第二鋪銅層的一長邊，該第一側端點與該中間端點之距離大致上等於該第二側端點與該中間端點之距離。 The backlight device as described in claim 8, wherein The copper wires further include at least one first copper wire, at least one second copper wire and at least one third copper wire, wherein the at least one first copper wire is electrically coupled to a first side of the second copper layer terminal, the at least one second copper wire is electrically coupled to a second side terminal of the second copper layer, and the at least one third copper wire is electrically coupled to an intermediate terminal of the second copper layer , and the first side end point, the second side end point and the middle end point are located on a long side of the second copper layer, and the distance between the first side end point and the middle end point is substantially equal to the first side end point The distance between the two side endpoints and the middle endpoint. 如請求項6所述之背光裝置，其中該印刷電路板具有複數孔洞，該第一鋪銅層透過該些孔洞電性耦接該第一列發光二極體電路與該第二列發光二極體電路，且該第一鋪銅層於該印刷電路板的該第一表面上的投影更覆蓋該些孔洞。The backlight device as claimed in claim 6, wherein the printed circuit board has a plurality of holes, and the first copper layer is electrically coupled to the first row of light-emitting diode circuits and the second row of light-emitting diodes through the holes. The body circuit, and the projection of the first copper layer on the first surface of the printed circuit board further covers the holes.
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