TW202227371A - Scribing method for bonded brittle substrate with terminal - Google Patents
Scribing method for bonded brittle substrate with terminal Download PDFInfo
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- TW202227371A TW202227371A TW110142846A TW110142846A TW202227371A TW 202227371 A TW202227371 A TW 202227371A TW 110142846 A TW110142846 A TW 110142846A TW 110142846 A TW110142846 A TW 110142846A TW 202227371 A TW202227371 A TW 202227371A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
Description
本發明係關於一種顯示器（display）用脆性基板的加工方法，更詳而言之，係關於一種不使對於接合脆性基板端部之端子部的切割產生不良之具有端子部的接合脆性基板之刻劃方法。The present invention relates to a method of processing a brittle substrate for a display, and more specifically, to a bonding brittle substrate having a terminal portion that does not cause defects in cutting of the terminal portion for the end portion of the bonding brittle substrate plan method.
已知有一種將包括有玻璃基板的薄型脆性基板切斷為必要之大小的方法，該方法以切劃（dicing ）和刻劃（scribing）的二種方法為代表。切劃係以鑽石刀將基板的表面予以切削而形成溝者，刻劃係以刻劃輪（scribing wheel）在基板的表面形成刻劃線而使之產生厚度方向的裂縫（crack）者。There is known a method of cutting a thin brittle substrate including a glass substrate to a necessary size, and this method is represented by two methods of dicing and scribing. Scribing refers to cutting the surface of the substrate with a diamond knife to form grooves, and scribing refers to forming scribe lines on the surface of the substrate with a scribing wheel to generate cracks in the thickness direction.
再者，在使用脆性基板的製品中，亦有使用接合脆性基板者。例如，液晶顯示面板係具有在一側的基板形成彩色濾光片（filter），且在另一側的基板形成TFT（thin-film transistor，薄膜電晶體），且於兩側的基板之間注入液晶再予以接合而成的構造。Furthermore, in products using a brittle substrate, there are also those using a bonding brittle substrate. For example, a liquid crystal display panel has a color filter (filter) formed on one side of the substrate, and a TFT (thin-film transistor, thin-film transistor) formed on the other side of the substrate, and injected between the two sides of the substrate. A structure in which liquid crystals are joined together.
不過，如圖1所示，由於接合脆性基板係在基板的一側具備有端子部（13a），故若在切斷時未特別注意，則大多會有端子部破裂，而將無法再使用該接合脆性基板的情形。However, as shown in FIG. 1 , since the bonding brittle substrate is provided with a terminal portion (13a) on one side of the substrate, if special attention is not paid during cutting, the terminal portion will be broken in many cases, and it will no longer be used. When joining brittle substrates.
圖1係用以說明對於接合脆性基板（10）之習知之刻劃方法之問題點的圖式。FIG. 1 is a diagram for explaining a problem with a conventional scribing method for bonding a brittle substrate (10).
如圖所示，接合脆性基板（10）係具有下板（15）和上板（13）的層積構造。另外，端子部（13a）係位於上板（13）的一端部。端子部（13a）係從平台（table）（T）浮起相應於下板（15）之厚度程度的狀態。As shown in the figure, the joint brittle substrate (10) has a laminated structure of a lower plate (15) and an upper plate (13). In addition, the terminal part (13a) is located at one end of the upper plate (13). The terminal portion (13a) is lifted from the table (T) corresponding to the thickness of the lower plate (15).
為了要在具有前述構造的接合脆性基板（10）上形成刻劃線，係在使刻劃輪（19）就定位於接合脆性基板（10）的上部一側，且使刻劃輪（19）朝下部推壓的同時，使之朝向端子部（13a）往箭頭a方向移動。In order to form a scribe line on the bonding brittle substrate (10) having the aforementioned structure, the scribing wheel (19) is positioned on the upper side of the bonding brittle substrate (10), and the scribing wheel (19) While pressing downward, move it in the direction of arrow a toward the terminal part (13a).
不過，此種方法具有製作上的問題。其原因在於當刻劃輪（19）行進於端子部（13a）的上部時，端子部（13a）會向下部彎折而產生破裂，或者，會在端子部（13a）上無法正確地形成刻劃線之故。However, this method has manufacturing problems. The reason for this is that when the scoring wheel (19) travels on the upper part of the terminal part (13a), the terminal part (13a) is bent downward and cracked, or the terminal part (13a) cannot be correctly formed with a score. Because of the line.
由於此情形，發明專利文獻1係揭示有一種貼合基板的刻劃方法和刻劃裝置。所揭示的刻劃方法係一種將第一基板之端緣部的一部分切除，且在第二基板的端緣部形成有端子區域的貼合基板，使用彼此相對向的二個切割輪（cutter wheel）朝端子區域的方向進行刻劃，藉此在基板的上下面加工分割用之刻劃線之貼合基板的刻劃方法，該方法係具有下列步驟：使刻劃具有端子區域之第二基板的第二切割輪在到達端子區域之終端位置的附近前，使之沿著與第二基板之表面平行的行進線移動行進，而從端子區域之終端位置的附近至端子區域的終端位置為止，則使之行進為從端子區域的表面逐漸遠離，當到達端子區域的終端位置時，即以零停止時間使之瞬間地從端子區域退開。然而，在發明專利文獻1所揭示的技術中，會有不足以獲得良品的問題。 [先前技術文獻] [發明專利文獻] In view of this situation, Invention Patent Document 1 discloses a scribing method and a scribing apparatus for a bonded substrate. The disclosed scribing method is a bonding substrate in which a part of the edge portion of the first substrate is cut off and a terminal area is formed on the edge portion of the second substrate, using two cutter wheels facing each other. ) scribing in the direction of the terminal area, whereby the upper and lower sides of the substrate are processed with a scribe line for dividing a substrate and a scribing method, the method has the following steps: scribing the second substrate having the terminal area The second cutting wheel moves along a travel line parallel to the surface of the second substrate before reaching the vicinity of the terminal position of the terminal area, and from the vicinity of the terminal position of the terminal area to the terminal position of the terminal area, Then it is made to travel gradually away from the surface of the terminal area, and when it reaches the terminal position of the terminal area, it is instantly withdrawn from the terminal area with zero stop time. However, in the technique disclosed in Invention Patent Document 1, there is a problem that a good product cannot be obtained. [Prior Art Literature] [Invention Patent Documents]
發明專利文獻1：韓國公開發明專利公報第10-2019-0078494號（貼合基板的刻劃方法和刻劃裝置）Invention Patent Document 1: Korean Laid-Open Patent Publication No. 10-2019-0078494 (Scribing method and scribing device for bonded substrates)
[發明所欲解決之問題][Problems to be Solved by Invention]
本發明係欲解決前述問題而研創者，其目的為提供一種具有端子部的接合脆性基板之刻劃方法，其係藉由控制刻劃輪對於基板的切入深度、荷重調節和行進速度，而能夠形成正確的刻劃線，且可防止端子部的破裂。 [用以解決問題的手段] The present invention has been developed to solve the aforementioned problems, and its object is to provide a scribing method for bonding a brittle substrate with a terminal portion, which is capable of controlling the cutting depth, load adjustment and traveling speed of the scribing wheel to the substrate. Accurate scribe lines are formed, and breakage of the terminal portion can be prevented. [means to solve the problem]
作為用以達成前述目的之問題之解決手段之本發明之具有端子部的接合脆性基板之刻劃方法，係於具有端子部的接合脆性基板上形成刻劃線的方法，該方法係包含下列步驟：區劃設定步驟，係將刻劃輪的行進預定路徑區分為預切割（pre cutting）區間、正式切割區間、和端子部切割區間；輪就定位步驟，係使刻劃輪定位於前述預切割區間的行進開始點；預切割區間線形成步驟，雖使位於行進開始點的刻劃輪對於接合脆性基板加壓而行進，但加速至成為所設定的速度為止；正式切割區間線形成步驟，係使通過前述預切割區間後的刻劃輪以所設定的速度行進而在正式切割區間形成刻劃線；減速步驟，係在通過前述正式切割區間後的刻劃輪到達端子部之前將刻劃輪的行進速度予以減速，而使其依每個比減速前短的移動距離接收每單位時間輸入的控制信號；及端子部切割區間線形成步驟，係使前述刻劃輪按照在前述減速步驟減速後的行進速度通過端子部切割區間而於端子部形成刻劃線。The method for scribing a bonding brittle substrate having a terminal portion of the present invention as a means for solving the problem for achieving the aforementioned object is a method for forming a scribe line on a bonding brittle substrate having a terminal portion, and the method includes the following steps : The division setting step is to divide the predetermined travel path of the scoring wheel into a pre-cutting section, a formal cutting section, and a terminal cutting section; the wheel positioning step is to position the scoring wheel in the aforementioned pre-cutting section. in the pre-cut section line forming step, although the scribing wheel located at the travel start point is pressed against the bonding brittle substrate to travel, it is accelerated until it reaches the set speed; in the formal cutting section line forming step, the The scoring wheel after passing through the aforementioned pre-cutting section travels at a set speed to form a scoring line in the main cutting section; the deceleration step is to reduce the speed of the scoring wheel after passing through the aforementioned main cutting section before reaching the terminal portion. The traveling speed is decelerated, so that it receives the control signal input per unit time according to each moving distance shorter than that before deceleration; and the step of forming the terminal part cutting section line is to make the scoring wheel decelerate according to the deceleration step. The traveling speed passes through the terminal portion cutting section to form a scribe line on the terminal portion.
另外，前述端子部切割區間線形成步驟係包含下列過程：儲存剛要進入前述端子部之前之刻劃輪的位置，並且將在正式切割區間內的切入量重設為目前位置的切入量，於重設之後，以前述目前位置為基準將要在端子部切割區間賦予的切入量變更至目標位置。In addition, the step of forming the cutting section line of the terminal section includes the following process: storing the position of the scoring wheel just before entering the terminal section, and resetting the cutting amount in the actual cutting section to the cutting amount of the current position, in After the reset, the cutting amount to be given in the terminal portion cutting section is changed to the target position based on the current position.
此外，被賦予至通過前述預切割區間和端子部切割區間之刻劃輪的平均切入量，係為被賦予至在正式切割區間之刻劃輪的切入量以下。In addition, the average cutting amount given to the scoring wheel in the pre-cutting section and the terminal section cutting section is equal to or less than the cutting amount given to the scoring wheel in the main cutting section.
另外，前述刻劃輪在端子部切割區間將接合脆性基板予以加壓的輪荷重，係比在正式切割區間將接合脆性基板予以加壓的輪荷重相對地較大。 [發明之功效] In addition, the wheel load of the scribing wheel for pressing the bonding brittle substrate in the terminal portion cutting section is relatively larger than the wheel load for pressing the bonding brittle substrate in the main cutting section. [Effect of invention]
以前述之方式所進行之本發明之具有端子部的接合脆性基板之刻劃方法，係在刻劃步驟進行期間，控制刻劃輪對於基板的切入深度、荷重調節和行進速度，藉此可形成正確的刻劃線，尤其可透過切入量的多段變更而防止端子部的破裂。The scribing method for a bonded brittle substrate having a terminal portion of the present invention carried out in the manner described above is performed during the scribing step by controlling the cutting depth, load adjustment and travel speed of the scribing wheel to the substrate, thereby forming An accurate scribe line can prevent the breakage of the terminal part especially by changing the cutting amount in multiple stages.
以下參照所附圖式更詳細地說明本發明的一實施例。An embodiment of the present invention is described in more detail below with reference to the accompanying drawings.
本發明的刻劃方法係用以在更有效率地以及不使端子部破損下切斷具有端子部的接合脆性基板者。因此，將在接合脆性基板上之輪的行進預定路徑按區間別區分，以控制性的方法來操控在各區間內之輪的速度、荷重和切入量。The scribing method of the present invention is for cutting a joint brittle substrate having a terminal portion more efficiently and without damaging the terminal portion. Therefore, the predetermined travel path of the wheel on the bonding brittle substrate is divided into sections, and the speed, load and cutting amount of the wheel in each section are controlled in a controlled manner.
如此之刻劃方法的基本構成係在具有端子部的接合脆性基板上形成刻劃線的方法，該方法係包括下列步驟：區劃設定步驟，係將刻劃輪的行進預定路徑區分為預切割區間、正式切割區間、和端子部切割區間；輪就定位步驟，係使刻劃輪定位於前述預切割區間的行進開始點；預切割區間線形成步驟，雖使位於行進開始點的刻劃輪對於接合脆性基板加壓而行進，但加速至成為所設定的速度為止；正式切割區間線形成步驟，係使通過前述預切割區間後的刻劃輪不變化速度地行進而在正式切割區間形成刻劃線；減速步驟，係在通過前述正式切割區間後的刻劃輪到達端子部之前將刻劃輪的行進速度予以減速，而使其依每個比減速前短的移動距離接收每單位時間輸入的控制信號；及端子部切割區間線形成步驟，係使前述刻劃輪按照在前述減速步驟減速後的行進速度通過端子部切割區間而於端子部形成刻劃線。The basic structure of such a scribing method is a method of forming a scribing line on a joint brittle substrate having a terminal portion, and the method includes the following steps: a division setting step of dividing the predetermined travel path of the scribing wheel into pre-cut sections. , the formal cutting section, and the terminal section cutting section; the wheel positioning step is to position the scoring wheel at the travel start point of the preceding pre-cut section; the pre-cut section line forming step, although the scoring wheel located at the travel start point is The joint brittle substrate is pressed and traveled, but is accelerated until it reaches the set speed; in the step of forming the line in the main dicing section, the scribing wheel after passing through the pre-cutting section does not change its speed to form a scribe in the main dicing section. Line; the deceleration step is to decelerate the travel speed of the scoring wheel before reaching the terminal part after passing through the aforementioned formal cutting interval, so that it receives the input per unit time for each moving distance shorter than that before the deceleration. The control signal; and the step of forming a terminal portion cutting section line, make the scribe wheel pass through the terminal section cutting section according to the traveling speed after deceleration in the aforementioned decelerating step to form a scribe line on the terminal section.
圖2係顯示本發明之一實施例之具有端子部的接合脆性基板之刻劃方法的方塊圖，圖3係用以說明在刻劃方法中之區劃設定步驟之接合脆性基板的側視圖。另外，圖4係將本發明之一實施例之刻劃方法予以圖形化進行顯示的圖式。FIG. 2 is a block diagram showing a scribing method for a bonding brittle substrate with terminal portions according to an embodiment of the present invention, and FIG. 3 is a side view of the bonding brittle substrate for explaining a division setting step in the scribing method. In addition, FIG. 4 is a diagram showing a scribing method according to an embodiment of the present invention in a graphic form.
如圖所示，本實施例之具有端子部的接合脆性基板之刻劃方法係包含：區劃設定步驟（101）、輪就定位步驟（103）、預切割區間線形成步驟（105）、正式切割區間線形成步驟（107）、減速步驟（109）、端子部切割區間線形成步驟（111）、及輪上升步驟（113）。As shown in the figure, the scribing method for a bonded brittle substrate with a terminal portion of this embodiment includes: a division setting step (101), a wheel positioning step (103), a pre-cut section line forming step (105), and a formal cutting step. A section line forming step ( 107 ), a deceleration step ( 109 ), a terminal portion cutting section line forming step ( 111 ), and a wheel ascending step ( 113 ).
區劃設定步驟（101）係將刻劃輪（19）的行進預定路徑區分為預切割區間（A）、正式切割區間（B）、及端子部切割區間（C）的過程。The division setting step ( 101 ) is a process of dividing the planned travel path of the scoring wheel ( 19 ) into a pre-cutting section (A), an actual cutting section (B), and a terminal portion cutting section (C).
如此之區劃設定係藉由對於設置於刻劃裝置的控制器輸入設定值來進行。亦即，為由作業者將從接合脆性基板（10）的一端部至數mm地點為止決定為預切割區間（A），及將從預切割區間至特定地點為止決定為正式切割區間（B），且將所決定的值予以輸入者。各區間的長度係被決定為依據接合脆性基板（10）的大小、形狀、材質特性等而不同。Such division setting is performed by inputting a set value to a controller provided in the scribing apparatus. That is, the operator determines the pre-cut section (A) from one end of the bonding brittle substrate ( 10 ) to a point of several mm, and the pre-cut section to a specific point is determined as the main cut section (B) , and the determined value is given to the inputter. The length of each section is determined to be different depending on the size, shape, material properties, and the like of the bonding brittle substrate ( 10 ).
然而，預切割區間（A）的距離，較佳為設定為刻劃輪（19）之總行進距離（L）的5%以下。例如，若總行進距離為500mm，則設定為25mm以下。However, the distance of the pre-cut section (A) is preferably set to be 5% or less of the total travel distance (L) of the scoring wheel (19). For example, if the total travel distance is 500 mm, it is set to 25 mm or less.
預切割區間（A）係刻劃輪（19）進入正式切割區間（B）之前所行進的準備區間。The pre-cutting section (A) is a preparation section that the scoring wheel (19) travels before entering the actual cutting section (B).
此外，正式切割區間（B）係在端子部（13a）開始之地點之前結束。亦即，正式切割區間（B）與端子部切割區間（C）的交界線位於端子部（13a）之上游側之前。所謂上游係指刻劃輪（19）接近而來的方向。使正式切割區間（B）與端子部切割區間（C）之交界地點位於端子部之上游側之前的理由，係考慮到讓刻劃輪可在減速的狀態下進入端子部（13a）。In addition, the actual cutting section (B) ends before the point where the terminal portion (13a) starts. That is, the boundary line between the main cutting section (B) and the terminal section cutting section (C) is located before the upstream side of the terminal section (13a). The so-called upstream refers to the direction from which the scoring wheel (19) approaches. The reason why the boundary point between the main cutting section (B) and the terminal section cutting section (C) is located before the upstream side of the terminal section is to allow the scoring wheel to enter the terminal section (13a) in a decelerated state.
只要通過前述區劃設定步驟（101）決定了預切割區間（A）、正式切割區間（B）、和端子部切割區間（C），接著就是輪就定位步驟（103）。Once the pre-cutting section (A), the actual cutting section (B), and the terminal section cutting section (C) are determined by the aforementioned section setting step (101), the wheel positioning step (103) follows.
輪就定位步驟（103）係使刻劃輪（19）位於預切割區間（A）之行進開始點的過程。刻劃輪（19）係設置於刻劃裝置的頭部上且形成為上升或下降。The wheel positioning step (103) is the process of positioning the scoring wheel (19) at the travel start point of the pre-cut section (A). The scoring wheel (19) is provided on the head of the scoring device and is formed to rise or fall.
接續的預切割區間線形成步驟（105）係使刻劃輪（19）出發而於預切割區間（A）形成刻劃線的過程。亦即，使位於行進開始點的刻劃輪（19）在接合脆性基板（10）上加壓使之加速行進。The subsequent step ( 105 ) of forming a pre-cut section line is a process of starting the scoring wheel ( 19 ) to form a scoring line in the pre-cut section (A). That is, the scribing wheel (19) at the starting point of travel is pressed against the joint brittle substrate (10) to accelerate the travel.
在預切割區間線形成步驟（105）中，包含有加速過程（105a）、切入量一次調整過程（105b）、輪荷重一次調整過程（105c）。加速過程（105a）係使刻劃輪（19）的移動速度增加，而將速度為0mm/s之刻劃輪（19）的速度加速為在正式切割區間（B）之行進速度的過程。在正式切割區間（B）之刻劃輪（19）的速度係可為例如300mm/s。In the step ( 105 ) of forming the pre-cut section line, an acceleration process ( 105 a ), a first adjustment process of the cutting amount ( 105 b ), and a first adjustment process of the wheel load ( 105 c ) are included. The acceleration process (105a) is a process of increasing the moving speed of the scoring wheel (19), and accelerating the speed of the scoring wheel (19) with a speed of 0 mm/s to the traveling speed in the actual cutting section (B). The speed of the scoring wheel ( 19 ) in the actual cutting interval (B) may be, for example, 300 mm/s.
切入量一次調整過程（105b）係調整在預切割區間（A）內之切入量的過程。切入量係刻劃輪（19）之輪軸的最大可能下降深度。亦即，在將接合脆性基板（10）的表面定為0時，輪軸可下降的最大深度。切入量係依據接合脆性基板（10）的厚度而有不同，可為例如（圖形上）-0.02mm。The primary adjustment process (105b) of the cutting amount is a process of adjusting the cutting amount within the pre-cutting interval (A). The amount of cut is the maximum possible descent depth of the axle of the scoring wheel (19). That is, when the surface of the bonding brittle substrate (10) is set as 0, the maximum depth that the axle can descend. The cut-in amount varies depending on the thickness of the joint brittle substrate (10), and can be, for example, (graphically) -0.02 mm.
切入量係經由對於控制器輸入切入量來設定。亦即，當對於控制器輸入0.02時，輪軸的最大可能下降深度即被設定為自接合脆性基板（10）的表面起算0.02mm下的地點。若將切入量設定為比接合脆性基板（10）的厚度還大的值，則輪軸就變成可穿透平台（T）的表面而下降至下部。The cut-in amount is set by inputting the cut-in amount to the controller. That is, when 0.02 is input to the controller, the maximum possible descending depth of the axle is set to a point below 0.02 mm from the surface where the brittle substrate (10) is joined. If the cut-in amount is set to a value larger than the thickness of the bonding brittle substrate (10), the axle can penetrate the surface of the platform (T) and descend to the lower part.
所輸入的切入量係依據接合脆性基板（10）的狀態來決定。例如，當預切割區間（A）內的接合脆性基板（10）較薄或較弱時則降低切入深度。反之，若預切割區間（A）之內部之接合脆性基板的厚度較厚而被堅固地支撐於平台上，則可將切入深度設定為較深（增大切入量）。切入深度愈深，則實際上刻劃輪（19）可下降的深度就愈深。此切入量係可視需要而進行多段調整。The input cut-in amount is determined according to the state of bonding the brittle substrate (10). For example, when the bonding brittle substrate ( 10 ) in the pre-cut section (A) is thin or weak, the cutting depth is reduced. Conversely, if the thickness of the bonding brittle substrate inside the pre-cut section (A) is thick and is firmly supported on the platform, the cutting depth can be set to be deep (increasing the cutting amount). The deeper the cut, the deeper the scoring wheel (19) can actually be lowered. This cut-in amount can be adjusted in multiple stages as needed.
輪荷重一次調整過程（105c）係調整施加於輪軸之加壓力的過程。亦即，為調整刻劃輪（19）推壓接合脆性基板（10）之力的過程。輪荷重的調整係不同於切入量的調整。其為通過控制器而獨立地輸入切入量和輪荷重者。然而，不能夠使輪荷重大幅增加，而使因為所設定的輪荷重所可下降的深度比所設定的切入量更大。A wheel load adjustment process (105c) is a process of adjusting the pressing force applied to the wheel axle. That is, it is a process of adjusting the force with which the scoring wheel (19) pushes and joins the brittle substrate (10). The adjustment of the wheel load is different from the adjustment of the cut-in amount. It is through the controller that the cut-in amount and the wheel load are input independently. However, the wheel load cannot be greatly increased, and the depth that can be lowered by the set wheel load cannot be made larger than the set cut-in amount.
被賦予至通過預切割區間（A）和後述之端子部切割區間（C）之刻劃輪的平均切入量，係比在正式切割區間（B）的切入量相對地較少。The average cutting amount given to the scribing wheel passing through the pre-cutting section (A) and the terminal part cutting section (C) described later is relatively smaller than the cutting amount in the main cutting section (B).
可通過輪荷重一次調整過程（105c）適當地控制在預切割區間（A）內的輪荷重。例如，為了減輕在切割開始的瞬間施加於接合脆性基板（10）上的應力（stress），亦可施加比在正式切割區間（B）預定的輪荷重小的輪荷重，或者（依據接合脆性基板的大小或形狀），可施加比在正式切割區間之輪荷重相對地較大的輪荷重。輪荷重愈大，則刻劃線的深度愈深。The wheel load within the pre-cut section (A) can be appropriately controlled through the wheel load one-time adjustment process (105c). For example, in order to reduce the stress applied to the joint brittle substrate (10) at the moment when cutting starts, a wheel load smaller than the wheel load predetermined in the main cutting section (B) may be applied, or (depending on the joint brittle substrate) size or shape), a relatively larger wheel load can be applied than in the formal cutting section. The greater the wheel load, the deeper the scribed line.
正式切割區間線形成步驟（107）係使通過預切割區間（A）後的刻劃輪（19）定速行進於正式切割區間（B）的過程。進入正式切割區間（B）後的刻劃輪（19），係無速度變化地經過正式切割區間（B）而進入端子部切割區間（C）。The main cutting section line forming step (107) is a process in which the scoring wheel (19) after passing through the pre-cutting section (A) travels at a constant speed in the main cutting section (B). The scoring wheel ( 19 ) after entering the main cutting section (B) passes through the main cutting section (B) without changing the speed and enters the terminal part cutting section (C).
另外，在正式切割區間（B）內的切入量係比在預切割區間（A）內的平均切入量大。另外，在預切割區間（A）與正式切割區間（B）之交界線的切入量，係與在正式切割區間（B）內的切入量相同。刻劃輪（19）係在超過預切割區間（A）與正式切割區間（B）之交界線的期間，藉由控制器的控制而增加了切入量。In addition, the cutting amount in the main cutting section (B) is larger than the average cutting amount in the pre-cutting section (A). In addition, the cutting amount in the boundary line between the pre-cutting section (A) and the main cutting section (B) is the same as the cutting amount in the main cutting section (B). When the scoring wheel (19) exceeds the boundary line between the pre-cutting section (A) and the actual cutting section (B), the cutting amount is increased by the control of the controller.
此外，在正式切割區間（B）的輪荷重係可比在預切割區間（A）或端子部切割區間（C）之輪荷重小。例如，若在預切割區間（A）與端子部切割區間（C）的輪荷重分別為6N和7N，則在正式切割區間（B）的輪荷重可為5N。然而，在各區間之輪荷重的大小，係可依據接合脆性基板（10）的厚度或各區間的長度而不同。In addition, the wheel load in the actual cutting section (B) may be smaller than the wheel load in the pre-cutting section (A) or the terminal cutting section (C). For example, if the wheel loads in the pre-cutting section (A) and the terminal section cutting section (C) are 6N and 7N, respectively, the wheel load in the actual cutting section (B) can be 5N. However, the magnitude of the wheel load in each section may be different depending on the thickness of the joint brittle substrate (10) or the length of each section.
刻劃輪（19）藉由維持前述的速度、輪荷重和切入量且通過正式切割區間（B），而在正式切割區間（B）形成刻劃線。The scoring wheel (19) forms a scoring line in the actual cutting section (B) by maintaining the aforementioned speed, wheel load and cutting amount and passing through the actual cutting section (B).
接續的減速步驟（109）係於通過正式切割區間（B）後之刻劃輪到達端子部之前，使刻劃輪之行進速度減速的過程。亦即，使刻劃輪（19）在減速區間（E）內減速。減速區間（E）係正式切割區間（B）和端子部切割區間（C）的交界線與下板（15）結束之地點之間的區間。端子部（13a）係從下板（15）結束的地點開始。刻劃輪（19）之減速後的速度係依據接合脆性基板（10）的狀態而不同，可為例如8mm/s。The subsequent deceleration step ( 109 ) is a process of decelerating the traveling speed of the scoring wheel before the scoring wheel reaches the terminal part after passing through the main cutting section (B). That is, the scoring wheel (19) is decelerated within the deceleration section (E). The deceleration section (E) is the section between the boundary line between the main cutting section (B) and the terminal section cutting section (C) and the point where the lower plate (15) ends. The terminal part (13a) starts from the point where the lower plate (15) ends. The speed after deceleration of the scoring wheel ( 19 ) varies depending on the state of bonding the brittle substrate ( 10 ), and may be, for example, 8 mm/s.
如此，之所以使刻劃輪（19）之速度減速的理由，係為了使之按照比減速前短的每一移動距離各接收一次每單位時間輸入的控制信號之故。As described above, the reason for decelerating the speed of the scoring wheel (19) is to make it receive a control signal input per unit time for each moving distance shorter than that before deceleration.
通常，在刻劃裝置中的控制器係以掃描單位不間歇地輸出控制信號。一掃描係例如為100ms的時間。控制器係於100ms的時間內，另外，以100ms的時間周期輸出所需的控制信號。此種控制信號的輸出，係獨立於刻劃輪（19）的移動速度。通過一定距離之刻劃輪（19）的移動速度愈快，傳遞至刻劃輪之控制信號的接收次數就愈減少。控制信號的接收次數愈減少，當然裝置的動作精密性就愈劣化。Generally, a controller in a scribing apparatus outputs a control signal without interruption in scan units. A scan is, for example, a time of 100 ms. The controller outputs the required control signal in a time period of 100ms, in addition, in a time period of 100ms. The output of this control signal is independent of the moving speed of the scoring wheel (19). The faster the movement of the scoring wheel (19) over a certain distance, the less the number of receptions of the control signal transmitted to the scoring wheel. As the number of times the control signal is received decreases, the precision of the operation of the device naturally deteriorates.
例如，若刻劃輪（19）於100ms之間通過100mm之長度的路徑，則在刻劃輪中只會接收到一次的控制信號（在偶然一致的情形下，雖可在0mm地點和100mm地點接收到二次的信號，但該情形不列於討論範圍）。For example, if the scoring wheel (19) passes a path of length 100 mm between 100 ms, the control signal will only be received once in the scoring wheel (in the case of accidental coincidence, although it may be at the 0 mm point and the 100 mm point A secondary signal is received, but this situation is beyond the scope of this discussion).
相較於此情形，若刻劃輪（19）於10秒之間通過100mm的長度，則會於10秒之間接收100次的控制信號。此即所謂在刻劃輪些許移動的狀態下接收控制信號，且在更些許移動之後接收控制信號的方式。如此，藉由頻繁地接收控制信號，當然動作精密性獲得提升。In contrast to this situation, if the scoring wheel (19) passes through the length of 100mm in 10 seconds, the control signal will be received 100 times in 10 seconds. This is a so-called method of receiving a control signal while the scribing wheel has moved a little, and receiving a control signal after moving a little more. In this way, by frequently receiving control signals, of course, the precision of movement is improved.
在本實施例的減速步驟（109）係用以使即將進入至端子部（13a）之刻劃輪（19）的行進速度下降，而使在端子部（13a）之刻劃輪（19）的控制精密度提升。使控制精密度提升的理由，係為了防止端子部（13a）的破裂，且具體實現在端子部（13a）之刻劃線的清晰性之故。The deceleration step ( 109 ) in this embodiment is to reduce the traveling speed of the scoring wheel ( 19 ) that is about to enter the terminal portion ( 13 a ), so that the speed of the scoring wheel ( 19 ) at the terminal portion ( 13 a ) is reduced. Control precision improved. The reason for improving the control precision is to prevent the breakage of the terminal portion (13a) and to realize the clarity of the scribed line in the terminal portion (13a).
端子部切割區間線形成步驟（111）係包含有切入量二次調整過程（111a）和輪荷重二次調整過程（111b）。依情形而定，亦可予以省略輪荷重二次調整過程（111b）。The step ( 111 ) of forming the cutting section line of the terminal part includes a second adjustment process ( 111 a ) of the cutting amount and a second adjustment process ( 111 b ) of the wheel load. Depending on the situation, the wheel load secondary adjustment process (111b) may also be omitted.
切入量二次調整過程（111a）係儲存剛要進入端子部之前之刻劃輪（19）的位置，且將在正式切割區間（B）內的切入量重設於目前位置，於重設之後，以刻劃輪（19）的目前位置（剛要進入端子部之前的位置）為基準，將要在端子部切割區間（C）賦予的切入量變更至目標位置的過程。The second adjustment process (111a) of the cutting amount is to store the position of the scoring wheel (19) just before entering the terminal part, and reset the cutting amount in the formal cutting interval (B) to the current position, after the reset , the process of changing the cutting amount to be given in the terminal part cutting section (C) to the target position based on the current position of the scoring wheel (19) (the position just before entering the terminal part).
進行切入量二次調整過程（111a）的理由，當然是為了調節刻劃輪（19）滲透接合脆性基板（10）的深度，以獲得在端子部（13a）之良好的切割線之故。The reason for performing the second adjustment process (111a) of the incision amount is, of course, to adjust the depth of the scribing wheel (19) infiltrating the brittle substrate (10) to obtain a good cutting line at the terminal part (13a).
另外，如前所述，藉由在剛要進入端子部切割區間（C）之前以目前位置為基準調整切入量，即可不受到平台或接合脆性基板（10）之平坦度之參差不齊的影響。此係由於例如多數個刻劃頭同時形成多數條平行的刻劃線之際，可按照各刻劃頭別以刻劃輪的目前位置為基準調整端子部（13a）的切入量，亦即目標位置之故。In addition, as mentioned above, by adjusting the cutting amount based on the current position just before entering the terminal portion cutting section (C), the unevenness of the flatness of the platform and the bonding brittle substrate (10) can be avoided. . This is because, for example, when a plurality of scribing heads form a plurality of parallel scribing lines at the same time, the cutting amount of the terminal portion (13a) can be adjusted according to the current position of the scribing wheel according to each scribing head, that is, the target Because of the location.
亦即，不論接合脆性基板（10）的平坦度是否參差不齊，刻劃精密性都會變得均等。換言之，當要在預切割區間等以基板的表面位置為基準設定在端子部切割區間（C）的切入量時，於端子部切割時各刻劃頭的刻劃輪滲透至端子部的深度雖有可能隨著基板的平坦度而改變，但以本實施例之情形而言，即使是應用複數個刻劃頭的裝備，也不會受到接合脆性基板（10）之平坦度的影響。That is, regardless of whether the flatness of the joint brittle substrate (10) is uneven, the scribe precision becomes uniform. In other words, when setting the cutting amount in the terminal cutting section (C) based on the surface position of the substrate in the pre-cutting section or the like, the depth of penetration of the scribing wheel of each scribing head into the terminal during cutting of the terminal is not enough. It may vary with the flatness of the substrate, but in the case of this embodiment, even the equipment using a plurality of scribing heads will not be affected by the flatness of the bonding brittle substrate (10).
另外，輪荷重二次調整過程（111b）係使輪荷重上升的過程。在正式切割區間（B）中，由於上板（13）被支撐於下板（15），故即使輪荷重相對地較小也會形成清晰的刻劃線，不過當對於浮在空中的端子部（13a）施加相同的輪荷重時，端子部（13a）即會向下部彈性變形而使刻劃線變淺，或有可能從最初起即無法形成刻劃線。In addition, the wheel load secondary adjustment process (111b) is a process of increasing the wheel load. In the actual cutting section (B), since the upper plate (13) is supported by the lower plate (15), even if the wheel load is relatively small, a clear scribe line will be formed, but when the terminal part floats in the air (13a) When the same wheel load is applied, the terminal portion (13a) elastically deforms downward to make the score line shallower, or the score line may not be formed from the beginning.
輪荷重二次調整過程（111b）係在端子部（13a）之彈性變形的範圍內進行。例如，可在彈性變形的範圍內使於正式切割區間（B）為5N的荷重上升為7N。如此，藉由使輪荷重上升，即可在浮於空中之端子部（13a）的上面亦形成清晰的刻劃線。The wheel load secondary adjustment process (111b) is performed within the range of elastic deformation of the terminal portion (13a). For example, the load which is 5N in the actual cutting section (B) can be raised to 7N within the range of elastic deformation. In this way, by raising the wheel load, a clear scribe line can also be formed on the upper surface of the terminal portion (13a) floating in the air.
接續的輪上升步驟（113）係在對於端子部（13a）之刻劃線的形成完成後，使刻劃輪（19）上升的過程。通過前述輪上升步驟（113）而結束刻劃形成過程。The subsequent wheel raising step ( 113 ) is a process of raising the scoring wheel ( 19 ) after the formation of the scoring line for the terminal portion ( 13 a ) is completed. The scribe forming process is ended by the aforementioned round up step (113).
在本實施例的說明中，雖已列舉了設定於平台（T）之狀態之接合脆性基板（10）之刻劃方式為例進行了說明，但本實施例之刻劃方法當然亦可適用於刻劃輪位於基板之上部和下部的上下同時刻劃方式。In the description of this embodiment, although the scribing method of the bonding brittle substrate (10) set in the state of the platform (T) has been cited as an example, the scribing method of this embodiment can of course also be applied to The scribing wheel is located on the upper and lower sides of the substrate to simultaneously scribe up and down.
綜上雖已通過具體的實施例詳細地說明了本發明，但本發明不限定於前述實施例，在本發明之技術思想的範圍內，可由具有通常知識者進行各種的變更。In conclusion, although the present invention has been described in detail through specific embodiments, the present invention is not limited to the foregoing embodiments, and various modifications can be made by those skilled in the art within the scope of the technical idea of the present invention.
10:接合脆性基板
13:上板
13a:端子部
15:下板
19:刻劃輪
101:區劃設定步驟
103:輪就定位步驟
105:預切割區間線形成步驟
105a:加速過程
105b:切入量一次調整過程
105c:輪荷重一次調整過程
107:正式切割區間線形成步驟
109:減速步驟
111:端子部切割區間線形成步驟
111a:切入量二次調整過程
111b:輪荷重二次調整過程
113:輪上升步驟
A:預切割區間
B:正式切割區間
C:端子部切割區間
E:減速區間
L:總行進距離
T:平台
10: Bonding brittle substrates
13:
圖1係用以說明對於接合脆性基板之習知刻劃方法之問題點的圖式。 圖2係顯示本發明之一實施例之刻劃方法的方塊圖。 圖3係用以說明本發明之一實施例之刻劃方法中之區劃設定步驟之接合脆性基板的側視圖。 圖4係將本發明之一實施例之刻劃方法予以圖形化進行顯示的圖式。 FIG. 1 is a diagram illustrating a problem with a conventional scribing method for bonding brittle substrates. FIG. 2 is a block diagram showing a scribing method according to an embodiment of the present invention. FIG. 3 is a side view of a bonded brittle substrate for illustrating a division setting step in a scribing method according to an embodiment of the present invention. FIG. 4 is a diagram showing a scribing method according to an embodiment of the present invention in a graphic form.
10:接合脆性基板 10: Bonding brittle substrates
13:上板 13: Upper board
13a:端子部 13a: Terminal part
15:下板 15: Lower board
19:刻劃輪 19: Scoring Wheel
A:預切割區間 A: Pre-cut section
B:正式切割區間 B: Formal cutting interval
C:端子部切割區間 C: Terminal cutting section
E:減速區間 E: deceleration zone
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200174506A KR102457343B1 (en) | 2020-12-14 | 2020-12-14 | Scribing method for bonded brittle substrate with terminal |
| KR10-2020-0174506 | 2020-12-14 |
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| Publication Number | Publication Date |
|---|---|
| TW202227371A true TW202227371A (en) | 2022-07-16 |
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| JP (1) | JP2022094318A (en) |
| KR (1) | KR102457343B1 (en) |
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| JP4472112B2 (en) * | 2000-05-10 | 2010-06-02 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus based thereon |
| JP4251203B2 (en) * | 2006-08-29 | 2009-04-08 | セイコーエプソン株式会社 | Method for scribing bonded mother substrate and dividing method for bonded mother substrate |
| JP5387915B2 (en) * | 2009-12-28 | 2014-01-15 | 旭硝子株式会社 | Cutter traveling control method and sheet glass cutting method |
| KR101696719B1 (en) * | 2010-09-13 | 2017-01-16 | 주식회사 탑 엔지니어링 | Scribing method of assembled brittle substrates having steps |
| JP5576516B2 (en) | 2012-03-27 | 2014-08-20 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus for tempered glass substrate |
| JP6384264B2 (en) | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus |
| TWI774883B (en) | 2017-12-26 | 2022-08-21 | 日商三星鑽石工業股份有限公司 | Scribing method and scribing device for bonding substrates |
| JP7032790B2 (en) | 2017-12-29 | 2022-03-09 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing device for bonded boards |
| JP2020050570A (en) * | 2018-09-28 | 2020-04-02 | 三星ダイヤモンド工業株式会社 | Scribing method |
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| CN114620932A (en) | 2022-06-14 |
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