TW202217216A - 散熱裝置 - Google Patents

散熱裝置 Download PDF

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TW202217216A
TW202217216A TW110103922A TW110103922A TW202217216A TW 202217216 A TW202217216 A TW 202217216A TW 110103922 A TW110103922 A TW 110103922A TW 110103922 A TW110103922 A TW 110103922A TW 202217216 A TW202217216 A TW 202217216A
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heat dissipation
dissipation device
flow channel
plate
internal flow
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TWI804812B (zh
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溫遠龍
樊美平
鄭善尹
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訊凱國際股份有限公司
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F28F3/14—Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/06—Hollow fins; fins with internal circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

一種散熱裝置用以供一相變化流體充填。散熱裝置包含一基部及多個散熱鰭片。基部具有至少一內部流道，用以供相變化流體充填。這些散熱鰭片各包含一板體及至少一管體。這些板體插設於基部之其中一側。這些板體各具有一延伸流道。這些管體之相對兩端分別插接於這些板體及基部，且這些板體之這些延伸流道分別透過這些管體連通至少一內部流道。

Description

散熱裝置
本發明係關於一種散熱裝置，特別是一種液冷式散熱裝置。
伴隨著電子元件運行頻率及速度之不斷提昇，電子元件每單位體積所產生之熱量隨之增高。然而，傳統之簡單鋁擠型及壓鑄型散熱鰭片由於受限於機械加工而其散熱面積極其有限，與周圍空氣交換熱量的面積不大，即使配用風扇亦無法及時充分地散發熱量，這種散熱鰭片不再滿足目前電子廠商之散熱要求。
本發明在於提供一種散熱裝置，藉以提升散熱裝置的散熱效率。
本發明之一實施例所揭露之散熱裝置用以供一相變化流體充填。散熱裝置包含一基部及多個散熱鰭片。基部具有至少一內部流道，用以供相變化流體充填。這些散熱鰭片各包含一板體及至少一管體。這些板體插設於基部之其中一側。這些板體各具有一延伸流道。這些管體之相對兩端分別插接於這些板體及基部，且這些板體之這些延伸流道分別透過這些管體連通至少一內部流道。
根據上述實施例之散熱裝置，透過內部流道與延伸流道相連通，使得充填於這些內部流道之相變化流體受熱後會汽化並流向延伸流道，且位於延伸流道之相變化流體液化後再流回內部流道以形成內部冷卻循環。如此一來，散熱裝置除了藉由基部構成二維度的傳導外，更透過均溫板構成第三維度的傳導，以令散熱裝置達到立體式的均溫效果，進而提升散熱裝置的散熱效能。
再者，吹脹板形式之板體透過管體組裝於基部，可降低散熱裝置的製造難度。
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。
請參閱圖1至圖4。圖1為根據本發明第一實施例所述之散熱裝置的立體示意圖。圖2為圖1之分解示意圖。圖3為圖1之分解示意圖。圖4為圖1之剖面示意圖。
本實施例之散熱裝置10，用以供一相變化流體(未繪示)充填，散熱裝置10包含一基部100及多個散熱鰭片200。
基部100例如具有多個內部流道S。這些內部流道S彼此平行，並彼此相連通。內部流道S用以供相變化流體(未繪示)充填。在本實施例中，基部100包含一第一板部110及一第二板部120。第一板部110之一側具有多個第一凹槽111，以及相對一側具有多個插槽112。第二板部120具有多個第二凹槽121。第一板部110與第二板部120相疊，且第一凹槽111與第二凹槽121共同形成多個內部流道S。第二板部120例如用以熱接觸一熱源(未繪示)。熱源例如為中央處理器、影像處理器等。相變化流體例如為水、醇類、冷媒等流體，其相變化流體之選用可視散熱裝置10本身的材質，或所應用之熱源(未繪示)的工作溫度來決定。舉例來說，熱源可接受之工作溫度為80度至100度，則相變化流體之汽化溫度介於80度至100度。
本實施例之基部100係透過兩板部組裝而成，但並不以此為限。在其他實施例中，基部亦可由吹脹、消失模鑄造的方式一體成型。此外，本實施例之內部流道S的數量為多個，但並不以此為限。在其他實施例中，內部流道的數量也可以僅為單個。
這些均溫板200各包含一板體210及至少一管體220。每一散熱鰭片200之板體210例如為吹脹板，即例如透過吹脹的方式形成。這些散熱鰭片200之這些板體210插設於第一板部110之這些插槽112，且這些板體210各具有一延伸流道C。這些管體220之相對兩端分別插接於這些板體210及基部100，且這些板體210之這些延伸流道C分別透過這些管體220連通內部流道S。
在本實施例中，這些散熱鰭片200之這些板體210插設於第一板部110之這些插槽112後例如可再透過焊接製程焊接板體210與第一板部110，以提升散熱裝置10的組裝品質。
在本實施例中，每一板體210透過兩個管體220與內部流道S相連通，但並不以此為限。在其他實施例中，每一板體也可以透過單個管體與內部流道S相連通，或是透過三個以上的管體與內部流道S相連通。
本實施例之板體210係由吹脹的方式一體成型，但並不以此為限。在其他實施例中，板體也可以由兩板件組合而成。
在本實施例中，散熱裝置10還可以包含一第一毛細結構300。第一毛細結構300分佈於第二板部120形成至少一內部流道S之壁面。然而，此設計並非用以限制本發明。在其他實施例中，第一毛細結構的數量亦可以多個，並分佈第一板部110形成至少一內部流道S之壁面與第二板部120形成至少一內部流道S之壁面。
第一毛細結構300例如為高分子微結構、微溝槽、金屬網、粉末燒結體、陶瓷燒結體或高分子微結構、微溝槽、金屬網、粉末燒結體及陶瓷燒結體之至少兩個的複合體，且第一毛細結構300分佈於第二板部120形成這些內部流道S之壁面。
本實施例之這些內部流道S與延伸流道C與散熱裝置10以外之元件不相連通而為封閉式流道。也就是說，充填於這些內部流道S之相變化流體受熱後會汽化並流向延伸流道C，且位於延伸流道C之相變化流體液化後再流回內部流道S，以形成內部冷卻循環。從前述冷卻循環可知，散熱裝置10除了藉由基部100構成二維度的傳導外，更透過均溫板200構成第三維度的傳導，以令散熱裝置10達到立體式的均溫效果，進而提升散熱裝置10的散熱效能。
此外，透過在基部100形成內部流道S，以及形成於基部100形成內部流道S之壁面的毛細結構300，來提升散熱裝置10的熱擴散速度。舉例來說，若熱源熱接觸於散熱裝置10之中央處，且內部流道S與毛細結構300自散熱裝置10之中央處延伸至散熱裝置10之邊緣處，則可透過內部流道S與毛細結構300讓熱源所產生的熱量迅速傳遞至散熱裝置10之邊緣處。如此一來，將可讓散熱裝置10之全域均勻地將熱源所產生的熱量排出。
此外，吹脹板形式之板體210透過管體220組裝於基部100，可降低散熱裝置10的製造難度。
請參閱圖5。圖5為根據本發明第二實施例所述之散熱裝置的剖面示意圖。
在本實施例中，散熱裝置10a還可以包含多個第二毛細結構400，這些第二毛細結構400分別分佈於這些板體210形成這些延伸流道C之壁面以及這些管體220之內壁面，且這些第二毛細結構400與第一毛細結構300分離。
第二毛細結構400例如為高分子微結構、微溝槽、金屬網、粉末燒結體、陶瓷燒結體或高分子微結構、微溝槽、金屬網、粉末燒結體及陶瓷燒結體之至少兩個的複合體，且第二毛細結構400分佈於板體210形成這些延伸流道C之壁面。
請參閱圖6。圖6為根據本發明第三實施例所述之散熱裝置的剖面示意圖。
在本實施例中，散熱裝置10b還可以包含多個第二毛細結構400b，這些第二毛細結構400分別分佈於這些板體210形成這些延伸流道C之壁面以及這些管體220之內壁面，且這些第二毛細結構400與第一毛細結構300相連。
第二毛細結構400b例如為高分子微結構、微溝槽、金屬網、粉末燒結體、陶瓷燒結體或高分子微結構、微溝槽、金屬網、粉末燒結體及陶瓷燒結體之至少兩個的複合體，且第二毛細結構400b分佈於板體210形成這些延伸流道C之壁面。
請參閱圖7。圖7為根據本發明第四實施例所述之散熱裝置的平面示意圖。在本實施例之散熱裝置10c中，以從第二板部120c底部的視角來看，至少一內部流道S的數量為多個，且這些內部流道S彼此交叉。
請參閱圖8。圖8為根據本發明第五實施例所述之散熱裝置的平面示意圖。在本實施例之散熱裝置10d中，以從第二板部120d底部的視角來看，至少一內部流道S之流道路徑匹配於震盪式熱管之流道路徑而形成彎曲狀迴路。
根據上述實施例之散熱裝置，透過內部流道與延伸流道相連通，使得充填於這些內部流道之相變化流體受熱後會汽化並流向延伸流道，且位於延伸流道之相變化流體液化後再流回內部流道以形成內部冷卻循環。如此一來，散熱裝置除了藉由基部構成二維度的傳導外，更透過均溫板構成第三維度的傳導，以令散熱裝置達到立體式的均溫效果，進而提升散熱裝置的散熱效能。
再者，吹脹板形式之板體透過管體組裝於基部，可降低散熱裝置的製造難度。
此外，透過在基部形成內部流道，以及形成於基部形成內部流道之壁面的毛細結構，來提升散熱裝置的熱擴散速度。舉例來說，若熱源熱接觸於散熱裝置之中央處，且內部流道與毛細結構自散熱裝置之中央處延伸至散熱裝置之邊緣處，則可透過內部流道與毛細結構讓熱源所產生的熱量迅速傳遞至散熱裝置之邊緣處。如此一來，將可讓散熱裝置之全域均勻地將熱源所產生的熱量排出。
雖然本發明以前述之諸項實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。
10、10a、10b、10c、10d:散熱裝置 100:基部 110:第一板部 111:第一凹槽 112:插槽 120、120c、120d:第二板部 121:第二凹槽 200:散熱鰭片 210:板體 220:管體 300:第一毛細結構 400、400b:第二毛細結構 S:內部流道 C:延伸流道
圖1為根據本發明第一實施例所述之散熱裝置的立體示意圖。 圖2為圖1之分解示意圖。 圖3為圖1之分解示意圖。 圖4為圖1之剖面示意圖。 圖5為根據本發明第二實施例所述之散熱裝置的剖面示意圖。 圖6為根據本發明第三實施例所述之散熱裝置的剖面示意圖。 圖7為根據本發明第四實施例所述之散熱裝置的平面示意圖。 圖8為根據本發明第五實施例所述之散熱裝置的平面示意圖。
10:散熱裝置
100:基部
110:第一板部
111:第一凹槽
112:插槽
120:第二板部
121:第二凹槽
200:散熱鰭片
210:板體
220:管體
300:第一毛細結構
400:第二毛細結構
S:內部流道
C:延伸流道

Claims (14)

  1. 一種散熱裝置，用以供一相變化流體充填，該散熱裝置包含： 一基部，具有至少一內部流道，用以供該相變化流體充填；以及多個散熱鰭片，該些散熱鰭片各包含一板體及至少一管體，該些板體插設於該基部之其中一側，該些板體各具有一延伸流道，該些管體之相對兩端分別插接於該些板體及該基部，且該些板體之該些延伸流道分別透過該些管體連通該至少一內部流道。
  2. 如請求項1所述之散熱裝置，其中該至少一內部流道為封閉式流道。
  3. 如請求項2所述之散熱裝置，其中該基部包含一第一板部及一第二板部，該些散熱鰭片之該些板體插設於該第一板部，且該第一板部與該第二板部共同圍繞出該至少一內部流道。
  4. 如請求項3所述之散熱裝置，更包含至少一第一毛細結構，該第一毛細結構分佈於該第二板部形成該至少一內部流道之壁面。
  5. 如請求項3所述之散熱裝置，更包含至少一第一毛細結構，該第一毛細結構分佈該第一板部形成該至少一內部流道之壁面與該第二板部形成該至少一內部流道之壁面。
  6. 如請求項5所述之散熱裝置，更包含多個第二毛細結構，該些第二毛細結構分別分佈於該些板體形成該些延伸流道之壁面。
  7. 如請求項6所述之散熱裝置，其中該些第二毛細結構與該第一毛細結構分離。
  8. 如請求項6所述之散熱裝置，其中該些第二毛細結構與該第一毛細結構相連。
  9. 如請求項4至8之任一項所述之散熱裝置，其中該至少一第一毛細結構為高分子微結構、微溝槽、金屬網、粉末燒結體、陶瓷燒結體或高分子微結構、微溝槽、金屬網、粉末燒結體及陶瓷燒結體之至少兩個的複合體。
  10. 如請求項1所述之散熱裝置，其中該至少一內部流道之流道路徑匹配於震盪式熱管之流道路徑而形成彎曲狀迴路。
  11. 如請求項1所述之散熱裝置，其中該至少一內部流道的數量為多個，且該些內部流道彼此交叉。
  12. 如請求項1所述之散熱裝置，其中該至少一內部流道的數量為多個，且該些內部流道彼此平行。
  13. 如請求項1所述之散熱裝置，其中每一該散熱鰭片之該板體為吹脹板。
  14. 如請求項1所述之散熱裝置，其中每一該散熱鰭片之該板體為兩板件組合而成。
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