TW202234793A

TW202234793A - Integrated cooling module and electronic device including the same

Info

Publication number: TW202234793A
Application number: TW110130308A
Authority: TW
Inventors: 洪銀樹; 尹佐國; 李明聰
Original assignee: 建準電機工業股份有限公司
Priority date: 2021-02-17
Filing date: 2021-08-17
Publication date: 2022-09-01
Also published as: TWI795873B; CN114945259A; CN214592558U

Abstract

An integrated cooling module is provided to solve the problem of large amounts of components in the prior liquid cooling module, and the working fluid needs a pump to drive. The integrated cooling module includes a tank has an upper chamber and a lower chamber. The upper chamber and the lower chamber are located inside the tank and communicated. There is a guiding portion inside the upper chamber, with the guiding portion connects to the lower chamber. A heat spreader is connected to the tank and aligned to the upper chamber. A heat conductor is connected to the tank and aligned to the lower chamber. A phase-changing liquid in the tank can converted from liquid state to gas state to absorb heat energy of the heat conductor. Then the phase-changing liquid will convert from gas state to liquid state by transfer heat energy to the heat spreader and flows back to the lower chamber along the guiding portion. An electronic device having the integrated cooling module is also disclosed.

Description

整合式冷卻模組及具有該整合式冷卻模組的電子裝置Integrated cooling module and electronic device having the same

本發明係關於一種冷卻模組及電子裝置，尤其是一種可幫助電子裝置維持適當工作溫度的整合式冷卻模組及具有該整合式冷卻模組的電子裝置。The present invention relates to a cooling module and an electronic device, in particular to an integrated cooling module which can help the electronic device to maintain a proper working temperature and an electronic device having the integrated cooling module.

按，隨著電子科技及網路技術的迅速發展，許多電子裝置都因高運算功能而需搭配更強大的散熱系統。常見用於電子裝置的散熱系統可概分為氣冷或液冷等二種運作方式，其中液冷的運作方式又因散熱效率較佳而成為近年來散熱系統的發展主力。Press, with the rapid development of electronic technology and network technology, many electronic devices need to be equipped with more powerful cooling systems due to their high computing functions. Commonly used heat dissipation systems for electronic devices can be roughly divided into two operating modes: air cooling or liquid cooling. Among them, the liquid cooling mode has become the main force in the development of heat dissipation systems in recent years due to its better heat dissipation efficiency.

請參照第1圖，其係一種習知的液冷式冷卻模組9，該習知的液冷式冷卻模組9具有一水冷頭91、一水冷排92、一泵浦（圖未示）及數個管件93。該水冷頭91設於電子裝置的熱源G處，並由該數個管件93連通該水冷頭91、該泵浦及該水冷排92；其中，該數個管件93之間還可藉由至少一轉向接座94來對位連接。據此結構，該泵浦可驅動工作液在該數個管件93中流動，且通過該水冷頭91而吸熱升溫的工作液，可在通過該水冷排92時冷卻降溫，並使該工作液再次被導向該水冷頭91；如此不斷循環，使該熱源G處能維持在適當的工作溫度，避免該電子裝置發生過熱的問題。Please refer to FIG. 1, which is a conventional liquid-cooled cooling module 9. The conventional liquid-cooled cooling module 9 has a water-cooling head 91, a water-cooling row 92, and a pump (not shown). and several pipe fittings 93. The water-cooled head 91 is located at the heat source G of the electronic device, and is connected to the water-cooled head 91 , the pump and the water-cooled row 92 through the plurality of pipes 93 ; wherein, the plurality of pipes 93 can also be connected by at least one Turn to socket 94 for alignment connection. According to this structure, the pump can drive the working fluid to flow in the plurality of pipe parts 93 , and the working fluid that passes through the water-cooled head 91 to absorb heat and heat up can be cooled and cooled when passing through the water-cooled row 92 , and the working fluid can be regenerated again. It is guided to the water-cooling head 91; in this way, it is continuously circulated, so that the heat source G can be maintained at a proper working temperature, so as to avoid the problem of overheating of the electronic device.

然而，該習知液冷式冷卻模組9的構件較為繁多，加上各構件之間所串接的管件93，造成整體液冷式散熱系統9的體積龐大，需佔用掉非常多的安裝空間，對電子裝置的輕薄化發展造成極大的困擾。再且，該習知液冷式冷卻模組9使用到大量的管件93，只要有任一管件93未與對應的構件密合組裝，就會導致內部工作液滲漏的情況，故需要謹慎組裝，相對較為費工耗時，且使用到的管件93數量越多，發生滲漏的可能性就越高；此外，使用一段時間後，該管件93還會有工作液蒸散及管件老化裂損等問題，以致使用壽命較短或較常需要檢修與維護。However, the conventional liquid-cooled cooling module 9 has many components, and the pipe fittings 93 connected in series between the components make the overall liquid-cooled heat dissipation system 9 bulky and take up a lot of installation space. , causing great trouble to the thinning development of electronic devices. Furthermore, the conventional liquid-cooled cooling module 9 uses a large number of pipe fittings 93. As long as any pipe fitting 93 is not tightly assembled with the corresponding component, it will lead to the leakage of the internal working fluid, so careful assembly is required. , it is relatively time-consuming and labor-intensive, and the more the number of pipe fittings 93 used, the higher the possibility of leakage; in addition, after a period of use, the pipe fitting 93 will have working fluid evaporation and pipe fitting aging cracks, etc. problems, resulting in a shorter service life or more frequent need for inspection and maintenance.

有鑑於此，習知的液冷式冷卻模組確實仍有加以改善之必要。In view of this, the conventional liquid-cooled cooling module still needs to be improved.

為解決上述問題，本發明的目的是提供一種整合式冷卻模組，可減少構件數量，且不需使用管件來連接構件，能有效減縮整體所需佔用的空間，並確保其中的相變化液幾乎不會有滲漏或蒸散而逐漸減量的問題。In order to solve the above problems, the purpose of the present invention is to provide an integrated cooling module, which can reduce the number of components, and does not need to use pipe fittings to connect components, can effectively reduce the space occupied by the whole, and ensure that the phase change liquid in it is almost There will be no leakage or evapotranspiration to taper off.

本發明的次一目的是提供一種整合式冷卻模組，不需使用到泵浦，相變化液即可主動在熱區與冷區之間不斷循環。Another object of the present invention is to provide an integrated cooling module, in which the phase change fluid can actively circulate continuously between the hot zone and the cold zone without using a pump.

本發明的又一目的是提供一種整合式冷卻模組，其相變化液可利用氣液相變化以提升對熱源的散熱效率。Another object of the present invention is to provide an integrated cooling module, the phase change liquid of which can utilize gas-liquid phase change to improve the heat dissipation efficiency of the heat source.

本發明的再一目的是提供一種整合式冷卻模組，可預先完成組裝，以便後續能快速地組裝至電子裝置之預定位置。Another object of the present invention is to provide an integrated cooling module that can be assembled in advance so that it can be quickly assembled to a predetermined position of an electronic device.

本發明的另一目的是提供一種電子裝置，具有上述之整合式冷卻模組。Another object of the present invention is to provide an electronic device having the above-mentioned integrated cooling module.

本發明全文所述方向性或其近似用語，例如「前」、「後」、「左」、「右」、「上（頂）」、「下（底）」、「內」、「外」、「側面」等，主要係參考附加圖式的方向，各方向性或其近似用語僅用以輔助說明及理解本發明的各實施例，非用以限制本發明。其中，本發明全文所述「軸向」係指泵浦的葉輪之旋轉軸線的延伸方向。The directional or similar terms used throughout this disclosure, such as "front", "back", "left", "right", "top (top)", "bottom (bottom)", "inside", "outside" , "side surface", etc., mainly refer to the directions of the attached drawings, each directionality or its similar terms are only used to assist the description and understanding of the various embodiments of the present invention, and are not intended to limit the present invention. Wherein, the "axial direction" mentioned in the whole of the present invention refers to the extending direction of the rotation axis of the impeller of the pump.

本發明全文所記載的元件及構件使用「一」或「一個」之量詞，僅是為了方便使用且提供本發明範圍的通常意義；於本發明中應被解讀為包括一個或至少一個，且單一的概念也包括複數的情況，除非其明顯意指其他意思。The use of the quantifier "a" or "an" for the elements and components described throughout the present invention is only for convenience and provides a general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

本發明全文所述「結合」、「組合」或「組裝」等近似用語，主要包含連接後仍可不破壞構件地分離，或是連接後使構件不可分離等型態，係本領域中具有通常知識者可以依據欲相連之構件材質或組裝需求予以選擇者。Similar terms such as "combined", "combined" or "assembled" mentioned in the whole text of the present invention mainly include the components that can be separated without destroying the components after the connection, or the components can not be separated after being connected, which are common knowledge in the field. It can be selected according to the material of the components to be connected or the assembly requirements.

本發明的整合式冷卻模組，包含：一槽體，該槽體內具有相連通的一上腔室及一下腔室，該上腔室內具有一引流部，該引流部銜接該下腔室；一散熱器，結合該槽體並對位於該上腔室；一導熱器，結合該槽體並對位於該下腔室；及一相變化液，填充於該槽體內，液態的相變化液吸收該導熱器的熱能以轉變成氣態，氣態的相變化液將熱能傳遞給該散熱器以冷凝回液態，並沿著該引流部流回該下腔室。The integrated cooling module of the present invention includes: a tank body, the tank body has an upper chamber and a lower chamber that are communicated with each other, the upper chamber has a drainage portion, and the drainage portion is connected to the lower chamber; a a heat sink, combined with the tank body and located in the upper chamber; a heat conductor, combined with the tank body and located in the lower chamber; and a phase change liquid filled in the tank body, and the liquid phase change liquid absorbs the The heat energy of the heat conductor is converted into a gaseous state, and the gaseous phase change liquid transfers the heat energy to the radiator to condense back to a liquid state, and flows back to the lower chamber along the drainage portion.

本發明的電子裝置，包含：一機殼；一電氣模組，位於該機殼內並具有一熱源；及前述的一整合式冷卻模組，設於該機殼內，並由該導熱器熱連接該熱源。The electronic device of the present invention includes: a casing; an electrical module located in the casing and having a heat source; and the aforementioned integrated cooling module, disposed in the casing and heated by the heat conductor Connect the heat source.

據此，本發明的整合式冷卻模組，可藉由在槽體內形成一引流部以銜接相連通的上腔室與下腔室，使吸收熱源處熱能而轉變成氣態的相變化液能向上流入該上腔室，與散熱器熱交換以冷凝回液態，並沿著該引流部流回該下腔室。如此，該整合式冷卻模組不需使用到管件、泵浦及轉向接座等構件，即可藉由該相變化液不斷地在該上腔室與該下腔室中形成主動式的循環流動，不僅構件成本得以下降，運作時也不需額外耗費電力來驅動相變化液流動，還可藉由該相變化液的氣液相變化以高效帶離熱源處的熱能。同時，該整合式冷卻模組的構件數量少，且不需使用管件來連接構件，能有效減縮整體所需佔用的空間，並確保其中的相變化液幾乎不會有滲漏或蒸散而逐漸減量的問題。此外，該整合式冷卻模組還能預先完成組裝，以便後續能快速地組裝至電子裝置之預定位置。因此，本發明的整合式冷卻模組具有減縮體積、節能、提升散熱及組裝效率等功效；具有該整合式冷卻模組的電子裝置則同樣具有前述功效所帶來的有益效果。Accordingly, in the integrated cooling module of the present invention, by forming a drainage portion in the tank to connect the connected upper chamber and the lower chamber, the phase change liquid that absorbs the heat energy at the heat source and is converted into a gaseous state can move upward. It flows into the upper chamber, exchanges heat with the radiator to condense back to a liquid state, and flows back to the lower chamber along the drain. In this way, the integrated cooling module can continuously form an active circulating flow in the upper chamber and the lower chamber by the phase change liquid without using components such as pipes, pumps and steering sockets. , not only the cost of components is reduced, but additional power is not required to drive the flow of the phase change liquid during operation, and the heat energy at the heat source can be efficiently taken away by the gas-liquid phase change of the phase change liquid. At the same time, the integrated cooling module has a small number of components, and does not need to use pipe fittings to connect the components, which can effectively reduce the space occupied by the whole, and ensure that the phase change liquid therein will hardly leak or evaporate and gradually reduce The problem. In addition, the integrated cooling module can be pre-assembled so that it can be quickly assembled to a predetermined position of the electronic device. Therefore, the integrated cooling module of the present invention has the functions of reducing volume, saving energy, improving heat dissipation and assembly efficiency, etc. The electronic device having the integrated cooling module also has the beneficial effects brought by the aforementioned functions.

其中，該上腔室的最大寬度可以大於該下腔室的最大寬度。如此，該槽體可概呈上寬下窄的型態，以節省該相變化液的用量，並擴大該散熱器的散熱面積，具有提升降低成本及提升散熱效率等功效。Wherein, the maximum width of the upper chamber may be greater than the maximum width of the lower chamber. In this way, the groove body can be generally wide at the top and narrow at the bottom, so as to save the amount of the phase change liquid and expand the heat dissipation area of the radiator, thereby improving the cost reduction and heat dissipation efficiency.

其中，該引流部可以為該槽體內的至少一導引斜面，該導引斜面的高處可以位於該上腔室且低處可以鄰於該下腔室。如此，該槽體的結構簡易而易於成型，具有提升製造及組裝便利性等功效。Wherein, the drainage portion may be at least one guiding inclined surface in the tank body, and the high position of the guiding inclined surface may be located in the upper chamber and the lower position may be adjacent to the lower chamber. In this way, the structure of the tank body is simple and easy to form, which has the effect of improving the convenience of manufacture and assembly.

其中，該導引斜面與水平面的夾角係可以大於0度且小於或等於45度。如此，可確保該槽體能有效避免液態的相變化液蓄積或滯留於該上腔室，且該夾角若太大，會造成該下腔室的容積變大而需要增加該相變化液的用量，故該槽體具有可節省該相變化液用量及可配合安裝環境的理想外型等功效。Wherein, the angle between the guiding inclined plane and the horizontal plane may be greater than 0 degrees and less than or equal to 45 degrees. In this way, it can be ensured that the tank body can effectively prevent the liquid phase change liquid from accumulating or staying in the upper chamber, and if the included angle is too large, the volume of the lower chamber will become larger and the amount of the phase change liquid needs to be increased, Therefore, the tank body has the functions of saving the amount of the phase change liquid and having an ideal appearance suitable for the installation environment.

其中，該槽體可以具有一第一開口對位於該上腔室，該散熱器可以具有一蓋板封閉該第一開口，該蓋板的內表面朝向該上腔室。如此，該散熱器可以由簡易的結構提供冷凝相變化液的效果，具有降低製造成本及提升組裝便利性等功效。Wherein, the tank body may have a first opening opposite to the upper chamber, the heat sink may have a cover plate to close the first opening, and the inner surface of the cover plate faces the upper chamber. In this way, the radiator can provide the effect of condensing the phase change liquid with a simple structure, and has the effects of reducing the manufacturing cost and improving the convenience of assembly.

其中，該蓋板的外表面可以連接一散熱鰭片組。如此，可以增加該散熱器與相對低溫空氣的接觸面積，具有提升該散熱器的散熱效果等功效。Wherein, the outer surface of the cover plate can be connected with a set of heat dissipation fins. In this way, the contact area between the radiator and the relatively low-temperature air can be increased, and the heat dissipation effect of the radiator can be improved.

其中，該蓋板的內表面可以具有數個輔助散熱凸部。如此，可以增加該散熱器與氣態的相變化液的接觸面積，具有提升對氣態相變化液的冷凝效率等功效。Wherein, the inner surface of the cover plate may have several auxiliary heat dissipation protrusions. In this way, the contact area between the radiator and the gaseous phase change liquid can be increased, and the condensation efficiency of the gaseous phase change liquid can be improved.

其中，該槽體可以具有一第二開口對位於該下腔室，該導熱器可以封閉該第二開口，該導熱器的內表面朝向該下腔室，該導熱器的一外表面裸露於該槽體外並可以供熱連接一熱源。如此，該導熱器可易於結合定位於該槽體的預定處，並有效地吸收熱源的熱能，具有提升組裝及使用便利性等功效。The tank body may have a second opening opposite to the lower chamber, the heat conductor may close the second opening, the inner surface of the heat conductor faces the lower chamber, and an outer surface of the heat conductor is exposed to the lower chamber. A heat source can be connected to the outside of the tank for heat supply. In this way, the heat conductor can be easily combined and positioned at a predetermined position of the groove body, and can effectively absorb the heat energy of the heat source, thereby improving the convenience of assembly and use.

其中，該散熱器與該導熱器可以呈非平行設置。如此，該整合式冷卻模組可適用於吸熱處與散熱處非平行設置的電子裝置，具有提升實用性等功效。Wherein, the radiator and the heat conductor may be arranged non-parallel. In this way, the integrated cooling module can be applied to an electronic device in which the heat sink and the heat sink are not arranged in parallel, and has the effects of improving practicality and the like.

其中，該散熱器位於該槽體的頂端且可以位於一XY平面，該導熱器位於該槽體的側端且可以位於一YZ平面。如此，該整合式冷卻模組可適用於熱源呈直立設置的電子裝置，具有提升實用性等功效。Wherein, the heat sink is located at the top end of the tank body and may be located in an XY plane, and the heat conductor is located at the side end of the tank body and may be located in a YZ plane. In this way, the integrated cooling module can be applied to an electronic device with a heat source arranged upright, and has functions such as improving practicability.

其中，該槽體可以具有一第一開口及一第二開口，該蓋板可以封閉該第一開口，該導熱器可以封閉該第二開口，該第一開口與該第二開口在X方向上可不重疊。如此，可以使該槽體形成凸出的尾部以便與熱源熱連接，並確保該槽體及該散熱器都不會與該電子裝置的其他部位產生干涉，具有提升組裝便利性等功效。Wherein, the tank body can have a first opening and a second opening, the cover plate can close the first opening, the heat conductor can close the second opening, the first opening and the second opening are in the X direction may not overlap. In this way, the groove body can be formed with a protruding tail for thermal connection with the heat source, and the groove body and the heat sink can be ensured that neither the groove body nor the heat sink interferes with other parts of the electronic device, thereby improving the convenience of assembly.

其中，該導熱器的內表面可以具有一多孔結構區，該多孔結構區至少有局部可以接觸該相變化液。如此，該多孔結構區可利用毛細現象將該相變化液往上導引，即使該相變化液的液體量不足以完全浸沒該導熱器，該導熱器仍能對液態的相變化液提供良好的汽化效率，具有減少相變化液的使用量以降低成本等功效。Wherein, the inner surface of the heat conductor may have a porous structure region, and at least part of the porous structure region can contact the phase change liquid. In this way, the porous structure region can use the capillary phenomenon to guide the phase change liquid upward, even if the liquid amount of the phase change liquid is not enough to completely submerge the heat conductor, the heat conductor can still provide a good liquid phase change liquid. Vaporization efficiency, which has the effect of reducing the amount of phase change liquid used to reduce costs.

其中，該導熱器可以具有數個加強熱交換部凸出或凹陷於該多孔結構區。如此，流體通過該數個加強熱交換部可產生渦流，進而擾動周遭氣態及液態的相變化液，並增加整體散熱面積，具有提升散熱效果等功效。Wherein, the heat conductor may have several reinforced heat exchange parts protruding or recessed in the porous structure area. In this way, the fluid can generate eddy currents through the plurality of enhanced heat exchange parts, thereby disturbing the surrounding gaseous and liquid phase change liquids, increasing the overall heat dissipation area, and improving the heat dissipation effect.

其中，該槽體形成該下腔室的部位可以具有二側壁連接一前壁，該前壁可以與該導熱器相對，該前壁與水平面的夾角係可以大於0度且小於90度。如此，傾斜的前壁可將從該上腔室流入該下腔室的液體導引流向該導熱器，及可減少相變化液的使用量，具有提升散熱效率及降低成本等功效。Wherein, the part where the groove body forms the lower chamber may have two side walls connected to a front wall, the front wall may be opposite to the heat conductor, and the angle between the front wall and the horizontal plane may be greater than 0 degrees and less than 90 degrees. In this way, the inclined front wall can guide the liquid flowing from the upper chamber into the lower chamber to flow to the heat conductor, and can reduce the usage amount of the phase change liquid, thereby improving the heat dissipation efficiency and reducing the cost.

其中，該下腔室的底部內表面朝該導熱器下傾。如此，該下腔室底端的液體可被導向該導熱器，且可減少相變化液的使用量，具有提升散熱效率及降低成本等功效。Wherein, the bottom inner surface of the lower chamber is inclined downward toward the heat conductor. In this way, the liquid at the bottom end of the lower chamber can be guided to the heat conductor, and the usage amount of the phase change liquid can be reduced, thereby improving the heat dissipation efficiency and reducing the cost.

其中，該槽體形成該下腔室的部位可以具有二側壁連接一前壁，該前壁可以與該導熱器相對，該二側壁在鄰近該前壁處可以分別形成一握持凹部。如此，使用者安裝該整合式冷卻模組時能更穩固地握持，及可減少相變化液的使用量，具有提升組裝便利性及降低成本等功效。Wherein, the part of the groove body forming the lower chamber may have two side walls connected to a front wall, the front wall may be opposite to the heat conductor, and the two side walls may respectively form a holding concave portion adjacent to the front wall. In this way, the user can hold the integrated cooling module more firmly when installing the integrated cooling module, and the usage amount of the phase change liquid can be reduced, which has the effects of improving the convenience of assembly and reducing the cost.

其中，該槽體內可以具有至少一導引部較鄰近該導熱器且較遠離該散熱器。如此，該導引部可對該槽體內的流體提供擾流效果，具有順暢導引氣態相變化液流向上腔室等功效。Wherein, the groove body may have at least one guide portion that is closer to the heat conductor and farther away from the heat sink. In this way, the guiding portion can provide a turbulent flow effect to the fluid in the tank, and has the effect of smoothly guiding the gaseous phase change liquid to flow to the upper chamber.

其中，該槽體可以具有一第一開口及一第二開口，該散熱器可以由一蓋板封閉該第一開口，該導熱器可以封閉該第二開口，該第一開口的面積可以大於該第二開口的面積。如此，可藉由擴大該散熱器的散熱面積以提升整體的散熱效率。The tank body may have a first opening and a second opening, the first opening may be closed by a cover plate of the radiator, the second opening may be closed by the heat conductor, and the area of the first opening may be larger than that of the The area of the second opening. In this way, the overall heat dissipation efficiency can be improved by enlarging the heat dissipation area of the heat sink.

其中，該引流部可以為該槽體內的二導引斜面，該二導引斜面的高處可以位於該上腔室，該下腔室可以對位在該二導引斜面的低處之間。如此，氣態的相變化液從該下腔室流入該上腔室後，可從該上腔室的中間部位自然向二側分流，以由大面積的散熱器快速地將該相變化液冷凝回液態，具有提升氣態相變化液的冷凝效率等功效。Wherein, the drainage portion may be two guiding inclined surfaces in the tank body, the high positions of the two guiding inclined surfaces may be located in the upper chamber, and the lower chamber may be aligned between the low positions of the two guiding inclined surfaces. In this way, after the gaseous phase change liquid flows into the upper chamber from the lower chamber, it can be naturally split from the middle part of the upper chamber to the two sides, so that the phase change liquid can be quickly condensed back by the large-area radiator. It is liquid, and has the effect of improving the condensation efficiency of gaseous phase change liquid.

其中，該散熱器可以具有一蓋板，該蓋板的內表面朝向該上腔室，並可以由該下腔室相對處往外周下傾。如此，氣態的相變化液冷凝成液態水珠後，水珠可易於順著該蓋板的內表面往側端流動與匯集，再沿著該引流部流回該下腔室，具有更進一步地提升相變化液的循環效率等功效。Wherein, the radiator may have a cover plate, and the inner surface of the cover plate faces the upper chamber, and can be inclined downward from the opposite part of the lower chamber to the outer circumference. In this way, after the gaseous phase change liquid is condensed into liquid water droplets, the water droplets can easily flow and collect along the inner surface of the cover plate to the side end, and then flow back to the lower chamber along the drainage portion, which has further advantages. Improve the circulation efficiency of phase change fluid and other functions.

其中，該蓋板的內表面的下傾角度係可以大於0度且小於或等於5度。如此，該蓋板能夠與該槽體穩固結合的前提下，使該蓋板兼具有導引水珠流動的效果。Wherein, the downward inclination angle of the inner surface of the cover plate may be greater than 0 degrees and less than or equal to 5 degrees. In this way, on the premise that the cover plate can be firmly combined with the groove body, the cover plate also has the effect of guiding the flow of water droplets.

其中，該蓋板的外表面可以形成平面狀。如此，該蓋板的外表面可更便於連接該散熱鰭片組，具有提升組裝效率與便利性等功效。Wherein, the outer surface of the cover plate may be formed into a plane shape. In this way, the outer surface of the cover plate can be more easily connected to the heat dissipation fin set, thereby improving assembly efficiency and convenience.

其中，該散熱器可以由一蓋板封閉該槽體的一第一開口，該蓋板的內表面朝向該上腔室，該內表面具有一第一端及一第二端，該第一端較鄰近該導熱器，該第二端較遠離該導熱器，該內表面可以由該第一端朝該第二端下傾。如此，氣態的相變化液冷凝成液態水珠後，水珠可易於順著該蓋板的內表面往前流動與匯集，使液態的相變化液能夠通過該引流部並沿著該槽體的前壁流回該下腔室，具有更進一步地提升相變化液的循環效率等功效。Wherein, the radiator can be closed by a cover plate to close a first opening of the tank body, the inner surface of the cover plate faces the upper chamber, the inner surface has a first end and a second end, the first end Closer to the heat conductor, the second end is farther from the heat conductor, and the inner surface may slope downward from the first end toward the second end. In this way, after the gaseous phase change liquid is condensed into liquid water droplets, the water droplets can easily flow and collect along the inner surface of the cover plate, so that the liquid phase change liquid can pass through the drainage part and along the groove body. The front wall flows back to the lower chamber, which further improves the circulation efficiency of the phase change liquid.

其中，該槽體內可以具有一導引部由該導熱器往該散熱器延伸，用以使氣態的相變化液可以沿著該槽體的內壁與該導引部之間的空間流入該上腔室，冷凝回液態的相變化液可以沿著該槽體的內壁與該導引部之間的空間流回該下腔室的底部。如此，該導引部所佔掉的體積能大幅減少該相變化液的用量，具有降低使用成本等功效。Wherein, the tank body may have a guide part extending from the heat conductor to the radiator, so that the gaseous phase change liquid can flow into the upper part along the space between the inner wall of the tank body and the guide part. In the chamber, the phase change liquid condensed back to the liquid state can flow back to the bottom of the lower chamber along the space between the inner wall of the tank body and the guide part. In this way, the volume occupied by the guide portion can greatly reduce the amount of the phase change liquid, which has the effect of reducing the use cost and the like.

其中，該導引部可以具有至少局部位於該上腔室的一延伸部，該散熱器可以由一蓋板封閉該槽體的一第一開口，該蓋板可以抵接該延伸部，該導引部可以具有一穿槽貫穿該延伸部以供該相變化液循環通過。如此，該導引部可維持定位於該槽體中的預定位置，並確保該相變化液能順暢地循環流動，具有提升結構穩固性及相變化液的循環順暢度等功效。Wherein, the guide portion may have an extension portion located at least partially in the upper chamber, the radiator may be closed by a cover plate to close a first opening of the groove body, the cover plate may abut the extension portion, the guide The lead portion may have a through groove running through the extension portion for the phase change liquid to circulate through. In this way, the guide portion can be maintained at a predetermined position in the tank body and ensure the smooth circulation of the phase change fluid, thereby improving the structural stability and the circulation smoothness of the phase change fluid.

其中，該導引部可以具有一下組塊位於該下腔室，該導引部可以具有一上組塊抵接該下組塊，該穿槽及該延伸部可以設於該上組塊。如此，該導引部可便於製造及組裝，具有降低製造成本及提升組裝便利性等功效。Wherein, the guide portion may have a lower block located in the lower chamber, the guide portion may have an upper block abutting against the lower block, and the through groove and the extension portion may be disposed on the upper block. In this way, the guide portion can be easily manufactured and assembled, and has the functions of reducing manufacturing cost and improving assembling convenience.

該整合式冷卻模組另可以包含一加強散熱模組，該加強散熱模組可以具有一結合框及一散熱鰭片組，該結合框可以連接於該槽體，該結合框的一連通槽可以連通該上腔室，該散熱鰭片組可以位於該連通槽中，該導引部可以具有一延伸部，該散熱器可以由一蓋板結合於該結合框，該蓋板可以抵接該散熱鰭片組，該散熱鰭片組可以抵接該延伸部，用以使該相變化液可以循環通過該散熱鰭片組。如此，可藉由該散熱鰭片組增加與該氣態的相變化液的接觸面積，使該整合式冷卻模組的內部能具有快速冷凝氣態相變化液的能力，並藉由該散熱鰭片組將剩餘熱能傳遞至該散熱器，以於該整合式冷卻模組的外部持續逸散熱能，故即使只使用了少量的相變化液，仍可對該熱源達到更佳的散熱效率。The integrated cooling module may further include an enhanced heat dissipation module, the enhanced heat dissipation module may have a combination frame and a heat dissipation fin set, the combination frame may be connected to the groove body, and a communication slot of the combination frame may be The upper chamber is communicated, the heat dissipation fin group can be located in the communication groove, the guide part can have an extension part, the radiator can be combined with the combination frame by a cover plate, the cover plate can abut the heat dissipation A set of fins, the set of heat dissipation fins can abut against the extension part, so that the phase change liquid can circulate through the set of heat dissipation fins. In this way, the contact area with the gaseous phase change liquid can be increased by the heat dissipation fin set, so that the interior of the integrated cooling module can have the ability to rapidly condense the gaseous phase change liquid, and the heat dissipation fin set can be used to increase the contact area with the gaseous phase change liquid. The residual heat energy is transferred to the radiator to continuously dissipate the heat energy outside the integrated cooling module, so even if only a small amount of the phase change liquid is used, the heat source can still achieve better heat dissipation efficiency.

其中，該結合框與該槽體可以一體成型相連接。如此，可簡化組裝步驟，具有提升組裝效率等功效。Wherein, the combination frame and the groove body can be integrally formed and connected. In this way, the assembly steps can be simplified, and the assembly efficiency can be improved.

其中，該槽體可以透明或半透明材質製成，該相變化液可以為有色流體。如此，使用者可以從外部看見該相變化液的工作型態，使熱流循環可視化，及產生特殊的視覺效果，具有提升消費者的購買意願的功效。Wherein, the tank body can be made of transparent or translucent material, and the phase change liquid can be a colored fluid. In this way, the user can see the working state of the phase change liquid from the outside, visualize the heat flow cycle, and generate special visual effects, which has the effect of enhancing the consumer's willingness to purchase.

其中，該機殼可以具有一第一通風口及一第二通風口，該散熱器相對的二端可以分別朝向該第一通風口及該第二通風口。如此，具有提升該散熱器的散熱效率等功效。Wherein, the casing may have a first ventilation port and a second ventilation port, and two opposite ends of the heat sink may face the first ventilation port and the second ventilation port, respectively. In this way, the heat dissipation efficiency of the heat sink can be improved, and the like.

其中，該機殼可以具有一第一風扇設於該第一通風口，該機殼可以具有一第二風扇設於該第二通風口，該第一風扇可以朝該散熱器吹風，該第二風扇可以將該機殼內的空氣抽出至外界。如此，可提升該機殼內外的氣流交換效率，避免熱空氣蓄積於該機殼內而影響該散熱器的散熱效率。Wherein, the casing may have a first fan disposed in the first vent, the casing may have a second fan disposed in the second vent, the first fan can blow air toward the radiator, the second fan A fan can draw the air inside the enclosure to the outside. In this way, the air flow exchange efficiency inside and outside the casing can be improved, and hot air can be prevented from accumulating in the casing and affecting the heat dissipation efficiency of the radiator.

為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式，作詳細說明如下：In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

請參照第2、3圖所示，其係本發明整合式冷卻模組M的第一實施例，係包含一槽體1、一散熱器2、一導熱器3及一相變化液4，該散熱器2及該導熱器3連接該槽體1，該相變化液4填充於該槽體1內，該相變化液4可例如為低沸點的不導電液。Please refer to Figures 2 and 3, which are the first embodiment of the integrated cooling module M of the present invention, which includes a tank body 1, a radiator 2, a heat conductor 3 and a phase change liquid 4. The The radiator 2 and the heat conductor 3 are connected to the tank body 1 , and the phase change liquid 4 is filled in the tank body 1 , and the phase change liquid 4 can be, for example, a non-conductive liquid with a low boiling point.

請參照第2、4圖所示，該槽體1內具有相連通的一上腔室S1及一下腔室S2，該上腔室S1內具有一引流部11，該引流部11銜接該下腔室S2，用以導引該上腔室S1中的液體利用重力自然流入該下腔室S2，而不易蓄積或滯留於該上腔室S1。其中，本實施例可藉由該槽體1的型態來形成上下相鄰的該上腔室S1與該下腔室S2，且二者之間並未設任何連通件（如管件）來連通，而是直接相連通。此外，本發明不限制該引流部11的型態，以能夠達到前述效果為原則。舉例而言，該引流部11可以為該槽體1內的至少一導引斜面12，該導引斜面12的高處H位於該上腔室S1，且該導引斜面12的低處L鄰接該下腔室S2；其中，該導引斜面12可以呈傾斜平面的型態，或像是漏斗的斜錐面型態等，不以圖式所揭示型態為限。Referring to Figures 2 and 4, the tank body 1 has an upper chamber S1 and a lower chamber S2 that are communicated with each other, and the upper chamber S1 has a drainage portion 11, and the drainage portion 11 is connected to the lower chamber. The chamber S2 is used to guide the liquid in the upper chamber S1 to naturally flow into the lower chamber S2 by gravity, and is not easy to accumulate or stay in the upper chamber S1. Wherein, in this embodiment, the upper chamber S1 and the lower chamber S2 that are adjacent up and down can be formed by the shape of the groove body 1, and there is no communication member (such as a pipe) between the two to communicate with each other. , but are directly connected. In addition, the present invention does not limit the type of the drainage portion 11, and the principle is that the aforementioned effects can be achieved. For example, the diversion portion 11 can be at least one guide slope 12 in the tank body 1 , the height H of the guide slope 12 is located in the upper chamber S1 , and the lower portion L of the guide slope 12 is adjacent to the upper chamber S1 The lower chamber S2; wherein, the guiding inclined surface 12 may be in the form of an inclined plane, or in the form of an inclined cone such as a funnel, etc., which is not limited to the type disclosed in the drawings.

在本實施例中，該上腔室S1的最大寬度W1可以大於該下腔室S2的最大寬度W2，使該槽體1可概呈上寬下窄的型態。例如但不限制地，該槽體1形成該上腔室S1的部位可概呈矩形，以定義出相正交的一X方向與一Y方向，且前述的「寬度」即為該上腔室S1及該下腔室S2分別沿該Y方向延伸的距離。藉此結構，本實施例的引流部11可以為該槽體1內呈傾斜平面狀的二導引斜面12；亦即，該二導引斜面12的高處H位於該上腔室S1，該下腔室S2可以對位在該二導引斜面12的低處L之間，使該上腔室S1的二側宛如銜接該下腔室S2頂端並向二側展開之傾斜雙翼，讓該上腔室S1中的液體可藉由該引流部11（該二導引斜面12）匯流入該下腔室S2。請配合參照第5圖所示，各該導引斜面12與一水平面P的夾角θ係可以大於0度且小於或等於45度。In this embodiment, the maximum width W1 of the upper chamber S1 may be greater than the maximum width W2 of the lower chamber S2, so that the groove body 1 may be generally wide at the top and narrow at the bottom. For example, but not limitation, the part of the groove body 1 forming the upper chamber S1 can be roughly rectangular to define an X direction and a Y direction that are orthogonal to each other, and the aforementioned “width” is the upper chamber The distances S1 and the lower chamber S2 extend along the Y direction respectively. With this structure, the drainage portion 11 of this embodiment can be two guiding inclined surfaces 12 in the groove body 1 that are inclined planes; that is, the height H of the two guiding inclined surfaces 12 is located in the upper chamber S1, and the The lower chamber S2 can be aligned between the lower parts L of the two guiding slopes 12, so that the two sides of the upper chamber S1 are like inclined wings that connect to the top of the lower chamber S2 and expand to both sides, so that the The liquid in the upper chamber S1 can flow into the lower chamber S2 through the drainage portion 11 (the two guiding slopes 12 ). Please refer to FIG. 5 , the included angle θ between each of the guiding inclined surfaces 12 and a horizontal plane P may be greater than 0 degrees and less than or equal to 45 degrees.

請參照第2、3圖所示，該槽體1可以具有一第一開口13對位於該上腔室S1，以供組裝該散熱器2；另可以具有一第二開口14對位於該下腔室S2，以供組裝該導熱器3。該第一開口13的面積可以大於該第二開口14的面積，以有助提升散熱效率。在本實施例中，該散熱器2與該導熱器3可以呈非平行設置，例如使該散熱器2位於該槽體1的頂端且位於一XY平面，另使該導熱器3位於該槽體1的側端且位於一YZ平面或一XZ平面，其係可依據使用需求而調整者，本發明並不加以限制。又，本實施例還可以使該第一開口13與該第二開口14在X方向上不重疊，並使該第二開口14位於該第一開口13在X方向上的前方或後方，以加長該下腔室S2在X方向上的深度，使該槽體1形成凸出的尾部以便熱連接於一電子裝置E的熱源G（請配合參照第6圖），例如直接接觸或是以導熱墊片（Thermal pad）之類的導熱材間接接觸，以確保該槽體1的上端（形成該上腔室S1處）及該散熱器2不會與該電子裝置E的其他部位產生干涉。Referring to Figures 2 and 3, the tank body 1 may have a first opening 13 located in the upper chamber S1 for assembling the heat sink 2; and may also have a second opening 14 located in the lower chamber Chamber S2 for assembling the heat conductor 3 . The area of the first opening 13 may be larger than that of the second opening 14 to help improve heat dissipation efficiency. In this embodiment, the heat sink 2 and the heat conductor 3 can be arranged non-parallel, for example, the heat sink 2 is located at the top of the tank body 1 and is located in an XY plane, and the heat conductor 3 is located in the tank body. The side end of 1 is located in a YZ plane or an XZ plane, which can be adjusted according to usage requirements, which is not limited in the present invention. In addition, in this embodiment, the first opening 13 and the second opening 14 may not overlap in the X direction, and the second opening 14 may be located in front of or behind the first opening 13 in the X direction, so as to lengthen The depth of the lower chamber S2 in the X direction enables the groove body 1 to form a protruding tail so as to be thermally connected to a heat source G of an electronic device E (please refer to Fig. 6), such as direct contact or a thermal pad A thermal pad such as a thermal pad is indirectly contacted to ensure that the upper end of the tank 1 (where the upper chamber S1 is formed) and the heat sink 2 do not interfere with other parts of the electronic device E.

請再參照第2、3圖所示，該槽體1形成該下腔室S2的部位可以具有二側壁15連接一前壁16，該前壁16概與該導熱器3相對，該前壁16與一水平面P的夾角β係可以大於0度且小於90度，以便將從該上腔室S1流入該下腔室S2的液體導引流向該導熱器3。此外，該槽體1內還可以具有至少一導引部17，該導引部17較鄰近該導熱器3且較遠離該散熱器2，該導引部17可對該槽體1內的氣體提供擾流效果，可用以導引氣態的相變化液4能更順暢地流向該上腔室S1。例如但不限制地，本實施例的導引部17可以具有位於該下腔室S2中的一斜板，該斜板的二側可以連接於該二側壁15，該斜板與該第一開口13在X方向上可以呈局部重疊狀。Please refer to Figures 2 and 3 again, the part of the tank body 1 forming the lower chamber S2 may have two side walls 15 connected to a front wall 16, the front wall 16 is almost opposite to the heat conductor 3, the front wall 16 The included angle β with a horizontal plane P can be greater than 0 degrees and less than 90 degrees, so that the liquid flowing from the upper chamber S1 into the lower chamber S2 can be directed to flow toward the heat conductor 3 . In addition, the tank body 1 may also have at least one guide portion 17 , the guide portion 17 is closer to the heat conductor 3 and farther away from the heat sink 2 , and the guide portion 17 can guide the gas in the tank body 1 . The turbulence effect is provided, which can be used to guide the gaseous phase change liquid 4 to flow to the upper chamber S1 more smoothly. For example, but not limitation, the guide portion 17 of this embodiment may have an inclined plate located in the lower chamber S2, two sides of the inclined plate may be connected to the two side walls 15, and the inclined plate is connected to the first opening. 13 may be partially overlapped in the X direction.

另請參照第2、6圖所示，該二側壁15可以在鄰近該前壁16處分別形成一握持凹部18，以供使用者安裝該整合式冷卻模組M時能更穩固地握持，同時也可減縮該下腔室S2的容積以減少該相變化液4的使用量，有助降低成本。請再參照第2、3圖所示，該下腔室S2的底部19的一內表面191可以形成朝該導熱器3下傾的型態，以便將該下腔室S2底端的液體導向該導熱器3。Please also refer to FIGS. 2 and 6 , a holding recess 18 can be formed on the two side walls 15 adjacent to the front wall 16 , so that the user can hold the integrated cooling module M more stably when installing the integrated cooling module M. , and at the same time, the volume of the lower chamber S2 can be reduced to reduce the usage amount of the phase change liquid 4 , which helps to reduce the cost. Referring to Figures 2 and 3 again, an inner surface 191 of the bottom 19 of the lower chamber S2 can be formed to slope downward toward the heat conductor 3, so as to guide the liquid at the bottom of the lower chamber S2 to the heat conductor device 3.

該散熱器2結合該槽體1並對位於該上腔室S1。本實施例的散熱器2可以具有一蓋板21封閉該第一開口13，該蓋板21可以為導熱係數高的材質，例如銅、鋁等金屬或另鍍有石墨烯層等。本發明不限制該散熱器2與該槽體1之間的結合方式，以防該相變化液4由該第一開口13滲漏為原則，例如可採用黏合、嵌入、夾固、鎖固或銲接等方式。此外，該蓋板21與該槽體1之間還可以具有一墊圈R，以提升該蓋板21對該第一開口13的密封性。該蓋板21的內表面21a朝向該上腔室S1，可用以將氣態的相變化液4冷凝回液態。較佳地，該蓋板21的外表面21b可以連接有一散熱鰭片組22，以增加該散熱器2與相對低溫空氣的接觸面積，提升該散熱器2的散熱效果。該蓋板21的內表面21a也可以具有數個輔助散熱凸部23，該數個輔助散熱凸部23可以朝該上腔室S1延伸，以增加該散熱器2與氣態的相變化液4的接觸面積，提升對氣態相變化液4的冷凝效率。在本實施例中，該散熱鰭片組22的鰭片設置方向可以與該數個輔助散熱凸部23的延伸方向相同，且可以沿著Y方向延伸。The heat sink 2 is combined with the tank body 1 and located in the upper chamber S1. The heat sink 2 of this embodiment may have a cover plate 21 to close the first opening 13 , and the cover plate 21 may be made of a material with high thermal conductivity, such as copper, aluminum and other metals or plated with a graphene layer. The present invention does not limit the combination of the radiator 2 and the tank body 1 to prevent the phase change liquid 4 from leaking through the first opening 13. For example, bonding, embedding, clamping, locking or welding, etc. In addition, a gasket R may be disposed between the cover plate 21 and the groove body 1 to improve the sealing performance of the cover plate 21 to the first opening 13 . The inner surface 21a of the cover plate 21 faces the upper chamber S1, and can be used to condense the gaseous phase change liquid 4 back to the liquid state. Preferably, the outer surface 21b of the cover plate 21 can be connected with a heat dissipation fin group 22 to increase the contact area between the heat sink 2 and the relatively low-temperature air and improve the heat dissipation effect of the heat sink 2 . The inner surface 21 a of the cover plate 21 may also have several auxiliary heat dissipation protrusions 23 , and the auxiliary heat dissipation protrusions 23 may extend toward the upper chamber S1 to increase the contact between the heat sink 2 and the gaseous phase change liquid 4 . The contact area improves the condensation efficiency of the gaseous phase change liquid 4 . In this embodiment, the disposition direction of the fins of the heat dissipation fin group 22 may be the same as the extending direction of the plurality of auxiliary heat dissipation protrusions 23 , and may extend along the Y direction.

該導熱器3結合該槽體1並對位於該下腔室S2。本實施例的導熱器3可以為導熱係數高的材質，例如銅、鋁等金屬或另鍍有石墨烯層等。其中，該導熱器3與該槽體1之間可以具有一墊圈R，以提升該導熱器3對該第二開口14的密封性。該導熱器3的內表面3a朝向該下腔室S2，並至少有局部接觸該相變化液4；該導熱器3的外表面3b則裸露於該槽體1外並供熱連接一熱源G，以由該導熱器3吸收該熱源G的熱能，並致使液態的相變化液4吸熱而汽化。The heat conductor 3 is combined with the tank body 1 and located in the lower chamber S2. The heat conductor 3 in this embodiment may be made of a material with high thermal conductivity, such as metals such as copper and aluminum, or a layer of graphene plated separately. Wherein, there may be a gasket R between the heat conductor 3 and the groove body 1 to improve the sealing performance of the heat conductor 3 to the second opening 14 . The inner surface 3a of the heat conductor 3 faces the lower chamber S2, and at least partially contacts the phase change liquid 4; the outer surface 3b of the heat conductor 3 is exposed outside the tank 1 and is connected to a heat source G for heat supply. In order to absorb the heat energy of the heat source G by the heat conductor 3, and cause the liquid phase change liquid 4 to absorb heat and vaporize.

另，該導熱器3的內表面3a可以具有一多孔結構區31，該多孔結構區31至少有局部接觸該相變化液4，該多孔結構區31可例如由銅粉燒結而成，以利用毛細現象將該相變化液4往上導引，故即使該相變化液4的液體量不足以完全浸沒該導熱器3，該導熱器3仍能對液態的相變化液4提供良好的汽化效率，故可減少該相變化液4的使用量，有助降低成本。又，該導熱器3還可以具有數個加強熱交換部32凸出或凹陷於該多孔結構區31，使流體通過此處可產生渦流，進而擾動周遭氣態及液態的相變化液4，增加整體散熱面積，使散熱效果提升；較佳地，該加強熱交換部32的橫截面可以呈三角形，以更加強化前述效果。In addition, the inner surface 3a of the heat conductor 3 may have a porous structure region 31, and the porous structure region 31 is in contact with the phase change liquid 4 at least partially. The capillary phenomenon guides the phase change liquid 4 upward, so even if the liquid amount of the phase change liquid 4 is not enough to completely submerge the heat conductor 3, the heat conductor 3 can still provide a good vaporization efficiency for the liquid phase change liquid 4 , so the usage amount of the phase change liquid 4 can be reduced, and the cost can be reduced. In addition, the heat conductor 3 can also have a plurality of enhanced heat exchange parts 32 protruding or recessed in the porous structure area 31, so that the fluid can generate eddy currents when passing through it, thereby disturbing the surrounding gaseous and liquid phase change liquid 4, increasing the overall The heat dissipation area improves the heat dissipation effect; preferably, the cross section of the enhanced heat exchange portion 32 can be triangular to further enhance the aforementioned effect.

請參照第3、6圖所示，組裝好的整合式冷卻模組M可以置入一電子裝置E的一機殼5內，該機殼5內具有一電氣模組6，該整合式冷卻模組M可以由該導熱器3的外表面3b熱連接該電氣模組6的一熱源G。如此，在該電子裝置E運作的過程中，當該熱源G的溫度上升時，可以由該導熱器3吸收該熱源G的熱能，使該下腔室S2中液態的相變化液4能夠在吸收該導熱器3的熱能後，轉變成氣態的相變化液4，並自然向上流入該上腔室S1，隨後在接觸到相對低溫的散熱器2時，將熱能傳遞給該散熱器2以冷凝回液態，並沿著該引流部11流回該下腔室S2。因此，本發明的整合式冷卻模組M不需使用到管件及泵浦等構件，即可藉由該相變化液4不斷地在該上腔室S1與該下腔室S2中形成主動式的循環流動，有效帶離該熱源G的熱能，幫助該電氣模組6散熱以維持適當的工作溫度。Referring to Figures 3 and 6, the assembled integrated cooling module M can be placed in a casing 5 of an electronic device E. The casing 5 has an electrical module 6 in it. The group M can be thermally connected to a heat source G of the electrical module 6 by the outer surface 3 b of the heat conductor 3 . In this way, during the operation of the electronic device E, when the temperature of the heat source G rises, the heat conductor 3 can absorb the heat energy of the heat source G, so that the liquid phase change liquid 4 in the lower chamber S2 can absorb After the thermal energy of the heat conductor 3 is converted into a gaseous phase change liquid 4, it naturally flows upward into the upper chamber S1, and then when it contacts the relatively low temperature radiator 2, the thermal energy is transferred to the radiator 2 to be condensed back. liquid, and flows back to the lower chamber S2 along the drainage portion 11 . Therefore, the integrated cooling module M of the present invention does not need to use components such as pipes and pumps, and can continuously form an active cooling module in the upper chamber S1 and the lower chamber S2 by the phase change liquid 4 The circulating flow effectively takes away the heat energy of the heat source G, and helps the electrical module 6 to dissipate heat to maintain a proper working temperature.

值得一提的是，請配合參照第4圖所示，由於本實施例的槽體1概呈上寬下窄的型態，使得氣態的相變化液4從該下腔室S2流入該上腔室S1後，可從該上腔室S1的中間部位自然向二側分流，以由大面積的散熱器2快速地將該相變化液4冷凝回液態，且液態的相變化液4還可以順著該二導引斜面12自然流入該下腔室S2，而不易蓄積或滯留於該上腔室S1。如此，該整合式冷卻模組M只需要少量的相變化液4即可主動且高效地產生循環，並對該熱源G達到良好散熱效果，特別適用於電競產業或其他需要高效能的電腦主機或伺服器等電子裝置E。It is worth mentioning that, please refer to Fig. 4. Since the tank body 1 of this embodiment is generally wide at the top and narrow at the bottom, the gaseous phase change liquid 4 flows from the lower chamber S2 into the upper chamber. After the chamber S1, the flow can be naturally branched from the middle part of the upper chamber S1 to the two sides, so that the phase change liquid 4 can be quickly condensed back to the liquid state by the large-area radiator 2, and the liquid phase change liquid 4 can also be The two guiding slopes 12 naturally flow into the lower chamber S2, and are not easy to accumulate or stay in the upper chamber S1. In this way, the integrated cooling module M only needs a small amount of the phase change liquid 4 to actively and efficiently generate circulation, and achieves a good heat dissipation effect for the heat source G, which is especially suitable for the gaming industry or other computer hosts that require high performance. or electronic devices such as servers.

請再參照第6圖所示，該機殼5可以具有一第一通風口51及一第二通風口52，該散熱器2在Y方向上的相對的二端可以分別朝向該第一通風口51及該第二通風口52，以便由流通於該第一通風口51及該第二通風口52之間的氣流提升該散熱器2的散熱效率。較佳地，該機殼5還可以具有一第一風扇53設於該第一通風口51，另具有一第二風扇54設於該第二通風口52，並控制該第一風扇53運作時可以朝該散熱器2吹風，該第二風扇54運作時可以將該機殼5內的空氣抽出至外界（或相反設置），以提升該機殼5內外的氣流交換效率，避免熱空氣蓄積於該機殼5內而影響該散熱器2的散熱效率。Referring to FIG. 6 again, the casing 5 may have a first vent 51 and a second vent 52, and opposite ends of the heat sink 2 in the Y direction may face the first vent respectively 51 and the second vent 52, so as to improve the heat dissipation efficiency of the radiator 2 by the airflow circulating between the first vent 51 and the second vent 52. Preferably, the casing 5 can also have a first fan 53 disposed in the first vent 51 and a second fan 54 disposed in the second vent 52 to control the operation of the first fan 53 . The air can be blown toward the radiator 2, and the second fan 54 can extract the air in the casing 5 to the outside (or vice versa) during operation, so as to improve the air flow exchange efficiency inside and outside the casing 5, and avoid the accumulation of hot air in the casing 5. The heat dissipation efficiency of the radiator 2 is affected by the casing 5 .

請參照第7圖所示，其係本發明整合式冷卻模組M的第二實施例的局部放大圖，本實施例可選擇使散熱器2的蓋板21也對液態的相變化液4具有引流效果。Please refer to FIG. 7 , which is a partial enlarged view of the second embodiment of the integrated cooling module M according to the present invention. In this embodiment, the cover plate 21 of the radiator 2 can be selected so that the liquid phase change liquid 4 also has a Drainage effect.

詳言之，本實施例的蓋板21可概呈向上凸起的錐狀；亦即，該蓋板21對應該下腔室S2的部位較為外凸，並由該外凸的部位往外周下傾。如此，該蓋板21朝向該上腔室S1的內表面21a可以由該下腔室S2相對處往外周下傾，使氣態的相變化液4在接觸到相對低溫的散熱器2而冷凝成液態水珠後，水珠可易於順著該蓋板21的內表面21a往外周流動與匯集，再沿著該引流部11流回該下腔室S2，使該相變化液4的循環效率可更進一步地提升。其中，該蓋板21的內表面21a的下傾角度α係可以大於0度且小於或等於5度，以於該蓋板21能夠與該槽體1穩固結合的前提下，使該蓋板21兼具有導引水珠流動的效果。In detail, the cover plate 21 of the present embodiment can be generally in the shape of an upwardly protruding cone; that is, the part of the cover plate 21 corresponding to the lower chamber S2 is relatively convex, and goes downward from the convex part to the outer periphery. pour. In this way, the inner surface 21a of the cover plate 21 facing the upper chamber S1 can be inclined downward from the lower chamber S2 to the outer periphery, so that the gaseous phase change liquid 4 is condensed into a liquid state when it contacts the relatively low temperature radiator 2 After the water droplets, the water droplets can easily flow and collect along the inner surface 21a of the cover plate 21 to the outer periphery, and then flow back to the lower chamber S2 along the drainage portion 11, so that the circulation efficiency of the phase change liquid 4 can be improved. further increase. Wherein, the downward inclination angle α of the inner surface 21a of the cover plate 21 can be greater than 0 degrees and less than or equal to 5 degrees, so that the cover plate 21 can be firmly combined with the tank body 1 on the premise that the cover plate 21 It also has the effect of guiding the flow of water droplets.

請參照第8圖所示，其係本發明整合式冷卻模組M的第三實施例的局部放大圖，本實施例的蓋板21同樣具有前述第二實施例導引相變化液4流動的效果，只是二實施例的蓋板21外型稍有不同。在本實施例中，該蓋板21的板厚並不一致，即該蓋板21僅將其內表面21a設成由該下腔室S2相對處往外周下傾的型態，使該蓋板21的板厚概呈中間較薄而外周較厚的型態，該蓋板21的外表面21b則形成平面狀，以便連接該散熱鰭片組22。Please refer to FIG. 8 , which is a partial enlarged view of the third embodiment of the integrated cooling module M of the present invention. The cover plate 21 of this embodiment also has the aforementioned second embodiment to guide the flow of the phase change liquid 4 . In effect, only the shape of the cover plate 21 of the two embodiments is slightly different. In this embodiment, the thickness of the cover plate 21 is not uniform, that is, only the inner surface 21a of the cover plate 21 is set to be inclined downward from the lower chamber S2 opposite to the outer circumference, so that the cover plate 21 The thickness of the plate is generally thinner in the middle and thicker at the outer periphery, and the outer surface 21b of the cover plate 21 is formed into a plane shape so as to connect the heat dissipation fin set 22 .

請參照第9圖所示，其係本發明整合式冷卻模組M的第四實施例，本實施例的蓋板21可選擇使其內表面21a呈後高前低的型態，即該內表面21a具有一第一端211及一第二端212，該第一端211較鄰近該導熱器3，該第二端212較遠離該導熱器3，該內表面21a可以由該第一端211朝該第二端212下傾，使該內表面21a的第一端211高於第二端212。如此，氣態的相變化液4在接觸到相對低溫的散熱器2而冷凝成液態水珠後，水珠可易於順著該蓋板21的內表面21a往前流動與匯集，使液態的相變化液4能夠通過該引流部11並沿著該槽體1的前壁16流回該下腔室S2，同樣可有助於提升該相變化液4的循環效率。Please refer to FIG. 9, which is the fourth embodiment of the integrated cooling module M of the present invention. The cover plate 21 of this embodiment can be selected to have its inner surface 21a high in the back and low in the front. The surface 21 a has a first end 211 and a second end 212 , the first end 211 is closer to the heat conductor 3 , the second end 212 is farther away from the heat conductor 3 , and the inner surface 21 a can be formed by the first end 211 The first end 211 of the inner surface 21a is tilted downward toward the second end 212 so that the first end 211 of the inner surface 21a is higher than the second end 212 . In this way, after the gaseous phase change liquid 4 contacts the relatively low temperature radiator 2 and is condensed into liquid water droplets, the water droplets can easily flow and collect along the inner surface 21a of the cover plate 21 to make the liquid phase change The liquid 4 can pass through the drainage portion 11 and flow back to the lower chamber S2 along the front wall 16 of the tank body 1 , which can also help to improve the circulation efficiency of the phase-change liquid 4 .

請參照第10、11圖所示，其係本發明整合式冷卻模組M的第五實施例，在本實施例中，該槽體1內部的導引部17具有較大的體積，除可對該槽體1內的氣體提供導引及擾流效果外，另兼具有減少該相變化液4用量，以降低使用成本的作用。Please refer to Figures 10 and 11, which are the fifth embodiment of the integrated cooling module M of the present invention. In this embodiment, the guide portion 17 inside the tank body 1 has a larger volume, except that the In addition to providing the effect of guiding and disturbing the flow of the gas in the tank body 1, it also has the effect of reducing the amount of the phase change liquid 4, so as to reduce the use cost.

詳言之，本發明並不限制該導引部17的型態，該導引部17可由該導熱器3往該散熱器2延伸，且該導引部17較佳可佔掉該下腔室S2約五至九成的空間。該導引部17可以具有數個支撐柱171分佈於該導引部17的外表面，並由該數個支撐柱171抵接該槽體1的內壁W，以輔助該導引部17維持定位在該槽體1中的預定位置。Specifically, the present invention does not limit the shape of the guide portion 17 , the guide portion 17 can extend from the heat conductor 3 to the heat sink 2 , and the guide portion 17 can preferably occupy the lower chamber S2 is about 50-90% of the space. The guide portion 17 may have a plurality of support columns 171 distributed on the outer surface of the guide portion 17 , and the plurality of support columns 171 abut against the inner wall W of the groove body 1 to assist the guide portion 17 to maintain Positioned at a predetermined position in the tank body 1 .

另一方面，該導引部17的上端可以具有一延伸部172及一穿槽173，該延伸部172可以位於該上腔室S1，該穿槽173概沿X方向貫穿該延伸部172。當該散熱器2由其蓋板21封閉該第一開口13時，該蓋板21可以抵接或不抵接於該延伸部172。使用時，該導熱器3吸熱後可使該下腔室S2中液態的相變化液4轉變成氣態的相變化液4，並沿著該槽體1的內壁W與該導引部17之間的空間，自然向上流入該上腔室S1及通過該穿槽173，冷凝回液態的相變化液4則可沿著該槽體1的內壁W與該導引部17之間的空間，順著該前壁16流回該下腔室S2的底部19。On the other hand, the upper end of the guide portion 17 may have an extension portion 172 and a through slot 173 , the extension portion 172 may be located in the upper chamber S1 , and the through slot 173 penetrates the extension portion 172 along the X direction. When the radiator 2 is closed by the cover plate 21 of the first opening 13 , the cover plate 21 may or may not be in contact with the extension portion 172 . When in use, the heat conductor 3 can convert the liquid phase change liquid 4 in the lower chamber S2 into the gaseous phase change liquid 4 after absorbing heat, and move along the inner wall W of the tank body 1 and the guide portion 17. The space between the upper chamber S1 and the through groove 173 naturally flows upward, and the phase change liquid 4 condensed back to the liquid state can follow the space between the inner wall W of the groove body 1 and the guide portion 17, It flows back to the bottom 19 of the lower chamber S2 along the front wall 16 .

為便於製造及組裝，該導引部17可例如由數個組塊相結合而構成，或也可以利用3D列印技術直接成型於該下腔室S2中。例如但不限制地，本實施例的導引部17可以具有一下組塊17a及一上組塊17b，該下組塊17a可以通過該槽體1的第二開口14置入該下腔室S2，該上組塊17b則可以通過該槽體1的第一開口13置入該槽體1內，並由該上組塊17b的下端抵接該下組塊17a的上端。該數個支撐柱171可以分佈於該下組塊17a及該上組塊17b，該延伸部172及該穿槽173則可以設於該上組塊17b。如此，可藉由使該蓋板21抵接於該延伸部172，達到輔助定位該上組塊17b的效果。For ease of manufacture and assembly, the guide portion 17 can be formed by combining several blocks, or can also be directly formed in the lower chamber S2 by 3D printing technology. For example but not limitation, the guide portion 17 of this embodiment may have a lower block 17a and an upper block 17b, and the lower block 17a may be inserted into the lower chamber S2 through the second opening 14 of the groove body 1 , the upper block 17b can be inserted into the tank 1 through the first opening 13 of the tank 1, and the lower end of the upper block 17b abuts the upper end of the lower block 17a. The plurality of support columns 171 can be distributed on the lower block 17a and the upper block 17b, and the extending portion 172 and the through groove 173 can be provided on the upper block 17b. In this way, by making the cover plate 21 abut against the extending portion 172, the effect of assisting the positioning of the upper block 17b can be achieved.

值得一提的是，本實施例還可選擇以透明或半透明材質（例如壓克力）製成該槽體1，並搭配將該相變化液4染成有色流體，讓使用者可以從外部看見該相變化液4的工作型態，使整體的熱流循環可視化，及產生特殊的視覺效果，從而有助提升消費者的購買意願。It is worth mentioning that in this embodiment, the tank body 1 can also be made of a transparent or translucent material (such as acrylic), and the phase change liquid 4 can be dyed into a colored fluid, so that the user can Seeing the working state of the phase change liquid 4 can visualize the overall heat flow cycle and produce special visual effects, thereby helping to increase consumers' willingness to buy.

請參照第12、13圖所示，其係本發明整合式冷卻模組M的第六實施例，本實施例大致上同於前述的第五實施例，其主要差異在於，本實施例加裝了一加強散熱模組7，以更進一步地提升該相變化液4的冷凝效率。Please refer to Figures 12 and 13, which are the sixth embodiment of the integrated cooling module M of the present invention. This embodiment is basically the same as the fifth embodiment described above, and the main difference is that this embodiment is equipped with A reinforced heat dissipation module 7 is provided to further improve the condensation efficiency of the phase change liquid 4 .

詳言之，該加強散熱模組7具有一結合框71及一散熱鰭片組72。該結合框71具有上下貫穿的一連通槽711，該結合框71連接於該槽體1，使該結合框71的連通槽711可以連通該上腔室S1。該散熱鰭片組72則可位於該結合框71的連通槽711中，並由該散熱鰭片組72抵接該導引部17的延伸部172。另一方面，該散熱器2的蓋板21可結合於該結合框71，以封閉該連通槽711的頂端，並由該蓋板21抵接該散熱鰭片組72。此外，該散熱器2的蓋板21與該結合框71之間還可以具有一墊圈R，以提升二者之間的密封性，且即便該蓋板21、該散熱鰭片組72與該結合框71三者之間具有尺寸公差的問題，也能藉由該墊圈R來改善，確保該蓋板21與該散熱鰭片組72能相互抵接。在其他實施例中，該結合框71還可以與該槽體1一體成型相連接，以簡化組裝步驟。Specifically, the enhanced heat dissipation module 7 has a combination frame 71 and a heat dissipation fin set 72 . The coupling frame 71 has a communication groove 711 penetrating up and down. The coupling frame 71 is connected to the groove body 1 so that the communication groove 711 of the coupling frame 71 can communicate with the upper chamber S1 . The heat dissipation fin set 72 can be located in the communication groove 711 of the combination frame 71 , and the heat dissipation fin set 72 abuts the extension portion 172 of the guide portion 17 . On the other hand, the cover plate 21 of the heat sink 2 can be combined with the combination frame 71 to close the top of the communication groove 711 , and the cover plate 21 abuts the heat dissipation fin set 72 . In addition, a gasket R may also be provided between the cover plate 21 of the heat sink 2 and the combination frame 71 to improve the sealing performance between the two, and even if the cover plate 21 and the heat dissipation fin set 72 are combined with the The problem of dimensional tolerance among the three frames 71 can also be improved by the washer R to ensure that the cover plate 21 and the heat dissipation fin set 72 can abut against each other. In other embodiments, the combination frame 71 can also be integrally connected with the tank body 1 to simplify assembly steps.

在本實施例的整合式冷卻模組M的運作過程中，該導熱器3吸收該熱源G的熱能後，可使該下腔室S2中液態的相變化液4轉變成氣態的相變化液4，並沿著該槽體1的內壁W與該導引部17之間的空間，自然向上流入該上腔室S1及該連通槽711，並通過該散熱鰭片組72；冷凝回液態的相變化液4可依序流回該上腔室S1及該下腔室S2，再沿著該槽體1的內壁W與該導引部17之間的空間，順著該前壁16流回該下腔室S2的底部19。其中，由於本實施例的整合式冷卻模組M，可藉由該散熱鰭片組72增加與該氣態的相變化液4的接觸面積，使該整合式冷卻模組M的內部能具有快速冷凝氣態相變化液4的能力，並藉由該散熱鰭片組72將剩餘熱能傳遞至該散熱器2，以於該整合式冷卻模組M的外部持續逸散熱能，故本實施例的整合式冷卻模組M可更進一步地提升該相變化液4的冷凝效率，即使只使用了少量的相變化液4，仍可對該熱源達到更佳的散熱效率。During the operation of the integrated cooling module M of this embodiment, after the heat conductor 3 absorbs the heat energy of the heat source G, the liquid phase change liquid 4 in the lower chamber S2 can be converted into a gaseous phase change liquid 4 , and along the space between the inner wall W of the tank body 1 and the guide portion 17, naturally flows upward into the upper chamber S1 and the communication groove 711, and passes through the heat dissipation fin group 72; condensed back to the liquid state The phase change liquid 4 can flow back to the upper chamber S1 and the lower chamber S2 in sequence, and then flows along the front wall 16 along the space between the inner wall W of the tank body 1 and the guide portion 17 . back to the bottom 19 of the lower chamber S2. Wherein, due to the integrated cooling module M of this embodiment, the contact area with the gaseous phase change liquid 4 can be increased by the heat dissipation fin set 72, so that the inside of the integrated cooling module M can have rapid condensation The ability of the gaseous phase change liquid 4 to transfer residual heat energy to the radiator 2 through the heat dissipation fin set 72 so as to continuously escape heat energy outside the integrated cooling module M. Therefore, the integrated The cooling module M can further improve the condensation efficiency of the phase change liquid 4, and even if only a small amount of the phase change liquid 4 is used, a better heat dissipation efficiency can still be achieved for the heat source.

綜上所述，本發明的整合式冷卻模組，可藉由在槽體內形成一引流部以銜接相連通的上腔室與下腔室，使吸收熱源處熱能而轉變成氣態的相變化液能向上流入該上腔室，與散熱器熱交換以冷凝回液態，並沿著該引流部流回該下腔室。如此，該整合式冷卻模組不需使用到管件、泵浦及轉向接座等構件，即可藉由該相變化液不斷地在該上腔室與該下腔室中形成主動式的循環流動，不僅構件成本得以下降，運作時也不需額外耗費電力來驅動相變化液流動，還可藉由該相變化液的氣液相變化以高效帶離熱源處的熱能。同時，該整合式冷卻模組的構件數量少，且不需使用管件來連接構件，能有效減縮整體所需佔用的空間，並確保其中的相變化液幾乎不會有滲漏或蒸散而逐漸減量的問題。此外，該整合式冷卻模組還能預先完成組裝，以便後續能快速地組裝至電子裝置之預定位置。因此，本發明的整合式冷卻模組具有減縮體積、節能、提升散熱及組裝效率等功效；具有該整合式冷卻模組的電子裝置則同樣具有前述功效所帶來的有益效果。To sum up, in the integrated cooling module of the present invention, by forming a drainage portion in the tank to connect the connected upper chamber and the lower chamber, the heat energy at the heat source can be absorbed and converted into a gaseous phase change liquid It can flow upward into the upper chamber, exchange heat with the radiator to condense back to a liquid state, and flow back to the lower chamber along the drain. In this way, the integrated cooling module can continuously form an active circulating flow in the upper chamber and the lower chamber by the phase change liquid without using components such as pipes, pumps and steering sockets. , not only the cost of components is reduced, but additional power is not required to drive the flow of the phase change liquid during operation, and the heat energy at the heat source can be efficiently taken away by the gas-liquid phase change of the phase change liquid. At the same time, the integrated cooling module has a small number of components, and does not need to use pipe fittings to connect the components, which can effectively reduce the space occupied by the whole, and ensure that the phase change liquid therein will hardly leak or evaporate and gradually reduce The problem. In addition, the integrated cooling module can be pre-assembled so that it can be quickly assembled to a predetermined position of the electronic device. Therefore, the integrated cooling module of the present invention has the functions of reducing volume, saving energy, improving heat dissipation and assembly efficiency, etc. The electronic device having the integrated cooling module also has the beneficial effects brought by the aforementioned functions.

雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the patent application attached hereto.

﹝本發明﹞ 1:槽體 11:引流部 12:導引斜面 13:第一開口 14:第二開口 15:側壁 16:前壁 17:導引部 17a:下組塊 17b:上組塊 171:支撐柱 172:延伸部 173:穿槽 18:握持凹部 19:底部 191:內表面 2:散熱器 21:蓋板 21a:內表面 21b:外表面 211:第一端 212:第二端 22:散熱鰭片組 23:輔助散熱凸部 3:導熱器 3a:內表面 3b:外表面 31:多孔結構區 32:加強熱交換部 4:相變化液 5:機殼 51:第一通風口 52:第二通風口 53:第一風扇 54:第二風扇 6:電氣模組 7:加強散熱模組 71:結合框 711:連通槽 72:散熱鰭片組 E:電子裝置 G:熱源 H:高處 L:低處 M:整合式冷卻模組 P:水平面 R:墊圈 S1:上腔室 S2:下腔室 W:內壁 W1,W2:最大寬度 θ,β:夾角 α:下傾角度 ﹝習用﹞ 9:液冷式冷卻模組 91:水冷頭 92:水冷排 93:管件 94:轉向接座 G:熱源 ﹝this invention﹞ 1: tank body 11: Drainage Department 12: Guide slope 13: The first opening 14: Second opening 15: Sidewall 16: Front Wall 17: Guidance Department 17a: Lower block 17b: Upper block 171: Support column 172: Extensions 173: Grooving 18: Grip recess 19: Bottom 191: inner surface 2: Radiator 21: Cover 21a: inner surface 21b: outer surface 211: First End 212: Second End 22: Cooling fin group 23: Auxiliary heat dissipation convex part 3: Heat spreader 3a: inner surface 3b: outer surface 31: Porous Structure Zone 32: Strengthen the heat exchange part 4: Phase change fluid 5: Chassis 51: First vent 52: Second vent 53: The first fan 54: Second fan 6: Electrical module 7: Strengthen the cooling module 71: Binding Box 711: Connecting slot 72: Cooling fin group E: electronic device G: heat source H: high place L: low M: Integrated cooling module P: horizontal plane R: Gasket S1: Upper chamber S2: Lower chamber W: inner wall W1,W2: maximum width θ, β: included angle α: Declination angle ﹝Accustomed ﹞ 9: Liquid-cooled cooling module 91: water cooling head 92: Water cooling row 93: Pipe fittings 94: Steering socket G: heat source

［第1圖］一種習知液冷式冷卻模組圖。［第2圖］本發明第一實施例的分解立體圖。［第3圖］本發明第一實施例的組合側剖圖。［第4圖］沿第3圖的A-A線剖面圖。［第5圖］如第4圖的局部放大圖。［第6圖］本發明第一實施例整合式冷卻模組組裝於電子裝置中的示意圖。［第7圖］如第5圖的本發明第二實施例局部剖視圖。［第8圖］如第5圖的本發明第三實施例局部剖視圖。［第9圖］本發明第四實施例的組合側剖圖。［第10圖］本發明第五實施例的分解立體圖。［第11圖］本發明第五實施例的組合側剖圖。［第12圖］本發明第六實施例的分解立體圖。［第13圖］本發明第六實施例的組合側剖圖。 [Picture 1] A diagram of a conventional liquid-cooled cooling module. [Fig. 2] An exploded perspective view of the first embodiment of the present invention. [Figure 3] A combined side sectional view of the first embodiment of the present invention. [Figure 4] A cross-sectional view along the line A-A in Figure 3. [Picture 5] As shown in the partial enlarged view of Fig. 4. [FIG. 6] A schematic diagram of an integrated cooling module assembled in an electronic device according to the first embodiment of the present invention. [Fig. 7] As shown in Fig. 5, a partial cross-sectional view of the second embodiment of the present invention. [Fig. 8] As shown in Fig. 5, a partial cross-sectional view of the third embodiment of the present invention. [Fig. 9] A combined side sectional view of the fourth embodiment of the present invention. [FIG. 10] An exploded perspective view of a fifth embodiment of the present invention. [FIG. 11] A combined side sectional view of the fifth embodiment of the present invention. [FIG. 12] An exploded perspective view of a sixth embodiment of the present invention. [FIG. 13] A combined side sectional view of the sixth embodiment of the present invention.

1:槽體 1: tank body

11:引流部 11: Drainage Department

12:導引斜面 12: Guide slope

13:第一開口 13: The first opening

14:第二開口 14: Second opening

15:側壁 15: Sidewall

16:前壁 16: Front Wall

17:導引部 17: Guidance Department

18:握持凹部 18: Grip recess

19:底部 19: Bottom

191:內表面 191: inner surface

2:散熱器 2: Radiator

21:蓋板 21: Cover

22:散熱鰭片組 22: Cooling fin group

23:輔助散熱凸部 23: Auxiliary heat dissipation convex part

3:導熱器 3: Heat spreader

3a:內表面 3a: inner surface

3b:外表面 3b: outer surface

31:多孔結構區 31: Porous Structure Zone

32:加強熱交換部 32: Strengthen the heat exchange part

M:整合式冷卻模組 M: Integrated cooling module

R:墊圈 R: Gasket

S1:上腔室 S1: Upper chamber

S2:下腔室 S2: Lower chamber

Claims

一種整合式冷卻模組，包含：一槽體，該槽體內具有相連通的一上腔室及一下腔室，該上腔室內具有一引流部，該引流部銜接該下腔室；一散熱器，結合該槽體並對位於該上腔室；一導熱器，結合該槽體並對位於該下腔室；及一相變化液，填充於該槽體內，液態的相變化液吸收該導熱器的熱能以轉變成氣態，氣態的相變化液將熱能傳遞給該散熱器以冷凝回液態，並沿著該引流部流回該下腔室。 An integrated cooling module comprising: a trough body, the trough body has an upper chamber and a lower chamber that communicate with each other, the upper chamber has a drainage portion, and the drainage portion is connected to the lower chamber; a radiator, combined with the tank body and positioned in the upper chamber; a heat conductor, combined with the tank body and positioned in the lower chamber; and A phase change liquid is filled in the tank. The liquid phase change liquid absorbs the heat energy of the heat conductor to transform into a gaseous state, and the gaseous phase change liquid transfers the heat energy to the radiator to condense back to a liquid state, and flows along the drainage portion. back into the lower chamber.

如請求項1之整合式冷卻模組，其中，該上腔室的最大寬度大於該下腔室的最大寬度。The integrated cooling module of claim 1, wherein the maximum width of the upper chamber is greater than the maximum width of the lower chamber.

如請求項1之整合式冷卻模組，其中，該引流部為該槽體內的至少一導引斜面，該導引斜面的高處位於該上腔室且低處鄰接該下腔室。The integrated cooling module according to claim 1, wherein the drainage portion is at least one guiding inclined surface in the groove body, and the upper portion of the guiding inclined surface is located in the upper chamber and the lower portion is adjacent to the lower chamber.

如請求項3之整合式冷卻模組，其中，該導引斜面與水平面的夾角係大於0度且小於或等於45度。The integrated cooling module of claim 3, wherein the angle between the guide slope and the horizontal plane is greater than 0 degrees and less than or equal to 45 degrees.

如請求項1之整合式冷卻模組，其中，該槽體具有一第一開口對位於該上腔室，該散熱器具有一蓋板封閉該第一開口，該蓋板的內表面朝向該上腔室。The integrated cooling module of claim 1, wherein the tank body has a first opening opposite to the upper chamber, the radiator has a cover plate to close the first opening, and an inner surface of the cover plate faces the upper chamber room.

如請求項5之整合式冷卻模組，其中，該蓋板的外表面連接一散熱鰭片組。The integrated cooling module of claim 5, wherein an outer surface of the cover plate is connected to a set of heat dissipation fins.

如請求項5之整合式冷卻模組，其中，該蓋板的內表面具有數個輔助散熱凸部。The integrated cooling module of claim 5, wherein the inner surface of the cover plate has a plurality of auxiliary heat dissipation protrusions.

如請求項1之整合式冷卻模組，其中，該槽體具有一第二開口對位於該下腔室，該導熱器封閉該第二開口，該導熱器的內表面朝向該下腔室，該導熱器的一外表面裸露於該槽體外並供熱連接一熱源。The integrated cooling module of claim 1, wherein the tank body has a second opening opposite to the lower chamber, the heat conductor closes the second opening, the inner surface of the heat conductor faces the lower chamber, the An outer surface of the heat conductor is exposed outside the tank and is connected to a heat source for heat supply.

如請求項1之整合式冷卻模組，其中，該散熱器與該導熱器呈非平行設置。The integrated cooling module of claim 1, wherein the heat sink and the heat conductor are arranged non-parallel.

如請求項9之整合式冷卻模組，其中，該散熱器位於該槽體的頂端且位於一XY平面，該導熱器位於該槽體的側端且位於一YZ平面。The integrated cooling module of claim 9, wherein the heat sink is located at the top end of the tank body and located in an XY plane, and the heat conductor is located at a side end of the tank body and located in a YZ plane.

如請求項10之整合式冷卻模組，其中，該槽體具有一第一開口及一第二開口，該散熱器由一蓋板封閉該第一開口，該導熱器封閉該第二開口，該第一開口與該第二開口在X方向上不重疊。The integrated cooling module of claim 10, wherein the tank body has a first opening and a second opening, the radiator is closed by a cover plate the first opening, the heat conductor closes the second opening, the The first opening and the second opening do not overlap in the X direction.

如請求項1之整合式冷卻模組，其中，該導熱器的內表面具有一多孔結構區，該多孔結構區至少有局部接觸該相變化液。The integrated cooling module of claim 1, wherein the inner surface of the heat conductor has a porous structure area, and the porous structure area at least partially contacts the phase change liquid.

如請求項12之整合式冷卻模組，其中，該導熱器具有數個加強熱交換部凸出或凹陷於該多孔結構區。The integrated cooling module of claim 12, wherein the heat conductor has a plurality of enhanced heat exchange parts protruding or recessed from the porous structure region.

如請求項1之整合式冷卻模組，其中，該槽體形成該下腔室的部位具有二側壁連接一前壁，該前壁與該導熱器相對，該前壁與水平面的夾角係大於0度且小於90度。The integrated cooling module of claim 1, wherein the part of the groove body forming the lower chamber has two side walls connected to a front wall, the front wall is opposite to the heat conductor, and the angle between the front wall and the horizontal plane is greater than 0 degrees and less than 90 degrees.

如請求項1之整合式冷卻模組，其中，該下腔室的底部內表面朝該導熱器下傾。The integrated cooling module of claim 1, wherein the bottom inner surface of the lower chamber is inclined downward toward the heat conductor.

如請求項1之整合式冷卻模組，其中，該槽體形成該下腔室的部位具有二側壁連接一前壁，該前壁與該導熱器相對，該二側壁在鄰近該前壁處分別形成一握持凹部。The integrated cooling module of claim 1, wherein the part of the groove body forming the lower chamber has two side walls connected to a front wall, the front wall is opposite to the heat conductor, and the two side walls are adjacent to the front wall respectively. A holding recess is formed.

如請求項1之整合式冷卻模組，其中，該槽體內具有至少一導引部較鄰近該導熱器且較遠離該散熱器。The integrated cooling module of claim 1, wherein the groove body has at least one guide portion that is closer to the heat conductor and farther away from the heat sink.

如請求項1之整合式冷卻模組，其中，該槽體具有一第一開口及一第二開口，該散熱器由一蓋板封閉該第一開口，該導熱器封閉該第二開口，該第一開口的面積大於該第二開口的面積。The integrated cooling module of claim 1, wherein the tank body has a first opening and a second opening, the radiator is closed by a cover plate to close the first opening, the heat conductor closes the second opening, the The area of the first opening is larger than that of the second opening.

如請求項1之整合式冷卻模組，其中，該引流部為該槽體內的二導引斜面，該二導引斜面的高處位於該上腔室，該下腔室對位在該二導引斜面的低處之間。The integrated cooling module of claim 1, wherein the flow guiding portion is two guide slopes in the tank, the heights of the two guide slopes are located in the upper chamber, and the lower chamber is aligned on the two guide slopes. between the lower part of the lead slope.

如請求項19之整合式冷卻模組，其中，該散熱器具有一蓋板，該蓋板的內表面朝向該上腔室，並由該下腔室相對處往外周下傾。The integrated cooling module of claim 19, wherein the radiator has a cover plate, the inner surface of the cover plate faces the upper chamber, and is inclined downward from the lower chamber opposite to the outer periphery.

如請求項20之整合式冷卻模組，其中，該蓋板的內表面的下傾角度係大於0度且小於或等於5度。The integrated cooling module of claim 20, wherein the downward inclination angle of the inner surface of the cover plate is greater than 0 degrees and less than or equal to 5 degrees.

如請求項21之整合式冷卻模組，其中，該蓋板的外表面形成平面狀。The integrated cooling module of claim 21, wherein the outer surface of the cover plate is formed into a plane shape.

如請求項1之整合式冷卻模組，其中，該散熱器由一蓋板封閉該槽體的一第一開口，該蓋板的內表面朝向該上腔室，該內表面具有一第一端及一第二端，該第一端較鄰近該導熱器，該第二端較遠離該導熱器，該內表面由該第一端朝該第二端下傾。The integrated cooling module of claim 1, wherein the radiator is closed by a cover plate to close a first opening of the tank body, an inner surface of the cover plate faces the upper chamber, and the inner surface has a first end and a second end, the first end is closer to the heat conductor, the second end is farther away from the heat conductor, and the inner surface is inclined downward from the first end toward the second end.

如請求項1之整合式冷卻模組，其中，該槽體內具有一導引部由該導熱器往該散熱器延伸，用以使氣態的相變化液沿著該槽體的內壁與該導引部之間的空間流入該上腔室，冷凝回液態的相變化液沿著該槽體的內壁與該導引部之間的空間流回該下腔室的底部。The integrated cooling module of claim 1, wherein the tank body has a guide portion extending from the heat conductor to the radiator, so that the gaseous phase change liquid is connected to the guide portion along the inner wall of the tank body and the guide portion. The space between the guide parts flows into the upper chamber, and the phase change liquid condensed back to the liquid state flows back to the bottom of the lower chamber along the space between the inner wall of the tank body and the guide part.

如請求項24之整合式冷卻模組，其中，該導引部具有至少局部位於該上腔室的一延伸部，該散熱器由一蓋板封閉該槽體的一第一開口，該蓋板抵接該延伸部，該導引部具有一穿槽貫穿該延伸部以供該相變化液循環通過。The integrated cooling module of claim 24, wherein the guide portion has an extension portion located at least partially in the upper chamber, the radiator is closed by a cover plate to close a first opening of the tank body, the cover plate Abutting against the extending portion, the guiding portion has a through groove penetrating the extending portion for the phase change liquid to circulate through.

如請求項25之整合式冷卻模組，其中，該導引部具有一下組塊位於該下腔室，該導引部具有一上組塊抵接該下組塊，該穿槽及該延伸部設於該上組塊。The integrated cooling module of claim 25, wherein the guide portion has a lower block located in the lower chamber, the guide portion has an upper block abutting against the lower block, the through groove and the extension portion set on the upper block.

如請求項24之整合式冷卻模組，另包含一加強散熱模組，該加強散熱模組具有一結合框及一散熱鰭片組，該結合框連接於該槽體，該結合框的一連通槽連通該上腔室，該散熱鰭片組位於該連通槽中，該導引部具有一延伸部，該散熱器由一蓋板結合於該結合框，該蓋板抵接該散熱鰭片組，該散熱鰭片組抵接該延伸部，用以使該相變化液循環通過該散熱鰭片組。The integrated cooling module of claim 24 further comprises an enhanced heat dissipation module, the enhanced heat dissipation module has a combination frame and a set of heat dissipation fins, the combination frame is connected to the groove body, and a communication of the combination frame The groove communicates with the upper chamber, the heat dissipation fin set is located in the communication groove, the guide portion has an extension portion, the heat sink is combined with the combination frame by a cover plate, and the cover plate abuts against the heat dissipation fin set , the heat dissipation fin set is abutted against the extension part, so as to make the phase change liquid circulate through the heat dissipation fin set.

如請求項27之整合式冷卻模組，其中，該結合框與該槽體一體成型相連接。The integrated cooling module of claim 27, wherein the combination frame is integrally connected with the tank body.

如請求項1之整合式冷卻模組，其中，該槽體係以透明或半透明材質製成，該相變化液為有色流體。The integrated cooling module of claim 1, wherein the tank system is made of transparent or translucent material, and the phase change liquid is a colored fluid.

一種電子裝置，包含：一機殼；一電氣模組，位於該機殼內並具有一熱源；及一如請求項1至29中任一項之整合式冷卻模組，設於該機殼內，並由該導熱器熱連接該熱源。 An electronic device comprising: a casing; an electrical module located in the casing and having a heat source; and An integrated cooling module as claimed in any one of claims 1 to 29, disposed in the casing, and thermally connected to the heat source by the heat conductor.

如請求項30之電子裝置，其中，該機殼具有一第一通風口及一第二通風口，該散熱器相對的二端分別朝向該第一通風口及該第二通風口。The electronic device of claim 30, wherein the casing has a first vent and a second vent, and opposite ends of the heat sink face the first vent and the second vent, respectively.

如請求項31之電子裝置，其中，該機殼具有一第一風扇設於該第一通風口，該機殼具有一第二風扇設於該第二通風口，該第一風扇朝該散熱器吹風，該第二風扇將該機殼內的空氣抽出至外界。The electronic device of claim 31, wherein the casing has a first fan disposed in the first vent, the casing has a second fan disposed in the second vent, the first fan facing the heat sink For blowing, the second fan draws out the air in the casing to the outside.