TW202221834A - Picking assembly and operating apparatus using the same - Google Patents

Picking assembly and operating apparatus using the same Download PDF

Info

Publication number
TW202221834A
TW202221834A TW109140981A TW109140981A TW202221834A TW 202221834 A TW202221834 A TW 202221834A TW 109140981 A TW109140981 A TW 109140981A TW 109140981 A TW109140981 A TW 109140981A TW 202221834 A TW202221834 A TW 202221834A
Authority
TW
Taiwan
Prior art keywords
pick
tool
axis
base
pickup
Prior art date
Application number
TW109140981A
Other languages
Chinese (zh)
Other versions
TWI748763B (en
Inventor
張原龍
Original Assignee
鴻勁精密股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鴻勁精密股份有限公司 filed Critical 鴻勁精密股份有限公司
Priority to TW109140981A priority Critical patent/TWI748763B/en
Application granted granted Critical
Publication of TWI748763B publication Critical patent/TWI748763B/en
Publication of TW202221834A publication Critical patent/TW202221834A/en

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)

Abstract

The present invention reveals a picking assembly, having a picker and a base. The picker is configured for picking electronic component. The picker defines a first reference surface and a second reference surface. The picker has a first major axis and a first minor axis defined at the first reference surface. The picker has a noncircular outline at the first reference surface shrinking in dimension from the opposite ends of the first major axis toward the opposite ends of the first minor axis. The picker has an abutting surface shrinking in dimension from the noncircular outline toward the second reference surface. The base has a receiving recess for receiving the picker. The base defines a third reference surface and a fourth reference surface. The base has a third major axis and a third minor axis defined at the third reference surface. The base has a noncircular outline at the third reference surface shrinking in dimension from the opposite ends of the third major axis toward the opposite ends of the third minor axis. The base has an supporting surface shrinking in dimension from the noncircular outline thereof toward the second reference surface. The picker is received in the receiving recess, the abutting surface laying on the supporting surface. The abutting surface and the supporting surface are nonspherical surfaces, prohibiting vertical rotation of the picker. Accuracy of the picker is then enhanced.

Description

拾取機構及其應用之作業設備Pick-up mechanism and its application equipment

本發明提供一種防止拾取具任意水平旋轉之拾取機構。The present invention provides a pick-up mechanism for preventing random horizontal rotation of a pick-up tool.

在現今,拾取機構應用於不同裝置移載及取放電子元件,電子元件日趨微小精密且接點數量繁多,因此,拾取機構之拾取精準度要求相當高。請參閱圖1,拾取機構之本體11內部設有容置孔111,並開設一相通容置孔111之抽氣道112,本體11另於頂端設有長孔113,一拾取件12裝配於本體11之容置孔111,並於一端設有吸嘴121,以供吸附電子元件14,拾取件12之內部設有相通吸嘴121及容置孔111的通氣道122,拾取件12之另一端設有穿孔123,以供軸桿13穿置本體11之長孔113及拾取件12之穿孔123,拾取件12利用軸桿13沿本體11之長孔113作線性位移,進而使拾取件12作緩衝浮動。Nowadays, the pick-up mechanism is used in different devices to transfer and pick up and place electronic components. The electronic components are becoming more and more small and precise with a large number of contacts. Therefore, the picking-up mechanism of the pick-up mechanism requires very high picking accuracy. Referring to FIG. 1 , the main body 11 of the pick-up mechanism is provided with a receiving hole 111 and a suction channel 112 corresponding to the receiving hole 111 is formed. The main body 11 is further provided with a long hole 113 at the top end, and a pick-up member 12 is assembled on the main body 11 . The accommodating hole 111 is provided with a suction nozzle 121 at one end for sucking the electronic components 14 , the pickup 12 is provided with an air passage 122 communicating with the suction nozzle 121 and the accommodating hole 111 , and the other end of the pickup 12 is provided with There is a through hole 123 for the shaft 13 to pass through the long hole 113 of the main body 11 and the through hole 123 of the pickup 12. The pickup 12 uses the shaft 13 to make a linear displacement along the long hole 113 of the main body 11, so that the pickup 12 acts as a buffer float.

惟,本體11之容置孔111與拾取件12間具有滑動餘隙,以及本體11之長孔113與軸桿13間又具有滑動餘隙,此二滑動餘隙導致拾取件12於移載電子元件14之行進過程中,易發生拾取件12帶動電子元件14任意作水平旋轉,尤其對於微小電子元件而言,拾取件12之些微水平旋轉,將導致電子元件14之基準接點無法精準對位測試器(圖未示出)之基準探針,以致電子元件14被誤判為不良品,進而影響測試品質。再者,由於拾取件12與本體11之容置孔111作長直桿與長直孔之組裝配合,當拾取機構之本體11與測試器無法保持平行,或者電子元件14之頂面具有斜度時,拾取件12並無法作垂直向擺動,以致拾取件12無法均勻下壓電子元件14執行測試作業,電子元件14在受力不平均之狀態即會影響測試品質。However, there is a sliding clearance between the accommodating hole 111 of the main body 11 and the pickup 12 , and there is a sliding clearance between the long hole 113 of the main body 11 and the shaft 13 . These two sliding clearances cause the pickup 12 to transfer electrons. During the moving process of the component 14 , it is easy for the pickup 12 to drive the electronic component 14 to rotate horizontally. Especially for tiny electronic components, a slight horizontal rotation of the pickup 12 will cause the reference contacts of the electronic component 14 to fail to be accurately aligned. The reference probe of the tester (not shown in the figure), so that the electronic component 14 is misjudged as a defective product, thereby affecting the test quality. Furthermore, since the pick-up member 12 and the accommodating hole 111 of the main body 11 are assembled and matched with the long straight rod and the long straight hole, when the main body 11 of the pick-up mechanism and the tester cannot be kept parallel, or the top surface of the electronic component 14 has a slope. At this time, the pick-up member 12 cannot swing vertically, so that the pick-up member 12 cannot evenly press the electronic component 14 to perform the test operation, and the uneven force on the electronic component 14 will affect the test quality.

本發明之目的一,提供一種拾取機構,包含拾取具及基座,拾取具以供取放電子元件,並沿軸線界定第一作業面及第二作業面,第一作業面設有第一長軸及第一短軸,並以第一短軸之二端朝向第一長軸之二端設有尺寸漸縮線段而形成一非正圓曲線之第一輪廓,第一作業面朝向第二作業面設有尺寸漸縮之貼接面,基座之容置槽供容置拾取具,並沿軸線界定第三作業面及第四作業面,第三作業面設有第三長軸及第三短軸,並以第三短軸之二端朝向第三長軸之二端設有尺寸漸縮線段而形成一非正圓曲線之第三輪廓,第三作業面朝向第四作業面設有尺寸漸縮之承接面,藉以拾取具與基座作非正圓曲線的相互卡抵而防止任意水平轉動,並使拾取具之貼接面作無餘隙貼合基座之承接面定位,進而提高拾取具之移載精確性。The first object of the present invention is to provide a pick-up mechanism, which includes a pick-up tool and a base, the pick-up tool is used for picking and placing electronic components, and defines a first working surface and a second working surface along an axis, and the first working surface is provided with a first long The shaft and the first short axis are provided with tapered line segments with the two ends of the first short axis facing the two ends of the first long axis to form a first contour of a non-perfect circular curve, and the first working surface faces the second working surface The surface is provided with an abutting surface with a tapered size, the accommodating groove of the base is used for accommodating the pick-up tool, and the third working surface and the fourth working surface are defined along the axis, and the third working surface is provided with a third long axis and a third working surface. The short axis, and the two ends of the third short axis are facing the two ends of the third long axis are provided with dimension tapered line segments to form a third contour of a non-circular curve, and the third working surface is facing the fourth working surface. The tapered bearing surface is used to prevent the pick-up tool and the base from interlocking with non-circular curves to prevent any horizontal rotation, and the abutment surface of the pick-up tool can be positioned to fit the bearing surface of the base without clearance, thereby improving the pick-up. The transfer accuracy of the tool.

本發明之目的二,提供一種拾取機構,更包含給壓器,給壓器配置於拾取具之上方,以供壓抵拾取具,於拾取具取出電子元件時,利用給壓器施壓拾取件,令拾取具之貼接面更加確實貼接基座之承接面而定位,使拾取具於移載行程中保持精確移載電子元件,進而提高拾取效能。The second object of the present invention is to provide a pickup mechanism, further comprising a pressure feeder, the pressure feeder is arranged above the pickup tool for pressing against the pickup tool, and when the pickup tool takes out electronic components, the pressure feeder is used to press the pickup piece , so that the abutting surface of the pick-up tool is more firmly attached to the receiving surface of the base to be positioned, so that the pick-up tool can maintain accurate transfer of electronic components during the transfer process, thereby improving the pick-up efficiency.

本發明之目的三,提供一種拾取機構,其拾取具之貼接面與基座之承接面作尺寸漸縮之斜度配合,而可供拾取具於接觸電子元件時作垂直向擺動,以調整貼接角度,使拾取具均勻壓接電子元件,進而提高測試品質。The third object of the present invention is to provide a pick-up mechanism, in which the abutting surface of the pick-up tool and the receiving surface of the base are matched with a tapered size, so that the pick-up tool can swing vertically when it contacts the electronic components to adjust The attachment angle enables the pick-up tool to evenly crimp the electronic components, thereby improving the test quality.

本發明之目的四,提供一種作業設備,包含機台、供料裝置、收料裝置、作業裝置、輸送裝置及中央控制裝置;供料裝置配置於機台,並設有至少一容納待作業電子元件之供料承置器;收料裝置配置於機台,並設有至少一容納已作業電子元件之收料承置器;作業裝置配置於機台,並設有至少一作業器,以供對電子元件執行預設作業;輸送裝置配置於機台,並設有至少一本發明之拾取機構,以供移載電子元件;中央控制裝置以供控制及整合各裝置作動,而執行自動化作業,達到提升作業效能之實用效益。The fourth object of the present invention is to provide an operation equipment, including a machine, a feeding device, a receiving device, an operating device, a conveying device and a central control device; the feeding device is arranged on the machine, and is provided with at least one accommodating electronic The feeding and receiving device for components; the receiving device is arranged on the machine table, and is provided with at least one receiving and receiving device for accommodating the electronic components that have been processed; the working device is arranged on the machine table, and is provided with at least one operating device The preset operation is performed on the electronic components; the conveying device is arranged on the machine table, and is provided with at least one pickup mechanism of the present invention for transferring the electronic components; the central control device is used to control and integrate the actions of each device to perform automatic operations, To achieve the practical benefits of improving operating efficiency.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:

請參閱圖2~6,本發明拾取機構包含拾取具21及基座22,更包含給壓器、作動臂24。Please refer to FIGS. 2 to 6 , the pickup mechanism of the present invention includes a pickup tool 21 and a base 22 , and further includes a pressure feeder and an actuating arm 24 .

拾取具21沿軸線X界定第一作業面211及第二作業面212,更進一步,第一作業面211可為拾取具21之頂面或任一水平面,第二作業面212可為拾取具21之底面或任一水平面;於本實施例,拾取具21之頂部為一承壓面213,並沿軸線X界定一靠近承壓面213之一水平面作為第一作業面211,以及沿軸線X界定一距離第一作業面211適當高度之另一水平面作為第二作業面212。第一作業面211設有至少一第一長軸2111及至少一第一短軸2112,並沿第一長軸2111及第一短軸2112之端部而連成一呈非正圓曲線之第一輪廓2113,更進一步,第一長軸2111及第一短軸2112相交,第一輪廓2113之線段可為直線或曲弧線,例如第一短軸2112之第一短軸端朝向第一長軸2111之第一長軸端設有呈尺寸漸縮之直線段,使第一輪廓2113呈菱形;例如第一短軸2112之第一短軸端朝向第一長軸2111之第一長軸端設有呈尺寸漸縮之曲弧線段,使第一輪廓2113呈橢圓形。The pickup tool 21 defines a first working surface 211 and a second working surface 212 along the axis X. Further, the first working surface 211 can be the top surface of the pickup tool 21 or any horizontal surface, and the second working surface 212 can be the pickup tool 21 . In this embodiment, the top of the pick-up tool 21 is a pressure-bearing surface 213, and a horizontal plane close to the pressure-bearing surface 213 is defined along the axis X as the first working surface 211, and is defined along the axis X Another horizontal plane with a proper height from the first working plane 211 is used as the second working plane 212 . The first working surface 211 is provided with at least one first long axis 2111 and at least one first short axis 2112, and is connected along the ends of the first long axis 2111 and the first short axis 2112 to form a first non-circular curve. The contour 2113, further, the first long axis 2111 and the first short axis 2112 intersect, the line segment of the first contour 2113 can be a straight line or a curved line, for example, the first short axis end of the first short axis 2112 faces the first long axis 2111 The first long axis end is provided with a straight line segment with a tapered size, so that the first contour 2113 is in the shape of a rhombus; for example, the first short axis end of the first short axis 2112 faces the first long axis of the first long axis A curved line segment with a tapered size makes the first outline 2113 an ellipse.

於本實施例,第一作業面211之第一短軸2112之第一短軸端朝向第一長軸2111之第一長軸端設有尺寸漸縮之曲弧線段,以於第一長軸2111之二第一長軸端及第一短軸2112之二第一短軸端連成一呈橢圓形之第一輪廓2113;又拾取具21之第一作業面211朝向第二作業面212設有尺寸漸縮之貼接面214,更進一步,貼接面214可為平面或弧面,於本實施例,貼接面214為弧面;拾取具21之底面215設有至少一拾取部件216,以供拾取及貼接電子元件,於本實施例 ,拾取部件216為吸嘴,並連通抽氣設備(圖未示出),以供吸取或釋放電子元件。 In this embodiment, the first short-axis end of the first short-axis 2112 of the first working surface 211 is provided with a curved line segment with a reduced size toward the first long-axis end of the first long-axis 2111, so that the first long-axis The second first long axis end of the 2111 and the second first short axis end of the first short axis 2112 are connected to form an oval first contour 2113; The abutting surface 214 with a tapered size, further, the abutting surface 214 can be a flat surface or a curved surface. In this embodiment, the abutting surface 214 is a curved surface; the bottom surface 215 of the pick-up tool 21 is provided with at least one pick-up part 216, For picking up and attaching electronic components, in this embodiment , the pick-up part 216 is a suction nozzle, and is communicated with a suction device (not shown in the figure) for sucking or releasing electronic components.

基座22設有容置槽221,以供容置拾取具21,容置槽221沿軸線X界定第三作業面222及第四作業面223,更進一步,第三作業面222可為容置槽221之頂面或任一水平面,第四作業面223可為容置槽221之底面或任一水平面;於本實施例,容置槽221具有相通之頂面及底面,並沿軸線X界定頂面為第三作業面222,以及沿軸線X界定一距離第三作業面222適當高度且為底面作為第四作業面223。第三作業面222設有至少一第三長軸2221及至少一第三短軸2222,並沿第三長軸2221及第三短軸2222之端部而連成一呈非正圓曲線之第三輪廓2223,更進一步,第三長軸2221及第三短軸2222相交,第三輪廓2223之尺寸可相同或相異於第一輪廓2113之尺寸,第三輪廓2223之線段可為直線或曲弧線,例如第三短軸2222之第三短軸端朝向第三長軸2221之第三長軸端設有呈尺寸漸縮之直線段,使第三輪廓2223呈菱形;例如第三短軸2222之第三短軸端朝向第三長軸2221之第三長軸端設有呈尺寸漸縮之曲弧線段,使第三輪廓2223呈橢圓形;於本實施例,第三作業面222之第三短軸2222的第三短軸端朝向第三長軸2221之第三長軸端設有尺寸漸縮之曲弧線段,以將第三長軸2221之二第三長軸端及第三短軸2222之二第三短軸端連成一呈橢圓形之第三輪廓2223;又容置槽221之第三作業面222朝向第四作業面223設有尺寸漸縮之承接面224,於本實施例,第四作業面223之第四輪廓2231的尺寸大於第二作業面212之第二輪廓2121的尺寸,更進一步,承接面224可為平面或弧面,於本實施例,承接面224為弧面,且曲弧相同於拾取具21之貼接面214的曲弧,於容置槽221容置拾取具21時 ,令容置槽221之承接面224貼合且卡抵該拾取具21之貼接面214,使拾取具21可沿軸線X位移,並防止拾取具21脫離;另基座22沿軸線X設有相通容置槽221且位於上方之承置部225。 The base 22 is provided with an accommodating groove 221 for accommodating the pick-up tool 21. The accommodating groove 221 defines a third working surface 222 and a fourth working surface 223 along the axis X. Furthermore, the third working surface 222 can be used for accommodating The top surface or any horizontal surface of the groove 221, the fourth working surface 223 can be the bottom surface or any horizontal surface of the accommodating groove 221; in this embodiment, the accommodating groove 221 has the same top surface and bottom surface, and is defined along the axis X The top surface is the third working surface 222 , and the fourth working surface 223 is defined along the axis X with a proper height from the third working surface 222 and is the bottom surface. The third working surface 222 is provided with at least one third long axis 2221 and at least one third short axis 2222, and is connected along the ends of the third long axis 2221 and the third short axis 2222 to form a third non-circular curve. The contour 2223, further, the third long axis 2221 and the third short axis 2222 intersect, the size of the third contour 2223 can be the same or different from the size of the first contour 2113, and the line segment of the third contour 2223 can be a straight line or a curved line For example, the third short axis end of the third short axis 2222 is provided with a straight line segment with a size tapering toward the third long axis end of the third long axis 2221, so that the third contour 2223 is rhombus; The third short-axis end faces the third long-axis end of the third long-axis 2221 and is provided with a curved line segment with a tapered size, so that the third contour 2223 is elliptical; in this embodiment, the third The third short axis end of the short axis 2222 is provided with a curved arc segment with a reduced size toward the third long axis end of the third long axis 2221, so as to connect the two third long axis ends and the third short axis of the third long axis 2221 Two third short axis ends of 2222 are connected to form a third oval contour 2223; and the third working surface 222 of the accommodating groove 221 is provided with a receiving surface 224 with a tapered size toward the fourth working surface 223. In this embodiment, , the size of the fourth contour 2231 of the fourth working surface 223 is larger than the size of the second contour 2121 of the second working surface 212 , and further, the receiving surface 224 can be a plane or an arc surface. In this embodiment, the receiving surface 224 is an arc surface, and the curved arc is the same as the curved arc of the contact surface 214 of the pick-up tool 21, when the pick-up tool 21 is accommodated in the accommodating groove 221 , to make the receiving surface 224 of the accommodating groove 221 abut against the abutting surface 214 of the pick-up tool 21, so that the pick-up tool 21 can be displaced along the axis X and prevent the pick-up tool 21 from disengaging; There is a receiving portion 225 that communicates with the receiving groove 221 and is located above.

又,容置槽221之第四作業面223的第四輪廓2231尺寸可相同或相異於第二作業面212之第二輪廓2121的尺寸,只要容置槽221之承接面224可卡抵該拾取具21之貼接面214,而防止拾取具21脫離即可。In addition, the size of the fourth contour 2231 of the fourth working surface 223 of the accommodating groove 221 may be the same as or different from the size of the second contour 2121 of the second working surface 212, as long as the receiving surface 224 of the accommodating groove 221 can be snapped against the second contour 2121 of the second working surface 212. The contact surface 214 of the pick-up tool 21 can prevent the pick-up tool 21 from coming off.

再者,容置槽221之第三作業面222的第三長軸2221及第三短軸2222數量可相同或相異於拾取具21之第一作業面211的第一長軸2111及第一短軸2112數量,使容置槽221可因應搭配不同形狀之拾取具21;例如容置槽221之第三作業面222具有雙橢圓相交曲線之第三輪廓,以供搭配拾取具21之第一作業面211具有單橢圓之第一輪廓2113,因此,不受限於本實施例。Furthermore, the number of the third long axis 2221 and the third short axis 2222 of the third working surface 222 of the accommodating groove 221 can be the same or different from the number of the first long axis 2111 and the first long axis 2111 of the first working surface 211 of the pick-up tool 21 . The number of short axes 2112 enables the accommodating groove 221 to be matched with different shapes of the pick-up tool 21 ; for example, the third working surface 222 of the accommodating groove 221 has a third contour of a double ellipse intersecting curve for matching with the first part of the pick-up tool 21 . The working surface 211 has a first contour 2113 of a single ellipse, so it is not limited to this embodiment.

給壓器以供拾取具21於移載電子元件之行程中,而對拾取具21施以一壓抵力,使拾取具21之貼接面214確實貼合容置槽221之承接面224定位;更進一步,給壓器可為壓缸、膜片式給壓器或氣囊式給壓器,於本實施例,給壓器為膜片式給壓器,包含膜片231及蓋板232,膜片231裝配於基座22之承置部225,並位於拾取具21之上方,蓋板232具有通氣口2321,並裝配於膜片231之上方,蓋板232與膜片231間形成一氣室233,利用蓋板232之通氣口2321將氣體注入於氣室233,以供膜片231膨脹向下弧凸變形而對拾取具21施以壓抵力。The pressure feeder is used for the pick-up tool 21 in the process of transferring electronic components, and a pressing force is applied to the pick-up tool 21, so that the abutment surface 214 of the pick-up tool 21 is indeed positioned in abutment with the receiving surface 224 of the accommodating groove 221 ; Further, the pressure feeder can be a pressure cylinder, a diaphragm type pressure feeder or an airbag type pressure feeder. In this embodiment, the pressure feeder is a diaphragm type pressure feeder, including a diaphragm 231 and a cover plate 232, The diaphragm 231 is assembled on the receiving portion 225 of the base 22 and located above the pick-up tool 21 . The cover plate 232 has a vent 2321 and is assembled above the diaphragm 231 , and an air chamber is formed between the cover plate 232 and the diaphragm 231 . 233 , using the vent 2321 of the cover plate 232 to inject gas into the air chamber 233 , so that the diaphragm 231 expands and deforms downwardly, so as to exert a pressing force on the pick-up tool 21 .

作動臂24以供驅動基座22作至少一方向位移,作動臂24可連接基座22或給壓器,於本實施例,作動臂24連接基座22,並位於膜片式給壓器之蓋板232上方,以帶動基座22、膜片式給壓器及拾取具21同步作X-Y-Z方向位移,以於不同裝置處移載電子元件。The actuating arm 24 is used to drive the base 22 to move in at least one direction. The actuating arm 24 can be connected to the base 22 or the pressure feeder. In this embodiment, the actuating arm 24 is connected to the base 22 and is located between the diaphragm pressure feeder. Above the cover plate 232, the base 22, the diaphragm pressure feeder and the pick-up tool 21 are driven to move in the X-Y-Z direction synchronously, so as to transfer electronic components to different devices.

請參閱圖7,拾取機構之作動臂24帶動基座22、膜片式給壓器及拾取具21同步作X-Y-Z方向位移至一承載電子元件32之載台31處,令拾取具21之拾取部件216微壓接觸電子元件32,電子元件32會對拾取具21產生一反作用力,而頂推拾取具21作Z方向微幅向上位移,拾取具21之承壓面213即頂抵膜片231而作一緩衝浮動位移。Please refer to FIG. 7 , the actuating arm 24 of the pick-up mechanism drives the base 22 , the diaphragm pressure feeder and the pick-up tool 21 to move in the X-Y-Z direction to a stage 31 carrying the electronic components 32 , so that the pick-up tool 21 picks up the components 216 is slightly pressed to contact the electronic component 32, the electronic component 32 will generate a reaction force on the pick-up tool 21, and push the pick-up tool 21 to slightly move upward in the Z direction, and the pressure-bearing surface 213 of the pick-up tool 21 pushes against the diaphragm 231 and Make a buffer floating displacement.

請參閱圖3、8、9,由於基座22之第三短軸2222的第三短軸端朝向第三長軸2221之第三長軸端設有呈尺寸漸縮之曲弧線段,而形成一呈非正圓曲線之第三輪廓2223,以及拾取具21的第一短軸2112之第一短軸端朝向第一長軸2111之第一長軸端設有呈尺寸漸縮之曲弧線段,而形成一呈非正圓曲線之第一輪廓2113 ,藉以基座22之第三輪廓2223尺寸漸縮的曲弧線段可卡抵拾取具21之第一輪廓2113尺寸漸縮的曲弧線段,以防止拾取具21任意作水平旋轉,當拾取具21之拾取部件216取出電子元件32後,給壓器之通氣口2321注入氣體至氣室233,以預設氣壓令膜片231膨脹向下弧凸變形而壓抵拾取具21向下位移,基座22之承接面224即導引拾取具21之貼接面214滑移且相互貼合,由於基座22之承接面224與拾取具21之貼接面214具有相互配合且尺寸漸縮之曲弧,使得基座22之承接面224可卡抵拾取具21之貼接面214,進而將拾取具21定位於基座22,在基座22之承接面224與拾取具21之貼接面214相互貼合之狀態下,基座22之容置槽221與拾取具21間並無組裝餘隙;因此,拾取具21於移載行程中不會任意產生水平向旋轉或垂直向擺動,換言之,拾取具21於移載行程中可使電子元件32保持正確之擺置位置及角度,進而將正確擺置之電子元件32精確移載至測試器33 ,使電子元件32之接點精準電性接觸測試器33之探針而執行測試作業,以提高測試品質。 Please refer to FIGS. 3 , 8 and 9 , since the third short axis end of the third short axis 2222 of the base 22 is provided with a curved line segment with a tapered size toward the third long axis end of the third long axis 2221 , forming A third contour 2223 with a non-circular curve, and a curved line segment with a tapered size is provided at the first short axis end of the first short axis 2112 of the pick-up tool 21 toward the first long axis end of the first long axis 2111 , forming a first contour 2113 with a non-perfect circular curve, whereby the tapered curved line segment of the third profile 2223 of the base 22 can snap against the tapered curved line segment of the first profile 2113 of the pick-up tool 21 , In order to prevent the pick-up tool 21 from arbitrarily rotating horizontally, after the pick-up part 216 of the pick-up tool 21 takes out the electronic components 32, the air vent 2321 of the pressure device is injected with gas into the air chamber 233, and the diaphragm 231 is inflated to a downward arc with a preset air pressure. The convex deforms and presses against the pick-up tool 21 and moves downward. The bearing surface 224 of the base 22 is the abutment surface 214 that guides the pick-up tool 21 to slide and stick to each other. Since the bearing surface 224 of the base 22 and the pick-up tool 21 The abutting surfaces 214 have curved arcs that cooperate with each other and have a tapered size, so that the receiving surface 224 of the base 22 can be clamped against the abutting surface 214 of the pick-up tool 21 , and then the pick-up tool 21 is positioned on the base 22 , on the base 22 . In the state where the receiving surface 224 and the abutting surface 214 of the pick-up tool 21 are attached to each other, there is no assembly clearance between the accommodating groove 221 of the base 22 and the pick-up tool 21; It will randomly generate horizontal rotation or vertical swing. In other words, the pick-up tool 21 can keep the electronic components 32 in the correct placement position and angle during the transfer process, so as to accurately transfer the correctly placed electronic components 32 to the tester. 33 , so that the contacts of the electronic components 32 are electrically contacted with the probes of the tester 33 precisely to perform the test operation, so as to improve the test quality.

請參閱圖9、10,拾取機構之拾取具21的另一型式拾取部件217,其拾取部件217具有拾取及壓接作用,拾取具21應用於拾取且壓接另一頂面具斜度之電子元件34時,拾取具21會承受電子元件34之反作用力,並向上頂壓膜片231作緩衝位移,由於拾取具21之貼接面214與基座22之承接面224作一曲弧配合 ,而可供拾取具21配合電子元件34之頂面斜度作一傾斜擺置(例如垂直向擺動) ,令拾取具21之拾取部件217貼合且均勻壓接電子元件34,使電子元件34在受力平均之狀態下而執行測試作業,進而提高測試品質。當拾取具21取出電子元件34時,膜片231即頂壓拾取具21向下位移,拾取具21利用貼接面214沿基座22之承接面224位移而導正定位。 Please refer to FIGS. 9 and 10 , another type of pick-up part 217 of the pick-up tool 21 of the pick-up mechanism, the pick-up part 217 has the function of picking up and crimping, and the pick-up tool 21 is used to pick up and crimp another electronic component with a slope of the top surface At 34, the pick-up tool 21 will bear the reaction force of the electronic component 34, and push the diaphragm 231 upward to buffer the displacement, because the abutment surface 214 of the pick-up tool 21 and the receiving surface 224 of the base 22 are matched by a curved arc , and the pick-up tool 21 can be tilted (for example, vertically swung) to match the inclination of the top surface of the electronic component 34 . , to make the pick-up part 217 of the pick-up tool 21 fit and evenly crimp the electronic components 34 , so that the electronic components 34 can perform the test operation under the state of uniform force, thereby improving the test quality. When the pickup 21 takes out the electronic components 34 , the diaphragm 231 presses the pickup 21 to move downward, and the pickup 21 uses the abutting surface 214 to move along the receiving surface 224 of the base 22 to guide the correct positioning.

請參閱圖2~6、11,一種作業設備,包含機台40、供料裝置50、收料裝置60、作業裝置70、輸送裝置80及中央控制裝置(圖未示出);供料裝置50裝配於機台40,並設有至少一供料承置器51,以供容納至少一待作業之電子元件;收料裝置60裝配於機台40,並設有至少一收料承置器61,以供容納至少一已作業之電子元件;作業裝置70裝配於機台40,並設有至少一作業器,以供對電子元件執行預設作業;於本實施例,作業器為一測試器,測試器設置電性連接之電路板71與具探針之測試座72,而對電子元件執行測試作業;輸送裝置80配置於機台40,並設有至少一本發明之拾取機構,以供移載電子元件;於本實施例,輸送裝置80以一第一移料器81於供料裝置50之供料承置器51取出待測之電子元件,並移載一入料載台82,入料載台82將待測之電子元件載送作業裝置70之側方,本發明之拾取機構以作動臂24帶動拾取具21於入料載台82取出待測之電子元件,並於移載行程中確實防止待測之電子元件任意水平旋轉,使待測之電子元件保持正確之擺置位置及角度,拾取具21將待測之電子元件精準移入作業裝置70之測試座72而執行測試作業,以及將已測之電子元件移載至一出料載台83,出料載台83載出已測之電子元件,一第二移料器84於出料載台83取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置60之收料承置器61處而分類收置;中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。Please refer to FIGS. 2 to 6 and 11 , an operation equipment including a machine table 40 , a feeding device 50 , a receiving device 60 , a working device 70 , a conveying device 80 and a central control device (not shown); the feeding device 50 It is assembled on the machine table 40 and is provided with at least one feeding and receiving device 51 for accommodating at least one electronic component to be operated; , for accommodating at least one electronic component that has been operated; the operating device 70 is assembled on the machine table 40 and is provided with at least one operator for performing preset operations on the electronic component; in this embodiment, the operator is a tester , the tester is provided with an electrically connected circuit board 71 and a test seat 72 with probes to perform testing operations on electronic components; the conveying device 80 is arranged on the machine table 40 and is provided with at least one pickup mechanism of the present invention for Transfer and load electronic components; in this embodiment, the conveying device 80 uses a first transfer device 81 to take out the electronic components to be tested from the feeding holder 51 of the feeding device 50, and transfers a feeding stage 82, The feeding stage 82 carries the electronic components to be tested to the side of the operation device 70. The pickup mechanism of the present invention uses the actuating arm 24 to drive the pick-up tool 21 to take out the electronic components to be tested on the feeding stage 82 and transfer them to During the stroke, the electronic components to be tested can be prevented from rotating horizontally at will, so that the electronic components to be tested can maintain the correct placement position and angle. , and transfer the tested electronic components to an unloading stage 83 , the unloading stage 83 carries out the tested electronic components, and a second feeder 84 takes out the tested electronic components from the unloading stage 83 , and according to the test results, the tested electronic components are sent to the receiving device 61 of the receiving device 60 for classification and storage; the central control device is used to control and integrate the actions of each device to perform automatic operations to achieve Practical benefits of improving operational efficiency.

11:本體 111:容置孔 112:抽氣道 113:長孔 12:拾取件 121:吸嘴 122:通氣道 123:穿孔 13:軸桿 14:電子元件 21:拾取具 211:第一作業面 2111:第一長軸 2112:第一短軸 2113:第一輪廓 212:第二作業面 2121:第二輪廓 213:承壓面 214:貼接面 215:底面 216、217:拾取部件 22:基座 221:容置槽 222:第三作業面 2221:第三長軸 2222:第三短軸 2223:第三輪廓 223:第四作業面 2231:第四輪廓 224:承接面 225:承置部 231:膜片 232:蓋板 2321:通氣口 233:氣室 24:作動臂 X:軸線 31:載台 32、34:電子元件 33:測試器 40:機台 50:供料裝置 51:供料承置器 60:收料裝置 61:收料承置器 70:作業裝置 71:電路板 72:測試座 80:輸送裝置 81:第一移料器 82:入料載台 83:出料載台 84:第二移料器 11: Ontology 111: accommodating hole 112: Air extraction duct 113: long hole 12: Pickup 121: suction nozzle 122: Airway 123: perforation 13: Axle 14: Electronic Components 21: Pickup 211: The first work surface 2111: The first long axis 2112: First short axis 2113: First Profile 212: Second work surface 2121: Second profile 213: Pressure bearing surface 214: Adhesive Surface 215: Underside 216, 217: Picking up parts 22: Pedestal 221: accommodating slot 222: The third work surface 2221: Third Long Axis 2222: Third Short Axis 2223: Third Profile 223: Fourth work surface 2231: Fourth Profile 224: Undertaking surface 225: Holder 231: Diaphragm 232: Cover 2321: Vent 233: Air Chamber 24: Actuator Arm X: axis 31: Carrier 32, 34: Electronic components 33: Tester 40: Machine 50: Feeding device 51: Feed holder 60: Receiving device 61: Receiving holder 70: Working device 71: circuit board 72: Test seat 80: Conveying device 81: First mover 82: Feeding platform 83: discharge stage 84: Second mover

圖1:習知拾取機構之示意圖。 圖2:本發明拾取機構之外觀圖。 圖3:本發明拾取機構之零件分解圖。 圖4:本發明拾取機構之組合剖視圖。 圖5:本發明拾取具之仰視圖。 圖6:本發明基座之俯視圖。 圖7:本發明拾取機構之使用示意圖(一)。 圖8:本發明拾取機構之使用示意圖(二)。 圖9:本發明拾取機構之使用示意圖(三)。 圖10:本發明拾取機構之另一使用示意圖。 圖11:本發明拾取機構應用於作業設備之示意圖。 Figure 1: Schematic diagram of a conventional pick-up mechanism. Figure 2: The external view of the pickup mechanism of the present invention. Figure 3: An exploded view of the parts of the pickup mechanism of the present invention. Figure 4: A cross-sectional view of the assembly of the pickup mechanism of the present invention. Figure 5: Bottom view of the pick-up tool of the present invention. Figure 6: A top view of the base of the present invention. Figure 7: Schematic diagram (1) of the use of the pickup mechanism of the present invention. Fig. 8: Schematic diagram (2) of the use of the pickup mechanism of the present invention. Fig. 9: Schematic diagram (3) of the use of the pickup mechanism of the present invention. Figure 10: Another schematic diagram of the use of the pickup mechanism of the present invention. FIG. 11 is a schematic diagram of the application of the pick-up mechanism of the present invention to work equipment.

21:拾取具 21: Pickup

2111:第一長軸 2111: The first long axis

2112:第一短軸 2112: First short axis

2113:第一輪廓 2113: First Profile

212:第二作業面 212: Second work surface

2121:第二輪廓 2121: Second profile

213:承壓面 213: Pressure bearing surface

214:貼接面 214: Adhesive Surface

215:底面 215: Underside

216:拾取部件 216: Pick up parts

22:基座 22: Pedestal

221:容置槽 221: accommodating slot

2221:第三長軸 2221: Third Long Axis

2222:第三短軸 2222: Third Short Axis

2223:第三輪廓 2223: Third Profile

223:第四作業面 223: Fourth work surface

2231:第四輪廓 2231: Fourth Profile

224:承接面 224: Undertaking surface

225:承置部 225: Holder

231:膜片 231: Diaphragm

232:蓋板 232: Cover

X:軸線 X: axis

Claims (10)

一種拾取機構,包含: 拾取具:設有至少一拾取部件,以供拾取電子元件,並沿軸線界定 第一作業面及第二作業面,該第一作業面設有至少一第一 長軸及至少一第一短軸,並沿該第一長軸及該第一短軸之 端部連成一呈非正圓曲線之第一輪廓,該拾取具之該第一 作業面朝向該第二作業面設有尺寸漸縮之貼接面; 基 座:設有容置槽,以供容置該拾取具,該容置槽沿該軸線界定 第三作業面及第四作業面,該第三作業面設有至少一第三 長軸及至少一第三短軸,並沿該第三長軸及該第三短軸之 端部連成一呈非正圓曲線之第三輪廓,該容置槽之該第三 作業面朝向該第四作業面設有尺寸漸縮之承接面,以供貼 合卡抵該拾取具之該貼接面。 A pick-up mechanism comprising: Pick-up tool: at least one pick-up part is provided for picking up electronic components and is defined along the axis a first work surface and a second work surface, the first work surface is provided with at least one first long axis and at least one first short axis, and along the first long axis and the first short axis The ends are connected to form a first contour that is not a perfect circular curve, and the first contour of the pick-up tool is The working surface faces the second working surface and is provided with an abutment surface with a tapered size; Base: There is an accommodating groove for accommodating the pick-up tool, and the accommodating groove is defined along the axis The third work surface and the fourth work surface, the third work surface is provided with at least one third long axis and at least one third short axis, and along the third long axis and the third short axis The ends are connected to form a third contour that is not a perfect circular curve, and the third contour of the accommodating groove is The working surface faces the fourth working surface and is provided with a receiving surface with a tapered size for sticking The joint card abuts the abutting surface of the pick-up tool. 如請求項1所述之拾取機構,其該拾取具之該第一長軸及該第一短軸相交,該第一輪廓之線段為直線或曲弧線。The pickup mechanism according to claim 1, wherein the first long axis and the first short axis of the pickup tool intersect, and the line segment of the first outline is a straight line or a curved line. 如請求項1所述之拾取機構,其該拾取具之該第一輪廓的線段由該第一短軸的端部朝向該第一長軸之端部呈尺寸漸縮。The pickup mechanism according to claim 1, wherein the line segment of the first contour of the pickup tool is tapered in size from the end of the first short axis toward the end of the first long axis. 如請求項1所述之拾取機構,其該拾取具之該貼接面為平面或弧面。The pick-up mechanism according to claim 1, wherein the abutting surface of the pick-up tool is a flat surface or an arc surface. 如請求項1所述之拾取機構,其該基座之該第三長軸及該第三短軸相交,該第三輪廓之線段為直線或曲弧線。The pickup mechanism according to claim 1, wherein the third long axis and the third short axis of the base intersect, and the line segment of the third contour is a straight line or a curved line. 如請求項1所述之拾取機構,其該基座之該第三輪廓的線段由該第三短軸的端部朝向該第三長軸之端部呈尺寸漸縮。The pickup mechanism according to claim 1, wherein the line segment of the third contour of the base is gradually reduced in size from the end of the third short axis toward the end of the third long axis. 如請求項1所述之拾取機構,其該基座之該承接面為平面或弧面。The pickup mechanism according to claim 1, wherein the receiving surface of the base is a flat surface or an arc surface. 如請求項1至7中任一項所述之拾取機構,更包含給壓器,該給壓器裝配於該基座,以供下壓該拾取具。The pickup mechanism according to any one of claims 1 to 7, further comprising a pressure feeder, the pressure feeder is assembled on the base for pressing down the pickup tool. 如請求項1至7中任一項所述之拾取機構,更包含作動臂,以供驅動該基座作至少一方向位移。The pickup mechanism according to any one of claims 1 to 7, further comprising an actuating arm for driving the base to displace in at least one direction. 一種作業設備,包含: 機台; 供料裝置:配置於該機台,並設有至少一容納待作業電子元件之供 料承置器; 收料裝置:配置於該機台,並設有至少一容納已作業電子元件之收 料承置器; 作業裝置:配置於該機台,並設有至少一作業器,以供對電子元件 執行預設作業; 輸送裝置:配置於該機台,並設有至少一如請求項1至7中任一項所 述之拾取機構,以供移載電子元件; 中央控制裝置:以供控制及整合各裝置作動。 A work equipment comprising: Machine; Feeding device: It is arranged on the machine and has at least one supply for accommodating the electronic components to be operated. material holder; Receiving device: It is arranged on the machine and has at least one receiving device for accommodating the electronic components that have been processed. material holder; Operating device: It is arranged on the machine and has at least one operating device for electronic components. execute preset jobs; Conveying device: It is arranged on the machine, and is equipped with at least one of the requirements of claim 1 to 7. The aforementioned pickup mechanism is used for transferring electronic components; Central control device: for controlling and integrating the actions of various devices.
TW109140981A 2020-11-23 2020-11-23 Picking assembly and operating apparatus using the same TWI748763B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109140981A TWI748763B (en) 2020-11-23 2020-11-23 Picking assembly and operating apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109140981A TWI748763B (en) 2020-11-23 2020-11-23 Picking assembly and operating apparatus using the same

Publications (2)

Publication Number Publication Date
TWI748763B TWI748763B (en) 2021-12-01
TW202221834A true TW202221834A (en) 2022-06-01

Family

ID=80681001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109140981A TWI748763B (en) 2020-11-23 2020-11-23 Picking assembly and operating apparatus using the same

Country Status (1)

Country Link
TW (1) TWI748763B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6341641B2 (en) * 2013-08-09 2018-06-13 ファスフォードテクノロジ株式会社 Die bonder
JP6643197B2 (en) * 2016-07-13 2020-02-12 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP6621771B2 (en) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP6653273B2 (en) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP6685245B2 (en) * 2017-02-08 2020-04-22 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Also Published As

Publication number Publication date
TWI748763B (en) 2021-12-01

Similar Documents

Publication Publication Date Title
TWI639546B (en) Electronic component crimping mechanism and test classification device
US7609052B2 (en) Contact pusher, contact arm, and electronic device handling apparatus
TWI477791B (en) Test equipment for presses and their applications
TWI597504B (en) Electronic components conveying device and its application test classification equipment
JPWO2017029750A1 (en) Component mounting equipment
CN113838789B (en) Automatic chip supply device and method
TWI623754B (en) Electronic component testing device and test classification device
JP3543089B2 (en) Contact unit
US6554128B1 (en) Die shuttle conveyor and nest therefor
JP6103745B2 (en) Thrust height measurement system
TW202221834A (en) Picking assembly and operating apparatus using the same
TW202129289A (en) The crimping mechanism for electronic component and the application thereof in the crimping device and in the testing classification equipment
JP4480253B2 (en) Electronic device testing pressing device, electronic device testing device and control method thereof
TWI585413B (en) Rotary angle adjustment mechanism and its application of the test classification equipment
TW202217321A (en) Position shifter for electronic component support and operating apparatus using the same
TW201810509A (en) Electronic component carrying unit and test classification device applying same wherein the electronic component is laterally displaced to abut against the benchmark plane of the receiving groove to make calibration and positioning
CN114545034A (en) Picking mechanism and working equipment applying same
KR20080033014A (en) Device contacting apparatus of test handler
TW202132194A (en) Operating device with correction unit and operating equipment using the same
TWI766335B (en) Alignment platform and electronic component transmission apparatus
US6864678B2 (en) Nestless plunge mechanism for semiconductor testing
KR200495436Y1 (en) Pressing mechanism, pressing device, and testing classification equipment
TW201917085A (en) Variable-pressure crimping device and testing and sorting equipment used for the same capable of crimping different types of electronic components, easy to change press-down force, and improving performance
JP4825133B2 (en) Electronic component handling apparatus and electronic component misalignment correction method
TWI685461B (en) Electronic component operation device and application operation classification equipment