TW202248770A

TW202248770A - exposure method

Info

Publication number: TW202248770A
Application number: TW111132449A
Authority: TW
Inventors: 名古屋淳
Original assignee: 日商亞多特克工程股份有限公司
Priority date: 2017-03-26
Filing date: 2018-03-01
Publication date: 2022-12-16
Also published as: JP2018163272A; KR20180109045A; JP2021113985A; TW201903519A; CN108628106A; KR102531997B1; TWI779014B; JP7196222B2; TWI830349B; CN108628106B; JP6865609B2

Abstract

To provide an exposure method in which optimized cleaning corresponding to a type of a substrate can be performed. A cleaning roller 4 is attached to a front end of a carry-in hand 31 via an arm 41 equipped with a telescopic mechanism 42, the cleaning roller 4 is horizontally moved while allowing the roller to contact a substrate W in returning to a standby position after the carry-in hand 31 mounts the substrate W on a platen 1, and the substrate W is cleaned. By an input from an input part 64 of a controller 6, an inner position from the substrate W mounted on the platen 1 can be set as a cleaning starting point Ps, and the controller 6 allows the cleaning roller 4 to perform cleaning while avoiding a margin.

Description

曝光方法exposure method

本案發明，係關於對基板照射預定圖型的光而曝光的曝光方法，特別是關於使用具備將附著於基板的表面的異物去除的清潔機構的曝光裝置之曝光方法。The present invention relates to an exposure method for exposing a substrate by irradiating light with a predetermined pattern, and particularly relates to an exposure method using an exposure apparatus equipped with a cleaning mechanism for removing foreign matter adhering to the surface of the substrate.

對基板照射預定圖型的光而曝光，係作為光微影(lithography)中主要的步驟廣受利用。因此，使用各種曝光裝置。曝光裝置，係已知有主要三個類型的裝置。一個類型係投影曝光，另一個類型係接觸曝光，再另一個類型係接近曝光。另外，亦已知有使用DMD(digital micro-mirror device，數位微鏡裝置)般之空間光調變元件的DI(direct imaging，直接成像)曝光。於該等曝光裝置中，基板係載置於被稱為載台(platen)之台狀的構件進行處理。 Exposure by irradiating light of a predetermined pattern on a substrate is widely used as a main step in photolithography. Therefore, various exposure devices are used. As exposure apparatuses, three main types of apparatuses are known. One type is projection exposure, another type is contact exposure, and yet another type is proximity exposure. In addition, DI (direct imaging, direct imaging) exposure using a spatial light modulation element such as a DMD (digital micro-mirror device, digital micromirror device) is also known. In these exposure apparatuses, a substrate is placed on a table-shaped member called a platen and processed.

於如此之曝光裝置中，在製品的高性能化、小型化、輕量化等的背景下，有曝光圖型的細微化或提升曝光品質的需求。因此，曝光裝置係多具備清潔機構。曝光處理的品質低落，多是在曝光之際於基板的表面附著有異物所導致。因此，已知有具備將微粒從基板去除的清潔機構的曝光裝置。於專利文獻1中，揭示有具備該種清潔機構的曝光裝置。設置於專利文獻1的裝置之清潔機構，係藉由黏著性的除塵滾輪將塵埃去除的機構。黏著性的除塵滾輪，係安裝於搬運基板的機械臂。 [先前技術文獻] [專利文獻] In such an exposure device, under the background of high performance, miniaturization, and weight reduction of products, there is a demand for miniaturization of exposure patterns or improvement of exposure quality. Therefore, exposure apparatuses are often equipped with a cleaning mechanism. The quality degradation of the exposure process is often caused by foreign matter adhering to the surface of the substrate during exposure. Therefore, there is known an exposure apparatus provided with a cleaning mechanism for removing particles from a substrate. Patent Document 1 discloses an exposure apparatus including such a cleaning mechanism. The cleaning mechanism provided in the device of Patent Document 1 is a mechanism for removing dust by an adhesive dust removal roller. Adhesive dust removal rollers are installed on the robot arm that transports the substrate. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2014-59494號公報 [專利文獻2]日本特開2007-25436號公報 [專利文獻3]日本特開2000-330097號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 2014-59494 [Patent Document 2] Japanese Unexamined Patent Publication No. 2007-25436 [Patent Document 3] Japanese Patent Laid-Open No. 2000-330097

[發明所欲解決的技術課題][Technical issues to be solved by the invention]

於專利文獻1中，雖針對遮罩的除塵進行詳細說明，然而並未針對基板的清潔進行詳細說明。根據發明者之研究，發現基板的清潔有特有的情況，該情況係依基板的種類有所不同。本案發明係依據如此發現而完成者，以提供一種能夠對應於基板的種類而進行最佳化的清潔的曝光方法為目的。 [用以解決課題的技術方案] In Patent Document 1, although the dust removal of the mask is described in detail, the cleaning of the substrate is not described in detail. According to the research of the inventors, it has been found that the cleaning of the substrate has its own characteristics, and the situation is different depending on the type of the substrate. The present invention was completed based on such findings, and aims at providing an exposure method capable of cleaning optimized according to the type of substrate. [Technical solution to solve the problem]

為解決前述課題，本案之請求項1之發明，係具有以下構成：一種曝光方法，係使用曝光裝置，藉由光照射單元對對載置於載台之基板照射預定圖型的光而使基板曝光；該曝光裝置係具備：前述載台；對於前述載台將前述基板搬入，並且在曝光後將前述基板從前述載台搬出的搬運系；對載置於前述載台的前述基板照射預定圖型的光的前述光照射單元；以及進行預對準的機構，係在將該基板載置於前述載台之前，將前述基板的位置大致對準；該方法之特徵為：前述搬運系，係包含在搬運之際保持前述基板的搬運臂，於前述搬運臂，係安裝有藉由黏著力將異物吸附而去除的清潔滾輪，前述清潔滾輪，係比所預想最大的前述基板的寬度更長，且比前述載台的寬度更長，並且，該方法係進行基板清潔之方法，在前述搬運臂為搬入或搬出前述基板而於待命位置與前述載台之間進行一次來回的移動之際，使前述清潔滾輪一邊接觸於前述基板一邊移動而藉此清潔前述基板，於前述基板清潔時之前述清潔滾輪之移動，係從載置於前述載台之前述基板之邊緣起至內側的位置起始，該內側的位置，就前述進行預對準的機構之預對準的精度而言，係比前述基板的邊緣更靠內側的位置，在進行預定次數的曝光之後，進行載台清潔，該載台清潔，係使前述清潔滾輪一邊接觸於未載置有前述基板之狀態下之前述載台一邊移動，藉此清潔前述載台。另外，為了解決前述課題，請求項2所述之發明，係具有如下構成：於前述請求項1的構成中，於前述載台清潔之移動之起始點，係移動方向之前述載台一方側的邊緣之位置，結束點係另一方側的邊緣。 [發明之效果] In order to solve the above-mentioned problems, the invention of claim 1 of this application has the following constitution: an exposure method, using an exposure device, and irradiating the substrate placed on the stage with light of a predetermined pattern by a light irradiation unit to make the substrate Exposure: The exposure apparatus is provided with: the aforementioned stage; a transfer system for carrying the aforementioned substrate into the aforementioned stage and carrying out the aforementioned substrate from the aforementioned stage after exposure; The above-mentioned light irradiation unit of light type; and the mechanism for pre-alignment, which roughly aligns the position of the above-mentioned substrate before placing the substrate on the above-mentioned stage; the method is characterized by: The aforementioned transfer system includes a transfer arm that holds the aforementioned substrate during transfer, The aforementioned transport arm is equipped with a cleaning roller that absorbs and removes foreign matter by adhesive force, The aforementioned cleaning roller is longer than the expected maximum width of the aforementioned substrate, and is longer than the width of the aforementioned stage, In addition, this method is a method of cleaning the substrate. When the transfer arm performs a back and forth movement between the stand-by position and the stage for carrying in or carrying out the substrate, the cleaning roller moves while contacting the substrate. And thereby cleaning the aforementioned substrate, The movement of the cleaning rollers during the cleaning of the substrate starts from the edge of the substrate placed on the stage to the inner position, and the inner position corresponds to the pre-alignment of the pre-alignment mechanism. In terms of accuracy, the position is closer to the inner side than the edge of the aforementioned substrate, After a predetermined number of exposures, stage cleaning is performed by moving the cleaning rollers while contacting the stage in a state where the substrate is not placed, thereby cleaning the stage. In addition, in order to solve the aforementioned problems, the invention described in Claim 2 has the following configuration: In the constitution of Claim 1, the starting point of the movement of the aforementioned stage cleaning is one side of the aforementioned stage in the moving direction. The position of the edge, the end point is the edge of the other side. [Effect of Invention]

如以下所說明般，依據本案所述之發明，因將從載置於載台的基板的邊緣起至內側的位置設定為清潔起始點，故能夠使清潔滾輪不接觸於載台而僅清潔基板，並且能夠一邊防止基板的位移等一邊進行清潔。另外，因亦進行載台的清潔，故能夠防止經由載台對於基板附著異物等。 As explained below, according to the invention described in this case, since the position from the edge to the inner side of the substrate placed on the stage is set as the cleaning starting point, it is possible to clean only the substrate without contacting the stage with the cleaning roller. substrate, and can be cleaned while preventing displacement of the substrate, etc. In addition, since the stage is also cleaned, it is possible to prevent foreign matter and the like from adhering to the substrate via the stage.

以下，針對用以實施本案發明之形態(以下稱為實施形態)進行說明。第1圖，係實施形態之曝光方法所使用之曝光裝置的正面示意圖。第1圖所示之曝光裝置，係具備：載台1；對載置於載台1的基板W照射預定圖型的光而曝光的光照射單元2；以及對於載台1將基板W搬入，在曝光後將基板W從載台1搬出的搬運系3。所謂載台1，係在處理之際基板W所載置的台狀的構件的總稱；於該實施形態中，載台1，係於水平的上面載置基板W。載台1，係於上面具備將基板W真空吸附的真空吸附機構12。 Hereinafter, an embodiment (hereinafter referred to as an embodiment) for implementing the present invention will be described. Fig. 1 is a schematic front view of an exposure apparatus used in the exposure method of the embodiment. The exposure apparatus shown in FIG. 1 includes: a stage 1; a light irradiation unit 2 for exposing a substrate W mounted on the stage 1 by irradiating light with a predetermined pattern; and carrying the substrate W into the stage 1, The transfer system 3 carries out the substrate W from the stage 1 after exposure. The stage 1 is a general term for a table-shaped member on which the substrate W is placed during processing; in this embodiment, the stage 1 is a horizontal upper surface on which the substrate W is placed. The stage 1 is provided with a vacuum suction mechanism 12 for vacuum suctioning the substrate W on its upper surface.

光照射單元2，係對應於曝光的方式而選擇適當者作裝載。例如以接觸方式而言，光照射單元2，係構成為具備與基板W相同程度的大小的遮罩、使載置於載台1的基板W密接於遮罩的載台驅動機構、通過遮罩照射預定圖型的光的照射光學系等。以接近方式而言，除了遮罩驅動機構使遮罩配置在從基板W稍微離開的位置的構成之外，與接觸方式基本上相同。以投影曝光方式而言，光照射單元2，係使穿透遮罩的光在基板W上成像的投影光學系。此外，以能採用使用如DMD般之空間光調變元件而將照射圖型無遮罩地直接形成的DI曝光方式。The photoirradiation unit 2 is loaded with an appropriate one according to the method of exposure. For example, in terms of a contact method, the light irradiation unit 2 is configured to include a mask having the same size as the substrate W, a stage drive mechanism for closely contacting the substrate W placed on the stage 1 to the mask, Irradiation optical system, etc., that irradiates light of a predetermined pattern. The approach method is basically the same as the contact method except that the mask drive mechanism arranges the mask at a position slightly separated from the substrate W. FIG. In terms of the projection exposure method, the light irradiation unit 2 is a projection optical system that forms an image on the substrate W with the light passing through the mask. In addition, the DI exposure method can be used to directly form the irradiation pattern without a mask by using a spatial light modulation device such as a DMD.

搬運系3，係包含在搬運之際保持基板W的搬運臂31、32。於該實施形態中，係於搬入側及搬出側設置搬運臂31、32(以下稱為搬入臂、搬出臂)。搬運系3，係具備驅動各搬運臂31、32的驅動機構310、320。另外，搬運系3，係隔著載台1具備輸送機33、34。搬入臂31，係從搬入側輸送機33拾取基板W並搬入至載台1，搬出臂32係從載台1拾取曝光完畢的基板W並搬運至搬出側輸送機34。於第1圖中，雖左側係搬入側而右側係搬出側，然相反亦可，乃不言自明。 The transfer system 3 includes transfer arms 31 and 32 that hold the substrate W during transfer. In this embodiment, the carrying arms 31 and 32 (hereinafter referred to as carrying arms and carrying arms) are provided on the carry-in side and the carry-out side. The conveyance system 3 includes drive mechanisms 310 and 320 for driving the respective conveyance arms 31 and 32 . In addition, the conveyance system 3 includes conveyors 33 and 34 via the stage 1 . The carry-in arm 31 picks up the substrate W from the carry-in conveyor 33 and carries it into the stage 1 , and the carry-out arm 32 picks up the exposed substrate W from the stage 1 and conveys it to the carry-out conveyor 34 . In Fig. 1, although the left side is the import side and the right side is the export side, it is self-explanatory that the reverse is also possible.

各搬運臂31、32，係具備從上側吸附基板W的吸附墊311、321。吸附墊311、321，於該實施形態中係真空吸附墊。吸附墊311、321，係對應於基板W的大小而均等地設置複數個。裝置，係具備使基板W在載台1上位於預定的位置的對準手段。對準手段，係以攝影基板W的對準標記之未圖示的照相機、驅動載台1而調節位置的載台驅動機構11等構成。 Each of the transfer arms 31 and 32 includes suction pads 311 and 321 for suctioning the substrate W from above. The adsorption pads 311 and 321 are vacuum adsorption pads in this embodiment. A plurality of suction pads 311 and 321 are equally provided corresponding to the size of the substrate W. As shown in FIG. The apparatus includes alignment means for positioning the substrate W at a predetermined position on the stage 1 . The alignment means is constituted by a camera (not shown) for photographing an alignment mark of the substrate W, a stage driving mechanism 11 for driving the stage 1 to adjust its position, and the like.

如此之曝光裝置，為了使提升曝光處理的品質，係於搬運臂設置清潔滾輪4。清潔滾輪4，係設置於搬入臂31及搬出臂32之任一者皆可，然而於該實施形態中係設置於搬入臂31。清潔滾輪4，於該實施形態中，係矽橡膠滾輪般使異物容易附著的樹脂製滾輪。In such an exposure device, in order to improve the quality of the exposure process, a cleaning roller 4 is attached to the transport arm. The cleaning roller 4 may be provided on either the carrying-in arm 31 or the carrying-out arm 32 , but is provided on the carrying-in arm 31 in this embodiment. The cleaning roller 4 is, in this embodiment, a resin roller such as a silicon rubber roller that facilitates adhesion of foreign matter.

以下，於搬入臂31中，將搬入基板W之際移動的方向為前，其相反側為後。另外，垂直於前後方向的水平方向(第1圖之紙面垂直方向)稱為深度方向。如第1圖所示，清潔滾輪4，係安裝於搬入臂31的前端。於清潔滾輪4的前端，固定有朝向下方延伸的臂部41。其係固定於深度方向的兩側之一對者。於臂部41，設置有伸縮機構42。伸縮機構42，係用以調節清潔滾輪4的位置，或是使清潔滾輪4退避而不致成為干擾的機構。作為伸縮機構42，能夠使用例如氣壓缸般之流體壓缸。清潔滾輪4，係長度方向朝向深度方向，藉由一對臂部41保持為能夠從動旋轉。清潔滾輪4的長度，係比被處理的基板W的深度方向的長度(基板W的寬度)稍長。雖多以一台曝光裝置處理不同大小的基板W，係使用比所預想最大的基板W的寬度稍長的清潔滾輪4。 Hereinafter, in the carrying-in arm 31 , the moving direction when carrying in the substrate W is referred to as the front, and the opposite side is referred to as the rear. In addition, the horizontal direction perpendicular to the front-back direction (the vertical direction on the paper surface in FIG. 1 ) is referred to as the depth direction. As shown in FIG. 1 , the cleaning roller 4 is mounted on the front end of the loading arm 31 . An arm portion 41 extending downward is fixed to the front end of the cleaning roller 4 . It is a pair fixed on both sides in the depth direction. A telescoping mechanism 42 is provided on the arm portion 41 . The retractable mechanism 42 is used to adjust the position of the cleaning roller 4, or to make the cleaning roller 4 recede without becoming an interference mechanism. As the expansion and contraction mechanism 42, a fluid pressure cylinder like an air cylinder can be used, for example. The cleaning roller 4 is rotatably held by a pair of arm parts 41 so that the longitudinal direction faces the depth direction. The length of the cleaning roller 4 is slightly longer than the length in the depth direction of the substrate W to be processed (the width of the substrate W). Although many substrates W of different sizes are processed with one exposure device, the cleaning roller 4 is used which is slightly longer than the expected maximum width of the substrate W.

另外，裝置係具備轉移附著滾輪5。轉移附著滾輪5，係以使附著於清潔滾輪4的異物轉移附著，降低清潔滾輪4的維護頻率為目的而設置。轉移附著滾輪5，係於表面具有黏著層的黏著滾輪。轉移附著滾輪5，係與家用的清掃用黏著滾輪相同，為捲繞有黏著膠帶(黏著紙)的構造，在異物對於轉移附著滾輪5的附著量較多的情形，藉由將表面的一枚黏著膠帶剝除便可使附著力回復。轉移附著滾輪5的黏著力，係比清潔滾輪4更高出相當程度。 In addition, the apparatus is provided with transfer attachment rollers 5 . The transfer adhesion roller 5 is provided for the purpose of transferring foreign matter adhering to the cleaning roller 4 and reducing the maintenance frequency of the cleaning roller 4 . The transfer attachment roller 5 is attached to the adhesive roller with an adhesive layer on the surface. The transfer attachment roller 5 is the same as the adhesive roller for household cleaning, and has a structure wound with an adhesive tape (adhesive paper). The adhesive tape can be peeled off to restore the adhesion. The adhesive force of transfer attachment roller 5 is higher than cleaning roller 4 to a certain degree.

於該實施形態中，轉移附著滾輪5，係設置於載台1與搬入側輸送機33之間的位置。轉移附著滾輪5，係與清潔滾輪4為相同程度的長度，且同樣地以長度方向朝向深度方向的方式配置。轉移附著滾輪5，係具備使本身主動旋轉的未圖示之轉移附著滾輪旋轉機構。若在清潔滾輪4接觸於轉移附著滾輪5的狀態，未圖示之轉移附著滾輪旋轉機構進行動作，則清潔滾輪4從動旋轉，而清潔滾輪4上的異物效率良好地轉移至轉移附著滾輪5。又，於轉移附著滾輪5，附設有轉移附著滾輪升降機構51。轉移附著滾輪升降機構51，係用以調整轉移附著滾輪5的高度以確保與清潔滾輪4的良好接觸狀態，或是使轉移附著滾輪5退避而不致干擾基板W的搬運動作的機構。In this embodiment, the transfer adhesion roller 5 is provided at a position between the stage 1 and the carry-in side conveyor 33 . The transfer attachment roller 5 is approximately the same length as the cleaning roller 4, and is similarly arranged so that the longitudinal direction faces the depth direction. The transfer adhesion roller 5 is equipped with a transfer adhesion roller rotation mechanism (not shown) that makes itself actively rotate. In the state where the cleaning roller 4 is in contact with the transfer adhesion roller 5, the transfer adhesion roller rotation mechanism (not shown) operates, the cleaning roller 4 is driven to rotate, and the foreign matter on the cleaning roller 4 is efficiently transferred to the transfer adhesion roller 5 . Also, a transfer adhesion roller elevating mechanism 51 is attached to the transfer adhesion roller 5 . The transfer attachment roller lifting mechanism 51 is used to adjust the height of the transfer attachment roller 5 to ensure a good contact state with the cleaning roller 4, or to retreat the transfer attachment roller 5 without interfering with the substrate W's transporting operation.

如第1圖所示，裝置係具備控制各部的控制器6。控制器6，係設置有記憶了使用於各部的控制之各種控制資訊的記憶部61，並安裝有以預定的程序使各部動作的程式62。控制器6，係能夠以藉由通用作業系統運作的電腦構成，並能夠構成為包含用以控制裝置的各部而安裝之控制板。如此之控制器，係具備對於各部輸出控制訊號的輸出部(包含各種介面)63。As shown in FIG. 1, the device includes a controller 6 for controlling each part. The controller 6 is provided with a memory 61 storing various control information used for controlling each part, and a program 62 for operating each part according to a predetermined program is installed. The controller 6 can be configured by a computer operated by a general-purpose operating system, and can be configured to include a control board installed to control various parts of the device. Such a controller includes an output unit (including various interfaces) 63 that outputs control signals to each unit.

針對程式62的示意圖，係於以下進行說明。第2圖，係表示程式62的概略的流程圖。如第2圖所示，程式62，係對於一個批次的各基板W，重複搬入動作、基板清潔、曝光、搬出動作。並且，當到達載台清潔週期，則進行載台1的清潔。當對於一個批次的最後的基板W的搬出動作結束，則對於該批次的程式的執行結束。程式62係被編程為以如此順序動作。 The schematic diagram of the program 62 is explained below. FIG. 2 is a flow chart showing the outline of the program 62 . As shown in FIG. 2 , the program 62 repeats the loading operation, substrate cleaning, exposure, and loading operation for each substrate W of one batch. And, when the stage cleaning cycle is reached, the stage 1 is cleaned. When the unloading operation for the last substrate W of one lot is completed, the execution of the program for the lot is ended. Program 62 is programmed to act in this order.

於前述構成之曝光裝置中，基板W的清潔，係在搬入臂31將基板W載置於載台1之後回到搬入側輸送機33的動作之際，在清潔滾輪4接觸於基板W的狀態使搬入臂31水平移動而進行。清潔滾輪4，係藉由與基板W的摩擦力而從動滾動，在此時吸附基板W上的異物。In the exposure apparatus having the aforementioned configuration, the cleaning of the substrate W is carried out in a state where the cleaning roller 4 is in contact with the substrate W when the carry-in arm 31 places the substrate W on the stage 1 and returns to the carry-in side conveyor 33 . This is performed by moving the carry-in arm 31 horizontally. The cleaning roller 4 is driven to roll by friction with the substrate W, and absorbs foreign matter on the substrate W at this time.

對於如此之清潔，使用曝光裝置之實施形態之曝光方法，為了使動作更佳，係將控制器6的構成進行最佳化。以下，針對該點進行說明。控制器6，係具備輸入任意的控制資訊的輸入部64，且於控制器6安裝有用以將控制資訊從輸入部64輸入而對於程式62賦予變數的未圖示之輸入程式。輸入部64係例如為觸控面板，輸入程式係編程為於觸控面板顯示輸入畫面，並將所輸入的值作為控制資訊寫入至程式62。 For such cleaning, the configuration of the controller 6 is optimized for better operation using the exposure method of the embodiment of the exposure device. Hereinafter, this point will be described. The controller 6 has an input unit 64 for inputting arbitrary control information, and an input program (not shown) for inputting control information from the input unit 64 and giving variables to the program 62 is installed in the controller 6 . The input unit 64 is, for example, a touch panel, and the input program is programmed to display an input screen on the touch panel, and write the input value into the program 62 as control information.

控制器6之控制資訊，亦包含用以控制前述清潔滾輪4的資訊。並且，從輸入部64所輸入的控制資訊，亦包含該清潔滾輪4的控制資訊。第3圖及第4圖，係表示清潔滾輪4的控制資訊的示意圖，第3圖係正面示意圖，第4圖係平面示意圖。於賦予程式62之清潔滾輪4的控制資訊，係包含用於清潔的移動起始地點及結束地點的資訊。此係包含基板W清潔之際的移動起始地點及結束地點。除此之外，亦有包含載台1清潔之際的移動起始地點及結束地點的情形。 The control information of the controller 6 also includes the information used to control the aforementioned cleaning roller 4 . In addition, the control information input from the input unit 64 also includes the control information of the cleaning roller 4 . Fig. 3 and Fig. 4 are schematic diagrams showing the control information of the cleaning roller 4, Fig. 3 is a front schematic diagram, and Fig. 4 is a schematic plan view. The control information of the cleaning roller 4 given to the program 62 includes the information of the moving start point and end point for cleaning. This includes the movement start point and end point when the substrate W is cleaned. In addition, the movement start point and end point when the stage 1 is cleaned may also be included.

另外，就高度方向而言，清潔之際載台1的上面(基板載置面)所位於的高度(以下稱為載台高度)，及清潔之際清潔滾輪4所位於之設定上的高度(以下稱為設定滾輪高度)係包含於控制資訊。又，對於搬運臂31、32，係設定基板W搬運時進行水平移動的高度(以下稱為搬運高度)。在搬入臂31位於搬運高度的狀態，清潔滾輪4的位於係比設定滾輪高度更高。於該實施形態中，在搬入臂31位於搬運高度的狀態，藉由伸縮機構42將臂部41伸長至極限位置使清潔滾輪4到達的預想位置係設定滾輪高度。 In addition, in terms of the height direction, the height at which the upper surface of the stage 1 (substrate mounting surface) is located during cleaning (hereinafter referred to as stage height), and the setting height at which the cleaning roller 4 is located during cleaning ( Hereinafter referred to as setting the height of the scroll wheel) is included in the control information. In addition, the conveyance arms 31 and 32 are set at a height at which the substrate W is horizontally moved during conveyance (hereinafter referred to as conveyance height). In the state where the carry-in arm 31 is located at the conveyance height, the position of the cleaning roller 4 is higher than the set roller height. In this embodiment, when the carrying arm 31 is at the carrying height, the expected position where the cleaning roller 4 reaches is the roller height set by extending the arm 41 to the limit position by the telescopic mechanism 42 .

於第3圖中，將載台高度以Hp表示，將基板的厚度以t表示，將設定滾輪高度以Hr表示。另外，將清潔起始地點以Ps表示，將清潔結束地點以Pe表示。清潔之際之基板W的表面的位置，雖係載台高度Hp+基板W的厚度t，然而在基板W較薄的情形，亦有將t視為零之情事。又，就特定各位置而言，必須有成為基準的位置，然而因例如具備支撐裝置整體之定盤10，故該定盤之上面成為基準面，其中心10C成為水平方向的基準點。In Fig. 3, the height of the stage is represented by Hp, the thickness of the substrate is represented by t, and the height of the set roller is represented by Hr. In addition, the cleaning start point is represented by Ps, and the cleaning end point is represented by Pe. The position of the surface of the substrate W at the time of cleaning is equal to the stage height Hp+the thickness t of the substrate W, but when the substrate W is thin, t may be regarded as zero. Also, for specifying each position, it is necessary to have a position as a reference, but because, for example, the fixed plate 10 of the whole supporting device is provided, the upper surface of the fixed plate becomes a reference plane, and its center 10C becomes a reference point in the horizontal direction.

雖非必要，於第3圖及第4圖中，載台1的中心與基準點10C位於相同鉛直線上。以下，將該鉛直線稱為中心軸。基板W的載置區域，係將作為中心軸上的點之載台1的中心設定為基準。亦即，在俯視觀察(第4圖)下，基板W的中心位於與載台1的中心一致的位置。又，基板W係方形，在一邊與搬運方向一致而另一邊與深度方向一致的狀態被載置。Although not necessary, in FIGS. 3 and 4 , the center of stage 1 and reference point 10C are located on the same vertical line. Hereinafter, this vertical line is called a central axis. The mounting area of the substrate W is based on the center of the stage 1 which is a point on the central axis. That is, the center of the substrate W coincides with the center of the stage 1 in plan view ( FIG. 4 ). In addition, the substrate W is a square shape, and is placed in a state where one side coincides with the conveyance direction and the other side coincides with the depth direction.

以下，在說明的方便上，設搬運方向為X方向，設深度方向為Y方向，設垂直方向為Z方向。如前述般，清潔滾輪4係在長度方向與深度方向一致的狀態進行配置，該長度係與載台1的深度為相同程度或稍微更長。基板W不會比載台1的上面更大。因此，清潔起始點Ps，基本上只要特定為X方向及Z方向的座標即可。亦即，就Y方向而言，不依基板W的種類，為常數便可。所謂為常數，係例如設定為清潔滾輪4的長度方向的中心位於Y軸上。Hereinafter, for convenience of description, the conveyance direction is referred to as the X direction, the depth direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. As mentioned above, the cleaning roller 4 is arrange|positioned in the state which the length direction and the depth direction correspond, and this length is about the same as the depth of the stage 1, or slightly longer. The substrate W is not larger than the upper surface of the stage 1 . Therefore, the cleaning start point Ps basically only needs to specify the coordinates in the X direction and the Z direction. That is, the Y direction may be constant regardless of the type of the substrate W. The term "constant" means, for example, that the center of the cleaning roller 4 in the longitudinal direction is located on the Y axis.

就Z方向而言，最初設定任一方皆可，例如對於設定滾輪高度Hr設定載台高度Hp。亦即，在清潔滾輪4位於設定滾輪高度Hr的位置之後，載台1上升之際，將載台1上的基板W能夠確實抵接於清潔滾輪4的高度設定為載台高度Hp。此時，清潔滾輪4，係稍微按壓載台1上的基板W為佳，故有設定滾輪高度Hr為比載台高度Hp+基板W的厚度t稍低的情形(Hp+t＞Hr)。此時，在清潔之際，清潔滾輪4係在被載台1稍微抬起的狀態，故清潔滾輪4的實際高度，係比設定滾輪高度Hr稍微更高。Regarding the Z direction, any one may be used for the initial setting, for example, the stage height Hp is set for the set roller height Hr. That is, when the stage 1 rises after the cleaning roller 4 is positioned at the set roller height Hr, the height at which the substrate W on the stage 1 can surely contact the cleaning roller 4 is set as the stage height Hp. At this time, it is better to slightly press the substrate W on the stage 1 for the cleaning roller 4, so the roller height Hr may be set to be slightly lower than the stage height Hp+the thickness t of the substrate W (Hp+t>Hr). At this time, during cleaning, the cleaning roller 4 is slightly lifted by the stage 1, so the actual height of the cleaning roller 4 is slightly higher than the set roller height Hr.

作為清潔滾輪4按壓載台1的構造，雖能夠考慮將任意之彈性構件設置於清潔滾輪4側，然而採用流體壓缸作為使清潔滾輪4上下移動的機構為簡便，於實施形態中係採用該構造。亦即，因載台1的上升，透過基板W使清潔滾輪4被抬起，成為使用作為伸縮機構42的流體壓缸內的流體稍微被壓縮的狀態。As a structure for the cleaning roller 4 to press the ballast stage 1, although it is conceivable to arrange any elastic member on the side of the cleaning roller 4, it is convenient to use a fluid pressure cylinder as a mechanism for moving the cleaning roller 4 up and down, and this is adopted in the embodiment. structure. That is, as the stage 1 rises, the cleaning roller 4 is lifted through the substrate W, and the fluid in the fluid pressure cylinder used as the telescoping mechanism 42 is slightly compressed.

另一方面，就X方向而言，係對應於清潔的種類及基板W的種類進行設定。於該實施形態中，清潔滾輪4不僅使用於基板W的清潔，亦使用於載台1的清潔，故清潔的種類會是基板W的清潔或是載台1的清潔。在載台1的清潔的情形，清潔起始點的X方向的位置，係載台1的上面的X方向的邊緣。另外，清潔結束點的X方向的位置，係X方向的相反側的邊緣。亦即，如第4圖所示，設載台1的上面的X方向的長度為PL時，清潔起始點的Y座標係+PL/2，清潔結束點的Y座標係-PL/2。 On the other hand, the X direction is set according to the type of cleaning and the type of substrate W. FIG. In this embodiment, the cleaning roller 4 is used not only to clean the substrate W, but also to clean the stage 1 , so the type of cleaning will be the cleaning of the substrate W or the stage 1 . In the case of cleaning the stage 1 , the position in the X direction of the cleaning start point is the edge of the upper surface of the stage 1 in the X direction. In addition, the position in the X direction of the cleaning end point is the edge on the opposite side in the X direction. That is, as shown in FIG. 4 , when the length in the X direction of the upper surface of the stage 1 is PL, the Y coordinate system of the cleaning start point is +PL/2, and the Y coordinate system of the cleaning end point is −PL/2.

就基板W的清潔而言，輸入對應於基板的種類的值，分別取得清潔起始點的X座標及清潔結束點的X座標。所謂「對應於基板的種類的值」，雖包含關於基板的形狀或大小的資訊，除此之外，亦有關於包含基板面內之應清潔的區域之資訊的情形。For the cleaning of the substrate W, values corresponding to the type of the substrate are input, and the X coordinates of the cleaning start point and the X coordinates of the cleaning end point are obtained respectively. The so-called "value corresponding to the type of substrate" includes information on the shape and size of the substrate, and may also include information on the region to be cleaned within the surface of the substrate.

具體而言，於第4圖中，將基板W的輪廓以S表示，將基板W的橫方向的長度以SL ₁表示。如後述般，基板W會被預對準，故載置於載台1的基板W的橫方向係與搬運方向一致，縱方向係與深度方向一致。因如前述般以使基板W的中心位於與中心軸一致的位置的方式配置基板W，故基板W的搬運方向的區域係對於原點O為±SL ₁/2。 Specifically, in Fig. 4 , the outline of the substrate W is represented by S, and the length _of the substrate W in the lateral direction is represented by SL1. As will be described later, since the substrate W is pre-aligned, the horizontal direction of the substrate W placed on the stage 1 coincides with the conveyance direction, and the vertical direction coincides with the depth direction. Since the substrate W is arranged so that the center of the substrate W coincides with the central axis as described above, the area in the conveyance direction of the substrate W is ±SL ₁ /2 with respect to the origin O.

此時，若於輸入部64輸入有SL ₁的資訊，則輸入程式將其給予程式62，於程式62，能夠將±SL ₁/2寫入作為清潔的控制資訊。亦即，能夠將+SL ₁/2被設定為清潔起始點的X座標，並將-SL ₁/2設定為清潔結束地點。 At this time, if the information of SL ₁ is input in the input unit 64, the input program gives it to the program 62, and in the program 62, ±SL _1/2 can be written as cleaning control information. That is, +SL _1/2 can be set as the X coordinate of the cleaning start point, and -SL _1/2 can be set as the cleaning end point.

作為更佳的實施形態，係將比SL ₁更小的尺寸資訊賦予程式62，能夠避開基板W周緣一定的區域(以下稱為餘裕區域)進行清潔。接著，針對其意義，使用第5圖及第6圖進行說明。第5圖及第6圖，係表示避開餘裕區域進行清潔的意義的正面示意圖。 As _a more preferable embodiment, size information smaller than SL1 is given to the program 62, and cleaning can be performed avoiding a certain area around the substrate W (hereinafter referred to as a margin area). Next, the significance thereof will be described using FIGS. 5 and 6 . Fig. 5 and Fig. 6 are front schematic diagrams showing the meaning of cleaning while avoiding spare areas.

避開餘裕區域較佳的理由之一，係為了防止基板W的位移。清潔基板W的表面的全部區域時，係如前述賦予±SL ₁的資訊而將±SL ₁/2設定為清潔起始點、清潔結束點。此時，清潔滾輪4的下端，係鮮少妥當地抵接於基板W的邊緣，因預對準的精度上的問題、使清潔滾輪4下降的機構精度上的問題，可能會多少有偏差。 One of the reasons why it is better to avoid the margin area is to prevent displacement of the substrate W. When cleaning the entire area of the surface of the substrate W, ±SL _1/2 is set as the cleaning start point and the cleaning end point as the information given to ±SL ₁ described above. At this time, the lower end of the cleaning roller 4 seldom abuts against the edge of the substrate W properly, and there may be some deviations due to problems in the precision of pre-alignment and the precision of the mechanism for lowering the cleaning roller 4 .

此時，如第5圖(1)所示，若清潔滾輪4下降至對於基板W朝向外側偏離的位置，且清潔滾輪4自該處開始水平移動，則成為清潔滾輪4將基板W朝向橫方向推出的狀態。此時，如前述般，基板W係被真空吸附於載台1，若施加有橫方向的力則容易偏移。在清潔後，係如前述般進行基板W的對準並在該狀態進行曝光，若位移較大，則對準標記會偏離照相機的視野而導致對準錯誤(無法對準)。At this time, as shown in FIG. 5 (1), if the cleaning roller 4 descends to a position deviated from the substrate W toward the outside, and the cleaning roller 4 starts to move horizontally from this position, the cleaning roller 4 turns the substrate W toward the lateral direction. The status of the rollout. At this time, as described above, the substrate W is vacuum-adsorbed to the stage 1, and is easily shifted when a force in the lateral direction is applied. After cleaning, the substrate W is aligned as described above, and exposure is performed in this state. If the displacement is large, the alignment mark will deviate from the field of view of the camera, resulting in misalignment (alignment failure).

前述問題，在翹曲的基板W的情形特別顯著。例如就玻璃環氧製般之剛性的基板W而言多少會有翹曲的情形，即便是翹曲的形狀亦不可謂之為不良品。就如此般之翹曲的基板W而言，載置於載台1並進行真空吸附之際，真空吸附孔無法充分密閉，故會有真空吸附力低落的情形。在真空吸附力低落的狀態，若如前述般施加橫方向的力，則容易產生大的位移，而容易導致對準錯誤。The aforementioned problems are particularly noticeable in the case of a warped substrate W. For example, a rigid substrate W made of glass epoxy may warp to some extent, and even a warped shape is not a defective product. When the substrate W with such a warp is placed on the stage 1 for vacuum suction, the vacuum suction holes cannot be sufficiently sealed, and thus the vacuum suction force may decrease. In the state where the vacuum adsorption force is low, if a force in the lateral direction is applied as described above, a large displacement is likely to occur, which easily leads to misalignment.

作為以+SL ₁/2作為清潔起始點的情形之別的問題點，係有容易拾起載台1上的異物之問題。該點係於第5圖(2)表示。如第5圖(2)所示，因預對準的精度等的問題使清潔滾輪4抵接於稍微偏離基板W的邊緣的位置時，清潔滾輪4會抵接於載台1的表面。此時，若於該部分存在有異物C，則該該異物C會附著於清潔滾輪4，且清潔滾輪4在該狀態進行水平移動於基板W的表面上滾動。因此，異物C會容易轉移附著於基板W的表面。因此，考慮預對準精度，從比基板W的邊緣稍微內側開始清潔為佳。 Another problem in the case where +SL _1/2 is used as the starting point for cleaning is that it is easy to pick up foreign objects on the stage 1 . This point is shown in Fig. 5 (2). As shown in FIG. 5 (2), when the cleaning roller 4 abuts on a position slightly deviated from the edge of the substrate W due to problems such as pre-alignment accuracy, the cleaning roller 4 abuts on the surface of the stage 1 . At this time, if there is a foreign object C in this portion, the foreign object C will adhere to the cleaning roller 4 , and the cleaning roller 4 moves horizontally and rolls on the surface of the substrate W in this state. Therefore, the foreign matter C is easily transferred and attached to the surface of the substrate W. As shown in FIG. Therefore, in consideration of the pre-alignment accuracy, it is better to start cleaning slightly inside from the edge of the substrate W. As shown in FIG.

應避開餘裕區域進行清潔的其他理由，係自防止乾膜剝離的觀點而言。該點係於第6圖表示。就印刷基板用的曝光裝置而言，會對於黏附有乾膜作為表面的光阻層的基板頻繁進行曝光。在對於附乾膜的基板進行清潔的情形，清潔滾輪4所直接抵接的係乾膜，而去除乾膜表面的異物。依據發明者之研究，若如此般對於附乾膜的基板進行清潔，容易產生乾膜的剝離。 Another reason to avoid cleaning in the margin area is from the standpoint of preventing dry film peeling. This point is shown in Figure 6. In the case of an exposure device for a printed board, exposure is frequently performed on a substrate to which a dry film is attached as a photoresist layer on the surface. In the case of cleaning a substrate with a dry film, the dry film directly abutted by the cleaning roller 4 removes foreign matters on the surface of the dry film. According to the research of the inventors, if the substrate with the dry film is cleaned in this way, the peeling of the dry film is likely to occur.

亦即，對於附乾膜的基板W進行清潔之際，若如第6圖(1)所示般將基板W的邊緣作為清潔起始點Ps進行清潔，則會如第6圖(2)所示般捲入乾膜F的邊緣而使乾膜F容易剝離。剝離了的乾膜F會成為碎片而被釋出，成為新的垃圾的產生源。乾膜F亦有覆蓋離基板W的周緣稍微內側的區域的情形，在該情形，亦容易發生乾膜F剝離、產生垃圾的問題，問題的發生頻率會更高。為防止如此之問題，係如第6圖(3)所示，從比乾膜F的邊緣更內側的位置開始清潔即可。亦即，將乾膜F的黏附位置的資料輸入作為控制資訊，使清潔起始點的X座標為比乾膜F的邊緣更靠原點側即可。 That is, when cleaning the substrate W with a dry film attached, if the edge of the substrate W is used as the cleaning starting point Ps as shown in FIG. 6 (1), the cleaning will be as shown in FIG. As shown, the edge of the dry film F is involved to make the dry film F easy to peel off. The peeled dry film F is released as fragments and becomes a source of new garbage. The dry film F may also cover an area slightly inward from the periphery of the substrate W. In this case, the dry film F is also prone to peeling and dust generation, and the occurrence frequency of the problem will be higher. In order to prevent such problems, as shown in Figure 6 (3), it is enough to start cleaning from the inner side of the edge of the dry film F. That is, the data of the sticking position of the dry film F is input as control information so that the X coordinate of the starting point of cleaning is closer to the origin side than the edge of the dry film F.

因此，如第4圖所示般設定為比SL ₁稍微更小的值SL ₂，並對於程式62賦予±SL ₂/2作為清潔起始點Ps的X座標、清潔結束點Pe的X座標。亦即，考慮前述各觀點決定餘裕量並以輸入部64輸入，設定±SL ₂/2。又，若如此般設定餘裕則該區域不會被清潔，然而該區域通常不會被使用於形成細微電路等用途，故鮮有特別造成問題之情形。另外，就清潔結束點而言，即便是基板W的邊緣亦無問題，故清潔結束點亦有以-SL ₁/2為X座標之情形。 Therefore, as shown in FIG. 4 , SL ₂ is set to a value slightly smaller than SL ₁ , and ±SL ₂ /2 is given to the program 62 as the X coordinate of the cleaning start point Ps and the X coordinate of the cleaning end point Pe. That is, the margin amount is determined in consideration of the aforementioned viewpoints, and is input through the input unit 64 to set ±SL ₂ /2. Also, if the margin is set in this way, the area will not be cleaned, but this area is not usually used for forming fine circuits, etc., so it is rarely a problem in particular. In addition, as for the end point of cleaning, there is no problem even at the edge of the substrate W, so the end point of cleaning may have -SL _1/2 as the X coordinate.

接著，針對使用如此般之曝光裝置之曝光方法而言，使用第7圖及第8圖進行概略地說明。第7圖及第8圖，係表示實施形態之曝光方法之曝光裝置的動作的正面示意圖。於以下的說明中，係以接觸方式的曝光裝置為例。一批次之基板W，係一枚一枚地藉由搬入側輸送機33搬入至曝光裝置，到達搬入側輸送機33上的待命位置。之後，在搬入側輸送機33上的待命位置被預對準。預對準係藉由預對準銷機構將基板W的位置大致對準的動作。預對準的精度，係例如100～數100μm程度。該基板W，係藉由第7圖(1)所示之搬入臂31拾取，並如第7圖(2)所示般被載置於載台1。基板W，係藉由真空吸附機構12被真空吸附於載台1。 Next, an exposure method using such an exposure apparatus will be schematically described using FIGS. 7 and 8 . Fig. 7 and Fig. 8 are schematic front views showing the operation of the exposure apparatus in the exposure method of the embodiment. In the following description, a contact exposure device is taken as an example. A batch of substrates W is carried in one by one to the exposure device by the carrying-in conveyor 33 , and arrives at the standby position on the carrying-in conveyor 33 . Thereafter, the standby position on the carry-in side conveyor 33 is pre-aligned. Pre-alignment is an operation of roughly aligning the position of the substrate W by a pre-alignment pin mechanism. The precision of pre-alignment is, for example, on the order of 100 to several 100 μm. This substrate W is picked up by the carrying arm 31 shown in FIG. 7 (1), and placed on the stage 1 as shown in FIG. 7 (2). The substrate W is vacuum-adsorbed on the stage 1 by the vacuum-adsorption mechanism 12 .

接著，搬入臂31，一旦上升至搬運高度之後，係水平移動至清潔滾輪4的X座標成為+SL ₁/2或是+SL ₂/2的位置。在該位置，伸縮機構42進行動作，臂部41延伸而使清潔滾輪4下降。清潔滾輪4的下降，係藉由未圖示的擋止件停止，而位於設定滾輪高度Hr的位置。在該狀態，載台驅動機構11動作，而將載台1抬起至載台高度Hp。因此，如第7圖(3)所示，成為清潔滾輪4抵接於基板W的狀態。清潔滾輪4的抵接位置的X座標，係藉由來自輸入部64的輸入所設定的+SL ₁/2或是+SL ₂/2。並且，搬入臂31係朝向X方向-側水平移動，如第7圖(4)所示，停止在清潔滾輪4的X座標成為-SL ₁/2或是-SL ₂/2的位置。在該動作之際，清潔滾輪4藉由與基板W的摩擦力從動旋轉，使基板W被清潔。 Next, the carrying arm 31 moves horizontally to the position where the X coordinate of the cleaning roller 4 becomes +SL ₁ /2 or +SL ₂ /2 once it rises to the transport height. In this position, the telescopic mechanism 42 operates, and the arm part 41 extends to lower the cleaning roller 4 . The descent of the cleaning roller 4 is stopped by a stopper (not shown), and it is located at the position where the roller height Hr is set. In this state, the stage drive mechanism 11 operates to raise the stage 1 to the stage height Hp. Therefore, as shown in FIG. 7 ( 3 ), the cleaning roller 4 is in contact with the substrate W. As shown in FIG. The X coordinate of the contact position of the cleaning roller 4 is +SL ₁ /2 or +SL ₂ /2 set by the input from the input unit 64 . And, the carrying-in arm 31 moves horizontally toward the X direction-side, and stops at a position where the X coordinate of the cleaning roller 4 becomes -SL ₁ /2 or -SL ₂ /2 as shown in FIG. 7 (4). During this operation, the cleaning roller 4 is driven to rotate by the friction force with the substrate W, and the substrate W is cleaned.

接著，在清潔滾輪4位於-SL ₁/2或是-SL ₂/2的位置之際，伸縮機構42進行動作，使清潔滾輪4上升。並且，搬入臂31，係朝向水平方向移動而回到搬入側的待命位置。接著，搬入臂31的待命位置，係清潔滾輪4位於轉移附著滾輪5的上方的位置，轉移附著滾輪升降機構51使轉移附著滾輪5上升，抵接於清潔滾輪4。在該狀態，未圖示之轉移附著滾輪旋轉機構使轉移附著滾輪5旋轉，而清潔滾輪4上的異物轉移附著至轉移附著滾輪5。又，在經過充分足以使清潔滾輪4的垃圾轉移至轉移附著滾輪5的時間之後，於搬入臂31，伸縮機構42係使臂部41回到當初的收縮狀態。 Next, when the cleaning roller 4 is at the position of -SL ₁ /2 or -SL ₂ /2, the telescopic mechanism 42 operates to raise the cleaning roller 4 . Then, the carry-in arm 31 moves in the horizontal direction and returns to the standby position on the carry-in side. Then, the standby position of the loading arm 31 is the position where the cleaning roller 4 is located above the transfer attachment roller 5 , and the transfer attachment roller elevating mechanism 51 lifts the transfer attachment roller 5 to abut against the cleaning roller 4 . In this state, the transfer adhesion roller 5 is rotated by an unillustrated transfer adhesion roller rotation mechanism, and the foreign matter on the cleaning roller 4 is transferred and adhered to the transfer adhesion roller 5 . Also, after a time sufficient to transfer the rubbish from the cleaning roller 4 to the transfer attachment roller 5, the telescopic mechanism 42 returns the arm 41 to the original retracted state in the arm 31.

另一方面，於載台1上，進行基板W的正式對準，使遮罩與基板W以正確的位置關係疊合。在該狀態，如第8圖(2)所示，照射來自光照射單元2的光，通過遮罩使基板W曝光。又，使清潔滾輪4上的異物轉移附著至轉移附著滾輪5的動作，亦有與曝光並行的情形。On the other hand, the main alignment of the substrate W is performed on the stage 1 so that the mask and the substrate W are superimposed in a correct positional relationship. In this state, as shown in FIG. 8 (2), the light from the light irradiation unit 2 is irradiated, and the substrate W is exposed through the mask. In addition, the operation of transferring and adhering the foreign matter on the cleaning roller 4 to the transfer and adhering roller 5 may be performed in parallel with the exposure.

當曝光結束，係如第8圖(3)所示，搬出臂32從載台1拾取基板W。並且，如第8圖(4)所示，搬出至搬出側輸送機34。搬出側輸送機34，係將基板W搬出至未圖示的載架等。另一方面，下個基板W被搬運至搬入側輸送機33上的待命位置，搬入臂31，係拾取該基板W並搬入。並且，重複同樣的步驟。重複如此之動作，依序對於各基板W進行曝光處理。When the exposure is finished, as shown in FIG. 8 ( 3 ), the carrying-out arm 32 picks up the substrate W from the stage 1 . And, as shown in FIG. 8 ( 4 ), it is carried out to the carry-out side conveyor 34 . The unloading side conveyor 34 unloads the substrate W onto a carrier (not shown) or the like. On the other hand, the next substrate W is conveyed to the standby position on the conveyer 33 on the carrying side, and the carrying arm 31 picks up the substrate W and carries it in. And, repeat the same steps. Such an operation is repeated, and exposure processing is sequentially performed on each substrate W.

當載台清潔週期的次數(片數)的曝光結束，藉由程式62的動作，進行載台1的清潔。搬入臂31，係不保持基板W而進入載台1上。並且，搬入臂31，停止在清潔滾輪4的X座標成為+PL/2的位置之位置之後，清潔滾輪4下降至成為設定滾輪高度的位置。接著，搬入臂31朝向X方向-側水平移動，停止在清潔滾輪4成為-PL/2的位置之位置之後，清潔滾輪4上升至原本的位置。之後，搬入臂31，係回到搬入側的待命位置。When the exposure for the number of times (the number of sheets) of the stage cleaning cycle ends, the stage 1 is cleaned by the operation of the program 62 . The carry-in arm 31 enters onto the stage 1 without holding the substrate W. Then, after the carry-in arm 31 stops at the position where the X coordinate of the cleaning roller 4 becomes +PL/2, the cleaning roller 4 descends to a position at which the roller height is set. Next, the carry-in arm 31 moves horizontally toward the - side in the X direction, stops at the position where the cleaning roller 4 becomes the position of -PL/2, and then the cleaning roller 4 rises to the original position. Thereafter, the loading arm 31 is tied back to the standby position on the loading side.

又，於前述動作中，搬入臂31的移動速度，在清潔滾輪4接觸於基板W之際以外會是較快的速度。針對該點，參照第9圖進行說明。第9圖，係表示搬入臂31的移動速度的示意圖。第9圖，係表示搬入臂31將基板W載置於載台1之後，回到搬入側的待命位置之際的移動速度。第9圖的橫軸係表示X方向(搬運方向)的位置，縱軸係表示移動速度。 In addition, in the above-mentioned operation, the moving speed of the carrying-in arm 31 is relatively fast except when the cleaning roller 4 is in contact with the substrate W. As shown in FIG. This point will be described with reference to FIG. 9 . FIG. 9 is a schematic diagram showing the moving speed of the carry-in arm 31 . FIG. 9 shows the moving speed when the carry-in arm 31 returns to the standby position on the carry-in side after placing the substrate W on the stage 1 . The horizontal axis in FIG. 9 represents the position in the X direction (conveying direction), and the vertical axis represents the moving speed.

於第9圖中，搬入臂31將基板W載置於載台1，清潔滾輪4的X座標到達清潔起始點Ps為止的水平移動之際的速度以V ₁表示，清潔滾輪4從清潔起始點Ps到達清潔結束點Pe為止的搬入臂31的移動速度以V ₂表示。接著，在清潔結束點Pe使清潔滾輪4上升至原本的高度之後，搬入臂31在以使清潔滾輪4位於轉移附著滾輪5的上方的方式進行移動之際的移動速度係與V ₁為相同程度。如第9圖所示，V ₁比V ₂更高，清潔時之外係使搬運臂高速移動，使產距時間變得短。如此之搬入臂31的速度控制，亦寫入至程式62，藉由從執行程式62的控制器6傳送至搬運系3的控制訊號實現。 In FIG. 9, the carrying-in arm 31 places the substrate W on the stage 1, and the speed at which the cleaning roller 4 moves horizontally until the X coordinate of the cleaning roller 4 reaches the cleaning start point Ps is represented by V1. _The cleaning roller 4 starts from cleaning. The moving speed of the carry _- in arm 31 until the starting point Ps reaches the cleaning end point Pe is represented by V2. Next, after the cleaning roller 4 is raised to the original height at the cleaning end point Pe, the moving speed of the carry-in arm 31 when moving so that the cleaning roller 4 is positioned above the transfer adhesion roller ₅ is about the same as V1. . As shown in Figure 9, V ₁ is higher than V ₂ , and the external system moves the transfer arm at high speed during cleaning, shortening the production time. Such speed control of the loading arm 31 is also written into the program 62 and realized by the control signal transmitted from the controller 6 executing the program 62 to the conveying system 3 .

接著，針對清潔滾輪的高度控制，係參照第10圖進行更詳細的說明。第10圖，係表示清潔滾輪的高度控制的正面示意圖。於前述實施形態中，對於清潔滾輪4抵接於基板W的高度，控制為一固定值(常數)亦可，控制為變數亦可。例如，藉由該曝光裝置曝光的基板W在所有批次皆厚度較薄，可在進行載台1的清潔之際的高度進行基板W的清潔的情形，有時將清潔滾輪4的高度設為常數。例如在基板W的厚度為0.1mm以下的情形，能夠為如此。 Next, the height control of the cleaning roller will be described in more detail with reference to FIG. 10 . Fig. 10 is a schematic front view showing the height control of the cleaning roller. In the aforementioned embodiments, the height at which the cleaning roller 4 abuts against the substrate W may be controlled to a fixed value (constant) or may be controlled to be variable. For example, when the substrate W exposed by this exposure apparatus is thin in all batches and the substrate W can be cleaned at the height when the stage 1 is cleaned, the height of the cleaning roller 4 may be set to constant. This can be done, for example, when the thickness of the substrate W is 0.1 mm or less.

作為控制為常數的情形之簡便的構成，可舉出如第10圖(1)所示般設置清潔滾輪4下降之際會抵接的擋止件43，使擋止件43的位置藉由與設定滾輪高度Hr的關係成為預定的固定之位置。前述之實施形態的係該構成。另一方面，亦有對應於基板W的厚度t而變更清潔滾輪4的高度進行控制的情形，此係在基板W較薄的情形亦可能發生。作為該構成之例，可舉出例如於清潔滾輪4設置在臂部41包含伺服馬達的位置調節機構之例。此時，對應於基板W的厚度t，賦予不同的值(變數)作為設定滾輪高度Hr，藉由控制器6進行控制使清潔滾輪4成為設定滾輪高度Hr。雖可為前述構成，然而若使用載台驅動機構11的伺服系，則能夠藉由簡便的構成進行相同動作。藉由載台驅動機構11控制載台1，並控制載台1的抬起量而藉此對應於各種基板厚度。此時，從輸入部64輸入對應於基板厚度的載台高度Hp，並作為變數賦予程式62。 As a simple structure for controlling the situation of being constant, as shown in Fig. 10 (1), the stopper 43 that can be abutted when the cleaning roller 4 is lowered can be enumerated, so that the position of the stopper 43 can be adjusted according to the setting The relationship of the roller height Hr becomes a predetermined fixed position. The above-mentioned embodiment is the structure. On the other hand, there is a case where the height of the cleaning roller 4 is changed and controlled according to the thickness t of the substrate W, and this may also occur when the substrate W is thin. As an example of this configuration, for example, an example in which a position adjustment mechanism including a servo motor is provided on the arm portion 41 is provided on the cleaning roller 4 . At this time, different values (variables) are given as the set roller height Hr corresponding to the thickness t of the substrate W, and the controller 6 controls the cleaning roller 4 to the set roller height Hr. Although the aforementioned configuration is possible, if the servo system of the stage drive mechanism 11 is used, the same operation can be performed with a simple configuration. The stage 1 is controlled by the stage driving mechanism 11, and the lifting amount of the stage 1 is controlled to correspond to various substrate thicknesses. At this time, the stage height Hp corresponding to the thickness of the substrate is input from the input unit 64 and given to the program 62 as a variable.

就如此之清潔滾輪4的高度控制而言，確認清潔滾輪4使否確實抵接於基板W為佳。設置有用於此之感應器的構成係示於第10圖(2)。為了檢測清潔滾輪4是否確實抵接於基板W，檢測清潔滾輪4的臂部41的位置較為簡便。亦即，如第10圖(2)所示，於臂部41的適當的高度位置設置被檢測部44，並設置檢測被檢測部44的感應器(接近感應器，光感應器等)45。在清潔滾輪4以適度的壓力抵接於基板W的位置關係，配置被檢測部44及感應器45。For such height control of the cleaning roller 4 , it is preferable to confirm whether the cleaning roller 4 is in contact with the substrate W or not. The structure provided with the sensor used for this is shown in Fig. 10 (2). In order to detect whether the cleaning roller 4 is in contact with the substrate W, it is relatively simple to detect the position of the arm portion 41 of the cleaning roller 4 . That is, as shown in FIG. 10 (2), the detected portion 44 is provided at an appropriate height position of the arm portion 41, and a sensor (proximity sensor, light sensor, etc.) 45 for detecting the detected portion 44 is provided. The detected portion 44 and the sensor 45 are disposed in a positional relationship where the cleaning roller 4 abuts against the substrate W with moderate pressure.

感應器45所致之清潔滾輪4的抵接確認，在將抵接高度的控制作為變數控制的情形特別有意義，然而在為常數的情形亦有意義。在常數的情形，即便誤將比預定更薄的基板W送入裝置的情形，有可能產生清潔滾輪4未抵接於基板W的狀態。又，在僅確認是否抵接的情形，亦可檢測採用驅動清潔滾輪4的臂部41的流體壓缸之流體的壓力變化(伴隨著抬起之流體的壓力上升)的構成。The abutment confirmation of the cleaning roller 4 by the sensor 45 is particularly meaningful when the control of the abutment height is controlled as a variable, but it is also meaningful when it is a constant. In the constant case, even if a substrate W thinner than expected is sent into the apparatus by mistake, a state where the cleaning roller 4 does not come into contact with the substrate W may occur. In addition, in the case of only confirming whether or not the abutment is performed, it is also possible to detect a change in fluid pressure of the fluid pressure cylinder driving the arm portion 41 of the cleaning roller 4 (increase in pressure of the fluid accompanied by lifting).

無論為何，依據實施形態之曝光方法，對應於基板W的清潔或是載台1的清潔，選擇清潔起始點Ps，且就基板W的清潔而言，因能夠對應於基板W的種類設定任意的清潔起始點Ps而進行清潔，故能夠對應於基板W的種類進行最適當的清潔。此時，因能夠設定與基板W的尺寸不同的餘裕，故藉由將比基板W的邊緣稍微更內側的位置設定作為清潔起始點，能夠防止清潔時之基板W的位移，或能夠防止為附乾膜基板的情形之清潔滾輪4所導致之乾膜捲入之情事。另外，在清潔滾輪4接觸於基板W之間搬入臂31的速度會減慢，且在此之外速度會變快，故能夠一邊進行導入基板W的清潔動作，一邊防止整體的產距時間長期化。 In any case, according to the exposure method of the embodiment, the cleaning start point Ps is selected corresponding to the cleaning of the substrate W or the cleaning of the stage 1, and since the cleaning of the substrate W can be set arbitrarily according to the type of the substrate W, Cleaning is performed at the cleaning start point Ps, so that cleaning can be performed optimally according to the type of substrate W. At this time, since a margin different from the size of the substrate W can be set, by setting a position slightly inside the edge of the substrate W as the starting point for cleaning, displacement of the substrate W during cleaning can be prevented, or In the case of dry film substrates, the dry film is involved by the cleaning roller 4. In addition, since the speed of the carrying-in arm 31 is slowed down while the cleaning roller 4 is in contact with the substrate W, and otherwise the speed is increased, it is possible to prevent the overall lead time from being prolonged while carrying out the cleaning operation for introducing the substrate W. change.

又，亦能夠將清潔滾輪安裝於搬出臂32而進行清潔。在此情形，在搬入臂31搬入基板W載置於載台1並後退之後，換搬出臂32進入而使清潔滾輪接觸於基板W。在此情形，清潔滾輪的位置係搬出臂32之X方向的-側的端部，搬出臂32一邊從X方向-側朝向+側水平移動一邊進行清潔。然而，若於搬出臂32安裝清潔滾輪進行清潔，搬出臂32會進行不同於基板W的搬出動作之往復動作，故與搬入臂31之情形相比，產距時間會變長。因此，亦能夠將清潔滾輪安裝於搬入臂31而進行清潔為佳。 Moreover, it is also possible to attach a cleaning roller to the carry-out arm 32 and perform cleaning. In this case, after the carrying-in arm 31 carries in the substrate W and places it on the stage 1 and moves back, the carrying-out arm 32 enters to bring the cleaning roller into contact with the substrate W. FIG. In this case, the position of the cleaning roller is the end of the delivery arm 32 on the - side in the X direction, and the delivery arm 32 cleans while moving horizontally from the - side to the + side in the X direction. However, if cleaning rollers are installed on the carry-out arm 32 for cleaning, the carry-out arm 32 will perform a reciprocating motion different from the carry-out motion of the substrate W, so compared with the case of the carry-in arm 31 , the lead time will be longer. Therefore, it is preferable that cleaning rollers can also be attached to the carry-in arm 31 and cleaned.

於前述實施形態的曝光方法之說明中，雖以接觸曝光為例，就接近曝光或投影曝光、DI曝光等其他方式之曝光而言，僅光照射單元2之構成、動作不同，其他部分能夠同樣地實施。另外，就基板而言，除了印刷基板，對於液晶基板及其他各種基板，本案發明亦能夠實施。In the description of the exposure method of the foregoing embodiment, although contact exposure was taken as an example, for exposure of other methods such as proximity exposure, projection exposure, and DI exposure, only the structure and operation of the light irradiation unit 2 are different, and other parts can be the same. implemented. In addition, the present invention can also be implemented on liquid crystal substrates and other various substrates in addition to printed circuit boards.

1:載台 11:載台驅動機構 12:真空吸附機構 2:光照射單元 3:搬運系 31:搬入臂 32:搬出臂 33:搬入側輸送機 34:搬出側輸送機 310,320:驅動機構 311,321:吸附墊 4:清潔滾輪 41:臂部 42:伸縮機構 5:轉移附著滾輪 51:轉移附著滾輪升降機構 6:控制器 61:記憶部 62:程式 63:輸出部 64:輸入部 Hr:設定滾輪高度 Hp:載台高度 Ps:清潔起始點 Pe:清潔結束點 W:基板 1: carrier 11: Stage drive mechanism 12: Vacuum adsorption mechanism 2: Light irradiation unit 3: Handling department 31: loading arm 32: Moving out the arm 33: Import side conveyor 34: Outgoing side conveyor 310,320: drive mechanism 311,321: Adsorbent pads 4: Clean the rollers 41: arm 42: telescopic mechanism 5: Transfer Attachment Roller 51: Transfer attachment roller lifting mechanism 6: Controller 61: memory department 62: program 63: output part 64: input part Hr: set the height of the scroll wheel Hp: stage height Ps: clean starting point Pe: cleaning end point W: Substrate

[第1圖]係實施形態之曝光方法所使用之曝光裝置的正面示意圖。 [第2圖]係表示程式的概略的流程圖。 [第3圖]係表示清潔滾輪的控制資訊的正面示意圖。 [第4圖]係表示清潔滾輪的控制資訊的平面示意圖。 [第5圖]係表示避開餘裕區域進行清潔的意義的正面示意圖。 [第6圖]係表示避開餘裕區域進行清潔的意義的正面示意圖。 [第7圖]係表示實施形態之曝光方法之曝光裝置的動作的正面示意圖。 [第8圖]係表示實施形態之曝光方法之曝光裝置的動作的正面示意圖。 [第9圖]係表示搬入臂的速度的示意圖。 [第10圖]係表示清潔滾輪的高度控制的正面示意圖。 [FIG. 1] is a schematic front view of an exposure device used in the exposure method of the embodiment. [FIG. 2] is a flowchart showing the outline of the program. [Fig. 3] is a schematic front view showing the control information of the cleaning roller. [Fig. 4] is a schematic plan view showing the control information of the cleaning roller. [Fig. 5] is a schematic front view showing the significance of cleaning while avoiding spare areas. [Fig. 6] is a schematic front view showing the significance of cleaning while avoiding spare areas. [FIG. 7] is a schematic front view showing the operation of the exposure apparatus in the exposure method of the embodiment. [FIG. 8] is a schematic front view showing the operation of the exposure apparatus in the exposure method of the embodiment. [Fig. 9] is a schematic diagram showing the speed of the carry-in arm. [Fig. 10] is a schematic front view showing the height control of the cleaning roller.

1:載台 1: carrier

2:光照射單元 2: Light irradiation unit

3:搬運系 3: Handling department

4:清潔滾輪 4: Clean the rollers

5:轉移附著滾輪 5: Transfer Attachment Roller

6:控制器 6: Controller

11:載台驅動機構 11: Stage drive mechanism

12:真空吸附機構 12: Vacuum adsorption mechanism

31:搬入臂 31: loading arm

32:搬出臂 32: Moving out the arm

33:搬入側輸送機 33: Import side conveyor

34:搬出側輸送機 34: Outgoing side conveyor

41:臂部 41: arm

42:伸縮機構 42: telescopic mechanism

51:轉移附著滾輪升降機構 51: Transfer attachment roller lifting mechanism

61:記憶部 61: memory department

62:程式 62: program

63:輸出部 63: output part

64:輸入部 64: input part

310,320:驅動機構 310,320: drive mechanism

311,321:吸附墊 311,321: Adsorbent pads

W:基板 W: Substrate

Claims

一種曝光方法，係使用曝光裝置，藉由光照射單元對對載置於載台之基板照射預定圖型的光而使基板曝光；該曝光裝置係具備：前述載台；對於前述載台將前述基板搬入，並且在曝光後將前述基板從前述載台搬出的搬運系；對載置於前述載台的前述基板照射預定圖型的光的前述光照射單元；以及進行預對準的機構，係在將該基板載置於前述載台之前，將前述基板的位置大致對準；該方法之特徵為：前述搬運系，係包含在搬運之際保持前述基板的搬運臂，於前述搬運臂，係安裝有藉由黏著力將異物吸附而去除的清潔滾輪，前述清潔滾輪，係比所預想最大的前述基板的寬度更長，且比前述載台的寬度更長，並且，該方法係進行基板清潔之方法，在前述搬運臂為搬入或搬出前述基板而於待命位置與前述載台之間進行一次來回的移動之際，使前述清潔滾輪一邊接觸於前述基板一邊移動而藉此清潔前述基板，於前述基板清潔時之前述清潔滾輪之移動，係從載置於前述載台之前述基板之邊緣起至內側的位置起始，該內側的位置，就前述進行預對準的機構之預對準的精度而言，係比前述基板的邊緣更靠內側的位置，在進行預定次數的曝光之後，進行載台清潔，該載台清潔，係使前述清潔滾輪一邊接觸於未載置有前述基板之狀態下之前述載台一邊移動，藉此清潔前述載台。 An exposure method is to use an exposure device to expose a substrate by irradiating light of a predetermined pattern to a substrate mounted on a stage by a light irradiation unit; the exposure device is provided with: the aforementioned stage; A conveying system for carrying in a substrate and carrying out the substrate from the stage after exposure; the light irradiation unit for irradiating light of a predetermined pattern to the substrate placed on the stage; and a mechanism for performing pre-alignment, Before placing the substrate on the aforementioned stage, the position of the aforementioned substrate is roughly aligned; the method is characterized by: The aforementioned transfer system includes a transfer arm that holds the aforementioned substrate during transfer, The aforementioned transport arm is equipped with a cleaning roller that absorbs and removes foreign matter by adhesive force, The aforementioned cleaning roller is longer than the expected maximum width of the aforementioned substrate, and is longer than the width of the aforementioned stage, In addition, this method is a method of cleaning the substrate, and when the transfer arm performs a back and forth movement between the stand-by position and the stage for loading or unloading the substrate, the cleaning roller is moved while contacting the substrate. And thereby cleaning the aforementioned substrate, The movement of the cleaning rollers during the cleaning of the substrate starts from the edge of the substrate placed on the stage to the inner position, and the inner position corresponds to the pre-alignment of the pre-alignment mechanism. In terms of accuracy, the position is closer to the inner side than the edge of the aforementioned substrate, After a predetermined number of exposures, stage cleaning is performed by moving the cleaning rollers while contacting the stage in a state where the substrate is not placed, thereby cleaning the stage.

如請求項1所述之曝光方法，其中，於前述載台清潔之移動之起始點，係移動方向之前述載台一方側的邊緣之位置，結束點係另一方側的邊緣。 The exposure method as described in Claim 1, wherein, The starting point of the movement of the aforementioned stage cleaning is the position of the edge of one side of the aforementioned stage in the moving direction, and the end point is the edge of the other side.