TW202303112A - Vibration sensor - Google Patents
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Abstract
Description
本說明書涉及感測器領域,特別涉及一種包括振動組件的振動感測器。 相關申請案之交叉參考 This specification relates to the field of sensors, in particular to a vibration sensor including a vibration component. Cross References to Related Applications
本申請案主張於2021年7月2日提交之申請號為202110751143.6的中國專利申請案的優先權,於2021年8月19日提交之申請號為PCT/CN2021/113419的國際專利申請案的優先權,以及於2021年8月11日提交之申請號為PCT/CN2021/112017的國際專利申請案的優先權其全部內容通過引用的方式併入本文。This application claims the priority of the Chinese patent application with application number 202110751143.6 filed on July 2, 2021, and the priority of the international patent application with application number PCT/CN2021/113419 filed on August 19, 2021 rights, and the priority of the International Patent Application No. PCT/CN2021/112017 filed on August 11, 2021, the entire contents of which are incorporated herein by reference.
振動感測器是一種將振動信號轉換為電信號的能量轉換裝置,其用途包括作為麥克風(如氣導麥克風、骨導麥克風等)或監控設備等。振動感測器可以通過獲取振動的振幅和方向等資料,並將其轉化為電信號或其他所需要的形式,以供進一步分析和處理。A vibration sensor is an energy conversion device that converts vibration signals into electrical signals. Its uses include microphones (such as air conduction microphones, bone conduction microphones, etc.) or monitoring equipment. Vibration sensors can obtain data such as vibration amplitude and direction, and convert them into electrical signals or other required forms for further analysis and processing.
本說明書提供一種振動感測器,其在不增加轉換器的前提下,增加該振動感測器的靈敏度。This specification provides a vibration sensor, which increases the sensitivity of the vibration sensor without adding a converter.
本揭示內容的實施例之一提供一種振動感測器,包括:轉換器;與所述轉換器連接的振動組件,所述振動組件被配置於將外部振動信號傳遞至所述轉換器以產生電信號,所述振動組件包括一個或多個板狀結構以及與所述一個或多個板狀結構中每個板狀結構物理連接的一個或多個質量塊;所述振動組件被配置成在一個或多個目標頻段內使所述振動感測器的靈敏度大於所述轉換器的靈敏度。One of the embodiments of the present disclosure provides a vibration sensor, including: a converter; a vibration component connected to the converter, and the vibration component is configured to transmit an external vibration signal to the converter to generate an electric current. signal, the vibration assembly includes one or more plate-like structures and one or more masses physically connected to each of the one or more plate-like structures; the vibration assembly is configured to be in a Make the sensitivity of the vibration sensor greater than the sensitivity of the converter in one or more target frequency bands.
在一些實施例中,所述振動感測器在所述振動組件作用下的頻率響應曲線具有多個諧振峰。In some embodiments, the frequency response curve of the vibration sensor under the action of the vibration component has a plurality of resonance peaks.
在一些實施例中,與所述一個或多個板狀結構中一個板狀結構連接的所述一個或多個質量塊包括至少兩個質量塊。In some embodiments, the one or more masses connected to one of the one or more plate-like structures comprises at least two masses.
在一些實施例中,所述至少兩個質量塊的至少一個結構參數不同,所述結構參數包括尺寸、質量、密度且形狀。In some embodiments, at least one structural parameter of the at least two proof masses is different, and the structural parameter includes size, mass, density and shape.
在一些實施例中,在所述振動組件的振動方向上,所述一個或多個質量塊的投影位於所述板狀結構的投影內板狀。In some embodiments, in the vibration direction of the vibration assembly, the projection of the one or more mass blocks is located in a plate shape within the projection of the plate-shaped structure.
在一些實施例中,所述振動組件進一步包括支撐結構,用於支撐所述板狀結構,所述支撐結構物理連接於所述轉換器,所述板狀結構連接於所述支撐結構。In some embodiments, the vibration assembly further includes a support structure for supporting the plate-like structure, the support structure is physically connected to the converter, and the plate-like structure is connected to the support structure.
在一些實施例中,所述支撐結構由不透氣的材料製成。In some embodiments, the support structure is made of an air impermeable material.
在一些實施例中,在與所述一個板狀結構和所述一個或多個質量塊連接的表面垂直方向上,所述質量塊的投影區域與所述支撐結構的投影區域不重疊。In some embodiments, in a direction perpendicular to the surface connected to the one plate structure and the one or more proof masses, the projected area of the proof mass does not overlap with the projected area of the support structure.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊對應所述目標頻段中的多個目標頻段,使在所述對應的多個目標頻段內所述振動感測器的靈敏度大於所述轉換器的靈敏度。In some embodiments, the one plate-shaped structure and at least two mass blocks physically connected to the one plate-shaped structure correspond to multiple target frequency bands in the target frequency bands, so that in the corresponding multiple target frequency bands The sensitivity of the vibration sensor is greater than the sensitivity of the converter.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊具有的多個共振頻率,所述多個共振頻率中至少一個小於所述轉換器的共振頻率以使在所述一個或多個目標頻段中的多個目標頻段所述振動感測器的靈敏度大於所述轉換器的靈敏度。In some embodiments, the one plate-like structure and at least two masses physically connected to the one plate-like structure have multiple resonant frequencies, at least one of the multiple resonant frequencies is lower than that of the transducer The resonant frequency is such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in a plurality of target frequency bands of the one or more target frequency bands.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊的所述多個共振頻率相同或不同。In some embodiments, the multiple resonance frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure are the same or different.
在一些實施例中,其中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊的所述多個共振頻率中至少一個共振頻率與所述轉換器的所述共振頻率之間的差值在1 kHz至10 kHz之內。In some embodiments, at least one of the multiple resonance frequencies of the one plate-like structure and at least two masses physically connected to the one plate-like structure is the same as the resonant frequency of the converter The difference between the resonant frequencies is within 1 kHz to 10 kHz.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊具有的所述多個共振頻率中相鄰兩個共振頻率相差小於2 kHz。In some embodiments, the difference between two adjacent resonant frequencies among the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure is less than 2 kHz.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊具有的所述多個共振頻率中相鄰兩個共振頻率相差不大於1 kHz。In some embodiments, the difference between two adjacent resonance frequencies among the plurality of resonant frequencies of the one plate structure and at least two masses physically connected to the one plate structure is not greater than 1 kHz.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊具有的所述共振頻率在1 kHz至10 kHz之內。In some embodiments, the resonant frequency of the one plate structure and at least two masses physically connected to the one plate structure is within 1 kHz to 10 kHz.
在一些實施例中,所述一個板狀結構以及與所述板狀結構物理連接的多個質量塊具有的所述共振頻率在1 kHz至5 kHz之內。In some embodiments, the resonant frequency of the one plate-like structure and the plurality of masses physically connected to the plate-like structure is within 1 kHz to 5 kHz.
在一些實施例中,所述一個板狀結構以及與所述一個板狀結構物理連接的至少兩個質量塊具有的所述多個共振頻率板狀與所述板狀結構和/或所述質量塊的參數有關,所述參數包括所述板狀結構的模量、所述轉換器與所述板狀結構之間形成腔體的體積、所述質量塊的半徑、所述質量塊的高度和所述質量塊的密度中至少一個。In some embodiments, the multiple resonant frequencies of the one plate-like structure and at least two mass blocks physically connected to the one plate-like structure are related to the plate-like structure and/or the mass The parameter is related to the parameters of the block, the parameters include the modulus of the plate structure, the volume of the cavity formed between the converter and the plate structure, the radius of the mass block, the height of the mass block and At least one of the densities of the mass.
在一些實施例中,與所述一個或多個板狀結構中一個板狀結構連接的所述一個或多個質量塊中的至少一個質量塊與所述一個板狀結構同心設置。In some embodiments, at least one of the one or more mass blocks connected to one of the one or more plate-like structures is arranged concentrically with the one of the plate-like structures.
在一些實施例中,所述一個或多個板狀結構中包括振膜。In some embodiments, a diaphragm is included in the one or more plate structures.
在一些實施例中,與所述振膜連接的所述一個或多個質量塊設置於所述振膜朝向所述轉換器的一面,或者設置於所述振膜背離所述轉換器的一面。In some embodiments, the one or more masses connected to the diaphragm are disposed on a side of the diaphragm facing the transducer, or disposed on a side of the diaphragm facing away from the transducer.
在一些實施例中,所述振膜包括聚四氟乙烯、膨體聚四氟乙烯、聚醚碸、聚偏氟乙烯、聚丙烯、聚對苯二甲酸乙二酯、尼龍、硝酸纖維素或混合纖維素中的至少一種。In some embodiments, the diaphragm comprises polytetrafluoroethylene, expanded polytetrafluoroethylene, polyether fluoride, polyvinylidene fluoride, polypropylene, polyethylene terephthalate, nylon, nitrocellulose, or At least one of mixed cellulose.
在一些實施例中,所述振膜的振動方向上,所述質量塊的投影區域位於所述振膜的投影區域內。In some embodiments, in the vibration direction of the diaphragm, the projected area of the proof mass is located within the projected area of the diaphragm.
在一些實施例中,與所述振膜連接的所述一個或多個質量塊的個數可以大於1,分別設於所述振膜垂直與所述振動方向的兩側。In some embodiments, the number of the one or more mass blocks connected to the diaphragm may be greater than 1, and they are respectively arranged on two sides of the diaphragm perpendicular to the vibration direction.
在一些實施例中,與所述振膜連接的所述一個或多個質量塊的個數可以大於或等於3;所述至少三個質量塊不共線設置。In some embodiments, the number of the one or more mass blocks connected to the diaphragm may be greater than or equal to 3; the at least three mass blocks are not collinearly arranged.
在一些實施例中,所述一個或多個板狀結構中至少一個包括懸臂梁。In some embodiments, at least one of the one or more plate-like structures comprises a cantilever beam.
在一些實施例中,所述懸臂梁的材料包括銅、鋁、錫、矽、氧化矽、氮化矽、碳化矽、氮化鋁、氧化鋅、鋯鈦酸鉛或合金中的至少一種。In some embodiments, the material of the cantilever includes at least one of copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate or alloys.
在一些實施例中,與所述懸臂梁連接的所述一個或多個質量塊設置於所述懸臂梁的自由端。In some embodiments, the one or more mass blocks connected to the cantilever beam are arranged at the free end of the cantilever beam.
在一些實施例中,與所述懸臂梁連接的所述一個或多個質量塊與所述懸臂梁共線設置。In some embodiments, the one or more masses connected to the cantilever beam are collinearly arranged with the cantilever beam.
在一些實施例中,所述轉換器還包括傳導通道;所述振動組件沿所述拾音孔的徑向截面設於所述傳導通道內;或,所述振動組件設於所述傳導通道的外側。In some embodiments, the converter further includes a conduction channel; the vibration component is arranged in the conduction channel along the radial section of the sound pickup hole; or, the vibration component is arranged in the conduction channel outside.
在一些實施例中,與所述一個或多個板狀結構中至少一個連接的所述一個或多個不與所述傳導通道的內壁接觸。In some embodiments, the one or more connected to at least one of the one or more plate-like structures does not contact the inner wall of the conductive channel.
在一些實施例中,所述一個或多個板板狀結構中至少一個板狀結構上開設有貫穿孔。In some embodiments, at least one of the one or more plate-shaped structures is provided with a through hole.
在一些實施例中,所述一個或多個板板狀結構中至少一個板狀結構不完全覆蓋所述傳導通道。In some embodiments, at least one of the one or more plate-like structures does not completely cover the conductive channel.
在一些實施例中,所述一個或多個板板狀結構中距離所述轉換器最遠的板狀結構被構造成封閉所述傳導通道。In some embodiments, a plate-like structure of the one or more plate-like structures that is furthest from the transducer is configured to enclose the conductive channel.
本揭示內容的實施例之一提供一種聲音輸入裝置,其包括上述任一種所述的振動感測器。One of the embodiments of the present disclosure provides an audio input device, which includes any one of the vibration sensors described above.
本揭示內容的實施例之一提供一種振動系統,包括:板狀結構;振動件,與所述板狀結構連接;至少一個配重塊,與所述振動件連接,且在所述振動件的振動方向上,所述配重塊的投影位於所述振動件的投影內。One of the embodiments of the present disclosure provides a vibrating system, including: a plate-like structure; a vibrating element connected to the plate-shaped structure; at least one counterweight connected to the vibrating element, and on the vibrating element In the vibration direction, the projection of the counterweight is located within the projection of the vibrating element.
本揭示內容的實施例之一提供一種耳機,其包括上述的一種振動系統。One of the embodiments of the present disclosure provides an earphone, which includes the aforementioned vibration system.
為了更清楚地說明本發明實施例的技術方案,下面將對實施例描述中所需要使用的附圖作簡單的介紹。顯而易見地,下面描述中的附圖僅僅是本發明的一些示例或實施例,對於所屬技術領域中具有通常知識者來講,在不付出進步性努力的前提下,還可以根據這些附圖將本發明應用於其它類似情景。除非從語言環境中顯而易見或另做說明,圖式中相同的元件符號代表相同結構或操作。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings that need to be used in the description of the embodiments. Apparently, the accompanying drawings in the following description are only some examples or embodiments of the present invention, and for those skilled in the art, the present invention can also be translated according to these drawings without making progressive efforts. The invention applies to other similar scenarios. Unless otherwise apparent from context or otherwise indicated, like reference symbols in the drawings represent like structures or operations.
如本說明書和申請專利範圍中所示,除非上下文明確提示例外情形,“一”、“一個”、“一種”和/或“該”等詞並非特指單數,也可包括複數。一般說來,術語“包括”與“包含”僅提示包括已明確標識的步驟和元素,而這些步驟和元素不構成一個排它性的羅列,方法或者設備也可能包含其他的步驟或元素。術語“基於”是“至少部分地基於”。術語“一個實施例”表示“至少一個實施例”;術語“另一實施例”表示“至少一個另外的實施例”。其他術語的相關定義將在下文描述中給出。As shown in this specification and claims, words such as "a", "an", "an" and/or "the" do not refer to the singular, and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other steps or elements. The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one further embodiment". Relevant definitions of other terms will be given in the description below.
在一些實施例中,振動感測器用於將振動轉換為電信號的裝置包括轉換器。通常單一轉換器僅存在一個諧振峰,該轉換器僅在諧振峰的頻率附近存在較高靈敏度。在一些實施例中,為了提高振動感測器的靈敏度,通過設置多個具有不同諧振峰的轉換器,以增加接收頻率範圍且靈敏度,但增加轉換器的數量會導致振動感測器的體積和製造成本的增加。In some embodiments, the vibration sensor means for converting vibrations into electrical signals includes a converter. Usually there is only one resonant peak in a single converter, and the converter has high sensitivity only around the frequency of the resonant peak. In some embodiments, in order to improve the sensitivity of the vibration sensor, a plurality of converters with different resonance peaks are arranged to increase the receiving frequency range and sensitivity, but increasing the number of converters will lead to the volume and Increased manufacturing costs.
有鑑於此,本說明書涉及一種振動感測器,其通過與轉換器連接的振動組件,使得振動感測器在目標頻段內的靈敏度大於轉換器的靈敏度。該振動感測器可以用於接收外界的振動信號,並將該振動信號轉換為能夠反映聲音資訊的電信號,其中,外部信號可以包括機械振動信號或信號等。振動組件可以包括板狀結構以及與板狀結構物理連接的一個或多個質量塊,質量塊被設置在板狀結構的一側。振動組件被配置成在一個或多個目標頻段內使所述振動感測器的靈敏度大於所述轉換器的靈敏度。In view of this, this specification relates to a vibration sensor, which makes the sensitivity of the vibration sensor in the target frequency band greater than that of the converter through a vibration component connected to the converter. The vibration sensor can be used to receive external vibration signals and convert the vibration signals into electrical signals capable of reflecting sound information, wherein the external signals can include mechanical vibration signals or signals. The vibrating assembly may include a plate structure and one or more mass blocks physically connected to the plate structure, and the mass block is arranged on one side of the plate structure. The vibratory assembly is configured such that the sensitivity of the vibration sensor is greater than the sensitivity of the transducer in one or more frequency bands of interest.
圖1是根據本揭示內容的一些實施例所示的振動感測器的模組化結構示意圖。FIG. 1 is a schematic diagram of a modular structure of a vibration sensor according to some embodiments of the present disclosure.
如圖1所示,振動感測器100可以包括轉換器110和振動組件120。在一些實施例中,轉換器110與振動組件120連接,振動組件120被配置為將外部振動信號傳遞至轉換器以產生電信號。當外部環境中出現振動時,振動組件120回應於外界環境的振動並將振動信號傳遞給轉換器110,再由轉換器120將振動信號轉化為電信號。振動感測器100可以應用於行動設備、可穿戴設備、虛擬實境設備、擴增實境設備等,或其任意組合。As shown in FIG. 1 , the
在一些實施例中,轉換器110可以是聲學轉換器,聲學轉換器可以包括麥克風。具體的,麥克風可以是以骨傳導為聲音主要傳播方式之一的麥克風或以空氣傳導為聲音主要傳播方式之一的麥克風。以氣空氣傳導為聲音主要傳播方式之一的麥克風為例,麥克風可以獲取傳導通道(如拾音孔處)的聲壓變化,並轉換為電信號。在一些實施例中,轉換器可以是加速度儀,加速度儀是彈簧至振動系統的具體應用,其通過敏感裝置接收振動信號得到電信號,再根據電信號處理得到加速度。在一些實施例中,加速度儀的工作頻率低於聲學轉換器。In some embodiments,
在一些實施例中,行動設備可以包括智慧手機、平板電腦、個人數位助理(PDA)、遊戲裝置、導航設備等,或其任何組合。在一些實施例中,可穿戴設備可以包括智慧手環、耳機、助聽器、智慧頭盔、智能手錶、智能服裝、智慧背包、智慧配件等,或其任意組合。在一些實施例中,虛擬實境設備和/或擴增實境設備可以包括虛擬實境頭盔、虛擬實境眼鏡、虛擬實境補丁、擴增實境頭盔、擴增實境眼鏡、擴增實境補丁等或其任何組合。例如,虛擬實境設備和/或擴增實境設備可以包括Google Glass、Oculus Rift、Hololens、Gear VR等。In some embodiments, mobile devices may include smartphones, tablet computers, personal digital assistants (PDAs), gaming devices, navigation devices, etc., or any combination thereof. In some embodiments, wearable devices may include smart bracelets, earphones, hearing aids, smart helmets, smart watches, smart clothing, smart backpacks, smart accessories, etc., or any combination thereof. In some embodiments, the virtual reality device and/or the augmented reality device may include a virtual reality helmet, virtual reality glasses, a virtual reality patch, an augmented reality helmet, an augmented reality glasses, an augmented reality environment patches, etc. or any combination thereof. For example, virtual reality devices and/or augmented reality devices may include Google Glass, Oculus Rift, Hololens, Gear VR, and the like.
如圖1所示,振動組件120包括一個或多個板狀結構121和一個或多個質量塊122。在一些實施例中,一個或多個板狀結構121中每個板狀結構與一個或多個質量塊122中的至少一個連接。振動組件120被配置成在一個或多個目標頻段內使振動感測器100的靈敏度大於轉換器110的靈敏度。在一些實施例中,一個板狀結構和與該板狀結構物理連接的質量塊形成的結構也可以稱為諧振結構。板狀結構121可以指能夠用於承載一個或多個質量塊的、柔性或剛性材料製成的結構。質量塊122為體積較小且質量較重的物體,在一些實施例中,根據振動組件120的使用場景和目標頻率的不同,質量塊的體積和質量也不同,具體可以參見圖2和圖8的相關描述,需要說明的,圖2和圖8的相關描述僅為本方案的一種實施例,並不意在限制本發明的保護範圍。As shown in FIG. 1 , the
在一些實施例中,板狀結構121可以包括單一的板狀結構(也可以稱為板狀件)。在一些實施例中,板狀結構121可以包括多個板狀件,例如,2個,3個,4個等。In some embodiments, the plate structure 121 may include a single plate structure (also referred to as a plate). In some embodiments, the plate-shaped structure 121 may include a plurality of plate-shaped members, for example, 2, 3, 4, etc.
在一些實施例中,與每個板狀結構連接的至少一個質量塊可以包括單一質量塊。在一些實施例中,與每個板狀結構連接的至少一個質量塊可以包括多個質量塊,例如,2個,3個,4個等。In some embodiments, at least one mass associated with each plate-like structure may comprise a single mass. In some embodiments, at least one mass connected to each plate-like structure may include multiple masses, eg, 2, 3, 4, etc.
在一些實施例中,板狀結構121中至少一個板狀結構連接至少兩個質量塊122。In some embodiments, at least one of the plate structures 121 is connected to at least two masses 122 .
在一些實施例中,振動組件120進一步包括支撐結構,用於支撐板狀結構121,支撐結構物理連接於轉換器110,板狀結構121連接於支撐結構。In some embodiments, the vibrating
在一些實施例中,一個或多個質量塊122可以設於板狀結構在振動方向上的任一側,在一些實施例中,多個質量塊還可以分別設於板狀結構在振動方向上的兩側。在一些實施例中,在板狀結構的振動方向上,與其連接的質量塊的投影區域位於板狀結構的投影區域內。在一些實施例中,在與板狀結構和質量塊連接的表面平行方向上(即垂直於振動方向),單側的一個或多個質量塊122的橫截面面積的總和小於板狀結構的橫截面面積。在一些實施例中,質量塊在板狀結構帶動下,振動方向與板狀結構的振動方向相同。In some embodiments, one or more mass blocks 122 can be arranged on either side of the plate-shaped structure in the vibration direction, and in some embodiments, multiple mass blocks can also be respectively arranged on the plate-shaped structure in the vibration direction on both sides. In some embodiments, in the vibration direction of the plate-shaped structure, the projected area of the mass block connected thereto is located within the projected area of the plate-shaped structure. In some embodiments, in the direction parallel to the surface connecting the plate-like structure and the mass block (that is, perpendicular to the vibration direction), the sum of the cross-sectional areas of one or more mass blocks 122 on one side is smaller than the cross-sectional area of the plate-like structure. Sectional area. In some embodiments, driven by the plate structure, the mass block vibrates in the same direction as the plate structure.
在一些實施例中,一個或多個板狀結構121以及與板狀結構物理連接的多個質量塊122對應目標頻段中的多個目標頻段,使在對應的多個目標頻段內振動感測器100的靈敏度大於轉換器110的靈敏度。在一些實施例中,至少一個板狀結構和質量塊的組合能夠在其接收到的振動信號時,會在其共振頻率附近的振動信號產生較大的振幅,從而提高振動感測器100的靈敏度。In some embodiments, one or more plate-like structures 121 and a plurality of mass blocks 122 physically connected to the plate-like structures correspond to multiple target frequency bands in the target frequency bands, so that the vibration sensor in the corresponding multiple target frequency bands The sensitivity of 100 is greater than the sensitivity of
在一些實施例中,測量振動感測器100和轉換器110靈敏度的方法可以是:在給定加速度(如1g,g為重力加速度)激勵下,採集裝置電學信號(如至30 dBV)的強度即為靈敏度(如,至30 dBV/g)。例如,可以在給定相同的加速度(如1g,g為重力加速度)激勵下,採集振動感測器100和轉換器110輸出的電學信號的強度以獲得振動感測器100和轉換器110的靈敏度。在一些實施例中,如轉換器110為麥克風時,在測量靈敏度時,可以把前述激勵源換成聲壓即可,即輸入指定頻段內的聲壓(聲壓的輸入方式可以是以骨導作為為聲音主要傳播方式或以氣導為聲音主要傳播方式)作為激勵,測量採集裝置的電學信號。In some embodiments, the method for measuring the sensitivity of the
在一些實施例中,為了適應多振動模態,一個板狀結構以及與板狀結構物理連接的一個或多個質量塊122的形成的振動組件會具有多個共振頻率,多個共振頻率可以相同或不同。多個質量塊中至少兩個質量塊的至少一個結構參數可以不同。質量塊的結構參數可以包括尺寸、質量、密度、形狀等。具體的,質量塊的尺寸可以是質量塊的長、寬、高、橫截面面積或體積參數中的至少一個。In some embodiments, in order to adapt to multiple vibration modes, a plate-shaped structure and one or more masses 122 physically connected to the plate-shaped structure form a vibration assembly that has multiple resonant frequencies, and the multiple resonant frequencies can be the same or different. At least one structural parameter of at least two masses of the plurality of masses may be different. The structural parameters of the proof mass may include size, mass, density, shape, etc. Specifically, the size of the mass block may be at least one of the length, width, height, cross-sectional area or volume parameter of the mass block.
在一些實施例中,振動感測器100在振動組件120作用下的頻率響應曲線具有多個諧振峰。In some embodiments, the frequency response curve of the
在一些實施例中,一個板狀結構以及與板狀結構物理連接的多個質量塊形成的諧振結構的多個共振頻率中至少一個共振頻率與轉換器100的共振頻率之間的差值在1 kHz至10 kHz之內。在一些實施例中,一個板狀結構121以及與板狀結構121物理連接的多個質量塊122具有的多個板狀結構121共振頻率中相鄰兩個共振頻率相差小於2 kHz。在一些實施例中,一個板狀結構121以及與板狀結構121物理連接的多個質量塊122具有的多個板狀結構121共振頻率中相鄰兩個共振頻率相差不大於1 kHz。In some embodiments, the difference between the resonant frequency of at least one of the resonant frequencies of the resonant structure formed by a plate-shaped structure and a plurality of masses physically connected to the plate-shaped structure and the resonant frequency of the
在一些實施例中,一個板狀結構121以及與板狀結構121物理連接的多個質量塊122具有的共振頻率在1 kHz至10 kHz之內。在一些實施例中,一個板狀結構121以及與板狀結構121物理連接的多個質量塊122具有的共振頻率在1 kHz至5 kHz之內。In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a resonant frequency within 1 kHz to 10 kHz. In some embodiments, a plate structure 121 and a plurality of masses 122 physically connected to the plate structure 121 have a resonant frequency within 1 kHz to 5 kHz.
通過在振動組件120中設置至少一個質量塊122,可以使得振動組件120能夠擁有多振動模態,從而使得振動感測器的頻率響應曲線具有兩個及兩個以上的諧振峰。由於在諧振峰所在的頻率區間內,振動感測器的靈敏度會增加,因此,頻率響應曲線具有兩個及兩個以上的諧振峰可以增加振動感測器高靈敏度的頻率區間。其中,振動模態是具有固定頻率、阻尼比和振型的振動狀態。不同振動模態對應不同的變形形式,例如,多個質量塊同步向上振動;一個質量塊向上振動、一個質量塊向下振動等。振動模態取決於振動組件120的自身特性,例如,質量塊122的剛度和尺寸、配重塊的大小、位置和密度等。在一些實施例中,一個質量塊可以產生一種模態、兩個質量塊可以產生兩種模態、三個質量塊可以產生三種有效模態或產生兩種有效模態。其中,有效模態指的是能夠讓空氣隙發生體積變化的模態。By arranging at least one mass 122 in the
在一些實施例中,一個或多個板狀結構121中至少一個板狀結構可以為振膜。振膜可以包括剛性膜或柔性膜。可以是剛性膜或柔性膜。剛性膜指的是膜體的楊氏模量大於第一模量閾值(例如,50 GPa)的膜體。柔性膜指的是膜體的楊氏模量小於第二模量閾值的膜體。在一些實施例中,第一模量閾值和/或第二模量閾值可以根據實際需要設置。在一些實施例中,第一模量閾值可以與第二模量閾值相等或不相等。例如,第一模量閾值可以為20 GPa、30 GPa、40 GPa、50 GPa等,第二模量閾值可以為1 MPa、10 MPa、1 GPa、10 GPa等。關於振膜的詳細描述可以參考如圖2中的振膜的相關描述。In some embodiments, at least one of the one or more plate structures 121 may be a diaphragm. The diaphragm may comprise a rigid membrane or a flexible membrane. Can be rigid or flexible membrane. A rigid membrane refers to a membrane body having a Young's modulus greater than a first modulus threshold (eg, 50 GPa). A flexible film refers to a film body whose Young's modulus is less than the second modulus threshold. In some embodiments, the first modulus threshold and/or the second modulus threshold can be set according to actual needs. In some embodiments, the first modulus threshold may or may not be equal to the second modulus threshold. For example, the first modulus threshold may be 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc., and the second modulus threshold may be 1 MPa, 10 MPa, 1 GPa, 10 GPa, etc. For a detailed description of the diaphragm, reference may be made to the related description of the diaphragm as shown in FIG. 2 .
在一些實施例中,一個或多個板狀結構121中至少一個板狀結構可以為懸臂梁。懸臂梁可以包括剛性板。在一些實施例中,剛性板指的是膜體的楊氏模量大於第三模量閾值(例如,50 GPa)的板體。在一些實施例中,第三模量閾值可以根據實際需要設置,例如,可以為20 GPa、30 GPa、40 GPa、50 GPa等,關於懸臂梁的詳細描述可以參考如圖8a中的懸臂梁的相關描述。In some embodiments, at least one of the one or more plate structures 121 may be a cantilever beam. The cantilever beam may comprise a rigid plate. In some embodiments, a rigid plate refers to a plate whose Young's modulus of the film body is greater than a third modulus threshold (eg, 50 GPa). In some embodiments, the third modulus threshold can be set according to actual needs, for example, it can be 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc. For a detailed description of the cantilever beam, please refer to the cantilever beam in Figure 8a related description.
在一些實施例中,一個或多個板狀結構121可以包括至少一個振膜和至少一個懸臂梁,關於振膜和懸臂梁的具體情況,可以參閱後文中相關描述。In some embodiments, one or more plate-shaped structures 121 may include at least one diaphragm and at least one cantilever beam. For details about the diaphragm and the cantilever beam, please refer to the related description below.
圖2是根據本揭示內容的一些實施例所示的振動感測器的結構示意圖。Fig. 2 is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure.
圖2中的振動感測器200可以是圖1中的振動感測器100的一種具體實施方式。在一些實施例中,振動感測器200包括聲學轉換器210且振動組件220。需要說明的是,在一些其他實施例中,轉換器可以是聲學轉換器外的其他轉換器,如加速度計;此外,聲學轉換器還可以是其他形式,如液體傳聲器和雷射傳聲器。The
參考圖2,在一些實施例中,氣導麥克風包括拾音裝置212,在一些實施例中,拾音裝置212根據換能原理可以包括電容式、壓電式等形式的轉換器敏感元件,本說明書不做限制。Referring to Fig. 2, in some embodiments, the air conduction microphone includes a sound pickup device 212. In some embodiments, the sound pickup device 212 may include capacitive, piezoelectric and other transducer sensitive elements according to the principle of energy conversion. The specification does not limit.
在一些實施例中,聲學轉換器210還設有用於拾音的傳導通道211。在一些實施例中,振動組件220沿拾音孔的徑向截面設於傳導通道211內或如圖2所示的設於傳導通道211的外側。傳導通道211也可以稱為拾音孔或者進聲孔。In some embodiments, the
如圖2所示,振動組件220包括一個板狀結構以及與其物理連接的一個質量塊222,在一些實施例中,板狀結構與質量塊222可以通過卡接、黏接或者一體成型等方式實現連接,在本說明書中不對其連接方式加以限定。在一些實施例中,板狀結構包括一個振膜221。在一些實施例中,振膜221可以設置為透氣或不透氣的,示例性的為了使其具備更好的拾音效果,在一些實施例中,振膜221可以是不透氣的。As shown in FIG. 2 , the
需要注意的是,圖中示出一個振膜且一個板狀結構僅為了描述方便,但並不會限制本發明的保護範圍,在一些實施例中,質量塊可以包括多個,多個質量塊可以分別設於振膜221兩側,在一些實施例中多個質量塊也可以設於振膜221的同一側。示例性的,假設振動組件包括兩個以上質量塊,兩個質量塊可以設置於板狀結構的兩側。在一些實施例中,多個質量塊可以全部設置於振膜朝向轉換器的一面,或者設置於振膜背離轉換器的一面,以此保證振動的均勻。在一些實施例中,一個板狀結構以及與板狀結構物理連接的多個質量塊振膜221對應一個或多個不同目標頻段中的多個目標頻段,使在對應的目標頻段內振動感測器100的靈敏度可以大於轉換器210的靈敏度。在一些實施例中,一個板狀結構以及與板狀結構物理連接的多個質量塊222的多個共振頻率相同或不同。在一些實施例中,附加一組或多組質量塊和振膜後的振動感測器100在目標頻段內較轉換器110的靈敏度可提升3 dB至30 dB。需要說明的是,在一些實施例中,附加振動組件220後的振動感測器200較轉換器210的靈敏度還可以可提升30 dB以上,如與板狀結構物理連接的多個質量塊222具有相同諧振峰。It should be noted that a diaphragm and a plate-shaped structure are shown in the figure only for convenience of description, but do not limit the protection scope of the present invention. In some embodiments, the mass block may include multiple, multiple mass blocks They can be respectively arranged on both sides of the
在一些實施例中,多個質量塊可以共線設置或不共線設置,示例性的,在一些實施例中,若質量塊包括四個,四個質量塊中的兩個或三個可以共線設置,此外,四個質量塊還可以按陣列(如矩形陣列和環形陣列)設置。In some embodiments, a plurality of mass blocks can be arranged collinearly or not. Exemplarily, in some embodiments, if the mass blocks include four, two or three of the four mass blocks can be co-linear. In addition, the four masses can also be arranged in arrays (such as rectangular arrays and circular arrays).
,在一些實施例中,當振動組件220包括多個振膜時,可以將除了距離聲學轉換器210最遠的振膜構造成透氣的,以保證空氣振動(例如,聲波)可盡可能完全通過振膜進而利用拾音裝置221拾取該振動,能夠有效提高拾音質量。通過將距離聲學轉換器210最遠的板狀結構構造成不透氣,用以封閉傳導通道211使得傳導通道211內空氣振動時不會產生逸散,保證空氣壓縮的效果,從而使振動感測器200具備更好的拾音效果。, in some embodiments, when the vibrating
在一些實施例中,支撐結構230由不透氣的材料製成,不透氣的支撐結構230可使空氣中的振動信號在傳遞過程中,導致支撐結構230內聲壓變化(或空氣振動),使支撐結構230內部振動信號通過傳導通道211傳遞至聲學轉換器220內,在傳遞過程中不會穿過支撐結構230向外逸散,進而保證聲壓強度,提升傳聲效果。在一些實施例中,支撐結構230可以包括但不限於金屬、合金材料(如鋁合金、鉻鉬鋼、鈧合金、鎂合金、鈦合金、鎂鋰合金、鎳合金等)、硬質塑膠、泡棉等中的一種或多種。In some embodiments, the
在一些實施例中,在與振膜221和質量塊222連接的表面垂直方向上(即垂直於振動方向),質量塊的投影區域與支撐結構的投影區域不重疊。此種設置為了避免振膜221和質量塊222的振動受到支撐結構230的限制。在一些實施例中,振膜在厚度方向上的橫截面的形狀可以包括圓形、矩形、三角形或不規則圖形等,在一些實施例中,振膜的形狀還可以根據支撐結構230形狀進行設置,在本說明書中不做限制。在一些實施例中,為防止非平滑的曲線過度導致角點處應力過於集中,因此,本揭示內容實施例選擇振膜221為圓形。在一些實施例中,質量塊的形狀可以是圓柱體、圓臺、圓錐、立方體、三角體等,其大小和材質將在後文中進行說明,在本說明書中不對形狀進行限制。In some embodiments, in the direction perpendicular to the surface connecting the
在一些實施例中,質量塊222可以與振膜221同心設置。示例性的,質量塊222或振膜221具有圓形外輪廓時,同心設置的質量塊222在振動時,動能較為均勻的分散於振膜221上,從而使振膜221可更好的回應振動。在一些其他實施例中,質量塊222還可以設置在振膜211的其他位置,如偏心位置,偏心位置是指質量塊不與振膜同心設置。在一些實施例中,質量塊222的中心線與振膜221的邊緣之間的距離可以變化。在一些實施例中,質量塊222相對於振膜221的位置不同,可以調整振動系統10的諧振峰位置。例如,質量塊222從振膜221的邊緣區域向振膜221的中心移動時,可以使得諧振峰前移,即向低頻方向移動(共振頻率降低),若質量塊222從振膜221的中心位置向振膜221的邊緣區域移動時,可以使得諧振峰後移,即向高頻方向移動(共振頻率升高)。In some embodiments, the
在一些實施例中,振動感測器200用於進行氣導拾音時,當外界環境產生振動(例如,聲波)時,振膜221及振膜221上的質量塊回應外界環境的振動而產生振動,振膜221和質量塊產生的振動連同外界的振動信號(例如,聲波),可以導致傳導通道211內聲壓變化(或空氣振動)使振動信號通過傳導通道211傳遞至拾音裝置212並轉化為電信號,從而實現振動信號在一個或多個目標頻段內加強後被轉化為電信號的過程。其中,目標頻段可以是板狀結構和質量塊222所對應的共振頻率(或諧振頻率)所在的頻率範圍。示例性的,當振動感測器200用於作為麥克風時,目標頻段的範圍可以是200 Hz至2 kHz,具體的,在一些實施例中,若聲學轉換器的共振頻率為2 kHz,振動組件220的共振頻率可以配置成800 Hz、1 kHz或1.7 kHz等。In some embodiments, when the
在一些實施例中,振動組件210可以是應用於MEMS(微機電系統)裝置設計,也可以應用於宏觀裝置(如麥克風或揚聲器等)設計。在MEMS裝置製程中,振膜221沿其厚度方向可以是單層材料,例如Si、SiO2、SiNx、SiC等,也可以為雙層或多層複合材料,例如Si/SiO2,SiO2/Si,Si/SiNx,SiNx/Si/SiO2等。質量塊221可以是單層材料,如Si、Cu等,也可以是雙層或多層複合材料,如Si/SiO2,SiO2/Si,Si/SiNx,SiNx/Si/SiO2等。在一些實施例中,MEMS裝置中的振膜221材料為Si或SiO2/SiNx,質量塊222材料為Si。當振膜221且質量塊222為圓形時,半徑可以為500 μm至1500 μm,振膜221厚度可以為0.5 μm至5 μm;質量塊222的半徑可以為100 μm至1000 μm,質量塊222的高度可以為50 μm至5000 μm。In some embodiments, the vibrating
在宏觀裝置中,振膜221材料可以是高分子薄膜,如聚氨酯類、環氧樹脂類、丙烯酸酯類等,也可以是金屬薄膜,如銅、鋁、錫或其他合金及其複合薄膜等;質量塊221一般要求在盡可能小的體積下具備一定的質量,因此需要密度較大,其材料可以是銅、錫或其他合金及其複合材料。在宏觀裝置中,振膜221半徑可以為1 mm至10 cm,振膜210厚度可以為0.1 mm至5 mm;質量塊221半徑可以為0.2 mm至5 cm,質量塊221高度可以為0.1 mm至10 mm。在一些實施例中,振膜221的半徑可以為1.5 mm至10 mm,振膜221的厚度可以為0.2 mm至0.7 mm;質量塊221半徑可以為0.3 mm至5 mm,質量塊221高度可以為0.3 mm至5 mm。In the macroscopic device, the material of the
在一些實施例中,振膜221可以包括透氣膜,透氣膜包括聚四氟乙烯、膨體聚四氟乙烯、聚醚碸、聚偏氟乙烯、聚丙烯、聚對苯二甲酸乙二酯、尼龍、硝酸纖維素或混合纖維素中的至少一種或組合製成。在一些實施例中,當振膜221被配置成不透氣時,振膜221的材料可以是前述板狀結構的材料或可以將上述透氣膜經過處理(如將透氣孔覆蓋)得到。In some embodiments, the
在一些實施例中,振膜221可以是具有貫穿孔的板狀結構。在一些實施例中,貫穿孔的孔徑為0.01μm至10μm。較佳的,貫穿孔的孔徑可以為0.1μm至5μm,如0.2μm、0.5μm、0.8μm、1μm、2μm等。振膜221上的貫穿孔的直徑可以相同也可以不同。在一些實施例中,若振動組件230包括多個振膜,多個振膜上貫穿孔的直徑可以相同也可以不同,同一振膜上的貫穿孔的直徑可以相同也可以不同。在一些實施例中,貫穿孔的孔徑還可以大於5μm。當貫穿孔的孔徑大於5μm時,可以在不影響透氣的前提下,在振膜221上設置其他材料(如矽膠等)對部分貫穿孔或貫穿孔的部分區域進行覆蓋。In some embodiments, the
在一些實施例中,在一些實施例中,振動組件220可以進一步包括支撐結構230,支撐結構230用於支撐一組或多組振膜221和質量塊。支撐結構230物理連接於聲學轉換器230,振膜221和質量塊連接於支撐結構230。具體的,支撐結構230可以與聲學轉換器210的殼體連接。In some embodiments, the vibrating
圖3是根據本揭示內容的一些實施例所示的示例性振動組件的示意圖。3 is a schematic diagram of an exemplary vibratory assembly, according to some embodiments of the present disclosure.
圖3中所示的振動組件320可以是圖1中振動組件120的示例性實施例。由圖3可以看出,振膜321上設置有一個質量塊322。The
在一些實施例中,板狀結構可以嵌入設置在支撐結構330的內壁上或嵌入支撐結構330內。在一些實施例中,板狀結構可在支撐結構230內部的空間內振動同時板狀結構可完全遮擋支撐結構開口,即板狀結構的面積可以大於或等於支撐結構的開口面積,此種設置使外界環境中的空氣振動(例如,聲波)可盡可能完全通過板狀結構進而利用拾音裝置拾取該振動,能夠有效提高拾音質量。在一些實施例中,板狀結構還可以不完全覆蓋該支撐結構的開口,如板狀結構為懸臂梁的情況,具體可以參見後文中圖8A至8C的相關描述。In some embodiments, the plate structure can be embedded on the inner wall of the
圖4A至4C是根據本揭示內容的一些實施例所示的示例性振動組件的示意圖。4A-4C are schematic diagrams of exemplary vibratory assemblies according to some embodiments of the present disclosure.
圖4A為振動組件420的立體結構示意圖;圖4B是圖4A中所示的振動組件420在振動方向上的投影圖;圖4B是圖4A中所示的振動組件420垂直於振動方向上的投影圖。圖4A至4C中所示的振動組件可以是圖1中振動組件120的示例性實施例。Fig. 4A is a three-dimensional schematic diagram of a vibrating
如圖4A所示,在一些實施例中,振動組件420包括板狀結構且板狀結構上設置的兩個質量塊422,與圖3中振動組件420相似,板狀結構可以是設於支撐結構430上的振膜421。在一些實施例中,兩個質量塊422的結構參數可以相同,也可以不同。需要說明的是,振膜上連接的質量塊的個數可以不限於兩個,例如,可以是三個、四個或五個以上。As shown in FIG. 4A , in some embodiments, the vibrating
在一些實施例中,兩個質量塊422物理連接於振膜421上。在一些實施例中,兩個質量塊422可以分別設置於振膜421在振動方向上的兩側。同時參考圖4B和圖4C,在一些實施例中,兩質量塊422在振動方向上可以具有相同外輪廓,例如,皆為圓形;兩質量塊422在水平方向上(與振動方向垂直的方向)可以具有不同高度。由此,兩個質量塊422可以使振動組件在目標頻段內具有兩個不同共振頻率,從而產生兩個諧振峰,進而使振動組件420在兩個共振頻率附近的頻率區間(即目標頻段)的靈敏度得到提升,達到了拓寬頻段頻寬、提高靈敏度的效果。In some embodiments, the two
在一些實施例中,通過振膜421及質量塊422的參數設置,可以在具有振動組件420的振動感測器的頻率響應曲線上形成至少兩個諧振峰,從而形成多個高靈敏度的頻率區間且更寬的頻段。在一些實施例中,板狀結構以及與板狀結構物理連接的多個質量塊422具有的多個共振頻率與振膜421和/或質量塊422的參數有關,參數包括板狀結構的模量、轉換器與板狀結構之間形成腔體的體積、質量塊422的半徑、質量塊422的高度和質量塊422的密度中至少一個。具體的,共振頻率和靈敏度與上述參數之間的數學關係可以參見後文中公式1的相關描述。需要注意的是,質量塊422的質量或尺寸參數並非越大越好,若該參數設置得過大,可能會抑制振膜421發生變形,或可能因為質量塊422振幅過大產生新的有效模態。In some embodiments, by setting the parameters of the
在一些實施例中,兩個質量塊422的參數,如在振動方向上的高度可以滿足預設比例,如在一些實施例中,兩質量塊422的高度比可以是3:2、2:1、3:4或3:1等。In some embodiments, the parameters of the two
圖5A至5B是根據本揭示內容的一些實施例所示的示例性振動組件的示意圖。5A-5B are schematic diagrams of exemplary vibratory assemblies according to some embodiments of the present disclosure.
圖5A為振動組件520的立體結構示意圖;圖5B是圖5A中所示的振動組件520在振動方向上的投影圖;在一些實施例中,如圖5A所示,振動組件520與振動組件420類似,不同此處在於,振膜521上質量塊522的數量為三個。Fig. 5A is a three-dimensional schematic diagram of a vibrating
在一些實施例中,三個質量塊522在振膜521上可以不共線設置。可以理解的是,當質量塊522包括三個時,三個質量塊中兩兩之間的連線不重合。同時參考圖5B,在本實施例中,三個質量塊522呈三角形分佈,且質量塊522兩兩之間的距離相同。在一些實施例中,三個質量塊522可以使振動組件520在目標頻段內至少兩個頻點附近的頻率區間的靈敏度得到提升,達到了拓寬頻段頻寬、提高靈敏度的效果。In some embodiments, the three
圖6是根據本揭示內容的一些實施例所示的示例性振動組件的示意圖。6 is a schematic diagram of an exemplary vibratory assembly, according to some embodiments of the present disclosure.
如圖6所示,在一些實施例中,振動組件620中質量塊622的數量還是可以是4個,4個質量塊622按陣列(如環形陣列或矩形陣列)設置。在一些實施例中,4個質量塊622中至少兩個質量塊622具有不同諧振峰。在一些實施例中,當質量塊622包括四個及以上時,任意兩質量塊在振膜上中心點的連線,不會重合為一條直線。As shown in FIG. 6 , in some embodiments, the number of mass blocks 622 in the vibrating
在一些實施例中,振動感測器在振膜及質量塊作用下的頻率響應曲線具有一個或多個諧振峰。In some embodiments, the frequency response curve of the vibration sensor under the action of the diaphragm and the mass has one or more resonance peaks.
圖7是根據本揭示內容的一些實施例所示的振動感測器中的振動組件具有不同個數的質量塊下的頻率響應曲線的示意圖。Fig. 7 is a schematic diagram of frequency response curves of vibration components in a vibration sensor with different numbers of masses according to some embodiments of the present disclosure.
圖7中的頻率響應曲線圖700包括頻率響應曲線710和頻率響應曲線720兩條頻率響應曲線,其中,頻率響應曲線710表示振膜上設置有一個質量塊時(如圖3所示)振動感測器的頻率響應曲線;頻率響應曲線720表示振膜上設置有兩個質量塊(如圖4A所示)時振動感測器的頻率響應曲線。由圖中可以看出,頻率響應曲線710具備一個諧振峰,頻率響應曲線720具備兩個諧振峰。The frequency response curve diagram 700 in FIG. 7 includes two frequency response curves, a
在一些實施例中,一個質量塊的設置方式可以參考圖3中的設置方式,兩個質量塊的設置方式可以參考圖4A中的設置方式。由圖中可以看出,當振膜上設置有一個質量塊時,振動感測器諧振峰的頻率在2000 Hz附近。而在添加兩個具有相同直徑但高度不同的振膜上,振動感測器諧振峰的頻率分別位於1300 Hz和3500 Hz附近。可以看出,添加兩個質量塊的場景下,在這兩個頻點(1300 Hz和3500 Hz附近)的靈敏度大於轉換器的靈敏度,達到了在目標頻率(如500 Hz至5000 Hz範圍內)顯著提升振動感測器的靈敏度的效果。相比通過增加多組具有不同諧振峰的轉換器來增加接收頻率範圍的方式,減小了設備整體的體積、減小了成本,使其在集成性更高的基礎上具有更強的性能。In some embodiments, the arrangement of one mass may refer to the arrangement in FIG. 3 , and the arrangement of two masses may refer to the arrangement in FIG. 4A . It can be seen from the figure that when a mass is set on the diaphragm, the frequency of the resonance peak of the vibration sensor is around 2000 Hz. On the other hand, adding two diaphragms with the same diameter but different heights, the frequencies of the resonance peaks of the vibration sensor are located around 1300 Hz and 3500 Hz, respectively. It can be seen that in the scenario of adding two mass blocks, the sensitivity at these two frequency points (near 1300 Hz and 3500 Hz) is greater than the sensitivity of the converter, reaching the target frequency (such as within the range of 500 Hz to 5000 Hz) Significantly improves the sensitivity of the vibration sensor. Compared with the method of increasing the receiving frequency range by adding multiple sets of converters with different resonance peaks, the overall volume of the device is reduced, the cost is reduced, and it has stronger performance on the basis of higher integration.
在一些實施例中,板狀結構和板狀結構上的一個或多個質量塊的共振頻率與板狀結構和/或質量塊的參數有關,參數可以包括板狀結構的彈性模量、轉換器與板狀結構之間形成腔體的體積、質量塊的半徑、質量塊的高度和質量塊的密度中至少一個。示例性的,在一些實施例中,振膜和質量塊的共振頻率與靈敏度的關係可以表示為: (S,f)=g(K film,K foam,V cavity,R m,h m,ρ m) (1)。 In some embodiments, the resonant frequency of the plate-like structure and one or more masses on the plate-like structure is related to parameters of the plate-like structure and/or the proof-mass, the parameters may include elastic modulus of the plate-like structure, transducer At least one of the volume of the cavity, the radius of the mass block, the height of the mass block and the density of the mass block is formed between the plate-like structure. Exemplarily, in some embodiments, the relationship between the resonance frequency of the diaphragm and the mass and the sensitivity can be expressed as: (S,f)=g(K film ,K foam ,V cavity ,R m ,h m ,ρ m ) (1).
其中,S為設置振動組件後的振動感測器的靈敏度,f為振動組件的共振頻率,K
film為板狀結構剛度,K
foam為支撐結構剛度,V
cavity為腔體體積,R
m為質量塊半徑,h
m為質量塊高度,ρ
m為質量塊密度。腔體體積V
cavity為轉換器中的敏感元件(如圖2中的拾音裝置212)與其最接近的振動組件中的振膜(如圖2中的振膜221)之間形成的空間體積。
Among them, S is the sensitivity of the vibration sensor after the vibration component is set, f is the resonance frequency of the vibration component, K film is the stiffness of the plate structure, K foam is the stiffness of the supporting structure, V cavity is the volume of the cavity, and R m is the mass block radius, h m is the mass block height, ρ m is the mass block density. The cavity volume V cavity is the volume of space formed between the sensitive element in the converter (such as the pickup device 212 in FIG. 2 ) and the diaphragm in the closest vibrating component (such as the
具體的,在一些實施例中,靈敏度S隨板狀結構剛度K film增大而降低、隨支撐結構剛度K foam增大而降低、隨腔體體積V cavity的增大先增大後減小、隨質量塊半徑R m先增大後減小、隨質量塊高度h m增大而增大、隨質量塊密度ρ m增大而提升。振動組件的共振頻率f隨板狀結構剛度K film增大而增大、隨支撐結構剛度K foam增大而增大、隨質量塊半徑R m的增大先減小後增大、隨質量塊高度h m增大而減小、隨質量塊密度ρ m增大而減小。在一些實施例中,可以通過控制板狀結構的剛度、腔體體積且質量塊的材料和大小,調整靈敏度的大小且共振頻率。在一些實施例中,當板狀結構具備較低的剛度,可以將其設置為振膜的形式,如圖2的描述。在一些實施例中,當板狀結構具備較高的剛度或板狀結構體積期望設置較小時,可以將其設置為懸臂梁的形式,具體可以參見後文中圖8A至8C的描述。 Specifically, in some embodiments, the sensitivity S decreases with the increase of the plate structure stiffness K film , decreases with the increase of the support structure stiffness K foam , increases first and then decreases with the increase of the cavity volume V cavity , As the mass block radius R m first increases and then decreases, it increases as the mass block height h m increases, and it increases as the mass block density ρ m increases. The resonant frequency f of the vibrating assembly increases with the increase of the plate structure stiffness K film , increases with the increase of the supporting structure stiffness K foam , decreases first and then increases with the increase of the radius R m of the mass block, and increases with the increase of the mass block radius R m The height h m increases and decreases, and decreases with the increase of mass block density ρ m . In some embodiments, the sensitivity and resonance frequency can be adjusted by controlling the stiffness of the plate structure, the volume of the cavity, and the material and size of the proof mass. In some embodiments, when the plate structure has low rigidity, it can be set in the form of a diaphragm, as described in FIG. 2 . In some embodiments, when the plate-like structure has high rigidity or the volume of the plate-like structure is expected to be small, it can be set in the form of a cantilever beam. For details, please refer to the description of FIGS. 8A to 8C below.
圖8A至8C是根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖。8A to 8C are structural schematic diagrams of vibration components of a vibration sensor according to some embodiments of the present disclosure.
圖8A為振動組件820的立體結構示意圖;圖8B是圖8A中所示的振動組件820在振動方向上的投影圖;圖8B是圖8A中所示的振動組件820垂直於振動方向上的投影圖。圖8A至8C中所示的振動組件可以是圖1中振動組件120的示例性實施例。Fig. 8A is a three-dimensional schematic diagram of a vibrating
如圖8A所示,振動組件包括支撐結構830、懸臂梁821和質量塊822。懸臂梁821的一端與支撐結構830的一側物理連接,另一端為自由端,質量塊822與懸臂梁821的自由端物理連接。具體地,懸臂梁821與支撐結構830的物理連接方式可以包括焊接、卡接、黏接或者一體成型等連接方式,此處不對其連接方式加以限定。在一些實施例中,振動組件還可以不包括支撐結構830,懸臂梁821可以沿傳導通道的徑向截面設於傳導通道內或設於傳導通道的外側,懸臂梁821不完全覆蓋傳導通道。As shown in FIG. 8A , the vibration assembly includes a
在一些實施例中,懸臂梁821的材料包括銅、鋁、錫、矽、氧化矽、氮化矽、碳化矽、氮化鋁、氧化鋅、鋯鈦酸鉛或合金中的至少一種。在一些實施例中,質量塊822可以設於懸臂梁821在振動方向上的任意一側,在本實施例中,以質量塊822設於懸臂梁821振動方向遠離轉換器(圖中未示出)的一側進行說明。In some embodiments, the material of the
在一些實施例中,懸臂梁821自由端垂直於振動方向的任一側上設置有至少一個質量塊822。各個質量塊822的尺寸可以部分相同或全部相同,或全部不同。在一些實施例中,相鄰質量塊822之間的距離可以相同,也可以不同。在實際使用時,可以根據振動模態進行設計。In some embodiments, at least one
同時參考圖8A至圖8C,在一些實施例中,懸臂梁821上設置有三個質量塊822。懸臂梁821上的三個質量塊822尺寸相同且三個質量塊822在懸臂梁821的中心點是共線的。在一些實施例中,由於懸臂梁821在於振動方向垂直的水平方向上的寬度較窄,較佳的,一個或多個質量塊822與懸臂梁821共線設置,以此獲得更穩定的靈敏度提升。Referring to FIG. 8A to FIG. 8C at the same time, in some embodiments, three
在一些實施例中,懸臂梁821在徑向截面上具備矩形輪廓,在一些其他實施例中,懸臂梁821在徑向上截面可以為矩形、三角形、梯形、菱形及其他曲線形狀。在一些實施例中,可以通過改變懸臂梁821和質量塊822的材料、形狀和尺寸,可調節振動感測器的多個諧振峰位,由於採用懸臂梁或振膜作為板狀結構的原理類似,因此具體調節方式可以參見前文公式(1),公式(1)中的振膜參數可以直接通過懸臂梁821的參數進行替代。In some embodiments, the
在一些實施例中,振動感測器可以應用於MEMS裝置設計。在一些實施例中,振動感測器可以應用於宏觀裝置(如麥克風、揚聲器等)設計。在MEMS裝置製程中,懸臂梁821沿厚度方向可以為單層材料,如Si、SiO2、SiNx、SiC等,可以為雙層或多層複合材料,例如Si/SiO2,SiO2/Si,Si/SiNx,SiNx/Si/SiO2等。質量塊822可以是單層材料,如Si、Cu等,也可以是雙層或多層複合材料,如Si/SiO2,SiO2/Si,Si/SiNx,SiNx/Si/SiO2等。本揭示內容實施例選擇MEMS裝置中的懸臂梁821材料為Si或SiO2/SiNx,質量塊822材料為Si。在MEMS裝置製程中,在一些實施例中,懸臂梁821長度可以為500 μm至1500 μm;在一些實施例中,懸臂梁821厚度可以為0.5 μm至5 μm;在一些實施例中,質量塊822邊長可以為50 μm至1000 μm;在一些實施例中,質量塊822高度可以為50 μm至5000 μm。在一些實施例中,懸臂梁821長度可以為700 μm至1200 μm,懸臂梁821厚度可以為0.8 μm至2.5 μm;質量塊822邊長可以為200 μm至600 μm,質量塊822高度可以為200 μm至1000 μm。In some embodiments, vibration sensors can be applied to MEMS device designs. In some embodiments, the vibration sensor can be applied to the design of macroscopic devices (such as microphones, speakers, etc.). In the MEMS device manufacturing process, the
在宏觀裝置中,懸臂梁821材料可以是無機非金屬材料,如氮化鋁、氧化鋅、鋯鈦酸鉛等,也可以是金屬材料,如銅、鋁、錫或其他合金,或者以上材料組合等。質量塊822一般要求在盡可能小的體積下具備一定的質量,因此需要密度較大,其材料可以是銅、錫或其他合金,也可以是陶瓷材料。較佳地,懸臂梁821材料為氮化鋁、銅,質量塊822材料為錫塊或銅塊。在宏觀裝置中,懸臂梁821長度可以為1 mm至20 cm,懸臂梁821厚度可以為0.1 mm至10 mm;在一些實施例中,質量塊822邊長可以為0.2 mm至5 cm,質量塊822高度可以為0.1 mm至10 mm。在一些實施例中,懸臂梁821長度可以為1.5 mm至10 mm,懸臂梁821厚度可以為0.2 mm至5 mm;質量塊822邊長可以為0.3 mm至5 cm,質量塊822高度可以為0.5 mm至5 cm。In a macro device, the material of the
圖9A至9B是根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖。9A to 9B are structural schematic diagrams of vibration components of a vibration sensor according to some embodiments of the present disclosure.
如圖9A所示,在一些實施例中,振動組件920的懸臂梁921上可以設置兩個質量塊922,且兩個質量塊922的在振動方向上具有不同高度。在一些實施例中,靠近懸臂梁921自由端的質量塊922的高度可以低於遠離自由端的質量塊922的高度。在一些實施例中,如圖9B所示,靠近懸臂梁921自由端的質量塊922可以高於遠離自由端的質量塊922。需要說明的是,即使兩質量塊922的其他結構參數相同,但由於圖9A和圖9B中兩種情況下質量塊922位置不同,因此在一些實施例中,兩種情況可能具有兩種不同的諧振峰的形式。As shown in FIG. 9A , in some embodiments, two
圖10是根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖。Fig. 10 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure.
圖11是根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖。Fig. 11 is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure.
如圖10和圖11所示,在一些實施例中,懸臂梁上的質量塊1022還可以包括一個或四個。懸臂梁上設置的四個質量塊1022其結構參數可以相同、可以部分不同或均不相同。As shown in FIG. 10 and FIG. 11 , in some embodiments, the mass blocks 1022 on the cantilever beam may also include one or four. The structural parameters of the four
圖12是根據本揭示內容的一些實施例所示的振動感測器中的振動組件具有不同個數的質量塊下的頻率響應曲線的示意圖。Fig. 12 is a schematic diagram of frequency response curves of vibration components in a vibration sensor with different numbers of masses according to some embodiments of the present disclosure.
如圖12所示,在一些實施例中,振動感測器在懸臂梁及質量塊作用下的頻率響應曲線具有一個或多個諧振峰。圖12中的頻率響應曲線圖1200包括頻率響應曲線1210、頻率響應曲線1220和頻率響應曲線1230三條頻率響應曲線,其中,頻率響應曲線1210表示懸臂梁上設置有一個質量塊時(如圖10所示),振動感測器的頻率響應曲線;頻率響應曲線1220表示懸臂梁上設置有兩個質量塊時(如圖9A或9B所示),振動感測器的頻率響應曲線;頻率響應曲線1230表示懸臂梁上設置有三個質量塊時,振動感測器的頻率響應曲線(如圖8A所示)。由圖中可以看出,頻率響應曲線1210具備一個諧振峰、頻率響應曲線1220具備兩個諧振峰、頻率響應曲線1230具有三個諧振峰。As shown in FIG. 12 , in some embodiments, the frequency response curve of the vibration sensor under the action of the cantilever beam and the proof mass has one or more resonance peaks. The frequency response curve diagram 1200 in Fig. 12 comprises
在一些實施例中,懸臂梁上的質量塊的設置方式可以參考前文中的方式,如一個質量塊的設置方式可以參考圖10;三個質量塊的設置方式可以參考圖8a。由圖中可以看出,在只有一個質量塊時,振動感測器的諧振峰在10 kHz左右,而在具備兩個諧振峰時,振動感測器在3 kHz且13 kHz處形成了兩個諧振峰,通過設置兩個質量塊,使得在這兩個頻點附近的目標頻率內(如2 kHz至15 kHz範圍內)靈敏度得到顯著提升。在同一懸臂梁上放置三個質量塊時,振動感測器形成三個諧振峰,具體的,振動感測器2250 Hz、7600 Hz和15700 Hz處形成了三個諧振峰,使得這三個頻點附近的目標頻率內(如1 kHz至20 kHz)的靈敏度得到顯著提升,且將頻率響應曲線天然地劃分為了三個不同的頻段區間,這對後續的信號處理是有利的。進一步的,由圖中可以看出,隨著質量塊數量的增加,振動感測器整體的靈敏度也得到了提高,如頻率響應曲線1230在低頻段(如1 kHz以下)時,其靈敏度依舊高於頻率響應曲線1210,可以看出,在合理設置板狀結構和質量塊後,可以拓寬具有較高靈敏度的頻段頻寬、並且提高目標頻段內靈敏度。In some embodiments, the configuration of the mass blocks on the cantilever beam can refer to the previous methods, for example, the configuration of one mass block can refer to Figure 10; the configuration of three mass blocks can refer to Figure 8a. It can be seen from the figure that when there is only one mass, the resonance peak of the vibration sensor is around 10 kHz, and when there are two resonance peaks, the vibration sensor forms two resonance peaks at 3 kHz and 13 kHz. For the resonance peak, by setting two mass blocks, the sensitivity is significantly improved within the target frequency (such as within the range of 2 kHz to 15 kHz) near these two frequency points. When three mass blocks are placed on the same cantilever beam, the vibration sensor forms three resonance peaks. Specifically, the vibration sensor forms three resonance peaks at 2250 Hz, 7600 Hz and 15700 Hz, making the three frequencies The sensitivity within the target frequency (such as 1 kHz to 20 kHz) near the point is significantly improved, and the frequency response curve is naturally divided into three different frequency bands, which is beneficial to subsequent signal processing. Further, it can be seen from the figure that with the increase in the number of mass blocks, the overall sensitivity of the vibration sensor is also improved. For example, when the
在本說明書的一些實施例中,還提供了一種聲音輸入裝置,其包括前述實施例中的感測器,通過感測器將振動信號轉化為電信號,以供進一步處理。In some embodiments of the present specification, there is also provided a sound input device, which includes the sensor in the foregoing embodiments, and the vibration signal is converted into an electrical signal by the sensor for further processing.
圖13是根據本揭示內容的一些實施例所示的振動感測器的結構示意圖。Fig. 13 is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure.
如圖13所示,振動感測器1300可以是圖1中的振動感測器100的一種具體實施方式。在一些實施例中,振動感測器1300包括聲學轉換器1310且振動組件。振動組件在傳導通道內1311遠離聲學轉換器1310的方向上依次包括懸臂梁1321、質量塊1323、振膜1322和多個質量塊1324。在一些實施例中,振膜1322可以是透氣膜也可以是不透氣膜,示例性的,振膜1322為不透氣膜。在一些實施例中,懸臂梁1321還可以設於振膜1322遠離聲學轉換器1310的一側,在該實施例中,振膜1322可以是透氣膜。As shown in FIG. 13 , the
在一些實施例中,懸臂梁1321和質量塊1323可以對應一個共振頻率;振膜1322和多個質量塊1324可以對應一個或兩個共振頻率。在一些實施例中,可以將前述三個共振頻率設置為不同的,使得振動感測器在振動組件1300的作用下的頻率響應曲線具有三個諧振峰,從而形成多個高靈敏度的頻率區間且更寬的頻段。In some embodiments, the
圖14是根據本揭示內容的一些實施例所示的耳機的模組化結構示意圖。Fig. 14 is a schematic diagram of a modular structure of an earphone according to some embodiments of the present disclosure.
如圖14所示,耳機1包括振動系統10,用於接收振動(如拾音)以進一步處理。振動系統10可以是圖1中振動感測器100中的振動組件120。As shown in FIG. 14 , the earphone 1 includes a
其中,耳機1中其餘的功能性元件請參考一般的耳機1,此處不對其餘功能性元件做進一步贅述。Wherein, for other functional components in the earphone 1, please refer to the general earphone 1, and further description of the other functional components will not be given here.
上述方案,通過合理的振動件及設計,可以在頻率響應曲線上形成至少兩個諧振峰,從而形成多個高靈敏度的頻率區間且更寬的頻段。In the above scheme, at least two resonant peaks can be formed on the frequency response curve through a reasonable vibrating element and design, thereby forming multiple high-sensitivity frequency ranges and wider frequency bands.
上文已對基本概念做了描述,顯然,對於所屬領域中具有通常知識者來說,上述發明揭露僅僅作為示例,而並不構成對本說明書的限定。雖然此處並沒有明確說明,所屬領域中具有通常知識者可能會對本說明書進行各種修改、改進和修正。該類修改、改進和修正在本說明書中被建議,所以該類修改、改進、修正仍屬於本說明書示範實施例的精神和範圍。The basic concept has been described above, obviously, for those with ordinary knowledge in the field, the above invention disclosure is only used as an example, and does not constitute a limitation to this description. Although not expressly stated herein, various modifications, improvements and amendments to this specification may be made by those having ordinary skill in the art. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.
同時,本說明書使用了特定詞語來描述本說明書的實施例。如“一個實施例”、“一實施例”和/或“一些實施例”意指與本說明書至少一個實施例相關的某一特徵、結構或特點。因此,應強調並注意的是,本說明書中在不同位置兩次或多次提及的“一實施例”或“一個實施例”或“一替代性實施例”並不一定是指同一實施例。此外,本說明書的一個或多個實施例中的某些特徵、結構或特點可以進行適當的組合。Meanwhile, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment" and/or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that two or more references to "an embodiment" or "an embodiment" or "an alternative embodiment" in different places in this specification do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics in one or more embodiments of this specification may be properly combined.
此外,所屬領域中具有通常知識者可以理解,本說明書的各方面可以通過若干具有可專利性的種類或情況進行說明和描述,包括任何新的和有用的工序、機器、產品或物質的組合或對他們的任何新的和有用的改進。相應地,本說明書的各個方面可以完全由硬體執行、可以完全由軟體(包括韌體、常駐軟體、微碼等)執行、也可以由硬體和軟體組合執行。以上硬體或軟體均可被稱為“資料塊”、“模組”、“引擎”、“單元”、“元件”或“系統”。此外,本說明書的各方面可能表現為位於一個或多個電腦可讀取媒體中的電腦產品,該產品包括電腦可讀取程式編碼。In addition, those skilled in the art will appreciate that various aspects of this specification may be illustrated and described in several patentable categories or situations, including any new and useful process, machine, product or combination of substances or Any new and useful improvements to them. Correspondingly, various aspects of this specification may be entirely executed by hardware, may be entirely executed by software (including firmware, resident software, microcode, etc.), or may be executed by a combination of hardware and software. The above hardware or software may be referred to as "data block", "module", "engine", "unit", "component" or "system". Additionally, aspects of this specification may be embodied as a computer product comprising computer readable program code on one or more computer readable media.
此外,除非申請專利範圍中明確說明,本說明書所述處理元素和序列的順序、數字字母的使用或其他名稱的使用,並非用於限定本說明書流程和方法的順序。儘管上述揭露中通過各種示例討論了一些目前認為有用的發明實施例,但應當理解的是,該類細節僅起到說明的目的,附加的申請專利範圍並不僅限於揭露的實施例,相反,申請專利範圍旨在覆蓋所有符合本揭示內容的實施例實質和範圍的修正和等價組合。例如,雖然以上所描述的系統元件可以通過硬體設備實現,但是也可以只通過軟體的解決方案得以實現,如在現有的伺服器或行動設備上安裝所描述的系統。In addition, unless it is clearly stated in the scope of patent application, the order of processing elements and sequences, the use of numbers and letters or the use of other names in this specification are not used to limit the sequence of processes and methods in this specification. While the foregoing disclosure discusses, by way of various examples, some embodiments of the invention that are presently believed to be useful, it should be understood that such details are for illustrative purposes only and that the scope of the appended claims is not limited to the disclosed embodiments. The scope of the patent is intended to cover all modifications and equivalent combinations consistent with the spirit and scope of the embodiments of the present disclosure. For example, although the above-described system components can be implemented by hardware devices, they can also be implemented by only software solutions, such as installing the described system on an existing server or mobile device.
同理,應當注意的是,為了簡化本說明書揭露的表述,從而幫助對一個或多個發明實施例的理解,前文對本揭示內容的實施例的描述中,有時會將多種特徵歸併至一個實施例、附圖或對其的描述中。但是,這種揭露方法並不意味著本說明書物件所需要的特徵比申請專利範圍中提及的特徵多。實際上,實施例的特徵要少於上述揭露的單個實施例的全部特徵。In the same way, it should be noted that in order to simplify the expression disclosed in this specification so as to facilitate the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of the disclosure, sometimes multiple features are combined into one implementation examples, drawings or descriptions thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.
一些實施例中使用了描述成分、屬性數量的數位,應當理解的是,此類用於實施例描述的數字,在一些示例中使用了修飾詞“大約”、“近似”或“大體上”等來修飾。除非另外說明,“大約”、“近似”或“大體上”表明所述數字允許有±20%的變化。相應地,在一些實施例中,說明書和申請專利範圍中使用的數值資料均為近似值,該近似值根據個別實施例所需特點可以發生改變。在一些實施例中,數值資料應考慮規定的有效位數並採用一般位數保留的方法。儘管本揭示內容的一些實施例中用於確認其範圍廣度的數值域和資料為近似值,在具體實施例中,此類數值的設定在可行範圍內盡可能精確。In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of the embodiments use modifiers such as "about", "approximately" or "substantially" in some examples. to modify. Unless otherwise stated, "about", "approximately" or "substantially" indicates that the stated figure allows for a variation of ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximations that may vary depending upon the desired characteristics of individual embodiments. In some embodiments, numerical data should take into account the specified number of significant digits and use the usual method of digit reservation. Although the numerical ranges and data used in some examples of the present disclosure to confirm the breadth of the scope thereof are approximations, in specific examples, such numerical values are set as precisely as practicable.
最後,應當理解的是,本發明中所述實施例僅用以說明本發明實施例的原則。其他的變形也可能屬於本發明的範圍。因此,作為示例而非限制,本發明實施例的替代配置可視為與本發明的教導一致。相應地,本發明的實施例不僅限於本發明明確介紹和描述的實施例。Finally, it should be understood that the embodiments described in the present invention are only used to illustrate the principles of the embodiments of the present invention. Other modifications are also possible within the scope of the present invention. Accordingly, by way of illustration and not limitation, alternative configurations of the embodiments of the present invention may be considered consistent with the teachings of the present invention. Accordingly, the embodiments of the present invention are not limited to the embodiments of the present invention explicitly shown and described.
1:耳機 10:振動系統 100:振動感測器 110:轉換器 120:振動組件 121:板狀結構 122:質量塊 200:振動感測器 210:聲學轉換器 220:振動組件 221:振膜 222:質量塊 230:支撐結構 320:振動組件 321:振膜 332:質量塊 330:支撐結構 420:振動組件 421:振膜 422:質量塊 430:支撐結構 520:振動組件 521:振膜 522:質量塊 620:振動組件 622:質量塊 700:頻率響應曲線圖 710:頻率響應曲線 720:頻率響應曲線 820:振動組件 821:懸臂梁 822:質量塊 830:支撐結構 920:振動組件 921:懸臂梁 922:質量塊 1022:質量塊 1200:頻率響應曲線圖 1210:頻率響應曲線 1220:頻率響應曲線 1230:頻率響應曲線 1300:振動感測器 1310:聲學轉換器 1311:傳導通道內 1321:懸臂梁 1322:振膜 1323:質量塊 1324:質量塊 1: Headphones 10: Vibration system 100: Vibration sensor 110: Converter 120: Vibration component 121: plate structure 122: mass block 200: vibration sensor 210: Acoustic Converter 220: Vibration components 221: Diaphragm 222: mass block 230: Support structure 320: Vibration components 321: Diaphragm 332: mass block 330: Support structure 420: Vibration components 421: Diaphragm 422: mass block 430: Support structure 520: vibration components 521: Diaphragm 522: mass block 620: Vibration components 622: mass block 700: Frequency Response Curve 710: Frequency response curve 720: Frequency response curve 820: Vibration components 821:Cantilever Beam 822: mass block 830:Support structure 920: Vibration components 921: cantilever beam 922: mass block 1022: mass block 1200: Frequency Response Curve 1210: Frequency response curve 1220: frequency response curve 1230: Frequency response curve 1300: Vibration sensor 1310: Acoustic Converter 1311: Inside the conduction channel 1321: cantilever beam 1322: Diaphragm 1323: mass block 1324: mass block
本發明將以示例性實施例的方式進一步說明,這些示例性實施例將通過附圖進行詳細描述。這些實施例並非限制性的,在這些實施例中,相同的編號表示相同的結構,其中:The invention will be further illustrated by way of exemplary embodiments which will be described in detail by means of the accompanying drawings. These examples are non-limiting, and in these examples, the same number indicates the same structure, wherein:
[圖1]係根據本揭示內容的一些實施例所示的振動感測器的模組化結構示意圖;[ FIG. 1 ] is a schematic diagram of a modular structure of a vibration sensor according to some embodiments of the present disclosure;
[圖2]係根據本揭示內容的一些實施例所示的振動感測器的結構示意圖;[ FIG. 2 ] is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure;
[圖3]係根據本揭示內容的一些實施例所示的示例性振動組件的示意圖;[ FIG. 3 ] is a schematic diagram of an exemplary vibrating assembly according to some embodiments of the present disclosure;
[圖4A]至[圖4C]係根據本揭示內容的一些實施例所示的示例性振動組件的示意圖;[FIG. 4A] to [FIG. 4C] are schematic diagrams of exemplary vibrating assemblies according to some embodiments of the present disclosure;
[圖5A]至[圖5B]係根據本揭示內容的一些實施例所示的示例性振動組件的示意圖;[FIG. 5A] to [FIG. 5B] are schematic diagrams of exemplary vibration assemblies according to some embodiments of the present disclosure;
[圖6]係根據本揭示內容的一些實施例所示的示例性振動組件的示意圖;[ FIG. 6 ] is a schematic diagram of an exemplary vibration assembly according to some embodiments of the present disclosure;
[圖7]係根據本揭示內容的一些實施例所示的振動感測器中的振動組件具有不同個數的質量塊下的頻率響應曲線的示意圖;[ FIG. 7 ] is a schematic diagram of the frequency response curves of the vibration components in the vibration sensor with different numbers of mass blocks according to some embodiments of the present disclosure;
[圖8A]至[圖8C]係根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖;[FIG. 8A] to [FIG. 8C] are structural schematic diagrams of the vibration components of the vibration sensor according to some embodiments of the present disclosure;
[圖9A]至[圖9B]係根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖;[FIG. 9A] to [FIG. 9B] are structural schematic diagrams of vibration components of vibration sensors according to some embodiments of the present disclosure;
[圖10]係根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖;[ Fig. 10 ] is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure;
[圖11]係根據本揭示內容的一些實施例所示的振動感測器的振動組件的結構示意圖;[ Fig. 11 ] is a schematic structural diagram of a vibration component of a vibration sensor according to some embodiments of the present disclosure;
[圖12]係根據本揭示內容的一些實施例所示的振動感測器中的振動組件具有不同個數的質量塊下的頻率響應曲線的示意圖;[ FIG. 12 ] is a schematic diagram of the frequency response curves of the vibration components in the vibration sensor with different numbers of mass blocks according to some embodiments of the present disclosure;
[圖13]係根據本揭示內容的一些實施例所示的振動感測器的結構示意圖;且[ Fig. 13 ] is a schematic structural diagram of a vibration sensor according to some embodiments of the present disclosure; and
[圖14]係根據本揭示內容的一些實施例所示的耳機的模組化結構示意圖。[ FIG. 14 ] is a schematic diagram of a modular structure of an earphone according to some embodiments of the present disclosure.
100:振動感測器 100: Vibration sensor
120:振動組件 120: Vibration component
121:板狀結構 121: plate structure
122:質量塊 122: mass block
110:轉換器 110: Converter
Claims (13)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110751143.6A CN115567848A (en) | 2021-07-02 | 2021-07-02 | Vibration system and earphone |
CN202110751143.6 | 2021-07-02 | ||
PCT/CN2021/112017 WO2023015478A1 (en) | 2021-08-11 | 2021-08-11 | Vibration sensor |
WOPCT/CN2021/112017 | 2021-08-11 | ||
WOPCT/CN2021/113419 | 2021-08-19 | ||
PCT/CN2021/113419 WO2023272906A1 (en) | 2021-07-02 | 2021-08-19 | Vibration sensor |
Publications (1)
Publication Number | Publication Date |
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TW202303112A true TW202303112A (en) | 2023-01-16 |
Family
ID=86657902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW111119260A TW202303112A (en) | 2021-07-02 | 2022-05-24 | Vibration sensor |
Country Status (3)
Country | Link |
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US (1) | US20230300519A1 (en) |
CN (1) | CN116636235A (en) |
TW (1) | TW202303112A (en) |
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2021
- 2021-08-19 CN CN202180083432.1A patent/CN116636235A/en active Pending
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2022
- 2022-05-24 TW TW111119260A patent/TW202303112A/en unknown
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2023
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US20230300519A1 (en) | 2023-09-21 |
CN116636235A (en) | 2023-08-22 |
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