TW202204230A - A device for cleaning and etching - Google Patents

A device for cleaning and etching Download PDF

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TW202204230A
TW202204230A TW109124295A TW109124295A TW202204230A TW 202204230 A TW202204230 A TW 202204230A TW 109124295 A TW109124295 A TW 109124295A TW 109124295 A TW109124295 A TW 109124295A TW 202204230 A TW202204230 A TW 202204230A
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Taiwan
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gear
rotating shaft
hanging basket
cleaning
driven
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TW109124295A
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Chinese (zh)
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TWI744988B (en
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林振衡
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禾邑實業股份有限公司
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A device for cleaning and etching comprising: a rotatable unit having a driving mechanism which a basket may be loaded thereon. At least one rotatable shaft is disposed at a bottom of the basket and a driven mechanism disposed at the basket is connected to the at least one rotatable shaft. At least one wafer boat may be placed into the basket, so that the lower edge of wafers inside the wafer boat are touched with the at least one rotatable shaft. When the basket is loaded on a loading seat of the rotatable unit, the driven mechanism is connected with the driving mechanism and the at least one rotatable shaft is driven by the driven mechanism, so that the wafers are driven to be rotating and moving up and down, as thus to enhance a degree of homogeneity and effect of cleaning and etching and reduce the process time.

Description

清洗及蝕刻裝置Cleaning and etching equipment

本發明涉及半導體晶圓片或類似技術領域的清洗與蝕刻裝置，特別是可以提昇清洗與蝕刻性能的清洗及蝕刻裝置。The present invention relates to a cleaning and etching device for semiconductor wafers or similar technical fields, in particular to a cleaning and etching device that can improve the cleaning and etching performance.

晶圓片製造過程需要依照製程需求對晶圓片片反復地清洗及蝕刻，在習知的清洗或蝕刻製程中，係將多個晶圓片片放置在晶舟內，再將晶圓片片連同晶舟放置在製程槽的晃動裝置的承載架上，當進行清洗或蝕刻製程時，將晶舟與晶圓片片一起置入清洗液或蝕刻液中，並且開啟晃動裝置驅動在垂直方向上晃動，使清洗液或蝕刻液得得充分接觸到每一個晶圓片片的每一個位置。The wafer manufacturing process needs to repeatedly clean and etch the wafers according to the process requirements. In the conventional cleaning or etching process, multiple wafers are placed in the wafer boat, and then the wafers are The wafer boat is placed on the carrier of the shaking device in the process tank. When the cleaning or etching process is performed, the wafer boat and the wafer are placed in the cleaning solution or etching solution, and the shaking device is turned on and driven in the vertical direction. Shake so that the cleaning solution or etching solution can fully contact each position of each wafer.

所述習知的清洗及蝕刻裝置雖然可以達到預定的功能與效果，但達到徹底清洗或徹底蝕刻所需要的時間可能較長，或晶舟間隔板接觸到晶圓片片的部分會蝕刻不到或不均勻。Although the conventional cleaning and etching device can achieve predetermined functions and effects, the time required to achieve thorough cleaning or thorough etching may be longer, or the part of the wafer spacer that contacts the wafer may not be etched. or uneven.

本發明的目的在於提供一種可以進一步提升晶圓片片清洗或蝕刻性能，進而縮短製程時間、提升清洗及蝕刻效率及均勻度的清洗及蝕刻裝置。The purpose of the present invention is to provide a cleaning and etching device that can further improve the wafer cleaning or etching performance, thereby shortening the process time, and improving the cleaning and etching efficiency and uniformity.

本發明提供的清洗及蝕刻裝置，具有一旋轉單元，該旋轉單元可以包括：一基座；一第一馬達組件，設於該基座；一承載座，連接該基座，該承載座設有連接該第一馬達組件的一驅動機構；以及一吊籃架，提供以安置在該承載座，該吊籃架的底部可旋轉地設置至少一支轉軸，該吊籃架設有連接至該至少一支轉軸的一被驅動機構，並且當該吊籃架安置於該承載座後，該被驅動機構與該驅動機構產生連接，使得該第一馬達組件通過該驅動機構與該被驅動機構帶動該至少一支轉軸旋轉，其中，該至少一支轉軸上方的該吊籃架內可置入至少一個晶舟，並且使放置在該晶舟內的晶圓片片邊緣接觸該至少一支轉軸，使該晶圓片片被該至少一支轉軸帶動旋轉。The cleaning and etching device provided by the present invention has a rotating unit, and the rotating unit may include: a base; a first motor assembly, disposed on the base; a bearing seat, connected to the base, the bearing seat is provided with a drive mechanism connected to the first motor assembly; and a hanging basket provided to be placed on the bearing base, the bottom of the hanging basket is rotatably provided with at least one rotating shaft, the hanging basket is provided with a connection to the at least one A driven mechanism supporting the rotating shaft, and when the hanging basket is placed on the bearing base, the driven mechanism is connected with the driving mechanism, so that the first motor assembly drives the at least one motor through the driving mechanism and the driven mechanism A rotating shaft rotates, wherein, at least one wafer boat can be placed in the hanging basket above the at least one rotating shaft, and the edge of the wafer placed in the wafer can be brought into contact with the at least one rotating shaft, so that the The wafer is driven to rotate by the at least one rotating shaft.

一較佳實施例，該驅動機構可以包括：一主動齒輪，連接該第一馬達組件的一輸出軸；一被動齒輪，設於該承載座，該被動齒輪同心地設有一被動小齒輪；以及一惰齒輪組，嚙合該主動齒輪與該被動齒輪；其中，該被驅動機構包括：至少一個齒輪，設於該至少一支轉軸的一端；一動力接收齒輪，設於該吊籃架的側壁，該動力接收齒輪同心地設有一轉向齒輪，該轉向齒輪嚙合該至少一個齒輪，其中，當該吊籃架安置於該承載座後，該被動小齒輪與該動力接收齒輪嚙合，使得旋轉單元可以通過該驅動機構與被驅動機構帶動轉軸旋轉；利用齒輪帶動，可避免化學液體造成傳動機構打滑而失去傳動能力。In a preferred embodiment, the driving mechanism may include: a driving gear connected to an output shaft of the first motor assembly; a driven gear disposed on the bearing base, the driven gear being concentrically provided with a driven pinion; and a The idler gear set is engaged with the driving gear and the driven gear; wherein, the driven mechanism includes: at least one gear, which is arranged at one end of the at least one rotating shaft; a power receiving gear is arranged on the side wall of the hanging basket, the The power receiving gear is concentrically provided with a steering gear, and the steering gear meshes with the at least one gear, wherein when the gondola is placed on the bearing seat, the driven pinion meshes with the power receiving gear, so that the rotating unit can pass through the at least one gear. The driving mechanism and the driven mechanism drive the rotating shaft to rotate; driven by gears, it can avoid the slippage of the transmission mechanism caused by the chemical liquid and the loss of transmission capacity.

一較佳實施例，該吊籃架可以包括二支彼此平行的轉軸，每一支該轉軸的一端均設有齒輪，並且轉向齒輪同時嚙合該二個齒輪，藉以使得二支轉軸被帶動往彼此相反的方向旋轉。In a preferred embodiment, the basket frame may include two rotating shafts parallel to each other, each of the rotating shafts is provided with a gear at one end, and the steering gear meshes with the two gears at the same time, so that the two rotating shafts are driven toward each other Rotate in the opposite direction.

一較佳實施例，該轉軸的外徑圓周可以為多邊形，使得晶圓片片被帶動旋轉的同時亦產生上下晃動。In a preferred embodiment, the outer diameter and circumference of the rotating shaft can be a polygon, so that the wafer is driven to rotate and also shakes up and down.

一較佳實施例，該承載座設有至少一個定位塊，且吊籃架的底部設有對應該定位塊的定位槽，當吊籃架安置於承載座後，該定位塊與該定位槽彼此接合，使得吊籃架被定位在承載座。In a preferred embodiment, the carrying base is provided with at least one positioning block, and the bottom of the hanging basket is provided with a positioning groove corresponding to the positioning block. When the hanging basket is placed on the carrying base, the positioning block and the positioning groove are mutually Engaged so that the gondola is positioned on the carrier.

本發明之清洗及蝕刻裝置，一般包括有一晃動單元，該晃動單元連接該旋轉單元，以驅動該旋轉單元在垂直方向上往復晃動，使得晶圓片片被帶動旋轉的同時亦在垂直方向上晃動，利用晶圓片片的自轉及上下晃動加速製程能力。The cleaning and etching apparatus of the present invention generally includes a shaking unit, which is connected to the rotating unit to drive the rotating unit to reciprocate in the vertical direction, so that the wafer is driven to rotate and also shakes in the vertical direction. , using the rotation and shaking of the wafer to accelerate the process capability.

本發明提供的清洗及蝕刻裝置，由於放置在晶舟中的晶圓片片在清洗液或蝕刻液中被帶動旋轉的同時產生上下向量晃動，並且晶舟亦隨著承載架被驅動在垂直方向上晃動，使得清洗液或蝕刻液更能快速、完全地接觸晶圓片片表面各處，以更有效率地徹底清洗或徹底蝕刻晶圓片片。In the cleaning and etching device provided by the present invention, since the wafers placed in the wafer are driven to rotate in the cleaning solution or the etching solution, the vertical vector sway is generated, and the wafer is also driven in the vertical direction along with the carrier. Shaking up makes the cleaning solution or etching solution more quickly and completely contact the surface of the wafer, so that the wafer can be thoroughly cleaned or completely etched more efficiently.

以下配合圖示及元件符號對本發明之實施方式做更詳細的說明，俾使熟習該項技藝者在研讀本說明書後能據以實施。The embodiments of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying the description.

如圖1及圖2所示，本發明提供的清洗及蝕刻裝置，較佳實施方式包括有旋轉單元1、吊籃架2與晃動單元5。As shown in FIG. 1 and FIG. 2 , the cleaning and etching device provided by the present invention, in a preferred embodiment, includes a rotating unit 1 , a hanging basket 2 and a shaking unit 5 .

其中，旋轉單元1係用以使放置在吊籃架2內之晶舟3中的晶圓片4旋轉的組件，該旋轉單元1包括有：基座10、設於基座10上的第一馬達組件11、以及連接至基座10的承載座14，第一馬達組件11與承載座14之間設置有驅動機構。具體而言，基座10大致上為一板狀體，第一馬達組件11設於基板10的上面，第一馬達組件11包含設置在外殼內部的第一馬達（圖中未顯示），延伸自第一馬達的輸出軸111設置一主動齒輪112。The rotating unit 1 is a component for rotating the wafers 4 placed in the wafer boat 3 in the hanging basket 2 . The rotating unit 1 includes: a base 10 , a first The motor assembly 11 and the bearing seat 14 connected to the base 10 are provided with a driving mechanism between the first motor assembly 11 and the bearing seat 14 . Specifically, the base 10 is substantially a plate-shaped body, the first motor assembly 11 is disposed on the top of the base plate 10 , and the first motor assembly 11 includes a first motor (not shown in the figure) disposed inside the casing, extending from The output shaft 111 of the first motor is provided with a driving gear 112 .

承載座14基本上具有水平的座體140以及連接在該水平座體的豎板143，使得承載座14大致上構成Ｌ形狀；承載座14利用豎板143的上端固定至基座10；豎板143上配置由多個惰齒輪構成的惰齒輪組12以及一個被動齒輪13，該多個惰齒輪系列地串聯配置且嚙合，並且使惰齒輪組12一端（上端）的惰齒輪和主動齒輪112嚙合，惰齒輪組12另一端（下端）的惰齒輪和被動齒輪13嚙合；所述被動齒輪13還同心地設有被動小齒輪131；因此，第一馬達組件11運轉時，主動齒輪112帶動惰齒輪組12旋轉，惰齒輪組12則驅動被動齒輪13與被動小齒輪131旋轉。The bearing seat 14 basically has a horizontal seat body 140 and a vertical plate 143 connected to the horizontal seat body, so that the bearing seat 14 generally forms an L shape; the bearing seat 14 is fixed to the base 10 by the upper end of the vertical plate 143; the vertical plate 143 is provided with an idler gear set 12 composed of a plurality of idler gears and a driven gear 13, the multiple idler gears are arranged in series and meshed, and the idler gear at one end (upper end) of the idler gear set 12 is meshed with the drive gear 112. , the idler gear at the other end (lower end) of the idler gear set 12 meshes with the driven gear 13; the driven gear 13 is also provided with a driven pinion 131 concentrically; therefore, when the first motor assembly 11 is running, the drive gear 112 drives the idler gear The group 12 rotates, and the idler gear group 12 drives the driven gear 13 and the driven pinion 131 to rotate.

承載座14的座體140大體上為底部鏤空的框體，其周圍之間的相對兩側分別形成有承板141，兩承板141上分別設置至少一個定位塊142；該座體140係用以提供吊籃架2安置在其中，並且使吊籃架2被支承在承板141上。The seat body 140 of the bearing seat 14 is generally a frame body with a hollow bottom, and support plates 141 are respectively formed on opposite sides between the surrounding sides, and at least one positioning block 142 is respectively provided on the two support plates 141; In order to provide the gondola 2 to be placed therein, and the gondola 2 to be supported on the support plate 141 .

所述晃動單元5係用以連接旋轉單元1以驅動旋轉單元1在垂直方向上往復晃動的組件。具體而言，如圖1所示，晃動單元5具有一固定座54，固定座54設置有在垂直方向上延伸的二支滑軌541，滑軌541上滑動配合地設置滑動座55，滑動座55的上端設置一夾持座551；延伸自旋轉單元1之基座10下方的豎軸101係穿設於夾持座551的洞孔並且被夾持固定。固定座54接近下方的位置配置一減速機52，減速機52的輸入軸連接第二馬達組件51，減速機52的輸出軸連接一偏心輪53，偏心輪53係接觸至滑動座55的下端邊。當晃動單元5的第二馬達組件51作動時帶動減速機52減速運轉，減速機52再驅動偏心輪53旋轉，偏心輪53則帶動滑動座55上升至最高行程後利用重力使滑動座55自行往下滑動，亦即使得滑動座55上下往復滑動，進而通過豎軸101與基座10使得整個旋轉單元1上下晃動。The shaking unit 5 is a component for connecting the rotating unit 1 to drive the rotating unit 1 to shake back and forth in the vertical direction. Specifically, as shown in FIG. 1 , the shaking unit 5 has a fixed seat 54 , and the fixed seat 54 is provided with two sliding rails 541 extending in the vertical direction. The upper end of 55 is provided with a clamping seat 551 ; the vertical shaft 101 extending from below the base 10 of the rotating unit 1 is passed through the hole of the clamping seat 551 and is clamped and fixed. A reducer 52 is arranged at a position close to the bottom of the fixed seat 54 , the input shaft of the reducer 52 is connected to the second motor assembly 51 , the output shaft of the reducer 52 is connected to an eccentric wheel 53 , and the eccentric wheel 53 is in contact with the lower end of the sliding seat 55 . . When the second motor assembly 51 of the shaking unit 5 is actuated, the reducer 52 is driven to decelerate, and the reducer 52 drives the eccentric wheel 53 to rotate. Downward sliding, that is, the sliding seat 55 slides up and down reciprocatingly, and then the entire rotating unit 1 is rocked up and down through the vertical shaft 101 and the base 10 .

圖2為本發明之一個吊籃架2可以置入一個晶舟3及其配置關係之實施例立體示意圖； 圖3為本發明之一個吊籃架2可以置入二個晶舟3及其配置關係之另一實施例立體示意圖。如圖2所示，所述吊籃架2係提供以放置承載晶圓片4的晶舟3於其中的組件，吊籃架2則被安置在旋轉單元1的承載座14，使得晶舟3和吊籃架2隨同旋轉單元1被輸送進入清洗槽的清洗液中進行清洗作業，或蝕刻槽的蝕刻液中進行蝕刻作業。FIG. 2 is a perspective view of an embodiment in which one gondola 2 can be placed into one wafer boat 3 and its configuration relationship; FIG. 3 is a gondola 2 of the present invention that can be placed in two wafer boats 3 and its configuration A perspective view of another embodiment of the relationship. As shown in FIG. 2 , the hanging basket 2 is an assembly provided to place the wafer boat 3 carrying the wafers 4 therein, and the hanging basket 2 is placed on the bearing base 14 of the rotating unit 1 so that the wafer boat 3 Together with the rotating unit 1, the hanging basket 2 is transported into the cleaning solution of the cleaning tank for cleaning operation, or the etching operation is performed in the etching solution of the etching tank.

如圖2及圖4所示，本發明提供之吊籃架2的第一實施例適用於對較大尺寸的晶圓片（例如4吋晶圓片到12吋晶圓片）進行清洗或蝕刻。具體而言，可以在吊籃架2的底部可旋轉地設置相對靠近的二支轉軸，即第一轉軸21A與第二轉軸21B，本發明的較佳實施例，該第一轉軸21A與第二轉軸21B的外徑圓周係形成為多邊形（例如六邊形或八邊形）。吊籃架2的側壁外側則設置有連接至該第一轉軸21A與第二轉軸21B的被驅動機構，該被驅動機構用以連接旋轉單元1的驅動機構。更明確地說，該被驅動機構包括：第一齒輪22A與第二齒輪22B，分別設置在第一轉軸21A與第二轉軸21B之延伸出吊籃架2的側壁外的中心軸的端部，該側壁還設置一動力接收齒輪23，該動力接收齒輪23同心地設有一轉向齒輪231，並且轉向齒輪231同時嚙合第一齒輪22A與第二齒輪22B，當動力接收齒輪23旋轉時，通過轉向齒輪231驅動第一齒輪22A與第二齒輪22B往彼此相反的方向旋轉。As shown in FIG. 2 and FIG. 4 , the first embodiment of the hanging basket 2 provided by the present invention is suitable for cleaning or etching larger-sized wafers (eg, 4-inch wafers to 12-inch wafers). . Specifically, two relatively close rotating shafts, namely the first rotating shaft 21A and the second rotating shaft 21B, can be rotatably arranged at the bottom of the hanging basket 2 . In a preferred embodiment of the present invention, the first rotating shaft 21A and the second rotating shaft 21B The outer diameter circumference of the rotating shaft 21B is formed in a polygonal shape (for example, a hexagon or an octagon). A driven mechanism connected to the first rotating shaft 21A and the second rotating shaft 21B is disposed on the outer side of the side wall of the hanging basket 2 , and the driven mechanism is used to connect the driving mechanism of the rotating unit 1 . More specifically, the driven mechanism includes: a first gear 22A and a second gear 22B, respectively disposed at the ends of the central shaft extending out of the side wall of the hanging basket 2 between the first rotating shaft 21A and the second rotating shaft 21B, The side wall is also provided with a power receiving gear 23, the power receiving gear 23 is provided with a steering gear 231 concentrically, and the steering gear 231 meshes with the first gear 22A and the second gear 22B at the same time. 231 drives the first gear 22A and the second gear 22B to rotate in opposite directions to each other.

如圖2所示，所述晶舟3係用以承載複數個晶圓片4的容器，從端部觀看， 晶舟3大體上呈「Ｈ」形狀，其內部的相對兩側分別形成對應的插槽31，當晶圓片4***各個插槽31中後，相鄰兩晶圓片之間保持預定的距離，並且各晶圓片4的下緣突出晶舟3的鏤空下方。As shown in FIG. 2 , the wafer boat 3 is a container for carrying a plurality of wafers 4. Viewed from the end, the wafer boat 3 is generally in the shape of an “H”, and opposite sides of the inside are formed with corresponding In the slots 31 , after the wafers 4 are inserted into the slots 31 , a predetermined distance is maintained between two adjacent wafers, and the lower edge of each wafer 4 protrudes below the hollow of the wafer boat 3 .

當要對晶圓片4進行清洗或蝕刻時，首先將晶圓片4分別***晶舟3的各個插槽31內，再將已***晶圓片4的晶舟3兩側的凸軌32沿著吊籃架2相對兩側的滑槽24滑入而將晶舟3置入吊籃架2內，在此狀態下各個晶圓片4的下緣接觸第一轉軸21A與第二轉軸21B(如圖4所示)，然後將已置入晶舟3的吊籃架2安置於旋轉單元1的承載座14，使得吊籃架2的下端置入座體140內，同時使設於吊籃架2下方的定位槽（圖中未顯示），與承板141上的定位塊142相互嵌合而定位，以避免吊籃架2晃動，並且在此狀態中，被動小齒輪131與動力接收齒輪23嚙合。隨後，旋轉單元1與晃動單元5一起由另外的輸送裝置（圖中未顯示）驅動，以將承載座14與吊籃架2一起沉入清洗槽內的清洗液中或蝕刻槽內的蝕刻液中，在此狀態下，第一馬達組件11與第二馬達組件51分別被啟動運轉，第一馬達組件11的運轉則通過主動齒輪112、惰齒輪組12與被動小齒輪131帶動動力接收齒輪23旋轉，並由轉向齒輪231經由第一齒輪22A與第二齒輪22B帶動第一轉軸21A與第二轉軸21B同步反向旋轉，由於第一轉軸21A與第二轉軸21B的外圓周係多邊形並且均與晶圓片4的下端緣接觸，因此，各個晶圓片4將會隨著旋轉中的第一轉軸21A與第二轉軸21B而上下跳動。於此同時，運轉中的第二馬達組件51亦驅動旋轉單元1的基座10在垂直方向上晃動，使得清洗液或蝕刻液更能快速、完全地接觸晶圓片表面各處，以更有效率地徹底清洗或徹底蝕刻晶圓片。When cleaning or etching the wafer 4, firstly insert the wafer 4 into the respective slots 31 of the wafer boat 3, and then insert the convex rails 32 on both sides of the wafer boat 3 into which the wafer 4 has been inserted along the The wafer boat 3 is placed in the gondola 2 by sliding into the chute 24 on the opposite sides of the gondola 2. In this state, the lower edge of each wafer 4 contacts the first rotating shaft 21A and the second rotating shaft 21B ( 4), and then place the hanging basket 2 that has been placed in the crystal boat 3 on the bearing base 14 of the rotating unit 1, so that the lower end of the hanging basket 2 is placed in the seat body 140, and at the same time the hanging basket The positioning groove (not shown in the figure) under the frame 2 is fitted with the positioning block 142 on the support plate 141 for positioning, so as to avoid the swing of the hanging basket frame 2, and in this state, the passive pinion 131 and the power receiving gear 23 mesh. Subsequently, the rotating unit 1 and the shaking unit 5 are driven by another conveying device (not shown in the figure) to sink the carrier 14 together with the gondola 2 into the cleaning solution in the cleaning tank or the etching solution in the etching tank In this state, the first motor assembly 11 and the second motor assembly 51 are respectively activated, and the operation of the first motor assembly 11 drives the power receiving gear 23 through the driving gear 112 , the idler gear set 12 and the passive pinion 131 . The steering gear 231 drives the first rotating shaft 21A and the second rotating shaft 21B to rotate in the opposite direction through the first gear 22A and the second gear 22B. Since the outer circumferences of the first rotating shaft 21A and the second rotating shaft 21B are polygonal and are The lower end edges of the wafers 4 are in contact with each other. Therefore, each wafer 4 will jump up and down with the rotating first rotating shaft 21A and the second rotating shaft 21B. At the same time, the second motor assembly 51 in operation also drives the base 10 of the rotating unit 1 to shake in the vertical direction, so that the cleaning solution or the etching solution can more quickly and completely contact all parts of the surface of the wafer, so that more Thoroughly clean or thoroughly etch wafers efficiently.

如圖3及圖5所示，本發明提供之吊籃架2的第二實施例適用於對較小尺寸的晶圓片（例如2吋晶圓片到4吋晶圓片）進行清洗或蝕刻。其同樣在吊籃架2的底部可旋轉地設置相對分開的二支轉軸，即第一轉軸21A與第二轉軸21B，該第一轉軸21A與第二轉軸21B的外徑圓周亦形成為多邊形。吊籃架2的側壁外側則設置有連接至該第一轉軸21A與第二轉軸21B的被驅動機構，該被驅動機構用以連接旋轉單元1的驅動機構。更明確地說，該被驅動機構包括：第一齒輪22A與第二齒輪22B，分別設置在第一轉軸21A與第二轉軸21B之延伸出吊籃架2的側壁外的中心軸的端部，該側壁還設置一動力接收齒輪23，該動力接收齒輪23同心地設有一轉向齒輪231，並且轉向齒輪231同時嚙合第一齒輪22A與第二齒輪22B，當動力接收齒輪23旋轉時，通過轉向齒輪231驅動第一齒輪22A與第二齒輪22B往彼此相反的方向旋轉。As shown in FIG. 3 and FIG. 5 , the second embodiment of the hanging basket 2 provided by the present invention is suitable for cleaning or etching wafers of smaller size (eg, 2-inch wafers to 4-inch wafers) . The bottom of the basket frame 2 is also rotatably provided with two relatively separated rotating shafts, namely a first rotating shaft 21A and a second rotating shaft 21B, and the outer diameters of the first rotating shaft 21A and the second rotating shaft 21B are also formed as polygons. A driven mechanism connected to the first rotating shaft 21A and the second rotating shaft 21B is disposed on the outer side of the side wall of the hanging basket 2 , and the driven mechanism is used to connect the driving mechanism of the rotating unit 1 . More specifically, the driven mechanism includes: a first gear 22A and a second gear 22B, respectively disposed at the ends of the central shaft extending out of the side wall of the hanging basket 2 between the first rotating shaft 21A and the second rotating shaft 21B, The side wall is also provided with a power receiving gear 23, the power receiving gear 23 is provided with a steering gear 231 concentrically, and the steering gear 231 meshes with the first gear 22A and the second gear 22B at the same time. 231 drives the first gear 22A and the second gear 22B to rotate in opposite directions to each other.

圖3所示的吊籃架2可供二個晶舟3置入其中，當要對晶圓片4進行清洗或蝕刻時，首先將晶圓片4分別***晶舟3的各個插槽31內，再將已***晶圓片4的晶舟3兩側的凸軌32沿著吊籃架2相對兩側的二組滑槽24滑入而將兩個晶舟3置入吊籃架2內，在此狀態下，其中一組晶舟3中的各個晶圓片4的下緣接觸第一轉軸21A，另一組晶舟3中的晶圓片4的下緣則接觸第二轉軸21B(如圖5所示)，然後將已置入晶舟3的吊籃架2安置於旋轉單元1的承載座14，使得吊籃架2的下端置入座體140內，同時使設於吊籃架2下方的定位槽（圖中未顯示），與承板141上的定位塊142相互嵌合而定位，以避免吊籃架2晃動，並且在此狀態中，被動小齒輪131與動力接收齒輪23嚙合。隨後，旋轉單元1與晃動單元5一起由另外的輸送裝置（圖中未顯示）驅動，以將承載座14與吊籃架2一起沉入清洗槽內的清洗液中或蝕刻槽內的蝕刻液中，在此狀態下，第一馬達組件11與第二馬達組件51分別被啟動運轉，第一馬達組件11的運轉則通過主動齒輪112、惰齒輪組12與被動小齒輪131帶動動力接收齒輪23旋轉，並由轉向齒輪231經由第一齒輪22A與第二齒輪22B帶動第一轉軸21A與第二轉軸21B同步反向旋轉，由於第一轉軸21A與第二轉軸21B的外圓周係多邊形並且均與晶圓片4的下端緣接觸，因此，各個晶圓片4將會隨著旋轉中的第一轉軸21A與第二轉軸21B而轉動。於此同時，運轉中的第二馬達組件51亦驅動旋轉單元1的基座10在垂直方向上晃動，使得清洗液或蝕刻液更能快速、完全地接觸晶圓片表面各處，以更有效率地徹底清洗或徹底均勻地蝕刻晶圓片。The hanging basket 2 shown in FIG. 3 can accommodate two wafer boats 3 therein. When cleaning or etching the wafers 4 , firstly insert the wafers 4 into the respective slots 31 of the wafer boat 3 . , and then slide the convex rails 32 on both sides of the wafer boat 3 into which the wafer 4 has been inserted along the two sets of chutes 24 on the opposite sides of the gondola 2 to place the two boats 3 into the gondola 2 In this state, the lower edge of each wafer 4 in one group of wafer boats 3 contacts the first rotating shaft 21A, and the lower edge of the wafer 4 in the other group of wafer boats 3 contacts the second rotating shaft 21B ( 5 ), and then place the hanging basket 2 that has been placed in the crystal boat 3 on the bearing seat 14 of the rotating unit 1, so that the lower end of the hanging basket 2 is placed in the seat body 140, and at the same time the hanging basket The positioning groove (not shown in the figure) under the frame 2 is fitted with the positioning block 142 on the support plate 141 for positioning, so as to avoid the swing of the hanging basket frame 2, and in this state, the passive pinion 131 and the power receiving gear 23 mesh. Subsequently, the rotating unit 1 and the shaking unit 5 are driven by another conveying device (not shown in the figure) to sink the carrier 14 together with the gondola 2 into the cleaning solution in the cleaning tank or the etching solution in the etching tank In this state, the first motor assembly 11 and the second motor assembly 51 are respectively activated, and the operation of the first motor assembly 11 drives the power receiving gear 23 through the driving gear 112 , the idler gear set 12 and the passive pinion 131 . The steering gear 231 drives the first rotating shaft 21A and the second rotating shaft 21B to rotate in the opposite direction through the first gear 22A and the second gear 22B. Since the outer circumferences of the first rotating shaft 21A and the second rotating shaft 21B are polygonal and are The lower end edges of the wafers 4 are in contact with each other. Therefore, each wafer 4 will rotate with the rotating first rotating shaft 21A and the second rotating shaft 21B. At the same time, the second motor assembly 51 in operation also drives the base 10 of the rotating unit 1 to shake in the vertical direction, so that the cleaning solution or the etching solution can more quickly and completely contact all parts of the surface of the wafer, so that more Efficiently thoroughly clean or thoroughly and uniformly etch wafers.

以上所述者僅為用以解釋本發明之較佳實施例，並非企圖據以對本發明做任何形式上之限制，是以，凡有在相同之發明精神下所作有關本發明之任何修飾或變更，皆仍應包括在本發明意圖保護之範疇。The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change of the present invention should be made within the same spirit of the invention. , all should still be included in the scope of the intended protection of the present invention.

1:旋轉單元 10:基座 101:豎軸 11:第一馬達組件 111:輸出軸 112:主動齒輪 12:惰齒輪組 13:被動齒輪 131:被動小齒輪 14:承載座 140:座體 141:承板 142:定位塊 143:豎板 2:吊籃架 21A:第一轉軸 21B:第二轉軸 22A:第一齒輪 22B:第二齒輪 23:動力接收齒輪 231:轉向齒輪 24:滑槽 3:晶舟 31:插槽 32:凸軌 4:晶圓片片 5:晃動單元 51:第二馬達組件 52:減速機 53:偏心輪 54:固定座 541:滑軌 55:滑動座 551:夾持座1: Rotary unit 10: Pedestal 101: Vertical axis 11: The first motor assembly 111: output shaft 112: drive gear 12: Idler gear set 13: Passive gear 131: Passive pinion 14: Bearing seat 140: seat body 141: Bearing plate 142: Positioning block 143: Riser 2: hanging basket 21A: The first reel 21B: The second reel 22A: First gear 22B: Second gear 23: Power receiving gear 231: Steering gear 24: Chute 3: Crystal boat 31: Slot 32: Raised rail 4: Wafers 5: Shaking unit 51: Second motor assembly 52: Reducer 53: Eccentric 54: Fixed seat 541: Slide rail 55: Sliding seat 551: Clamping seat

圖1為顯示本發明之旋轉單元組合於晃動單元，以及吊籃架與旋轉單元之配置關係之立體示意圖； 圖2為本發明之一個吊籃架可以置入一個晶舟及其配置關係之立體示意圖； 圖3為本發明之一個吊籃架可以置入二個晶舟及其配置關係之立體示意圖； 圖4為顯示圖2所示之一個晶舟置入吊籃架，並且由二支轉軸帶動晶圓片旋轉之平面示意圖；以及 圖5為顯示圖3所示之二個晶舟置入吊籃架，並且由二支轉軸帶動晶圓片旋轉之平面示意圖。FIG. 1 is a perspective view showing the combination of the rotating unit in the swaying unit and the configuration relationship between the hanging basket and the rotating unit according to the present invention; FIG. 2 is a three-dimensional schematic diagram of a hanging basket frame of the present invention that can be placed in a crystal boat and its configuration relationship; FIG. 3 is a three-dimensional schematic diagram of a hanging basket of the present invention that can be placed in two wafer boats and their configuration; FIG. 4 is a schematic plan view showing that a wafer boat shown in FIG. 2 is placed in the hanging basket, and the wafer is rotated by two rotating shafts; and FIG. 5 is a schematic plan view showing that the two wafer boats shown in FIG. 3 are placed in the hanging basket, and the wafers are rotated by two rotating shafts.

1:旋轉單元1: Rotary unit

10:基座10: Pedestal

101:豎軸101: Vertical axis

11:第一馬達組件11: The first motor assembly

111:輸出軸111: output shaft

112:主動齒輪112: drive gear

12:惰齒輪組12: Idler gear set

13:被動齒輪13: Passive gear

131:被動小齒輪131: Passive pinion

14:承載座14: Bearing seat

140:座體140: seat body

141:承板141: Bearing plate

142:定位塊142: Positioning block

143:豎板143: Riser

2:吊籃架2: hanging basket

21A:第一轉軸21A: The first reel

21B:第二轉軸21B: The second reel

23:動力接收齒輪23: Power receiving gear

5:晃動單元5: Shaking unit

51:第二馬達組件51: Second motor assembly

52:減速機52: Reducer

53:偏心輪53: Eccentric

54:固定座54: Fixed seat

541:滑軌541: Slide rail

55:滑動座55: Sliding seat

551:夾持座551: Clamping seat

Claims (6)

一種清洗及蝕刻裝置，具有一旋轉單元，該旋轉單元包括： 一基座； 一第一馬達組件，設於該基座； 一承載座，連接該基座，該承載座設有連接該第一馬達組件的一驅動機構；以及 一吊籃架，提供以安置在該承載座，該吊籃架的底部可旋轉地設置至少一支轉軸，該吊籃架設有連接至該至少一支轉軸的一被驅動機構，並且當該吊籃架安置於該承載座後，該被驅動機構與該驅動機構產生連接，使得該第一馬達組件通過該驅動機構與該被驅動機構帶動該至少一支轉軸旋轉， 其中，該至少一支轉軸上方的該吊籃架內可置入至少一個晶舟，並且使放置在該晶舟內的晶圓片片邊緣接觸該至少一支轉軸，使該晶圓片片被該至少一支轉軸帶動旋轉。A cleaning and etching device has a rotating unit, the rotating unit includes: a base; a first motor assembly disposed on the base; a bearing seat connected to the base, the bearing seat is provided with a driving mechanism connected to the first motor assembly; and A hanging basket is provided to be placed on the bearing base, the bottom of the hanging basket is rotatably provided with at least one rotating shaft, the hanging basket is provided with a driven mechanism connected to the at least one rotating shaft, and when the hanging After the basket is placed on the bearing base, the driven mechanism is connected with the driving mechanism, so that the first motor assembly drives the at least one rotating shaft to rotate through the driving mechanism and the driven mechanism, Wherein, at least one wafer boat can be placed in the hanging basket above the at least one rotating shaft, and the edge of the wafer placed in the wafer can be brought into contact with the at least one rotating shaft, so that the wafer is The at least one rotating shaft drives the rotation. 如請求項1所述之清洗及蝕刻裝置，其中， 該驅動機構包括： 一主動齒輪，連接該第一馬達組件的一輸出軸； 一被動齒輪，設於該承載座，該被動齒輪同心地設有一被動小齒輪；以及 一惰齒輪組，嚙合該主動齒輪與該被動齒輪； 其中，該被驅動機構包括： 至少一個齒輪，設於該至少一支轉軸的一端； 一動力接收齒輪，設於該吊籃架的側壁，該動力接收齒輪同心地設有一轉向齒輪，該轉向齒輪嚙合該至少一個齒輪， 其中，當該吊籃架安置於該承載座後，該被動小齒輪與該動力接收齒輪嚙合。The cleaning and etching device of claim 1, wherein, The drive mechanism includes: a driving gear connected to an output shaft of the first motor assembly; a driven gear disposed on the bearing base, the driven gear is provided with a driven pinion concentrically; and an idler gear set, meshing the driving gear with the driven gear; Wherein, the driven mechanism includes: at least one gear, located at one end of the at least one rotating shaft; A power receiving gear is arranged on the side wall of the hanging basket, and a steering gear is concentrically arranged on the power receiving gear, and the steering gear engages with the at least one gear, Wherein, after the hanging basket is placed on the bearing base, the passive pinion gear meshes with the power receiving gear. 如請求項2所述之清洗及蝕刻裝置，其中，包括有二支彼此平行的該轉軸，每一支該轉軸的一端均設有該齒輪，並且該轉向齒輪同時嚙合該二個齒輪。The cleaning and etching device as claimed in claim 2, comprising two rotating shafts parallel to each other, one end of each of the rotating shafts is provided with the gear, and the steering gear meshes with the two gears at the same time. 如請求項1至3項中任一項所述之清洗及蝕刻裝置，其中，該轉軸的外徑圓周為多邊形。The cleaning and etching device according to any one of claims 1 to 3, wherein the outer diameter and circumference of the rotating shaft is a polygon. 如請求項1至3項中任一項所述之清洗及蝕刻裝置，其中，該承載座設有至少一個定位塊，且該吊籃架的底部設有對應該定位塊的定位槽，當該吊籃架安置於該承載座後，該定位塊與該定位槽彼此接合。The cleaning and etching device according to any one of claims 1 to 3, wherein the carrier is provided with at least one positioning block, and the bottom of the hanging basket is provided with a positioning groove corresponding to the positioning block. After the hanging basket is installed on the bearing base, the positioning block and the positioning groove are engaged with each other. 如請求項1至3項中任一項所述之清洗及蝕刻裝置，其中，進一步包括一晃動單元，該晃動單元連接該旋轉單元，以驅動該旋轉單元在垂直方向上往復晃動。The cleaning and etching apparatus according to any one of claims 1 to 3, further comprising a shaking unit, the shaking unit is connected to the rotating unit, so as to drive the rotating unit to shake back and forth in a vertical direction.
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