TW202144262A

TW202144262A - Detection device, correction method and test equipment using the same

Info

Publication number: TW202144262A
Application number: TW109116578A
Authority: TW
Inventors: 李佳賢; 賴士興
Original assignee: 鴻勁精密股份有限公司
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2021-12-01
Also published as: TWI715499B

Abstract

The present invention provides a detection device and a correction method thereof. The detection device includes a detector disposed on a feeding path of a carrier tape, and the correction method includes a capture step, an analysis step, and a correction step. In the capture step, the detector captures image of at least one carrying area located on the carrier tape and transfers the image to a processor. The carrying area includes an electronic component and a reference position. In the analysis step, the processor analyzes the image so as to obtain a positional difference between the reference positions of at least one set of the carrying areas. The correction step is to move the carrier tape according to the positional difference so as to correct the position of the carrier tape. Therefore, the detection device of present invention prevents misidentification of an electronic component as a defective product.

Description

檢知裝置及其應用之測試調校方法、測試設備Detection device and test adjustment method and test equipment for its application

本發明提供一種提高電子元件測試良率及品質之檢知裝置及測試調校方法。The invention provides a detection device and a test adjustment method for improving the test yield and quality of electronic components.

在現今，載帶（如薄膜載帶）應用作為電子元件之載具，並分批次成型電路單元，以供固接電子元件；請參閱圖1、2，載帶10具有第一批次之第一電路單元11、第二批次之第二電路單元12…，第一電路單元11之各第一承載區111包含第一電路112及第一電子元件113，第一電子元件113之第一接點1131供電性連接第一電路112之第一傳輸點1121；第二批次之第二電路單元12之各第二承載區121包含第二電路122及第二電子元件123，第二電子元件123之第二接點1231供電性連接第二電路122之第二傳輸點1221。At present, carrier tapes (such as film carrier tapes) are used as carriers for electronic components, and circuit units are formed in batches for fixing electronic components; please refer to FIGS. 1 and 2, the carrier tape 10 has the first batch of The first circuit unit 11 , the second circuit units 12 of the second batch, . The contact 1131 is electrically connected to the first transmission point 1121 of the first circuit 112 ; each second carrying area 121 of the second circuit unit 12 of the second batch includes the second circuit 122 and the second electronic component 123 . The second electronic component The second contact 1231 of 123 is electrically connected to the second transmission point 1221 of the second circuit 122 .

測試設備以上鏈輪21及下鏈輪22輸送載帶10作X-Z方向位移，令第一電路單元11的第一電子元件113及第二電路單元12之第二電子元件123位於貼接件23前方，再以探針卡24之第一探針241及第二探針242電性接觸第一電路單元11之第一電路112的第一傳輸點1121及第二電路單元12之第二電路122的第二傳輸點1221，而同步對第一電子元件113及第二電子元件123執行測試作業。The upper sprocket 21 and the lower sprocket 22 of the testing equipment convey the carrier tape 10 for displacement in the XZ direction, so that the first electronic component 113 of the first circuit unit 11 and the second electronic component 123 of the second circuit unit 12 are located in front of the attachment member 23 , and then use the first probe 241 and the second probe 242 of the probe card 24 to electrically contact the first transmission point 1121 of the first circuit 112 of the first circuit unit 11 and the second circuit 122 of the second circuit unit 12 The second transmission point 1221 performs a test operation on the first electronic component 113 and the second electronic component 123 synchronously.

惟，由於電路成型製程採分批次於載帶10上製作第一電路單元11、第二電路單元12…，雖然第一電路單元11同一批次之複數個第一傳輸點1121不易產生間距位差，但第一電路單元11及第二電路單元12易因不同批次製作時序或機構等因素，致使第一電路單元11與第二電路單元12具有Y方向之間距位差L，易言之，第一電路112的第一傳輸點1121與第二電路122的第二傳輸點1221具有間距位差L，當探針卡24之第一探針241及第二探針242欲同步測試第一電子元件113及第二電子元件123時，即會發生第一探針241雖準確接觸第一電路112之第一傳輸點1121，但第二探針242卻無法準確接觸第二電路122之第二傳輸點1221，以致誤判第二電子元件123為不良品，進而影響測試準確性。又若被誤判之第二電子元件123實際為良品，僅因誤判而被淘汰，造成電子元件之成本損失。再者，於實際作業中，測試裝置設定探針卡24之第二探針242要發生至少三次測試異常，方可判定第二電子元件123為不良品，但易使載帶10或第二電子元件123因第二探針242多次錯誤壓抵而受損，以致增加成本。However, since the first circuit unit 11 , the second circuit unit 12 . . . are fabricated on the carrier tape 10 in batches in the circuit forming process, although the plurality of first transmission points 1121 in the same batch of the first circuit unit 11 are not easy to generate spacing bits However, the first circuit unit 11 and the second circuit unit 12 are likely to have a distance L between the first circuit unit 11 and the second circuit unit 12 in the Y direction due to factors such as different batches of production timing or mechanism. , the first transmission point 1121 of the first circuit 112 and the second transmission point 1221 of the second circuit 122 have a pitch difference L. When the first probe 241 and the second probe 242 of the probe card 24 want to synchronously test the first When the electronic component 113 and the second electronic component 123 are used, it will happen that although the first probe 241 accurately contacts the first transmission point 1121 of the first circuit 112 , the second probe 242 cannot accurately contact the second transmission point 1121 of the second circuit 122 . The transmission point 1221 may misjudge the second electronic component 123 as a defective product, thereby affecting the test accuracy. In addition, if the second electronic component 123 that is misjudged is actually a good product, it is only eliminated due to the misjudgment, resulting in cost loss of the electronic component. Furthermore, in actual operation, the test device sets the second probe 242 of the probe card 24 to have at least three abnormal tests before it can be determined that the second electronic component 123 is a defective product, but it is easy to cause the carrier tape 10 or the second electronic The element 123 is damaged due to multiple incorrect pressing of the second probe 242, thereby increasing the cost.

本發明之目的一，係提供一種檢知裝置，其於載帶之入料路徑配置承檢器，承檢器取像載帶之至少一批次具電子元件及調校基準之承載區，並將承載區取像資料傳輸至處理器，處理器分析承載區取像資料，並取得調校基準位差值，以供調校載帶，進而提高電子元件良率及測試品質。One of the objectives of the present invention is to provide a detection device, in which a detection device is arranged on the feeding path of the carrier tape, and the detection device captures at least one batch of the carrier tape with electronic components and a bearing area for calibration standards, and The imaging data of the bearing area is transmitted to the processor, and the processor analyzes the imaging data of the bearing area, and obtains the adjustment reference position difference value for adjustment of the carrier tape, thereby improving the yield rate and test quality of electronic components.

本發明之目的二，係提供一種檢知裝置，其於載帶之入料路徑配置整平機構，以確保載帶之平整性，使承檢器準確取像至少一批次具電子元件及調校基準之承載區，達到提升調校精確性之實用效益。The second object of the present invention is to provide a detection device, which is equipped with a leveling mechanism on the feeding path of the carrier tape to ensure the flatness of the carrier tape, so that the detector can accurately capture images of at least one batch of electronic components and adjust The bearing area of the calibration standard achieves the practical benefit of improving the accuracy of calibration.

本發明之目的三，係提供一種檢知裝置，其整平機構設置至少一第一溫控件，以於入料路徑預溫載帶上之電子元件，進而有效縮短測試作業時間，達到提高生產效能之實用效益。The third object of the present invention is to provide a detection device, wherein the leveling mechanism is provided with at least one first temperature control device to pre-heat the electronic components on the carrier tape in the feeding path, thereby effectively shortening the test operation time and improving production. Practical benefits of performance.

本發明之目的四，係提供一種檢知裝置，其於測試器之前方配置定檢取像器，於每次測試時序時，以取像載帶之承載區的至少一定位點，以供檢知承載區是否位於預設定點位置，達到提升調校精確性之實用效益。The fourth object of the present invention is to provide a detection device, which is equipped with a fixed detection imager in front of the tester, in each test sequence, at least one positioning point of the bearing area of the image carrier tape is captured for inspection. Knowing whether the bearing area is located at the preset point position can achieve the practical benefit of improving the accuracy of adjustment.

本發明之目的五，係提供一種檢知裝置，其於載帶與測試器之間配置初檢取像器，於初始測試作業時，初檢取像器取像載帶之預設測試接點及測試器之傳輸件，以供調校載帶，使預設之測試接點初始對位於傳輸件，達到提升調校精確性之實用效益。The fifth object of the present invention is to provide a detection device, wherein an initial inspection imager is arranged between the carrier tape and the tester. During the initial test operation, the initial inspection imager captures the preset test contact of the carrier tape. And the transmission part of the tester is used to adjust the carrier tape, so that the preset test contacts are initially aligned with the transmission part, so as to achieve the practical benefit of improving the adjustment accuracy.

本發明之目的六，係提供一種測試調校方法，其承檢取像手段以承檢器取像載帶之至少一批次具電子元件及調校基準之承載區，並將承載區取像資料傳輸至處理器，承檢比對手段以處理器分析承載區取像資料，而取得至少一組承載區之調校基準位差值，調校手段於具位差之一組承載區的一電子元件完測後，將調校基準位差值補償於載帶之位移值，而調校載帶，使誤判之另一電子元件搭配預設電子元件同步執行測試作業，進而提高電子元件之測試良率。The sixth object of the present invention is to provide a test and adjustment method, wherein the inspection and image capturing means use an inspection device to capture images of at least one batch of bearing areas of a carrier tape with electronic components and calibration standards, and capture images of the bearing areas The data is transmitted to the processor, and the inspection and comparison means analyzes the imaging data of the bearing area by the processor, and obtains the calibration reference position difference value of at least one set of bearing areas, and the adjustment means is used in a set of bearing areas with the position difference. After the electronic components are tested, the adjustment reference position difference is compensated for the displacement value of the carrier tape, and the carrier tape is adjusted so that another electronic component that has been misjudged is matched with the preset electronic component to perform the test operation synchronously, thereby improving the testing of electronic components. Yield.

本發明之目的七，係提供一種測試設備，包含機台、輸送裝置、供料裝置、收料裝置、測試裝置、檢知裝置及中央控制裝置；輸送裝置係配置於機台，並設有承載機構及輸送機構，輸送機構裝配於承載機構，以輸送載帶；供料裝置係裝配於輸送裝置，並設有至少一供料器，以提供具待測電子元件之載帶；收料裝置係裝配於輸送裝置，並設有至少一收料器，以收置具已測電子元件之載帶；測試裝置係配置於機台，並設有至少一測試器，以供對載帶上之複數個電子元件執行測試作業；檢知裝置包含承檢器及處理器，承檢器於入料路徑取像載帶，處理器接收分析承檢器之取像資料；中央控制裝置以控制及整合各裝置作動，而執行自動化作業，達到提升測試效能之實用效益。The seventh object of the present invention is to provide a testing equipment, including a machine, a conveying device, a feeding device, a receiving device, a testing device, a detection device and a central control device; the conveying device is arranged on the machine, and is provided with a bearing Mechanism and conveying mechanism, the conveying mechanism is assembled on the carrying mechanism to convey the carrier tape ; The feeding device is assembled on the conveying device and has at least one feeder to provide the carrier tape with the electronic components to be tested; the receiving device is assembled on the conveying device and has at least one receiver to receive A carrier tape on which the tested electronic components are placed; the testing device is arranged on the machine table, and is provided with at least one tester for performing testing operations on a plurality of electronic components on the carrier tape; the detection device includes a tester and a processing device The detector takes the image carrier tape in the feeding path, and the processor receives and analyzes the imaging data of the detector; the central control device controls and integrates the actions of each device, and performs automatic operations to achieve practical benefits of improving test performance.

本發明之目的八，係提供一種測試設備，更包含於輸送裝置之承載機構配置具至少一第二溫控件之溫控裝置，以供載帶之電子元件於預設溫度測試環境執行測試作業，進而提升測試品質。The eighth object of the present invention is to provide a test equipment, further comprising a temperature control device provided with at least one second temperature control device in the carrier mechanism of the conveying device, so that the electronic components of the carrier tape can perform testing operations in a preset temperature test environment , thereby improving the test quality.

為使　貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如後：In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:

請參閱圖3，載帶30具有複數個批次之電路單元，各批次電路單元包含至少一具電路之承載區，以供連結且承固電子元件，例如一批次電路單元包含一具電路之承載區，例如一批次電路單元包含複數個具電路之承載區；於本實施例中，載帶30包含第一批次之第一電路單元31、第二批次之第二電路單元32…等，第一電路單元31設有複數個第一承載區311，各第一承載區311包含第一定位點312、第一電路313及第一電子元件314，第一電子元件314以第一接點3141電性連接第一電路313之第一傳輸點3131；第二電路單元32設有複數個第二承載區321，各第二承載區321包含第二定位點322、第二電路323及第二電子元件324，第二電子元件324以第二接點3241電性連接第二電路323之第二傳輸點3231。Please refer to FIG. 3 , the carrier tape 30 has a plurality of batches of circuit units, and each batch of circuit units includes at least one circuit-bearing area for connecting and holding electronic components. For example, a batch of circuit units includes one circuit. For example, a batch of circuit units includes a plurality of bearing areas with circuits; in this embodiment, the carrier tape 30 includes the first circuit units 31 of the first batch and the second circuit units 32 of the second batch ... etc., the first circuit unit 31 is provided with a plurality of first bearing areas 311, each of the first bearing areas 311 includes a first positioning point 312, a first circuit 313 and a first electronic component 314, the first electronic component 314 is represented by a first The contact 3141 is electrically connected to the first transmission point 3131 of the first circuit 313; the second circuit unit 32 is provided with a plurality of second bearing areas 321, and each second bearing area 321 includes a second positioning point 322, a second circuit 323 and The second electronic element 324 is electrically connected to the second transmission point 3231 of the second circuit 323 through the second contact 3241 .

由於電子元件型式不同，其接點之配置也所有差異，例如電子元件之頂面及底面分別具有接點，或電子元件之底面具接點，業者可依電子元件之型式及測試作業需求，以電路之傳輸點或電子元件之接點作為測試接點；於本實施例中，以第一電路313之第一傳輸點3131及第二電路323之第二傳輸點3231分別作為第一承載區311及第二承載區321的測試接點。Due to the different types of electronic components, the configuration of their contacts is also different. For example, electronic components have contacts on the top surface and bottom surface respectively, or contacts on the bottom surface of electronic components. According to the type of electronic components and the needs of testing operations, the industry can use The transmission point of the circuit or the contact of the electronic component is used as the test contact; in this embodiment, the first transmission point 3131 of the first circuit 313 and the second transmission point 3231 of the second circuit 323 are respectively used as the first bearing area 311 and the test contacts of the second bearing area 321 .

請參閱圖3、4，一種測試設備包含機台40、輸送裝置50、供料裝置60、收料裝置70、測試裝置80、檢知裝置90及中央控制裝置(圖未示出)，以供測試及調校具電子元件之載帶30，測試設備更包含溫控裝置100，使電子元件於預設溫度測試環境執行測試作業，中央控制裝置以控制及整合各裝置作動，以執行自動化作業。Please refer to FIGS. 3 and 4 , a test equipment includes a machine 40 , a conveying device 50 , a feeding device 60 , a receiving device 70 , a testing device 80 , a detection device 90 and a central control device (not shown) for supplying The carrier tape 30 with electronic components is tested and adjusted, and the testing equipment further includes a temperature control device 100, which enables the electronic components to perform testing operations in a predetermined temperature test environment, and the central control device controls and integrates the actions of each device to perform automated operations.

輸送裝置50裝配於機台40，包含承載機構及輸送機構，輸送機構裝配於承載機構，以輸送載帶30；承載機構包含承載驅動單元及載架單元，承載驅動單元設有至少一承載驅動器，以供驅動載架單元位移，於本實施例中，承載驅動單元包含第一承載驅動器51及第二承載驅動器52；載架單元設有至少一載架，並由承載驅動單元驅動作至少一方向位移，於本實施例中，載架單元包含第一載架53、第二載架54、第一貼接件55及第二貼接件56，第一載架53供第一承載驅動器51驅動作Y-X方向位移，並裝配第二承載驅動器52，第二載架54供第二承載驅動器52驅動作X方向位移，第一貼接件55裝配於第二載架54，並位於載帶30之測試路徑，第二貼接件56作可位移式配置於第二載架54，並由貼接驅動器57驅動相對第一貼接件55位移，以供貼接載帶30，並可顯露載帶30之第一承載區311或第二承載區321；輸送機構設有至少一輸送器，以供輸送載帶30，於本實施例中，輸送器包含第一輸送輪581及第二輸送輪582，第一輸送輪581及第二輸送輪582裝配於第二載架54，以供輸送具複數個第一、二電子元件314、324之載帶30沿入料路徑、測試路徑及出料路徑位移。The conveying device 50 is assembled on the machine table 40 and includes a carrying mechanism and a conveying mechanism. The conveying mechanism is assembled on the carrying mechanism to convey the carrier tape 30; For driving the carrier unit to move, in this embodiment, the carrier driving unit includes a first carrier driver 51 and a second carrier driver 52; the carrier unit is provided with at least one carrier, which is driven by the carrier driving unit in at least one direction Displacement, in this embodiment, the carrier unit includes a first carrier 53 , a second carrier 54 , a first attachment member 55 and a second attachment member 56 , and the first carrier 53 is driven by the first carrier driver 51 The second carrier 54 is driven by the second carrier driver 52 to move in the X direction, and the first abutting member 55 is assembled on the second carrier 54 and located between the carrier tape 30 . In the test path, the second attaching member 56 is displaceably arranged on the second carrier 54 and is driven by the attaching driver 57 to displace relative to the first attaching member 55 for attaching the carrier tape 30 and revealing the carrier tape The first carrying area 311 or the second carrying area 321 of 30; the conveying mechanism is provided with at least one conveyor for conveying the carrier tape 30. In this embodiment, the conveyor includes a first conveying wheel 581 and a second conveying wheel 582 , the first conveying wheel 581 and the second conveying wheel 582 are assembled on the second carrier 54 for conveying the carrier tape 30 of the plurality of first and second electronic components 314 and 324 along the feeding path, the testing path and the discharging path displacement.

供料裝置60係裝配於輸送裝置50，並設有至少一供料器61，以提供具待測第一、二電子元件314、324之載帶30。收料裝置70係裝配於輸送裝置50，並設有至少一收料器61，以收置具已測第一、二電子元件314、324之載帶30。測試裝置80係配置於機台40，並設有至少一測試器，以供對載帶30上之複數個電子元件執行測試作業；測試器依測試作業需求而配置複數個傳輸件；於本實施例中，測試裝置80位於輸送裝置50之前方，並於承板81裝配一為探針卡82之測試器，探針卡82設有通孔821，並於通孔821配置為第一探針83及第二探針84之複數個傳輸件，以供同步測試載帶30上之第一電子元件314、第二電子元件324或第一電子元件314及第二電子元件324。The feeding device 60 is assembled to the conveying device 50 and is provided with at least one feeder 61 to provide the carrier tape 30 with the first and second electronic components 314 and 324 to be tested. The receiving device 70 is assembled to the conveying device 50, and is provided with at least one receiving device 61 for receiving the carrier tape 30 having the tested first and second electronic components 314 and 324. The test device 80 is disposed on the machine 40 and is provided with at least one tester for performing the test operation on a plurality of electronic components on the carrier tape 30; the tester is configured with a plurality of transmission parts according to the test operation requirements; In the example, the testing device 80 is located in front of the conveying device 50, and a tester is assembled on the support plate 81 as a probe card 82. The probe card 82 is provided with a through hole 821, and the through hole 821 is configured as a first probe 83 and a plurality of transmission parts of the second probe 84 for synchronously testing the first electronic component 314 , the second electronic component 324 or the first electronic component 314 and the second electronic component 324 on the carrier tape 30 .

檢知裝置90包含承檢器91及處理器(圖未示出)，承檢器91係配置於載帶30之入料路徑，以取像載帶30之至少一具電子元件及調校基準之承載區，更進一步，承檢器91可直接取像載帶30，或搭配菱鏡使用，承檢器91可依測試作業需求而取像預設數量之承載區，例如承檢器91逐一取像載帶30之承載區，例如承檢器91單次之取像數量相同或異於測試器之傳輸件數量；承檢器91可作固定式或移動式配置，承檢器91與載帶30作相對位移，例如載帶30沿入料路徑位移行經承檢器91，以供承檢器91取像，例如承檢器91沿入料路徑位移，以取像載帶30，前述方式均可達到承檢器91取像載帶30之目的，而不受限於本實施例；本實施例中，承檢器91為CCD，而固設於輸送裝置50之第一載架53，並搭配菱鏡，以取像入料路徑之載帶30的複數個第一承載區311、複數個第二承載區321或第一、二承載區311、321。The detection device 90 includes a detector 91 and a processor (not shown in the figure). The detector 91 is arranged on the feeding path of the carrier tape 30 to capture at least one electronic component of the carrier tape 30 and adjust the reference bearing area Furthermore, the detector 91 can directly take images of the carrier tape 30, or be used with a diamond mirror. The detector 91 can take images of a preset number of bearing areas according to the requirements of the test operation, for example, the detector 91 can take images of the carrier tapes one by one. Bearing area with 30 For example, the number of images taken by the detector 91 in a single time is the same as or different from the number of transmission parts of the tester; The belt 30 is displaced along the feeding path and travels through the detector 91 for the detector 91 to capture images. For example, the detector 91 is displaced along the feeding path to capture the image of the carrier tape 30. The above methods can all reach the detector 91 The purpose of capturing the image carrier tape 30 is not limited to this embodiment; in this embodiment, the detector 91 is a CCD, which is fixed on the first carrier 53 of the conveying device 50 and is matched with a diamond mirror to capture the image. Like a plurality of first bearing areas 311 , a plurality of second bearing areas 321 or the first and second bearing areas 311 and 321 of the carrier tape 30 of the feeding path.

處理器係接收該承檢器之承載區取像資料，並分析該承載區之調校基準位差；更進一步，處理器可將承載區取像資料與資料庫內建之承載區樣本資料作比對分析，或者將二承載區取像資料作比對分析；又檢知裝置90可獨立配置處理器，或應用中央控制裝置之處理器，不受限於本實施例；於本實施例中，檢知裝置90應用中央控制裝置之處理器，處理器設有資料庫，資料庫內建之承載區樣本資料。The processor receives the imaging data of the bearing area of the detector, and analyzes the calibration reference level difference of the bearing area; further, the processor can compare the imaging data of the bearing area with the sample data of the bearing area built in the database. The comparison analysis, or the comparison and analysis of the image data of the two bearing areas; and the detection device 90 can be independently configured with a processor, or the processor of the central control device can be used, which is not limited to this embodiment; in this embodiment , the detection device 90 uses the processor of the central control device, the processor is provided with a database, and the built-in database carries the sample data of the bearing area.

檢知裝置90於載帶30之入料路徑配置整平機構，整平機構設置至少一承靠件，並於承靠件設有至少一整平部件，以整平載帶30，使承檢器91準確取像電子元件；更進一步，整平部件可為夾具或吸孔，以供夾持或吸附載帶30平貼於承靠件；於本實施例中，整平機構於輸送裝置50之第一載架53且位於承檢器91下方設置承靠件92，承靠件92之頂面相對於載帶30之底面，承靠件92設有複數個為吸孔921之整平部件，以供吸附載帶30貼平定位於承靠件92。The detection device 90 is provided with a leveling mechanism on the feeding path of the carrier tape 30, the leveling mechanism is provided with at least one bearing member, and at least one leveling component is arranged on the bearing member to level the carrier tape 30 so that the detection The device 91 accurately captures the image of the electronic components; further, the leveling component can be a clamp or a suction hole for clamping or sucking the carrier tape 30 to be flat against the bearing member; in this embodiment, the leveling mechanism is on the conveying device 50 The first carrier 53 is provided with a bearing member 92 under the inspection device 91. The top surface of the bearing member 92 is opposite to the bottom surface of the carrier tape 30. The bearing member 92 is provided with a plurality of leveling members which are suction holes 921. For the adsorption carrier tape 30 to be flatly positioned on the bearing member 92 .

又，整平機構設置至少一第一溫控件93，以預溫載帶30上之電子元件，而縮短測試作業時間，第一溫控件93可為加熱件、致冷晶片或具預溫流體之座體，於本實施例中，第一溫控件93為致冷晶片，以預冷載帶30上之第一電子元件314及第二電子元件324。In addition, the leveling mechanism is provided with at least one first temperature control 93 to pre-warm the electronic components on the carrier tape 30 and shorten the test operation time. The first temperature control 93 can be a heating element, a cooling chip or a pre-heating For the fluid seat, in this embodiment, the first temperature control 93 is a cooling chip to pre-cool the first electronic components 314 and the second electronic components 324 on the carrier tape 30 .

檢知裝置90更包含於測試器之前方配置定檢取像器94，於每次測試時序時，以取像載帶30之承載區的至少一定位點，而供檢知承載區是否位於預設定點位置；於本實施例中，定檢取像器94為CCD，並位於探針卡82之前方，以取像載帶30，且將定位取像資料傳輸至處理器以供分析比對。The detection device 90 further includes a fixed detection imager 94 disposed in front of the tester, in each test sequence, to capture at least one positioning point of the bearing area of the carrier tape 30 for detecting whether the bearing area is located in a predetermined position. Set point position; in this embodiment, the fixed inspection imager 94 is a CCD and is located in front of the probe card 82 , to capture the image carrier tape 30, and transmit the positioning and capturing data to the processor for analysis and comparison.

檢知裝置90更包含初檢取像器95，初檢取像器95以供位移至載帶30與測試器之間，於初始測試作業時取像載帶30之預設測試接點及測試器之傳輸件，以供調校載帶30，使預設測試接點初始對位於傳輸件；於本實施例中，初檢取像器95為CCD，並由取像驅動器驅動初檢取像器95作Y方向位移，以供初檢取像器95取像載帶30之第一承載區311的二第一傳輸點3131及探針卡82之第一、二探針83、84，並將初檢取像資料傳輸至處理器以供分析比對。The detection device 90 further includes an initial inspection imager 95, the initial inspection imager 95 is used for displacement between the carrier tape 30 and the tester, and the preset test contacts of the carrier tape 30 are captured and tested during the initial test operation. The transmission part of the device is used to adjust the carrier tape 30 so that the preset test contacts are initially aligned with the transmission part; in this embodiment, the initial inspection imager 95 is a CCD, and the image capture driver drives the initial inspection to capture the image. The sensor 95 is displaced in the Y direction, so that the initial inspection imager 95 captures the two first transmission points 3131 of the first carrying area 311 of the carrier tape 30 and the first and second probes 83 and 84 of the probe card 82, and The first-shot image data is transmitted to the processor for analysis and comparison.

溫控裝置100係裝配於輸送裝置50，包含測試室101及至少一第二溫控件102，測試室101供移入及移出載帶30，第二溫控件102供測試室101形成一預設溫度測試環境，使載帶30之電子元件於預設溫度測試環境執行測試作業；於本實施例中，測試室101裝配於輸送裝置50之第二載架54，第二溫控件102輸送低溫流體於測試室101，使測試室101形成一預設低溫測試環境。The temperature control device 100 is assembled on the conveying device 50, and includes a test chamber 101 and at least one second temperature control device 102. The test chamber 101 is used for moving in and out of the carrier tape 30, and the second temperature control device 102 is used for the test chamber 101 to form a preset The temperature test environment enables the electronic components of the carrier tape 30 to perform the test operation in the preset temperature test environment In this embodiment, the test chamber 101 is assembled on the second carrier 54 of the conveying device 50, and the second temperature controller 102 delivers low temperature fluid in the test chamber 101, so that the test chamber 101 forms a preset low temperature test environment.

請參閱圖3~8，本發明之測試調校方法包含承檢取像手段、承檢比對手段及調校手段，承檢取像手段以承檢器91取像載帶30之至少一具電子元件及調校基準之承載區，並將承載區取像資料傳輸至處理器；更進一步，承檢取像手段以承檢器91與載帶30其中一者位移，例如載帶30沿入料路徑位移行經承檢器91，以供承檢器91取像，例如承檢器91沿入料路徑位移，以取像載帶30 ，前述承檢取像手段均可達到承檢器91取像載帶30之目的，而不受限於本實施例。Please refer to FIGS. 3 to 8 , the test and adjustment method of the present invention includes inspection and image capturing means, inspection and comparison means and adjustment means. The inspection and image capturing means is at least one of the image carrier tape 30 captured by the inspection device 91 . The bearing area of the electronic components and the calibration reference is transmitted, and the imaging data of the bearing area is transmitted to the processor; further, the detection and imaging means are displaced by one of the detector 91 and the carrier tape 30, for example, the carrier tape 30 moves along the The material path is displaced to travel through the inspector 91 for the inspector 91 to take images, for example, the inspector 91 is displaced along the feeding path to take images of the carrier tape 30 , the aforementioned inspection and image capturing means can all achieve the purpose of capturing the image of the carrier tape 30 by the inspection device 91 , and are not limited to this embodiment.

承檢取像手段依測試作業需求，以承檢器91取像預設數量之承載區；例如可設定承檢器91逐一取像載帶30之承載區；例如可設定承檢器91單次之取像數量相同或異於測試器之傳輸件數量，以於承檢器91取像同一批次電路單元之複數個承載區後，並可取像複數個不同批次電路單元之複數個承載區，以供檢知複數個不同批次電路單元之調校基準位差。According to the test operation requirements, the inspection and image capturing means use the inspection device 91 to capture images of a preset number of bearing areas; for example, the inspection device 91 can be set to take images of the bearing area of the carrier tape 30 one by one; for example, the inspection device 91 can be set to take a single The number of images taken is the same or different from the number of transmission parts of the tester, so that after the detector 91 takes images of a plurality of bearing areas of the same batch of circuit units, it can take images of a plurality of bearing areas of a plurality of different batches of circuit units , for detecting the calibration reference level difference of a plurality of different batches of circuit units.

然於承檢取像手段前，可執行定帶手段，定帶手段由檢知裝置90之整平機構整平定位載帶30，使承檢器91精確取像載帶30；於本實施例中，輸送裝置50之第一輸送輪581及第二輸送輪582將供料裝置60輸出之載帶30沿入料路徑輸送至承檢器91及整平機構之承靠件92間，整平機構以承靠件92之複數個吸孔921吸附載帶30，使載帶30平整定位於承靠件92。However, before the inspection and capturing means, the tape fixing means can be executed, and the tape fixing means is used to level and position the carrier tape 30 by the leveling mechanism of the detection device 90, so that the inspection device 91 can accurately capture the image of the carrier tape 30; in this embodiment In the middle, the first conveying wheel 581 and the second conveying wheel 582 of the conveying device 50 convey the carrier tape 30 output from the feeding device 60 along the feeding path to between the inspector 91 and the bearing member 92 of the leveling mechanism, and level the tape 30. The mechanism sucks the carrier tape 30 through the plurality of suction holes 921 of the bearing member 92 , so that the carrier tape 30 is positioned flat on the bearing member 92 .

於整平定位載帶30後，由於探針卡82具有第一探針83及第二探針84之二個傳輸件，載帶30之第一電路單元31具有七個第一承載區311及第二電路單元32具有七個第二承載區321，承檢取像手段可設定承檢器91的取像數量相同於測試器之傳輸件數量，即承檢取像手段以承檢器91單次取像載帶30上之二個承載區，承檢器91依序取像第一電路單元31及第二電路單元32…，然因同一批次電路單元之各承載區不易產生異常位差，茲以承檢器91單次取像載帶30上之第7號第一承載區311及第8號第二承載區321為例，承檢器91於取像後，將第7號第一承載區311及第8號第二承載區321的承載區取像資料傳輸至處理器。After the carrier tape 30 is leveled and positioned, since the probe card 82 has two transmission members of the first probe 83 and the second probe 84, the first circuit unit 31 of the carrier tape 30 has seven first carrying areas 311 and The second circuit unit 32 has seven second bearing areas 321 , and the image capturing means can set the number of images captured by the inspection device 91 to be the same as the number of transmission parts of the tester, that is, the image capturing means can be set by the inspection device 91 as a single unit. In the second image of the two bearing areas on the carrier tape 30, the detector 91 sequentially takes images of the first circuit unit 31 and the second circuit unit 32 . , hereby take the No. 7 first carrying area 311 and No. 8 second carrying area 321 on the carrier tape 30 for a single image acquisition by the detector 91 as an example, after the detector 91 takes an image, the No. 7 The image data of a bearing area 311 and the bearing area of the No. 8 second bearing area 321 are transmitted to the processor.

承檢比對手段以處理器分析承載區取像資料，而取得承載區之調校基準位差值；然載帶30可以各承載區內之任一點位或電子元件作為調校基準，例如以定位點、電路之傳輸點、電子元件之接點或電子元件之一面作為調校基準，只要供分析出調校基準位差值即可，不受限於本實施例；於本實施例中，以第一電子元件314之第一側面3142及第二電子元件324之第二側面3242分別作為第一承載區311及第二承載區321的調校基準；更進一步，承檢比對手段可將承載區取像資料與處理器之資料庫內建的承載區樣本資料作比對，亦或將二個承載區取像資料作比對；於本實施例中，承檢比對手段將承檢器91傳輸之承載區取像資料與處理器之資料庫內建的承載區樣本資料作比對，若第7號之第一電子元件314的第一側面3142與第8號之第二電子元件324的第二側面3242二者並無調校基準位差，則無需補償料帶30之位移值，反之，第7號之第一電子元件314的第一側面3142與第8號之第二電子元件324的第二側面3242二者具有調校基準位差L，即顯示第一電路單元31與第二電路單元32二者具有位差，而需補償料帶30之位移值。In the inspection and comparison method, the processor analyzes the imaging data of the bearing area, and obtains the calibration reference position difference value of the bearing area; however, the carrier tape 30 can use any point or electronic component in each bearing area as the calibration reference For example, the positioning point, the transmission point of the circuit, the contact point of the electronic component or one surface of the electronic component is used as the calibration reference, as long as the calibration reference position difference value can be analyzed, and it is not limited to this embodiment; example , the first side surface 3142 of the first electronic component 314 and the second side surface 3242 of the second electronic component 324 are used as the calibration benchmarks of the first bearing area 311 and the second bearing area 321 respectively; further, the inspection and comparison means can be Compare the imaging data of the bearing area with the sample data of the bearing area built in the database of the processor, or compare the imaging data of the two bearing areas; in this embodiment, the inspection and comparison means will be The imaging data of the bearing area transmitted by the detector 91 is compared with the sample data of the bearing area built in the database of the processor. If the first side surface 3142 of the first electronic component 314 of No. The second side 3242 of the component 324 does not have to adjust the reference level difference, so there is no need to compensate the displacement value of the tape 30. On the contrary, the first side 3142 of the first electronic component 314 of No. 7 and the second side of No. 8 do not need to compensate. Both the second side surfaces 3242 of the electronic component 324 have the calibration reference level difference L, which means that the first circuit unit 31 and the second circuit unit 32 have a level difference, and the displacement value of the tape 30 needs to be compensated.

於承檢器91取像載帶30後，承靠件92之第一溫控件93已預冷載帶30上之第一電子元件314及第二電子元件324，並令吸孔921釋放載帶30，第一輸送輪581及第二輸送輪582輸送載帶30移入溫控裝置100之測試室101，使載帶30之第一電子元件314及第二電子元件324位於預設低溫測試環境，並位於輸送裝置50之第一貼接件55及第二貼接件56間。After the detector 91 captures the image of the carrier tape 30, the first temperature control 93 of the support member 92 has pre-cooled the first electronic component 314 and the second electronic component 324 on the carrier tape 30, and makes the suction hole 921 release the load. The belt 30, the first conveying wheel 581 and the second conveying wheel 582 move the carrier tape 30 into the test chamber 101 of the temperature control device 100, so that the first electronic component 314 and the second electronic component 324 of the carrier tape 30 are located in a preset low temperature test environment , and is located between the first abutting member 55 and the second abutting member 56 of the conveying device 50 .

調校手段於具位差之一組承載區的一電子元件完測後，將調校基準位差值補償於載帶之位移值，而調校載帶，使誤判之另一電子元件搭配預設電子元件同步執行測試作業；更進一步，調校手段以輸送裝置50之第一承載驅動器51或第一輸送輪581及第二輸送輪582帶動調整載帶30位移，於本實施例中，若第7號之第一電子元件314與第8號之第二電子元件324具有Y方向之調校基準位差L，當第7號之第一承載區311的第一傳輸點3131位於第一測試位置A，並與探針卡82之第一探針83電性接觸時，第8號之第二承載區321的第二傳輸點3231會因調校基準位差L而無法位於第二測試位置B，即第二傳輸點3231無法電性接觸探針卡82之第二探針84，於探針卡82以第一探針83及第二探針84同步對第一電子元件314及第二電子元件324執行測試作業時，第二電子元件324將會被誤判為不良品；因此，調校手段於第一電子元件314完測後，將調校基準位差值補償於載帶30之位移值，利用輸送裝置50之第一承載驅動器51帶動第一載架53 、第二載架54及載帶30等作Y方向位移，而調校載帶30，令第8號之第二承載區321的第二傳輸點3231位於第一測試位置A，並使第9號之第二承載區321A的第二傳輸點3231A位於第二測試位置B，使探針卡82之第一探針83及第二探針84準確電性接觸第8號之第二承載區321的第二傳輸點3231及第9號之第二承載區321A的第二傳輸點3231A，而同步對第8號之第二承載區321的第二電子元件324及第9號之第二承載區321A的第二電子元件324A執行測試作業，進而防止誤判電子元件，以提高測試良率及節省成本。The adjustment method is to compensate the displacement value of the carrier tape with the adjustment reference level difference value after the measurement of an electronic component in a set of bearing areas with a position difference is completed, and then adjust the carrier tape so that another electronic component that has been misjudged is matched with the preset value. The electronic components are set to perform the test operation synchronously; further, the adjustment means uses the first carrying driver 51 of the conveying device 50 or the first conveying wheel 581 and the second conveying wheel 582 to drive and adjust the displacement of the carrier tape 30, in this embodiment , if the first electronic component 314 of No. 7 and the second electronic component 324 of No. 8 have a calibration reference level difference L in the Y direction, when the first transmission point 3131 of the first carrying area 311 of No. 7 is located in the When a test position A is in electrical contact with the first probes 83 of the probe card 82, the second transmission point 3231 of the second bearing area 321 of No. 8 cannot be located at the second transmission point 323 due to the adjustment of the reference level difference L The test position B, that is, the second transmission point 3231 cannot electrically contact the second probe 84 of the probe card 82 , the probe card 82 uses the first probe 83 and the second probe 84 to synchronously test the first electronic element 314 and the second probe 84 . When the second electronic component 324 performs the test operation, the second electronic component 324 will be misjudged as a defective product; therefore, after the first electronic component 314 is tested, the calibration means compensates the calibration reference position difference on the carrier tape 30 The displacement value of the first carrier 53 is driven by the first carrier driver 51 of the conveying device 50 , the second carrier 54 and the carrier tape 30 are displaced in the Y direction, and the carrier tape 30 is adjusted so that the second transfer point 3231 of the second carrier area 321 of No. 8 is located at the first test position A, and the No. 9 The second transmission point 3231A of the No. 8 second carrying area 321A is located at the second test position B, so that the first probes 83 and the second probes 84 of the probe card 82 can accurately electrically contact the No. 8 second carrying area 321 The second transmission point 3231 of the second transmission point 3231 of the No. 9 and the second transmission point 3231A of the second carrying area 321A of the No. 9, and the second electronic components 324 of the second carrying area 321 of the No. 8 and the second carrying area of The second electronic component 324A of 321A performs the test operation, thereby preventing misjudgment of the electronic component, so as to improve the test yield and save the cost.

測試調校方法更包含定檢取像手段及定檢比對手段，定檢取像手段以定檢取像器94於每次測試時序取像載帶30之複數承載區的至少一定位點，並將定位取像資料傳輸至處理器；於本實施例中，定檢取像器94透過探針卡82之通孔821取像第7號第一承載區311的第一定位點312與第8號第二承載區321之第二定位點322，並將定位取像資料傳輸至處理器；定檢比對手段以處理器分析定位取像資料，以供判斷至少一承載區的至少一定位點是否位於預設定位位置；於本實施例中，定檢比對手段以處理器將定位取像資料與資料庫92內建之定位點樣本資料作比對，以判別第7號第一承載區311的第一定位點312是否位於預設定位位置，若無位於定位位置，利用調校手段調校載帶30之位置。The test and adjustment method further includes a fixed inspection and image acquisition method and a fixed inspection and comparison method. In the fixed inspection image acquisition method, the fixed inspection image acquisition device 94 captures at least one positioning point of the plurality of bearing areas of the image carrier tape 30 in each test sequence. and transmits the positioning and imaging data to the processor; in this embodiment, the positioning and imaging device 94 acquires images of the first positioning point 312 and the first positioning point 312 of the No. 7 first bearing area 311 through the through hole 821 of the probe card 82 The second positioning point 322 of the second bearing area 321 of No. 8, and transmits the positioning and imaging data to the processor; the regular inspection and comparison method uses the processor to analyze the positioning and imaging data, so as to determine at least one positioning of at least one bearing area Whether the point is at the preset positioning position In this embodiment, the regular inspection and comparison method uses the processor to compare the positioning acquisition data with the positioning point sample data built in the database 92 to determine the first positioning point of the No. 7 first bearing area 311 312 is at the preset positioning position, if not at the positioning position, adjust the position of the carrier tape 30 by adjusting means.

測試調校方法更包含初檢取像手段及初檢比對手段，初檢取像手段以初檢取像器95於初始測試作業時取像載帶30之預設複數個承載區及測試器之複數個傳輸件，並將初檢取像資料傳輸至處理器；於本實施例中，初檢取像器95於初始測試作業時取像載帶30之二第一承載區311的第一傳輸點3131及探針卡82之第一、二探針83、84；初檢比對手段以處理器分析初檢取像資料，以判斷是否有初始位差；於本實施例中，初檢比對手段以處理器將二第一傳輸點3131及第一、二探針83、84的初檢取像資料作比對，以判斷是否具初始位差，若具初始位差，利用調校手段調校載帶30之位置。The test and adjustment method further includes a preliminary inspection and image acquisition method and a preliminary inspection and comparison method. The preliminary inspection and image acquisition method uses the preliminary inspection imager 95 to acquire images of a plurality of preset bearing areas of the carrier tape 30 and the tester during the initial test operation. and transmits the data of the initial inspection image to the processor; in this embodiment, the initial inspection imager 95 captures the first image of the first carrying area 311 of the second carrying area 311 of the carrier tape 30 during the initial test operation. The first and second probes 83 and 84 of the transmission point 3131 and the probe card 82; the initial inspection and comparison method uses the processor to analyze the initial inspection image data to determine whether there is an initial position difference; in this embodiment, the initial inspection The comparison means uses the processor to compare the two first transmission points 3131 and the first-detected image data of the first and second probes 83 and 84 to determine whether there is an initial disparity. If there is an initial disparity, use the adjustment means to adjust the position of the carrier tape 30 .

［習知］ 10:載帶 11:第一電路單元 111:第一承載區 112:第一電路 1121:第一傳輸點 113:第一電子元件 1131:第一接點 12:第二電路單元 121:第二承載區 122:第二電路 1221:第二傳輸點 123:第二電子元件 1231:第二接點 21:上鏈輪 22:下鏈輪 23:貼接件 24:探針卡 241:第一探針 242:第二探針 L:間距位差［本發明］ 30:載帶 31:第一電路單元 311:第一承載區 312:第一定位點 313:第一電路 3131:第一傳輸點 314:第一電子元件 3141:第一接點 3142:第一側面 32:第二電路單元 321、321A:第二承載區 322:第二定位點 323:第二電路 3231、3231A:第二傳輸點 324、324A:第二電子元件 3241:第二接點 3242:第二側面 40:機台 50:輸送裝置 51:第一承載驅動器 52:第二承載驅動器 53:第一載架 54:第二載架 55:第一貼接件 56:第二貼接件 57:貼接驅動器 581:第一輸送輪 582:第二輸送輪 60:供料裝置 61:供料器 70:收料裝置 71:收料器 80:測試裝置 81:承板 82:探針卡 821:通孔 83:第一探針 84:第二探針 90:檢知裝置 91:承檢器 92:承靠件 921:吸孔 93:第一溫控件 94:定檢取像器 95:初檢取像器 100:溫控裝置 101:測試室 102:第二溫控件 L:調校基準位差 A:第一測試位置 B:第二測試位置[Knowledge] 10: Carrier tape 11: The first circuit unit 111: The first bearing area 112: First Circuit 1121: First transmission point 113: The first electronic component 1131: First Contact 12: The second circuit unit 121: The second carrying area 122: Second Circuit 1221: Second transmission point 123: Second Electronic Components 1231: Second Contact 21: Winding sprocket 22: Lower sprocket 23: Attachment 24: Probe card 241: First Probe 242: Second Probe L: pitch difference [this invention] 30: Carrier tape 31: The first circuit unit 311: First Bearing Area 312: First positioning point 313: First Circuit 3131: First Transmission Point 314: First Electronic Components 3141: First Contact 3142: First side 32: Second circuit unit 321, 321A: The second bearing area 322: Second anchor point 323: Second Circuit 3231, 3231A: The second transmission point 324, 324A: Second electronic component 3241: Second Contact 3242: Second side 40: Machine 50: Conveyor device 51: First carrier drive 52: Second carrier drive 53: First carrier 54: Second carrier 55: The first attachment 56: The second attachment 57: Attach the driver 581: The first conveyor wheel 582: Second Conveyor Wheel 60: Feeding device 61: Feeder 70: Receiving device 71: Receiver 80: Test device 81: Bearing plate 82: Probe card 821: Through hole 83: First Probe 84: Second probe 90: Detection device 91: Detector 92: Relying parts 921: suction hole 93: The first temperature control 94: Fixed inspection imager 95: Initial inspection imager 100: Temperature control device 101: Testing Room 102: Second temperature control L: Adjust the reference level difference A: The first test position B: Second test position

圖1：習知載帶與探針之使用示意圖。圖2：習知測試設備之局部示意圖。圖3：本發明載帶之示意圖。圖4：本發明檢知裝置應用於測試設備之示意圖。圖5：本發明測試調校方法之使用示意圖（一）。圖6：本發明測試調校方法之使用示意圖（二）。圖7：本發明測試調校方法之使用示意圖（三）。圖8：本發明測試調校方法之使用示意圖（四）。Figure 1: Schematic diagram of the use of conventional carrier tapes and probes. Figure 2: A partial schematic diagram of a conventional test equipment. Figure 3: A schematic diagram of the carrier tape of the present invention. FIG. 4 is a schematic diagram of the application of the detection device of the present invention to a test equipment. Figure 5: Schematic diagram (1) of the use of the test and adjustment method of the present invention. Figure 6: Schematic diagram (2) of the use of the test and adjustment method of the present invention. Figure 7: Schematic diagram (3) of the use of the test and adjustment method of the present invention. Figure 8: Schematic diagram (4) of the use of the test and adjustment method of the present invention.

30:載帶30: Carrier tape

314:第一電子元件314: First Electronic Components

324:第二電子元件324: Second Electronic Components

50:輸送裝置50: Conveyor device

581:第一輸送輪581: The first conveyor wheel

582:第二輸送輪582: Second Conveyor Wheel

90:檢知裝置90: Detection device

91:承檢器91: Detector

92:承靠件92: Relying parts

921:吸孔921: suction hole

Claims

一種檢知裝置，包含：承檢器：係配置於載帶之入料路徑，該承檢器與該載帶作至少一方向相對位移，以供該承檢器取像該載帶之至少一具電子元件及調校基準之承載區；處理器：以接收該承檢器之承載區取像資料，並分析該承載區之調校基準位差。A detection device, comprising: Detector: It is arranged on the feeding path of the carrier tape. The detector and the carrier tape are at least one side. relative displacement for the detector to image at least one electronic element of the carrier tape The bearing area of the parts and the adjustment standard; Processor: to receive the image data of the bearing area of the detector, and analyze the tone of the bearing area Calibration level difference.

如請求項1所述之檢知裝置，更包含整平機構，該整平機構配置於該載帶之該入料路徑，並設置至少一承靠件，該承靠件設有至少一整平部件，以整平該載帶。The detection device according to claim 1, further comprising a leveling mechanism, the leveling mechanism is configured At least one bearing member is arranged on the feeding path of the carrier tape, and the bearing member is provided with at least one bearing member. A leveling part to level the carrier tape.

如請求項2所述之檢知裝置，其該整平機構設置至少一第一溫控件，以預溫該載帶上之電子元件。The detection device according to claim 2, wherein the leveling mechanism is provided with at least one first temperature control to pre-warm the electronic components on the carrier tape.

如請求項1至3中任一項所述之檢知裝置，更包含定檢取像器及初檢取像器，該定檢取像器配置於測試器前方，以於每次測試時序時取像該載帶之該承載區的至少一定位點，該初檢取像器以供位移至該載帶與該測試器之間，於初始測試作業時取像該載帶之預設測試接點及該測試器之傳輸件。The detection device according to any one of claims 1 to 3, further comprising a fixed detection imager and an initial an imager, the fixed inspection imager is arranged in front of the tester, so that every time the test sequence is taking an image of at least one positioning point of the carrying area of the carrier tape, the initial inspection of the imager for displacement to Between the carrier tape and the tester, a preset test of the carrier tape is taken during the initial test operation Contacts and transmission parts of the tester.

一種測試調校方法，包含：承檢取像手段：以承檢器取像載帶之至少一具電子元件及調校基準之承載區，並將承載區取像資料傳輸至處理器；承檢比對手段：以該處理器分析該承載區取像資料，而取得該承載區之調校基準位差值；調校手段：於具位差之一組該承載區的一電子元件完測後，將該調校基準位差值補償於該載帶之位移值，而調校該載帶，使誤判之另一電子元件搭配預設電子元件同步執行測試作業。A test tuning method that includes: Inspection and image capture means: take at least one electronic component of the image carrier tape with the inspection device and adjust the reference the bearing area, and transmit the image data of the bearing area to the processor; Bearing inspection and comparison means: using the processor to analyze the image acquisition data of the bearing area, and obtain the bearing Adjustment base level difference of the zone; Adjustment method: After a group of electronic components with position difference in the bearing area is tested, adjust the adjustment method. The calibration level difference value is compensated for the displacement value of the carrier tape, and the carrier tape is adjusted, Synchronize the test with another electronic component that is misjudged with the default electronic component Operation.

如請求項5所述之測試調校方法，更包含定帶手段，該定帶手段於該承檢取像手段前，由檢知裝置之整平機構整平定位該載帶。The test and adjustment method as described in claim 5, further comprising a tape fixing means, the tape fixing means The carrier tape is leveled and positioned by the leveling mechanism of the detection device before the image capturing means.

如請求項5或6所述之測試調校方法，更包含定檢取像手段及定檢比對手段，該定檢取像手段以定檢取像器於每次測試時序取像該載帶之該承載區的至少一定位點，並將定位取像資料傳輸至該處理器，該定檢比對手段以該處理器分析該定位取像資料，以供判斷該承載區的該定位點是否位於預設定位位置。The test and adjustment method as described in claim 5 or 6 further includes a means of regular inspection and image acquisition and a constant inspection The comparison means, the fixed-check image-taking means uses a fixed-check imager to take images of the carrier at each test timing take at least one positioning point of the bearing area, and transmit the positioning and imaging data to the processor , the constant verification and comparison method uses the processor to analyze the positioning and imaging data for judging the bearing Whether the positioning point of the load zone is located at the preset positioning position.

如請求項5或6所述之測試調校方法，更包含初檢取像手段及初檢比對手段，該初檢取像手段以初檢取像器於初始測試作業時取像該載帶預設之該承載區及測試器之傳輸件，並將初檢取像資料傳輸至該處理器，該初檢比對手段以該處理器分析該初檢取像資料，以判斷是否有初始位差。The test and adjustment method as described in claim 5 or 6 further includes a means of initial inspection and image acquisition and an initial inspection The comparison means, the initial inspection image acquisition method uses the initial inspection imager to capture the image during the initial test operation. The carrier has the preset carrier area and the transmission part of the tester, and transmits the initial inspection image data to The processor, the first-check comparison means analyzes the first-check image data with the processor to determine Check if there is an initial bit difference.

一種測試設備，包含：機台；輸送裝置：係配置於該機台，並設有承載機構及輸送機構，該輸送機構裝配於該承載機構，以輸送載帶；至少一如請求項1所述之檢知裝置：以供檢知該載帶；供料裝置：係裝配於該輸送裝置，並設有至少一供料器，以提供具待測電子元件之該載帶；收料裝置：係裝配於該輸送裝置，並設有至少一收料器，以收置具已測電子元件之該載帶；測試裝置：係配置於該機台，並設有至少一測試器，以供測試該載帶之電子元件；中央控制裝置：以控制及整合各裝置作動，以執行自動化作業。A test device comprising: Machine; Conveying device: It is arranged on the machine, and is equipped with a carrying mechanism and a conveying mechanism. A mechanism is assembled to the carrier mechanism for conveying the carrier tape; At least the detection device as described in claim 1: for detecting the carrier tape; Feeding device: It is assembled on the conveying device and has at least one feeder to provide the carrier tape of the electronic component to be tested; Receiving device: it is assembled on the conveying device, and is provided with at least one receiving device to receive the the carrier tape of the tested electronic components; Test device: It is arranged on the machine and has at least one tester for testing the load with electronic components; Central control device: to control and integrate the actions of various devices to perform automated operations.

如請求項9所述之測試設備，更包含溫控裝置，該溫控裝置裝配於該輸送裝置，並設置測試室及至少一第二溫控件，該測試室供移入及移出該載帶，該第二溫控件供該測試室形成預設溫度測試The test equipment as claimed in claim 9, further comprising a temperature control device, the temperature control device is equipped with In the conveying device, a test chamber and at least one second temperature control device are arranged, and the test chamber is used for Moving in and out of the carrier tape, the second temperature control is used for the test chamber to form a preset temperature test