TW202211260A - Conductive particle and connector for electrical connection including same - Google Patents
Conductive particle and connector for electrical connection including same Download PDFInfo
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- TW202211260A TW202211260A TW110131790A TW110131790A TW202211260A TW 202211260 A TW202211260 A TW 202211260A TW 110131790 A TW110131790 A TW 110131790A TW 110131790 A TW110131790 A TW 110131790A TW 202211260 A TW202211260 A TW 202211260A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Abstract
Description
本發明涉及導電性粒子，用於電連接用連接器的導電部。並且，本發明涉及連接器，具有由導電性粒子組成的導電部，用於電連接檢查裝置和受檢設備。This invention relates to electroconductive particle used for the electroconductive part of the connector for electrical connection. Furthermore, the present invention relates to a connector which has a conductive portion made of conductive particles and is used to electrically connect an inspection device and a device to be inspected.
為了對受檢設備進行電檢查，在所屬技術領域中使用用於電連接受檢設備與檢查裝置的連接器。連接器配置在檢查裝置與受檢設備之間。作為這種連接器的一例，在所屬技術領域中使用因施加於受檢設備的加壓力而產生彈性變形的導電性橡膠片（conductive rubber sheet）。In order to electrically inspect a device under inspection, a connector for electrically connecting the device under inspection and an inspection device is used in the art. The connector is arranged between the inspection device and the device under inspection. As an example of such a connector, a conductive rubber sheet that is elastically deformed by a pressing force applied to a device under inspection is used in the related art.
導電性橡膠片包括：導電部，用於傳遞信號；以及絕緣部，用於絕緣導電部。多個導電性粒子以能夠導電的方式沿著上下方向聚集形成。導電部的一部分與絕緣部由相同彈性材料製成，例如，矽橡膠。The conductive rubber sheet includes: a conductive part for transmitting signals; and an insulating part for insulating the conductive part. A plurality of electroconductive particles are aggregated in the up-down direction so as to be able to conduct electricity. A portion of the conductive portion is made of the same elastic material as the insulating portion, eg, silicone rubber.
導電部和絕緣部可從在液相的矽橡膠混合有多個金屬粒子的液相的成型材料中一併成型。通過向上述液相的成型材料施加磁場來將導電性粒子聚集成導電部形狀，從而可形成導電部。作為導電性粒子的一例，可使用在所屬技術領域中已知的球形的導電性粒子與形成特定的文字形狀的導電性粒子。The conductive portion and the insulating portion can be integrally molded from a liquid-phase molding material in which a plurality of metal particles are mixed with a liquid-phase silicone rubber. The conductive portion can be formed by applying a magnetic field to the molding material in the liquid phase to gather the conductive particles in the shape of the conductive portion. As an example of electroconductive particle, the electroconductive particle of spherical shape and the electroconductive particle which forms a specific character shape well-known in the art can be used.
在由球形的導電性粒子組成的導電部中，因呈球形形狀，相鄰的導電性粒子點接觸。由於點接觸的導電性粒子具有較小的接觸面積，因此，導電部的電流密度低。In the electroconductive part which consists of spherical electroconductive particle, since it has a spherical shape, adjacent electroconductive particle is in point contact. Since the conductive particles in point contact have a small contact area, the current density of the conductive portion is low.
在點接觸的球形的導電性粒子中，因球形的導電性粒子的比表面積較小而導致導電性粒子與彈性材料之間的結合力低。當檢查受檢設備時，若加壓力反復施加於導電部，則可導致點接觸的導電性粒子之間的接點變得輕易分離並使得導電性粒子與彈性材料之間的結合被輕易解除，從而可導致導電性粒子從原位置中脫離。由此，使得導電性粒子之間的電連接變得不穩定並導致連接器的使用壽命縮短。Among the spherical conductive particles in point contact, since the specific surface area of the spherical conductive particles is small, the binding force between the conductive particles and the elastic material is low. When the device under test is inspected, if the pressure is repeatedly applied to the conductive part, the contacts between the conductive particles in point contact can be easily separated and the bonding between the conductive particles and the elastic material can be easily released. As a result, the conductive particles may be detached from their original positions. Thereby, the electrical connection between electroconductive particles becomes unstable, and the service life of a connector is shortened.
若在高溫環境中使用由球形的導電性粒子組成的導電部，則因彈性材料的膨脹而導致導電性粒子之間的間隔變大並增加接觸電阻。為了增加導電部的電流密度，雖然可高密度聚集球形的導電性粒子，但是，高密度聚集的球形的導電性粒子會降低導電部的工作性。When the conductive part which consists of spherical electroconductive particles is used in a high temperature environment, the space|interval between electroconductive particles becomes large due to the expansion of an elastic material, and a contact resistance increases. In order to increase the current density of the conductive portion, although spherical conductive particles can be aggregated at a high density, the spherical conductive particles aggregated at a high density reduce the workability of the conductive portion.
作為用於增加導電性粒子之間的接觸面積的一種方案，提出了形成特定文字形狀的導電性粒子，例如，C型、H型、V型。當通過磁力排列時，文字形狀的導電性粒子可沿著一個方向相結合。在文字形狀的導電性粒子的粒子之間的接觸面積被限制成粒子之間結合的面積，文字形狀的導電性粒子無法沿著未結合的方向電連接。因此，文字形狀的導電性粒子會降低導電部在未結合方向中的工作性。並且，由文字形狀的導電性粒子組成的導電部因粒子之間較多的空間而具有較低的粒子密度，從而導致導電部的電流密度低。As one solution for increasing the contact area between the conductive particles, conductive particles formed into a specific character shape, for example, C-type, H-type, and V-type have been proposed. When aligned by magnetic force, the text-shaped conductive particles can be combined in one direction. The contact area between the particles of the character-shaped conductive particles is limited to the area where the particles are bonded, and the character-shaped conductive particles cannot be electrically connected in the unbonded direction. Therefore, the electroconductive particle of a character shape reduces the workability|operativity of an electroconductive part in an unbonded direction. In addition, the conductive portion composed of the conductive particles in the shape of a character has a low particle density due to many spaces between the particles, resulting in a low current density of the conductive portion.
由於文字形狀的導電性粒子可通過磁力沿著一個方向相結合，因此，為了提高連接器的收率(yield)，可通過文字形狀的導電性粒子組成導電部。由於文字形狀的導電性粒子可使得導電部的工作性僅在一個方向中實現，因此，可考慮在導電部的上側區間和下側區間配置球形的導電性粒子，在承受較小加壓力的負荷的導電部的中間區間配置文字形狀的導電性粒子。但是，當在導電部使用形狀互不相同的兩種導電性粒子時，在上側區間與中間區間之間及中間區間與下側區間之間的介面中，可通過減少導電性粒子之間的接觸面積來降低導電部的導電性。Since the character-shaped conductive particles can be coupled in one direction by magnetic force, in order to improve the yield (yield) of the connector, the conductive portion can be composed of the character-shaped conductive particles. Since the conductive particles in the shape of characters can realize the workability of the conductive part only in one direction, it is considered that spherical conductive particles are arranged in the upper section and the lower section of the conductive section to withstand a load with a small pressing force. Character-shaped conductive particles are arranged in the middle section of the conductive portion. However, when two types of conductive particles with different shapes are used in the conductive portion, the contact between the conductive particles can be reduced by reducing the interface between the upper section and the middle section and between the middle section and the lower section. area to reduce the conductivity of the conductive portion.
[現有技術文獻] [專利文獻] 專利文獻0001：韓國授權專利公報第10-1525520號。 專利文獻0002：韓國公開專利公報第10-2017-0127319號。[Prior Art Literature] [Patent Literature] Patent Document 0001: Korean Patent Publication No. 10-1525520. Patent Document 0002: Korean Laid-Open Patent Publication No. 10-2017-0127319.
[發明所欲解決之問題] 本發明的一實施例提供如下的導電性粒子，即，能夠增加粒子之間的接觸面積並實現前方向中的面接觸。本發明的一實施例提供如下的導電性粒子，即，能夠以密集分佈構成導電部並增加導電部的導電性和電流密度。本發明的一實施例提供如下的導電性粒子，即，可提高導電部的工作性並分散施加於導電部的加壓力並防止因加壓力產生的損傷。並且，本發明的一實施例提供如下的連接器，即，具有由上述導電性粒子組成的導電部。[Problems to be Solved by Invention] An embodiment of the present invention provides conductive particles capable of increasing the contact area between particles and realizing surface contact in the front direction. An embodiment of the present invention provides conductive particles capable of forming a conductive portion in a dense distribution and increasing the conductivity and current density of the conductive portion. An embodiment of the present invention provides conductive particles that can improve the workability of the conductive portion, disperse the pressing force applied to the conductive portion, and prevent damage due to the pressing force. Moreover, one Embodiment of this invention provides the connector which has the electroconductive part which consists of the said electroconductive particle.
[解決問題之技術手段] 本發明實施例的一實施方式涉及導電性粒子，用於電連接檢查裝置和受檢設備的連接器的導電部。一實施例的導電性粒子包括底面接觸部；以及多個側面接觸部，底面接觸部及多個側面接觸部形成導電性粒子的表面。底面接觸部具有多個邊。多個側面接觸部分別與底面接觸部的多個邊相接觸，沿著垂直於底面接觸部的第一方向逐漸變窄。多個側面接觸部中的相鄰的側面接觸部沿著作為第一方向的周圍方向的第二方向相接觸。[Technical means to solve problems] One Embodiment of the Example of this invention relates to electroconductive particle for electrically connecting the electrically conductive part of the connector of an inspection apparatus and an inspection apparatus. The conductive particle of one embodiment includes a bottom surface contact part; and a plurality of side surface contact parts, and the bottom surface contact part and the plurality of side surface contact parts form the surface of the conductive particle. The bottom surface contact portion has a plurality of sides. The plurality of side contact portions are respectively in contact with the plurality of sides of the bottom contact portion, and gradually narrow along a first direction perpendicular to the bottom contact portion. Adjacent side contact portions among the plurality of side contact portions are in contact along a second direction, which is a peripheral direction of the first direction.
根據一實施例，導電性粒子包括：多個頂點接觸部，分別形成在底面接觸部與多個側面接觸部中的兩個側面接觸部相接觸的位置；多個邊角接觸部，分別形成在底面接觸部與多個側面接觸部中的一個側面接觸部相接觸的位置；以及多個邊角接觸部，分別形成在多個側面接觸部中的相鄰的側面接觸部沿著第二方向相接觸的位置。According to an embodiment, the conductive particle includes: a plurality of vertex contact parts, respectively formed at positions where the bottom surface contact part contacts two side surface contact parts of the plurality of side surface contact parts; a plurality of edge contact parts, respectively formed at a position where the bottom contact portion contacts one side contact portion of the plurality of side contact portions; and a plurality of corner contact portions, respectively formed on adjacent side contact portions of the plurality of side contact portions in contact with each other along the second direction contact location.
根據一實施例，導電性粒子包括上側頂點接觸部，形成在所有多個側面接觸部沿著第一方向相接觸的位置。底面接觸部的一邊長度與從底面接觸部到上側頂點接觸部為止的高度之間的比例可以為1：0.71。According to one embodiment, the conductive particle includes an upper vertex contact portion formed at a position where all the plurality of side contact portions are in contact along the first direction. The ratio between the length of one side of the bottom contact portion and the height from the bottom contact portion to the upper vertex contact portion may be 1:0.71.
根據一實施例，導電性粒子包括：上部面接觸部，從底面接觸部沿著第一方向隔開並與多個側面接觸部相接觸；以及多個頂點接觸部，分別形成在上部面接觸部與多個側面接觸部中的兩個側面接觸部相接觸的位置。According to one embodiment, the conductive particle includes: an upper surface contact portion spaced from the bottom surface contact portion along the first direction and in contact with the plurality of side surface contact portions; and a plurality of vertex contact portions formed on the upper surface contact portion, respectively A position in contact with two side contact portions of the plurality of side contact portions.
根據一實施例，底面接觸部與多個側面接觸部中的一個之間的夾角可以為54.7度。According to an embodiment, the included angle between the bottom contact portion and one of the plurality of side contact portions may be 54.7 degrees.
根據一實施例，底面接觸部和多個側面接觸部可具有多孔性。According to an embodiment, the bottom contact portion and the plurality of side contact portions may have porosity.
本發明實施例的另一實施方式涉及連接器，用於電連接檢查裝置與受檢設備的連接器。一實施例的連接器包括：導電部，具有以能夠導電的方式沿著上下方向接觸的上述導電性粒子；以及絕緣部，由彈性材料製成，用於將多個導電性粒子維持為導電部。Another implementation of the embodiments of the present invention relates to a connector for electrically connecting an inspection apparatus and a device under inspection. A connector according to an embodiment includes: a conductive part having the above-mentioned conductive particles in contact in an up-down direction so as to be able to conduct electricity; and an insulating part made of an elastic material for maintaining the plurality of conductive particles as the conductive part .
根據一實施例，在多個導電性粒子中，相鄰的兩個導電性粒子可通過任一個導電性粒子的底面接觸部與另一個導電性粒子的底面接觸部之間的面接觸、任一個導電性粒子的底面接觸部與另一個導電性粒子的多個側面接觸部中的一個之間的面接觸或任一個導電性粒子的多個側面接觸部中的一個與另一個導電性粒子的多個側面部中的一個之間的面接觸來相互接觸。According to an embodiment, among the plurality of conductive particles, two adjacent conductive particles may be in surface contact through the bottom surface contact portion of any one of the conductive particles and the bottom surface contact portion of the other conductive particle, either The surface contact between the bottom surface contact part of the conductive particle and one of the plurality of side surface contact parts of the other conductive particle, or the multiplication of one of the plurality of side surface contact parts of any one conductive particle and the other conductive particle surface contact between one of the side portions to come into contact with each other.
根據一實施例，在多個導電性粒子中，相鄰的兩個導電性粒子可以以能夠沿著多個側面接觸部中的一個滑動的方式相接觸。According to an embodiment, among the plurality of conductive particles, two adjacent conductive particles may be in contact with each other so as to be slidable along one of the plurality of side contact portions.
根據一實施例，多個導電性粒子中的一部分導電性粒子與多個導電性粒子中的另一部分導電性粒子可具有互不相同的尺寸。According to one embodiment, a part of the conductive particles in the plurality of conductive particles and another part of the conductive particles in the plurality of conductive particles may have mutually different sizes.
一實施例的導電性粒子為具有多個面接觸部的三維形狀的導電性立體物。根據一實施例，由於底面接觸部和沿著垂直於底面接觸部的第一方向逐漸變窄的多個側面接觸部形成導電性粒子的表面，因此，可使得導電性粒子可容易在前方向與另一導電性粒子進行面接觸。由此，若通過一實施例的導電性粒子組成連接器的導電部，則因導電性粒子的密集配置而形成未具有粒子無法接觸方向的導電部，從而增加導電部中的粒子之間的接觸面積並增加導電部的電流密度。所以，相比於由現有的球形導電性粒子或文字形狀的導電性粒子組成的導電部，可實現進一步提升導電性和電流密度的導電部。The conductive particle of one embodiment is a three-dimensional conductive three-dimensional object having a plurality of surface contact portions. According to an embodiment, since the bottom contact portion and the plurality of side contact portions gradually narrowed along the first direction perpendicular to the bottom contact portion form the surface of the conductive particles, the conductive particles can easily interact with the conductive particles in the front direction. The other electroconductive particle makes surface contact. Thereby, when the conductive part of the connector is composed of the conductive particles of one embodiment, the conductive part without the direction in which the particles cannot contact is formed due to the dense arrangement of the conductive particles, thereby increasing the contact between the particles in the conductive part area and increase the current density of the conductive part. Therefore, compared with the electroconductive part which consists of the conventional spherical electroconductive particle or the electroconductive particle of a character shape, the electroconductive part which improves electroconductivity and a current density can be realized.
根據一實施例的導電性粒子所具備的三維立體物的形狀特性，當導電部承受加壓力時，導電部內的一實施例的導電性粒子可沿著前方向相對滑動。由此，在導電部承受加壓力的情況下，可提高在上下方向中的工作性及在水平方向中的工作性，從而提高連接器的使用壽命。According to the shape characteristics of the three-dimensional object possessed by the conductive particles of an embodiment, when the conductive portion is subjected to a pressing force, the conductive particles of an embodiment in the conductive portion can relatively slide in the forward direction. Thereby, when the conductive portion is subjected to a pressing force, the workability in the vertical direction and the workability in the horizontal direction can be improved, thereby improving the service life of the connector.
根據一實施例的導電性粒子所具備的三維立體物的形狀特性，由於具有增加的比表面積並組成導電部的所有導電性粒子形成一個相互結合體，因此，可防止產生導電性粒子的脫離並增加導電部的耐久性。According to the shape characteristic of the three-dimensional object possessed by the conductive particles of one embodiment, since all the conductive particles having an increased specific surface area and constituting the conductive portion form a mutual bond, the separation of the conductive particles can be prevented and the occurrence of Increase the durability of the conductive portion.
一實施例的導電性粒子可具有增加的接觸面積和密集的分佈結構且以能夠導電的方式沿著上下方向相接觸，因此，可實現導電性有所增加且粒子之間的接觸結構穩定的導電部。並且，由於導電性粒子以能夠導電的方式相接觸且具有增加的接觸面積和密集的分佈結構，因此，可製造一種具有導電性粒子之間的電連接穩定的導電部並具有優秀收率的連接器。The conductive particles of an embodiment can have an increased contact area and a dense distribution structure, and are in contact along the upper and lower directions in a conductive manner. Therefore, the conductive particles with increased conductivity and stable contact structure between particles can be realized. department. Also, since the conductive particles are in contact with each other in a conductive manner and have an increased contact area and a dense distribution structure, it is possible to manufacture a connection having a conductive portion with stable electrical connection between the conductive particles and an excellent yield device.
本發明實施例的例示以說明本發明的技術思想為目的。本發明的發明要求保護範圍並不限定於以下實施例的具體說明。The illustration of the embodiment of the present invention is for the purpose of explaining the technical idea of the present invention. The claimed protection scope of the present invention is not limited to the specific description of the following examples.
除非另有定義，否則在本發明中所使用的所有技術術語及科學術語具有與本發明所屬技術領域的普通技術人員所理解的含義相同。在本發明中選擇使用的所有術語僅用於進一步明確說明本發明，並不用於限定本發明的發明要求保護範圍。Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as understood by one of ordinary skill in the art to which this invention belongs. All terms selected and used in the present invention are only used to further and clearly describe the present invention, and are not used to limit the claimed protection scope of the present invention.
除非在句子或文章中特別提及相應表達方式，否則在本發明中所使用的「包括」、「具有」、「具備」等表達方式應理解為開放性術語（open-ended terms），具有包括其他實施例的可能性。Unless the corresponding expressions are specifically mentioned in a sentence or article, expressions such as "including", "having" and "having" used in the present invention should be understood as open-ended terms, including Possibilities of other embodiments.
除非另有說明，否則在本發明中所記述的單數的表達包括複數的含義，其同樣適用於發明要求保護範圍中的單數的表達。Unless otherwise specified, the singular expression described in the present invention includes the plural meaning, which is also applicable to the singular expression in the protection scope of the invention.
在本發明中所使用的「第一」、「第二」等表達僅用於相互區分多個結構元件，並不限定相應結構元件的順序或重要性。Expressions such as "first" and "second" used in the present invention are only used to distinguish a plurality of structural elements from each other, and do not limit the order or importance of the corresponding structural elements.
在本發明中，當某結構元件與另一結構元件「相連接」或「相結合」時，上述某結構元件可直接與上述另一結構元件相連接或相結合，但還應理解為在中間以新的其他結構元件為介質相連接或相結合。In the present invention, when a certain structural element is "connected" or "combined" with another structural element, the above-mentioned certain structural element can be directly connected or combined with the above-mentioned other structural element, but it should also be understood as an intermediate Connect or combine with new other structural elements as a medium.
在本發明中所示記載的尺寸和數值並不限定於所記載的尺寸或數值。除非另有說明，否則應理解上述尺寸或數值具有所記載的值及包括其值的等同範圍。The dimensions and numerical values shown and described in the present invention are not limited to the described dimensions or numerical values. Unless otherwise indicated, the above dimensions or numerical values are to be understood to have the recited values and equivalent ranges including their values.
在本發明中所使用的方向指示語「上方」是指基於連接器相對於檢查裝置的位置方向，方向指示語「下方」是指與上方相反的方向。雖然在本發明中所使用的方向指示語「上下方向」包括上方方向和下方方向，但應理解的是，其並非指定上方方向和下方方向中的一個方向。The directional term "upper" used in the present invention refers to the direction based on the position of the connector with respect to the inspection device, and the directional term "below" refers to the direction opposite to the upper direction. Although the directional indicator "up and down direction" used in the present invention includes the upper direction and the lower direction, it should be understood that it does not specify one of the upper direction and the lower direction.
以下，參照附圖所示的多個例說明實施例。在附圖中，對於相同或對應的結構元件賦予了相同的附圖標記。並且，在說明以下實施例的過程中，省略了對於相同或對應的結構元件的重複說明。但是，即使省略了相關結構元件的技術，也並不意味著能夠從某一實施例中排除這種結構元件。Hereinafter, the embodiment will be described with reference to a plurality of examples shown in the accompanying drawings. In the drawings, the same or corresponding structural elements are given the same reference numerals. Also, in describing the following embodiments, repeated descriptions of the same or corresponding structural elements are omitted. However, even if the technique of a related structural element is omitted, it does not mean that such a structural element can be excluded from a certain embodiment.
以下說明的實施例和附圖示出的例涉及用於電連接檢查裝置和受檢設備的連接器及用於組成上述連接器的導電部而使用的導電性粒子。在電檢查受檢設備的情況下，實施例的連接器可用於檢查裝置和受檢設備的電連接。作為一例，在半導體設備的製造步驟中的後半步驟中，雖然實施例的連接器用於半導體設備的最終電檢查，但是，應用實施例的連接器的例並不限定於此。The embodiments described below and the examples shown in the drawings relate to a connector for electrically connecting an inspection apparatus and a device to be inspected, and conductive particles used for constituting a conductive portion of the connector. In the case of electrical inspection of the device under test, the connector of the embodiment may be used to inspect the electrical connection of the device and the device under test. As an example, in the second half of the manufacturing steps of the semiconductor device, the connector of the embodiment is used for the final electrical inspection of the semiconductor device, but the example to which the connector of the embodiment is applied is not limited to this.
參照圖1，說明一實施例的連接器的結構及應用連接器的例。圖1簡要示出了連接器和與連接器相連接的電子設備，圖1所示的形狀僅屬於為了理解實施例而選擇的例。Referring to FIG. 1 , a configuration of a connector according to an embodiment and an example of applying the connector will be described. FIG. 1 schematically shows a connector and an electronic device connected to the connector, and the shape shown in FIG. 1 is only an example selected for understanding of the embodiment.
一實施例的連接器10為片（sheet）形狀的結構物。連接器10配置在兩個電子設備之間。在圖1所示的例中，兩個電子設備中的一個可以為檢查裝置20，而另一個可以為被檢查裝置20檢查的受檢設備30。The
作為一例，連接器10以能夠更換的方式固定在測試插口40，通過測試插口40位於檢查裝置20的上方。測試插口40以能夠消除的方式安裝在檢查裝置20。測試插口40在其內部收容通過手工或搬運裝置向檢查裝置20搬運的受檢設備30，可整列受檢設備30與連接器10相對應。當檢查受檢設備30時，連接器10沿著上下方向VD與檢查裝置20和受檢設備30相接觸，使得檢查裝置20與受檢設備30相互電連接。As an example, the
受檢設備30可以為使用樹脂材料將半導體IC晶片和多個端子以正方體形狀封裝形成的半導體設備。受檢設備30在其下側具有多個端子31。端子31可以為球（ball）類型的端子。受檢設備30也可具有相比於球類型的端子高度較低的地（land）類型的端子。The
檢查裝置20可檢查受檢設備30的各種工作特性。檢查裝置20可具有用於檢查的板，可在上述板設置有用於檢查受檢設備的檢查電路21。並且，檢查電路21具有與連接器10的導電部相接觸的多個端子22。檢查裝置20的端子22可發送電測試信號並接收回應信號。The
當檢查受檢設備30時，連接器10使得檢查裝置的端子22和與其相對應的受檢設備的端子31沿著上下方向VD電連接，通過連接器10使得檢查裝置20執行受檢設備30的檢查。When inspecting the device under
連接器10的至少一部分可由彈性物質組成。為了檢查受檢設備30，可通過機械裝置或手動方式使得加壓力P沿著上下方向VD的下方通過受檢設備30施加於連接器10。可通過加壓力P使得受檢設備的端子31與連接器10沿著上下方向VD緊貼，並且，可使得連接器10和檢查裝置的端子22沿著上下方向VD緊貼。並且，可通過加壓力P使得連接器10的一部分結構元件沿著下方方向和水平方向HD產生彈性變形。若消除加壓力P，則連接器10的上述一部分結構元件可復原成原來形狀。At least a portion of the
參照圖1，一實施例的連接器10包括導電部11和絕緣部12。導電部11沿著上下方向VD設置，以能夠沿著上下方向VD導電的方式形成。絕緣部12包圍導電部11並絕緣導電部11。連接器10可包括多個導電部11，絕緣部12沿著水平方向HD隔開多個導電部11，可形成為能夠相互絕緣多個導電部11的一個彈性體。Referring to FIG. 1 , a
當檢查受檢設備時，導電部11的其下端與檢查裝置的端子22相接觸，其上端與受檢設備的端子31相接觸。因此，在與一個導電部11相對應的端子22與端子31之間形成有以導電部11為介質的上下方向的導電路徑。檢查裝置的測試信號可通過導電部11從端子22傳遞到受檢設備30的端子31，受檢設備30的回應信號可通過導電部11從端子31傳遞到檢查裝置20的端子22。When the device under inspection is inspected, the lower end of the
在連接器10中，導電部11大致可形成圓柱形狀。在導電部11的圓柱形狀中，上端及下端的尺寸可大於中間的尺寸。即，導電部11可形成上下方向中的中間部分比上端及下端更窄的圓柱形狀。In the
圖1示出了導電部11的上端並未突出於絕緣部12的上部面且導電部11的下端並未突出於絕緣部12的下部面的例。作為另一例，可形成如下的導電部11，即，使得導電部11的上端突出於絕緣部12的上部面。並且，可形成如下的導電部11，即，使得導電部11的下端突出於絕緣部12的下部面。1 shows an example in which the upper end of the
導電部11的平行排列方式可根據受檢設備30的端子31的排列方式產生多種變化。例如，在連接器10中，絕緣部12可形成為四邊形區域，導電部11可在絕緣部12內排列成一行列或一雙行列。或者，導電部11也可沿著絕緣部12的四邊形區域的每條邊排列成一行列。The parallel arrangement of the
導電部11包括多個導電性粒子。多個導電性粒子以能夠導電的方式沿著上下方向VD相接觸，從而組成的導電部11。通過以能夠導電的方式沿著上下方向VD相接觸的多個導電性粒子在導電部11內沿著上下方向VD形成導電路徑。在多個上述導電性粒子中，相鄰的導電性粒子可通過面與面相接觸的面接觸方式、面與線或線與線相接觸的線接觸方式或面與點相接觸的點接觸方式沿著上下方向VD相接觸，並且，相鄰的導電性粒子可沿著上下方向VD相接觸或沿著水平方向HD相接觸或沿著上下方向與水平方向之間的傾斜方向相接觸。通過以上例示性的接觸方式，使得多個導電性粒子沿著上下方向VD以能夠導電的方式相接觸並形成密集的分佈結構，從而可組成導電部11。The
絕緣部12由具有絕緣性的彈性材料製成。雖然作為形成絕緣部12的上述彈性材料可包括矽橡膠，但並不限定於此。絕緣部12將以能夠導電的方式沿著上下方向VD相接觸的多個上述導電性粒子維持成導電部11。並且，形成絕緣部12的上述彈性材料可填充導電部11的多個導電性粒子之間的間隔。即，導電部11包括形成絕緣部12的彈性材料的一部分，這種導電部的彈性材料可存在於導電部的下端到上端為止。The insulating
包括彈性材料的導電部11和由彈性材料形成的絕緣部12具有上下方向VD和水平方向HD的彈性。當受檢設備的端子31因加壓力P而向下方按壓導電部11的上端時，導電部11可沿著水平方向HD略微膨脹並以沿著下方壓縮的方式產生彈性變形，絕緣部12可產生彈性變形以允許導電部11的膨脹。若消除加壓力P，則導電部11和絕緣部12可彈性復原成原狀態。The
作為一例，導電部11和絕緣部12可從在液相彈性物質混合有多個導電性粒子的液相成型材料中一併成型。上述液相彈性物質是指形成絕緣部12的彈性材料的液體狀態的物質。可將液相成型材料注入於成型模具並使得磁場沿著上下方向施加於形成導電部的每個位置。由此，導電性粒子將聚集在施加磁場的導電部的區域並沿著上下方向相接觸。隨後，通過固化液相成型材料來同時形成導電部11和絕緣部12，從而可成型一實施例的連接器。作為另一例，首先，通過固體狀態的上述彈性材料形成絕緣部12，並在這種絕緣部12按照導電部11的位置形成貫通孔。通過向上述貫通孔注入上述液相成型材料並沿著上下方向施加磁場來使得導電性粒子沿著上下方向聚集並相互接觸，隨後，可固化注入於貫通孔的液相成型材料。As an example, the
參照圖2至圖9，說明實施例的導電性粒子。圖2至圖9為簡要示出了導電性粒子的形狀和導電性粒子的接觸方式。圖2至圖9所示的接觸方式僅為用於理解實施例而選擇的例。2-9, the electroconductive particle of an Example is demonstrated. 2 to 9 schematically illustrate the shape of the conductive particles and the contact mode of the conductive particles. The contact patterns shown in FIGS. 2 to 9 are only selected examples for understanding the embodiments.
圖2為示出一實施例的導電性粒子的立體圖，圖3為圖2所示的導電性粒子的主視圖(正視圖，front view)。以下，參照圖2及圖3說明一實施例的導電性粒子的結構。FIG. 2 is a perspective view showing an electroconductive particle according to an embodiment, and FIG. 3 is a front view (front view) of the electroconductive particle shown in FIG. 2 . Hereinafter, the structure of the electroconductive particle of an Example is demonstrated with reference to FIG.2 and FIG.3.
導電性粒子100用於組成上述連接器的導電部，由金屬材料製成。一實施例的導電性粒子100為三維立體物。導電性粒子100具有沿著垂直於立體物的底面方向逐漸變窄的形狀，由於這種導電性粒子的形狀特性，多個導電性粒子密集分佈在導電部的內部並使得接觸面積有所增加。The
導電性粒子100以能夠導電的方式在其表面部分或形成在其表面之間的點部分或形成在其表面之間的線部分與另一導電性粒子相接觸。即，在導電性粒子100的表面部分、線部分及點部分為以能夠導電的方式與另一導電性粒子相接觸的接觸部。在以下說明過程中，表面部分的接觸部參照面接觸部，線部分的接觸部參照邊角接觸部，點部分的接觸部參照頂點接觸部。實施例的導電性粒子可包括四個以上的面接觸部、6個以上的邊角接觸及四個以上的頂點接觸部。The
如圖2所示，導電性粒子100包括形成導電性粒子的表面的5個面接觸部。導電性粒子100的5個面接觸部分別為底面接觸部111及多個側面接觸部112、113、114、115。底面接觸部111可以與作為立體物的導電性粒子的底面相對應。圖2示出的導電性粒子可具有四角錐形狀，多個側面接觸部可以與作為立體物的導電性粒子的四個側面相對應。因此，導電性粒子100的多個側面接觸部是指第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115。As shown in FIG. 2, the
底面接觸部111可形成為四邊形。雖然底面接觸部111的四邊形可以為正方形，但是，底面接觸部111也可形成為長方形。四邊形的底面接觸部111具有多個邊。與底面接觸部111的邊數量相同的第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115分別與底面接觸部111的四個邊相接觸。The bottom
第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的一部分或整體可分別具有與等腰三角形相對應的形狀。因此，當假設第一方向AD經過底面接觸部111的中心並垂直於底面接觸部111時，第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115可沿著第一方向AD逐漸變窄。並且，當假設第二方向CD為第一方向AD的周圍方向時，在第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的沿著第二方向CD相鄰的側面接觸部相接觸。即，第一側面接觸部112與第二側面接觸部113相接觸，第二側面接觸部113與第三側面接觸部114相接觸、第三側面接觸部114與第四側面接觸部115相接觸，第四側面接觸部115與第一側面接觸部112相接觸。A part or the whole of the first
根據上述底面接觸部與第一側面接觸部至第四側面接觸部的形狀特性，導電性粒子100可具有四角錐形狀或與四角錐台類似的形狀。由於導電性粒子100具有沿著第一方向AD逐漸變窄的形狀特性，因此，導電性粒子100的底面接觸部或側面接觸部中的一個可以與另一導電性粒子的底面接觸部或側面接觸部中的一個輕易實現面接觸。因此，一實施例的導電性粒子可在具有密集的分佈結構和有所增加的接觸面積的同時組成導電部。According to the shape characteristics of the bottom contact portion and the first to fourth side contact portions, the
形成在底面接觸部111與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115相接觸的位置的頂點和邊角形成上述頂點接觸部和邊角接觸部。因此，實施例的導電性粒子包括多個頂點接觸部和多個邊角接觸部，分別形成在底面接觸部與側面接觸部相接觸的位置。當導電性粒子組成導電部時，導電性粒子的一個頂點接觸部可以與另一導電性粒子的面接觸部中的一個相接觸，導電性粒子的一個邊角接觸部可以與另一導電性粒子的面接觸部中的一個或邊角接觸部中的一個相接觸。The vertices and corners formed at the positions where the
一實施例的導電性粒子100包括第一頂點接觸部121、第二頂點接觸部122、第三頂點接觸部123及第四頂點接觸部124，分別形成在底面接觸部111與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的兩個側面接觸部相接觸的位置。如圖2及圖3所示，四角錐形狀的導電性粒子100包括位於最上端的第五頂點接觸部125。第五頂點接觸部125為導電性粒子100的上側頂點接觸部。第五頂點接觸部125形成在第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115全部沿著第一方向AD相接觸的位置。The
一實施例的導電性粒子100包括上述多個邊角接觸部，即，第一邊角接觸部131、第二邊角接觸部132、第三邊角接觸部133、第四邊角接觸部134、第五邊角接觸部135、第六邊角接觸部136、第七邊角接觸部137及第八邊角接觸部138。第一邊角接觸部131、第二邊角接觸部132、第三邊角接觸部133及第四邊角接觸部134分別形成在底面接觸部111與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的一個側面接觸部相接觸的位置。第五邊角接觸部135、第六邊角接觸部136、第七邊角接觸部137及第八邊角接觸部138分別形成在第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中相鄰的側面接觸部沿著第二方向CD相接觸的位置。The
一實施例的導電性粒子100由金屬材料製成，可通過粉末冶金步驟將金屬粉末成型為燒結體來製備。上述金屬粉末的金屬材料可以為鐵、鎳、金、銀、銅、鈀、銠、鎢、鉑、鈦、鈷。上述燒結體可以為部分固溶體。作為一例，可將用於導電性的銀（Ag）的粉末、銅（Cu）的金屬粉末、用於賦予磁性的鈷（Co）的粉末通過燒結成型來製備導電性粒子。The
可在成型為燒結體的導電性粒子100的表面和內部形成有多個由開孔或閉孔混合形成的微型氣孔。即，形成導電性粒子100的表面的底面接觸部和側面接觸部具有多孔性。由此，底面接觸部111和第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115具有較大的表面粗糙度（surface roughness）和較高的比表面積（specific surface area）。因此，導致形成連接器的絕緣部的彈性材料與導電性粒子100的表面之間的接觸面積或連接器的導電部內的彈性材料與導電性粒子100的表面之間的接觸面積有所增加，從而可使得導電性粒子100通過強力的結合力維持在導電部內。A plurality of micro pores formed by mixing open pores or closed pores may be formed on the surface and inside of the
根據一實施例，具有多種尺寸的導電性粒子可組成連接器的導電部。圖4為簡要示出一實施例的具有多種尺寸的導電性粒子的立體圖。According to an embodiment, conductive particles with various sizes may constitute the conductive portion of the connector. FIG. 4 is a perspective view schematically showing conductive particles having various sizes according to an embodiment.
參照圖4，導電性粒子101、102、103可具有多種尺寸。在導電性粒子101、102、103中，底面接觸部111的一邊長度L與從底面接觸部111到第五頂點接觸部（上側頂點接觸部）125的高度H可互不相同。但是，在多種尺寸的導電性粒子101、102、103中的底面接觸部111的一邊長度L與從底面接觸部到111第五頂點接觸部125的高度H的比例可相同。作為一例，底面接觸部111的一邊長度L與從底面接觸部111到第五頂點接觸部125的高度H的比例可以為約1：0.71。並且，底面接觸部111的邊長L可以為20μm至60μm。4, the
如圖4所例示，多種尺寸的導電性粒子可用於組成一實施例的連接器的導電部。因此，組成連接器的導電部的多個導電性粒子中的一部分導電性粒子與另一部分導電性粒子可具有互不相同的尺寸。通過具有多種尺寸的導電性粒子組成導電部，可使得導電部中的粒子密度進一步增加。As illustrated in FIG. 4 , conductive particles of various sizes can be used to form the conductive portion of the connector of one embodiment. Therefore, a part of electroconductive particle and another part of electroconductive particle among the some electroconductive particle which comprise the electroconductive part of a connector may have mutually different size. The particle density in the conductive portion can be further increased by constituting the conductive portion with conductive particles having various sizes.
在一實施例的導電性粒子中，底面接觸部與側面接觸部中的一個之間的夾角可以為特定角度。圖5a及圖5b為簡要示出一實施例的導電性粒子的縱剖面形狀的圖。參照圖5a及圖5b，底面接觸部111與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的一個之間的夾角IA可以為約54.7度。如圖5a所示，底面接觸部111與第一側面接觸部112之間的夾角IA及底面接觸部111與第三側面接觸部114之間的夾角IA可以為約54.7度。如圖5b所示，底面接觸部111與第四側面接觸部115之間的夾角IA可以為約54.7度。並且，在具有多種尺寸的導電性粒子中，底面接觸部與側面接觸部中的一個之間均可具有上述夾角IA。In the conductive particle of an embodiment, the included angle between the bottom contact portion and one of the side contact portions may be a specific angle. FIGS. 5 a and 5 b are diagrams schematically showing the longitudinal cross-sectional shape of the electroconductive particles according to the embodiment. 5a and 5b, the angle IA between the
圖6為示出再一實施例的導電性粒子的立體圖。圖6示出了具有四角錐台形狀的導電性粒子。FIG. 6 is a perspective view showing an electroconductive particle of still another example. FIG. 6 shows electroconductive particles having a quadrangular frustum shape.
參照圖6，導電性粒子100A包括：上述底面接觸部；上述第一側面接觸部至第四側面接觸部；上述第一頂點接觸部至第四頂點接觸部；以及上述第一邊角接觸部至第八邊角接觸部。圖6示出的導電性粒子100A包括呈四邊形且面積比底面接觸部111小的上部面接觸部116。上部面接觸部116從底面接觸部111沿著第一方向AD隔開，上部面接觸部116可平行於底面接觸部111。上部面接觸部116在其四個邊中分別與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115相接觸。像這樣，包括上部面接觸部116的導電性粒子100A可具有四角錐台形狀。導電性粒子100A並不包括上述第五頂點接觸部。導電性粒子100A包括第六頂點接觸部126、第七頂點接觸部127、第八頂點接觸部128及第九頂點接觸部129，分別形成在上部面接觸部116與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的兩個側面接觸部相接觸的位置。並且，可在上部面接觸部116與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的一個側面接觸部相接觸的位置分別形成有邊角接觸部。6 , the
與上述實施例的導電性粒子相同，導電性粒子100A可形成多種尺寸。並且，在導電性粒子100A中，底面接觸部111與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的一個之間的夾角可以為約54.7度。並且，在導電性粒子100A中，上部面接觸部126與第一側面接觸部112、第二側面接觸部113、第三側面接觸部114及第四側面接觸部115中的一個之間的夾角可以為125.3度。Like the conductive particles of the above-described embodiments, the
圖7為示出另一實施例的導電性粒子的立體圖。圖7所示的導電性粒子可具有底面為長方形的四角錐形狀。即，圖7所示的導電性粒子100B的底面接觸部111為長方形。導電性粒子100B也可形成與圖6所示的導電性粒子類似的四角錐台形狀。FIG. 7 is a perspective view showing an electroconductive particle of another embodiment. The electroconductive particle shown in FIG. 7 may have a quadrangular pyramid shape whose bottom surface is a rectangle. That is, the bottom
若向由絕緣部的彈性材料的液相物質與多個上述導電性粒子混合而成的液相成型材料對導電部的每個位置沿著上下方向施加磁場，則多個導電性粒子聚集在磁場區域並沿著上下方向密集接觸。由此，可通過多個導電性粒子組成連接器的導電部。根據導電性粒子具有的上述形狀特徵，導電性粒子可在磁場區域內以未產生相互之間的間隔的方式密集接觸。因此，導電性粒子可沿著上下方向密集分佈在連接器的導電部內。所以，連接器的導電部可因具有增加的粒子密度和粒子之間的接觸面積而表現出提高的導電性及電流密度。When a magnetic field is applied to the liquid-phase molding material in which the liquid-phase substance of the elastic material of the insulating portion and the plurality of the conductive particles are mixed in the vertical direction for each position of the conductive portion, the plurality of conductive particles are gathered in the magnetic field. area and in close contact along the top-bottom direction. Thereby, the electroconductive part of a connector can be comprised by several electroconductive particle. According to the said shape characteristic which electroconductive particle has, electroconductive particle can contact densely so that the space|interval between them may not generate|occur|produce in a magnetic field area|region. Therefore, the conductive particles can be densely distributed in the conductive portion of the connector in the up-down direction. Therefore, the conductive portion of the connector may exhibit increased electrical conductivity and current density due to increased particle density and contact area between particles.
圖8為簡要示出在一實施例的連接器的導電部內的一實施例的導電性粒子以能夠導電的方式相接觸的例的立體圖。FIG. 8 is a perspective view schematically showing an example in which conductive particles of an embodiment are in contact with each other so as to be able to conduct electricity in a conductive portion of a connector of an embodiment.
雖然圖8示出了由四角錐形狀的導電性粒子組成的導電部的例，但是，也可通過圖6和圖7所示的導電性粒子組成導電部。並且，也可混合圖2、圖6及圖7所示的導電性粒子組成導電部。Although FIG. 8 shows the example of the electroconductive part which consists of the electroconductive particle of the quadrangular pyramid shape, the electroconductive part may be comprised by the electroconductive particle shown in FIG.6 and FIG.7. Moreover, the electroconductive particle shown in FIG. 2, FIG. 6, and FIG. 7 may be mixed to form an electroconductive part.
一實施例的多個導電性粒子以能夠導電的方式沿著上下方向VD相接觸，從而組成連接器的導電部11。導電部11可包括相同尺寸的導電性粒子104、105。多個導電性粒子104、105以無序取向(orientational disorder)密集接觸在導電部11內。垂直於底面接觸部的第一方向AD無序取向定位在導電部11內。例如，導電性粒子的第一方向AD定位在上下方向VD、水平方向HD或上下方向VD與水平方向HD之間的任意傾斜方向，導電性粒子可在導電部11沿著上下方向和水平方向密集分佈。並且，可通過在導電部11內密集分佈配置導電性粒子來使得各個導電性粒子的第五頂點接觸部125朝向上下方向VD、水平方向HD或上下方向VD與水平方向HD之間的任意傾斜方向。The plurality of conductive particles of one embodiment are in contact with each other along the vertical direction VD so as to be able to conduct electricity, thereby forming the
導電部11內的相鄰的導電性粒子104、105可通過面接觸方式、面與線的接觸方式、面與點的接觸方式相接觸。與此相關地，面接觸是指一個導電性粒子104的底面接觸部或側面接觸部中的一個與另一導電性粒子105的底面接觸部或側面接觸部中的一個相接觸。面與線的接觸是指一個導電性粒子104的底面接觸部或側面接觸部中的一個與另一導電性粒子105的邊角接觸部中的一個相接觸。面與點的接觸是指一個導電性粒子104的底面接觸部或側面接觸部中的一個與另一導電性粒子105的頂點接觸部中的一個相接觸。The adjacent
具體地，上述面接觸可包括底面接觸部與底面接觸部的面接觸、底面接觸部與側面接觸部的面接觸、側面接觸部與側面接觸部的面接觸。即，在導電部11內，相鄰的兩個導電性粒子104、105可通過如下方式相接觸，即，一個導電性粒子104的底面接觸部與另一導電性粒子105的底面接觸部之間的面接觸、一個導電性粒子104的底面接觸部與另一導電性粒子105的側面接觸部中的一個之間的面接觸或一個導電性粒子104的側面接觸部中的一個與另一導電性粒子105的側面接觸部中的一個之間的面接觸。Specifically, the above-mentioned surface contact may include surface contact between the bottom surface contact part and the bottom surface contact part, the surface contact between the bottom surface contact part and the side surface contact part, and the surface contact between the side surface contact part and the side surface contact part. That is, in the
如上所述，相鄰的兩個導電性粒子104、105通過面接觸部的任意方向中的面接觸來使得組成導電部11的多個導電性粒子表現出在前方向中的接觸性。並且，通過相接觸的面接觸部來使得相鄰的兩個導電性粒子104、105的第一方向AD並不平行且相互重疊或交叉。由此，如圖8所示，相鄰的導電性粒子104、105可沿著上下方向VD及水平方向HD密集分佈並相互接觸。因此，組成導電部11的多個導電性粒子可在導電部11內以非常高的密集度並能夠導電的方式沿著上下方向相接觸。As described above, the two adjacent
並且，導電部11內的相鄰的導電性粒子104、105可通過如線接觸的接觸方式相接觸。與此關聯地，線接觸是指一個導電性粒子104的邊角接觸部中的一個與另一導電性粒子105的邊角接觸部中的一個相接觸。In addition, the adjacent
如上所述，配置成無序取向並相互密集接觸的導電性粒子104、105可大幅增加在導電部11內的粒子之間的接觸面積。當通過由底面接觸部與側面接觸部組成的四角錐形狀的導電性粒子組成導電部11時，可容易引導相鄰的導電性粒子之間的面接觸。並且，多個導電性粒子在上述接觸方式中主要以面接觸的接觸方式進行接觸。因此，在組成導電部11的多個導電性粒子中並無接觸性低的方向，多個導電性粒子具有大幅增加的接觸面積。並且，在導電部11內，由於多個導電性粒子相結合成一個結構物，因此，可防止在導電部產生導電性粒子的脫離並增加導電部的耐久性。並且，由於多個導電性粒子以高密度分佈在導電部11內，因此，可提高導電部的電流密度。As described above, the
作為另一例，導電部11可包括具有多種尺寸的導電性粒子。如圖4所示，多種尺寸的導電性粒子可組成導電部11並混合存在於導電部11內。在這種例中，組成導電部11的多個導電性粒子中的一部分導電性粒子和多個導電性粒子中的另一部分導電性粒子可具有互不相同的尺寸。並且，也可通過混合如圖2及圖4所示的導電性粒子、圖6所示的導電性粒子及圖7所示的導電性粒子中的兩種以上的導電性粒子來組成導電部11。在這種例中也相同，多種尺寸的導電性粒子可用於導電部11。As another example, the
由作為從底面逐漸變窄的立體物組成的導電性粒子通過面接觸相接觸，導電性粒子可通過各自的面接觸部進行滑動。因此，當檢查受檢設備時，導電部內的整體導電性粒子回應所施加的加壓力相對滑動，從而提高與加壓力相對應的工作性。並且，當導電性粒子以組成導電部的方式聚集在磁場內時，面接觸部的滑動特性可使得導電性粒子的移動變得容易。參照圖9，例示出在一實施例的連接器的導電部內的一實施例的導電性粒子相對滑動移動。The conductive particles composed of the three-dimensional objects gradually narrowed from the bottom surface are in contact with each other by surface contact, and the conductive particles can slide through the respective surface contact portions. Therefore, when the device to be inspected is inspected, the entirety of the conductive particles in the conductive portion relatively slides in response to the applied pressing force, thereby improving the workability corresponding to the pressing force. Furthermore, when the conductive particles are gathered in the magnetic field so as to constitute the conductive portion, the sliding properties of the surface contact portion can facilitate the movement of the conductive particles. Referring to FIG. 9 , it is illustrated that the conductive particles of one embodiment in the conductive portion of the connector of one embodiment are relatively slidingly moved.
相鄰的兩個導電性粒子104、105分別通過側面接觸部之間的面接觸相接觸。因此，在組成導電部的多個導電性粒子中，相鄰的兩個導電性粒子104、105相接觸，以能夠沿著側面接觸部中的一個滑動。並且，在相鄰的兩個導電性粒子通過底面接觸部實現面接觸的狀態下，相鄰的兩個導電性粒子也可沿著底面接觸部滑動。The adjacent two
當檢查受檢設備時，加壓力P沿著上下方向VD中的下方施加於導電部11。相鄰的兩個導電性粒子中的一個導電性粒子104的側面接觸部中的一個和另一導電性粒子105的側面接觸部中的一個通過面接觸相接觸。一個導電性粒子104與另一導電性粒子105隨著回應加壓力P並通過實現面接觸的側面接觸部而被引導，可沿著滑動方向SD進行滑動。滑動方向SD可以為加壓力P的方向、垂直於加壓力P的方向或傾斜於加壓力P的方向。When the device under inspection is inspected, the pressing force P is applied to the
在導電部11內，可滑動的兩個導電性粒子可回應加壓力P並容易沿著傾斜於水平方向HD或水平方向HD的方向移動。因此，連接器的導電部可通過加壓力P沿著水平方向膨脹，在此過程中，導電性粒子可滑動。通過加壓力滑動移動的導電性粒子可提高導電部在上下方向及水平方向中的工作性。並且，通過加壓力滑動移動的導電性粒子可分散施加於導電部的加壓力P並減少因加壓力P引起的受損。In the
圖9示出的導電性粒子的接觸方式僅為例示。相鄰的導電性粒子可通過底面接觸部之間的面接觸相接觸，或者，可通過底面接觸部與側面接觸部中的一個之間的面接觸相接觸，或者，可通過底面接觸部或側面接觸部與邊角接觸部之間的接觸相接觸。上述接觸可定位在相對於上下方向VD的多種方向。因此，導電部內的多個導電性粒子可回應加壓力P並在前方向進行相對滑動。The contact form of the electroconductive particle shown in FIG. 9 is only an illustration. Adjacent conductive particles may be in contact by surface contact between bottom contact portions, or may be in contact by surface contact between the bottom contact portion and one of the side contact portions, or may be in contact by bottom contact portion or side surface The contact portion is in contact with the contact between the corner contact portion. The above-mentioned contacts can be positioned in various directions with respect to the up-down direction VD. Therefore, the plurality of conductive particles in the conductive portion can respond to the pressing force P and relatively slide in the forward direction.
如上所述，高密度分佈並實現相對滑動移動的導電性粒子可分佈在連接器的導電部中的下端到上端。即，在一實施例的連接器的導電部中，具有相同或不同尺寸且具有四角錐或四角錐台形狀的導電性粒子以高密度分佈在導電部的上側區間、導電部的中間區間及導電部的下側區間。因此，一實施例的連接器的導電部可消除因使用兩種粒子引起的問題，例如，不穩定結合力及接觸面積等。作為另一實施例，可在導電部的上側區間和下側區間配置有球形的導電性粒子，也可在導電部的中間區間配置有實施例的導電性粒子。在此例中，由於實施例的導電性粒子密集分佈，因此，可穩定確保實施例的導電性粒子與球形的導電性粒子之間的介面中的粒子之間的接觸面積。As described above, the conductive particles that are distributed at a high density and achieve relative sliding movement can be distributed from the lower end to the upper end in the conductive portion of the connector. That is, in the conductive portion of the connector of an embodiment, the conductive particles having the same or different sizes and having the shape of a quadrangular pyramid or a quadrangular pyramid are distributed at high density in the upper section of the conductive section, the middle section of the conductive section, and the conductive particles. the lower section of the section. Therefore, the conductive portion of the connector of an embodiment can eliminate the problems caused by using two kinds of particles, such as unstable bonding force and contact area. As another example, spherical conductive particles may be arranged in the upper section and lower section of the conductive portion, and the conductive particles of the embodiment may be arranged in the middle section of the conductive portion. In this example, since the conductive particles of the embodiment are densely distributed, the contact area between the particles in the interface between the conductive particles of the embodiment and the spherical conductive particles can be stably secured.
一實施例的導電性粒子通過粉末冶金步驟將金屬粉末成型為燒結體來製造。圖10a至圖10e為簡要示出製造一實施例的導電粒子的例示圖，圖10a至圖10e示出的形狀僅為用於理解實施例而選擇的例。The conductive particles of one embodiment are produced by molding metal powder into a sintered body through a powder metallurgy step. FIGS. 10 a to 10 e are schematic diagrams illustrating the production of conductive particles of an embodiment, and the shapes shown in FIGS. 10 a to 10 e are only selected examples for understanding the embodiment.
參照圖10a，準備用於成型導電性粒子的成型基板310。作為一例，成型基板可以為矽晶片基板。可在成型基板310的上部面311附著有貫通形成多個開口（未圖示）的掩膜(或遮罩，mask)（未圖示）。上述掩膜的上述開口可以與導電性粒子的上述底面接觸部的形狀相對應。Referring to Fig. 10a, a
圖10b為簡要示出在成型基板中形成用於成型導電性粒子的成型孔的圖。將成型基板310通過KOH水溶液進行濕蝕刻（wet-etching）。成型基板310通過上述濕蝕刻從存在上述掩膜的開口的上部面311開始進行蝕刻並形成成型孔321、322、323。成型孔321、322、323的形狀與實施例的導電性粒子的形狀相對應。作為一例，成型孔321、322可具有上下逆轉的四角錐形狀，成型孔323可具有上下逆轉的四角錐台形狀。成型孔321、322、323的側壁面331與上部面311形成的角度可以為約54.7度。沿著作為矽晶片的成型基板310的結晶方向，濕蝕刻的蝕刻度將產生差異。由此，可蝕刻以相對於上部面311傾斜約54.7度並從上部面311沿著下方逐漸變窄的成型孔的側壁面331。可通過調節濕蝕刻的區域尺寸或濕蝕刻的時間來使得成型孔321、322具有頂點332或成型孔323具有底面333。頂點332可以與上述第五頂點接觸部相對應，底面333可以與上部面接觸部相對應。Fig. 10b is a diagram schematically showing the formation of molding holes for molding conductive particles in the molding substrate. The
圖10c為簡要示出在成型基板的成型孔中填充用於組成導電性粒子的金屬材料粉末的圖。投入於成型孔321、322、323的金屬粉末341由組成一實施例的導電性粒子的金屬材料形成，例如，可由上述金屬材料形成。金屬粉末341可以為上述金屬材料中的一種金屬材料的粉末，或者，也可以為兩種以上的金屬材料的粉末。作為一例，可向成型孔321、322、323投入銀的粉末、銅的粉末、鈷的粉末。Fig. 10c is a diagram schematically showing that the metal material powder for constituting the conductive particles is filled in the molding hole of the molding substrate. The
圖10d為簡要示出導電性粒子通過粉末冶金步驟在成型基板的成型孔中成型的圖。如圖10c所示，向成型孔321、322、323填充金屬粉末341後，以燒結溫度加熱金屬粉末來進行燒結。在燒結金屬粉末341之前，也可壓縮金屬粉末341。如圖10d所示，隨著通過燒結金屬粉末來形成與成型孔321、322、323的形狀相對應的燒結體351、352、353，最後，燒結體351、352、353將成為一實施例的導電性粒子。Fig. 10d is a diagram schematically showing that the conductive particles are formed in the forming holes of the forming substrate by the powder metallurgy step. As shown in FIG. 10 c , after filling the molding holes 321 , 322 , and 323 with the
圖10e為簡要例示出從成型基板分離燒結的導電性粒子的圖。完成金屬粉末的燒結後，從成型孔321、322、323分離導電性粒子101、102、100A。導電性粒子101、102可具有與成型孔321、322的形狀相對應的四角錐形狀，導電性粒子100A可具有與成型孔323的形狀相對應的四角錐台形狀。各個導電性粒子101、102、100A包括底面接觸部，通過填充在成型孔321、322、323的金屬粉末的上部面形成。各個導電性粒子101、102、100A包括第一側面接觸部、第二側面接觸部、第三側面接觸部及第四側面接觸部，具有與成型孔的側壁面331形狀相對應的形狀。並且，導電性粒子100A包括上部面接觸部，具有與成型孔323的底面333形狀相對應的形狀。並且，通過燒結成型的各個導電性粒子101、102、100A的面接觸部具有多孔性。FIG. 10e is a diagram schematically illustrating the separation of sintered conductive particles from a molding substrate. After the sintering of the metal powder is completed, the
圖11為示出又一實施例的導電性粒子的立體圖。圖11所示的導電性粒子200形成為如四角錐的立體物。FIG. 11 is a perspective view showing an electroconductive particle of still another example. The
導電性粒子200的組成材料可以與上述實施例的導電性粒子的組成材料相同。導電性粒子200可通過粉末冶金步驟將金屬粉末成型為燒結體來製造。The composition material of the
導電性粒子200具有沿著垂直於立體物的底面的方向逐漸變窄的形狀。導電性粒子200可包括形成導電性粒子的表面的四個面接觸部。導電性粒子200的四個面接觸部包括底面接觸部211和多個側面接觸部，即，第一側面接觸部212、第二側面接觸部213及第三側面接觸部214。The
底面接觸部211具有三個邊，可形成為三角形，例如，正三角形。第一側面接觸部212、第二側面接觸部213及第三側面接觸部214分別與底面接觸部211的三個邊相接觸。第一側面接觸部212、第二側面接觸部213及第三側面接觸部214可沿著第一方向AD逐漸變窄。並且，在第一側面接觸部212、第二側面接觸部213及第三側面接觸部214中，沿著第二方向CD相鄰的側面接觸部相接觸。根據上述底面接觸部與第一側面接觸部、第二側面接觸部及第三側面接觸部的形狀特性，導電性粒子200的底面接觸部或側面接觸部中的一個與另一導電性粒子200的底面接觸部或側面接觸部中的一個容易面接觸。因此，導電性粒子可在具有密集的分佈結構和有所增加的接觸面積的同時組成導電部。並且，導電性粒子可通過施加於導電部的加壓力沿著前方向相對滑動。The
導電性粒子200包括第一頂點接觸部221、第二頂點接觸部222及第三頂點接觸部223，分別形成在底面接觸部211與第一側面接觸部212、第二側面接觸部213及第三側面接觸部214中的兩個側面接觸部相接觸的位置。導電性粒子200包括位於最上端的上側頂點接觸部225。上側頂點接觸部225形成在第一側面接觸部212、第二側面接觸部213及第三側面接觸部214均沿著第一方向AD相接觸的位置。並且，導電性粒子200包括：邊角接觸部231、232、233，分別形成在底面接觸部211與第一側面接觸部212、第二側面接觸部213及第三側面接觸部214中的一個側面接觸部相接觸的位置；以及邊角接觸部235、236、237，分別形成在第一側面接觸部212、第二側面接觸部213及第三側面接觸部214中的相鄰的側面接觸部沿著第二方向CD相接觸的位置。The
以上，雖然通過部分實施例和附圖所示的例說明了本發明的技術思想，但應當理解一點，本發明所屬技術領域的普通技術人員可在不脫離本發明的技術思想及範疇的情況下進行多種改變、修改及變更。並且，這種改變、修改及變更均屬於本發明的發明要求保護範圍內。In the above, although the technical idea of the present invention has been described through some embodiments and examples shown in the accompanying drawings, it should be understood that those skilled in the art to which the present invention pertains can do so without departing from the technical idea and scope of the present invention. Various changes, modifications and alterations are made. Moreover, such changes, modifications and alterations all fall within the protection scope of the invention claimed in the present invention.
10:連接器 11:導電部 12:絕緣部 20:檢查裝置 21:檢查電路 22:端子 30:受檢設備 31:端子 40:測試插口 100,101,102:導電性粒子 100A:導電性粒子 100B:導電性粒子 111:底面接觸部 112:第一側面接觸部 113:第二側面接觸部 114:第三側面接觸部 115:第四側面接觸部 116:上部面接觸部 121:第一頂點接觸部 122:第二頂點接觸部 123:第三頂點接觸部 124:第四頂點接觸部 125:第五頂點接觸部 126:第六頂點接觸部 127:第七頂點接觸部 128:第八頂點接觸部 129:第九頂點接觸部 131:第一邊角接觸部 132:第二邊角接觸部 133:第三邊角接觸部 134:第四邊角接觸部 135:第五邊角接觸部 136:第六邊角接觸部 137:第七邊角接觸部 138:第八邊角接觸部 200:導電性粒子 211:底面接觸部 212:第一側面接觸部 213:第二側面接觸部 214:第三側面接觸部 221:第一頂點接觸部 222:第二頂點接觸部 223:第三頂點接觸部 225:上側頂點接觸部 231,232,233,235,236,237:邊角接觸部 310:成型基板 311:上部面 321,322,323:成型孔 331:側壁面 332:頂點 333:底面 341:金屬粉末 351,352,353:燒結體 VD:上下方向 HD:水平方向 AD:第一方向 CD:第二方向 IA:夾角 SD:滑動方向 P:加壓力 L:底面接觸部的邊長 H:從底面接觸部到上側頂點接觸部的高度10: Connector 11: Conductive part 12: Insulation part 20: Inspection device 21: Check the circuit 22: Terminals 30: Tested equipment 31: Terminal 40: Test socket 100, 101, 102: Conductive particles 100A: Conductive particles 100B: Conductive particles 111: Bottom contact part 112: First side contact part 113: Second side contact part 114: The third side contact part 115: Fourth side contact part 116: Upper surface contact part 121: The first vertex contact part 122: The second vertex contact part 123: The third vertex contact part 124: Fourth vertex contact 125: Fifth vertex contact 126: sixth vertex contact 127: seventh vertex contact 128: Eighth vertex contact 129: Ninth Vertex Contact 131: The first corner contact part 132: The second corner contact part 133: The third corner contact part 134: Fourth corner contact part 135: Fifth corner contact part 136: The sixth corner contact part 137: seventh corner contact 138: Eighth corner contact part 200: Conductive particles 211: Bottom contact part 212: First side contact part 213: Second side contact part 214: The third side contact part 221: first vertex contact 222:Second vertex contact 223: Third vertex contact 225: Upper vertex contact part 231, 232, 233, 235, 236, 237: Edge and corner contact 310: Forming substrate 311: Upper face 321, 322, 323: Forming holes 331: Sidewall Surface 332: Vertex 333: Underside 341: Metal Powder 351, 352, 353: Sintered body VD: up and down direction HD: Horizontal orientation AD: first direction CD: Second Direction IA: included angle SD: Swipe direction P: pressurized L: The side length of the bottom contact part H: The height from the bottom contact portion to the upper vertex contact portion
圖1為簡要示出應用一實施例的連接器的例示圖。 圖2為示出一實施例的導電性粒子的立體圖。 圖3為圖2所示的導電性粒子的主視圖。 圖4為簡要示出具有多種尺寸的導電性粒子的立體圖。 圖5a為示出一實施例的導電性粒子的縱剖面形狀的圖。 圖5b為簡要示出一實施例的導電性粒子的另一縱剖面形狀的圖。 圖6為示出再一實施例的導電性粒子的立體圖。 圖7為示出另一實施例的導電性粒子的立體圖。 圖8為簡要示出在一實施例的連接器的導電部內的一實施例的導電性粒子以能夠導電的方式相接觸的例的立體圖。 圖9為示出在一實施例的連接器的導電部內的一實施例的導電性粒子相對滑動移動的例示圖。 圖10a為簡要示出一實施例的用於製造導電性基板的成型基板的剖面圖。 圖10b為簡要示出在圖10a所示的成型基板中形成用於成型導電性粒子的成型孔的剖面圖。 圖10c為簡要示出在圖10b所示的成型孔中填充用於組成導電性粒子的金屬材料粉末的剖面圖。 圖10d為簡要示出導電性粒子通過粉末冶金步驟在成型基板的成型孔中成型的剖視圖。 圖10e為簡要例示出從成型基板分離燒結的導電性粒子的圖。 圖11為示出又一實施例的導電性粒子的立體圖。FIG. 1 is an illustration schematically showing a connector to which an embodiment is applied. FIG. 2 is a perspective view showing an electroconductive particle according to an embodiment. FIG. 3 is a front view of the electroconductive particle shown in FIG. 2 . FIG. 4 is a perspective view schematically showing conductive particles having various sizes. Fig. 5a is a view showing a longitudinal cross-sectional shape of an electroconductive particle according to an embodiment. Fig. 5b is a diagram schematically showing another longitudinal cross-sectional shape of the conductive particle of one embodiment. FIG. 6 is a perspective view showing an electroconductive particle of still another example. FIG. 7 is a perspective view showing an electroconductive particle of another embodiment. FIG. 8 is a perspective view schematically showing an example in which conductive particles of an embodiment are in contact with each other so as to be able to conduct electricity in a conductive portion of a connector of an embodiment. FIG. 9 is a diagram illustrating a relative sliding movement of conductive particles in an embodiment in a conductive portion of a connector in an embodiment. FIG. 10a is a cross-sectional view schematically showing a molding substrate for manufacturing a conductive substrate according to an embodiment. Fig. 10b is a cross-sectional view schematically showing the formation of molding holes for molding conductive particles in the molding substrate shown in Fig. 10a. Fig. 10c is a cross-sectional view schematically showing that the forming hole shown in Fig. 10b is filled with metal material powder constituting the conductive particles. Fig. 10d is a cross-sectional view schematically showing that conductive particles are formed in a forming hole of a forming substrate by a powder metallurgy step. FIG. 10e is a diagram schematically illustrating the separation of sintered conductive particles from a molding substrate. FIG. 11 is a perspective view showing an electroconductive particle of still another example.
100:導電性粒子100: Conductive particles
111:底面接觸部111: Bottom contact part
112:第一側面接觸部112: First side contact part
113:第二側面接觸部113: Second side contact part
114:第三側面接觸部114: The third side contact part
115:第四側面接觸部115: Fourth side contact part
121:第一頂點接觸部121: The first vertex contact part
122:第二頂點接觸部122: The second vertex contact part
123:第三頂點接觸部123: The third vertex contact part
124:第四頂點接觸部124: Fourth vertex contact
125:第五頂點接觸部125: Fifth vertex contact
131:第一邊角接觸部131: The first corner contact part
132:第二邊角接觸部132: The second corner contact part
133:第三邊角接觸部133: The third corner contact part
134:第四邊角接觸部134: Fourth corner contact part
135:第五邊角接觸部135: Fifth corner contact part
136:第六邊角接觸部136: The sixth corner contact part
137:第七邊角接觸部137: seventh corner contact
138:第八邊角接觸部138: Eighth corner contact part
AD:第一方向AD: first direction
CD:第二方向CD: Second Direction
Claims (11)
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| KR20140109102A (en) * | 2013-03-05 | 2014-09-15 | 삼성디스플레이 주식회사 | Anisotropic Conductive Film And Display Apparatus Having The Same |
| EP3069353B1 (en) * | 2013-11-15 | 2019-10-30 | 3M Innovative Properties Company | An electrically conductive article containing shaped particles and methods of making same |
| KR101525520B1 (en) | 2015-02-03 | 2015-06-03 | (주)티에스이 | Testing socket including conductive particles having combinable shape |
| KR101805834B1 (en) | 2016-05-11 | 2017-12-07 | 주식회사 아이에스시 | Test socket and conductive particle |
| KR20170017951A (en) * | 2017-01-20 | 2017-02-15 | 주식회사 아이에스시 | anisotropic conductive sheet |
| KR101973609B1 (en) * | 2018-02-19 | 2019-04-29 | (주)티에스이 | Rubber socket for semiconductor test including conductive part mixed regular conductive particles and irregular conductive particles |
| KR102444643B1 (en) * | 2018-11-06 | 2022-09-19 | (주)티에스이 | Conductive particle and data signal transmission connector having the same |
-
2020
- 2020-08-28 KR KR1020200109065A patent/KR102474337B1/en active IP Right Grant
-
2021
- 2021-08-26 WO PCT/KR2021/011415 patent/WO2022045787A1/en active Application Filing
- 2021-08-26 CN CN202180055825.1A patent/CN116114125A/en active Pending
- 2021-08-27 TW TW110131790A patent/TWI806138B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022045787A1 (en) | 2022-03-03 |
| CN116114125A (en) | 2023-05-12 |
| KR102474337B1 (en) | 2022-12-07 |
| KR20220028280A (en) | 2022-03-08 |
| TWI806138B (en) | 2023-06-21 |
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